JP2023059079A - Direct-acting mechanism, positioning mechanism, bonding device and bonding method - Google Patents

Abstract

To provide a technique for suppressing positional displacement of a move target object.SOLUTION: A direct-acting mechanism comprises a base member, a movable member, a drive mechanism, a fixing member and a connection member. The movable member is provided so as to directly act along a direct-acting axis with respect to the base member. The drive mechanism moves the movable member along the direct-acting axis. The fixing member is disposed on an opposite side of the movable member with the base member interposed therebetween and includes a fixing surface on which a move target object can be fixed. The connection member connects the fixing member with the movable member movably between an isolation position where the fixing member is isolated from the base member and the movable member is allowed to move and an abutment position where the fixing member is abutted to the base member and the movement of the movable member is regulated.SELECTED DRAWING: Figure 7

Description

TECHNICAL FIELD The present disclosure relates to a linear motion mechanism, a positioning mechanism, a joining device, and a joining method.

2. Description of the Related Art Conventionally, a bonding apparatus for bonding substrates such as semiconductor wafers is known (see, for example, Patent Document 1).

JP 2015-095579 A

The present disclosure provides a technique for suppressing displacement of a moving object.

A linear motion mechanism according to one aspect of the present disclosure includes a base member, a movable member, a drive mechanism, a fixed member, and a connecting member. The movable member is provided to be linearly movable along the linear motion axis with respect to the base member. The drive mechanism moves the movable member along the linear motion axis. The fixed member is arranged on the opposite side of the movable member with the base member interposed therebetween, and has a fixed surface capable of fixing the moving object. The connecting member moves the fixed member between a separated position where the fixed member is separated from the base member to allow movement of the movable member and a contact position where the fixed member is brought into contact with the base member to restrict movement of the movable member. It is movably connected to the movable member.

According to the present disclosure, displacement of a moving object can be suppressed.

FIG. 1 is a schematic diagram showing the configuration of a joining system according to an embodiment. FIG. 2 is a schematic diagram showing the configuration of the joining system according to the embodiment. FIG. 3 is a schematic diagram showing a state before bonding of the first substrate and the second substrate according to the embodiment. FIG. 4 is a schematic diagram showing the configuration of the bonding apparatus according to the embodiment. FIG. 5 is a schematic diagram showing the configuration of the bonding apparatus according to the embodiment. FIG. 6 is a schematic diagram showing a first holding portion and a second holding portion according to the embodiment. FIG. 7 is a perspective view showing the configuration of the positioning mechanism according to the embodiment; FIG. 8 is a plan view showing the configuration of the positioning mechanism according to the embodiment; FIG. 9 is a side cross-sectional view showing the configuration of the positioning mechanism according to the embodiment. FIG. 10 is an operation explanatory diagram (part 1) of the positioning mechanism according to the embodiment; FIG. 11 is an operation explanatory diagram (2) of the positioning mechanism according to the embodiment; FIG. 12 is a flowchart illustrating a procedure of processing executed by the joining system according to the embodiment;

Embodiments for implementing the linear motion mechanism, the positioning mechanism, the joining apparatus, and the joining method according to the present disclosure (hereinafter referred to as "embodiments") will be described in detail below with reference to the drawings. Note that the linear motion mechanism, the positioning mechanism, the joining apparatus, and the joining method according to the present disclosure are not limited to this embodiment. Further, each embodiment can be appropriately combined within a range that does not contradict the processing contents. Also, in each of the following embodiments, the same parts are denoted by the same reference numerals, and overlapping descriptions are omitted.

Further, in the embodiments described below, expressions such as "constant", "perpendicular", "perpendicular" or "parallel" may be used, but these expressions are strictly "constant", "perpendicular", " It does not have to be "perpendicular" or "parallel". That is, each of the expressions described above allows deviations in, for example, manufacturing accuracy and installation accuracy.

In addition, in each drawing referred to below, in order to make the explanation easier to understand, an orthogonal coordinate system is shown in which the X-axis direction, the Y-axis direction and the Z-axis direction that are orthogonal to each other are defined, and the Z-axis positive direction is the vertically upward direction. Sometimes. Also, the direction of rotation about the vertical axis is sometimes called the θ direction.

2. Description of the Related Art In a bonding apparatus for bonding substrates together, horizontal positional adjustment of the substrates is performed before the substrates are bonded together. Image data obtained by imaging the bonding surfaces of the substrates with the imaging unit is used when adjusting the horizontal position of the substrates. The imaging unit is fixed as a moving object to a movable member of a linear guide provided with a movable member that can move linearly on the base member, and the imaging unit is positioned using the linear guide before imaging the bonding surface of the substrate. is done. In this linear guide, drift, which is a phenomenon in which the movable member wobbles in a direction different from the moving direction, generally occurs after the movement of the movable member is stopped. As a result, there is a possibility that a moving object such as an imaging unit fixed to the movable member may be displaced. A positional deviation of a moving object such as an imaging unit causes disturbance in image data captured by the imaging unit, which may reduce the accuracy of horizontal position adjustment between substrates. Therefore, it is expected to suppress the displacement of the moving object.

<Composition of joining system>
First, the configuration of a joining system according to an embodiment will be described with reference to FIGS. 1 to 3. FIG. 1 and 2 are schematic diagrams showing the configuration of the joint system according to the embodiment. Moreover, FIG. 3 is a schematic diagram showing a state before bonding of the first substrate and the second substrate according to the embodiment.

The bonding system 1 shown in FIG. 1 forms a superimposed substrate T by bonding a first substrate W1 and a second substrate W2 (see FIG. 3).

The first substrate W1 and the second substrate W2 are substrates in which a plurality of electronic circuits are formed on semiconductor substrates such as silicon wafers and compound semiconductor wafers. The first substrate W1 and the second substrate W2 have substantially the same diameter. The second substrate W2 may be, for example, a bare wafer on which electronic circuits are not formed.

Hereinafter, as shown in FIG. 3, of the plate surfaces of the first substrate W1, the plate surface on the side to be bonded to the second substrate W2 is referred to as "bonding surface W1j", and the surface opposite to the bonding surface W1j is referred to as "bonding surface W1j". The plate surface is described as "non-bonded surface W1n". In addition, among the plate surfaces of the second substrate W2, the plate surface on the side to be bonded to the first substrate W1 is referred to as “bonded surface W2j”, and the plate surface opposite to the bonded surface W2j is referred to as “non-bonded surface W2n”. ”.

As shown in FIG. 1, the joining system 1 comprises a loading/unloading station 2 and a processing station 3 . The loading/unloading station 2 is arranged on the X-axis negative direction side of the processing station 3 and is integrally connected to the processing station 3 .

The loading/unloading station 2 includes a mounting table 10 and a transport area 20 . The mounting table 10 includes a plurality of mounting plates 11 . Cassettes C1 to C4 each accommodating a plurality of (for example, 25) substrates in a horizontal state are mounted on each mounting plate 11, respectively. The cassette C1 can accommodate a plurality of first substrates W1, the cassette C2 can accommodate a plurality of second substrates W2, and the cassette C3 can accommodate a plurality of superimposed substrates T. FIG. The cassette C4 is, for example, a cassette for recovering defective substrates. The number of cassettes C1 to C4 placed on the placing plate 11 is not limited to that illustrated.

The transport area 20 is arranged adjacent to the mounting table 10 in the positive direction of the X axis. The transport area 20 is provided with a transport path 21 extending in the Y-axis direction and a transport device 22 movable along the transport path 21 . The conveying device 22 can move not only in the Y-axis direction but also in the X-axis direction and can turn around the Z-axis. The transport device 22 transfers the first substrate W1, the second substrate W2 and the superimposed substrate T between the cassettes C1 to C4 placed on the platen plate 11 and the third processing block G3 of the processing station 3, which will be described later. Carry out transportation.

The processing station 3 is provided with, for example, three processing blocks G1, G2, G3. The first processing block G1 is arranged on the front side of the processing station 3 (the Y-axis negative direction side in FIG. 1). The second processing block G2 is arranged on the back side of the processing station 3 (the positive direction of the Y axis in FIG. 1), and the third processing block G3 is arranged on the loading/unloading station 2 side of the processing station 3 (the X side in FIG. 1). side).

In the first processing block G1, a surface modification device 30 for modifying bonding surfaces W1j and W2j of the first substrate W1 and the second substrate W2 is arranged. The surface modification device 30 cuts the bonds of SiO2 on the bonding surfaces W1j and W2j of the first substrate W1 and the second substrate W2 to form single-bonded SiO, thereby making the bonding surfaces W1j easier to hydrophilize. , W2j.

Specifically, in the surface modification apparatus 30, for example, oxygen gas or nitrogen gas, which is the processing gas, is excited into plasma and ionized under a reduced pressure atmosphere. By irradiating the bonding surfaces W1j and W2j of the first substrate W1 and the second substrate W2 with such oxygen ions or nitrogen ions, the bonding surfaces W1j and W2j are plasma-processed and modified.

Also, in the first processing block G1, an inspection device 31 for inspecting the bonded state of the superposed substrate T, in which the first substrate W1 and the second substrate W2 are bonded by the bonding device 41, which will be described later, is arranged.

For example, the inspection device 31 captures images of the patterns formed on the first substrate W1 and the second substrate W2 using infrared rays, and calculates the deviation of the patterns between the first substrate W1 and the second substrate W2 based on the captured images. do.

A surface hydrophilization device 40 and a bonding device 41 are arranged in the second processing block G2. The surface hydrophilizing device 40 hydrophilizes the bonding surfaces W1j and W2j of the first substrate W1 and the second substrate W2 with pure water, for example, and cleans the bonding surfaces W1j and W2j. Specifically, the surface hydrophilization apparatus 40 supplies pure water onto the first substrate W1 or the second substrate W2 while rotating the first substrate W1 or the second substrate W2 held by the spin chuck, for example. . As a result, the pure water supplied onto the first substrate W1 or the second substrate W2 diffuses over the bonding surfaces W1j and W2j of the first substrate W1 or the second substrate W2, thereby making the bonding surfaces W1j and W2j hydrophilic. .

The bonding device 41 bonds the hydrophilic first substrate W1 and second substrate W2 by intermolecular force. The configuration of the joining device 41 will be described later.

In the third processing block G3, as shown in FIG. 2, transition (TRS) devices 50 and 51 for the first substrate W1, the second substrate W2 and the superimposed substrate T are provided in this order from the bottom.

A transfer area 60 is formed in an area surrounded by the first processing block G1, the second processing block G2, and the third processing block G3. A transport device 61 is arranged in the transport area 60 . The transport device 61 has a transport arm that is movable vertically, horizontally, and around a vertical axis, for example. The transport device 61 moves within the transport region 60 and transfers the first substrate W1 and the second substrate W1 to predetermined devices in the first processing block G1, the second processing block G2 and the third processing block G3 adjacent to the transport region 60. The substrate W2 and the superimposed substrate T are transferred.

The joining system 1 also includes a control device 70 . A control device 70 controls the operation of the joining system 1 . Such control device 70 is, for example, a computer, and includes a control section and a storage section (not shown). The control unit includes a microcomputer having a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), an input/output port, and various circuits. The CPU of such a microcomputer reads out and executes a program stored in the ROM, thereby realizing the control described later. Also, the storage unit is realized by, for example, a semiconductor memory device such as a RAM or a flash memory, or a storage device such as a hard disk or an optical disk.

The program may be recorded in a computer-readable recording medium and installed in the storage section of the control device 70 from the recording medium. Examples of computer-readable recording media include hard disks (HD), flexible disks (FD), compact disks (CD), magnet optical disks (MO), and memory cards.

<Structure of joining device>
Next, the configuration of the joining device 41 will be described with reference to FIGS. 4 and 5. FIG. 4 and 5 are schematic diagrams showing the configuration of the joining device 41 according to the embodiment.

As shown in FIG. 4, the bonding apparatus 41 has a processing container 100 whose inside can be sealed. A loading/unloading port 101 for the first substrate W1, the second substrate W2, and the superimposed substrate T is formed on the side surface of the processing container 100 on the transfer region 60 side, and the loading/unloading port 101 is provided with an open/close shutter 102 .

The interior of the processing container 100 is partitioned into a transfer area T1 and a processing area T2 by an inner wall 103 . The loading/unloading port 101 described above is formed on the side surface of the processing container 100 in the transport area T1. Also, the inner wall 103 is formed with a loading/unloading port 104 for the first substrate W1, the second substrate W2, and the superimposed substrate T. As shown in FIG.

In the transport area T1, the transition 110, the substrate transport mechanism 111, the reversing mechanism 130, and the position adjusting mechanism 120 are arranged in this order from the loading/unloading port 101 side, for example.

The transition 110 temporarily rests the first substrate W1, the second substrate W2 and the superimposed substrate T. FIG. The transition 110 is formed, for example, in two stages, and any two of the first substrate W1, the second substrate W2 and the superimposed substrate T can be placed at the same time.

As shown in FIGS. 4 and 5, the substrate transfer mechanism 111 is movable, for example, in the vertical direction (Z-axis direction), horizontal directions (Y-axis direction, X-axis direction), and directions around the vertical axis (.theta. direction). It has a transport arm. The substrate transport mechanism 111 can transport the first substrate W1, the second substrate W2 and the superimposed substrate T within the transport region T1 or between the transport region T1 and the processing region T2.

The position adjustment mechanism 120 adjusts the horizontal orientations of the first substrate W1 and the second substrate W2. Specifically, the position adjusting mechanism 120 includes a base 121 having a holding portion (not shown) that holds and rotates the first substrate W1 and the second substrate W2, and notch portions of the first substrate W1 and the second substrate W2. and a detection unit 122 that detects the position of the . The position adjusting mechanism 120 detects the positions of the notches of the first substrate W1 and the second substrate W2 using the detection unit 122 while rotating the first substrate W1 and the second substrate W2 held on the base 121. to adjust the position of the notch. Thereby, the horizontal orientations of the first substrate W1 and the second substrate W2 are adjusted.

The reversing mechanism 130 reverses the front and back of the first substrate W1. Specifically, the reversing mechanism 130 has a holding arm 131 that holds the first substrate W1. The holding arm 131 extends in the horizontal direction (X-axis direction). Further, the holding arm 131 is provided with holding members 132 for holding the first substrate W1 at, for example, four positions.

The holding arm 131 is supported by a drive section 133 including, for example, a motor. The holding arm 131 is rotatable around the horizontal axis by the driving portion 133 . In addition, the holding arm 131 is rotatable around the driving portion 133 and is also movable in the horizontal direction (X-axis direction). Below the drive unit 133, another drive unit (not shown) is provided, which includes, for example, a motor. This other drive allows the drive 133 to move vertically along a vertically extending support post 134 .

In this way, the first substrate W1 held by the holding member 132 can be rotated around the horizontal axis by the drive unit 133 and can be moved vertically and horizontally. In addition, the first substrate W1 held by the holding member 132 can rotate around the driving portion 133 and move between the position adjusting mechanism 120 and the first holding portion 140, which will be described later.

In the processing area T2, there are a first holding unit 140 that sucks and holds the upper surface (non-bonded surface W1n) of the first substrate W1 from above, and a first holder 140 that sucks and holds the lower surface (non-bonded surface W2n) of the second substrate W2 from below. 2 holding portions 141 are provided. The second holding portion 141 is provided below the first holding portion 140 and configured to be arranged to face the first holding portion 140 . The first holding part 140 and the second holding part 141 are, for example, vacuum chucks.

As shown in FIG. 5 , the first holding portion 140 is supported by a support member 180 provided above the first holding portion 140 . The support member 180 is fixed to the ceiling surface of the processing container 100 via a plurality of support columns 181, for example.

An upper imaging section 145 is provided on the side of the first holding section 140 for imaging the upper surface (bonding surface W2j) of the second substrate W2 held by the second holding section 141 via the positioning mechanism 401. . A CCD camera, for example, is used for the upper imaging unit 145 . The positioning mechanism 401 includes a first linear motion mechanism and a second linear motion mechanism fixed to the first linear motion mechanism, and the upper imaging section 145 is fixed to the second linear motion mechanism. The positioning mechanism 210 positions the upper imaging section 145 by the first linear motion mechanism and the second linear motion mechanism.

The second holding portion 141 is supported by a first moving portion 160 provided below the second holding portion 141 . The first moving part 160 moves the second holding part 141 in the horizontal direction (X-axis direction) as will be described later. Further, the first moving part 160 is configured to move the second holding part 141 in the vertical direction and to rotate about the vertical axis.

The first moving unit 160 is provided with a lower imaging unit 146 that images the lower surface (bonding surface W1j) of the first substrate W1 held by the first holding unit 140 via the positioning mechanism 402 . A CCD camera, for example, is used for the lower imaging unit 146 . The positioning mechanism 402 includes a first linear motion mechanism and a second linear motion mechanism like the positioning mechanism 210, and the lower imaging section 146 is fixed to the second linear motion mechanism. The positioning mechanism 402 positions the lower imaging section 146 by the first linear motion mechanism and the second linear motion mechanism. A more specific configuration of the positioning mechanism 402 will be described later.

The first moving part 160 is attached to a pair of rails 162,162. A pair of rails 162, 162 are provided on the lower surface side of the first moving part 160 and extend in the horizontal direction (X-axis direction). The first moving part 160 is configured to be movable along rails 162 .

A pair of rails 162 , 162 are arranged on the second moving portion 163 . The second moving part 163 is attached to a pair of rails 164,164. A pair of rails 164, 164 are provided on the lower surface side of the second moving portion 163 and extend in the horizontal direction (Y-axis direction). The second moving part 163 is configured to be movable in the horizontal direction (Y-axis direction) along the rail 164 . The pair of rails 164 , 164 are arranged on a mounting table 165 provided on the bottom surface of the processing container 100 .

An alignment unit 166 is configured by the first moving unit 160, the second moving unit 163, and the like. The alignment unit 166 aligns the first substrate W1 held by the first holding unit 140 with the second holding unit 141 by moving the second holding unit 141 in the X-axis direction, the Y-axis direction, and the θ direction. Horizontal alignment with the held second substrate W2 is performed. Further, by moving the second holding portion 141 in the Z-axis direction, the alignment portion 166 can move the first substrate W1 held by the first holding portion 140 and the second substrate W1 held by the second holding portion 141. Vertical alignment is performed with two substrates W2.

Although the second holding portion 141 is moved in the X-axis direction, the Y-axis direction, and the θ direction here, the alignment portion 166 moves the second holding portion 141 in the X-axis direction and the Y-axis direction, for example. , and the first holding portion 140 may be moved in the θ direction. Also, although the second holding portion 141 is moved in the Z-axis direction here, the alignment portion 166 may move the first holding portion 140 in the Z-axis direction, for example.

Next, configurations of the first holding portion 140 and the second holding portion 141 will be described with reference to FIG. FIG. 6 is a schematic diagram showing the first holding portion 140 and the second holding portion 141 according to the embodiment.

As shown in FIG. 6 , the first holding portion 140 has a body portion 170 . Body portion 170 is supported by support member 180 . A through hole 176 is formed in the support member 180 and the main body portion 170 so as to vertically penetrate the support member 180 and the main body portion 170 . The position of the through-hole 176 corresponds to the central portion of the first substrate W1 held by the first holding portion 140 by suction. A pressing pin 191 of the striker 190 is inserted through the through hole 176 .

The striker 190 is arranged on the upper surface of the support member 180 and includes a pressing pin 191 , an actuator section 192 and a linear motion mechanism 193 . The pressing pin 191 is a columnar member that extends along the vertical direction and is supported by the actuator section 192 .

The actuator unit 192 generates a constant pressure in a constant direction (here, vertically downward) by air supplied from, for example, an electro-pneumatic regulator (not shown). The actuator unit 192 can control the pressure load applied to the center of the first substrate W1 by coming into contact with the center of the first substrate W1 by air supplied from the electropneumatic regulator. Also, the tip of the actuator section 192 can be vertically moved up and down through the through hole 176 by air from the electro-pneumatic regulator.

The actuator section 192 is supported by the direct acting mechanism 193 . The linear motion mechanism 193 moves the actuator section 192 in the vertical direction by a driving section including a motor, for example.

The striker 190 is configured as described above, the linear motion mechanism 193 controls the movement of the actuator section 192 , and the actuator section 192 controls the pressing load of the pressing pin 191 on the first substrate W<b>1 . As a result, the striker 190 presses the central portion of the first substrate W1 adsorbed and held by the first holding portion 140 to bring it into contact with the second substrate W2.

A plurality of pins 171 are provided on the lower surface of the body portion 170 to contact the upper surface (non-bonded surface W1n) of the first substrate W1. The plurality of pins 171 have, for example, a diameter dimension of 0.1 mm to 1 mm and a height of several tens of μm to several hundred μm. The plurality of pins 171 are evenly arranged at intervals of 2 mm, for example.

The first holding part 140 includes a plurality of suction parts for sucking the first substrate W1 in a partial region of the region where the plurality of pins 171 are provided. Specifically, a plurality of outer suction portions 301 and a plurality of inner suction portions 302 are provided on the lower surface of the main body portion 260 of the first holding portion 140 to suck the first substrate W1 by vacuuming. The plurality of outer suction portions 301 and the plurality of inner suction portions 302 have arc-shaped suction regions in plan view. The plurality of outer suction portions 301 and the plurality of inner suction portions 302 have the same height as the pins 171 .

A plurality of outer suction portions 301 are arranged on the outer peripheral portion of the main body portion 260 . The plurality of outer suction portions 301 are connected to a suction device (not shown) such as a vacuum pump, and suction the outer peripheral portion of the first substrate W1 by vacuum suction.

The plurality of inner suction portions 302 are arranged side by side in the circumferential direction radially inward of the main body portion 260 relative to the plurality of outer suction portions 301 . The plurality of inner suction units 302 are connected to a suction device (not shown) such as a vacuum pump, and suction the region between the outer peripheral portion and the central portion of the first substrate W1 by vacuum suction.

The second holding portion 141 has a main body portion 200 having the same diameter as or a larger diameter than the second substrate W2. Here, the second holding portion 141 having a diameter larger than that of the second substrate W2 is shown. The upper surface of the main body part 200 is a facing surface that faces the lower surface (non-bonding surface W2n) of the second substrate W2.

A plurality of pins 201 are provided on the upper surface of the body portion 200 to contact the lower surface (non-bonded surface W2n) of the second substrate W2. The plurality of pins 201 has, for example, a diameter dimension of 0.1 mm to 1 mm and a height of several tens of μm to several hundred μm. The plurality of pins 201 are evenly arranged at intervals of 2 mm, for example.

A lower rib 202 is provided annularly outside the plurality of pins 201 on the upper surface of the main body 200 . The lower rib 202 is formed in an annular shape and supports the outer peripheral portion of the second substrate W2 over the entire circumference.

Further, the main body part 200 has a plurality of lower suction ports 203 . A plurality of lower suction ports 203 are provided in the suction area surrounded by the lower ribs 202 . The plurality of lower suction ports 203 are connected to a suction device (not shown) such as a vacuum pump through suction tubes (not shown).

The second holding unit 141 decompresses the suction area surrounded by the lower ribs 202 by evacuating the suction area through the plurality of lower suction ports 203 . As a result, the second substrate W<b>2 placed in the adsorption area is held by the second holding part 141 by adsorption.

Since the lower rib 202 supports the outer peripheral portion of the lower surface of the second substrate W2 over the entire circumference, the second substrate W2 is properly vacuumed up to the outer peripheral portion. As a result, the entire surface of the second substrate W2 can be held by suction. Further, since the lower surface of the second substrate W2 is supported by the plurality of pins 201, the second substrate W2 is easily peeled off from the second holding portion 141 when the evacuation of the second substrate W2 is released.

<Configuration and Operation of Positioning Mechanism>
By the way, when adjusting the horizontal position of the first substrate W1 held by the first holding portion 140 and the second substrate W2 held by the second holding portion 141, the upper imaging portion 145 and the lower imaging portion are used. Image data captured by the unit 146 is used. From the viewpoint of improving the accuracy of horizontal positional adjustment of the first substrate W1 and the second substrate W2, the bonding surface of the first substrate W1 and the bonding surface of the second substrate W2 are precisely aligned by the upper imaging unit 145 and the lower imaging unit 146. Good imaging is important. Therefore, it is important to accurately position the upper imaging section 145 and the lower imaging section 146 prior to imaging the bonding surface of the first substrate W1 and the bonding surface of the second substrate W2.

In this regard, the prior art, which is a comparative example, has a structure in which the imaging unit is fixed to a movable member of a linear guide, for example, in which a movable member is provided on a base member so as to be able to move directly, and drift occurs when the movable member stops moving. As a result, there is a possibility that the imaging unit fixed to the movable member may be misaligned.

Therefore, in this embodiment, the positioning mechanisms 401 and 402 each include a first linear motion mechanism and a second linear motion mechanism fixed to the first linear motion mechanism, and the first linear motion mechanism restricts the movement of the movable member. The structure is such that the movement of the movable member can be stopped with high accuracy.

Thereby, a moving object such as a second linear motion mechanism fixed on the first linear motion mechanism and an imaging unit (that is, the upper imaging unit 145 and the lower imaging unit 146) fixed on the second linear motion mechanism can be suppressed. As a result, the positioning of the upper imaging section 145 and the lower imaging section 146 can be performed with high accuracy, and the imaging accuracy of the upper imaging section 145 and the lower imaging section 146 can be improved. The configuration of the positioning mechanism 402 according to the embodiment will be specifically described below with reference to FIGS. 7 and 8. FIG. Since the positioning mechanism 401 has the same configuration as the positioning mechanism 402, detailed description thereof will be omitted here.

FIG. 7 is a perspective view showing the configuration of the positioning mechanism 402 according to the embodiment. FIG. 8 is a plan view showing the configuration of the positioning mechanism 402 according to the embodiment.

As shown in FIGS. 7 and 8 , the positioning mechanism 402 includes a first linear motion mechanism 420 and a second linear motion mechanism 430 fixed to the first linear motion mechanism 420 .

The second linear motion mechanism 430 has a fixing surface on which the lower imaging section 146 can be fixed. The second direct-acting mechanism 430 is configured, for example, as a direct-acting piezo stage, and moves (directly moves) the lower imaging section 146 along a vertical axis (an example of a direct-acting axis) Vx. Thereby, the second direct-acting mechanism 430 controls the focus operation of the lower imaging section 146 . The moving distance (stroke) of the lower imaging section 146 by the second linear motion mechanism 430 is smaller than the moving distance (stroke) of the second linear motion mechanism 430 by the first linear motion mechanism 420 .

The first linear motion mechanism 420 includes a base member 421 , a movable member 422 , a drive mechanism 423 , a fixed member 424 , a connecting member 425 and a linear motion guide member 426 .

The base member 421 is a member that is fixed to the first moving portion 160 (see FIGS. 4 and 5) and serves as a base material of the first direct-acting mechanism 420 . The base member 421 is provided with an air supply portion 421a and a suction portion 421b.

The movable member 422 is provided to be linearly movable along the vertical axis Vx with respect to the base member 421 via a linear motion guide member 426 .

The drive mechanism 423 moves (translates) the movable member 422 along the vertical axis Vx. Here, a specific configuration of the drive mechanism 423 will be described with reference to FIG. 9 . FIG. 9 is a side sectional view showing the configuration of the positioning mechanism 402 according to the embodiment. FIG. 9 schematically shows a cross section taken along line II of FIG. In addition, in FIG. 9, the illustration of the second direct-acting mechanism 430 in the positioning mechanism 402 is omitted for convenience of explanation.

The drive mechanism 423 is configured as, for example, a direct acting actuator, and includes a screw shaft 423a, a slider 423b, and a drive source 423c. The screw shaft 423a is fixed to the base member 421 and extends along the vertical axis Vx. The slider 423 b is fixed to the screw shaft 423 a and the movable member 422 . The drive source 423c is fixed to the base member 421 and rotates the screw shaft 423a.

The drive mechanism 423 rotates the screw shaft 423a using the drive source 423c, thereby moving the slider 423b fixed to the screw shaft 423a along the vertical axis Vx. Thereby, the driving mechanism 423 can move the movable member 422 fixed to the slider 423b along the vertical axis Vx together with the slider 423b. The movable member 422 is connected to the fixed member 424 by a connecting member 425 as will be described later. Therefore, when the movable member 422 moves along the vertical axis Vx, the fixed member 424 can also move along the vertical axis Vx.

Returning to the description of FIGS. 7 and 8. FIG. The fixed member 424 is arranged on the opposite side of the movable member 422 with the base member 421 interposed therebetween, and has a fixed surface 424 a capable of fixing the second linear motion mechanism 430 .

The connecting member 425 connects the fixed member 424 to the movable member 422 so as to be movable between the separated position and the contact position. The separated position is a position where the fixed member 424 is separated from the base member 421 to allow movement of the movable member 422, and the contact position is a position where the fixed member 424 is brought into contact with the base member 421 and the movable member 422 is moved. is a position that regulates the In FIG. 8, the fixing member 424 positioned at the separated position is indicated by a solid line, and the fixing member 424 positioned at the contact position is indicated by a broken line.

The linear guide member 426 linearly guides the movable member 422 along the vertical axis Vx. As the linear guide member 426, for example, a cross roller guide or a ball guide can be used.

Each component shown in FIGS. 7 to 9 will be specifically described with reference to FIGS. 10 and 11. FIG. 10 and 11 are operation explanatory diagrams (1) and (2) of the positioning mechanism 402 according to the embodiment. 10 shows the operation state of each component when the movable member 422 is moved, and FIG. 11 shows the operation state of each component when the movement of the movable member 422 is stopped.

First, the base member 421 is configured as an air bearing, for example. Specifically, as shown in FIG. 10, the base member 421 supplies air to the air supply portion 421a via an air supply source 421d and a valve 421c. The base member 421 has air ejection grooves on the bearing surface of the fixing member 424 side, and ejects the air supplied to the air supply portion 421a to the back surface of the fixing member 424 opposite to the fixing surface 424a. By floating the fixing member 424, the fixing member 424 is moved to the separated position. In the isolated position, the fixed member 424 is allowed to move along the vertical axis Vx (arrow 1001 in the drawing), so that the movable member 422 connected to the fixed member 424 via the connecting member 425 moves along the vertical axis Vx. is permitted (arrow 1002 in the figure). Therefore, the drive mechanism 423 can move the movable member 422 along with the slider 423b along the vertical axis Vx by operating the drive source 423c to rotate the screw shaft 423a. As the movable member 422 moves along the vertical axis Vx, the fixed member 424 also moves along the vertical axis Vx.

Further, when the movement of the movable member 422 is stopped by the driving mechanism 423, the base member 421 is configured such that, as shown in FIG. Stop blowing air to

Next, the connecting member 425 will be described. The connecting member 425 is configured, for example, as an elastic hinge, and has elasticity that expands and contracts in directions for moving the fixing member 424 between the separated position and the contact position. The connecting member 425 is stretched by being pulled by the fixing member 424 which floats under the pressure of the air ejected from the base member 421 . When the air ejection from the base member 421 stops, the connecting member 425 contracts due to its own elastic force to move the fixing member 424 from the separated position to the contact position (see arrow 1101 in the drawing). ). At this contact position, the movement of the fixed member 424 along the vertical axis Vx is restricted, so that the movable member 422 connected to the fixed member 424 via the connecting member 425 is restricted from moving along the vertical axis Vx. be done.

Thus, when the movement of the movable member 422 is stopped by the drive mechanism 423, the connecting member 425 restricts the movement of the movable member 422 by moving the fixed member 424 from the separated position to the contact position. can be done. That is, the connecting member 425 can suppress the drift of the movable member 422 and the fixed member 424 when the movement of the movable member 422 is stopped, and can stop the movement of the movable member 422 and the fixed member 424 with high accuracy. As a result, the static stability of the movable member 422 and the fixed member 424 is improved, and the connecting member 425 serves to fix the second linear motion mechanism 430 and the second linear motion mechanism 430 fixed to the fixed surface 424a of the fixed member 424. It is possible to suppress positional deviation of the lower imaging section 146 fixed to the surface. As a result, the positioning mechanism 402 can accurately position the lower imaging section 146, and the imaging accuracy of the lower imaging section 146 can be improved.

As shown in FIG. 11, the base member 421 is connected to a suction device 421f such as a vacuum pump via a suction portion 421b and a valve 421e. A member 424 can be attracted to the bearing surface. As a result, the movement of the movable member 422 is more strongly restricted, so that the drift of the movable member 422 and the fixed member 424 due to the stoppage of the movement of the movable member 422 can be further suppressed.

Also, the power source 423c in the drive mechanism 423 may be turned off when the movement of the movable member 422 is stopped. As a result, problems caused by heat transferred from the drive source 423c to the movable member 222 can be prevented.

<Specific operation of the joining system>
Next, specific operations of the joining system 1 will be described with reference to FIG. 12 . FIG. 12 is a flowchart showing the procedure of processing executed by the joining system 1 according to the embodiment. Various processes shown in FIG. 12 are executed under the control of the control device 70 .

First, a cassette C1 containing a plurality of first substrates W1, a cassette C2 containing a plurality of second substrates W2, and an empty cassette C3 are placed on a predetermined mounting plate 11 of the loading/unloading station 2. be. After that, the first substrate W<b>1 in the cassette C<b>1 is taken out by the transport device 22 and transported to the transition device 50 of the third processing block G<b>3 of the processing station 3 .

Next, the first substrate W1 is transferred by the transfer device 61 to the surface modification device 30 of the first processing block G1, and the bonding surface W1j is modified in the surface modification device 30 (step S101). In the surface modification apparatus 30, the oxygen gas, which is the processing gas, is excited into plasma and ionized under a predetermined reduced pressure atmosphere. The bonding surface W1j of the first substrate W1 is irradiated with the oxygen ions, and the bonding surface W1j is plasma-processed. Thereby, the bonding surface W1j of the first substrate W1 is modified.

Next, the first substrate W1 is transported by the transport device 61 to the surface hydrophilization device 40 of the second processing block G2. In the surface hydrophilization device 40, pure water is supplied onto the first substrate W1 while rotating the first substrate W1 held by the spin chuck. Then, the supplied pure water diffuses on the bonding surface W1j of the first substrate W1, and hydroxyl groups (silanol groups) adhere to the bonding surface W1j of the first substrate W1 modified in the surface modification device 30, thereby The joint surface W1j is made hydrophilic. The pure water also cleans the bonding surface W1j of the first substrate W1 (step S102).

Next, the first substrate W1 is transferred by the transfer device 61 to the bonding device 41 of the second processing block G2. The first substrate W<b>1 loaded into the bonding device 41 is transported to the position adjustment mechanism 120 by the substrate transport mechanism 111 via the transition 110 . Then, the horizontal orientation of the first substrate W1 is adjusted by the position adjustment mechanism 120 (step S103).

After that, the first substrate W<b>1 is transferred from the position adjusting mechanism 120 to the holding arm 131 of the reversing mechanism 130 . Subsequently, in the transport area T1, the holding arm 131 is reversed to reverse the front and back surfaces of the first substrate W1 (step S104). That is, the bonding surface W1j of the first substrate W1 faces downward.

Thereafter, the holding arm 131 of the reversing mechanism 130 rotates and moves below the first holding portion 140 . Then, the first substrate W1 is transferred from the reversing mechanism 130 to the first holding unit 140, and the first substrate W1 is sucked and held by the first holding unit 140 (step S105). In step S<b>105 , the first holding unit 140 sucks and holds the first substrate W<b>1 using all of the plurality of outer suction portions 301 and the plurality of inner suction portions 302 .

The processing for the second substrate W2 is performed in duplicate with the processing of steps S101 to S105 for the first substrate W1. First, the second substrate W<b>2 in the cassette C<b>2 is taken out by the transport device 22 and transported to the transition device 50 of the processing station 3 .

Next, the second substrate W2 is transported to the surface modification device 30 by the transport device 61, and the bonding surface W2j of the second substrate W2 is modified (step S106). The modification of the bonding surface W2j of the second substrate W2 in step S106 is the same as in step S101 described above.

After that, the second substrate W2 is transported to the surface hydrophilization device 40 by the transport device 61, and the bonding surface W2j of the second substrate W2 is hydrophilized and cleaned (step S107). Hydrophilization and cleaning of the bonding surface W2j of the second substrate W2 in step S107 are the same as in step S102 described above.

After that, the second substrate W<b>2 is transferred to the bonding device 41 by the transfer device 61 . The second substrate W<b>2 loaded into the bonding device 41 is transported to the position adjustment mechanism 120 by the substrate transport mechanism 111 via the transition 110 . Then, the horizontal orientation of the second substrate W2 is adjusted by the position adjustment mechanism 120 (step S108).

After that, the second substrate W2 is transferred to the second holding portion 141 by the substrate transfer mechanism 111 and held by suction on the second holding portion 141 (step S109).

Next, the positioning mechanisms 401 and 402 position the imaging units (that is, the upper imaging unit 145 and the lower imaging unit 146) for imaging the bonding surfaces W1j and W2j of the first substrate W1 and the second substrate W2 in the vertical direction. is performed (step S110).

Next, the horizontal positions of the first substrate W1 held by the first holding unit 140 and the second substrate W2 held by the second holding unit 141 are adjusted (step S111). Specifically, first, while moving the second holding unit 141 in the horizontal direction by the first moving unit 160 and the second moving unit 163, the upper imaging unit 145 is used to move the reference point of the bonding surface W2j of the second substrate W2. is imaged. At the same time, while moving the second holding part 141 in the horizontal direction, the lower imaging part 146 is used to image the reference point of the bonding surface W1j of the first substrate W1.

The captured image data is output to the control device 70 . Then, the control device 70 identifies the reference point of the first substrate W1 and the reference point of the second substrate W2 based on the captured image data. Then, the control device 70 moves the first moving part 160 and the second moving part 163 so that the reference point of the first substrate W1 and the reference point of the second substrate W2 are aligned. Accordingly, the horizontal positions of the first holding part 140 and the second holding part 141 are adjusted, and the horizontal positions of the first substrate W1 and the second substrate W2 are adjusted.

Next, the vertical positions of the first substrate W1 held by the first holding portion 140 and the second substrate W2 held by the second holding portion 141 are adjusted (step S112). Specifically, the first moving unit 160 moves the second holding unit 141 vertically upward, thereby bringing the second substrate W2 closer to the first substrate W1.

Next, after releasing the suction and holding of the first substrate W1 by the plurality of inner suction portions 302 (step S113), the pressing pins 191 of the striker 190 are lowered to press down the center portion of the first substrate W1 (step S113). S114).

When the central portion of the first substrate W1 contacts the central portion of the second substrate W2 and the central portion of the first substrate W1 and the central portion of the second substrate W2 are pressed with a predetermined force by the striker 190, the pressing force is applied. Bonding starts between the central portion of the first substrate W1 and the central portion of the second substrate W2. That is, since the bonding surface W1j of the first substrate W1 and the bonding surface W2j of the second substrate W2 have been modified in steps S101 and S106, respectively, the Van der Waals force (intermolecular force) between the bonding surfaces W1j and W2j ) is generated, and the joint surfaces W1j and W2j are joined together. Furthermore, since the bonding surface W1j of the first substrate W1 and the bonding surface W2j of the second substrate W2 have been made hydrophilic in steps S102 and S107, respectively, the hydrophilic groups between the bonding surfaces W1j and W2j are hydrogen-bonded to form the bonding surface W1j. , W2j are firmly joined together. In this manner, a bonding region is formed between the central portion of the first substrate W1 and the central portion of the second substrate W2.

After that, a bonding wave is generated between the first substrate W1 and the second substrate W2 in which the bonding area expands from the central portion of the first substrate W1 and the second substrate W2 toward the outer peripheral portion.

Thereafter, the suction and holding of the first substrate W1 by the plurality of outer suction portions 301 is released (step S115). As a result, the outer peripheral portion of the first substrate W1 sucked and held by the outer suction portion 301 drops. As a result, the entire surface of the bonding surface W1j of the first substrate W1 and the bonding surface W2j of the second substrate W2 are in contact with each other, and the superimposed substrate T is formed.

Thereafter, the pressing pins 191 are lifted up to the first holding portion 140, and the suction holding of the second substrate W2 by the second holding portion 141 is released. After that, the superimposed substrate T is carried out from the bonding device 41 by the transport device 61 . In this way, a series of joining processes is completed.

<effect>
As described above, the linear motion mechanism (eg, first linear motion mechanism 420) according to the embodiment includes a base member (eg, base member 421), a movable member (eg, movable member 422), and a drive mechanism ( For example, it includes a drive mechanism 423), a fixing member (for example, fixing member 424), and a connecting member (for example, connecting member 425). The movable member is provided to be linearly movable with respect to the base member along a linear motion axis (for example, vertical axis Vx). The drive mechanism moves the movable member along the linear motion axis. The fixed member is arranged on the opposite side of the movable member across the base member, and has a fixed surface (eg, fixed surface 424a) capable of fixing the object to be moved (eg, second linear motion mechanism 430). The connecting member moves the fixed member between a separated position where the fixed member is separated from the base member to allow movement of the movable member and a contact position where the fixed member is brought into contact with the base member to restrict movement of the movable member. It is movably connected to the movable member. Thereby, according to the direct-acting mechanism according to the embodiment, it is possible to suppress the displacement of the object to be moved.

Further, the connecting member may be an elastic hinge and have elasticity that expands and contracts in a direction for moving the fixing member between the separated position and the contact position. Thus, according to the linear motion mechanism according to the embodiment, the fixed member positioned at the abutment position can be pressed against the base member by the elastic force of the connecting member, and the fixed member and the movable body connected to the fixed member can be pressed against the base member. The static definiteness of the member can be improved.

In addition, the base member is an air bearing, and when the movable member is moved, air is ejected to the back surface of the fixed member opposite to the fixed surface to float the fixed member. may be moved to the remote position. Thus, according to the linear motion mechanism according to the embodiment, it is possible to easily allow the movement of the movable member using air.

Further, the base member may stop blowing air when the movement of the movable member is stopped. Further, the connecting member may be stretched by being pulled by a fixing member that floats under the pressure of air ejected from the base member. Further, the connection member may be contracted by an elastic elastic force when the ejection of air from the base member is stopped, and the fixing member may be moved from the separated position to the contact position. Thereby, according to the direct-acting mechanism according to the embodiment, it is possible to easily regulate the movement of the movable member by using the elastic force of the connecting member.

Further, the base member may be connected to a suction device and suck the fixed member positioned at the contact position by suction of the suction device. As a result, according to the linear motion mechanism according to the embodiment, it is possible to further suppress the drift of the movable member and the fixed member that accompanies the movement stop of the movable member.

Further, the linear motion mechanism may further include a linear motion guide member (for example, a linear motion guide member 426) that linearly guides the movable member along the linear motion shaft. Also, the linear guide member may be a cross roller guide or a ball guide. Thereby, according to the direct-acting mechanism according to the embodiment, the movable member can be smoothly moved along the direct-acting shaft.

The drive mechanism may also include a screw shaft (eg, screw shaft 423a), a slider (eg, slider 423b), and a drive source (eg, drive source 423c). The threaded shaft may be fixed to the base member and extend along the linear motion axis. The slider may be fixed to the screw shaft and the movable member. The drive source may be fixed to the base member and rotate the screw shaft to move the movable member together with the slider along the linear motion shaft. Then, the power source of the drive source may be turned off when the movement of the movable member is stopped. As a result, according to the linear motion mechanism according to the embodiment, it is possible to prevent problems caused by heat transmitted from the drive source to the movable member.

<Other Modifications>
In the above-described embodiment, an example in which the imaging units (that is, the upper imaging unit 145 and the lower imaging unit 146) are positioned in the vertical direction using the positioning mechanisms 401 and 402 has been described. is not limited to For example, even when the horizontal positions of the first holding portion 140 and the second holding portion 141 are adjusted using the first moving portion 160 and the second moving portion 163, the positioning mechanism of the present disclosure and the second moving part 163 .

It should be noted that the embodiments disclosed this time should be considered as examples in all respects and not restrictive. Indeed, the above-described embodiments may be embodied in many different forms. Also, the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims.

1 Joining system 2 Loading/unloading station 3 Processing station 30 Surface modification device 40 Surface hydrophilization device 41 Joining device 70 Control device 140 First holding unit 141 Second holding unit 145 Upper imaging unit 146 Lower imaging unit 160 First moving unit 163 Second moving parts 401, 402 Positioning mechanism 420 First linear motion mechanism 421 Base member 421a Air supply part 421b Suction part 421c Valve 421d Air supply source 421e Valve 421f Suction device 422 Movable member 423 Drive mechanism 423a Screw shaft 423b Slider 423c Drive source 424 fixing member 424a fixing surface 425 connecting member 426 linear motion guide member 430 second linear motion mechanism W1 first substrate W2 second substrate

Claims (11)

a base member;
a movable member provided to be linearly movable along a linear motion axis with respect to the base member;
a drive mechanism for moving the movable member along the linear motion axis;
a fixing member disposed on the opposite side of the movable member across the base member and having a fixing surface capable of fixing a moving object;
The fixed member is separated from the base member at a separated position to allow movement of the movable member, and at a contact position at which the fixed member is brought into contact with the base member to restrict movement of the movable member. a connecting member movably connected to the movable member between the linear motion mechanism. The connecting member is
2. The linear motion mechanism according to claim 1, wherein the hinge is an elastic hinge and has elasticity for expanding and contracting in a direction for moving the fixed member between the separated position and the contact position. The base member is
The air bearing is an air bearing, and when the movable member is moved, the fixed member is lifted by ejecting air to the back surface of the fixed member opposite to the fixed surface to levitate the fixed member. 3. The linear motion mechanism according to claim 2, which moves to said separated position. The base member is
stopping blowing of the air when the movement of the movable member is stopped;
The connecting member is
It is stretched by being pulled by the fixed member that floats under the pressure of the air ejected from the base member, and contracted by the elastic force of the elastic force when the ejection of the air from the base member stops. 4. The linear motion mechanism according to claim 3, wherein the fixed member is moved from the separated position to the contact position. The base member is
5. The linear motion mechanism according to claim 4, which is connected to a suction device and sucks said fixing member positioned at said contact position by suction of said suction device. The linear motion mechanism according to any one of claims 1 to 5, further comprising a linear motion guide member that linearly guides the movable member along the linear motion shaft. The linear guide member is
7. The linear motion mechanism according to claim 6, which is a cross roller guide or a ball guide. The drive mechanism is
a screw shaft fixed to the base member and extending along the linear motion shaft;
a slider fixed to the screw shaft and the movable member;
a drive source fixed to the base member and configured to move the movable member together with the slider along the linear motion shaft by rotating the screw shaft;
8. The linear motion mechanism according to any one of claims 1 to 7, wherein the power source of said drive source is turned off when movement of said movable member is stopped. a first linear motion mechanism;
a second linear motion mechanism fixed to the first linear motion mechanism,
The first linear motion mechanism is
a base member;
a movable member provided on the base member so as to be linearly movable along a linear motion axis;
a drive mechanism for moving the movable member along the linear motion axis;
a fixing member disposed on the opposite side of the movable member with respect to the base member and having a fixing surface capable of fixing the second linear motion mechanism;
The fixed member is separated from the base member at a separated position to allow movement of the movable member, and at a contact position at which the fixed member is brought into contact with the base member to restrict the movement of the movable member. and a connecting member movably connected to the movable member between. A bonding apparatus for bonding substrates,
a first holding part that sucks and holds the first substrate from above;
a second holding part that sucks and holds the second substrate from below;
a moving part that horizontally moves one of the first holding part and the second holding part with respect to the other;
a positioning mechanism comprising a first linear motion mechanism and a second linear motion mechanism fixed to the first linear motion mechanism;
an imaging unit that is fixed to the second linear motion mechanism of the positioning mechanism and captures an image of the joint surface of the first substrate or the second substrate,
The first linear motion mechanism is
a base member;
a movable member provided on the base member so as to be linearly movable along a linear motion axis;
a drive mechanism for moving the movable member along the linear motion axis;
a fixing member disposed on the opposite side of the movable member with respect to the base member and having a fixing surface capable of fixing the second linear motion mechanism;
The fixed member is separated from the base member at a separated position to allow movement of the movable member, and at a contact position at which the fixed member is brought into contact with the base member to restrict the movement of the movable member. and a connecting member that is movably connected to the movable member between. A bonding method for bonding substrates,
a step of sucking and holding the first substrate using a first holding portion that sucks and holds the first substrate from above;
sucking and holding the second substrate using a second holding part that sucks and holds the second substrate from below;
A positioning mechanism comprising a first linear motion mechanism and a second linear motion mechanism fixed to the first linear motion mechanism, wherein the first linear motion mechanism includes a base member and a linear motion shaft mounted on the base member. a drive mechanism for moving the movable member along the linear motion shaft; a fixed member having a fixed surface capable of fixing a moving mechanism; a spaced position separating the fixed member from the base member to allow movement of the movable member; The positioning mechanism is fixed to the second direct-acting mechanism using the positioning mechanism that includes a connecting member that connects the movable member so as to be movable between a contact position that contacts and restricts the movement of the movable member. a step of positioning an imaging unit for imaging the bonding surfaces of the first substrate and the second substrate;
adjusting the horizontal positions of the first holding part and the second holding part using a moving part for moving one of the first holding part and the second holding part in the horizontal direction with respect to the other; including
The step of adjusting the position includes:
A bonding method, wherein the moving section is moved based on image data captured by the imaging section.

Images