JP2022540471A - 積層方法及び製品 - Google Patents

積層方法及び製品 Download PDF

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Publication number
JP2022540471A
JP2022540471A JP2022501197A JP2022501197A JP2022540471A JP 2022540471 A JP2022540471 A JP 2022540471A JP 2022501197 A JP2022501197 A JP 2022501197A JP 2022501197 A JP2022501197 A JP 2022501197A JP 2022540471 A JP2022540471 A JP 2022540471A
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Japan
Prior art keywords
layer
contact layer
adhesive
ethylene
coc
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JP2022501197A
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English (en)
Japanese (ja)
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JP2022540471A5 (https=
Inventor
フォートマン、トーベン
ヨハンセン、ペーター
クリステンセン、ラース
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Danapak Flexibles AS
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Danapak Flexibles AS
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Publication date
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Publication of JP2022540471A publication Critical patent/JP2022540471A/ja
Publication of JP2022540471A5 publication Critical patent/JP2022540471A5/ja
Priority to JP2025091794A priority Critical patent/JP2025131666A/ja
Pending legal-status Critical Current

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    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Thermal Sciences (AREA)
  • Laminated Bodies (AREA)
  • Wrappers (AREA)
JP2022501197A 2019-07-11 2020-07-10 積層方法及び製品 Pending JP2022540471A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025091794A JP2025131666A (ja) 2019-07-11 2025-06-02 積層方法及び製品

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
EP19185793 2019-07-11
EP19185793.7 2019-07-11
DKPA202070248 2020-04-22
DKPA202070248 2020-04-22
PCT/DK2020/050212 WO2021004594A1 (en) 2019-07-11 2020-07-10 Laminate methods and products

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US20220274392A1 (en) 2022-09-01
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WO2021004594A1 (en) 2021-01-14
KR20220033492A (ko) 2022-03-16
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