JP2023027451A - Optical device, processing method and article manufacturing method - Google Patents

Abstract

To improve accuracy in laser processing.SOLUTION: An optical device processes an object by irradiating the object with a laser beam. The optical device comprises: a focus position adjustment mechanism that adjusts a focus position of a laser beam; and a converging-angle changing mechanism that changes a converging angle of a laser beam made which is made incident to the object, by varying a beam diameter of a laser beam that is made incident to the focus position adjustment mechanism so that the diameter becomes smaller, as the focus position moves in an advancing direction of the laser beam from a laser incident surface side of the object.SELECTED DRAWING: Figure 5

Description

The present invention relates to an optical device, a processing method, and an article manufacturing method.

An optical scanning device in a laser processing device or the like includes a translational optical system, a condensing optical system, and a condensing optical system so as to irradiate a position (x, y, z) on an object with condensed light from an orientation (θx, θy). and deflection optics. A translational optical system is an optical system that translates (parallel shifts) light incident on a condensing optical system described later in order to change the orientation (Patent Document 1). A focusing optic is an optical system that changes the focal position (z) of light in order to focus it on an object. A deflection optical system (also referred to as a scanning optical system) is an optical system that includes a deflection optical element such as a mirror and changes the irradiation position (x, y) of light. Among these optical systems, the translational optical system of Patent Document 1 includes a rotatable reflecting member having a first reflecting surface and a second reflecting surface. It also includes an optical system that sequentially reflects the light reflected by the first reflecting surface by the plurality of reflecting surfaces and makes the light incident on the second reflecting surface. Further, it includes an adjustment unit that adjusts the optical path of the light that is reflected by the second reflecting surface and exits the reflecting member by changing the rotation angle of the reflecting member. Such a configuration realizes translational movement (parallel shift) of light emitted from the reflecting member. Also, by arranging two sets of the translational optical system, light can be translated in two axial directions. When the light emitted from the reflecting member enters the condensing optical system (condensing lens) with parallel eccentricity, the converging light inclined at an angle determined by the amount of eccentricity and the focal length of the condensing optical system enters the condensing optical system. to inject. The condensed light is applied to an object, for example, in an optical processing device, and can be used for processing the object, such as drilling holes, by thermal or wave effects.

JP-A-4-253584

When drilling a hole in an optical processing apparatus using an optical scanning device as described above, a laser beam is scanned in the in-plane direction (xy direction) of the object while the focal position is set on the surface of the object (laser The processing is performed from the incident surface side) to the back surface (laser emission surface side).

However, when the focal position is lowered to the back of the object, the beam diameter at the height of the surface of the object is large, so the beam hits the edge of the surface, and the beam does not reach to the back, creating a deep hole. There is a problem that there is no

An exemplary object of the present invention is to solve the above-described problems and improve the accuracy of laser processing.

In order to solve the above problems, the present invention provides an optical apparatus for processing an object by irradiating it with a laser beam, comprising: a focal position adjusting mechanism for adjusting the focal position of the laser beam; By changing the beam diameter of the laser beam incident on the focal position adjustment mechanism so as to decrease as the position moves from the laser incident surface side of the object in the traveling direction of the laser beam, and a condensing angle changing mechanism for changing the condensing angle of the incident laser light.

According to the present invention, it is possible to solve the above-described problems and improve the accuracy of laser processing.

It is a figure showing an example of composition of some optical devices concerning this embodiment. It is a figure which shows the structural example of the drive part which changes the angle of a reflecting member. It is a figure showing other examples of composition of some optical devices. It is a figure which shows the structural example of the laser processing apparatus containing a translational optical system. It is a figure which shows the structural example of the laser processing apparatus which concerns on this embodiment. It is a schematic diagram explaining an example of the drilling process of a laser processing apparatus. FIG. 10 is a diagram showing the shape of a hole to be machined and how beams are condensed when the hole is drilled; FIG. 10 is a diagram showing numerical examples when processing is performed by changing the beam condensing angle;

Embodiments of the present invention will be described below with reference to the accompanying drawings. In principle (unless otherwise noted), the same members and the like are given the same reference numerals throughout the drawings for describing the embodiments, and repeated description thereof will be omitted.

[Embodiment of Processing Apparatus]
FIG. 1 is a diagram showing a configuration example of part of an optical device according to this embodiment. The optical device according to the present embodiment can control the path of emitted light (optical path), and can, for example, translate (parallel shift) light rays. The light beam parallel shift mechanism (translational optical system) of this embodiment includes a mirror member 2 (also referred to as a reflecting member) that reflects the light beam 51 from the laser light source 50 . In the following description, each reflecting surface can be regarded as a plane, and a case in which the optical path is translated will be exemplified. The mirror member 2 is made of glass, for example, and has a first reflecting surface 2a that receives the light beam 51 from the laser light source 50 and a second reflecting surface 2b on the opposite side. The first reflecting surface 2a and the second reflecting surface 2b are each coated with a high reflectance coating. The mirror member 2 may be configured in a prism shape, or may be configured such that the first reflecting surface 2a and the second reflecting surface 2b are independent of each other.

Also, the mirror member 2 is configured to be angle-variable so that the optical path of the light emitted from the optical device can be controlled (changed). Here, FIG. 2 is a diagram showing a configuration example of the driving section (1) that changes the angle of the reflecting member (2). As shown, the mirror member 2 is supported by an output shaft 1a of a (galvano) motor 1 (drive unit). The control unit 60 outputs a drive signal to the motor 1, and the motor 1 rotates the mirror member 2 via the output shaft 1a by a drive amount corresponding to the drive signal. Thus, the mirror member 2 is configured to be rotatable (variable in angle). Here, the mirror member 2 is inclined at approximately 45 degrees with respect to the light beam 51 from the laser light source 50 . In this specification, such a mirror member is called a galvanomirror optical system. Note that the mirror member 2 is not limited to this configuration as long as it is configured to be able to control the optical path of the light emitted from the optical device.

Returning to FIG. 1 , the translational optical system has an optical system 80 that sequentially reflects the light reflected by the mirror member 2 on a plurality of reflecting surfaces and causes the light to enter the mirror member 2 . The optical system 80 includes, for example, four mirrors 3 , 4 , 5 and 6 (reflecting surfaces) fixedly arranged so as to be symmetrical with respect to the light ray 51 . The light reflected by the first reflecting surface 2a of the mirror member 2 is sequentially reflected by these mirrors 3, 4, 5 and 6 and guided to the second reflecting surface 2b of the mirror member 2. As shown in FIG. The light that is finally reflected by the second reflecting surface 2 b and exits the mirror member 2 has a traveling direction that is substantially the same as (substantially parallel to) the traveling direction of the light ray 51 .

The angle (advancing direction) of this emitted light does not change even if the rotation angle of the mirror member 2 is changed. Therefore, by controlling the rotation angle of the mirror member 2 by the control unit 60, the path of the light reflected by the second reflecting surface 2b and exiting the mirror member 2 can be adjusted (translationally or parallelly shifted).

FIG. 3 is a diagram showing another configuration example of part of the optical device. This configuration is a combination of the configurations shown in FIG. system 62; The first translational optical system 61 has an angle-variable mirror member 13 that reflects the light beam 51 from the laser light source 50 . The first translational optical system 61 also has mirrors 14-1, 14-2, 14-3, and 14-4. The second translational optical system 62 has an angle-variable mirror member 15 that reflects the light rays emitted from the first translational optical system. The second translational optical system 62 also has mirrors 16-1, 16-2, 16-3, and 16-4. The rotation axis 63 of the mirror member 13 of the first translational optical system 61 and the rotation axis 64 of the mirror member 15 of the second translational optical system 62 are arranged so as to be non-parallel, for example, perpendicular to each other. .

In the first translational optical system 61, the incident light reflected by the first reflecting surface of the mirror member 13 is sequentially reflected by the mirrors 14-1, 14-2, 14-3, and 14-4, and is reflected by the mirror member 13. It is guided to the second reflecting surface opposite to the first reflecting surface. The light reflected by the second reflecting surface and exiting the mirror member 13 enters the mirror member 15 of the second translational optical system 62 . In the second translational optical system 62, the incident light reflected by the first reflecting surface of the mirror member 15 is sequentially reflected by the mirrors 16-1, 16-2, 16-3, and 16-4, and the mirror member 15 It is guided to the second reflecting surface opposite to the first reflecting surface. The light finally reflected by the second reflecting surface of the mirror member 15 and emitted from the mirror member 15 has a traveling direction substantially identical (substantially parallel) to the traveling direction of the light ray 51 . As shown in FIG. 3, a plane formed by an optical path formed by reflection at each mirror of the first translational optical system 61 and an optical path formed by reflection at each mirror of the second translational optical system 62 are formed. You may employ|adopt arrangement|positioning which intersects a plane. By arranging the two translational optical systems so as to intersect each other in this way, it is possible to reduce the size of the optical device.

Here, a processing apparatus including the translational optical system described above and an optical system that guides (irradiates) the light emitted from the translational optical system to an object (object) will be described. FIG. 4 is a diagram showing a configuration example of a laser processing apparatus including a translational optical system. The laser processing apparatus shown in FIG. 4 includes the translational optical system 17 described with reference to FIG. The rear side contains a magnifying optic, which magnifies the beam diameter by the required amount. A magnifying optical system includes a lens 18 and a collimating lens 19 . In addition, the magnifying optical system includes a condensing optical system (condensing lens 22) behind the magnifying optical system, thereby condensing and irradiating an object 23 placed in its focal plane with laser light. (Galvano) mirrors 20 and 21 (deflecting optical system) are included between the magnifying optical system and the condensing optical system, and the target incident position (x, y) on the object 23 can be adjusted by adjusting the rotation angle thereof. irradiate the light. In other words, the (galvano) mirrors 20 and 21 can be said to be an incident position adjusting mechanism for adjusting the incident position of light. The (galvano) mirrors 20 and 21 adjust the incident position of the laser light incident on the object 23 in the direction perpendicular to the focal direction of the laser light.

According to the above configuration, the light rays incident on the condensing optical system can be parallel decentered by the translational optical system 17, and the angle (incidence angle) of the light rays exiting the condensing optical system and incident on the object 23 can be changed. (or adjust). In other words, the translational optical system 17 can be said to be an angle adjustment mechanism. Further, by adjusting the relative distance between the lens 18 and the collimating lens 19 in the magnifying optical system, the position of the focal plane where the object 23 is irradiated can be changed. As a result, the object can be formed with a tapered hole, cut with an oblique cross-section, and the like.

Here, the laser processing device 100 as an optical device according to this embodiment will be described. FIG. 5 is a diagram showing a configuration example of the laser processing apparatus 100 according to this embodiment. As shown in FIG. 5, the laser processing apparatus 100 irradiates a light beam from a laser light source 71 onto an object through an optical device including the translation optical system, the expansion optical system, the deflection optical system, and the condensing optical system. Thus, the configuration is such that laser processing is performed. As the laser light source 71, for example, a femtosecond solid-state laser having an oscillation wavelength of 1030 nm, a frequency of 100 kHz, a pulse width of 350 fs (femtoseconds), and an output of 100 μJ/pulse can be used. As the object 23, for example, a stainless steel plate (SUS304) can be used.

Also, the lens 18 included in the magnifying optical system is fixed on the linear stage 34 . The control unit 60 outputs a drive signal to the linear stage 34, and the linear stage 34 moves the lens 18 in the optical axis direction by a drive amount according to the drive signal. Thereby, the position of the focal plane with which the object 23 is irradiated can be changed. That is, the linear stage 34 functions as a focus position adjusting mechanism. Further, as the focus position adjusting mechanism, a mechanism for moving the condensing lens 22 included in the condensing optical system in the optical axis direction may be used.

Additionally, the laser processing apparatus 100 includes a reduction optical system between the laser light source 71 and the translational optics 17 to reduce the beam diameter to the required amount. A reduction optical system includes a lens 24 and a collimating lens 25 . Lens 24 is fixed on linear stage 31 . The control unit 60 outputs a drive signal to the linear stage 31, and the linear stage 31 moves the lens 24 in the optical axis direction by a drive amount according to the drive signal. Thereby, the diameter of the light beam can be reduced. A beam expander capable of adjusting the diameter of light rays to a required amount may be used as the reduction optical system. Furthermore, an aperture stop capable of adjusting the diameter of light rays to a required amount may be used as the reduction optical system. A light beam emitted from the laser light source 71 is applied to the object 23 through an optical device including a reduction optical system, a translation optical system, an expansion optical system, a deflection optical system, and a condensing optical system.

The object 23 is fixed and supported by a suction holding mechanism (vacuum chuck) 33 on an XY stage 32 movable in a plane perpendicular to the optical axis of the condensing optical system. The XY stage 32 has an XY plane perpendicular to the optical axis of the condensing optical system, and a Z axis parallel to the optical axis of the condensing optical system. The XY stage 32 is controlled by a computer device 35 via a stage controller 36 .

Here, a procedure for drilling the object 23 using the laser processing apparatus 100 described above will be described. While scanning the laser beam (ray) emitted from the laser light source 71 in the in-plane direction (here, the XY direction) of the surface of the object 23, the focal position is shifted from the surface (laser incident surface side) of the object 23 to the rear surface (laser emission surface side). face side). When the object 23 is irradiated with the laser beam, a portion of the object 23 is locally heated and removed in the vicinity of the focal position. Such a drilling method is generally called trepanning.

FIG. 6 is a schematic diagram illustrating an example of the drilling process of the laser processing apparatus 100. FIG. FIG. 6A is a diagram showing an example of the trajectory of the focal position of the laser beam during drilling. As shown in the figure, the laser processing apparatus 100 sequentially removes portions of the object 23 locally in the vicinity of the focal position with the laser beam, for example, while drawing a circular trajectory. First, the focal position is adjusted to the surface of the object 23, and the laser beam is scanned in the in-plane direction to remove a part of the object 23 in the scanned in-plane near the surface. Next, by slightly lowering the focal position from the surface of the object toward the back, and similarly scanning the laser beam in the in-plane direction, a part of the object 23 within the scanned plane is removed. FIG. 6B is a diagram showing a state in which the focal position is lowered from the object surface toward the back surface. At this time, a part of the object 23 is removed in the depth direction by the amount that the focus position is slightly lowered. By repeating this step by step, drilling is performed while removing the object 23 in the depth direction.

However, when the focal position is lowered to the vicinity of the back surface of the object 23, the beam at the height of the surface of the object 23 spreads. There is a problem that a deep hole cannot be dug because it does not reach. FIG. 6C is a diagram showing a state in which the focal position is lowered to the vicinity of the back surface of the object 23. FIG.

FIG. 7 is a diagram showing the shape of a hole to be machined and how the beam is condensed during the hole punching process. Here, the machined hole refers to a hole machined in the object 23 . FIG. 7A is a diagram showing the shape of a machined hole and how the beam is condensed when the beam condensing angle is relatively large. As shown in FIG. 7(A), when the focal position is lowered to the vicinity of the back surface in the process of digging the object 23, the beam at the surface position 232 of the object 23 becomes defocused and condensed at the focal position. The beam diameter becomes wider than the spot diameter. As shown in this figure, this spread beam hits the edge portion 231 of the machined hole surface, and a part of the beam is eclipsed. As a result, part of the energy of the laser beam does not reach the focal position, and the removing ability at the focal position is lowered, making it impossible to excavate the object 23 .

Conversely, if the beam condensing angle is reduced so as not to impinge on the beam, the diameter of the condensed spot at the focal position becomes large, which poses a problem that fine processing cannot be performed. FIG. 7B shows the processed hole shape and the state of beam convergence when the beam condensing angle is made smaller than that in FIG. 7A. As shown in FIG. 7B, when the beam condensing angle is reduced, the beam diameter at the surface height of the object 23 becomes smaller than that in FIG. 7A. Therefore, the edge portion 231 of the surface is not irradiated with the beam, but the condensed spot diameter at the focal position becomes large. When the object 23 is irradiated with the laser beam in this state, a portion of the object 23 is locally heated near the focal position and removed, but the removed volume increases. In drilling using a pulsed laser, if the volume removed per pulse of laser beam irradiation increases, the processing resolution deteriorates, making fine processing impossible.

Therefore, in this embodiment, as the focal position of the laser beam moves in the direction from the front surface to the back surface of the object 23, that is, in the traveling direction of the laser beam, the diameter of the laser beam incident on the focusing optical system is changed. to change the beam convergence angle. In other words, as the processing depth of the laser beam into the object 23 increases, the beam condensing angle is changed by changing the diameter of the laser beam incident on the condensing optical system. That is, the beam condensing angle is made different between when processing the vicinity of the front surface of the object 23 and when processing the vicinity of the back surface of the object 23 . Specifically, when processing the vicinity of the surface of the object 23, the position of the lens 24 of the reduction optical system is adjusted to increase the diameter of the laser beam incident on the focusing optical system. Processing is performed by increasing the light angle. After that, the focus position is gradually moved from the front surface to the back surface. When processing the vicinity of the back surface of the object 23, the position of the lens 24 of the reduction optical system is adjusted to reduce the diameter of the laser beam incident on the condensing optical system. Make it smaller and work on it. That is, the reduction optical system also functions as a condensing angle changing mechanism that changes the condensing angle of the laser light incident on the object 23 .

The reduction optical system reduces the laser beam diameter based on the diameter D of a hole (machined hole) machined in the object 23, the machined depth of the machined hole, and the incident angle (beam incident angle) at which the laser beam enters the object 23. change. Specifically, the diameter of the laser beam incident on the focal position adjustment mechanism is changed so that the laser beam diameter 90 at the surface position 232 of the object 23 on the laser beam incidence side does not overlap the edge portion 231 of the machined hole surface. That is, the diameter of the laser beam incident on the focal position adjustment mechanism is changed so that the laser beam diameter 90 at the surface position 232 of the object 23 on the laser beam incidence side is smaller than the diameter D of the hole machined in the object 23. .

Here, assuming that the diameter of the processed hole is D, the beam incident angle is θ, and the distance from the surface of the object 23 to the focal position is ΔZ, the beam condensing angle φ can be changed so as to satisfy the following formula for processing. is preferred.

FIG. 8 is a diagram showing numerical examples when processing is performed by changing the beam condensing angle. This figure shows an example of numerical values obtained by calculating the beam converging angle φ when the diameter D of the machined hole is 100 μm and the beam incident angle θ is 3° using the above formula. FIG. 8A shows an example of the beam converging angle φ when the distance ΔZ from the surface of the object 23 to the focal position is 300 μm. FIG. 8B shows an example of the beam convergence angle φ when the distance ΔZ from the surface of the object 23 on the laser light incident side to the focal position is 1000 μm. For example, when the distance ΔZ from the surface of the object 23 to the focal position is 300 μm, the beam condensing angle φ is 3.76° in half angle. Similarly, when the distance ΔZ from the surface of the object 23 to the focal position is 1000 μm, the beam condensing angle φ is 1.88° in half angle.

Therefore, the beam condensing angle φ is calculated according to the distance ΔZ from the surface of the object 23 to the focal position, and the position of the lens 24 of the reducing optical system is adjusted so as not to exceed the beam condensing angle φ. Then, the diameter of the laser beam incident on the condensing lens 22 included in the condensing optical system may be reduced to carry out laser processing. In the case of this embodiment, since the beam condensing angle is changed from 3.76° to 1.88° in half angle, the focal length of the condensing lens 22 is 60 mm. It may be changed from 8 mm to 4 mm.

At this time, the focused spot diameter at the focal position changes from 10 μm to 20 μm. As the focused spot diameter increases, the processing resolution deteriorates as described above. However, in drilling, when the distance .DELTA.Z from the surface of the object 23 to the focal position is large, that is, when processing the vicinity of the back surface of the object 23, the processing resolution does not deteriorate even if the focused spot diameter increases. This is because the laser beam undergoes multiple reflections inside the object 23 and the effective focused spot diameter becomes smaller.

In order to further reduce deterioration of processing resolution, the amount of laser light from the laser light source 71 may be changed according to the converging angle of the laser light. For example, the controller 60 increases the amount of laser light from the laser light source 71 as the condensing angle of the laser light decreases. This makes it possible to further reduce deterioration of processing resolution.

Therefore, when processing the vicinity of the surface of the object 23, the beam condensing angle is increased and the condensed spot diameter is decreased to prevent deterioration of processing resolution. Make it small so that the beam does not hit the edge of the surface.

Note that the distance ΔZ from the surface of the object 23 to the focal position may be replaced with the machining depth of the machined hole. Here, the machining depth is the depth of the machined hole at the time of machining. For example, it is possible to acquire the processing depth according to the processing time in advance. Also, the incident angle (beam incident angle θ) at which the laser beam is incident on the object 23 can be determined in advance according to the material of the object 23, for example. Then, for example, the computer device 35 can obtain in advance the beam condensing angle φ according to the lapse of processing time. Therefore, the computer device 35 can obtain in advance the diameter of the laser beam incident on the condensing optical system according to the lapse of processing time. For example, the computer device 35 outputs to the controller 60 the diameter of the laser beam incident on the condensing optical system according to the lapse of processing time. Then, according to the processing time, the controller 60 outputs a drive signal to the linear stage 31 so that the input laser beam diameter is obtained, and the linear stage 31 moves the lens 24 in the optical axis direction. good too. The controller 60 may change the diameter of the laser beam incident on the condensing optical system stepwise or discretely.

Moreover, although the case of machining a cylindrical hole in the object 23 has been described in the present embodiment, the machined hole may be rectangular, for example. When the machined hole is rectangular, the diameter D of the machined hole is replaced with the side of the machined hole. When machining a tapered (conical) hole in the object 23, the laser beam diameter is changed based on the diameter of the machined hole at the surface position of the object 23 and the machining depth of the machined hole.

As described above, the processing apparatus according to the present embodiment can solve the above-described problems, improve the accuracy of laser processing, and realize drilling with a high aspect ratio.

[Embodiment according to article manufacturing method]
The processing apparatus according to the embodiments described above can be used in the article manufacturing method. The article manufacturing method can include a step of processing an object (object) using the processing apparatus, and a step of processing the object processed in the step. The processing can include, for example, at least one of processing different from the processing, transportation, inspection, sorting, assembly (assembly), and packaging. The article manufacturing method of the present embodiment is advantageous in at least one of article performance, quality, productivity, and production cost compared to conventional methods.

[Other embodiments]
Although the preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist. In the above-described embodiment, the control unit 60 and the computer device 35 are separated. Also good.

The present invention supplies a program that implements one or more functions of the above-described embodiments to a system or apparatus via a network or a storage medium, and one or more processors in the computer of the system or apparatus reads and executes the program. It can also be realized by processing to It can also be implemented by a circuit (for example, ASIC) that implements one or more functions.

17 translation optical system 20, 21 (galvano) mirror 23 object 24 lens 31 linear stage 35 computer device 50, 71 laser light source 60 controller 100 laser processing device

Claims (16)

An optical device for processing an object by irradiating the object with a laser beam,
a focal position adjusting mechanism for adjusting the focal position of the laser beam;
By changing the beam diameter of the laser beam incident on the focal position adjusting mechanism so as to decrease as the focal position moves from the laser incident surface side of the object in the traveling direction of the laser beam, the object is and a condensing angle changing mechanism for changing the condensing angle of the laser beam incident on an object. 2. The optical device according to claim 1, wherein the condensing angle changing mechanism changes the beam diameter based on the distance from the surface of the object on the laser light incident side to the focal position. 3. The optical device according to claim 1, further comprising an angle adjustment mechanism that adjusts an incident angle of the laser beam incident on the object. 4. The optical device according to claim 3, wherein the angle adjustment mechanism includes a galvanomirror optical system. The condensing angle changing mechanism adjusts the laser beam incident side based on the diameter or side of a hole machined in the object, the machined depth of the hole, and the incident angle at which the laser beam is incident on the object. changing the beam diameter of the laser beam incident on the focal position adjustment mechanism so that the beam diameter of the laser beam at the surface position of the object is smaller than the diameter or side of the hole machined in the object 5. The optical device according to any one of claims 1 to 4, wherein the optical device The condensing angle changing mechanism has D as the diameter or side of the hole, ΔZ as the distance from the surface of the object on the laser beam incidence side to the focal position, and the incident angle at which the laser beam is incident on the object. 6. The optical device according to claim 5, wherein the condensing angle φ is changed based on the following equation, where θ is set as θ.

7. The optical device according to any one of claims 1 to 6, wherein the condensing angle changing mechanism includes a beam expander. 8. The optical device according to any one of claims 1 to 7, wherein the condensing angle changing mechanism includes an aperture stop. 9. The apparatus according to any one of claims 1 to 8, further comprising an incident position adjusting mechanism that adjusts an incident position of the laser beam incident on the object in a direction perpendicular to the focal direction of the laser beam. optical device. 10. The optical device according to claim 9, wherein the incident position adjustment mechanism includes a galvanomirror optical system. 11. The optical device according to claim 9, wherein the incident position adjustment mechanism includes a stage that moves the object. 12. The optical apparatus according to any one of claims 1 to 11, wherein the focus position adjusting mechanism includes a stage that moves the object. 13. The optical device according to any one of claims 1 to 12, wherein the amount of laser light is changed according to the condensing angle of the laser light. A processing method for processing an object by irradiating the object with a laser beam,
A step of processing the object while adjusting the focal position of the laser beam,
Condensing the laser beam incident on the object by changing the beam diameter of the laser beam incident on the mechanism for adjusting the focal position so as to be smaller according to the depth of processing of the object. A processing method characterized by changing the angle. a step of processing an object using the optical device according to any one of claims 1 to 13;
and a step of treating the object processed in the step. 16. The article manufacturing method according to claim 15, wherein the processing is trepanning processing in which a hole is formed while scanning the laser beam.

Images