JP2023001603A - holding device - Google Patents

Abstract

To provide a holding device capable of improving an insulation property around a terminal and of electrically connecting between an external power supply and the terminal via a resin connector.SOLUTION: An electrostatic chuck 1 that holds a semiconductor wafer W on a holding surface 11 of a plate-like member 10, has: the plate-like member 10 that comprises terminal pads 60 connected with internal electrodes 50 and 52; a base member 20 that comprises through-holes 25 and cooling medium passages 23; terminal members 70 each comprising a conductive member 71 whose one end is connected with the terminal pad 60 and whose the other end is connected with a connector 80, being arranged inside each through-hole 25; and a bonding layer 40 bonding between the plate-like member 10 and the base member 20. The bonding layer 40 is formed of an inorganic bonding material whose main component is an inorganic material. Each terminal member 70 is arranged between the cooling medium passages 23 of the base member 20, and the conductive member 71 is formed in a ceramic member 72.SELECTED DRAWING: Figure 2

Description

The present disclosure relates to a holding device for holding an object.

As a holding device, for example, an electrostatic chuck described in Patent Document 1 is known. This electrostatic chuck includes a ceramic substrate (first member) for holding a semiconductor wafer on its surface (holding surface), and a metal base member (second member) bonded to the ceramic substrate. Internal electrodes such as a chuck electrode and a heater electrode are arranged inside. In such an electrostatic chuck, a first terminal electrically connected to the internal electrode is arranged on the lower surface of the ceramic substrate as a configuration for supplying power to the internal electrode, and a first terminal is provided in a through hole formed in the base member. , a second terminal having one end connected to the external power supply and the other end connected to the first terminal. In order to insulate the base member from the first and second terminals, insulating tubes are arranged around the terminals. This insulating tube is fixed to the electrostatic chuck with a resin adhesive.

JP 2010-103321 A

However, in recent years, the use of electrostatic chucks at high temperatures (250°C or higher) has increased, making it impossible to fix the insulating tube with a resin adhesive, and there is a risk that the insulation around the terminals will be insufficient. . In addition, when the electrostatic chuck is used at a high temperature (250° C. or higher), it is necessary to use a resin connector connected to the terminals and arranged on the lower surface side of the base member for connecting the terminals to an external power supply. There is a possibility that it will not be possible.

Therefore, the present disclosure has been made in order to solve the above-described problems, and it is possible to improve the insulation around the terminals and electrically connect the external power supply and the terminals via a resin connector. It is an object of the present invention to provide a holding device capable of

One aspect of the present disclosure made to solve the above problems is
a first member having a first surface, a second surface provided opposite to the first surface, and terminal pads provided on the second surface and connected to internal electrodes;
a third surface, a fourth surface provided on the opposite side of the third surface, a through hole penetrating the third surface and the fourth surface, and a coolant channel through which a coolant flows; a second member comprising
a terminal member disposed inside the through-hole, comprising a conducting member having one end connected to the terminal pad and the other end connected to the connector;
a bonding layer disposed between the second surface of the first member and the third surface of the second member to bond the first member and the second member;
In a holding device that holds an object on the first surface of the first member,
The bonding layer is formed of an inorganic bonding material containing an inorganic material as a main component,
The terminal member is arranged between the coolant flow paths of the second member, and the conductive member is formed in a ceramic member.

In this holding device, the bonding layer is formed of an inorganic bonding material whose main component is an inorganic material (for example, metal such as solder, ceramics such as alumina or zirconia, etc.). Even if it is used in , the connection failure between the first member and the second member does not occur. Further, since the conductive member provided in the terminal member and connected to the terminal pad is formed inside the ceramic member, the ceramic member provides a connection around the terminal (between the terminal pad or conductive member and the bonding layer or second member). Insulation can be secured.

In addition, since the terminal member is arranged between the coolant channels, the terminal member is easily cooled by the coolant, and the conductive member is less likely to become hot. Therefore, even if the holding device is used at a high temperature (250°C or higher), a resin connector can be connected to the other end of the conductive member. can be directly connected.

In this way, according to this holding device, it is possible to improve the insulation around the terminals at high temperatures (250° C. or higher) and to electrically connect the external power source and the terminals via the resin connector. can be done.

In the holding device described above,
It is preferable that the terminal member is joined to the second member on the fourth surface side from the upper surface forming the coolant channel.

Thus, by joining the terminal member to the second member on the fourth surface side of the second member where the temperature is low, heat transfer from the terminal member to the lowest temperature portion of the second member can be promoted. . Thereby, the temperature of the terminal member (conducting member) can be effectively lowered. Therefore, the temperature of the connector connected to the conductive member can be further lowered, and the external power supply and the terminal can be electrically connected stably via the resin connector even when used at high temperatures. can be done.

In the holding device described above,
A gap is preferably formed between the terminal member and the through hole.

Here, if there is a difference in thermal expansion between the material forming the first member and the material forming the second member, when the temperature of the holding device rises/falls, the difference in thermal expansion causes the terminal member to expand. Contact with the second member may damage the terminal member.

Therefore, by forming a gap between the terminal member and the through hole in this way, damage to the terminal member can be reliably prevented. Thereby, the terminal member can improve the insulation between the terminal pad or the conductive member and the bonding layer or the second member.

In the holding device described above,
The conductive member is brazed to the terminal pad,
a cylindrical member arranged in the through hole so as to cover the outer periphery of the terminal member;
It is preferable that the tubular member is integrally formed with the first member.

Here, when the terminal member is joined to the first member in a state in which the conductive member and the terminal pad are brazed and the terminal member is provided, a gap may occur between the terminal member and the first member. Further, when the bonding layer or the second member is formed of a conductive material such as a metal material, if a gap is generated between the terminal member and the first member, the terminal pad or the conductive member and the bonding layer or the second member may be separated from each other. There is a risk that the insulation between the members will be insufficient.

Therefore, by arranging a cylindrical member integrally formed with the first member in the through hole so as to cover the outer periphery of the terminal member, the terminal pad or the conductive member and the bonding layer or the second member are connected by the cylindrical member. It is possible to reliably improve the insulation between the members.

In the holding device described above,
A gap is preferably formed between the cylindrical member and the through hole.

Here, if there is a difference in thermal expansion between the material forming the tubular member and the material forming the second member, when the temperature of the holding device rises/falls, the difference in thermal expansion causes the tubular member to contact with the second member, the tubular member may be damaged.

Therefore, by forming a gap between the tubular member and the through hole in this way, it is possible to reliably prevent damage to the tubular member. Thereby, the cylindrical member can improve the insulation between the terminal pad or the conductive member and the bonding layer or the second member.

Advantageous Effects of Invention According to the present disclosure, it is possible to provide a holding device capable of improving insulation around terminals and electrically connecting an external power source and terminals via a resin connector.

1 is a schematic perspective view of an electrostatic chuck of a first embodiment; FIG. 2 is a schematic configuration diagram of an XZ cross section of the electrostatic chuck of the first embodiment; FIG. 2 is a schematic configuration diagram of the XY plane of the electrostatic chuck of the first embodiment; FIG. 3 is an enlarged view of the X1 portion shown in FIG. 2; FIG. 4 is a schematic configuration diagram of an XY cross section of the base member; FIG. It is a schematic block diagram of the XZ cross section of the electrostatic chuck of 2nd Embodiment. 7 is an enlarged view of the X2 portion shown in FIG. 6; FIG. It is a schematic block diagram of the XZ cross section of the electrostatic chuck which shows a modification.

A holding device that is an embodiment according to the present disclosure will be described in detail with reference to the drawings. In this embodiment, as the holding device, for example, an electrostatic chuck used in a semiconductor manufacturing device such as a film forming device (CVD film forming device, sputtering film forming device, etc.) or an etching device (plasma etching device, etc.) is exemplified. explain.

[First embodiment]
First, the electrostatic chuck 1 of the first embodiment will be described with reference to FIGS. 1 to 5. FIG. The electrostatic chuck 1 of the present embodiment is a device that attracts and holds a semiconductor wafer W (object) by electrostatic attraction. be done. As shown in FIG. 1 , the electrostatic chuck 1 has a plate-like member 10 , a base member 20 , and a joining layer 40 that joins the plate-like member 10 and the base member 20 . The plate member 10 is an example of the "first member" of the present disclosure, and the base member 20 is an example of the "second member" of the present disclosure.

In the following description, the XYZ axes are defined as shown in FIG. 1 for convenience of explanation. Here, the Z-axis is the axis in the axial direction of the electrostatic chuck 1 (vertical direction in FIG. 1), and the X-axis and the Y-axis are the radial axes of the electrostatic chuck 1 .

As shown in FIG. 1, the plate-like member 10 is a disk-like member made of ceramics. Various ceramics are used as ceramics, but from the viewpoint of strength, wear resistance, plasma resistance, etc., for example, ceramics containing aluminum oxide (alumina, Al ₂ O ₃ ) or aluminum nitride (AlN) as a main component is preferably used. The term "main component" as used herein means a component with the highest content (for example, a component with a volume content of 90 vol % or more). The plate member 10 has a diameter of, for example, about 150 mm to 350 mm, and a thickness of, for example, about 2 mm to 6 mm.

As shown in FIGS. 1 and 2, the plate-like member 10 has a holding surface 11 for holding the semiconductor wafer W, and a holding surface 11 in the thickness direction of the plate-like member 10 (the direction coinciding with the Z-axis direction, the vertical direction). and a lower surface 12 provided on the opposite side. A semiconductor wafer W is held on this holding surface 11 . Note that the holding surface 11 is an example of the "first surface" of the present disclosure, and the lower surface 12 is an example of the "second surface" of the present disclosure.

A holding surface 11 of the plate member 10 has an uneven shape. Specifically, as shown in FIGS. 2 and 3, the holding surface 11 is formed with an annular convex seal band 16 near its outer edge, and a plurality of independent columnar convex portions are formed inside the seal band 16. 17 is formed. The shape of the cross section (XZ cross section) of the seal band 16 is substantially rectangular as shown in FIG. The height (dimension in the Z-axis direction) of the seal band 16 is, for example, about 10 μm to 20 μm. Further, the width (dimension in the X-axis direction) of the seal band 16 is, for example, approximately 0.5 mm to 5.0 mm.

As shown in FIG. 3, each convex portion 17 has a substantially circular shape when viewed in the Z-axis direction (planar view), and is arranged at substantially equal intervals. Moreover, the shape of the cross section (XZ cross section) of each convex portion 17 is substantially rectangular as shown in FIG. The height of the protrusion 17 is substantially the same as the height of the seal band 16, and is, for example, about 10 to 20 μm. Further, the width of the convex portion 17 (maximum diameter of the convex portion 17 when viewed in the Z-axis direction) is, for example, approximately 0.5 to 1.5 mm. A portion of the holding surface 11 of the plate-like member 10 inside the seal band 16 where the convex portion 17 is not formed serves as a concave portion 18 .

The semiconductor wafer W is held by the electrostatic chuck 1 by being supported by the seal band 16 and the plurality of projections 17 on the holding surface 11 of the plate member 10 . When the semiconductor wafer W is held by the electrostatic chuck 1, between the surface (lower surface) of the semiconductor wafer W and the holding surface 11 of the plate member 10 (more specifically, the recess 18 of the holding surface 11), There will be a space S (see FIG. 2). An inert gas (for example, helium gas) is supplied to the space S through a gas hole 30b (see FIG. 3) passing through the electrostatic chuck 1. As shown in FIG. Further, as shown in FIG. 3, the electrostatic chuck 1 has through-holes 30b through which the electrostatic chuck 1 is penetrated. Holes 30a and the like are formed. In the following description, the lift pin insertion holes 30a and the gas holes 30b may be simply referred to as "through holes 30".

Further, as shown in FIG. 2, the plate member 10 includes a chuck electrode 50 and a heater electrode 52 inside. The chuck electrode 50 has, for example, a substantially circular shape when viewed in the Z-axis direction, and is made of a conductive material (eg, tungsten, molybdenum, etc.). The heater electrode 52 forms, for example, a substantially spiral pattern when viewed in the Z-axis direction, and is made of a conductive material (eg, tungsten, molybdenum, platinum, etc.). The chuck electrode 50 and the heater electrode 52 are examples of the "internal electrode" of the present disclosure.

Here, the power supply structure to the chuck electrode 50 will be described with reference to FIG. 4 as well. First, vias 61 are connected to the chuck electrode 50 as shown in FIG. The via 61 is arranged to extend in the Z-axis direction from the chuck electrode 50 toward the lower surface 12 side. The other end of via 61 is connected to terminal pad 60 . Thereby, the terminal pad 60 is electrically connected to the chuck electrode 50 through the via 61 . Terminal pads 60 and vias 61 are made of a conductive material (eg, tungsten, molybdenum, etc.).

The terminal pad 60 is arranged on the bottom portion 15b of the bottomed hole 15 provided in the lower surface 12 of the plate member 10, as shown in FIGS. In addition, the shape of the terminal pad 60 when viewed in the Z-axis direction is, for example, substantially circular. The bottomed hole 15 is a circular recess, and when viewed in the Z-axis direction, a region overlapping a through hole 25 of the base member 20 described later has a shape recessed toward the holding surface 11 side.

As shown in FIG. 4, the terminal pad 60 is connected to a conducting member 71 provided on the terminal member 70 . The terminal member 70 is a member in which a conductive member 71 is arranged inside a cylindrical ceramic member 72 (the conductive member 71 is covered with the ceramic member 72), and the ceramic member 72 and the plate-like member 10 are fired at the same time. and formed integrally with the plate member 10 . As a result, the terminal pads 60 and the terminal pads 71a are completely covered with the terminal member 70 (ceramic member 72) and the plate member 10. As shown in FIG. Note that the tip of the ceramic member 72 is positioned substantially flush with the bottom surface 22 of the base member 20 . The ceramics member 72 is made of ceramics like the plate-like member 10 and is made of the same material as the plate-like member 10 .

In addition, as a method of manufacturing (co-firing) the terminal member 70, a cylindrical ceramic terminal (the terminal member 70 before sintering) was previously manufactured from a green sheet in which a conductive paste serving as a conductive member 71 was arranged. After that, the ceramic terminal is inserted into the counterbored hole (bottomed hole 15) in the lower surface of the plate-like member before sintering, and the ceramic terminal and the plate-like member before sintering are bonded by a solvent and thermocompression, and then the two are joined. Sintering (co-firing) may suffice. Alternatively, a plate-like member in the state of a thick green sheet is formed by disposing a conductive paste as the conductive member 71 at the position where the terminal member 70 is arranged, and after sintering the plate-like member, the plate-like member after sintering is formed. Therefore, unnecessary portions other than the plate member 10 and the terminal member 70 may be scraped off by machining such as polishing. Alternatively, a plate-shaped member before sintering and a columnar ceramic terminal in which a conductive paste serving as the conducting member 71 is arranged may be formed together with a green sheet and then sintered.

A terminal pad 71 a connected to the terminal pad 60 and a terminal pad 71 b exposed to the outside at the end of the ceramic member 72 are provided at the end of the conductive member 71 provided in the terminal member 70 . A male terminal 71c is joined to the terminal pad 71b by brazing. The conducting member 71, the terminal pads 71a and 71b, and the male terminal 71c are examples of the "conducting member" of the present disclosure.

A connector 80 connected to an external power source is fitted to the male terminal 71c. The connector 80 has a female terminal 82 inside a resin member 81 , and the female terminal 82 is connected to an external power supply via a wiring 83 . Therefore, by connecting the connector 80 to the terminal member 70, that is, by fitting the female terminal 82 of the connector 80 to the male terminal 71c, the external power supply and the terminal pad 60 are electrically connected through the terminal member 70. be. As a result, power is supplied from the external power source to the chuck electrode 50 via the terminal member 70 (conducting member 71 ), the terminal pad 60 and the via 61 .

The structure for supplying power to the heater electrode 52 is basically the same as the structure for supplying power to the chuck electrode 50 described above, so a detailed description thereof will be omitted. Another difference is that the terminal pad 60 is not directly connected to the heater electrode 52 by the via 61 but is electrically connected through the connection pad 63 . Specifically, the terminal pad 60 and the connection pad 63 are connected by the via 61, and the connection pad 63 and the heater electrode 52 are connected by the via 62, whereby the terminal pad 60 is electrically connected to the heater electrode 52. It is As a result, power is supplied to the heater electrode 52 from an external power source via the connector 80 , terminal member 70 (conducting member 71 ), terminal pad 60 , via 61 , connection pad 63 and via 62 .

As shown in FIG. 1, the base member 20 has a cylindrical shape, more specifically, two cylinders having different diameters, and a cylindrical upper surface portion having a large diameter and a cylindrical lower surface portion having a small diameter placed thereon. , and a stepped cylindrical shape formed by overlapping with a common central axis Ca. The base member 20 is made of metal (eg, aluminum, aluminum alloy, etc.).

As shown in FIGS. 1 and 2, the base member 20 has an upper surface 21 and a central axis Ca (see FIG. 2) of the base member 20 (plate-like member 10) (that is, the Z-axis direction). and a lower surface 22 provided on the opposite side. Note that the upper surface 21 is an example of the "third surface" of the present disclosure, and the lower surface 22 is an example of the "fourth surface" of the present disclosure.

The diameter of the base member 20 is, for example, about 150 mm to 300 mm at the upper portion and about 180 mm to 350 mm at the lower portion. Also, the thickness (dimension in the Z-axis direction) of the base member 20 is, for example, about 20 mm to 50 mm.

Further, as shown in FIG. 2, the base member 20 is formed with a coolant channel 23 for flowing a coolant (for example, fluorine-based inert liquid, water, etc.). As shown in FIG. 5, the coolant channel 23 is formed in a helical shape when viewed in the Z-axis direction. It is connected to an outlet 28 provided in the portion of . The coolant supplied to the base member 20 through the supply port 27 flows through the coolant channel 23 and is discharged out of the base member 20 through the discharge port 28 as indicated by the arrow in FIG. Note that the supply port 27 and the discharge port 28 may be reversed. In this manner, the base member 20 is cooled by causing the coolant to flow through the coolant passages 23 of the base member 20 , thereby cooling the plate-like member 10 via the joining layer 40 .

As shown in FIG. 2, the base member 20 is formed with a cylindrical through-hole 25 that penetrates between the upper surface 21 and the lower surface 22 in the thickness direction (Z-axis direction, vertical direction in FIG. 2). there is The through-holes 25 are provided between the coolant flow paths 23 in the XZ cross-sectional view (positions sandwiched between the adjacent coolant flow paths 23 in the Z-axis direction view). A terminal member 70 is arranged in the through hole 25, and on the side of the lower surface 22 of the base member 20 from the upper surface 23a forming the coolant channel 23 (that is, between the upper surface 23a and the lower surface 22 in the Z-axis direction), It is joined to the base member 20 with an adhesive 26 . In this embodiment, the terminal member 70 is joined to the base member 20 near the bottom surface 22 of the base member 20 . In this embodiment, the tip portion of the terminal member 70 is joined to the base member 20 by, for example, the adhesive 26 . A gap 35 (see FIG. 4) is formed between the terminal member 70 and the through hole 25 .

The joining layer 40 is arranged between the lower surface 12 of the plate member 10 and the upper surface 21 of the base member 20 to join the plate member 10 and the base member 20, as shown in FIG. The bonding layer 40 thermally connects the bottom surface 12 of the plate member 10 and the top surface 21 of the base member 20 . The thickness (dimension in the Z-axis direction) of the bonding layer 40 is, for example, approximately 0.1 to 1.0 mm.

The bonding layer 40 is made of an inorganic bonding material containing an inorganic material (for example, metal such as solder, ceramics such as alumina or zirconia, etc.) as a main component. Generally, a resin adhesive is often used as the bonding layer 40 , but when the electrostatic chuck 1 is used at high temperatures (for example, 250° C. or higher), the resin adhesive does not have sufficient heat resistance. An inorganic bonding material is used because there is a risk of poor bonding. By using such an inorganic bonding material, the heat resistance is improved, so even if the electrostatic chuck 1 is used at high temperatures, it is possible to prevent defective bonding between the plate member 10 and the base member 20. can be done.

In the case of using a metal bonding material containing a metal material as a main component as the inorganic bonding material, for example, metal adhesives that bond using metal powder or metal foil, metal fibers, porous materials, network structures , or a plurality of columnar metal pieces and brazing material. Titanium, nickel, aluminum, copper, brass, alloys thereof, stainless steel, or the like can be used as the metal that forms the metal adhesive, metal mesh, or metal piece.

As shown in FIG. 2, the bonding layer 40 is formed with bonding layer through-holes 45 in which the terminal members 70 are arranged. That is, a cylindrical bonding layer through-hole 45 is formed between the bottomed hole 15 and the through-hole 25 . The bonding layer through-hole 45 is coaxial with the bottomed hole 15 and the through-hole 25, and the bottomed hole 15, the bonding layer through-hole 45, and the through-hole 25 extend in the Z-axis direction (the axial direction of the electrostatic chuck 1). A series of terminal holes 65 (see FIG. 4) are formed in which the terminal pads 60 and the terminal members 70 are arranged.

Here, when the electrostatic chuck 1 is used at a high temperature (e.g., 250° C. or higher), an insulating tube is arranged around the terminals and the insulating tube is attached to the electrostatic chuck with a resin adhesive as in a conventional electrostatic chuck. Since it is difficult to keep the junction to This is because the resin adhesive deteriorates under high temperature, so that a gap is formed in the joint portion or the adhesive itself is damaged, and the gap or the damaged portion becomes a leak path. If a leak path is formed, the insulation between the terminal pad 60 and the base member 20 or the bonding layer 40 (if it is made of a metal bonding material) is destroyed, resulting in abnormal discharge.

Therefore, in the electrostatic chuck 1 of the present embodiment, the terminal member 70 having the conductive member 71 (terminal pad 71a) connected to the terminal pad 60 inside the ceramic member 72 is fired simultaneously with the plate-like member 10 to integrally form it. ing. As a result, the terminal pads 60 and the terminal pads 71a are completely covered with the ceramic member 72 of the terminal member 70 and the plate member 10 . Therefore, even if the electrostatic chuck 1 is used at high temperatures, it is possible to ensure insulation between the terminal pads 60 or 71a and the base member 20 or the bonding layer 40 (when composed of a metal bonding material). can.

In addition, in the electrostatic chuck 1 of the present embodiment, since the terminal member 70 is arranged between the coolant channels 23, the terminal member 70 is easily cooled by the coolant, and the conductive member 71 inside the terminal member 70 is heated to a high temperature. hard to be Then, the terminal member 70 is joined to the base member 20 with an adhesive 26 on the side of the lower surface 22 of the base member 20 (near the lower surface 22 having a low temperature in this embodiment) from the upper surface 23a forming the coolant channel 23. It is Therefore, heat transfer from the terminal member 70 to the low-temperature portion of the base member 20 can be accelerated through the adhesive 26, and the terminal member 70 (conducting member 71) can be cooled more effectively. Therefore, the resin connector 80 can be connected to the male terminal 71c provided at the other end of the conducting member 71 even at high temperatures. As a result, stable electrical connection between the external power source and the electrostatic chuck 1 can be ensured via the connector 80 even at high temperatures.

In the electrostatic chuck 1 of the present embodiment, since there is a difference in thermal expansion between the material (ceramics) forming the plate member 10 and the material (metal) forming the base member 20, the electrostatic chuck 1 When the temperature rises/falls, the terminal member 70 may come into contact with the base member 20 due to the difference in thermal expansion, which may damage the terminal member 70 . In particular, when the electrostatic chuck 1 is used at high temperatures, the terminal member 70 is more likely to be damaged because the amount of deformation due to the difference in thermal expansion increases.

Therefore, in the electrostatic chuck 1 of this embodiment, the gap 35 is formed between the terminal member 70 and the through hole 25 . The gap 35 may be set to such an extent that the terminal member 70 does not come into contact with the base member 20 due to the difference in thermal expansion between the terminal member 70 and the base member 20 (for example, about 0.1 to 2.0 mm). By forming such a gap 35, damage to the terminal member 70 can be reliably prevented. Thus, the terminal member 70 can ensure insulation between the terminal pad 60 or the conductive member 71 and the base member 20 or the bonding layer 40 (when composed of a metal bonding material).

As described above, according to the electrostatic chuck 1 of the present embodiment, the terminal member 70 in which the conductive member 71 is formed in the ceramic member 72 is co-fired with the plate-like member 10 to be integrally formed. Therefore, it is possible to ensure insulation around the terminals (between the terminal pad 60 or the conductive member 71 and the base member 20 or the bonding layer 40 (when composed of a metal bonding material)) even at high temperatures. The terminal member 70 is arranged between the coolant channels 23 of the base member 20 and is joined to the base member 20 near the lower surface 22 by the adhesive 26 . Therefore, even at high temperatures, the terminal member 70 (conducting member 71) can be efficiently cooled by the refrigerant flowing through the refrigerant passage 23, so that the conducting member 71 does not easily reach a high temperature. Therefore, the resin connector 80 can be connected to the male terminal 71c provided at the other end of the conductive member 71 even when the electrostatic chuck 1 is used at high temperatures. Thereby, the external power supply and the electrostatic chuck 1 can be electrically connected stably via the connector 80 .

[Second embodiment]
Next, a second embodiment will be described with reference to FIGS. 6 and 7. FIG. In the second embodiment, the basic configuration is the same as in the first embodiment, except that the terminal member is not integrally formed with the plate-like member, and that an insulating sleeve (cylindrical member) surrounding the terminal member is provided. is different from the first embodiment. Therefore, the same reference numerals are given to the same configurations as in the first embodiment, and the description thereof is omitted as appropriate, and the description will focus on the differences from the first embodiment.

In the electrostatic chuck 1a of the present embodiment, as shown in FIGS. 6 and 7, the terminal member 70 is not integrally formed with the plate member 10, and the terminal pad 60 and the terminal pad 71a are joined by brazing. there is In other words, the end surface of the terminal member 70 and the plate-like member 10 (the bottom portion 15b of the bottomed hole 15) are in contact with each other, but are not joined. Therefore, there is a risk that a gap will be formed between the terminal member 70 and the plate member 10 . If a gap is formed between the terminal member 70 and the plate-like member 10, the gap between the terminal pad 60 or the conductive member 71 and the base member 20 or the bonding layer 40 (when composed of a metal bonding material) Insulation may become insufficient. In particular, there is a high risk of insufficient insulation in the power supply path to the chuck electrode 50 to which the highest voltage is applied among the internal electrodes. Note that the terminal member 70 of the present embodiment may be manufactured using a green sheet as in the first embodiment, or a metal member serving as the conductive member 71 may be placed in ceramic powder and heated, pressurized, or the like. It can also be produced by

Therefore, a cylindrical insulating sleeve 75 made of ceramics is arranged in the through hole 25 so as to surround the outer periphery of the terminal member 70 . The insulating sleeve 75 is formed integrally with the plate-like member 10 by diffusion-bonding the ends thereof to the plate-like member 10 (bottomed hole 15). By providing such an insulating sleeve 75, insulation between the terminal pad 60 or the conductive member 71 and the base member 20 or the bonding layer 40 (when composed of a metal bonding material) is ensured even at high temperatures. can be done.

The insulating sleeve 75 is joined to the base member 20 with an adhesive 76 in the vicinity of the lower surface 22 of the base member 20 . The terminal member 70 is joined to an insulating sleeve 75 with an adhesive 26 in the vicinity of the lower surface 22 of the base member 20 . As a result, heat transfer from the terminal member 70 to the low-temperature portion of the base member 20 can be accelerated through the adhesive 26, the insulating sleeve 75, and the adhesive 76, and the terminal member 70 (conducting member 71) can be effectively can be cooled effectively. Therefore, the resin connector 80 can be connected to the male terminal 71c provided at the other end of the conducting member 71 even at high temperatures. As a result, stable electrical connection between the external power supply and the electrostatic chuck 1a can be ensured via the connector 80 even at high temperatures.

Here, since there is a difference in thermal expansion between the material (ceramics) forming the insulating sleeve 75 and the material (metal) forming the base member 20, when the temperature of the electrostatic chuck 1a rises/falls, thermal The insulating sleeve 75 may be damaged by contacting the base member 20 due to the expansion difference.

Therefore, in the electrostatic chuck 1a of this embodiment, a gap 77 is formed between the insulating sleeve 75 and the base member 20 (see FIG. 7). The gap 77 may be set to such an extent that the insulating sleeve 75 does not come into contact with the base member 20 due to the difference in thermal expansion between the insulating sleeve 75 and the base member 20 (for example, about 0.1 to 2.0 mm). By forming such a gap 77, damage to the insulating sleeve 75 can be reliably prevented. Thus, the insulating sleeve 75 can ensure insulation between the terminal pad 60 or the conductive member 71 and the base member 20 or the bonding layer 40 (when composed of a metal bonding material).

As described above, according to the electrostatic chuck 1a of the present embodiment, the terminal member 70 is not integrally formed with the plate-like member 10, but the terminal pad 60 and the terminal member are connected by brazing the terminal pad 60 and the terminal pad 71a. 70 (conducting member 71) is connected, and an insulating sleeve 75 arranged so as to surround the terminal member 70 is diffusion-bonded to the plate-like member 10, and the insulating sleeve 75 and the plate-like member 10 are integrally formed. there is Therefore, even at high temperatures, the insulating sleeve 75 can ensure insulation between the terminal pad 60 or the conductive member 71 and the base member 20 or the bonding layer 40 (when composed of a metal bonding material).

Then, according to the electrostatic chuck 1a of the present embodiment, heat transfer from the terminal member 70 to the low-temperature portion of the base member 20 can be promoted through the adhesive 26, the insulating sleeve 75, and the adhesive 76. Therefore, the terminal member 70 (conducting member 71) can be effectively cooled. As a result, the connector 80 made of resin can be connected to the male terminal 71c provided at the other end of the conductive member 71 even at high temperatures. connection can be ensured.

It should be noted that the above-described embodiment is merely an example and does not limit the present disclosure in any way, and of course various improvements and modifications are possible without departing from the gist of the present disclosure. For example, in the above embodiment, the terminal pad 60 and the heater electrode 52 are connected via the connection pad 63, but the terminal pad 60 and the heater electrode 52 are directly connected via the via 61. good too.

In the above-described embodiment, when a breathable metal bonding material (metal mesh or the like) is used as the bonding layer 40, airtightness of the through holes 30 such as the lift pin insertion holes 30a and the gas holes 30b is ensured. I can't do it. Therefore, as shown in FIG. 8, it is preferable to arrange an insulating sleeve 75 in the through-hole 30 and bond the insulating sleeve 75 to the base member 20 with an adhesive 76 . This is because by doing so, the airtightness of the through hole 30 can be ensured.

Further, in the above-described embodiment, metal is exemplified as a material for forming the base member 20, but it is not limited to metal, and materials other than metal, such as ceramics (AlSiC, Si, etc.), may be used. Also good.

Furthermore, in the above-described embodiment, the plate-like member 10 and the base member 20 are bonded by the bonding layer 40, but the plate-like member and the base member are bonded by diffusion bonding without using a bonding agent. It's okay to be there. Also in this case, since a bonding layer made of a resin material is not used, it can be used at high temperatures (for example, 250° C. or higher).

1 Electrostatic chuck 10 Plate member 11 Holding surface 12 Lower surface 20 Base member 21 Upper surface 22 Lower surface 23 Coolant channel 23a Upper surface 25 Through hole 26 Adhesive 35 Gap 40 Bonding layer 50 Chuck electrode 52 Heater electrode 60 Terminal pad 70 Terminal member 71 Conductive member 72 Ceramic member 75 Insulating sleeve 76 Adhesive 77 Gap 80 Connector W Semiconductor wafer

Claims (5)

a first member having a first surface, a second surface provided opposite to the first surface, and terminal pads provided on the second surface and connected to internal electrodes;
a third surface, a fourth surface provided on the opposite side of the third surface, a through hole penetrating the third surface and the fourth surface, and a coolant channel through which a coolant flows; a second member comprising
a terminal member disposed inside the through-hole, comprising a conducting member having one end connected to the terminal pad and the other end connected to the connector;
a bonding layer disposed between the second surface of the first member and the third surface of the second member to bond the first member and the second member;
In a holding device that holds an object on the first surface of the first member,
The bonding layer is formed of an inorganic bonding material containing an inorganic material as a main component,
The holding device, wherein the terminal member is arranged between the coolant channels of the second member, and the conductive member is formed in a ceramic member. A holding device according to claim 1,
The holding device, wherein the terminal member is joined to the second member on the fourth surface side from the upper surface forming the coolant channel. In the holding device according to claim 1 or claim 2,
A holding device, wherein a gap is formed between the terminal member and the through hole. A holding device according to claim 1,
The conductive member is brazed to the terminal pad,
a cylindrical member arranged in the through hole so as to cover the outer periphery of the terminal member;
The holding device, wherein the cylindrical member is integrally formed with the first member. A holding device according to claim 4,
A holding device, wherein a gap is formed between the cylindrical member and the through hole.

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