JP2023069239A

JP2023069239A - Coil component

Info

Publication number: JP2023069239A
Application number: JP2021180980A
Authority: JP
Inventors: 卓馬相良; Takuma Sagara
Original assignee: Murata Manufacturing Co Ltd
Current assignee: Murata Manufacturing Co Ltd
Priority date: 2021-11-05
Filing date: 2021-11-05
Publication date: 2023-05-18
Also published as: CN219778670U

Abstract

To provide a coil component capable of suppressing adverse effects caused by flux.SOLUTION: A coil component 1 includes a core 10 having a winding core portion 13 extending in one direction and a first flange portion 11 provided on a first end portion of the winding core portion 13 in the one direction, a wire 21 wound around the winding core portion 13, a first terminal electrode 31 provided on the first flange portion 11, a solder 50 connecting the first terminal electrode 31 and the wire 21, and a suppression portion 318 formed on the surface of the first flange portion 11 to prevent a flux from spreading.SELECTED DRAWING: Figure 2

Description

本開示は、コイル部品に関する。 The present disclosure relates to coil components.

特許文献１、及び特許文献２は、巻芯部と当該巻芯部の両端に設けられた一対の鍔部とを有するコアと、巻芯部に巻回されたワイヤと、一対の鍔部のそれぞれに設けられた端子電極と、を有したコイル部品を開示する。 Patent Documents 1 and 2 disclose a core having a winding core and a pair of flanges provided at both ends of the winding core, a wire wound around the winding core, and a pair of flanges. A coil component having terminal electrodes provided thereon is disclosed.

国際公開２０２０／２５５５９３号WO2020/255593 特許第５１５６０７６号公報Japanese Patent No. 5156076

従来のコイル部品において、ワイヤと端子電極とを、はんだによって接続することが考えられる。
しかしながら、はんだを用いる場合、はんだと共に用いられるフラックスが溶け、溶けたフラックスが濡れ拡がることでコイル部品に悪影響が生じる虞がある。例えば、濡れ拡がったフラックスがワイヤを伝って巻芯部に到る虞がある。また例えば、溶融したフラックスによってワイヤの絶縁被覆が軟化し当該絶縁被膜を劣化させる虞がある。絶縁被膜が劣化した場合には、巻芯部に巻回されたワイヤが短絡する虞もある。 In conventional coil components, it is conceivable to connect wires and terminal electrodes with solder.
However, when solder is used, the flux used together with the solder melts, and the melted flux may wet and spread, which may adversely affect the coil components. For example, there is a risk that the flux that has wetted and spread will travel along the wire and reach the winding core. Further, for example, the melted flux may soften the insulation coating of the wire and deteriorate the insulation coating. If the insulating coating deteriorates, there is a possibility that the wire wound around the winding core may be short-circuited.

本開示は、フラックスによる影響を抑えることができるコイル部品を提供することを目的とする。 An object of the present disclosure is to provide a coil component capable of suppressing the influence of flux.

本開示の一態様は、一方向に延びる巻芯部と、前記一方向における前記巻芯部の第１端部に設けられた第１鍔部とを有するコアと、前記巻芯部に巻回されたワイヤと、前記第１鍔部に設けられた端子電極と、前記端子電極と前記ワイヤとを接続するはんだと、前記第１鍔部の表面に形成され、フラックスの拡がりを抑える抑制部と、を備えることを特徴とするコイル部品である。 One aspect of the present disclosure is a core having a core extending in one direction and a first flange provided at a first end of the core in the one direction, and wound around the core. a terminal electrode provided on the first brim portion; solder connecting the terminal electrode and the wire; and a suppression portion formed on the surface of the first brim portion for suppressing spread of flux. A coil component characterized by comprising:

本開示の各態様によれば、フラックスによる悪影響を抑えることができる。 According to each aspect of the present disclosure, adverse effects of flux can be suppressed.

第１実施形態に係るコイル部品を示す正面図である。It is a front view which shows the coil component which concerns on 1st Embodiment. コイル部品の側面図である。It is a side view of a coil component. 図２のＩＩＩ－ＩＩＩ断面図である。3 is a cross-sectional view taken along line III-III of FIG. 2; FIG. コイル部品の製造工程を示す図である。It is a figure which shows the manufacturing process of coil components. コイル部品の製造工程を示す図である。It is a figure which shows the manufacturing process of coil components. 第２実施形態に係るコイル部品の側面図である。FIG. 11 is a side view of a coil component according to a second embodiment;

以下、本開示の一態様であるコイル部品を図示の実施の形態により詳細に説明する。なお、図面は一部に模式図を含む場合がある。模式図における寸法や比率は実際のコイル部品と異なる場合がある。 A coil component, which is one aspect of the present disclosure, will be described in detail below with reference to the illustrated embodiments. Note that the drawings may partially include schematic diagrams. The dimensions and ratios in the schematic diagrams may differ from the actual coil components.

（第１実施形態）
図１は、本実施形態に係るコイル部品１を示す正面図である。図２は、コイル部品１の側面図である。
図１及び図２に示すように、コイル部品１は、コア１０と、コア１０に巻回されたワイヤ２１と、ワイヤ２１の両端が接続された第１端子電極３１および第２端子電極３２と、ワイヤ２１と第１端子電極３１および第２端子電極３２とを電気的に接続するはんだ５０と、コア１０に取り付けられた磁性体板１５とを備える。コイル部品１は、例えば、コモンモードチョークコイル、トランス、結合インダクタなどの巻線型コイルとして用いられる。 (First embodiment)
FIG. 1 is a front view showing a coil component 1 according to this embodiment. FIG. 2 is a side view of the coil component 1. FIG.
As shown in FIGS. 1 and 2, the coil component 1 includes a core 10, a wire 21 wound around the core 10, and a first terminal electrode 31 and a second terminal electrode 32 to which both ends of the wire 21 are connected. , a solder 50 for electrically connecting the wire 21 to the first terminal electrode 31 and the second terminal electrode 32 , and a magnetic plate 15 attached to the core 10 . The coil component 1 is used, for example, as a wound coil such as a common mode choke coil, transformer, or coupled inductor.

コア１０は、ドラム状の形状を成す。すなわち、コア１０は、一方向に延びる形状であってワイヤ２１が巻回された巻芯部１３と、巻芯部１３の延びる方向の第１端に設けられ、当該方向と直交する方向に張り出す第１鍔部１１と、巻芯部１３の延びる方向の第１端とは反対側の第２端に設けられ、当該方向と直交する方向に張り出す第２鍔部１２とを有する。巻芯部１３の延びる方向は、巻芯部１３の軸方向ともいう。巻芯部１３は、軸方向に直交する横断面の形状が四角形状である。ただし、横断面は六角形状などの他の多角形状、真円または楕円の円状、多角形状および円状を組み合わせた形状のいずれでもよい。コア１０の材料は、例えば、フェライトの焼結体や、磁性粉含有樹脂の成型体などの磁性体が好ましく、アルミナや、樹脂などの非磁性体であってもよい。 The core 10 has a drum-like shape. That is, the core 10 has a shape extending in one direction and is provided with a winding core portion 13 around which the wire 21 is wound, and a first end in the extending direction of the winding core portion 13, and is stretched in a direction orthogonal to the direction. It has a protruding first flange portion 11 and a second flange portion 12 provided at a second end opposite to the first end in the extending direction of the winding core portion 13 and protruding in a direction orthogonal to that direction. The direction in which the core portion 13 extends is also referred to as the axial direction of the core portion 13 . The core portion 13 has a rectangular cross section perpendicular to the axial direction. However, the cross section may be any other polygonal shape such as a hexagonal shape, a circular shape such as a perfect circle or an elliptical shape, or a shape combining a polygonal shape and a circular shape. The material of the core 10 is preferably a magnetic material such as a sintered body of ferrite or a molded body of resin containing magnetic powder, or may be a non-magnetic material such as alumina or resin.

なお、以下では、コア１０の底面を実装基板に実装される面とし、コア１０の底面と反対側の面をコア１０の天面とする。巻芯部１３の軸方向をＬ方向とし、コア１０の底面においてＬ方向と直交する方向をＷ方向とし、コア１０の底面と天面の対向方向（底面および天面に直交する方向）をＴ方向とする。Ｔ方向は、Ｌ方向およびＷ方向に直交する。Ｔ方向の正方向（底面から天面への方向）を上方とし、Ｔ方向の負方向を下方とする。つまり、コア１０の底面は、鉛直方向下方に対応し、コア１０の天面は、鉛直方向上方に対応する。Ｌ方向をコア１０の長さ方向、Ｗ方向をコア１０の幅方向、Ｔ方向をコア１０の高さ方向ともいう。 In the following description, the bottom surface of core 10 is the surface to be mounted on a mounting substrate, and the surface opposite to the bottom surface of core 10 is the top surface of core 10 . The axial direction of the winding core 13 is the L direction, the direction orthogonal to the L direction at the bottom surface of the core 10 is the W direction, and the facing direction of the bottom surface and the top surface of the core 10 (the direction orthogonal to the bottom surface and the top surface) is T. direction. The T direction is orthogonal to the L and W directions. The positive direction in the T direction (the direction from the bottom surface to the top surface) is defined as upward, and the negative direction in the T direction is defined as downward. That is, the bottom surface of the core 10 corresponds to the downward direction in the vertical direction, and the top surface of the core 10 corresponds to the upward direction in the vertical direction. The L direction is also referred to as the length direction of the core 10 , the W direction as the width direction of the core 10 , and the T direction as the height direction of the core 10 .

第１鍔部１１は、略直方体形状を成す。すなわち、第１鍔部１１は、巻芯部１３側に面する内端面１１１と、Ｌ方向においてコア１０の外側に面し内端面１１１と対向する外端面１１２と、Ｔ方向においてコア１０の下方に位置し内端面１１１と外端面１１２とを連結しかつ実装時において実装基板側に向けられる底面１１３と、Ｔ方向においてコア１０の上方に位置し底面１１３と対向する天面１１４と、内端面１１１と外端面１１２とを連結しかつ底面１１３と天面１１４とを連結する２つの側面１１５とを有する。天面１１４には、内端面１１１の側から外端面１１２の側にワイヤ２１を引き出すための凹部１１６が形成されている。 The first collar portion 11 has a substantially rectangular parallelepiped shape. That is, the first flange portion 11 includes an inner end surface 111 facing the winding core portion 13 side, an outer end surface 112 facing the outer side of the core 10 in the L direction and facing the inner end surface 111, and an inner end surface 112 facing the inner end surface 111 in the L direction, and below the core 10 in the T direction. a bottom surface 113 that connects the inner end surface 111 and the outer end surface 112 and is oriented toward the mounting substrate during mounting; a top surface 114 that is located above the core 10 in the T direction and faces the bottom surface 113; It has two side surfaces 115 connecting the bottom surface 113 and the top surface 114 and connecting the outer end surface 112 to the bottom surface 111 . The top surface 114 is formed with a recess 116 for pulling out the wire 21 from the inner end surface 111 side to the outer end surface 112 side.

第２鍔部１２は、第１鍔部１１と同一形状を成す。すなわち、第２鍔部１２は、巻芯部１３側に面する内端面１２１と、Ｌ方向においてコア１０の外側に面し内端面１２１と対応する外端面１２２と、Ｔ方向においてコア１０の下方に位置し内端面１２１と外端面１２２を連結しかつ実装時において実装基板側に向けられる底面１２３と、Ｔ方向においてコア１０の上方に位置し底面１２３と対向する天面１２４と、内端面１２１と外端面１２２とを連結しかつ底面１２３と天面１２４とを連結する２つの側面１２５とを有する。天面１２４には、内端面１２１の側から外端面１２２の側にワイヤ２１を引き出すための凹部が形成されている。 The second collar portion 12 has the same shape as the first collar portion 11 . That is, the second flange portion 12 has an inner end surface 121 facing the core portion 13 side, an outer end surface 122 facing the outside of the core 10 in the L direction and corresponding to the inner end surface 121, and an outer end surface 122 facing the inner end surface 121 in the T direction. a bottom surface 123 that connects the inner end surface 121 and the outer end surface 122 and faces the mounting substrate during mounting; a top surface 124 that is located above the core 10 in the T direction and faces the bottom surface 123; and the outer end surface 122 and two side surfaces 125 connecting the bottom surface 123 and the top surface 124 . The top surface 124 is formed with a recess for pulling out the wire 21 from the inner end surface 121 side to the outer end surface 122 side.

磁性体板１５は、略矩形板状を成し、Ｔ方向の上方から覆うようにコア１０に固定される。すなわち、磁性体板１５は、一対の第１鍔部１１および第２鍔部１２に跨った状態で、これら第１鍔部１１および第２鍔部１２に固定されている。磁性体板１５は、第１鍔部１１の天面１１４と第２鍔部１２の天面１２４とに接着剤により取り付けられる。磁性体板１５の材料は、例えば、コア１０と同じである。コア１０と磁性体板１５は、ともに磁性体であるので、閉磁路を構成し、インダクタンス値の取得効率が向上する。したがって、磁気効率が上がり、少ないワイヤ数で所望のインダクタンス値が得られる。なお、磁性体板１５は第１鍔部１１および第２鍔部１２に対面する面に突起を有してもよい。磁性体板１５がかかる突起を有することで直流重畳特性が向上する。また、この実施形態では、コイル部品１は磁性体板１５を備えているが、磁性体板１５を備えてなくてもよい。 The magnetic plate 15 has a substantially rectangular plate shape and is fixed to the core 10 so as to cover it from above in the T direction. That is, the magnetic plate 15 is fixed to the first flange portion 11 and the second flange portion 12 while straddling the pair of the first flange portion 11 and the second flange portion 12 . The magnetic plate 15 is attached to the top surface 114 of the first flange portion 11 and the top surface 124 of the second flange portion 12 with an adhesive. The material of the magnetic plate 15 is the same as that of the core 10, for example. Since both the core 10 and the magnetic plate 15 are magnetic bodies, they form a closed magnetic circuit, improving the efficiency of obtaining the inductance value. Therefore, magnetic efficiency is increased, and a desired inductance value can be obtained with a small number of wires. The magnetic plate 15 may have projections on the surface facing the first flange portion 11 and the second flange portion 12 . Since the magnetic plate 15 has such protrusions, the DC superimposition characteristics are improved. Further, although the coil component 1 includes the magnetic plate 15 in this embodiment, the magnetic plate 15 may not be provided.

ワイヤ２１は、導線と、該導線を覆う絶縁被膜とを有する。導線は、例えば銅や、銀、金などの良導性の金属からなる。絶縁被膜は、ポリウレタンやポリアミドイミドなどの樹脂からなる。ワイヤ２１の第１端部は、第１端子電極３１に電気的に接続され、ワイヤ２１の第２端部は、第２端子電極３２に電気的に接続されている。 The wire 21 has a conducting wire and an insulating coating covering the conducting wire. The conducting wire is made of a highly conductive metal such as copper, silver, or gold. The insulating coating is made of resin such as polyurethane or polyamideimide. A first end of the wire 21 is electrically connected to the first terminal electrode 31 and a second end of the wire 21 is electrically connected to the second terminal electrode 32 .

第１端子電極３１は、第１鍔部１１に固定され、第２端子電極３２は、第２鍔部１２に固定されている。第１端子電極３１および第２端子電極３２の固定には、例えば熱硬化性を有するエポキシ樹脂系の接着剤が用いられる。接着剤には、シリカフィラーなどの無機フィラーが添加されていてもよい。第１端子電極３１および第２端子電極３２は、金属板を折り曲げて構成される。金属板は、ＦｅやＣｕを主成分とする金属材料から形成される。かかる金属材料は、例えば、金型加工が容易なステンレスやリン青銅などである。金属板の表面には、ニッケルとスズの合金めっきが施されている。
第１端子電極３１は、ワイヤ２１の第１端部を固定し、第２端子電極３２は、ワイヤ２１の第２端部を固定する。 The first terminal electrode 31 is fixed to the first collar portion 11 and the second terminal electrode 32 is fixed to the second collar portion 12 . For fixing the first terminal electrode 31 and the second terminal electrode 32, for example, a thermosetting epoxy resin-based adhesive is used. An inorganic filler such as silica filler may be added to the adhesive. The first terminal electrode 31 and the second terminal electrode 32 are formed by bending a metal plate. The metal plate is made of a metal material containing Fe or Cu as a main component. Examples of such metal materials include stainless steel and phosphor bronze, which are easy to mold. The surface of the metal plate is plated with an alloy of nickel and tin.
The first terminal electrode 31 fixes the first end of the wire 21 and the second terminal electrode 32 fixes the second end of the wire 21 .

はんだ５０は、ワイヤ２１の第１端部と第１端子電極３１とを電気的および物理的に接続し、ワイヤ２１の第２端部と第２端子電極３２とを電気的および物理的に接続する。 The solder 50 electrically and physically connects the first end of the wire 21 and the first terminal electrode 31, and electrically and physically connects the second end of the wire 21 and the second terminal electrode 32. do.

コイル部品１は、実装基板に実装される際、第１鍔部１１の底面１１３および第２鍔部１２の底面１２３が実装基板に対向する。このとき、巻芯部１３の軸方向と、実装基板の主面は平行となる。すなわち、コイル部品１は、ワイヤ２１の巻回軸が実装基板と平行となる横巻型である。 When the coil component 1 is mounted on the mounting substrate, the bottom surface 113 of the first flange portion 11 and the bottom surface 123 of the second flange portion 12 face the mounting substrate. At this time, the axial direction of the core portion 13 and the main surface of the mounting substrate are parallel. That is, the coil component 1 is of a horizontal winding type in which the winding axis of the wire 21 is parallel to the mounting substrate.

図１および図２に示すように、第１鍔部１１の外端面１１２には抑制部３１８が形成されている。抑制部３１８は、はんだ溶接時に、ワイヤ２１とはんだ５０との接続を良好にするために用いられるフラックスの当該はんだ５０からの濡れ拡がりを抑える部位である。抑制部３１８は、第１鍔部１１の外端面１１２の表面に形成された凹みを有し、外端面１１２の平面視において、はんだ５０は、この凹みに少なくとも一部が重なるように設けられている。この凹みは、第１鍔部１１の外端面１１２の表面へのレーザＱの照射による、いわゆるレーザ照射痕によって形成されている。なお、抑制部３１８の凹みは、レーザＱの照射に限らず、エッチングや工具による削り加工などによって形成してもよい。 As shown in FIGS. 1 and 2 , a suppressing portion 318 is formed on the outer end surface 112 of the first collar portion 11 . The suppressing portion 318 is a portion that suppresses the wetting and spreading of flux from the solder 50, which is used to improve the connection between the wire 21 and the solder 50 during solder welding. The suppressing portion 318 has a recess formed in the surface of the outer end surface 112 of the first collar portion 11, and the solder 50 is provided so that at least a portion of the recess overlaps with the outer end surface 112 in plan view. there is This recess is formed by a so-called laser irradiation mark caused by irradiation of the laser Q to the surface of the outer end face 112 of the first collar portion 11 . Note that the depression of the suppressing portion 318 may be formed not only by irradiation with the laser Q, but also by etching, cutting with a tool, or the like.

はんだ溶接時には、熱によって溶けたフラックスが抑制部３１８の凹みに貯まることで、フラックスの濡れ拡がりが抑えられる。したがって、濡れ拡がったフラックスによってワイヤ２１の絶縁被覆が軟化し当該絶縁被膜を劣化させたり、フラックスがワイヤ２１を伝って巻芯部１３に浸入し巻芯部１３に巻回されたワイヤ２１を短絡させたりする、といった事態を防止できる。 At the time of solder welding, flux melted by heat accumulates in the recesses of the suppressing portion 318, thereby suppressing wetting and spreading of the flux. Therefore, the flux that wets and spreads softens the insulation coating of the wire 21 and degrades the insulation coating, or the flux enters the winding core portion 13 along the wire 21 and short-circuits the wire 21 wound around the winding core portion 13 . It is possible to prevent situations such as

本実施形態において、抑制部３１８の凹みの開口部の外形３１８ａは、外端面１１２の平面視において略矩形状に形成されている。この外形３１８ａは、はんだ５０の外縁５０ａに沿った形状に形成されてもよい。具体的には、本実施形態において、はんだ５０は略半球状を成し、外端面１１２の平面視において、はんだ５０の外縁５０ａは略円形となっている。この場合、抑制部３１８の凹みの外形３１８ａは当該外縁５０ａに沿った略円形に形成されてもよい。このように、抑制部３１８の凹みの外形３１８ａがはんだ５０の外縁５０ａに沿った形状になることで、第１鍔部１１の外端面１１２において抑制部３１８の余分な凹みが抑えられ、抑制部３１８の大きさを抑えることができ、フラックスが濡れ拡がる範囲をより狭い範囲に制限することができる。なお、図１及び図２のはんだ５０の形状はあくまでも模式的に描かれたものであり、実際のはんだ５０の外縁５０ａの形状は、完全な円形ではない場合が多い。 In this embodiment, the outer shape 318a of the opening of the depression of the suppressing portion 318 is formed in a substantially rectangular shape when the outer end surface 112 is viewed from above. This outline 318 a may be formed in a shape along the outer edge 50 a of the solder 50 . Specifically, in the present embodiment, the solder 50 has a substantially hemispherical shape, and the outer edge 50a of the solder 50 has a substantially circular shape in plan view of the outer end surface 112 . In this case, the outer shape 318a of the depression of the suppressing portion 318 may be formed in a substantially circular shape along the outer edge 50a. In this way, the outer shape 318a of the depression of the suppressing portion 318 has a shape along the outer edge 50a of the solder 50, thereby suppressing an excessive depression of the suppressing portion 318 on the outer end surface 112 of the first collar portion 11, thereby suppressing the suppressing portion. 318 can be suppressed, and the range in which the flux wets and spreads can be restricted to a narrower range. Note that the shape of the solder 50 in FIGS. 1 and 2 is only schematically drawn, and the actual shape of the outer edge 50a of the solder 50 is often not a perfect circle.

第２鍔部１２の外端面１２２にも、第１鍔部１１の外端面１１２と同様に抑制部３２８が形成されており、抑制部３２８によって抑制部３１８と同様な効果が得られている。 Similarly to the outer end surface 112 of the first flange portion 11 , the suppression portion 328 is also formed on the outer end surface 122 of the second flange portion 12 , and the same effect as that of the suppression portion 318 is obtained by the suppression portion 328 .

図３は、図２のＩＩＩ－ＩＩＩ断面図である。図３では、はんだ５０を省略する。
図１、図２及び図３に示すように、第１端子電極３１は、第１鍔部１１の底面１１３及び外端面１１２に沿う断面略Ｌの字形状を成す。すなわち、第１端子電極３１は、第１鍔部１１の底面１１３に面する底面部３１１と、底面部３１１に接続され第１鍔部１１の外端面１１２に面する端面部３１２とを有する。Ｔ方向において端面部３１２の上方の端部は、かしめ部３１５を有する。 FIG. 3 is a cross-sectional view along III-III in FIG. In FIG. 3, the solder 50 is omitted.
As shown in FIGS. 1, 2 and 3, the first terminal electrode 31 has a substantially L-shaped cross section along the bottom surface 113 and the outer end surface 112 of the first collar portion 11 . That is, the first terminal electrode 31 has a bottom surface portion 311 facing the bottom surface 113 of the first collar portion 11 and an end surface portion 312 connected to the bottom surface portion 311 and facing the outer end surface 112 of the first collar portion 11 . An upper end portion of the end surface portion 312 in the T direction has a crimped portion 315 .

かしめ部３１５は、図３に示すように、第１鍔部１１の外端面１１２に面する支持部３１５ａと、支持部３１５ａに接続され支持部３１５ａ側に折り曲げられる曲げ部３１５ｂと、曲げ部３１５ｂに接続され当該曲げ部３１５ｂが折り曲げられた状態において支持部３１５ａに向かい合うように配置される把持部３１５ｃとを有する。支持部３１５ａと把持部３１５ｃは、平坦面を有し、曲げ部３１５ｂは、曲面を有する。 As shown in FIG. 3, the crimped portion 315 includes a support portion 315a facing the outer end surface 112 of the first collar portion 11, a bent portion 315b connected to the support portion 315a and bent toward the support portion 315a, and a bent portion 315b. and a grip portion 315c arranged to face the support portion 315a in a state in which the bent portion 315b is bent. The support portion 315a and the grip portion 315c have flat surfaces, and the bending portion 315b has a curved surface.

かしめ部３１５は、かしめられてワイヤ２１の第１端部の一部分２１ａを固定する。
具体的に述べると、かしめ部３１５は、把持部３１５ｃが支持部３１５ａに接近するように曲げ部３１５ｂを支点として曲げられて、ワイヤ２１の一部分２１ａを支持部３１５ａと把持部３１５ｃにより挟持する。つまり、ワイヤ２１の一部分２１ａは、支持部３１５ａ、曲げ部３１５ｂおよび把持部３１５ｃにより囲まれるかしめ部３１５内に位置する。 The crimped portion 315 is crimped to fix the first end portion 21 a of the wire 21 .
Specifically, the crimped portion 315 is bent around the bent portion 315b so that the grip portion 315c approaches the support portion 315a, and the portion 21a of the wire 21 is sandwiched between the support portion 315a and the grip portion 315c. That is, the portion 21a of the wire 21 is positioned within the crimped portion 315 surrounded by the support portion 315a, the bent portion 315b and the grip portion 315c.

はんだ５０は、かしめ部３１５とワイヤ２１とを電気的および物理的に接続する。
具体的に述べると、図２に示すように、ワイヤ２１は、かしめ部３１５の外を延びる部分に、絶縁被膜が剥がされて導線が露出した導線露出部２１ｃが形成されている。はんだ５０は、導線露出部２１ｃおよびかしめ部３１５を一体に覆う。これにより、ワイヤ２１の導線露出部２１ｃは、はんだ５０を介して、かしめ部３１５に電気的および物理的に接続される。なお、導線露出部２１ｃは、かしめ部３１５内に位置する上記一部分２１ａを含んでもよい。また、導線露出部２１ｃは、当該一部分２１ａの範囲内に形成されてもよい。この場合、導線露出部２１ｃがかしめ部３１５に直接的に接触することで電気的に接続され、はんだ５０は専らかしめ部３１５とワイヤ２１との物理的な接続に寄与する。 Solder 50 electrically and physically connects crimped portion 315 and wire 21 .
More specifically, as shown in FIG. 2, the wire 21 has an exposed wire portion 21c where the wire is exposed by peeling off the insulating film from the portion extending outside the crimped portion 315. As shown in FIG. The solder 50 integrally covers the conductor exposed portion 21c and the crimped portion 315 . As a result, the conductor exposed portion 21 c of the wire 21 is electrically and physically connected to the caulked portion 315 via the solder 50 . In addition, the conductive wire exposed portion 21 c may include the portion 21 a located within the crimped portion 315 . Also, the conductive wire exposed portion 21c may be formed within the range of the portion 21a. In this case, the conductor exposed portion 21c is electrically connected to the crimped portion 315 by directly contacting it, and the solder 50 exclusively contributes to the physical connection between the crimped portion 315 and the wire 21 .

第２端子電極３２は、図１に示すように、第１端子電極３１と同様に、第２鍔部１２の底面１２３に面する底面部３２１と、底面部３２１に接続され第２鍔部１２の外端面１２２に面する端面部３２２とを有する。端面部３２２の端部は、かしめ部３２５を有する。 As shown in FIG. 1 , the second terminal electrode 32 has a bottom surface portion 321 facing the bottom surface 123 of the second collar portion 12 and a bottom surface portion 321 connected to the bottom surface portion 321 , like the first terminal electrode 31 . and an end surface portion 322 facing the outer end surface 122 of the . An end portion of the end surface portion 322 has a crimped portion 325 .

かしめ部３２５は、第２鍔部１２の外端面１２２に対向する支持部３２５ａと、支持部３２５ａに接続され支持部３２５ａ側に折り曲げられる曲げ部３２５ｂと、曲げ部３２５ｂに接続され支持部３２５ａに向かい合うように配置される把持部３２５ｃと、を有する。 The crimped portion 325 includes a support portion 325a facing the outer end surface 122 of the second collar portion 12, a bent portion 325b connected to the support portion 325a and bent toward the support portion 325a, and a bent portion 325b connected to the support portion 325a. and holding portions 325c arranged to face each other.

かしめ部３２５は、かしめられてワイヤ２１の第２端部の一部分２１ａを固定する。はんだ５０は、かしめ部３２５とワイヤの第２端部の一部分２１ａとを電気的および物理的に接続する。 The crimped portion 325 is crimped to fix the second end portion 21 a of the wire 21 . The solder 50 electrically and physically connects the crimped portion 325 and the wire second end portion 21a.

上記構成によれば、かしめ部３１５、３２５は、かしめられてワイヤ２１の一部分２１ａを固定するので、ワイヤ２１は、かしめ部３１５、３２５により第１端子電極３１および第２端子電極３２に物理的に接続される。一方、はんだ５０は、かしめ部３１５、３２５とワイヤ２１の導線露出部２１ｃを電気的に接続するので、ワイヤ２１は、はんだ５０により第１端子電極３１および第２端子電極３２に電気的に接続される。
かしめ部３１５、３２５によってワイヤ２１が十分な強度で固定される構成とすることで、コイル部品１は、ワイヤ２１を固定する固定手段と、ワイヤ２１を電気的に接続する電気的接続手段とが別体となり、ワイヤ２１の固定と電気的な接続とのそれぞれの強度を個別に調整できる。したがって、ワイヤ２１の固定とワイヤ２１の電気的な接続とを良好に両立することができる。 According to the above configuration, the crimped portions 315 and 325 are crimped to fix the portion 21 a of the wire 21 . connected to On the other hand, the solder 50 electrically connects the crimped portions 315 and 325 and the wire exposed portion 21 c of the wire 21 , so the wire 21 is electrically connected to the first terminal electrode 31 and the second terminal electrode 32 by the solder 50 . be done.
By configuring the wire 21 to be fixed with sufficient strength by the crimped portions 315 and 325, the coil component 1 has fixing means for fixing the wire 21 and electrical connection means for electrically connecting the wire 21. It becomes a separate body, and the respective strengths of fixing the wire 21 and electrical connection can be individually adjusted. Therefore, both fixing of the wire 21 and electrical connection of the wire 21 can be satisfactorily achieved.

具体的に述べると、コイル部品１は、第１端子電極３１および第２端子電極３２にワイヤ２１を電気的に接続するためにレーザＱの照射などの溶接が用いられていないため、溶接時におけるレーザのエネルギによるワイヤ切れを抑制できる。また、コイル部品１は、第１端子電極３１および第２端子電極３２にワイヤ２１を固定するためにレーザＱの照射などの溶接が用いられていないため、ワイヤ２１を固定するかしめ部３１５、３２５が溶接時に溶融してワイヤ２１の固定が解除されるおそれもない。 Specifically, since the coil component 1 does not use welding such as laser Q irradiation for electrically connecting the wire 21 to the first terminal electrode 31 and the second terminal electrode 32, Wire breakage due to laser energy can be suppressed. In addition, since the coil component 1 does not use welding such as laser Q irradiation for fixing the wire 21 to the first terminal electrode 31 and the second terminal electrode 32, the caulking portions 315 and 325 for fixing the wire 21 are not used. There is no possibility that the wire 21 will be unfixed due to melting during welding.

図３に示すように、第１端子電極３１において、支持部３１５ａと把持部３１５ｃとの間の距離ｄは、曲げ部３１５ｂから離れるに従い狭くなる。例えば、ワイヤ２１の一部分２１ａを支持部３１５ａと把持部３１５ｃとの間で一度把持し、治具により把持部３１５ｃを押圧することで、把持部３１５ｃの先端を支持部３１５ａに近づけることができる。上記構成によれば、支持部３１５ａと把持部３１５ｃとの間の距離ｄは、曲げ部３１５ｃから離れるに従い狭くなるので、ワイヤ２１の一部分２１ａが、支持部３１５ａ、曲げ部３１５ｂおよび把持部３１５ｃにより囲まれるかしめ部３１５内に位置するとき、ワイヤ２１の一部分２１ａは、かしめ部３１５の外側に向かってずれ難くなる。また、支持部３１５ａと把持部３１５ｃとの間の距離ｄは、曲げ部３１５ｃから離れるに従い狭くなるので、はんだ５０が、かしめ部３１５内に進入し難くなり、はんだ５０によるワイヤ２１への損傷を抑制できる。 As shown in FIG. 3, in the first terminal electrode 31, the distance d between the supporting portion 315a and the gripping portion 315c becomes narrower with increasing distance from the bent portion 315b. For example, a portion 21a of the wire 21 is gripped once between the supporting portion 315a and the gripping portion 315c, and the gripping portion 315c is pressed by a jig, whereby the tip of the gripping portion 315c can be brought closer to the supporting portion 315a. According to the above configuration, the distance d between the support portion 315a and the grip portion 315c becomes narrower as the distance from the bent portion 315c increases. When positioned within the enclosed crimped portion 315 , the portion 21 a of the wire 21 is less likely to slip toward the outside of the crimped portion 315 . Further, since the distance d between the supporting portion 315a and the gripping portion 315c becomes narrower as the distance from the bent portion 315c increases, it becomes difficult for the solder 50 to enter the crimped portion 315, and damage to the wire 21 by the solder 50 is prevented. can be suppressed.

第１端子電極３１と同様に、第２端子電極３２において、支持部３２５ａと把持部３２５ｃとの間の距離ｄは、曲げ部３１５ｂから離れるに従い狭くなる。これにより、第１端子電極３１と同様の効果を有する。 As in the case of the first terminal electrode 31, in the second terminal electrode 32, the distance d between the support portion 325a and the grip portion 325c becomes narrower with distance from the bent portion 315b. This provides the same effect as the first terminal electrode 31 .

好ましくは、コア１０は、フェライトから構成されている。これによれば、コア１０の耐熱性を確保できる。また、はんだ５０の加熱に対してコア１０の耐熱性を確保できる。さらに、レーザＱの照射による表面形状変化を容易に形成でき、抑制部３１８、３２８の形成が容易になる。 Preferably, core 10 is made of ferrite. According to this, the heat resistance of the core 10 can be ensured. Moreover, the heat resistance of the core 10 against heating of the solder 50 can be ensured. Furthermore, the surface shape change due to the irradiation of the laser Q can be easily formed, and the formation of the suppressing portions 318 and 328 is facilitated.

好ましくは、コア１０のフェライトのキュリー点は、１５０℃以上である。これによれば、高温時の使用においても、コア１０の特性の劣化を低減できる。 Preferably, the Curie point of the ferrite of core 10 is 150° C. or higher. According to this, deterioration of the characteristics of the core 10 can be reduced even when used at high temperatures.

好ましくは、コア１０のフェライトの体積抵抗率は、１０^６Ω・ｃｍ以上である。これによれば、コア１０の絶縁性を確保し、第１端子電極３１および第２端子電極３２間のショートを防ぐことができる。 Preferably, the ferrite of the core 10 has a volume resistivity of 10 ⁶ Ω·cm or more. According to this, the insulation of the core 10 can be ensured, and the short circuit between the first terminal electrode 31 and the second terminal electrode 32 can be prevented.

好ましくは、コア１０のフェライトの初期透磁率は、９００以上である。これによれば、インダクタンス値の取得効率が向上する。 Preferably, the initial magnetic permeability of the ferrite of core 10 is 900 or higher. According to this, the acquisition efficiency of the inductance value is improved.

好ましくは、第１端子電極３１および第２端子電極３２の主成分は、Ｆｅである。これによれば、第１端子電極３１および第２端子電極３２の耐熱性を確保できる。また、はんだ５０の加熱に対して第１端子電極３１および第２端子電極３２の耐熱性を確保できる。 Preferably, the main component of the first terminal electrode 31 and the second terminal electrode 32 is Fe. According to this, the heat resistance of the first terminal electrode 31 and the second terminal electrode 32 can be ensured. Moreover, the heat resistance of the first terminal electrode 31 and the second terminal electrode 32 against the heating of the solder 50 can be ensured.

好ましくは、第１端子電極３１および第２端子電極３２の主成分は、Ｃｕである。これによれば、第１端子電極３１および第２端子電極３２の耐熱性を確保できる。また、はんだ５０の加熱に対して第１端子電極３１および第２端子電極３２の耐熱性を確保できる。 Preferably, the main component of the first terminal electrode 31 and the second terminal electrode 32 is Cu. According to this, the heat resistance of the first terminal electrode 31 and the second terminal electrode 32 can be ensured. Moreover, the heat resistance of the first terminal electrode 31 and the second terminal electrode 32 against the heating of the solder 50 can be ensured.

好ましくは、第１端子電極３１および第２端子電極３２はそれぞれ、エポキシ樹脂系接着剤によって、第１鍔部１１および第２鍔部１２に接着されている。これによれば、エポキシ樹脂系接着剤は、熱硬化性であるため、接着剤の耐熱性を確保できる。また、はんだ５０の加熱に対して接着剤の耐熱性を確保できる。 Preferably, the first terminal electrode 31 and the second terminal electrode 32 are respectively adhered to the first flange portion 11 and the second flange portion 12 with an epoxy resin adhesive. According to this, since the epoxy resin-based adhesive is thermosetting, the heat resistance of the adhesive can be ensured. Moreover, the heat resistance of the adhesive against heating of the solder 50 can be ensured.

好ましくは、磁性体板１５は、エポキシ樹脂系接着剤によって、一対の第１鍔部１１および第２鍔部１２に接着されている。これによれば、エポキシ樹脂系接着剤は、熱硬化性であるため、接着剤の耐熱性を確保できる。また、はんだ５０の加熱に対して接着剤の耐熱性を確保できる。 Preferably, the magnetic plate 15 is adhered to the pair of the first flange portion 11 and the second flange portion 12 with an epoxy resin adhesive. According to this, since the epoxy resin-based adhesive is thermosetting, the heat resistance of the adhesive can be ensured. Moreover, the heat resistance of the adhesive against heating of the solder 50 can be ensured.

好ましくは、ワイヤ２１の絶縁被膜は、ポリアミドイミドを主成分とする。これによれば、はんだ５０の加熱に対してワイヤ２１の耐熱性を確保できる。また、レーザＱの照射により絶縁被膜を剥がしやすい。 Preferably, the insulating coating of wire 21 is mainly composed of polyamide-imide. According to this, the heat resistance of the wire 21 against the heating of the solder 50 can be ensured. In addition, the insulating coating can be easily peeled off by irradiation with the laser Q.

好ましくは、ワイヤ２１の絶縁被膜の厚みは、４μｍ以上１０μｍ以下である。これによれば、はんだ５０の加熱に対しワイヤ２１の耐熱性を確保できる。特に、絶縁被膜の厚みが４μｍ以上であることで、レーザＱの照射によって絶縁被膜を剥がす際に、レーザＱの出力を抑えることができ、導体への影響を小さくすることができる。また、絶縁被膜の厚みが１０μｍ以下であることで、レーザＱの照射によって絶縁被膜を剥がし易くなる。 Preferably, the thickness of the insulating coating of wire 21 is 4 μm or more and 10 μm or less. According to this, the heat resistance of the wire 21 against heating of the solder 50 can be ensured. In particular, since the thickness of the insulating coating is 4 μm or more, the output of the laser Q can be suppressed when the insulating coating is peeled off by the irradiation of the laser Q, and the effect on the conductor can be reduced. In addition, since the thickness of the insulating coating is 10 μm or less, the insulating coating can be easily peeled off by laser Q irradiation.

好ましくは、ワイヤ２１の導線の直径は、３０μｍ以上７０μｍ以下である。これによれば、はんだ５０の加熱に対しワイヤ２１の耐熱性を確保できる。また、導線の直径が３０μｍ以上であることで、レーザＱの照射によって絶縁被膜を剥がす際に断線されにくく、導線の直径が７０μｍ以下であることで、レーザＱの照射によって絶縁被膜を剥がしやすい。 Preferably, the wire diameter of the wire 21 is 30 μm or more and 70 μm or less. According to this, the heat resistance of the wire 21 against heating of the solder 50 can be ensured. Further, since the diameter of the conducting wire is 30 μm or more, disconnection is unlikely to occur when the insulating coating is removed by laser Q irradiation.

好ましくは、コイル部品１のＬ方向の長さは、２５ｍｍ以上４５ｍｍ以下であり、コイル部品１のＷ方向の幅は、２０ｍｍ以上４５ｍｍ以下である。例えば、コイル部品１のサイズ（Ｌ、Ｗ）として、（２５ｍｍ×２０ｍｍ）以上（４５ｍｍ×４５ｍｍ）以下である。これによれば、コイル部品の小型化を図ることができ、また、レーザＱによる加工能力に適したサイズとなる。この好ましい態様において、コイル部品１のＬ方向の長さは、コイル部品１の全体の長さ、磁性体板１５の長さ、コア１０の長さ、及び、第１端子電極３１と第２端子電極３２とに亘る長さのいずれでもよい。 Preferably, the length of the coil component 1 in the L direction is 25 mm or more and 45 mm or less, and the width of the coil component 1 in the W direction is 20 mm or more and 45 mm or less. For example, the size (L, W) of the coil component 1 is (25 mm×20 mm) or more and (45 mm×45 mm) or less. According to this, the size of the coil component can be reduced, and the size of the coil component is suitable for the processing capability of the laser Q. In this preferred embodiment, the length of the coil component 1 in the L direction is the total length of the coil component 1, the length of the magnetic plate 15, the length of the core 10, and the length of the first terminal electrode 31 and the second terminal. Any length between the electrodes 32 may be used.

図４および図５は、コイル部品１の製造工程を示す図である。
図４に示すように、先ず、コア１０の成型体を準備する（ステップＳ１）。具体的に述べると、金型を用いてフェライトの粉末をプレス形成し、得られた成型体を焼成し、焼成した成型体をバレル研磨することでバリを除去する。これらの工程を経てコア１０の成型体が得られる。 4 and 5 are diagrams showing the manufacturing process of the coil component 1. FIG.
As shown in FIG. 4, first, a molded core 10 is prepared (step S1). Specifically, ferrite powder is pressed using a mold, the resulting compact is fired, and the fired compact is barrel-polished to remove burrs. A molding of the core 10 is obtained through these steps.

次いで、コア１０の第１鍔部１１の天面１１４および外端面１１２と、第２鍔部１２の天面１２４および外端面１２２とに接着剤をエアーディスペンサによって塗布し、第１鍔部１１の接着剤の塗布箇所に第１端子電極３１を搭載し、第２鍔部１２の接着剤の塗布箇所に第２端子電極３２を搭載する（ステップＳ２）。これらの第１端子電極３１および第２端子電極３２は、金型でプレス成形した金属板にめっきを施し、当該金属板を曲げ加工して形成されたものである。そして、コア１０をオーブン内で加熱することで接着剤を硬化させ、第１端子電極３１および第２端子電極３２をコア１０に接着する（ステップＳ３）。 Next, an adhesive is applied to the top surface 114 and the outer end surface 112 of the first flange portion 11 of the core 10 and to the top surface 124 and the outer end surface 122 of the second flange portion 12 using an air dispenser. The first terminal electrode 31 is mounted on the adhesive application location, and the second terminal electrode 32 is mounted on the adhesive application location of the second collar portion 12 (step S2). The first terminal electrode 31 and the second terminal electrode 32 are formed by plating a metal plate pressed with a mold and bending the metal plate. Then, the core 10 is heated in an oven to cure the adhesive, and the first terminal electrode 31 and the second terminal electrode 32 are bonded to the core 10 (step S3).

次に、ワイヤ２１の第１端部を第１端子電極３１のかしめ部３１５に配置し、当該ワイヤ２１の第２端部を第２端子電極３２のかしめ部３２５に配置し、これらかしめ部３１５、３２５をかしめることで、ワイヤ２１を第１端子電極３１および第２端子電極３２に固定した状態とし、この状態で、巻線機を用いてコア１０の巻芯部１３にワイヤ２１を巻き付ける（ステップＳ４）。 Next, the first end of the wire 21 is placed on the crimped portion 315 of the first terminal electrode 31 , the second end of the wire 21 is placed on the crimped portion 325 of the second terminal electrode 32 , and these crimped portions 315 , 325 to fix the wire 21 to the first terminal electrode 31 and the second terminal electrode 32. In this state, the wire 21 is wound around the winding core 13 of the core 10 using a winding machine. (Step S4).

次いで、図５に示すように、第１鍔部１１の外端面１１２および第２鍔部１２の外端面１２２へのレーザＱの照射によって、ワイヤ２１の絶縁被膜を剥離して導線露出部２１ｃを形成し、同時に、抑制部３１８の凹みを外端面１１２、１２２に形成する（ステップＳ５）。具体的に述べると、かしめ部３１５、３２５の一部又は全部（図５の例では一部）と、当該かしめ部３１５、３２５の外を延びるワイヤ２１の部分と、はんだペーストの塗布範囲Ｒａとの少なくとも一部と、を含む所定の照射範囲ＲにレーザＱを照射する。塗布範囲Ｒａは少なくとも、かしめ部３１５、３２５の外を延びるワイヤ２１の部分と、かしめ部３１５、３２５との少なくとも一部と、を含む範囲である。 Next, as shown in FIG. 5, the outer end surface 112 of the first collar portion 11 and the outer end surface 122 of the second collar portion 12 are irradiated with a laser Q to peel off the insulating coating of the wire 21 and expose the conductive wire exposed portion 21c. At the same time, depressions of the suppressing portions 318 are formed in the outer end surfaces 112 and 122 (step S5). Specifically, some or all of the crimped portions 315 and 325 (a portion in the example of FIG. 5), a portion of the wire 21 extending outside the crimped portions 315 and 325, and a solder paste application range Ra. A predetermined irradiation range R including at least a part of and is irradiated with a laser Q. The application range Ra is a range including at least a portion of the wire 21 extending outside the crimped portions 315 and 325 and at least a part of the crimped portions 315 and 325 .

照射範囲ＲにレーザＱが照射されることで、ワイヤ２１の絶縁被膜が除去されて導線露出部２１ｃが形成され、かつ、外端面１１２、１２２の表面においてレーザＱに直接的に照らされた箇所に凹みがレーザ照射痕によって形成される。この凹みによって抑制部３１８が形成される。ここで、はんだペーストの塗布範囲Ｒａが略円形である場合には、照射範囲Ｒの外形も塗布範囲Ｒａの外形に沿った略円形としてもよい。これにより、半球状のはんだ５０の外縁５０ａに沿う円形の抑制部３１８が形成される。
このステップＳ５では、ワイヤ２１の絶縁被膜の除去と抑制部３１８の形成とをレーザＱの照射によって同時に行っているが、別々の工程で行ってもよい。ステップＳ５のように、同一工程内で同時に行うことで、工程を減らすことができ製造コストを削減することができる。また、抑制部３１８の凹みをコア１０に予め形成しておく必要がないため、コア１０の製造コストを削減することもできる。 By irradiating the irradiation range R with the laser Q, the insulating coating of the wire 21 is removed to form the conductor exposed portion 21c, and the portions on the surfaces of the outer end surfaces 112 and 122 directly irradiated with the laser Q A recess is formed by the laser irradiation trace. A suppressing portion 318 is formed by this depression. Here, when the application range Ra of the solder paste is substantially circular, the external shape of the irradiation range R may also be substantially circular along the external shape of the application range Ra. Thereby, a circular suppressing portion 318 is formed along the outer edge 50a of the hemispherical solder 50 .
In this step S5, the removal of the insulating coating of the wire 21 and the formation of the suppressing portion 318 are simultaneously performed by irradiating the laser Q, but they may be performed in separate steps. By simultaneously performing the steps in the same process as in step S5, the number of processes can be reduced, and the manufacturing cost can be reduced. Moreover, since it is not necessary to form the depression of the suppressing portion 318 in advance in the core 10, the manufacturing cost of the core 10 can be reduced.

なお、レーザＱは、例えば、波長１０６４ｎｍの赤外線レーザや波長５３２ｎｍの緑色レーザが用いられる。ただし、レーザＱは、ワイヤ２１の絶縁皮膜を除去し、かつ、第１鍔部１１の外端面１１２および第２鍔部１２の外端面１２２に凹みを形成できるものであればよい。照射範囲Ｒに対するレーザＱの照射態様は、レーザＱによって照射範囲Ｒを走査する態様でもよいし、マスク等を用いて照射範囲Ｒと略同じビーム形状のレーザＱを照射する態様でもよい。 As the laser Q, for example, an infrared laser with a wavelength of 1064 nm or a green laser with a wavelength of 532 nm is used. However, the laser Q should be capable of removing the insulating film of the wire 21 and forming a recess in the outer end surface 112 of the first collar portion 11 and the outer end surface 122 of the second collar portion 12 . The irradiation mode of the laser Q with respect to the irradiation range R may be a mode in which the irradiation range R is scanned with the laser Q, or a mode in which the laser Q having a beam shape substantially the same as that of the irradiation range R is irradiated using a mask or the like.

ステップＳ５の完了後、エアーディスペンサを用いてはんだペーストを塗布範囲Ｒａに塗布し、レーザ等の加熱手段を用いた加熱によって当該はんだペーストを溶融する（ステップＳ６）。上述の通り、塗布範囲Ｒａは、ワイヤ２１の導線露出部２１ｃとかしめ部３１５、３２５の少なくとも一部とを含む範囲であり、この塗布範囲Ｒａのはんだペーストが溶融することで、ワイヤ２１と、かしめ部３１５（第１端子電極３１）およびかしめ部３２５（第２端子電極３２）とが電気的および物理的に接続される。なお、はんだペーストは、ワイヤ２１の導線露出部２１ｃと、かしめ部３１５、３２５とのそれぞれを覆うように塗布されればよく、コア１０の表面（外端面１１２）に接する必要はない。 After step S5 is completed, the solder paste is applied to the application range Ra using an air dispenser, and the solder paste is melted by heating using a heating means such as a laser (step S6). As described above, the application range Ra is a range that includes at least part of the conductor exposed portion 21c of the wire 21 and the crimped portions 315 and 325. By melting the solder paste in this application range Ra, the wire 21, The crimped portion 315 (first terminal electrode 31) and the crimped portion 325 (second terminal electrode 32) are electrically and physically connected. The solder paste need only be applied so as to cover the conductor exposed portion 21c of the wire 21 and the crimped portions 315 and 325, and does not need to be in contact with the surface of the core 10 (outer end surface 112).

ここで、ステップＳ６において、かしめ部３１５、３２５およびワイヤ２１とはんだ５０とを良好に接続するためにフラックスが用いられる。フラックスは塗布範囲Ｒａに塗布等され、加熱によるはんだペーストの溶融時にはフラックスも溶融する。溶融したフラックスの一部は塗布範囲Ｒａの外に向かって外端面１１２上を流動し、塗布範囲Ｒａの外側の抑制部３１８の凹みに貯まり、当該抑制部３１８よりも外側への濡れ拡がりが抑えられる。フラックスは、例えばロジン系フラックスであり、また、はんだペースとは別に塗布されるのではなく、はんだペーストに予め混合されてもよい。 Here, in step S6, flux is used to ensure good connection between the crimped portions 315, 325 and the wire 21 and the solder 50. FIG. The flux is applied to the application range Ra, and the flux is also melted when the solder paste is melted by heating. A part of the melted flux flows on the outer end surface 112 toward the outside of the application range Ra and accumulates in the recesses of the suppressing portions 318 outside the coating range Ra, thereby suppressing wetting and spreading outside the suppressing portions 318. be done. The flux is, for example, a rosin-based flux, and may be pre-mixed with the solder paste rather than applied separately from the solder paste.

ステップＳ６の完了後、コア１０の第１鍔部１１の天面１１４と、第２鍔部１２の天面１２４とに接着剤をエアーディスペンサによって塗布し、これら天面１１４、１２４に磁性体板１５を搭載する（ステップＳ７）。接着剤には例えば熱硬化性を有するエポキシ樹脂系の接着剤が用いられる。そして、コア１０および磁性体板１５をオーブン内で加熱することで接着剤を硬化させ、コア１０に磁性体板１５を接着し（ステップＳ８）、これにより、コイル部品が完成する。 After step S6 is completed, the top surface 114 of the first flange portion 11 and the top surface 124 of the second flange portion 12 of the core 10 are coated with an adhesive by an air dispenser, and the top surfaces 114 and 124 are coated with a magnetic plate. 15 is mounted (step S7). As the adhesive, for example, a thermosetting epoxy resin adhesive is used. Then, the core 10 and the magnetic plate 15 are heated in an oven to cure the adhesive, and the magnetic plate 15 is adhered to the core 10 (step S8), thereby completing the coil component.

（第２実施形態）
第１実施形態では、コア１０の巻芯部１３に巻回されるワイヤ２１が１本であるコイル部品１を説明した。本実施形態では、ワイヤ２１の本数が２本である、いわゆる２本巻のコイル部品２を説明する。
図６は、本実施形態に係るコイル部品２の側面図である。図６において、第１実施形態と同じ構成や部材には同一の符号を付し、その説明を省略する。
コイル部品２は、コア１０の巻芯部１３に２本のワイヤ２１が巻回されており、それぞれのワイヤ２１の端部が第１鍔部１１および第２鍔部１２の外端面１１２、１２２に引き出されている。第１鍔部１１には、ワイヤ２１の本数と同じ個数（本実施形態では２個）の第１端子電極３１ａ、３１ｂが互いに離間距離Ｍａで離れた位置でエポキシ樹脂系の接着剤によって固定されている。それぞれの第１端子電極３１ａ、３１ｂには、互いに異なるワイヤ２１の端部がはんだ５０によって接続されている。
図示は省略するが、第２鍔部１２についての構成も第１鍔部１１と同様である。すなわち、第２鍔部１２には、ワイヤ２１の本数と同じ個数の第２端子電極が互いに離間距離Ｍａで離れた位置でエポキシ樹脂系の接着剤によって固定されている。それぞれの第２端子電極には、互いに異なるワイヤ２１の端部がはんだ５０によって接続されている。 (Second embodiment)
In the first embodiment, the coil component 1 in which the single wire 21 is wound around the winding core portion 13 of the core 10 has been described. In this embodiment, a so-called two-winding coil component 2 in which the number of wires 21 is two will be described.
FIG. 6 is a side view of the coil component 2 according to this embodiment. In FIG. 6, the same reference numerals are assigned to the same configurations and members as in the first embodiment, and the description thereof is omitted.
In the coil component 2 , two wires 21 are wound around a winding core portion 13 of a core 10 , and the ends of the wires 21 are connected to the outer end surfaces 112 and 122 of the first flange portion 11 and the second flange portion 12 . is drawn out to First terminal electrodes 31a and 31b, which are the same in number as the wires 21 (two in the present embodiment), are fixed to the first flange 11 at positions spaced apart from each other by an epoxy resin-based adhesive. ing. Different ends of wires 21 are connected by solder 50 to the first terminal electrodes 31a and 31b.
Although illustration is omitted, the configuration of the second collar portion 12 is also the same as that of the first collar portion 11 . That is, the same number of second terminal electrodes as the number of wires 21 are fixed to the second collar portion 12 with an epoxy resin-based adhesive at positions separated from each other by the separation distance Ma. Different ends of wires 21 are connected to the respective second terminal electrodes by solder 50 .

図６に示すように、第１端子電極３１ａ、３１ｂのそれぞれのはんだ５０は互いに離れており、第１鍔部１１の外端面１１２の表面において、各はんだ５０の外側に凹みによる抑制部３１８が設けられている。各抑制部３１８の離間距離Ｍｂは、第１端子電極３１ａ、３１ｂの離間距離Ｍａよりも大きくなっている。この構成によれば、各はんだ５０の溶接時のフラックスは、第１端子電極３１ａ、３１ｂの離間距離Ｍａよりも離れた抑制部３１８に貯まり、第１端子電極３１ａ、３１ｂの離間距離Ｍａよりも近付くことがない。したがって、フラックスに起因してマイグレーションが発生した場合でも、第１端子電極３１ａ、３１ｂの短絡が生じ難くなり品質不良の発生を抑制することができる。また、フェライトから成るコア１０に抑制部３１８の凹みをレーザＱの照射によって形成する場合、レーザＱの照射範囲ＲがレーザＱの照射の熱によって導通化し、この導通化によってマイグレーションがより発生し易くなる。これに対して、各抑制部３１８の離間距離Ｍｂが第１端子電極３１ａ、３１ｂの離間距離Ｍａよりも大きいことで、このようなマイグレーションによる品質不良を十分に抑えることができる。 As shown in FIG. 6 , the solders 50 of the first terminal electrodes 31 a and 31 b are separated from each other, and on the surface of the outer end surface 112 of the first collar portion 11 , suppressing portions 318 formed by depressions are formed outside the solders 50 . is provided. A separation distance Mb between the suppressing portions 318 is larger than a separation distance Ma between the first terminal electrodes 31a and 31b. According to this configuration, the flux during welding of each solder 50 accumulates in the suppressing portion 318 which is separated from the separation distance Ma between the first terminal electrodes 31a and 31b. never come close. Therefore, even if migration occurs due to the flux, short-circuiting of the first terminal electrodes 31a and 31b is unlikely to occur, and the occurrence of quality defects can be suppressed. Further, when the depression of the suppressing portion 318 is formed in the core 10 made of ferrite by irradiating the laser Q, the irradiation range R of the laser Q becomes conductive by the heat of the irradiation of the laser Q, and migration is more likely to occur due to this conduction. Become. On the other hand, by setting the separation distance Mb between the suppressing portions 318 larger than the separation distance Ma between the first terminal electrodes 31a and 31b, it is possible to sufficiently suppress quality defects due to such migration.

なお、図６に示すように、コイル部品２において、はんだ５０の外縁５０ａが略円形である場合、抑制部３１８の外形３１８ａも外縁５０ａに沿った略円形としてもよい。これにより、第１鍔部１１の外端面１１２において抑制部３１８のそれぞれの余分な凹みが抑えられ、それぞれの抑制部３１８の大きさが抑えられる。したがって、フラックスが濡れ拡がる範囲をより狭い範囲に制限できるため、マイグレーションによる品質不良を、より確実に抑えることができる。 As shown in FIG. 6, in the coil component 2, when the outer edge 50a of the solder 50 is substantially circular, the outer shape 318a of the suppressing portion 318 may also be substantially circular along the outer edge 50a. As a result, excessive depression of each suppressing portion 318 on the outer end surface 112 of the first collar portion 11 is suppressed, and the size of each suppressing portion 318 is suppressed. Therefore, the range in which the flux wets and spreads can be restricted to a narrower range, so quality defects due to migration can be suppressed more reliably.

また、本実施形態において、好ましくは、２本のワイヤ２１にコモンモードの信号を入力したときの測定周波数１００ｋＨｚにおけるコイル部品２のインダクタンス値は、１１μＨ以上３００μＨ以下である。これによれば、インダクタンス値の取得効率が向上する。 Further, in the present embodiment, preferably, the inductance value of the coil component 2 at a measurement frequency of 100 kHz when a common mode signal is input to the two wires 21 is 11 μH or more and 300 μH or less. According to this, the acquisition efficiency of the inductance value is improved.

また、本実施形態において、巻芯部１３に巻回されるワイヤ２１の数はＮ（Ｎは２以上の自然数）でもよい。この場合、第１鍔部１１には、離間距離Ｍａで離間したＮ個の第１端子電極３１が設けられ、これらＮ個の第１端子電極のそれぞれには互いに異なるワイヤ２１がはんだ５０によって接続され、Ｎ個の第１端子電極３１のそれぞれのはんだ５０は互いに離間し、第１鍔部１１の表面においてはんだ５０のそれぞれの外側に、互いに離間した抑制部３１８が設けられ、抑制部３１８同士の離間距離Ｍｂは、第１端子電極３１の離間距離Ｍａよりも大きく構成される。また、第２鍔部１２についても第１鍔部１１と同様に構成される。 Further, in the present embodiment, the number of wires 21 wound around the core portion 13 may be N (N is a natural number of 2 or more). In this case, the first collar portion 11 is provided with N first terminal electrodes 31 separated by a separation distance Ma, and different wires 21 are connected to the N first terminal electrodes by solder 50 respectively. The solders 50 of the N first terminal electrodes 31 are spaced apart from each other, and suppression portions 318 spaced apart from each other are provided on the outer sides of the solders 50 on the surface of the first flange portion 11 , and the suppression portions 318 are separated from each other. is set larger than the spacing distance Ma of the first terminal electrode 31 . Also, the second flange portion 12 is configured in the same manner as the first flange portion 11 .

上述した各実施形態は本発明の一態様を例示したものであって、本発明の趣旨を逸脱しない範囲において任意に変形及び応用が可能である。
例えば、第１実施形態と第２実施形態のそれぞれの特徴点を様々に組み合わせてもよい。 Each embodiment described above is an example of one aspect of the present invention, and can be arbitrarily modified and applied without departing from the scope of the present invention.
For example, each characteristic point of the first embodiment and the second embodiment may be combined in various ways.

例えば、各実施形態において、抑制部３１８は、加熱によって溶けたフラックスの流動を抑える作用を有していればよく、凹みに代えて、他の箇所よりも粗い粗面でもよい。この場合にも、各実施形態と同様な効果が得られる。
抑制部３１８の凹みや粗面は、レーザＱの照射によるレーザ照射痕でもよいし、エッチングや工具による加工などの加工によって形成されてもよい。 For example, in each embodiment, the suppressing portion 318 only needs to have the effect of suppressing the flow of flux melted by heating, and a rough surface that is rougher than other portions may be used instead of the depression. Also in this case, the same effect as each embodiment can be obtained.
The dents and rough surface of the suppressing portion 318 may be traces of laser irradiation caused by the irradiation of the laser Q, or may be formed by processing such as etching or processing with a tool.

例えば、各実施形態において、抑制部３１８の凹みや粗面の外形３１８ａは、はんだ５０の外縁５０ａに倣った円形でなくてもよく、例えば矩形でもよい。 For example, in each embodiment, the contour 318a of the depression or roughened surface of the restraining portion 318 may not be circular following the outer edge 50a of the solder 50, but may be rectangular, for example.

例えば、各実施形態において、第１端子電極３１のかしめ部３１５をかしめてワイヤ２１を固定したが、かしめ部３１５を用いずに、はんだ５０のみによって固定してもよい。第２端子電極３２についても同様である。 For example, in each embodiment, the wire 21 is fixed by crimping the crimped portion 315 of the first terminal electrode 31 , but the crimped portion 315 may not be used and only the solder 50 may be used for fixing. The same applies to the second terminal electrode 32 as well.

なお、各実施形態における水平、及び垂直等の方向や各種の数値、形状、材料は、特段の断りがない限り、それら方向や数値、形状、材料と同じ作用効果を奏する範囲（いわゆる均等の範囲）を含む。 In addition, unless otherwise specified, the horizontal and vertical directions, various numerical values, shapes, and materials in each embodiment have the same effects as those directions, numerical values, shapes, and materials (so-called uniform ranges). )including.

１、２コイル部品
１０コア
１１第１鍔部
１２第２鍔部
１３巻芯部
１５磁性体板
２１ワイヤ
２１ｃ導線露出部
３１、３１ａ、３１ｂ第１端子電極
３２第２端子電極
５０はんだ
３１８、３２８抑制部
Ｍａ、Ｍｂ離間距離 Reference Signs List 1, 2 Coil component 10 Core 11 First flange 12 Second flange 13 Winding core 15 Magnetic plate 21 Wire 21c Wire exposure part 31, 31a, 31b First terminal electrode 32 Second terminal electrode 50 Solder 318, 328 Suppression part Ma, Mb Spacing distance

Claims

a core having a winding core extending in one direction and a first flange provided at a first end of the winding core in the one direction;
a wire wound around the winding core;
a terminal electrode provided on the first flange;
solder that connects the terminal electrode and the wire;
a suppressing portion formed on the surface of the first flange portion to suppress spread of the flux;
A coil component comprising:

2. The coil component according to claim 1, wherein said suppressing portion is formed by a recess.

2. The coil component according to claim 1, wherein the suppressing portion is formed by laser irradiation traces.

2. The coil component according to claim 1, wherein the suppressing portion is formed with a rough surface.

N (where N is a natural number of 2 or more) wires are wound around the winding core,
The first collar portion is provided with N terminal electrodes spaced apart from each other,
The wires different from each other are connected to each of the N terminal electrodes by the solder,
the solders of each of the N terminal electrodes are spaced apart from each other;
The suppressing portions are formed on the surface of the first flange portion so as to be spaced apart from each other for each solder,
The coil component according to any one of claims 1 to 4, wherein the distance between the suppressing portions is larger than the distance between the terminal electrodes.

3. The coil component according to claim 2, wherein the contour of the depression of the suppressing portion is shaped along the outer edge of the solder.

a second flange provided at a second end opposite to the first end of the winding core in the one direction;
a magnetic plate, which is a plate-shaped magnetic body straddling the first brim portion and the second brim portion;
The coil component according to any one of claims 1 to 4, comprising:

8. The coil component according to claim 7, wherein said core is made of ferrite.

9. The coil component according to claim 8, wherein the magnetic plate is adhered to the first flange portion and the second flange portion with an epoxy resin-based adhesive.

10. The coil component according to claim 9, wherein the ferrite has an initial magnetic permeability of 900 or higher.

10. The coil component according to claim 10, wherein said ferrite has a Curie point of 150[deg.] C. or higher.

12. The coil component according to claim 11, wherein the ferrite has a volume resistivity of 10 ^<6 > [Omega].cm or more.

13. The coil component according to claim 12, wherein the length in said one direction is 25 nm or more and 45 nm or less, and the length in a direction orthogonal to said one direction is 20 nm or more and 45 nm or less.

Two wires are wound around the winding core,
14. The coil component according to claim 13, wherein an inductance value at a measurement frequency of 100 kHz when a common mode signal is input to said two wires is 11 [mu]H or more and 300 [mu]H or less.

5. The coil component according to any one of claims 1 to 4, wherein the main component of said terminal electrodes is Fe.

5. The coil component according to any one of claims 1 to 4, wherein a main component of said terminal electrodes is Cu.

17. The coil component according to claim 16, wherein the terminal electrode is adhered to the first collar portion with an epoxy resin-based adhesive.

18. The coil component according to claim 17, wherein the length in said one direction is 25 nm or more and 45 nm or less, and the length in a direction perpendicular to said one direction is 20 nm or more and 45 nm or less.

Two wires are wound around the winding core,
19. The coil component according to claim 18, wherein an inductance value at a measurement frequency of 100 kHz when a common mode signal is input to said two wires is 11 [mu]H or more and 300 [mu]H or less.

The wire is
a wire and
and an insulating coating covering the conductor,
The main component of the insulating coating is polyamideimide,
The coil component according to any one of claims 1 to 4, characterized in that:

21. The coil component according to claim 20, wherein said insulating coating has a thickness of 4 [mu]m or more and 10 [mu]m or less.

22. The coil component according to claim 21, wherein the conductor has a diameter of 30 [mu]m or more and 70 [mu]m or less.

23. The coil component according to claim 22, wherein the length in said one direction is 25 nm or more and 45 nm or less, and the length in a direction orthogonal to said one direction is 20 nm or more and 45 nm or less.

Two wires are wound around the winding core,
24. The coil component according to claim 23, wherein an inductance value at a measurement frequency of 100 kHz when a common mode signal is input to said two wires is 11 [mu]H or more and 300 [mu]H or less.

a second flange provided at a second end opposite to the first end of the winding core in the one direction;
a magnetic plate, which is a plate-shaped magnetic body straddling the first brim portion and the second brim portion;
with
The magnetic plate is adhered to the first flange portion and the second flange portion with an epoxy resin-based adhesive,
The core is made of ferrite,
The initial magnetic permeability of the ferrite is 900 or more,
The Curie point of the ferrite is 150° C. or higher,
The ferrite has a volume resistivity of 10 ⁶ Ω·cm or more,
A main component of the terminal electrode is Cu,
The terminal electrode is adhered to the first flange with an epoxy resin-based adhesive,
The wire has a conductor and an insulating coating covering the conductor,
The main component of the insulating coating is polyamideimide,
The thickness of the insulating coating is 4 μm or more and 10 μm or less,
The diameter of the conducting wire is 30 μm or more and 70 μm or less.
The coil component according to any one of claims 1 to 4, characterized in that: