JP2023045271A - game machine - Google Patents

Abstract

To provide a game machine with a reduced risk of its components being damaged.SOLUTION: In a state where a screw is firmly tightened without loosening and a substrate 400 is secured to a first case 710, the game machine is such that a dimension from a second surface of the substrate 400 to the tip of a lead component terminal is defined as a first dimension A, a dimension from the second surface of the substrate 400 to the tip of the screw head is defined as a second dimension B, and a dimension from the second surface of the substrate 400 to the top surface portion of a second case 720 is defined as a third dimension C. The third dimension C is greater than the second dimension B, and the second dimension B is greater than the first dimension A.SELECTED DRAWING: Figure 30

Description

The present invention relates to gaming machines.

As a gaming machine, a pachinko gaming machine is known which includes a game area in which game balls (game value) move, a shooting device for shooting game balls into the game area, and the like. The pachinko game machine has a starter opening provided in a game area, and when entry of a game ball into the starter opening is detected, a special symbol lottery is performed. When the result of the special symbol lottery is a jackpot, the game state shifts to the special game state, and the special game is executed a plurality of times in the special game state. In each special game, the big winning opening provided in the game area operates in an open state, and the game ball is paid out based on the entry of the game ball into the big winning opening.

Also, as a game machine, a slot machine is known which includes a plurality of reels having a plurality of patterns arranged on the outer peripheral surface, a start lever, a stop button, and the like. In the slot machine, reels start rotating based on a game start operation, and an internal lottery using a lottery table is performed. When each reel stops, the symbol combination corresponding to the winning combination won in the internal lottery is displayed, and when the winning combination wins, as processing corresponding to the winning combination, for example, medals (game value) are paid out. A medal payout process, a replay process that enables the game to be played again without consuming new medals, and the like are performed.

2. Description of the Related Art Gaming machines such as slot machines and pachinko gaming machines are equipped with a substrate unit that accommodates a substrate on which various electronic components are arranged (see, for example, Patent Document 1).

JP 2021-74049 A

By the way, in game machines, it is required to reduce the risk of parts being damaged.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a gaming machine in which the risk of damage to parts is reduced.

In order to achieve the above object, the gaming machine of the present invention
comprising a board, a board case, and a screw,
The substrate case includes a first case covering a first surface side of the substrate and a second case covering a second surface side of the substrate,
The board is fixed to the first case by inserting the screw from the second surface side and screwing it to the board mounting portion of the first case,
The terminal of the electronic component inserted from the first surface side of the substrate protrudes from the second surface by a predetermined length,
The electronic component is visible through the top surface of the first case facing the first surface of the substrate,
Through the top surface of the second case facing the second surface of the substrate, the terminal of the electronic component and the head of the screw are visible,
In a state in which the screw is tightened without loosening and the board is fixed to the first case,
A dimension from the second surface of the substrate to the tip of the terminal of the electronic component is defined as a first dimension,
A dimension from the second surface of the substrate to the tip of the head of the screw is defined as a second dimension,
Assuming that the dimension from the second surface of the substrate to the top surface of the second case is the third dimension,
the third dimension being greater than the second dimension;
The second dimension is greater than the first dimension.

According to this configuration, in a state in which the screw is tightened without loosening and the substrate is fixed to the first case, the third dimension is larger than the second dimension, and the second dimension is larger than the first dimension. Therefore, the tip of the head of the screw and the tip of the terminal of the lead component do not come into contact with the top surface of the second case. As a result, it is possible to prevent damage to the second case, the lead parts, and the like.

Further, in the configuration of the present invention, a fourth dimension is a dimension from the tip of the head of the screw to the top surface of the second case, and a fifth dimension is the length of the screw inserted into the board mounting portion. As for dimensions, the fifth dimension is larger than the fourth dimension.

According to this configuration, since the fifth dimension is larger than the fourth dimension, if the tightening of the screw is loosened, the screw moves toward the top surface of the second case, and the Even when the head of the screw comes into contact with the top surface of the second case and the fourth dimension=0, the fifth dimension>0. Therefore, even when the head of the screw comes into contact with the top surface of the second case, the screw is inserted into the board mounting portion by a predetermined amount, and the screw falls out of the board mounting portion. I have nothing to do. Therefore, the terminal of the lead component does not come into contact with the top surface of the second case when the screw falls off (because the screw does not exist). This prevents the lead component from contacting the top surface of the second case and detaching from the substrate or damaging the lead component when the tightening of the screw is loosened. be able to.

ADVANTAGE OF THE INVENTION According to this invention, a possibility that components may be damaged can be reduced.

BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective view which shows an example of the game machine which concerns on embodiment of this invention, and shows the external structure. It is a front view showing the external configuration of the game board of the same. It is a front view which shows the appearance structure of a state display part equally. It is a block diagram showing a schematic configuration of the gaming machine. Similarly, it is a state transition diagram of a game state. Similarly, it is a perspective view of the payout control board unit viewed from the surface side. Similarly, it is a perspective view of the payout control board unit viewed from the surface side. It is a figure for demonstrating a seal|sticker sticking area|region similarly. It is a figure for demonstrating the seal|sticker stuck on a board|substrate case equally. FIG. 10 is a diagram for explaining a mounting portion of a part that is not mounted at the time of mass production; FIG. 10A is a view showing the appearance of a main IC of a gaming machine according to a second embodiment, FIG. 1A being a view from the top side, and FIG. . Fig. 3 shows the same socket, in which (a) is a view from the top side, (b) is a view from the lateral direction, and (c) is a view from the bottom side. . Fig. 3 shows socket terminals of the same, wherein (a) is a diagram showing a socket terminal with odd pin numbers, (b) is a diagram showing a socket terminal with even pin numbers, and (c) is a diagram showing a socket. It is a figure which shows the positional relationship of the socket terminal Q shown to (a) and (b) in the state hold|maintained by the main body. It is a top view which shows the through-hole to which the terminal of a socket is joined similarly. It is a figure which shows the relationship between the clearance gap and solder fillet which are formed between the mounting surface and the bottom surface of the socket. Fig. 10 is a view for explaining a gap formed between the socket and the main IC or the substrate, in which (a) is a view of the socket viewed from the top side, and (b) is a view of the socket viewed from the bottom side; It is the figure seen from. Fig. 10(a) is a longitudinal view of the socket, the main I, and the substrate for explaining the relationship between the gap formed between the socket and the main IC or the substrate and the ground pattern; It is a figure and (b) is the figure which looked at the socket, the main IC, and the board|substrate from the top surface side. It is a figure which shows a connector equally. It is a figure which shows the socket which concerns on a modification similarly, (a) is the figure seen from the bottom face side, (b) is sectional drawing seen from the longitudinal direction. It is the figure which looked at the payout control board of the game machine concerning a 3rd embodiment from the surface side. Similarly, it is the figure which looked at the payout control board which concerns on a modification from the surface side. Similarly, it is the figure which looked at the gaming machine from the back side. It is an exploded perspective view showing a payout control board unit of a gaming machine according to a fourth embodiment of the present invention. It is a schematic diagram showing the first surface of the substrate of the same. It is a schematic diagram showing the first surface of the substrate of the same. It is the perspective view which looked at the board|substrate case from the back side equally. FIG. 4 is a schematic view of the second surface of the substrate, in which (a) shows a state in which the screw is not inserted into the through-hole, and (b) shows a state in which the screw is inserted into the through-hole; is. It is a perspective view which shows the part in which the recessed part in a board|substrate case is provided equally. It is a partial enlarged view showing the surroundings of a predetermined through hole in the substrate. It is a schematic sectional drawing which shows the state by which the board|substrate is fixed to the board|substrate case equally. FIG. 11 shows parts arranged on a board of a gaming machine according to a fifth embodiment of the present invention, where (a) shows the state before forming, and (b) shows the state after forming. be. Also, (c) shows a state in which the ends of the leads are bent after being placed on the substrate. It is a schematic side view of a part of the substrate of the same, in which (a) shows the state before the lead of the first component is bent, and (b) shows the state after the lead of the first component is bent. It indicates the state. 3A and 3B are schematic diagrams of a portion of the substrate viewed from the direction normal to the substrate surface, where (a) shows the state before the leads of the first component are bent, and (b) the leads of the first component are bent. It shows the state after It is the schematic which looked at some board|substrates from the side equally.

(First embodiment)
A first embodiment of the present invention will be described below with reference to the drawings. In this embodiment, a pachinko game machine, which is one of game machines, will be described, but other game machines may be used. In the following description, "front and back" basically means that the player is "front" and the gaming machine is "back" when the player is in front of the gaming machine, and "up and down" means that the game is played. The top side of the machine means 'up' and the bottom side means 'down', and 'left and right' means 'left' for the left hand side of the player playing the machine and 'right' for the right hand side.

FIG. 1 is a perspective view showing the external configuration of the gaming machine according to this embodiment. The gaming machine of the present embodiment performs a game using game balls (game media) rented from a gaming arcade. , a game board 6 that forms a game area 4 in which game balls move, an inner frame 7 that holds the game board 6, a glass unit 8 that makes the game board 6 visible and inaccessible to the player, and a glass unit. It has a front frame 10 to which 8 is attached. The inner frame 7 is attached to the outer frame 2 via a hinge mechanism so that it can be opened and closed. Also, the front frame 10 is attached to the inner frame 7 via a hinge mechanism so as to be openable and closable. The inner frame 7 (and the front frame 10) can be opened and closed between a closed position (closed state) that blocks the opening of the outer frame 2 and an open position (open state) that opens the opening of the outer frame 2. It's becoming

A portion of the front frame 10 surrounding the glass unit 8 is made of a translucent material that transmits light. A plurality of front frame lamps 12 for outputting are provided. Speakers 14 (acoustic devices) are provided on the left and right of the upper part of the front frame 10 and on the left and right of the lower part of the front frame 10 for outputting dramatic sounds for exciting the game.

An upper plate 16 for storing game balls is provided in the lower center of the front frame 10, and a left part of the inner side surface of the upper plate 16 is for paying out game balls from the game machine to the player. A payout port 18 is provided. In addition, a grip unit 20 is provided on the lower right side of the front frame 10. When the player performs an operation to rotate the grip unit 20 clockwise toward the gaming machine, a A shooting device that does not operate is activated to shoot game balls into the game area 4.例文帳に追加The shooting device of this embodiment can shoot 99 game balls per minute (1.65 game balls per second).

A supply port 22 for supplying game balls from the upper plate 16 to the shooting device is provided on the right side of the inner side surface of the upper plate 16 . A lower tray 24 is provided below the upper tray 16 for storing surplus game balls when the upper tray 16 cannot store all the game balls.

In addition, an effect button 26 (effect operation means) is provided on the front side of the edge of the upper tray 16, and when the player operates the effect button 26, the effect performed by the game machine changes.

FIG. 2 is a front view showing the external configuration of the game board 6 shown in FIG. As shown in FIG. 2, the game board 6 is provided with a circular outer rail 28, and an area surrounded by the outer rail 28 serves as a game area 4 in which game balls move. In addition, at the left end of the game area 4, an inner rail 30 is provided in an arc shape along the outer rail 28. The outer rail 28 and the inner rail 30 are provided below the game board 6 (not shown). A game ball shot from a shooting device is guided to a game area 4. - 特許庁

At the center of the game board 6, a liquid crystal display 32 (a performance display device) for displaying performance images for exciting the game, and a performance unit 36 having a display frame 34 formed so as to surround the liquid crystal display 32 are provided. It is A display frame lamp 38 is provided in the display frame 34 above the center of the liquid crystal display 32 to output effect light or the like for livening up the game.

In this embodiment, the game ball cannot pass through the front side of the liquid crystal display 32, and the game ball shot from the shooting device falls in the left game area 4a or the right game area 4b of the liquid crystal display 32. It is designed to Also, in the game area 4, a large number of game nails (not shown) are nailed so as to intersect the surface of the game board 6, so that the moving direction of the game ball moving in the game area 4 changes at random. there is

In addition, an opening 40 is formed in the left part of the display frame 34 through which game balls falling in the game area 4a on the left side of the liquid crystal display 32 can pass. It passes through the passage 42 and falls onto a stage 44 provided below the liquid crystal display 32 . The upper surface of the stage 44 is a smoothly curved surface, and a gap is formed between the stage 44 and the glass unit 8 to allow game balls to fall downward from the stage 44, and drop onto the stage 44 from the passage 42. After the game ball hits the stage 44 and reciprocates left and right, it falls downward from the vicinity of the central portion of the stage 44. - 特許庁

Below the central portion of the stage 44, there is provided a first starting port 46 into which game balls that have fallen downward from the vicinity of the central portion of the stage 44 can enter. A first starter switch 100 (see FIG. 4) is arranged in the first starter 46 to detect a game ball entering the first starter 46 . The first start port switch 100 outputs a detection signal to the main control board 200 when detecting a game ball (entering the game ball into the first start port 46). Also, the main control board 200 executes a first special symbol lottery as a special symbol lottery based on the input of the detection signal from the first starter switch 100 . Further, the main control board 200 causes the payout device 130 to pay out prize balls based on the input of the detection signal from the first start port switch 100 . Also, the game ball that has entered the first starting port 46 is collected inside the game machine.

A plurality of (three) general winning openings 47 (upper left general winning opening 47a, middle left general winning opening 47b and lower left general winning opening 47c) are provided to the left of the first starting opening 46 in the game area 4. . In addition, the game board 6 is provided with a general winning slot switch 101 (see FIG. 4) for detecting a game ball entering the upper left general winning slot 47a, the middle left general winning slot 47b, or the lower left general winning slot 47c. there is General winning a prize mouth switch 101, when detecting a game ball (entrance of the game ball to the upper left general winning a prize mouth 47a, left middle general winning a prize mouth 47b or lower left general winning a prize mouth 47c), a detection signal to the main control board 200 Output. In addition, the main control board 200 causes the payout device 130 to perform a prize ball payout operation based on the input of the detection signal from the general prize winning port switch 101 . Incidentally, one general prize winning port switch 101 may be provided for each of the upper left general prize prize port 47a, the middle left general prize prize port 47b, and the lower left general prize prize port 47c. Only one may be provided for each. In addition to the upper left general winning opening 47a, the middle left general winning opening 47b and the lower left general winning opening 47c, the general winning opening 47 and the general winning opening switch corresponding to this general winning opening may be provided.

In addition, in the game area 4b on the right side of the liquid crystal display 32, there is provided a passage gate 48 through which game balls pass without being collected inside the game machine. Also, a gate switch 102 (see FIG. 4) is arranged in the passage gate 48 for detecting that a game ball has passed. The gate switch 102 outputs a detection signal to the main control board 200 when a game ball (passage of the game ball through the passage gate 48) is detected. In addition, the main control board 200 executes a normal symbol lottery for determining whether or not a normal hit is won based on the input of the detection signal from the gate switch 102 .

A second starting port 49 is provided below the passage gate 48 in the game area 4 b on the right side of the liquid crystal display 32 . Further, in the second starting port 49, a second starting port switch 103 (see FIG. 4) for detecting a game ball entering the second starting port 49 is arranged. The second starting port switch 103 outputs a detection signal to the main control board 200 when detecting a game ball (entering the game ball into the second starting port 49). Also, the main control board 200 executes a second special symbol lottery as a special symbol lottery based on the input of the detection signal from the second starting port switch 103 . Further, the main control board 200 causes the payout device 130 to pay out prize balls based on the input of the detection signal from the second start port switch 103 . Also, the game ball that has entered the second starting port 49 is collected inside the game machine.

In the second starting port 49, there are a reduced state (state that does not assist entry, non-assisted state) in which game balls are difficult to enter into the second start port 49, and an expanded state (state that assists entry, non-assisted state) in which game balls easily enter. state) is provided. The normal accessory 54 incorporates a driving device such as a solenoid, and is controlled to be in an enlarged state under a predetermined condition when a normal winning is won in a normal symbol lottery.

Also, in the game area 4b on the right side of the liquid crystal display 32, a big winning opening 50 is provided. In addition, a count switch 104 (see FIG. 4) for detecting a game ball that has entered the big winning hole 50 is arranged in the big winning hole 50 . The count switch 104 outputs a detection signal to the main control board 200 when detecting a game ball (entering the game ball into the big winning hole 50). In addition, the main control board 200 causes the payout device 130 to perform the payout operation of prize balls based on the input of the detection signal from the count switch 104 . In addition, the main control board 200 counts the number of game balls entering the big winning hole 50 based on the detection signal input from the count switch 104 . Also, the game ball that has entered the big winning hole 50 is collected inside the game machine.

The big winning hole 50 has a closed state (second state, non-enterable state) in which game balls cannot enter the big winning hole 50, and an open state (first state, enterable state) in which game balls can enter. A special accessory 56 is provided operable therebetween. The special accessory 56 incorporates a driving device such as a solenoid, and is opened under predetermined conditions in a special game state that starts when a big win is won in a special symbol lottery (first special symbol lottery or second special symbol lottery). state is controlled.

In addition, at the bottom of the game area 4, an out port 62 is provided for collecting game balls that have fallen in the game area 4 without entering any of the winning openings 46, 47, 49, 50 into the gaming machine. there is Here, a discharge path (not shown) through which game balls collected (discharged) from the game area 4 pass is provided inside the game machine. This game machine is configured such that all game balls launched into the game area 4 (all game balls collected from the game area 4) pass through the discharge path. That is, the game ball hit into the game area 4 is collected from the game area 4 and flows into the discharge path by entering one of the winning openings 46, 47, 49, 50 or passing through the out opening 62.例文帳に追加Specifically, the game balls that have entered the respective winning openings 46, 47, 49, 50 are guided to the discharge path after being detected by the switches 100, 101, 103, 104 provided in the winning openings. . Also, the game balls collected from the out port 62 are guided to the discharge path. In addition, an out switch 106 (see FIG. 4) is arranged in the discharge path. The out switch 106 outputs a detection signal to the main control board 200 when detecting a game ball passing through the discharge path (discharge of the game ball from the game area 4). Further, the main control board 200 counts the number of game balls ejected from the game area 4 based on the detection signal input from the out switch 106 .

The game ball shooting device is constructed so that the game ball shooting force can be changed by adjusting the amount of rotation of the grip unit 20 shown in FIG. Game balls are shot so as to fall in the game area 4a on the left side of the display 32, and when the amount of rotation of the grip unit 20 is large, the game balls fall in the game area 4b on the right side of the liquid crystal display 32. A game ball is launched.

Therefore, the player adjusts the amount of rotation of the grip unit 20 according to the game situation, and the game ball falls down the left game area 4a, or passes through the opening 40, the passage 42 and the stage 44 to the first starting port. A game ball is shot so as to win a prize 46 (left hitting), the game ball falls through the game area 4b on the right side, and the game ball passes through the passage gate 48, or the game is played to the second start port 49. A game ball is shot so that the ball wins or the game ball wins the big prize opening 50 (right hitting).

In addition, in the gaming machine of the present embodiment, when the game ball falls in the left game area 4a, the game ball does not pass through the passage gate 48, and the game ball enters the second start opening 49 and the big winning opening 50. The ball is designed not to enter (win a prize). Further, when the game ball falls in the right game area 4b, the game ball does not enter the first starting hole 46, the upper left general winning hole 47a, the middle left general winning hole 47b and the lower left general winning hole 47c. It's like

At the lower right portion of the game board 6 and outside the game area 4, there is provided a state display section 70 that indicates various states of the game machine by lighting and extinguishing lamps and the like.

FIG. 3 is a front view showing the external configuration of the state display section 70. As shown in FIG. As shown in FIG. 3, the state display portion 70 includes a normal symbol display portion 72, a normal reservation display portion 74, a first special symbol display portion 76, a first special reservation display portion 78, a second special symbol display portion 80, a 2 A special hold display section 82 and a game state display section 84 are provided.

The normal symbol display part 72 is composed of two lamps, and when the normal symbol lottery is performed, the normal symbols are variably displayed by flickering the two lamps, and the normal symbols are displayed by lighting or extinguishing the two lamps. A stop display is performed to display the result of the normal symbol lottery.

The normal holding display part 74 is composed of two lamps, and acquires a normal symbol lottery random number when the normal symbol is already being displayed in a variable or stopped manner when the game ball passes through the passage gate 48.例文帳に追加When the normal symbol lottery random number value is reserved due to the fact that the normal symbol lottery cannot be performed even if the A combination of turning on or off or blinking the two lamps displays 0 to 4 normal pending numbers.

The first special symbol display part 76 is composed of a 7-segment display, and when the first special symbol lottery is performed by entering the game ball into the first starting port 46, the 7-segment display flashes to display the first symbol. A special pattern is variably displayed, a 7-segment display is lit in one of a plurality of types of modes, a first special pattern is stop-displayed, and a result of a first special pattern lottery is displayed.

The first special holding display part 78 is composed of two lamps, and when the game ball enters the first starting port 46, the first special symbol or the second special symbol is already displayed in a variable display or in a stopped display. When the special symbol lottery random number is reserved as the first special random number because the special symbol lottery cannot be performed even if the special symbol lottery random number (lottery information) is acquired, etc., it is reserved. It displays the first special reserved number corresponding to the number of the first special random number, and displays 0 to 4 first special reserved numbers by a combination of lighting, extinguishing, or blinking the two lamps. .

The second special symbol display unit 80 is composed of a 7-segment display, and when the second special symbol lottery is performed by entering the game ball into the second starting port 49, the 7-segment display flashes to display the second symbol. A special pattern is variably displayed, a 7-segment display is lit in one of a plurality of types of modes, a second special pattern is stop-displayed, and a result of a second special pattern lottery is displayed.

The second special holding display part 82 is composed of two lamps, and when the game ball enters the second start port 49, the first special symbol or the second special symbol is already displayed in a variable display or in a stopped display. If the random number for the special symbol lottery is reserved as the second special random number due to the fact that the special symbol lottery cannot be performed even if the random number for the special symbol lottery is acquired, the second special random number that is reserved The second special reserved number corresponding to the numerical value is displayed, and the second special reserved number of 0 to 4 is displayed by a combination of lighting, extinguishing, or blinking the two lamps.

The game state display section 84 is composed of six lamps, and displays the currently set game state type by a combination of lighting, extinguishing, or blinking of the six lamps. In this embodiment, a normal state (low probability state), a probability variable state (high probability state/special state) in which the probability of winning a jackpot is set higher than the normal state, and a jackpot in a special symbol lottery will start. It is possible to set four types of game states, namely, a special game state and a time-saving state (special state) in which the fluctuation time of the first special pattern or the second special pattern is shortened to frequently come the opportunity to execute the special pattern lottery. Which game state is set is displayed by a combination of lighting, extinguishing, or blinking of the six lamps.

FIG. 4 is a functional block diagram of the gaming machine of this embodiment. The gaming machine of this embodiment is controlled by control boards including a main control board 200 (main control means) and a sub-control board 202 (sub-control means). The functions of each board such as the main control board 200 and the sub-control board 202 are implemented by hardware such as various processors (CPU, DSP, etc.), ASIC (gate array, etc.), ROM (an example of information storage medium), or RAM. It is realized by software consisting of a given program pre-stored in a ROM or the like.

The main control board 200 controls the progress of the game. The main control board 200 receives an input signal from an input means such as a first starting port switch 100, a general winning port switch 101, a gate switch 102, a second starting port switch 103, a count switch 104, or an out switch 106, and plays a game. , and based on the results of the calculations, the state display unit 70, the normal accessory 54, the special accessory 56, or the output means such as the payout device 130 is controlled.

The sub control board 202 controls execution of effects based on information transmitted from the main control board 200 . The sub-control board 202 receives a signal sent from the main control board 200 and an input signal from the effect button switch 150 that detects the operation of the effect button 26, and executes effects according to the progress of the game. , and based on the results of the calculations, the operations of the liquid crystal display 32, the illumination device, the speaker 14, the performance driving device, and other performance devices are controlled.

The main control board 200 includes random number generation means 210, normal symbol lottery means 220, normal display control means 222, normal role item control means 224, special symbol lottery means 230, special display control means 240, game state transition control means 250, special It includes game execution means 260 , payout instruction means 270 , communication control means 280 and main memory 290 .

The random number generating means 210 is a means for generating random numbers for lottery, and is implemented by a random number generator for generating hardware random numbers or a program for generating software random numbers. A software random number can be generated, for example, based on the count value of an increment counter (a counter that counts numerical values so as to cycle through a predetermined count range). In this embodiment, "random value" includes not only a value that is randomly generated in a mathematical sense, but also a substantially It also includes values that can function as random numbers.

The normal symbol lottery means 220 acquires a normal symbol lottery random value from the random number generation means 210 on the basis of the detection signal being input from the gate switch 102 for detecting game balls passing through the passage gate 48 one by one. Then, a normal symbol lottery is performed to determine whether or not a normal win is possible with respect to the normal symbol lottery random number read out from the normal random number storage means 2912 of the main memory 290.例文帳に追加Specifically, the normal symbol lottery means 220 performs a normal winning determination process or the like as a normal symbol lottery.

The normal hit determination process is a process of determining the propriety of the normal hit. In the normal winning determination process, the normal symbol lottery means 220 refers to any normal symbol lottery table among a plurality of types of normal symbol lottery tables stored in the lottery table storage means 2910 of the main memory 290, and performs random number determination processing. is selected according to the game state. Here, in each normal symbol lottery table, each of 100 normal symbol lottery random numbers from 0 to 99 is associated with a normal win or a loss. Then, the normal symbol lottery means 220 refers to the selected normal symbol lottery table and determines whether or not one normal symbol lottery random number read from the normal random number storage means 2912 is associated with a normal hit. Thus, it is determined whether or not the normal winning is won. Then, the normal symbol lottery means 220 sets the winning flag of the normal win in the ON state in the flag storage means 2916 of the main memory 290 when the normal win is won, and when it becomes a loss, the normal win. is set to OFF state.

In addition, the normal symbol lottery table selected when the game state is the probability variable state or the time saving state wins a normal hit as compared with the normal symbol lottery table selected when the game state is neither the probability variable state nor the time saving state. High probability is set. In other words, the normal symbol lottery performed when the game state is the probability variable state or the time saving state has a higher probability of winning a normal hit than the normal symbol lottery performed when the game state is neither the probability variable state nor the time saving state. It's becoming

The normal display control means 222 is means for controlling the display of the state display section 70 based on the lottery result of the normal symbol lottery, and performs normal symbol display control processing and normal reserved display control processing.

In the normal symbol display control process, the normal display control means 222 variably displays the normal symbol by blinking the two lamps of the normal symbol display unit 72 until a predetermined variation time elapses, and normal in the normal winning determination process. The normal pattern display part 72 is caused to display the result of the normal pattern lottery by stopping and displaying the normal pattern by lighting or extinguishing two lamps of the normal pattern display part 72 according to whether or not the win is won. .

Specifically, in this embodiment, when the game state at the time when the normal symbol lottery is performed is neither the probability variable state nor the time saving state, the normal symbol fluctuation time is set to 20 seconds, and the normal symbol lottery is performed. When the game state at the time of winning is the probability variable state or the time saving state, the fluctuation time of the normal symbol is set to 1 second, and the case where the game state is the probability variable state or the time saving state is better. , The execution opportunity of the normal symbol lottery comes frequently.

In the normal reservation display control process, the normal display control means 222 turns on or off the two lamps of the normal reservation display section 74 according to the number of random number values for normal symbol lottery stored in the normal random number storage means 2912. A blinking combination displays 0 to 4 normal pending numbers.

The normal role control means 224 is means for controlling the normal role 54 based on the lottery result of the normal symbol lottery. When the game state is neither the probability variable state nor the time saving state, the normal role product control means 224 is normally displayed until 0.1 seconds pass, triggered by the stop display of the normal symbol in the mode indicating the winning of the normal winning. Control is performed to operate the normal role object 54 so that the role object 54 returns to the reduced state after being in the enlarged state. In addition, when the game state is the probability variable state or the time saving state, the normal role product control means 224 is normally displayed until 20 seconds pass, triggered by the stop display of the normal symbol in the mode indicating the winning of the normal hit. Control is performed to operate the normal role object 54 so that the role object 54 returns to the reduced state after being in the enlarged state.

Therefore, when normal winning is achieved in the normal symbol lottery, if the game state is neither the probability variable state nor the time saving state, the normal accessory 54 is arranged so that the ease of entry of the game ball into the second start port 49 hardly increases. operates, but if the game state is a probability variable state or a time-saving state, the normal accessory 54 operates so as to increase the ease with which the game ball enters the second starting port 49 .

The special symbol lottery means 230 selects the special symbol lottery from the random number generation means 210 based on the detection signal input from the first start port switch 100 for detecting the game balls entering the first start port 46 one by one. A random number value is acquired and stored in the special random number storage means 2914 of the main memory 290 as a first special random number value. In addition, the special symbol lottery means 230 receives a detection signal from the second start port switch 103 for detecting game balls entering the second start port 49 one by one, and the special symbol from the random number generation means 210. A lottery random number is acquired and stored in the special random number storage means 2914 as a second special random number. Then, the special symbol lottery means 230 uses the first special random number value or the second special random number value read out from the special random number storage means 2914 to perform a special symbol lottery for determining whether or not a big hit is won. Specifically, the special symbol lottery means 230 performs a big hit determination process, a symbol determination process, etc. as a special symbol lottery.

The big hit determination process is a process of reading out one big hit determination random number value contained in the first special random number value or the second special random number value stored in the special random number storage means 2914, and determining whether or not the big win is won. Here, one jackpot determination random number is obtained from 65536 jackpot determination random numbers of 0 to 65535 based on the detection signal being input from the first starter switch 100 or the second starter switch 103. , is stored in the special random number storage means 2914 as the first special random number value or the second special random number value.

In the big-hit determination process, the special symbol lottery means 230 refers to which of a plurality of types of big-hit lottery tables stored in the lottery table storage means 2910 of the main memory 290 to perform the random number determination process according to the game state. to select. Here, in each big-hit lottery table, each of 65536 big-hit determination random numbers from 0 to 65535 is associated with a big hit or a loss. Then, the special symbol lottery means 230 refers to the selected big win lottery table and judges whether or not one read-out big win determination random number value is associated with the big win, thereby determining whether or not the big win has been won. to decide. In addition, the special symbol lottery means 230 sets the winning flag of the big win in the ON state in the flag storage means 2916 when the big win is won, and sets the winning flag of the big win to the OFF state when the loss occurs. to set

The jackpot lottery table selected when the game state is the variable probability state is set to have a higher probability of winning the jackpot than the jackpot lottery table selected when the game state is the normal state or the time-saving state. there is In other words, the jackpot determination process (special symbol lottery) performed when the game state is the variable probability state is compared to the jackpot determination process (special symbol lottery) performed when the game state is normal or in a time-saving state. You have a higher chance of winning.

The symbol determination process is a process performed when a big hit is won in the jackpot determination process. It is a process of reading numerical values and determining which one of the 16-round probability variation pattern, the 4-round probability variation pattern, the 16-round normal pattern, and the 4-round normal pattern as the jackpot pattern (type of jackpot). Here, one symbol determination random value is obtained from 100 symbol determination random values of 0 to 99 based on the detection signal input from the first start switch 100 or the second start switch 103, It is stored in the special random number storage means 2914 as the first special random number or the second special random number.

In the symbol determination process, the special symbol lottery means 230 refers to one of the plurality of types of symbol lottery tables stored in the lottery table storage means 2910 to perform the random number determination process. A selection is made depending on whether the number was stored as the first special random value or the second special random value. Here, each symbol lottery table corresponds to each of the 100 symbol determination random numbers from 0 to 99, one of 16 round probability variable symbols, 4 round probability variable symbols, 16 round normal symbols, and 4 round normal symbols. It is attached. Then, the special symbol lottery means 230 refers to the selected symbol lottery table and determines to which one of the plurality of types of jackpot symbols the one read symbol determination random number value is associated. It determines which of the jackpot symbols has been won. In addition, the special symbol lottery means 230 sets the winning flag corresponding to the winning jackpot symbol in the flag storage means 2916 to the ON state.

The special display control means 240 is a means for controlling the display of the state display unit 70 based on the lottery result of the special symbol lottery, and includes a first special symbol display control process, a second special symbol display control process, and a first special hold. Display control processing and second special hold display control processing are performed.

The first special symbol display control process is a process performed when the first special random number value is read out from the special random number storage means 2914 and a special symbol lottery is performed. Until the time elapses, the 7-segment display of the first special symbol display part 76 is blinked to variably display the first special symbol, and then the 7-segment display of the first special symbol display part 76 is lit in a predetermined manner. By doing so, the first special symbol is stopped and displayed.

In this embodiment, the display mode of the 7-segment display is predetermined corresponding to each of the four types of jackpot symbols and losses, and the special display control means 240 determines whether or not the jackpot has been won in the jackpot determination process. The 7-segment display of the first special symbol display part 76 is lit up in a mode corresponding to the jackpot, and in a mode corresponding to the jackpot pattern determined in the pattern determination process when the jackpot is won in the jackpot determination process. The special symbols are stopped and displayed, and the result of the special symbol lottery is displayed on the first special symbol display part 76.例文帳に追加

The second special symbol display control process is a process performed when the second special random number value is read out from the special random number storage means 2914 and a special symbol lottery is performed. Until the time elapses, the 7-segment display of the second special symbol display part 80 is blinked to variably display the second special symbol, and then the 7-segment display of the second special symbol display part 80 is lit in a predetermined manner. By doing so, the second special symbol is stopped and displayed.

Then, the special display control means 240 is in a mode according to whether or not the big win is won in the big win determination process, and in a mode according to the big win pattern determined in the pattern determination process when the big win is won in the big win determination process. Then, by lighting the 7-segment display of the second special symbol display part 80, the second special symbol is stopped and displayed, and the result of the special symbol lottery is displayed on the second special symbol display part 80.例文帳に追加

In the first special pending display control process, the special display control means 240 lights the two lamps of the first special pending display section 78 according to the number of the first special random number values stored in the special random number storage means 2914. Or 0 to 4 first special reserved numbers are displayed by a combination of extinguishing or blinking.

In the second special pending display control process, the special display control means 240 turns on the two lamps of the second special pending display section 82 according to the number of the second special random number values stored in the special random number storage means 2914. Alternatively, 0 to 4 second special reserved numbers are displayed by a combination of extinguishing or blinking.

Game state transition control means 250, as shown in FIG. 5, based on the establishment of a predetermined transition condition, normal state, special game state, probability variable state, game state transition control processing to shift the game state between the time-saving state I do. As for the game state transition condition, one condition may be defined, or a plurality of conditions may be defined. When a plurality of conditions are defined, the game state is changed based on the satisfaction of one of the plurality of predetermined conditions or the satisfaction of all of the plurality of predetermined conditions. It is possible to move to another game state.

The normal state is a game state corresponding to the initial state among a plurality of types of game states, and it is possible to shift from the normal state to the special game state. In a normal state, a normal pattern lottery is performed with reference to a normal pattern lottery table in which the probability of winning a normal win is set to about 1/20, and a big win lottery table in which a probability of winning a big win is set to 1/319 is used. A special pattern lottery is performed with reference to this.

In the normal state, the normal winning probability in the normal symbol lottery is as low as about 1/20, and the fluctuation time of the normal symbols is set long, and the period during which the normal accessory 54 is in the enlarged state is 0.00. Since it is as short as 1 second, it is difficult for the game ball to enter the second starting port 49.例文帳に追加

The special game state is started based on winning the jackpot in the special symbol lottery in the normal state, the probability variable state or the time saving state, and the special game of the number of rounds (the number of executions) predetermined according to the type of the jackpot symbol. Terminates when executed.

Specifically, when the special game state is started based on the fact that the winning flag of the 16 round probability variation pattern is set to the ON state in the special symbol lottery, the special game of 16 rounds from the 1st round to the 16th round is performed. The special game state ends on the condition that it is executed.

In addition, when the special game state is started based on the fact that the winning flag of the 4 round probability variation pattern is set to the ON state in the special symbol lottery, the special game of 4 rounds from the 1st round to the 4th round is executed. Under the condition that the special game state ends.

Further, when the special game state is started based on the fact that the win flag of the 16th round normal pattern is set to the ON state in the special symbol lottery, the 16th round special game from the 1st round to the 16th round is executed. Under the condition that the special game state ends.

Further, when the special game state is started based on the fact that the winning flag of the 4th round normal pattern is set to the ON state in the special symbol lottery, the 4th special game of the 1st round to the 4th round is executed. Under the condition that the special game state ends.

The probability variation state is started when the special game state started based on the fact that the winning flag of the 16 round probability variation pattern or the 4 round probability variation pattern (probability variation pattern) is set to the ON state, and is started from the probability variation state. can transition to a special game state or normal state. In addition, in the variable probability state, the normal pattern lottery is performed with reference to the normal pattern lottery table in which the normal winning probability is set to about 19/20, and the big winning lottery table in which the big winning winning probability is set to 1/31. is more advantageous to the player than in the normal state in that the special symbol lottery is performed with reference to . Then, the variable probability state ends under the condition that the number of times the special symbol lottery is performed in the variable probability state reaches 9999 times, and shifts to the normal state.

Specifically, the game state transition control means 250 writes a value (e.g., 9999) corresponding to a predetermined number of games (e.g., 9999 times) to the variable probability end determination counter 2930 of the main memory 290 when the special game state ends. , Every time a special symbol lottery is performed in the variable probability state, a value (for example, 1) corresponding to the number of games for one time is subtracted from the stored value of the variable probability end determination counter 2930 to update the decrement. Then, when the stored value of the variable probability end determination counter 2930 reaches a threshold value (for example, 0), the variable probability state is ended and the normal state is started. However, in the variable probability state, the winning probability of the big hit in the special symbol lottery is set to 1/31, so the special game state is started before the number of times the special symbol lottery is performed in the variable probability state reaches 9999 times, and the probability variable It is almost impossible to transition from the state to the normal state.

In addition, in the variable state, the normal winning probability in the normal pattern lottery is as high as about 19/20, the fluctuation time of the normal pattern is as short as 1 second, and the period in which the normal accessory 54 is in the expanded state is 20 seconds. Since it is longer, it is easier for the game ball to enter the second starting port 49 than in the normal state, which is advantageous to the player.

In addition, in the variable state, regardless of the number of reservations, a shorter variation time is often set as the variation time of the first special symbol or the second special symbol, so the opportunity to execute the special symbol lottery is more frequent than in the normal state. is expected to arrive at

The time saving state is started when the special game state started based on the fact that the win flag of the 16 round normal pattern or the 4 round normal pattern is set to ON state, and the special game state is started from the time saving state. Or it is possible to shift to the normal state. In addition, in the time saving state, the normal pattern lottery is performed with reference to the normal pattern lottery table in which the probability of winning the normal hit is set to about 19/20 as in the variable state, but the probability of winning the jackpot is the same as in the normal state. A special symbol lottery is performed with reference to a jackpot lottery table set to approximately 1/319, which is more disadvantageous to the player than the variable probability state. Then, the time saving state is ended on condition that the number of times the special symbol lottery is performed in the time saving state reaches 100 times, and the state is shifted to the normal state.

Specifically, the game state transition control means 250 is triggered by the game state being shifted to the time saving state, and the time saving end determination counter 2932 of the main memory 290 corresponds to a predetermined number of games (for example, 100 times). A value (eg, 100) is written, and a value (eg, 1) corresponding to the number of games for one time is subtracted from the stored value of the time-saving end determination counter 2932 each time a special symbol lottery is performed in the time-saving state. . And when the stored value of the time saving end determination counter 2932 reaches a threshold value (for example, 0), the time saving state is ended.

In addition, in the time saving state, as in the probability variable state, the winning probability of the normal winning in the normal pattern lottery is as high as about 19/20, and the fluctuation time of the normal pattern is as short as 1 second, and the normal accessory 54 is in the expanded state. Since the period is as long as 20 seconds, it is easier for the game ball to enter the second starting port 49 than in the normal state, which is advantageous to the player.

In addition, in the time saving state, as in the variable state, a shorter variation time is often set as the variation time of the first special symbol or the second special symbol regardless of the number of reservations, so the special symbol than the normal state Opportunities for executing the lottery have come frequently.

The special game execution means 260 is means for executing a special game based on the lottery result of the special symbol lottery, and performs special game execution processing 1 to special game execution processing 4 and the like.

The special game execution process 1 is executed based on the winning of the 16-round probability variation pattern in the special symbol lottery, and the special game execution means 260 sets the number of rounds predetermined for the 16-round probability variation pattern as the upper limit value of the round counter 2933. A value (for example, 16) corresponding to 16 times is set, and each time the special accessory 56 completes the operation in a predetermined manner in each round, the stored value of the round counter 2933 is set to the number of rounds for one time. Incremental update is performed by adding a value (eg, 1) corresponding to . When the stored value of the round counter 2933 reaches the upper limit (for example, 16), the special game state ends.

Specifically, in the special game execution process 1, in the special game of each round from the 1st round to the 16th round, the opening timer 2934 counts 29 seconds after the special accessory 56 is opened. When the switch 104 detects the entry of one game ball, a value (for example, 1) corresponding to one game ball is added. Drive control of the special prize 56 is performed so that the special prize 56 is in a closed state. Then, "1" is added to the value of the round counter 2933 assuming that the end condition for one round is satisfied.

The special game execution process 2 is executed based on the winning of the 4 round probability variation pattern in the special symbol lottery, and the special game execution means 260 sets the predetermined round number for the 4 round probability variation pattern as the upper limit value of the round counter 2933. A value (for example, 4) corresponding to 4 times is set, and each time the special accessory 56 completes the operation in a predetermined manner in each round, the stored value of the round counter 2933 is set to the number of rounds for one time. Incremental update is performed by adding a value (eg, 1) corresponding to . When the stored value of the round counter 2933 reaches the upper limit (for example, 4), the special game state ends.

Specifically, in the special game execution process 2, in the special game of each round of the first to fourth rounds, the opening timer 2934 counts 29 seconds after the special accessory 56 is opened, or When the value of the prize number counter 2936 reaches the upper limit (for example, 10), the special accessory 56 is driven and controlled so that the special accessory 56 is closed. Then, "1" is added to the value of the round counter 2933 assuming that the end condition for one round is satisfied.

The special game execution process 3 is executed based on the winning of the 16 round normal symbols in the special symbol lottery, and the special game execution means 260 sets the number of rounds predetermined for the 16 round probability variable symbols as the upper limit value of the round counter 2933. A value (for example, 16) corresponding to 16 times is set, and each time the special accessory 56 completes the operation in a predetermined manner in each round, the stored value of the round counter 2933 is set to the number of rounds for one time. Incremental update is performed by adding a value (eg, 1) corresponding to . When the stored value of the round counter 2933 reaches the upper limit (for example, 16), the special game state ends.

Specifically, in the special game execution process 3, in the special game of each round from the 1st round to the 16th round, the opening timer 2934 counts 29 seconds after the special accessory 56 is opened, or When the value of the prize number counter 2936 reaches the upper limit (for example, 10), the special accessory 56 is driven and controlled so that the special accessory 56 is closed. Then, "1" is added to the value of the round counter 2933 assuming that the end condition for one round is satisfied.

The special game execution processing 4 is executed based on the winning of the 4 round normal symbols in the special symbol lottery. A value (for example, 4) corresponding to 4 times is set, and each time the special accessory 56 completes the operation in a predetermined manner in each round, the stored value of the round counter 2933 is set to the number of rounds for one time. Incremental update is performed by adding a value (eg, 1) corresponding to . When the stored value of the round counter 2933 reaches the upper limit (for example, 4), the special game state ends.

Specifically, in the special game execution process 4, in the special game of each round of the first to fourth rounds, the opening timer 2934 counts 29 seconds after the special accessory 56 is opened, or When the value of the prize number counter 2936 reaches the upper limit (for example, 10), the special accessory 56 is driven and controlled so that the special accessory 56 is closed. Then, "1" is added to the value of the round counter 2933 assuming that the end condition for one round is satisfied.

The payout instructing means 270 receives a detection signal from the first starting port switch 100, a detection signal from the general winning port switch 101, a detection signal from the second starting port switch 103, or a detection signal from the count switch 104. , control is performed to cause the payout device 130 to pay out a number of game balls corresponding to the number of prize balls predetermined for each detection signal. Specifically, the payout instruction means 270 transmits to the payout device 130 a payout command instructing to pay out the number of game balls corresponding to the number of prize balls determined for each input detection signal. The number of prize balls may be any number as long as it is one or more, and the number of prize balls paid out by each of the first start port switch 100, the general prize winning port switch 101, the second start port switch 103, or the count switch 104 may be different, or may be set to the same number of prize balls.

The payout device 130 performs an operation to pay out the number of game balls instructed by the payout instruction means 270 . The payout device 130 includes a payout control board 400, a game ball tank for storing game balls, a payout motor for paying out the game balls stored in the game ball tank as prize balls to the player, It is equipped with a payout counting switch or the like that detects passage.

The payout control board 400 controls the payout of prize balls. The payout control board 400 includes a CPU, a ROM, a RAM, etc., and is connected to the main control board 200 so as to be bidirectionally communicable. A payout motor is connected to the payout control board 400 . Then, the payout control board 400 controls the payout motor based on the payout command transmitted from the main control board 200 and the detection signal from the payout counting switch, and causes predetermined prize balls to be paid out to the player. Specifically, the payout control board 400 starts energizing the payout motor based on the payout command transmitted from the main control board 200 . While the payout motor is energized and rotating, game balls are paid out one by one. At this time, the payout counting switch detects passage of the putout game ball and transmits a detection signal to the payout control board 400 . The payout control board 400 grasps the number of game balls put out based on the detection signal, and when the number of game balls corresponding to the instruction from the main control board 200 is put out, the power supply to the payout motor is stopped. , terminates the payout of game balls.

The communication control means 280 controls transmission of various commands generated according to various calculation results in the main control board 200 to the sub control board 202, the payout control board 400, and the like. In addition, in the gaming machine of this embodiment, between the main control board 200 and the sub control board 202, only one-way communication from the main control board 200 to the sub control board 202 is possible. are connected so as not to be able to transmit information to the main control board 200 from.

Next, the sub-control board 202 will be described. The sub-control board 202 includes a performance control means 300 and a sub-memory 310 .

The effect control means 300 controls the liquid crystal display based on various commands transmitted from the main control board 200, input signals from the effect button switch 150, and effect data stored in the effect data storage means 3110 of the sub-memory 310. A production image is displayed on the display 32, lighting devices such as the front frame lamp 12 and the display frame lamp 38 are lit or blinked, production sound is output from the speaker 14, and a production driving device is driven to drive the production. By controlling the performance device such as by operating

FIG. 6 is a perspective view of the payout control board unit 401 including the payout control board 400 and the board case 402 as seen from the surface side. In this embodiment, the payout control board 400 is arranged such that the front side faces the back side (rear) of the gaming machine and the back side faces the front side (front) of the gaming machine.

In this embodiment, all the components mounted on the payout control board 400 are mounted on the surface side of the payout control board 400 . Hereinafter, the surface (front surface) of the payout control board 400 on which components are mounted is sometimes referred to as a mounting surface. Note that there may be components mounted on the back side of the payout control board 400 .

The payout control board 400 has a region where electronic components to be mounted during mass production (mounted components during mass production) are placed (mounted component placement region during mass production (first component placement region) A: the region outside the two-dot chain line in FIG. ) and an area in which electronic components that are not mounted during mass production (unmounted components during mass production) are placed (unmounted component placement area during mass production (second component placement area) B: the area inside the two-dot chain line in FIG. 6) have. Specifically, the mass-production non-mounted component placement region B is a range occupied by the mass-production non-mounted component when the mass-production non-mounted component is placed at a predetermined position on the payout control board 400 (mass-production non-mounted component placement region B). It can be said that the area occupied by the mounting part 405 (land, through hole, etc.) for attaching (soldering) the mounted part and the area occupied by the silk 406 for the unmounted part at the time of mass production. Note that mass production refers to the time when a large amount of products to be offered to the market are produced. In other words, in products (game machines) distributed in the market, basically no parts (mass-production unmounted parts) are arranged in the mass-production unmounted parts arrangement area B.
It should be noted that a plurality of mass-production mounted component placement regions A and mass-production non-mounted component placement regions B may be provided in plurality, respectively, or may be a single region.
Note that electronic components are, for example, ICs (including main ICs), LEDs, passive elements (resistors, capacitors, inductors, etc.), switches, connectors, and the like.

Parts not mounted during mass production are (1) development parts that are used only during development and are not mounted during mass production (development connectors, development ICs, development passive elements, etc.), and (2) functions (specifications) in later models. It is an electronic component that is mounted when it is decided to add , etc., and is not mounted at the time of mass production (on the current model) for function expansion (connector for function expansion, IC for function expansion, passive element for function expansion, etc.) ), and (3) test parts (test connectors, test ICs, test passive elements, etc.) that are used in predetermined tests to provide game machines to the market and are not mounted during mass production. In this embodiment, the mass-production non-mounted component placement area B is an area in which development components as mass-production non-mounted components are placed. Mounting portions 405 (lands, through holes, etc.) for mounting (soldering) development components are provided in mass-production non-mounting component placement area B. FIG.

The payout control board 400 is housed in a board case 402 . The substrate case 402 has a front case 402a and a back case 402b. The front case 402a has a rectangular box shape with an open front side. The back case 402b has a rectangular box shape with an open rear side. The front case 402a and the back case 402b are made of transparent synthetic resin. A transparent box-shaped board case 402 is formed by combining the front case 402a and the back case 402b. The payout control board 400 is accommodated inside the board case 402 with the front case 402 a facing the front surface of the payout control board 400 and the back case 402 b facing the back surface of the payout control board 400 .

In this embodiment, of the surfaces of the board case 402, the surface facing the front surface of the payout control board 400 is called the top surface, and the surface facing the back surface of the payout control board 400 is called the bottom surface. That is, the top surface of the board case 402 is formed by the front case 402a, and the bottom surface of the board case 402 is formed by the back case 402b.

Further, in the present embodiment, the portion of the board case 402 (the top surface of the board case 402) facing the mounting component placement area A during mass production (the area outside the two-dot chain line in FIG. 6) is the case side first area A. ', and the portion facing the mass-production non-mounted component placement region B (the region inside the two-dot chain line in FIG. 6) is defined as a case-side second region B'.

In the present embodiment, the case-side second area B' includes a low visibility portion C (a hatched area in FIG. 6) that reduces the visibility of the unmounted component placement area B during mass production. The reduced visibility portion C is a portion that overlaps with the mass-production unmounted component placement area B in a direction orthogonal to the board surface (surface) of the dispensing control board 400, and is orthogonal to the board surface (surface) of the dispensing control board 400. When the payout control board 400 (the surface of the payout control board 400) is viewed from the direction of , it is a portion that obstructs the visibility of the non-mounted component placement area B at the time of mass production. In other words, when viewed from this direction, the low visibility portion C is a mounting portion 405 (land, through hole, etc.) for mounting mass-production non-mounted components arranged in the mass-production non-mounted component placement region B. Alternatively, it is a portion that reduces the visibility of at least a part of the silk 406 or the like regarding parts that are not mounted during mass production. It should be noted that "reducing (obstructing) visibility" means that the visibility reduction portion C reduces the visibility of the unmounted component placement region B during mass production (lowering the visibility of the unmounted component placement region B during mass production) when viewed from the relevant direction. The part overlapping the part C) (mounted part 405, silk 406, etc. for parts not mounted at the time of mass production) may be obscured, but "obscured" here includes the case where it is completely obscured. In addition, the visibility reduction portion C may reduce the visibility of at least a part of the mass-production non-mounted component placement region B (mounting portion 405, silk 406, etc. related to mass-production non-mounting components). The visibility of the entire non-mounted component placement area B may be lowered. In other words, all of the mounting portions 405 for mounting parts not mounted at the time of mass production provided on the payout control board 400 (at least part of them) are present at positions overlapping the visibility reduced portion C. good. Note that the portion where the visibility is reduced by the reduced visibility portion C is a specific mass-produced mounted component placement area A (a specific area of the mass-produced mounted component placement area A, for example, the main IC 500, which will be described later). It can also be said that the visibility is lowered compared to the area where the LED is arranged, the area where the LED is arranged, etc.).

The low visibility portion C may be, for example, a portion (character portion) to which predetermined characters are added. That is, predetermined characters are attached to the board case 402, and the visibility of the mass-production unmounted component placement area B may be reduced by the characters. Specifically, the low-visibility portion C may be a portion on which characters relating to predetermined operating means (buttons, etc.) provided on the payout control board 400 are added. More specifically, the low-visibility portion C may be a portion to which characters or the like describing the type of predetermined operation means (function of the operation means) such as the characters "RAM clear button" are added. .
When the low visibility portion C is a predetermined character portion, the character portion may be formed by printing characters on the substrate case 402, and a sticker or the like with the characters printed thereon may be attached. Alternatively, it may be formed by the uneven shape of the substrate case 402 .

Further, the low visibility portion C may be a portion with a sticker of a predetermined size. That is, the substrate case 402 may be provided with a predetermined seal, and the seal may reduce the visibility of the mass-production unmounted component arrangement area B. FIG. The seal may be partially transparent and partially colored, or may be entirely colored. In other words, for example, it may be a sticker or the like in which predetermined characters, figures (graphics), etc. are printed on a transparent sheet (film), or a white sheet (film) with predetermined characters, figures (graphics), etc. printed thereon. A printed seal or the like may be used. In the case of a sticker with a predetermined print on a transparent sheet, the visibility of the unmounted component placement area B at the time of mass production is improved by the portion (printed portion: colored portion) where the predetermined print is applied and the predetermined color is applied. descend.

Further, the low-visibility portion C may be, for example, a portion (uneven portion) in which a predetermined uneven shape is formed. That is, the board case 402 may have a predetermined uneven shape, and the uneven shape may reduce the visibility of the unmounted component placement area B during mass production. Further, the uneven shape may have predetermined information (predetermined character string, date mark, predetermined symbol, etc.), and may not have predetermined information such as step shape. may

In this embodiment, the reduced visibility portion C is formed by a seal 410 as shown in FIG. In addition, the seal 410 is attached to a seal attaching area 412 of the substrate case 402 (top surface of the substrate case 402).

The seal attachment area 412 is an area for attaching the seal 410 . In this embodiment, the seal pasting area 412 is an area indicated by an uneven shape (predetermined shape) formed on the substrate case 402 . Specifically, as shown in FIGS. 7 and 8A, on the top surface of the substrate case 402, a convex portion projecting in the shape of a rectangular frame toward the inner surface side (board side) is provided as a predetermined shape portion 413. is provided. A rectangular region surrounded by the convex portion as the predetermined shape portion 413 serves as a sticker attaching region 412 . That is, in the present embodiment, the area defined by the predetermined shape portion 413 can be recognized as the sticker application area 412, and the operator (working device) who applies the sticker can identify the sticker application area 412. It's like In this embodiment, the seal 410 is attached to the outer surface of the substrate case 402, but may be attached to the inner surface.
8(a) and 8(b) show the payout control board unit 401 cut along a plane (horizontal plane) perpendicular to the payout control board 400 and extending in the left-right direction (and the front-rear direction). is a schematic cross-sectional view showing the case of viewing from above. Not only cross sections cut along the horizontal plane, but also cross sections cut along the vertical plane (planes extending in the vertical direction and the front-rear direction) are as shown in FIGS.

In this embodiment, as shown in FIG. 8A, the uneven shape as the predetermined shape portion 413 is formed on the inner surface of the substrate case 402 and corresponds to the predetermined shape portion 413 on the outer surface of the substrate case 402. The part that does is flat. However, as shown in FIG. 8B, as the predetermined shape portion 413, a concave portion (groove) recessed in a rectangular frame shape from the outer surface side toward the inner surface side is projected in a rectangular frame shape toward the inner surface side. may be formed with a convex portion). Also, the seal attachment region 412 may be a region recessed from the outer surface side toward the inner surface side (projected toward the inner surface side) compared to the peripheral portion of the seal attachment region 412 . In other words, the predetermined shape portion 413 may not have a rectangular frame shape, and may be a portion recessed in a rectangular shape. Further, the predetermined shape portion 413 may be a portion protruding to the outer surface side in a rectangular frame shape or a rectangular shape. Further, the predetermined shape portion 413 may be one or a plurality of L-shaped projections or recesses, and the corners of the seal attachment region 412 may be indicated by the L-shaped projections or recesses. If the L-shaped convex portion or concave portion is one, at least part of the seal 410 exists within the virtual triangle formed by connecting the three vertices (both ends and corners) of the L-shape. A range in which the seal 410 is to be applied (and a range in which the seal 410 does not straddle the L-shaped convex portion or concave portion) is defined as a seal pasting region 412 .

Seal 410 is a seal of a predetermined size. Also, the size (area) of the seal application region 412 is larger than the size (area) of the seal 410 . That is, when the board case 402 is viewed from a direction orthogonal to the board surface (surface) of the payout control board 400 (the top surface of the board case 402), the area of the seal attachment area 412 is larger than the area of the seal 410. ing. As a result, the accuracy required for the operation of attaching the sticker 410 is relaxed. That is, since the operator (working device) can apply the seal 410 to any position within the seal application area 412, there is no need to completely match the center of the seal application area 412 with the center of the seal 410. Displaced placement is allowed.

In addition, the payout control board 400 (the surface of the payout control board 400) has a seal sticking area facing area 420 (the area inside the chain double-dashed line in FIG. 7) as an area facing the seal sticking area 412 of the board case 402. exist. Also, the size (area) of the seal attachment area facing area 420 and the size (area) of the seal attachment area 412 are the same. In other words, when viewed from a direction orthogonal to the board surface (surface) of the payout control board 400 , the sticker sticking area facing area 420 completely overlaps the sticker sticking area 412 . In other words, when viewed from this direction, the seal pasting area 412 does not protrude from the payout control board 400 and is located inside the outer edge of the payout control board 400 .

Here, the electronic components mounted on the payout control board 400 are within the range of the seal pasting area facing area 420 without protruding from the range (the entire electronic component exists within the range). electronic components) are called specific electronic components. In this embodiment, at least a portion of the specific electronic component faces the seal 410 regardless of where the seal 410 is adhered within the seal application area 420 . That is, in the present embodiment, a plurality of electronic components exist as specific electronic components. One of the parts is adapted to face seal 410 . One or a plurality of electronic components exist as specific electronic components, and all of the specific electronic components (all electronic components that are within the range of the sticker attachment region facing region 420 without protruding from the range). , even if the seal 410 is attached to any position within the range of the seal attachment area 412, at least a portion of the seal 410 faces the seal 410 and visibility is reduced by the seal 410. good. It should be noted that the expression “wherever the seal 410 is attached at any position within the range of the seal attachment area 412” means that the seal 410 protrudes to any position within the range of the seal attachment area 412. It means that it can be pasted without It should be noted that "within the range of the sticker pasting region 412" means a range that does not straddle (do not cross) the outer edge of the predetermined shape portion 413 (the range inside the dashed-dotted line f in FIGS. 8A and 8B). is. However, "within the range of the sticker pasting region 412" means a range that does not straddle (do not exceed) the inner edge of the predetermined shape portion 413 (the range inside the dashed line g in FIGS. 8A and 8B). may be The same is true for "within the range of the seal sticking area facing area 420".

That is, in the present embodiment, the seal 410 as the visibility reduced portion C reduces the visibility of the unmounted component placement region B during mass production, and can be placed at an arbitrary position (any position) within the range of the seal attachment region 412. Even if it is attached, it faces the specific electronic component and reduces the visibility of the specific electronic component. Further, even if the sticker 410 as the visibility reduced portion C is attached to an arbitrary position (any position) within the range of the sticker attaching area 412, at least one of the mass-production unmounted component arrangement areas B It is designed to reduce the visibility of the part.
It should be noted that a configuration in which mass-production non-mounted component placement region B (mounting portion 405, silk 406, etc. related to mass-production non-mounted components) does not exist within the range of seal attachment region facing region 420 (position facing seal 410) is also possible. good.

Here, the reduction in visibility of the electronic component (specific electronic component) due to the seal 410 as the visibility reduced portion C will be described in more detail. In the present embodiment, the seal 410 has a printed portion (colored portion) printed with predetermined characters and figures (graphics) on a seal body (transparent portion) as a transparent sheet.

In the present embodiment, as shown in FIG. 9, the sticker 410 has a white rectangular shape as a column for writing the character of "Dispensing control board" printed in white characters and the person who opened the board case 402 as a printed part. Enter the filled (printed) opener entry field, the character "opener" printed in white along with the opener entry field to indicate that it is an opener entry field, and the opening date of the substrate case 402. The opening date entry field filled (printed) in a white rectangle as a field to fill in, and the "opening date" printed in white letters indicating that it is an opening date entry field written together with the opening date entry field It has characters, a character string of white characters as a description of information about the parts mounted on the payout control board 400, and white frame lines covering these various characters and columns. In the direction orthogonal to the board surface (front surface) of the payout control board 400, the printed portion overlaps the specific electronic component and mass-production non-mounted component placement area B, thereby arranging the specific electronic component and mass-production non-mount component. The visibility of the area B is lowered. Note that each print as the printed portion (colored portion) shown here is an example, and the seal 410 may include a part of each print shown here or another print.
In addition, the "information about the component mounted on the payout control board 400" is, for example, an explanation of the information indicated by the lighting state of the LED as the component (for example, what kind of information is indicated when which LED is lit). (for example, the type of error indicated by the lighting state of the LED, etc.), or a description of the type of operation means (button, etc.) as the part (function of the operation means) or information (for example, an arrow symbol indicating the location) indicating the location of the component (operation means, etc.).

Note that the substrate case 402 may have a plurality of seals 410 and seal attachment areas 412 . In addition, when there are a plurality of stickers 410 and a plurality of sticker attachment regions 412, the plurality (all) of the stickers 410 have respective characteristics related to the reduction in visibility of the above-described specific electronic components and mass-production unmounted component placement region B. You may have In addition, the predetermined seal 410 has the above-described features related to the reduction in visibility of the specific electronic component, and the other seals 410 have the above-described features related to the reduction in visibility of the unmounted component placement region B during mass production. may have. Further, for example, the predetermined sticker 410 is a sticker containing information about the parts mounted on the payout control board 400 (for example, a sticker printed with the type of error indicated by the lighting state of the LED), and other stickers 410 may be a sticker relating to the opening of the substrate case 402 (a sticker printed with characters such as "opener", "opening date", opener entry column, opening date entry column, etc.). In addition, the sizes (areas) of the stickers 410 and the sizes (areas) of the seal-attached regions 412 may be different among the plurality of stickers 410 and the seal-attached regions 412 . By making the sizes (areas) different, it is possible to prevent incorrect attachment of the seal 410 .

Note that the sticker 410 may be a white sheet with a predetermined print instead of a transparent sheet with a predetermined print. In other words, the seal 410 may be a colored portion as a whole, and the colored portion may reduce the visibility of the specific electronic component and the unmounted component placement area B during mass production.

(Modification)
In the game machine of this modification, as shown in FIG. 10, the payout control board 400 has a specific connector (development connector, function expansion connector, test connector, etc.) attached (soldered) as an unmounted component at the time of mass production. It has a specific connector mounting part 430 as a mounting part for The specific connector mounting portion 430 is composed of a plurality of (four) through holes 430a having lands, and the specific connector is mounted by inserting the terminals of the specific connector into the through holes 430a and joining them with solder. It's becoming Although the specific connector is not mounted on the specific connector mounting portion 430 at the time of mass production, the through holes of the specific connector mounting portion 430 are all filled with solder and are not penetrated.

Further, the specific connector mounting portion 430 is covered with the board case 402 (front case 402a). Further, an opening for exposing the specific connector to the outside of the board case 402 is not provided in the portion of the board case 402 facing the specific connector mounting part 430 (specific connector mounting part facing area). In other words, when the specific connector is mounted, the board case 402 is not closed and the payout control board 400 cannot be housed in the board case 402 . In addition, no ventilation holes or the like are provided in the area facing the specific connector mounting portion. In other words, no through holes are provided in the specific connector mounting portion facing area. Since no opening, vent, or the like for exposing the specific connector is provided, it is possible to prevent unauthorized access through the specific connector mounting portion 430 . Moreover, since no opening is provided for exposing the specific connector, it is easy to understand that there is no problem even if the connector is not mounted on the specific connector mounting portion 430 .

In addition, the specific connector is aligned along a predetermined side (upper side) of the payout control board 400 with other connectors in approximately one row (here, "substantially in one row" includes the case where it is completely in one row). It is designed to be placed. Specifically, in this embodiment, a plurality of (four) connectors are prepared that are arranged at substantially equal intervals (here, "substantially equal intervals" include cases where they are completely equal intervals) from the specific connector. ing. The plurality of connectors are components mounted in mass production. Specifically, the plurality of connectors can be connected to parts mounted in the game machine (game machine mounted It is a mounted component connection connector used for connection with a component).
Connectors other than the specific connector and the four mounting component connection connectors (for example, other mounting component connection connectors) are provided along the predetermined side (at intervals equal to or larger than the interval between these connectors). may be

The substrate case 402 is provided with openings 432 for exposing the four mounted component connectors to the outside at portions facing the four mounted component connectors. That is, a corresponding opening 432 is provided for each of the four mounted component connectors. It should be noted that illustration of the mounting component connection connector is omitted in FIG. 10 . In addition, one recessed portion 434 recessed from the outer surface side toward the inner surface side is formed in the substrate case 402 (front case 402a). Four openings 432 corresponding to the four mounting component connectors and a specific connector mounting portion facing area are arranged in the recess (the bottom surface of the recess 434). In other words, the four openings 432 and the specific connector mounting portion facing area are within the range of the bottom surface of the recess 434 when viewed from the direction orthogonal to the board surface (surface) of the payout control board 400. It fits in without sticking out. As described above, in the present embodiment, the mounting component connection connector (opening 432 for exposing the mounting component connection connector) and the specific connector mounting portion facing area are arranged in one recess 434, so that the specific connector mounting portion 430 It is easier to notice when an incorrect part is installed.
In this embodiment, the payout control board 400 has mounted component connectors (not shown) in addition to the four mounted component connectors arranged in the recesses 434 . In addition to the recess 434, the substrate case 402 is formed with a recess 438 in which an opening 436 for exposing the other mounted component connector is arranged.

In addition, the terminals of the specific connector (through holes 430a through which the terminals are inserted) are more flexible than the terminals (through holes through which the terminals are inserted) of any of the four mounting component connection connectors arranged in the recess 434. It is arranged on the inner side (on the inner side of the payout control board 400 in the surface direction, that is, at a position away from the upper side). Therefore, it is easy to understand that there is no problem even if the connector is not mounted on the specific connector mounting portion 430 .

In addition, the specific connector (specific connector mounting portion 430) does not have to be arranged substantially in line with other connectors along a predetermined side (upper side) of the payout control board 400. For example, the center of the payout control board 400 It may be arranged at a position away from the peripheral edge, such as a part. Alternatively, the specific connector may be a surface-mounted component, and the specific connector mounting portion 430 may be configured by a land having no through hole.

The gaming machine of the present embodiment is a gaming machine comprising a substrate 400 and a substrate case 402 that houses the substrate 400. The area of the substrate 400 in which electronic components to be mounted during mass production are mounted is A mounted component arrangement area (first component arrangement area) is defined as A, and an area in which electronic components that are not mounted during mass production can be mounted is defined as an unmounted component arrangement area during mass production (second component arrangement area) B. Assuming that the area facing the pre-mounted component placement area A is a first area A' and the area facing the mass-production non-mounted component placement area B is a second area B', the second area B' is a mass production area. A low visibility portion C that reduces the visibility of at least a part of the unmounted component placement region B is present. According to such a configuration, the low visibility portion C overlaps the mass-produced non-mounted component placement region B in which electronic components are not mounted in mass-produced products. Therefore, the area of the low-visibility portion C that overlaps with the mass-production component placement area A can be reduced. Therefore, it is possible to prevent deterioration of the visibility of the portion where the electronic component is mounted.

The gaming machine of the present embodiment is a gaming machine that includes a substrate 400 and a substrate case 402 that houses the substrate 400. The substrate case 402 has a sticker pasting area 412 to which a sticker 410 is pasted. Assuming that the region of the substrate 400 that faces the seal sticking region 412 is a seal sticking region facing region 320, the area of the seal sticking region 412 is larger than the area of the seal 410 and is the same as the area of the seal sticking region facing region 420. When viewed from the direction orthogonal to one surface of the substrate 400, the electronic component that fits within the range of the seal attachment area facing area 420 without protruding from the range is defined as a specific electronic component. Even when the seal 410 is attached to any position (any position) within the area 412 , at least a portion of the specific electronic component faces the seal 410 . According to such a configuration, electronic components that do not pose a problem even if the visibility is lowered or electronic components that are desired to be lowered in visibility are grouped within the range of the seal pasting region facing region 420, thereby avoiding degradation in visibility. Therefore, it is possible to prevent deterioration of the visibility of the electronic parts which are not covered.

(Second embodiment)
Next, a second embodiment of the invention will be described. The gaming machine of this embodiment has the same configuration as the gaming machine of the first embodiment. Therefore, the description of the configuration similar to that of the first embodiment is omitted or simplified.

In this embodiment, all the components mounted on the payout control board 400 are mounted on the surface side of the payout control board 400 . Hereinafter, the surface of the payout control board 400 on which components are mounted may be referred to as a mounting surface. Note that there may be components mounted on the back side of the payout control board 400 .

In the following description, the longitudinal direction (long side) of a component mounted on a board basically means the longitudinal direction (long side) when viewed from a direction perpendicular to the mounting surface, and the short direction ( The short side) means the width direction (short side) when viewed from the direction orthogonal to the mounting surface, and the height direction means the direction orthogonal to the mounting surface. Further, with respect to components mounted on a substrate, the bottom surface means the surface on the mounting surface side, and the top surface means the surface facing away from the mounting surface.

A main IC 500 shown in FIG. 11 is mounted on the payout control board 400 . The main IC 500 is an IC in which a CPU, a ROM, a RAM, and the like are integrated (one chip). Also, the main IC 500 controls various processes by the payout control board 400 .

The main IC 500 is mounted on the payout control board 400 via a socket 502 shown in FIG. That is, the socket 502 is attached to the payout control board 400 and the main IC 500 is attached to the socket 502 .

As shown in FIG. 11, the main IC 500 includes an IC main body 510 formed in a substantially rectangular plate shape containing a CPU, a memory, etc., and a plurality of ICs electrically connected to the circuits built in the IC main body 510. and a terminal P. The plurality of IC terminals P are arranged in two rows along the longitudinal direction of the IC body 510 and extend from the IC body 510 toward the mounting surface. In other words, the plurality of IC terminals P are arranged along the longitudinal direction on both sides of the IC body 510 in the short side direction. In other words, the plurality of IC terminals P are arranged along each of two opposing sides (two long sides) of the IC body 510 . The package of the main IC 500 is a so-called DIP (Dual In-line Package).

In this embodiment, the main IC 500 has 71 terminals of IC terminals P1 to P71. Thirty-five terminals of IC terminals P1 to P35 are arranged in one of the two rows, and thirty-six terminals of IC terminals P36 to P71 are arranged in the other row. It should be noted that the IC terminals P1 to P71 can be said to be the 1st pin (first terminal) to the 71st pin (71st terminal) of the main IC 500, respectively, and can also be said to be pins (terminals) with pin numbers (terminal numbers) 1 to 71. .

A distance Px from the IC terminal P1 to the IC terminal P2 is 1 mm. Also, the distance Py from the IC terminal P2 to the IC terminal P3 is 1 mm. Also, the distance Pz from the IC terminal P1 to the IC terminal P3 is 2 mm. That is, the distance Px and the distance Py are equal. Also, the distance Pz is twice the distance Px and the distance Py. The IC terminals P1 to P17 have the same interval between adjacent IC terminals (1 mm), and the IC terminals P18 to P35 have the same interval between adjacent IC terminals (1 mm). ), IC terminals P36 to P53 have the same interval between adjacent IC terminals (1 mm), and IC terminals P54 to P71 have the same interval between adjacent IC terminals. (1 mm). Also, the distance between the IC terminal P17 and the IC terminal P18 and the distance between the IC terminal P53 and the IC terminal P54 are longer than 1 mm. That is, for a group of continuous IC terminals P (IC terminals P1 to P17, IC terminals P18 to P35, IC terminals P36 to P53 or IC terminals P54 to P71), the intervals between adjacent IC terminals P are equal. Also, for a group of continuous IC terminals P (IC terminals P1 to P17, IC terminals P18 to P35, IC terminals P36 to P53 or IC terminals P54 to P71), the interval (2 mm) between every other IC terminal P is , is twice the interval (1 mm) between the adjacent IC terminals P.
The interval between the IC terminals P17 and P18 and the interval between the IC terminals P53 and P54 may be 1 mm.

As shown in FIG. 12, the socket 502 includes a plurality of socket terminals Q to which the IC terminals P of the main IC 500 are connected, and a socket body (housing) which holds the plurality of socket terminals Q and on which the main IC 500 is mounted. ) 515 and a plurality of legs 517 . The socket main body 515 is formed in a substantially rectangular parallelepiped shape from an insulating resin material. The socket main body 515 is made of a transparent or translucent resin material and has translucency. Here, "having translucency" includes the case of being "transparent".

The top surface of the socket body 515 is the surface on which the main IC 500 is mounted (mounted). The bottom surface of the main IC 500 does not have to touch the top surface of the socket body 515 , and the main IC 500 attached to the socket body 515 only needs to be positioned on the top surface side of the socket body 515 . Further, one or a plurality of protrusions may be provided on the top surface of the socket body 515 to protrude toward the main IC 500 , and the protrusions may come into contact with the bottom surface of the main IC 500 .

Also, the socket body 515 is provided with a plurality of legs 517 . The leg 517 protrudes from the bottom surface of the socket body 515 toward the mounting surface. In this embodiment, four legs 517 provided at the four corners of the socket body 515 and two legs 517 provided spaced apart in the lateral direction at the longitudinal center of the socket body 515. , there are a total of six legs 517 . Further, the leg 517 is formed integrally with the socket main body 515 from the same material (insulating material) as the socket main body 515, but may be formed from a different material.
The legs 517 are preferably provided at least at the four corners of the socket 502, but the number of legs may be less than four or may be four or more. Also, the height h of the leg 517 (the amount of protrusion from the bottom surface of the socket body 515) is 1 mm.

In this embodiment, the socket 502 has 71 socket terminals Q1 to Q71. The socket terminals Q1 to Q71 can be said to be the 1st pin (first terminal) to the 71st pin (71st terminal) of the socket 502, respectively, and can also be said to be pins (terminals) with pin numbers (terminal numbers) 1 to 71. . Also, in a state where the main IC 500 is attached to the socket 502, the socket terminals Q1 to Q71 are electrically connected to the IC terminals P1 to P71 of corresponding pin numbers (same pin numbers). .

The socket terminal Q has an IC terminal contact portion 520 that contacts the IC terminal P on the side away from the mounting surface (top surface side), and the mounting surface side (bottom surface side) is a substrate that is joined to the payout control substrate 400. It is a joint portion 521 . The upper end of the IC terminal contact portion 520 (socket terminal Q) is positioned closer to the mounting surface than the top surface of the socket main body 515 . Also, the IC terminal contact portion 520 has a shape into which the IC terminal P can be inserted. In other words, the socket main body 515 is formed with a plurality of (71) holes 518 in which the socket terminals Q are embedded, respectively. The main IC 500 is attached to the socket 502 while the terminal P and the IC terminal contact portion 520 are in contact with each other. Further, the substrate joint portion 521 protrudes from the bottom surface of the socket body 515 toward the mounting surface (toward the substrate). Further, the board joint portion 521 protrudes from the leg 517 toward the mounting surface (toward the board). The board joint portions 521 of the socket terminals Q are inserted into the through holes 504 of the payout control board 400, which will be described later, and joined by soldering, whereby the sockets 502 are attached to the payout control board 400. ing. Also, the IC terminal contact portion 520 and the substrate joint portion 521 are integrally formed of conductive metal. The socket terminal Q electrically connects the IC terminal P (main IC 500) and the through hole 504 (payout control board 400).

Each IC terminal contact portion 520 may have any shape as long as each IC terminal P of the main IC 500 can be connected thereto. Also, each IC terminal contact portion 520 may have a shape that can prevent the main IC 500 attached to the socket 502 from coming off. In this embodiment, as shown in FIG. 13, the IC terminal contact portion 520 is formed by bending metal into an elastic shape, and clamps the IC terminal P by elastic force. The IC terminal contact portion 520 may have a hole into which the IC terminal P can be inserted, and the IC terminal P may be fitted into the hole.
Note that the substrate joint portion 521 is formed in a substantially linear shape (here, “substantially linear” means a completely linear shape) in a direction perpendicular to the mounting surface (height direction) so that it can be inserted into the through hole 504 . including).

In the socket 502, as shown in FIG. 12, a plurality of socket terminals Q are arranged in two rows along the longitudinal direction of the socket body 515. As shown in FIG. Among the plurality of socket terminals Q arranged in two rows, 35 socket terminals Q1 to Q35 are arranged in one row, and 36 socket terminals Q36 to Q71 are arranged in the other row. are placed. In addition, the ends of the plurality of socket terminals Q on the side of the main IC 500 (on the top surface side of the socket body 515) are arranged in two rows along the longitudinal direction of the socket body 515. The ends on the control board 400 side (bottom side of the socket body 515 ) are arranged in four rows along the longitudinal direction of the socket body 515 . In other words, the IC terminal contact portions 520 are arranged in two rows along the longitudinal direction of the socket body 515 . Also, the board joint portions 521 are arranged in four rows along the longitudinal direction of the socket body 515 . In other words, the plurality of socket terminals Q are arranged in two rows along the longitudinal direction of the socket body 515, and the ends of the socket terminals Q on the main IC 500 side are arranged in a straight line. , and the ends on the payout control board 400 side are arranged in a zigzag pattern.

In this way, the plurality of socket terminals Q are arranged in two rows on the main IC 500 side and in four rows on the payout control board 400 side. The positions of the IC terminal contact portion 520 and the substrate joint portion 521 in the width direction of the socket body 515 are different. In other words, at least some of the socket terminals Q are
A bent portion 522 is provided between the IC terminal contact portion 520 and the board joint portion 521 so that the positions of the IC terminal contact portion 520 and the board joint portion 521 in the width direction are different.

The bent portion 522 of the socket terminal Q of this embodiment will be described with reference to FIG. 13 . 13A and 13B are diagrams showing the shape of the socket terminal Q when viewed from a direction (longitudinal direction) orthogonal to the short side direction and the height direction of the socket body 515. FIG. (b) is a diagram showing a socket terminal Q with an even pin number, and (c) is a diagram showing a socket terminal Q with an even number of pins; It is a figure which shows the positional relationship of the socket terminal Q which shows. Regarding the socket terminals Q arranged in two rows in the longitudinal direction, the socket terminals in one row are arranged in the orientation shown in FIG. 13, and the socket terminals in the other row are symmetrical with the orientation shown in FIG. placed in the correct direction.

The bent portion 522 connects the first bent portion 523 positioned on the substrate joint portion 521 side, the second bent portion 524 positioned on the IC terminal contact portion 520 side, and the first bent portion 523 and the second bent portion 524 . , and an intermediate portion 525 that is substantially linear (here, “substantially linear” includes completely linear). The first curved portion 523 extends from the height direction in the lateral direction of the socket main body 515 (the surface direction of the payout control board 400) on the side (top surface side) away from the mounting surface of the substrate joint portion 521 extending in the height direction. It is a part that bends to the side. Also, the first curved portion 523 has a bending angle α (the angle between the substrate joint portion 521 and the intermediate portion 525) of 120 degrees. In addition, the second curved portion 524 is a portion that is bent in the height direction from the lateral direction of the socket body 515 (surface direction of the payout control substrate 400) on the side of the intermediate portion 525 away from the substrate joint portion 521. . Further, the second curved portion 524 has a bending angle β (the angle between the intermediate portion 525 and the portion on the IC terminal contact portion 520 side) of 120 degrees. Further, the intermediate portion 525 extends in the short extension direction of the socket body 515 , specifically, in the short extension direction and in a direction inclined at a predetermined angle with respect to the surface direction of the payout control board 400 . That is, the bent portion 522 has a crank shape (here, the “crank shape” includes a substantially crank shape) when viewed from the longitudinal direction of the socket body 515 .

The bent portion 522 allows the substrate joint portion 521 of the adjacent socket terminals Q among the plurality of socket terminals Q arranged in a line to be positioned vertically (perpendicular to the alignment direction and the height direction of the socket terminals Q). By changing (shifting) the position in the direction), the number of rows of the substrate joint portions 521 is larger than that of the IC terminal contact portions 520 .

In the present embodiment, socket terminals Q having a plurality of types (two types) of shapes are prepared. For a plurality of socket terminals Q arranged in a line, adjacent socket terminals Q have different shapes, Although every other socket terminal Q has the same shape, all the socket terminals Q may have the same shape.

In this embodiment, the IC terminal contact portion 520, the substrate bonding portion 521, and the bent portion 522 of the socket terminal Q are integrally formed of conductive metal, but are formed of a plurality of parts. may be In other words, each socket terminal Q is sufficient if the IC terminal contact portion 520 and the substrate joint portion 521 are electrically connected when the main IC 500 is attached to the socket 502 .

A distance Qx from the substrate joint portion 521 (lower end) of the socket terminal Q1 to the substrate joint portion 521 (lower end) of the socket terminal Q2 is 2.5 mm (see FIG. 12). Further, the distance Qy from the substrate joint portion 521 (lower end) of the socket terminal Q2 to the substrate joint portion 521 (lower end) of the socket terminal Q3 is 2.5 mm. Also, the distance Qz from the substrate joint portion 521 (lower end) of the socket terminal Q1 to the substrate joint portion 521 (lower end) of the socket terminal Q3 is 2 mm. That is, the distance between the substrate-bonding portion 521 of the socket terminal Q1 and the substrate-bonding portion 521 of the socket terminal Q2 is longer than the distance between the substrate-bonding portion 521 of the socket terminal Q1 and the substrate-bonding portion 521 of the socket terminal Q3. . In other words, for a group of continuous socket terminals Q (socket terminals Q1 to Q17, socket terminals Q18 to Q35, socket terminals Q36 to Q53, or socket terminals Q54 to Q71), the distance between the substrate joint portions 521 of adjacent socket terminals Q is are equal (2.5 mm). For a group of continuous socket terminals Q (socket terminals Q1 to Q17, socket terminals Q18 to Q35, socket terminals Q36 to Q53, or socket terminals Q54 to Q71), the distance between the board joint portions 521 of adjacent socket terminals Q ( 2.5 mm) is longer than the interval (2 mm) between the substrate joint portions 521 of the alternate socket terminals Q. In other words, the interval (2.5 mm) between the substrate joint portions 521 of the adjacent socket terminals Q is longer than 1/2 of the interval (2 mm) between the substrate joint portions 521 of the alternate socket terminals Q. there is

In addition, for a group of consecutive socket terminals Q (socket terminals Q1 to Q17, socket terminals Q18 to Q35, socket terminals Q36 to Q53 or socket terminals Q54 to Q71), the intervals between adjacent socket terminals Q are equal (1 mm). It has become. For a group of consecutive socket terminals Q (socket terminals Q1 to Q17, socket terminals Q18 to Q35, socket terminals Q36 to Q53 or socket terminals Q54 to Q71), the interval between the IC terminal contact portions 520 of adjacent socket terminals Q are equal (1 mm). Also, for a group of consecutive socket terminals Q (socket terminals Q1 to Q17, socket terminals Q18 to Q35, socket terminals Q36 to Q53 or socket terminals Q54 to Q71), alternate socket terminals Q (IC terminal contact portion 520 ) is twice (2 mm) the interval between the adjacent socket terminals Q (between the IC terminal contact portions 520). Specifically, the distance from the IC terminal contact portion 520 (upper end) of the socket terminal Q1 to the IC terminal contact portion 520 (upper end) of the socket terminal Q2 is 1 mm. The distance from the IC terminal contact portion 520 (upper end) of the socket terminal Q3 to the IC terminal contact portion 520 (upper end) of the socket terminal Q3 is 1 mm. The distance to is 2 mm. That is, the socket terminals Q1 to Q71 (IC terminal contact portions 520) are arranged at the same intervals as the IC terminals P1 to P71.

For a group of continuous socket terminals Q (socket terminals Q1 to Q17, socket terminals Q18 to Q35, socket terminals Q36 to Q53 or socket terminals Q54 to Q71), the interval (1 mm) between adjacent socket terminals Q in each group The interval (2.5 mm) between the substrate joint portions 521 of the adjacent socket terminals Q in each group is longer than the interval. Also, the interval (2.5 mm) between the substrate joint portions 521 of the adjacent socket terminals Q in each group is longer than the interval (1 mm) between the IC terminal contact portions 520 of the adjacent socket terminals Q in each group. It's becoming In other words, the substrate bonding of the socket terminals Q to which the adjacent IC terminals P are connected is greater than the distance between the adjacent IC terminals P of the main IC 500 (for example, the distance Px between the IC terminal P1 and the IC terminal P2: 1 mm). The interval between the portions 521 (for example, the interval Qx between the substrate joint portion 521 of the socket terminal Q1 and the substrate joint portion 521 of the socket terminal Q2: 2.5 mm) is longer. By widening the interval (distance Qx, Qy) between the adjacent substrate joint portions 521 in this way, it is possible to prevent the adjacent socket terminals Q from being short-circuited.

The payout control board 400 is provided with a plurality of (the same number as the socket terminals Q) through holes 504 through which the socket terminals Q are inserted. Also, the plurality of through holes 504 are arranged in four rows along the long side direction of the payout control board 400 so that the board joint portions 521 of the plurality of socket terminals Q can be inserted. Further, the board joint portion 521 of each socket terminal Q is inserted through each through hole 504 . The arrangement of the through holes 504 is the same as the arrangement of the substrate joint portions 521 of the socket terminals Q. As shown in FIG. In other words, the spacing between the through holes 504 is the same as the spacing between the substrate joint portions 521 of the corresponding socket terminals Q. As shown in FIG.

Each through hole 504 has an annular land 526 on each of the front side and the back side of the payout control board 400 . FIG. 14 shows the through holes 504 viewed from the surface side of the payout control board 400. As shown in FIG. The diameter (φ: outer diameter) of each land 526 is 1.5 mm. In other words, the radius of the land 526 (the length from the center (central axis) of the through hole 504 to the outer edge of the land 526) is 0.75 mm. In addition, the width of the land 526 (the length from the outer edge of the through hole 504 to the outer edge of the land 526 in the plate surface direction of the payout control board 400) is 0.35 mm. Also, the diameter of the through hole 504 is 0.8 mm.
Note that the diameter of the land 526 may be 1 mm or less. Also, the radius of the land 526 may be 0.5 mm or less. Also, the width of the land 526 may be 0.5 mm or less.

When attaching the socket 502 to the payout control board 400, each socket terminal Q (board joint portion 521) is inserted into each through hole 504, and each through hole 504 and each socket terminal Q (board joint portion 521) are soldered. joined by Further, when the socket 502 is attached to the payout control board 400, the feet 517 come into contact with the payout control board 400 to restrict further pushing of the socket 502. Therefore, the bottom surface of the socket body 515 is shown in FIG. As shown, it is in a state of floating from the payout control board 400 . Therefore, when the socket 502 is attached to the payout control board 400, the foot 517 is in contact with (or close to) the payout control board 400, and there is a gap between the bottom surface of the socket main body 515 and the payout control board 400. Z is formed. That is, the gap Z is formed by the leg 517 . In this embodiment, the height of the leg 517 is 1 mm, and the gap Z has a length (height) of 1 mm.
Note that the height (length) of the gap Z, in other words, the height of the leg 517 may be, for example, 1 mm or more.

Also, the clearance Z has a length such that the solder fillet of the solder that joins each socket terminal Q and each through hole 504 does not come into contact with the bottom surface of the socket body 515 . Here, solder fillets formed around the socket terminals Q will be described. In the soldering process for mounting the socket 502 on the payout control board 400 , each socket terminal Q (board joint portion 521 ) is first inserted into each through hole 504 . Then, the melted solder adheres to the socket terminal Q (substrate joint portion 521) and the through hole 504 and solidifies. As a result, the socket 502 is fixed to the payout control board 400 while the socket terminals Q and the through holes 504 (wiring patterns connected to the through holes 504) are electrically connected. At this time, if the soldering is properly performed, a solder fillet is formed by solidified solder around the socket terminal Q (substrate joint portion 521).

The solder fillet formed on the surface side of the dispensing control board 400 has a substantially conical shape, as shown in FIG. The shape of the solder fillet is preferably such that the contact angle θ (the angle formed by the tangent to the solder surface at the intersection of the substrate surface and the solder surface and the substrate surface) is between 15 degrees and 45 degrees. In this embodiment, the leg 517 has a height of 1 mm, so that the solder fillet with such a good shape (with a contact angle θ of 15 degrees to 45 degrees) does not come into contact with the socket body 515. there is Here, the diameter of the solder fillet is approximately equal to the diameter of land 526 . Therefore, when the height of the solder fillet (the length from the surface of the dispensing control board 400 to the top of the solder fillet) is substantially equal to the radius of the land 526, the top of the solder fillet and the outer edge of the solder fillet (solder fillet and dispensing control The angle between the line segment connecting the outer edge of the contact portion with the substrate 400 and the line segment connecting the outer edge of the solder fillet and the center of the bottom surface of the solder fillet (the angle between the generatrix of the solder fillet and the payout control board 400 ) is about 45 degrees. Therefore, in order to prevent a solder fillet with a good shape (with a contact angle θ of 15 to 45 degrees) from coming into contact with the socket body 515, it is preferable that the height of the leg 517 is equal to or greater than the radius of the land 526. , at least the width of the land 526 or more. Also, the height of the leg 517 may be equal to or greater than the diameter of the land 526 , in other words, it may be equal to or greater than twice the width of the land 526 .

In addition, in this embodiment, soldering is performed from the back side of the payout control board 400 . That is, in this embodiment, while soldering is performed from the back side, at least some of the socket terminals Q are soldered so that solder fillets are formed on the front side (and the back side). In addition, solder fillets may be formed on the surface side of all the socket terminals Q.

In this embodiment, the socket main body 515 is provided with a plurality of legs 517, and the gap Z is formed, so that the heat generated by the main IC 500 can be dissipated through the gap Z, thereby improving the heat dissipation performance. can be enhanced. In addition, in this embodiment, the gap Z, which takes into consideration the shape of the solder fillet, can prevent the well-shaped solder fillet from contacting the socket body 515 .

If the height of the gap Z is too high, it may become easy to mount an unauthorized component to the socket terminal Q. Therefore, the height of the leg 517 should be less than twice the diameter of the land. and more preferably 1.5 times or less the diameter of the land.

At least part of the bent portion 522 is positioned within the gap Z in this embodiment. Specifically, the socket terminal Q has a portion (first curved portion 523) that is bent in the lateral direction of the socket body 515 (the surface direction of the payout control substrate 400) on the side away from the mounting surface of the substrate joint portion 521. and the portion is located within the gap Z. Also, the socket terminal Q has a portion 527 (see FIG. 13) that protrudes in the height direction from the bottom surface of the socket body 515, and the second curved portion 524 is positioned within the gap Z. As shown in FIG. In other words, the entire bent portion 522 is positioned within the gap Z in this embodiment. In other words, the socket 502 of the present embodiment has adjacent socket terminals Q (for example, a socket terminal Q1 and a socket terminal Q1) when viewed from the longitudinal direction of the socket body 515 (the direction perpendicular to the width direction and the height direction). Q2) has a bifurcated portion (portion D shown in FIG. 13(c)), and this portion is located within the gap Z. In other words, when viewed from the longitudinal direction of the socket body 515, adjacent socket terminals Q (for example, socket terminal Q1 and socket terminal Q2) are divided into two parts (point D shown in FIG. 13(c)). , and a portion (a portion 527 protruding in the height direction from the bottom surface of the socket main body 515) where the adjacent socket terminals Q overlap and one socket terminal is hidden can be visually recognized.
The distance from the mounting surface to the bottom surface of the socket body 515 (the height of the gap Z) is 1.0 mm, but the distance from the mounting surface to the first curved portion 523 (the height of the first curved portion 523) is 1.0 mm. ) may be, for example, 0.8 mm, and the distance from the mounting surface to the second curved portion 524 (point D) (the height of the second curved portion 524 (point D)) may be, for example, 0.8 mm.

Further, in this embodiment, at least part of the bent portion 522 is located on the side farther from the mounting surface than the apex of the solder fillet of the socket terminal Q (substrate joint portion 521). Specifically, the second curved portion 524 is positioned farther from the mounting surface than the apex of the solder fillet of the socket terminal Q (substrate joint portion 521). In other words, when viewed from the longitudinal direction of the socket body 515, the bifurcated portion of the adjacent socket terminals Q (for example, the socket terminal Q1 and the socket terminal Q2) is on the side farther from the mounting surface than the top of the solder fillet. positioned. That is, the second curved portion 524 is formed at a position where the solder (solder fillet) joining the socket terminal Q and the through hole 504 does not come into contact. The height of the second curved portion 524 is preferably equal to or greater than the radius of the land 526 and at least equal to or greater than the width of the land 526 in order to prevent the solder from contacting. Also, the height of the second curved portion 524 may be equal to or greater than the diameter of the land, in other words, it may be equal to or greater than twice the width of the land 526 . In addition, the first curved portion 523 may be arranged on the side farther from the mounting surface than the apex of the solder fillet of the socket terminal Q (substrate joint portion 521) (position where the solder does not hit). In other words, the height of the first curved portion 523 may be greater than or equal to the radius of the land 526 and may be greater than or equal to the width of the land 526 . Also, the height of the first curved portion 523 may be equal to or greater than the diameter of the land, in other words, it may be equal to or greater than twice the width of the land 526 . That is, the entire bent portion 522 may be positioned further from the mounting surface than the apex of the solder fillet of the socket terminal Q (substrate joint portion 521).

As shown in FIGS. 16 and 17, the socket 502 has a center portion in the short side direction that is larger in the long side direction than both ends in the short side direction (portions where the socket terminals Q1 to Q35 or the socket terminals Q36 to Q71 are arranged). height decreases along In other words, the top surface side of the socket main body 515 has a shape in which the central portion in the short side direction is recessed toward the mounting surface side along the long side direction. In other words, a first recessed groove (first recess) 540 recessed toward the mounting surface side and extending along the long side direction is provided on the top surface side of the socket body 515 at the center in the short side direction. is formed. Further, the bottom surface side of the socket 502 has a shape in which the central portion in the short side direction is recessed toward the top surface side along the long side direction. In other words, a second recessed groove (second recess) 542 recessed toward the top surface and extending along the long side is formed on the bottom side of the socket body 515 at the center in the short side direction. It is That is, the substantially rectangular parallelepiped portion for holding the socket terminals Q1 to Q35 in the socket body 515 is defined as a first holding portion 544, and the substantially rectangular parallelepiped portion for holding the socket terminals Q36 to Q71 is defined as a second holding portion 546. Assuming that the portion that connects the holding portion 544 and the second holding portion 546 is a connecting portion 548 , the connecting portion 548 is thinner than the first holding portion 544 and the second holding portion 546 . In other words, the connecting portion 548 is positioned above the bottom surfaces of the first holding portion 544 and the second holding portion 546 and below the top surfaces of the first holding portion 544 and the second holding portion 546. . In addition, in the present embodiment, a plurality (four) of connecting portions 548 are arranged side by side along the long side direction of the socket body 515, and between adjacent connecting portions 548, there are gaps extending in the height direction. A plurality of holes 549 connecting the first groove 540 and the second groove 542 are formed.

A gap X is formed by the first concave groove 540 between the main IC 500 and the socket 502 (that is, the top surface side of the socket body 515). That is, a gap X is formed between the main IC 500 and the socket 502 so as to penetrate the socket 502 (main IC 500 ) in the long side direction. A gap Y is formed by the second concave groove 542 between the surface (mounting surface) of the payout control board 400 and the socket 502 (that is, the bottom surface side of the socket body 515). That is, a gap Y is formed between the surface (mounting surface) of the payout control board 400 and the socket 502 so as to penetrate the socket 502 (main IC 500) in the long side direction. In this embodiment, the gap Y exists integrally with the gap Z formed by the leg 517 of the socket 502, and the gap Y and the gap Z constitute one gap.

As shown in FIG. 17, on the surface of the payout control board 400, IC terminals P1 to P35 (socket terminals Q1 to Q35) and IC terminals P36 to P71 (socket terminals Q36 to Q71) and through the main IC 500 in the longitudinal direction (first ground pattern 560: ground plane). Also, on the back surface of the payout control board 400, when viewed from the above direction, a ground pattern (second A ground pattern 561 (ground plane) is provided. In other words, the first ground pattern 560 and the second ground pattern 561 are provided at positions overlapping the main IC 500 when viewed in this direction. Also, the payout control board 400 is provided with a plurality of through holes (main IC back through holes 562 ) electrically connecting the first ground pattern 560 and the second ground pattern 561 . In addition, the plurality of main IC back through holes 562 are provided at positions overlapping the main IC 500 when viewed from the direction, and are provided in plurality along the longitudinal direction of the main IC 500 . By providing the first ground pattern 560 and the second ground pattern 561 as described above, the noise resistance of the main IC 500 can be improved, and the heat dissipation can be improved.

In addition, the first ground pattern 560, the second ground pattern 561, and the main IC back through hole 562 are connected to the gap X formed between the main IC 500 and the socket 502 and the surface (mounting surface) of the payout control board 400, respectively. It is formed at a position corresponding to the gap Y formed between it and the socket 502 . In other words, at least a part of the first ground pattern 560, the second ground pattern 561 and the main IC back through-hole 562 are separated from the gap X and the gap Y when viewed in a direction orthogonal to the surface of the payout control board 400. overlap with each other. By providing such gaps X and Y, heat dissipation can be improved.

In addition, on at least one of the front surface and the rear surface of the payout control board 400, a first ground pattern 560 or a second ground pattern is provided from the outside of the main IC 500 (socket 502) in the lateral direction when viewed in a direction perpendicular to the surface of the payout control board 400. A ground pattern communicating with 561 (for example, a ground pattern passing between IC terminal P17 and IC terminal P18 of main IC 500 and/or between IC terminals P53 to P54) may be formed. That is, on at least one of the front surface and the back surface of the payout control board 400, there is a line between the IC terminals P (socket terminals Q) arranged in a row in the longitudinal direction when viewed in the direction. cross) and connected to the first ground pattern 560 or the second ground pattern 561 may be formed.

The payout control board 400 is provided with a connector 570 to which a harness used for connection with another board is connected. Also, the connector 570 has a housing 571 and a plurality of terminals 572 . The housing 571 is formed in a substantially rectangular parallelepiped shape from an insulating resin material. In addition, each terminal 572 is formed of a conductive metal, and the payout control board 400 and other boards are electrically connected via the terminals 572 . Further, when attaching the connector 570 to the payout control board 400, each terminal 572 is inserted through each of a plurality of through holes provided in the payout control board 400, and each through hole and each terminal 572 are joined by soldering. be. Thereby, the connector 570 is fixed to the payout control board 400 in a state in which each terminal 572 and each through hole (wiring pattern connected to the through hole) are electrically connected.

Further, the housing 571 is provided with a positioning pin (protrusion for positioning) 574 that protrudes from the bottom surface of the housing 571 toward the mounting surface side. holes) 575 are provided. When attaching the connector 570 to the payout control board 400, the positioning pins 574 are inserted into the corresponding through holes 575. As shown in FIG. In this embodiment, the connector 570 is attached by inserting the terminals 572 into the through holes and soldering them. It is now stable. However, by providing the positioning pin 574, it is possible to attach the connector 570 without making a mistake in the attachment direction.

Also, the length (height) of the positioning pin 574 is less than or equal to the thickness of the payout control board 400 . In other words, when the connector 570 is attached to the payout control board 400 , the positioning pin 574 does not protrude from the back surface of the payout control board 400 .

Although the positioning pin 574 is formed integrally with the housing 571 from the same material (insulating material) as the housing 571, it may be formed from a different material. Moreover, although the connector 570 has only one positioning pin 574 in this embodiment, it may have a plurality of positioning pins.

The back case 402b is slidable with respect to the front case 402a. Specifically, as shown in FIG. 7, one of the front case 402a and the back case 402b is provided with an engaging projection, and the other is a groove into which the engaging projection is inserted, extending in the left-right direction. A groove 580 extending in a direction parallel to the top surface and the back surface of the substrate case 402 is provided. By sliding the back case 402b relative to the front case 402a, movement of the back case 402b relative to the front case 402a in the front-rear direction (and the vertical direction and the back side in the insertion direction) is restricted. By crimping the front case 402a and the back case 402b in this state, the front case 402a and the back case 402b are joined together.

In addition, a plurality of ribs 581 protruding toward the inner surface side are provided on the back case 402b. The ends of the plurality of ribs 581 in the projecting direction are in contact with the back surface of the payout control board 400 housed between the back case 402b and the front case 402a. In other words, a predetermined space is formed between the surface of the back case 402 b facing the payout control board 400 and the rear surface of the payout control board 400 by the plurality of ribs 581 . In addition, the plurality of ribs 581 are adapted to be in contact with a solid ground portion (that is, a resist covering the solid ground) formed on the back surface of the payout control board 400, and are provided between the back case 40b and the front case 402a. When the back case 402b is slid with respect to the front case 402a with the control board 400 arranged, the rib 581 can slide on the solid ground portion formed on the back surface of the payout control board 400. FIG. In addition, the rib 581 slides through holes provided in the payout control board 400, terminals (leads) of various electronic components protruding from the back face of the payout control board 400, and wiring pattern portions formed on the back face of the payout control board 400. It is designed not to move. In other words, the ribs 581 do not come into contact with any through holes, terminals, or wiring patterns when the back case 402b is slid relative to the front case 402a.
Note that the "wiring pattern" here excludes the ground pattern. That is, the "wiring pattern" here can also be rephrased as a wiring pattern (signal line) through which signals pass.

(Modification)
A modification of the second embodiment will be described. In this modified example, the shape of the socket 502 is different from that described above.

In the socket 502 of this modified example, the height h of the leg 517 (the amount of protrusion from the bottom surface of the socket body 515) is 0.5 mm. A gap Z is formed between the bottom surface of the socket body 515 and the payout control board 400 by the leg 517.

Further, as shown in FIG. 19, the bottom surface of the socket body 515 has a recessed shape around the socket terminals Q. As shown in FIG. In other words, on the bottom surface of the socket main body 515, recesses 550 are formed in the portions corresponding to the socket terminals Q so as to be recessed in the direction away from the mounting surface. In this modification, two rows of recesses (grooves) 550 are formed corresponding to the socket terminals Q arranged in two rows along the longitudinal direction of the socket body 515 . Each row of the recesses 550 is divided by a leg 517 provided in the longitudinal center of the socket body 515, and a total of four recesses 550 are formed on the bottom surface of the socket body 515. .
Note that the recesses (grooves) 550 may be formed in four rows corresponding to the four rows of board joint portions 521 along the longitudinal direction of the socket body 515 . Also, one concave portion 550 may be provided for each socket terminal Q, for example.

In this modified example, the height of the portion corresponding to the socket terminal Q in the gap Z is increased by the concave portion 550 . That is, in this modification, the distance from the bottom surface of the socket main body 515 to the payout control board 400 in the portion where the concave portion 550 does not exist is 0.5 mm due to the foot 517 . Also, in the portion corresponding to the recess 550, the distance from the payout control board 400 to the socket body 515 is long, and the distance is 1.0 mm.

Here, in this modified example, the height of the leg 517 is 0.5 mm, and the diameter of the land 526 is 1.5 mm. 45 degree) solder fillet may contact the socket body 515 . However, in this modified example, the recess 550 increases the height around the socket terminal Q in the gap Z, so that the solder fillet can be prevented from coming into contact with the socket main body 515 . That is, even if the distance from the bottom surface of the socket main body 515 to the dispensing control board 400 is less than (less than) the radius of the land, the provision of the recess 550 prevents contact between the solder fillet and the socket main body 515. can be done.

Further, in the present modified example, the socket terminal Q has the bending angle α of the first curved portion 523 of 90 degrees and the bending angle β of the second curved portion 524 of 90 degrees.

The bent portion 522 (the boundary between the bent portion 522 and the substrate joint portion 521) is located on the side farther from the payout control board 400 (mounting surface) than the gap Z. In other words, the socket terminal Q has a bent portion 522 that is bent so that the positions of the IC terminal contact portion 520 and the substrate joint portion 521 in the direction of short extension of the socket body 515 are different. is positioned farther from the mounting surface side than the bottom surface of the socket body 515 (in other words, inside the socket body 515).

Further, in this modification, the distance Qx from the substrate joint portion 521 (lower end) of the socket terminal Q1 to the substrate joint portion 521 (lower end) of the socket terminal Q2 is 2.0 mm. Further, the distance Qy from the substrate joint portion 521 (lower end) of the socket terminal Q2 to the substrate joint portion 521 (lower end) of the socket terminal Q3 is 2.0 mm. Further, the distance Qz from the substrate joint portion 521 (lower end) of the socket terminal Q1 to the substrate joint portion 521 (lower end) of the socket terminal Q3 is 2.0 mm. That is, the distance between the substrate-bonding portion 521 of the socket terminal Q1 and the substrate-bonding portion 521 of the socket terminal Q2 is equal to the distance between the substrate-bonding portion 521 of the socket terminal Q1 and the substrate-bonding portion 521 of the socket terminal Q3. In other words, for a group of continuous socket terminals Q (socket terminals Q1 to Q17, socket terminals Q18 to Q35, socket terminals Q36 to Q53, or socket terminals Q54 to Q71), the distance between the substrate joint portions 521 of adjacent socket terminals Q is are equal (2.0 mm). For a group of continuous socket terminals Q (socket terminals Q1 to Q17, socket terminals Q18 to Q35, socket terminals Q36 to Q53, or socket terminals Q54 to Q71), the distance between the board joint portions 521 of adjacent socket terminals Q ( 2.0 mm) is equal to the interval (2.0 mm) between the substrate joint portions 521 of the alternate socket terminals Q. The arrangement of the through-holes 504 is the same as the arrangement of the substrate joint portions 521 of the socket terminals Q. As shown in FIG. By arranging the substrate joint portion 521 (through hole 504 ) in this manner, the socket 502 is stably held in the through hole 504 .
In this embodiment, "equal" for each interval means that the design lengths are equal, and manufacturing errors and the like may occur. In other words, "equal to" in this embodiment includes the case of being substantially equal.

The gaming machine of this embodiment is a gaming machine comprising a board 400 and a board case 402 that houses the board 400. The board 400 has a plurality of through holes used for mounting sockets 502 to which ICs 500 are mounted. The through hole 504 has a land 526, the socket 502 has a plurality of socket terminals Q electrically connecting the IC terminal P and the through hole 504, and a socket body 515 holding the socket terminals Q. and a plurality of legs 517 for supporting the socket body 515. The plurality of legs 517 form a predetermined gap Z between the socket body 515 and the substrate surface (mounting surface) of the substrate 400. In the gap Z, the distance from the socket main body 515 to the board surface (mounting surface) is equal to or greater than the width of the land 526, and the solder that joins the socket terminal Q and the through hole 504 is in contact with the socket main body 515. do not have. With such a configuration, the gap Z formed between the socket main body 515 and the mounting surface can improve the heat dissipation of the IC 500 . In addition, the height of the gap Z at least in the portion corresponding to the socket terminal Q is equal to or greater than the width of the land 526, so that the solder does not come into contact with the socket body 515, thereby further improving heat dissipation. and damage to the socket 502 can be prevented. Moreover, since the solder does not come into contact with the socket body 515 in this way, an unexpected short circuit can be prevented.

In addition, in the gaming machine of the present embodiment, the IC terminals P include a first terminal (IC terminal P1), a second terminal (IC terminal P2), and a third terminal (IC terminal P3) which are continuously arranged in a predetermined direction. ), and the socket terminal Q includes a first socket terminal (socket terminal Q1) to which the first terminal is connected, a second socket terminal (socket terminal Q2) to which the second terminal is connected, and a third terminal and a third socket terminal (socket terminal Q3) to which is connected, and the portion of each socket terminal Q that is soldered to the through hole 504 is defined as a board joint portion 521. When the first terminal P1 to the second terminal The distance to P2 and the distance from the second terminal P2 to the third terminal P3 are both equal in the first length, and the board joint portion 521 of the first socket terminal Q1 to the board joint portion of the second socket terminal Q2 is the same. 521 and the distance from the board joint portion 521 of the first socket terminal Q1 to the board joint portion 521 of the third socket terminal Q3 are both equal in the second length, and the second length is equal to the second length. longer than the length of 1. With such a configuration, the distance between the substrate joint portions of the adjacent socket terminals Q can be made wider than the distance between the adjacent terminals P of the IC, and the distance between the portions to be soldered can be made sufficiently large. can be ensured and short circuits can be prevented. In addition, the distance from the substrate-bonding portion 521 of the first socket terminal Q1 to the substrate-bonding portion 521 of the second socket terminal Q2, and the distance from the substrate-bonding portion 521 of the first socket terminal Q1 to the substrate-bonding portion 521 of the third socket terminal Q3 are equal to each other, the socket 502 is stably held in the through hole 504 .

In addition, in the gaming machine of this embodiment, a connector 570 is mounted on the board 400, the connector 570 has a positioning pin 574, and the board 400 is formed with a hole 575 into which the positioning pin 574 is inserted. , and the length of the positioning pin 574 is equal to or less than the thickness of the substrate 400 .

(Third Embodiment)
Next, a third embodiment of the invention will be described. The gaming machine of this embodiment has the same configuration as the gaming machines according to the first and second embodiments. Therefore, descriptions of the same configurations as those of the first and second embodiments are omitted or simplified.

In this embodiment, the payout control board 400 has a rectangular plate shape elongated in the left-right direction. Further, in the present embodiment, all the components mounted on the payout control board 400 are mounted on the surface side of the payout control board 400 . Hereinafter, the surface (front surface) of the payout control board 400 on which components are mounted is sometimes referred to as a mounting surface. In addition, there may be components mounted on the back side of the payout control board 400 .

In this embodiment, as shown in FIG. 20, when facing the payout control board 400 (the surface of the payout control board 400) (when the payout control board 400 is viewed from the direction orthogonal to the plate surface (surface)) , when the payout control board 400 is divided by two straight lines that pass through the center of the payout control board 400 and are orthogonal to each other, the upper right area is the first area R1, the upper left area is the second area R2, and the lower left area is the second area. The 3rd region R3 and the lower right region are called the 4th region R4. In other words, when facing the payout control board 400, the virtual straight line extending in the longitudinal direction (horizontal direction) passing through the center of the payout control board 400 is defined as the X axis, direction), the first quadrant corresponds to the first region R1, the second quadrant corresponds to the second region R2, and the third quadrant corresponds to the third region R3. , the fourth quadrant corresponds to the fourth region R4. Also, when facing the payout control board 400, payout is made on a line (plane) that passes through the center of the payout control board 400 (the center in the lateral direction) and is parallel to a predetermined side (long side) of the payout control board 400. When the control board 400 is divided into two, one area is called a first specific area S1, and the other area is called a second specific area S2. In this embodiment, the first specific region S1 is composed of the first region R1 and the second region R2, and the second specific region S2 is composed of the third region R3 and the fourth region R4. Note that, for example, the first specific region S1 may be composed of the first region R1 and the fourth region R4, and the second specific region S2 may be composed of the second region R2 and the third region R3. .
Note that the payout control board 400 may be shaped like a rectangular plate with a part missing. In the case of such a shape, the straight line (virtual straight line) that separates each region described here and passes through the center of the payout control board 400 is a virtual rectangle (virtual straight line) along the outer edge of the payout control board 400 ( It can be interpreted as a straight line (virtual straight line) passing through the center of the virtual rectangle (assuming that the part is not missing) (see FIG. 21).

In addition, in the present embodiment, when facing the payout control board 400, the upper long side is called the first long side, the lower long side is called the second long side, and the right short side is the first long side. The short side is called the short side, and the left short side is called the second short side. That is, the first specific region (the first region and the second region) can also be called the region on the first long side, and the second specific region (the third region and the fourth region) can also be called the region on the second long side. I can say. Further, the first area and the fourth area can be said to be areas on the first short side, and the second area and the third area can be said to be areas on the second short side.

As shown in FIG. 20, the payout control board 400 includes parts ( A plurality of connectors (equipment component connection connectors) 600 used for connection with game machine components) are mounted. The payout control board 400 is electrically connected to components installed in the gaming machine via each connector 600 and a harness connected to each connector 600 . In addition, the parts mounted on the game machine may be a board or the like for connecting a device outside the game machine (for example, a so-called hall computer, a CR unit, etc.) and the game machine (payout control board 400). Also, the gaming machine mounted parts may be, for example, various switches, sensors, motors, solenoids, and the like.

In this embodiment, a full tank switch that detects that the lower tray (receiving tray) is full, a front frame open switch that detects the opening of the front frame 10, an inner frame open switch that detects the opening of the inner frame 7, A payout counting switch, a payout motor, a firing device, an external terminal plate, etc., and the payout control board 400 are connected via a first predetermined board. A connector used for connection with a predetermined board is mounted. The external terminal board is a board for connecting the game machine to external electronic equipment (data display device, hall computer, etc.). An information signal is output toward an external electronic device. In addition, the discharge control board 400 is connected to the discharge control board 400 with a discharge lever volume for detecting the amount of rotation of the handle, a discharge stop switch for detecting a discharge stop operation for stopping the discharge of the game ball, etc., via a second predetermined board. A connector used for connection with the second predetermined board is mounted on the payout control board 400 as a connector 600 . A connector used for connection with the main control board 200 is mounted on the payout control board 400 as a connector 600 .

A plurality of connectors 600 are arranged in the first specific region S1. Specifically, the connector 600 is arranged in the vicinity of the edge facing the boundary with the second specific region S2 in the first specific region S1. In other words, the connector 600 is arranged in the first long side portion of the first specific region S1. Specifically, a plurality of connectors 600 are arranged along the edge (in the vicinity of the edge). Note that the connectors 600 may all be arranged along the edge (near the edge) (see FIG. 21). Also, all of the connectors 600 may be arranged in the first region R1.

The main IC 500 and mass-production unmounted component placement area B (the area inside the two-dot chain line in FIG. 20) are arranged in the second specific area S2. Specifically, the main IC 500 and the mass-production non-mounted component arrangement area B are arranged in the third area R3. In this embodiment, the main IC 500 is mounted on the payout control board 400 via the socket 502 , but may be mounted (soldered) directly on the payout control board 400 without the socket 502 .

In this embodiment, the mass-production unmounted component placement region B is an area in which test components (test connectors, test ICs, test passive elements, etc.) are placed as mass-production unmounted components. In mass-production non-mounted component placement region B, mounting portions 405 (lands, through holes, etc.) for placing (soldering) test components and silk 406 for test components are provided. That is, the test component can be mounted in the second specific area S2 (third area R3).
Note that the test component may be a component mounted during mass production (mass-produced component).

Further, the connector 600 is not arranged in the third region R3. Specifically, the connector 600 is not arranged in the second specific region S2. That is, in the present embodiment, the connector 600 is arranged in one area (upper area: first specific area S1) when the payout control board 400 is divided into two in a predetermined direction (vertical direction), and the connector 600 is arranged in the other area. One side of the region (lower region: second specific region S2) further divided into two in a direction (left and right direction) perpendicular to the predetermined direction (left side when facing payout control board 400: third The main IC 500 and test components can be mounted in the 3 area R3). Also, the connector 600 is not arranged on the one side (the third region R3), more specifically, the other region (the second specific region S2).

(Modification)
As shown in FIG. 21, in the gaming machine of this embodiment, a main IC 500 and a verification terminal 602 may be arranged in the third region R3 (second specific region S2). In this case, the third region R3 (second specific region S2) may or may not be mountable with test components.
Here, the reference terminal 602 is a connector (terminal) used for a predetermined inspection, capable of outputting predetermined information, and connectable to an inspection terminal (inspection equipment). The verification terminal 602 is normally not connected to the inspection terminal, and is connected to the inspection terminal only during inspection. By connecting an inspection terminal to the collation terminal, it is possible to inspect whether or not the payout control board 400 has been illegally modified. Here, the predetermined information output from the verification terminal 602 includes the ID of the payout control board 400 and the like.
In the gaming machine of the present embodiment as a mass-produced product, wiring (harness) is connected to all of the plurality of connectors 600, and the payout control board 400 has wiring (harness) in addition to the verification terminal 602. There are no unconnected connectors. However, for example, in addition to the reference terminal 602, there may be a connector to which wiring (harness) is not connected. may be a connector to which wiring (harness) is not connected. Moreover, such a test connector may be arranged in the third region R3 (the second specific region S2).

The main IC 500 and the verification terminal 602 are connected via electronic components and wiring patterns. Specifically, the payout control board 400 has predetermined signal lines 604 and 604 that connect the main IC 500 and the verification terminal 602 as wiring patterns. Resistors 606, 606 are provided. Resistor 606 is a leaded resistor and has a resistor body and two leads (terminals: legs) extending from the resistor body. The resistor 606 is attached to the payout control board 400 by soldering with two leads inserted through through holes provided in the payout control board 400 .

The height of resistor 606 is lower than the height of main IC 500 . Specifically, when mounted on the payout control board 400, the height of the resistor 606 is less than half the height of the main IC 500. FIG. Also, the height of the resistor 606 is lower than the height of the reference terminal 602 . Specifically, when mounted on the payout control board 400, the height of the resistor 606 is less than half the height of the collation terminal 602. As shown in FIG.
Here, the “height” of each electronic component is the distance in the height direction from the mounting surface of the payout control board 400 to the tip of each electronic component in the projecting direction (the part farthest from the mounting surface). say.

Note that in this embodiment, there are two signal lines 604 that connect the main IC 500 and the verification terminal 602 , and each of the two signal lines 604 is provided with a resistor 606 . Besides the resistor 606, there is no electronic component provided on the signal line 604 connecting the main IC 500 and the verification terminal 602. FIG. In other words, in the payout control board 400, all the electronic components provided on the signal line 604 connecting the main IC 500 and the verification terminal 602 are lower than the main IC 500 and lower than the verification terminal 602. ing.
In this embodiment, the collation terminal 602 has four terminals, two of which are connected to the signal lines 604 and 604, and the other two terminals are connected to the ground pattern. It is

In this embodiment, the payout control board 400 is attached in the arrangement shown in FIG. FIG. 22 is a view of the gaming machine viewed from the rear side (rear side). As shown in FIG. 22 , the payout control board 400 is arranged below the main control board 200 . In addition, the connector 600a used for connection with the main control board 200 is arranged above the payout control board 400, and the payout control board 400 and the main control board 200 are electrically connected via the connector 600a. ing.

Further, no other board is arranged below the payout control board 400 . In other words, the payout control board 400 is the lowest board among all the boards installed in the gaming machine.
Here, "no other board is arranged on the lower side (the board is arranged on the lowest side)" means that the upper end of all the other boards is lower than the lower end of the payout control board 400. However, the lower ends of all the other boards are above the lower end of the payout control board 400 (at least above the lower end of the payout control board 400 in the vertical direction). above).

In addition, the payout control board 400 is arranged so as to overlap other boards in the front-rear direction (the direction orthogonal to the surface (board surface) of the payout control board 400). Specifically, in front of the payout control board 400, a power supply board 610 as the other board is arranged. The power board 610 is a board connected to each board, and power is supplied to each board from a commercial power supply via the power board. In addition, the payout control board 400 is arranged at the rearmost among the plurality of boards arranged overlapping in the front-rear direction. In other words, when the game machine is viewed from the back side (when the inner frame 7 is opened and the payout control board 400 is faced directly), the payout control board 400 is the closest side among the boards overlapping in the front-rear direction. (observer side). In other words, when viewing the mounting surface of the payout control board 400 from the back side of the gaming machine (when viewing the mounting surface of the payout control board 400 with the inner frame 7 in the open state), the view is blocked by other boards. It seems that there is no

The gaming machine of the present embodiment is a gaming machine that includes a substrate 400 on which electronic components are mounted. A connector 600 used for electrical connection with a component mounted on the is arranged, and when the other area (second specific area S2) is further divided into two in the direction orthogonal to the predetermined direction, one On the side (third area R3) are a control means (main IC 500) for controlling processing in the substrate 400, and a mounting section 405 on which a predetermined electronic component is not mounted. , and are arranged, and the connector 600 is not arranged. According to such a configuration, the control means 500 is arranged in one area (third area R3) when the substrate 400 is divided into four parts, and the parts mounted on the game machine are electrically connected to the area. Since the connector 600 that is used for the normal connection is not arranged, it is possible to prevent the visibility of the control means 500 from being lowered by the harness or the like connected to the connector 600 . Further, by arranging the mounting portion 405 on which no electronic component is mounted in the area, the visibility of the control means 500 can be improved. Further, by arranging the mounting portion 405 in this area, it is possible to increase the degree of freedom in arranging the connector 600 while ensuring the visibility of the control means 500 .

Further, the gaming machine of the present embodiment is a gaming machine that includes a substrate 400 on which electronic components are mounted, and the substrate 400 is divided into two in a predetermined direction, and one region (first specific region S1) has the corresponding When the connector 600 used for electrical connection with parts mounted in the game machine is arranged, and the other area (second specific area S2) is further divided into two in the direction perpendicular to the predetermined direction. A control means (main IC 500) for controlling processing in the substrate 400 and an inspection terminal (verification terminal 602) used for a predetermined inspection are arranged on one side (third area R3) of the Connector 600 is not placed. According to such a configuration, the control means 500 is arranged in one area (third area R3) when the board is divided into four parts, and the parts mounted on the game machine are electrically connected to the area. Since the connector 600 used for such connection is not arranged, it is possible to prevent deterioration of the visibility of the control means 500 due to a harness or the like connected to the connector 600 . In addition, by arranging the inspection terminal 602 used for a predetermined inspection, that is, the connector to which the harness is not normally connected, in this area, the visibility of the control means is ensured, and the other connector 600 can be connected. The degree of freedom of arrangement can be increased.

(Fourth embodiment)
A fourth embodiment of the present invention will now be described.
The gaming machine of the present embodiment basically has the same configuration as that of the gaming machine of the first embodiment. be omitted or simplified. Although the payout control board unit 700 including the payout control board 400 (hereinafter referred to as the board 400) will be described below, the present invention is applicable to other predetermined board units provided in the gaming machine.

23 is an exploded perspective view of the payout control board unit 700. FIG. The payout control board unit 700 has a substantially square shape (substantially rectangular shape). Specifically, it is long in the horizontal direction and short in the vertical direction. The payout control board unit 700 mainly includes a board 400 (payout control board, payout control means), a board case 701 for accommodating (storing, enclosing) the board 400 inside, screws (not shown), and the like. ing.

The board case 701 includes a first case 710 covering the front side (first surface side) of the board 400 and a second case 720 covering the rear side (second surface side) of the board 400 . Each of the first case 710 and the second case 720 has a top surface (bottom surface) and predetermined side surfaces (side walls), and has a substantially box shape. A space is formed inside by assembling the first case 710 and the second case 720, and the substrate 400 is accommodated in the space. The substrate case 701 is made of a transparent synthetic resin so that the substrate 400 arranged inside can be viewed from the outside.

Here, the surface on the front side (front side) of the substrate 400 is referred to as a first surface (front surface), and the surface on the rear side (rear surface side) is referred to as a second surface (rear surface). The first surface of the substrate 400 faces the top surface portion (first top surface) of the first case 710 . The second surface of the substrate 400 faces the top surface portion (second top surface) of the second case 720 . The top surface portion of the first case 710 may be referred to as the top surface portion of the substrate case 701 , and the top surface portion of the second case 720 may be referred to as the bottom surface portion of the substrate case 701 .

FIG. 24 is a schematic diagram of the first surface of the substrate 400 viewed from the front side (front side). The substrate 400 has a rectangular plate shape, and is arranged so that the long sides extend in the horizontal direction, the short sides extend in the vertical direction, and the normal direction of the substrate surface (thickness direction) is the front-back direction. It is One of the long sides of the substrate 400 is positioned on the upper side, the other of the long sides is positioned on the lower side, one of the short sides is positioned on the right, and the other of the short sides is positioned on the left.

The substrate 400 has a plurality of through holes 450 passing through the first surface and the second surface. In this embodiment, the through holes 450 are formed at the four corners of the substrate 400, respectively. Note that four or more through holes 450 may be provided. Also, there may be less than four through-holes 450 , for example, two at each diagonal corner of the substrate 400 . In this embodiment, the through holes 450 include those used for fixing to the substrate case 701 (first case 710) and those used for positioning the substrate 400 (described later).

Although illustration is simplified (omitted), a plurality of components (various electronic components) are mounted (arranged) on the first surface of the substrate 400 . The multiple components include connectors, ICs, resistors, capacitors, diodes and switches. Although illustration is omitted, on the substrate 400, identification information (identification code) for identifying (identifying) each electronic component (which enables identification of each electronic component) is provided to indicate the arrangement position of each electronic component. located nearby. The identification information is composed of predetermined characters or a predetermined character string (the character string may include numbers and symbols). A character string "CN1" is formed by combining "CN" and the number "1". This identification information is formed (written) by silk printing, and is white in this embodiment. The identification information can also be referred to as silk letters. Further, in this embodiment, the substrate 400 is a green substrate. In other words, the substrate 400 has a green resist color. Although not shown, the substrate 400 is provided with a plurality of through holes.

As shown in FIG. 23, the first case 710 has two mounting holes 711 (substrate mounting portions). The mounting holes 711 are provided at positions corresponding to (facing) the through holes 450 provided at the diagonal corners of the substrate 400 . The substrate 400 is fixed to the first case 710 by passing a screw (not shown) through the through hole 450 from the second surface side (rear surface side) of the substrate 400 and screwing (inserting) the screw into the mounting hole 711 . It's like

The first case 710 also has two positioning pins 712 . The positioning pins 712 are provided at positions corresponding to (opposing to) the through holes 450 provided at the diagonal corners of the substrate 400 . The positioning pin 712 protrudes from the front side toward the rear side by a predetermined length, is formed in a cylindrical shape, and has a diameter that allows it to be inserted into the through hole 450 . The rotation of the substrate 400 is restricted by inserting the positioning pin 712 into the through hole 450 .

Here, another example of the board and the board case (fixing the board to the board case) will be shown with reference to FIGS. 25 to 27. FIG. A substrate 400 shown in FIG. 25 has five through holes 450 . The through holes 450 are provided at the four corners and at the substantially central portion in the left-right direction on the lower side.

FIG. 26 is a rear view of the first case 710 corresponding to the substrate 400 shown in FIG. The first case 710 has five bosses 715 (board mounting portions). The boss 715 is provided at a position corresponding to (facing) the through hole 450 of the substrate 400 . The boss 715 protrudes from the front side toward the rear side by a predetermined length and is formed in a columnar shape (cylindrical shape). The boss 715 is provided with a screw hole for inserting a screw (for tightening the screw). The diameter of this screw hole can also be said to be the inner diameter of the boss 715 . The substrate 400 is fixed (fastened) to the first case 710 by passing screws through the five through holes 450 from the second surface side (rear surface side) of the substrate 400 and screwing (inserting) the screws into the screw holes of the bosses 715 . It is designed to be

When the screw is inserted into the screw hole by a predetermined amount (predetermined length), the tip surface of the boss 715 comes into contact with the first surface of the substrate 400 and the head of the screw touches the first surface of the substrate 400 . It will be in contact with two sides. That is, the substrate 400 is sandwiched between the tip surface of the boss 715 and the head of the screw and fixed (fixed state). At this time, the screw is in a state in which it does not rotate any more (a state in which the screw is tightened without loosening). This may be referred to as the maximum screw insertion state. The head of the screw protrudes from the second surface of the substrate 400 when the substrate 400 is fixed.

In this embodiment, patterns made of copper foil are formed on the first and second surfaces of the substrate 400 (copper foil is attached). The patterns include a wiring pattern through which signals pass and a ground pattern (solid ground).

FIG. 27(a) is a diagram showing the second surface of the substrate 400 shown in FIG. In this embodiment, a predetermined region (predetermined range) including at least the periphery of the through hole 450 is a region where no pattern is formed (pattern non-formation region N: hatched portion in the figure). In the present embodiment, the periphery of each through-hole 450 (five places) and the peripheral edge portion (edge portion of each side) of the substrate 400 constitute the pattern non-formation region N (insulating region). It is sufficient that the periphery of the hole 450 becomes the pattern non-formation region N. Each through hole 450 is provided in the pattern non-formation region N. As shown in FIG.

FIG. 27(b) shows a state in which screws are inserted through the through holes 450 in FIG. The pattern non-formation region N has a size such that at least the screw head does not protrude from the pattern non-formation region N (a size that does not allow the screw head to enter the pattern formation region). In other words, the head of the screw is sized to fit inside the pattern non-formation region N. As shown in FIG. Specifically, the distance (shortest distance) between the end (peripheral portion) of the screw head and the copper foil is, for example, about 1 mm to 2 mm. Therefore, when the screw is tightened, the head of the screw comes into contact with the pattern non-formation area N, so that the head of the screw does not come into contact with the pattern (copper foil). As a result, it is possible to prevent the screw and the pattern (such as solid ground) from being electrically connected to each other, causing a short circuit or the like, and damaging the parts (causing trouble). Also, it is possible to prevent the pattern from being damaged due to the contact of the head of the screw.

Although illustration is omitted, in FIG. 27A, for example, a through hole 450 is provided in the central portion of the substrate 400, and a predetermined range around the through hole 450 becomes the pattern non-formation region N. may be In other words, the predetermined pattern non-formation region N may be provided so as not to be continuous with other pattern non-formation regions N (in an isolated state). It should be noted that the pattern non-formation region N is a region in which no pattern is provided but a resist is provided.

As the screws, countersunk screws as well as pan screws can be used. Since flat head screws have a conical bearing surface, the distance (shortest distance) to the copper foil is greater when flat head screws are used than when pan head screws are used. can do. In other words, it can be made less likely to come into contact with the copper foil.

Next, the first surface side will be described. The tip surface of the boss 715 (FIG. 26) contacts the first surface of the substrate 400, and the boss 715 (substrate attachment portion) serves as a substrate support portion (contact surface, receiving surface) for supporting the substrate. also functions as A predetermined shape other than the boss 715 may be provided on the first case 710 as the substrate support portion. As the predetermined shape, for example, a protrusion (protrusion) erected at a corner (a position facing the corner of the substrate) or a predetermined length extending inward from the side surface of the case (inner surface of the side wall) may be used. There are ribs (projections) and the like formed as follows. For example, in addition to the positions corresponding to the four corners of the substrate, when the substrate supporting portions (convex portions) are provided at positions corresponding to the approximately central portion of the substrate in the left-right direction, in addition to the four corners of the substrate, approximately the center of the substrate in the left-right direction is provided. The part is supported from the first surface side. Therefore, when a force is applied to the substrate from the second surface side, it is possible to make the substrate less likely to flex (it is possible to suppress the flexing of the substrate).

As shown in FIG. 25, in this embodiment, the first surface of the substrate 400 is also provided with a pattern non-formation region N (hatched portion). The substrate supporting portion (boss 715) contacts (abuts) the pattern non-formation region N. As shown in FIG. In other words, on the first surface of the substrate 400, the pattern non-formation region N is at least the portion that contacts the substrate supporting portion. In other words, the pattern non-formation region N is a predetermined range on the first surface of the substrate 400 that includes the range in contact with the substrate supporting portion. In the present embodiment, when comparing the first surface and the second surface of the pattern non-formation region N around the predetermined through-hole 450, the first surface has a larger area. This is because, in this embodiment, the diameter of the boss 715 is larger than the diameter of the screw head. The shortest distance between the outer periphery of the boss 715 and the copper foil on the first surface may be smaller than the shortest distance between the outer periphery of the screw head and the copper foil on the second surface. Also, pattern non-formation regions may be formed in the same manner (in the same range) on the first surface and the second surface. Further, predetermined information (substrate control number, etc.) may be displayed in the pattern non-formation regions N of the first and second surfaces.

Bosses, ribs, and the like, which serve as substrate support portions, are made of resin and are not electrically conductive when they come into contact with the pattern (copper foil). However, when the pattern (copper foil) is contacted and pressed, the pattern may be damaged or disconnected. In this embodiment, since the substrate support portion is in contact with the pattern non-formation region N, the pattern is not damaged or the wire is disconnected due to pressure, and the occurrence of defects (damage to parts) is prevented. can be suppressed.

Although illustration is omitted, pattern non-formation regions N are also provided on the first and second surfaces of the substrate 400 shown in FIG. ) and the pattern are avoided.

At least one connector is arranged on the first surface of the board 400, and as shown in FIG. 400 side) has a concave portion 718 (concave shape). The recess 718 is provided with an opening through which the connector is exposed to the outside.

In this embodiment, the bottom (bottom surface) of the concave portion 718 and the first surface of the substrate 400 (the portion around the connector) are in surface contact. area to which the copper foil is applied). In other words, like the bottom of the concave portion 718 in the board case 701 (first case 710), the portion that can be in surface contact with the mating component (the portion where the contact area is relatively large) is not the pattern non-formation region N but the pattern formation region N. It may be a region. The contact area is large, and the load (stress) is distributed so that it is difficult to concentrate on one point. On the other hand, a portion (a portion with a relatively small contact area), such as the tip of the boss 715 (FIG. 26) in the board case 701, which can come into point contact with the mating component, is a pattern non-formation region N (copper foil is applied). area). This is because the contact area is small and the load (stress) tends to concentrate.

FIG. 29 is a partially enlarged view showing a predetermined through-hole 450 and its surroundings on a predetermined surface of the substrate 400. FIG. In this embodiment, at the boundary portion (boundary portion) between the pattern formation region (copper foil-applied region) and the pattern non-formation region N (non-copper foil region), the edge of the pattern formation region is A plurality of ground through holes H are provided along (along) the portion. As a result, the ground is strengthened, the noise immunity of the board can be improved, and the stable operation of the board can be realized. A wiring pattern through which signals pass is formed in the pattern forming region, and ground through holes H are provided further outside the wiring pattern located on the outermost side (peripheral side) of the substrate among the wiring patterns. ing. Therefore, it is possible to reduce the influence of noise on the outermost wiring pattern. In addition, since a plurality of ground through holes H are provided at the outer end portion of the pattern formation region (a plurality of current flow paths are provided) to strengthen grounding, for example, screws used for fixing the substrate can be inserted through the ground through holes H. Even if electricity (static electricity) flows into the housing, the electricity can be released more reliably.
In addition, the ground through hole H provided in this boundary part has a state in which the solder enters inside (a state in which the solder is buried) and a state in which the solder does not enter the inside (a state in which the solder is not buried). state) and

In the present embodiment, the board unit (payout control board unit 700) is arranged in the gaming machine so that the normal direction of the board surface is the front-rear direction, but the normal direction of the board surface is the vertical direction. (for example, so that the first surface faces upward) in the gaming machine.

FIG. 30 is a schematic cross-sectional view showing the substrate 400 fixed to the first case 710 (boss 715). In addition, in FIG. 30, hatching indicating a cross section is partially omitted. FIG. 30 shows a state (specific state, first state) in which the screw α is tightened without loosening and the substrate 400 is properly (appropriately) fixed to the first case 710 (boss 715).

The first surface (surface) of the substrate 400 and the top surface of the first case 710 (upper case) face each other. The first surface of the substrate 400 can be visually recognized through the top surface portion of the first case 710 . Specifically, various electronic components arranged on the first surface can be visually recognized. In FIG. 30, the lead component β and the connector γ can be visually recognized through the top surface portion of the first case 710 . The connector γ is a connector (non-exposed connector) that is covered with the top surface of the first case 710 without being exposed through the opening provided in the first case 710 . Non-exposed connectors include, for example, those for development that are used only during development and are not used during mass production, and those that are used when additional functions (specifications) are decided for later models, and are used during mass production of current models. There are those for functional expansion that are not used, and those for testing that are used in predetermined tests conducted to provide gaming machines to the market but are not used during mass production.

The second surface (rear surface) of the substrate 400 faces (faces) the top surface of the second case 720 (lower case). The second surface of the substrate 400 can be visually recognized through the top surface portion of the second case 720 . In FIG. 30 , the terminal of the lead component β and the head of the screw α can be visually recognized through the top surface of the second case 720 .

Electronic components arranged on the first surface of the substrate 400 include those (lead components β) that include a body portion and lead terminal portions (leads) (terminals) extending from the body portion. Examples of lead components β (discrete components β) include diodes, ICs, capacitors, and resistors. The lead component β is fixed (mounted) to the substrate 400 by soldering with the lead terminal portion inserted into a through hole formed in the substrate 400 . The lead terminal portion protrudes from the second surface of the substrate 400 by a predetermined length. Further, if the portion of the lead terminal portion opposite to the side connected to the main body portion is the leading end side of the lead terminal portion, in the present embodiment, the leading end side of the lead terminal portion is bent. For example, in the case of a resistor having two leads, the tip of each terminal is bent inward. The electronic components arranged on the substrate 400 may include chip components (chip-type components) in addition to lead components.

As shown in FIG. 30, the height dimension of the boss 715 (substrate mounting portion) is defined as dimension L. As shown in FIG. A dimension L is a dimension from the top surface (inner surface) of the first case 710 to the tip of the boss 715 (the first surface of the substrate 400). Further, in the state shown in FIG. 30, the height dimension of the connector γ (non-exposed connector) from the first surface of the substrate 400 is defined as dimension M. As shown in FIG. When a plurality of non-exposed connectors such as the connector γ are arranged on the substrate 400, the dimension M is the height of the one with the highest (largest) height from the first surface. Further, in the state shown in FIG. 30, the dimension from the first surface of the substrate 400 to the tip of the screw α inserted into the boss 715 is defined as the dimension N. As shown in FIG. The tip of the screw α is the end opposite to the head of the screw α.

In this embodiment, the dimension L (sixth dimension) is larger than the dimension M (seventh dimension). When the screw α is tightened to attach the substrate 400 to the first case 710 (boss 715 ), the connector γ does not come into contact with the top surface of the first case 710 . This can prevent the connector γ from being damaged.
Also, the dimension N (eighth dimension) is smaller than the dimension M (seventh dimension). If the dimension N is larger than the dimension M, the connector γ is likely to come into contact with the top surface of the first case 710 because the screw α is inserted deep into the boss 715 . , and the dimension N are set smaller than the dimension M, such a risk can be reduced.

Also, in the state shown in FIG. 30, the dimension from the second surface (rear surface) of the substrate 400 to the tip (top) of the head of the screw α is defined as dimension B (second dimension). Also, in the state shown in FIG. 30, the dimension (projection amount) from the second surface (rear surface) of the substrate 400 to the tip of the lead terminal portion of the lead component β is defined as dimension A (first dimension). When a plurality of lead parts β (diodes, ICs, capacitors, resistors, etc.) are arranged on the substrate 400, the dimension A is the amount of protrusion of the lead terminal portion having the largest height from the second surface. and It should be noted that the plurality of lead components β may be configured so that all the dimensions A are the same. In the state shown in FIG. 30, the dimension (distance) from the second surface (back surface) of the substrate 400 to the top surface (inner surface) of the second case 720 is defined as dimension C (third dimension).

Dimension B is larger than dimension A in this embodiment. Dimension C is larger than dimension B in this embodiment. When the board 400 is attached to the first case 710 , the head of the screw α and the tip of the lead terminal portion of the lead component β do not contact the top surface of the second case 720 . This can prevent damage to the second case 720, lead parts, and the like.

Here, in the state shown in FIG. 30, the amount of insertion of the screw α into the boss 715 (the amount of engagement of the screw) is defined as dimension E (fifth dimension). In other words, let dimension E be the length (dimension) of the screw α being inserted into the screw hole of the boss 715 . Also, in the state shown in FIG. 30, the distance (dimension) from the tip (top) of the head of the screw α to the top surface (inner surface) of the second case 720 is defined as a dimension D (fourth dimension). Note that the dimension D can also be said to be the difference between the dimension C and the dimension B. Dimension E is larger than dimension D in this embodiment.

Here, consider a case where the screw α is loosened due to the influence of vibration or the like, and the substrate 400 moves to the second case 720 side together with the screw α. When the dimension E is smaller than the dimension D (when the dimension D is greater than the dimension E), the dimension E becomes 0 before the head of the screw α contacts the top surface of the second case 720, and the screw α It falls out of the boss 715. In this case, since the screw α does not exist, the terminal of the lead component β may come into contact with the top surface of the second case 720, causing the lead component β to come off (fall off) from the substrate 400 or break the lead component β. There is

Dimension E is larger than dimension D in this embodiment. Therefore, when the head of the screw α contacts the top surface of the second case 720 (that is, when the dimension D=0), the dimension E>0 (the insertion amount of the screw α is ensured). ), and the screw α does not drop out of the boss 715 . Therefore, even if the head of the screw α contacts the top surface of the second case 720, the presence of the screw α prevents the terminal of the lead component β from coming into contact with the top surface of the second case 720 ( A gap is secured between the terminal of the lead component β and the top surface of the second case 720). Therefore, if the screw α is loosened in tightening, the terminals of the lead component β come into contact with the top surface of the second case 720, thereby preventing the lead component β from coming off the substrate 400 or damaging the lead component β. can be prevented.

The gaming machine of this embodiment is
Equipped with a substrate 400, a substrate case 701, and screws,
The substrate case includes a first case 710 covering the first surface side of the substrate and a second case 720 covering the second surface side of the substrate,
The board is fixed to the first case by inserting the screw from the second surface side and screwing it to the board mounting portion of the first case,
The terminal of the electronic component inserted from the first surface side of the substrate protrudes from the second surface by a predetermined length,
The electronic component is visible through the top surface of the first case facing the first surface of the substrate,
Through the top surface of the second case facing the second surface of the substrate, the terminal of the electronic component and the head of the screw are visible,
In a state in which the screw is tightened without loosening and the board is fixed to the first case,
A dimension from the second surface of the substrate to the tip of the terminal of the electronic component is defined as a first dimension,
A dimension from the second surface of the substrate to the tip of the head of the screw is defined as a second dimension,
Assuming that the dimension from the second surface of the substrate to the top surface of the second case is the third dimension,
the third dimension being greater than the second dimension;
The second dimension is larger than the first dimension.

The third dimension is larger than the second dimension, and the second dimension is larger than the first dimension when the screw is tightened without loosening and the board is fixed to the first case. It's getting bigger. Therefore, the tip of the head of the screw and the tip of the terminal of the lead component do not come into contact with the top surface of the second case. As a result, it is possible to prevent damage to the second case, the lead parts, and the like.

In addition, the gaming machine of this embodiment is
Equipped with a substrate 400, a substrate case 701, and screws,
The substrate case includes a first case 710 covering the first surface side of the substrate and a second case 720 covering the second surface side of the substrate,
The board is fixed to the first case by inserting the screws from the second surface side and screwing the board mounting portions (711, 715) of the first case,
The terminal of the electronic component inserted from the first surface side of the substrate protrudes from the second surface by a predetermined length,
The electronic component is visible through the top surface of the first case facing the first surface of the substrate,
Through the top surface of the second case facing the second surface of the substrate, the terminal of the electronic component and the head of the screw are visible,
In a state in which the screw is tightened without loosening and the board is fixed to the first case,
A first dimension (dimension A) is defined as a dimension from the second surface of the substrate to the tip of the terminal of the lead component,
A second dimension (dimension B) is defined as a dimension from the second surface of the substrate to the tip of the head of the screw;
A dimension from the second surface of the substrate to the top surface of the second case is defined as a third dimension (dimension C),
A fourth dimension (dimension D) is defined as a dimension from the tip of the head of the screw to the top surface of the second case,
Assuming that the length of the screw inserted into the board mounting portion is a fifth dimension (dimension E),
the third dimension being greater than the second dimension;
the second dimension being greater than the first dimension;
The fifth dimension is greater than the fourth dimension.

The third dimension is larger than the second dimension, and the second dimension is larger than the first dimension when the screw is tightened without loosening and the board is fixed to the first case. It's getting bigger. Therefore, the tip of the head of the screw and the tip of the terminal of the lead component do not come into contact with the top surface of the second case. As a result, it is possible to prevent damage to the second case, the lead parts, and the like. Further, since the fifth dimension is larger than the fourth dimension, if the tightening of the screw is loosened, the screw moves toward the top surface of the second case, and the head of the screw is in contact with the top surface of the second case and the fourth dimension=0, the fifth dimension>0. Therefore, even when the head of the screw comes into contact with the top surface of the second case, the screw is inserted into the board mounting portion by a predetermined amount, and the screw falls out of the board mounting portion. I have nothing to do. Therefore, the terminal of the lead component does not come into contact with the top surface of the second case when the screw falls off (because the screw does not exist). This prevents the lead component from contacting the top surface of the second case and detaching from the substrate or damaging the lead component when the tightening of the screw is loosened. be able to.

Also, in the gaming machine of the present embodiment,
A sixth dimension (dimension L) is defined as a dimension from the first surface of the substrate to the top surface of the first case,
The height from the first surface of the connector arranged on the first surface of the substrate and covered with the top surface of the first case is defined as a seventh dimension (dimension M),
Assuming that the dimension from the first surface of the substrate to the tip of the screw inserted into the substrate mounting portion is an eighth dimension (dimension N),
the sixth dimension is greater than the seventh dimension;
The eighth dimension is smaller than the seventh dimension.

Since the sixth dimension is larger than the seventh dimension, in a state in which the screw is tightened without loosening and the substrate is fixed to the first case, the connector is positioned on the top surface of the first case. do not come into contact with This can prevent damage to the connector. Further, if the eighth dimension is larger than the seventh dimension, there is a risk that the connector will come into contact with the top surface of the first case due to the deep insertion of the screw into the board mounting portion. However, in the present embodiment, since the eighth dimension is set smaller than the seventh dimension, such fear can be reduced.

(Fifth embodiment)
Next, a fifth embodiment of the invention will be described. In the following, explanations of the same configurations as those of the gaming machine of the fourth embodiment will be omitted or simplified. Also, although the board 400 of the payout control board unit 700 is used for the description, the present invention is also applicable to other predetermined boards included in the gaming machine.

FIG. 31(a) shows an electrolytic capacitor 810 (first component), which is one of the lead components arranged on the substrate 400. FIG. The electrolytic capacitor 810 includes a cylindrical body portion 811 and lead terminal portions 812 extending from the bottom portion of the body portion 811 . The lead terminal portion 812 consists of two leads (a pair of leads). The two leads are provided in a predetermined direction (along) with a predetermined spacing α (the spacing between the leads is α).

Although illustration is omitted, the substrate 400 is provided with through holes (holes) through which the lead terminal portions 812 of the electrolytic capacitor 810 can be inserted. Assuming that the interval (pitch) between the through holes (holes) is β, the interval β is larger than the interval α in this embodiment. Therefore, as shown in FIG. 31(b), the lead terminal portion 812 of the electrolytic capacitor 810 is subjected to bending (forming) so that the interval on the tip side becomes β.

The electrolytic capacitor 810 is fixed to the substrate 400 by soldering with the lead terminal portions 812 inserted (inserted) into the through holes (holes) of the substrate 400 . FIG. 31(c) shows the second surface side of the substrate 400. With the electrolytic capacitor 810 attached to the substrate 400, the leading end side of the lead terminal portion 812 is bent. In this embodiment, the tip of each lead faces outward (diagonally outward).

As shown in FIG. 32(a), a predetermined distance γ is secured between (the bottom portion of) the body portion 811 and the surface (first surface, mounting surface) of the substrate 400 (the predetermined gap γ is formed). In other words, the electrolytic capacitor 810 (body portion 811) is in a state of floating from the surface (first surface) of the substrate 400 by a predetermined distance γ. Since the lead terminal portion 812 of the electrolytic capacitor 810 is formed in accordance with the pitch (interval β) of the holes, the body portion 811 does not contact (abut) the substrate 400 and is floated by a predetermined distance γ. It is arranged on the substrate 400 .
Although illustration is omitted, when the substrate 400 is accommodated in the substrate case 701 (see the fourth embodiment), a predetermined gap is formed between the tip of the electrolytic capacitor 810 and the top surface of the first case 710. is ensured so that the electrolytic capacitor 810 does not come into contact with the top surface of the first case 710 .

FIG. 33(a) is a view of the first surface of the substrate 400 viewed from the normal direction of the substrate surface. A plurality of holes (through holes) into which the leads of the electrolytic capacitor 810 are inserted are provided in the substrate 400 at predetermined intervals in (along) a predetermined direction. Here, a direction parallel to the substrate surface and along the predetermined direction is defined as a second direction. In FIG. 33(a), the second direction coincides with the vertical direction of the figure. A direction parallel to the substrate surface and perpendicular to the second direction (a direction orthogonal to the second direction) is defined as a first direction. Note that "perpendicular" is not limited to 90° and includes substantially perpendicular, and for example, the angle between the first direction and the second direction may be about 75° to about 105°. The electrolytic capacitor 810 is a component relatively taller than other electronic components (for example, resistors) arranged on the substrate 400, and is subjected to a force (external force) during assembly compared to other electronic components. ).

Here, as cases where force is applied to electrolytic capacitor 810 (body portion 811), let us consider a case where force is applied along a first direction and a case where force is applied along a second direction. When force is applied along the first direction (force directed in the first direction), the electrolytic capacitor 810 (body portion 811) is likely to fall (the lead terminal portion 812 is likely to bend). In other words, the electrolytic capacitor 810 is weak against external forces along the first direction, and the lead terminal portions 812 are prone to bending. On the other hand, the electrolytic capacitor 810 is resistant to the external force along the second direction, and the lead terminal portion 812 is less likely to bend than when subjected to the external force along the first direction.

As shown in FIG. 32A, the distance (height) from the surface (first surface) of substrate 400 to the tip of electrolytic capacitor 810 is defined as distance δ (specific distance). The distance δ can be said to be the height of the electrolytic capacitor 810 (from the first surface). Further, as shown in FIG. 33(a), the inner range of a circle (virtual circle) centered at the position of electrolytic capacitor 810 and having a distance δ as a radius is defined as a specific range ε. In this embodiment, a ceramic capacitor 820 (second component) is arranged within the specific range ε and at a position in the first direction of the electrolytic capacitor 810 (position adjacent to the electrolytic capacitor 810 in the first direction). It is

As shown in FIG. 32(b), when the electrolytic capacitor 810 falls toward the ceramic capacitor 820 due to an external force along the first direction (when the leads are bent), the electrolytic capacitor 810 and the ceramic capacitor 820 come into contact ( contact). In other words, the electrolytic capacitor 810 stops collapsing (becomes in a state where it does not collapse any more) by contact with the ceramic capacitor 820 . In other words, ceramic capacitor 820 is arranged at a position (within a contactable range) in contact with electrolytic capacitor 810 whose leads are bent due to the application of an external force in the first direction.

The ceramic capacitor 820 has two leads (a pair of leads) extending from the main body, and the two leads are inserted (inserted) into the through holes (holes) of the substrate 400 and soldered. and fixed to the substrate 400 . The distance between the main body of the ceramic capacitor 820 and the substrate 400 is smaller than the above-mentioned predetermined distance γ, so that the ceramic capacitor 820 is less likely to fall (the leads are less likely to bend) than the electrolytic capacitor 810. there is In addition, the ceramic capacitor 820 is arranged such that the direction in which the holes into which the leads are inserted (the direction in which the intervals between the holes are formed) is the direction in which the holes into which the leads of the electrolytic capacitor 810 are inserted (the direction in which the holes are formed to insert the leads of the electrolytic capacitor 810). second direction). Therefore, the ceramic capacitor 820 is likely to fall in the above-described second direction, but is difficult to fall in the above-described first direction. Therefore, even if electrolytic capacitor 810 falls and receives force (force acting in the first direction), ceramic capacitor 820 can support electrolytic capacitor 810 without falling together with electrolytic capacitor 810 .

As shown in FIG. 33( a ), identification information (silk characters) “C32” corresponding to the ceramic capacitor 820 is written on the substrate 400 near the ceramic capacitor 820 . In this embodiment, the identification information “C32” is written at a position within the specific range ε and in the first direction of the electrolytic capacitor 810 . Specifically, the identification information “C32” is written at a position substantially opposite to the electrolytic capacitor 810 across the ceramic capacitor 820 in the first direction.
The identification information "C32" is a character string that combines the alphabet "C" representing a capacitor and the number "32" assigned to the capacitor. For example, the capacitor assigned the number "3" becomes "C3", and the capacitor assigned the number "108" becomes "C108".

As shown in FIG. 33(b), in this embodiment, when the electrolytic capacitor 810 is tilted (the lead is bent) and is in contact with the ceramic capacitor 820, the ceramic Even if the capacitor 820 is covered (hidden) and cannot be visually recognized, the identification information “C32” of the ceramic capacitor 820 (contacted part) is visible without being hidden (obstructed) (that is, The visibility of the identification information “C32” is ensured). In addition, "visible" does not mean that the whole is completely visible, even if the visibility of part (for example, part of the number) is impaired (hidden ), if the operator can identify that it is the identification information "C32", it is assumed to be visually recognizable.

The identification information “C32” is written at a position not covered by the electrolytic capacitor 810 in contact with the ceramic capacitor 820 . In this embodiment, the leads of the electrolytic capacitor 810 arranged on the substrate 400 in a state of floating by a predetermined distance γ are bent when a force is applied in the first direction. is within a range that does not obscure the identification information "C32".

The identification information “C62” corresponding to electrolytic capacitor 810 is provided in (one side of) the second direction in which body portion 811 is less likely to fall. Therefore, the identification information “C62” is visible even when the electrolytic capacitor 810 falls in the first direction and contacts the ceramic capacitor 820 .

In addition, in FIG. 33(a), the ceramic capacitor 820 is arranged on one side (left side) adjacent to the electrolytic capacitor 810 in the first direction. Ceramic capacitors 820 may be placed on both sides. In other words, even if the electrolytic capacitor 810 falls to either side in the first direction, it may abut against the ceramic capacitor 820 and stop falling. In that case, even if the electrolytic capacitor 810 falls to any side in the first direction and comes into contact with the ceramic capacitor 820, the identification information of each ceramic capacitor 820 is visible when viewed from the direction normal to the substrate surface. It is possible.

In the present embodiment, the electrolytic capacitor 810 is described as the first component, but the first component is not limited to the electrolytic capacitor 810 and may be another lead component. Specifically, it has a main body portion and leads (lead terminal portions) extending from the main body portion. Any lead component may be used as long as the part can fall down. Also, the number of leads may be two or more, and for example, three leads may be provided. In the case of three leads, three holes into which the leads of the first component are inserted are provided in the substrate 400 at predetermined intervals in a predetermined direction (at predetermined intervals).

Further, in the present embodiment, the ceramic capacitor 820 (second component) is the component within the specific range ε and arranged in the first direction of the electrolytic capacitor 810, but the second component is the ceramic capacitor Not limited to 820, other electronic components may be used. However, it is assumed that the second component has a predetermined height from the substrate surface (first surface) and can come into contact with the first component with the lead bent.

Further, the electrolytic capacitors arranged on the substrate 400 may include an electrolytic capacitor 840 (second electrolytic capacitor) (fourth component) in addition to the electrolytic capacitor 810 (first electrolytic capacitor) described above. FIG. 34 is a diagram showing electrolytic capacitor 810 and electrolytic capacitor 840. As shown in FIG. The electrolytic capacitor 840 includes a cylindrical body portion 841 and lead terminal portions 842 extending from the bottom portion of the body portion 841 . The diameter of body portion 841 of electrolytic capacitor 840 is larger than the diameter of body portion 811 of electrolytic capacitor 810 (has a large diameter). In other words, the size of body portion 841 of electrolytic capacitor 840 is larger than the size of body portion 811 of electrolytic capacitor 810 .

As described above, the electrolytic capacitor 810 has a formed lead terminal portion 812 and is arranged on the substrate 400 with a predetermined gap γ provided between the body portion 811 and the substrate 400 . On the other hand, in the electrolytic capacitor 840, the distance (gap) between the body portion 841 and (the surface of) the substrate 400 is smaller than the predetermined distance γ (the distance between the body portion 811 and the substrate 400 in the electrolytic capacitor 810). It's becoming The state of being smaller than the predetermined distance γ (the state of being smaller than the predetermined distance γ) includes the state of no gap (the gap being 0). In this embodiment, the electrolytic capacitor 840 is arranged on the substrate 400 with no gap provided between the body portion 841 and the surface of the substrate 400 (that is, with the body portion 841 in contact with the substrate 400). there is Although illustration is omitted, a minute gap (a gap smaller than the predetermined distance γ) may be provided between the main body part 841 and the surface of the substrate 400 . The smaller the gap between the main body portion 811 (the main body portion 840 ) and the surface of the substrate 400 , the greater the stability when the electrolytic capacitor is arranged on the substrate 400 .
The electrolytic capacitor 810 is a taller component than the electrolytic capacitor 840 when arranged on the substrate 400 .

The interval (pitch) between the holes of the substrate 400 into which the lead terminal portions 812 of the electrolytic capacitor 810 are inserted is β, and in this embodiment, the interval β is 5.5 mm. The interval (pitch) between the holes into which the lead terminal portions 842 of the electrolytic capacitor 840 are inserted is also β (5.5 mm). In other words, the interval between the lead terminal portions 842 is β. Note that the lead terminal portion 842 is not formed. Electrolytic capacitor 810 and electrolytic capacitor 840 have the same mounting hole pitch (the lead interval of electrolytic capacitor 810 and the lead interval of electrolytic capacitor 840 are the same). By aligning the pitch of the holes (by aligning the intervals between the leads), it is possible to enjoy the effect of facilitating the pattern design.

The electrolytic capacitor 810 arranged on the substrate 400 with a gap of a predetermined distance γ is an electrolytic capacitor arranged on the substrate 400 with a gap (including 0) smaller than the predetermined distance γ. Compared to 840, the lead is easily bent. In the present embodiment, even if the leads of the electrolytic capacitor 810 (first electrolytic capacitor) whose leads are likely to bend are bent and come into contact with a predetermined component (adjacent component), the identification information of the predetermined component is It is made visible.

As shown in FIG. 33( a ), the ceramic capacitor 820 (second component) is arranged within the specific range ε and in the first direction of the electrolytic capacitor 810 . This ceramic capacitor 820 is a component that is more resistant to heat (higher heat resistance) than the IC 830 . Also, the ceramic capacitor 820 is a component that generates less (smaller) amount of heat than the IC 830 .

The IC 830 (third component) includes a rectangular plate-shaped body portion 831 and lead terminal portions 832 extending from the body portion 831 . A plurality of leads forming the lead terminal portion 832 are provided at predetermined intervals along each longitudinal side (each of the pair of long sides) of the main body portion 831 . The IC 830 is fixed to the substrate 400 by soldering with the lead terminal portion 832 inserted into a through hole (hole) of the substrate 400 . At least a portion of IC 830 is arranged within specific range ε and in the second direction of electrolytic capacitor 810 . The IC 830 is a component that is weak against heat (has low heat resistance) compared to the ceramic capacitor 820 . Also, the IC 830 is a component that generates more (larger) amount of heat than the ceramic capacitor 820 . In this embodiment, the IC 830 is a plastic-packaged IC.
The IC 830 is a motor driver, and although it depends on the frequency of use and circumstances, when the game machine is played normally and the operation (operation) continues for a predetermined period of time, the amount of heat generated is greater than that of the ceramic capacitor 820. (Surface temperature rises).

When the electrolytic capacitor 810 is used in a high-temperature environment, its deterioration is accelerated (the speed of deterioration is faster) than when it is used in a low-temperature environment. In other words, the electrolytic capacitor 810 deteriorates more rapidly in a high-temperature environment.

In this embodiment, the IC 830 with low heat resistance is arranged in the second direction of the electrolytic capacitor 810, but the leads of the electrolytic capacitor 810 are difficult to bend in the second direction. In other words, the heat-sensitive component (IC 830) is arranged at a position where it is difficult for electrolytic capacitor 810 to come into contact. In other words, electrolytic capacitor 810 is less likely to come into contact with IC 830 (a component vulnerable to heat). As a result, electrolytic capacitor 810 abuts against IC 830, and damage to IC 830 due to heat can be suppressed.
It should be noted that the component (ceramic capacitor 820), whose leads are likely to bend and is located at a position where the electrolytic capacitor 810 is likely to come into contact, is resistant to heat, so even if the electrolytic capacitor 810 comes into contact with it, it will not be easily damaged. .

Also, although the IC 830 that generates a large amount of heat is arranged in the second direction of the electrolytic capacitor 810, the leads of the electrolytic capacitor 810 are less likely to bend in the second direction. In other words, a component (IC 830) that generates a large amount of heat is arranged at a position where it is difficult for electrolytic capacitor 810 to come into contact therewith. In other words, it is difficult for electrolytic capacitor 810 to come into contact with IC 830 . As a result, it is possible to prevent electrolytic capacitor 810 from coming into contact with IC 830, causing electrolytic capacitor 810 to become hot, and accelerating deterioration of electrolytic capacitor 810. FIG.
In addition, since the component (ceramic capacitor 820) whose lead is easily bent and which is arranged at a position where the electrolytic capacitor 810 is likely to contact has a small amount of heat generation, even if the electrolytic capacitor 810 is in contact with the ceramic capacitor 820, electrolysis cannot be performed. Degradation of capacitor 810 is less likely to be accelerated.

The gaming machine of this embodiment is
a substrate 400;
and a component arranged on the substrate,
The components include a first component (electrolytic capacitor 810) and a second component (ceramic capacitor 820),
The first component includes a main body portion 811 and a lead terminal portion 812 having a plurality of leads extending from the main body portion,
The substrate has a plurality of holes provided at predetermined intervals in a predetermined direction,
the first component is arranged on the substrate in a state in which the plurality of leads are inserted into the plurality of holes and a predetermined gap is formed between the body portion and the substrate;
A direction parallel to the substrate surface and a direction along the predetermined direction is defined as a second direction,
A direction parallel to the substrate surface and perpendicular to the second direction is defined as a first direction,
Assuming that the distance from the substrate to the tip of the main body is a specific distance,
In the substrate, the second component is arranged within a range of a circle centered on the position of the first component and having a radius of the specific distance, and identification information corresponding to the second component is written. and
The second component and the identification information are provided in the first direction of the first component,
When a force acting in the first direction is applied to the main body portion, the lead terminal portion is bent, and the main body portion is in contact with the second component, when viewed from the direction normal to the substrate surface, The identification information is visible.

When a force acting in the first direction is applied to the main body portion, the lead terminal portion is bent, and the main body portion is in contact with the second component, when viewed from the direction normal to the substrate surface, The identification information is visible. Therefore, even if at least a part of the second part is covered by the contact of the main body and the second part becomes difficult to see, the identification information corresponding to the second part is can be used to identify (identify) the second part. As a result, when the lead terminal portion of the first component is bent, it becomes difficult to identify the component (the second component) covered by the first component, and work (inspection work, etc.) becomes difficult. A decrease in efficiency can be suppressed.

Also, in the gaming machine of the present embodiment,
When the force acting in the second direction is applied to the main body, the first component is more likely to be engaged with the lead terminal portion than when the force acting in the first direction is applied to the main body. is difficult to bend,
Identification information corresponding to the first part is provided in the second direction of the first part.

Identification information corresponding to the first component is provided in the second direction in which the lead terminal portion is less likely to bend. Therefore, it is possible to prevent the visibility of the identification information corresponding to the first component from being impaired when the lead terminal portion is bent.

Also, in the gaming machine of the present embodiment,
The component includes a third component (IC830) arranged on the substrate such that at least a portion of the component is included within the range of the circle and positioned in the second direction of the first component,
The third component has a larger heat value than the second component arranged in the first direction of the first component,
The deterioration of the first component is accelerated in a high-temperature environment,
When the force acting in the second direction is applied to the main body, the first component is more likely to be engaged with the lead terminal portion than when the force acting in the first direction is applied to the main body. is difficult to bend.

The first part is a part whose deterioration is accelerated in a high-temperature environment, and the third part having a large heat generation amount is arranged in the second direction of the first part. The lead terminal portion is difficult to bend in the second direction. By arranging the third component, which generates a large amount of heat, on the side where the lead terminal portion is less likely to bend, the first component comes into contact with the third component, and the first component becomes hot. Acceleration of deterioration of the first component can be suppressed.
Further, the second component, which is arranged on the side where the lead terminal portion is likely to bend (the side where the first component is likely to come into contact), is a component that generates less heat than the third component. Therefore, even when the first part comes into contact with the second part, it is possible to prevent the first part from becoming hot due to the influence of the ambient temperature, thereby preventing the deterioration of the first part from being accelerated. can.

Also, in the gaming machine of the present embodiment,
The component includes a third component (IC830) arranged on the substrate such that at least a portion of the component is included within the range of the circle and positioned in the second direction of the first component,
The third component has lower heat resistance than the second component arranged in the first direction of the first component,
When the force acting in the second direction is applied to the main body, the first component is more likely to be engaged with the lead terminal portion than when the force acting in the first direction is applied to the main body. is difficult to bend.

Although the third component having low heat resistance is arranged in the second direction of the first component, the lead terminal portion of the first component is difficult to bend in the second direction. Thus, by arranging the third component on the side where the lead terminal portion is less likely to bend (the side where the first component is less likely to come into contact), the first component comes into contact with the third component, thereby providing heat resistance. It is possible to suppress failure (deterioration) of the low third component.
In addition, by arranging the second component having higher heat resistance than the third component on the side where the lead terminal portion is likely to bend (the side where the first component is likely to come into contact), the first component can be contacted. It is possible to suppress the failure of the second component when it comes into contact with the second component.

Also, in the gaming machine of the present embodiment,
The component includes a fourth component (electrolytic capacitor 840) that is of the same type as the first component and has a larger body size than the first component,
The first component and the fourth component have the same interval between the holes into which the lead terminal portions are inserted,
The fourth component is arranged on the substrate such that the gap between the body portion and the substrate is smaller than the predetermined gap in the first component.

The first part is arranged such that the distance between the holes of the substrate into which the lead terminal parts are inserted (same as the distance of the holes into which the lead terminal parts of the fourth part whose main body part is larger than the first part is inserted) ), the lead terminal portion is bent. The first component is arranged on the substrate with a predetermined gap formed between the main body portion (the main body portion of the first component) and the substrate. On the other hand, the fourth component is arranged on the substrate such that the gap between the main body portion (the main body portion of the fourth component) and the substrate is smaller than the predetermined gap. The lead terminal portion of the first component is more likely to bend than the fourth component.
In the present embodiment, for the first component different from the fourth component, a force acting in the first direction is applied to the main body portion (main body portion of the first component), and the lead terminal portion (first component Even if the lead terminal portion of the first component) is bent and the main body portion (the main body portion of the first component) is in contact with the second component, the identification information ( identification information of the second part) can be visually recognized. As a result, when the lead terminal portion of the first component is bent, it becomes difficult to identify the component (the second component) covered by the first component, and work (inspection work) is performed. decrease in efficiency can be suppressed.

In FIG. 31(c), in the case of the electrolytic capacitor 810, the tips of the terminals of the pair of leads are directed outward (diagonally outward). On the other hand, in FIG. 30 according to the fourth embodiment, in the case of the lead component β, the tips of the terminals of the pair of leads are directed inward. Here, lead component β is assumed to be a resistor. In this way, with respect to lead components, by varying the bending method of the tip of the lead according to the type of the component (by setting a rule for the bending method of the lead), only the second surface side of the substrate 400 can be bent. By looking at it, it is possible to specify which type of component it is (can narrow down). As a result, the efficiency of work such as inspection can be improved.

(Application to other substrates)
In each of the above embodiments, an example of applying the present invention to the payout control board has been described, but the present invention may be applied to boards other than the payout control board. In other words, each configuration related to the payout control board described above has a predetermined board other than the payout control board (for example, the main control board, the sub control board, etc.) and the members related to the predetermined board. good too.

(Application to slot machines)
In each of the above embodiments, an example of applying the present invention to a pachinko gaming machine that uses game balls as game values has been described. Applicable to slot machines (including medalless machines) that rotate the reels by operation, stop the rotating reels by pressing the stop button, and win prizes depending on the type and combination of symbols when the reels are stopped. You may For example, a predetermined board (eg, main control board, sub-control board, etc.) and members related to the predetermined board in the slot machine may have respective configurations related to the aforementioned payout control board.

In addition, within the scope of the invention, the present invention can freely combine each component of each embodiment, arbitrarily modify each component, or omit each component. Moreover, the present invention is not limited to pachinko game machines, and can be applied to other game machines such as slot machines.

400 board 701 board case 710 first case 720 second case 711 mounting hole (board mounting part)
715 Boss (substrate mounting part)

Claims (2)

comprising a board, a board case, and a screw,
The substrate case includes a first case covering a first surface side of the substrate and a second case covering a second surface side of the substrate,
The board is fixed to the first case by inserting the screw from the second surface side and screwing it to the board mounting portion of the first case,
The terminal of the electronic component inserted from the first surface side of the substrate protrudes from the second surface by a predetermined length,
The electronic component is visible through the top surface of the first case facing the first surface of the substrate,
Through the top surface of the second case facing the second surface of the substrate, the terminal of the electronic component and the head of the screw are visible,
In a state in which the screw is tightened without loosening and the board is fixed to the first case,
A dimension from the second surface of the substrate to the tip of the terminal of the electronic component is defined as a first dimension,
A dimension from the second surface of the substrate to the tip of the head of the screw is defined as a second dimension,
Assuming that the dimension from the second surface of the substrate to the top surface of the second case is the third dimension,
the third dimension being greater than the second dimension;
said second dimension being greater than said first dimension;
A gaming machine characterized by: A fourth dimension is a dimension from the tip of the head of the screw to the top surface of the second case,
Assuming that the length of the screw inserted into the board mounting portion is the fifth dimension,
said fifth dimension being greater than said fourth dimension;
2. The game machine according to claim 1, characterized by:

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