JP2023039625A - Self-adhesive tape and method for manufacturing semiconductor device - Google Patents

Abstract

To provide a self-adhesive tape that can fix adherend without causing foaming even when exposed to high-temperature, is excellent in followability to a curved surface, and can easily be peeled off from the adherend after completion of a process, and to provide a method for manufacturing a semiconductor device using the self-adhesive tape.SOLUTION: Provided is a self-adhesive tape having at least a self-adhesive agent layer A, in which the self-adhesive agent layer A contains a self-adhesive polymer A and a cross-linking agent having an isocyanurate skeleton, and the self-adhesive agent layer A has a gel fraction of 80 wt.% or more and 95 wt.% or less, a storage elastic modulus G' at 23°C and 1 Hz of 1×104 Pa or more and 5×104 Pa or less, and a self-adhesive strength after heating at 260°C for 2 minutes of 0.1 N/25 mm or more and 3.0 N/25 mm or less.SELECTED DRAWING: None

Description

The present invention relates to an adhesive tape and a method for manufacturing a semiconductor device.

2. Description of the Related Art In order to cope with miniaturization and high integration of semiconductor devices, flip-chip mounting using a semiconductor chip having protruding electrodes (solder bumps) having tip portions made of solder or the like is attracting attention. In flip-chip mounting, a semiconductor chip having solder bumps and a mounting substrate are thermocompressed at a temperature higher than the melting temperature of solder (usually 250° C. or higher) to electrically bond and mount (TCB ( Thermal Compression Bonding, also called "reflow process") is performed.

The reflow process is widely used as a component mounting method in the manufacture of electronic equipment such as semiconductor devices. In recent years, not only semiconductor chips but also components such as semiconductor chips are housed in a housing and the entire module is subjected to a reflow process (for example, Patent Document 1). In such a case, for example, for the purpose of preventing foreign matter from adhering to the parts inside the housing during the reflow process, the opening of the housing is covered with a protective member such as a cover glass, and the protective member is removed after the reflow process. Removal may be done. Adhesive tape is used to cover the opening of the housing with the protective member.

JP 2009-171413 A

The adhesive tape used to cover the opening of the housing with the protective member does not peel off or foam even when exposed to high temperatures during the reflow process, and sufficiently secures the housing and the protective member. It is required to be able to peel off easily from the housing after the process is completed. In addition, the upper surface of the opening of the housing, that is, the surface that comes into contact with the adhesive tape, may have a curved surface (warp) such as a convex arch shape or a concave arch shape. are also required to be excellent.

SUMMARY OF THE INVENTION An object of the present invention is to provide a pressure-sensitive adhesive tape that can be fixed to an adherend without causing foaming even when exposed to high temperatures, has excellent conformability to curved surfaces, and can be easily peeled off from the adherend after completion of the process. do. Another object of the present invention is to provide a method of manufacturing a semiconductor device using the adhesive tape.

The present invention is a pressure-sensitive adhesive tape having at least a pressure-sensitive adhesive layer A, wherein the pressure-sensitive adhesive layer A contains a pressure-sensitive adhesive polymer A and a cross-linking agent having an isocyanurate skeleton, and the pressure-sensitive adhesive layer A contains a gel component. modulus of 80% by weight or more and 95% by weight or less, storage elastic modulus G′ at 23° C. and 1 Hz of 1×10 ⁴ Pa or more and 5×10 ⁴ Pa or less, and after heating at 260° C. for 2 minutes The adhesive tape has an adhesive strength of 0.1 N/25 mm or more and 3.0 N/25 mm or less.
The present invention will be described in detail below.

The present inventors found that, in a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer, by using a cross-linking agent having an isocyanurate skeleton as a cross-linking agent blended in the pressure-sensitive adhesive layer, foaming of the pressure-sensitive adhesive layer that occurs when exposed to high temperatures is suppressed. I have found that it can be suppressed. Furthermore, the present inventors have found that the gel fraction of the adhesive layer, the storage elastic modulus G' at 23 ° C. and 1 Hz, and the adhesive strength after heating at 260 ° C. for 2 minutes are adjusted to specific ranges. It has been found that a soft pressure-sensitive adhesive layer can be obtained even though it is highly crosslinked, and that both the followability to curved surfaces and the peelability after exposure to high temperatures (after the process is completed) can be improved. This led to the completion of the present invention.

The pressure-sensitive adhesive tape of the present invention is a pressure-sensitive adhesive tape having at least a pressure-sensitive adhesive layer A, and the pressure-sensitive adhesive layer A contains the pressure-sensitive adhesive polymer A and a cross-linking agent having an isocyanurate skeleton.
When the pressure-sensitive adhesive layer A contains the cross-linking agent having the isocyanurate skeleton, the molecular chains of the pressure-sensitive adhesive polymer A are cross-linked. By adjusting the degree of crosslinking at this time, the gel fraction of the pressure-sensitive adhesive layer A, the storage elastic modulus G′ at 23° C. and 1 Hz, and the adhesive force after heating at 260° C. for 2 minutes can be adjusted. can. In addition, since the pressure-sensitive adhesive layer A contains a cross-linking agent having an isocyanurate skeleton, the pressure-sensitive adhesive that is generated when exposed to high temperatures is compared to the case where the pressure-sensitive adhesive layer A contains a cross-linking agent that does not have an isocyanurate skeleton. Foaming of the layer is suppressed. A possible reason for this is that the above-mentioned cross-linking agent having an isocyanurate skeleton has high heat resistance and is not easily decomposed even at high temperatures.

The cross-linking agent having an isocyanurate skeleton is not particularly limited, and commercially available products include, for example, isocyanate-based cross-linking agent Colonate HX (manufactured by Tosoh Corporation), Takenate D-170N (manufactured by Mitsui Chemicals), Stabio D-370N (Mitsui Kagaku Co., Ltd.) and the like.
The content of the cross-linking agent having the isocyanurate skeleton in the adhesive layer A is the gel fraction of the adhesive layer A, the storage elastic modulus G' at 23 ° C. and 1 Hz, and after heating at 260 ° C. for 2 minutes. Although there is no particular limitation as long as the adhesive strength of is adjustable within the range described later, a preferred lower limit is 0.01 parts by weight and a preferred upper limit is 10 parts by weight with respect to 100 parts by weight of the adhesive polymer A. A more preferable lower limit to the content of the cross-linking agent having the isocyanurate skeleton is 0.1 parts by weight, and a more preferable upper limit is 5 parts by weight.

The pressure-sensitive adhesive layer A has a gel fraction with a lower limit of 80% by weight and an upper limit of 95% by weight or less. When the gel fraction is 80% by weight or more, the pressure-sensitive adhesive layer A has a high degree of cross-linking, a low adhesive strength, and an improved peelability of the pressure-sensitive adhesive tape. When the gel fraction is 95% by weight or less, the pressure-sensitive adhesive layer A becomes sufficiently soft, and the conformability to curved surfaces of the pressure-sensitive adhesive tape is improved. A more preferable lower limit of the gel fraction is 86% by weight, a more preferable upper limit is 94% by weight, a still more preferable lower limit is 87% by weight, and a further preferable upper limit is 93% by weight.
In addition, the gel fraction of the adhesive layer can be measured by the following method.
Only 0.1 g of the adhesive layer (adhesive composition) is taken out from the adhesive tape, immersed in 50 mL of ethyl acetate, and shaken with a shaker at 200 rpm and a temperature of 23° C. for 24 hours. After shaking, a metal mesh (#200 mesh) is used to separate the ethyl acetate and the pressure-sensitive adhesive composition that has absorbed and swollen the ethyl acetate. The adhesive composition after separation is dried at 110° C. for 1 hour. The weight of the pressure-sensitive adhesive composition containing the metal mesh after drying is measured, and the gel fraction of the pressure-sensitive adhesive layer is calculated using the following formula.
Gel fraction (% by weight) = 100 x (W ₁ - W ₂ )/W ₀
(W ₀ : initial weight of adhesive composition, W ₁ : weight of adhesive composition containing metal mesh after drying, W ₂ : initial weight of metal mesh)

The pressure-sensitive adhesive layer A has a storage modulus G′ at 23° C. and 1 Hz with a lower limit of 1×10 ⁴ Pa and an upper limit of 5×10 ⁴ Pa. When the storage elastic modulus G′ at 23° C. and 1 Hz is within the above range, the pressure-sensitive adhesive layer A becomes sufficiently soft, and the conformability of the pressure-sensitive adhesive tape to curved surfaces is improved. A preferred lower limit of the storage modulus G' at 23°C and 1 Hz is 1.5 x ^104Pa , and a preferred upper limit is 4 x ^104Pa .
The storage elastic modulus G' of the pressure-sensitive adhesive layer at 23°C and 1 Hz can be measured, for example, using a viscoelastic spectrometer (manufactured by IT Keisoku Co., Ltd., DVA-200), etc., in a simple heating mode at a heating rate of 5. It can be obtained as the storage elastic modulus at 23°C when the dynamic viscoelasticity spectrum is measured from -40 to 140°C under the conditions of °C/min and 1Hz.

The adhesive layer A has a lower limit of 0.1 N/25 mm and an upper limit of 3.0 N/25 mm in adhesive strength after heating at 260° C. for 2 minutes. If the adhesive strength after heating at 260 ° C. for 2 minutes is within the above range, the adhesive strength of the adhesive layer A after being exposed to high temperature in a reflow process or the like is low, and the peelability of the adhesive tape is improved. . The preferred lower limit of the adhesive strength after heating at 260° C. for 2 minutes is 0.15 N/25 mm, the preferred upper limit is 2.0 N/25 mm, the more preferred lower limit is 0.2 N/25 mm, and the more preferred upper limit is 1.0 N/ 25 mm.
The adhesive strength of the adhesive layer after heating at 260° C. for 2 minutes can be measured by the following method. For example, a pressure-sensitive adhesive layer that has been cut to a width of 25 mm and a length of 10 cm is lined with a polyimide film (Kapton, manufactured by DuPont Toray) having a width of 30 mm, a length of 20 cm, and a thickness of 50 μm. A 12.5 cm, 2 mm thick stainless steel plate is laminated, and a 2 kg roller is reciprocated once to prepare a test piece for measurement. After that, for example, a high-temperature incubator (manufactured by Espec Co., Ltd.) or the like is preheated to 260° C., and when the temperature reaches 260° C., a test piece for measurement is added and heated for 2 minutes. For the obtained test piece for measurement after heating, for example, using an autograph (manufactured by Shimadzu Corporation) or the like, according to JIS Z0237: 2009, a temperature of 23 ° C. and a relative humidity of 50% in an environment of 300 mm / min. A peeling test is performed by peeling off the adhesive layer in a 180° direction at a tensile speed, and the 180° adhesive strength (N/25 mm) is measured.

The initial adhesive strength (adhesive strength before heating at 260° C. for 2 minutes) of the adhesive layer A is not particularly limited, but the preferred lower limit is 0.1 N/25 mm, and the preferred upper limit is 2.5 N/25 mm. When the initial adhesive strength is within the above range, the peelability of the adhesive tape is further improved. A more preferable lower limit of the initial adhesive strength is 0.2 N/25 mm, and a more preferable upper limit is 1.0 N/25 mm.

The method for adjusting the gel fraction of the pressure-sensitive adhesive layer A, the storage elastic modulus G′ at 23° C. and 1 Hz, and the adhesive force after heating at 260° C. for 2 minutes to the above ranges is not particularly limited. A method of adjusting the composition and weight average molecular weight (Mw) of the adhesive polymer A, the content of the above-mentioned cross-linking agent having an isocyanurate skeleton, and the like can be mentioned.

The adhesive polymer A is not particularly limited, but the gel fraction of the adhesive layer A, the storage elastic modulus G' at 23 ° C. and 1 Hz, and the adhesive strength after heating at 260 ° C. for 2 minutes are adjusted to the above ranges. (Meth)acrylic polymers are preferred from the viewpoint of
The (meth)acrylic polymer preferably contains a structural unit derived from a (meth)acrylic acid ester having an alkyl group having 12 or more and 18 or less carbon atoms. Since the (meth)acrylic polymer contains such a structural unit having an alkyl group with a relatively long carbon chain, the gel fraction of the pressure-sensitive adhesive layer A and the storage elastic modulus G′ at 23° C. and 1 Hz And, the adhesive strength after heating at 260° C. for 2 minutes can be easily adjusted to the above range, and the adhesive layer A can be a sufficiently crosslinked yet soft adhesive layer. As a result, the conformability to curved surfaces of the adhesive tape and the releasability after being exposed to high temperature (after completion of the process) are further improved.

The preferred upper limit of the glass transition temperature (Tg) of the (meth)acrylic acid ester having an alkyl group having 12 to 18 carbon atoms is 0°C as a homopolymer. If the glass transition temperature (Tg) is 0° C. or lower, the gel fraction of the adhesive layer A, the storage elastic modulus G′ at 23° C. and 1 Hz, and the adhesive force after heating at 260° C. for 2 minutes are It becomes easier to adjust within the above range. The glass transition temperature (Tg) has a more preferred lower limit of -80°C, a more preferred upper limit of -5°C, a still more preferred lower limit of -70°C, and a still more preferred upper limit of -10°C.
The glass transition temperature (Tg) of the homopolymer is determined by differential scanning calorimetry (T・Can be measured using a device such as A Instruments Co., Ltd.).

The (meth)acrylic acid ester having an alkyl group having 12 or more carbon atoms and 18 or less is not particularly limited. The Tg at that time is -65°C). Further examples include isomyristyl acrylate (Tg of -56°C when converted to a homopolymer), isostearyl acrylate (Tg of -18°C when converted to a homopolymer), and the like. Among them, at least one selected from the group consisting of lauryl acrylate, lauryl methacrylate and isostearyl acrylate is preferred. Furthermore, lauryl acrylate is more preferred.

In the (meth)acrylic polymer, the content of the structural unit derived from the (meth)acrylic acid ester having an alkyl group having 12 or more and 18 or less carbon atoms is not particularly limited, but the preferred lower limit is 35% by weight. . When the content of the structural unit is 35% by weight or more, the gel fraction of the adhesive layer A, the storage elastic modulus G′ at 23° C. and 1 Hz, and the adhesive force after heating at 260° C. for 2 minutes are It becomes easier to adjust within the above range. A preferable lower limit of the content of the structural unit is 42 parts by weight, and a more preferable lower limit is 45% by weight.
The upper limit of the content of the structural unit is not particularly limited, but the upper limit is preferably 90% by weight, and the upper limit is more preferably 80% by weight.

The (meth)acrylic polymer preferably further contains a structural unit derived from a (meth)acrylic acid ester having an alkyl group having 8 or more and less than 12 carbon atoms.

The preferred upper limit of the glass transition temperature (Tg) of the (meth)acrylic acid ester having an alkyl group having 8 or more and less than 12 carbon atoms is 0°C as a homopolymer. If the glass transition temperature (Tg) is 0° C. or lower, the gel fraction of the adhesive layer A, the storage elastic modulus G′ at 23° C. and 1 Hz, and the adhesive force after heating at 260° C. for 2 minutes are It becomes easier to adjust within the above range. The glass transition temperature (Tg) has a more preferred lower limit of -80°C, a more preferred upper limit of -5°C, a still more preferred lower limit of -70°C, and a still more preferred upper limit of -10°C.

The (meth)acrylic acid ester having an alkyl group having 8 or more carbon atoms and less than 12 carbon atoms is not particularly limited. Tg when converted to a homopolymer is -65°C). Furthermore, isononyl acrylate (Tg is -58°C when converted to homopolymer), isodecyl acrylate (Tg is -62°C when converted to homopolymer), and the like. Among them, 2-ethylhexyl acrylate is preferred.

In the (meth)acrylic polymer, the content of structural units derived from the (meth)acrylic acid ester having an alkyl group having 8 or more and less than 12 carbon atoms is not particularly limited. Since it becomes easier to adjust the gel fraction of the adhesive layer A, the storage elastic modulus G′ at 23 ° C. and 1 Hz, and the adhesive strength after heating at 260 ° C. for 2 minutes to the above ranges, A preferable lower limit of the content is 20% by weight, a preferable upper limit is 60% by weight, a more preferable lower limit is 30% by weight, and a more preferable upper limit is 50% by weight.

The (meth)acrylic polymer includes the (meth)acrylic acid ester having an alkyl group having 12 or more and 18 or less carbon atoms, and the (meth)acrylic acid ester having an alkyl group having 8 or more and less than 12 carbon atoms. It may contain structural units derived from other (meth)acrylic monomers.
Such other (meth) acrylic monomers are not particularly limited, and examples include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, cyclohexyl (meth)acrylate, isobornyl (meth)acrylate and the like. These (meth)acrylic monomers may be used alone, or two or more of them may be used in combination.

The (meth)acrylic polymer preferably further contains a structure derived from a crosslinkable functional group-containing monomer.
When the (meth)acrylic polymer contains a structure derived from the crosslinkable functional group-containing monomer, the gel fraction of the pressure-sensitive adhesive layer A is adjusted by crosslinking of the crosslinkable functional group, and the cohesive force is adjusted. be able to. The crosslinkable functional group may or may not be crosslinked, but is more preferably crosslinked. However, even if the structure remains uncrosslinked, the cohesive force of the pressure-sensitive adhesive layer increases due to the interaction between the functional groups.

Examples of the crosslinkable functional group-containing monomers include monomers containing carboxyl groups, hydroxyl groups, epoxy groups, double bonds, triple bonds, amino groups, amide groups, nitrile groups, and the like. These crosslinkable functional group-containing monomers may be used alone, or two or more of them may be used in combination. Among them, at least one selected from the group consisting of carboxyl group-containing monomers, hydroxyl group-containing monomers and amide group-containing monomers is preferable. The storage elastic modulus G′ of the pressure-sensitive adhesive layer A at 23° C. and 1 Hz can be more easily adjusted within the above range by the cross-linking with the cross-linking agent having the isocyanurate skeleton, and the conformability to the curved surface of the pressure-sensitive adhesive tape is further improved. Therefore, a hydroxyl group-containing monomer is more preferable. In addition, when the content of the structural unit derived from the (meth)acrylic acid ester having an alkyl group having 12 or more and 18 or less carbon atoms is large, the pot life during crosslinking tends to be short. Amide group-containing monomers are also preferred because they can easily maintain a long pot life.
The crosslinkable functional group-containing monomer may further contain an alkyl group, an ether group, a carbonyl group, an ester group, a carbonate group, an amide group, a urethane group, or the like.

Examples of the carboxyl group-containing monomer include (meth)acrylic acid-based monomers such as (meth)acrylic acid. Examples of the hydroxyl group-containing monomer include 4-hydroxybutyl (meth)acrylate and 2-hydroxyethyl (meth)acrylate. Glycidyl (meth)acrylate etc. are mentioned as said epoxy-group-containing monomer. Examples of the double bond-containing monomer include allyl (meth)acrylate, hexanediol di(meth)acrylate, and the like. Examples of the triple bond-containing monomer include propargyl (meth)acrylate. Examples of the amide group-containing monomer include (meth)acrylamide.

In the (meth)acrylic polymer, the content of the structure derived from the monomer having the crosslinkable functional group is not particularly limited. A preferable lower limit of the content of the structural unit is 0.1% by weight, and a preferable upper limit thereof is 30% by weight. A more preferable lower limit of the content of the structural unit is 0.5% by weight, and a more preferable upper limit is 25% by weight.
In the (meth)acrylic polymer, the content of the structure derived from the hydroxyl group-containing monomer is not particularly limited. The preferred lower limit of the content of is 1% by weight, and the preferred upper limit is 20% by weight. A more preferable lower limit to the content of the structural unit is 3% by weight, and a more preferable upper limit is 10% by weight.
In addition, the content of the structure derived from the amide group-containing monomer in the (meth)acrylic polymer is not particularly limited. The preferred lower limit of the unit content is 0.01% by weight, and the preferred upper limit is 1% by weight.

In order to obtain the (meth)acrylic polymer, a monomer mixture containing the (meth)acrylic monomer, the crosslinkable functional group-containing monomer, etc. is radically reacted in the presence of a polymerization initiator, and copolymerized. good. As a method of radically reacting the monomer mixture, that is, a polymerization method, a conventionally known method is used, and examples thereof include solution polymerization (boiling point polymerization or constant temperature polymerization), emulsion polymerization, suspension polymerization, bulk polymerization, and the like.

A preferable upper limit of the weight average molecular weight (Mw) of the (meth)acrylic polymer is 1,000,000. If the weight-average molecular weight (Mw) is 1,000,000 or less, the storage elastic modulus G′ at 23° C. and 1 Hz of the pressure-sensitive adhesive layer A and the adhesive strength after heating at 260° C. for 2 minutes are within the above ranges. It becomes easier to adjust, and the followability to the curved surface of the adhesive tape and the releasability are further improved. A more preferable upper limit of the weight average molecular weight (Mw) is 950,000, and a further preferable upper limit is 900,000.
The lower limit of the weight-average molecular weight (Mw) is not particularly limited, but from the viewpoint of the adhesive strength and shape retention of the pressure-sensitive adhesive layer A, a preferable lower limit is 400,000, and a more preferable lower limit is 500,000.
The weight average molecular weight of the (meth)acrylic polymer can be determined, for example, by GPC (Gel Permeation Chromatography) in terms of standard polystyrene. More specifically, for example, using "2690 Separations Module" manufactured by Water as a measuring instrument, "GPC KF-806L" manufactured by Showa Denko as a column, and ethyl acetate as a solvent, a sample flow rate of 1 mL/min, and a column temperature of 40°C. can be measured under the conditions of

The pressure-sensitive adhesive layer A may contain a tackifying resin.
Examples of the tackifying resin include rosin ester-based resins, hydrogenated rosin-based resins, terpene-based resins, terpene phenol-based resins, coumarone-indene-based resins, alicyclic saturated hydrocarbon-based resins, C5-based petroleum resins, and C9-based resins. petroleum resins, C5-C9 copolymer petroleum resins, and the like. These tackifying resins may be used alone or in combination of two or more.

Although the content of the tackifying resin is not particularly limited, it is preferable not to contain the tackifying resin from the viewpoint of improving the peelability of the adhesive tape. When the tackifier resin is contained, the upper limit of the content of the tackifier resin is preferably 5 parts by weight with respect to 100 parts by weight of the adhesive polymer A.

The pressure-sensitive adhesive layer A may further contain an inorganic filler such as fumed silica. By blending the inorganic filler, the cohesive force of the pressure-sensitive adhesive layer can be increased.

The pressure-sensitive adhesive layer A may further contain known additives such as plasticizers, resins, surfactants, waxes and fine particle fillers. These additives may be used alone, or two or more of them may be used in combination.

The thickness of the pressure-sensitive adhesive layer A is not particularly limited, but the preferred lower limit is 50 μm. If the thickness of the pressure-sensitive adhesive layer A is 50 µm or more, the followability to the curved surface of the pressure-sensitive adhesive tape is further improved. A more preferable lower limit of the thickness of the pressure-sensitive adhesive layer A is 75 μm. Although the upper limit of the thickness of the pressure-sensitive adhesive layer A is not particularly limited, the upper limit is preferably 200 µm, more preferably 150 µm, from the viewpoint of the adhesive strength, shape retention, etc. of the pressure-sensitive adhesive layer A.

The pressure-sensitive adhesive tape of the present invention further has a pressure-sensitive adhesive layer B, and the pressure-sensitive adhesive layer B preferably contains the pressure-sensitive adhesive polymer B and a cross-linking agent. When the pressure-sensitive adhesive tape of the present invention is used to cover the opening of the housing with a protective member, the pressure-sensitive adhesive tape of the present invention adheres the pressure-sensitive adhesive layer A to the housing and the pressure-sensitive adhesive layer B to the protective member. It is preferable to use them together.

The gel fraction of the pressure-sensitive adhesive layer B is not particularly limited, but the preferred lower limit is 50% by weight and the preferred upper limit is 95% by weight or less. When the gel fraction is 50% by weight or more, the heat resistance of the pressure-sensitive adhesive layer B is improved. When the gel fraction is 95% by weight or less, the pressure-sensitive adhesive layer B becomes sufficiently soft, and the conformability of the pressure-sensitive adhesive layer B to curved surfaces is improved. A more preferable lower limit of the gel fraction is 60% by weight, a more preferable upper limit is 90% by weight, and a still more preferable lower limit is 80% by weight.

The storage modulus G' of the pressure-sensitive adhesive layer B at 23°C and 1 Hz is not particularly limited, but preferably has a lower limit of 1 x 10 ⁴ Pa and an upper limit of 5 x 10 ⁴ Pa. When the storage elastic modulus G′ at 23° C. and 1 Hz is within the above range, the pressure-sensitive adhesive layer B becomes sufficiently soft, and the conformability of the pressure-sensitive adhesive layer B to curved surfaces is improved. A more preferable lower limit of the storage elastic modulus G′ at 23° C. and 1 Hz is 1.5×10 ⁴ Pa, and a more preferable upper limit thereof is 4×10 ⁴ Pa.

The adhesive strength of the adhesive layer B after heating at 260° C. for 2 minutes is preferably higher than the adhesive strength of the adhesive layer A after heating at 260° C. for 2 minutes. In this case, when the adhesive tape of the present invention is used by attaching the adhesive layer A to the housing and the adhesive layer B to the protective member, the adhesive after being exposed to high temperatures in a reflow process or the like The adhesive strength of the layer B becomes higher than the adhesive strength of the adhesive layer A. Therefore, after exposure to high temperature (after the process is completed), the pressure-sensitive adhesive layer A side, not the pressure-sensitive adhesive layer B side, can be easily peeled off by mechanical peeling or the like. That is, the adhesive tape can be easily peeled off from the housing while leaving the adhesive tape on the protective member. By providing a difference in adhesive strength between the two adhesive layers in this manner, the adhesive layers can be selectively peeled off.
The difference between the adhesive strength of the adhesive layer B after heating at 260° C. for 2 minutes and the adhesive strength of the adhesive layer A after heating at 260° C. for 2 minutes is not particularly limited, but the preferred lower limit is 3 N/25 mm. A more preferable lower limit is 3.5 N/25 mm. The upper limit of the difference is not particularly limited, and the larger the difference, the better.
The specific value of the adhesive strength after heating at 260 ° C. for 2 minutes of the adhesive layer B is not particularly limited, but the preferred lower limit is 4 N / 25 mm, the preferred upper limit is 50 N / 25 mm, and the more preferred lower limit is 8 N / 25 mm. , and a more preferable upper limit is 45 N/25 mm.

The initial adhesive strength (adhesive strength before heating at 260° C. for 2 minutes) of the adhesive layer B is not particularly limited, but the preferred lower limit is 5 N/25 mm, and the preferred upper limit is 50 N/25 mm. If the initial adhesive strength is within the above range, the adhesive strength of the adhesive layer B after heating at 260 ° C. for 2 minutes is adjusted to be higher than the adhesive strength of the adhesive layer A after heating at 260 ° C. for 2 minutes. easier to do. A more preferable lower limit of the initial adhesive strength is 10 N/25 mm, and a more preferable upper limit is 45 N/25 mm.

The adhesive polymer B is not particularly limited, but the gel fraction of the adhesive layer B, the storage elastic modulus G' at 23 ° C. and 1 Hz, and the adhesive strength after heating at 260 ° C. for 2 minutes are adjusted to the above ranges. From the point of view, the same (meth)acrylic polymer as the above-mentioned (meth)acrylic polymer used as the adhesive polymer A is preferable.
The cross-linking agent contained in the pressure-sensitive adhesive layer B is not particularly limited, and examples thereof include isocyanate-based cross-linking agents, aziridine-based cross-linking agents, epoxy-based cross-linking agents, and metal chelate-type cross-linking agents. Among them, at least one selected from the group consisting of isocyanate-based cross-linking agents and epoxy-based cross-linking agents is preferable because of its high heat resistance. The isocyanate-based cross-linking agent may or may not have an isocyanurate skeleton.
The content of the cross-linking agent in the adhesive layer B is the gel fraction of the adhesive layer B, the storage elastic modulus G' at 23 ° C. and 1 Hz, and the adhesive strength after heating at 260 ° C. for 2 minutes. Although it is not particularly limited as long as it can be adjusted within the range, a preferable lower limit is 0.01 parts by weight and a preferable upper limit is 10 parts by weight with respect to 100 parts by weight of the adhesive polymer B. A more preferable lower limit of the content of the cross-linking agent is 0.1 parts by weight, and a more preferable upper limit thereof is 5 parts by weight.
Further, the pressure-sensitive adhesive layer B, like the pressure-sensitive adhesive layer A, may contain a tackifying resin, may contain an inorganic filler such as fumed silica, a plasticizer, a resin, a surfactant , waxes, particulate fillers, and other known additives.

The thickness of the pressure-sensitive adhesive layer B is not particularly limited, but the preferred lower limit is 50 μm. If the thickness of the pressure-sensitive adhesive layer B is 50 μm or more, the conformability of the pressure-sensitive adhesive layer B to curved surfaces is further improved. A more preferable lower limit of the thickness of the pressure-sensitive adhesive layer B is 75 μm. Although the upper limit of the thickness of the pressure-sensitive adhesive layer B is not particularly limited, the upper limit is preferably 200 µm, more preferably 150 µm, from the viewpoint of the adhesive strength, shape retention property, etc. of the pressure-sensitive adhesive layer B.
In particular, the thickness of at least one selected from the group consisting of the pressure-sensitive adhesive layer A and the pressure-sensitive adhesive layer B is preferably 50 μm or more because the conformability to the curved surface of the pressure-sensitive adhesive tape is further improved.

The pressure-sensitive adhesive tape of the present invention is preferably a non-support type that does not have a substrate. In this case, the conformability to the curved surface of the adhesive tape, the transparency, etc. are further improved. Moreover, when the adhesive tape of the present invention is used to cover the opening of the housing with a protective member, there is an advantage that the visibility of the inside of the housing is improved.
The pressure-sensitive adhesive tape of the present invention may be a support type having a substrate. In the case of a support type, the pressure-sensitive adhesive tape of the present invention may be a single-sided pressure-sensitive adhesive tape having the above-mentioned pressure-sensitive adhesive layer A on only one side of a base material, or may be a single-sided pressure-sensitive adhesive tape having the above-mentioned pressure-sensitive adhesive layer A and the above-mentioned pressure-sensitive adhesive A double-sided pressure-sensitive adhesive tape having layer B may be used, but a single-sided pressure-sensitive adhesive tape having the pressure-sensitive adhesive layer A on only one side of a substrate is preferable.

The substrate is not particularly limited, and examples of materials for the substrate include polyethylene terephthalate, polyethylene naphthalate, polyacetal, polyamide, polycarbonate, polyphenylene ether, polybutylene terephthalate, ultra-high molecular weight polyethylene, syndiotactic polystyrene, poly Arylate, polysulfone, polyethersulfone, polyphenylene sulfide, polyetheretherketone, polyimide, polyetherimide, fluororesin, liquid crystal polymer and the like. Among them, polyimide is preferable because of its excellent heat resistance.

The thickness of the base material is not particularly limited, but a preferable lower limit is 5 μm and a preferable upper limit is 188 μm. When the thickness of the base material is within the above range, the pressure-sensitive adhesive tape can have appropriate stiffness and excellent handleability. A more preferable lower limit of the thickness of the substrate is 12 μm, and a more preferable upper limit thereof is 125 μm.

The storage elastic modulus G' at 23°C and 1 Hz of the pressure-sensitive adhesive tape of the present invention is not particularly limited, but the preferred lower limit is 1 x ^104Pa and the preferred upper limit is 5 x ^104Pa . If the storage elastic modulus G′ at 23° C. and 1 Hz is within the above range, the pressure-sensitive adhesive tape will be sufficiently soft, and the followability to curved surfaces will be further improved. A more preferable lower limit of the storage elastic modulus G′ at 23° C. and 1 Hz is 1.5×10 ⁴ Pa, and a more preferable upper limit thereof is 4×10 ⁴ Pa.

Since the pressure-sensitive adhesive tape of the present invention further improves the conformability to curved surfaces, the thickness of the entire pressure-sensitive adhesive tape is preferably 100 μm or more, more preferably 150 μm or more. The upper limit of the thickness of the adhesive tape as a whole is not particularly limited, but the preferred upper limit is 400 μm.

The application of the adhesive tape of the present invention is not particularly limited as long as it is used to fix the adherend at high temperature and peel it off from the adherend after the process is completed. (usually 250° C. or higher), it can be used to cover the opening of the housing with a protective member. In such a case, solder bumps are usually provided on some part of the module.

FIG. 1 is a cross-sectional view schematically showing an example of a state in which the opening of a housing is covered with a protective member using the adhesive tape of the present invention. In FIG. 1 , a component 2 is housed inside a housing 3 , and the opening of the housing 3 is covered with a protective member 4 via an adhesive tape 1 . Here, the upper surface of the opening of the housing 3, that is, the contact surface with the adhesive tape 1 may have a curved surface (warp) such as a convex arch shape or a concave arch shape. FIG. 2 is a cross-sectional view schematically showing an example in which the upper surface of the opening of the housing has a convex arch-shaped curved surface (warp). In FIG. 2, the upper surface of the opening of the housing 3, ie, the contact surface with the adhesive tape 1, has a convex arch-shaped curved surface (warp). The pressure-sensitive adhesive tape 1 has excellent conformability even to such a curved surface.
In addition, as shown in FIG. 2, the upper surface of the opening of the housing may have a convex arch shape on one side of the opening of the housing. Alternatively, it may have a concave arch shape (not shown) that is low at the central portion in the width direction and becomes higher toward both ends. Moreover, although not shown, one side of the opening of the housing may have a convex arch shape that is high at the center in the length direction and becomes lower toward both ends. It may have a concave arch shape that becomes higher as it approaches .

FIG. 3 is a cross-sectional view schematically showing another example of a state in which the opening of the housing is covered with a protective member using the adhesive tape of the present invention. In FIG. 3, the adhesive tape 1 is a double-sided adhesive tape having an adhesive layer A (1a) and an adhesive layer B (1b) on both sides of a substrate (1c). The adhesive tape 1 is used by attaching the adhesive layer A (1a) to the housing 3 and the adhesive layer B (1b) to the protective member 4. As shown in FIG. In this case, by providing a difference in adhesive strength between the two adhesive layers, the adhesive layers can be selectively peeled off.

A method for manufacturing a semiconductor device using the adhesive tape of the present invention, comprising a module in which components are housed inside a housing, and an opening of the housing is covered with a protective member via the adhesive tape of the present invention. and an adhesive tape peeling step of peeling off the adhesive tape of the present invention from the housing and removing the adhesive tape of the present invention and the protective member from the module. , is one of the present invention.

The housing is not particularly limited, and examples thereof include a housing made of epoxy resin or the like. The component is not particularly limited, and examples thereof include semiconductor chips and semiconductor devices. The protective member is not particularly limited, and examples thereof include a cover glass. In addition, it is preferable that solder bumps are provided on any part of the module.
When the pressure-sensitive adhesive tape of the present invention has the pressure-sensitive adhesive layer A and the pressure-sensitive adhesive layer B, it can be used by bonding the pressure-sensitive adhesive layer A to the housing and the pressure-sensitive adhesive layer B to the protective member. preferable.
In the heat treatment step, the heat treatment temperature is not particularly limited, and may be a temperature normally employed in the reflow step, which is usually about 250° C. or higher and 300° C. or lower.

In the adhesive tape peeling step, the method for peeling the adhesive tape of the present invention from the housing is not particularly limited, but examples thereof include mechanical peeling.
When the pressure-sensitive adhesive tape of the present invention has the pressure-sensitive adhesive layer A and the pressure-sensitive adhesive layer B, by providing a difference between the adhesive strengths of the two pressure-sensitive adhesive layers, the pressure-sensitive adhesive tape of the present invention can be applied to the housing while the pressure-sensitive adhesive tape of the present invention remains on the protective member. The adhesive tape of the present invention can be easily peeled from the body.

ADVANTAGE OF THE INVENTION According to the present invention, it is possible to provide a pressure-sensitive adhesive tape that can be fixed to an adherend without causing foaming even when exposed to high temperatures, has excellent conformability to curved surfaces, and can be easily peeled off from the adherend after the process is completed. can. Moreover, according to the present invention, it is possible to provide a method for manufacturing a semiconductor device using the adhesive tape.

FIG. 2 is a cross-sectional view schematically showing an example of a state in which the opening of a housing is covered with a protective member using the adhesive tape of the present invention; FIG. 4 is a cross-sectional view schematically showing an example in which the upper surface of the opening of the housing has a convex arch-shaped curved surface (warp). FIG. 4 is a cross-sectional view schematically showing another example of a state in which the opening of the housing is covered with a protective member using the adhesive tape of the present invention;

EXAMPLES The aspects of the present invention will be described in more detail below with reference to Examples, but the present invention is not limited to these Examples.

(Example 1)
(1) Preparation of Adhesive Polymer A ((meth)acrylic polymer) A reactor equipped with a thermometer, a stirrer, and a cooling tube was charged with 52 parts by weight of ethyl acetate, and after nitrogen substitution, the reactor was heated to reflux. started. After 30 minutes from the boiling of ethyl acetate, 0.08 part by weight of azobisisobutyronitrile was added as a polymerization initiator. To this, 47.2 parts by weight of 2-ethylhexyl acrylate, 47.5 parts by weight of lauryl acrylate, 5 parts by weight of 4-hydroxybutyl acrylate and 0.3 parts by weight of acrylic acid were added dropwise evenly and gradually over 1 hour and 30 minutes. reacted. 0.1 part by weight of azobisisobutyronitrile was added 30 minutes after the completion of dropping, and the polymerization reaction was continued for 5 hours. A solution of
The obtained (meth)acrylic polymer was measured using "2690 Separations Module" manufactured by Water as a measuring instrument, "GPC KF-806L" manufactured by Showa Denko Co., Ltd. as a column, ethyl acetate as a solvent, and a sample flow rate of 1 mL/min. The weight average molecular weight was measured at a temperature of 40°C.

(2) Preparation of Adhesive Polymer B ((meth)acrylic polymer) Adhesive polymer B was obtained in the same manner as A.

(3) Production of Adhesive Tape To the solution of Adhesive Polymer A, Coronate HX (manufactured by Tosoh Corporation) as a cross-linking agent having an isocyanurate skeleton is added to 100 parts by weight of Adhesive Polymer A so that the solid content becomes 1 part by weight. The mixture was further sufficiently stirred to obtain an adhesive solution A. The resulting pressure-sensitive adhesive solution A is applied onto a release-treated polyethylene terephthalate (PET) film having a thickness of 75 μm using an applicator so that the dry film has a thickness of 75 μm, and dried at 110° C. for 3 minutes. Thus, the adhesive layer A was formed. This was designated as laminated film A.
On the other hand, Tetrad C (manufactured by Mitsubishi Chemical Co., Ltd.) as an epoxy-based cross-linking agent is added to the solution of the adhesive polymer B so that the solid content becomes 0.1 part by weight with respect to 100 parts by weight of the adhesive polymer B, and the mixture is thoroughly stirred. and an adhesive solution B was obtained. The resulting pressure-sensitive adhesive solution B is applied onto a release-treated polyethylene terephthalate (PET) film having a thickness of 75 μm using an applicator so that the dry film has a thickness of 75 μm, and dried at 110° C. for 3 minutes. Thus, the adhesive layer B was formed. This was designated as laminated film B.
By laminating laminated film A and laminated film B so that the adhesive layers are mutually aligned, a non-support type adhesive tape having no base material in which adhesive layer A and adhesive layer B are laminated is obtained. rice field.

(4) Measurement of gel fraction of adhesive layer A and adhesive layer B Only 0.1 g of the adhesive layer (adhesive composition) was taken out from the adhesive tape, immersed in 50 mL of ethyl acetate, and heated with a shaker. It was shaken for 24 hours under conditions of 23 degrees and 200 rpm. After shaking, ethyl acetate and the adhesive composition swollen by absorbing ethyl acetate were separated using a metal mesh (#200 mesh opening). The adhesive composition after separation was dried at 110° C. for 1 hour. The weight of the adhesive composition containing the dried metal mesh was measured, and the gel fraction of the adhesive layer was calculated using the following formula.
Gel fraction (% by weight) = 100 x (W ₁ - W ₂ )/W ₀
(W ₀ : initial weight of adhesive composition, W ₁ : weight of adhesive composition containing metal mesh after drying, W ₂ : initial weight of metal mesh)

(5) Measurement of storage elastic modulus G′ of adhesive layer A and adhesive layer B at 23° C. and 1 Hz A dynamic viscoelastic spectrum was measured from −40 to 140° C. under the conditions of a heating rate of 5° C./min and 1 Hz in the heating mode. The storage elastic modulus at 23°C was taken as the storage elastic modulus G' at 23°C and 1 Hz of the pressure-sensitive adhesive layer.

(6) Measurement of initial adhesive strength of adhesive layer A and adhesive layer B, and adhesive strength after heating at 260 ° C. for 2 minutes. Lined with a 20 cm thick, 50 μm thick polyimide film (Kapton, manufactured by Toray DuPont), then laminated to a 50 mm wide, 12.5 cm long, and 2 mm thick stainless steel plate, and reciprocated once with a 2 kg roller. A test piece for measurement was produced. The resulting test piece for measurement was stretched at a tensile speed of 300 mm/min at a tensile speed of 300 mm/min in accordance with JIS Z0237:2009 using an Autograph (manufactured by Shimadzu Corporation) in a 180° direction at a temperature of 23°C and a relative humidity of 50%. 180° adhesive strength (N/25 mm) was measured by peeling off the adhesive layer. This was taken as the initial adhesive strength.
In addition, for the test piece for measurement in which the pressure-sensitive adhesive layer is attached to the stainless steel plate, a high-temperature incubator (manufactured by Espec Co., Ltd.) is preheated to 260 ° C., and when the temperature reaches 260 ° C., the test piece for measurement is put in and 2 heated for a minute. 180° adhesive strength (N/25 mm) was measured in the same manner as the initial adhesive strength for the test piece for measurement after heating. This was taken as the adhesive strength after heating at 260° C. for 2 minutes.

(Examples 2 to 9, Comparative Examples 1 to 4)
A pressure-sensitive adhesive tape was obtained in the same manner as in Example 1, except that the compositions of the pressure-sensitive adhesive layer A and the pressure-sensitive adhesive layer B were changed as shown in Tables 1 and 2.
In Example 2, a polyimide base material having a thickness of 25 μm was used as the base material, and laminated film A and laminated film B were laminated on both sides of the polyimide base material so that the adhesive layer was in contact with the polyimide base material. , obtained a support type adhesive tape. Further, in Example 9, Stabio D-370N (manufactured by Mitsui Chemicals, Inc.), which is a cross-linking agent having an isocyanurate skeleton, was used as the cross-linking agent, and in Comparative Example 4, an isocyanate-based cross-linking agent (isocyanurate skeleton ) was used, which is Coronate L (manufactured by Tosoh Corporation).

<Evaluation>
The adhesive tapes obtained in Examples and Comparative Examples were evaluated as follows. The results are shown in Tables 1-2.

(1) After heating at 260° C., a protective member (made of glass, thickness 0.5 mm) was attached to the opening of the peelable housing (made of epoxy resin) using the obtained adhesive tape to prepare a sample. At this time, the adhesive layer A was attached to the housing, and the adhesive layer B was attached to the protective member. The bonding was performed by pressure bonding at 0.3 MPa for 10 seconds under the conditions of 23° C. and 50% relative humidity. A high-temperature incubator (manufactured by Espec Co., Ltd.) was heated to 260° C. After reaching 260° C., the prepared sample was placed in the high-temperature incubator and heated for 2 minutes.
After returning the sample to room temperature, the adhesive tape was peeled off from the housing while leaving the adhesive tape on the protective member (peeling test). The adhesive tape is peeled off by using Autograph (manufactured by Shimadzu Corporation) and peeling off the housing and the protective member in the vertical direction at a tensile speed of 300 mm / min under an environment of 23 ° C. and 50% relative humidity. gone.
The case where the adhesive tape could be peeled off from the housing and there was no adhesive residue was rated as ◯, and the case where there was adhesive residue was rated as x.

(2) Foaming after heating at 260°C Heating was carried out in the same manner as in (1) Peelability after heating at 260°C. After returning the sample to room temperature, the presence or absence of foaming in the pressure-sensitive adhesive layer A was observed using an optical microscope (manufactured by Keyence Corporation). The case where there was no foaming was rated as ◯, and the case where there was foaming was rated as x.

(3) Presence or absence of peeling from the protective member after heating at 260° C. Heating and peeling tests were conducted in the same manner as in the above (1) Peelability after heating at 260° C. When the adhesive tape is peeled off from the protective member (adhesive layer B side) instead of the adhesive tape being peeled off from the housing (adhesive layer A side), the peeling from the protective member is “present”, and the housing (adhesive layer A case where the adhesive tape was peeled off from the side A) was evaluated as "no peeling" from the protective member.

(3) Followability to a curved surface An adhesive tape was attached to a glass plate having a length of 20 mm, a width of 5 mm and a thickness of 0.5 mm. This was adhered to an epoxy resin housing having a concave arch-shaped curved surface (opening upper surface) with a chord length of 20 mm, a width of 5 mm, and a curvature radius of 2500 mm, and was heated at 0.3 MPa under the conditions of 23 ° C. and 50% relative humidity. It was crimped for 10 seconds. Observed using an optical microscope (manufactured by Keyence), ◎ if the adhesive tape was not peeled off from the housing, ○, 5% if the area of the peeled adhesive tape was less than 5% of the entire tape. The case where more peeling occurred was evaluated as x.

BA: butyl acrylate 2-EHA: 2-ethylhexyl acrylate LA: lauryl acrylate LMA: lauryl methacrylate ISTA: isostearyl acrylate 4-HBA: 4-hydroxybutyl acrylate AAc: acrylic acid Aam: acrylamide

ADVANTAGE OF THE INVENTION According to the present invention, it is possible to provide a pressure-sensitive adhesive tape that can be fixed to an adherend without causing foaming even when exposed to high temperatures, has excellent conformability to curved surfaces, and can be easily peeled off from the adherend after the process is completed. can. Moreover, according to the present invention, it is possible to provide a method for manufacturing a semiconductor device using the adhesive tape.

1 Adhesive tape 1a Adhesive layer A
1b adhesive layer B
1c base material 2 part 3 housing 4 protection member

Claims (13)

An adhesive tape having at least an adhesive layer A,
The adhesive layer A contains an adhesive polymer A and a cross-linking agent having an isocyanurate skeleton,
The adhesive layer A has a gel fraction of 80% by weight or more and 95% by weight or less, and a storage elastic modulus G′ at 23° C. and 1 Hz of 1×10 ⁴ Pa or more and 5×10 ⁴ Pa or less. , an adhesive tape having an adhesive strength of 0.1 N/25 mm or more and 3.0 N/25 mm or less after being heated at 260° C. for 2 minutes. 2. The pressure-sensitive adhesive tape according to claim 1, wherein the pressure-sensitive adhesive polymer A is a (meth)acrylic polymer, and the (meth)acrylic polymer contains a structural unit derived from a hydroxyl group-containing monomer. 3. The adhesive according to claim 2, wherein the (meth)acrylic polymer contains 35% by weight or more of structural units derived from a (meth)acrylic acid ester having an alkyl group having 12 or more and 18 or less carbon atoms. tape. 4. The pressure-sensitive adhesive tape according to claim 2, wherein the (meth)acrylic polymer contains 0.01% by weight or more and 1% by weight or less of structural units derived from an amide group-containing monomer. 1, 2 or 3, wherein the pressure-sensitive adhesive layer A contains a tackifying resin, and the content of the tackifying resin is 5 parts by weight or less with respect to 100 parts by weight of the pressure-sensitive adhesive polymer A. 4. The adhesive tape according to 4 above. 6. The pressure-sensitive adhesive tape according to claim 1, wherein the pressure-sensitive adhesive layer A has an initial adhesive strength of 0.1 N/25 mm or more and 2.5 N/25 mm or less. Furthermore, it has an adhesive layer B, the adhesive layer B contains an adhesive polymer B and a cross-linking agent, and the adhesive strength after heating the adhesive layer B at 260 ° C. for 2 minutes is the adhesive 7. The adhesive tape according to claim 1, 2, 3, 4, 5 or 6, wherein the adhesive strength is higher than that of layer A after heating at 260[deg.] C. for 2 minutes. 8. The pressure-sensitive adhesive tape according to claim 7, wherein the pressure-sensitive adhesive layer B has a storage elastic modulus G' of 1×10 ⁴ Pa or more and 5×10 ⁴ Pa or less at 23° C. and 1 Hz. 1, 2, 3, 4, 5, and 6, wherein the adhesive tape has a storage elastic modulus G′ of 1×10 ⁴ Pa or more and 5×10 ⁴ Pa or less at 23° C. and 1 Hz. , 7 or 8. 8. The pressure-sensitive adhesive tape according to claim 7, wherein the thickness of at least one selected from the group consisting of said pressure-sensitive adhesive layer A and said pressure-sensitive adhesive layer B is 50 μm or more. 11. The adhesive tape according to claim 1, wherein the thickness of the entire adhesive tape is 100 [mu]m or more. 12. The adhesive tape according to claim 1, 2, 3, 4, 5, 6, 7, 8, 9, 10 or 11, which has no substrate. A method for manufacturing a semiconductor device using the adhesive tape according to claim 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11 or 12,
A heat treatment step of heat-treating a module in which parts are housed inside a housing and the opening of the housing is covered with a protective member via the adhesive tape;
and an adhesive tape peeling step of peeling off the adhesive tape from the housing and removing the adhesive tape and the protective member from the module.

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