JP2023045993A - Light-emitting module and luminaire - Google Patents

Abstract

To provide a light-emitting module and a luminaire that can take measures against noise.SOLUTION: A light-emitting module 11 comprises a module substrate 20, a light-emitting element 21 mounted on the module substrate 20, and ferrite beads L1, L2 which have an impedance peak at a frequency of 30 MHz to 1 GHz, and are connected in series with the light-emitting element 21.SELECTED DRAWING: Figure 1

Description

Embodiments of the present invention relate to light emitting modules and lighting devices.

2. Description of the Related Art Conventionally, there is a lighting device that includes a light-emitting module in which a light-emitting element is mounted on a module substrate, and a lighting circuit that supplies lighting power to the light-emitting module. Since the lighting circuit performs power conversion for converting input power into predetermined lighting power, noise is generated.

In general, a noise filter is used to reduce noise in the lighting circuit. It is hoped that it can be done.

JP 2016-162596 A

A problem to be solved by the present invention is to provide a light-emitting module and a lighting device that can take countermeasures against noise.

A light-emitting module of an embodiment includes a module substrate, a light-emitting element mounted on the module substrate, and a ferrite bead having an impedance peak at a frequency of 30 MHz to 1 GHz and connected in series to the light-emitting element.

According to the embodiment, it is possible to provide a light-emitting module capable of noise countermeasures.

1 is a circuit diagram of a lighting device with a light emitting module showing an embodiment; FIG. 4 is a graph of impedance characteristics of ferrite beads included in the same light emitting module.

An embodiment will be described below with reference to the drawings.

A lighting device 10 is shown in FIG. This lighting device 10 includes a light emitting module 11 and a lighting circuit 12 .

The illumination device 10 includes, for example, a lamp device such as a bulb-shaped lamp. In the case of a lamp device, a lighting circuit 12 is housed in a cylindrical housing, a light emitting module 11 is arranged on one end side of the housing, and a globe is arranged to cover the light emitting module 11, and the other end side of the housing is arranged. A base is placed on the The housing includes a metal housing, and the base includes an E17 type base or an E26 type base that can be connected to a socket for a general lighting bulb.

The light-emitting module 11 includes a module substrate 20, a light-emitting element 21 mounted on the module substrate 20, ferrite beads L1 and L2, capacitors C1 and C2, and a connector serving as an input section for lighting power from the lighting circuit 12. 22.

The module substrate 20 is made of a metal material such as aluminum. An insulating layer is formed on the mounting surface, which is one surface of the module substrate 20, and wiring patterns 23 are formed on this insulating layer. Light emitting element 21, ferrite beads L1 and L2, capacitors C1 and C2, and connector 22 are surface-mounted and electrically connected to wiring pattern 23, respectively.

The wiring pattern 23 includes a first wiring pattern 23a on the high potential side and a second wiring pattern 23b on the low potential side between the light emitting element 21 and the connector 22, and the second wiring pattern 23b and the ground side (FIG. 1). and a third wiring pattern 23c for connecting the side of the housing indicated by symbol A).

Although the module substrate 20 is shown in a rectangular shape in FIG. 1, in the case of a lamp device, it is formed in a circular shape and is arranged on one end side of the metal housing. mounted in a thermally connected state with a plurality of screws. Through this screw, the ground side of the third wiring pattern 23c is electrically connected to the metal housing (A in FIG. 1).

Moreover, the light emitting element 21 includes, for example, an LED. The LEDs are mounted, for example, on an element substrate, and are mounted and electrically connected on the wiring pattern 23 of the module substrate 20 by the element substrate, that is, across the first wiring pattern 23a and the second wiring pattern 23b. For the light emitting element 21, an SMD (Surface Mount Device) package or a COB (Chip On Board) module may be used, or a light emitting element other than the LED, such as an organic EL, may be used.

The light emitting element 21 has an anode on the positive electrode side (high potential side) and a cathode on the negative electrode side (low potential side). The anode side is connected to the first wiring pattern 23a, and the cathode side is connected to the second wiring pattern 23b. It is connected.

Also, the ferrite beads L1 and L2 are, for example, surface-mountable chip-type and are surface-mounted on the wiring pattern 23 of the module substrate 20 . One of the first ferrite beads L1 is connected in series to the anode side of the light emitting element 21 on the first wiring pattern 23a between the anode side of the light emitting element 21 and the + pole side of the connector 22. FIG. The second ferrite bead L2 is connected in series to the cathode side of the light emitting element 21 on the second wiring pattern 23b between the cathode side of the light emitting element 21 and the negative pole side of the connector 22. FIG. Ferrite beads L<b>1 and L<b>2 are connected at positions closer to connector 22 than light emitting element 21 . That is, the length of each wiring pattern 23a, 23b between the ferrite beads L1, L2 and the connector 22 is shorter than the length of each wiring pattern 23a, 23b between the ferrite beads L1, L2 and the light emitting element 21. It is in.

The graph of FIG. 2 shows the impedance characteristics of the ferrite beads L1 and L2. Ferrite beads L1 and L2 have the highest impedance peaks in the frequency range of 30 MHz to 1 GHz. Due to this impedance characteristic, conduction noise in the high frequency range of 30 MHz to 1 GHz superimposed on the lighting power supplied from the lighting circuit 12 to the light emitting module 11 is reduced. reduce radiated noise from 30 MHz to 1 GHz.

Radiation noise generated by conduction noise superimposed on the lighting power supplied from the lighting circuit 12 to the light emitting module 11 is mostly contained in the frequency range of 30 MHz to 100 MHz. It is preferable to use ferrite beads L1 and L2 having an impedance peak in the frequency range of 30 MHz to 100 MHz or in the vicinity of 100 MHz and having an impedance of 200Ω or more at a frequency of 30 MHz to 100 MHz.

Also, the capacitors C1 and C2 are mounted in series on the third wiring pattern 23c of the module substrate 20. As shown in FIG. One end sides of the capacitors C1 and C2 are connected to the second wiring pattern 23b between the cathode side of the light emitting element 21 and the ferrite bead L2 so as to be connected in series with the cathode side of the light emitting element 21. The other ends of C1 and C2 are electrically connected to the metal housing (A in FIG. 1), which is the ground side, through the wiring pattern portion 23c.

Capacitors C1 and C2 each have a capacitance in the range of 470 pF to 3300 pF, preferably 1000 pF. Since two capacitors are connected in series in the embodiment, the combined capacitance of the capacitors C1 and C2 should be in the range of 235 pF to 1650 pF, preferably 500 pF. The impedance corresponding to this capacitance reduces noise (including common mode noise) at a frequency of 9 kHz to 30 MHz, which is lower than the frequency of noise reduced by the ferrite beads L1 and L2. This is obtained from the results obtained by experiments that the use of capacitors C1 and C2 with capacitances in the range of 470 pF to 3300 pF can reduce noise at frequencies of 9 kHz to 30 MHz.

In the embodiment, two capacitors are used, but the configuration is not limited to this and one capacitor may be used. In one case the capacitor has a capacitance in the range 235 pF to 1650 pF, preferably 500 pF.

The connector 22 is mounted across the first wiring pattern 23a and the second wiring pattern 23b of the module substrate 20 and electrically connected.

The lighting circuit 12 receives AC power, which is external power supplied from an AC power supply E, which is an external power supply, converts the AC power into lighting power of a predetermined DC voltage for lighting the light emitting element 21 , and supplies the lighting power to the light emitting module 11 . do. The lighting circuit 12 includes a switching element such as a MOS-FET, and power conversion is performed by the switching operation of the switching element.

The lighting circuit 12 has a circuit board 30 on which a plurality of circuit elements are mounted. One end of the output wiring 31 is connected to the output side of the circuit board 30 for lighting power, and the connector 32 provided on the other end of the output wiring 31 is electrically connected to the connector 22 of the light emitting module 11 .

In the case of a lamp device, the lighting circuit 12 is housed in a housing, the input side of the lighting circuit 12 is electrically connected to the base, and the output wiring 31 of the lighting circuit 12 is led out to the mounting surface side of the module substrate 20 of the light emitting module 11 . The connector 32 of the output wiring 31 is electrically connected to the connector 22 of the light emitting module 11 .

In the case of a lamp device, the lighting device 10 is attached to a socket of a lighting fixture, and AC power from an AC power supply E is supplied from the socket to the lighting circuit 12 through a base.

When the AC power source E is turned on, the lighting device 10 converts the AC power into lighting power of a predetermined DC voltage by the lighting circuit 12 and supplies the lighting power to the light emitting module 11 . The lighting power supplied to the light emitting module 11 is supplied from the connector 22 to the light emitting element 21 through the ferrite beads L1 and L2, and the light emitting element 21 lights.

The inductance characteristics of the ferrite beads L1 and L2 of the light emitting module 11 reduce conduction noise in the high frequency range of 30 MHz to 1 GHz superimposed on the lighting power supplied from the lighting circuit 12 to the light emitting module 11, and reduce the conduction noise. is reduced, the radiation noise of 30 MHz to 1 GHz radiated from the wiring pattern 23 or the like as an antenna is reduced. Therefore, it is possible to meet the radiation noise standard of 30 MHz to 1 GHz established in Table 10 of the Electrical Appliances and Materials Safety Act in accordance with CISPR (International Special Committee on Radio Interference) 15.

Furthermore, the capacitors C1 and C2 of the light emitting module 11 reduce noise including common mode noise with a frequency of 9 kHz to 30 MHz, which is lower than the frequency of noise reduced by the ferrite beads L1 and L2, due to their inductance characteristics. Therefore, the influence on flickering of the light emitting element 21 can be suppressed.

As described above, since the light-emitting module 11 of the present embodiment includes the ferrite beads L1 and L2 connected in series to the light-emitting element 21, the lighting power supplied from the lighting circuit 12 to the light-emitting module 11 is superimposed on the lighting power. Conduction noise can be reduced, and the radiation noise radiated from the light emitting module 11 can be reduced by the reduction of the conduction noise.

Therefore, even when sufficient noise countermeasures cannot be taken by the lighting circuit 12 because the size of the lighting circuit 12 accommodated in the housing is limited, as in the case of a lamp device, the noise countermeasures can be taken by the light emitting module 11. .

Since the ferrite beads L1 and L2 have an impedance peak within the frequency range of 30 MHz to 1 GHz, the radiation noise of 30 MHz to 1 GHz emitted from the light emitting module 11 can be effectively reduced.

More preferably, the ferrite beads L1 and L2 have an impedance peak within a frequency range of 30 MHz to 100 MHz, or have an impedance peak near a frequency of 100 MHz, and have an impedance of 200Ω or more at a frequency of 30 MHz to 100 MHz. As a result, radiation noise of 30 MHz to 100 MHz, which is likely to be emitted from the light emitting module 11, can be effectively reduced.

Furthermore, since the ferrite beads L1 and L2 are connected in series to both the anode side and the cathode side of the light emitting element 21, respectively, the effect of reducing radiation noise from the light emitting module 11 can be enhanced.

Moreover, since the light-emitting module 11 includes the capacitors C1 and C2 connected in series between the light-emitting element 21 and the ground side, noise can be reduced by the impedance characteristics of the capacitors C1 and C2.

Furthermore, the capacitors C1 and C2 each have a capacitance in the range of 470 pF to 3300 pF, and the combined capacitance is 235 pF to 1650 pF. can effectively reduce noise in the low frequency range of 9 kHz to 30 MHz.

Therefore, the light-emitting module 11 can reduce noise in a wide range of frequencies by including the ferrite beads L1 and L2 and the capacitors C1 and C2, and can ensure noise countermeasures.

In addition, the ferrite beads L1 and L2 are connected at positions closer to the connector 22 than the light emitting element 21, that is, the lengths of the wiring patterns 23a and 23b between the ferrite beads L1 and L2 and the light emitting element 21 are longer than the lengths of the wiring patterns 23a and 23b. Since the lengths of the wiring patterns 23a and 23b between the ferrite beads L1 and L2 and the connector 22 are short, the radiation noise radiated from the wiring pattern 23 as an antenna can be reduced.

Note that the light emitting module 11 may include only one of the ferrite beads L1 and L2, and the radiation noise radiated from the light emitting module 11 can be reduced even if only one of the ferrite beads L1 and L2 is provided.

Further, the light emitting module 11 may connect a plurality of ferrite beads with small capacity to the first wiring pattern 23a and the like.

Also, one end sides of the capacitors C1 and C2 may be connected between the connector 22 and the ferrite bead L2, and connected in series to the cathode side of the light emitting element 21 via the ferrite bead L2. Also, one end sides of the capacitors C1 and C2 may be connected in series to the anode side of the light emitting element 21 . In either case, noise can be reduced.

In addition, the light-emitting module 11 is not limited to a lamp device, and can be applied to various lighting devices such as a lighting fixture installed on a ceiling or a wall surface, or a street light or a security light.

While several embodiments of the invention have been described, these embodiments have been presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and modifications can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the scope of the invention described in the claims and equivalents thereof.

REFERENCE SIGNS LIST 10 lighting device 11 light emitting module 12 lighting circuit 20 module substrate 21 light emitting elements C1, C2 capacitors L1, L2 ferrite beads

Claims (4)

a module substrate;
a light emitting element mounted on the module substrate;
a ferrite bead having an impedance peak at a frequency of 30 MHz to 1 GHz and connected in series with the light emitting element;
A light-emitting module comprising: 2. The light emitting module according to claim 1, further comprising a capacitor connected in series with said light emitting element. 3. The light-emitting module according to claim 1, wherein the capacitance of said capacitor is between 235pF and 1650pF. a light emitting module according to any one of claims 1 to 3;
a lighting circuit that supplies lighting power to the light emitting module;
A lighting device comprising:

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