JP2023041377A - Power substrate and outdoor machine of air conditioner using the same - Google Patents

Abstract

To provide a power substrate from which heat is radiated well and an outdoor machine of an air conditioner using the same.SOLUTION: In an electrical component module 200 having a fixed plate 210 installed in a machine room of an outdoor machine, a power substrate 270 on which a power device 274 is mounted comprises: a first pattern connected to the power device 274; a second pattern not connected to the first pattern; and a jumper that connects the first and second patterns to each other and projects from the substrate surface of the power substrate. Heat is radiated well by thermally connecting the jumper to a heat sink 310.SELECTED DRAWING: Figure 6

Description

An embodiment of the present invention relates to a power board and an outdoor unit of an air conditioner using the same.

In the outdoor unit of an air conditioner, the electric parts are also required to be downsized in order to reduce the installation space. In order to reduce the size of this electrical part, it is effective to reduce the board area of the power board included in the electrical part. something is desirable.

If the board area of the power board is reduced in order to reduce the size of the electrical component, the heat dissipation amount of the board itself becomes a problem. As a conventional technique for ensuring heat dissipation even when the substrate area is reduced in this way, a technique is known in which a metal body is provided to connect the terminals of the electrolytic capacitor and the terminals of the power device, and a heat dissipation part is provided in this metal body. ing. According to this, the heat generated by the power device can be dissipated without occupying a large substrate area.

JP 2017-121124 A

However, the above-described prior art does not correspond to small power devices that have been developed in recent years, and it cannot be said that heat dissipation is sufficiently implemented. For example, as the power device becomes smaller, the distance between pins in the power device becomes smaller and the width of the pattern connected to the pins becomes narrower. When the width of the pattern is narrowed in this manner, the electrical resistance increases, which increases the amount of heat generated by the pattern. Such a problem becomes conspicuous especially in a power board through which a large current flows.

Therefore, the present disclosure proposes a power board that can dissipate heat well and an outdoor unit of an air conditioner using the power board.

A power board according to one aspect of the present disclosure is a power board on which a power device is mounted, which includes a first pattern connected to the power device, a second pattern not connected to the first pattern, and the first pattern. and the second pattern, and a jumper protruding from the board surface of the power board.

Good heat dissipation can be achieved.

1 is a perspective view of an outdoor unit according to an embodiment; FIG. FIG. 2 is a perspective view of the outdoor unit with a service panel removed according to the embodiment. FIG. 3 is a perspective view of a state in which an electrical component module is removed from a machine room of the outdoor unit according to the embodiment; FIG. 4 is an exploded perspective view of an electrical component module and a cooler. FIG. 5 is an explanatory drawing for attaching the upper frame and the lower frame to the partition plate. FIG. 6 is a longitudinal sectional view of the electrical component module. 7 is a cross-sectional view taken along line AA of FIG. 6. FIG. FIG. 8 is a plan view of the outdoor unit with the top panel removed according to the embodiment. FIG. 9 is a right side view of the outdoor unit with the right side panel removed according to the embodiment. FIG. 10 is a front view of the main board. FIG. 11 is a front view of the power board. FIG. 12 is an enlarged front view of the vicinity of the IPM elements, jumpers and output terminals of the power board. 13 is an enlarged front view of FIG. 12 with the IPM elements, jumpers and output terminals removed. FIG. 14 is a perspective view of the vicinity of the jumper on the power board.

Hereinafter, a power board according to embodiments and an outdoor unit of an air conditioner using the power board will be described with reference to the drawings. Configurations having the same functions in the embodiments are denoted by the same reference numerals, and overlapping descriptions are omitted. It should be noted that the power board and the outdoor unit of the air conditioner using the power board described in the following embodiments are merely examples, and do not limit the embodiments. Moreover, each of the following embodiments may be appropriately combined within a non-contradictory range.

1 to 3, 8 and 9 show an outdoor unit 100 according to an embodiment. This outdoor unit 100 is installed outdoors in an air conditioner. The outdoor unit 100 and an indoor unit installed indoors are connected by a refrigerant pipe 30 to form a vapor compression refrigeration cycle.

For example, the outdoor unit 100 includes an outdoor heat exchanger 11 that exchanges heat between outdoor air and a refrigerant, a blower fan 11F, a compressor 12 that compresses the refrigerant, an accumulator 15 that separates the inflow refrigerant into gas and liquid, and the like. In addition, the outdoor unit 100 includes an oil separator that separates the lubricating oil from the mixed fluid of the lubricating oil and the refrigerant, an expansion valve that expands the inflowing refrigerant to reduce the pressure to a predetermined pressure, and a four-way valve that switches between the heating operation and the cooling operation. etc. are also provided.

An indoor heat exchanger that exchanges heat between indoor air and a refrigerant, a blower fan, and the like are provided on the indoor unit side. A refrigerant pipe 30 connects the outdoor heat exchanger 11, the compressor 12, the oil separator, the expansion valve, the accumulator 15, the four-way valve and the indoor heat exchanger.

A housing 110 of the outdoor unit 100 includes a front panel 111, a service panel 112 on the right side of the front panel 111, a right side panel 113, a left side panel 114, a top panel 115, a rear panel 116, and a bottom panel 117. A stand 118 is attached to the bottom panel 117 .

The housing 110 is partitioned in the left-right direction by a partition plate 119 such that the back side of the front panel 111 is a heat exchanger chamber 110A and the back side of the service panel 112 is a machine chamber 110B. This partition plate 119 constitutes a part of the wall surface of the machine room 110B. An outdoor heat exchanger 11 and a blower fan 11F are arranged in the heat exchanger chamber 110A.

The machine room 110B houses the refrigerant pipe 30, the compressor 12, the expansion valve, the accumulator 15, the sub-accumulator 15A, the four-way valve, and the like. The machine room 110B can be visually recognized from the front side of the outdoor unit 100 by removing the service panel 112 .

Reference numeral 200 denotes an electrical component module which, as shown in FIGS. It has an elongated upper frame 220 and an elongated lower frame 230 to which the lower part of the fixing plate 210 is attached.

The electrical component module 200 also includes a mounting bracket 240 for attaching the upper frame 220 to the partition plate 119 , a mounting bracket 250 for attaching the lower frame 230 to the partition plate 119 , a main board 260 and a power board 270 . The main substrate 260 is a printed circuit board on which electronic components forming part of the control circuit and other electronic components are mounted. The power board 270 is a printed board on which electronic components constituting the rest of the control circuit, other electronic components, and a plurality of power devices 274 to be described later are mounted, and a double-sided board is used. The electronic components mounted on the main board 260 and the power board 270 are merely examples, and can be changed as appropriate.

As described above, the printed board of the electrical component module 200 is divided into the main board 260 and the power board 270 . The main substrate 260 is mounted on the fixing plate 210 so that the back surface 260b faces the front surface 211a of the fixing plate 210 (see FIG. 4). The power board 270 is mounted on the fixed plate 210 so that the rear surface 270b faces the rear surface 211b of the fixed plate 210 (see FIG. 4).

Reference numeral 300 denotes a cooler, and as will be described later, in a state in which the U-shaped bent portion 31 of the liquid-side refrigerant pipe 30L is attached, the upper frame 220 extends over the upper frame 220 and the lower frame 230 (see FIG. 6). and attached to the lower frame 230 .

The fixing plate 210 includes a main body portion 211, an upper horizontal piece 212 for reinforcement bent at 90 degrees from the upper end of the main body portion 211 toward the back surface 211b, and a rear end of the upper horizontal piece 212 upward at 90 degrees. and an upper vertical piece 213 for attachment that is bent into the shape of the . The main board 260 is mounted on the front surface 211a of the body part 211, and the power board 270 is mounted on the rear surface 211b.

The fixed plate 210 includes a lower horizontal piece 214 for reinforcement that is bent at 90 degrees from the lower end of the main body 211 toward the front surface 211a, and a lower horizontal piece 214 that is bent downward at 90 degrees from the front end of the lower horizontal piece 214. a longitudinal piece 215; Both ends of the lower vertical piece 215 are formed with mounting portions 215a projecting downward.

The upper frame 220 consists of a vertical piece 221 screwed to the upper vertical piece 213 of the fixing plate 210 , a reinforcing horizontal piece 222 bent backward at 90 degrees from the upper end of the vertical piece 221 , and the vertical piece 221 . and a mounting piece 223 that is bent forward from the left end at 45 degrees. 224 is the end to which the cooler 300 is attached.

The lower frame 230 includes a lower vertical piece 231, an upper horizontal piece 232 bent backward at 90 degrees from the upper end of the lower vertical piece 231, and a reinforcing piece 232 bent upward at 90 degrees from the inner end of the upper horizontal piece 232. and an attachment piece 234 bent forward from the left end of the lower vertical piece 231 at 45 degrees. The lower vertical piece 231 is screwed to the lower vertical piece 215 of the fixing plate 210 . A terminal plate 400 is attached to the front side of the lower vertical piece 231 . 235 is the end to which the cooler 300 is attached.

The cooler 300 includes an aluminum heat sink 310 thermally coupled to a plurality of power devices 274 (to be described later) mounted on the front surface 270a of the power board 270, and two heat sinks having a semicircular cross section formed on the heat sink 310. The U-shaped bent portion 31 of the liquid-side refrigerant pipe 30</b>L is fitted into each groove 311 and a cover 320 made of sheet metal for fixing the U-shaped bent portion 31 to the heat sink 310 .

In addition to the groove 311 , the heat sink 310 has a thick plate portion 312 against which the power device 274 is pressed and thermally coupled, and cover mounting portions 313 and 314 formed on both sides of the thick plate portion 312 . The cover 320 includes a central pressing portion 321 that presses the U-shaped bent portion 31 of the liquid-side refrigerant pipe 30L, a hook portion 322 bent from one end of the pressing portion 321, and a hook portion extending from the other end of the pressing portion 321. 322 and a pressing portion 323 that is bent to face.

FIG. 10 is a front view of the main substrate 260. FIG. As shown in FIG. 10, the front surface 260a of the main substrate 260 is mounted with electronic components that form part of the control circuit and other electronic components as described above.

That is, on the front surface 260 a of the main board 260 , an AC input current detection/temperature detection circuit 261 , an actuator drive circuit 262 , a display setting circuit 263 , a main control IC 264 , an EMC filter circuit 265 (EMC: ElectroMagnetic Compatibility), a switching power supply circuit 266 . , an inrush current control circuit 267, a connector 268, and the like are mounted.

The actuator drive circuit 262 is a circuit for driving actuators such as expansion valves and four-way valves. The display setting circuit 263 includes an LED lamp 263a as a display, a DIP switch 263b and a button switch 263c as an operation section, and the like. The EMC filter circuit 265 is a circuit for countermeasures against external noise and spontaneous noise including a common mode choke coil 265a and a capacitor 265b. The switching power supply circuit 266 has a switching transformer 266a and a switching IC 266b.

260b is the rear surface of the main board 260; 260c is the upper end of the main board 260, 260d is the lower end of the main board 260, 260e is the left end of the main board 260, and 260f is the right end of the main board 260. The main substrate 260 is mounted on the front surface 211a of the main body portion 211 of the fixing plate 210 so that the back surface 260b faces the front surface 211a.

11 is a front view of the power board 270. FIG. As shown in FIG. 11, on the front surface 270a of the power board 270 are mounted electronic components including a plurality of power devices 274, which will be described later, and which constitute the rest of the control circuit as described above.

That is, on the front surface 270a of the power board 270, a diode bridge circuit 271a for rectification and an IGBT element 271b (IGBT: Insulated Gate Bipolar Transistor) having a reduced operating resistance by incorporating a MOSFET in the gate portion of a bipolar transistor are mounted. In addition, on the front face 270a of the power board 270, an FRD element 271c (FRD: Fast Recovery Diode) for high-speed operation, a PFC coil 271d (PFC: Power Factor Correction) for improving the power factor, and an aluminum electrolytic capacitor for large power smoothing 271e is installed. This aluminum electrolytic capacitor 271e is an example of the smoothing capacitor of the present invention.

The diode bridge circuit 271a, the IGBT element 271b, the FRD element 271c, the PFC coil 271d, the aluminum electrolytic capacitor 271e, and the like constitute a converter circuit 271 that converts AC power supplied from the outside into DC power and outputs the DC power. Furthermore, on the front face 270a of the power board 270, an IPM element 272 (IPM: Intelligent Power Module) that constitutes an inverter circuit that converts the DC power supplied from the converter circuit 271 into AC power and outputs it, an inverter control IC 273 and an output A terminal 275 is also provided.

The output terminal 275 is a terminal electrically connected to the IPM element 272 included in the power device 274 (details will be described later), and outputs AC power converted by the IPM element 272 to the motor of the compressor 12 or the like. The output terminals 275 include output terminals 275u, 275v, and 275w for outputting AC power of three phases (U, V, W) (see FIG. 12).

270b is the rear surface of the power board 270; 270c is the upper end of the power board 270, 270d is the lower end of the power board 270, 270e is the left end of the power board 270, and 270f is the right end of the power board 270. The diode bridge circuit 271a, the IGBT element 271b, the FRD element 271c, the IPM element 272, etc. are power devices 274 that generate a large amount of heat, and are mounted in a vertical arrangement near the left end 270e so that they can be easily cooled by the cooler 300. ing.

The power board 270 is mounted on the back surface 211b of the main body 211 of the fixing plate 210 so that the back surface 270b faces the back surface 211b. The cooler 300 faces and abuts the plurality of power devices 274 .

The vertical size of the power board 270 is set according to the size of the vertical arrangement of the plurality of power devices 274, and the PFC coil 271d, the aluminum electrolytic capacitor 271e, the inverter control IC 273, etc. are arranged so as to fit within the size. be done. In this way, the vertical size of the power board 270 is set slightly larger than the vertical size of the plurality of power devices 274 arranged vertically. Note that the IGBT element 271b may be replaced with a MOSFET or the like.

The main board 260 is set to have approximately the same vertical size corresponding to the vertical size of the power board 270 . On the main board 260, an AC input current detection/temperature detection circuit 261, an actuator drive circuit 262, a display setting circuit 263, a main control IC 264, an EMC filter circuit 265, a switching power supply circuit 266, and an inrush current are arranged within the size. A control circuit 267 and a connector 268 are mounted.

To dispose the electrical component module 200 described above in the machine room 110B of the outdoor unit 100, first, the mounting bracket 240 having the slope 241 and the mounting bracket 250 having the slope 251 are attached to the partition plate 119 in advance. 5, the mounting piece 223 of the upper frame 220 is screwed to the inclined surface 241 of the mounting bracket 240, and the mounting piece 234 of the lower frame 230 is screwed to the inclined surface 251 of the mounting bracket 250. As shown in FIG. screw to. As a result, the upper frame 220 and the lower frame 230 are attached to the partition plate 119 in a horizontal posture in a cantilevered manner.

Next, in the arrangement of the electrical component module 200, as shown in FIG. Attach the heat sink 310 of the device 300 with screws B1 and B2.

Also, in the arrangement of the electrical component module 200, as shown in FIG. is engaged with one of the cover mounting portions 313 of the . Next, in arranging the electrical component module 200, the pressing portion 323 is pressed against the other cover mounting portion 314 of the heat sink 310, and the pressing portion 323 is fixed to the cover mounting portion 314 with screws B3 and B4. This work is performed with the rear panel 116 of the outdoor unit 100 removed.

As described above, the cooler 300 is attached so as to straddle between the end portion 224 of the upper frame 220 and the end portion 235 of the lower frame 230 and so that the thick plate portion 312 of the heat sink 310 faces the service panel 112. .

Further, in the arrangement of the electrical component module 200, the main substrate 260 is mounted on the front surface 211a of the body portion 211 of the fixing plate 210, and the power substrate 270 is mounted on the rear surface 211b. The fixed plate 210 on which the main board 260 and the power board 270 are mounted has its upper vertical piece 213 fitted to the vertical piece 221 of the upper frame 220 and its lower vertical piece 215 fitted to the lower vertical piece 231 of the lower frame 230. , are attached by screws B5 and B6. Accordingly, when the outdoor unit 100 is installed on a horizontal plane, the main substrate 260 and the power substrate 270 are arranged so that their substrate surfaces are parallel to each other in the vertical direction in the machine room 110B of the outdoor unit 100 .

At this time, the mounting piece 223 of the upper frame 220 and the mounting piece 234 of the lower frame 230 are mounted to the partition plate 119 by the mounting bracket 240 and the mounting bracket 250, respectively. Also, the end portion 224 of the upper frame 220 and the end portion 235 of the lower frame 230 are fixed to the U-shaped bent portion 31 of the liquid-side refrigerant pipe 30L by the cooler 300 . Therefore, the fixed plate 210 is firmly fixed.

Also, the power devices 274 of the power board 270 are pressed against the thick plate portion 312 of the heat sink 310 of the cooler 300 and thermally coupled there. Therefore, when the air conditioner starts operating, the heat generated by power device 274 is cooled by cooler 300 . By applying heat-dissipating grease with high thermal conductivity to the thick plate portion 312 of the heat sink 310, thermal coupling is improved.

After the electrical component module 200 is attached to the machine room 110B as described above, a plug to which required wiring is connected is connected to the connector 268 of the main substrate 260 and the output terminal 275 of the power substrate 270 of the electrical component module 200. are connected, and another required wiring is connected to the terminal board 400 .

In the machine room 110B to which the electrical component module 200 is attached, the lower vertical piece 231 of the lower frame 230 projects forward from the fixed plate 210 by means of the upper horizontal piece 232, and the terminal plate 400 is attached to the front surface 231a of the lower vertical piece 231. As it is mounted, the terminal strip 400 projects forward for easy access. In addition, in the machine room 110B, a wide space SP is formed on the back surface 231b of the lower vertical piece 231, so that the lower frame 230 does not interfere with piping or the like arranged in the space SP.

Also, in the machine room 110B, the plurality of power devices 274 mounted on the power board 270 are thermally coupled to the cooler 300 on the rear surface 211b side of the fixing plate 210, but are pressed against the cooler 300. There is only Therefore, by loosening the screws B5 and B6, the fixed plate 210, the main board 260 and the power board 270 can be removed from the front of the machine room 110B as a unit without being disturbed by the cooler 300. Thus, maintenance of the main substrate 260 and the power substrate 270 is facilitated in the machine room 110B.

A display setting circuit 263 including LED lamps 263a, DIP switches 263b, button switches 263c, etc. and a plurality of connectors 268 are mounted on the front surface 260a of the main substrate 260. FIG. Therefore, simply by removing the service panel 112 from the outdoor unit 100, it becomes easy to confirm and change the settings and operation details of the air conditioner, and to switch the circuit connection.

Next, the connection between the IPM element 272 included in the power device 274 mounted on the power board 270 and the output terminals 275 (275u, 275v, 275w) will be described with reference to FIGS. 12 to 14. FIG. FIG. 12 is an enlarged front view of the vicinity of the IPM element 272 and the output terminals 275u, 275v, and 275w of the power board 270. FIG. FIG. 13 is an enlarged front view of FIG. 12 with the IPM element 272, jumpers and output terminals 275u, 275v and 275w removed. 13 indicate the IPM element 272, jumpers and output terminals 275u, 275v and 275w before removal. FIG. 14 is a perspective view of the power board 270 near the jumper.

As shown in FIG. 12, between the IPM element 272 included in the power device 274 and the output terminal 275, there are electrode wiring patterns 281u, 281v, and 281w (first embodiment of the present invention) that are not mechanically connected to each other. patterns) and patterns 283u, 283v, 283w (second patterns of the present invention) are arranged along the substrate surface. A jumper 282u connects the patterns 281u and 283u, a jumper 282v connects the patterns 281v and 283v, and a jumper 282w connects the patterns 281w and 283w. That is, the jumper connects the first pattern and the second pattern and electrically and mechanically connects them.

Specifically, in the IPM element 272, a terminal 272u for outputting U-phase AC power is connected to the pattern 281u. Similarly, the terminal 272v for outputting V-phase AC power is connected to the pattern 281v, and the terminal 272w for outputting W-phase AC power is connected to the pattern 281w.

A pattern 283u is connected to the output terminal 275u for outputting the U-phase AC power to the outside. Similarly, a pattern 283v is connected to an output terminal 275v for outputting V-phase AC power to the outside, and a pattern 283w is connected to an output terminal 275w for outputting W-phase AC power to the outside.

Patterns 281u, 281v, 281w are arranged to extend over the substrate toward patterns 283u, 283v, 283w connected to corresponding output terminals 275u, 275v, 275w, respectively. is not directly connected to Therefore, the patterns 281u, 281v, 281w and the patterns 283u, 283v, 283w are connected via jumpers 282u, 282v, 282w at locations adjacent to each other with a predetermined distance (for example, several cm).

The jumpers 282u, 282v, and 282w are conductive members whose at least surfaces are made of metal and are capable of passing a large current (for example, a rated current of 60 A). As an example, the jumpers 282u, 282v, and 282w can be made of copper and surface-treated with nickel base tin plating.

As shown in FIG. 14, the jumpers 282u, 282v, and 282w are formed in, for example, a U shape (or a V shape or the like), and both ends are attached to connection points on the board surface and soldered or the like. Fixed. That is, the jumpers 282u, 282v, and 282w are fixed in an inverted U shape with respect to the board surface. Therefore, the jumpers 282u, 282v, and 282w protrude from the board surface of the power board 270. FIG.

In the power board 270, heat can be efficiently dissipated through the jumpers 282u, 282v, and 282w protruding from the board surface. Specifically, heat generated by a large current flowing through patterns 283u, 283v, and 283w from patterns 281u, 281v, and 281w connected to a power device 274 (for example, IPM element 272) via jumpers 282u, 282v, and 282w, or , the heat generated by the power device 274 itself and conducted to the power substrate 270 can be efficiently dissipated.

As shown in FIG. 13, one end side of the jumper 282u is attached to the connection portion 281ua at the end adjacent to the pattern 283u in the pattern 281u. The other end of the jumper 282u is attached to the connecting portion 283ua at the end adjacent to the pattern 281u in the pattern 283u. Therefore, in the jumper 282u, the surface area of the conductor portion (U-shaped in the example of FIG. 14) bridging between the pattern 281u and the pattern 283u is the connection portion 281ua where the jumper 282u is connected to the pattern 281u The surface formed by connecting the connection portion 283ua to which the jumper 282u is connected to the pattern 283u (the double-dot chain line portion corresponding to the jumper 282u, for example, the surface of the copper foil forming the pattern for connecting the connection portion 281ua and the connection portion 283ua ).

One end side of the jumper 282v is attached to the connecting portion 281va at the end adjacent to the pattern 283v in the pattern 281v. The other end of the jumper 282v is attached to the connecting portion 283va at the end adjacent to the pattern 281v in the pattern 283v. Therefore, in the jumper 282v, the surface area of the conductor portion (U-shaped in the example of FIG. 14) bridging between the pattern 281v and the pattern 283v is the connection portion 281va where the jumper 282v is connected to the pattern 281v, The surface formed by connecting the connecting portion 283va to which the jumper 282v is connected to the pattern 283v (the two-dot chain line portion corresponding to the jumper 282v, for example, the surface of the copper foil forming the pattern for connecting the connecting portion 281va and the connecting portion 283va ).

One end side of the jumper 282w is attached to the connection portion 281wa at the end adjacent to the pattern 283w in the pattern 281w. The other end of the jumper 282w is attached to the connecting portion 283wa at the end adjacent to the pattern 281w in the pattern 283w. Therefore, in the jumper 282w, the surface area of the conductor portion (U-shaped in the example of FIG. 14) bridging between the pattern 281w and the pattern 283w is the connection portion 281wa where the jumper 282w is connected to the pattern 281w, A surface formed by connecting the connecting portion 283wa to which the jumper 282w is connected to the pattern 283w (the double-dot chain line portion corresponding to the jumper 282w, for example, the surface of the copper foil forming the pattern for connecting the connecting portion 281wa and the connecting portion 283wa) ).

The mounting positions of the jumpers 282u, 282v, and 282w are lower than the aluminum electrolytic capacitor 271e (diagonally lower left in the illustrated example) on the board surface of the power board 270 arranged parallel to the vertical direction. That is, aluminum electrolytic capacitor 271e is arranged above jumpers 282u, 282v, and 282w.

Jumpers 282u, 282v, and 282w may also be thermally connected to heat sink 310 in cooler 300 described above. Specifically, the thick plate portion 312 of the heat sink 310 in the cooler 300 indicated by the two-dot chain line in FIG. It is thermally connected to jumpers 282u, 282v, and 282w via grease or the like.

Also, although it has been described that the three sets of patterns, ie, the pattern 281u and the pattern 283u, the pattern 281v and the pattern 283v, and the pattern 281w and the pattern 283w are connected by jumpers, at least one set of patterns is connected by jumpers. good. For example, the pattern 281u and the pattern 283u are connected by the jumper 282u, the pattern 281v and the pattern 283v are connected by the jumper 282v, the pattern 281w and the pattern 283w are connected by the pattern, and only two sets of patterns are connected by the jumper. can be

As described above, in the power board 270 on which the power device 274 is mounted, the front face 270a has patterns 281u, 281v, and 281w connected to the power device 274 and a pattern 283u not connected to the patterns 281u, 281v, and 281w. , 283v, 283w. The front surface 270a of the power board 270 is provided with patterns 281u, 281v and 281w, and jumpers 282u, 282v and 282w that connect the patterns 283u, 283v and 283w and protrude from the board surface of the power board 270. FIG.

As a result, in the power board 270, a large current flows from the patterns 281u, 281v, and 281w connected to the power device 274 (for example, the IPM element 272) to the patterns 283u, 283v, and 283w via the jumpers 282u, 282v, and 282w. Heat is conducted to jumpers 282u, 282v, 282w. Since the jumpers 282u, 282v, and 282w protrude from the board surface of the power board 270 and are separated from the board surface and floated in space, they are more efficient than the patterns 281u, 281v, and 281w and the patterns 283u, 283v, and 283w. can dissipate heat. That is, the power board 270 can dissipate heat better than the case where heat is dissipated only by the patterns 281u, 281v, 281w, etc. arranged along the board surface.

In the jumpers 282u, 282v, and 282w, the surface areas of the conductor portions (U-shaped in the example of FIG. Connections 281ua, 281va, 281wa to which jumpers 282u, 282v, 282w are connected to 281v, 281w and connection parts 283u, 283va, 283wa to which jumpers 282u, 282v, 282w are connected to patterns 283u, 283v, 283w are connected. It is larger than the area of the surface to be formed (the part corresponding to the jumpers 282u, 282v, and 282w in FIG. 13, eg, the surface of the copper foil forming the pattern for connecting the connecting portion 281va and the connecting portion 283va). In this way, the patterns 283u, 283v, By increasing the surface area of the conductor portion 283w, the power board 270 can increase the amount of heat released by the large current described above.

At least the surfaces of the jumpers 282u, 282v, and 282w are made of metal. As a result, in the power board 270, the heat generated by the above-described large current can be efficiently radiated from the metal surfaces of the jumpers 282u, 282v, and 282w.

Also, power device 274 is thermally coupled to cooler 300 , and cooler 300 , patterns 281 u, 281 v, 281 w and jumpers 282 u, 282 v, 282 w are provided on the same board surface of power board 270 . As a result, the heat generated by the above-described large current can be dissipated through the cooler 300 on the same substrate surface side.

Also, the power board 270 is a board attached to the outdoor unit 100 of the air conditioner having the refrigerant pipe 30 , and the cooler 300 is attached to a part of the refrigerant pipe 30 . Thereby, the cooler 300 can be cooled via the refrigerant pipe 30 in the air conditioner.

Jumpers 282 u , 282 v , 282 w are also thermally coupled to cooler 300 . As a result, in the power board 270, the jumpers 282u, 282v, and 282w can be cooled via the cooler 300, and the heat generated by the large current can be efficiently dissipated.

Jumpers 282u, 282v and 282w are provided at locations where patterns 281u, 281v and 281w and patterns 283u, 283v and 283w are adjacent to each other with a predetermined distance therebetween. As described above, in the power board 270, the jumpers 282u, 282v, and 282w used in the portions that intersect the wiring patterns on the board are defined by the patterns 281u, 281v, and 281w, and the patterns 283u, 283v, and 283w. By providing them at adjacent locations with a distance of , the heat generated by the large current can be efficiently dissipated.

Further, in the outdoor unit 100 of the air conditioner to which the power board 270 is mounted, which is characterized by mounting the aluminum electrolytic capacitor 271e, the power board 270 has a board surface that is vertical when the outdoor unit 100 is installed on a horizontal plane. parallel to the direction, and the aluminum electrolytic capacitor 271e is arranged above the jumpers 282u, 282v, 282w. In general, the amount of heat generated by a large current flowing from the patterns 281u, 281v, and 281w to the patterns 283u, 283v, and 283w via the jumpers 282u, 282v, and 282w is generated from the aluminum electrolytic capacitor 271e because its resistance value is sufficiently small. small compared to the amount of heat. Therefore, by arranging the board surface parallel to the vertical direction and the aluminum electrolytic capacitor 271e to be positioned above the jumpers 282u, 282v, and 282w, the members that become hotter are placed above, so that a so-called chimney Convection due to the effect is likely to occur. This convection allows the power board 270 to dissipate heat more efficiently.

11 Outdoor heat exchanger 11F Blower fan 12 Compressor 15 Accumulator 30 Refrigerant pipe 30L Liquid side refrigerant pipe 31 U-shaped bent portion 100 Outdoor unit 110 Housing 110A Heat exchanger chamber 110B Machine room 111 Front panel 112 Service panel 113 Right side panel 114 Left side panel 115 Top panel 116 Rear panel 117 Bottom panel 118 Stand 119 Partition plate 200 Electrical component module 210 Fixing plate 211 Main body 211a Front 211b Rear 220 Upper frame 230 Lower frame 231a Front 231b Rear 260 Main substrate 261 AC input current detection/temperature detection circuit 262 Actuator drive circuit 263 Display setting circuit 263a LED Lamp 263b DIP switch 263c Button switch 264 Main control IC
Reference numeral 265: EMC filter circuit 265a: Common mode choke coil 265b: Capacitor 266: Switching power supply circuit 266a: Switching transformer 266b: Switching IC
267 Rush current control circuit 268 Connector 270 Power board 270a Front 270b Rear 271 Converter circuit 271a Diode bridge circuit 271b IGBT element 271c FRD element 271d PFC coil 271e Aluminum electrolytic capacitor 272 IPM element 272u ~ 272w terminal 273 inverter control IC
274 Power devices 275, 275u to 275w Output terminals 281u to 281w, 283u to 283w Patterns 281ua to 281wa, 283ua to 283wa Connections 282u to 282w Jumper 300 Cooler 310 Heat sink 311 Groove 312 Thick plate Portions 313, 314 Cover mounting portion 320 Covers 321, 323 Holding portion 322 Hook portion 400 Terminal plates B1 to B6 Screw SP Space

Claims (8)

In the power board on which the power device is mounted,
a first pattern connected to the power device;
a second pattern that is not connected to the first pattern;
a jumper that connects the first pattern and the second pattern and protrudes from the board surface of the power board;
A power board, comprising: In the jumper, the surface area of the conductor portion bridging between the first pattern and the second pattern is equal to the surface area of the connection portion where the jumper is connected to the first pattern and the second pattern. larger than the area of the surface formed by connecting the connection parts to which the jumper is connected to
The power board according to claim 1, characterized by: the jumper is made of metal at least on its surface;
3. The power board according to claim 1 or 2, characterized in that: the power device is thermally coupled to the cooler;
the cooler, the first pattern and the jumper are provided on the same board surface of the power board;
The power board according to any one of claims 1 to 3, characterized in that: The power board is a board attached to an outdoor unit of an air conditioner having a refrigerant pipe,
The cooler is attached to a portion of the refrigerant pipe,
5. The power board according to claim 4, characterized in that: the jumper is thermally coupled to the cooler;
6. The power board according to claim 4 or 5, characterized in that: The jumper is provided at a location where the first pattern and the second pattern are adjacent to each other with a predetermined distance therebetween.
The power board according to any one of claims 1 to 6, characterized in that: An outdoor unit of an air conditioner to which the power board according to any one of claims 1 to 7 is mounted, wherein a smoothing capacitor is mounted,
The power board is
When the outdoor unit is installed on a horizontal plane, the board surface is parallel to the vertical direction, and the smoothing capacitor is arranged above the jumper.
An outdoor unit for an air conditioner characterized by:

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