JP2023057858A - Mark detection device, exposure device and article production method - Google Patents

Abstract

To provide a technique useful for improving the reproducibility of position of a scope when fixing the scope.SOLUTION: A mark detection device has: a support member; a scope for detecting a mark; a driving mechanism for changing the position of the scope relative to the support member; a plurality of fixing mechanisms that perform fixing operation to fix the scope to the support member; and a controller. When the plurality of fixing mechanisms are used to fix the scope to the support member, the controller causes the plurality of fixing mechanisms to perform the fixing operation in a preset order.SELECTED DRAWING: Figure 4

Description

The present invention relates to a mark detection device, an exposure device, and an article manufacturing method.

2. Description of the Related Art In recent years, the line width of a pattern formed on a substrate has become very small due to the high integration and miniaturization of semiconductor integrated circuits. Along with this, further miniaturization is desired in the lithography process for forming a resist pattern on a substrate. In the step-and-repeat type projection exposure apparatus and the step-and-scan type exposure apparatus, the exposure light is imaged at a desired position on the substrate via the projection optical system, and the stage on which the substrate is mounted is shifted relative to the substrate. A desired pattern is formed on the substrate by moving. Therefore, in order to meet the demand for finer patterns, it is important to align the relative positions of the substrate and the exposure light with high accuracy. Conventionally, prior to pattern formation, a method of measuring the positions of alignment marks formed in the vicinity of shot areas on a substrate and determining the arrangement of shot areas for alignment (global alignment) has been carried out.

In Patent Document 1, a force generating device provided in a support device that movably supports a plurality of mark detection systems generates forces opposite to each other in the vertical direction between the detection systems while maintaining clearance. A method for moving the detection system is described. According to Patent Document 1, the detection system can be moved without being affected by frictional force, so the detection system can be positioned with high accuracy.

Japanese Patent No. 5534262

Even if the scope that detects the mark can be positioned at the target position with high accuracy, if you try to fix the scope in order to keep it stationary at the target position, the position of the scope may change due to the fixing operation. .

An object of the present invention is to provide an advantageous technique for improving the reproducibility of the position of the scope when the scope is fixed.

One aspect of the present invention relates to a mark detection device, the mark detection device comprising: a support member; a scope for detecting a mark; a drive mechanism for changing the relative position of the scope with respect to the support member; a plurality of fixing mechanisms that perform a fixing operation for fixing the scope to a support member; and a control unit that causes the fixing operation to be performed in order.

The present invention provides an advantageous technique for improving the repeatability of scope position when the scope is fixed.

1 is a schematic diagram showing the configuration of an exposure apparatus according to one embodiment; FIG. 1 is a schematic diagram showing a configuration example of a mark detection device according to a first embodiment; FIG. FIG. 4 is a schematic diagram showing the configuration of a mark detection system of a comparative example; 4 is a schematic diagram showing a mark detection system in the first embodiment; FIG. Schematic showing a configuration example of a vacuum pad or a movable member. 4 is a flowchart illustrating the operation of the exposure apparatus of one embodiment; FIG. 4 is a schematic diagram showing a mark detection system of a second embodiment; FIG. 11 is a schematic diagram showing a mark detection system according to a third embodiment; FIG. 11 is a schematic diagram showing a mark detection system according to a fourth embodiment; 1 is a schematic diagram illustrating a mark detection device including three mark detection systems; FIG.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. In addition, the following embodiments do not limit the invention according to the scope of claims. Although multiple features are described in the embodiments, not all of these multiple features are essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same or similar configurations are denoted by the same reference numerals, and redundant description is omitted.

[First embodiment]
FIG. 1 is a block diagram showing the configuration of an exposure apparatus EXP incorporating a mark detection apparatus 100. As shown in FIG. The exposure apparatus EXP includes an illumination device IL, an original stage RS that holds and positions the original 31, a projection optical system 2, a substrate stage WS that holds and positions the substrate 3, a mark detection device 100, and a controller 1100. be prepared. A reference plate 39 can be arranged on the substrate stage WS. The controller 1100 has a processor and memory, and can control the illumination device IL, the original stage RS, the substrate stage WS, and the mark detection device 100 . The control unit 1100 can process signals output from the mark detection device 100 to detect the positions of the marks on the substrate 3 .

The illumination device IL illuminates an original 31 having a pattern to be transferred onto the substrate 3 . The illuminator IL can include a light source section 800 and an illumination optical system 801 . The illumination optical system 801 can have a function of uniformly illuminating the original 31 . Also, the illumination optical system 801 can have a polarized illumination function.

Light source unit 800 may include, for example, a laser. The laser can include, for example, an ArF excimer laser with a wavelength of about 193 nm or a KrF excimer laser with a wavelength of about 248 nm, but the type of light source is not limited to excimer lasers. Specifically, an F2 laser with a wavelength of about 157 nm or an EUV (Extreme Ultraviolet) light source with a wavelength of 20 nm or less may be used.

The illumination optical system 801 is an optical system that illuminates the surface to be illuminated, that is, the original plate 31 using the light flux emitted from the light source section 800 . The illumination optical system 801 can, for example, form a light beam into a slit shape and illuminate the master 31 with the slit-shaped light beam. The illumination optical system 801 can include lenses, mirrors, optical integrators, diaphragms, and the like. These can be arranged, for example, in the following order: condenser lens, fly-eye lens, aperture stop, condenser lens, slit, imaging optics.

The original plate 31 is made of quartz, for example, and a pattern to be transferred to the substrate 3 can be provided thereon. The original 31 can be held by an original stage RS and driven by an actuator (not shown). Diffracted light emitted from the original 31 is projected onto the substrate 3 by the projection optical system 2 . The original 31 and the substrate 3 can be arranged in an optically conjugate relationship. The pattern of the original 31 can be transferred to the substrate 3 by scanning the original 31 and the substrate 3 at a speed ratio according to the reduction magnification ratio of the projection optical system 2 . The exposure apparatus EXP can further include an oblique-incidence-type original detection unit. The position of the original plate 31 can be detected by the original plate detection unit and placed at a predetermined position.

The original plate stage RS holds the original plate 31 by an original plate chuck (not shown) and can be driven by a drive mechanism (not shown). The drive mechanism is composed of a linear motor or the like, and can drive the original 31 by driving the original stage RS in the X-axis direction, the Y-axis direction, the Z-axis direction, and the rotation directions of the respective axes. The projection optical system 2 has a function of forming an image on the image plane of the projection optical system 2 from the light flux from the object plane of the projection optical system 2 . In other words, the projection optical system 2 forms an image of the diffracted light from the pattern of the original 31 on the substrate 3 . The projection optical system 2 is, for example, an optical system consisting of a plurality of lens elements, an optical system (catadioptric optical system) having a plurality of lens elements and at least one concave mirror, or a plurality of lens elements and at least one concave mirror. can be an optical system having a diffractive optical element such as a kinoform of

A substrate 3 is an object to be processed, and a photoresist is applied on the substrate 3 . The substrate 3 can also be understood as a detectable object having marks whose positions are detected using the mark detection device 100 . The substrate 3 can be, for example, a semiconductor substrate or a glass substrate.

The substrate stage WS holds the substrate 3 with a substrate chuck (not shown). The substrate stage WS is driven by a drive mechanism (not shown) composed of a linear motor or the like, and can thereby move the substrate 3 in the X-axis direction, the Y-axis direction, the Z-axis direction, and the rotation directions of these axes. Also, the position of the original stage RS and the position of the substrate stage WS can be monitored by, for example, a 6-axis laser interferometer 81 or the like, and driven at a constant speed ratio by the controller 1100 .

Next, a configuration example of the mark detection device 100 will be described with reference to FIG. The mark detection device 100 can include a plurality of mark detection systems 21a to 21c having detection areas arranged at different positions along the X-axis direction. The mark detection apparatus 100 may also include a plurality of drive mechanisms 22a-22c drivable with respect to a detection system frame 23 holding a plurality of mark detection systems 21a-21c, respectively. Thus, the mark detection device 100 can individually adjust the positions in the X-axis direction of the detection regions of the plurality of mark detection systems 21a to 21c using the plurality of drive mechanisms 22a to 22c. The mark detection device 100 can be configured such that the relative positions of the respective detection regions of the plurality of mark detection systems 21a-21c can be adjusted at least in the X-axis direction by the plurality of drive mechanisms 22a-22c. The driving directions of the plurality of mark detection systems 21a to 21c are not limited to the X-axis direction, and may be configured to be drivable in the Y-axis direction and/or the Z-axis direction, for example, in addition to the X-axis direction. At least one of the plurality of mark detection systems 21a to 21c, for example, the mark detection system 21a, may not be driven by the drive mechanism, and the position of the detection area may be fixed. Also, the mark detection system in which the position of the detection area is fixed may be the mark detection system 21b and/or the mark detection system 21c. In the following description, the plurality of mark detection systems 21a, 21b, and 21c will be referred to as the mark detection system 21 when the description is made without distinguishing between them.

FIG. 2B is a diagram showing a configuration example of the mark detection system 21. As shown in FIG. The mark detection system 21 includes a scope SCP. The scope SCP can include an illumination system that illuminates the substrate 3 with light emitted from the light source 61 and an imaging system that forms an image of the mark 72 provided on the substrate 3 . The illumination system can include illumination optics 62 , 63 , 66 , illumination aperture stop 64 , mirror M 2 , relay lens 67 , polarizing beam splitter 68 , λ/4 plate 70 and objective optics 71 . The imaging system may include objective optics 71 , λ/4 plate 70 , detection aperture stop 69 , polarizing beam splitter 68 and imaging optics 74 . The imaging system may be configured to image the reflected light from mark 72 onto sensor 75 . Based on the position information of the substrate stage WS measured using the laser interferometer 81 and the signal waveform of the mark of the substrate 3 detected using the mark detection system 21, the control unit 1100 determines the coordinate position of the mark. demand.

In the mark detection system 21 , light emitted from the light source 61 passes through illumination optical systems 62 and 63 and reaches an illumination aperture stop 64 arranged at a position conjugate with the substrate 3 . At this time, the luminous flux diameter at the illumination aperture stop 64 is sufficiently smaller than the luminous flux diameter at the light source 61 . Light passing through the illumination aperture stop 64 passes through an illumination optical system 66, a mirror M2, and a relay lens 67 and is guided to a polarization beam splitter 68. Here, in the polarizing beam splitter 68, P-polarized light parallel to the Y direction is transmitted, and S-polarized light parallel to the X direction is reflected. Therefore, the P-polarized light that has passed through the polarizing beam splitter 68 passes through the detection aperture stop 69 and the λ/4 plate 70 , is converted into circularly polarized light, passes through the objective optical system 71 , and passes through the mark on the substrate 3 . 72 is Koehler illuminated.

The light reflected, diffracted, and scattered by the mark 72 passes through the objective optical system 71 again, passes through the λ/4 plate 70 , is converted from circularly polarized light into S-polarized light, and reaches the detection aperture stop 69 . Here, the polarization state of the light reflected by the mark 72 becomes circularly polarized in the opposite direction to the circularly polarized light irradiated onto the mark 72 . That is, when the polarization state of the light applied to the mark 72 is right-handed circularly polarized light, the polarization state of the light reflected by the mark 72 is left-handed circularly polarized light. Further, the detection aperture stop 69 can change the numerical aperture of the reflected light from the mark 72 by changing the aperture amount according to the command from the control section 1100 . The light passing through the detection aperture stop 69 is reflected by the polarizing beam splitter 68 and then directed to the sensor 75 via the imaging optical system 74 . Therefore, the polarizing beam splitter 68 separates the optical path of the illumination light to the substrate 3 and the optical path of the reflected light from the substrate 3 , and an image of the mark 72 provided on the substrate 3 is formed on the sensor 75 .

Next, a method of detecting (the position of) a mark on the substrate 3 using the mark detection apparatus 100 will be described with reference to FIGS. 2(C) to 2(F). FIG. 2(C) is a view of the mark detection device 100 shown in FIG. 2(A) as seen from the Z-axis direction, and FIGS. 2 shows the positional relationship between the mark detection device 100 and the mark 32 on the substrate 3 at different points in time. In view of productivity, the mark detection apparatus 100 is designed to measure only the marks 32 in some of the shot areas, as shown in FIGS. 2(D) and 2(E). can be controlled. In one example, by controlling the position of the substrate stage WS, the plurality of marks 32 on the substrate 3 are aligned with the respective detection areas of the plurality of mark detection systems 21 of the mark detection apparatus 100 so that the plurality of marks 32 are aligned. can be detected. At this time, the control unit 1100 can control the position of the substrate stage WS so as to detect the plurality of marks 32 to be detected in the shortest possible time.

For example, by aligning the marks 32 on the substrate 3 within the detection areas and focal depths of at least two mark detection systems 21 out of the plurality of mark detection systems 21 of the mark detection apparatus 100, two marks 32 can be detected at the same time. can be detected. For example, as shown in FIG. 2(D), two marks 32F and 32G on the substrate 3 can be aligned with the mark detection systems 21a and 21b to detect the positions of the marks simultaneously. Further, as shown in FIG. 2E, the mark detection system 21 used for detecting the positions of the marks 32 may be changed according to the layout of the marks 32 on the substrate 3. FIG. For example, the marks 32L and 32M on the substrate 3 can be aligned with the mark detection systems 21b and 21c to detect the positions of the marks. Further, as shown in FIG. 2(F), the three marks 32R, 32S, and 32T on the substrate 3 are simultaneously aligned within the detection areas and focal depths of the three mark detection systems 21a to 21c, and the marks 32R, 32T, and 32T are detected. It is also possible to detect the positions of 32S and 32T. As a result, the drive time of the substrate stage WS and the measurement time of the mark detection apparatus 100 are reduced compared to the case where the plurality of marks 32 on the substrate 3 are sequentially positioned with respect to the detection area of one mark detection system and detected. can be shortened.

The control unit 1100 calculates shift (movement), magnification, and rotation regarding the arrangement of the plurality of shot areas 34 on the substrate 3 by global alignment based on the detection results of the marks 32 in the detection areas of the plurality of mark detection systems 21. I can. This makes it possible to determine the regularity of the lattice arrangement of the plurality of shot areas 34 on the substrate 3 . After that, the control unit 1100 obtains a correction coefficient from the reference baseline and the regularity of the determined lattice arrangement, and can align the master 31 and the substrate 3 based on the result.

Here, before explaining the fixing operation of the mark detection system in the mark detection device of the embodiment, the fixing operation of the mark detection system in the mark detection device of the comparative example and its problems will be explained.

FIG. 3A shows an example of a fixing method of the mark detection system of the comparative example. Note that FIG. 3A shows only one of a plurality of drivable mark detection systems. Other drivable mark detection systems may have the same configuration. A mark detection system housing 12 is supported by one guide 10 with respect to the detection system frame 23 so as to be movable in the X-axis direction. A gap is provided between the fixing mechanism 11 and the mark detection system housing 12 . The fixing mechanism 11 has a channel (not shown) for vacuum suction inside, and is equipped with an electromagnetic valve 15 in the middle of the channel. Further, the mark detection system housing 12 is driven by a drive mechanism (not shown), and the mark detection system housing 12 is positioned at a predetermined position under the control of the controller 1100 based on information measured by an encoder (not shown). . After that, by supplying a vacuum pressure to the fixing mechanism 11 from the electromagnetic valve 15, the fixing mechanism 11 and the mark detection system housing 12 can be brought into contact with each other, and the position of the mark detection system housing 12 is fixed by frictional force. .

Here, in the relationship between the fixing mechanism 11 and the mark detection system housing 12, there are many individual differences in gap amount and inclination before vacuum suction (before fixing) due to part manufacturing errors and assembly errors. For example, as shown in FIG. 3B, when the right fixing mechanism 11 is tilted and the right fixing mechanism 11 is close to the mark detection system housing 12, first, part of the right fixing mechanism 11 is used for mark detection. It can come into contact with the system housing 12 . Then, when the other part of the right fixing mechanism 11 and the left fixing mechanism 11 contact the mark detection system housing 12 with the part of the right fixing mechanism 11 as a fulcrum, the mark detection system housing 12 force can act in the horizontal direction.

Also, as shown in FIG. 3C, when there is a gap amount difference between the two fixing mechanisms 11, a difference in attraction force occurs between the two fixing mechanisms 11, causing the mark detection system housing 12 to move. A rotational force about the X axis can act. When the force described above acts on the mark detection system housing 12, the position of the mark detection system housing 12 may be displaced.

Further, when the distance of the flow path from the solenoid valve 15 to the two fixing mechanisms 11 has a manufacturing error, the timing of vacuum suction deviates from the target timing. As a result, if the order in which the vacuum pressure is supplied to the two fixing mechanisms 11 is reversed from the intended order, the behavior during vacuum suction may change and the positional deviation may not be constant. These shift factors cause the mark 32 to be detected to deviate from the center of the detection area of the mark detection system 21, and detection errors may occur due to the aberration of the optical system of the mark detection system housing 12. FIG. Further, if the position of the mark detection system housing 12 deviates from the target position by several μm, the mark 32 may deviate from the detection area, resulting in a measurement error.

The configuration of the mark detection system 21 in the mark detection device 100 of the embodiment will be described below. FIGS. 4A and 4B show one mark detection system among the plurality of drivable mark detection systems 21 in the embodiment. FIG. 4A is a plan view, and FIG. 4B is a cross-sectional view. Note that the detection system frame 23 is omitted in FIG. 4(A). Since the mark detection system housing 12 is a housing that accommodates the aforementioned scope SCP, the mark detection system housing 12 in the following description can be read as the scope SCP. The mark detection system 21 can include a detection system frame 23 as a support member, a mark detection system housing 12 (scope SCP), a driving mechanism DM, and horizontal fixing mechanisms 13a and 13b as a plurality of fixing mechanisms. The mark detection device 100 may have one or more guides for guiding the mark detection system housing 12, and in the example of FIG. The two guides 10 can be arranged parallel to each other. The guide 10 can be, for example, a linear motion guide using rolling elements or a hydrostatic bearing type linear motion guide.

The two horizontal fixing mechanisms 13a, 13b can be supported by the detection system frame 23. FIG. Two horizontal fixing mechanisms 13a, 13b can be arranged between the two guides 10 in orthogonal projection to the horizontal plane. The two horizontal fixing mechanisms 13a and 13b can be arranged so that the center of gravity of the mark detection system housing 12 is positioned between the two horizontal fixing mechanisms 13a and 13b in orthogonal projection onto the horizontal plane. The two horizontal fixing mechanisms 13 a , 13 b can have horizontal surfaces that are pressed against the mark detection system housing 12 . The mark detection device 100 may comprise two vertical fixing mechanisms 14a, 14b as additional fixing mechanisms. The two vertical fixing mechanisms 14 a , 14 b may have vertical surfaces that press against the mark detection system housing 12 . Hereinafter, the horizontal fixing mechanisms 13a, 13b and the vertical fixing mechanisms 14a, 14b are also referred to as fixing mechanisms 13a, 13b, 14a, 14b. The fixing mechanisms 13a, 13b, 14a, and 14b apply forces for fixing the scope SCP to different positions of the mark detection system housing 12 or the scope SCP.

The two vertical fixing mechanisms 14a and 14b can generate a holding force for fixing the mark detection system housing 12 in the ωY-axis direction (rotational direction around the Y-axis). In the example of FIG. 4, the X direction span of each guide 10 is not sufficient and the stiffness in the ωY axis direction (around the Y axis) is not sufficient, so two vertical fixing mechanisms 14a, 14b may be provided. However, if the rigidity in the ωY-axis direction (around the Y-axis) satisfies the required specifications, the two vertical fixing mechanisms 14a and 14b are unnecessary. The horizontal fixing mechanisms 13a and 13b can generate a holding force for fixing the mark detection system housing 12 in the horizontal direction (direction parallel to the XY plane). The horizontal fixing mechanisms 13a and 13b can also generate a holding force for fixing the mark detection system housing 12 in the ωZ-axis direction (rotational direction around the Z-axis).

The vertical fixing mechanisms 14a, 14b can be supported by the detection system frame 23. FIG. The vertical fixing mechanisms 14a and 14b can generate holding force for fixing the mark detection system housing 12 in the vertical direction (Z-axis direction). The vertical fixing mechanisms 14a and 14b can generate a holding force for fixing the mark detection system housing 12 in the ωY-axis direction.

Pressure lines can be connected to the horizontal fixing mechanisms 13a, 13b for supplying vacuum pressure to them individually. The vertical fixing mechanisms 14a, 14b may be connected to a common pressure line for supplying them with vacuum pressure.

Pressure lines for individually supplying vacuum pressure to the horizontal fixing mechanisms 13a and 13b can be connected to the vacuum lines via normally open type air operated valves 30a and 30b, respectively. The pressure lines for individually supplying vacuum pressure to the horizontal fixing mechanisms 13a, 13b can also be communicated to the atmospheric environment via normally closed type air operated valves 40a, 40b. A common pressure line for supplying vacuum pressure to the vertical fixing mechanisms 14a, 14b can be connected to the vacuum line via a normally open type air operated valve 30c. A common pressure line for supplying vacuum pressure to the vertical fixation mechanisms 14a, 14b may also be communicated to the atmospheric environment via a normally closed type air operated valve 40c.

Compressed air can be supplied to the air operated valves 30 a , 30 b , 30 c through electromagnetic valves 15 a , 15 b , 15 c controlled by the control unit 1100 . When the control unit 1100 opens the solenoid valves 15a, 15b, and 15c, the normally open type air operated valves 30a, 30b, and 30c are closed, and the normally closed type air operated valves 40a, 40b, and 40c are opened. become. When the control unit 1100 closes the solenoid valves 15a, 15b, and 15c, the normally open type air operated valves 30a, 30b, and 30c are opened, and the normally closed type air operated valves 40a, 40b, and 40c are closed. become.

When causing the horizontal fixing mechanisms 13a, 13b and the vertical fixing mechanisms 14a, 14b to perform fixing operations so that the mark detection system housing 12 is fixed, the control unit 1100 closes the electromagnetic valves 15a, 15b, 15c. do. As a result, the normally open type air operated valves 30a, 30b and 30c are opened, and the normally closed type air operated valves 40a, 40b and 40c are closed. Therefore, a vacuum pressure is supplied to the horizontal fixing mechanisms 13a and 13b and the vertical fixing mechanisms 14a and 14b, and the horizontal fixing mechanisms 13a and 13b and the vertical fixing mechanisms 14a and 14b perform fixing operations.

When causing the horizontal fixing mechanisms 13a, 13b and the vertical fixing mechanisms 14a, 14b to perform the releasing operation so as to release the fixing of the mark detection system housing 12, the control unit 1100 opens the solenoid valves 15a, 15b, 15c. state. As a result, the normally open type air operated valves 30a, 30b and 30c are closed, and the normally closed type air operated valves 40a, 40b and 40c are opened. Therefore, the atmospheric pressure is supplied to the horizontal fixing mechanisms 13a and 13b and the vertical fixing mechanisms 14a and 14b, and the vertical fixing mechanisms 14a and 14b perform releasing operations.

FIG. 5A shows a configuration example of a vacuum chuck that configures horizontal fixing mechanisms 13a and 13b and vertical fixing mechanisms 14a and 14b, respectively. The vacuum chuck illustrated in FIG. 5A has a vacuum pad 16 that contacts the mark detection system housing 12 and a spring 17 that supports the vacuum pad 16 when the mark detection system housing 12 is vacuum-sucked. can contain Vacuum pad 16 may be understood as an example of a movable member. The spring 17 is flexible and can allow the vacuum pad 16 to move in the suction direction.

The vacuum pad 16 may be provided with recesses communicating with the vacuum lines described above. The recess of the vacuum pad 16 can have a rectangular shape as illustrated in FIG. 5(B). Alternatively, in order to reduce the amount of elastic deformation of the vacuum pad 16 during vacuum suction, as illustrated in FIG. sell. The island-shaped portion may have a circular shape as exemplified in FIG. 5(D), or may have a rectangular shape as exemplified in FIG. 5(E). It may have a shape as exemplified in 5(F).

Since the vacuum suction force is determined by the area of the concave portion of the vacuum pad 16, the number and area of the island-shaped portions can be freely designed within the range in which the necessary vacuum suction force can be obtained. Although it depends on the shape of the island-like portion, deformation due to vacuum suction can be reduced when the area of the island-like portion is large. The spring 17 is flexible in the suction direction in which the vacuum pad 16 sucks the mark detection system housing 12 (the direction in which the vacuum pad 16 is pressed against the mark detection system housing 12), and is rigid in the direction orthogonal to the suction direction. can have a high structure. In order to fix the mark detection system housing 12 with high rigidity by vacuum suction, the rigidity of the spring 17 in the direction perpendicular to the suction direction should be adjusted to the rigidity of the spring 17 in the suction direction within the range where the vacuum suction can be performed. It is desirable to make it 500 times or more. In other words, the stiffness of the spring 17 in the suction direction is preferably lower than the stiffness of the spring 17 in the direction perpendicular to the suction direction.

The fixing mechanisms 13 a , 13 b , 14 a , 14 b described above, and the drive motor, ball screw, etc., described later can be covered with a cover 28 attached to the detection system frame 23 and the mark detection system housing 12 . The portion covering the movable portion is provided with a narrow gap of about 1 mm and is not in contact with the movable portion. By exhausting the air inside the cover 28 through the exhaust port 29, particles emitted from the drive mechanism etc. are suppressed from being exhausted to the external space of the cover 28, and part of the heat generated by the mark detection system 21 is removed. can be released.

The drive operation and fixing operation of the mark detection system 21 in the mark detection device 100 of the embodiment will be described below. First, based on the output of the encoder 19 that measures the position of the mark detection system housing 12 (scope SCP), the control unit 1100 feeds back the drive mechanism DM so that the mark detection system housing 12 is positioned at the target position. controllable. The drive mechanism DM can include, for example, an AC servomotor 26 and a ball screw 27 that is rotationally driven by the AC servomotor 26 . The drive mechanism DM may include a pulse motor as an actuator. The drive mechanism DM may be composed of a linear motion mechanism such as a linear motor instead of a combination of a motor and a motion conversion mechanism.

The control unit 1100 performs settling determination when the mark detection system housing 12 reaches the target position, and completes positioning control if the control deviation is equal to or less than the threshold. At this time, the control unit 1100 should control the positioning operation to complete the positioning operation by driving the mark detection system housing 12 in a certain direction (predetermined direction) without fail in the final driving of the positioning operation. This increases the reproducibility of the positioning of the mark detection system housing 12 (scope SCP). At this time, feedback control (servo control) is still ON.

Next, the control unit 1100 executes a fixing sequence for fixing the mark detection system housing 12 (scope SCP). In this fixing sequence, the timings for operating the horizontal fixing mechanisms 13a and 13b are different from each other, and the individual timings for operating the horizontal fixing mechanisms 13a and 13b are different from the timings for operating the vertical fixing mechanisms 14a and 14b.

First, the controller 1100 can operate the electromagnetic valve 15a to supply vacuum pressure to the horizontal fixing mechanism 13a. The control unit 1100 can then operate the solenoid valve 15b to supply vacuum pressure to the horizontal fixing mechanism 13b. The control unit 1100 can stop feedback control according to the timing of operating the solenoid valve 15b. By stopping the feedback control, the driving of the AC servomotor 26 is stopped, and the holding force by the AC servomotor 26 is lost. Since it takes about several hundred milliseconds to start the vacuum suction by the horizontal fixing mechanism 13b, the stop of the feedback control is substantially completed first, and the driving force by the AC servomotor 26 and the horizontal fixing mechanisms 13a and 13b are stopped. It does not interfere with retention by frictional force. Alternatively, the feedback control gain may be gradually lowered so that the feedback control is turned off by the time the vacuum suction is completed.

Next, the control unit 1100 operates the solenoid valve 15c to supply vacuum pressure to the vertical fixing mechanisms 14a and 14b, thereby completing the position fixing operation of the mark detection system housing 12 (scope SCP).

In the above example, the control unit 1100 operates the horizontal fixing mechanism 13b after operating the horizontal fixing mechanism 13a after executing the positioning control. Alternatively, the controller 1100 can operate the horizontal fixing mechanism 13a after executing the positioning control, then operate the horizontal fixing mechanism 13b, and then operate the vertical fixing mechanisms 14a and 14b. Instead of such an operation, the control section 1100 may operate the horizontal fixing mechanism 13a after operating the horizontal fixing mechanism 13b after executing the positioning control. Alternatively, the controller 1100 may operate the horizontal fixing mechanism 13b after executing the positioning control, then operate the horizontal fixing mechanism 13a, and then operate the vertical fixing mechanisms 14a and 14b. Here, the order of operating the horizontal fixing mechanisms 13a and 13b can be a preset order. Alternatively, the order of operating the horizontal fixing mechanisms 13a, 13b and the vertical fixing mechanisms 14a, 14b can be a preset order. As will be described later, this order should be determined so that the variation in the position of the scope SCP due to the fixed sequence is within an acceptable range, preferably such that the variation is minimized. However, if this order is a preset order, the reproducibility of the variation between fixed sequences over multiple times can be obtained, so the amount of variation is managed as an offset value and used for positioning the scope SCP. The target position may be corrected based on the offset value.

Setting the order of operating the horizontal fixing mechanisms 13a and 13b in a preset order is advantageous for suppressing, with high reproducibility, fluctuations in the position of the scope SCP that accompany the operation of fixing the scope SCP. Alternatively, setting the order in which the horizontal fixing mechanisms 13a and 13b and the vertical fixing mechanisms 14a and 14b are operated in a preset order suppresses the positional fluctuation of the scope SCP accompanying the operation of fixing the scope SCP with high reproducibility. It is advantageous to

To summarize the above, when the scope SCP is fixed to the support member by the plurality of fixing mechanisms, the control unit 1100 causes the plurality of fixing mechanisms to perform the fixing operations in a preset order. Furthermore, preferably, when the scope SCP is fixed to the support member by the plurality of fixing mechanisms, the control unit 1100 causes the plurality of fixing mechanisms to start the fixing operation with a preset time lag. Alternatively, when the scope SCP is fixed to the support member by a plurality of fixing mechanisms, the control unit 1100 causes the plurality of fixing mechanisms to perform constant operations at different timings and in a preset order. Alternatively, when the scope SCP is fixed to the support member by a plurality of fixing mechanisms, the control unit 1100 causes one preset fixing mechanism among the plurality of fixing mechanisms to start the fixing operation, and then Another fixing mechanism among the plurality of fixing mechanisms is caused to start a fixing operation. Typically, the positional deviation of the scope SCP caused by fixing the scope SCP when a plurality of fixing mechanisms are caused to perform the fixing operations in a predetermined order is is less than the displacement of the scope SCP associated with the fixation of the scope SCP.

The configuration in which the center of gravity G of the mark detection system housing 12 (scope SCP) is arranged between the horizontal fixing mechanisms 13a and 13b is the same as that of the mark detection system housing 12 when vacuum suction by the horizontal fixing mechanisms 13a and 13b is started. This is advantageous for suppressing the occurrence of misalignment. The structure in which the mark detection system housing 12 is arranged between the two guides 10 prevents the mark detection system housing 12 from rotating in the ωX-axis direction even when there is a difference in the vacuum suction force between the horizontal fixing mechanisms 13a and 13b. is advantageous for suppressing The vertical fixing mechanisms 14a and 14b can generate forces in the Y-axis direction and the ωZ-axis direction. However, as long as the guide 10 and the horizontal fixing mechanisms 13a and 13b have sufficient rigidity in the Y direction, positional deviation due to the forces generated by the vertical fixing mechanisms 14a and 14b is permissible. According to this embodiment, it is advantageous to suppress the positional fluctuation of the mark detection system housing 12 (scope SCP) due to the fixing operation of the mark detection system housing 12 (scope SCP) by the horizontal fixing mechanisms 13a and 13b within an allowable range. This is advantageous for detecting the positions of the marks on the substrate with high accuracy.

The mark detection device 100 is assembled so that a narrow gap of, for example, about 0 to 20 μm is formed between the fixing mechanism and the mark detection system housing 12 when the mark detection system housing 12 is not vacuum-sucked by the fixing mechanism. , adjustments may be made. However, due to component tolerances and assembly errors, the gap amount and slope may vary. When the plurality of solenoid valves 15a to 15c are sequentially operated, the time difference between the operations cannot be so large in order to position the plurality of mark detection systems 21 in a short period of time, and may be within several hundred milliseconds. . In that case, there is a possibility that vacuum suction will not be performed in the intended order due to the amount of the gap and the difference in slope, the difference in the length of the vacuum line, the difference in the reaction speed of the air operated valve, and the like. Further, even if the intended order is followed, positional deviation after fixing by vacuum suction may exceed the allowable range. In such a case, an order in which the difference between the measured value by the encoder 19 before execution of the fixed sequence and the measured value by the encoder 19 after execution of the fixed sequence falls within an allowable range or the order in which the difference is minimized can be selected. Such selection may be performed by the control unit 1100 . That is, the control unit 1100 can determine the order so that the positional deviation of the scope SCP caused by fixing the scope SCP when the plurality of fixing mechanisms are caused to perform the fixing operations in a preset order falls within an allowable range. .

The information for determining the above order includes, for example, the amount of movement of the mark detection system, the movement speed, the movement acceleration, the direction of movement (whether to proceed in the + direction or the - direction of the X-axis direction), the target It may also include a position and the like.

Regarding the amount of movement, if the temperature distribution of the peripheral members of the scope SCP before and after the movement is different due to the large amount of movement, the amount and inclination of the gap will change due to the change in the amount of thermal expansion. I can. As for the movement speed, a high speed can change the path and degree of bending of a mounted object such as a tube connected to the mark detection system, which can act as a resistance during driving. Alternatively, the amount and inclination of the gap may change because the mark detection system is pulled by the tension of the mounted object after driving. Furthermore, with regard to acceleration, when the acceleration is large, the peripheral members vibrate due to the reaction force acting on the peripheral members of the scope SCP.

Regarding the direction of movement, depending on whether the direction of movement is in the + or - direction of the X-axis, even if the drive command value is the same, the movement position will differ slightly due to backlash of the ball screw, etc., and the center of gravity position. changes, the amount of gap and the difference in slope can change. Regarding the target position, the center of gravity of the mark detection system shifts depending on the target position, and the degree of deformation of the common base frame changes. order will change.

Furthermore, when a plurality of mark detection systems are provided, the center of gravity of the mark detection apparatus changes depending on which mark detection system is moved, and the degree of deformation of the common base frame or the like changes. Differences and changes in amounts and slopes can change the optimal adsorption order.

Furthermore, when a plurality of mark detection systems are provided, each mark detection system has part tolerances and assembly errors. may not be in the order that minimizes the misalignment of Therefore, it is also effective to define the optimum fixed order for each mark detection system.

FIG. 10 shows a schematic diagram when three mark detection systems 21 are provided. According to this, the common base plate 41 that supports the three mark detection systems 21 is bent with respect to fastening points 42 of the base plate 41 where the weight of the mark detection systems 21 is applied. The amount of deflection varies depending on the thickness of the base plate 41 and the locations of the fastening points 42 . Therefore, from the viewpoint of minimizing positional deviation after fixing, the order of fixing operations for the plurality of mark detection systems 21 can be different from each other. The optimum fixing operation order for each of the plurality of mark detection systems 21 is the order in which the difference between the measurement value of the encoder 19 of the mark detection system 21 before the fixing sequence and the measurement value of the encoder 19 after the fixing sequence falls within an allowable range, Alternatively, it can be ordered to be smallest. Such order determination may be performed by the control unit 1100 .

If the optimum order of fixing operations changes depending on factors such as the movement amount, movement direction, target position, etc. of the scope SCP, the control unit 1100 may determine the order by executing a predetermined setting sequence. Further, in the above description, when the scope is not fixed by the fixing mechanism, there is a gap between the mark detection system housing 12 and the fixing mechanism. However, the mark detection system housing 12 may be assembled and adjusted while being in contact with the mark detection system housing 12 or under preloaded state, and when the mark detection system 21 is moved, a gap may be created by supplying compressed air. .

The operation of the exposure apparatus EXP will be exemplified below. FIG. 6A is a flowchart showing an exposure processing sequence by exposure apparatus EXP. The exposure sequence shown in FIG. 6A is controlled by the controller 1100 . First, in S101, the substrate 3 (eg, wafer) is loaded into the exposure apparatus EXP. In S<b>102 , the control unit 1100 determines whether or not to drive the board 3 at least one mark detection system 21 among the plurality of mark detection systems 21 of the mark detection device 100 . The control unit 1100 indicates, for example, layout information of marks to be detected registered in advance by the user, the number of marks to be detected, the exposure recipe executed immediately before, and whether productivity or accuracy is prioritized. This determination may be made based on information such as settings.

If it is determined in S102 that the mark detection system 21 needs to be driven, the process proceeds to S103. In S<b>102 , the control unit 1100 controls the mark detection device 100 to drive, position, and fix the mark detection system 21 to be driven among the plurality of mark detection systems 21 of the mark detection device 100 . Specifically, the control unit 1100 causes the drive mechanism DR to drive and position the mark detection system 21, and causes the fixing mechanisms 13a, 13b, 14a, and 14b to fix the mark detection system 21. FIG. If it is determined in S102 that neither mark detection system 21 needs to be driven, the process proceeds to S104. In S<b>104 , the control unit 1100 causes a surface position detection device (not shown) to detect surface positions at a plurality of locations on the substrate 3 and measures the shape of the surface of the substrate 3 . The process of driving and fixing the mark detection device 100 in S103 may be performed in parallel with the process of S104.

In S105, the control unit 1100 places the reference mark on the optical axis of the plurality of mark detection systems 21 of the mark detection device 100 based on the designed coordinate position of the reference mark SM formed on the reference member in the stage coordinate system. The substrate stage WS is moved so that the SM is arranged. Then, the control unit 1100 measures the positional deviation of the reference mark SM with respect to the optical axis of the plurality of mark detection systems 21, and based on the positional deviation, adjusts the stage coordinates so that the origin of the stage coordinate system coincides with the optical axis. Reconfigure the system. Thereafter, based on the designed positional relationship between the optical axis of the projection optical system 2 and the optical axis of the mark detection device 100, the control unit 1100 moves the substrate so that the reference mark SM is positioned on the optical axis of the exposure light. Move the stage WS. Then, the control unit 1100 measures the displacement of the reference mark with respect to the optical axis of the exposure light via the projection optical system 2 using a TTL detection system (not shown).

In S106, the control unit 1100 determines a reference baseline between the optical axis of each of the plurality of mark detection systems 21 of the mark detection apparatus 100 and the optical axis of the projection optical system 2 based on the measurement results in S105. In S107, the control unit 1100 detects the positions of the marks on the substrate 3 using the mark detection device 100, and aligns the XY plane of the substrate 3 with the exposure device EXP. In S108, the control unit 1100 shifts (moves), magnifies (magnification), and rotates (rotation) the arrangement of the plurality of shot areas on the substrate 3 by the global alignment method based on the measurement result of S107. calculate. Then, the control unit 1100 performs correction of each item and trapezoidal correction based on the calculation result, and determines the regularity of the grid arrangement. After that, the control unit 1100 obtains a correction coefficient from the reference baseline and the regularity of the determined lattice arrangement, and aligns the exposure light and the substrate 3 based on the result.

In S109, the controller 1100 performs exposure and scanning of the substrate stage WS in the Y direction. During exposure, the stage is driven in the Z direction and the tilt direction based on the surface shape data of the exposure shot detected by the surface position detection device. At the same time, perform the operation to match the In S110, the controller 1100 determines whether or not there is a shot area to be exposed (that is, an unexposed shot area), and repeats the above operation until there is no unexposed shot area. When the exposure of all shot areas is completed, the substrate 3 is unloaded in S111, and the exposure process is completed.

Next, description will be made with reference to FIG. The process of S105 described above is a method of calibrating positional deviations of the plurality of mark detection systems 21 on the XY plane. Actually, there is a possibility that the respective focal positions (Z direction) of the multiple mark detection systems 21 are different. In general, when mark detection is performed at a position deviated from the focal position, an error from the correct position occurs. Therefore, it is advantageous to improve the detection accuracy by performing calibration in consideration of focal position information. The method will be described with reference to FIG. 6(B). Here, an example in which the mark detection system 21 does not have a focus driving mechanism will be described. Focus adjustment is performed by controlling the position and attitude of the substrate 3 in this example.

In S151, the control unit 1100 causes each mark detection system 21 to measure the reference mark SM, and acquires the focal position of each mark detection system 21 and detection position information in the XY directions. In S152, the control unit 1100 calculates the inclination and orientation of the substrate surface with the least deviation from the focal position of each mark detection system 21 from the information acquired using each mark detection system 21, using the method of least squares or the like. .

In S153, the controller 1100 controls the attitude of the substrate stage WS so that the tilt calculated in S151 is achieved. In S154, the controller 1100 observes the marks with the plurality of mark detection systems 21, so that the measurement can be performed at a position as close to the focal position as possible. This improves the accuracy of mark detection. In S155, the control unit 1100 determines whether there is an abnormality in the measurement result due to staining or missing of the mark. If the measurement is performed normally, the process proceeds to S156. , and perform the measurement again. In S156, the control unit 1100 calculates, as a correction value, the amount of deviation from the design value of the mark position within the substrate surface from the measured value.

[Second embodiment]
A second embodiment will be described with reference to FIG. Matters not mentioned in the second embodiment may follow the first embodiment. In the second embodiment, a horizontal fixing mechanism 13c is employed instead of the vertical fixing mechanisms 14a and 14b in the first embodiment. The horizontal fixing mechanism 13c attracts the mark detection system housing 12 in the Z-axis direction. In the second embodiment, solenoid valves 15a, 15b, 15c may be arranged in the vacuum lines respectively connected to the horizontal fixing mechanisms 13a, 13b, 13c. The solenoid valves 15a, 15b, 15c can be controlled by the controller 1100. FIG. Note that, as in the first embodiment, a method of operating an air operated valve using an electromagnetic valve may be employed.

The horizontal fixing mechanism 13 c can be supported by the detection system frame 23 . The horizontal fixing mechanism 13c can generate a holding force for fixing the mark detection system housing 12 in the horizontal direction. Further, the horizontal fixing mechanism 13c can generate a holding force for fixing the mark detection system housing 12 in the ωZ-axis direction (rotating direction around the Z-axis) together with the horizontal fixing mechanisms 13a and 13b. Further, the horizontal fixing mechanism 13c can generate a holding force for fixing the mark detection system housing 12 in the ωY-axis direction (rotating direction around the Y-axis) together with the horizontal fixing mechanisms 13a and 13b. In the example of FIG. 7, the X-direction span of each guide 10 is insufficient, and the rigidity in the ωY-axis direction (around the Y-axis) is not sufficient. The horizontal fixing mechanism 13c is useful for improving rigidity in the ωY-axis direction (around the Y-axis). In order to improve the rigidity in the ωY-axis direction (around the Y-axis), the horizontal fixing mechanism 13c attracts the mark detection system housing 12 at a height different from that of the horizontal fixing mechanisms 13a and 13b.

Next, a procedure for fixing the position of the mark detection system 21 in the second embodiment will be described. First, the controller 1100 can operate the electromagnetic valve 15a to supply vacuum pressure to the horizontal fixing mechanism 13a. The controller 1100 can then operate the solenoid valve 15c to supply vacuum pressure to the horizontal fixing mechanism 13c. The control unit 1100 can stop the feedback control according to the timing of operating the solenoid valve 15c. By stopping the feedback control, the driving of the AC servomotor 26 is stopped, and the holding force by the AC servomotor 26 is lost. Since it takes about several hundred milliseconds to start the vacuum suction by the horizontal fixing mechanism 13c, the stop of the feedback control is substantially completed first, and the driving force by the AC servomotor 26 and the horizontal fixing mechanisms 13a and 13c are stopped. It does not interfere with retention by frictional force. Alternatively, the feedback control gain may be gradually lowered so that the feedback control is turned off by the time the vacuum suction is completed.

Next, the control unit 1100 operates the solenoid valve 15b to supply vacuum pressure to the horizontal fixing mechanism 13b, thereby completing the position fixing operation of the mark detection system housing 12 (scope SCP).

In the second embodiment, the horizontal fixing mechanisms 13a and 13c can be arranged so that the center of gravity G of the mark detection system housing 12 is positioned between the horizontal fixing mechanisms 13a and 13c in orthogonal projection onto the XY plane. Regarding the height direction, it is preferable that the height of the suction surface of the horizontal fixing mechanism 13c is in the vicinity of the height of the center of gravity G. Such a configuration is advantageous for suppressing positional deviation of the mark detection system housing 12 when the mark detection system housing 12 is sucked by the horizontal fixing mechanisms 13a and 13c. Moreover, such a configuration is advantageous in suppressing rotation in the ωX-axis direction even when there is a difference in the attraction force between the horizontal fixing mechanisms 13a and 13c. The horizontal fixing mechanism 13c generates a force to fix the mark detection system housing 12 in the horizontal direction. Thus, the mark detection system housing 12 can also be fixed in the ωY-axis direction. Finally, the horizontal fixing mechanism 13b sucks the mark detection system housing 12, so that a holding force sufficient to fix the mark detection system housing 12 can be obtained. The guide 10 and the horizontal fixing mechanisms 13a and 13c can provide sufficient rigidity for fixing the mark detection system housing 12 with six degrees of freedom. Therefore, the positional deviation due to the suction of the mark detection system housing 12 by the horizontal fixing mechanism 13b can be sufficiently suppressed.

[Third Embodiment]
A third embodiment will be described with reference to FIG. Matters not mentioned in the third embodiment may follow the second embodiment or the first embodiment through the second embodiment. In the third embodiment, instead of applying vacuum pressure to the horizontal fixing mechanisms 13a, 13b, and 13c in the second embodiment to generate the holding force, actuators 20a, 20b, and 20c are used to generate the holding force. It is Actuators 20 a , 20 b , 20 c are controlled by control unit 1100 .

The horizontal fixing mechanisms 13a, 13b can be supported by the detection system frame 23 via actuators 20a, 20b. The horizontal fixing mechanisms 13 a and 13 b are driven in the Z direction by actuators 20 a and 20 b controlled by the control section 1100 and pressed against the mark detection system housing 12 . Fixing mechanisms 13a and 13b driven by actuators 20a and 20b, respectively, generate a holding force that fixes mark detection system housing 12 in the horizontal direction and the ωZ-axis direction. The horizontal fixing mechanism 13c can be supported by the detection system frame 23 via the actuator 20c. The horizontal fixing mechanism 13 c is driven in the Z direction by an actuator 20 c controlled by the controller 1100 and pressed against the mark detection system housing 12 . A fixing mechanism 13c driven by the actuator 20c generates a holding force that fixes the mark detection system housing 12 in the horizontal direction and the ωZ-axis direction. The horizontal fixing mechanism 13c is useful for improving rigidity in the ωY-axis direction (around the Y-axis). In order to improve the rigidity in the ωY-axis direction (around the Y-axis), the horizontal fixing mechanism 13c can be pressed against the mark detection system housing 12 at a height different from that of the horizontal fixing mechanisms 13a and 13b.

Actuators 20 a , 20 b , 20 c can be individually controlled by control unit 1100 . The actuators 20a, 20b, 20c can be composed of piezo elements, air cylinders, or electromagnetic actuators, for example. The third embodiment does not require a vacuum line and a recess for vacuum suction, which can contribute to structural simplification.

Next, a procedure for fixing the position of the mark detection system 21 in the third embodiment will be described. First, the control unit 1100 can operate the actuator 20 a to press the horizontal fixing mechanism 13 a against the mark detection system housing 12 . The controller 1100 can then operate the actuator 20 c to press the horizontal fixing mechanism 13 c against the mark detection system housing 12 . The control unit 1100 can stop feedback control according to the timing of operating the actuator 20c. By stopping the feedback control, the driving of the AC servomotor 26 is stopped, and the holding force by the AC servomotor 26 is lost. It may take several hundred milliseconds to operate the actuator 20c to press the horizontal fixing mechanism 13c against the mark detection system housing 12. FIG. Therefore, substantially, the stop of the feedback control is completed first, and the driving force by the AC servomotor 26 and the holding by the frictional force by the horizontal fixing mechanisms 13a and 13c do not interfere. Alternatively, the feedback control gain may be gradually lowered so that the feedback control is turned off by the time the vacuum suction is completed. Next, the control unit 1100 operates the actuator 20a to press the horizontal fixing mechanism 13b against the mark detection system housing 12, thereby completing the position fixing operation of the mark detection system housing 12 (scope SCP). When the horizontal fixing mechanisms 13a, 13b, and 13c are not pressed against the mark detection system housing 12, mark detection is performed so that a gap is formed between the horizontal fixing mechanisms 13a, 13b, and 13c and the mark detection system housing 12. Assembly and adjustment of device 100 may be performed. On the contrary, however, the horizontal fixing mechanisms 13 a , 13 b , 13 c may be assembled and adjusted in a state in which they are not pressed against the mark detection system housing 12 . In this case, when moving the mark detection system 21, gaps may be formed between the horizontal fixing mechanisms 13a, 13b, and 13c and the mark detection system housing 12 by the actuator.

[Fourth Embodiment]
A fourth embodiment will be described with reference to FIG. The fourth embodiment is provided as a supplement to the first embodiment. Matters not mentioned in the fourth embodiment may follow the first embodiment. In the fourth embodiment, the mark detection device 100 may comprise a main mark detection system housing 12a fixed to the detection system frame 23 described in the first embodiment. The mark detection apparatus 100 can also include two sub-mark detection system housings 12b and 12c that are supported by two guides 10a and 10b that are fixed to the detection system frame 23 and that are independently movable in the X direction. . It can be shared by the guides 10a and 10b and the mark detection system housings 12a and 12b. The guides 10a, 10b may comprise rails, for example.

Two horizontal fixing mechanisms 13a, 13b may be provided for the sub mark detection system housing 12b. Two horizontal locking mechanisms 13a, 13b may be arranged between the guides 10a, 10b. Also, the two horizontal fixing mechanisms 13a and 13b can be arranged so that the center of gravity of the mark detection system housing 12b is positioned between the two horizontal fixing mechanisms 13a and 13b. Two horizontal fixing mechanisms 13c, 13d may be provided for the sub mark detection system housing 12c. Two horizontal locking mechanisms 13c, 13d may be arranged between the guides 10a, 10b. Also, the two horizontal fixing mechanisms 13c and 13d can be arranged so that the center of gravity of the mark detection system housing 12c is positioned between the two horizontal fixing mechanisms 13a and 13b.

Two vertical fixing mechanisms 14a and 14b for attracting the mark detection system housing 12b from the Y-axis direction may be provided for the sub mark detection system housing 12b. Also, two vertical fixing mechanisms 14c and 14d for attracting the mark detection system housing 12c from the Y-axis direction may be provided for the sub mark detection system housing 12b. In the example of FIG. 9, the X-direction span of each guide 10 is insufficient, and the rigidity in the ωY-axis direction (around the Y-axis) is not sufficient. The vertical fixing mechanisms 14a, 14b, 14c, and 14d are useful for improving rigidity in the ωY-axis direction (around the Y-axis).

The horizontal fixing mechanisms 13a and 13b generate a holding force for fixing the mark detection system housing 12b in the horizontal direction, and a combination of the two can generate a holding force for fixing in the ωZ-axis direction. The horizontal fixing mechanisms 13c and 13d generate a holding force for fixing the mark detection system housing 12c in the horizontal direction, and a combination of the two can generate a holding force for fixing in the ωZ-axis direction. The vertical fixing mechanisms 14c and 14d may be supported by the detection system frame 23 via the same member, and have a holding force for fixing the mark detection system housing 12c in the vertical direction and a holding force for fixing in the ωY axis direction by a combination of two. can generate force.

Vacuum pressure can be supplied to the horizontal fixing mechanisms 13a, 13b, 13c, 13d via vacuum lines independent of each other. Vacuum pressure may be supplied to the vertical fixing mechanisms 14a, 14b, 14c, 14d via a common vacuum line.

The exposure apparatus EXP can be used in an article manufacturing method for manufacturing an article. The article manufacturing method includes an exposure step of exposing a substrate using an exposure apparatus EXP, a developing step of developing the substrate that has undergone the exposure step, and a processing step of processing the substrate that has undergone the developing step to obtain an article. and The processing step can include, for example, etching the substrate that has undergone the developing step.

The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the claims are appended to make public the scope of the invention.

23: detection system frame (supporting member), SCP: scope, DM: driving mechanism, 12a, 12b, 13a, 13b: fixing mechanism, 1100: control unit

Claims (21)

a support member;
a scope for detecting marks;
a drive mechanism for changing the relative position of the scope with respect to the support member;
a plurality of fixing mechanisms for fixing the scope to the support member;
a control unit that causes the plurality of fixing mechanisms to perform the fixing operation in a preset order when the scope is fixed to the support member by the plurality of fixing mechanisms;
A mark detection device comprising: When the scope is fixed to the support member by the plurality of fixing mechanisms, the control unit causes the plurality of fixing mechanisms to start the fixing operation with a preset time lag.
2. The mark detection device according to claim 1, wherein: The plurality of fixing mechanisms apply forces for fixing the scope to different positions of the scope,
3. The mark detection device according to claim 1, wherein: each of the plurality of fixing mechanisms includes a movable member, and applies a force to the scope to fix the scope by pressing the movable member against the scope;
4. The mark detection device according to claim 3, wherein: each of the plurality of fixing mechanisms aspirates the scope by vacuum pressure;
5. The mark detection device according to claim 4, wherein: wherein the movable member includes a vacuum pad, and each of the plurality of fixing mechanisms includes a spring supporting the movable member;
6. The mark detection device according to claim 5, wherein: the stiffness of the spring in a direction that presses the movable member against the scope is lower than the stiffness of the spring in a direction perpendicular to the direction;
7. The mark detection device according to claim 6, wherein: each of the plurality of fixing mechanisms includes an actuator that presses the movable member against the scope;
5. The mark detection device according to claim 4, wherein: Positional deviation of the scope due to fixation of the scope when the plurality of fixing mechanisms are caused to perform the fixing operations in the order is equivalent to displacement of the scope when the plurality of fixing mechanisms are caused to perform the fixing operations simultaneously. smaller than the displacement of the scope due to fixation;
9. The mark detection device according to any one of claims 1 to 8, characterized in that: The control unit determines the order such that positional deviation of the scope caused by fixing the scope when the plurality of fixing mechanisms are caused to perform the fixing operations in the order is within an allowable range.
9. The mark detection device according to any one of claims 1 to 8, characterized in that: The order is determined according to at least one of a movement amount, a movement direction, a target position, a movement speed, and a movement acceleration of the scope for positioning the scope.
9. The mark detection device according to any one of claims 1 to 8, characterized in that: a direction of final drive of the scope in an operation for positioning the scope by the drive mechanism is a predetermined direction;
The mark detection device according to any one of claims 1 to 11, characterized in that: Equipped with multiple mark detection systems,
each of the plurality of mark detection systems includes the scope, the driving mechanism and the plurality of fixing mechanisms;
the order is determined for each of the plurality of mark detection systems;
13. The mark detection device according to any one of claims 1 to 12, characterized in that: further comprising two guides arranged in parallel to guide the scope;
the plurality of fixation mechanisms includes two fixation mechanisms disposed between the two guides;
14. The mark detection device according to any one of claims 1 to 13, characterized in that: The center of gravity of the scope is located between the two fixation mechanisms in orthogonal projection to a horizontal plane.
15. The mark detection device according to claim 14, characterized in that: the two fixation mechanisms have horizontal surfaces that press against the scope;
16. The mark detection device according to claim 14 or 15, characterized in that: wherein the plurality of fixing mechanisms includes a fixing mechanism arranged at a different height than the two fixing mechanisms;
17. The mark detection device according to any one of claims 14 to 16, characterized in that: a support member;
a scope for detecting marks;
a drive mechanism for changing the relative position of the scope with respect to the support member;
a plurality of fixing mechanisms for fixing the scope to the support member;
a control unit that causes the plurality of fixing mechanisms to perform the fixing operations at different timings and in a preset order when the scope is fixed to the support member by the plurality of fixing mechanisms;
A mark detection device comprising: a support member;
a scope for detecting marks;
a drive mechanism for changing the relative position of the scope with respect to the support member;
a plurality of fixing mechanisms for fixing the scope to the support member;
When the scope is fixed to the support member by the plurality of fixing mechanisms, one of the plurality of fixing mechanisms that is set in advance is caused to start the fixing operation, and then the plurality of fixing mechanisms. a control unit that causes another fixing mechanism to start the fixing operation;
A mark detection device characterized by: An exposure apparatus for exposing a substrate,
20. An exposure apparatus comprising a mark detection device according to any one of claims 1 to 19 configured to detect marks on the substrate. an exposure step of exposing a substrate using the exposure apparatus according to claim 20;
a developing step of developing the substrate that has undergone the exposure step;
a processing step for obtaining an article by processing the substrate that has undergone the developing step;
An article manufacturing method comprising:

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