JP2023009331A - レーザ走査装置及びレーザ走査方法 - Google Patents
レーザ走査装置及びレーザ走査方法 Download PDFInfo
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- JP2023009331A JP2023009331A JP2021112487A JP2021112487A JP2023009331A JP 2023009331 A JP2023009331 A JP 2023009331A JP 2021112487 A JP2021112487 A JP 2021112487A JP 2021112487 A JP2021112487 A JP 2021112487A JP 2023009331 A JP2023009331 A JP 2023009331A
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- laser
- light guide
- polygon mirror
- light
- cylindrical lens
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- 238000000034 method Methods 0.000 title claims description 17
- 230000003287 optical effect Effects 0.000 description 29
- 230000032258 transport Effects 0.000 description 6
- 230000001678 irradiating effect Effects 0.000 description 4
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
- 230000010356 wave oscillation Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/12—Scanning systems using multifaceted mirrors
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Laser Beam Processing (AREA)
- Mechanical Optical Scanning Systems (AREA)
Abstract
Description
12 レーザ発生器
13 レーザ走査装置
20 第1導光部
21 第1シリンドリカルレンズ(第1集光部)
30 ポリゴンミラー
40 第2導光部
43 第2シリンドリカルレンズ(第2集光部)
Claims (4)
- レーザ発生器が発生させたレーザを反射して導く第1導光部と、
多角形状に配置された反射面を有しており、前記第1導光部により導かれたレーザを、回転しながら前記反射面で反射するポリゴンミラーと、
前記ポリゴンミラーの前記反射面で反射されたレーザを更に反射してレーザがワークに照射されるようにレーザを導く第2導光部と、
を備え、
前記第1導光部は、レーザの第1方向のビーム径が小さくなるように当該レーザを集光する第1集光部を備え、
前記第2導光部は、レーザの前記第1方向に直交する第2方向のビーム径が小さくなるように当該レーザを集光する第2集光部を備えることを特徴とするレーザ走査装置。 - 請求項1に記載のレーザ走査装置であって、
前記第1集光部の焦点距離をf1とし、前記第1集光部に入射されるレーザの前記第1方向の径をd1とし、
前記第2集光部の焦点距離をf2とし、前記第2集光部に入射されるレーザの前記第2方向の径をd2としたときに、
d2/d1=f2/f1が実質的に成立するように、レーザが照射されることを特徴とするレーザ走査装置。 - 請求項1又は2に記載のレーザ走査装置であって、
前記第1集光部が第1シリンドリカルレンズであり、前記第1シリンドリカルレンズでレーザの前記第1方向のビーム径が小さくなるように当該レーザを集光し、
前記第2集光部が第2シリンドリカルレンズであり、前記第2シリンドリカルレンズでレーザの第2方向のビーム径が小さくなるように当該レーザを集光することを特徴とするレーザ走査装置。 - レーザ発生器が発生させたレーザを第1導光部を用いて反射して導く第1導光工程と、
多角形状に配置された反射面を有するポリゴンミラーを用いて、前記第1導光部により導かれたレーザを、ポリゴンミラーを回転させながら前記反射面で反射するポリゴンミラー反射工程と、
前記ポリゴンミラーの前記反射面で反射されたレーザを第2導光部で更に反射してレーザがワークに照射されるようにレーザを導く第2導光工程と、
を含み、
前記第1導光工程は、第1集光部を用いてレーザの第1方向のビーム径が小さくなるように当該レーザを集光する処理を含み、
前記第2導光工程は、第2集光部を用いてレーザの前記第1方向に直交する第2方向のビーム径が小さくなるように当該レーザを集光する処理を含むことを特徴とするレーザ走査方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021112487A JP6998488B1 (ja) | 2021-07-07 | 2021-07-07 | レーザ走査装置及びレーザ走査方法 |
PCT/JP2022/026558 WO2023282223A1 (ja) | 2021-07-07 | 2022-07-04 | レーザ走査装置及びレーザ走査方法 |
KR1020237045109A KR20240013241A (ko) | 2021-07-07 | 2022-07-04 | 레이저 주사 장치 및 레이저 주사 방법 |
CN202280048220.4A CN117616322A (zh) | 2021-07-07 | 2022-07-04 | 激光扫描装置以及激光扫描方法 |
TW111125261A TWI834211B (zh) | 2021-07-07 | 2022-07-06 | 雷射掃描裝置及雷射掃描方法 |
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JP2021112487A JP6998488B1 (ja) | 2021-07-07 | 2021-07-07 | レーザ走査装置及びレーザ走査方法 |
Publications (2)
Publication Number | Publication Date |
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JP6998488B1 JP6998488B1 (ja) | 2022-01-18 |
JP2023009331A true JP2023009331A (ja) | 2023-01-20 |
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JP2021112487A Active JP6998488B1 (ja) | 2021-07-07 | 2021-07-07 | レーザ走査装置及びレーザ走査方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6998488B1 (ja) |
KR (1) | KR20240013241A (ja) |
CN (1) | CN117616322A (ja) |
TW (1) | TWI834211B (ja) |
WO (1) | WO2023282223A1 (ja) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS541629U (ja) | 1977-06-07 | 1979-01-08 | ||
JPH0618803A (ja) * | 1992-05-08 | 1994-01-28 | Fuji Xerox Co Ltd | 光走査装置 |
JP5515723B2 (ja) * | 2009-02-02 | 2014-06-11 | 株式会社リコー | 光走査装置、画像形成装置および光通信システム |
TWI426297B (zh) * | 2009-06-25 | 2014-02-11 | E Pin Optical Industry Co Ltd | 雷射掃描裝置之短聚光距二片式fΘ鏡片(二) |
TWI453461B (zh) * | 2011-03-08 | 2014-09-21 | Kawasaki Heavy Ind Ltd | Optical scanning devices and laser processing devices |
KR101884397B1 (ko) * | 2012-10-24 | 2018-08-02 | 에이치피프린팅코리아 주식회사 | 광 주사 장치 및 이를 채용한 전자 사진 방식의 화상 형성 장치 |
CN104392199B (zh) * | 2014-12-10 | 2017-10-13 | 福建新大陆电脑股份有限公司 | 双重激光扫描设备 |
KR102389080B1 (ko) * | 2016-05-06 | 2022-04-22 | 가부시키가이샤 니콘 | 빔 주사 장치 및 묘화 장치 |
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2021
- 2021-07-07 JP JP2021112487A patent/JP6998488B1/ja active Active
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2022
- 2022-07-04 KR KR1020237045109A patent/KR20240013241A/ko unknown
- 2022-07-04 CN CN202280048220.4A patent/CN117616322A/zh active Pending
- 2022-07-04 WO PCT/JP2022/026558 patent/WO2023282223A1/ja active Application Filing
- 2022-07-06 TW TW111125261A patent/TWI834211B/zh active
Also Published As
Publication number | Publication date |
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TWI834211B (zh) | 2024-03-01 |
JP6998488B1 (ja) | 2022-01-18 |
TW202309574A (zh) | 2023-03-01 |
CN117616322A (zh) | 2024-02-27 |
KR20240013241A (ko) | 2024-01-30 |
WO2023282223A1 (ja) | 2023-01-12 |
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