JP2023024287A - Containment container and charging method of substrate-like sensor - Google Patents

Abstract

To provide a containment container that houses a substrate-like sensor and a charging method of the substrate-like sensor.SOLUTION: A containment container that houses a substrate-like sensor includes a container body with an opening, a support unit that is located in the container body and supports the substrate-like sensor, a contact pin that is located in the container body and can contact a terminal of the substrate-like sensor, a drive mechanism that is located in the container body and drives the contact pin, a rotating shaft member that drives the drive mechanism from the outside of the container body, a jack that is located outside the container body and is electrically connected to the contact pin, and a lid body that can block the opening of the container body.SELECTED DRAWING: Figure 6

Description

The present disclosure relates to a charging method for a container and a substrate-like sensor.

A semiconductor processing system is disclosed that transports a substrate-like sensor using a transport device that transports a substrate such as a wafer.

Patent Documents 1 and 2 disclose a wireless substrate-like sensor that is taken out of its housing by a robot and moved to a reference target.

Japanese Patent Publication No. 2005-521926 Japanese Patent Application Laid-Open No. 2005-202933

By the way, it is demanded to charge the substrate-like sensor while the substrate-like sensor is accommodated in the container. Further, it is demanded that the storage container containing the substrate-like sensor can be transported by a transport device such as an OHT (Overhead Hoist Transport) or a PGV (Person Guided Vehicle).

In one aspect, the present disclosure provides a container containing a substrate-like sensor and a method of charging the substrate-like sensor.

In order to solve the above problems, according to one aspect, there is provided a container for containing a substrate-like sensor, comprising: a container body having an opening; and a support arranged in the container body for supporting the substrate-like sensor. a contact pin disposed within the container body and capable of contacting a terminal portion of the substrate-shaped sensor; a drive mechanism disposed within the container body for driving the contact pin; A container comprising: a rotating shaft member for driving a mechanism; a jack arranged outside the container body and electrically connected to the contact pin; and a lid capable of closing the opening of the container body. provided.

According to one aspect, it is possible to provide a storage container that stores a substrate-like sensor and a charging method for the substrate-like sensor.

The figure which shows an example of the whole structure of the semiconductor manufacturing apparatus which concerns on one Embodiment. An example of the partial cross section which looked at the container from the side. An example of the front view of the storage container which removed the cover. An example of the partial cross section which looked at the container from upper direction. An example of the rear view of a container. An example of the schematic diagram of the state which charges the board|substrate-shaped sensor accommodated in the accommodation container. An example of the schematic diagram of the state which took out the board|substrate-shaped sensor accommodated in the container. FIG. 2 is a configuration block diagram of a substrate-shaped sensor housed in a housing; Another example of the partial sectional view which looked at the container from the side.

Hereinafter, embodiments for carrying out the present disclosure will be described with reference to the drawings. In each drawing, the same components are denoted by the same reference numerals, and redundant description may be omitted.

[Overall Configuration of Semiconductor Manufacturing Equipment]
First, an example of a vertical cross-sectional configuration of a semiconductor manufacturing apparatus 100 according to an embodiment of the present invention will be described with reference to FIG. The semiconductor manufacturing apparatus 100 shown in FIG. 1 is an apparatus with a cluster structure (multi-chamber type), and the transfer chamber VTM and the substrate processing chamber PM are examples of vacuum apparatuses.

The semiconductor manufacturing apparatus 100 of FIG. 1 includes substrate processing chambers PM (Process Modules) 1 to PM6, a transfer chamber VTM (Vacuum Transfer Module), load lock chambers LLM (Load Lock Modules) 1 and LLM2, and a loader module LM (Loader Module). and load ports LP1 to LP3.

The semiconductor manufacturing apparatus 100 is controlled by a control unit 110 and performs predetermined processing on a semiconductor wafer W (hereinafter also referred to as "wafer W"), which is an example of a substrate.

The substrate processing chambers PM1-PM6 are arranged adjacent to the transfer chamber VTM. The substrate processing chambers PM1 to PM6 are also collectively referred to as substrate processing chambers PM. The substrate processing chambers PM1 to PM6 and the transfer chamber VTM communicate with each other by opening and closing a gate valve GV. The substrate processing chambers PM1 to PM6 are depressurized to a predetermined vacuum atmosphere, and wafers W are subjected to processing such as etching processing, film forming processing, cleaning processing, and ashing processing in the chambers.

A transfer device VA for transferring the wafer W is arranged inside the transfer chamber VTM. The transport device VA has two bendable and rotatable robot arms AC and AD. Picks C and D are attached to the tips of the robot arms AC and AD, respectively. The transfer apparatus VA can hold wafers W on picks C and D, respectively, and carries in and out wafers W between the substrate processing chambers PM1 to PM6 and the transfer chamber VTM according to the opening and closing of the gate valve GV. . Further, the transfer device VA carries in and out the wafer W between the transfer chamber VTM and the load lock chambers LLM1 and LLM2 in accordance with the opening and closing of the gate valve GV.

The load lock chambers LLM1 and LLM2 are provided between the transfer chamber VTM and the loader module LM. The load-lock chambers LLM1 and LLM2 switch between the atmospheric atmosphere and the vacuum atmosphere to transfer the wafer W from the atmosphere-side loader module LM to the vacuum-side transfer chamber VTM, or transfer the wafer W from the vacuum-side transfer chamber VTM to the atmosphere-side loader. For example, it is transported to the module LM.

The loader module LM is provided with load ports LP1 to LP3. A FOUP (Front Opening Unified Pod) containing, for example, 25 wafers W or an empty FOUP is placed on the load ports LP1 to LP3. The loader module LM loads the wafers W unloaded from the FOUPs in the load ports LP1 to LP3 into one of the load lock chambers LLM1 and LLM2, and loads the wafers W unloaded from the load lock chambers LLM1 and LLM2 into the FOUPs. be carried into

The control unit 110 has a CPU (Central Processing Unit) 111 , a ROM (Read Only Memory) 112 , a RAM (Random Access Memory) 113 and a HDD (Hard Disk Drive) 114 . The control unit 110 may have other storage areas such as an SSD (Solid State Drive) in addition to the HDD 114 . Storage areas such as the HDD 114 and the RAM 113 store recipes in which process procedures, process conditions, transfer conditions, and the like are set.

The CPU 111 controls the processing of the wafer W in the substrate processing chamber PM according to the recipe, and controls the transfer of the wafer W. The CPU 111 also controls process processing such as gas introduction and exhaust control, particle measurement, and the like according to the present embodiment. The HDD 114 and RAM 113 may store programs for executing substrate transfer processing, cleaning processing, exhaust control processing, and the like, for example. These programs may be stored in a storage medium and provided, or may be provided from an external device through a network.

The number of substrate processing chambers PM, load lock chambers LLM, and load ports LP is not limited to the number shown in this embodiment, and may be one or more.

With such a configuration, the semiconductor manufacturing apparatus 100 can attach FOUPs containing wafers W and empty FOUPs to the load ports LP1 to LP3. In addition, the semiconductor manufacturing apparatus 100 takes out the unprocessed wafers W housed in the FOUP from the FOUP and transports them to the substrate processing chambers PM1 to PM6 via the loader module LM, the load lock chambers LLM1 and LLM2, and the transfer chamber VTM. can be transported. Further, the semiconductor manufacturing apparatus 100 can perform desired processing on the wafer W in each of the substrate processing chambers PM1 to PM6. In addition, the semiconductor manufacturing apparatus 100 can take out the processed wafers W from the substrate processing chambers PM1 to PM6 and store them in the FOUP via the transfer chamber VTM, the load lock chambers LLM1 and LLM2, and the loader module LM. .

<Container>
Next, the container 1 according to this embodiment will be further described with reference to FIGS. 2 to 7. FIG. FIG. 2 is an example of a partial cross-sectional view of the container 1 viewed from the side. FIG. 3 is an example of a front view of the container 1 with the lid 20 removed. FIG. 4 is an example of a partial cross-sectional view of the container 1 viewed from above. FIG. 5 is an example of a rear view of the container 1. FIG. FIG. 6 is an example of a schematic diagram of a state in which the board-shaped sensor 200 accommodated in the container 1 is charged. FIG. 7 is an example of a schematic diagram showing a state in which the substrate-shaped sensor 200 accommodated in the container 1 is taken out. In the following description, the opening side of the container 1 (the side connected to the load ports LP1 to LP3) is the front side of the container 1, and the rear side of the container 1 when viewed from the opening side is the back side of the container 1. explain. In addition, in FIG. 6, the DC jack 50 and the switch 60 schematically show the circuit configuration, and the positions thereof are not limited. 3, 4, 5 and 7, the wirings 49a to 49c are omitted as appropriate. Moreover, FIG. 7 shows that the storage container 1 is attached to the load port LP (not shown in FIG. 7), the lid body 20 (not shown in FIG. 7) is removed by the load port LP, and the loader module LM conveying device An example of a state in which the board-shaped sensor 200 is taken out from the container 1 by an end effector 120 (not shown) is shown.

The storage container 1 includes a container body 10 that can store the substrate-like sensor 200 and a lid 20 that detachably opens and closes an open front surface of the container body 10 .

Here, the housing container 1 housing the board-shaped sensor 200 has a mounting shape similar to that of the FOUP. Accordingly, the container 1 is configured to be attachable to the load ports LP1 to LP3. Further, the load ports LP1 to LP3 can open and close the lid body 20 (see FIG. 2) of the storage container 1. FIG.

Moreover, as shown in FIGS. 6 and 7, the substrate-like sensor 200 has a disc having the same diameter as the wafer W, for example. Further, the substrate-shaped sensor 200 includes various sensors 220 (see FIG. 8 described later; for example, a temperature sensor, a capacitance sensor, a humidity sensor, an acceleration sensor, an image sensor, etc.) provided on a disc. are doing. As a result, the substrate sensor 200 can be transported in the same manner as the wafer W by the transport device VA in the transport chamber VTM and the transport device (not shown) in the loader module LM. Further, the mounting tables (not shown) of the substrate processing chambers PM1 to PM6 and the mounting tables (not shown) of the load lock chambers LLM1 and LLM2 can mount the substrate sensor 200 in the same manner as the wafer W.

With such a configuration, the semiconductor manufacturing apparatus 100 can attach the container 1 containing the substrate-shaped sensor 200 to the load ports LP1 to LP3. Further, the semiconductor manufacturing apparatus 100 takes out the substrate-shaped sensor 200 accommodated in the container 1 from the container 1, and transfers it to a desired measurement position ( For example, it can be transferred to each of the substrate processing chambers PM1 to PM6). Also, the semiconductor manufacturing apparatus 100 can store the substrate-shaped sensor 200 in the storage container 1 from a desired measurement position via the transfer chamber VTM, the load lock chambers LLM1 and LLM2, and the loader module LM. Further, the substrate-shaped sensor 200 detects various information (temperature, capacitance, humidity, acceleration, image, etc.) using the sensor 220 (see FIG. 8 described later) during transportation and at a desired detection position. can be done.

The container body 10 has a bottom wall, a top wall, a pair of side walls 10s and a rear side wall 10b, and is formed into a front open box with an open front. A front opening to which the lid 20 is attached is formed by the bottom wall, the top wall and the pair of side walls 10s. The rear side wall 10b is provided on the side opposite to the front opening to which the lid 20 is attached. The front opening shape of the container body 10 has the same shape as the front opening shape of the standardized FOUP for accommodating the wafers W therein. Engineering plastics such as PC (polycarbonate) and PBT (polybutylene terephthalate) can be used as the molding material for the container body 10 . Further, it is more preferable to use a low hygroscopic material for the container body 10 .

Inside the side wall 10s of the container body 10, a pair of left and right teeth 11, which are horizontally formed shelf-like projections, are provided. The substrate-like sensor 200 is placed on a pair of left and right teeth 11 . That is, the pair of left and right teeth 11 horizontally support the left and right peripheral edges of the bottom surface of the substrate-shaped sensor 200 .

Moreover, the teeth 11 may be provided in multiple stages in the height direction. The teeth 11 formed in multiple stages in the height direction are formed at the same pitch as the standardized FOUP that accommodates the wafers W. As shown in FIG. As a result, the transfer device (not shown) of the loader module LM can take out the substrate-shaped sensor 200 from the storage container 1 in the same operation as when taking out the wafer W from the FOUP. Also, a FOUP container body can be used as the container body 10 of the storage container 1 . In the example shown in FIG. 3, it is assumed that the substrate-shaped sensor 200 is placed on the pair of teeth 11 on the eighth stage from the bottom.

In addition, among the teeth 11 formed in multiple stages, the teeth 11 on the stage supporting the substrate-shaped sensor 200 (in the example shown in FIG. 3, the eighth stage from the bottom) have a pitch twice that of the other stages. stages of teeth 11 may be formed. In other words, of the teeth 11 formed in multiple stages at equal pitches, the teeth corresponding to the stage next to the stage supporting the board-shaped sensor 200 (the ninth stage from the bottom) are removed. Accordingly, even if the substrate-shaped sensor 200 is formed to be thicker than the wafer W, it can be accommodated in the container body 10 . Further, when the substrate-shaped sensor 200 is taken out from the storage container 1, even if the substrate-shaped sensor 200 is lifted by the end effector 120 of the transport device (not shown) of the loader module LM, the upper surface of the substrate-shaped sensor 200 will be on the next stage. Touching the lower surface of the teeth 11 can be prevented.

A rear retainer (not shown) may be provided inside the rear side wall of the container body 10 to substantially horizontally support the rear peripheral edge of the bottom surface of the substrate-like sensor 200 . A front retainer (not shown) may be provided on the rear surface of the lid 20 to substantially horizontally support the front peripheral edge of the lower surface of the substrate-shaped sensor 200 .

Further, on the outside of the side wall 10s of the container body 10, a handle (not shown) may be provided to be gripped by the operator when the container 1 is transported, like the FOUP. Further, rails (not shown) may be provided outside the side wall 10s of the container body 10 to serve as guides for transporting the storage container 1, similarly to the FOUP. Further, on the outer side of the bottom wall of the container body 10, grooves (not shown) are provided for positioning the container 1 when attaching the container 1 to the load ports LP1 to LP3, similarly to the FOUP. may be A flange (not shown) for lifting and transporting the container 1 may be provided on the upper surface of the container body 10 .

The lid 20 has a structure similar to that of a standardized FOUP lid (not shown) that accommodates the wafer W therein. As a result, the lid 20 can seal the front opening of the container body 10 with the substrate-shaped sensor 200 housed in the container body 10 . Also, the load ports LP1 to LP3 can open and close the lid 20 of the storage container 1 in the same manner as the lid of the FOUP (not shown).

Further, the container 1 has a support 30 erected from the inside of the bottom wall of the container body 10 . The support 30 has support blocks 31 , support columns 32 , support plates 33 , and support columns 34 . The support plate 33 is fixed to the bottom wall of the container body 10 via support columns 34 . The support block 31 is fixed to the support plate 33 via the support columns 32 . For example, three support columns 32 are provided, each having a height adjustment mechanism 32a. Thereby, the height and horizontality of the upper surface of the support block 31 can be adjusted.

With such a configuration, when the substrate-like sensor 200 is accommodated in the container 1 and the left and right peripheral edges of the lower surface of the substrate-like sensor 200 are supported by the teeth 11 , the upper surface of the support block 31 is positioned at the center of the lower surface of the substrate-like sensor 200 . support.

At the center of the upper surface of the substrate-like sensor 200, a terminal portion 210 is provided with which contact pins 41 to 43, which will be described later, come into contact. In other words, when the substrate-like sensor 200 is accommodated in the container 1 , the support block 31 supports the substrate-like sensor 200 below the terminal portions 210 . As a result, even if the terminal portion 210 is pressed by the contact pins 41 to 43, the board-shaped sensor 200 can be prevented from bending or the like.

Moreover, the support block 31 is formed in a disc shape. Here, the diameter of the disk-shaped support block 31 is formed smaller than the opening width of the end effector 120 having a bifurcated shape. As a result, even if the end effector 120 of the transport device (not shown) of the loader module LM is inserted under the substrate sensor 200 when the substrate sensor 200 is taken out from the container 1, the end effector 120 and the support block 31 do not move. are configured so as not to interfere.

Moreover, the support 30 arranged in the container 1 is preferably made of, for example, PTFE (polytetrafluoroethylene). Moreover, the support block 31 that contacts the back surface of the substrate-like sensor 200 is preferably made of, for example, PTFE (polytetrafluoroethylene). As a result, it is possible to suppress the generation of abrasion powder from the support block 31 due to the friction between the back surface of the substrate-shaped sensor 200 and the upper surface of the support block 31 . In addition, it is possible to suppress the abrasion powder from affecting the process of the wafer W in the substrate processing chambers PM1 to PM6.

The container 1 also includes a power supply mechanism 40 for supplying power to the terminal portion 210 of the substrate-shaped sensor 200 . The power feeding mechanism 40 has contact pins 41 to 43 for electrically contacting the terminal portion 210 of the board-shaped sensor 200 . The contact pins 41 to 43 are supported by the lower end of a shaft member 44 arranged inside the container body 10 .

A support plate 45 is provided inside the container body 10 . As shown in FIG. 4, the support plate 45 has a substantially C-shape obtained by cutting out the front side and the central portion from a disk having the same diameter as the wafer W. As shown in FIG.

By the way, the transfer device (not shown) of the loader module LM performs mapping processing for detecting the height positions of the wafers W accommodated in the FOUPs (the substrate-like sensors 200 accommodated in the container 1). In the mapping process, the tip of the end effector 120 provided with an optical sensor at the tip is inserted into the FOUP, and then the end effector 120 is moved in the height direction to detect the wafer W (substrate sensor 200). . By notching the front side of the support plate 45, the support plate 45 is prevented from interfering with the end effector 120 during the mapping process. In addition, since the central portion of the support plate 45 is notched, the shaft member 44 and the support plate 45 are prevented from interfering with each other when the shaft member 44 is moved up and down.

Moreover, the support plate 45 is accommodated in the stage (the 25th stage from the bottom in the example shown in FIG. 3) supporting the support plate 45 among the teeth 11 formed in multiple stages. Arc-shaped fixing members 45a are fixed to the left and right peripheral edges of the lower surface of the support plate 45 with bolts (not shown) or the like. Here, the teeth 11 are sandwiched between the support plate 45 and the fixing member 45a. The support plate 45 is thereby fixed to the container body 10 .

A bracket 45 b extending downward is provided on the back side of the support plate 45 . An elevating mechanism 46 for elevating the shaft member 44 is provided on the bracket 45b. The lifting mechanism 46 has a fixed portion 46a, a movable portion 46b, and a rotating portion 46c. A fixed portion 46a of the lifting mechanism 46 is fixed to a bracket 45b. A shaft member 44 is fixed to the movable portion 46b of the lifting mechanism 46 via a bracket 44d. The lifting mechanism 46 has, for example, a rack and pinion mechanism. By rotating the rotating portion 46c provided in the fixed portion 46a of the lifting mechanism 46, the pinion rotates, which is converted into linear motion of the rack fixed to the movable portion 46b, and the shaft member 44 fixed to the movable portion 46b. up and down.

A rotating shaft member 47 is connected to the rotating portion 46 c of the lifting mechanism 46 . One end of the rotating shaft member 47 is fixed to the rotating portion 46c of the lifting mechanism 46, and the other end of the rotating shaft member 47 penetrates the rear side wall 10b of the container body 10 and is provided outside the container body 10. FIG. Further, the other end of the rotating shaft member 47 is provided with a grip to be gripped by the operator. A seal (not shown) is provided between the rotating shaft member 47 and the rear side wall 10b of the container body 10 to seal the inside of the container body 10 while allowing the rotating shaft member 47 to rotate. .

As a result, by rotating the rotating shaft member 47 from outside the container body 10, the rotating portion 46c of the elevating mechanism 46 can be rotated, and the elevating mechanism 46 can raise and lower the contact pins 41-43. In other words, the lifting mechanism 46 can move the contact pins 41 to 43 in contact with the terminal portion 210 of the substrate-shaped sensor 200 (see FIG. 6) and the contact pins 41 to 43 to separate from the terminal portion 210 of the substrate-shaped sensor 200. It is possible to switch between the state (see FIG. 7) and the

A cover plate 48 is provided at the lower end of the bracket 45b. A cover plate 48 is arranged between the lifting mechanism 46 and the substrate-like sensor 200 . As a result, even if an object falls from the elevating mechanism 46 , the object is prevented from falling onto the substrate-shaped sensor 200 . Further, the cover plate 48 is provided with a through hole having substantially the same diameter as the shaft member 44 (slightly larger than the shaft member 44). The shaft member 44 penetrates the through hole of the cover plate 48 and is configured to be movable in the penetrating direction.

In addition, the shaft member 44, the bracket 44d, the support plate 45, the fixing member 45a, the bracket 45b, the lifting mechanism 46, the rotation shaft member 47, and the cover plate 48 arranged in the container 1 are made of a resin composition. is preferred. For example, the shaft member 44, bracket 44d, support plate 45, fixing member 45a, and bracket 45b are preferably made of POM (polyacetal). Also, the lifting mechanism 46 is preferably made of acrylic, polycarbonate, polyacetal, or the like. The rotary shaft member 47 is preferably made of nylon 6. As shown in FIG. The cover plate 48 is preferably made of PVC (polyvinyl chloride). As a result, materials that may affect the process of wafers W can be eliminated from inside container 1 .

As shown in FIG. 6, wirings 49a to 49c are provided inside the shaft member 44. As shown in FIG. The container 1 also has a DC jack 50 and a switch 60 . Wirings 49a-49c extend from the contact pins 41-43 inside the container body 10, pass through the rear side wall 10b of the container body 10, and are connected to a DC jack 50 and a switch 60 provided outside the container body 10. FIG. A sealing member 49 is provided on the rear side wall 10b of the container body 10 for sealing the inside of the container body 10 while the wirings 49a to 49c are inserted. The wiring 49 a is, for example, a power supply line, and has one end connected to the contact pin 41 and the other end connected to one terminal of the DC jack 50 . The wiring 49 b is, for example, a ground (GND) line, one end of which is connected to the contact pin 42 , the other end of which is branched, and is connected to the other terminal of the DC jack 50 and the other terminal of the switch 60 . The wiring 49 c is, for example, a signal line, and has one end connected to the contact pin 43 and the other end connected to one terminal of the switch 60 .

As shown in FIGS. 4 and 5, the DC jack 50 is outside the container body 10 and fixed to the rear side wall 10b. The DC jack 50 has an insertion portion (not shown) into which a DC plug of the AC adapter 70 (DC power supply) can be attached and detached, and two terminals. Also, the AC adapter 70 has an AC plug and a DC plug. The AC plug of AC adapter 70 is connected to an AC power supply (for example, commercial power supply). A DC plug of the AC adapter 70 is connected to the insertion portion of the DC jack 50 . A DC voltage is applied between the contact pins 41 and 42 by connecting the AC plug of the AC adapter 70 to an AC power supply (eg, commercial power supply) and connecting the DC plug to the insertion portion of the DC jack 50 . be done.

As shown in FIGS. 4 and 5, the switch 60 is outside the container body 10 and fixed to the rear side wall 10b. The switch 60 is, for example, a normally open momentary switch, and can be energized only while the switch 60 is pressed, for example. That is, when the switch 60 is turned on, the contact pin 43 and the contact pin 42 can be energized, and when the switch 60 is turned off, the energization between the contact pin 43 and the contact pin 42 is interrupted.

The grip of the rotating shaft member 47, the DC jack 50, and the switch 60 are provided outside the rear side wall 10b of the container body 10. As shown in FIG. Thereby, for example, a flange (not shown) can be provided on the upper surface of the ceiling wall of the container body 10 . Moreover, a handle (not shown) and a rail (not shown) can be provided on the outside of the side wall 10s of the container body 10 . Further, a groove (not shown) for positioning can be provided on the outside of the bottom wall of the container body 10 . Therefore, the container 1 containing the substrate-shaped sensor 200 can be transported by a transport device (not shown) such as an OHT (Overhead Hoist Transport) or a PGV (Person Guided Vehicle), like the FOUP containing the wafer W. can be done.

Here, the transportation device such as OHT holds the storage container 1 by engaging with the flange of the storage container 1 and transports the storage container 1 . Also, the container 1 held by the OHT rotates around the flange during transportation. For this reason, the container 1 transported by a transport device such as an OHT or PGV is placed within a circular range 300 (indicated by a two-dot chain line) in plan view as shown in FIG. It is required to store parts. The grip of the rotating shaft member 47, the DC jack 50, and the switch 60 are provided outside the rear side wall 10b of the container body 10 and within the range 300. As shown in FIG. As a result, even when the container 1 transported by the OHT is rotated around the flange, the grip of the rotating shaft member 47 provided outside the container body 10, the DC jack 50, and the switch 60 do not come into contact with others. can be prevented.

The rotating shaft member 47 penetrates the side wall 10s of the container body 10, and a sealing member 49 for sealing the inside of the container body 10 is provided on the side wall 10s of the container body 10 while the wirings 49a to 49c are inserted. may Also, the grip of the rotating shaft member 47, the DC jack 50, and the switch 60 may be provided outside the side wall 10s of the container body 10. FIG. That is, the grip of the rotating shaft member 47, the DC jack 50, and the switch 60 may be provided outside the side wall 10s of the container body 10 and within the range 300. FIG. As a result, even when the container 1 transported by the OHT is rotated around the flange, the grip of the rotating shaft member 47 provided outside the container body 10, the DC jack 50, and the switch 60 do not come into contact with others. can be prevented. Further, the grip of the rotating shaft member 47, the DC jack 50, and the switch 60 may be provided outside the side wall 10s of one container body 10, and may be provided outside one side wall 10s and the other side wall 10s. It may be separately provided on the outside.

In addition, as a standard established when transporting a storage container (FOUP) with a transport device such as an OHT or PGV, the storage container (FOUP) is designed within an area of φ480 mm (see the two-dot chain line in FIG. 4). . The container 1 according to this embodiment is designed so that the grip of the rotating shaft member 47, the DC jack 50, and the switch 60 are accommodated within this area (see the two-dot chain line in FIG. 4).

The DC jack 50 is oriented such that the DC plug can be inserted from above. Also, the switch 60 is provided in a direction that allows it to be operated from above. As a result, the operator can insert the DC plug into the DC jack 50 and operate the switch 60 from above, improving workability.

<Substrate-like sensor 200>
Next, the substrate-like sensor 200 housed in the housing container 1 will be described with reference to FIG. FIG. 8 is an example of a configuration block diagram of a substrate-like sensor 200 housed in the housing container 1 according to this embodiment.

The board-like sensor 200 has a terminal section 210 , a sensor 220 , a sensor control section 230 , a storage section 240 , a communication section 250 , a power supply control section 260 and a battery 270 .

The terminal portion 210 is provided at the center of the upper surface of the board-shaped sensor 200 . The terminal section 210 has a terminal array corresponding to the arrangement of the contact pins 41-43.

The sensor 220 is a sensor for inspecting the semiconductor manufacturing apparatus 100, and may be, for example, a temperature sensor, a capacitance sensor, a humidity sensor, an acceleration sensor, an image sensor, or the like.

The sensor control unit 230 controls the sensor 220 and acquires detection values. Further, the sensor control unit 230 controls the storage unit 240 to store the acquired detection value of the sensor 220 in the storage unit 240 . Further, the sensor control unit 230 controls the communication unit 250 to transmit the detection value of the sensor 220 and/or the detection value of the sensor 220 stored in the storage unit 240 to the outside. Also, the sensor control unit 230 can be communicably connected to an external terminal (not shown) via the communication unit 250 . Accordingly, the operation of the sensor control section 230 can be controlled by transmitting a control signal from the external terminal to the sensor control section 230 .

The power control unit 260 has a function of determining whether or not DC power is being supplied. In a state where DC power is supplied, the power control unit 260 drives the sensor 220, the sensor control unit 230, the storage unit 240, and the communication unit 250 by DC power supply. Also, the power supply control unit 260 charges the battery 270 with DC power supply. On the other hand, in a state in which DC power is not supplied, power supply control unit 260 drives sensor 220 , sensor control unit 230 , storage unit 240 , and communication unit 250 with power supply from battery 270 .

Next, a usage example of the storage container 1 according to this embodiment will be described. Here, a case of operating the charging function of the board-shaped sensor 200 by the container 1 will be described.

As shown in FIG. 6, the substrate-like sensor 200 is accommodated in the container 1 . At this time, the front opening of the container body 10 is closed by the lid 20 . Specifically, the right and left edges of the bottom surface of the substrate-like sensor 200 are supported by the teeth 11 on the eighth stage, and the center of the bottom surface of the substrate-like sensor 200 is supported by the support 30 (support block 31).

An operator inserts the DC plug of the AC adapter 70 into the DC jack 50 and connects the AC plug to an AC power supply (commercial power supply).

Next, the operator operates the lifting mechanism 46 to lower the shaft member 44 and bring the contact pins 41 to 43 into contact with the terminal portions 210 of the board-shaped sensor 200 . At this time, the contact pins 41 to 43 push the center of the upper surface of the board-shaped sensor 200 . On the other hand, the center of the lower surface of the substrate-like sensor 200 is supported by the support 30 (support block 31). Therefore, it is possible to prevent the board-shaped sensor 200 from being bent or damaged. Also, the contact pressure between the contact pins 41 to 43 and the terminal portion 210 can be increased.

As a result, a charging voltage is applied to the terminal portion 210 of the board-shaped sensor 200 from the AC adapter 70 via the DC jack 50, the wirings 49a and 49b, and the contact pins 41 and 42. FIG. The power control unit 260 starts charging the battery 270 when the charging voltage is applied to the terminal unit 210 .

The board-shaped sensor 200 may be provided with an LED (not shown) that displays the state of charge of the battery 270 . For example, the LEDs indicate the state of charge of the battery 270 with lighting patterns and colors. Thereby, it is possible to grasp from the outside of the housing container 1 whether or not the charging function is operating normally. Also, the state of charge of the battery 270 can be grasped from the outside of the container 1 .

As described above, according to the container 1 according to the present embodiment, the battery 270 of the substrate-like sensor 200 can be charged without removing the substrate-like sensor 200 from the container 1 . In addition, by removing the substrate-like sensor 200 from the container 1, it is possible to prevent the substrate-like sensor 200 from absorbing moisture or the like. Moreover, the charging work by the operator can be simplified.

A sensor 220 and the like are placed on the disk of the substrate-like sensor 200 . Therefore, the plate thickness of the disk of the substrate-like sensor 200 is formed thinner than the plate thickness of the wafer W in some cases. According to the storage container 1 according to this embodiment, when the contact pins 41 to 43 are brought into contact with the terminal portion 210, the lower surface of the substrate-like sensor 200 is supported by the support 30 (support block 31). As a result, bending and damage of the substrate-like sensor 200 can be prevented.

Further, according to the storage container 1 according to the present embodiment, the contact pins 41 to 43 are brought into contact with the terminal portions 210 of the substrate-shaped sensor 200 to supply power. By the way, when wireless power is supplied to the board-shaped sensor 200 housed in the container, it is necessary to arrange an antenna (coil) for power transmission, etc. inside the container. Particles generated from materials such as antennas for power transmission may affect the process of wafers W in the substrate processing chambers PM1 to PM6. On the other hand, according to the storage container 1 according to the present embodiment, the materials of the members (the support 30, the contact pins 41 to 43, and the shaft member 44) arranged in the storage container 1 are the same as those in the substrate processing chambers PM1 to PM6. It is possible to select a material that has less influence on the process of the wafer W in .

Next, another usage example of the storage container 1 according to this embodiment will be described. Here, a case will be described in which the board-shaped sensor 200 housed in the container 1 is operated by an external power supply.

As shown in FIG. 6, the substrate-like sensor 200 is accommodated in the container 1 . At this time, the front opening of the container body 10 is closed by the lid 20 . Specifically, the right and left edges of the bottom surface of the substrate-like sensor 200 are supported by the teeth 11 on the eighth stage, and the center of the bottom surface of the substrate-like sensor 200 is supported by the support 30 (support block 31).

An operator inserts the DC plug of the AC adapter 70 into the DC jack 50 and connects the AC plug to an AC power supply (commercial power supply).

Next, the operator operates the lifting mechanism 46 to lower the shaft member 44 and bring the contact pins 41 to 43 into contact with the terminal portions 210 of the board-shaped sensor 200 . As a result, voltage is applied from the AC adapter 70 to the terminal portion 210 of the substrate-like sensor 200 via the DC jack 50, the wirings 49a and 49b, and the contact pins 41 and 42. FIG.

A worker operates the switch 60 . This activates the power control unit 260 . At this time, the sensor 220 , the sensor control unit 230 , the storage unit 240 and the communication unit 250 are driven by the external power applied to the terminal unit 210 .

As described above, according to the container 1 according to the present embodiment, the sensor control unit 230 of the substrate-like sensor 200 can be activated without removing the substrate-like sensor 200 from the container 1 . Further, by driving the sensor control unit 230 and the like with an external power source, consumption of the charge amount of the battery 270 can be suppressed.

By activating the sensor control unit 230 , for example, information accumulated in the storage unit 240 can be transmitted to an external terminal (not shown) via the communication unit 250 . Thereby, the information in the semiconductor manufacturing apparatus 100 detected by the board-shaped sensor 200 can be acquired by the external terminal.

Next, still another usage example of the storage container 1 according to this embodiment will be described. Here, preparations for inspecting the semiconductor manufacturing apparatus 100 using the substrate-shaped sensor 200 housed in the housing container 1 will be described.

As shown in FIG. 6, the substrate-like sensor 200 is accommodated in the container 1 . At this time, the front opening of the container body 10 is closed by the lid 20 . Specifically, the right and left edges of the bottom surface of the substrate-like sensor 200 are supported by the teeth 11 on the eighth stage, and the center of the bottom surface of the substrate-like sensor 200 is supported by the support 30 (support block 31).

Next, the operator operates the lifting mechanism 46 to lower the shaft member 44 and bring the contact pins 41 to 43 into contact with the terminal portions 210 of the board-shaped sensor 200 .

Next, the operator operates switch 60 . This activates the power control unit 260 . Accordingly, the sensor 220 , the sensor control section 230 , the storage section 240 and the communication section 250 are driven by power supplied from the battery 270 . Thereby, the sensor control unit 230 is communicably connected to an external terminal (not shown) via the communication unit 250 . It should be noted that the sensor control section 230 starts recording the detected value by the sensor 220 when receiving a recording start instruction signal via the communication section 250 . Further, when the sensor control unit 230 receives a recording end instruction signal via the communication unit 250, the recording of the detection value by the sensor 220 is ended.

Next, the operator operates the elevating mechanism 46 to raise the shaft member 44 and separate the contact pins 41 to 43 from the terminal portion 210 of the board-shaped sensor 200 .

Next, the operator attaches the container 1 containing the substrate-shaped sensor 200 to the load port LP1.

The control section 110 controls each section of the semiconductor manufacturing apparatus 100 . First, the control unit 110 controls the load port LP1 to open the lid 20 of the container 1, and controls the conveying device (not shown) of the loader module LM to insert the end effector 120 into the container body 10. to take out the substrate-shaped sensor 200 (see FIG. 7). After that, the substrate-like sensor 200 is transported to a set position by the transport device VA of the transport chamber VTM and the transport device (not shown) of the loader module LM. Then, the substrate-shaped sensor 200 is accommodated in the container body 10, and the lid 20 of the container 1 is closed.

As described above, according to the container 1 according to the present embodiment, the sensor control unit 230 of the substrate-like sensor 200 can be activated without removing the substrate-like sensor 200 from the container 1 . Further, since the sensor control unit 230 of the substrate-like sensor 200 can be activated immediately before inspecting the semiconductor manufacturing apparatus 100 using the substrate-like sensor 200, consumption of the charge amount of the battery 270 can be suppressed.

Further, the storage container 1 may be configured so as to be able to supply _N2 gas, similarly to the FOUP. As a result, the substrate-like sensor 200 can be accommodated and stored in the container 1 while the container 1 is filled with N ₂ gas. As a result, for example, the various sensors 220 of the substrate-like sensor 200 can be prevented from being degraded by oxygen and moisture in the atmosphere. Moreover, the storage container 1 may be configured to be able to supply dry air. As a result, the substrate-like sensor 200 can be accommodated and stored in the container 1 while the container 1 is filled with dry air. As a result, for example, it is possible to prevent the various sensors 220 of the substrate-shaped sensor 200 from deteriorating due to moisture.

<Other processing containers>
In addition, the structure of the container 1 is not limited to the structure of the container 1 shown in FIGS. 2-7. Another configuration example of the container 1 will be described with reference to FIG. 9 . FIG. 9 is another example of a partial cross-sectional view of the container 1A viewed from the side.

In the container 1 shown in FIGS. 2 to 7, the elevating mechanism 46 is arranged below the support plate 45 , in other words, the elevating mechanism 46 is suspended and supported by the support plate 45 . On the other hand, in the container 1A shown in FIG. 9, the elevating mechanism 46 is arranged above the support plate 45. In other words, the elevating mechanism 46 is placed on and supported by the support plate 45. As shown in FIG.

In the storage container 1A, the support plate 45 is provided with a through hole having substantially the same diameter as the shaft member 44 . The shaft member 44 penetrates through the through hole of the support plate 45 and is configured to be movable in the penetrating direction. Further, in the storage container 1</b>A, the support plate 45 can also function as a cover plate 48 that prevents falling objects from the lifting mechanism 46 from falling onto the substrate-shaped sensor 200 .

Other configurations are the same as those of the storage container 1 shown in FIGS. 2 to 7, and redundant description will be omitted.

Moreover, a hygroscopic agent storage part (not shown) that stores a hygroscopic agent may be provided inside the storage container 1, 1A. This can prevent water from entering the semiconductor manufacturing apparatus 100 through the substrate-shaped sensor 200 .

The embodiments disclosed above include, for example, the following aspects.
(Appendix 1)
A container for containing a substrate-shaped sensor,
a container body having an opening;
a support portion that is arranged in the container body and supports the substrate-like sensor;
a contact pin arranged in the container body and capable of coming into contact with a terminal portion of the substrate-shaped sensor;
a drive mechanism arranged in the container body for driving the contact pin;
a rotating shaft member that drives the drive mechanism from outside the container body;
a jack disposed outside the container body and electrically connected to the contact pin;
a lid capable of closing the opening with the container body;
A containment vessel comprising a
(Appendix 2)
further comprising a drive mechanism support portion disposed within the container body and supporting the drive mechanism;
The container according to Appendix 1.
(Appendix 3)
The drive mechanism support section suspends and supports the drive mechanism,
The container according to appendix 2.
(Appendix 4)
The drive mechanism support section supports the drive mechanism by placing it thereon.
The container according to appendix 2.
(Appendix 5)
Further comprising a switch arranged outside the container body and electrically connected to the contact pin,
The container according to any one of appendices 1 to 4.
(Appendix 6)
The terminal portion of the substrate-like sensor is provided on the upper surface of the substrate-like sensor,
The support portion includes a support member that supports the back surface corresponding to the position where the terminal portion of the substrate-shaped sensor is provided,
The container according to any one of appendices 1 to 5.
(Appendix 7)
The container is
configured to be attachable to a load port configured to be attachable to a carrier containing a substrate;
The container according to any one of appendices 1 to 5.
(Appendix 8)
The rotating shaft member penetrates a rear side wall of the container body provided on the opposite side of the lid,
wherein the jack is provided on the outside of the rear side wall;
The container according to any one of appendices 1 to 7.
(Appendix 9)
The rotating shaft member penetrates the side wall of the container body,
The jack is provided outside the side wall,
The container according to any one of appendices 1 to 7.
(Appendix 10)
The rotating shaft member penetrates a rear side wall of the container body provided on the opposite side of the lid,
said jack and said switch are provided outside said rear side wall;
The container according to appendix 5.
(Appendix 11)
The rotating shaft member penetrates the side wall of the container body,
wherein the jack and the switch are provided outside the side sidewalls;
The container according to appendix 5.
(Appendix 12)
a container body having an opening; a support portion arranged in the container body for supporting a substrate-shaped sensor; a contact pin arranged in the container body and capable of contacting a terminal portion of the substrate-shaped sensor; a drive mechanism arranged inside the container to drive the contact pin; a rotating shaft member for driving the drive mechanism from outside the container body; and a jack arranged outside the container body and electrically connected to the contact pin. and a lid capable of closing the opening with the container body, a charging method for a substrate-shaped sensor housed in a housing container,
bringing the contact pin into contact with the terminal portion of the substrate-shaped sensor by the drive mechanism;
connecting a DC power supply to the jack;
A method of charging a substrate-like sensor, comprising:

It should be noted that the present invention is not limited to the configurations shown here, such as combinations with other elements, etc., in the configurations described in the above embodiments. These points can be changed without departing from the gist of the present invention, and can be determined appropriately according to the application form.

1 Container 10 Container Main Body 10b Rear Side Wall 10s Side Side Wall 11 Teeth (support portion)
20 lid 30 support (support)
31 support block 40 power supply mechanism 41 to 43 contact pin 44 shaft member (driving mechanism)
45 support plate (drive mechanism support)
46 lifting mechanism (driving mechanism)
47 Rotating shaft member 48 Cover plate 49 Seal members 49a to 49c Wiring 50 DC jack (jack)
60 switch 70 AC adapter (DC power supply)
200 board-like sensor 210 terminal unit 220 sensor 230 sensor control unit 240 storage unit 250 communication unit 260 power supply control unit 270 battery 300 Range

Claims (12)

A container for containing a substrate-shaped sensor,
a container body having an opening;
a support portion that is arranged in the container body and supports the substrate-like sensor;
a contact pin arranged in the container body and capable of coming into contact with a terminal portion of the substrate-shaped sensor;
a drive mechanism arranged in the container body for driving the contact pin;
a rotating shaft member that drives the drive mechanism from outside the container body;
a jack disposed outside the container body and electrically connected to the contact pin;
a lid capable of closing the opening with the container body;
A containment vessel comprising a further comprising a drive mechanism support portion disposed within the container body and supporting the drive mechanism;
The container according to claim 1. The drive mechanism support section suspends and supports the drive mechanism,
The container according to claim 2. The drive mechanism support section supports the drive mechanism by placing it thereon.
The container according to claim 2. Further comprising a switch arranged outside the container body and electrically connected to the contact pin,
The storage container according to claim 3 or 4. The terminal portion of the substrate-like sensor is provided on the upper surface of the substrate-like sensor,
The support portion includes a support member that supports the back surface corresponding to the position where the terminal portion of the substrate-shaped sensor is provided,
The container according to claim 5. The container is
configured to be attachable to a load port configured to be attachable to a carrier containing a substrate;
The container according to claim 6. The rotating shaft member penetrates a rear side wall of the container body provided on the opposite side of the lid,
wherein the jack is provided on the outside of the rear side wall;
The container according to claim 4. The rotating shaft member penetrates the side wall of the container body,
The jack is provided outside the side wall,
The container according to claim 4. The rotating shaft member penetrates a rear side wall of the container body provided on the opposite side of the lid,
said jack and said switch are provided outside said rear side wall;
The container according to claim 5. The rotating shaft member penetrates the side wall of the container body,
wherein the jack and the switch are provided outside the side sidewalls;
The container according to claim 5. a container body having an opening; a support portion arranged in the container body for supporting a substrate-shaped sensor; a contact pin arranged in the container body and capable of contacting a terminal portion of the substrate-shaped sensor; a drive mechanism arranged inside the container to drive the contact pin; a rotating shaft member for driving the drive mechanism from outside the container body; and a jack arranged outside the container body and electrically connected to the contact pin. and a lid capable of closing the opening with the container body, a charging method for a substrate-shaped sensor housed in a housing container,
bringing the contact pin into contact with the terminal portion of the substrate-shaped sensor by the drive mechanism;
connecting a DC power supply to the jack;
A method of charging a substrate-like sensor, comprising:

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