JP2023005095A - Substrate processing method - Google Patents

Abstract

To shorten the period required for substrate processing.SOLUTION: In a substrate processing method, a flow recipe including a first process recipe for setting the content of a first process to be executed on a substrate, a second process recipe for setting the content of a second process to be executed on the substrate after the first process, and a pre-recipe that sets the content of the preliminary operation for the second process recipe is preset. The first process includes discharging a first chemical solution onto the substrate, the second process includes discharging the first chemical solution onto the substrate, and the preliminary operation includes discharging the first chemical solution. The substrate processing method includes the steps of executing a first process, determining whether a period from the end of the first process to the start of the second process is shorter than a first threshold, and reducing the time of preliminary operation and executing the second process when the period from the end of the first process to the start of the second process is shorter than the first threshold.SELECTED DRAWING: Figure 16

Description

The present disclosure relates to methods of processing substrates.

2. Description of the Related Art In a process of manufacturing an electronic device (eg, a semiconductor device, a liquid crystal display device) using a substrate, the substrate is subjected to various treatments (hereinafter referred to as “substrate treatment”). Substrate processing includes, for example, so-called single wafer processing in which substrates are processed one by one. Single-wafer processing includes, for example, cleaning processing and etching processing.

A chemical solution used for substrate processing (hereinafter also referred to as “processing liquid”) is supplied to the substrate from, for example, a nozzle. In order to increase the efficiency of the treatment, for example, the nozzle is supplied with a treatment liquid that has been adjusted (eg, heated) to a temperature suitable for the treatment through a pipe. The content of substrate processing is defined as a process recipe.

After the substrate processing is finished, the processing liquid stays in the nozzle or the pipe, and the temperature of the staying processing liquid may be lower than the temperature suitable for the processing. A change in the specific gravity of the treatment liquid due to precipitation of components contained in the treatment liquid is also assumed. Such a phenomenon tends to cause deterioration of the processing liquid. If a deteriorated processing liquid is used, it is difficult to perform appropriate substrate processing.

Japanese Unexamined Patent Application Publication No. 2002-100000 proposes, as a pre-operation to be performed before substrate processing is performed, to perform a pre-dispensing operation for discarding the stagnant processing liquid, for example. The content of the pre-operation is defined as a pre-recipe. Japanese Patent Application Laid-Open No. 2002-200001 proposes a technique in which a substrate processing and a pre-dispense operation are performed for each substrate.

JP 2009-231733 A JP 2019-160910 A

If the period during which the processing liquid stays in the nozzle or pipe is short, it is assumed that the processing liquid will not deteriorate to the extent that the substrate processing cannot be performed properly. Even if the substrate processing is performed discontinuously a plurality of times, if the period during which the substrate processing is not performed is short, the substrate processing can be properly performed even if the period required for the pre-dispensing operation (hereinafter also referred to as "pre-processing") is reduced. will be executed. Reducing the time required for the pre-dispense operation shortens the time required for substrate processing. The present disclosure provides a simplified substrate processing method.

A substrate processing method according to the present disclosure includes a first process recipe that sets details of a first process to be performed on a substrate, and a second process recipe that is performed on the substrate after the first process. A flow recipe, which includes a second process recipe for setting details of processing and a pre-recipe for setting details of preliminary operations for the second process recipe, is a preset substrate processing method. In a first aspect of this substrate processing method, the first processing includes discharging a first chemical liquid onto the substrate, the second processing includes discharging the first chemical liquid onto the substrate, and the The preliminary operation includes discharging the first chemical solution.

A first aspect of this substrate processing method includes a step of executing the first process, and whether or not a period from the end of the first process to the start of the second process is shorter than a first threshold. and, if the result of the determination is affirmative, reducing the time for the preliminary operation and executing the second process.

A second aspect of this substrate processing method is the first aspect, wherein after the discharge of the first chemical liquid in the first process is completed, the first chemical in the second process is performed. When the period until the ejection of the chemical liquid starts is shorter than a second threshold, which is longer than the first threshold, and longer than the first threshold, the preliminary operation time is reduced.

A third aspect of this substrate processing method is the second aspect, in which after the discharge of the first chemical solution in the first process is completed, the first chemical in the second process is performed. If the period until the ejection of the liquid chemical starts is longer than a third threshold that is longer than the second threshold, the preliminary operation time is increased.

A fourth aspect of this substrate processing method is any of the first aspect, the second aspect, or the third aspect, wherein the discharge of the first chemical liquid is completed after the discharge of the first chemical liquid is completed. When a time period longer than a fourth threshold value longer than the first threshold value elapses without the ejection being restarted, the discharge of the first liquid chemical is executed.

A fifth aspect of this substrate processing method is any of the first aspect, the second aspect, the third aspect, or the fourth aspect, wherein the flow recipe is for N substrates (N is an integer of 2 or more). ), wherein the first processing for the first to (N−1)th substrates is completed, and the first processing for the Nth substrate is performed. At the time when one process starts, it is determined whether or not the period from the end of the Nth first process to the start of the second process is shorter than the first threshold.

According to the first aspect of the substrate processing method according to the present disclosure, the period required for substrate processing is shortened.

According to the second aspect of the substrate processing method according to the present disclosure, the period required for substrate processing is shortened.

According to the third aspect of the substrate processing method according to the present disclosure, the influence of deterioration of the chemical solution on the second processing is reduced.

According to the fourth aspect of the substrate processing method according to the present disclosure, the influence of chemical degradation on subsequent processing is reduced.

According to the fifth aspect of the substrate processing method according to the present disclosure, even when the recipe is changed during execution of the flow recipe, the need for pre-processing is appropriately determined.

1 is a schematic plan view showing an example of a schematic configuration of a substrate processing apparatus; FIG. 4 is a schematic diagram illustrating the configuration of one processing unit; FIG. FIG. 3 is a schematic diagram schematically illustrating the configuration of a processing liquid supply section; It is a figure which shows an example of schematic structure of a substrate processing system. 3 is a block diagram showing an example of the electrical configuration of a host computer; FIG. 4 is a block diagram showing an example of an electrical configuration of a main body control unit; FIG. 4 is a block diagram showing an example of an electrical configuration of a liquid management control unit; FIG. It is a figure which shows an example of the process using a processing unit. 4 is a timing chart conceptually illustrating a flow recipe; 4 is a timing chart illustrating contents of a process recipe over time; 4 is a timing chart illustrating contents of a process recipe over time; 4 is a timing chart illustrating contents of a process recipe over time; 4 is a timing chart illustrating contents of pre-recipes over time; 4 is a timing chart illustrating contents of pre-recipes over time; It is a timing chart which shows a part of flow recipe. 7 is a flowchart illustrating a routine for determining whether pre-processing is necessary; 4 is a timing chart showing substrate processing using a process recipe and a pre-recipe; 4 is a timing chart showing substrate processing using a process recipe and a pre-recipe; 4 is a timing chart showing substrate processing using a process recipe and a pre-recipe;

<Points to note in explanation>
Embodiments will be described below with reference to the attached drawings. It should be noted that the drawings are shown schematically, and for the convenience of explanation, the configurations are omitted and simplified as appropriate. Also, the interrelationships between the sizes and positions of the components shown in the drawings are not necessarily described accurately and may be changed as appropriate.

In addition, in the description given below, the same components are denoted by the same reference numerals, and their names and functions are also the same. Therefore, a detailed description thereof may be omitted to avoid duplication.

Also, even if ordinal numbers such as “first” or “second” are used in the description below, these terms are used to facilitate understanding of the content of the embodiments. are used for convenience, and are not limited to the order or the like that can occur with these ordinal numbers.

Expressions indicating relative or absolute positional relationships (e.g., "in one direction", "along one direction", "parallel", "perpendicular", "center", "concentric", "coaxial", etc.) are used unless otherwise specified. Not only the positional relationship is strictly expressed, but also the relatively displaced state in terms of angle or distance within the range of tolerance or equivalent function. Expressions indicating equality (e.g., "same", "equal", "homogeneous", etc.), unless otherwise specified, not only express quantitatively strictly equality, but also tolerances or equivalent functions can be obtained It shall also represent the state in which there is a difference. Expressions indicating shapes (e.g., "square shape" or "cylindrical shape"), unless otherwise specified, not only represent the shape strictly geometrically, but also to the extent that the same effect can be obtained, such as Shapes having unevenness, chamfering, etc. are also represented. The terms "comprise", "comprise", "comprise", "include" or "have" an element are not exclusive expressions that exclude the presence of other elements. The phrase "at least one of A, B and C" includes only A, only B, only C, any two of A, B and C, and all of A, B and C.

<1-1. Configuration Example of Substrate Processing Apparatus>
FIG. 1 is a schematic plan view showing an example of the schematic configuration of the substrate processing apparatus 20. As shown in FIG. A direction perpendicular to the paper surface of FIG. 1 corresponds to the vertical direction of the substrate processing apparatus 20 . The substrate processing apparatus 20 performs single-wafer processing by supplying a processing liquid to the surface of the substrate W, for example. An example in which a semiconductor substrate (wafer) is used as the substrate W will be described below.

In the following, an example will be described in which a cleaning process for removing foreign substances and objects to be removed using a processing liquid is used as substrate processing. Examples of the processing liquid used in the cleaning process include a mixture of ammonia and hydrogen peroxide (used for Standard Cleaning 1 used in so-called RCA cleaning; hereinafter referred to as "processing liquid SC1"), hydrofluoric acid. Dilute hydrofluoric acid (hereinafter referred to as "treatment liquid DHF") obtained by diluting hydrochloride acid (HF) with pure water, and isopropyl alcohol (hereinafter referred to as "treatment liquid IPA"). exemplified.

In addition to the above examples, other treatment liquids may be employed in the cleaning treatment. In addition to the above examples, etching using an etchant, rinsing with water, and coating with a resist may be used instead of or in addition to the cleaning.

The substrate processing apparatus 20 includes load ports LP1, LP2, LP3 and LP4. The number of load ports is not limited to four. Each of the load ports LP1, LP2, LP3, LP4 functions as a container holding mechanism that holds the carrier C. The carrier C functions as a FOUP (Front Opening Unified Pod) that accommodates a plurality of substrates W (for example, 25 substrates).

For example, the carrier C is transported from the carrier place 40 by the transport device 30 and placed on the load ports LP1, LP2, LP3, and LP4. When a plurality of substrate processing apparatuses 20 are provided, for example, the transport apparatus 30 transports the carrier C between the substrate processing apparatuses 20 .

The substrate processing apparatus 20 includes six processing units 21 . The number of processing units 21 is not limited to six. In the example shown in FIG. 1, a set of three processing units 21 are stacked in the vertical direction. Hereinafter, a set of processing units 21 (here, three processing units 21 arranged vertically stacked) may be described as one tower 21t. Two towers 21t appear in plan view.

The substrate processing apparatus 20 further includes, for example, an indexer robot 91, a center robot 92, a main body control unit 22, storage tanks 261, 262, 263, 264, a liquid management control unit 24, and a processing liquid supply section 28. include.

The indexer robot 91 transports substrates W between the load ports LP1, LP2, LP3, LP4 and the center robot 92, for example. The center robot 92 has a function of transporting the substrate W between the indexer robot 91 and the processing unit 21, for example. The indexer robot 91 and the center robot 92 function as a transport section 93 that transports a plurality of substrates W accommodated in the carrier C from the carrier C toward each processing unit 21 .

The body control unit 22 controls, for example, the operation of each part provided in the substrate processing apparatus 20 and the opening and closing of valves. The body control unit 22 transmits and receives various signals to and from the liquid management control unit 24, for example.

The storage tanks 261, 262, 263, and 264 store the processing liquid supplied to the processing unit 21 as described later. For example, the storage tank 261 stores the processing liquid DHF, the storage tank 262 stores the processing liquid SC1, the storage tank 263 stores the processing liquid IPA, and the storage tank 264 stores the processing liquids DHF, SC1, and IPA. Either is stored. The case where the processing liquid DHF is stored in the storage tank 264 will be exemplified below.

Each of the storage tanks 161, 262, 263, 264 is provided with a sensor 27, for example. Sensor 27 measures physical quantities indicative of the state of the processing liquid, such as concentration, power of hydrogen (pH) and temperature. Each of the storage tanks 161, 262, 263, and 264 may be provided with, for example, a mechanism for stirring the processing liquid stored therein.

The liquid management control unit 24 manages the states of the processing liquids stored in the storage tanks 161 , 262 , 263 and 264 by, for example, controlling the operation of each part provided in the storage tanks 161 , 262 , 263 and 264 . Specifically, the liquid management control unit 24 obtains, for example, from the sensors 27 corresponding to the storage tanks 161, 262, 263, and 264, signals relating to physical quantities indicating the state of the treatment liquid.

The liquid management control unit 24 transmits/receives various signals to/from the body control unit 22, for example. For example, the liquid management control unit 24 transmits a signal obtained from the sensor 27 or a numerical value indicating a physical quantity recognized from the signal to the main body control unit 22 .

The two processing liquid supply units 28 respectively correspond to the two towers 21t. The processing liquids in the storage tanks 261 , 262 , 263 and 264 are controlled in flow rate by one of the processing liquid supply units 28 . Each of the processing liquid supply units 28 supplies the processing liquid via the pipe group 35 to all the processing units 21 included in the corresponding tower 21t. The processing liquid supply section 28 limits the flow rate of the processing liquid under the control of the liquid management control unit 24 as will be described later.

The load ports LP1, LP2, LP3, and LP4 serve as portions for loading and unloading substrate groups between the substrate processing apparatus 20 and the outside of the substrate processing apparatus 20 (hereinafter also referred to as “loading/unloading portions”). has the function of Here, the "substrate group" refers to a plurality of substrates forming one lot.

In the example of FIG. 1, load ports LP1, LP2, LP3, LP4 are arranged along a first direction DR1 orthogonal to the vertical direction (in other words, "horizontal"). Each of the load ports LP1, LP2, LP3, LP4 and the processing unit 21 are spaced apart in a second direction DR2 that is horizontal (and therefore also perpendicular to the vertical direction) orthogonal to the first direction DR1.

For example, the transport device 30 transports a plurality of substrate groups to load ports LP1, LP2, LP3, and LP4. In the example of FIG. 1, the transport device 30 is movable along, for example, the first direction DR1 and the second direction DR2. For example, a carrier C containing a plurality of substrates W constituting one substrate group is transported from the carrier storage space 40 and placed on one of the load ports LP1, LP2, LP3, LP4.

The indexer robot 91 has a function of transporting a plurality of substrates W one by one from the carrier C to the center robot 92 . The indexer robot 91 has a function of transporting a plurality of substrates W from the center robot 92 to the carrier C one by one.

The center robot 92 has a function of loading a plurality of substrates W from the indexer robot 91 to each processing unit 21 one by one. The center robot 92 has a function of transporting a plurality of substrates W from each processing unit 21 to the indexer robot 91 one by one. Further, for example, the center robot 92 has a function of transporting the substrate W between the plurality of processing units 21 as required.

For example, the indexer robot 91 has four hands (not shown). Each hand has a function of supporting the substrate W in a horizontal posture. The indexer robot 91 has a function of moving the hand horizontally and vertically. The indexer robot 91 has a function of rotating (rotating) around a vertical axis and changing the orientation of the hand by the rotation.

The indexer robot 91 moves along the first direction DR1 on the path 201 passing through the delivery position. The delivery position is a position where the indexer robot 91 and the center robot 92 face each other in the second direction DR2 in plan view.

The indexer robot 91 has a function of facing an arbitrary carrier C and the center robot 92 with its hands. For example, the indexer robot 91 performs a loading operation of loading the substrate W into the carrier C and a loading operation of loading the substrate W from the carrier C by moving the hand. For example, the indexer robot 91 cooperates with the center robot 92 to perform a delivery operation of moving the substrate W from one of the indexer robot 91 and the center robot 92 to the other at the delivery position.

Like the indexer robot 91, the center robot 92 has, for example, four hands (not shown). Each hand has a function of supporting the substrate W in a horizontal posture. The center robot 92 moves the hand horizontally and vertically, for example. The center robot 92 rotates (rotates) about, for example, a vertical axis, and the orientation of the hand is changed by the rotation.

The center robot 92 has a function of facing any one of the processing unit 21 and the indexer robot 91 with its hand. For example, the center robot 92 performs a loading operation for loading the substrate W into each processing unit 21 and a loading operation for loading the substrate W from each processing unit 21 by moving the hand. For example, the center robot 92 cooperates with the indexer robot 91 to perform a transfer operation of moving the substrate W from one of the indexer robot 91 and the center robot 92 to the other.

<1-2. Configuration example of processing unit>
FIG. 2 is a schematic diagram illustrating the configuration of one processing unit 21. As shown in FIG. FIG. 2 is a view seen from a direction perpendicular to the vertical direction. The processing unit 21 is a single-wafer type unit that processes the substrates W one by one. The processing unit 21 operates under the control of the body control unit 22 (see FIG. 1). The body control unit 22 controls the operation of each part provided in the processing unit 21 and the operation of the processing liquid supply unit 28 .

Each processing unit 21 includes a chamber 4 , a spin chuck 5 , nozzles 341 , 342 , 343 and 344 and a guard mechanism 7 . Chamber 4 houses spin chuck 5 , processing liquid supply mechanism 6 , nozzles 341 , 342 , 343 and 344 , and guard mechanism 7 .

The spin chuck 5 functions as a substrate holding mechanism that holds one substrate W in the chamber 4 in a horizontal posture. The spin chuck 5 rotates the substrate W around a substrate rotation axis A1 parallel to the vertical direction. For example, the center of the substrate W is arranged on the substrate rotation axis A1. The guard mechanism 7 surrounds the spin chuck 5 around the substrate rotation axis A1.

The nozzles 341 , 342 , 343 supply the processing liquid to the vertically upper surface (hereinafter also referred to as “upper surface”) Wu of the substrate W held by the spin chuck 5 . The nozzle 344 supplies the processing liquid to the vertically lower surface (hereinafter also referred to as “lower surface”) Wb of the substrate W held by the spin chuck 5 .

Spin chuck 5 includes spin base 11 , spin shaft 14 , and spin motor 15 . The spin base 11 is disc-shaped and held in a horizontal posture. The outer diameter of the spin base 11 is smaller than the diameter of the substrate W. The spin base 11 has a function of sucking and holding the substrate W using, for example, a vacuum chuck (not shown). The substrate W is held horizontally while the lower surface Wb of the substrate W is attracted to the upper surface of the spin base 11 .

The centerline of the spin base 11 is positioned on the substrate rotation axis A1. The spin base 11 rotates the substrate W around the substrate rotation axis A1.

The spin shaft 14 extends vertically downward from the central portion of the spin base 11 . The nozzle 344 is provided inside the spin shaft 14, for example.

The spin motor 15 rotates the spin shaft 14, and thus rotates the spin base 11 around the substrate rotation axis A1, for example, in a counterclockwise direction Rdr when viewed vertically downward. When the spin motor 15 rotates the spin shaft 14 while the substrate W is attracted to the spin base 11, the substrate W rotates together with the spin base 11 around the substrate rotation axis A1.

Nozzle 341 is connected to pipe 351 . Nozzle 342 is connected to pipe 352 . Nozzle 343 is connected to pipe 353 . Nozzle 344 is connected to pipe 354 . The pipes 351, 352, 353, 354 constitute the pipe group 35 (see FIG. 1).

A valve 361 is inserted in the pipe 351 . A valve 362 is inserted in the pipe 352 . A valve 363 is inserted in the pipe 353 . A valve 364 is inserted in the pipe 354 . The valves 361 , 362 , 363 and 364 are housed in the processing liquid supply section 28 . One processing liquid supply unit 28 is in charge of three processing units 21 constituting one tower 21t. Accordingly, three valves 361, 362, 363, and 364 are accommodated in each of the treatment liquid supply units 28. As shown in FIG.

Pipe 351 is connected to storage tank 261 via valve 361 . Pipe 352 is connected to reservoir 262 via valve 362 . Pipe 353 is connected to storage tank 263 via valve 363 . Piping 354 is connected to reservoir 264 via valve 364 .

When the valve 361 is opened, the treatment liquid DHF supplied from the pipe 351 to the nozzle 341 is discharged downward from the nozzle 341 . When the valve 361 is closed, ejection of the treatment liquid DHF from the nozzle 341 is stopped.

When the valve 362 is opened, the treatment liquid SC1 supplied from the pipe 352 to the nozzle 342 is discharged downward from the nozzle 342 . When the valve 362 is closed, ejection of the treatment liquid SC1 from the nozzle 342 is stopped.

When the valve 363 is opened, the processing liquid IPA supplied from the pipe 353 to the nozzle 343 is discharged downward from the nozzle 343 . When the valve 363 is closed, ejection of the treatment liquid IPA from the nozzle 343 is stopped.

When the valve 364 is opened, the treatment liquid DHF supplied from the pipe 354 to the nozzle 344 is discharged upward from the nozzle 344 . When the valve 364 is closed, ejection of the treatment liquid DHF from the nozzle 344 is stopped.

The processing unit 21 includes nozzle moving devices 371 , 372 and 373 . A nozzle moving device 371 moves the nozzle 341 , a nozzle moving device 372 moves the nozzle 342 , and a nozzle moving device 373 moves the nozzle 343 .

For example, the nozzle 341 functions as a scan nozzle that ejects the treatment liquid DHF while moving the landing position of the treatment liquid DHF between the central portion and the peripheral edge of the upper surface Wu. The nozzle 341 may eject the treatment liquid DHF with a fixed liquid landing position on the upper surface Wu.

For example, the nozzle 342 functions as a scan nozzle that ejects the treatment liquid SC1 while moving the landing position of the treatment liquid SC1 between the central portion and the peripheral edge of the upper surface Wu. The nozzle 342 may eject the treatment liquid SC1 with a fixed liquid landing position on the upper surface Wu.

For example, the nozzle 343 functions as a scan nozzle that ejects the treatment liquid IPA while moving the landing position of the treatment liquid IPA between the central portion and the peripheral edge of the upper surface Wu. The nozzle 343 may eject the treatment liquid IPA with a fixed liquid landing position on the upper surface Wu.

The processing unit 21 includes a bottom nozzle 44 , a purge line 45 and a purge valve 46 . The lower surface nozzle 44 discharges gas such as nitrogen gas toward the vicinity of the periphery of the lower surface Wb. A purge pipe 45 is connected to the bottom nozzle 44 . A purge valve 46 is inserted in the purge pipe 45 . Nitrogen gas is supplied to the purge pipe 45 by, for example, an air supply facility (not shown) provided in the factory where the substrate processing system 1 is installed.

The lower surface nozzle 44 ejecting nitrogen gas to the lower surface Wb contributes to avoiding the treatment liquids DHF, SC1, and IPA ejected to the upper surface Wu from going around to the lower surface Wb.

Processing unit 21 may include a film thickness gauge. The film thickness gauge measures a predetermined film thickness on the upper surface Wu. For example, an optical interference type film thickness meter is adopted as the film thickness meter. For example, the film thickness gauge is moved above the substrate W by a configuration similar to the nozzle moving device 371 .

Processing unit 21 includes guard lifting device 55 and guard mechanism 7 . The guard mechanism 7 is positioned outward (in the direction away from the substrate rotation axis A1) from the substrate W held by the spin chuck 5, and limits the range in which the processing liquids DHF, SC1, and IPA scatter from the substrate W. FIG. For example, guard mechanism 7 includes guards 71 , 72 , 73 , walls 74 , 75 , 76 and bottom 77 .

A wall 76 surrounds the spin chuck 5 . Wall 75 surrounds spin chuck 5 and wall 76 . Wall 74 surrounds walls 75 , 76 and spin chuck 5 . The bottom 77 connects and fixes the vertically lower ends of the walls 74 , 75 , 76 and the outer periphery of the spin chuck 5 .

Guard 71 is vertically movable while being sandwiched between walls 74 and 75 . Guard 72 is vertically movable while being sandwiched between walls 75 and 76 . The guard 73 is vertically movable while being sandwiched between the wall 76 and the spin chuck 5 . The guard lifting device 55 has a function of moving the guards 71, 72, 73 in the vertical direction.

For example, the end of the guard 71 on the side of the substrate rotation axis A1 extends vertically downward, and is located on the side of the substrate rotation axis A1 from the end of the guard 72 on the side of the substrate rotation axis A1, relative to the end of the guard 73 on the side of the substrate rotation axis A1. They face each other along the vertical direction.

The cup 70 receives the treatment liquid DHF from the nozzle 341, the treatment liquid SC1 from the nozzle 342, and the treatment liquid IPA from the nozzle 343 in the pre-treatment. The nozzle moving devices 371 , 372 , 373 move the nozzles 341 , 342 , 343 vertically above the cup 70 to contribute to the operation of ejecting the treatment liquids DHF, SC1, IPA into the cup 70 . Discharge of the treatment liquid DHF into the cup 70 is also expressed as discharge of the treatment liquid DHF below. The same applies to the treatment liquids SC1 and IPA.

A cup 70 may be provided for each of the treatment liquids DHF, SC1, and IPA. For example, the nozzles 341, 342, and 343 stand by at different positions apart from the spin chuck 5 in a plan view when the processing liquids DHF, SC1, and IPA are not discharged onto the upper surface Wu. For example, the cups 70 corresponding to the treatment liquids DHF, SC1, and IPA are arranged vertically below the standby positions of the nozzles 341 , 342 , and 343 .

<1-3. Configuration Example of Processing Liquid Supply Unit>
FIG. 3 is a schematic diagram schematically illustrating the configuration of the treatment liquid supply section 28. As shown in FIG. The processing liquid supply unit 28 includes pipes 331 , 332 , 333 and 334 , pumps 81 , 82 , 83 and 84 and valves 361 , 362 , 363 and 364 . FIG. 3 also shows three processing units 21 connected by a processing liquid supply section 28 and a pipe group 35 and included in a tower 21t, and storage tanks 261, 262, 263, and 264. FIG.

Valves 361, 362, 363, and 364 are provided for each processing unit 21, respectively. The pipe group 35 includes pipes 351, 352, 353, and 354 of the three processing units 21, and is connected between the tower 21t and the processing liquid supply section 28 (see also FIG. 1).

A pipe 331 is connected to the reservoir 261 , and the treatment liquid DHF flows in and out of the reservoir 261 via the pipe 331 . A pump 81 is inserted in the pipe 331 . The pump 81 causes the processing liquid DHF to flow through the pipe 331 in the direction of the arrow, thereby circulating the processing liquid DHF between the pipe 331 and the storage tank 261 .

A pipe 332 is connected to the reservoir 262 , and the treatment liquid SC 1 flows into and out of the reservoir 262 via the pipe 332 . A pump 82 is inserted in the pipe 332 . The pump 82 causes the processing liquid SC1 to flow in the direction of the arrow in the pipe 332 to circulate the processing liquid SC1 between the pipe 332 and the storage tank 262 .

A pipe 333 is connected to the reservoir 263 , and the treatment liquid IPA flows in and out of the reservoir 263 via the pipe 333 . A pump 83 is inserted in the pipe 333 . The pump 83 causes the processing liquid IPA to flow in the direction of the arrow in the pipe 333 to circulate the processing liquid IPA between the pipe 333 and the storage tank 263 .

A pipe 334 is connected to the reservoir 264 , and the processing solution DHF flows in and out of the reservoir 264 via the pipe 334 . A pump 84 is inserted in the pipe 334 . The pump 84 causes the processing liquid SC<b>1 to flow in the direction of the arrow in the pipe 334 to circulate the processing liquid DHF between the pipe 334 and the storage tank 264 .

The circulation of the treatment liquid DHF through the piping 331, 334, the circulation of the treatment liquid SC1 through the piping 332, and the circulation of the treatment liquid IPA through the piping 333 described above are all hereinafter referred to as "tower circulation". There is something.

The pipe 351 of any processing unit 21 is also connected to the pipe 331 . The pipe 352 of any processing unit 21 is also connected to the pipe 332 . The pipe 353 of any processing unit 21 is also connected to the pipe 333 . The pipe 354 of any processing unit 21 is also connected to the pipe 334 . In FIG. 3, connections between pipes are indicated by black circles. Pipes shown crossing each other without black circles are not connected.

The processing liquid DHF branched from the tower circulation in the pipe 331 is supplied to the nozzle 341 via the pipe 351 in which the opened valve 361 is inserted. The processing liquid SC1 branched from the tower circulation in the pipe 332 is supplied to the nozzle 342 via the pipe 352 in which the open valve 362 is inserted. The processing liquid IPA branched from the tower circulation in the pipe 333 is supplied to the nozzle 343 via the pipe 353 in which the opened valve 363 is inserted. The processing liquid DHF branched from the tower circulation in the pipe 334 is supplied to the nozzle 344 via the pipe 354 through which the opened valve 364 is inserted.

The presence or absence of tower circulation does not depend on the opening and closing of valves 361, 362, 363, and 364. Even if the temperatures of the pipes 351, 352, 353, and 354 in the processing unit 21 are lowered, the temperatures of the processing liquids DHF, SC1, and IPA circulating in the tower are appropriately maintained.

When the valves 361, 362, 363, and 364 are closed, the processing liquids stagnate in the pipes 351, 352, 353, and 354, respectively. If such retention continues for a long time, deterioration of the processing liquid is caused. For example, temperature changes, concentration changes, and component changes of the treatment liquid may occur.

Whether or not pretreatment is necessary is determined based on the period during which the treatment liquid stays in a certain nozzle. For example, even if both of the nozzles 341 and 344 have the function of ejecting the treatment liquid DHF, the need for pre-treatment is determined based on the period during which the treatment liquid DHF is not ejected from each of the nozzles 341 and 344. be. From this point of view, in order to avoid complication of the description, the following description ignores the discharge of the treatment liquid DHF from the nozzles 344 .

<1-4. Configuration example of substrate processing system>
FIG. 4 is a diagram showing an example of a schematic configuration of the substrate processing system 1. As shown in FIG. The substrate processing system 1 also includes a host computer 10 in addition to the substrate processing apparatus 20 and transfer apparatus 30 described above. The host computer 10, the substrate processing apparatus 20, and the transport apparatus 30 are communicably connected via a communication line 50, for example. For the communication line 50, for example, one or both of a wired line and a wireless line are adopted.

A plurality of substrate processing apparatuses 20 may be provided. At this time, the host computer 10 has a function of centrally managing the plurality of substrate processing apparatuses 20 .

<1-5. Configuration example of host computer>
FIG. 5 is a block diagram showing an example of the electrical configuration of the host computer 10. As shown in FIG. The host computer 10 is implemented by, for example, a computer and includes a communication section 101, an input section 102, an output section 103, a storage section 104, a control section 105 and a drive 106, which are connected via a bus line Bu1.

The communication unit 101 functions as a transmission unit capable of transmitting signals to each substrate processing apparatus 20 and the transport apparatus 30 via the communication line 50, for example. The communication unit 101 functions as a receiving unit capable of receiving signals from each substrate processing apparatus 20 and the transport apparatus 30 via the communication line 50, for example.

A signal corresponding to, for example, an operation of a user using the host computer 10 can be input to the input unit 102 . The input unit 102 may include, for example, an operation unit, a microphone, various sensors, and the like.

The output unit 103 has, for example, a function of outputting various information. The output unit 103 may include, for example, a display unit and a speaker.

The storage unit 104 has, for example, a function of storing various information. The storage unit 104 is configured by a storage medium such as a hard disk and a flash memory, for example. The storage unit 104 stores various information including, for example, information PP1 about the program Pg1 and the processing plan. The information PP1 indicates, for example, the timing of executing a plurality of consecutive substrate processes for a group of substrates. The storage unit 104 may include a memory 105b, which will be described later.

The control unit 105 includes, for example, an arithmetic processing unit 105a that functions as a processor and a memory 105b that temporarily stores information. For example, a central processing unit (CPU) is adopted as the arithmetic processing unit 105a. A random access memory (RAM), for example, is employed for the memory 105b. The functions of the host computer 10 are realized by the arithmetic processing unit 105a reading and executing, for example, the program Pg1 stored in the storage unit 104. FIG. Various information temporarily obtained by various information processing in the control unit 105 is appropriately stored in the memory 105b, for example.

For example, a portable storage medium RM1 is detachable from the drive 106 . In the drive 106, for example, data is exchanged between the storage medium RM1 and the controller 105 while the storage medium RM1 is mounted. For example, when the storage medium RM1 storing the program Pg1 is loaded into the drive 106, the program Pg1 is read from the storage medium RM1 into the storage unit 104 and stored.

<1-6. Configuration example of main unit control unit>
FIG. 6 is a block diagram showing an example of the electrical configuration of the body control unit 22. As shown in FIG. The main body control unit 22 includes a communication section 221, an input section 222, an output section 223, a storage section 224, a control section 225, and a drive 226, which are realized by, for example, a computer and connected via a bus line Bu2.

The communication unit 221 functions as a transmission unit capable of transmitting signals to the host computer 10 via the communication line 50, for example. The communication unit 221 functions as a receiving unit capable of receiving signals from the host computer 10 via the communication line 50, for example. For example, the communication unit 221 can also transmit and receive signals to and from the liquid management control unit 24 via wiring such as cables.

For example, the input unit 222 can receive a signal corresponding to the user's operation using the substrate processing apparatus 20 . The input unit 222 may include, for example, an operation unit, a microphone, various sensors, and the like, similar to the input unit 102 described above.

The output unit 223 has, for example, a function of outputting various information. The output unit 223 may include, for example, a display unit, a speaker, and the like, similar to the output unit 103 described above.

The storage unit 224 has a function of storing various information, for example. This storage unit 224 can be configured by a storage medium such as a hard disk and flash memory, for example. The storage unit 224 may store, for example, the program Pg2 and various information Dt2. The storage unit 224 may include a memory 225b, which will be described later.

Program Pg2 contains, for example, flow recipes. The flow recipe includes a process recipe that defines the details of substrate processing and a pre-recipe that defines the details of pre-processing. A flow recipe is commonly set for a group of substrates W, for example, substrates W accommodated in the same carrier C. As shown in FIG.

The control unit 225 includes, for example, an arithmetic processing unit 225a that functions as a processor and a memory 225b that temporarily stores information. For example, a CPU is adopted as the arithmetic processing unit 225a. A RAM, for example, is adopted as the memory 225b. The functions of the main body control unit 22 are realized by, for example, reading and executing the program Pg2 stored in the storage unit 224 in the arithmetic processing unit 225a. Various types of information temporarily obtained by various types of information processing in the control unit 225 are appropriately stored in the memory 225b, for example.

The drive 226 is, for example, a removable part of the portable storage medium RM2. In the drive 226, for example, data can be exchanged between the storage medium RM2 and the controller 225 while the storage medium RM2 is attached. For example, when the storage medium RM2 storing the program Pg2 is attached to the drive 226, the program Pg2 is read from the storage medium RM2 into the storage unit 224 and stored.

<1-7. Configuration example of liquid management control unit>
FIG. 7 is a block diagram showing an example of the electrical configuration of the liquid management control unit 24. As shown in FIG. The liquid management control unit 24 is implemented by a computer or the like, for example, similarly to the main body control unit 22 described above, and includes a communication section 241, an input section 242, an output section 243, and a storage section 244, which are connected via a bus line Bu3. , a controller 245 and a drive 246 .

The communication unit 241 can transmit and receive signals to and from the main body control unit 22 via wiring such as a cable, for example.

For example, a signal corresponding to an operation of a user using the substrate processing apparatus 20 can be input to the input unit 242 . The input unit 242 may include, for example, an operation unit, a microphone, various sensors, and the like, similar to the input unit 102 described above.

The output unit 243 has, for example, a function of outputting various information. The output unit 243 may include, for example, a display unit, a speaker, and the like, similar to the output unit 103 described above.

The storage unit 244 has, for example, a function of storing various information. This storage unit 244 may be configured by a storage medium such as a hard disk and a flash memory, for example, like the storage unit 224 described above. The storage unit 244 can store, for example, a program Pg3 and various information Dt3. The storage unit 244 may include a memory 245b, which will be described later.

Program Pg3 includes, for example, process recipes and pre-recipes. For example, the program Pg3 includes the type of processing liquid that needs to be discharged and the predetermined amount to be discharged for each process recipe, and the type of processing liquid that needs to be discharged and the predetermined amount to be discharged for each pre-recipe.

The control unit 245 includes, for example, an arithmetic processing unit 245a that functions as a processor and a memory 245b that temporarily stores information. For example, a CPU is applied to the arithmetic processing unit 245a. A RAM, for example, is applied to the memory 245b. The functions of the liquid management control unit 24 are realized by, for example, reading and executing the program Pg3 stored in the storage unit 244 in the arithmetic processing unit 245a. Various information temporarily obtained by various information processing in the control unit 245 is appropriately stored in the memory 245b, for example.

The drive 246 is, for example, a removable part of the portable storage medium RM3. In the drive 246, for example, data can be exchanged between the storage medium RM3 and the controller 245 while the storage medium RM3 is mounted. For example, when the storage medium RM3 storing the program Pg3 is loaded into the drive 246, the program Pg3 is read from the storage medium RM3 into the storage unit 244 and stored.

<1-8. Processing Using Processing Unit>
<1-8-1. Overall processing>
FIG. 8 is a diagram showing an example of processing using the processing unit 21. As shown in FIG. FIG. 8 corresponds to a plurality of substrate treatments of the same type and one pre-treatment. FIG. 8 illustrates substrate processing and pre-processing performed on a group of substrates W, for example, substrates W housed in the same carrier C. FIG. The process illustrated in FIG. 8 includes steps S1-S6.

The substrate processing and pre-processing are realized by controlling the operation of each section by the main body control unit 22 and the liquid management control unit 24 . Here, one processing unit 21 of the substrate processing apparatus 20 will be focused on and explained.

A substrate W is carried into the processing unit 21 in step S1. Specifically, the center robot 92 loads the substrate W into the chamber 4 and places it on the spin base 11 . The body control unit 22 causes the spin base 11 to hold the substrate W in a substantially horizontal posture using a vacuum chuck.

After the substrate W is held by the spin base 11, the upper surface Wu is subjected to a chemical solution treatment in step S2. The chemical liquid treatment is, for example, a cleaning process (hereinafter referred to as "first cleaning process") in which the treatment liquids DHF and SC1 are sequentially discharged onto the upper surface Wu. Alternatively, the chemical solution treatment is, for example, a cleaning treatment (hereinafter referred to as a “second cleaning treatment”) in which the treatment liquid SC1 is discharged onto the upper surface Wu. Alternatively, the chemical solution treatment is, for example, a cleaning treatment (hereinafter referred to as a “third cleaning treatment”) in which the treatment liquids DHF and IPA are sequentially ejected onto the upper surface Wu.

In the first cleaning process, the rinsing process may be performed after the treatment liquid DHF is discharged and before the treatment liquid SC1 is discharged. In either or both of the first cleaning process and the second cleaning process, the rinsing process may be performed after the treatment liquid SC1 is discharged. In the third cleaning process, a rinse process may be performed after the treatment liquid DHF is discharged and before the treatment liquid IPA is discharged. In the third cleaning process, the rinsing process may be performed after the treatment liquid IPA is discharged.

For these rinsing processes, for example, de-ionized water for cleaning (hereinafter referred to as "pure water DIW") is discharged onto the upper surface Wu or onto the upper surface Wu and the lower surface Wb. . The nozzles used for discharging the pure water DIW are, for example, shared with the nozzles 341, 342, 343, and 344, or are provided side by side, or provided independently. In this embodiment, the rinsing process is omitted for the sake of simplicity.

In the chemical solution processing, the body control unit 22 controls the spin motor 15 to rotate the spin base 11 about the substrate rotation axis A1. The substrate W is rotated by the rotation. When step S2 is executed, the rotation speed of the spin base 11 may fluctuate, or the rotation may stop.

When the first cleaning process is executed in step S2, the body control unit 22 controls the nozzle moving devices 371 and 372 to move the nozzles 341 and 342 in a predetermined manner. The liquid management control unit 24 controls the valves 361 and 362 to discharge predetermined amounts of the treatment liquids DHF and SC1 from the nozzles 341 and 342 toward the upper surface Wu in this order.

When the first cleaning process is executed, the body control unit 22 controls the nozzle moving device 373 to move the nozzle 343 to the standby position. The liquid management control unit 24 closes the valve 363 when the first cleaning process is executed.

When the second cleaning process is executed in step S2, the body control unit 22 controls the nozzle moving device 372 to cause the nozzle 342 to move in a predetermined manner. The liquid management control unit 24 controls the valve 362 to discharge a predetermined amount of the treatment liquid SC1 from the nozzle 342 toward the upper surface Wu.

When the second cleaning process is executed, the main body control unit 22 controls the nozzle moving devices 371 and 373 to move the nozzles 341 and 343 to their standby positions. The liquid management control unit 24 closes the valves 361 and 363 when the second cleaning process is performed.

When the third cleaning process is executed in step S2, the body control unit 22 controls the nozzle moving devices 371 and 373 to move the nozzles 341 and 343 in a predetermined manner. The liquid management control unit 24 controls the valves 361 and 363 to discharge predetermined amounts of the treatment liquids DHF and IPA respectively from the nozzles 341 and 343 toward the upper surface Wu in this order.

When the third cleaning process is executed, the body control unit 22 controls the nozzle moving device 372 to move the nozzle 342 to the standby position. The liquid management control unit 24 closes the valve 362 when the third cleaning process is performed.

When step S2 is executed, the main body control unit 22 may control the purge valve 46 to discharge nitrogen gas from the lower surface nozzle 44 to the lower surface Wb. The nitrogen gas reduces or suppresses the processing liquids DHF and SC1 discharged onto the upper surface Wu from going around to the lower surface Wb.

For example, in the first cleaning process and the third cleaning process, the processing liquid DHF is discharged onto the upper surface Wu and the processing liquid DHF is discharged onto the lower surface Wb. At this time, the liquid management control unit 24 controls the valves 361 and 364 to discharge a predetermined amount of the treatment liquid DHF from the nozzles 341 and 344 toward the upper surface Wu and the lower surface Wb, respectively.

When step S2 is executed, the body control unit 22 controls the guard lifting device 55 to change the relative positions of the guards 71, 72, and 73 with respect to the substrate W in the vertical direction.

For example, when all the top plates of the guards 71, 72, and 73 are positioned above the upper surface Wu and the side surfaces of the guard 71 face the upper surface Wu in the horizontal direction, the treatment liquid is discharged to the upper surface Wu and scattered from the upper surface Wu. is led to bottom 77 between wall 76 and spin chuck 5 .

For example, when all the top plates of the guards 71 and 72 are positioned above the upper surface Wu, the top plate of the guard 73 is positioned below the lower surface Wb, and the side surfaces of the guard 72 face the upper surface Wu in the horizontal direction, The processing liquid discharged onto the upper surface Wu and scattered from the upper surface Wu is guided to the bottom 77 between the walls 75 and 76 .

For example, when the top plate of the guard 71 is positioned above the upper surface Wu, both the top plates of the guards 72 and 73 are positioned below the lower surface Wb, and the side surfaces of the guard 71 face the upper surface Wu in the horizontal direction, The processing liquid discharged onto the upper surface Wu and scattered from the upper surface Wu is guided to the bottom 77 between the walls 74 and 75 .

By appropriately combining the ejection timing of the treatment liquid ejected from the nozzles 341, 342, and 343 and the relative positions of the guards 71, 72, and 73 with respect to the substrate W in the vertical direction, the type of treatment liquid can be determined. guided to a different area each time. Such guidance contributes to recovery of the processing liquid for each type.

Each substrate W is processed in step S2. The substrate W that has been chemically processed in step S2 is unloaded in step S3. Specifically, the body control unit 22 releases the vacuum chuck on the spin base 11 . The center robot 92 removes the processed substrate W from the spin base 11 and unloads it from the chamber 4 .

After step S3 is executed, step S4 is executed. In step S4, it is determined whether there is a next substrate W to be processed in the processing unit 21 or not. For example, the main body control unit 22 refers to the flow recipe and determines whether or not there is a "next substrate" among the plurality of substrates accommodated in one carrier C.

If the determination result of step S4 is affirmative (if the "next substrate W" exists), the process returns to step S1. If the determination result of step S4 is negative (if "next substrate W" does not exist), the process proceeds to step S5.

In step S5, it is determined whether or not pre-processing is necessary. As will be described later, in principle, pre-processing is executed in the flow recipe, but pre-processing is omitted as an exception. A flowchart for determining the necessity of pre-processing will be described later.

When the result of determination in step S5 is affirmative (that is, when it is determined that pre-processing is necessary), pre-processing is executed in step S6. When the result of determination in step S5 is negative (that is, when it is determined that pre-processing is unnecessary) and after step S6 is executed, the processing shown in FIG. 8 ends.

<1-8-2. An example of a flow recipe>
FIG. 9 conceptually illustrates the flow recipe as a timing chart. The flow recipe includes process recipe groups J1, J2, J3 and pre-recipes Pr1, Pr2, Pr3. Based on the flow recipe, a plurality of substrates W stored in the same carrier C, 25 substrates in this case, are processed.

The process recipe group J1 includes process recipes J1(1) to J1(25). The process recipe group J2 includes process recipes J2(1) to J2(25). The process recipe group J3 includes process recipes J3(1) to J3(25). The numbers enclosed in parentheses are integers from 1 to 25 and correspond to each of the 25 substrates W stored in the same carrier C. FIG. In the following, substrate W(k) refers to the kth substrate W stored on the same carrier C (k=1-25). The kth substrate is subject to substrate processing based on process recipes J1(k), J2(k), J3(k).

The flow recipe specifies processing in the following order: pre-recipe Pr1, process recipe J1(1), ... J1(25), pre-recipe Pr2, process recipe J2(1), ... J2(25), pre-recipe Pr3, process recipe. J3(1), . . . J3(25).

FIG. 10 is a timing chart illustrating the contents of the process recipe J1(k) over time. The process recipe J1(k) sets the details of the first cleaning process for the substrate W(k). The process recipe J1(k) includes a carry-in recipe J10(k), discharge recipes J11(k), J12(k), and a carry-out recipe J14(k). The carry-in recipe J10(k), the discharge recipes J11(k), J12(k), and the carry-out recipe J14(k) are adopted in this order, and the processing set by each is executed.

The loading recipe J10(k) sets the processing for loading the substrate W(k). The substrate W(k) is taken out from the carrier C and placed on the spin chuck 5 according to the carry-in recipe J10(k). After the substrate W(k) is placed on the spin chuck 5, the process set by the ejection recipe J11(k) is executed.

The ejection recipe J11(k) sets the process of ejecting the treatment liquid DHF onto the upper surface Wu of the substrate W(k). In the following, the ejection of the treatment liquid DHF is also referred to as ejection P(1).

After the ejection P(1) according to the ejection recipe J11(k) is completed, the process set by the ejection recipe J12(k) is executed. The ejection recipe J12(k) sets the process of ejecting the treatment liquid SC1 onto the upper surface Wu of the substrate W(k). In the following, the ejection of treatment liquid SC1 is also referred to as ejection P(2).

After the ejection P(2) according to the ejection recipe J12(k) is completed, the process set by the carry-out recipe J14(k) is executed. The unloading recipe J14(k) sets a process for unloading the substrate W(k). The substrate W(k) is taken out from the spin chuck 5 and carried into the carrier C according to the carry-out recipe J14(k).

FIG. 11 is a timing chart illustrating the contents of the process recipe J2(k) over time. The process recipe J2(k) sets the details of the second cleaning process for the substrate W(k). The process recipe J2(k) includes a carry-in recipe J20(k), a discharge recipe J22(k), and a carry-out recipe J24(k). A carry-in recipe J20(k), a discharge recipe J22(k), and a carry-out recipe J24(k) are adopted in this order, and the processing set by each is executed.

The carry-in recipe J20(k) sets the process for carrying in the substrate W(k). The substrate W(k) is taken out from the carrier C and placed on the spin chuck 5 according to the carry-in recipe J20(k). After the substrate W(k) is placed on the spin chuck 5, the process set by the ejection recipe J22(k) is executed.

The ejection recipe J22(k) sets the ejection P(2) for the upper surface Wu of the substrate W(k). In the following, the ejection of the treatment liquid DHF is also referred to as ejection P(2).

After the ejection P(2) according to the ejection recipe J22(k) is completed, the process set by the carry-out recipe J24(k) is executed. The unloading recipe J24(k) sets a process for unloading the substrate W(k). The substrate W(k) is taken out from the spin chuck 5 and carried into the carrier C according to the carry-out recipe J24(k).

FIG. 12 is a timing chart illustrating the contents of the process recipe J3(k) over time. The process recipe J3(k) sets the details of the third cleaning process for the substrate W(k). The process recipe J3(k) includes a carry-in recipe J30(k), discharge recipes J31(k), J33(k), and a carry-out recipe J34(k). The carry-in recipe J30(k), discharge recipes J31(k), J33(k), and carry-out recipe J34(k) are adopted in this order, and the processing set by each is executed.

The loading recipe J30(k) sets the processing for loading the substrate W(k). The substrate W(k) is taken out from the carrier C and placed on the spin chuck 5 according to the carry-in recipe J30(k). After the substrate W(k) is placed on the spin chuck 5, the process set by the ejection recipe J31(k) is executed.

The ejection recipe J31(k) sets ejection (1) to the upper surface Wu of the substrate W(k). After the ejection P(1) according to the ejection recipe J31(k) is completed, the process set by the ejection recipe J33(k) is executed. The ejection recipe J33(k) sets the process of ejecting the treatment liquid IPA onto the upper surface Wu of the substrate W(k). In the following, the ejection of the treatment liquid IPA is also referred to as ejection P(3).

After the ejection P(3) according to the ejection recipe J33(k) is completed, the process set by the carry-out recipe J34(k) is executed. The unloading recipe J34(k) sets a process for unloading the substrate W(k). The substrate W(k) is taken out from the spin chuck 5 and carried into the carrier C according to the carry-out recipe J34(k).

Step S1 shown in FIG. 8 corresponds to carry-in recipes J10(1) to J10(25), J20(1) to J20(25), and J30(1) to J30(25). Step S2 shown in FIG. ), J33(1) to J33(25). Step S3 shown in FIG. 8 corresponds to export recipes J14(1) to J14(25), J24(1) to J24(25), and J34(1) to J34(25).

For example, step S5 can be excluded from the flowchart of FIG. 8 unless the pre-processing is omitted as described later. At this time, for example, step S1 is executed according to the carry-in recipe J10(k), step S2 is executed according to the ejection recipes J11(k) and J12(k), and step S3 is executed according to the carry-out recipe J14(k). If k<25, step S1 is further executed via step S4. If k=25, step S6 is executed according to the pre-recipe Pr2 via step S4.

Alternatively, step S1 is executed according to the carry-in recipe J20(k), step S2 is executed according to the discharge recipe J22(k), and step S3 is executed according to the carry-out recipe J24(k). If k<25, step S1 is further executed via step S4. If k=25, step S6 is executed according to the pre-recipe Pr3 via step S4.

The pre-recipe Pr1 sets preliminary operations for the ejections P(1) and P(2) performed in the process recipe group J1. Pre-recipe Pr2 sets a preliminary operation for ejection P(2) performed in process recipe group J2. The pre-recipe Pr3 sets preliminary operations for the ejections P(1) and P(3) performed in the process recipe group J3. These preliminary operations correspond to the pre-operations described above.

FIG. 13 is a timing chart illustrating the contents of the pre-recipe Pr1 over time. The pre-recipe Pr1 corresponds to pre-treatment for the treatment liquids DHF and SC1. The pre-recipe Pr1 includes ejection recipes Pr11 and Pr12, which are adopted in this order. The discharge recipe Pr11 sets the discharge P(1) to the cup 70 . The discharge recipe Pr12 sets the discharge P(2) to the cup 70 .

The pre-recipe Pr2 corresponds to pre-treatment for the treatment liquid SC1. The pre-recipe Pr2 sets the discharge P(2) to the cup 70 .

FIG. 14 is a timing chart illustrating the contents of the pre-recipe Pr3 over time. The pre-recipe Pr3 corresponds to pre-treatment for the treatment liquids DHF and IPA. The pre-recipe Pr3 includes ejection recipes Pr31 and Pr33, which are adopted in this order. The discharge recipe Pr31 sets the discharge P(1) to the cup 70 . The discharge recipe Pr33 sets the discharge P(3) to the cup 70 .

Import recipes J10(k), J20(k), J30(k), ejection recipes J11(k), J12(k), J22(k), J31(k), J33(k), J31(k), J33(k), Pr11, Pr12, Pr31, Pr33, carry-out recipes J14(k), J24(k), J34(k), and pre-recipe Pr2. is preset in

<1-8-3. Determination of Necessity of Preprocessing>
In the present embodiment, when the time during which the processing liquid to be pre-processed is not discharged is shorter than a predetermined threshold value, it is determined that the pre-process is unnecessary. This shortens the time required for substrate processing, and such shortening contributes to the simplification of the substrate processing method.

Hereinafter, the process of determining whether pre-processing set by pre-recipe Pr2 is required will be described first, and then the process of determining whether pre-processing is required by pre-recipe Pr3 will be described.

FIG. 15 shows, as a timing chart, ejection recipe J11(24) to ejection recipe J22(1), which are part of the flow recipe. Time t11e(k) is the time when the substrate processing set by the ejection recipe J11(k) ends, more specifically, the time when the ejection P(1) onto the upper surface Wu of the substrate W(k) ends. . Time t12s(k) is the time when the substrate processing set by the discharge recipe J12(k) starts, more specifically, the time when the discharge P(2) onto the upper surface Wu of the substrate W(k) starts. .

In FIG. 15, the times t11e(k) and t12s(k) are shown to be the same time for the sake of simplicity, but more accurately, the time t11e(k) precedes the time t12s(k).

Time t12e(k) is the time when the substrate processing set by the ejection recipe J12(k) ends, more specifically, the time when the ejection P(2) onto the upper surface Wu of the substrate W(k) ends. . Time t10(k) is the time at which the process set by the carry-in recipe J10(k) starts, specifically the time at which the substrate W(k) is carried.

FIG. 16 is a flowchart illustrating a routine for determining whether pre-processing is necessary. In the figure and below, this routine is abbreviated as "preprocessing necessity determination routine". The pre-processing necessity determination routine is realized by controlling the operation of each part by the main body control unit 22 and the liquid management control unit 24 .

The determination result of the pre-processing necessity determination routine is used for the determination result of step S5 shown in FIG. The pre-processing necessity determination routine does not substitute for step S5, nor does it show the details of step S5.

In the pre-processing necessity determination routine, step S51 is a step of determining whether or not ejection P(j) has started. Here, the parameter j is either 1 or 2, and the pre-processing necessity determination routine is employed for each parameter j.

The first pre-processing necessity determination routine is executed for the ejection recipes Pr11 and Pr31 that set the pre-processing for the treatment liquid DHF, and the second pre-processing is performed for the ejection recipe Pr12 that sets the pre-processing for the treatment liquid SC1. A necessity determination routine is executed.

If the determination result of step S51 is negative, step S55 is executed. Step S55 will be described later.

If the determination result of step S51 is affirmative, step S52 is executed. Step S52 is a step of ending the counting of the count value M(j), which will be described later, and resetting the count value M(j).

Count value M(j) collectively indicates count values M(1) and M(2). The count value M(j) is a value that is incremented by counting in the j-th pre-processing necessity determination routine. The count value M(j) represents the time after the discharge P(j) is completed.

Referring to FIG. 15, time t12s(24) is the time at which ejection P(2) set by ejection recipe J12(24) starts. At time t12s(24), the determination in step S51 becomes affirmative, and count value M(2) is reset in step S52.

In FIG. 15, the square on the dashed line C2 indicates the point in time when the counting of the count value M(2) in the second pre-processing necessity determination routine ends and the count value M(2) is reset (step S52 is at which it will be executed).

After step S52 is executed, step S53 is executed. Step S53 is a step of determining whether or not the ejection P(j) has ended. If the determination result of step S53 is negative, step S53 is repeatedly executed. If the determination result of step S53 is affirmative, step S54 is executed. Step S54 is a step of starting counting the count value M(j).

Referring to FIG. 15, time t12e(24) is the time when ejection P(2) set by ejection recipe J12(24) ends. At time t12e(24), the determination in step S53 becomes affirmative, and counting of count value M(2) is started in step S54.

In FIG. 15, the black dot on dashed line C2 indicates the point in time when counting of count value M(2) starts in the second pre-processing necessity determination routine (step S54 is executed).

Time t11e (24) is the time at which ejection P(1) set by ejection recipe J11 (24) ends. Discharge P(1) is performed before time t11e (24), and step S52 in the first pre-processing necessity determination routine is performed before time t11e (24). At time t11e (24), the determination in step S53 becomes affirmative, and counting of count value M(1) is started in step S54.

A black dot on dashed line C1 indicates the point in time when counting of count value M(1) starts in the first pre-processing necessity determination routine (step S54 is executed).

After the counting is started by step S54, step S55 is executed. Step S55 is a step of determining whether count value M(j) is less than predetermined value M0(j). The predetermined value M0(j) corresponds to a period during which the state in which no ejection P(j) is performed is permitted. If the state in which the ejection P(j) is not performed is shorter than the time corresponding to the predetermined value M0(j), the pre-processing for the ejection P(j) is unnecessary.

When the determination result in step S55 is negative, count value M(j) is greater than or equal to predetermined value M0(j), and steps S50 and S59 are executed. Step S50 is a step of ending counting of the count value M(j) and resetting the count value M(j). In step S59, it is determined that pre-processing is necessary. After steps S50 and S59 are executed, the pre-processing necessity determination routine ends.

When the determination result in step S55 is affirmative, count value M(j) is less than predetermined value M0(j), and step S56 is executed. In step S56, it is determined whether the substrate We has been loaded into the chamber 4 or not. Among the substrates W stored in the same carrier C, the substrates We are the substrates W which are subjected to the substrate processing set by the last process recipe among the process recipes belonging to the same process recipe group. Since 25 substrates W are stored in the same carrier C here, the substrate We refers to the substrate W (25).

Before time t10 (25), the determination result of step S56 becomes negative, and step S51 is executed again without determining whether or not pre-processing is necessary.

When step S56 is executed after time t10 (25), the determination result in step S56 becomes affirmative, and step S57 is executed.

A step S57 estimates the time from the end of the ejection P(j) to the substrate We until the ejection P(j) is performed again, and performs the pre-processing based on this time and the time corresponding to the predetermined value M0(j). Judge whether it is necessary or not. Specifically, it is determined whether the count value M(j) is less than the value (M0(j)-R(j)).

Regarding the second pre-processing necessity determination routine, step S57 will be described with reference to FIG. According to the flow recipe, after time t10 (25), carry-in recipe J10 (25), discharge recipe J11 (25), J12 (25), carry-out recipe J14 (25), pre-recipe Pr2, carry-in recipe J20 (1). After executing the processes set by each of the above, the ejection P(2) based on the ejection recipe J22(1) is performed.

After time t12e (25), it is expected that processes corresponding to carry-out recipe J14 (25) and carry-in recipe J20 (1) will be executed before the time corresponding to predetermined value M0 (2) elapses. At this time, pre-processing based on pre-recipe Pr2 is assumed to be unnecessary.

Count value M(2) is reset at time t12e(24). The count value M(2) at time t10(25) corresponds to the time during which the process set by the carry-out recipe J14(25) is executed. This time is assumed to be equal to the time from the end of ejection P(2) at time t12e(25) to the end of unloading of the substrate We according to the unloading recipe J14(25).

If the result of adding the count value corresponding to the time required for the processing set by the carry-in recipe J20(1) to the count value M(2) at time t10(25) is less than the predetermined value M0(2) For example, pre-processing based on pre-recipe Pr2 is assumed to be unnecessary.

A count value corresponding to the time required for the process set by the carry-in recipe J20(1) is used as the value R(2). If the count value M(2) is less than the value (M0(2)-R(2)) when the substrate We is loaded into the chamber 4 and the determination result in step S56 is affirmative, the determination in step S57 The result is positive. At this time, it is determined in step S58 that the pre-processing, specifically the pre-processing set by the pre-recipe Pr2, is unnecessary.

If the count value M(2) is equal to or greater than the value (M0(2)-R(2)), after time t12e(25), processing corresponding to each of the carry-out recipe J14(25) and the carry-in recipe J20(1) is executed, it is assumed that the time corresponding to the predetermined value M0(2) has elapsed. At this time, the determination result in step S57 is negative, and it is determined in step S59 that pre-processing, specifically pre-processing set by pre-recipe Pr2, is necessary.

FIG. 17 is a timing chart showing substrate processing using process recipes and pre-recipes when step S59 is executed in the second pre-processing necessity determination routine. At step S5 in FIG. 8, the determination result is affirmative, and the pre-processing set by the pre-recipe Pr2 is executed corresponding to step S6. The pre-processing starts at time t2s and ends at time t2e.

After that, the flowchart of FIG. 8 is executed again for the process recipe group J2, and the pre-processing necessity determination routine is executed again for step S5.

Time t22s(k) is the time when the substrate processing set by the discharge recipe J22(k) starts, more specifically, the time when the discharge P(2) onto the upper surface Wu of the substrate W(k) starts. . Time t22e(k) is the time when the substrate processing set by the ejection recipe J22(k) ends, more specifically, the time when the ejection P(2) onto the upper surface Wu of the substrate W(k) ends. .

Time t20(25) is the time at which the process set by the loading recipe J20(25), specifically the substrate W(25) (which is also the substrate We) is loaded.

FIG. 18 is a timing chart showing substrate processing using process recipes and pre-recipes when step S58 is executed in the second pre-processing necessity determination routine. The determination result in step S5 of FIG. 8 is negative, and step S6 is not executed. After the substrate We is unloaded based on the unloading recipe J14 (25), the flowchart of FIG. 8 is executed again corresponding to the process recipe group J2.

The time tr31s is the time when the ejection P(1) set by the ejection recipe Pr31 starts. The time tr31e is the time when the ejection P(1) set by the ejection recipe Pr31 ends. Time tr33s is the time at which ejection P(3) set by ejection recipe Pr33 starts. Time tr33e is the time at which ejection P(3) set by ejection recipe Pr33 ends. Although the times tr31e and tr33s are shown to be the same time in FIG. 18 for the sake of simplicity, the time tr31e precedes the time tr33s.

Time t31s(k) is the time at which ejection P(1) set by ejection recipe J31(k) starts. Time t31e is the time when ejection P(1) set by ejection recipe J31(k) ends. Time t33s(k) is the time at which ejection P(1) set by ejection recipe J33(k) starts. In FIG. 18, the times t31e(k) and t33s(k) are shown to be the same time for the sake of simplicity, but more precisely, the time t31e precedes the time t33s.

Referring to FIG. 15, in the first pre-processing necessity determination routine, counting of count value M(1) starts at time t11e (24) (see step S54 in FIG. 16), and time t10 (25 ), the determination in step S57 is made.

9, 11, 12 and 17, except for the pre-processing set by the pre-recipe Pr3, after the ejection P(1) based on the ejection recipe J11(25) is completed, the ejection recipe J31(1) ), the state in which ejection P(1) is not executed continues until ejection P(1) based on ) starts. During this period, processes set by the discharge recipe J12 (25), the carry-out recipe J14 (25), the pre-recipe Pr2, the process recipe group J2, and the carry-in recipe J30 (1) (hereinafter referred to as "first intermediate process group"). tentative name) is executed.

Since ejection P(1) does not start while the first intermediate process group is being executed, steps S51, S55, and S56 are repeatedly executed without executing step S52, and the count value M(1) increases. continue.

Whether or not the period during which the first intermediate process group is executed is longer than the period during which the state in which ejection P(1) is not performed is permitted (this corresponds to the predetermined value M0(1)) Based on this, it is determined whether or not the pre-processing set by the pre-recipe Pr3 is necessary.

After the counting of the count value M(1) starts at time t11e (24) (see the black dot on the dashed line C1 in FIG. 15), the determination result of step S56 becomes affirmative at time t10 (25), and step S57 is executed. be done.

17 and 18, count value M(1) at time t10(25), process recipe J1(25), pre-recipe Pr2, process recipe group J2, carry-in recipe J30(1) are set respectively. If the sum of the count value corresponding to the time during which the processing (hereinafter, tentatively referred to as the “second intermediate processing group”) is executed is smaller than the predetermined value M0 (1), the pre-processing of the processing liquid DHF is unnecessary. is. From this point of view, a count value corresponding to the total amount of time the second intermediate process group is executed is taken as the value R(1).

If the determination result of step S57 is affirmative, the process proceeds to step S58, and it is determined that the pre-processing set by the ejection recipe Pr31 of the pre-recipe Pr3 is unnecessary. If the determination result of step S57 is negative, the process proceeds to step S59, and it is determined that pre-processing set by pre-recipe Pr3 is necessary.

Specifically, it is not the entire pre-processing set by the pre-recipe Pr3 that is determined in the second pre-processing necessity determination routine. Therefore, the determination result of step S5 in FIG. 8 becomes affirmative, and step S6 is executed. The pre-processing executed in step S6 is discharge P(3) set by the discharge recipe Pr33. This can be viewed as a reduction in pre-processing. FIG. 19 is a timing chart showing the substrate processing when the discharge recipe Pr31 is omitted, using the process recipe and the pre-recipe.

In this case as well, the period required for substrate processing can be shortened compared to the case where the determination result in step S57 is negative in the second pre-processing necessity determination routine, and such a reduction can simplify the substrate processing method. contribute to

<1-8-4. Timing for Determining Necessity of Preprocessing>
For any recipe included in the flow recipe, the time required for executing the process set by each recipe is set in advance. Therefore, at the beginning of substrate processing based on the flow recipe, it may be determined whether or not pre-processing is necessary. Based on the determination result, pre-processing is not executed (for example, pre-processing set by pre-recipe Pr2 is not executed), or pre-processing is partially not executed (pre-processing is reduced: for example, pre-processing is set by ejection recipe Pr31. (non-execution of ejection P(1)) may be realized.

However, it is assumed that the recipe is changed while the flow recipe is being executed. Further, it is conceivable that processing may be executed at a time different from the time set in the flow recipe due to the processing statuses of the plurality of processing units 21 . In such an assumption, there is a possibility that the necessity of pre-processing determined at the beginning of the substrate processing based on the flow recipe will not be appropriate.

In the above-described example, in the first cleaning process, the timing at which the substrate We is loaded into the chamber 4, specifically, the count value at time t10 (25) is used to determine whether pre-processing is necessary. Determining whether or not pre-processing is necessary at such timing contributes to appropriately determining whether or not pre-processing is necessary even in the case assumed as described above.

<2. General explanation>
A general description of the above embodiments can be described as follows. A flow recipe is preset in the substrate processing method in which the flow recipe is preset in the present disclosure. A flow recipe includes a first process recipe, a second process recipe, and a pre-recipe.

In the embodiment, referring to FIG. 9, process recipes J1(1) to J1(25) are exemplified as the first process recipe.

Process recipes J2(1) to J2(25) are exemplified as the second process recipe, and pre-recipe Pr2 is exemplified as the pre-recipe. Alternatively, process recipes J3(1) to J3(25) are exemplified as the second process recipe, and pre-recipe Pr3 is exemplified as the pre-recipe.

The first process recipe sets the details of the first process to be performed on the substrate. In an embodiment, referring to FIG. 10, process recipe J1(k) sets dispenses P(1) and P(2) to be performed on substrate W(k). More specifically, the process recipe J1(k) includes ejection recipes J11(k) and J12(k), which respectively set ejections P(1) and P(2) to be performed on the substrate W(k). do. The first process includes ejection P(1) of the processing liquid DHF onto the substrate W(k). The first process includes ejection P(2) of treatment liquid SC1 onto substrate W(k).

The second process recipe sets the details of the second process to be performed on the substrate after the first process. The pre-recipe sets the contents of the pre-operation for the second process recipe.

In an embodiment, referring to FIG. 11, process recipe J2(k) establishes dispense P(2) to be performed on substrate W(k). More specifically, process recipe J2(k) includes dispense recipe J22(k), which sets dispense P(2) to be performed on substrate W(k). The second process includes ejection P(2) of treatment liquid SC1 onto substrate W(k). The pre-recipe Pr2 sets the contents of the preliminary operation for the process recipe J2(k). The preliminary operation includes discharging the processing liquid SC1.

In an embodiment, referring to FIG. 12, process recipe J3(k) sets dispenses P(1) and P(3) to be performed on substrate W(k). More specifically, process recipe J3(k) includes ejection recipes J31(k) and J33(k), which respectively set ejections P(1) and P(3) to be performed on substrate W(k). do.

The second process includes ejection P(1) of the processing liquid DHF onto the substrate W. FIG. The second process includes ejection P(3) of the processing liquid IPA onto the substrate W. FIG. The pre-recipe Pr3 sets the contents of the preparatory operation for the process recipe group J3. The pre-recipe Pr3 includes an ejection recipe Pr31, and the preliminary operation set by the ejection recipe Pr31 includes ejection of the processing liquid DHF. The pre-recipe Pr3 includes an ejection recipe Pr33, and the preliminary operation set by the ejection recipe Pr33 includes ejection of the treatment liquid IPA.

Both the first process and the second process include discharging the first chemical solution onto the substrate W. FIG. Here, the treatment liquid SC1 can be assumed as the first chemical liquid, the first treatment is set by the ejection recipes J12(1) to J12(25), the preliminary operation is set by the ejection recipe Pr12, and the second The process is set by ejection recipes J22(1) to J22(25). Alternatively, the treatment liquid DHF can be assumed as the first chemical liquid, the first process is set by the ejection recipes J11(1) to J11(25), the preliminary operation is set by the ejection recipe Pr31, and the second process is set by ejection recipes J31(1) to J31(25).

If the period from the end of the first process to the start of the second process is shorter than the first threshold, the second process is executed after reducing the preparatory operation time. When the treatment liquid SC1 is assumed as the first chemical liquid, the first process ends with the end of the ejection recipe J12(25), and the second process starts with the start of the ejection recipe J22(1). A period during which the state in which ejection P(2) is not performed is permitted is assumed as the first threshold. If the period from time t12e(25) to time t22s(1) is shorter than the first threshold, the pre-operation set by pre-recipe Pr2 is omitted. The predetermined value M0(2) is a count value corresponding to the first threshold.

When the treatment liquid SC1 is assumed as the first chemical liquid, the pre-operation time is reduced substantially to zero.

When the treatment liquid DHF is assumed as the first chemical liquid, the first process ends with the end of the ejection recipe J11(25), and the second process starts with the start of the ejection recipe J31(1). A period during which the state in which ejection P(1) is not performed is permitted is assumed as the first threshold. If the period from time t11e(25) to time t31s(1) is shorter than the first threshold, the pre-operation set by the discharge recipe Pr31 is omitted from the pre-recipe Pr3. The predetermined value M0(1) is a count value corresponding to the first threshold.

When the treatment liquid DHF is assumed as the first chemical liquid, the time for the pre-operation is reduced by the time required for the pre-operation set by the ejection recipe Pr31.

In the substrate processing method, a step of executing a first process (for example, the first process is set by the process recipe group J1) and a period from the end of the first process to the start of the second process are defined as the second process. determining whether it is shorter than a threshold of 1 (such determination is realized by steps S55, S56, S57, S58, S59 and step S5, for example). The substrate processing method further comprises the step of reducing the pre-operation time and performing the second processing if the result of the j determination is positive.

Considering treatment liquid SC1, the second treatment includes ejection P(2). At this time, it is determined whether or not the pre-processing set by the pre-recipe Pr2 is necessary, and if the result of the determination is affirmative, the pre-processing is omitted. This omission can be said to drastically reduce the time required for pre-processing.

Considering the treatment liquid DHF, the second treatment includes ejection P(1). At this time, it is determined whether or not the pre-processing set by the ejection recipe Pr31 is necessary, and if the result of the determination is affirmative, the pre-processing is omitted. This omission can be said to reduce the time required for the pre-processing set by the pre-recipe Pr3.

However, when the treatment liquid SC1 is assumed as the first chemical liquid, the period from time t12e (25) to time t22s (1) is estimated at time t10 (25) in the embodiment, so step S57 The value R(2) described using is used. When the treatment liquid DHF is assumed, the period from time t11e (25) to time t31s (1) is estimated at time t10 (25) in the embodiment. R(1) is used.

In other words, the flow recipe includes N first processes corresponding to N substrates W(1) to W(N) (where N is an integer equal to or greater than 2: integer 25 in the embodiment). including. When the first processing for the substrates W(1) to W(N-1) is completed and the first processing for the substrate W(N) is started, the second processing is started from the end of the first processing. It is determined whether the period to start is shorter than a first threshold.

<3. Deformation>
<3-1. First Modification>
Even if the period from the end of ejection of the first chemical solution in the first process to the start of ejection of the first chemical solution in the second process exceeds the first threshold, if the extent is small, the It is considered that the degree of deterioration of the chemical solution of 1 is also low. In the following, a description is given introducing a second threshold that is longer than the first threshold.

In terms of the embodiment, the period from time t12e(25) to time t22s(1) is a period of time δ2 (>0) during which the state in which ejection P(2) is not performed is allowed to continue. If the time δ2 is small, it is considered that the deterioration of the treatment liquid SC1 is small. Therefore, the second threshold may be set larger than the first threshold for ejection P(2) to reduce the pre-operation time set by the ejection recipe Pr12.

Alternatively, if the period from time t11e(25) to time t31s(1) is estimated to exceed the period in which the state in which ejection P(1) is not performed is allowed to continue by time δ1 (>0), time If δ1 is small, it is considered that the deterioration of the treatment liquid DHF is small. Therefore, the second threshold may be set larger than the first threshold for ejection P(1) to reduce the pre-operation time set by the ejection recipe Pr31.

Such a reduction in pre-operation time contributes to a reduction in the period required for substrate processing. Such a reduction in pre-operation time is realized by controlling the operation of each section by the main body control unit 22 and the liquid management control unit 24 when step S6 is executed, for example.

<3-2. Second Modification>
If the period from the end of ejection of the first chemical liquid in the first process to the start of ejection of the first chemical liquid in the second process exceeds the first threshold value, and if the period is large, the first It is considered that the extent to which the chemical solution deteriorates is also large. In the following, a description is given introducing a third threshold that is longer than the second threshold.

If it is estimated that the period from time t12e(25) to time t22s(1) greatly exceeds the period in which the state in which ejection P(3) is not performed is permitted to continue, the deterioration of treatment liquid SC1 is also large. Conceivable. Therefore, the third threshold may be set larger than the second threshold for ejection P(2) to increase the pre-operation time set by the ejection recipe Pr12.

Alternatively, if the period from time t11e(25) to time t31s(1) is estimated to greatly exceed the period in which the state in which ejection P(1) is not performed is permitted to continue, the treatment liquid DHF will also deteriorate significantly. it is conceivable that. Therefore, the third threshold may be set larger than the second threshold for ejection P(1) to increase the pre-operation time set by the ejection recipe Pr31.

Such an increase in pre-operation time contributes to slightly reducing the influence of deterioration of the first chemical solution on the second process. Such an increase in pre-operation time is realized by controlling the operation of each part by the main body control unit 22 and the liquid management control unit 24 when step S6 is executed, for example.

<3-3. Third Modification>
When a time period longer than a fourth threshold longer than the first threshold elapses without restarting the ejection of the first chemical liquid after the ejection of the first chemical liquid is finished, the first chemical liquid is discharged. may be performed.

For example, if the discharge recipe J11(25) is completed and the discharge P(2) is not resumed even after a period of time longer than the fourth threshold has elapsed, the treatment liquid SC1 is discharged. For example, if the discharge recipe J12(25) is completed and the discharge P(2) does not resume even after a period of time longer than the fourth threshold has passed, the treatment liquid SC1 is discharged.

For example, if the ejection P(1) does not restart even after a period of time longer than the fourth threshold has elapsed since the ejection recipe J11(25) ended, the treatment liquid DHF is discharged. For example, if the ejection P(1) does not restart even after a period of time longer than the fourth threshold has elapsed since the ejection recipe J11(25) ended, the treatment liquid DHF is discharged.

For example, if the discharge recipe J33(25) is completed and the discharge P(3) does not resume even after a period of time longer than the fourth threshold has elapsed, the treatment liquid IPA is discharged.

The discharge of the processing liquid according to the third modification enhances the effect of reducing the influence of deterioration of the chemical liquid on subsequent processing.

The embodiments and modifications disclosed this time are examples, and the substrate processing method is not limited to the above contents. For example, it is possible to appropriately combine all or part of each of the embodiments and modifications.

DHF, IPA, SC1 Treatment liquid J1, J2, J3 Process recipe group J1(1) to J1(25), J1(k), J2(1) to J2(25), J2(k), J3(1) to J3(25), J3(k) Process recipe J11(1) to J11(25), J11(k), J12(1) to J12(25), J12(k), J22(1) to J22(25) , J22(k), J31(1) to J31(25), J31(k), J33(1) to J33(25), J33(k), Pr11, Pr12, Pr31, Pr33 Discharge recipe M Count value M0 Predetermined Value P(1), P(2), P(3) Ejection S1, S2, S3, S4, S5, S6, S50, S51, S52, S53, S54, S55, S56, S57, S58, S59 Step W Substrate t11e(24), t12s(24), t12e(24), t10(25), t11s(25), t11e(25), t12s(25), t12e(25), t2s, t2e, t22s(1), t22e (1), t22s(24), t22e(24), t20(25), t22s(25), t22e(25), tr31s, tr31e, tr33s, tr33e, t31s(1), t31e(1), t33s(1 ), t33e (1) time

Claims (5)

a first process recipe for setting details of a first process to be performed on the substrate;
a second process recipe for setting details of a second process to be performed on the substrate after the first process;
A substrate processing method in which a flow recipe including a pre-recipe for setting contents of a preliminary operation for the second process recipe is set in advance,
the first process includes discharging a first chemical liquid onto the substrate;
the second process includes discharging the first chemical liquid onto the substrate;
the preliminary operation includes discharging the first chemical solution;
a step of performing the first process;
determining whether a period from the end of the first process to the start of the second process is shorter than a first threshold;
and reducing the time of the preliminary operation and performing the second process if the result of the determination is affirmative. A period from the end of the ejection of the first chemical liquid in the first process to the start of the ejection of the first chemical liquid in the second process is longer than the first threshold. 2. The substrate processing method of claim 1, wherein the preparatory operation time is reduced when less than a second threshold and greater than the first threshold. A period from the end of the ejection of the first chemical liquid in the first process to the start of the ejection of the first chemical liquid in the second process is longer than the second threshold value. 3. The substrate processing method of claim 2, wherein greater than a threshold of 3 increases the time of the preparatory operation. When a time longer than a fourth threshold longer than the first threshold elapses without restarting the ejection of the first chemical after the ejection of the first chemical is completed, the The discharge of one chemical solution is performed. The substrate processing method according to any one of claims 1 to 3. The flow recipe includes N first processes corresponding to each of N substrates (N is an integer equal to or greater than 2),
When the first processing for the first to (N−1)th substrates is completed and the first processing for the Nth substrate is started, the Nth first processing is completed. 5. The substrate processing method according to any one of claims 1 to 4, wherein it is determined whether or not a period from the start of the second process to the start of the second process is shorter than the first threshold.

Images