JP2022526812A - Applicator with active back pressure controller - Google Patents

Abstract

The present disclosure describes methods and systems for controlling the distribution of adhesive from the applicator. This method involves pumping adhesive from multiple pump assemblies to multiple distribution modules and measuring the current drawn from each of the multiple pump assemblies. This method also individually determines the adjustments for each of the multiple pump assemblies based on the current drawn from each of the multiple pump assemblies, and individually adjusts the respective operating speeds of the multiple pump assemblies. Including doing. [Selection diagram] Fig. 1

Description

The present invention relates to an applicator for distributing an adhesive onto a substrate and components for controlling the pump assembly of the applicator.

A typical applicator for distributing an adhesive can include multiple distribution modules for distributing the adhesive onto a substrate. Such applicators also typically include a single pump assembly that pumps material through the applicator or a single drive that powers multiple pump assemblies. During operation, the applicator may be monitored to detect changes in the flow of adhesive through the applicator and allow the applicator operator to respond accordingly. These changes can be due to problems that occur within the applicator, such as clogging, wear of parts, and so on. In addition, these changes are the physics of the adhesive provided to the applicator, as it is not uncommon for suppliers to provide solid materials with slightly inconsistent physical properties within a batch or between separate batches. It may be due to inconsistency in quality. However, given that a single drive may pump the adhesive to each of the multiple distribution modules, the system will detect the change after the change in the flow of the adhesive has occurred in the applicator. , It may take a considerable amount of time for an appropriate response to be established. This can lead to inconsistencies and inaccuracies in the distribution process and can result in large volumes of waste products.

Therefore, there is an applicator for distributing the adhesive that allows it to monitor the flow of adhesive in the applicator and quickly adjust the operation of the applicator's pump assembly after changes occur in the applicator. is necessary.

An embodiment of the present disclosure is a distribution system for distributing an adhesive. The distribution system includes an applicator containing a manifold, a plurality of distribution modules coupled to the manifold, and a plurality of pump assemblies, each of the plurality of pump assemblies having a plurality of adhesives at their respective operating speeds. It is configured to pump to each one of the distribution modules of. The distribution system also includes a controller that signals and communicates with the applicator, which a) measures the current drawn from each of the multiple pump assemblies and b) draws the current of each of the multiple pump assemblies. Based on this, the adjustments for each of the operating speeds of the plurality of pump assemblies are individually determined, and c) each of the plurality of pump assemblies is configured to be instructed to individually adjust their operating speeds.

Another embodiment of the present disclosure is a method of controlling the distribution of the adhesive from the applicator. This method involves pumping adhesive from multiple pump assemblies to multiple distribution modules and measuring the current drawn from each of the multiple pump assemblies. The method also includes individually determining the adjustments for each of the multiple pump assemblies based on their respective current draws and individually adjusting the respective operating speeds of the multiple pump assemblies. ..

The disclosures mentioned above and the detailed description below will be better understood when read in conjunction with the accompanying drawings. The drawings show exemplary embodiments of the invention. However, it should be understood that the application is not limited to the exact arrangement and means shown.

It is a front perspective view of the distribution system by one Embodiment of this invention. It is a top view of the applicator of the distribution system shown in FIG. It is a rear view of the applicator shown in FIG. It is a side view of the applicator shown in FIG. FIG. 3 is a rear perspective view of the applicator shown in FIG. 1 with the recirculation pump assembly removed from the applicator. FIG. 3 is a bottom perspective view of the pump assembly used in the applicator shown in FIG. FIG. 6 is a top perspective view of the pump assembly shown in FIG. FIG. 6 is an exploded view of the pump assembly shown in FIG. FIG. 6 is a cross-sectional view of the pump assembly shown in FIG. It is a perspective view of the gear assembly used for the pump assembly shown in FIGS. 6-9. FIG. 3 is a perspective view of an alternative pump assembly that can be used in the applicator shown in FIG. FIG. 11 is an exploded view of the pump assembly shown in FIG. FIG. 3 is a perspective view of the applicator shown in FIG. 1 in a horizontal cross section. It is an enlarged view of the area surrounded by the circle shown in FIG. It is a schematic diagram which illustrates the method of adhesive recirculation by one Embodiment of this disclosure. FIG. 1 is a schematic representation of the distribution system shown in FIG. 1 with associated sensing components according to one embodiment of the present disclosure. FIG. 16 is a process flow diagram of a method for controlling the distribution of adhesive from the applicator and associated sensing components shown in FIG. FIG. 5 is a continuation of the process flow diagram of the method shown in FIG. 17 for controlling the distribution of adhesive from the applicator and associated detection components. FIG. 3 is a rear perspective view of an applicator according to another embodiment of the present invention.

Here, the distribution system 1 including the distribution modules 16a to 16f, the pump assemblies 20a to 20f, and the applicator 10 including the controller 7 for controlling the pump assemblies 20a to 20g will be described. Specific terms are used, but are not limited to, for convenience in the following description to describe the distribution system 1. The terms "right", "left", "bottom", and "top" specify the orientation in the referenced drawing. The terms "inside" and "outside" specify directions towards and away from the geometric center in the description, respectively, to describe the distribution system 1 and its related parts. The terms "forward" and "backward" specify vertical 2 along the distribution system 1 and its associated portions and the opposite direction to the vertical 2. Terms include the terms mentioned above, their derivatives, and terms with similar meanings.

Unless otherwise specified herein, the terms "vertical", "crossing", and "horizontal" are used in distribution system 1 as specified by vertical 2, horizontal 4, and cutting direction 6. Used to describe the direction of various components in Cartesian coordinates. Vertical 2 and horizontal 4 are shown to extend along a horizontal plane and cutting direction 6 is shown to extend along a vertical plane, while planes that include various directions are shown during use. Please understand that it may be different.

Embodiments of the present invention include a distribution system I comprising an applicator 10 for distributing an adhesive onto a substrate during product manufacture. Referring to FIGS. 1-5, the applicator 10 includes a manifold 12. The applicator 10 has a top surface 32, a bottom surface 30 facing the top surface 32 along the cutting direction 6, a first side surface 34a, and a second side surface 34a facing the first side surface 34a along the lateral direction 4. And a front surface 36, and a back surface 38 facing the front surface 36 along the vertical direction 2. The first side surface 34a and the second side surface 34b extend from the front surface 36 to the back surface 38 and from the bottom surface 30 to the top surface 32. The manifold 12 is defined by a first end plate 24, a second end plate 26, and at least one manifold segment 22 disposed between the first end plate 24 and the second end plate 26. To. As a result, the first end plate 24 and the second end plate 26 are arranged at intervals along the lateral direction 4. The first end plate 24 and the second end plate, as well as the manifold segment 22, are detachably connected so that they can be added to or removed from the applicator 10 depending on the operating conditions required for the manifold segment 22. Can be done. As a result, FIGS. 1 to 5 show the applicator 10 so as to include the three manifold segments 22a to 22c, but the applicator 10 includes more or even fewer manifold segments 22 as needed. Can include. However, in another embodiment, the manifold 12 may be a single manifold.

Referring to FIGS. 2-4, the first side surface 34a of the manifold 12 is in the first plane P1 and the second side surface 34b is in the second plane P2. The second plane P2 may be parallel to the first plane P1. However, when the first side surface 34a and the second side surface 34b are at an angle to each other, the first plane P1 and the second plane P2 do not have to be parallel to each other. The applicator 10 defines the horizontal plane X so that the horizontal direction 4 and the vertical direction 2 are located in the horizontal plane X. The pump assembly 20 may define a drive shaft A in a plane Y. The interrelationships between these planes and axes will be further described below.

The applicator 10 includes an input connector 14 through which an adhesive is press-fitted into the manifold 12. The adhesive can be pumped from the melter 3 to the input connector 14 via the hose 5, which receives the adhesive in solid form, melts the adhesive, and then applies the adhesive to the applicator 10. Can be configured to provide to. The applicator 10 may include a filter 13 (shown in FIG. 16) that filters the remaining solid components from the adhesive after the adhesive has entered the applicator 10. The manifold 12 may further include a pressure release valve 17 that allows the user to dampen the pressure generated by the adhesive in the manifold and a distribution module 16 for applying the adhesive to the substrate. Upon opening the pressure release valve 17, the adhesive can be drained from the manifold through a drain (not shown). The applicator 10 also includes a pump assembly 20 detachably attached to the manifold 12. The pump assembly 20 pumps the adhesive flowing from the internal flow path of the manifold 12 to the distribution module 16 and then distributes the adhesive from the applicator via the nozzle 21. The applicator 10 may include a thermal element 23 configured to raise the temperature of the manifold 12, which raises the temperature of the pump 40 in each pump assembly 20. 1 to 5 show the applicator 10 as including five thermal elements 23a to 23e, but may include any number of thermal elements 23 as needed.

In various embodiments, the applicator 10 includes a plurality of sets of pump assemblies 20, a distribution module 16, and a nozzle 21. For example, as shown in FIGS. 1-5, the applicator 10 is shown to include seven pump assemblies 20a, 20b, 20c, 20d, 20e, 20f, and 20g. Although the seven pump assemblies 20a-20g are illustrated in FIGS. 1-5, the applicator 10 can include any desired number of pump assemblies 20. For example, the applicator 10 can include two pump assemblies, three pump assemblies, or more than three pump assemblies. The pump assemblies 20a-20g can be arranged side by side to increase the processing width of the applicator 10. For clarity, a single pump assembly 20 is described below. However, the reference number 20 can be used interchangeably with the reference numbers 20a to 20g. Although the pump assemblies 20a-20g are shown in similar sizes, each of the individual pump assemblies 20 contained in the applicator 10 is individually sized as desired to suit a particular purpose. can do. For example, the recirculation pump assembly 20g described further below may be larger than the other pump assemblies 20a-20f.

Further, the applicator 10 is shown to include six distribution modules 16a, 16b, 16c, 16d, 16e, and 16f. Although FIGS. 1 to 3 illustrate the six distribution modules 16a to 16f, the applicator can include any number of distribution modules 16 as needed. For example, the applicator 10 can include one distribution module, two distribution modules, or more than two distribution modules. Similarly, a single distribution module 16 will be described below. However, the reference number 16 can be used interchangeably with the reference numbers 16a-16f. The applicator 10 is also shown to include six nozzles 21a, 21b, 21c, 21d, 21e, and 21f. Each of the nozzles 21a-21f may receive an adhesive supplied from the corresponding distribution module 16 or from several combinations of distribution modules 16a-16f. The configuration of the nozzles 21a-21f can be changed by the user according to the required operating conditions, to which additional nozzles 21 may be added or the nozzles 21a-to be already coupled to the applicator 10. Includes removing any of 21f. Further, the nozzles 21a-21f can be selected from different types to suit a particular distribution application. For example, as shown in FIG. 3, the nozzles 2la, 21b, 21e, and 21f may be one type of nozzle, and the nozzles 2lc and 21d may be different types of nozzles.

Continuing with reference to FIGS. 1-5, each pump assembly 20a-20f may be associated with a corresponding one of the distribution modules 16a-16f. During operation, each pump assembly 20a-20f pumps fluid supplied by the manifold 12 to the corresponding one of the distribution modules 16a-16f, with the distribution modules 16a-16f passing through nozzles 21a-21d to a predetermined value. An adhesive may be applied to the substrate. However, each distribution module 16 does not have to correspond to a single pump assembly 20 such that multiple pump assemblies 20 pump the adhesive to a single distribution module 16. Further, each of the pump assembly 20 and the distribution module 16 may be coupled to and associated with the respective manifold segment 22. However, the two or more pump assemblies 20 and / or the two or more distribution modules 16 may be coupled to a single manifold segment 22.

However, the pump assembly 20g is not associated with the particular distribution module 16 and is designated as a recirculation pump assembly. The function of the recirculation pump assembly 20g may include pumping the adhesive through the recirculation flow path 236, as described below. Therefore, the inlet 52 of the pump assembly 20g is in fluid communication with the recirculation flow path 236, and the outlet of the pump assembly 20g is in fluid communication with the supply flow path 200. The pump assembly 20g is shown as the pump assembly 20 located closest to the second side surface 34b, whereas the recirculation pump assembly 20g is located anywhere along the series of pump assemblies 20a-20g. can do. For example, the recirculation pump assembly 20g can be placed as the pump assembly closest to the first side surface 34a or in a central position of the pump assemblies 20a-20g. When the pump assembly 20g is arranged as the pump closest to the first side surface 34a or the second side surface 34b of the applicator 10, the first end plate 24 or the second end plate 26 with which the pump assembly 20g abuts. The specific one may be configured to accommodate a portion of the pump assembly 20g. For example, as shown in FIG. 5, the second end plate 26 includes a recess 25 sized to accommodate the housing assembly 42 of the pump assembly 20g. When the pump assembly 20g is arranged in the recess 25, the pump assembly 20g may be substantially aligned with the other pump assemblies 20a-20f along the longitudinal direction 2 and the cutting direction 6.

Further, in this embodiment, the pump assembly 20g is configured as the only recirculation pump assembly for the applicator 10, whereas in other embodiments, the applicator 10 is a plurality of recirculation pump assemblies (not shown). ) Can be included, each of which is contemplated to be similarly configured as a pump assembly 20g. For example, each distribution module 16 can accommodate a unique recirculation pump assembly. Alternatively, the applicator 10 may include a plurality of recirculation pump assemblies that collectively pump the adhesive through a single recirculation flow path. In another embodiment with multiple recirculation pump assemblies, each recirculation pump assembly can pump the adhesive through a separate recirculation flow path. Furthermore, in another embodiment, the applicator 10 can include a pump assembly that includes both the function of pumping the adhesive to the distribution module 16 as well as the function of pumping the adhesive through the recirculation flow path. Such a pump assembly can be configured as a single dual gear stack pump, one gear stack functioning to pump the adhesive to the distribution module 16 and the other gear stack recirculating flow. It functions to pump the adhesive through the path. Each gear stack can include one drive gear and one driven gear, and each gear stack can be contained within a common pump body. Alternatively, each gear stack can be housed in a separate pump body. Further, each gear stack may be driven by a common motor or independently by a separate motor.

Referring to FIGS. 6-10, each pump assembly 20a-20g includes a pump 40 and a dedicated drive motor unit 60 for supplying power to the pump 40. Since each pump 40 has a dedicated drive motor unit 60, each pump assembly 20 can be independently controlled by an operator and / or a control system (not shown). The pump assembly 20 also includes an adiabatic region 70 located between the pump 40 and the drive motor unit 60. The thermal element 23 can be used to raise the temperature of the manifold 12, which raises the temperature of the pump 40 in each pump assembly 20. The insulation region 70 minimizes heat transfer from the pump 40 to the drive motor unit 60, thereby minimizing the effect of temperature on the electronic components within the drive motor unit 60. Exposing the electronic components in the drive motor unit 60 to a sufficiently high temperature can damage the electronic components and make the drive motor unit 60 inoperable.

The drive motor unit 60 includes a motor 62, an output drive shaft 66, and one or more connectors (not shown) coupled to a power source (not shown). The drive motor unit 60 can include any type of gear that transmits rotational motion from the output drive shaft 66 of the motor to the input drive shaft (not shown) of the pump to achieve the desired rotational speed. It is connected to 67. In one embodiment, the gear assembly 67 includes a planetary gear train. The output drive shaft 66 has a drive shaft A around which the output drive shaft rotates.

With reference back to FIGS. 3 and 4, the pump assembly 20 may be attached to the manifold 12 in many different configurations. In one embodiment, the pump assembly 20 faces the manifold 12 at a position where the bottom surface 41 of the pump 40, including the inlet 52 and the outlet 54, is located away from the first side surface 34a and the second side surface 34b. Is attached to the manifold 12. In this configuration, the drive motor shaft A does not intersect either the first side surface 34a or the second side surface 34b of the applicator 10. Rather, the pump assembly 20 is on the manifold 12 such that the drive motor shaft A of the drive motor unit 60 is located on the plane Y parallel to the first plane P1 where the first side surface 34a is located, as described above. Is placed in. Further, the plane Y may be parallel to the second plane P2 in which the second side surface 34b is present. Each pump assembly 20a-20g has its own axis A in its respective plane that can be parallel to the first plane P1 and / or the second plane P2. Further, the pump assemblies 20a-20f can be arranged so that when attached to the manifold 12, each inlet 52 of the pump assemblies 20a-20f is located above the outlet 54 along the cutting direction 6. However, the recirculation pump assembly 20g can be attached to the manifold 12 such that the outlet 54 is located above the inlet 52 along the cutting direction 6.

Further referring to FIGS. 3 and 4, the pump assembly 20 is arranged on the manifold 12 such that the drive motor shaft A is oriented in any particular direction in the plane Y. For example, the pump assembly 20 can be positioned on the manifold 12 such that the drive motor shaft A is in the plane Y and is angled with respect to the plane X. For example, the pump assembly 20 can be positioned on the manifold 12 so that the drive motor shaft A defines an angle θ with the plane X. Any angle can be specified for the angle θ, if necessary. In one embodiment, the angle θ is an acute angle. Alternatively, the angle θ can be an obtuse angle, an angle greater than 180 degrees, or substantially 90 degrees.

Referring to FIGS. 6-10, the pump 40 includes a housing assembly 42 and a gear assembly 50 housed within the housing assembly 42. Alternatively, a plurality of gear assemblies 50 may be housed in the housing assembly 42. The housing assembly 42 further includes an inlet 52 configured to receive the adhesive from the manifold segment 22 and an outlet 54 to feed the adhesive back into the manifold segment 22. According to the embodiments shown in FIGS. 6 to 10, the inlet 52 and the outlet 54 of the pump 40 are defined by the bottom surface 41 of the pump 40 and oriented in a direction parallel to the drive motor shaft A of the drive motor unit 60.

The housing assembly 42 includes an upper plate 44a, a lower plate 44b, and a central block 46. The upper plate 44a and the lower plate 44b are separated from each other along a direction corresponding to the drive shaft A of the drive motor unit 60. The lower plate 44b defines a bottom surface 41 on which the drive shaft A can extend. The upper plate 44a, the central block 46, and the lower plate 44b are connected by bolts 48. The upper plate 44a has a plurality of holes 49a configured to receive the bolt 48, the central block 46 has a plurality of holes 49b configured to receive the bolt 48, and the lower plate 44b has a plurality of holes 49b. , Has a plurality of holes 49c configured to receive the bolt 48. The bolt 48, the hole 49a, the hole 49b, and the hole 49c can be screwed so that the holes 49a to 49c can screw the bolt 48.

The central block 46 has an internal chamber 56 sized to substantially match the outer shape of the gear assembly 50. In one embodiment, the gear assembly 50 includes a driven gear 55a and an idler gear 55b known to those of skill in the art. The driven gear 55a is connected to the output drive shaft 66 of the drive motor unit 60, and as a result, the driven gear 55a is rotated by the rotation of the output drive shaft 66, and subsequently the idler gear 55b is rotated. The driven gear 55a rotates about the _first shaft A1, and the idler gear 55c rotates about the _second shaft A2. In the case of FIG. 10, the _first axis A1 is shown coaxially with the drive motor axis A. However, the first shaft A ₁ may be offset from the drive motor shaft A. The gear assembly 50 may include an elongated gear shaft (not shown) coupled to the end of the output drive shaft 66 via a coupling (not shown). The gear shaft extends into the driven gear 55a and is keyed to actuate the driven gear 55a. A sealing member (not shown) such as a coating and / or casing can be placed around the elongated gear shaft to facilitate sealing of the gear assembly 50 and the internal chamber 56.

In use, the rotation of the driven gear 55a and idler gear 55b drives the adhesive in the pump 40 from the first portion 58a of the internal chamber 56 to the second portion 58b of the internal chamber 56. The adhesive is then delivered from the second portion 58b of the internal chamber 56 to the outlet 54. According to the illustrated embodiment, the driven gear 55a has a diameter D ₁ and a length L ₁ , and the length L ₁ may be larger than the diameter D ₁ . Similarly, the idler gear 55b has a diameter D ₂ and a length L ₂ , and the length L ₂ may be larger than the diameter D ₂ . Although a gear assembly 50 with two gears is shown, the pump can have a gear assembly with any number of gear configurations to generate the desired flow rate of adhesive through the pump 40. In these configurations, the central block 46 can be split to support the gear stack. In one embodiment, multiple gear assemblies (not shown) can be stacked along the pump input shaft. In this embodiment, the gear assembly can have different outputs that are combined to form a single output flow. In another embodiment, the gear assembly has different outputs, which are held separately and can provide multiple outputs via the bottom plate 44b and additional ports in the manifold 12.

Further referring to FIGS. 6-10, the insulation region 70 is defined by a insulation plate 72 and a gap 74 extending from the insulation plate 72 to the housing assembly 42. The pump assembly 20 includes a bolt 75 that connects the insulation plate 72 to the top of the housing assembly 42 so that a gap 74 is formed between the housing assembly 42 and the insulation plate 72. The insulation plate 72 plate is disposed around the bolt 75 and may include a plurality of spacers 76 located between the surface of the insulation plate 72 and the top plate 44a of the housing assembly 42. The spacer 76 may be integral with the insulation plate 72 or may be separable from the insulation plate 72 so that the gap 74 is adjustable. The spacer 76 may extend inward from the upper plate 44a in order to ensure alignment between the output drive shaft 66 and the driven gear 55a. The heat insulating plate 72 functions to prevent heat transfer from the pump 40 to the drive motor unit 60. To do this, the insulation plate 72 and spacer 76 are made of a material that has a lower thermal conductivity than the adhesive that forms the components of the housing assembly 42 of the drive motor unit 60 and the outer casing 61. Further, the spacer 76 separates the heat insulating plate 72 and the housing assembly 42 so that the heat insulating plate 72 and the housing assembly 42 have a gap 74, and minimizes direct contact between the housing assembly 42 and the drive motor unit 60. To.

Referring to FIG. 3, each of the pump assemblies 20a-20g is detachably attached to the manifold 12. In one embodiment, each pump assembly 20 is secured to the plate 28 via fasteners 27. One end of the plate 28 is attached to the first end plate 24 via the fastener 29, and the other end is attached to the second end plate 26 via another fastener 29. The fastener 29 can also attach the plate 28 to one of the manifold segments 22. The fastener 27 is screwed so that the fastener 27 needs to be loosened from the pump assembly 20 and the pump assembly 20 removed from the manifold 12 in order to remove the pump assembly 20 from the manifold 12. However, other methods of releasably attaching the pump assembly 20 to the manifold 12, such as slot and groove systems, snap fit engagement, etc. are conceivable. Since the pump assembly 20 can be releasably coupled to the manifold 12 as described above, the particular pump assembly 20 can be replaced individually without completely disassembling the entire applicator 10. The pump assembly 20 may need to be replaced for a variety of reasons, including cleaning, damage, or changing adhesive pumping conditions or requirements.

11 to 12 show another embodiment of the present invention. FIG. 13 shows the pump assembly 120, which is shown in FIGS. 1-9 and is largely similar to the pump assembly 20 described above. However, the pump assembly 120 has an inlet 152 and an outlet 154 that are oriented differently from the inlet 52 and outlet 54 of the pump assembly 20. The pump assembly 120 is configured to supply a liquid heated at a predetermined volume flow rate to the manifold 12. Each pump assembly 120 includes a pump 140 and a dedicated drive motor unit 160 that powers the pump 140. The pump assembly 120 also includes an insulation region 170 between the pump 140 and the drive motor unit 160. The heat insulating region 170 is defined by a heat insulating plate 172 and a gap 174 extending from the heat insulating plate 172 to the housing assembly 142. The insulation region 170 minimizes the heat transfer of heat generated by the pump 140 to the drive motor unit 160, thereby minimizing the effect of temperature on the electronic components within the drive motor unit 160. The dedicated drive motor unit 160 and the heat insulating area 170 are the same as the above-mentioned drive motor unit 60 and the heat insulating area 70 shown in FIGS. 6 to 9.

Further referring to FIGS. 11-12, the drive motor unit 160 includes a motor 162, an output drive shaft 266, a connector (not shown) coupled to a power source (not shown), and a control system 110. .. The drive shaft 166 has a drive shaft B on which the drive shaft 166 rotates. When the pump assembly 120 is connected to the manifold 12, the drive shaft B may intersect a plane X perpendicular to the plane Y or be angularly offset. In this configuration, the drive motor shaft B does not intersect either the first side surface 34a or the second side surface 34b of the manifold 12. Further, the drive motor shaft B does not intersect the bottom surface 30 of the manifold 12. Rather, in the pump assembly 120, the drive motor shaft B of the drive motor unit 160 is in a plane Y parallel to the first plane P1 and / or the second plane P2 of the first side surface 34a and the second side surface 34b, respectively. It is arranged on the manifold 12 so as to be located.

The pump 140 defines a bottom surface 141 and a side surface 143 into a housing assembly 142, one or more gear assemblies 150 housed within the housing assembly 142, an inlet 152 for receiving liquid from the manifold 12, and within the manifold 12. It has an outlet 154 for returning the liquid. According to the illustrated embodiment, the inlet 152 and the outlet 154 of the pump 140 are arranged on the side surface 143 of the pump 140, and the inlet 152 and the outlet 154 are oriented in a direction perpendicular to the drive motor shaft B of the drive motor unit 160. Will be done.

With reference to FIGS. 13 to 14, the flow path of the adhesive passing through the applicator 10 will be described. The flow of adhesive through a particular element is represented by the solid arrow shown in the relevant figure. The applicator 10 may be attached to the melter 3 by a hose 5 attached to the input connector 14 (as shown in FIG. 1). The adhesive flows from the melter 3 through the hose 5 and through the input connector 14 into the supply flow path 200 defined by the manifold 12 of the applicator 10. The supply flow path 200 can extend from the first side surface 34a through each of the manifold segments 22a to 22c to the second side surface 34b. However, the supply flow path 200 does not necessarily have to completely extend from the first side surface 34a to the second side surface 34b, and may be terminated at an internal position between the first side surface 34a and the second side surface 34b. good. Further, the supply channel 200 may optionally extend between other combinations on the surface of the manifold 12.

The manifold 12 includes a pressure release valve 17 that regulates the flow in the pressure release flow path (not shown) that communicates with the supply flow path 200. The pressure release valve 17 is shown to be located on the front surface 36 of the manifold 12. However, the pressure release valve can be placed as desired on any surface of the manifold 12. The pressure release valves 17 can be arranged alternately between the open position and the closed position. When the operator wants to release the adhesive pressure in the supply flow path 200, the pressure release valve 17 is switched from the closed position to the open position. In the open position, the adhesive flows out of the applicator 10 from the supply channel 200, through the pressure release channel, and through the drain (not shown). Pressure release is desired when the operator is about to initiate a service or maintenance operation on the applicator 10.

As the supply flow path 200 extends through the manifold 12, the adhesive is supplied to each of the pump assemblies 20a-22f, except for the designated recirculation pump assembly 20g. For simplicity, the cross section of the applicator 10 shown in FIGS. 13-14 shows only the supply of adhesive to one pump assembly 20 and one distribution module 16. However, each additional pump assembly 20 and distribution module 16 may be similarly supplied to the supply channel 200. The manifold segment 22 defines a first segment input flow path 204 extending from the supply flow path 200 to the divertor plate 208, the diverter plate 208 located on the applicator 10 between the pump assembly 20d and the manifold segment 22b. Can be done. The divertor plate 208 may be detachably coupled to the applicator 10 and may define various channels for carrying the adhesive from the manifold 12 to the pump assembly 20. For example, as shown in FIG. 13, the divertor plate 208 defines a divertor input flow path 212 extending from the first segment input flow path 204 to the inlet 52 of the pump assembly 20d. The divertor plate 208 may also define a divertor output flow path 216 extending from the outlet 54 of the pump assembly 20d to the second segment input flow path 220. However, the divertor plate 208 can include a flow path configuration different from that shown. The divertor plate 208 shown in FIG. 13 is one of many replaceable divertor plates that can be used to variably route the adhesive via the applicator 10 when different distribution operations are required. Can function as.

In the embodiments shown in FIGS. 13-14, the adhesive flows from the supply channel 200 to the inlet 52 of the pump assembly 20 via the first segment input channel 204 and the divertor input channel 212. The pump assembly 20 then pumps the adhesive at a predetermined volumetric flow rate from the outlet 54, which volumetric flow rate may be different from the volumetric flow rate of the adhesive as it enters the inlet 52 of the pump assembly 20. From there, the adhesive flows through the divertor output flow path 21, and through the second segment input flow path 220 and the distribution flow path 224. The distribution channel 224 is defined by the lower portion 18b of the distribution module 16 received by the manifold segment 22. The distribution flow path 224 defines an upper portion 224a, a lower portion 224c facing the upper portion 224a, and a central portion 224b arranged between the upper portion 224a and the lower portion 224c. The lower portion 224c of the distribution flow path 224 communicates fluidly with the nozzle flow path 228 extending away from the distribution flow path 224. The upper part 224a of the distribution flow path 224 communicates with the recirculation supply flow path 232 extending from the upper part 224a of the distribution flow path 224 to the recirculation flow path 236. The recirculation flow path 236 will be further described below.

The lower portion 18b of the distribution module 16 is a portion of the applicator 10 that interacts directly with the adhesive to control the outflow of the adhesive from the applicator 10. The applicator 10 may include a valve stem 260 extending from the upper 18a of the distribution module 16 facing the lower 18b of the distribution module 16 to the lower 18b of the distribution module 16. The valve stem 260 can define a lower valve element 264 and an upper valve element 272 spaced apart from the lower valve element 264 along the valve stem 260. The lower 18b of the distribution module 16 is spaced apart from the lower valve seat 268 configured to interact with the lower valve element 264 of the valve stem 260 and the lower valve seat 268, with the upper valve seat 276 being the valve stem. An upper valve seat 276 configured to interact with the upper valve element 272 of 260 may be defined.

During operation, the valve stem 260 may alternate between the first and second positions. When the valve stem 260 is in the first position, the distribution module 18 is in the open configuration. When the valve stem 260 is in the second position, the distribution module 16 is in a closed configuration. The upper valve element 272 and the lower valve element 264 are substantially opposite so as to interact with the upper valve seat 276 and the lower valve seat 268 so that they correspond differently in each of the first and second positions. It may be suitable for. In FIGS. 13-14, the upper valve element 272 is shown to face the upper 18a of the distribution module 16 and the lower valve element 264 is shown to face the upper 18a of the distribution module 16. .. However, in another embodiment, this relationship can be reversed so that the upper valve element 272 is directed towards the upper 18a of the distribution module 16 and the lower valve element 264 is directed away from the upper 18a of the distribution module 16. In one embodiment, in the first position, the valve stem 260 is lowered in the distribution flow path 224, the upper valve element 272 of the valve stem 260 engages the upper valve seat 276, and the lower valve element 264 is the lower valve seat. Separated from 268. At this position, the engagement of the upper valve element 272 with the upper valve seat 276 prevents the flow of adhesive from the central portion 224b of the distribution flow path 224 to the upper 224a. Rather, the lack of engagement between the lower valve element 264 and the lower valve seat 268 allows the adhesive to flow from the central portion 224b of the distribution channel 224 to the lower 224c. Thus, when the valve stem 260 is in the first position, the adhesive flows from the second segment input flow path 220 to the nozzle flow path 228 via the central portion 224b and the lower portion 224c of the distribution flow path 224. It flows. Then, from the nozzle flow path 228, the adhesive flows out of the applicator 10 through the nozzle 21. Therefore, the first position of the present embodiment is the position where the applicator 10 applies the adhesive to the substrate at the time of manufacturing.

In the second position, the valve stem 260 rises in the distribution channel 224, the upper valve element 272 of the valve stem 260 separates from the upper valve seat 276, and the lower valve element 264 engages the lower valve seat 268. At this position, the engagement of the lower valve element 264 with the lower valve seat 268 prevents the flow of adhesive from the central portion 224b of the distribution flow path 224 to the lower 224c. Rather, the lack of engagement between the upper valve element 272 and the upper valve seat 276 allows the adhesive to flow from the central portion 224b of the distribution channel 224 to the upper 224a. Therefore, in the second position, the adhesive flows from the second segment input flow path 220 to the recirculation supply flow path 232 via the central portion 224b and the upper portion 224a of the distribution flow path 224. The adhesive flows from the recirculation supply flow path 232 into the recirculation flow path 236. Although one distribution module 16 and a manifold segment 22 are shown in a cross-sectional view in FIGS. 13 to 14, each additional distribution module 16 and the manifold segment 22 may be similarly configured. Further, the valve stem 260 of each distribution module 16 can be configured to operate between the first and second positions independently of any of the other valve stems 260, as a result. At any time, the valve stem 260 of the distribution module 16 can be in any combination of the first and second positions. Alternatively, any combination of valve stems 260 may be configured to transition simultaneously between the first and second positions.

The ability to alternate the valve stem 260 between the particular first and second positions described above serves several purposes. One purpose is that a consistent flow of adhesive is not required or desired during the adhesive distribution operation. In this way, the operator of the applicator 10 must be able to selectively operate the distribution module 16 to provide and prevent the flow of adhesive to the substrate. Moving the valve stem 260 from the first position to the second position prevents the adhesive from coming out of the applicator 10, while moving the valve stem 260 from the second position to the first position. That allows the adhesive to come out of the applicator 10. Another object of the alternative valve stem 260 described above relates to the pressure in the flow path of the adhesive. When the valve stem 260 is in the first position, the adhesive can flow through the gap between the lower valve element 264 and the lower valve seat 268 and exit the applicator 10 through the nozzle 21. However, when the valve stem 260 is in the second position, the adhesive cannot flow through this gap. Therefore, there is a possibility that unused adhesive will be backed up in the distribution channel 224 and / or the second segment input channel 220. This backup can accumulate pressure within the applicator 10. This pressure can cause pattern deformation of the adhesive on the substrate, such as a hammer head, during the next transition of the valve stem 260 from the second position to the first position.

Including the recirculation channel 236 in the applicator 10 helps alleviate this problem. When the valve stem 260 is in the second position, the ability of the adhesive to flow from the central portion 224b of the distribution channel 224 to the top 224a and through the recirculation supply channel 232 to the recirculation channel 236 is distributed. It provides the adhesive with the ability to escape from the flow path 224. This alleviates any pressure rise that can occur when the valve stem 260 is in the second position, thus allowing the adhesive to flow through the nozzle 21 when the valve stem 260 is in the first position. Helps to standardize (by preventing glue hammerheads on the substrate, for example). However, this problem may not be completely solved only by adding the recirculation flow path 236. The adhesive flowing through the recirculation channel 236 essentially produces an amount of pressure within the recirculation channel 236. In a configuration in which the recirculation flow path 236 returns the adhesive to the inlet 52 of the pump assembly 20 or to the supply tank that supplies the adhesive to the applicator 10, the recirculation flow when the valve stem 260 is in the second position. There may be a difference between the pressure of the adhesive flowing through the path 236 and the pressure of the adhesive flowing through the distribution modules 16a-16f. This pressure difference can cause the flow rate of the adhesive flowing through the nozzle 21 to be non-uniform, which means that the volume of material entering the recirculation flow path 236 is valved in a second position at a particular moment. This is because it can change over time depending on which of the distribution modules having the stem 260.

FIG. 15 shows a process flow diagram showing a system for controlling the flow of adhesive through the recirculation flow path 236 to actively control this pressure difference. Solid lines and arrows indicate the flow of adhesive through the applicator 10, dashed lines and arrows indicate the transmission of information. The adhesive flows from the adhesive supply source (not shown) into the supply flow path 200 through a hose (not shown) coupled to the input connector 14 (FIG. 1) of the applicator 10. The adhesive flows at the first pressure as it flows through the supply channel 200. In order to detect the first pressure, the first pressure sensor 302 can be arranged in the supply flow path 200. The first pressure sensor 302 can be any type of pressure sensor capable of measuring the pressure of a fluid, such as a pressure converter. The first pressure sensor 302 can measure the first pressure of the adhesive as it flows through the supply flow path 200 to the pump assembly 20. The adhesive subsequently flows through the distribution pumps 20a-20f, which pump the adhesive to the distribution modules 16a-16f. The applicator 10 may include a plurality of pressure sensors 310a-310f, and each pressure sensor 310a-310f may be incorporated into or communicate with each one output of the pump assemblies 20a-20f. can. For example, the pressure sensor 310a may communicate with the output of the pump assembly 20a, the pressure sensor 310b may communicate with the output of the pump assembly 20b, and so on. Although any number of pressure sensors 310a to 310f can be considered, the number of these pressure sensors 310a to 310f can generally correspond to the number of pump assemblies 20a to 20f. In one embodiment, the pressure sensors 310a-310f are such that they detect the pressure of the adhesive pumped from the corresponding one of the pump assemblies 20a-20f to the corresponding one of the distribution modules 16a-16f. It may be a configured pressure sensor.

When the valve stem 260 of the distribution modules 16a-16f is in the first position, the adhesive flows out of the nozzle 21. Alternatively, when the valve stem 260 is in the second position, the adhesive flows into the recirculation flow path 236. The adhesive from each of the distribution modules 16a-16f flowing into the recirculation flow path 236 is directed to the recirculation pump assembly 20g. The adhesive flows at a second pressure as it flows through the recirculation flow path 236. A second pressure sensor 304 can be placed in the recirculation flow path 236 to detect the second pressure. The second pressure sensor 304, like the first pressure sensor 302, may be any type of pressure sensor capable of measuring the pressure of a fluid such as a pressure converter.

When the first and second pressures are measured, the first pressure sensor 302 and the second pressure sensor 304 transmit the first and second pressures to the controller 7. Further, the pressure sensors 310a to 310f can signal-communicate with the controller 7 and can transmit the detected pressure of the adhesive pressure-fed from the pump assemblies 20a to 20f to the controller 7. The controller 7 can be connected to the applicator 10 via a signal connection 8 which can include wired and / or wireless connections. The controller 7 can include one or more processors, one or more memories, input / output components, and a human-machine interface (HMI) device 7a, and may include any device that can include these components. can. The HMI device 7a can include a touch screen, a mouse, a keyboard, buttons, dials and the like. The input / output components can be configured to receive signals including the first and second pressures from the first pressure sensor 302 and the second pressure sensor 304 via the signal connection 8. The controller 7 can actively instruct the operation of the recirculation pump assembly 20g by using the pressure information received from the first pressure sensor 302, the second pressure sensor 304, and the pressure sensors 310a to 310f. .. Therefore, the pump assembly 20g can operate independently of the other pump assemblies 20a to 20f.

The recirculation pump assembly 20g functions to send the adhesive back from the recirculation flow path 236 to the supply flow path 200. The controller 7 automatically adjusts the rotation speed (RPM) of the drive motor in the control of the recirculation pump assembly 20g, so that the recirculation pump assembly 20g actively pumps the adhesive from the recirculation flow path 236. Control. As a result, in the controller 7, the recirculation flow path 236 and the pump assemblies 20a to 20f distribute the adhesive to each of the distribution modules 16a to 16f so that the recirculation flow path 236 and the pump assemblies 20a to 20f are detected by the respective pressure sensors 310a to 310f in the recirculation pump assembly 20g. It can be instructed to pump the adhesive at a flow rate sufficient to control the pressure difference to and from the pressure pumped to. In one embodiment, the recirculation pump assembly 20g is a pump assembly 20a-20f such that the second pressure of the adhesive flowing through the recirculation flow path 236 is detected by each of the pressure sensors 310a-310f. Can be substantially equal to the pressure with which the adhesive is pumped into each of the distribution modules 16a-16f. The recirculation flow path 236 itself reduces the pressure difference between the material recirculated from the distribution modules 16a-16f and the material entering the distribution modules 16a-16f, while the recirculation pump assembly 20g is a recirculation flow. The adhesive that functions to actively control the difference between the pressure of the adhesive flowing through the path 236 and the pressure of the adhesive flowing through the distribution modules 16a-16f and is applied to the substrate through the nozzle 21. Can help increase the continuity of the volume output of. The controller 7 can autonomously control the operation of the recirculation pump assembly 20g to equalize these pressures, while the operator of the applicator 10 can either via user input received by the controller 7 or. By executing the program stored in the memory of the controller 7, the operation of the recirculation pump assembly 20g can be arbitrarily controlled manually. Further, in addition to pressure equalization, in certain embodiments, a recirculation pump assembly 20g is utilized between the pressure of the recirculation flow path 236 and the adhesive provided to the individual distribution modules 16a-16f. It may be desirable to generate an unequal relationship to ensure optimal pattern and flow conditions for a particular adhesive or substrate.

Although shown in FIGS. 1 to 5 in a state of being attached to the manifold 12, the recirculation pump assembly 20 g may be separated from the manifold 12. In this configuration, the recirculation pump assembly 20g is connected to the manifold 12 via one or more hoses, allowing the pump assembly 20g to receive the adhesive from the manifold 12 and pump the adhesive. For example, one hose can guide the adhesive from the recirculation flow path 236 to the recirculation pump assembly 20g, while the other hose can guide the adhesive from the recirculation pump assembly 20g to the supply flow path 200.

The presence of a dedicated recirculation pump assembly 20g for actively adjusting the pressure of the adhesive flowing through the recirculation flow path 236 of the applicator 10 may simplify the overall structure of the applicator 10. For example, the recirculation pump assembly 20g does not require a second hose to connect the recirculation flow path 236 to the adhesive source (not shown). In addition, the applicator 10 is better adapted to different applications. As client requirements change, the recirculation pump assembly 20g is similarly adapted to actively regulate the pressure in the applicator 10, resulting in the recirculation flow path 236 and the distribution modules 16a-16f. The pressure difference to and from the adhesive pumped to is minimal or remains absent, with or without application.

The presence of the recirculation pump assembly 20g further helps maintain a tighter tolerance for the flow rate of the adhesive flowing out of the applicator 10 through the nozzle 21. Despite the intermittent operation of the distribution module 16, by actively adjusting the pressure of the adhesive in the recirculation flow path 236, the flow rate is the adhesive and the adhesive in the recirculation flow path 236 at any time. A controllable and consistent flow rate of the adhesive flowing out of the applicator 10 is possible, as opposed to being a function of the pressure of the adhesive pumped into the distribution modules 16a-16f. This constant flow rate helps reduce the costs incurred during the distribution operation, especially on substrates to which the adhesive is applied. Some substrates are more susceptible to the effects of pattern deformation of the adhesive applied to the substrate, but some substrates are more sensitive to such changes in the flow of the adhesive. Differences in these flow rates can result in substrate deformation or "total loss". By actively adjusting the pressure of the adhesive using the recirculation pump assembly 20g to ensure a constant flow rate, the waste of the substrate can be avoided and therefore the operating cost of the applicator 10. Can be reduced.

Further referring to FIG. 16, a schematic diagram of the distribution system 1 for controlling the operation of the pump assemblies 20a-20g is shown, where the solid line shows the flow of adhesive and the dashed line shows the signal transmission. Although only pump assemblies 20a, 20b, and 20g are shown in FIG. 16, the features and functions described below for pump assemblies 20a, 20b, and 20g are equally applicable to each pump assembly 20a-20g. .. The components including the applicator 10 are shown schematically within the dashed line labeled with reference number 10. As shown, the adhesive is melted by the melter 3, and the supply flow path 200 of the applicator 10 configured to provide the adhesive to each of the plurality of pump assemblies 20a to 20f via the filter 13. Directed to. The applicator 10 includes a first pressure sensor 302 configured to measure the pressure of the adhesive flowing through the supply channel 200 and send a signal to the controller 7 via a signal connection 8 representing that pressure. be able to. Although the pressure sensor 302 can be a pressure converter, it is believed that any conventional pressure sensor suitable for measuring the pressure of a fluid can be utilized. Pressure transducers include devices that convert pressure into analog electrical signals. Various types of pressure transducers such as capacitive pressure transducers, digital output pressure transducers, voltage / current output pressure transducers, etc. can be utilized.

After the adhesive has passed through the supply channel 200, the adhesive can be directed to each of the pump assemblies 20a-20f. As described above, each of the pump assemblies 20a-20f is configured to pump the adhesive to each of the distribution modules 16a-16f. Thus, each of the pump assemblies 20a-20f can pump the adhesive at a respective operating rate that can be the same as or different from any of the other pump assemblies 20a-20f. As described above, the applicator 10 is configured to detect the pressure of the adhesive pressured by the respective distribution modules 16a to 16f and transmit a signal to the controller 7 via a signal connection 8 representing those pressures. A plurality of pressure sensors 310a to 310f can be included. Therefore, the operating speed of any of the pump assemblies 20a to 20f can be individually adjusted by the controller 7 that signals and communicates with each of the pump assemblies 20a to 20f. The controller 7 can be configured to detect the respective current draws of the plurality of pump assemblies 20a to 20f. The current drawn from each of the pump assemblies 20a-20g is forced through the distribution process to draw more or less current in a predetermined order so that the pump assemblies 20a-20g maintain a particular operating rate. Can fluctuate. This variation in current draw can indicate to the user changes within the applicator 10, such as changes in the viscosity of the material.

After supplying the material to the distribution modules 16a-16f, each distribution module 16a-16f is configured to selectively distribute the material from the applicator 10. In particular, as described above, each of the distribution modules 16a-16f transitions back and forth along a linear path, also called a valve stroke, to control the flow of adhesive from each of the plurality of distribution modules 16a-16f. Each valve stem 260 configured to include. Similar to the pump assemblies 20a-20f, the distribution modules 16a-16f may be affected by changes in the distribution system 1, such as clogging or characteristic changes in the material flowing through the distribution system 1. In particular, the length of time required for each valve stem 260 to travel through the full stroke length can be affected. To monitor this, the applicator 10 measures the instantaneous position of the valve stem 260 of the corresponding one of the distribution modules 16a-16f and sends a signal to the controller 7 via a signal connection 8 representing the instantaneous position. Can include a plurality of position sensors 314a to 314f configured in. The position sensors 314a-314f may be optical fiber sensors configured to measure changes in the intensity of light reflected from the components connected to the respective valve stems 260, but the instantaneous positions of the valve stems 260. It is believed that any conventional position sensor suitable for measuring is available. Although only the position sensors 314a and 314b are shown, the applicator 10 can include position sensors 314a to 314f corresponding to the respective distribution modules 16a to 16f. For example, the position sensor 314a may be configured to measure the instantaneous position of the valve stem 260 of the distribution module 16a, and the position sensor 314b may be configured to measure the instantaneous position of the valve stem 260 of the distribution module 16b. Can be etc. The valve stroke can fluctuate throughout the distribution process as the fluid properties of the adhesive change, clog, or accumulate dry material within the applicator 10.

As mentioned above, they can direct the material to the recirculation channel 236 while the distribution modules 16a-16f do not distribute the material from the applicator 10. The recirculation flow path 236 can return the recirculation flow material from the distribution modules 16a to 16f to the supply flow path 200. Similar to the first pressure sensor 302 associated with the supply channel 200, the applicator 10 measures the pressure of the adhesive flowing through the recirculation channel 236 and the controller via a signal connection 8 representing that pressure. A second pressure sensor 304 configured to send a signal to 7 can be included. The second pressure sensor 304 may be a pressure transducer, but it is believed that any conventional pressure sensor suitable for measuring the pressure of the fluid can be utilized.

As described above, the recirculation pump assembly 20g pumps material through the recirculation flow path 236, or controls the flow of adhesive through the recirculation flow path 236. The controller 7 can signal and communicate with the recirculation pump assembly 20g via the signal connection 8 and is configured to detect the current draw of the recirculation pump assembly 20g. The current drawn from the recirculation pump assembly 20g can fluctuate throughout the distribution process as the recirculation pump assembly 20g is more or less forcibly drawn to maintain a particular recirculation material flow rate. This fluctuation in current draw can indicate to the user changes in the applicator 10, such as changes in the viscosity of the material and clogging in the recirculation flow path 236.

The applicator 10 is also configured to detect other aspects of the pump assembly 20a-20f and the recirculation pump assembly 20g other than the suction current, respectively, for accurate monitoring of material flow. 311f and 31 lg of recirculation pump sensor can be included. For example, the pump sensors 311a-311f and the recirculation pump sensor 311g are the motor torque and operating speed of the pump assemblies 20a to 20f and the recirculation pump assembly 20g, or the adhesive flowing out from the pump assemblies 20a to 20f and the recirculation pump assembly 20g. Can include sensors that measure the pressure of the pump, as well as send signals representing these various measurements to the controller 7. Therefore, the pump sensors 311a to 311f and the recirculation pump sensor 311g can be an optical encoder or a Hall effect sensor. Measurements of these coefficients can be performed continuously or intermittently by the pump sensors 311a-311f and the recirculation pump sensor 311g, which can be selected or changed by the operator.

Further referring to FIG. 16, as described above, the applicator 10 may include a manifold 12 of the applicator 10 and similarly, a plurality of thermal elements 23 for heating the material flowing through the applicator 10. can. The heating element 23 can be a cartridge type, a capton wire, an inset type, or an induction coil heating element, but any type of conventional heater can be considered. The thermal element 23 can function to keep the material at a high temperature, which helps maintain the fluid properties of the material and thus allows the material to easily pass through the applicator. Many conventional applicators have a single thermal element and therefore define only a single heating zone. However, the thermal element 23 can form multiple heating zones throughout the applicator 10 so that heating within a particular portion of the applicator 10 can be controlled more locally and accurately. The thermal element 23 can be placed at various positions throughout the applicator 10 so that the material is uniformly heated as it flows through the applicator 10. Although only two thermal elements 23 are shown schematically, the applicator 10 can include one, three, four, or five or more thermal elements 23. The applicator 10 can also include a plurality of thermal sensors 318, each thermal sensor 318 corresponding to each of the plurality of thermal elements 23. The thermal sensor 318 may communicate with the material in fluid so as to detect the temperature of the material in the vicinity of the corresponding thermal element 23 and transmit a thermal signal representing the temperature of the material to the controller 7. The thermal sensor 318 may be a nickel or platinum resistance temperature detector or a thermocouple, but any type of conventional thermal sensor can be considered. The controller 7 can utilize the measurements from the thermal sensor 318 to determine material properties such as material viscosity.

A first controller 7 corresponds to various parameters of the adhesive and components in the applicator 10 to determine how to control the pump assemblies 20a-20f, the recirculation pump assembly 20g, and the thermal element 23. It can be configured to receive signals from the pressure sensor 302, the second pressure sensor 304, the pressure sensors 310a-310f, the position sensors 314a-314f, and the thermal sensor 318. In particular, the controller 7 individually determines the adjustments for the operating speeds of the plurality of pump assemblies 20a-20f based on their respective current draws, and then on each of the plurality of pump assemblies 20a-20f. You can instruct the operating speed to be adjusted individually. An increase or decrease in current draw can indicate to the operator that a change within the applicator 10 has occurred, such as a change in the properties of the adhesive. As a result, the operator may consider it desirable to increase or decrease the operating speed of any of the pump assemblies 20a-20f in order to maintain the consistency of distribution.

Adjustments to any of the operating speeds of the pump assemblies 20a-20f are automatic by the controller 7 when they detect a deviation between the intended or preset current draw and the actual current draw detected by the controller 7. Can be done. Alternatively, the controller 7 may attach the respective pump assemblies 20a to 20f to each of the plurality of pump assemblies 20a to 20f so as to individually adjust their operating speeds when the currents of the plurality of pump assemblies 20a to 20f are out of a predetermined range. It can be configured to indicate. For example, this range is about plus or minus 0.1-10 amps, but a typical value can be about 0.25 amps. Therefore, this range defines the permissible range in which the current current draw changes. Such ranges may be preselected by the operator or automatically determined by the controller 7 based on factors such as the material to be distributed, the distribution operation performed, the substrate on which the material is distributed, and the like. To preselect this range, the HMI device 7a can be configured to receive user input that allows the operator to manually select a predetermined range. Also, the operator is free to adjust the range at any time during the distribution process. The HMI device 7a adjusts the operating speeds of the respective pump assemblies 20a to 20f when they are out of the predetermined range, and the HMI device 7a at least one of the plurality of pump assemblies 20a to 20f. It can also be configured to issue a warning when the draw current is out of a predetermined range. The warning can notify the operator of the problem in the applicator 10 and notify the operator that human intervention is required to correct the problem. Similarly, the controller 7 instructs the plurality of pump assemblies 20a to 20f to individually adjust their operating speeds when the current draws of the plurality of pump assemblies 20a to 20f are out of a predetermined range, and the plurality of pump assemblies 20a to 20f. Each can also be configured to instruct them to maintain their operating speed when their respective current draws are within a predetermined range. Thereby, the pump assemblies 20a-20f continue to operate despite slight fluctuations in current that may indicate a problem that is not significant to the extent that it has little effect on the quality or consistency of the distributed material. be able to.

Although the adjustment for the pump assemblies 20a to 20f is specifically described, the recirculation pump assembly 20g can operate in the same manner. The controller 7 is configured to determine an adjustment to the operating speed of the recirculation pump assembly 20g based on the draw current from the recirculation pump assembly 20g detected by the controller 7. Adjustments to the operating speed of the recirculation pump assembly 20g are made when a deviation between the intended or preset current draw and the actual current draw measured by the controller 7 is detected, or the measured current draw. When it is out of the predetermined operating range, it can be automatically performed by the controller 7. Similarly, the controller 7 can be configured to instruct the pump 20g to maintain its operating rate when the current draw of the recirculation pump assembly 20g is within a predetermined range.

The adjustment of the operating speeds of the pump assemblies 20a-20f and the recirculation pump assembly 20g has been described above in consideration of their respective current draws, but the controller 7 also considers various other measurements in making these decisions. be able to. For example, the controller 7 adjusts the operating speeds of the plurality of pump assemblies 20a to 20f and the recirculation pump assembly 20g based on the pressure of the adhesive flowing through the supply flow path measured by the first pressure sensor 302. It can be configured to be determined individually. Further, the controller 7 has, as measured by the second pressure sensor 304, each of the plurality of pump assemblies 20a-20f and the recirculation pump assembly 20g based on the pressure of the adhesive flowing through the recirculation flow path. It can be configured to individually determine the adjustment to the operating speed of. Further, the controller 7 operates each of the plurality of pump assemblies 20a to 20f and the recirculation pump assembly 20g based on the pressure of the adhesive pumped to the distribution modules 16a to 16f as measured by the pressure sensors 310a to 310f. It can be configured to individually determine the adjustment for speed.

In addition to determining adjustments to the operating speed of the pump assemblies 20a-20f and the recirculation pump assembly 20g, the controller 7 can also process measurements made by various sensors, with the removal process and predetermined values. It is also possible to identify specific defects present in the applicator 10 through the comparison of. For example, based on the measurements made by the pressure sensors 302, 304, the pressure sensors 310a-310f, the position sensors 314a-314f, and the thermal sensor 318, the controller 7 identifies a particular problem occurring within the applicator 10. Can be done. If a particular problem is identified by the controller 7, the controller 7 will automatically make adjustments to address the problem, indicate the problem to the operator via the HMI device 7a, and the operator will manually correct the problem. Can generate warnings that allow you to take. Alerts include noise, vibration, light output, and text notifications.

For example, the speed of the pump assemblies 20a to 20f is less than a predetermined set value, the current draw of the pump assemblies 20a to 20f increases, the pressure detected by the pressure sensors 310a to 310f increases, and any of the thermal sensors 318. If the temperature detected by the controller 7 is less than the set value, the controller 7 can recognize the cause of these factors as an increase in the viscosity of the adhesive. Conversely, when the speed of the pump assemblies 20a to 20f exceeds a predetermined set point, the current draw of the pump assemblies 20a to 20f decreases, the pressure detected by the pressure sensors 310a to 310f decreases, and any of the heat sensors When the temperature detected by 318 exceeds the set value, the controller 7 can recognize these factors as a decrease in the viscosity of the adhesive. As the draw currents of the pump assemblies 20a-20f increase and the pressure detected by the pressure sensors 310a-310f increases, the controller 7 can recognize the cause of these factors as a blockage in at least one of the nozzles 21. .. If the pressure detected by the pressure sensors 310a-310f rises and the temperature detected by any of the thermal sensors 318 falls below the set value, the controller 7 causes one or more thermal factors to cause these factors. It can be recognized as a failure of 23. When the speed of the pump assemblies 20a to 20f is lower than the predetermined set value, the current draw of the pump assemblies 20a to 20f increases, and the pressure detected by the pressure sensors 310a to 310f decreases, the controller 7 causes these factors. Can be recognized as a poor control of the pump assemblies 20a to 20f. In a situation where the speeds of the pump assemblies 20a-20f are both above and below a predetermined set point and the current draw of the pump assemblies 20a-20f assembly increases, the controller 7 causes these factors in the pump assemblies 20a-20f. It can be recognized as a control failure.

Further, when the current draw of the pump assemblies 20a to 20f is reduced, the pressure detected by the pressure sensors 310a to 310f is reduced, and the temperature detected by any of the thermal sensors 318 exceeds the set value, the controller 7 sets the controller 7. The cause of these factors can be recognized as a failure in the control of the thermal element 23. The current draw in the pump assemblies 20a-20f is reduced, the pressure detected by the pressure sensors 310a-310f is reduced, and the time the valve stem 260 of any of the distribution modules 16a-16f is in the first position is the position sensor. If above the nominal value as detected by 314a-314f, the controller 7 recognizes the cause of these factors as an increase in the time interval during which the solenoid (unlabeled) is operating the valve stem 260. Can be done. The current draw in the pump assemblies 20a-20 increases, the pressure detected by the pressure sensors 310a-310ff increases, and the time the valve stem 260 of any of the distribution modules 16a-16f is in the first position is the position sensor. If it is less than the nominal value as detected by 314a-314f, the controller 7 causes these factors to be due to a decrease in the interval at which the solenoid is operating the valve stem 260 or a failure of one of the valve stem 260. Can be recognized as. A situation in which the current draw in the pump assemblies 20a-20f is reduced and the time that the valve stem 260 of any of the distribution modules 16a-16f is in the first position exceeds the nominal value as detected by the position sensors 314a-314f. Then, the controller 7 can recognize the cause of these factors as the consumption of the components of the distribution modules 16a to 16f. Although the multiple problems that can occur within the applicator 10 and the potential causes of these problems are described above, this list includes both the types of problems that controller 7 can recognize and the potential causes of these problems. Is not intended to cover.

Further referring to FIGS. 17-18, a method 400 of controlling the distribution of the adhesive from the applicator 10 is described using the components described in connection with FIG. Method 400 includes step 402, where the adhesive is melted by the melter 3. At any time during, while the melter 3 melts the adhesive, before or after the melter 3 melts, the operator in step 406, pump assembly 20a-20f and / or recirculation pump assembly 20g. A predetermined tolerance for current draw can be manually entered. Alternatively, the allowable range can be determined by the controller 7 based on the adhesive to be distributed, the specific distribution operation to be performed, and the like. In step 412, the melter 3 can supply the melted adhesive to the applicator 10 via, for example, a hose 5. Once the applicator 10 receives the melted adhesive, in step 414 the adhesive is directed at the pump assemblies 20a-20f through the supply channel 200. In step 418, the first pressure sensor 302 measures the pressure of the adhesive flowing through the supply channel 200 and measures the measured pressure while the adhesive is being guided through the supply channel 200. The represented signal can be sent to the controller 7.

After step 418, the adhesive is pumped to the distribution modules 16a-16f via pump assemblies 20a-20f, respectively, in step 422. In step 424, the pressure sensors 310a-310f can measure the pressure of the adhesive pumped to the distribution modules 16a-16f by the pump assemblies 20a-20f. The controller 7 can utilize the pressure of the material flowing through the distribution modules 16a-16f to determine the adjustment for each operating speed of the plurality of pump assemblies 20a-20f and the recirculation pump assembly 20g. As described above, the distribution modules 16a to 16f are configured to selectively distribute the adhesive onto the substrate by the reciprocating motion of the respective valve stems 260 of the distribution modules 16a to 16f. When the valve stem 260 prevents the adhesive from being applied to the substrate, the adhesive is pumped from the plurality of distribution modules 16a-16f via the recirculation flow path 236 and in step 426 the recirculation pump assembly 20g. It returns to the supply flow path 200 via. As a result, the adhesive is recirculated through the applicator 10 and supplied to the pump assemblies 20a to 20f again. In step 430, the second pressure sensor 304 applies the pressure of the adhesive flowing through the recirculation flow path 236 while the adhesive is pumped through the recirculation flow path 236 by the recirculation pump assembly 20g. A signal representing the measured pressure can be sent to the controller 7. Similar to the pressure of the material flowing through the supply flow path 200, the controller 7 utilizes the pressure of the material flowing through the recirculation flow path 236 measured by the pressure sensor 304 to adjust the operating speed of each of the plurality of pump assemblies. Can be decided.

In step 434, the controller 37 can measure the current drawn from each of the pump assemblies 20a-20f while the pump assemblies 20a-20f pump the adhesive. The current draw of any of the pump assemblies 20a-20f may fluctuate over time in response to changing conditions within the applicator 10 in order to maintain a consistent set operating rate for each pump assembly 20a-20f. can. Following or simultaneously with step 434, in step 438, the pump sensors 311a-311f relate to the pump assemblies 20a-20f, such as the motor torques, operating speeds, and pump pressures of the plurality of pump assemblies 20a-20f, respectively. Parameters can be measured. After steps 434 and / or 438 have been performed, in step 442 the controller 7 can determine adjustments to the operating speed of each pump assembly 20a-20f based on their respective current draws. This adjustment can be individually determined by the controller for each of the pump assemblies 20a-20f and may be based on each of their unique measured motor torque, operating speed, pump pressure, etc., in addition to current draw. can. In one embodiment, step 442 may include determining an adjustment to the operating speed of the pump assemblies 20a-20f only if the current draw of any of the pump assemblies 20a-20f is outside the predetermined range. .. As mentioned above, this range can be about plus or minus 0.1-10 amps, but other ranges are possible. Similarly, step 442 can include maintaining the respective operating speeds of the plurality of pump assemblies 20a-20f when their respective current draws are within a predetermined range.

After the adjustments to the operating speeds of the pump assemblies 20a-20f are determined in step 442, in step 446 the controller 7 is assigned to the pump assemblies 20a-20f to individually adjust their respective operating speeds according to the determined adjustments. Can be instructed. Adjust the operating speed of any number of pump assemblies 20a-20f according to the measurements made by the first sensor 302 and the second sensor 304, and the pressure sensors 310a-310f, as well as the decisions made by the controller 7. Or can be maintained. Warning at step 450 at any time after step 442 is performed, and at the same time, before or after step 446, when the current draw of one of the plurality of pump assemblies 20a-20f is out of the predetermined range. Can be generated. This warning can be generated by the HMI device 7a and can notify the operator that the current of one of the plurality of pump assemblies 20a-20f is out of the predetermined range, noise, vibration, light. It can take the form of output, text notifications, or any other type of conventional warning.

Further referring to FIG. 18, in step 454, the controller 7 determines the current drawn from the recirculation pump assembly 20g while the recirculation pump assembly 20g pumps the adhesive through the recirculation flow path 236. At the same time, a signal indicating a current draw of 20 g of the recirculation pump assembly can be transmitted to the controller 7. The current draw of any of the recirculation pump assemblies 20g varies over time in order to maintain a constant set operating rate of the recirculation pump assembly 20g in response to varying conditions within the applicator 10. be able to. Following or at the same time as step 454, in step 458, the pump sensor 311g measures other parameters related to the recirculation pump assembly 20g, such as motor torque, operating speed, and pump pressure of the recirculation pump assembly 20g. be able to. After steps 454 and / or 458 have been performed, in step 462 the controller 7 can determine adjustments to the operating speed of the recirculation pump assembly 20g based on its current pull-in amount. This adjustment can be made based on the motor torque, operating speed, pump pressure, etc., in addition to the current draw, and can also be made based on the pressure measured by the pressure sensors 310a-310f. In one embodiment, step 462 can include determining adjustments to the operating speed of the recirculation pump assembly 20g only if the current draw of the recirculation pump assembly 20g is outside the predetermined range. As mentioned above, this range can be about plus or minus 0.1-10 amps, but other ranges are possible. Similarly, step 462 can include maintaining the operating speed of the recirculation pump assembly 20g when the current draw is within a predetermined range. After the adjustment to the operating speed of the recirculation pump assembly 20g is determined in step 462, in step 466 the controller 7 can instruct the recirculation pump assembly 20g to adjust the operating speed according to the determined adjustment. ..

In step 470, the thermal sensor 318 located in the vicinity of the thermal element 23 measures the temperature of the adhesive at different positions throughout the applicator 10 and sends a thermal signal representing the temperature of the adhesive to the controller 7. Can be configured. This measurement step can be performed at any time with respect to steps 402-466 described above so that the controller 7 can be performed simultaneously with the step of determining adjustments to the operating speeds of the pump assemblies 20a-20f and the recirculation pump assembly 20g. After step 470 is performed, in step 474, the controller 7 can determine the properties of the adhesive based on the temperature of the adhesive detected by the thermal sensor 318. For example, this property may be the viscosity of the adhesive, which may be determined by the controller 7 based on the temperature measured by the thermal sensor 318 and compared to the known material properties of the adhesive, but other properties. Is also possible. The heat sensed in step 470 by the thermal sensor 318 can also be utilized by the controller 7 in determining adjustments to the operating speed of the pump assemblies 20a-20f and / or the recirculation pump assembly 20g.

In step 478, the position sensors 314a to 314f measure the valve stem 260 instantaneous position corresponding to any one of the distribution modules 16a to 16f, and a signal representing this instantaneous position is transmitted to the controller 7 via the signal connection 8. send. Similar to step 470, this measurement step may be performed at any time with respect to steps 402-466 described above so that the controller 7 can be performed simultaneously with the step of determining adjustments to the operating speeds of the pump assemblies 20a-20f and the recirculation pump assembly 20g. can do. Using the instantaneous position of the valve stem 260 measured in step 478, in step 482 the controller 7 can determine if there is a defect in the distribution system. Such defects can include clogging in the material flow path, component failure, etc., and position the valve stem 260 by increasing the time required for the valve stem 260 to complete the full stroke length. Can affect. In addition to the instantaneous position measured by the position sensors 314a-314f, the first sensor 302 and the second sensor 304, the pressure sensors 310a-310f, the pump sensors 31la-311f, the recirculation pump sensor 310g, and the thermal sensor 318. The measured values measured can also be used in making this decision. Further, the instantaneous position measured by the position sensors 314a-314f can also be used to determine the adjustment for the operating speed of the pump assemblies 20a-20f and / or the recirculation pump assembly 20g.

Since the adhesive flow to the respective distribution modules 16a to 16f is individually controlled by the respective pump assemblies 20a to 20f, the aspect of the adhesive flow to the individual distribution modules 16a to 16f is that of the distribution system 1. It can be adjusted without changing the operation of other parts. By adding the first sensor 302 and the second sensor 304, the pressure sensors 310a to 310f, the position sensors 314a to 314f, and the thermal sensor 318, the flow of the adhesive in the applicator 10 can be made more accurate and more accurate. It can be monitored at higher resolutions, while at the same time allowing changes or problems within the applicator 10 to react more quickly. The ability of the controller 7 to receive and utilize the entire measurement taken by the sensors described above is that the controller 7 reacts faster than the conventional system and the pump assembly when changes must be made within the applicator 10. It is possible to adjust the operation of any combination of 20a-20f and / or the recirculation pump assembly 20g, which can save wasted adhesive and reduce unsellable finished products.

Another embodiment of the present disclosure is a hybrid applicator for distributing an adhesive. FIG. 19 shows the applicator 510. The hybrid applicator 510 is configured for both metered and pressure-fed outputs. The applicator 510 is the same as the applicator 10 described above. For example, the hybrid applicator 510 includes a distribution module 516 and a single or segmented manifold 512.

The hybrid applicator 510 includes at least one pump assembly 420 (or pump assembly 120) and at least one pressure supply block 520, each of which is coupled to a manifold 512. With respect to this embodiment, reference number 420 can be used interchangeably with reference numbers 520a-520c, unless otherwise noted. According to the embodiment shown in FIG. 16, the applicator 10 includes three pump assemblies 520a, 520b, 520c, and four pumping blocks 522a, 522b, 522c, 522d. However, the applicator 510 can include any number of pump assemblies 420 and pump blocks 520. Both the pump assemblies 520a and 520c can be configured to operate as a recirculation pump assembly, as described for the pump assembly 20g described above.

Further referring to FIG. 19, the pump assembly 420 is substantially the same as the pump assembly 20 (or pump assembly 120), as described above. The pump assembly 420 receives the adhesive from the flow path in the manifold 512, which is input to input 519c. The pressure supply blocks 522a, 522c include inlets and outlets that receive the adhesive from the manifold supplied via the input 519c. The pressure supply blocks 522b, 522d are supplied with adhesive via inputs 519a, 519b that receive the adhesive from an adhesive source (not shown). A pump (not shown) near the adhesive supply section can be used to supply the adhesive to the inputs 519a, 519b coupled to the pressure supply blocks 522b, 522d, respectively, via a hose. Then, the heat from the manifold 512 is transferred to the pressure feed blocks 522a to 522d, thereby heating the adhesive in the pressure feed block 520. As shown, the hybrid applicator 510 has multiple input fittings 519a-519c that can be used to supply different types of adhesive to the applicator 510, some of these fittings being pressure. It is related to the supply block.

Combining the pump assembly 420 with the pressure supply block 520 increases the process flexibility of the applicator 510. For example, the pump assembly 420 allows precise metering of the adhesive flow from the distribution module 516, while other adhesive flows are associated with the less precise pressure supply block 520. It should be appreciated that the hybrid applicator 510 can all be weighed, pressure-fed, and multi-zone pressure-fed within a single manifold, if desired.

The invention is described herein using a limited number of embodiments, but these particular embodiments limit the scope of the invention as described and claimed separately herein. Not intended to be. The exact placement of the various elements, as well as the order of the steps of the articles and methods described herein, is not considered to be limiting. For example, the steps of the method are described with reference to a series of reference numerals and block progressions in the figure, but the method can be performed in any particular order desired.

This application claims the priority of US Patent Application No. 16 / 378,186 filed April 8, 2019, the disclosure of which is by reference in its entirety as described herein. Incorporated herein.

Claims (25)

It is a distribution system that distributes an adhesive, and the distribution system is
Being an applicator
Manifold and
With a plurality of distribution modules coupled to the manifold,
A plurality of pump assemblies, each of which is configured to pump the adhesive to each of the plurality of distribution modules at their respective operating rates. And with an applicator,
A controller that signals and communicates with the applicator, which a) measures the current drawn from each of the plurality of pump assemblies and b) adjusts the operating speed of each of the plurality of pump assemblies. The controller and the controller are configured to individually determine based on each of the drawn currents and c) instruct each of the plurality of pump assemblies to individually adjust their operating speeds. To prepare for. The applicator is
A supply channel configured to provide the adhesive to the plurality of pump assemblies,
A recirculation flow path configured to receive the adhesive from the plurality of pump assemblies and guide the adhesive to the supply flow path.
The distribution system of claim 1, further comprising a recirculation pump assembly configured to control the flow of adhesive through the recirculation flow path. The applicator is
It further comprises a plurality of pressure sensors configured to measure the pressure of the adhesive pumped from each of the plurality of pumps to the corresponding one of the plurality of distribution modules and send a signal representing the pressure to the controller. , The distribution system according to claim 2. The applicator further comprises a recirculation pressure sensor configured to measure the pressure of the adhesive flowing through the recirculation flow path and send a signal representing the pressure to the controller.
The controller is configured to determine adjustments to the operating speed of the recirculation pump assembly such that the pressure measured by the recirculation pressure sensor is equal to the pressure measured by the pressure sensor. Item 3. The distribution system according to Item 3. The controller signals and communicates with the recirculation pump assembly, which measures the current drawn from the recirculation pump assembly and is based on the current drawn from the recirculation pump assembly. The distribution system according to claim 2, further configured to determine adjustments to the operating speed of the assembly. The applicator further comprises a plurality of pump sensors and a recirculation pump sensor.
The plurality of pump sensors and the recirculation pump sensor are the motor torques and operating speeds of the plurality of pump assemblies and the recirculation pump assemblies, respectively, and the adhesions flowing out of the plurality of pump assemblies and the recirculation pump assemblies, respectively. The distribution system according to claim 5, which is configured to measure the pumping pressure of the agent. Each of the plurality of distribution modules includes a valve stem configured to control the flow of adhesive from the plurality of distribution modules.
The applicator is a plurality of position sensors, each of the plurality of position sensors measures the instantaneous position of each of the valve stems, and transmits a position signal representing the instantaneous position of each of the valve stems to the controller. Further equipped with multiple single sensors configured as
The distribution system according to claim 1, wherein the controller is configured to determine whether or not a defect is present in the distribution system based on the instantaneous position. The applicator further comprises a plurality of thermal elements for heating the adhesive and a plurality of thermal sensors.
Each of the plurality of thermal sensors is located adjacent to each one of the plurality of thermal elements and is in fluid communication with the adhesive.
The plurality of thermal elements are configured to detect the temperature of the adhesive and transmit a thermal signal representing the temperature of the adhesive to the controller.
The distribution system of claim 1, wherein the controller is configured to determine the properties of the adhesive based on the temperature of the adhesive. The controller is configured to instruct each of the plurality of pump assemblies to individually adjust their operating speeds when the currents of the plurality of pump assemblies are out of a predetermined range. The distribution system according to claim 1. The controller is configured to instruct each of the plurality of pump assemblies to maintain their operating speeds individually when the currents of the plurality of pump assemblies are within a predetermined range. The distribution system according to claim 9. 9. The controller comprises a human-machine interface (HMI) device configured to warn when the current in one of the plurality of pump assemblies is outside the predetermined range. Distribution system. 11. The distribution system of claim 11, wherein the HMI device is configured to receive user input for manually selecting the predetermined range. The distribution system according to claim 1, further comprising a lysator configured to melt the adhesive and supply the adhesive to the applicator. A method of controlling the distribution of adhesive from the applicator,
Pumping adhesive from multiple pump assemblies to multiple distribution modules,
To draw and measure the current from each of the multiple pump assemblies,
Determining the adjustment for each operating speed of the plurality of pump assemblies individually based on each of the drawn currents.
A method comprising individually adjusting the operating speed of each of the plurality of pump assemblies. Directing the adhesive through the supply channels to the multiple pump assemblies,
14. The method of claim 14, further comprising pumping the adhesive from the plurality of distribution modules through the recirculation pump assembly to the supply flow path via the recirculation flow path. Measuring the recirculation pressure of the adhesive flowing through the recirculation channel and
Measuring the distribution pressure of the adhesive flowing from each of the plurality of pump assemblies to each of the plurality of distribution modules, and
15. The method of claim 15, further comprising adjusting the operating speed of the recirculation pump assembly to make the recirculation pressure equal to the distribution pressure. Determining the current drawn from the recirculation pump assembly
Determining the adjustment of the operating speed of the recirculation pump assembly based on the amount of current drawn.
15. The method of claim 15, further comprising adjusting the operating speed of the recirculation pump assembly. Determining the adjustment of the operating speed of the recirculation pump assembly further comprises measuring motor torque, operating speed, and pump pressure.
Determining the adjustment of the operating speed of the recirculating pump assembly comprises determining the adjustment of the operating speed of the recirculating pump assembly based on the motor torque, the operating speed, and the pump pressure. 17. The method according to 17. Further comprising measuring the motor torque, operating speed, and pump pressure of each of the plurality of pump assemblies.
Determining the adjustment of the operating speed of the recirculation pump assembly is the operating speed of each of the plurality of pump assemblies based on the motor torque, the operating speed, and the pump pressure of each of the plurality of pump assemblies. 14. The method of claim 14, comprising individually determining adjustments to. 14. The method of claim 14, further comprising:
Measuring the instantaneous position of each valve stem of the plurality of distribution modules, and
14. The method of claim 14, further comprising determining if a defect is present in the applicator based on the instantaneous position. Measuring the temperature of the adhesive and
14. The method of claim 14, further comprising determining the properties of the adhesive based on the temperature of the adhesive. Individually adjusting the operating speed of each of the plurality of pump assemblies means that the operating speed of each of the plurality of pump assemblies is such that the current drawn from each of the plurality of pump assemblies is out of a predetermined range. 14. The method of claim 14, comprising adjusting. Individually adjusting the operating speed of each of the plurality of pump assemblies means that the operating speed of each of the plurality of pump assemblies is such that the current drawn from each of the plurality of pump assemblies is within a predetermined range. 22. The method of claim 22, comprising maintaining. 22. The method of claim 22, further comprising issuing an alarm when the current drawn from one of the plurality of pump assemblies is out of a predetermined range. 22. The method of claim 22, further comprising receiving user input for manually selecting the predetermined range.

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