JP2023051422A - Cutting device - Google Patents

Abstract

To provide a cutting device capable of suppressing collision of a microscope with a workpiece held on a chuck table when implementing dressing of a cutting blade.SOLUTION: A cutting device 1 comprises a chuck table 10, a cutting unit 20 and a moving unit for moving the chuck table 10 in relative to the cutting unit 20. The chuck table 10 includes a main chuck table 11 holding a workpiece 200-1 and a sub chuck table 12 being adjacent to the main chuck table 11 and holding a dress board 210 on a dress board holding surface 121. The sub chuck table 12 includes a sub chuck table lifting unit 13 for changing a height of the dress board holding surface 121 between a dressing position corresponding to a height of a top face of the thick workpiece 200-1, which is held by the main chuck table 11 and becomes as high as or higher than a predetermined level, and a retraction position which is lower than the dressing position.SELECTED DRAWING: Figure 6

Description

The present invention relates to a cutting device.

Cutting equipment that cuts with a cutting blade not only cuts and divides thin workpieces such as wafers, but also workpieces with a thickness of 2 mm or more (usually 0.5 mm or less). may be cut. When cutting a thick workpiece, the cutting apparatus may use a special jig to adjust the height position of the chuck table.

In addition, the cutting device sharpens the cutting edge of the cutting blade whose cutting ability has decreased due to clogging or crushed by cutting with the cutting edge of the cutting blade, and the cutting edge attached to the cutting edge of the cutting blade. In some cases, the sub-chuck table holds a dressing board that recovers the cutting ability of the cutting edge of the cutting blade by removing debris (see, for example, Patent Document 1).

Japanese Patent No. 5636213

When dressing is performed by cutting a cutting blade into a dressing board held by a sub-chuck table nearby while a thick workpiece is held by the chuck table, the cutting device has a blade cover, nozzle, and chuck to cover the cutting blade. There has been a problem that the microscope arranged on the same straight line between the table and the sub-chuck table collides with the workpiece held by the chuck table.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a cutting apparatus capable of suppressing collision of a microscope with a workpiece held on a chuck table when dressing a cutting blade.

In order to solve the above-described problems and achieve the object, the cutting apparatus of the present invention comprises a chuck table for holding a workpiece on a holding surface, and a cutting blade for cutting the workpiece held by the chuck table with a cutting blade. and a moving unit for relatively moving the chuck table with respect to the cutting unit, wherein the chuck table includes a main chuck table for holding a workpiece, and a main chuck table for holding a workpiece. and a sub-chuck table for holding a dress board used for dressing the cutting blade on a dress board holding surface adjacent thereto, the sub-chuck table having a height equal to or higher than the predetermined height held by the main chuck table. A sub-chuck table elevating unit for changing the height of the dressing board holding surface is provided at a dressing position corresponding to the height of the upper surface of the workpiece and a retreat position lower than the dressing position.

In the cutting apparatus, the sub-chuck table elevating unit may rotate the dressing board holding surface from upward to sideways to move it from the dressing position to the retracted position.

In the cutting apparatus, the sub-chuck table moving unit may move the dressing board holding surface between the dressing position and the retracted position by raising and lowering the sub-chuck table with an air cylinder.

Advantageous Effects of Invention The present invention has the effect of suppressing collision of a microscope with a workpiece held on a chuck table when dressing a cutting blade.

FIG. 1 is a perspective view showing a configuration example of a cutting device according to Embodiment 1. FIG. FIG. 2 is a perspective view showing a configuration example of a sub-chuck table of the cutting apparatus according to Embodiment 1. FIG. 3 is a perspective view showing a state in which the sub-chuck table shown in FIG. 2 is positioned at a dressing position; FIG. FIG. 4 is a side view schematically showing a state in which the cutting device shown in FIG. 1 cuts a thin work piece, with a partial cross section. FIG. 5 is a side view schematically showing a state in which the cutting device shown in FIG. 1 cuts a thick workpiece, in partial cross section. FIG. 6 is a side view schematically showing a state in which the cutting device shown in FIG. 5 is dressed, with a partial cross section. FIG. 7 is a perspective view showing a configuration example of a sub-chuck table positioned at a dressing position of the cutting device according to Embodiment 2. FIG. 8 is a perspective view showing a state in which the sub-chuck table shown in FIG. 7 is positioned at a retracted position; FIG. FIG. 9 is a side view schematically showing a state in which a thick workpiece is cut by the cutting apparatus according to Embodiment 2, partially in cross section. FIG. 10 is a side view schematically showing a state in which the cutting device shown in FIG. 9 is being dressed, in partial cross section.

A form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in Embodiment 1 below. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions, or changes in configuration can be made without departing from the gist of the present invention.

[Embodiment 1]
A cutting device 1 according to Embodiment 1 of the present invention will be described based on the drawings. FIG. 1 is a perspective view showing a configuration example of a cutting device according to Embodiment 1. FIG. FIG. 2 is a perspective view showing a configuration example of a sub-chuck table of the cutting apparatus according to Embodiment 1. FIG. 3 is a perspective view showing a state in which the sub-chuck table shown in FIG. 2 is positioned at a dressing position; FIG.

The cutting apparatus 1 shown in FIG. 1 according to the first embodiment is a thick workpiece 200-1 that is a workpiece having a thickness greater than or equal to a predetermined thickness, or a thin workpiece 200 that is a workpiece having a thickness less than a predetermined thickness. -2 (shown in FIG. 4).

(Workpiece)
The thick workpiece 200-1 to be processed by the cutting apparatus 1 according to the first embodiment has a thickness of 2 mm or more (preferably a thickness of 5 mm or more and 100 mm or less), A component, a ceramic substrate made of ceramics, a glass substrate made of glass, or the like. In Embodiment 1, the thick workpiece 200-1 is formed to have a rectangular planar shape.

The thin workpiece 200-2 has a thickness of 1 mm or less, and is, for example, a disk-shaped semiconductor wafer or light beam made of silicon, gallium arsenide, SiC (silicon carbide), sapphire, or the like. It is a wafer such as a device wafer, or a resin package substrate such as a rectangular QFN (Quad Flat No Leaded) package substrate having a plurality of device chips sealed with resin.

(cutting device)
The cutting device 1 according to the first embodiment is a processing device that holds either one of the workpieces 200-1 and 200-2 on the chuck table 10 and cuts one of the workpieces 200-1 and 200-2. is. As shown in FIG. 1, the cutting apparatus 1 includes a chuck table 10 for sucking and holding one of workpieces 200-1 and 200-2, and workpieces 200-1 and 200-2 held by the chuck table 10. 2 or the like with a cutting blade 21, a microscope 30 for photographing one of the workpieces 200-1 and 200-2 held on the chuck table 10, and a control unit 100. Prepare.

The cutting apparatus 1 also includes a moving unit 40 that relatively moves the chuck table 10 with respect to the cutting unit 20, as shown in FIG. The moving unit 40 includes an X-axis moving unit 41 which is a processing feed unit for processing and feeding the chuck table 10 in the X-axis direction parallel to the horizontal direction, and a Y-axis moving unit 41 which is a processing feed unit for processing and feeding the cutting unit 20 in parallel to the horizontal direction and perpendicular to the X-axis direction. A Y-axis moving unit 42, which is an indexing unit for axially indexing and feeding, and a cutting feed unit for cutting and feeding the cutting unit 20 in the Z-axis direction parallel to the vertical direction orthogonal to both the X-axis direction and the Y-axis direction. and a rotary movement unit 44 that rotates the chuck table 10 around an axis parallel to the Z-axis direction.

The X-axis movement unit 41 relatively moves the chuck table 10 and the cutting unit 20 along the X-axis direction by moving the chuck table 10 and the rotary movement unit 44 in the X-axis direction, which is the processing feed direction. It is something to do. The Y-axis movement unit 42 is installed on the support frame 3 erected from the apparatus main body 2, and moves the cutting unit 20 in the Y-axis direction, which is the index feed direction, to move the chuck table 10 and the cutting unit 20 relative to each other. are indexed and fed along the Y-axis direction.

The Z-axis moving unit 43 is installed on the support frame 3 erected from the apparatus main body 2, and moves the cutting unit 20 in the Z-axis direction, which is the feed direction for cutting, to move the chuck table 10 and the cutting unit 20 relative to each other. It feeds by cutting along the Z-axis direction. The rotary movement unit 44 is provided so as to be movable in the X-axis direction by the X-axis movement unit 41 .

The X-axis moving unit 41, the Y-axis moving unit 42, and the Z-axis moving unit 43 are a well-known ball screw provided rotatably around the axis, a well-known motor for rotating the ball screw around the axis, and the chuck table 10. Alternatively, a well-known guide rail that supports the cutting unit 20 so as to be movable in the X-axis direction, the Y-axis direction, or the Z-axis direction is provided. The rotary movement unit 44 also includes a motor that rotates the chuck table 10 around its axis.

The chuck table 10 has a main chuck table 11 that holds one of the workpieces 200-1 and 200-2, and a sub-chuck table 12 that holds a dress board 210, which is the workpiece. The main chuck table 11 has a disk shape and sucks and holds one of the workpieces 200-1 and 200-2 on a holding surface 111 parallel to the horizontal direction. The main chuck table 11 is rotated around an axis parallel to the Z-axis direction by the rotary movement unit 44 . The main chuck table 11 is separated from the machining area below the cutting unit 20 by the X-axis movement unit 41 together with the rotation movement unit 44, and the workpieces 200-1 and 200-2 are carried in and out. It is moved in the X-axis direction across the loading/unloading area.

The main chuck table 11 has a holding surface 111 formed with a suction groove 112 connected to a vacuum suction source (not shown). The main chuck table 11 sucks and holds one of the workpieces 200-1 and 200-2 placed on the holding surface 111 by sucking the suction groove 112 from the vacuum suction source. Moreover, the chuck table 10 is surrounded by a table cover 4 attached to the outer peripheral surface of the rotary movement unit 44 .

A bellows member 5 covering the X-axis moving unit 41 is attached to the table cover 4 . A pair of bellows members 5 are provided. One bellows member 5 is attached to the table cover 4 and the end portion of the device main body 2 on the front side in FIG. attached to the far end of the Each bellows member 5 is flexible and stretchable in the X-axis direction, allowing the table cover 4, ie, the chuck table 10, to move in the X-axis direction. Each bellows member 5 prevents cutting water or the like from adhering to the X-axis moving unit 41 or the like.

(Sub chuck table)
The sub chuck table 12 is adjacent to the main chuck table 11 and holds the dress board 210 by suction on a flat dress board holding surface 121 . In addition, the dressing board 210 is cut by the cutting edge of the cutting blade 21 to sharpen the cutting edge of the cutting blade 21 whose cutting ability is reduced due to clogging or crushing. The cutting ability of the cutting edge of the cutting blade 21 is recovered by removing the cutting debris adhering to the cutting blade 21 . Cutting the dress board 210 with the cutting edge of the cutting blade 21, sharpening the cutting edge of the cutting blade 21, and restoring the cutting ability of the cutting edge of the cutting blade 21 is called dressing.

That is, the dress board 210 is used for dressing the cutting blade 21 . The dressing board 210 has abrasive grains fixed with a bonding material (bonding material), and in the first embodiment, the dressing board 210 has a rectangular planar shape equivalent to the thickness of the thin workpiece 200-2. is formed in

The sub-chuck table 12 is installed on the table cover 4 and moved in the X-axis direction by the X-axis movement unit 41 together with the main chuck table 11 and the rotary movement unit 44 . As shown in FIGS. 2 and 3, the sub-chuck table 12 includes the sub-chuck table lifting unit 13, the holding member 14 having the dressing board holding surface 121 described above, and the holding member 14 attached to the sub-chuck table lifting unit 13. Also, an orientation adjusting mechanism 15 for adjusting the orientation of the dress board holding surface 121 and a cover 16 are provided.

The sub-chuck table elevating unit 13 has a dressing position corresponding to the height of the upper surface of the thick workpiece 200-1 held by the main chuck table 11 and having a predetermined height or more, and a retraction position lower than the dressing position. Second, the height of the dress board holding surface 121 is changed. The sub-chuck table lifting unit 13 is a so-called air cylinder having a cylinder 131 installed on the table cover 4 and an extendable rod 132 extending from the cylinder 131 along the Z-axis direction and having the holding member 14 attached to its upper end. be.

In the first embodiment, the sub-chuck table lifting unit 13 retracts the telescopic rod 132 to position the dress board holding surface 121 of the holding member 14 at the retracted position as shown in FIG. In the first embodiment, at the retracted position, the dress board holding surface 121 of the holding member 14 is positioned flush with the holding surface 111 of the main chuck table 11 in the Z-axis direction.

However, in the present invention, in the retracted position, the dress board holding surface 121 of the holding member 14 is such that when the cutting edge of the cutting blade 21 cuts into the dress board 210 held by the dress board holding surface 121, the lower end of the microscope 30 is It is located above the upper surface of the thin workpiece 200-2 held on the holding surface 111, and when the thin workpiece 200-2 held on the holding surface 111 is cut with the cutting blade 21, the cutting blade If the lower end of the cutting edge 21 is located above the upper surface of the dress board 210 and the difference in height between the holding surfaces 111 and 121 in the Z-axis direction is small, the holding surface 111 of the main chuck table 11 and the Z-axis do not necessarily have the same height. The heights of the directions do not have to be positioned on the same plane.

Alternatively, even when the thin workpiece 200-2 is being processed, if the dressing of the cutting blade 21 is performed at the dressing position of the sub-chuck table 12, the retracted position of the sub-chuck table 12 is the same as that of the main chuck. Any height that does not contact the cutting blade 21 that processes the table 11, the blade cover that covers the cutting blade 21, or the cutting water nozzle 24 is sufficient.

In the first embodiment, the sub-chuck table lifting unit 13 extends the telescopic rod 132 to position the dress board holding surface 121 of the holding member 14 at the dressing position as shown in FIG. In the first embodiment, at the dressing position, the dress board holding surface 121 of the holding member 14 is positioned higher in the Z-axis direction than the holding surface 111 of the main chuck table 11 .

In the present invention, in the dressing position, when the cutting edge of the cutting blade 21 is cut into the dressing board 210 held on the dressing board holding surface 121, the lower end of the microscope 30 is held by the holding surface 111. It is desirable to be located at a height higher than the upper surface of -1. In addition, in the present invention, in the dressing position, the dress board holding surface 121 of the holding member 14 is arranged such that when the cutting edge of the cutting blade 21 is cut into the dress board 210 held on the dress board holding surface 121, the holding surface 111 is It is desirable to position it at the same level as or above the upper surface of the held thick workpiece 200-1.

However, according to the present invention, at the dressing position, the dress board holding surface 121 of the holding member 14 is arranged such that when the cutting edge of the cutting blade 21 cuts into the dress board 210 held by the dress board holding surface 121, the holding surface 111, If the height difference of 121 in the Z-axis direction is small, it does not necessarily have to be positioned above the upper surface of the thick workpiece 200 - 1 held on the holding surface 111 of the main chuck table 11 .

In the present invention, when the cutting edge of the cutting blade 21 is cut into the dressing board 210 held on the dressing board holding surface 121 positioned at the dressing position, the lower end of the microscope 30 is held on the holding surface 111 to cut the thick workpiece. 200-1, the difference in height in the Z-axis direction between the holding surfaces 111 and 121 is small. 11 is positioned at the same height in the Z-axis direction as the upper surface of the thick workpiece 200-1 held by the holding surface 111 of . That is, in the present invention, the dress board holding surface 121 positioned at the dressing position of the holding member 14 is equivalent to the upper surface of the thick workpiece 200-1 held on the holding surface 111 of the main chuck table 11 in the Z-axis direction. It is desirable to be positioned at the height of

At the dressing position, the main chuck table 11 holds the dress board holding surface 121 of the holding member 14 at the same height as the upper surface of the thick workpiece 200-1 held on the holding surface 111. It is said to be located at a position (height) corresponding to the height of the upper surface of the thick workpiece 200-1 having a predetermined height or more. As described above, in the first embodiment, the sub-chuck table lifting unit 13 is an air cylinder that lifts and lowers the dressing board holding surface 121. By lifting and lowering the dressing board holding surface 121, the position between the dressing position and the retracted position can be adjusted. to move the dress board holding surface 121 with .

The holding member 14 is formed in a rectangular plate shape having the same size as the dress board 210 in plan view, and holds the dress board 210 on the flat dress board holding surface 121 by suction. The holding member 14 has a dress board holding surface 121 formed with a suction groove 122 connected to a vacuum suction source (not shown). The holding member 14 , that is, the sub-chuck table 12 sucks and holds the dress board 210 placed on the dress board holding surface 121 by sucking the suction groove 122 from the vacuum suction source.

The orientation adjusting mechanism 15 is attached to the tip of the telescopic rod 132 of the sub-chuck table lifting unit 13, and supports the lower surface of the holding member 14 (the surface on the back side of the dress board holding surface 121). and an adjustment member 152 of . A plurality of adjusting members 152 change the orientation of the holding member 14 with respect to the supporting member 151 . In Embodiment 1, three adjusting members 152 are provided at intervals.

In Embodiment 1, one adjusting member 152 out of the three adjusting members 152 is provided between the supporting member 151 and the holding member 14, and is rotated around the axis of the screw shaft to rotate the holding member. 14 is a nut for changing the height of the supporting position in the Z-axis direction. The remaining two adjustment members 152 are screwed into the support member 151 from the side of the dress board holding surface 121, and rotated around the axis to adjust the amount of screwing, thereby adjusting the Z-axis at the position supported by the holding member 14. It is the screw that changes the height of the direction. The orientation adjustment mechanism 15 adjusts the orientation of the dress board holding surface 121 by changing the height in the Z-axis direction of the position supported by each adjustment member 152 of the holding member 14 . In the first embodiment, the orientation adjusting mechanism 15 adjusts each adjusting member 152 during periodic maintenance of the cutting device 1 to increase the Z-axis direction height of the position supported by each adjusting member 152 of the holding member 14 . The height is adjusted so that the dress board holding surface 121 is parallel to the horizontal direction.

As shown in FIGS. 2 and 3, the cover 16 covers the outer periphery of the cylinder 131 of the sub-chuck table lifting unit 13 to prevent cutting chips from adhering to the sub-chuck table lifting unit 13, particularly the telescopic rod 132, during cutting. It is a restraint to do. The cover 16 is formed in a flat plate shape to cover the outer periphery of the cylinder 131 of the sub-chuck table lifting unit 13 .

The cutting unit 20 is a processing unit in which a cutting blade 21 is attached to a spindle 23 and which cuts one of the workpieces 200 - 1 and 200 - 2 held on the main chuck table 11 . The cutting unit 20 moves one of the workpieces 200-1 and 200-2 held on the main chuck table 11 or the dressing board 210 held on the sub-chuck table 12 by the Y-axis moving unit . It is provided movably in the Z-axis direction and is provided movably in the Z-axis direction by the Z-axis moving unit 43 . As shown in FIG. 1, the cutting unit 20 is provided on the support frame 3 erected from the apparatus main body 2 via a Y-axis movement unit 42, a Z-axis movement unit 43, and the like. The cutting unit 20 moves the cutting blade 21 to an arbitrary position on the holding surface 111 of the main chuck table 11 or an arbitrary position on the dressing board holding surface 121 of the sub chuck table 12 by the Y-axis moving unit 42 and the Z-axis moving unit 43 . Positioning is possible.

The cutting unit 20 includes a cutting blade 21, a spindle housing 22 provided to be movable in the Y-axis direction and the Z-axis direction by a Y-axis moving unit 42 and a Z-axis moving unit 43, and a spindle housing 22 that rotates around the axis. It has a spindle 23 that can be provided and has a cutting blade 21 attached to its tip, a spindle motor (not shown) that rotates the spindle 23 around its axis, and a cutting water nozzle 24 that supplies cutting water to the cutting blade 21 .

The cutting blade 21 is an ultra-thin cutting whetstone having a substantially ring shape. A cutting blade 21 is fixed to the tip of a spindle 23 . In Embodiment 1, the cutting blade 21 is a so-called hub blade that includes an annular base and an annular cutting edge that is disposed on the outer peripheral edge of the circular base and cuts the workpiece 200 . The cutting edge is made of abrasive grains such as SiC, alumina, diamond, or CBN (Cubic Boron Nitride), and a bond (bonding material) that fixes the abrasive grains such as metal or resin, and is formed to have a predetermined thickness. In addition, in the present invention, the cutting blade 21 may be a so-called washer blade composed only of a cutting edge. The axial centers of the cutting blade 21 and the spindle 23 of the cutting unit 20 are set parallel to the Y-axis direction.

The microscope 30 is fixed to the cutting unit 20 so as to move together with the cutting unit 20 . In Embodiment 1, the microscope 30 is arranged at a position where the objective lens facing the workpieces 200-1 and 200-2 held on the main chuck table 11 is aligned with the cutting blade 21 in the X-axis direction. The microscope 30 is equipped with an imaging element that captures an area to be divided of either of the workpieces 200-1 and 200-2 held on the main chuck table 11 before cutting. The imaging device is, for example, a CCD (Charge-Coupled Device) imaging device or a CMOS (Complementary MOS) imaging device. The microscope 30 photographs one of the workpieces 200-1 and 200-2 held on the main chuck table 11, and aligns one of the workpieces 200-1 and 200-2 with the cutting blade 21. images for performing alignment, etc., are obtained, and the obtained images are output to the control unit 100 . The microscope 30 also photographs the dress board 210 held on the sub-chuck table 12 .

The cutting apparatus 1 also includes an X-axis position detection unit (not shown) for detecting the position of the chuck table 10 in the X-axis direction, and a Y-axis position detection unit (not shown) for detecting the position of the cutting unit 20 in the Y-axis direction. A detection unit and a Z-axis direction position detection unit for detecting the position of the cutting unit 20 in the Z-axis direction are provided. The X-axis direction position detection unit and the Y-axis direction position detection unit can be composed of a linear scale parallel to the X-axis direction or the Y-axis direction and a reading head. The Z-axis direction position detection unit detects the position of the cutting unit 20 in the Z-axis direction using motor pulses. The X-axis direction position detection unit, the Y-axis direction position detection unit, and the Z-axis direction position detection unit control the position of the chuck table 10 in the X-axis direction and the lower end of the cutting edge of the cutting unit 20 in the Y-axis direction or Z-axis direction. Output to unit 100 .

In the first embodiment, the positions of the chuck table 10 and the cutting unit 20 of the cutting apparatus 1 in the X-axis direction, the Y-axis direction, and the Z-axis direction are determined based on predetermined reference positions (not shown). In Embodiment 1, the reference position of the cutting unit 20 in the Z-axis direction is the position where the holding surface 111 of the chuck table 10 and the lower end of the cutting edge of the cutting blade 21 are positioned on the same plane.

The control unit 100 also controls each component of the cutting device 1 to cause the cutting device 1 to perform a machining operation on one of the workpieces 200-1 and 200-2. Note that the control unit 100 includes an arithmetic processing unit having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as ROM (read only memory) or RAM (random access memory), and an input/output unit. A computer having an interface device. The arithmetic processing device of the control unit 100 performs arithmetic processing according to a computer program stored in the storage device, and outputs control signals for controlling the cutting device 1 to each of the cutting devices 1 through the input/output interface device. Output to a component.

The control unit 100 is connected to a display unit configured by a liquid crystal display device or the like for displaying the state of machining operation, images, etc., and an input unit used by the operator to register machining content information and the like. The input unit is configured by a touch panel provided on the display unit.

(machining operation)
Next, the machining operation of the cutting device 1 will be described. FIG. 4 is a side view schematically showing a state in which the cutting device shown in FIG. 1 cuts a thin work piece, with a partial cross section. FIG. 5 is a side view schematically showing a state in which the cutting device shown in FIG. 1 cuts a thick workpiece, in partial cross section. FIG. 6 is a side view schematically showing a state in which the cutting device shown in FIG. 5 is dressed, with a partial cross section.

When starting the machining operation of the cutting device 1, the operator registers the machining conditions in the control unit 100, the control unit 100 receives the machining conditions, and the workpieces 200-1 and 200-2 before cutting are processed. Either one is placed on the holding surface 111 of the main chuck table 11 , and the dress board 210 is placed on the dress board holding surface 121 of the sub chuck table 12 . After that, the cutting device 1 starts the machining operation when the control unit 100 receives a machining operation start instruction from the operator. When starting the machining operation, the cutting device 1 suction-holds one of the workpieces 200-1 and 200-2 on the holding surface 111 of the main chuck table 11 and holds it on the dressing board holding surface 121 of the sub-chuck table 12. The dress board 210 is held by suction.

In the machining operation, as shown in FIGS. 4 and 5, the cutting device 1 causes the sub-chuck table lifting unit 13 to position the dressing board holding surface 121 of the sub-chuck table 12 at the retracted position. In the machining operation, the X-axis moving unit 41 moves the chuck table 10 toward the machining area, the microscope 30 photographs either the workpiece 200-1 or 200-2, and the microscope Alignment is performed based on the images captured by 30 . The cutting device 1 relatively moves the main chuck table 11 and the cutting unit 20, and while supplying cutting water from the cutting water nozzle 24, the cutting blade 21 moves either the workpiece 200-1 or 200-2. to cut.

In the machining operation, after cutting one of the workpieces 200-1 and 200-2, the cutting device 1 moves the chuck table 10 toward the loading/unloading area, and moves the holding surface 111 in the loading/unloading area. , and the machining operation is terminated.

Further, the cutting apparatus 1 performs dressing at a predetermined timing during the machining operation (for example, each time a predetermined number of workpieces 200-1 and 200-2 are cut). For example, when the thick workpiece 200-1 is held on the holding surface 111 of the main chuck table 11, the cutting device 1 causes the sub-chuck table lifting unit 13 to move the dressing board holding surface 121 of the sub-chuck table 12. to the dressing position. As shown in FIG. 6, the cutting device 1 causes the cutting edge of the cutting blade 21 to cut into the dressing board 210 based on the machining conditions for dressing.

In the first embodiment, when the cutting apparatus 1 carries out dressing, when the thin workpiece 200-2 is held on the holding surface 111 of the main chuck table 11, the sub-chuck table lifting unit 13 moves the sub-chuck table lifting unit 13. Dressing is performed by positioning the dress board holding surface 121 of the chuck table 12 at the dressing position. However, in the present invention, when the cutting device 1 performs dressing, when the thin workpiece 200-2 is held on the holding surface 111 of the main chuck table 11, the sub chuck table lifting unit 13 Dressing may be performed by positioning the dress board holding surface 121 of the sub-chuck table 12 at the retracted position.

As described above, in the cutting apparatus 1 according to the first embodiment, the height of the dressing board holding surface 121 of the sub-chuck table 12 in the Z-axis direction can be changed by the sub-chuck table lifting unit 13, so that the cutting blade 21 can be dressed. By positioning the dressing board holding surface 121 at the dressing position at the same height as the upper surface of the thick workpiece 200-1, the microscope 30 can move the thick workpiece held on the main chuck table 11. 200-1 can be suppressed.

As a result, in the cutting apparatus 1 according to the first embodiment, the microscope 30 collides with the workpieces 200-1 and 200-2 held on the main chuck table 11 of the chuck table 10 when the cutting blade 21 is dressed. There is an effect that it is possible to suppress doing.

Further, the cutting apparatus 1 according to the first embodiment positions the dress board holding surface 121 of the sub chuck table 12 at the retracted position when cutting either of the workpieces 200-1 and 200-2. Collision of the cutting blade 21 with the board 210 can be suppressed.

[Embodiment 2]
A cutting device 1 according to Embodiment 2 of the present invention will be described based on the drawings. FIG. 7 is a perspective view showing a configuration example of a sub-chuck table positioned at a dressing position of the cutting device according to Embodiment 2. FIG. 8 is a perspective view showing a state in which the sub-chuck table shown in FIG. 7 is positioned at a retracted position; FIG. FIG. 9 is a side view schematically showing a state in which a thick workpiece is cut by the cutting device according to the second embodiment, partially in cross section. FIG. 10 is a side view schematically showing a state in which the cutting device shown in FIG. 9 is being dressed, in partial cross section. 7, 8, 9 and 10, the same reference numerals are assigned to the same parts as in the first embodiment, and the description thereof is omitted.

In the cutting apparatus 1 according to the second embodiment, the sub-chuck table lifting unit 13-2 shifts from the dressing position shown in FIG. 7 in which the dress board holding surface 121 faces upward to the retracted position shown in FIG. 8 in which the dress board holding surface 121 faces sideways. , and the sub-chuck table 12 is provided with a protective film 17 shown in FIG. It is the same as the first embodiment except that

In the second embodiment, as shown in FIGS. 7 and 8, the sub-chuck table lifting unit 13-2 is installed on the table cover 4 and has an output shaft 133 that rotates with an axis parallel to the Y-axis direction, and an output shaft 133 that rotates. It comprises a pivot arm 134 fixed to the shaft 133 and the holding member 14 of the orientation adjustment mechanism 15 . In the second embodiment, the sub-chuck table lifting unit 13 rotates the output shaft 133 around the axis, thereby rotating the rotating arm 134 to the dressing position where the dress board holding surface 121 faces upward, and the dressing position. The height of the dress board holding surface 121 in the Z-axis direction is changed by moving the dress board holding surface 121 between the retracted position where the board holding surface 121 faces sideways.

In Embodiment 2, the protective film 17 of the sub-chuck table 12 is made of flexible resin and formed into a film shape. One end of the protective film 17 is attached to the support member 151 of the orientation adjustment mechanism 15, and when the dress board holding surface 121 is positioned at the retracted position, as shown in FIG. cover the top of

Further, in the second embodiment, the cover 16 is formed in a flat plate shape to cover the outer circumference of the sub chuck table lifting unit 13-2.

The cutting apparatus 1 according to the second embodiment moves the dress board holding surface 121 to the retracted position as shown in FIG. Position. 9 shows an example in which a thick workpiece 200-1 is held on the holding surface 111, and an example in which a thin workpiece 200-2 is held on the holding surface 111 is omitted. Further, the cutting apparatus 1 according to the second embodiment positions the dressing board holding surface 121 at the dressing position as shown in FIG. 10 when dressing in the machining operation. Note that FIG. 10 representatively shows an example in which a thick workpiece 200-1 is held on the holding surface 111, and in the second embodiment, even when a thin workpiece 200-2 is held on the holding surface 111, , to position the dress board holding surface 121 in the dressing position.

In the cutting apparatus 1 according to the second embodiment, the sub-chuck table lifting unit 13-2 can change the height of the dressing board holding surface 121 of the sub-chuck table 12 in the Z-axis direction. By positioning the dressing board holding surface 121 at the dressing position, the workpieces 200-1, 200-1, 200-1, 200-1, 200-1, 200-1 held on the main chuck table 11 of the chuck table 10 when the cutting blade 21 is dressed, as in the first embodiment. This has the effect of preventing the microscope 30 from colliding with 200-2.

It should be noted that the present invention is not limited to the above embodiments. That is, various modifications can be made without departing from the gist of the present invention. For example, even when the thickness of the workpiece 200 is thicker than a predetermined value, the thin workpiece 200-2 fixed with a thick fixture is held on the main chuck table 11 via the fixture. Even in this case, the height of the surface of the workpiece 200-2 is equal to or higher than the above-mentioned predetermined height, so that the present invention can obtain the same effect.

1 Cutting Device 10 Chuck Table 11 Main Chuck Table 12 Sub Chuck Table 13, 13-2 Sub Chuck Table Elevating Unit 20 Cutting Unit 21 Cutting Blade 40 Moving Unit 111 Holding Surface 121 Dressing Board Holding Surface 200-1 Thick Workpiece ( (workpieces with a thickness greater than the prescribed thickness)
200-2 thin workpiece (workpiece)
210 dress board (workpiece)

Claims (3)

A chuck table that holds a workpiece on a holding surface, a cutting unit that cuts the workpiece held by the chuck table with a cutting blade, and a moving unit that relatively moves the chuck table with respect to the cutting unit. A cutting device comprising
The chuck table is
a main chuck table for holding a workpiece;
a sub-chuck table adjacent to the main chuck table and holding a dress board used for dressing the cutting blade on a dress board holding surface;
The subchuck table is
The height of the dressing board holding surface is changed between a dressing position corresponding to the height of the upper surface of the workpiece held by the main chuck table and having a predetermined height or higher, and a retracted position lower than the dressing position. A cutting device comprising a sub-chuck table lifting unit. 2. The cutting apparatus according to claim 1, wherein the sub-chuck table elevating unit rotates the dressing board holding surface from upward to lateral to move it from the dressing position to the retracted position. 2. The cutting apparatus according to claim 1, wherein the sub-chuck table moving unit moves the dressing board holding surface between the dressing position and the retracted position by raising and lowering the sub-chuck table with an air cylinder.

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