JP2022540795A - 低インピーダンス電極構造 - Google Patents
低インピーダンス電極構造 Download PDFInfo
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Abstract
Description
(項目1)
電気生理学的測定用のカテーテルであって、
近位端及び遠位端を含むカテーテルシャフトと、
前記カテーテルに取り付けられているとともに、電子制御ユニット(ECU)に通信可能に接続されるように構成された導電体と、
前記導電体上に配置された電極と、
を備え、
前記電極の接触面領域は、インピーダンス低減層を含む、
カテーテル。
(項目2)
前記導電体は、フレキシブル回路に沿って配置されたトレースである、項目1に記載のカテーテル。
(項目3)
前記インピーダンス低減層は、白金コーティングである、項目1に記載のカテーテル。
(項目4)
前記白金コーティングは、白金イリジウムコーティングである、項目3に記載のカテーテル。
(項目5)
前記導電体の銅層と前記インピーダンス低減層との間に配置された金層をさらに備える、項目1に記載のカテーテル。
(項目6)
前記インピーダンス低減層は、前記インピーダンス低減層を有さない類似サイズの電極と比較して、前記電極におけるインピーダンスを少なくとも50パーセント低減するように構成されている、項目5に記載のカテーテル。
(項目7)
前記インピーダンス低減層は、1μm~30μmの間の厚さを有する、項目1に記載のカテーテル。
(項目8)
前記インピーダンス低減層は、前記電極の生体適合性を高めるように構成されている、項目1に記載のカテーテル。
(項目9)
前記インピーダンス低減層の前記接触面領域は、1.0mm2以下である、項目1に記載のカテーテル。
(項目10)
前記インピーダンス低減層の前記接触面領域は、0.5mm2以下である、項目1に記載のカテーテル。
(項目11)
前記インピーダンス低減層は、1μm~30μmの間の表面粗さを有する表面テクスチャを含む、項目1に記載のカテーテル。
(項目12)
低インピーダンス電極を含むカテーテルを作製する方法であって、
電子制御ユニット(ECU)に通信可能に接続されるように構成された導電体を前記カテーテルに取り付けることと、
前記導電体上にインピーダンス低減層を配置することであって、前記インピーダンス低減層は、組織と接触するための電極として構成される接触面領域を含むとともに、白金又は白金イリジウムを含む群から選択される材料を含む、前記インピーダンス低減層を配置することと、を備える方法。
(項目13)
フレキシブル回路は、前記導電体の銅層と前記インピーダンス低減層との間に配置された金層を含む、項目12に記載の方法。
(項目14)
前記インピーダンス低減層は、1μm~30μmの間の厚さを有する、項目12に記載の方法。
(項目15)
前記接触面領域が、1.0mm2以下である、項目12に記載の方法。
(項目16)
前記インピーダンス低減層に表面テクスチャを付与することをさらに含む、項目12に記載の方法。
(項目17)
前記表面テクスチャは、1μm~30μmの間の表面粗さを含む、項目16に記載の方法。
(項目18)
レーザを使用して、前記表面テクスチャを付与することをさらに含む、項目16に記載の方法。
(項目19)
前記導電体を前記カテーテルに取り付けることは、前記導電体を含むフレキシブル回路を前記カテーテルに取り付けることをさらに備える、項目12に記載の方法。
(項目20)
前記導電体を前記カテーテルに取り付けることは、前記導電体をバスケットカテーテルのスパインに取り付けることを備える、項目12に記載の方法。
Claims (20)
- 電気生理学的測定用のカテーテルであって、
近位端及び遠位端を含むカテーテルシャフトと、
前記カテーテルに取り付けられているとともに、電子制御ユニット(ECU)に通信可能に接続されるように構成された導電体と、
前記導電体上に配置された電極と、
を備え、
前記電極の接触面領域は、インピーダンス低減層を含む、
カテーテル。 - 前記導電体は、フレキシブル回路に沿って配置されたトレースである、請求項1に記載のカテーテル。
- 前記インピーダンス低減層は、白金コーティングである、請求項1に記載のカテーテル。
- 前記白金コーティングは、白金イリジウムコーティングである、請求項3に記載のカテーテル。
- 前記導電体の銅層と前記インピーダンス低減層との間に配置された金層をさらに備える、請求項1に記載のカテーテル。
- 前記インピーダンス低減層は、前記インピーダンス低減層を有さない類似サイズの電極と比較して、前記電極におけるインピーダンスを少なくとも50パーセント低減するように構成されている、請求項5に記載のカテーテル。
- 前記インピーダンス低減層は、1μm~30μmの間の厚さを有する、請求項1に記載のカテーテル。
- 前記インピーダンス低減層は、前記電極の生体適合性を高めるように構成されている、請求項1に記載のカテーテル。
- 前記インピーダンス低減層の前記接触面領域は、1.0mm2以下である、請求項1に記載のカテーテル。
- 前記インピーダンス低減層の前記接触面領域は、0.5mm2以下である、請求項1に記載のカテーテル。
- 前記インピーダンス低減層は、1μm~30μmの間の表面粗さを有する表面テクスチャを含む、請求項1に記載のカテーテル。
- 低インピーダンス電極を含むカテーテルを作製する方法であって、
電子制御ユニット(ECU)に通信可能に接続されるように構成された導電体を前記カテーテルに取り付けることと、
前記導電体上にインピーダンス低減層を配置することであって、前記インピーダンス低減層は、組織と接触するための電極として構成される接触面領域を含むとともに、白金又は白金イリジウムを含む群から選択される材料を含む、前記インピーダンス低減層を配置することと、を備える方法。 - フレキシブル回路は、前記導電体の銅層と前記インピーダンス低減層との間に配置された金層を含む、請求項12に記載の方法。
- 前記インピーダンス低減層は、1μm~30μmの間の厚さを有する、請求項12に記載の方法。
- 前記接触面領域が、1.0mm2以下である、請求項12に記載の方法。
- 前記インピーダンス低減層に表面テクスチャを付与することをさらに含む、請求項12に記載の方法。
- 前記表面テクスチャは、1μm~30μmの間の表面粗さを含む、請求項16に記載の方法。
- レーザを使用して、前記表面テクスチャを付与することをさらに含む、請求項16に記載の方法。
- 前記導電体を前記カテーテルに取り付けることは、前記導電体を含むフレキシブル回路を前記カテーテルに取り付けることをさらに備える、請求項12に記載の方法。
- 前記導電体を前記カテーテルに取り付けることは、前記導電体をバスケットカテーテルのスパインに取り付けることを備える、請求項12に記載の方法。
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