JP2023102109A - Film deposition device of metal coating, and film deposition method therefor - Google Patents

Abstract

To provide a film deposition device of a metal coating, capable of suppressing the deterioration of film deposition quality by avoiding the dissolving of an undercoat layer of a substrate.SOLUTION: A film deposition device 1 comprises: an anode 11; an electrolyte film 13 that is disposed between the anode and a substrate B; a power source 14 that applies a voltage between the anode and the substrate by using the substrate as a cathode; a storage 15 that stores the anode 11 and an electrolytic solution L including a metal ion, with an opening 15d open toward the substrate side being covered with the electrolyte film 13; a base 18 that supports the substrate so that the substrate faces the electrolyte film; and a liquid pressure regulator 60 that raises the liquid pressure of the electrolytic solution stored in the storage. The base 18 comprises: a metallic placing plate 20 on which the substrate is placed; and an elastic body that energizes the placing plate toward the electrolyte film in a state where the electrolyte film is pressed against the substrate by the liquid pressure of the electrolytic solution.SELECTED DRAWING: Figure 1

Description

The present invention relates to a film forming apparatus for forming a metal film on the surface of a substrate, and a film forming method thereof.

BACKGROUND ART Conventionally, deposition of metal on the surface of a substrate to form a metal film has been performed (for example, Patent Document 1). Patent Literature 1 describes a film forming apparatus that includes a metal anode, a solid electrolyte film (hereinafter also referred to as an electrolyte film) disposed on the surface of the anode and positioned between the anode and the substrate, and a power supply section that applies a voltage between the anode and the substrate using the substrate as a cathode. In the film forming apparatus, a solution containing metal ions (for example, an aqueous solution containing copper ions) is supplied to the electrolyte membrane, and the electrolyte membrane is impregnated with metal ions by contact with the metal ion solution.

In this film-forming apparatus, a voltage is applied between the anode and the substrate using the power source while the electrolyte film is in contact with the substrate. As a result, the metal ions impregnated in the electrolyte membrane migrate to the substrate in contact with the electrolyte membrane and are reduced on this surface. As a result, metal is deposited on the surface of the substrate to form a metal film.

JP 2014-122377 A

By the way, when forming a metal film on the surface of a substrate, the metal ions impregnated in the electrolyte membrane may move to the substrate side through the electrolyte membrane, and the water component of the metal ion solution may seep out to the substrate side. The exuded water component may contain a small amount of metal ions (for example, copper ions) (hereinafter also referred to as "exudate"). This oozing liquid may flow along the side surface of the substrate and enter between the substrate and the mounting plate on which it is mounted. When a substrate in which an insulating plate is coated with a metal underlayer is used, the metal underlayer (e.g., electroless copper) facing the mounting plate is kept in contact with the oozing liquid, which may cause dissolution of the metal underlayer. Furthermore, when a voltage is applied between the anode and the substrate by the power source, a potential difference is generated between the metal base layer and the metal mounting plate, thereby promoting dissolution of the metal base layer.

A portion of the metal base layer of the substrate that is in contact with the mounting plate serves as an electrical contact, but if this portion is dissolved, the electrical contact between the mounting plate and the substrate is lost. Therefore, even if a voltage is applied between the anode and the substrate, a stable electric field is not formed toward the substrate, resulting in deterioration of the deposition quality of the metal film.

SUMMARY OF THE INVENTION The present invention has been made in view of these points, and an object thereof is to provide a metal film forming apparatus and a method for forming a metal film that suppress deterioration of the film forming quality by avoiding dissolution of the metal underlayer on the substrate.

In view of the above problems, the present invention provides a metal film deposition apparatus comprising: an anode; a solid electrolyte film disposed between the anode and a substrate; a power supply section that applies a voltage between the anode and the substrate using the substrate as a cathode; a container that houses the anode and an electrolytic solution containing metal ions; a liquid pressure adjusting device for increasing the liquid pressure of an electrolytic solution to a predetermined liquid pressure, wherein a voltage is applied between the anode and the substrate while the solid electrolyte film is in contact with the substrate to reduce the metal ions contained in the solid electrolyte film, thereby forming a metal film derived from the metal ions on the surface of the substrate in which an insulating plate is covered with a metal underlayer, wherein the base comprises a metal mounting plate on which the substrate is placed; and an elastic body for urging the mounting plate toward the solid electrolyte membrane in a state where the solid electrolyte membrane is pressed against the substrate by the liquid pressure of .

In the film forming apparatus according to the present invention, when the liquid pressure of the electrolyte is increased by the liquid pressure adjusting device, the metal ions impregnated in the electrolyte membrane move to the surface of the substrate through the electrolyte membrane, and the exuding liquid described above may seep out to the substrate side. Here, when the liquid pressure of the electrolyte increases, the electrolyte membrane deforms toward the substrate, but the elastic body urges the mounting plate toward the electrolyte membrane with a force corresponding to the amount of deformation of the electrolyte membrane. The mounting plate is in surface contact with the substrate, and the mounting plate is pressed against the substrate by this urging force, so that even if the exuding liquid oozes out in response to an increase in the liquid pressure of the electrolytic solution, it is possible to prevent the exuding liquid from entering between the substrate and the mounting plate. Therefore, since the metal underlayer of the substrate does not continue to contact the exuding liquid, dissolution of the metal underlayer can be avoided. Therefore, even if a voltage is applied between the anode and the substrate by the power source and a potential difference is generated between the metal underlayer and the mounting plate, dissolution of the underlayer is not promoted. In this way, it is possible to maintain the electrical contact between the mounting plate and the substrate when depositing the metal film, thereby suppressing deterioration in the deposition quality of the metal film.

In a preferred embodiment, the base further includes a conductive pin electrically connected to the power supply unit and extending along the biasing direction of the elastic body. The conductive pin is disposed at a position where the tip of the conductive pin contacts the mounting plate when the solid electrolyte membrane is pressed against the substrate by the liquid pressure of the electrolytic solution, and at a position where the tip of the conductive pin is separated from the mounting plate when the solid electrolyte membrane is separated from the substrate.

According to this aspect, the tips of the conductive pins contact the mounting plate in a state in which the electrolyte membrane is pressed against the substrate by the liquid pressure of the electrolyte, that is, in a state in which the metal coating is formed. On the other hand, in a state in which the electrolyte film is separated from the substrate, that is, in a state in which no metal film is formed, the tips of the conductive pins are separated from the mounting plate. That is, when the electrolyte membrane is pressed against the substrate as the liquid pressure of the electrolyte increases, the tips of the conductive pins come into contact with the mounting plate. As a result, the metal base layer of the substrate is electrically connected to the power source via the mounting plate and the conductive pins. Thus, according to this aspect, the formation of the metal film can be started with the increase in the liquid pressure of the electrolytic solution as a trigger.

The present application further discloses a film forming method capable of suitably forming a metal film. A method for forming a metal film according to the present invention is a method for forming a metal film using the above-described metal film forming apparatus, and is characterized by comprising the steps of bringing the solid electrolyte film covering the opening formed in the container into contact with the substrate, increasing the liquid pressure of the electrolytic solution contained in the container while the solid electrolyte film is in contact with the substrate, and applying a voltage between the anode and the substrate to form the metal film.

According to the film forming method according to the present invention, when the liquid pressure of the electrolyte is increased in the step of increasing the liquid pressure of the electrolyte, the metal ions impregnated in the electrolyte membrane move to the surface of the substrate through the electrolyte membrane, and the exuding liquid described above may seep out to the substrate side. In particular, when forming a plurality of metal films, if the process is repeated a plurality of times, the amount of exudate that seeps out to the substrate side through the electrolyte membrane may increase. In this respect, according to the film forming method of the present invention, since the film forming apparatus described above is used, the metal base layer of the substrate does not continue to come into contact with the oozing liquid in the step of increasing the liquid pressure of the electrolytic solution. Therefore, dissolution of the metal underlayer can be avoided. Therefore, even when the step of forming the metal film is performed, the dissolution of the underlying layer is not promoted. In this way, it is possible to maintain the electrical contact between the mounting plate and the substrate when depositing the metal film, thereby suppressing deterioration in the deposition quality of the metal film.

According to the present invention, deterioration of film formation quality can be suppressed by avoiding dissolution of the metal underlayer on the substrate.

1 is a schematic cross-sectional view of a metal film deposition apparatus according to an embodiment of the present invention; FIG. 2 shows a state in which an electrolytic solution is injected in the film forming apparatus of FIG. 1; 2 is a partially enlarged cross-sectional view showing an enlarged part of the film forming apparatus in the state shown in FIG. 1; FIG. 3 is a partially enlarged cross-sectional view showing an enlarged part of the film forming apparatus in the state shown in FIG. 2; FIG. It is a flow chart explaining the film-forming method concerning the embodiment of the present invention. It is a partial expanded sectional view which expands and shows a part of film-forming apparatus based on the modification of embodiment of this invention. It is a partial expanded sectional view which expands and shows a part of film-forming apparatus based on the modification of embodiment of this invention. It is a flowchart explaining the film-forming method based on the modification of embodiment of this invention. 4 is a photograph of observing the back surface of the substrate after film formation was performed using the film formation apparatus according to Reference Example 1 of the present invention. 4 is a photograph of observing the back surface of a substrate after film formation is performed using the film formation apparatus according to Reference Comparative Example 1 of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS A metal film forming apparatus according to an embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic cross-sectional view of a metal film deposition apparatus 1 according to an embodiment of the present invention. FIG. 2 shows a state in which the electrolytic solution L is injected in the film forming apparatus 1 of FIG. FIG. 3 is a partially enlarged cross-sectional view showing an enlarged part of the film forming apparatus 1 in the state shown in FIG. FIG. 4 is a partially enlarged cross-sectional view showing an enlarged part of the film forming apparatus 1 in the state shown in FIG.

As shown in FIGS. 1 and 2, the film forming apparatus 1 includes an anode 11, a solid electrolyte film (hereinafter also referred to as an electrolyte film) 13 disposed between the anode 11 and the substrate B, and a power supply unit 14 that applies a voltage between the anode 11 and the substrate B using the substrate B as a cathode.

As shown in FIG. 2, the film forming apparatus 1 is an apparatus for forming a metal film F derived from the metal ions on the surface B1 of the substrate B by applying a voltage between the anode 11 and the substrate B while the electrolyte film 13 is in contact with the substrate B, thereby reducing the metal ions contained inside the electrolyte film 13. In this embodiment, for convenience of explanation, the positional relationship of the constituent members of the film forming apparatus 1 is specified on the premise that the electrolyte membrane 13 is arranged below the anode 11 and the substrate B is further arranged below it. However, if the metal film F can be formed on the surface B1 of the substrate B, the positional relationship is not limited to this positional relationship, and for example, the film forming apparatus 1 in FIG. 1 may be turned upside down.

Substrate B may function as a cathode (that is, a conductive surface). Substrate B has a surface B<b>1 facing electrolyte membrane 13 . That is, the surface B1 of the substrate B is a surface facing upward. Further, the substrate B includes a back surface B5 facing downward and a side surface B4 connecting the surface B1 and the back surface B5. The substrate B is obtained by covering an insulator B3 with a metal base layer B2. The metal base layer B2 may cover only the upper and lower surfaces of the insulator B3. In this case, the metal underlying layer B2 is electrically connected by a conductive material such as a lead wire. Examples of materials for the insulator B3 include resins and ceramics. Examples of the material of the metal underlying layer B2 include copper and the like. The substrate B may be, for example, an insulator B3 made of resin and the entire surface of which is electrolessly plated with a metal base layer B2 made of copper. For example, when the metal underlayer B2 is a film of electroless copper, its thickness is usually several hundred nm (for example, about 150 nm). If the metal underlying layer B2 is dissolved, electrical contact between the mounting plate 20 described later and the substrate B cannot be obtained, and the metal film F cannot be formed on the substrate B. As shown in FIG.

The anode 11 has a shape corresponding to the film formation area of the substrate B. As shown in FIG. The film-forming region of the substrate B means the portion of the surface B1 of the substrate B facing the anode 11 . The anode 11 is made of the same metal as the metal film F. Anode 11 may be non-porous (eg, non-porous) or porous. Further, the anode 11 may be block-shaped, flat plate-shaped, or metallic ball-shaped. Examples of materials for the anode 11 include copper, nickel, gold, and silver. The anode 11 may be soluble in the electrolytic solution L. In other words, the anode 11 may be dissolved by applying a voltage using the power supply section 14 . However, if the film is formed only with the electrolyte solution L containing metal ions, the anode 11 does not have to be dissolved. Anode 11 is electrically connected to the positive electrode of power supply section 14 .

The electrolytic solution L is a solution containing the metal of the metal film F to be formed in the form of ions, and examples of the metal include copper, nickel, gold, and silver. The electrolytic solution L is an aqueous solution obtained by dissolving (ionizing) these metals with an acid such as nitric acid, phosphoric acid, succinic acid, sulfuric acid, or pyrophosphoric acid. For example, when the metal is copper, the electrolytic solution L can be an aqueous solution containing copper sulfate, copper pyrophosphate, or the like.

The electrolyte membrane 13 is a flexible membrane that can be impregnated (contained) with metal ions when brought into contact with the electrolytic solution L. As shown in FIG. The electrolyte membrane 13 is not particularly limited as long as the metal ions are reduced on the substrate B when a voltage is applied by the power supply unit 14 and the metal derived from the metal ions can be deposited. Examples of the material of the electrolyte membrane 13 include fluorine-based resins such as Nafion (registered trademark) manufactured by DuPont, hydrocarbon-based resins, polyamic acid resins, and resins having an ion exchange function such as Celemion (CMV, CMD, CMF series) manufactured by Asahi Glass Co., Ltd.

As shown in FIGS. 1 to 4, the film forming apparatus 1 further includes a container 15 and a base 18. As shown in FIGS.

The container 15 contains the anode 11 and the electrolytic solution L containing metal ions, and the opening 15 d of the container 15 is covered with the electrolyte membrane 13 . An anode 11 and an electrolyte membrane 13 are attached to the container 15 , and the inner wall surface of the container 15 , the anode 11 , and the electrolyte membrane 13 form a storage space 15 c in which the electrolytic solution L is stored. An opening 15d of the container 15 opens toward the substrate B (that is, downward), and the electrolyte membrane 13 is attached to the container 15 so as to cover the opening 15d. The anode 11 and the electrolyte membrane 13 are arranged apart from each other, and the accommodation space 15c between them is filled with the electrolytic solution L. As shown in FIG. As shown in FIG. 2, the container 15 has a structure in which the electrolytic solution L contained in the container space 15c is in direct contact with the anode 11 and the electrolyte membrane 13. As shown in FIG. The container 15 is made of a material that is insoluble in the electrolytic solution L. As shown in FIG. Further, the container 15 is formed with a supply channel 15a for supplying the electrolytic solution L to the containing space 15c and a discharge channel 15b for discharging the electrolytic solution L from the containing space 15c. The supply channel 15a is fluidly connected to a liquid supply pipe 50, which will be described later, and the discharge channel 15b is fluidly connected to a liquid discharge pipe 52, which will be described later.

The base 18 supports the substrate B so that the substrate B faces the electrolyte membrane 13 . The base 18 includes a metal mounting plate 20 on which the substrate B is mounted, an elastic body 81 that biases the mounting plate 20 toward the electrolyte membrane 13, and conductive pins 83 that extend along the biasing direction of the elastic body 81. The base 18 further includes, for example, a fixed table 22 which is a member fixed to a part of the film forming apparatus 1 , and the mounting plate 20 is a movable table movable with respect to the fixed table 22 . Here, when the fixed base 22 is made of a conductive material, the negative electrode of the power supply section 14 is electrically connected to the fixed base 22 as shown in FIG. If the fixing base 22 is made of an insulating material, the negative electrode of the power supply section 14 is electrically connected directly to the conductive pin 83 .

The mounting plate 20 supports the rear surface B5 of the substrate B. As shown in FIG. The mounting plate 20 is in surface contact with the rear surface B5 of the substrate B. As shown in FIG. The mounting plate 20 is made of metal (for example, stainless steel, aluminum, etc.) and is electrically connected to the negative electrode of the power supply section 14 via the conductive pins 83 and the fixing base 22 . When the mounting plate 20 is made of stainless steel, a passivation film is formed on the surface of the mounting plate 20, so dissolution of the mounting plate 20 is suppressed. As described above, from the viewpoint of suppressing dissolution of the metal underlying layer B2, the mounting plate 20 may be made of a metal less base than the metal (for example, copper) of the metal underlying layer B2. As shown in FIG. 1 , the mounting plate 20 may be block-shaped or flat plate-shaped, and the substrate B is mounted on the mounting plate 20 . Note that the mounting plate 20 may have any shape as long as it can support the substrate B, and may have a concave shape so as to come into contact with the back surface B5 and the side surface B4 of the substrate B, for example. In this case, the substrate B is accommodated in the recessed portion of the mounting plate 20 and held by the rear surface B5 and the side surface B4. When the mounting plate 20 has a concave shape, the portion of the mounting plate 20 that contacts the side surface B4 of the substrate B may be made of resin or the like, for example.

The elastic body 81 is, for example, a compression spring, and urges the mounting plate 20 toward the electrolyte membrane 13 while the electrolyte membrane 13 is pressed against the substrate B by the liquid pressure of the electrolyte L. As shown in FIG. As a result, the mounting plate 20 applies an upward force to the substrate B. As shown in FIG. As shown in FIG. 3, the elastic body 81 elastically supports the mounting plate 20 from below via a moving insulator 82 which will be described later. The elastic body 81 may elastically support the mounting plate 20 directly from below. In addition, the elastic body 81 is supported at its lower end by a fixed insulator 84, which will be described later. Note that the lower end of the elastic body 81 may be supported by the fixed base 22 . The material of the elastic body 81 may be an insulating material or a conductive material. The elastic member 81 is not limited to a compression spring, and may be any member capable of urging the mounting plate 20 upward as described above, such as rubber. The relationship between the liquid pressure of the electrolytic solution L and the biasing of the mounting plate 20 by the elastic body 81 will be described later.

The conductive pin 83 is electrically connected to the power supply section 14 and extends along the biasing direction of the elastic body 81 . For example, the conductive pin 83 may pass through the elastic body 81 and extend in the biasing direction, that is, in the vertical direction. As shown in FIGS. 3 and 4, the conductive pin 83 is arranged at a position where the tip 83a of the conductive pin 83 is in contact with the mounting plate 20 in a state in which the electrolyte membrane 13 is pressed against the substrate B by the liquid pressure of the electrolyte L, and in a position in which the tip 83a of the conductive pin 83 is separated from the mounting plate 20 in a state in which the electrolyte membrane 13 is separated from the substrate B. When the film forming apparatus 1 includes a moving insulator 82 to be described later, the tip 83a of the conductive pin 83 terminates inside the moving insulator 82 with the electrolyte film 13 separated from the substrate B. FIG. Further, the tip 83 a of the conductive pin 83 is exposed from above the moving insulator 82 while the electrolyte membrane 13 is pressed against the substrate B by the liquid pressure of the electrolyte L. As shown in FIG. The conductive pin 83 is made of metal and is connected to the fixed base 22 at the proximal end 83b. The base end 83 b of the conductive pin 83 is in contact with the fixed base 22 and the tip 83 a of the conductive pin 83 is in contact with the mounting plate 20 , whereby the substrate B is electrically connected to the negative electrode of the power supply section 14 . The conductive pin 83 is preferably made of a material that is difficult to dissolve with the oozing liquid, such as stainless steel.

Also, the base 18 of the film forming apparatus 1 may include a moving insulator 82 and a fixed insulator 84 .

The moving insulator 82 is formed, for example, in a columnar shape, and is fixed to the mounting plate 20 at an upper end face 82b that faces upward. Therefore, the moving insulator 82 moves downward together with the mounting plate 20 by pressing the electrolyte membrane 13 against the substrate B by the liquid pressure of the electrolyte L. As shown in FIG. The movable insulator 82 also has a housing recess 82c that opens toward the mounting plate 20 (that is, opens downward). The accommodation recess 82c has a lower end surface 82a which is arranged above the opening of the accommodation recess 82c and faces downward. The upper portion of the elastic body 81 is accommodated in the accommodation recess 82c, and the elastic body 81 is in contact with the lower end surface 82a. That is, the movable insulator 82 is elastically supported by the elastic body 81 at the lower end face 82a. The accommodation recess 82c may surround the elastic body 81 entirely or may partially surround the elastic body 81 . Since the elastic body 81 is accommodated in the accommodation recess 82c in this way, it is possible to suppress the displacement of the elastic body 81 . The moving insulator 82 is made of an insulating material such as resin.

The fixed insulator 84 has a cylindrical shape with a bottom and opens toward the mounting plate 20 . Conductive pins 83 extend from the bottom of stationary insulator 84 to mounting plate 20 . A base end 83 b of the conductive pin 83 is embedded in the fixed insulator 84 and electrically connected to the fixed base 22 by contacting the fixed base 22 . The conductive pin 83 is formed with a plurality of branched portions 83c toward the tip 83a side, and each branched portion 83c is slidably inserted into a through hole 82d formed in the movable insulator 82. As shown in FIG. When the moving insulator 82 sinks as shown in FIG. 4 due to the deformation of the electrolyte membrane 13, which will be described later, the tip 83a of the conductive pin 83 (branch portion 83c) contacts the mounting plate 20, and the mounting plate 20 and the conductive pin 83 are electrically connected. In this embodiment, since the mounting plate 20 is electrically connected to the mounting plate 20 by the plurality of branch portions 83c, stable conduction can be expected for the mounting plate 20. FIG.

In this embodiment, as shown in FIG. 3, the moving insulator 82 is supported by an elastic body 81 so that the upper part protrudes from an opening of a fixed insulator 84, and a conductive pin 83 is inserted through the elastic body 81. The stationary insulator 84 includes a contact portion 84b made of resin, for example, and a base portion 84c made of rubber, for example, arranged below the contact portion 84b. Note that the fixed insulator 84 may be entirely made of resin or entirely made of rubber. The contact portion 84 b may come into contact with the mounting plate 20 when the mounting plate 20 moves downward due to deformation of the electrolyte membrane 13 . A base portion 84c is attached to the lower surface of the contact portion 84b. The base portion 84c may be fixed to the lower surface of the contact portion 84b. The stationary insulator 84 has a bottom surface 84a facing upward inside the base 84c. A bottom surface 84 a of the base 84 c faces the lower end surface 82 a of the moving insulator 82 . The elastic body 81 is fixed to the bottom surface 84a of the base portion 84c. When the contact portion 84b contacts the mounting plate 20, the stationary insulator 84 and the mounting plate 20 form a closed space. Therefore, when the mounting plate 20 is in contact with the contact portion 84b of the fixed insulator 84, the conductive pin 83 and the elastic member 81 are accommodated in the closed space, and are unlikely to come into direct contact with the exuding liquid.

As shown in FIGS. 1 and 2, the film forming apparatus 1 includes a linear motion actuator 70 that is attached to the container 15 and moves the container 15 up and down. Linear actuator 70 is an electric actuator, and includes, for example, guide 71 to which a motor (not shown) is attached, and rod 72 that moves linearly with respect to guide 71 . The rod 72 converts rotary motion of the motor into linear motion by, for example, a ball screw or the like (not shown). This linear motion actuator 70 makes it possible to move the housing body 15 up and down with respect to the mounting plate 20 to bring the electrolyte membrane 13 into contact with and separate from the substrate B. As shown in FIG.

Next, a mechanism for circulating the electrolytic solution L in the film forming apparatus 1 will be described. As shown in FIG. 1 , the film forming apparatus 1 includes a tank T for storing the electrolytic solution L to be supplied to the container 15 . The electrolytic solution L in the tank T is sucked by a pump P, which will be described later, and supplied to the container 15 through the liquid supply pipe 50 . Further, the electrolytic solution L used during film formation is discharged from the container 15 to the tank T through the liquid discharge pipe 52 .

A pump P is provided in the liquid supply pipe 50 . In this embodiment, the pump P is configured to rotate forward and backward. By forward rotation of the pump P, the electrolytic solution L is sucked into the liquid supply pipe 50 from the tank T, and the electrolytic solution L is pressure-fed into the accommodation space 15 c of the accommodation body 15 . On the other hand, when the pump P rotates in the reverse direction, the electrolytic solution L is returned from the container 15 to the tank T through the liquid supply pipe 50 .

A three-way valve 56 for switching the flow direction of the electrolytic solution L is provided in the liquid discharge pipe 52 . The three-way valve 56 switches the flow direction of the electrolytic solution L from the container 15 to the tank T through the liquid discharge pipe 52 and the flow direction of the air from the outside toward the container 15 through the air introduction pipe 58 and the liquid discharge pipe 52. A pressure regulating valve 54 is interposed in the liquid discharge pipe 52 downstream of the three-way valve 56 in the flow direction of the electrolytic solution L from the container 15 to the tank T. As shown in FIG. This prevents the pressure (fluid pressure) of the electrolytic solution L accommodated in the accommodation space 15c from exceeding a predetermined pressure. By continuously rotating the pump P forward, the electrolyte L in the tank T is continuously supplied to the storage space 15c of the storage body 15, and the pressure of the electrolyte L in the storage space 15c is maintained at a constant pressure by the pressure regulating valve 54. Thus, in this embodiment, the pump P and the pressure regulating valve 54 function as the hydraulic pressure regulating device 60, and increase the hydraulic pressure of the electrolytic solution L contained in the container 15 to a predetermined hydraulic pressure. By the way, when the liquid pressure of the electrolyte L is increased by the liquid pressure adjusting device 60, the metal ions impregnated in the electrolyte membrane 13 move to the surface B1 of the substrate B through the electrolyte membrane 13, and the exuding liquid described above may seep out to the substrate B side. This oozing liquid flows downward along the side surface B4 of the substrate B. As shown in FIG.

When the liquid pressure of the electrolytic solution L increases, the flexible electrolyte membrane 13 deforms toward the substrate B side (that is, downward). Since the electrolyte membrane 13 is in contact with the substrate B, the electrolyte membrane 13 applies a force toward the mounting plate 20 (that is, downward) to the substrate B in accordance with the deformation of the electrolyte membrane 13 . 3 and 4, since the elastic body 81 elastically supports the mounting plate 20, the substrate B and the mounting plate 20 supporting the substrate B move downward together according to the deformation of the electrolyte membrane 13, and a restoring force is generated in the elastic body 81 according to the amount of movement (see FIG. 4). That is, the elastic body 81 applies an upward biasing force to the mounting plate 20 so as to press the mounting plate 20 against the substrate B according to the amount of deformation of the electrolyte membrane 13 . Therefore, the substrate B and the mounting plate 20 are applied with a downward force by which the substrate B pushes the mounting plate 20 due to the liquid pressure of the electrolyte L, and an upward force by which the mounting plate 20 pushes the substrate B due to the biasing force of the elastic body 81. As a result, the substrate B and the mounting plate 20 are brought into close contact with each other, so that the seeping liquid can be prevented from entering between the substrate B and the mounting plate 20 .

Further, when the film forming apparatus 1 has the movable insulator 82 and the fixed insulator 84 , the tip 83 a of the conductive pin 83 is covered with the movable insulator 82 . Furthermore, the fixed insulator 84 supports the mounting plate 20 while the conductive pins 83 are in contact with the mounting plate 20 . Thereby, a closed space is formed by the fixed insulator 84 and the mounting plate 20 . Since the moving insulator 82, the conductive pin 83, and the elastic body 81 are all accommodated in the closed space, even if the exuding liquid seeps out due to the increase in the liquid pressure of the electrolytic solution L, the exuding liquid can be prevented from contacting the conductive pin 83. Since the conductive pins 83 can be protected from exuding liquid in this way, the electrical contact between the mounting plate 20 and the substrate B can be maintained when the metal film F is formed, and deterioration of the film formation quality of the metal film F can be suppressed.

Further, when the electrolyte membrane 13 is pressed against the substrate B as the liquid pressure of the electrolyte L rises, the tips 83 a of the conductive pins 83 come into contact with the mounting plate 20 . As a result, the metal underlying layer B2 of the substrate B is electrically connected to the negative electrode of the power supply section 14 via the mounting plate 20 and the conductive pins 83. As shown in FIG. As described above, according to the film forming apparatus 1, the film formation of the metal film F can be started with the liquid pressure rise of the electrolyte L as a trigger.

In the present embodiment, the electrolytic solution L contained in the containing body 15 is returned to the tank T by changing the containing space 15c of the containing body 15 from the electrolytic solution L to the atmosphere. Specifically, by rotating the pump P in the reverse direction, the electrolytic solution L is sucked from the container 15 into the liquid supply pipe 50, and the electrolytic solution L is pressure-fed to the tank T. As shown in FIG. At this time, the three-way valve 56 is switched so as to form a flow of air from the outside toward the container 15 through the air introduction pipe 58, so when the pump P continues to rotate in the reverse direction, air is introduced into the housing space 15c of the container 15 through the air introduction pipe 58, the liquid discharge pipe 52, and the discharge flow path 15b.

As shown in FIGS. 1 and 2 , the film forming apparatus 1 includes a direct-acting actuator 70 and a control device 90 that controls the operation of a pump P that functions as a liquid pressure adjusting device 60 . The control device 90 comprehensively controls the operation of the film forming apparatus 1, and can transmit and receive information to and from each component of the film forming apparatus 1 by wire or wirelessly. For example, the control device 90 may transmit and receive a signal regarding the stroke amount of the rod 72 with respect to the guide 71, a signal regarding the rotation speed and rotation direction of the pump P, and the like. The control device 90 may control the direction of rotation of the pump P so as to rotate it in the reverse direction, and may also control switching of the three-way valve 56 so as to introduce the atmosphere into the housing space 15c.

As described above, according to the film forming apparatus 1 according to the present embodiment, the base 18 includes the metal mounting plate 20 on which the substrate B is mounted, and the elastic member 81 that biases the mounting plate 20 toward the electrolyte film 13 while the electrolyte membrane 13 is pressed against the substrate B by the liquid pressure of the electrolytic solution L. When the liquid pressure of the electrolyte L rises, the electrolyte membrane 13 deforms downward. In other words, as the electrolyte membrane 13 deforms, the electrolyte membrane 13 applies downward force to the substrate B toward the mounting plate 20 . In this case, the elastic body 81 urges the mounting plate 20 upward toward the electrolyte membrane 13 with a force corresponding to the amount of deformation of the electrolyte membrane 13 . The mounting plate 20 is in surface contact with the substrate B, and the mounting plate 20 is pressed against the substrate B by this urging force. Therefore, even when the exuding liquid oozes out due to the increase in the liquid pressure of the electrolytic solution L, the permeation of the exuding liquid between the substrate B and the mounting plate 20 can be avoided. Therefore, since the metal base layer B2 of the substrate B does not continue to contact the oozing liquid, dissolution of the metal base layer B2 can be avoided. Therefore, even if a voltage is applied between the anode 11 and the substrate B by the power supply unit 14 and a potential difference occurs between the metal base layer B2 and the mounting plate 20, the dissolution of the base layer B2 is not promoted. In this manner, the electrical contact between the mounting plate 20 and the substrate B can be maintained when the metal film F is formed, so that deterioration of the film formation quality of the metal film F can be suppressed.

In particular, when the mounting plate 20 has a concave shape that accommodates the substrate B, the exuding liquid tends to enter between the back surface B5 of the substrate B and the mounting plate 20 through the space between the side surface B4 of the substrate B and the portion of the mounting plate 20 facing the side surface B4. Even in such a case, according to the film forming apparatus 1 according to the present embodiment, it is possible to prevent the exudate from entering between the back surface B5 of the substrate B and the mounting plate 20 . The portion of the mounting plate 20 facing the side surface B4 of the substrate B is preferably made of, for example, resin. As a result, even when a voltage is applied by the power supply unit 14, no potential difference is generated between the side surface B4 of the substrate B and the portion of the mounting plate 20 facing the side surface B4, and the facilitation of dissolution of the underlying layer B2 corresponding to the side surface B4 of the substrate B can be avoided.

Next, a film forming method using the film forming apparatus 1 according to this embodiment will be described. Each step (S100 to S180) included in this film forming method is realized by the control device 90 controlling the operation of each component of the film forming apparatus 1. FIG. FIG. 5 is a flow chart explaining a film forming method according to an embodiment of the present invention. The film forming method according to the present embodiment is a method for forming a metal film using the film forming apparatus 1 described above, and includes the steps of bringing the electrolyte film 13 covering the opening 15d formed in the container 15 into contact with the substrate B (S100, S110); and a step of applying voltage to form a metal film F (S140).

First, in S100, the control device 90 controls a transport device (not shown) and the like, and places the substrate B on the mounting plate 20 arranged below the container 15 so that the substrate B faces the electrolyte membrane 13. In S<b>110 , the control device 90 controls the direct acting actuator 70 to move the rod 72 downward with respect to the guide 71 . As a result, the housing body 15 descends and brings the electrolyte membrane 13 into contact with the surface B1 of the substrate B. As shown in FIG.

Next, in S<b>120 , the controller 90 controls the three-way valve 56 to switch the three-way valve 56 so that the electrolytic solution L flows from the tank T toward the container 15 . In S<b>130 , the control device 90 controls the pump P to forwardly rotate the pump P so that the electrolyte L is stored in the storage space 15 c of the storage body 15 from the tank T storing the electrolyte L. As a result, the electrolytic solution L is accommodated in the container 15 through the liquid supply pipe 50 . At this time, by continuously rotating the pump P forward, the electrolytic solution L is continuously supplied to the container 15 , and the electrolytic solution L inside the container 15 is kept at a constant pressure by the pressure regulating valve 54 . In the step of increasing the liquid pressure of the electrolytic solution L, when the liquid pressure is increased, the metal ions impregnated in the electrolyte membrane 13 move to the surface B1 of the substrate B through the electrolyte membrane 13, and the exuding liquid may seep out to the substrate B side. In particular, when forming a plurality of metal films F, if the process is repeated a plurality of times, the amount of liquid exuding through the electrolyte membrane 13 to the substrate B side may increase.

In S120 and S130, when the liquid pressure of the electrolyte L is increased, the flexible electrolyte membrane 13 deforms downward toward the substrate B side. Since the electrolyte membrane 13 is in contact with the substrate B, the electrolyte membrane 13 applies a force toward the mounting plate 20 (that is, downward) to the substrate B in accordance with the deformation of the electrolyte membrane 13 . 3 and 4, since the elastic body 81 elastically supports the mounting plate 20, the substrate B and the mounting plate 20 supporting the substrate B move downward together according to the deformation of the electrolyte membrane 13, and a restoring force is generated in the elastic body 81 according to the amount of movement (see FIG. 4). That is, the elastic body 81 applies an upward biasing force to the mounting plate 20 so as to press the mounting plate 20 against the substrate B according to the amount of deformation of the electrolyte membrane 13 . Therefore, the substrate B and the mounting plate 20 are applied with a downward force by which the substrate B pushes the mounting plate 20 due to the liquid pressure of the electrolyte L, and an upward force by which the mounting plate 20 pushes the substrate B due to the biasing force of the elastic body 81. As a result, the substrate B and the mounting plate 20 are brought into close contact with each other, so that the seeping liquid can be prevented from entering between the substrate B and the mounting plate 20 .

When the electrolyte membrane 13 is pressed against the substrate B as the liquid pressure of the electrolyte L increases, the tips 83 a of the conductive pins 83 come into contact with the mounting plate 20 . As a result, the metal underlying layer B2 of the substrate B is electrically connected to the negative electrode of the power supply section 14 via the mounting plate 20 and the conductive pins 83. As shown in FIG. Therefore, a voltage is applied between the anode 11 and the substrate B for a certain period of time, and the metal film F is formed (S140). In S140, the metal ions contained in the electrolyte membrane 13 migrate to the substrate B and are reduced on its surface B1. As a result, metal is deposited on the surface B1 of the substrate B, and a metal film F having a constant thickness is formed on the surface B1 of the substrate B. As shown in FIG. In S140, the control device 90 may apply a voltage between the anode 11 and the substrate B for a certain period of time by controlling the power supply section 14 while the tips 83a of the conductive pins 83 are in contact with the mounting plate 20. As a result, even if the tip 83a of the conductive pin 83 cannot be separated from the mounting plate 20, the film can be formed under the control of the power supply unit 14, so that the film formation quality of the metal film F can be ensured.

Next, in this film forming method, after forming the metal film F, the steps (S150, S160) of replacing the electrolytic solution L accommodated in the container 15 with the air are carried out. In S150, the control device 90 transmits a predetermined drive signal to the pump P so that the pump P rotates in the reverse direction. Next, in S<b>160 , the control device 90 switches the three-way valve 56 so as to form a flow direction of the atmosphere from the outside toward the container 15 through the atmosphere introduction pipe 58 and the liquid discharge pipe 52 .

Next, in this film forming method, the step of separating the electrolyte film 13 from the surface B1 of the substrate B (S170) is performed. Controller 90 sends a signal to linear actuator 70 to return rod 72 . As a result, the rod 72 moves upward with respect to the guide 71, and the container 15 rises.

Finally, in this film forming method, the step of removing the substrate B from the mounting plate 20 (S180) is performed. The control device 90 controls a transfer device (not shown) and the like to remove the substrate B from the mounting plate 20 . As described above, the present film forming method ends, and a series of controls of the film forming apparatus 1 using the control device 90 returns to the start. It should be noted that the above-described film formation method may not be performed by the control device 90 in all steps, and at least part of the steps may be performed manually.

<Modification>
Next, a modified example of the film forming apparatus 1 according to this embodiment will be described. FIG. 6 is a partially enlarged cross-sectional view showing an enlarged part of a film forming apparatus according to a modification of this embodiment. FIG. 6 shows the base 180 in a state corresponding to FIG. 3 of the above embodiment (state in which the electrolyte membrane 13 is separated from the substrate B). FIG. 7 is a partially enlarged cross-sectional view showing an enlarged part of a film forming apparatus according to a modification of this embodiment. FIG. 7 shows the base 180 in a state corresponding to FIG. 4 of the above embodiment (state in which the electrolyte membrane 13 is in contact with the substrate B and liquid pressure is applied to the electrolyte L).

The film forming apparatus according to this modification differs from the film forming apparatus 1 according to the above-described embodiment in the structure of the base 180, and has the same structure as the film forming apparatus 1 according to the embodiment except for the base 180. FIG. Hereinafter, configurations having the same or similar functions as those of the film forming apparatus 1 according to the above-described embodiment are denoted by the same reference numerals, and descriptions thereof are omitted, and different portions will be described.

As shown in FIGS. 6 and 7 , the base 180 includes a movable body 103 electrically connected to the power supply section 14 and movable along the biasing direction of the elastic body 81 . For example, the movable body 103 may pass through the elastic body 81 and extend in the biasing direction, that is, in the vertical direction. The movable body 103 is vertically movable between a first position shown in FIG. 7 and a second position shown in FIG. The first position ( FIG. 7 ) is a position where the tip 103 a of the movable body 103 contacts the mounting plate 20 by the biasing force of the elastic body 81 while the electrolyte membrane 13 is pressed against the substrate B by the liquid pressure of the electrolyte L. The second position (FIG. 6) is a position where the tip 103a of the movable body 103 is separated from the mounting plate 20 by the movement of the draw bar 106, which will be described later, with the electrolyte membrane 13 separated from the substrate B. FIG.

A film forming apparatus according to this modification may include a moving insulator 82 . A tip 103 a of the movable body 103 is embedded in a through hole 82 d ′ formed in the moving insulator 82 , and the upper surface of the tip 103 a is exposed upward from the moving insulator 82 . In this case, the movable body 103 moves vertically together with the moving insulator 82 . When the moving insulator 82 moves downward, the elastic body 81 is compressed by the lower end face 82a of the moving insulator 82. As shown in FIG. The movable body 103 is made of metal and is connected to the fixed base 22 at the base end 103b. The base end 103 b of the movable body 103 is in contact with the fixed base 22 and the tip 103 a of the movable body 103 is in contact with the mounting plate 20 , whereby the substrate B is electrically connected to the negative electrode of the power source section 14 . The movable body 103 is preferably made of a material that is difficult to dissolve with the oozing liquid, such as stainless steel.

The film forming apparatus according to this modification includes a pull bar 106 that moves the movable body 103 to the second position (FIG. 6), and a stopper plate 105 that holds the movable body 103 at the second position (FIG. 6). Note that the film forming apparatus may not have the stopper plate 105 .

The drawbar 106 may be attached, for example, to the moving insulator 82 and pass vertically through the base 84c of the stationary insulator 84. As shown in FIG. The draw bar 106 may be, for example, a cylindrical bar member. The pull bar 106 is vertically moved by an actuator (not shown), and accordingly the movable body 103 and the movable insulator 82 are vertically moved. The stopper plate 105 may be, for example, a rectangular flat plate in plan view. The stopper plate 105 may pass through the contact portion 84b of the fixed insulator 84 in the horizontal direction (perpendicular to the vertical direction), for example. The stopper plate 105 is horizontally moved by an actuator (not shown). By positioning the stopper plate 105 above the movable body 103 and the moving insulator 82, the movable body 103 can be held in the second position even when the tensile force applied to the drawbar 106 by the actuator (the force that moves the drawbar 106 downward) is released (FIG. 6). Further, by moving the stopper plate 105 from above the movable body 103 and the movable insulator 82, it is possible to move the movable body 103 to the first position by the biasing force of the elastic body 81 (FIG. 7).

When the film forming apparatus does not have the stopper plate 105, the movable body 103 can be held at the second position by maintaining the tensile force applied to the pull rod 106 by the actuator while the movable body 103 and the movable insulator 82 are moved downward (that is, the elastic body 81 is compressed). In this case, by releasing the tensile force applied to the pull rod 106 by the actuator, the biasing force of the elastic body 81 can move the movable body 103 to the first position.

The control device 90 controls the operation of the actuator of the stopper plate 105 and the actuator of the drawbar 106 (both not shown). The control device 90 controls the actuator of the drawbar 106 in a state in which the stopper plate 105 is positioned above the movable body 103 and the moving insulator 82 (that is, in a state in which the elastic body 81 is compressed), and releases the tensile force applied to the drawbar 106. The control device 90 controls the actuator of the stopper plate 105 to move the stopper plate 105 from above the movable body 103 and the movable insulator 82 at the same time as the liquid pressure of the electrolyte L is increased or before the liquid pressure is increased. If the film forming apparatus does not have the stopper plate 105, the controller 90 controls the actuator of the drawbar 106 at the same time as the liquid pressure of the electrolytic solution L rises or before the liquid pressure rises, and releases the tensile force applied to the drawbar 106. Therefore, the elastic body 81 kept in the compressed state applies a biasing force toward the mounting plate 20 to the movable body 103 and the movable insulator 82 , and the tip 103 a of the movable body 103 contacts the mounting plate 20 .

The control device 90 controls the liquid pressure adjustment device 60 to increase the liquid pressure of the electrolyte L contained in the container 15 at the same time as the tip 103a of the movable body 103 contacts the mounting plate 20 or after that. As a result, the substrate B and the mounting plate 20 are applied with a downward force by which the substrate B pushes the mounting plate 20 due to the liquid pressure of the electrolyte L, and an upward force by which the mounting plate 20 pushes the substrate B due to the biasing force of the elastic body 81. As a result, the substrate B and the mounting plate 20 are brought into close contact with each other, so that the seeping liquid can be prevented from entering between the substrate B and the mounting plate 20 . Note that the force of the mounting plate 20 pushing the substrate B upward due to the biasing force of the elastic body 81 may be set larger than the force of the substrate B pushing the mounting plate 20 downward due to the liquid pressure of the electrolyte L. In this case, the adhesion between the substrate B and the mounting plate 20 can be improved. In addition, since the tip 103a of the movable body 103 comes into contact with the mounting plate 20 at the same time as the liquid pressure of the electrolyte L rises or before the liquid pressure rises, the deformation of the electrolyte membrane 13 due to the biasing force of the elastic body 81 can be avoided.

After completing the formation of the metal film F, the control device 90 controls the actuator of the drawbar 106 to move the movable body 103 and the movable insulator 82 downward. Since the moving insulator 82 moves downward, the elastic body 81 in contact with the lower end surface 82a of the moving insulator 82 is compressed. Controller 90 then controls the actuator of stopper plate 105 to position stopper plate 105 above movable body 103 and moving insulator 82 (FIG. 6). Controller 90 then releases the pulling force applied to drawbar 106 by the actuator (the force that causes drawbar 106 to move downward).

Next, a film forming method using the film forming apparatus according to this modified example will be described. Each step (S100 to S180, S200, S210) included in the film forming method is realized by the control device 90 controlling the operation of each component of the film forming apparatus. FIG. 8 is a flow chart for explaining a film forming method using the film forming apparatus according to this modification. The film forming method according to this modification differs from the film forming method according to the above embodiment in that S200 is performed between S120 and S130, and S210 is performed between S150 and S160. Hereinafter, steps having the same or similar functions as those of the film forming method according to the above-described embodiment are denoted by the same reference numerals, and descriptions thereof are omitted, and different portions are described.

In S200, a step of moving the stopper plate 105 positioned above the movable body 103 and the movable insulator 82 and releasing the holding by the stopper plate 105 is performed (FIG. 7). In this process, the control device 90 controls the actuator of the stopper plate 105 to move the stopper plate 105 from above the movable body 103 and the movable insulator 82 . In the film forming method according to this modification, S130 is performed after this step (S200). Therefore, the substrate B and the mounting plate 20 are applied with a downward force by which the substrate B pushes the mounting plate 20 due to the liquid pressure of the electrolyte L, and an upward force by which the mounting plate 20 pushes the substrate B due to the biasing force of the elastic body 81. As a result, the substrate B and the mounting plate 20 are brought into close contact with each other, so that the seeping liquid can be prevented from entering between the substrate B and the mounting plate 20 . Note that the step of S200 may be performed between the step of S110 and the step of S120.

In S210, a step of moving the movable body 103 and the movable insulator 82 downward to compress the elastic body 81 and a step of positioning the stopper plate 105 above the movable body 103 and the movable insulator 82 are performed (FIG. 6). Controller 90 controls the actuator of drawbar 106 to move movable body 103 and moving insulator 82 downward. At this time, since the movable insulator 82 moves downward, the elastic body 81 in contact with the lower end surface 82a of the movable insulator 82 is compressed. The controller 90 then controls the actuator of the stopper plate 105 to position the stopper plate 105 above the movable body 103 and the moving insulator 82 . This holds the movable body 103 and the moving insulator 82 at the second position (FIG. 6). Therefore, the elastic body 81 maintains the state in which the restoring force is generated.

The invention is illustrated by the following examples. FIG. 9 is a photograph of an underlying layer of a substrate observed after film formation using the film formation apparatus according to Reference Example 1 of the present invention. FIG. 10 is a photograph of an underlying layer of a substrate observed after film formation using the film formation apparatus according to Reference Comparative Example 1 of the present invention.

[Reference Example 1]
A substrate having an insulator (ABF) coated with electroless copper was prepared as a substrate on which a film was formed. The film thickness of the electroless copper was set to 150 nm.

Next, based on the film forming apparatus 1 (FIGS. 1 and 2) according to the embodiment, a spacer (not shown) was arranged between the mounting plate and the back surface of the substrate, and a film forming apparatus was prepared in which the mounting plate applied force to the substrate from below when the electrolyte film was pressed against the substrate as the liquid pressure of the electrolytic solution increased. That is, the film forming apparatus according to Reference Example 1 is not provided with an elastic body. A 1 mol/L copper sulfate aqueous solution (containing 0.2 mol/L sulfuric acid) was used as the electrolyte, and a Cu plate was used as the anode. As film formation conditions, the temperature of the electrolytic solution was set to 70° C., and a solid electrolytic film (Nafion (manufactured by DuPont) with a thickness of 8 μm was brought into close contact with the substrate. A copper film was formed under the conditions of a liquid pressure of the electrolytic solution of 0.6 MPa, a current density of 18 A/dm ² , and a cumulative film formation time of 150 seconds.

[Reference Comparative Example 1]
A copper film was formed in the same manner as in Reference Example 1. A different point from Reference Example 1 is that no spacer is arranged between the mounting plate and the back surface of the substrate. That is, in Reference Comparative Example 1, when the electrolyte membrane was pressed against the substrate as the pressure of the electrolytic solution increased, the force applied by the mounting plate to the substrate from below was smaller than in Reference Example 1.

(Results and Discussion)
The state of the back surface of the substrate on which the film was formed as described above was observed. As shown in FIG. 9, when the film forming apparatus according to Reference Example 1 was used, no dissolution of the electroless copper film was observed on the back surface of the substrate. For this reason, it is considered that by applying to the substrate and the mounting plate a downward force with which the substrate pushes the mounting plate and an upward force with which the mounting plate pushes the substrate, infiltration of the exuding liquid between the substrate and the mounting plate can be suppressed. On the other hand, as shown in FIG. 10, when the film forming apparatus according to Reference Comparative Example 1 was used, dissolution of the electroless copper film was observed on the back surface of the substrate. The electroless copper film was completely dissolved at the outer periphery where the exudate was presumed to have penetrated. In addition, the film thickness of the copper film was also thin in the central portion of the back surface of the substrate.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the film forming apparatus 1 according to the above embodiments, and includes all aspects included in the concept and claims of the present invention. Moreover, each configuration may be selectively combined as appropriate so as to achieve the above-described problems and effects. For example, the shape, material, arrangement, size, etc. of each component in the above embodiments may be changed as appropriate according to specific aspects of the present invention.

By forming a film using the film forming apparatus 1 according to the present embodiment, it is possible to reduce the electric power required for adjusting the temperature of the electrolytic solution L and air conditioning in the factory. In addition, since the film forming apparatus 1 has a high film forming speed, the power consumption per product can be reduced. Therefore, the amount of carbon dioxide emissions can be reduced. In addition, since the amount of electrolyte waste to be treated can be reduced, the impact on the global environment can be reduced.

1: Film forming apparatus, 11: Anode, 13: Solid electrolyte membrane, 14: Power supply unit, 15: Container, 15d: Opening, 18: Base, 20: Mounting plate, 60: Fluid pressure adjustment device, 81: Elastic body, 83: Conductive pin, B: Substrate, B1: Surface, B2, Metal underlayer, B3: Insulating plate, F: Metal film, L: Electrolyte

Claims (3)

an anode;
a solid electrolyte membrane disposed between the anode and the substrate;
a power supply section that applies a voltage between the anode and the substrate using the substrate as a cathode;
a container containing the anode and an electrolytic solution containing metal ions, wherein the opening facing the substrate is covered with the solid electrolyte membrane;
a base supporting the substrate so that the substrate faces the solid electrolyte membrane;
a hydraulic pressure adjusting device for increasing the hydraulic pressure of the electrolyte contained in the container to a predetermined hydraulic pressure,
A voltage is applied between the anode and the substrate while the solid electrolyte film is in contact with the substrate to reduce the metal ions contained in the solid electrolyte film, thereby forming a metal film derived from the metal ions on the surface of the substrate in which an insulating plate is coated with a metal underlayer, wherein
The base is
a metal mounting plate on which the substrate is mounted;
and an elastic body that biases the mounting plate toward the solid electrolyte membrane in a state where the solid electrolyte membrane is pressed against the substrate by the liquid pressure of the electrolyte. The base further comprises a conductive pin electrically connected to the power supply unit and extending along the urging direction of the elastic body,
2. The apparatus for depositing a metal film according to claim 1, wherein the conductive pin is arranged at a position where the tip of the conductive pin contacts the mounting plate in a state where the solid electrolyte film is pressed against the substrate by the liquid pressure of the electrolytic solution, and at a position where the tip of the conductive pin is separated from the mounting plate when the solid electrolyte film is separated from the substrate. A method for forming a metal film using the apparatus for forming a metal film according to claim 1 or 2,
bringing the solid electrolyte membrane covering the opening formed in the container into contact with the substrate;
a step of increasing the liquid pressure of the electrolyte contained in the container while the solid electrolyte membrane is in contact with the substrate;
and applying a voltage between the anode and the substrate to form the metal film.