JP2023056304A - Laser soldering equipment - Google Patents

Abstract

To provide laser soldering equipment that can supply solder along an irradiation center.SOLUTION: An irradiation head 1 has: a plurality of optical paths 3a, 3b, 3c and 3d arranged in such a way as to surround an irradiation center O; and a solder supply nozzle 4 arranged at the irradiation center O. The plurality of optical paths include: irradiation optical paths 3a through which a soldering point 2 is irradiated with laser beams L; imaging optical paths 3b for imaging the soldering point 2; illumination optical paths 3c for irradiating the soldering point 2 with illuminating light Lc; and measurement optical paths 3d for measuring temperature of the soldering point 2, wherein the laser beams L of the irradiation optical paths 3a are emitted to the soldering point 2 while keeping an angle at which the beams do not impinge solder 8 supplied from the solder supply nozzle 4.SELECTED DRAWING: Figure 1

Description

TECHNICAL FIELD The present invention relates to a laser soldering apparatus for performing soldering by irradiating a soldering point with a laser beam. to a soldering point for soldering.

The conventional laser soldering apparatus disclosed in Patent Document 1 has an irradiation head that irradiates laser light and a solder supply nozzle that supplies linear solder. A soldering point is irradiated along the irradiation center, which is the center of the head, and linear solder is supplied from a solder supply nozzle to the soldering point for soldering. The solder supply nozzle is attached to the side surface of the irradiation head, and the linear solder from the solder supply nozzle is supplied to the soldering point in a form that traverses the laser beam emitted from the irradiation head. .

However, the soldering points are usually joints between the annular lands formed on the substrate and the leads of the electronic component inserted into the lands. Depending on the type, shape, size, etc. of the electronic component, it may not always be located in a location that is easy to supply, and may be placed in various heights, complicated locations, or behind other electronic components mounted on the board. Sometimes there are Therefore, when soldering, it is necessary to adjust or set the solder supply direction, the supply angle, etc. according to the situation of the soldering point, and this work has been very detailed and troublesome.

Such a problem can be solved by arranging the solder supply nozzle at the irradiation center of the irradiation head so as to supply the solder from the irradiation center to the soldering point. Since an optical path is arranged at the irradiation center and the laser beam is irradiated along this optical path, the solder supply nozzle cannot be arranged at the irradiation center.

On the other hand, Patent Literature 2 discloses a laser processing apparatus that performs surface modification processing, welding processing, and the like of a base material. In this laser processing apparatus, optical paths of a plurality of laser beams are arranged around the axis (irradiation center) of the processing head, and a supply nozzle for supplying molten material is arranged on the axis, that is, at the irradiation center. , the molten material can be supplied along the irradiation center of the processing head.

However, the configuration of this laser processing apparatus cannot be applied as it is to a soldering apparatus. The reason for this is that the optical paths of a plurality of laser beams arranged around the irradiation center are directed to the molten material, and the molten material supplied from the supply nozzle is melted by the laser beam and supplied to the base material. Therefore, when the configuration is applied to a soldering device and the linear solder is melted with a laser beam, the molten linear solder becomes spherical, and the soldering point remains attached to the tip of the linear solder. Even if it were to be supplied, the molten solder would be supplied to unheated soldering points, so the supplied molten solder would come into contact with the low-temperature soldering points. This is because if the solder is rapidly cooled down, the solder solidifies without sufficiently diffusing to the soldering point, resulting in defective solder and incorrect soldering.

Further, in the devices described in Patent Documents 1 and 2, for example, when it is necessary to observe a soldering point, a processed part, or the like, that is, when an image of the soldering point is taken or the temperature of the soldering point is measured, When measurement is required, the optical path system for observation, that is, the optical path system for imaging, the optical path system for temperature measurement, etc. must be externally attached to the processing head. Complication of structure and enlargement were inevitable.

JP 2015-56442 A Japanese Patent No. 6757877

A technical object of the present invention is to enable solder to be supplied from the center of an irradiation head (irradiation center) to a soldering point, and to provide the irradiation head with an irradiation optical path for irradiating a laser beam. Furthermore, by integrating an optical path for observing a soldering point, that is, an imaging optical path, an illumination optical path, or a temperature measuring optical path, etc., the structure of the irradiation head can be simplified and the size can be reduced. It is in.

In order to solve the above problems, the laser soldering apparatus of the present invention has an irradiation head for irradiating a laser beam, and the irradiation heads are arranged so as to surround the center of the irradiation head, that is, the irradiation center. and a solder supply nozzle arranged at or near the irradiation center, wherein the plurality of optical paths include at least one irradiation optical path for irradiating a soldering point with a laser beam; an imaging optical path for imaging the soldering point, an illumination optical path for irradiating the soldering point with illumination light, and a measurement optical path for measuring the temperature of the soldering point, The irradiation optical path includes a semiconductor laser element capable of controlling the output of laser light, an optical fiber connected to the semiconductor laser element, a parallel lens for collimating the laser light emitted from the optical fiber, and the parallel lens. and a condensing lens for condensing the emitted laser light, and the laser light of the irradiation optical path is set at an angle with respect to the center of irradiation so as not to impinge on the solder supplied from the solder supply nozzle to the soldering point. It is characterized in that the soldering point is irradiated while keeping the soldering point.

In the present invention, there are a plurality of the irradiation optical paths, and the laser beams of the plurality of irradiation optical paths are kept at an angle with respect to the irradiation center so as not to hit the solder supplied from the solder supply nozzle. It is also possible to irradiate the attachment point so as to surround the irradiation center.

Also, in the present invention, the laser soldering apparatus preferably has a first gas flow path for supplying inert gas to the soldering point.
In this case, the first gas flow path has a conical shape surrounding the laser beam emitted from the condenser lens, and a ring-shaped tip for injecting an inert gas so as to surround the soldering point. It is desirable to have an injection port.
Further, at the tip of the irradiation head, an optical path cover having a double-layered conical structure including an inner cylinder and an outer cylinder is attached, and the optical path cover surrounds the plurality of optical paths in a conical shape, The first gas flow path may be formed between the inner cylinder and the outer cylinder.

In the present invention, the irradiation head has a second gas flow path for supplying inert gas to the soldering point, and the second gas flow path has a double cylindrical shape surrounding the soldering nozzle. It is preferably formed between the inner cylinder and the outer cylinder of the channel cylinder.

Further, in the present invention, the irradiation head may have a gas channel for supplying inert gas to the soldering point and a suction channel for sucking fumes generated during soldering. good.
In this case, at the tip of the irradiation head, an optical path cover having a double-structured cone shape as a whole including an inner cylinder and an outer cylinder is attached, and the optical path cover surrounds the plurality of optical paths in a conical shape, The suction channel is formed between the inner cylinder and the outer cylinder, and a ring-shaped suction port communicating with the suction channel is formed at the tip of the optical path cover. A flow path is preferably formed.
The gas flow path includes an inner flow path formed between an inner tube and an outer tube of a double cylindrical flow tube surrounding the soldering nozzle, an inner circumference of the optical path cover and the flow path. It preferably has an outer channel formed between it and the outer circumference of the tube.

In the present invention, the imaging optical path has a CCD camera, a parallel lens and a condenser lens interposed between the CCD camera and the soldering point, and the soldering point is detected through the parallel lens and the condenser lens. An image is captured by the CCD camera, the illumination optical path has a light source, a parallel lens and a condenser lens interposed between the light source and the soldering point, and the illumination light from the light source is The soldering point is irradiated through a parallel lens and a condenser lens, and the optical path for measurement includes a radiation thermometer and a parallel lens and a condenser lens interposed between the radiation thermometer and the soldering point. and measuring the temperature of the soldering point by receiving the infrared light emitted from the soldering point through the condensing lens and the parallel lens with the radiation thermometer.

According to the present invention, solder can be supplied to the soldering point from the solder supply nozzle arranged at or near the irradiation center of the irradiation head. Solder can be reliably and accurately supplied to a soldering point without the need to adjust or reset the solder supply direction, supply angle, or the like. In addition, since the laser beam on the irradiation optical path does not hit the solder supplied from the solder supply nozzle to the soldering point, the solder is not melted by the laser beam before being supplied to the soldering point. Furthermore, an irradiation optical path for irradiating a laser beam, each optical path for observing a soldering point, i.e., an imaging optical path, an illumination optical path, and a temperature measurement optical path are integrated into the irradiation head. Therefore, the simplification and miniaturization of the structure of the irradiation head can be realized.

1 is a perspective view of an irradiation head in a laser soldering apparatus according to a first embodiment of the present invention; FIG. FIG. 2 is a plan view of FIG. 1; FIG. 4 is an enlarged cross-sectional view of a soldering point; FIG. 4 is a plan view of FIG. 3; FIG. 3 is a cross-sectional view taken along line VV of FIG. 2; FIG. 4 is a plan view of a soldering point irradiated with laser light; FIG. 4 is an enlarged cross-sectional view of a main part showing the positional relationship between a laser beam and linear solder during soldering; FIG. 10 is a cross-sectional view of a soldering point after soldering; FIG. 3 is a cross-sectional view taken along line IX-IX of FIG. 2; FIG. 3 is a cross-sectional view taken along line XX of FIG. 2; FIG. 3 is a cross-sectional view taken along line XI-XI of FIG. 2; FIG. 4 is a cross-sectional view of a main part showing an example of a second gas flow path; FIG. 5 is a perspective view of an irradiation head in a second embodiment of the laser soldering apparatus according to the present invention; FIG. 14 is a plan view of FIG. 13; FIG. 10 is a side view showing another structural example of a soldering point; FIG. 11 is a cross-sectional view of the essential parts of an irradiation head in a third embodiment of the laser soldering apparatus;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a laser soldering apparatus according to the present invention will be described in detail with reference to the drawings.
As shown in FIGS. 1 and 2, the laser soldering apparatus has an irradiation head 1 for irradiating a soldering point 2 with laser light. The irradiation head 1 is arranged at the irradiation center O with a plurality of optical paths 3a, 3b, 3c, and 3d arranged at equal angular intervals around the irradiation center O, which is the center of the irradiation head 1, or , a solder supply nozzle 4 arranged near the irradiation center O, and a first gas flow path 5 (see FIG. 5) for supplying an inert gas to the soldering point 2 . In the illustrated example, nine optical paths 3a, 3b, 3c, 3d are arranged around the irradiation center O at intervals of 40 degrees. The solder supply nozzle 4 is connected to a solder supply device 6 for supplying linear solder, and the first gas flow path 5 is a gas for supplying an inert gas such as nitrogen gas or argon gas. It is connected to the supply device 7 . The solder supply device 6 is connected to a control device 14, and the solder supply device 6 is controlled by the control device 14 to control the supply and stop of solder, as well as the speed and amount of solder feeding. be. Similarly, the gas supply device 7 is also connected to the control device 14. By controlling the gas supply device 7 with the control device 14, the supply and stop of the inert gas, as well as the flow rate and flow velocity of the inert gas, are controlled. etc. is adjusted.

The soldering points 2, as shown in FIGS. 3 and 4, consist of an annular land 11 formed on a printed circuit board 10 and leads 12 extending from an electronic component 13. The leads 12 are The printed circuit board 10 is inserted upward from the lower surface side into the through hole 11 a of the land 11 . The land 11 is formed by plating a copper body with tin, and the lead 12 is formed by plating a copper body with gold.

The plurality of optical paths 3a, 3b, 3c, and 3d, as shown in FIG. It includes a plurality (three in the example shown) of observation optical paths 3b, 3c, 3d for observing the marking point 2. FIG.

As is clear from FIG. 5, the irradiation optical path 3a includes a semiconductor laser element 15 whose laser light output can be controlled by a control device 14, an optical fiber 16 connected to the semiconductor laser element 15, and an optical fiber 16 from the optical fiber 16. It has a parallel lens 17a for collimating the laser beam L emitted in a diverging shape, and a condenser lens 18 for condensing the laser beam L collimated by the parallel lens 17a. It should be noted that the semiconductor laser elements 15 of the plurality of irradiation optical paths 3a can use laser light having different wavelengths.

The parallel lenses 17a of the plurality of irradiation optical paths 3a are arranged inside the irradiation head 1 along a circumference surrounding the irradiation center O in one plane S orthogonal to the irradiation center O. there is On the other hand, the condensing lens 18 is a single ring-shaped lens having a central hole 18a, and is a large-diameter lens facing the plurality of parallel lenses 17a of the plurality of irradiation optical paths 3a. A single condenser lens 18 is shared by the plurality of optical paths 3a, 3b, 3c, and 3d, and the solder supply nozzle 4 penetrates through the center hole 18a of the condenser lens 18. As shown in FIG. Then, during soldering, as shown in FIG. 6, the laser light L of the plurality of irradiation optical paths 3a surrounds the irradiation center O at the soldering point 2, and as shown in FIGS. , with respect to the irradiation center O, the beam is irradiated while maintaining an angle at which it does not hit the linear solder 8 supplied from the solder supply nozzle 4 .

In the example shown in FIG. 6, the land 11 is irradiated with the laser beam L, and the lead 12 is not directly irradiated. Therefore, the lead 12 is also heated. However, by changing the focus of the parallel lens 17a or by adjusting the distance from the condenser lens 18 to the soldering point 2, the spot diameter of the laser light L can be increased. It is also possible to irradiate directly across both 11 and lead 12 .

The plurality of semiconductor laser elements 15 connected to the plurality of irradiation optical paths 3a can individually control the outputs of the laser beams L according to the shapes of the lands 11 and the leads 12 by the control device 14. , the control can arbitrarily change the intensity distribution of the plurality of laser beams L applied to the soldering point 2 .

Then, when the soldering point 2 is heated to a predetermined temperature by the irradiation of the laser beam L, the linear solder 8 sent from the solder supply device 6 is supplied from the solder supply nozzle 4 to the soldering point 2. Hand soldering is performed. At this time, the linear solder 8 is supplied toward the land 11 as shown in FIG. However, the solder wire 8 can also be supplied so as to contact the sides of the leads 12 . In this case, by arranging the solder supply nozzle 4 in the vicinity of the irradiation center O in a state slightly inclined with respect to the irradiation center O, the linear solder 8 is applied to a position near the lower end of the side surface of the lead 12. can be fed obliquely downward toward the

Further, at this time, as shown in FIGS. 5 and 7, the laser beams L of the plurality of irradiation optical paths 3a are set at an angle with respect to the irradiation center O so as not to hit the linear solder 8 supplied from the solder supply nozzle 4. , the linear solder 8 is not melted by the laser beam L before contacting the soldering point 2 . For this reason, the melted portion of the solder wire 8 becomes spherical and remains attached to the tip of the solder wire 8, thereby preventing the supply of solder from being hindered.

Further, during the soldering, the inert gas from the gas supply device 7 surrounds the laser light L of the irradiation optical path 3a from the injection port 5a at the tip of the first gas flow path 5, and the It is sprayed so as to surround the soldering point 2 .

As is clear from FIG. 5, the first gas flow path 5 is formed inside a conical optical path cover 20 attached to the tip of the irradiation head 1 . The optical path cover 20 has a double structure consisting of a conical inner cylinder 20a and a conical outer cylinder 20b. 5 is formed at the tip of the optical path cover 20, and the ring-shaped injection port 5a for injecting the inert gas so as to surround the soldering point 2 is formed at the tip of the optical path cover 20. A connection portion 21 for connecting the first gas flow path 5 to the gas supply device 7 is formed at the base end portion. Therefore, the first gas flow path 5 surrounds the plurality of laser beams L emitted from the condenser lens 18 in a conical shape, and the tip of the first gas flow path 5 surrounds the soldering point 2 with an inert gas. It has the ring-shaped injection port 5a that injects as described above. The channel width of the first gas channel 5 (the interval between the inner cylinder 20a and the outer cylinder 20b) is gradually narrowed from the base end side of the optical path cover 20 toward the tip side thereof.

Then, the soldering point 2 is enveloped in an atmosphere of inert gas by jetting the inert gas from the first gas passage 5 . As a result, the lands 11, the leads 12, and the solder 8 are prevented from being oxidized, and the molten solder spreads smoothly. is prevented. In addition, since the soldering point 2 is blocked from the outside by the optical path cover 20 and the inert gas jetted from the optical path cover 20 surrounding the soldering point 2, the linear solder 8 is melted. Splashing of solder balls to the surroundings, which sometimes occurs, is prevented. This results in high quality soldering. FIG. 8 shows the state of the soldering points 2 after soldering. It is preferable that the inert gas is heated to an appropriate temperature by a heater provided at an appropriate position in the flow path and then jetted so that the soldering point is not cooled by the jet.
When the soldering of one soldering point 2 is completed in this way, the irradiation head 1 and the printed circuit board 10 are displaced relatively by the control device 14, so that all the soldering points 2 are soldered one after another. be done.

Here, one of the three observation optical paths 3b, 3c, and 3d is the imaging optical path 3b for imaging the soldering point 2, and the other is the imaging optical path 3b for illuminating the soldering point 2. An illumination beam path 3c for illumination, the remaining one is a measurement beam path 3d for measuring the temperature of said soldering point 2. FIG.

As shown in FIG. 9, the imaging optical path 3b includes a CCD camera 23, a light guide fiber 24 connected to the CCD camera 23, and a parallel lens 17b interposed between the light guide fiber 24 and the soldering point 2. and a condensing lens 18, and the image of the soldering point 2 is picked up by the CCD camera 23 through the parallel lens 17b and the condensing lens 18. FIG. An image of the soldering point 2 captured by the CCD camera 23 is displayed on a monitor (not shown). The image obtained by the CCD camera is used, for example, when setting the irradiation position of the laser beam to the soldering point 2, the solder supply position, etc. during the teaching work performed prior to soldering.

10, the illumination optical path 3c has a light source 25, and a parallel lens 17c and a condensing lens 18 interposed between the light source 25 and the soldering point 2. At times, the soldering point 2 is irradiated with illumination light Lc from the light source 25 through the parallel lens 17c and the condensing lens .

Further, the measurement optical path 3d has an infrared radiation thermometer 26, and a parallel lens 17d and a condensing lens 18 interposed between the radiation thermometer 26 and the soldering point 2, as shown in FIG. Then, the infrared light Ld emitted from the soldering point 2 is received by the radiation thermometer 26 through the condenser lens 18 and the parallel lens 17d, and the temperature of the soldering point 2 is measured. Based on the temperature, the controller 14 controls the output of the semiconductor laser element 15, the irradiation time of the laser light L, and controls the entire soldering process.

Of the three observation optical paths 3b, 3c, and 3d, one observation optical path 3b, 3c, or 3d is arranged every two irradiation optical paths 3a, as shown in FIG. In other words, by arranging the observation optical paths 3b, 3c and 3d one by one between the irradiation optical path 3a and the irradiation optical path 3a, the observation optical paths 3b, 3c and 3d are not directly adjacent to each other. The three observation optical paths 3b, 3c, and 3d are arranged around the irradiation center O at equal angular intervals (120 degrees in the example of a stripe). This is because, when the observation optical paths 3b, 3c, and 3d are directly adjacent to each other, the distance between the adjacent irradiation optical paths 3a and 3a is greatly widened at that portion, so that the laser beam L is projected onto the soldering point 2. This is to prevent irradiation unevenness from occurring. However, the positions of the three observation optical paths 3b, 3c, and 3d in the plurality of optical paths are arbitrary, and they do not necessarily have to be arranged in the order shown in FIGS.

The parallel lenses 17b, 17c and 17d of the three observation optical paths 3b, 3c and 3d are located on the same circumference in the same plane S as the parallel lenses 17a of the six illumination optical paths 3a. The condenser lens 18 for the observation optical paths 3b, 3c, and 3d is common to the condenser lens 18 for the irradiation optical path 3a. However, the condenser lens 18 may be independent for each of the optical paths 3a, 3b, 3c and 3d. In that case, a plurality of independent condenser lenses 18 must be arranged so that the solder supply nozzle 4 can be arranged along the irradiation center O.

Thus, by incorporating the irradiation optical path 3a and the observation optical paths 3b, 3c, and 3d into the irradiation head 1 in the manner described above, these observation optical paths 3b, 3c, and 3d are integrated into the irradiation head 1. It is possible to reduce the size and weight of the irradiation head 1, that is, the soldering device, as compared with the case where the soldering head is attached to the outside.

Further, the irradiation head 1 can be provided with a second gas flow path 27 in addition to the first gas flow path 5 . The two-gas flow path 27 is formed inside a flow tube 28 arranged so as to surround the solder supply nozzle 4, as schematically shown in FIG. The channel cylinder 28 has a double cylindrical shape comprising an inner cylinder 28a and an outer cylinder 28b, and the second gas channel 27 is formed between the inner cylinder 28a and the outer cylinder 28b. A ring-shaped injection port 27 a for injecting inert gas is formed at the tip (lower end) of the passage tube 28 so as to surround the solder supply nozzle 4 . However, the second gas flow path 27 is not necessarily required if the first gas flow path 5 is provided.

Although six irradiation optical paths 3a are provided in the first embodiment, the number of irradiation optical paths 3a may be more or less than six, or may be one. When there is one irradiation optical path 3a, as in the second embodiment shown in FIGS. An optical path 3c for measurement and an optical path 3d for measurement are arranged around the irradiation center O at intervals of 90 degrees. However, the four optical paths 3a, 3b, 3c, and 3d do not necessarily have to be arranged at exactly equal intervals, and the angles between them may be slightly different. Also, the positional relationship among the four optical paths 3a, 3b, 3c, and 3d is arbitrary.

In the case where there is one irradiation optical path 3a as described above, the soldering point 2 can be uniformly heated with one laser beam L in a short time as shown in FIGS. For example, as shown in FIG. 15, a flat linear terminal 30 formed on a printed circuit board 10 and a flat wire of an electronic component are used instead of the annular land 11 and lead 12 shown in FIG. It is preferable that the terminal 31 has a shape or a pin shape.

FIG. 16 shows a main part of a third embodiment of the present invention. An irradiation head 1A of a soldering apparatus according to the third embodiment includes gas flow paths 34 and 35 for injecting inert gas, and a suction channel 36 for sucking fumes generated when the solder melts.

For this reason, at the tip of the irradiation head 1A, an optical path cover 32 having a conical double structure consisting of an inner cylinder 32a and an outer cylinder 32b is attached. 32 b , and a ring-shaped suction port 36 a communicating with the suction flow path 36 is formed at the tip of the optical path cover 32 .

A double-cylindrical channel tube 33 composed of an inner tube 33a and an outer tube 33b is attached to the outer circumference of the solder supply nozzle 4. The inner tube 33a and the outer tube 33b of the channel tube 33 An inner gas flow path 34 for injecting an inert gas is formed between them, and an inert gas is injected between the outer circumference of the flow tube 33 and the inner circumference of the optical path cover 32. The inner gas flow path 34 is connected to the gas supply device 7, and the outer gas flow path 35 is also connected to the gas through a communication path 35a formed inside the irradiation head 1. It is connected to the supply device 7 . Since the inner gas channel 34 and the outer gas channel 35 are covered with the optical path cover 32 , it can be said that they are formed inside the optical path cover 32 .

In the third embodiment, during soldering, the inert gas from the gas supply device 7 flows through the inner gas flow path 34 and the outer gas flow path 35 to the soldering point 2 as indicated by the arrow a in FIG. supplied to On the other hand, the air containing fumes generated during the soldering is sucked into the suction channel 36 from the suction port 36a and filtered by the suction device 37 as indicated by the arrow b in FIG. It is then released into the atmosphere.

The gas supply device 7 and the suction device 37 are connected to the control device 14. By controlling the gas supply device 7 and the suction device 37 by the control device 14, the inner gas flow path 34 and the outer gas flow path are controlled. The injection amount and injection speed of the inert gas from 35, the suction amount and suction speed of the air containing the fume to the suction flow path 36, and the like are controlled.
The configuration and action of the third embodiment other than the configuration and action described above are substantially the same as those of the first embodiment or the second embodiment.

In each of the above-described embodiments, the solder supplied from the solder supply nozzle 4 is the linear solder 8, but the solder may not necessarily be the linear solder 8, and may be a solder piece cut into a predetermined length. Alternatively, it may be solder paste. In this case, the solder flakes or solder paste are delivered to the soldering points 2 in such a manner that they drop or squirt from the solder delivery nozzle 4 .

Reference Signs List 1 irradiation head 2 soldering point 3a irradiation optical path 3b imaging optical path 3c illumination optical path 3d measurement optical path 4 solder supply nozzle 5 first gas flow path 15 semiconductor laser element 16 optical fibers 17a, 17b, 17c, 17d parallel lens 18 collection Optical lens 20, 32 Optical path cover 20a, 32a Inner cylinder 20b, 32b Outer cylinder 23 CCD camera 25 Light source 26 Radiation thermometer 27 Second gas channel 27a Injection port 28 Channel cylinder 28a Inner cylinder 28b Outer cylinder 34 Inner gas channel 35 outer gas channel 36 suction channel 36a suction port
L laser light

Claims (10)

Having an irradiation head for irradiating laser light,
The irradiation head has a plurality of optical paths arranged to surround an irradiation center, which is the center of the irradiation head, and a solder supply nozzle arranged at or near the irradiation center,
The plurality of optical paths include at least one irradiation optical path for irradiating a soldering point with laser light, an imaging optical path for imaging the soldering point, and an illumination light for irradiating the soldering point. and a measuring optical path for measuring the temperature of the soldering point,
The irradiation optical path includes a semiconductor laser element capable of controlling the output of laser light, an optical fiber connected to the semiconductor laser element, a parallel lens for collimating the laser light emitted from the optical fiber, and the parallel lens. and a condenser lens for condensing the laser beam emitted from
The laser light on the irradiation optical path is irradiated to the soldering point while maintaining an angle with respect to the irradiation center that does not hit the solder supplied from the solder supply nozzle to the soldering point.
A laser soldering device characterized by: There are a plurality of irradiation optical paths, and the laser beams of the plurality of irradiation optical paths reach the soldering point while maintaining an angle with respect to the irradiation center that does not impinge on the solder supplied from the solder supply nozzle. Irradiated so as to surround the irradiation center,
2. The laser soldering apparatus according to claim 1, wherein: 3. A laser soldering apparatus according to claim 1, further comprising a first gas passage for supplying inert gas to said soldering point. The first gas flow path has a conical shape surrounding the laser beam emitted from the condenser lens, and has a ring-shaped injection port at the tip for injecting inert gas so as to surround the soldering point. 4. A laser soldering apparatus according to claim 3, characterized in that: At the tip of the irradiation head, an optical path cover having a double-structured cone shape as a whole including an inner cylinder and an outer cylinder is attached, the optical path cover surrounds the plurality of optical paths in a conical shape, 5. The laser soldering apparatus according to claim 4, wherein the first gas flow path is formed between the and the outer cylinder. having a second gas flow path for supplying inert gas to the soldering point;
6. The second gas passageway according to claim 1, wherein the second gas passageway is formed between an inner cylinder and an outer cylinder of a double-cylindrical passage cylinder surrounding the soldering nozzle. A laser soldering apparatus as described in . 3. The laser soldering device according to claim 1, further comprising a gas channel for supplying inert gas to said soldering point and a suction channel for sucking fumes generated during soldering. attachment device. At the tip of the irradiation head, an optical path cover having a double-structured cone shape as a whole including an inner cylinder and an outer cylinder is attached, the optical path cover surrounds the plurality of optical paths in a conical shape, and the outer cylinder, a ring-shaped suction port communicating with the suction flow path is formed at the tip of the optical path cover, and the gas flow path is formed inside the optical path cover. 8. The laser soldering device according to claim 7, wherein the laser soldering device is formed. The gas flow path includes an inner flow path formed between an inner tube and an outer tube of a double cylindrical flow tube surrounding the soldering nozzle, an inner circumference of the optical path cover and the flow tube. 9. The laser soldering device according to claim 7, further comprising an outer flow path formed between the outer periphery of the laser soldering device. The imaging optical path has a CCD camera and a parallel lens and a condensing lens interposed between the CCD camera and the soldering point. captured by a camera,
The illumination optical path has a light source and a parallel lens and a condenser lens interposed between the light source and the soldering point, and the illumination light from the light source passes through the parallel lens and the condenser lens. Irradiate the attachment point,
The measurement optical path has a radiation thermometer, and a parallel lens and a condenser lens interposed between the radiation thermometer and the soldering point, and collects the infrared light emitted from the soldering point. measuring the temperature of the soldering point by receiving light with the radiation thermometer through an optical lens and a collimating lens;
10. The laser soldering apparatus according to any one of claims 1 to 9, characterized in that:

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