JP2023086827A5 - - Google Patents
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- JP2023086827A5 JP2023086827A5 JP2023067440A JP2023067440A JP2023086827A5 JP 2023086827 A5 JP2023086827 A5 JP 2023086827A5 JP 2023067440 A JP2023067440 A JP 2023067440A JP 2023067440 A JP2023067440 A JP 2023067440A JP 2023086827 A5 JP2023086827 A5 JP 2023086827A5
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- styrene
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Claims (4)
前記スチレン系化合物は、スチレン、α-メチルスチレン、パラメチルスチレン、エチルスチレン、プロピルスチレン、ブチルスチレン、クロロスチレン又はブロモスチレンであり、
前記モノビニル化合物は、メチル(メタ)アクリレート、エチル(メタ)アクリレート、ブチル(メタ)アクリレート、セチル(メタ)アクリレート、(メタ)アクリロニトリル、ジメチルマレエート、ジメチルフマレート、ジエチルフマレート、エチルフマレート、無水マレイン酸、マレイミド、又は核置換マレイミドであり、
前記多分岐ビニル化合物を有する場合は以下の(a)および(b)を満たし、
(a)前記多分岐ビニル化合物の含有量は、前記モノビニル化合物の総量1モルに対して2.0×10-6~4.0×10-4モルである、
(b)前記多分岐ビニル化合物の数平均分子量(Mn)は、850~100000である、
前記共役ジビニル化合物を有する場合は以下の(c)および(d)を満たす、
(c)前記共役ジビニル化合物の含有量は、モノビニル化合物の総量1モルに対して、2.0×10-6~4.0×10-4モルである、
(d)前記共役ジビニル化合物の数平均分子量(Mn)は、850~100000である、
200℃、49N荷重の条件で測定したメルトマスフローレイト(MFR)が2.0g/10分超10g/10分以下であり、
スチレンダイマーとトリマーの合計含有量が100~3000μg/gであり、
190℃で測定した溶融張力値(MT)が40~80gfであることを特徴とする、スチレン系樹脂組成物。 It contains a radical copolymer of a monovinyl compound having a styrene compound and a conjugated divinyl compound having at least two conjugated vinyl groups in the molecule and/or a multi-branched vinyl compound having one or more branched structures, and The content of the styrene-based compound in the monovinyl compound is 70 mol% or more of the content of the monovinyl compound,
The styrenic compound is styrene, α-methylstyrene, paramethylstyrene, ethylstyrene, propylstyrene, butylstyrene, chlorostyrene or bromostyrene,
The monovinyl compound includes methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, cetyl (meth)acrylate, (meth)acrylonitrile, dimethyl maleate, dimethyl fumarate, diethyl fumarate, ethyl fumarate, maleic anhydride, maleimide, or nuclear-substituted maleimide,
When having the multi-branched vinyl compound, the following (a) and (b) are satisfied,
(a) the content of the multi-branched vinyl compound is 2.0×10 −6 to 4.0×10 −4 mol per 1 mol of the total amount of the monovinyl compound;
(b) the multi-branched vinyl compound has a number average molecular weight (Mn) of 850 to 100,000;
When having the conjugated divinyl compound, the following (c) and (d) are satisfied,
(c) the content of the conjugated divinyl compound is 2.0×10 −6 to 4.0×10 −4 mol per 1 mol of the total amount of the monovinyl compound;
(d) the conjugated divinyl compound has a number average molecular weight (Mn) of 850 to 100,000;
The melt mass flow rate (MFR) measured under the conditions of 200° C. and 49 N load is more than 2.0 g/10 minutes and 10 g/10 minutes or less,
The total content of styrene dimer and trimer is 100 to 3000 μg / g,
A styrenic resin composition characterized by having a melt tension value (MT) measured at 190° C. of 40 to 80 gf.
〔2〕分子量100万以上の成分の含有量が、スチレン系樹脂組成物100質量%中に7質量%以上である、 [2] The content of components having a molecular weight of 1,000,000 or more is 7% by mass or more in 100% by mass of the styrene resin composition.
〔3〕分子量200万以上の成分の含有量が、スチレン系樹脂組成物100質量%中に2質量%以上である、 [3] The content of components having a molecular weight of 2,000,000 or more is 2% by mass or more in 100% by mass of the styrene resin composition.
〔4〕数平均分子量(Mn)に対する重量平均分子量(Mw)の比(Mw/Mn)が、3.0~7.0である、 [4] The ratio (Mw/Mn) of the weight average molecular weight (Mw) to the number average molecular weight (Mn) is 3.0 to 7.0.
〔5〕重量平均分子量(Mw)に対するz平均分子量(Mz)の比(Mz/Mw)が、1.8~6.0である、 [5] The ratio (Mz/Mw) of the z-average molecular weight (Mz) to the weight-average molecular weight (Mw) is 1.8 to 6.0.
〔6〕最大立上り比が1.1~4.0である、 [6] The maximum rise ratio is 1.1 to 4.0.
〔7〕分岐度が0.60~0.95である、 [7] the degree of branching is 0.60 to 0.95;
〔8〕ゲル化度が1.10~1.60である。 [8] The degree of gelation is from 1.10 to 1.60.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023067440A JP2023086827A (en) | 2018-12-19 | 2023-04-17 | Styrenic resin composition, foam sheet and food container |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2018237788A JP2020100679A (en) | 2018-12-19 | 2018-12-19 | Styrenic resin composition, foam sheet and food container |
JP2023067440A JP2023086827A (en) | 2018-12-19 | 2023-04-17 | Styrenic resin composition, foam sheet and food container |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2018237788A Division JP2020100679A (en) | 2018-12-19 | 2018-12-19 | Styrenic resin composition, foam sheet and food container |
Publications (2)
Publication Number | Publication Date |
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JP2023086827A JP2023086827A (en) | 2023-06-22 |
JP2023086827A5 true JP2023086827A5 (en) | 2023-06-29 |
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Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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JP2018237788A Pending JP2020100679A (en) | 2018-12-19 | 2018-12-19 | Styrenic resin composition, foam sheet and food container |
JP2023067440A Pending JP2023086827A (en) | 2018-12-19 | 2023-04-17 | Styrenic resin composition, foam sheet and food container |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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JP2018237788A Pending JP2020100679A (en) | 2018-12-19 | 2018-12-19 | Styrenic resin composition, foam sheet and food container |
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JP (2) | JP2020100679A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7303626B2 (en) * | 2018-12-19 | 2023-07-05 | Psジャパン株式会社 | Styrene resin composition, foam sheet and food container |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2014189767A (en) * | 2013-03-28 | 2014-10-06 | Sekisui Plastics Co Ltd | Polystyrenic resin composition for foaming, polystyrenic resin foam sheet, and foam molding |
TWI626268B (en) * | 2016-03-28 | 2018-06-11 | Ps Japan股份有限公司 | Styrenic copolymer and process for producing the same, extruded foam sheet and molded article thereof |
JP7303626B2 (en) * | 2018-12-19 | 2023-07-05 | Psジャパン株式会社 | Styrene resin composition, foam sheet and food container |
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2018
- 2018-12-19 JP JP2018237788A patent/JP2020100679A/en active Pending
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2023
- 2023-04-17 JP JP2023067440A patent/JP2023086827A/en active Pending
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