JP2023069552A - Method for manufacturing electronic component, and manufacturing device of electronic component - Google Patents

Abstract

To provide a method for manufacturing an electronic component for improving the transferability and the alignment property of electronic components.SOLUTION: A method for manufacturing an electronic component includes an alignment process for collectively aligning electronic components 1 by using an alignment device 100. The alignment device 100 includes a first flat plate 110 having first through holes 112, a second flat plate 120 having second through holes 122 smaller than the first through holes, and a third flat plate 130 having third through holes 132 smaller than the second through holes and having elastic members 134 arranged on an inner wall. The alignment process includes the steps of: vibrating the first flat plate 110 to transfer the electronic components 1 into the first through holes 112; moving the first flat plate 110 to drop the electronic components 1 of the first through holes 112 into the second through holes 122; and using pressing members 160 to press the electronic components 1, moving the electronic components 1 in the second through holes 122 to the third through holes 132 and holding the electronic components 1 by the elastic members 134.SELECTED DRAWING: Figure 2

Description

The present invention relates to an electronic component manufacturing method and an electronic component manufacturing apparatus.

2. Description of the Related Art When manufacturing an electronic component, a holding jig is used to hold the electronic component in a predetermined state. Patent Document 1 discloses such a holding jig and alignment plate. The holding jig disclosed in Patent Document 1 has a holding hole with an elastic inner surface, and the alignment plate is arranged on the upper surface side of the holding jig and has a plurality of through holes. And in Patent Document 1,
・Place multiple electronic components on the alignment plate,
・By vibrating the aligning plate, the electronic parts are thrown into the through-holes of the aligning plate, thereby aligning the electronic parts,
- Using a pressing member, the electronic component placed on the alignment plate is pressed against the holding hole of the holding jig, thereby holding the electronic component.
It is disclosed to align and hold electronic components by means of an electric motor.

JP 2010-182876 A

From the viewpoint of alignment of electronic parts, it is preferable that the through-holes of the alignment plate are small. However, if the through-holes of the alignment plate are made smaller, it becomes difficult to move the electronic components into the through-holes of the alignment plate when the electronic components are moved into the through-holes of the alignment plate by vibrating the alignment plate.

Therefore, from the viewpoint of transferability of electronic parts, it is necessary to enlarge the through holes of the alignment plate. However, if the through-holes of the alignment plate are enlarged, the posture of the electronic component becomes unstable in the through-holes of the alignment plate. Therefore, when the electronic component is pressed into the holding hole of the holding jig, the electronic component is held in an unstable posture in alignment.

An object of the present invention is to provide an electronic component manufacturing method and an electronic component manufacturing apparatus that improve the transferability and alignment of electronic components.

A method of manufacturing an electronic component according to the present invention is a method of manufacturing an electronic component including an alignment step of collectively aligning a plurality of electronic components using an alignment device. The aligning device has a first flat plate having a plurality of first through holes aligned in a predetermined direction and a plurality of second through holes aligned in the predetermined direction, wherein at least the plurality of second through holes A second flat plate arranged on the lower surface side of the first flat plate so that a part thereof does not overlap with the plurality of first through holes, wherein the plurality of second through holes are arranged from the plurality of first through holes a third flat plate having a smaller diameter than the second flat plate and a plurality of third through holes aligned in the predetermined direction, the third flat plate being disposed on the lower surface side of the second flat plate, wherein the plurality of third through holes and the third flat plate, wherein the holes are smaller than the plurality of second through holes, and a plurality of elastic members are arranged on the inner walls of the plurality of third through holes, respectively. The aligning step includes a transferring step of transferring the plurality of electronic components arranged on the upper surface of the first flat plate into the plurality of first through holes by vibrating the first flat plate; By moving the first flat plate in the predetermined direction relative to the second flat plate so that one through-hole and the plurality of second through-holes communicate with each other, the plurality of first through-holes are formed. a second flat plate aligning step of dropping the plurality of electronic components into the plurality of second through holes, and pressing the plurality of electronic components using a plurality of pressing members, thereby forming the plurality of second through holes a first holding step of respectively moving the plurality of electronic components to the plurality of third through holes in and holding the plurality of electronic components by the plurality of elastic members on the inner walls of the plurality of third through holes; including.

An electronic component manufacturing apparatus according to the present invention is an electronic component manufacturing apparatus including an aligning device for collectively aligning a plurality of electronic components. The aligning device has a first flat plate having a plurality of first through holes aligned in a predetermined direction and a plurality of second through holes aligned in the predetermined direction, wherein at least the plurality of second through holes A second flat plate arranged on the lower surface side of the first flat plate so that a part thereof does not overlap with the plurality of first through holes, wherein the plurality of second through holes are arranged from the plurality of first through holes a third flat plate having a smaller diameter than the second flat plate and a plurality of third through holes aligned in the predetermined direction, the third flat plate being disposed on the lower surface side of the second flat plate, wherein the plurality of third through holes The holes are smaller than the plurality of second through holes, and the inner walls of the plurality of third through holes are respectively arranged with a plurality of elastic members for controlling the third flat plate and the alignment device as a whole. and a control unit. By vibrating the first flat plate, the control unit causes the plurality of electronic components arranged on the upper surface of the first flat plate to be transferred into the plurality of first through holes, respectively. By moving the first flat plate in the predetermined direction relative to the second flat plate so that the plurality of are dropped into the plurality of second through holes, and the plurality of electronic components in the plurality of second through holes are pressed by using a plurality of pressing members. and the plurality of electronic components are held by the plurality of elastic members on the inner walls of the plurality of third through holes.

According to the present invention, it is possible to improve the transferability and alignment of electronic components.

FIG. 2 is a schematic plan view showing an alignment device included in the electronic component manufacturing apparatus according to the present embodiment; 2 is a schematic cross-sectional view along line II-II of an alignment device included in the electronic component manufacturing apparatus shown in FIG. 1; FIG. It is a schematic diagram showing a transfer process in the alignment process in the method of manufacturing an electronic component according to the present embodiment. It is a schematic diagram showing a first alignment step (first plate alignment step) in the alignment step in the method of manufacturing an electronic component according to the present embodiment. It is the schematic which shows the 2nd alignment process (2nd plate alignment process) in the alignment process in the manufacturing method of the electronic component which concerns on this embodiment. It is a schematic diagram showing the 1st holding process in the alignment process in the manufacturing method of electronic parts concerning this embodiment. It is the schematic which shows the 2nd holding process in the alignment process in the manufacturing method of the electronic component which concerns on this embodiment. It is a schematic diagram showing a conductive member placement step in the method of manufacturing an electronic component according to the present embodiment. 1 is a perspective view showing an example of an electronic component (laminated ceramic capacitor) according to this embodiment; FIG. FIG. 10 is a cross-sectional view (LT cross section) taken along line XX of an example of the electronic component (multilayer ceramic capacitor) shown in FIG. 9; FIG. 10 is a sectional view (WT section) taken along the line XI-XI of the multilayer ceramic capacitor, which is an example of the electronic component shown in FIG. 9; It is a schematic sectional drawing which shows the alignment apparatus and alignment process of the electronic components which concern on a comparative example.

An example of an embodiment of the present invention will be described below with reference to the accompanying drawings. In each drawing, the same reference numerals are given to the same or corresponding parts.

(Electronic parts: laminated ceramic capacitors)
First, as an example of an electronic component manufactured by the manufacturing method and manufacturing apparatus according to the present embodiment, a laminated ceramic capacitor will be described with reference to FIGS. 9 to 11. FIG. FIG. 9 is a perspective view showing an example of an electronic component (laminated ceramic capacitor) according to the present embodiment, and FIG. 10 is a cross-sectional view taken along line XX of an example of the electronic component (laminated ceramic capacitor) shown in FIG. 11 is a cross-sectional view taken along line XI-XI of an example of the electronic component (multilayer ceramic capacitor) shown in FIG. 9. FIG. An electronic component (laminated ceramic capacitor) 1 shown in FIGS. External electrode 40 includes a first external electrode 41 and a second external electrode 42 .

9 to 11 show an XYZ orthogonal coordinate system. The X direction is the length direction L of the electronic component 1 and the laminate 10, the Y direction is the width direction W of the electronic component 1 and the laminate 10, and the Z direction is the lamination direction T of the electronic component 1 and the laminate 10. be. 10 is also called the LT section, and the section shown in FIG. 11 is also called the WT section.

Note that the length direction L, the width direction W, and the stacking direction T are not necessarily orthogonal to each other, and may intersect each other.

The laminate 10 has a substantially rectangular parallelepiped shape, and includes a first main surface TS1 and a second main surface TS2 facing in the lamination direction T, and a first side surface WS1 and a second side surface WS2 facing in the width direction W. , a first end surface LS1 and a second end surface LS2 facing each other in the length direction L. As shown in FIG.

The corners and ridges of the laminate 10 are preferably rounded. A corner is a portion where three surfaces of the laminate 10 intersect, and a ridge is a portion where two surfaces of the laminate 10 intersect.

As shown in FIGS. 10 and 11, the laminate 10 has a plurality of dielectric layers 20 and a plurality of internal electrode layers 30 laminated in the lamination direction T. As shown in FIGS. In addition, the laminate 10 has, in the stacking direction T, an inner layer portion 10A, and a first outer layer portion 10B and a second outer layer portion 10C which are arranged so as to sandwich the inner layer portion 10A.

The inner layer portion 10A includes a portion of the multiple dielectric layers 20 and the multiple internal electrode layers 30 . In the inner layer portion 10A, a plurality of internal electrode layers 30 are arranged facing each other with the dielectric layers 20 interposed therebetween. The inner layer portion 10A is a portion that generates capacitance and substantially functions as a capacitor.

The first outer layer portion 10B is arranged on the first main surface TS1 side of the laminate 10, and the second outer layer portion 10C is arranged on the second main surface TS2 side of the laminate 10. As shown in FIG. More specifically, the first outer layer portion 10B is arranged between the internal electrode layer 30 closest to the first main surface TS1 among the plurality of internal electrode layers 30 and the first main surface TS1, The second outer layer portion 10C is arranged between the internal electrode layer 30 closest to the second main surface TS2 among the plurality of internal electrode layers 30 and the second main surface TS2. The first outer layer portion 10B and the second outer layer portion 10C do not include the internal electrode layers 30, and include portions of the plurality of dielectric layers 20 other than the portion for the inner layer portion 10A. The first outer layer portion 10B and the second outer layer portion 10C are portions that function as protective layers for the inner layer portion 10A.

As the material of the dielectric layer 20, for example, a dielectric ceramic containing BaTiO ₃ , CaTiO ₃ , SrTiO ₃ , CaZrO ₃ or the like as a main component can be used. Moreover, as a material of the dielectric layer 20, a Mn compound, an Fe compound, a Cr compound, a Co compound, a Ni compound, or the like may be added as an accessory component.

The multiple internal electrode layers 30 include multiple first internal electrode layers 31 and multiple second internal electrode layers 32 . The plurality of first internal electrode layers 31 and the plurality of second internal electrode layers 32 are alternately arranged in the stacking direction T of the stack 10 .

The first internal electrode layer 31 includes a counter electrode portion 31A and a lead electrode portion 31B, and the second internal electrode layer 32 includes a counter electrode portion 32A and a lead electrode portion 32B.

The counter electrode portion 31A and the counter electrode portion 32A face each other in the stacking direction T of the laminate 10 with the dielectric layer 20 interposed therebetween. The shape of the counter electrode portion 31A and the counter electrode portion 32A is not particularly limited, and may be, for example, a substantially rectangular shape. The counter electrode portion 31A and the counter electrode portion 32A are portions that generate capacitance and substantially function as capacitors.

The extraction electrode portion 31B extends from the counter electrode portion 31A toward the first end surface LS1 of the laminate 10 and is exposed at the first end surface LS1. The extraction electrode portion 32B extends from the counter electrode portion 32A toward the second end surface LS2 of the laminate 10 and is exposed at the second end surface LS2. The shape of the extraction electrode portion 31B and the extraction electrode portion 32B is not particularly limited, and may be, for example, a substantially rectangular shape.

As a result, the first internal electrode layer 31 is connected to the first external electrode 41, and the first internal electrode layer 31 and the second end surface LS2 of the laminate 10, that is, the second external electrode 42 are connected. A gap exists in between. In addition, the second internal electrode layer 32 is connected to the second external electrode 42, and between the second internal electrode layer 32 and the first end surface LS1 of the laminate 10, that is, the first external electrode 41, there is a gap in

The first internal electrode layers 31 and the second internal electrode layers 32 contain metal Ni as a main component. In addition, the first internal electrode layer 31 and the second internal electrode layer 32 are formed of metals such as Cu, Ag, Pd, or Au, or alloys containing at least one of these metals, such as Ag—Pd alloys. , may be included as a main component, or may be included as a component other than the main component. Furthermore, the first internal electrode layer 31 and the second internal electrode layer 32 may contain dielectric particles having the same composition as the ceramic contained in the dielectric layer 20 as a component other than the main component. In this specification, the metal of the main component is defined as the metal component with the highest weight percentage.

As shown in FIG. 11, the laminate 10 includes, in the width direction W, an electrode facing portion W30 facing the internal electrode layers 30, and a first side gap portion WG1 and a first side gap portion WG1 arranged to sandwich the electrode facing portion W30. 2 side gap portions WG2. The first side gap portion WG1 is located between the electrode facing portion W30 and the first side surface WS1, and the second side gap portion WG2 is located between the electrode facing portion W30 and the second side surface WS2. do. More specifically, the first side gap portion WG1 is located between the end of the internal electrode layer 30 on the side of the first side surface WS1 and the first side surface WS1, and the second side gap portion WG2 is It is located between the end of the internal electrode layer 30 on the side of the second side surface WS2 and the second side surface WS2. The first side gap portion WG1 and the second side gap portion WG2 do not include the internal electrode layers 30, and include only the dielectric layers 20. As shown in FIG. The first side gap portion WG1 and the second side gap portion WG2 are portions that function as protective layers for the internal electrode layers 30 . The first side gap portion WG1 and the second side gap portion WG2 are also referred to as W gaps.

As shown in FIG. 10, the laminated body 10 includes, in the length direction L, an electrode facing portion L30 in which the first internal electrode layer 31 and the second internal electrode layer 32 of the internal electrode layer 30 face each other; end gap portion LG1 and a second end gap portion LG2. The first end gap portion LG1 is located between the electrode facing portion L30 and the first end surface LS1, and the second end gap portion LG2 is located between the electrode facing portion L30 and the second end surface LS2. do. More specifically, the first end gap portion LG1 is located between the end of the second internal electrode layer 32 on the side of the first end surface LS1 and the first end surface LS1. LG2 is located between the end of the first internal electrode layer 31 on the second end surface LS2 side and the second end surface LS2. The first end gap portion LG1 does not include the second internal electrode layer 32, but includes the first internal electrode layer 31 and the dielectric layer 20, and the second end gap portion LG2 includes the first internal electrode layer 31 but includes the second internal electrode layer 32 and the dielectric layer 20 . The first end gap portion LG1 is a portion that functions as a lead electrode portion to the first end surface LS1 of the first internal electrode layer 31, and the second end gap portion LG2 is a portion that functions as the second internal electrode layer 32. This is a portion that functions as a lead-out electrode portion to the second end surface LS2 of the . The first end gap portion LG1 and the second end gap portion LG2 are also called L gaps.

Note that the counter electrode portion 31A of the first internal electrode layer 31 and the counter electrode portion 32A of the second internal electrode layer 32 described above are located in the electrode facing portion L30. In addition, the lead electrode portion 31B of the first internal electrode layer 31 described above is located in the first end gap portion LG1, and the lead electrode portion 31B of the second internal electrode layer 32 described above is located in the second end gap portion LG2. An extraction electrode portion 32B is located.

External electrode 40 includes a first external electrode 41 and a second external electrode 42 .

The first external electrode 41 is arranged on the first end surface LS<b>1 of the laminate 10 and connected to the first internal electrode layer 31 . The first external electrode 41 may extend from the first end surface LS1 to part of the first main surface TS1 and part of the second main surface TS2. Also, the first external electrode 41 may extend from the first end surface LS1 to a portion of the first side surface WS1 and a portion of the second side surface WS2.

The second external electrode 42 is arranged on the second end surface LS<b>2 of the laminate 10 and connected to the second internal electrode layer 32 . The second external electrode 42 may extend from the second end surface LS2 to a portion of the first main surface TS1 and a portion of the second main surface TS2. Also, the second external electrode 42 may extend from the second end surface LS2 to a portion of the first side surface WS1 and a portion of the second side surface WS2.

The first external electrode 41 has a first base electrode layer 41A and a first plating layer 41B, and the second external electrode 42 has a second base electrode layer 42A and a second plating layer 42B. have The first external electrode 41 may be composed only of the first plated layer 41B, and the second external electrode 42 may be composed only of the second plated layer 42B.

The first base electrode layer 41A and the second base electrode layer 42A may be fired layers containing metal and glass. Examples of glass include glass components containing at least one selected from B, Si, Ba, Mg, Al, Li, and the like. As a specific example, borosilicate glass can be used. The metal contains Cu as a main component. In addition, the metal may contain at least one selected from metals such as Ni, Ag, Pd, or Au, or alloys such as Ag—Pd alloys as a main component, or may contain as a component other than the main component. It's okay.

The fired layer is a layer obtained by coating a laminate with a conductive paste containing metal and glass by a dipping method and firing the paste. The firing may be performed after firing the internal electrode layers, or may be performed simultaneously with the firing of the internal electrode layers. Also, the fired layer may be a plurality of layers.

Alternatively, the first base electrode layer 41A and the second base electrode layer 42A may be resin layers containing conductive particles and thermosetting resin. The resin layer may be formed on the fired layer described above, or may be formed directly on the laminate without forming the fired layer.

The resin layer is a layer obtained by applying a conductive paste containing conductive particles and a thermosetting resin to the laminate by a coating method and baking the paste. The firing may be performed after firing the internal electrode layers, or may be performed simultaneously with the firing of the internal electrode layers. Also, the resin layer may be a plurality of layers.

The thickness of each of the first base electrode layer 41A and the second base electrode layer 42A as the fired layer or resin layer is not particularly limited, and may be 1 μm or more and 10 μm or less.

Alternatively, the first base electrode layer 41A and the second base electrode layer 42A may be formed by a thin film forming method such as sputtering or vapor deposition, and may be thin film layers of 1 μm or less in which metal particles are deposited.

The first plating layer 41B covers at least part of the first base electrode layer 41A, and the second plating layer 42B covers at least part of the second base electrode layer 42A. The first plated layer 41B and the second plated layer 42B contain, for example, at least one selected from metals such as Cu, Ni, Ag, Pd, and Au, and alloys such as Ag—Pd alloys.

Each of the first plating layer 41B and the second plating layer 42B may be formed of multiple layers. A two-layer structure of Ni plating and Sn plating is preferred. The Ni plating layer can prevent the base electrode layer from being eroded by solder when mounting the ceramic electronic component, and the Sn plating layer improves the wettability of the solder when mounting the ceramic electronic component. , can be easily implemented.

The thickness of each layer of the first plating layer 41B and the second plating layer 42B is not particularly limited, and may be 1 μm or more and 10 μm or less.

The conductive member 50 is arranged on the mounting surface side of the external electrode 40 , that is, the first external electrode 41 and the second external electrode 42 . Examples of the conductive member 50 include bumps, interposers, and the like. As a result, the occurrence of so-called squealing can be suppressed. Details are given below.

In such an electronic component 1, when a voltage is applied between the external electrodes 40, the dielectric layer 20 causes an electric field-induced strain according to the applied voltage. When the electronic component 1 is surface-mounted on a substrate, this electric field-induced strain causes the electronic component 1 to deform the substrate and produce a sound called "squeal" depending on the frequency of this deformation. And when this "squeal" becomes large, it causes a problem of noise.

Regarding this problem, it is known to suppress the wetting of the solder in order to suppress the noise. For example, by arranging a conductive member 50 such as a bump or an interposer on the mounting surface side of the electronic component 1, it is possible to suppress the wetting of solder and the occurrence of noise.

(Method for manufacturing electronic component)
Next, a method for manufacturing the electronic component (multilayer ceramic capacitor) 1 described above will be described. First, a dielectric sheet for the dielectric layers 20 and a conductive paste for the internal electrode layers 30 are prepared. Dielectric sheets and conductive pastes contain binders and solvents. Known materials can be used as the binder and solvent.

Next, an internal electrode pattern is formed on the dielectric sheet by printing a conductive paste on the dielectric sheet, for example, in a predetermined pattern. As a method for forming the internal electrode pattern, screen printing, gravure printing, or the like can be used.

Next, a predetermined number of dielectric sheets for the second outer layer portion 10C on which the internal electrode pattern is not printed are laminated. Dielectric sheets for the inner layer portion 10A on which the internal electrode patterns are printed are successively laminated thereon. A predetermined number of dielectric sheets for the first outer layer portion 10B on which the internal electrode pattern is not printed are laminated thereon. Thereby, a laminated sheet is produced.

Next, the laminated sheet is pressed in the lamination direction by a means such as isostatic pressing to produce a laminated block. Next, the laminated block is cut into a predetermined size to cut out laminated chips. At this time, the corners and ridges of the laminated chips are rounded by barrel polishing or the like. Next, the laminated chip is fired to produce the laminated body 10 . The firing temperature is preferably 900° C. or more and 1400° C. or less, although it depends on the materials of the dielectric and internal electrodes.

In addition, as a method of fabricating the laminated chip, a method of applying the dielectric of the side gaps on the side surfaces WS1 and WS2 in the width direction W of the laminated body afterward may be applied. In this case, both ends of the internal electrode layers in the width direction W are aligned (with an error of 5 μm, for example).

Next, by dipping the first end surface LS1 of the laminate 10 in a conductive paste, which is an electrode material for the underlying electrode layer, the first underlying electrode layer 415 is formed on the first end surface LS1. Apply conductive paste for Similarly, by dipping the second end face LS2 of the laminate 10 in a conductive paste, which is an electrode material for the base electrode layer, a second base electrode layer 425 is formed on the second end face LS2. Apply conductive paste for After that, by firing these conductive pastes, the first base electrode layer 415 and the second base electrode layer 425, which are fired layers, are formed. The firing temperature is preferably 600° C. or higher and 900° C. or lower.

As described above, the first base electrode layer 415 and the second base electrode layer 415, which are resin layers, are formed by applying a conductive paste containing conductive particles and a thermosetting resin by a coating method and baking the paste. The layer 425 may be formed, or the first base electrode layer 415 and the second base electrode layer 425 which are thin films may be formed by a thin film formation method such as a sputtering method or an evaporation method.

In the above description, the base electrode layer was formed and fired after the laminated chip was fired, that is, the stacked body and the external electrodes were fired separately. However, the base electrode layer may be formed and fired before firing the laminated chip, that is, the stacked body and the external electrodes may be fired at the same time.

Thereafter, a first plated layer 416 is formed on the surface of the first base electrode layer 415 to form the first external electrode 41, and a second plated layer 426 is formed on the surface of the second base electrode layer 425. Then, the second external electrodes 42 are formed. Through the above steps, the electronic component (multilayer ceramic capacitor) 1 described above is obtained.

Thereafter, the electronic components 1 are collectively aligned and held (aligning step). The alignment process and the alignment apparatus used in the alignment process will be described later.

After that, a conductive member 50 such as a bump or an interposer is placed on the mounting surface side of the external electrode 40, that is, the first external electrode 41 and the second external electrode 42 (conductive member placement step). For example, when forming bumps, a conductive paste is applied or printed on the mounting surface side of the first external electrode 41 and the second external electrode 42 and fired. The conductive paste includes a metal material containing at least one high melting point metal selected from Cu and Ni and Sn as a low melting point metal.

(Electronic component manufacturing equipment: alignment equipment)
Next, an alignment device in the electronic component manufacturing apparatus according to the present embodiment will be described with reference to FIGS. 1 and 2. FIG. FIG. 1 is a schematic plan view showing an alignment device in the electronic component manufacturing apparatus according to the present embodiment, and FIG. 2 is a schematic cross section of the alignment device in the electronic component manufacturing apparatus shown in FIG. 1 along line II-II. It is a diagram.

An aligning device (manufacturing device) 100 shown in FIGS. 1 and 2 is a device that collectively aligns and holds electronic components 1 in the aligning step in the above-described electronic component manufacturing method. The alignment device 100 includes a first alignment plate (first flat plate) 110, a second alignment plate (second flat plate) 120, a holding jig (third flat plate) 130, a holding plate (fourth flat plate) 140, It includes a magnet 150 , a table 152 , a plurality of pressing members 160 and a control section 170 .

1 omits components other than the first alignment plate 110, the second alignment plate 120, and the holding jig 130 in the alignment device 100 in FIG. 1 and 2 also show an XYZ orthogonal coordinate system. Note that the XYZ orthogonal coordinate system in FIGS. 1 and 2 and the XYZ orthogonal coordinate system in FIGS. 9 to 11 do not necessarily match. 1 and 2, the XY plane is a plane along the upper and lower surfaces of first alignment plate 110, second alignment plate 120, holding jig 130, and holding plate 140, and the Z direction is the plane along first alignment plate 110. , the direction in which the second alignment plate 120, the holding jig 130, and the holding plate 140 are overlapped.

The first alignment plate 110 has a plurality of first through holes 112 aligned in the Y direction (predetermined direction) and the X direction. The first through hole 112 has a rectangular shape or a substantially rectangular shape corresponding to the shape of the electronic component 1 . For example, if the length in the length direction L of the electronic component 1 is L1, the width in the width direction W is W1, and the thickness in the thickness direction T is T1 (such as 1206 size, generally L1= 2×W1=2×T1 in many cases), and the size of the first through-hole 112 in the X direction may be larger than L1, preferably about 1.2×L1. The size of the first through-hole 112 in the Y direction should be larger than √(W1 ² +T1 ² )×W1 and smaller than L1, preferably about 1.5×W1. The size of the first through hole 112 in the Z direction should be larger than √(W1 ² +T1 ² )×W1. As a result, the electronic component 1 can be easily transferred into the first through-hole 112 in the transfer step described later. Further, in the first alignment process described later, it is possible to facilitate rotation of the electronic component 1 in the first through hole 112 .

The upper surface side of the peripheral portion of the first through hole 112 in the first alignment plate 110 is tapered. As a result, the electronic component 1 can be easily transferred into the first through-hole 112 in the transfer step described later.

The first alignment plate 110 includes metal, resin, or an elastic member. This can reduce damage to the electronic component 1 .

The second alignment plate 120 has a plurality of second through holes 122 aligned in the Y direction (predetermined direction) and the X direction. The second alignment plate 120 is arranged on the lower surface side of the first alignment plate 110 so that at least part of the second through holes 122 do not overlap the first through holes 112 . The second through hole 122 has a rectangular shape or a substantially rectangular shape corresponding to the shape of the electronic component 1 . The size of the second through hole 122 in the Y direction is smaller than the size of the first through hole 112 in the Y direction. The X-direction and Z-direction sizes of the second through holes 122 may be the same as the X- and Z-direction sizes of the first through holes 112 . Thereby, the posture of the electronic component 1 can be stabilized in the second alignment process and the first holding process, which will be described later.

The upper surface side of the peripheral portion of the second through hole 122 in the second alignment plate 120 is tapered. This makes it easier to rotate the electronic component 1 by 90 degrees when dropping the electronic component 1 into the second through hole 122 in the second alignment step, which will be described later.

The second alignment plate 120 includes metal, resin, or an elastic member. This can reduce damage to the electronic component 1 .

The holding jig 130 is arranged on the lower surface side of the second alignment plate 120 . The holding jig 130 has a plurality of third through holes 132 aligned in the Y direction (predetermined direction) and the X direction. An elastic member 134 is arranged on the inner wall of the third through hole 132 . Holding jig 130 holds electronic component 1 in third through-hole 132 with elastic member 134 on the inner wall of third through-hole 132 .

The third through hole 132 has a rectangular shape or a substantially rectangular shape corresponding to the shape of the electronic component 1 . The size of the third through hole 132 in the Y direction is smaller than the size of the first through hole 112 in the Y direction. The X-direction and Z-direction sizes of the third through-hole 132 may be the same as the X- and Z-direction sizes of the second through hole 122 .

The holding jig 130 contains metal or resin, and the elastic member 134 contains rubber or silicone resin. This can reduce damage to the electronic component 1 .

The holding plate 140 has adhesiveness and holds the electronic component 1 .

The platform 152 is a platform for moving the magnets 150 and is arranged between the first alignment plate 110 and the magnets 150 . The magnet 150 is a rectangular parallelepiped extending in the X direction and moves along the table 152 in the Y direction (predetermined direction).

The pressing member 160 is a member for pressing the electronic component 1 . The pressing member 160 has a rectangular cross-sectional shape corresponding to the first through hole 112, the second through hole 122, and the third through hole 132, and has a rectangular parallelepiped shape extending in the Z direction. The pressing member 160 includes metal, resin, or an elastic member. This can reduce damage to the electronic component 1 .

The control unit 170 controls the alignment device (manufacturing device) 100 as a whole. The control unit 170 functions to implement a transferring process, a first aligning process, a second aligning process, a first holding process, and a second holding process in the aligning process, which will be described later.

The control unit 170 is composed of an arithmetic processor such as a CPU (Central Processing Unit), a DSP (Digital Signal Processor), and an FPGA (Field-Programmable Gate Array). Various functions of the control unit 170 are implemented by executing programs (applications) stored in the storage unit, for example. The program (application) may be provided via a network, or stored in a computer readable storage medium 40 such as a CD-ROM (Compact Disc Read only memory) or a DVD (Digital Versatile Disc). May be recorded and provided. Recording media include non-transitory tangible media.

(Electronic component manufacturing method: Alignment process)
Next, the alignment process described above in the method of manufacturing an electronic component according to the present embodiment will be described with reference to FIGS. 3 to 8. FIG. FIG. 3 is a schematic diagram showing the transfer step in the alignment step in the electronic component manufacturing method according to the present embodiment. FIG. 4 is a schematic diagram showing a first alignment step (first plate alignment step) in the alignment step in the electronic component manufacturing method according to the present embodiment, and FIG. 5 is a schematic diagram showing the electronic component manufacturing method according to the present embodiment. is a schematic view showing a second alignment step (second plate alignment step) in the alignment step in . FIG. 6 is a schematic diagram showing the first holding step in the alignment step in the electronic component manufacturing method according to the present embodiment, and FIG. It is the schematic which shows a process. Moreover, FIG. 8 is a schematic diagram showing a conductive member placement step in the method of manufacturing an electronic component according to the present embodiment.

First, a plurality of electronic components 1 having external electrodes 40 formed on the end surfaces of the laminate 10 are arranged on the upper surface of the first alignment plate 110 . Next, as shown in FIG. 3, by vibrating the first alignment plate 110 under the control of the control unit 170, the electronic components 1 arranged on the upper surface of the first alignment plate 110 are moved to the position of the first alignment plate 110. Each is transferred to the first through holes 112 (transfer step).

At this time, as described above, since the size of the first through-hole 112 in the Y direction is relatively large, the electronic component 1 can be easily transferred into the first through-hole 112 . Further, since the upper surface side of the peripheral portion of the first through hole 112 in the first alignment plate 110 is tapered, the electronic component 1 can be easily transferred into the first through hole 112 .

Next, as shown in FIG. 4, the stacking direction T of the electronic components 1 is collectively aligned. Specifically, the magnet 150 is moved in the Y direction (predetermined direction) on the table 152 under the control of the controller 170 . As a result, the magnetic lines of force act on the internal electrode layers to rotate the electronic component 1 whose stacking direction T is not the Y direction in the first through hole 112, and the stacking direction T of all the electronic components 1 is the Y direction, in other words, horizontal. The electronic components 1 are collectively aligned so that they are aligned in the direction (first alignment step). The moving speed of the magnet 150 is preferably 100 mm/s or less. Also, the movement of the magnet 150 may be performed multiple times.

Note that instead of moving the magnet 150 in the X direction, the first alignment plate 110 may be moved in the X direction. That is, the magnet 150 may be moved in the X direction relative to the first alignment plate 110 .
Alternatively, the magnets 150 may be moved on the upper surface side of the first alignment plate 110 or the magnets 150 may be moved on the lower surface side of the first alignment plate 110 .

At this time, as described above, since the size of the first through hole 112 in the Y direction is relatively large, the electronic component 1 can be easily rotated in the first through hole 112 . As described above, if the second alignment plate 120 is arranged on the lower surface side of the first alignment plate 110 so that at least a part of the second through holes 122 do not overlap the first through holes 112, electrons The component 1 can be clipped into the first through hole 112 .

Next, as shown in FIG. 5, the electronic components 1 are collectively aligned so that the stacking direction T of the electronic components 1 is rotated by 90 degrees. Specifically, under the control of the controller 170, the first alignment plate 110 is moved in the Y direction (predetermined direction) so that the first through holes 112 and the second through holes 122 communicate with each other. Thereby, the electronic component 1 in the first through hole 112 is dropped into the second through hole 122 of the second alignment plate 120 . At this time, the electronic components 1 are collectively aligned so that the stacking direction T of the electronic components 1 is rotated 90 degrees from the Y direction (predetermined direction) (second alignment step). As a result, the electronic components 1 are collectively aligned so that the stacking direction T of all the electronic components 1 in the second through holes 122 is aligned with the Z direction, in other words, the vertical direction.

At this time, as described above, since the size of the second through-hole 122 in the Y direction is relatively small, the posture of the electronic component 1 in the second through-hole 122 is stabilized. In addition, since the upper surface side of the peripheral portion of the second through hole 122 in the second alignment plate 120 is tapered, when the electronic component 1 is dropped from the first through hole 112 into the second through hole 122, the upper surface side is tapered. , it is easy to rotate the electronic component 1 by 90 degrees.

Note that instead of moving the first alignment plate 110 in the X direction, the second alignment plate 120 and the holding jig 130 may be moved in the X direction. That is, the first alignment plate 110 may be moved in the X direction relative to the second alignment plate 120 and the holding jig 130 .

Next, as shown in FIG. 6, the electronic component 1 is held in the third through hole 132 of the holding jig 130 . Specifically, the electronic component 1 is pressed using the pressing member 160 under the control of the control unit 170 . As a result, the electronic component 1 in the second through hole 122 is moved to the third through hole 132 of the holding jig 130, and the electronic component 1 is held by the elastic member 134 on the inner wall of the third through hole 132 (first holding step).

At this time, as described above, the size of the second through hole 122 in the Y direction is relatively small. , can be held.

Next, as shown in FIG. 7, the electronic component 1 is held by the holding plate 140 . Specifically, under the control of the control unit 170, the second alignment plate 120 and the first alignment plate 110 are removed from the holding jig 130 to prepare the holding plate 140, and the pressing member 160 is used to press the electronic component 1. . Thereby, the electronic component 1 in the third through hole 132 is moved to the holding plate 140, and the electronic component 1 is held by the holding plate 140 (second holding step).

Next, as shown in FIG. 8, conductive members 50 such as bumps or interposers are placed on the mounting surface side of the external electrodes 40 of the electronic component 1 held by the holding plate 140 (conductive member placement step). For example, when forming bumps, a conductive paste is applied or printed on the mounting surface side of the first external electrode 41 and the second external electrode 42 and fired.

At this time, since the posture of the electronic component 1 is stable as described above, for example, the position of the surface to which the conductive paste is applied for the conductive member 50 is stabilized.

Here, a comparative example devised by the inventors of the present application in the course of reaching the present embodiment described above will be described. FIG. 12 is a schematic cross-sectional view showing an electronic component aligning device and an aligning process according to a comparative example. The aligning device of the comparative example shown in FIG. different in that it does not have

In the aligning device of the comparative example, it is preferable that through-hole 112 of first aligning plate 110 is small from the viewpoint of aligning electronic components. However, if the through-holes 112 of the first alignment plate 110 are made smaller, it becomes difficult to deposit the electronic components 1 into the through-holes 112 when the first alignment plate 110 is vibrated to deposit the electronic components 1 into the through-holes 112 .

Therefore, it is necessary to enlarge the through hole 112 of the first alignment plate 110 from the viewpoint of transferability of electronic components. However, if the through-hole 112 of the first alignment plate 110 is enlarged, the attitude of the electronic component 1 becomes unstable in the through-hole 112 . For example, the electronic component 1 becomes oblique in the through hole 112 . Therefore, when the electronic component 1 is pressed against the through hole 132 of the holding jig 130, the electronic component 1 is aligned and held in an unstable posture.

If the electronic component 1 is held in alignment in the holding jig 130 in an unstable posture, for example, in the above-described conductive member placement step, the position of the conductive paste applied surface for the conductive member 50 is shifted. It becomes unstable.

In this regard, according to the electronic component manufacturing apparatus of the present embodiment, the alignment device 100 includes the second alignment plate 120 between the first alignment plate 110 and the holding jig 130, and the first alignment plate 110 The first through holes 112 are relatively large, and the second through holes 122 of the second alignment plate 120 are smaller than the first through holes 112 of the first alignment plate 110 .
Further, according to the electronic component manufacturing method of the present embodiment, in the alignment step, the electronic components 1 are transferred (transfer step) into the relatively large first through holes 112 of the first alignment plate 110 , and the first alignment plate 110 The electronic component 1 is dropped from the first through hole 112 of the second aligning plate 120 into the relatively small second through hole 122 of the second aligning plate 120 (second aligning step), and the holding jig is inserted through the second through hole 122 of the second aligning plate 120. The electronic component 1 is pushed into the third through hole 132 of the tool 130 (first holding step).

As a result, it is possible to improve the transferability of the electronic component 1 into the relatively large first through-hole 112 of the first alignment plate 110 . Also, the posture of the electronic component 1 can be stabilized in the relatively small second through holes 122 of the second alignment plate 120 . Therefore, when the electronic component 1 is pressed against the third through hole 132 of the holding jig 130, the electronic component 1 can be aligned and held in a stable posture. Therefore, the alignment of the position and posture of the electronic component 1 can be improved.

Further, according to the electronic component manufacturing apparatus of the present embodiment, the alignment device 100 includes the magnet 150 and the table 152 .
Moreover, according to the manufacturing method of the electronic component of the present embodiment, in the aligning process, the stacking direction of the electronic components 1 is collectively aligned in the horizontal direction (first aligning process). Further, when the electronic component 1 is dropped from the first through hole 112 of the first alignment plate 110 into the second through hole 122 of the second alignment plate 120, the electronic component 1 rotates 90 degrees and the stacking direction of the electronic component 1 becomes vertical. aligned together in the direction (second alignment step).
Thereby, the alignment of the electronic component 1 in the lamination direction can be improved.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various changes and modifications are possible. For example, in the above-described embodiments, the electronic component manufacturing method including the alignment step of collectively aligning the positions and orientations of the electronic components and the stacking direction has been illustrated. However, the present invention is not limited to this, and can also be applied to an electronic component manufacturing method including an alignment step of collectively aligning the positions and orientations of electronic components. In this case, in the alignment process, the first alignment process of collectively aligning the stacking direction of the electronic components can be omitted. In this case, the alignment device in the electronic component manufacturing apparatus does not need to include the magnet 150 and the base 152 .

Moreover, in the above-described embodiments, a laminated ceramic capacitor is exemplified as an electronic component. However, the present invention is not limited to this, and can be applied to various laminated electronic components in which a plurality of dielectric layers and one or a plurality of conductor layers are laminated, such as laminated inductors and laminated resistors. . Furthermore, the present invention is not limited to laminated electronic components, and can be applied to various electronic components.

Further, in the above-described embodiments, the step of collectively arranging the conductive members on the electronic component was exemplified as the process after the alignment step. However, the present invention is not limited to this, and can be applied as a pre-process for various processes collectively performed on electronic components.

1 Electronic components (multilayer ceramic capacitors)
100 alignment device (manufacturing device)
110 first alignment plate (first flat plate)
112 first through hole 120 second alignment plate (second flat plate)
122 second through hole 130 holding jig (third flat plate)
132 third through hole 134 elastic member 140 holding plate (fourth flat plate)
150 magnet 152 base 160 pressing member 170 control unit

Claims (17)

An electronic component manufacturing method including an alignment step of collectively aligning a plurality of electronic components using an alignment device,
The alignment device
a first flat plate having a plurality of first through holes aligned in a predetermined direction;
It has a plurality of second through holes aligned in the predetermined direction, and is provided on the lower surface side of the first flat plate so that at least a part of the plurality of second through holes does not overlap with the plurality of first through holes. an arranged second flat plate, wherein the plurality of second through holes are smaller than the plurality of first through holes;
A third flat plate having a plurality of third through holes aligned in the predetermined direction and arranged on a lower surface side of the second flat plate, wherein the plurality of third through holes are the plurality of second through holes the third flat plate, which is smaller than the third through-holes and has a plurality of elastic members arranged on the inner walls of the plurality of third through-holes;
with
The alignment step includes
a transferring step of transferring the plurality of electronic components arranged on the upper surface of the first flat plate into the plurality of first through holes by vibrating the first flat plate;
By moving the first flat plate in the predetermined direction relative to the second flat plate so that the plurality of first through holes and the plurality of second through holes communicate with each other, the a second flat plate aligning step of dropping the plurality of electronic components in the first through holes into the plurality of second through holes;
By pressing the plurality of electronic components using a plurality of pressing members, the plurality of electronic components in the plurality of second through holes are moved to the plurality of third through holes, respectively, and the plurality of third a first holding step of respectively holding the plurality of electronic components by the plurality of elastic members on the inner wall of the through hole;
A method of manufacturing an electronic component, comprising: an upper surface side of a peripheral edge portion of each of the plurality of first through-holes in the first flat plate is tapered,
The upper surface side of the peripheral edge of each of the plurality of second through holes in the second flat plate is tapered,
A method for manufacturing an electronic component according to claim 1 . The first flat plate includes metal, resin, or an elastic member,
the second flat plate includes metal, resin, or an elastic member,
each of the plurality of pressing members has a rectangular parallelepiped shape and includes metal, resin, or an elastic member;
3. The method of manufacturing an electronic component according to claim 1 or 2. 4. The method of manufacturing an electronic component according to claim 1, wherein said plurality of elastic members on inner walls of said plurality of third through holes contain rubber or silicone resin. Each of the plurality of electronic components includes a laminate in which a plurality of dielectric layers and one or more conductor layers are laminated, and an external electrode disposed on the surface of the laminate,
In the aligning step, between the transferring step and the second flat plate aligning step,
By moving the magnet in the predetermined direction relative to the first flat plate, the plurality of electronic components are rotated in the plurality of first through holes, and the stacking direction of the plurality of electronic components is aligned with the predetermined direction. A first plate alignment step of collectively aligning the plurality of electronic components so that they are aligned,
In the second flat plate aligning step, when the plurality of electronic components in the plurality of first through holes are respectively dropped into the plurality of second through holes, the stacking direction of the plurality of electronic components is 90 degrees from the predetermined direction. The plurality of electronic components are collectively aligned so as to rotate;
A method for manufacturing an electronic component according to any one of claims 1 to 4. The alignment device comprises a fourth plate,
The aligning step includes, after the first holding step,
By pressing the plurality of electronic components using the plurality of pressing members, the plurality of electronic components in the plurality of third through holes are moved to the fourth flat plate, and the fourth flat plate moves the plurality of electronic components. Including a second holding step of holding the electronic component,
A method for manufacturing an electronic component according to claim 5 . 7. The method of manufacturing an electronic component according to claim 6, wherein said fourth flat plate has adhesiveness. 8. The method of manufacturing an electronic component according to claim 6, further comprising, after the aligning step, placing a conductive member on the surface of the fourth flat plate on which the external electrodes of the plurality of electronic components are mounted. An electronic component manufacturing apparatus including an aligning device for collectively aligning a plurality of electronic components,
The alignment device
a first flat plate having a plurality of first through holes aligned in a predetermined direction;
It has a plurality of second through holes aligned in the predetermined direction, and is provided on the lower surface side of the first flat plate so that at least a part of the plurality of second through holes does not overlap with the plurality of first through holes. an arranged second flat plate, wherein the plurality of second through holes are smaller than the plurality of first through holes;
A third flat plate having a plurality of third through holes aligned in the predetermined direction and arranged on a lower surface side of the second flat plate, wherein the plurality of third through holes are the plurality of second through holes the third flat plate, which is smaller than the third through-holes and has a plurality of elastic members arranged on the inner walls of the plurality of third through-holes;
a control unit that controls the alignment device as a whole;
with
The control unit
by vibrating the first flat plate, the plurality of electronic components arranged on the upper surface of the first flat plate are respectively transferred into the plurality of first through holes;
By moving the first flat plate in the predetermined direction relative to the second flat plate so that the plurality of first through holes and the plurality of second through holes communicate with each other, the dropping the plurality of electronic components in the first through holes into the plurality of second through holes;
By pressing the plurality of electronic components using a plurality of pressing members, the plurality of electronic components in the plurality of second through holes are moved to the plurality of third through holes, respectively, and the plurality of third each of the plurality of electronic components is held by the plurality of elastic members on the inner wall of the through hole;
Manufacturing equipment for electronic components. an upper surface side of a peripheral edge portion of each of the plurality of first through-holes in the first flat plate is tapered,
The upper surface side of the peripheral edge of each of the plurality of second through holes in the second flat plate is tapered,
The electronic component manufacturing apparatus according to claim 9 . The first flat plate includes metal, resin, or an elastic member,
the second flat plate includes metal, resin, or an elastic member,
each of the plurality of pressing members has a rectangular parallelepiped shape and includes metal, resin, or an elastic member;
The electronic component manufacturing apparatus according to claim 9 or 10. 12. The electronic component manufacturing apparatus according to claim 9, wherein said plurality of elastic members on inner walls of said plurality of third through-holes include rubber or silicone resin. Each of the plurality of electronic components includes a laminate in which a plurality of dielectric layers and one or more conductor layers are laminated, and an external electrode disposed on the surface of the laminate,
The control unit
By moving the magnet in the predetermined direction relative to the first flat plate, the plurality of electronic components are rotated in the plurality of first through holes, and the stacking direction of the plurality of electronic components is aligned with the predetermined direction. collectively aligning the plurality of electronic components so as to align with
When the plurality of electronic components in the plurality of first through holes are respectively dropped into the plurality of second through holes, the plurality of Electronic parts are arranged all at once,
The electronic component manufacturing apparatus according to any one of claims 9 to 12. 14. The electronic component manufacturing apparatus according to claim 13, wherein said aligning device comprises a table arranged between said first flat plate and said magnet for moving said magnet. The alignment device comprises a fourth plate,
The control unit
By pressing the plurality of electronic components using the plurality of pressing members, the plurality of electronic components in the plurality of third through holes are moved to the fourth flat plate, and the fourth flat plate moves the plurality of electronic components. holding electronic components,
15. The electronic component manufacturing apparatus according to claim 13 or 14. 16. The electronic component manufacturing apparatus according to claim 15, wherein said fourth flat plate has adhesiveness. The control unit
17. The apparatus for manufacturing electronic components according to claim 15, wherein a conductive member is arranged on the surface of said fourth flat plate on which said external electrodes of said plurality of electronic components are mounted.

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