JP2022522146A - Integrated tool elevator - Google Patents

Abstract

SOLUTION: A second axis is fixedly supported by an upper support framework, a plurality of semiconductor processing chambers arranged along a first axis, and an upper support framework, and is substantially parallel to the first axis. A semiconductor processing tool including a linear guidance system extending along the axis of the carriage and a carriage is provided. Each chamber has a base portion fixed and mounted relative to the top support framework, and a removable top cover with one or more hoisting features. The carriage includes a hoisting arm configured to pivot about a vertical axis that is substantially perpendicular to the second axis and movably engages the linear guidance system with respect to the linear guidance system. Is configured to translate along the second axis. The carriage and hoisting arm are movable such that the hoisting feature engaging interface of the hoisting arm can be moved to engage any said hoisting feature in the removable top cover. [Selection diagram] Fig. 2

Description

(Mutual reference of related applications)
The PCT application form is submitted at the same time as this specification as part of this application. As identified in the PCT application form submitted at the same time, each application for which this application claims interest or priority is effectively incorporated herein by reference in its entirety.

Many semiconductor processing tools have large and heavy components that are removed during maintenance, inspection, and repair.

Described herein are novel devices and systems for moving the components of semiconductor processing tools for maintenance, inspection, and repair. These tools may have a large number of semiconductor processing chambers arranged side by side in the form of a linear array, mounted directly or indirectly on the tool's support framework. Many components of a semiconductor processing chamber are lifted and moved using conventional floor-supported hoisting equipment, eg cranes or forklifts, traditionally separate from the tool, as described herein. Some tools have a hoisting system for moving removable components integrated within the tool itself. In some implementations, the hoisting system may include a linear guidance system that extends along a linear array of semiconductor processing chambers, either directly or indirectly mounted on the support framework. Connected to and supported by a linear guidance system is a movable carriage with a movable hoisting arm that can contact, lift and move any component of the semiconductor processing chamber. The carriage and its hoisting arm, together, are straight so that the hoisting arm can come into contact with any removable component in the semiconductor processing chamber and move them. Can move along the guidance system. The hoisting arm and removable components may have complementary connecting features that allow the hoisting arm to contact and lift them in contact with the removable components. When the carriage lifts the removable component, the weight of the removable component is fully transferred to the support framework through the hoisting arm, carriage, and linear guidance system. In some embodiments, the carriage may hang from the linear guidance system, eg, below the linear guidance system, or to the sides of the linear guidance system.

In some implementations, one may move the carriage along a linear guidance system and also move the hoisting arm into a position where it contacts removable components. In some such implementations, a motor may power various aspects of the carriage, such as a hoisting mechanism on the carriage that raises and lowers the hoisting arm. In some other embodiments, the motor and other moving mechanisms may move the carriage along a linear guidance system and / or move the hoisting arm horizontally and / or vertically. A controller with a processor and memory can control the movement of the carriage and hoisting arm.

In some alternative embodiments, the tool may have a hoisting system that is different from the carriage and linear guidance system. These alternative embodiments use a separable hoisting system that connects to one or more attachment points connected to the support framework. This separable hoisting system has a vertical member that is positioned on the floor, supported by the floor, and connected to a point of attachment on the support framework to provide side support to the vertical member. The separable hoisting system also moves to a vertical member that can be connected to one removable component in the semiconductor processing chamber and lifted when the vertical member is connected to one or more attachment points. Includes hoisting arms that are potentially attached. In some embodiments, the separable hoisting system is stationary when connected to one or more attachment points, except for its hoisting arm, while in some other embodiments it is separable. The hoisting system and the attachment points to which it is connected can move simultaneously along the array of semiconductor processing chambers.

In some embodiments, semiconductor processing tools may be provided. The semiconductor processing tool is substantially on the first axis, fixed and supported by the upper support framework, the first plurality of semiconductor processing chambers arranged along the first axis, and the upper support framework. It may include a first linear guidance system extending along a second axis parallel to and a first carriage. Each semiconductor processing chamber may have a base portion fixed and mounted relative to the top support framework and may have a removable top cover with one or more hoisting features, first. The carriage may include a first hoisting arm with one or more links, the first hoisting arm being pivoted about a vertical axis that is substantially perpendicular to the second axis. It may be configured to move so that the first carriage movably engages with the first linear guidance system and translates along the second axis with respect to the first linear guidance system. The first hoisting arm may be configured to engage any hoisting feature in the removable top cover of the first plurality of semiconductor processing chambers. An interface may be included, the first carriage and the first hoisting arm hoisting to engage any hoisting feature within the removable top cover of the first plurality of semiconductor processing chambers. Features It may be movable so that the engagement interface can be moved.

In some embodiments, the first carriage is a first vertical translation configured to translate the first hoisting arm perpendicular to the first linear guidance system and in a direction parallel to the vertical axis. The system may be further included.

In some such embodiments, the semiconductor processing tool may further include a power source. The first vertical translation system may include a motor configured to provide a first mechanical input to the first vertical translation system, the first mechanical input in the vertical direction and on the vertical axis. The first hoisting arm may be translated in parallel directions, the first carriage being connected to a power source and routed along the first hoisting arm, and an electrical control cable terminated by a connector. The removable top cover may further include an electrical interface configured to connect to the connector, the electrical control cable may include the connector, and the hoisting of the first hoisting arm. The feature engagement interface may each consist of a length that can be simultaneously engaged with only one electrical interface and the hoisting feature in the semiconductor processing chamber.

In some other such embodiments, the semiconductor processing tool may further include a controller with one or more processors and one or more non-temporary storage elements, one or more non-semiconductors. The temporary storage device controls one or more processors to receive information about the operating state of each semiconductor processing chamber, and the semiconductor processing chamber is placed in one of the semiconductor processing chambers by an electrical interface. Only when the information about the operating state of the semiconductor processing chamber indicates that the person is in a safe state is the instruction to provide the first operating signal to operate the first vertical translation system.

In some other such embodiments, the semiconductor processing tool comprises a first carriage position sensor configured to generate data about the position of the first carriage along the first linear guidance system. It may further include one or more processors and a controller with one or more non-temporary storage elements, one or more non-temporary storage elements controlling one or more processors. The position of the first carriage along the first linear guidance system is determined based on the data generated by the first carriage position sensor, and the first plurality at a time is determined based on the determination of the position of the first carriage. Stores instructions for powering only the electrical interface of one semiconductor processing chamber in the semiconductor processing chamber.

In some other embodiments, the semiconductor processing tool is an arm position sensor configured to generate data about the position of the first hoisting arm with respect to the semiconductor processing chamber among the first plurality of semiconductor processing chambers. One or more non-temporary storage elements may control one or more processors and based on the data generated by the arm position sensor, in the first plurality of semiconductor processing chambers. The hoisting of the first hoisting arm is determined based on the position of the first hoisting arm with respect to each of the semiconductor processing chambers and the position of the first hoisting arm and the position of the first carriage. Features Further stores instructions to power only the electrical interface of the semiconductor processing chamber among the first plurality of semiconductor processing chambers that is closest to the engaging interface.

In some other embodiments, one or more non-temporary storage elements control one or more processors to pass through the first carriage and parallel to the vertical axis and the second axis. Further memory may be given to move the first hoisting arm only on the first side of the vertical plane perpendicular to.

In some other such embodiments, the semiconductor processing tool is whether one hoisting feature in a removable top cover and the hoisting feature engagement interface of the first hoisting arm are engaged. It may further include an engagement sensor configured to generate data about, and a controller with one or more processors and one or more non-temporary storage elements, one or more non-temporary. The storage element controls one or more processors, and based on the data generated by the engagement sensor, one hoisting feature in the removable top cover of the first plurality of semiconductor processing chambers and the first. One hoisting feature and hoisting feature engagement in the removable top cover of the first plurality of semiconductor processing chambers, determining if the hoisting feature engagement interface of the hoisting arm is engaged. An instruction to power only the electrical interface of a semiconductor processing chamber among a first plurality of semiconductor processing chambers including its removable top cover in response to determining that the interface is engaged. Remember.

In some other such embodiments, the removable top cover may receive power from a power source through an electrical cable.

In some such embodiments, the first carriage engages with any of the hoisting features in the removable top cover of the first plurality of semiconductor processing chambers, the first plurality. A first configured to prevent the first vertical translation system from vertically translating the first hoisting arm when not engaging with one hoisting feature in the removable top cover of the semiconductor processing chamber. Interlocks may be further included.

In some such embodiments, the first vertical translational system may be a linear ball screw actuator, a hydraulic actuator, an actuator with a rack and a pinion, and a cable hoisting device.

In some such embodiments, the semiconductor processing tool may further include a controller with one or more processors and one or more non-temporary storage elements. The first linear guidance system may further include a carriage translation system configured to translate the first carriage along the second axis, the first carriage in a plane perpendicular to the vertical axis. It may further include a hoisting arm moving system configured to move the first hoisting arm, one or more non-temporary storage elements controlling one or more processors to be a carriage translation system. First, the first carriage is moved along the second axis, and the hoisting arm translation system and the first vertical translation system are moved by the first hoisting arm to process the first plurality of semiconductors. One hoisting feature and hoisting feature engagement interface in the removable top cover of the chamber engages, and one hoisting feature and hoisting feature engaging interface in the removable top cover engages. When this is done, the removable top cover is translated vertically into the first vertical translation system, and when one of the hoisting features in the removable top cover and the hoisting feature engagement interface are engaged, the first. Translate its removable top cover into the vertical translation system of, and to the hoisting arm moving system when the hoisting feature and hoisting feature engagement interface in one of the removable top covers is engaged. Instructions for translating the removable top cover in a plane perpendicular to the vertical axis may be stored.

In some other such embodiments, one or more non-temporary storage elements control one or more processors and have one hoisting feature and winding in a removable top cover. Top Features When the engagement interface engages, the hoisting arm movement system and the first vertical translation system move the first hoisting arm from its removable top cover hoisting feature to hoisting feature. Further instructions for disconnecting the interface may be stored.

In some other such embodiments, one or more non-temporary storage elements control one or more processors and have one hoisting feature and winding in a removable top cover. Top Features The carriage translation system and hoisting arm movement system may further store instructions for translating its removable top cover in a plane perpendicular to the vertical axis when the engagement interface is engaged.

In some embodiments, the semiconductor processing chambers in the first plurality of semiconductor processing chambers may all be located inside the tool envelope, and the first hoisting arm may be the first plurality of semiconductor processing. Any of the removable top covers of the chamber may be movable so that it can be moved outside the tool envelope.

In some embodiments, the first linear guidance system may further include a first rail and a second rail that are parallel to each other and offset from each other in a direction parallel to the vertical axis, the first carriage being the first. While engaging at the same time as the first rail and the second rail and at the same time as the first rail and the second rail, it translates along the second axis with respect to the first linear guidance system. It may be configured to do so.

In some such embodiments, the first carriage is below the first linear guidance system and above the first plurality of semiconductor processing chambers, with the first hoisting arm in the first straight line. It may further include a first vertical translation system configured to translate perpendicular to the guidance system and in a direction parallel to the vertical axis.

In some other such embodiments, the first vertical translation system may be further configured to vertically translate the first hoisting arm above the first linear guidance system.

In some embodiments, the first linear guidance system may be offset vertically above the first plurality of semiconductor processing chambers in a direction parallel to the vertical axis, and the first carriage is a first straight line. It may shift vertically beneath the guidance system.

In some embodiments, the hoisting feature engaging interface uses a fitting configured to allow the hoisting feature engaging interface to rotate about two or more axes perpendicular to the vertical axis. And may be connected to the distal end of the first hoisting arm.

In some such embodiments, the fitting may be a spherical fitting.

In some such embodiments, the fitting may be further configured to allow the hoisting feature engagement interface to rotate about an axis parallel to the vertical axis.

In some embodiments, each removable top cover hoisting feature may include a pair of saddle posts, each saddle post being a pair of vertical riser rods, and a pair of vertical riser rods. It may include a saddle plate that caps and extends between the vertical riser rods, each saddle plate may include a first mechanical interface feature, and each hoisting feature saddle post may include a first mechanical interface feature. May be positioned so that they are spaced apart from each other by a first distance, and the hoisting feature engagement interface is two second machines spaced apart by a first distance. Each first mechanical interface feature may be complementary to one of the second mechanical interface features.

In some embodiments, each semiconductor processing chamber within the first plurality of semiconductor processing chambers comprises removable components that may be radio frequency (RF) generators, pumps, and low temperature pumps. May include. Each removable component may include one or more second hoisting features, and the hoisting feature engagement interface of the first hoisting arm is a removable first plurality of semiconductor processing chambers. The first carriage and the first hoisting arm may be further configured to engage any second hoisting feature in any of the components, with the removal of the first plurality of semiconductor processing chambers. It may be movable such that the hoisting feature engagement interface can be moved to engage any second hoisting feature among the possible components.

In some embodiments, the first hoisting arm may include a linear compartment that includes a hoisting feature engagement interface that is perpendicular to the vertical axis.

In some such embodiments, the first hoisting arm may include a pivot compartment configured to pivot itself about a vertical axis, between the pivot compartment and the linear compartment. It may include compartments that form an angle oriented at an oblique angle with respect to the vertical axis.

In some embodiments, the first plurality of semiconductor processing chambers may include two semiconductor processing chambers.

In some such embodiments, the first plurality of semiconductor processing chambers may include three semiconductor processing chambers.

In some other such embodiments, the first plurality of semiconductor processing chambers comprises five semiconductor processing chambers.

In some embodiments, the semiconductor processing tool comprises a second plurality of semiconductor processing chambers arranged along a third axis off the first axis, substantially parallel to the first axis. A fourth, secured and supported by an upper support framework and substantially parallel to a third axis, with an internal region located between the first plurality of semiconductor processing chambers and the second plurality of semiconductor processing chambers. A second linear guidance system extending along the axis of the second carriage and a second carriage may be further included. The first linear guidance system and the second linear guidance system may be positioned outside the internal region, and each semiconductor processing chamber in the second plurality of semiconductor processing chambers is fixed to the upper support framework. The second carriage may have one or more second hoisting features and a second removable top cover with one or more second hoisting features. A second hoisting arm with a plurality of links may be included, the second hoisting arm may be configured to pivot about a second vertical axis perpendicular to the fourth axis. The second carriage may be configured to movably engage the second linear guidance system and translate along the fourth axis with respect to the second linear guidance system, the second winding. The upper arm is configured to engage any second hoisting feature in the second removable top cover of the semiconductor processing chamber in the second plurality of semiconductor processing chambers. Hoisting Features The engagement interface may include a second carriage and a second hoisting arm in a second removable top cover of the semiconductor processing chamber in a second plurality of semiconductor processing chambers. It may be movable such that the second hoisting feature engagement interface can be moved to engage any of the hoisting features of.

In some such embodiments, the base portion of the first plurality of semiconductor processing chambers, the second base portion of the second plurality of semiconductor processing chambers, and the internal region are all inside the second envelope. The first hoisting arm can be moved so that the removable top cover in any of the first plurality of semiconductor processing chambers can be moved to the outside of the second envelope. The second hoisting arm may be such that the second removable top cover in any of the second plurality of semiconductor processing chambers can be moved to the outside of the second envelope. It may be mobile.

In some such embodiments, the second removable top cover may be of the same type as the removable top cover, and the second hoisting feature engaging interface is a hoisting feature engaging interface. The second hoisting feature may be of the same type as the hoisting feature.

In some embodiments, the semiconductor processing tool further comprises a bellows that creates a seal at the interface between the first carriage and the first linear guidance system when the first carriage engages the first linear guidance system. It's fine.

In some embodiments, the semiconductor processing tool may further include a second carriage. The second carriage may include a second hoisting arm with one or more links, the second hoisting arm centered on a second vertical axis perpendicular to the second axis. Configured to move, the second carriage is movably engaged with the first linear guidance system and is configured to translate along the second axis with respect to the first linear guidance system. A second hoisting arm may be configured to engage any hoisting feature in the removable top cover of the first plurality of semiconductor processing chambers. A combined interface may be included, the second carriage and the second hoisting arm so as to engage any hoisting feature in the removable top cover of the first plurality of semiconductor processing chambers. The second hoisting feature of the second hoisting arm may be movable so that the engagement interface can be moved, and the first linear guidance system is such that the first carriage and the second carriage are the first. It may be further configured to be simultaneously engaged with a linear guidance system and be able to move along a second axis.

In some embodiments, the removable top cover does not have to be the substrate.

In some embodiments, the first hoisting arm does not have to be configured to support the substrate.

In some such embodiments, the hoisting feature engagement interface does not have to be configured to support the substrate.

In some embodiments, semiconductor processing tools may be provided. The semiconductor processing tool is a support framework, a first plurality of semiconductor processing chambers arranged along a first axis, a first attachment point connected to the support framework, and a first separable winding. May include the above system. Each semiconductor processing chamber may have a base portion fixedly mounted to a support framework and may have a removable top cover with one or more hoisting features, first. The separable hoisting system may include a vertical member with an upper end having a complementary attachment point and a lower end having a moving mechanism, the complementary attachment point being connected so as to be separable to the first attachment point. The moving mechanism may be supported by the floor, and the first separable hoisting system may further include a hoisting arm with one or more links connected to a vertical member, hoisting. The arm may be configured to pivot about a vertical axis that is substantially perpendicular to the first axis, and the hoisting arm may be inside the removable top cover of the first plurality of semiconductor processing chambers. It may include a hoisting feature engagement interface configured to engage any of the hoisting features of.

In some embodiments, the first separable hoisting system is a vertical translational system configured to translate the hoisting arm in a direction perpendicular to the support framework and in a direction parallel to the vertical axis. Further may be included.

In some such embodiments, the first vertical translation system may include a motor configured to provide a first mechanical input to the first vertical translation system, the first mechanical. The input translates the hoisting arm along the vertical member.

In some such embodiments, the first vertical translation system may be configured to move with the hoisting arm as a single unit along the vertical members.

In some embodiments, the moving mechanism may include foldable wheels.

In some embodiments, semiconductor processing tools may be provided. The semiconductor processing tool includes a support framework with an upper attachment point, a vertically offset lower attachment point below the upper attachment point, and a first plurality of semiconductor processing chambers arranged along a first axis. , May include a separable hoisting system. Each semiconductor processing chamber may have a base portion fixed and mounted relative to a support framework, having a removable component with one or more hoisting features, and a separable hoisting system. May include an upper end with a high attachment point, a lower end with a bottom attachment point, and a vertical member with a moving mechanism, the high attachment point being separably connected to the upper attachment point and the most. The lower attachment points may be separably connected to the lower attachment points, and the separable hoisting system is configured to pivot around a vertical axis that is substantially perpendicular to the first axis. It may further include a hoisting arm with one or more links and a vertical translation system configured to translate the hoisting arm in a direction perpendicular to the support framework and in a direction parallel to the vertical axis. .. The hoisting arm may include a hoisting feature engaging interface configured to engage any hoisting feature among the removable components of the first plurality of semiconductor processing chambers.

In some embodiments, the vertical translation system may include a motor configured to provide a first mechanical input to the first vertical translation system, the first mechanical input being on the vertical axis. Translate the hoisting arm in parallel directions.

In some such embodiments, the semiconductor processing tool may further include a power source. The separable hoisting system may further include an electrical control cable that is connected to a power source and routed along the hoisting arm and terminated by a connector, with each removable component connectable to the connector. It may further include an electrical interface configured as such, the electrical control cable has only one electrical interface and winding of the semiconductor processing chamber at a time, with the connector and the hoisting feature engaging interface of the hoisting arm, respectively. It may consist of a length that can be engaged at the same time only with the above features.

In some other such embodiments, the semiconductor processing tool may further include a controller with one or more processors and one or more non-temporary storage elements. The temporary storage device controls one or more processors to receive information about the operating state of each semiconductor processing chamber, and the electrical interface makes it one of the semiconductor processing chambers, and the semiconductor processing chamber is sent to a person. Only when the information about the operating state of the semiconductor processing chamber indicates that it is in a safe state, it stores an instruction to provide a first operating signal to operate the vertical translation system.

In some other such embodiments, the removable component may receive power from a power source through an electrical cable.

In some such embodiments, the vertical translational system may be a linear ball screw actuator, a hydraulic actuator, an actuator with racks and pinions, and a cable hoisting device.

In some embodiments, the separable system engages with any hoisting feature within the removable top cover of the first plurality of semiconductor processing chambers to engage with the first plurality of semiconductor processing. A first interlock configured to prevent the first vertical translation system from vertically translating the first hoisting arm when not engaging with one hoisting feature in the removable top cover of the chamber. May further be included.

In some embodiments, the moving mechanism may include four wheels.

In some embodiments, the moving mechanism may include a set of foldable wheels.

In some embodiments, the first vertical translation system may be configured to move with the hoisting arm as a single unit along a vertical member.

In some such embodiments, the vertical member may further include a slide rail configured to move the first vertical translation system.

In some embodiments, the moving mechanism does not have to be supported by the floor when connected to the lower and upper attachment points.

In some embodiments, the moving mechanism may be supported by the floor when connected to the lower and upper attachment points.

In some embodiments, the lower attachment points may be vertically offset below the base of the treatment chambers.

In some embodiments, the support framework may further include a plurality of top attachment points, the tool may further include a plurality of bottom attachment points offset below the plurality of top attachment points, and the plurality of semiconductors. The processing chamber may include N processing chambers, the plurality of upper attachment points may include the upper attachment points of N-1, and the plurality of lower attachment points may include the lower attachment points of N-1. ..

In some embodiments, the hoisting arm may further include three or more links, a double shoulder joint, and a double elbow joint.

In some embodiments, the removable component does not have to be the substrate.

In some embodiments, the hoisting arm does not have to be configured to support the substrate.

In some such embodiments, the hoisting feature engagement interface does not have to be configured to support the substrate.

This specification exemplifies, but not by limitation, the various embodiments disclosed herein in the form of illustrations in the accompanying drawings in which similar reference numerals refer to similar elements.

Draw a schematic top view of an example of a semiconductor processing tool that includes two plurality of semiconductor processing chambers.

A perspective view of the first example of a portion of the example of the semiconductor processing tool of FIG. 1 is drawn.

A detailed perspective view of a portion of the example of the semiconductor tool of FIG. 2 is drawn.

A cross-sectional view of a part of the example of the first hoisting arm of FIG. 3 is drawn. An off-angle view of the example of the removable top cover of FIG. 3 is drawn.

Draw the same detailed perspective view of a portion of the tool of FIG.

A sequence of movements of an example of a removable component of the first example of a portion of the example of the semiconductor tool of FIG. 2 is drawn. A sequence of movements of an example of a removable component of the first example of a portion of the example of the semiconductor tool of FIG. 2 is drawn. A sequence of movements of an example of a removable component of the first example of a portion of the example of the semiconductor tool of FIG. 2 is drawn. A sequence of movements of an example of a removable component of the first example of a portion of the example of the semiconductor tool of FIG. 2 is drawn. A sequence of movements of an example of a removable component of the first example of a portion of the example of the semiconductor tool of FIG. 2 is drawn.

Draw an example of a hoisting arm.

A perspective view of a second alternative of a portion of the tool schematic of FIG. 1 is drawn.

The enlarged part of FIG. 8 is drawn.

An example of a tool similar to FIGS. 6A-6E with two first carriages engaged with one linear guidance system is drawn.

A top view of an example of a semiconductor processing tool similar to the semiconductor processing tool shown in the schematic of the tool of FIG. 1 is drawn, with additional details and features.

A top view of the example semiconductor processing tool of FIG. 6E is drawn, showing additional features as well.

A block diagram of a part of the example 1200 of the semiconductor processing tool is drawn.

Draw another example of a semiconductor processing tool.

A side view of another example of the semiconductor processing tool of FIG. 14 and a first example of a separable hoisting system is drawn. A side view of another example of the semiconductor processing tool of FIG. 14 and a first example of a separable hoisting system is drawn.

Draw a perspective view of a second example of a separable hoisting system.

Draw yet another example of a semiconductor processing tool.

A side view of the adhesion sequence between the tool and the second example of the separable hoisting system of FIGS. 16 and 17 is drawn. A side view of the adhesion sequence between the tool and the second example of the separable hoisting system of FIGS. 16 and 17 is drawn.

A perspective view of a second example of a separable hoisting system connected to the tools of FIGS. 17-18B is drawn.

A second example of a separable hoisting system depicts a sequence of movements of an example of removable components. A second example of a separable hoisting system depicts a sequence of movements of an example of removable components.

Another configuration of the second example of the separable hoisting system of FIG. 16 is depicted.

The following description provides a number of specific details to help you fully understand the embodiments presented. The disclosed embodiments may be implemented without some or all of these specific details. In other examples, well-known processing operations have not been described in detail in order not to unnecessarily obscure the disclosed embodiments. It will be appreciated that while the disclosed embodiments are described in relation to the specific embodiments, they are not intended to be limited to the disclosed embodiments.

Semiconductor processing tools typically have at least one processing chamber in which processing of one or more substrates is performed, along with other component components that allow this processing. Examples of substrate processing include chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition, PECVD, atomic layer deposition, ALD on the substrate. In addition to deposition, it also includes patterning and etching of various materials, including conductors, semiconductors, and dielectrics, using, for example, atomic layer etching (ALE). In this application, the terms "semiconductor wafer", "wafer", "board", "wafer board", and "partially manufactured integrated circuit" are used interchangeably. For example, the operation for depositing a film on a semiconductor substrate may be performed in a substrate processing apparatus having a processing chamber with a single substrate holder in an internal volume that may be maintained under vacuum by a vacuum pump. The substrate holder, eg, the pedestal, may have a heating element that may heat the pedestal and the substrate. Also fluidly coupled to the chamber to deliver (eg) membrane precursors, carrier gas and / or purge gas and / or processing gas, secondary reactants, etc. are gas delivery systems and shower heads. Equipment for generating plasma inside the processing chamber, such as an RF power supply for powering the plasma and a matching network, may also be included within the device. Plasma energy controls one or more of processing station pressure, gas concentration, RF power supply, RF source frequency, and plasma power pulse timing (eg, via a system controller with appropriate machine-readable instructions). It may be controlled by this. The RF power supply may provide RF power of any suitable frequency and may be configured to control high and low frequency RF power supplies independently of each other, between 50 kHz and 500 kHz and 1.8 MHz to 2. It may include frequencies between .45 GHz.

Many substrate processing equipment uses a single processing chamber, while performing a large number of substrate operations in parallel to a large number of substrates when a time-consuming membrane deposition operation is involved. It may be advantageous to increase the substrate processing throughput. For this purpose, the multi-station substrate processing apparatus may have a single substrate processing chamber with a large number of substrate processing stations within a single internal volume defined by the walls of the processing chamber. Some other multi-station board processing equipment may have a large number of processing chambers, sometimes called "cluster tools". The cluster tool may have a processing chamber with a large number of stations, such as two, three or four stations within each processing chamber. Similarly, the cluster tool may have 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, or 16 or more processing chambers. ..

In terms of equipment and operating costs, various efficiencies may also be achieved by using a tool that includes a large number of chambers, i.e., a cluster tool. As an example, a single vacuum pump may be used to create a single high vacuum environment for two or more processing chambers, and also for two or more chambers, using a single vacuum pump. The processed gas that has already been processed may be discharged. Depending on the embodiment, the processing chambers may share the same gas delivery system, and certain elements of the plasma generator equipment may be shared between the processing chambers (eg, power supply). In some cluster tools, numerous processing chambers are connected not only to wafer transfer systems, but also to other components for performing deposition, etching, or other operations, such as vacuum pumps and gas delivery systems. Ru. Wafer transfer systems are installed in and out of the processing chamber, and in and out of wafer containers such as cassettes or FOUPs (Front Opening Unified Pods). May include a robot arm with one or more end effectors configured to pick and transfer wafers inside the tool. A single cluster tool may be able to perform multiple processes simultaneously in multiple chambers while sharing some of the operational systems such as gas delivery systems and power generators.

Various efficiencies such as space and throughput may also be obtained by using the cluster tool. Generally speaking, many cluster tools are positioned on the floor of a semiconductor manufacturing plant or equipment (“Fab”). However, positioning the tools on the floor relative to each other is subject to a number of constraints, such as the electrical separation distance area between the tools and the inspection area. The inspection area for the tool is to remove parts of the tool (eg, pump, top cover of the processing chamber), to perform maintenance on the tool, to add or replace parts of the tool. In order to access the area of the tool, it may include the area required to scrutinize the tool, and ergonomics or other industries such as to comply with the requirements of OSHA (Occupational Safety and Health Assessment). At least part of it may be specified according to standards, and the electrical separation area prevents electrical interference between areas required for human or equipment safety and one or more elements of adjacent tools. May include the area required for

The multiple chambers of each cluster tool may also be arranged to maximize the number of chambers positioned on the Fab floor, thereby further increasing the throughput of the substrate being processed. It may be possible. For example, cluster tools may be tightly packed so that their components are positioned close to each other, resulting in limited space and distance between the components. Tightening the components of a cluster tool can be required for many maintenance and inspection operations, limiting the ability to access and move the components of the tool, and so on. Presents the challenges of carrying out the actions of. For many tightly packed tools, the positioning and alignment of the tool components prevents traditional hoisting mechanisms from accessing and moving the components. For example, this access may be hampered by components mounted side-by-side and close together, by components stacked on top of each other and mounted on top of each other, and by support components of tools such as support frames. The denser the array, the less space you have to access and move the components of the tool. In some examples, one or more components of the tool are moved to allow access and separation distance of a conventional lifting mechanism, connect to one component of the tool, and lift and move it. There must be. For example, it is generally required to remove the top cover of the processing chamber to scrutinize, inspect, repair and maintain the internal elements of the processing chamber. For some tightly packed tools, some traditional lifting mechanisms are on top without removing other components that surround the top cover, such as the heavy RF generator mounted above the top cover. Unable to reach the cover. The support frame may further prevent the conventional lifting mechanism from reaching the top cover, even if the top cover may be accessed.

Similarly, the tool may not have sufficient space across the entire surface of the tool, below or inside the tool, to allow conventional lifting mechanisms to access the components of the tool. For example, some traditional lifting mechanisms slide below a semiconductor processing tool and wind up using one or more lifting arms (similar to how the pallet jack may slide below the shipping pallet). Although supported on the floor by long horizontal support legs, some tightly packed tools are needed for such mechanisms to access and move removable components. In addition, there may not be enough space to accommodate the support legs or lifting arms of such a mechanism.

In addition, the occupied area of some conventional lifting mechanisms can adversely affect how close the tools can be positioned, i.e., the separation distance between the tools. For example, some tools provide all of the sufficient distance area, thus allowing some tools to be positioned as close as possible to maximize the floor space of the Fab. It may be necessary to separate by a minimum distance of 1. However, some conventional lifting mechanisms that are moved on the floor and supported by the floor may have an occupied area area that may be greater than the first minimum distance. In these examples, the tools may have to be separated by a distance greater than the first minimum distance in order for these traditional lifting mechanisms to be able to move and operate, thereby. Reduce the spatial placement efficiency of tools on the Fab floor.

These traditional lifting mechanisms also require additional time and effort to access the tool components and move them, assuming they can even access and move them. I have something to do. In addition, when you need to move other components off the path to access them, you can move, remove, and re-install these other components by realigning them additionally. And may need to be calibrated again. This additional time and effort for regular mandatory maintenance and inspection results in unwanted tool downtime. Therefore, it is desirable to have a tool with a lifting mechanism that allows easy, quick, and efficient access to the components of the tool without the need for an undesired amount of time, effort, and tool downtime. ..

Described herein are new devices and systems for driving the components of semiconductor processing tools or cluster tools, all of which are sometimes referred to herein. In some embodiments, features configured to move the components of the tool are integrated within the tool itself. FIG. 1 draws a schematic top view of an example of a semiconductor processing tool comprising two plurality of semiconductor processing chambers. As can be seen in FIG. 1, the tool 100 includes a first plurality of semiconductor processing chambers 102 having five semiconductor processing chambers 104 arranged along a first axis 106 and a second plurality. The semiconductor processing chamber 108 of the above includes five processing chambers 110, also arranged along an axis 112 substantially parallel to the first axis 106. The use of "substantially" herein is that the axes or other elements do not actually have to be exactly aligned, and in this example, these axes are substantially accurate to each other. It may be parallel to, but in the example it also means that it may be parallel to each other within the range of ± 10 °, ± 5 °, or ± 1 °. Each plurality of semiconductor processing chambers includes five processing chambers, but may have 2, 3, 4, 5, 6 or more processing chambers in the embodiment. The tool 100 also includes an upper support framework 114 in which a portion of each of the semiconductor processing chambers 104 and 110 may be fixed and mounted. When one item is "fixed and loaded" on another item, this means that the item is fixed to another item directly or through one or more intervening components, such as support brackets. It means that it will be loaded on another item at the specified position. For example, parts of each of the semiconductor processing chambers 104 and 110 are fixed and mounted on the top support framework 114 such that these parts are fixed to the corresponding positions of those parts with respect to the top support framework 114. To. Other parts of the semiconductor processing chamber 104 may be intended to be removable / movable with respect to the top support framework 114 during periodic inspection operations, as further discussed below.

As described above, the tool 100 has an inspection area 115 that surrounds the occupied area of the tool 100, where a portion of the other tool should not be positioned, and a similar inspection area is similarly on the opposite side of the tool 100. May be present in (but this is not shown). This inspection area 115 can also be thought of as a separation distance between other tools that allows people and equipment to move between the tools. Some embodiments of the tools described herein increase little or no static occupied area of the tool.

The tool 100 may also include a linear guidance system and carriage configured to easily and enable the removal and movement of removable components of the semiconductor processing chamber. As discussed in more detail below, in some embodiments, the linear guidance system may be fixedly connected to the support framework, the carriage may be movably connected to the linear guidance system, and semiconductor processing. It may be configured to be movably connected to the removable components of the chamber, whereby the carriage translates along the linear guidance system to access the removable components of the semiconductor processing chamber, with them. It will be possible to connect and move them.

FIG. 2 draws a perspective view of a first example of a portion of the example of the semiconductor processing tool of FIG. In this figure, the first plurality of semiconductor processing chambers 102 are identified, but the base portion 116 of each of the five semiconductor processing chambers 104 is shown for illustrative purposes only, plus one semiconductor processing chamber. The removable top cover 118 of 104A is shown in the removed state (the remaining top covers of the other semiconductor processing chamber 104 are not shown). Although the interface between each base portion 116 and the top support framework 114 cannot be seen, each base portion 116 of the semiconductor processing chamber 104 is mounted directly or indirectly fixed to the top support framework 114. It's okay. The base portion 116 may be secured and mounted on the upper support framework 114 by any known means such as, for example, bolts, welds, fasteners, or pins.

FIG. 2 also depicts a first linear guidance system 120 and a first carriage 122, which are further depicted in FIG. 3 and discussed further below. The first carriage 122 is included by a dotted line for illustration purposes. The first linear guidance system 120 may be fixed and supported by or mounted on the upper support framework 114, wherein the first linear guidance system 120 is relative to the upper support framework 114. It may include anchoring or connecting the first linear guidance system 120 directly or indirectly to the top support framework 114 so that it is secured in place. The first linear guidance system 120 is also substantially parallel to the first axis 106 (substantially these axes may be, for example, exactly parallel to each other, or ± 10 °, ± 5 to each other. It may be arranged to extend along the second axis 124 (meaning that it may be parallel within the range of ° or ± 1 °).

The first carriage 122 is configured to movably engage the first linear guidance system 120 so that it can be translated along the second axis 124. This configuration is characterized by supporting the first carriage 122 and allowing the first carriage 122 to move within that range along the first linear guidance system 120. May include. For example, the first carriage 122 may have wheels or bearings that can be received by one or more rails or slots of the first linear guidance system 120, thereby the first linear guidance system. The first carriage 122 is supported by 120, and the first carriage 122 can move along the first linear guidance system 120 and the second axis 124 by rotating or sliding. In some embodiments, the movable engagement between the first carriage 122 and the first linear guidance system 120 is such that a person manually drives the first carriage 122 along the first linear guidance system 120. It may be passive so that it can be moved by. In another embodiment described below, this movable engagement may be powered by a carriage translation system capable of pushing the first carriage 122 along the first linear guidance system 120.

FIG. 3 draws a detailed perspective view of a portion of the example of the semiconductor tool of FIG. In FIG. 3, a portion of the first linear guidance system 120, a first carriage 122, and a removable top cover 118 are visible. The first linear guidance system 120 extends along the second axis 124 and is visible to include the two rails 126A and 126B, among the two rails 126A and 126B, of the first carriage 122. The wheels or bearings allow the first linear guidance system 120 to support the first carriage 122 and the first carriage 122 to move along the second axis 124 as indicated by the double-sided arrows 128. , Movably engages.

Next, yet another feature of the first carriage 122 will be discussed. In some implementations, the first carriage may include a first hoisting arm that has one or more links and may be configured to pivot about a vertical axis. In FIG. 3, the first carriage 122 includes a first hoisting arm 130 with a single link 132. The first hoisting arm 130 is configured to pivot around the vertical axis 134 with respect to the first linear guidance system 120 or the upper support framework 114, as indicated by the arrow 136 in the embodiment. 134 is substantially perpendicular to the second axis 124 (substantially perpendicular, in this case, these axes are actually perpendicular, or at least ± 10 °, ± 5 with respect to each other in the example. °, or vertical within the range of ± 1 °). The ability of the first hoisting arm 130 to pivot causes the first hoisting arm 130 to be at least partially numerous in order to engage these components so that they may move the components of the semiconductor processing chamber. It will be possible to move it into the position of. The first hoisting arm 130 is also connected to the first carriage 122 so as to move with the first carriage 122.

The first hoisting arm and removable components connect to each other so that the removable components can be lifted and lowered by the first carriage and moved while supported by the first carriage. It is configured as follows. In some implementations, this configuration includes a first hoisting arm with a hoisting feature engaging interface configured to engage the hoisting features of the removable component. This engagement between the interface and the hoisting feature creates a connection between the first hoisting arm and the removable component, which is removable by the first hoisting arm and the first carriage. Be able to lift, lower and support.

Suitable hoisting features Some examples of engaging interfaces and hoisting features, as well as their physical connection to each other (ie, engagement to each other), are conventional lifting and connecting elements such as lifting hooks or holes. It can be a hoisting ring, a shackle, a threaded connection between elements, pins and holes, a rotary latch, and a cable, strap, or chain. For example, the hoisting feature of the removable component may be a lifting hook connected to the removable component, and the hoisting feature engaging interface may be a cable connected to a first hoisting arm. The engagement between the hoisting feature and the hoisting feature engagement interface of the removable component may be cables and lifting hooks connected together (eg, by bolt or screw). It connects the first hoisting arm to the removable component, which in turn allows the first hoisting arm to lift, lower and move the removable component high.

In some embodiments, the hoisting feature engagement interface engages with a hoisting feature, which is the second structure of the removable component connected to the end of the first hoisting arm. It may have a first structure configured in. For example, as depicted in FIG. 3, the first hoisting arm 130 is a hoisting feature engagement of a first structure 138 connected to an end 140 of the first hoisting arm 130, i.e. a beam 138. Including the interface, a removable component or removable top winding feature, ie, the removable top cover 118 (in some embodiments, also on a removable top plate or removable top). (May be considered), the second structures 142A and 142B. The first structure 138 may engage the second structures 142A and 142B in a variety of ways, including pinning together, bolting, gripping, or screwing.

In some embodiments, the hoisting feature engagement interface may have mechanical features configured to engage the complementary mechanical features of the hoisting feature. For example, FIG. 4A depicts a cross-sectional view of a portion of the example of the first hoisting arm of FIG. 3, and FIG. 4B depicts an off-angle view of the example of the removable top cover of FIG. In FIG. 4A, the beam, i.e., the first structure 138 of the hoisting feature engagement interface, is depicted as holes 144A and 144B, two firsts spaced apart by a first distance of 146. Includes mechanical interface features. These first mechanical interface features are complementary to the second mechanical interface features of the hoisting features of the removable top cover 118. In FIG. 4B, the hoisting features of the removable top cover 118, sometimes referred to herein as saddleposts, that is, the second structures 142A and 142B, are included within the dashed line shape. Each second structure includes a pair of vertical riser rods 148A and 148B, as well as saddle plates 150A and 150B that extend between a pair of vertical riser rods 148A and 148B with an upper limit. Each saddle plate 150A and 150B may also include second mechanical interface features 151A and 151B depicted as pins, these second mechanical interface features 152 may be separated by a first distance of 146. .. Based on these feature configurations, the second mechanical interface features 151A and 151B can be inserted into the first mechanical feature of the hoisting feature engagement interface, namely holes 144A and 144B of the beam 138. Can be thought of as the engagement between the hoisting feature engagement interface and the hoisting feature of the removable component. Alternatively, the pins may be placed on the hoisting beam and the holes may be placed on the saddle plate.

In some embodiments, the first structure 138 of the hoisting feature engagement interface can be connected to removable components using hooks, fasteners, bolts, etc., as well as beams, vertically. A post perpendicular to the beam, similar to one of the riser rods 148A, may also be included. In some such implementations, the hoisting feature may be a hole, screw hole, or other connecting feature that can be connected to the hoisting feature engaging interface.

The first carriage and the first hoisting arm are also movable so that they can move the hoisting feature engagement interface and engage with any hoisting feature among the removable components. .. This mobility, with reference to FIG. 2, goes back along the second axis 124 so that the first carriage 122 may be near or near any one of the semiconductor processing chambers 104. Including the mobility of the carriage 122 of 1, and back to FIG. 3, the first hoisting arm 130 includes the ability to rotate around the vertical axis 134. As the first hoisting arm 130 rotates about the vertical axis 134, the first hoisting arm 130 can move within a plane perpendicular to the vertical axis 134, as discussed in more detail below. It will be possible.

The mobility of the first hoisting arm 130 may also include the mobility of the hoisting feature engagement interface. The hoisting feature engagement interface may be rotatable about one or more axes. Returning to FIG. 4A, the hoisting feature engagement interface is embraced by the dotted line shape 152 and is connected by a joint 158 to the single link 132 of the first hoisting arm 130. A vertical axis 134, an axis 160 parallel to the vertical axis, and two other axes 154 and 156 perpendicular to the axis 160 are drawn in FIGS. 4A and 5. The fitting 158, in which the hoisting feature engaging interface 152 is connected to the link 132 of the first hoisting arm 130, is such that the hoisting feature engaging interface 152 has a vertical axis 134 in this particular example with respect to the first link 132. And two other axes 154 and 156 may be configured to allow rotation about one or more of these axes. For example, the hoisting feature engagement interface 152 may rotate about the axis 156 at the joint 158 with respect to the link 132 and further around the axis 160 parallel to the vertical axis 134 with respect to the link 132. good. In some embodiments, the fitting to which the hoisting feature engagement interface 152 is connected to the link 132 of the first hoisting arm 130 may be a spherical fitting. This spherical joint may allow partial gimbling around an axis parallel to the vertical axis, which may facilitate planar alignment. This spherical fitting may be advantageous as it allows alignment of the chamber lid with respect to the chamber when the chamber and chamber lid are not aligned. In some embodiments, some moving shafts may be lockable using spring plungers, pins, screws, or fasteners to prevent movement around the locked shaft.

In some embodiments, the first carriage may include a first linear guidance system or a vertical translation system configured to translate the hoisting arm perpendicular to the top support framework. This vertical movement of the hoisting arm may further allow the first carriage to engage with the removable component of the semiconductor processing chamber and lift it up and down. In FIG. 5, which draws the same detailed perspective view of a portion of the tool of FIG. 3, the vertical translation system 162 is included by a dotted line shape. The vertical translation system 162 is configured to translate the first hoisting arm 130 vertically along a second vertical axis parallel to the vertical axis 134, exemplifying such translation using the double-headed arrow 164. do. Going back and referring to FIGS. 4A and 4B, the vertical translation system 162 positions the hoisting feature engaging interface 152 on the second mechanical interface features 151A and 151B, i.e., just below the pin, and then the second machine. Interface Features 151A and 151B are inserted into the first mechanical interface features, ie holes 144A and 144B, respectively, thereby engaging the hoisting and hoisting feature engagement interface 152 of the removable top cover 118. It may be possible to move it vertically and upwards to fit. When the hoisting feature engagement interface 152 and the hoisting feature of the removable top cover engage, the removable top cover is lifted and lowered by the vertical translation system 162 without the risk of disconnecting the hoisting engagement interface 152. You can do it.

The vertical translation system 162 may utilize various mechanisms for vertically translating the first hoisting arm 130. For example, the vertical translational system 162 may be a linear ball screw actuator, a hydraulic actuator, a screw actuator, an actuator using a rack and a pinion, or a cable hoisting device. The vertical translation system 162 may also include a motor 166 configured to provide a mechanical input to the vertical translation system 162. For example, the motor 166 may provide mechanical driving force to any of the actuators, such as a linear ball screw actuator.

In some embodiments, the tool seals some parts of the linear guidance system and the first carriage to prevent contamination by particulates and other substances that these movable features give rise to. It may contain one or more bellows, these contaminants can be harmful to the substrate and other aspects of the tool. The interface between the linear guidance system and the first carriage may be one of the mobile components that can generate contaminants, and the linear guidance system and the linear guidance system to create a seal at this interface. It may be advantageous to include bellows surrounding this interface between the first carriages. Vertical translation systems may also have bellows as this system can generate contaminants.

The first carriage, the first hoisting arm, or both may also be movable such that the removable components engaged with the first hoisting arm may be moved. As described above, when the hoisting feature of the removable component and the hoisting feature engagement interface of the first hoisting arm engage, the first carriage is removable, as illustrated in FIG. The components may be configured to translate vertically and in a direction parallel to the vertical axis 134. In addition, the first carriage moves the removable component engaged with the first hoisting arm horizontally or in one or more directions within a plane perpendicular to the vertical axis 134. May be configured to allow 6A-6E depict a sequence of movements of an example of a removable component of the first example of a portion of the example of the semiconductor tool of FIG. These figures are simplified top views of the tool of FIG. 2 without the top support framework for illustration purposes, with FIGS. 3 and 3 and so that the vertical axis extends into the page perpendicular to the page. It is viewed at an angle parallel to the vertical axis of FIG. In this case, the first linear guidance system 120 includes two rails 126A and 126B and extends along the second axis 124. The first carriage 122 is movably engaged with the first linear guidance system 120 so that it can be translated along the second axis 124. The first plurality of semiconductor processing chambers 102 also have a base portion 116 of these semiconductor processing chambers, a first hoisting arm 130, a link 132, and a hoisting feature, ie, a second structure of a removable top cover 118. It is visible with the first hoisting feature engaging interface 152 engaged with objects 142A and 142B.

As shown in FIGS. 6A-6E, the first hoisting arm 130, the link 132, the first hoisting feature engagement interface 152, the first carriage 122, and the removable top cover 118 are on the vertical axis. It can move inside a plane perpendicular to it. FIG. 6A may be considered as the starting position after engagement between the hoisting feature of the removable top cover 118 and the hoisting feature engagement interface 152 of the first hoisting arm 130. In FIG. 6B, the first carriage 122 translates in the direction of arrow 128 along the second axis 124, and the removable top cover 118 moves horizontally 168 perpendicular to the second axis 124. Has been done. This movement of the removable top cover 118 can be thought of as movement within a plane perpendicular to the vertical axis. This movement of the top cover 118 is also indicated by arrow 136 by the rotation of the hoisting feature engagement interface 152 with respect to the link 132 as indicated by arrow 169 and by the linear translation of the carriage 122 along the second axis 124. It is made possible by the rotation of the first hoisting arm 130 about a vertical axis (represented by an "X" labeled 134, which goes into the page). Along with the corresponding movements and rotations of the first hoisting arm 130, hoisting feature engagement interface 152, link 132, and first carriage 122, additional movement of the removable top cover 118 in the horizontal direction 168 is shown in the figure. It can be seen further from 6C to 6E.

The removable components may be moved by methods other than those depicted in FIGS. 6A-6E. For example, the carriage 122 may have one or more of the first hoisting arm 130, hoisting feature engaging interface 152, link 132, and removable top cover 118 centered on an axis parallel to the vertical axis 134. It may remain in a fixed position on the second axis 124 while being rotated. In some examples, only the first hoisting arm 130 is centered on an axis parallel to the vertical axis 134, as indicated by arrow 136, while the other aspects of the first carriage remain stationary. You may rotate. The mobility of the removable component engaged with the first carriage is also not limited to horizontal 168 linear motion or linear motion along the second axis 124. In some embodiments, the motion has a vector component within the range of horizontal 168 and a second axis 124, and a rotational component about an axis parallel to the vertical axis, as shown by arrow 136, and the above. Removable components such as having a rotational component about an axis perpendicular to the first axis within a horizontal plane that includes, but is not limited to, the horizontal direction 168 and the second axis 124 as described in. You may move.

The mobility of the first carriage, the first hoisting arm, or both also allows the removable component engaged with the first hoisting arm to move outside the envelope of the tool. In some embodiments, for example with reference to FIG. 6E, the base portion of the first plurality of semiconductor processing chambers may be located inside the envelope surface 170 and the aforementioned movement of the first carriage 122 is removable. Allows the possible top cover 118 to be moved outside the envelope surface 170. In some embodiments, the removable top cover 118 may be moved outside the envelope surface 170 and into the inspection area surrounding the tool 100 as illustrated in FIG. The envelope 170 may be considered to embrace all of the base portion of the tool's semiconductor processing chamber.

In some embodiments, the first hoisting arm may have a straight section as depicted in FIG. This linear compartment is connected to a pivot compartment 133, which is part of a first hoisting arm 130 that pivots or rotates about a vertical axis 134, as indicated by arrow 136, and a hoisting feature engagement interface. , May be the same as the link 132 extending between the first hoisting arm 130 and the end 140. In some such embodiments, the first hoisting arm may have a straight section and an angled section. FIG. 7 depicts an example of a hoisting arm. In FIG. 7, an example of a hoisting arm includes a linear compartment 732 having an end 740 to which the hoisting feature engaging interface 752 is connected, and also forms an angle extending between the pivot compartment 733 and the linear compartment 732. Includes compartment 772. The angled compartments 772 are oriented at an angle 774 tilted with respect to the vertical axis 134, which may be acute or obtuse, as depicted in FIG. This angle may range from about 15 ° to 75 °, from about 30 ° to 60 °, and includes about 45 °. A hoisting arm at this angle may be advantageous as it allows for a different vertical stroke than a hoisting arm with only a straight section. In some embodiments, the hoisting arm may include two or more links and a large number of fittings, such as elbow fittings and double elbow fittings.

The positioning and alignment of the first linear guidance system and the first carriage may vary, which in turn affects the mobility of the first carriage and the first hoisting arm. In some embodiments, the first linear guidance system may be positioned above the first plurality of semiconductor processing chambers. For example, referring back to FIG. 2, the first linear guidance system 120 is vertically offset above or above the first plurality of semiconductor processing chambers 102 and positioned in a direction parallel to the vertical axis 134. It can be seen that it has been done. In some implementations, the first carriage 122 may be offset vertically below the first linear guidance system 120 in a direction parallel to the vertical axis 134, as can be seen in FIG. In some embodiments, when viewed along a direction parallel to the second axis 124, the first carriage 122 is a first plurality of semiconductor processes such as a first linear guidance system 120 and a base portion 116. It can be considered that it is placed vertically between the part of the chamber 102 and the part of the chamber 102.

The first hoisting arm 130 may be connected to, or may surround, the base portion 116 of various removable components of the semiconductor processing chamber 110 within the first plurality of semiconductor processing chambers 102. Can engage with. These removable components may include, for example, a removable top cover 118, a radio frequency (RF) generator, a pump, or a cold pump. It may be desirable to remove these components from the semiconductor processing chamber for maintenance or inspection of removable components or other parts of the semiconductor processing chamber. Each of these removable components allows the hoisting feature engagement interface to engage with these removable components so that the removable components can be lifted, lowered, and moved. It may include some of the hoisting features discussed above. For example, any of the removable components may have the hoisting features described with respect to FIG. 4B above, or may have conventional hoisting features such as lifting holes, lifting hooks, and the like. Regardless of the type of hoisting feature arranged on top of the removable component, the first carriage and first hoisting arm are to engage with these hoisting features of the removable component. The hoisting feature may be movable so that the engagement interface can be moved.

In some other embodiments, the linear guidance system and the first carriage may be aligned and positioned so that the first carriage can access other aspects of the tool. In order to consider tools with different component configurations, it may be advantageous to have different configurations of linear guidance systems and carriages. For example, the first example of a portion of the tool of FIG. 2 has components arranged in a particular manner that may be sufficient for linear guidance and positioning of the first carriage as described above. In another embodiment, the tool may have removable components arranged such that the linear guidance and first carriage described above do not have to reach such components. In these examples, the charges may be configured differently as described above.

FIG. 8 draws a perspective view of a second alternative example of a portion of the schematic diagram of the tool of FIG. The array of components of the tool 800 is similar to, but different from, the array of components of the tool 100 described above. In the case of FIG. 8, as shown in FIG. 2, in this example, the first plurality of semiconductor processing chambers 802 including three semiconductor processing chambers are arranged along the first axis 806, and each semiconductor processing chamber is on the upper side. Includes a base portion 816 fixedly mounted on the support framework 814. As further visible in FIG. 8, the tool 800 includes a component 874, some of which may be removable, above the first plurality of semiconductor processing chambers 802. These components 874 are positioned and arranged such that it may be advantageous to use, for example, a linear guidance system different from that described above with respect to FIG. 2, a first carriage, or both.

The tool 800 is a second aligned along a second axis 824, including a first rail 878A and a second rail 878B, substantially parallel to the first axis 806, as described above. Includes a linear guidance system 876. These two rails are parallel to each other and are vertically offset from each other along a vertical axis 834 perpendicular to the second axis 824 as described above. The second linear guidance system 876 is also directly or indirectly fixed and supported by the upper support framework 814, and FIG. 8 is a second fixed and mounted directly to the upper support framework 814. Draw a linear guidance system 876. The second carriage 880 is also drawn inside the dotted shape and is visible in more detail in FIG. 9, which depicts the enlarged portion of FIG. In FIG. 9, the second carriage 880 is movably engaged with the second linear guidance system 876 so that both the first rail 878A and the second rail 878B are movably engaged at the same time. It allows translation along the second axis 824 in the direction of arrow 828 as described above. References to the "second" linear guidance system and "second" carriage are not intended to suggest that each "first" example always exists in the same semiconductor processing tool, and are in sequence. It will be appreciated that the indicator representing is simply used to distinguish this linear guidance system and carriage from the examples already discussed.

The second carriage 880 also engages with the elements of the second carriage 880, the ability of the second carriage 880 to rotate about an axis parallel to the vertical axis 834, and the hoisting features of the removable components. First hoisting arm 830, including the inclusion of a hoisting feature engaging interface configured to do so, which may be the same as described above for the first hoisting arm 130. including. In some embodiments, the link 832 may be longer or shorter than the link of FIG. 2 to reach the other components of the tool 800. Further, as described above, the second carriage 880 provides a first vertical translation system 862 configured to translate the second hoisting arm 830 in a direction parallel to the vertical axis 834 as indicated by arrow 864. May include. The first vertical translation system 862 includes a motor 866 configured to drive the vertical translation, which may use pulleys and cables, or screw actuators, as described above.

In some embodiments, the structure of the second linear guidance system and the second carriage allows the second hoisting arm to be translated below, between, and above the second linear guidance system. For example, in FIG. 8, the first hoisting arm 830 translates below the second linear guidance system 876 and between the first rail 878A and the second rail 878B of the second linear guidance system 876. In some implementations, the vertical translation system may even extend above the second rail 878B, translating the second hoist arm to a location above the second rail 878B. to enable. This vertical translation range is such that the hoisting feature engagement interface of the first hoisting arm 830 is below the second linear guidance system 876, with the removable top cover 818 and removable components 882A, etc. To access and access possible components, as well as removable components such as the removable component 882B between the first rail 878A and the second rail 878B (or above the second rail 878B). Allows you to move. In some embodiments, the first carriage allows the first hoisting arm 830 to access and move removable components above the bottom of the second linear guidance system 876. It may be configured to allow.

Some embodiments of the tool may have two or more carriages that simultaneously movably engage the same linear guidance system. For example, the first linear guidance system 120 of FIGS. 2 and 3 may have two first carriages 122 that are movably and simultaneously engaged with themselves. These two first carriages 122 may be duplicates of each other in some implementations. For example, FIG. 10 depicts a tool similar to FIGS. 6A-6E with two first carriages engaged with one linear guidance system. In this case, both the first carriage 122A and the first carriage 122B (which may be considered to be the second carriage) are both the first so that they can both be translated along the second axis 124. It is movably engaged at the same time as the linear guidance system 120. In these embodiments, the first carriage 122A and the first carriage 122B are duplicates and are configured like the first carriage 122 described above. This allows access to and moving a large number of removable components of the semiconductor processing chamber 104, which may increase efficiency and reduce inspection and maintenance time.

Going back and referring to FIG. 1, the tool 100 may have two plurality of semiconductor processing chambers, i.e., a first plurality of semiconductor processing chambers 102 and a second plurality of semiconductor processing chambers 108. The second plurality of semiconductor processing chambers 108 are arranged along a third axis that deviates from the first axis 106 and is substantially parallel to the first axis 106 and can be considered to be the same as the axis 112. It's okay. In FIG. 1, the second plurality of semiconductor processing chambers 108 have a plurality of first semiconductor processing chambers such that the tool has an internal region 184 represented as a dashed line diagram of translucent cross-hatching between the plurality of semiconductor processing chambers. It is offset from the semiconductor processing chamber 102 in another direction perpendicular to the first axis. The internal region may include not only a portion of the upper support framework 114, but also components used for semiconductor processing such as gas boxes, diversified tubes, gas sources, electronic circuits, conduits and the like. .. This internal region 184 also includes one or more substrate transfer robots configured to transfer one or more substrates into or out of the processing chamber, or other aspect of the tool. good. As discussed herein, these substrate transfer robots differ from the disclosed carriages. For example, a substrate transfer robot is typically placed in an internal area, which is a different processing chamber while such a robot still holds the wafer in a controlled environment, for example inside a vacuum transfer module. This is because the wafers can be efficiently transferred between them.

The tool 100 with a large number of semiconductor processing chambers may have a linear guidance system and a carriage for each of the plurality of semiconductor processing chambers. FIG. 11 draws a top view of an example of a semiconductor processing tool similar to the semiconductor processing tool shown in the schematic diagram of the tool of FIG. 1, but shows additional details and features. The first plurality of semiconductor processing chambers 102 may be similar to those described in FIGS. 2 to 7. These semiconductor processing chambers may be arranged along the second axis 124, and the base portion 116 of these semiconductor processing chambers may be fixedly mounted on the upper support framework 114. As described above in FIGS. 2-7, the first linear guidance system 120 and the first carriage 122 are removable, such as the removable top cover 118 of only the first plurality of semiconductor processing chambers 102. Components may be accessed, positioned and configured to move them.

In addition, the second plurality of semiconductor processing chambers 108 may be arranged along the third axis. The second linear guidance system 1120 may be positioned along a fourth axis 1185 that is substantially parallel to the third axis 112 (see FIG. 1). The second carriage 1122 may be movably engaged with the second linear guidance system 1120 and is configured to access and move the removable components of only the second plurality of semiconductor processing chambers 108. May be done. The second carriage 1122 engages with the hoisting features of the removable components of the second plurality of semiconductor processing chambers 108, such as the removable top cover 1118, as described above for the first carriage 122. It may be configured to do so. In some embodiments, the second linear guidance system 1120 may be a duplicate of the first linear guidance system 120 and the second carriage 1122 may be a duplicate of the first carriage 122. The removable components of one plurality of semiconductor processing chambers and the second plurality of semiconductor processing chambers may all have the same design or similar designs. In some other embodiments, the first linear guidance system 120 may be different from the second linear guidance system 1120 and the first carriage 122 may be different from the second carriage 1122. The carriage and the second carriage, respectively, may still be configured to engage the hoisting features of the removable components of their corresponding semiconductor processing chambers.

In some embodiments, the first plurality of semiconductor processing chambers 102, the second plurality of semiconductor processing chambers 108, and the internal region may be arranged inside the envelope surface 170. In some embodiments, at least a portion of the first carriage and / or linear guidance system is positioned outside the envelope surface 170. The first carriage 122 and the second carriage 1122, including the corresponding first hoisting arm and second hoisting arm, move removable components from each of the plurality of semiconductor processing chambers out of the envelope. It may be movable so that it can be moved. Illustrating this in FIG. 11, the removable top covers 118 and 1118 are moved and positioned outside the envelope surface 170.

The hoisting modalities described herein, such as linear guidance systems and first carriages, may include varying degrees of powered and unpowered features. For example, in some embodiments of the tool, the movement of the first carriage 122 along the second axis 124, and the horizontal and rotational movement of the first hoisting arm, are both motor and power. It is not necessary to have a power source to move the first carriage 122 by human power without any mechanical force and to move the first hoisting arm horizontally and in a rotating manner. In some examples, mechanical power, such as a motor or hydraulic application, is one of the first carriage 122 and the first hoisting arm 130, such as the motor moving the first hoisting arm 130 vertically. Multiple modes may be moved vertically. In some other embodiments, the movement of the first carriage along the linear guidance system, as well as the horizontal and rotating movements of the first hoisting arm, are powered by motors, pumps, hydraulic application equipment, etc. It may be a movement by.

Some embodiments of the tools described herein may also include controllers that control various aspects of the tool. In some implementations, the controller is part of one or more processing chambers, one or more platforms for processing, and / or specific processing components (wafer pedals, gas flow systems, etc.). It's okay. These tools may be integrated with electronic circuits to control their operation before, during, and after processing a semiconductor wafer or substrate. Electronic circuits are sometimes referred to as "controllers" that may control various components or subdivisions of the tool. The controller controls when the hoisting system disclosed herein may be powered, depending on processing requirements and / or the type of tool, and for safe and maintainable conditions. Any of the processes disclosed herein may be programmed to control, including monitoring the operating state of the processing chamber. The controller also delivers processing gas, temperature settings (eg heating and / or cooling), pressure settings, vacuum settings, output settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, Includes fluid delivery settings, position and operation settings, wafer transfer into and out of tools and other transfer tools, and / or load locks connected to or interface with specific systems. , Other modes of tool operation may be controlled.

Broadly speaking, the controller receives various integrated circuits, logic circuits, memory (including non-temporary media), and / or instructions, issues instructions, controls operations, enables cleaning operations, and ends. It may be defined as an electronic circuit having software that enables point measurement and the like. Integrated circuits are chips in the form of firmware that stores program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and /. Alternatively, it may include one or more microprocessors or microcontrollers that execute program instructions (eg, software). Program instructions are transmitted to the controller in the form of various individual settings (or program files) that specify operating parameters on or for the semiconductor wafer or for performing specific processing on the system. It may be an instruction. The operating parameters are, in some embodiments, one or more while making the die of one or more layers, materials, metals, oxides, silicon, silicon oxide, surfaces, circuits, and / or wafers. It may be part of a recipe specified by a processing technician to accomplish the processing step.

In some implementations, the controller may be part of a computer that is integrated with the tool, attached to the tool, networked to the tool in other ways, or a combination thereof. May be combined with a computer. For example, the controller may be in the "cloud" or may be all or part of Fab's host computer system, which may allow remote access to wafer processing. The computer monitors the current progress of the production operation, examines the history of past production operations, allows remote access to the system to determine trends or performance indicators from multiple production operations, and parameters of the current process. May be modified to set a processing step that follows the current processing, or to start a new processing. In some examples, a remote computer (eg, a server) can provide processing recipes to the system over a local network or a network that may include the Internet. The remote computer may include a user interface that allows input or programming of parameters and / or settings, which are then transmitted from the remote computer to the system. In some examples, the controller receives instructions in the form of data that specify parameters for each processing step to be performed during one or more operations. It should be understood that the parameters may be specific to the type of processing to be performed and the type of tool the controller is configured to interface with or control. Accordingly, as described above, the controller is by comprising one or more separate controllers networked together to operate towards a common purpose such as the processing and control described herein. Etc. may be dispersed. One example of a distributed controller for such purposes is one or more remotely located integrated circuits (such as at the platform level or as part of a remote computer) that are combined to control processing on the chamber. One or more integrated circuits on the chamber that are in communication with.

Examples of tools include, without limitation, plasma etching chambers or modules, deposition chambers or modules, spin rinse chambers or modules, metal plating chambers or modules, cleaning chambers or modules, bevel edge etching chambers or modules, Physical vapor deposition (PVD) chamber or module, chemical vapor deposition (CVD) chamber or module, atomic layer deposition (ALD) chamber or module, atomic layer etching (ALE) chamber or module, ion injection chamber Alternatively, it may include a module, or a track chamber or module. The tool may have multiple chambers or modules.

As pointed out above, depending on one or more processing steps the tool should perform, the controller may be another tool circuit or module, other tool components, cluster tools, other tool interfaces, adjacent tools. Of the tools used to transport wafer containers to and from adjacent tools, factory-wide tools, main computers, other controllers, or tool locations and / or load ports in semiconductor manufacturing plants. You may communicate with one or more.

In some embodiments, the various hoisting modes of the tool may be powered and the controller is driven to control the movement of the carriage with respect to the linear guidance system and / or the movement of one or more arm links with respect to the carriage. It may be configured to control the system. FIG. 12 draws a top view of the example semiconductor processing tool of FIG. 6E, but also shows additional features. For example, the tool 1200 may have a first linear guidance system 120 including a carriage translation system 1288 configured to translate the first carriage 122 along the first axis 124. The carriage translation system 1288 may include a moving mechanism (such as a motor) capable of pushing out the first carriage 122 along the first linear guidance system 120. For example, the first carriage 122 may have one or more motors that power one or more wheels to move the first carriage 122 along the first linear guidance system 120. .. In another embodiment depicted in FIG. 6A and the like, the first linear guidance system 120 moves the first carriage 122 along the first linear guidance system 120 when the linear ball screw 189 is actuated by the motor 191. There may be a linear ball screw actuator with a motor 191 configured to turn the linear ball screw 189 connected to the first carriage 122.

The tool 1200, in some implementations, is configured to move the first hoisting arm 130 in a plane perpendicular to the vertical axis as described above, represented by the hoisting arm movement represented by the box 1290. It may have a first carriage that further includes a system. This configuration may include the ability to drive one or more pivot points of the first hoisting arm to rotate about a direction parallel to the vertical axis. For example, the first carriage 122 includes a motor connected to the first link 132 in a pivot compartment 133 capable of rotating the first link 132 around the vertical axis 134 in the direction of arrow 136. It's fine. The first carriage 122 is also exemplified above in 169 of FIGS. 6C-6E, and as can be seen in FIG. 4A, the hoisting feature engaging interface 152 can be rotated about the axis 160, hoisting. Features Another motor connected directly or indirectly to the engagement interface 152 may be included. This other motor, air system, or hydraulic system may be located on the first hoisting arm or inside the first carriage 122, including pulleys, belts, drive chains, drive screws, gears. It may be connected to the hoisting feature engagement interface 152 through an interlocking mechanism or the like. In some implementations, the hoisting arm moving system also has the hoisting feature engagement interface 152 centered on one or more axes perpendicular to the vertical axis, eg, a first axis as described above. It may be possible to rotate around an axis parallel to the interface. The tool 1200 also includes the vertical translation system 162 described above, configured to translate the first hoisting arm 130 along a vertical axis 134.

The tool 1200 also includes a controller 1292, which is similar to, for example, the controller described above, employed to control the carriage translation system and hoisting arm movement mechanism. Controller 1292 may include one or more non-temporary storage elements 1294 and one or more processors 1296. Processor 1296 is one or more CPUs, ASICs, one or more general purpose computers and / or one or more dedicated computers, one or more analog and / or digital input / output connections, one or more. It may include a step motor controller board and the like.

The controller 1292 may be communicably connected to the carriage translation system 1288, the hoisting arm movement system 1290, and the vertical translation system 162. FIG. 13 depicts a block diagram of a portion of the example of the semiconductor processing tool 1200, and as can be understood, the controller 1292 is a semiconductor processing chamber 104 in the first plurality of semiconductor processing chambers 102. , Carrying translation system 1288, hoisting arm movement system 1290, and vertical translation system 162 communicably connected. The controller 1292 also controls one or more processors 1296 to store instructions in the non-temporary memory 1294 for moving the first carriage 122 including the first hoisting arm 130. This command causes the carriage translation system 1288 to move the first carriage 122 along the second axis 124, and causes the vertical translation system 162 to move the first link 132 and hoist as described above. Features The engagement interface 152 is included to allow the first hoisting arm 130 to move vertically, as well as to the hoisting arm movement system 1290 in a plane perpendicular to the vertical axis 134 as described above. It includes moving the hoisting arm 130 of 1.

In some embodiments, the controller 1292 also controls one or more processors 1296 to handle the hoisting and hoisting feature engagement interface 152 of one removable component in the semiconductor processing chamber 104. The instruction to engage with is stored in the non-temporary memory 1294. These commands are linear translations along the second axis 124, vertical movement of the first hoisting arm 130, and horizontal movement of the first hoisting arm 130, i.e., within a plane perpendicular to the vertical axis. Causes various movements of the first carriage 122, such as movements of the first carriage 122. For example, referring back to FIGS. 4A and 4B, the instruction is that the hoisting feature engaging interface 152 including holes 144A and 144B is the second mechanical interface feature 151A and 151B of the hoisting feature, i.e. the second. The vertical translation system 162 may be made to move the first hoisting arm 130 in a direction parallel to the vertical axis 134 so as to be below the structures 142A and 142B of the above. The instruction also aligns the first hoisting arm 130, which may include the hoisting feature engaging interface 152, with the vertical axis so that the second mechanical interface features 151A and 151B are aligned using the holes 144A and 144B, respectively. It may be moved linearly or either so that it rotates within a vertical plane. When these features are aligned (which may be determined, for example, based on the output of various sensors configured to detect such alignment), the instructions are given by the second mechanical interface features 151A and 151B. Vertical so that they are inserted into holes 144A and 144B, respectively, and in some embodiments the saddle plates 150A and 150B are in contact with the hoisting feature engagement interface 152 by manual user input. The translational system 162 may or may not allow the first hoisting arm 130 to move upward, in a direction parallel to the vertical axis 134.

Removable component hoisting feature and first hoisting arm hoisting feature When the engagement interfaces engage with each other, the instruction controls one or more processors to make the removable component vertical. It may be lifted and / or lowered in a direction parallel to the axis, and similarly, the instructions may be on the hoisting arm moving system, the carriage translation system, or both, as described above, in the first winding. The removable component may be moved within a plane perpendicular to the vertical axis by allowing the upper arm to move. For example, controller 1292 may include instructions that give rise to the sequence of motion described for FIGS. 6A-6E.

In some implementations, the instruction may cause only the first hoisting arm movement system to move the first hoisting arm while the first carriage remains stationary. In some embodiments, with respect to FIGS. 6A-6FE, one coupled to the simultaneous translation of the carriage, eg, the removable component moves along a generally linear axis perpendicular to the translation axis of the carriage. Alternatively, as described above for the rotation of multiple hoisting arm links, the command may cause both the hoisting arm movement system and the carriage translation system to move the first hoisting arm. In another embodiment, the instruction may cause only the carriage translation system to move the first hoist arm while the hoist arm movement system is not moving the first hoist arm. In an exemplary example, with reference to FIG. 12, the hoisting feature engagement interface 152 engages the hoisting feature of the removable top cover 1218, and the carriage translation system 1288 attaches the first carriage 122 and thus. The removable top cover 1218 may be translated along the second axis 124. During this movement, the hoisting arm moving mechanism 1290 and the first vertical translation system 162 do not have to move the first hoisting arm 130.

The instruction also provides, for example, a removable component hoisting feature and a first hoisting arm hoisting feature engagement interface after the removable component has been returned to its original location and re-installed. Separate. In FIGS. 4A and 4B, this disconnection may include lowering the first hoisting arm 130 so that the second mechanical interface features 151A and 151B are removed from the holes 144A and 144B.

In some embodiments, the tool may also include a first carriage position sensor configured to generate information about the position of the first carriage along the first linear guidance system. Going back and referring to FIG. 13, the first carriage position sensor 1298 appears to be positioned on top of the first carriage 122 and the controller 1292 can receive the data generated by the first carriage position sensor 1298. As such, it is communicably connected to the controller 1292 through a wired or wireless connection. From this data, controller 1292 also provides data on which of the semiconductor processing chambers 104 is closest to the first carriage 122 and which is in close proximity to or next to the first carriage 122. Can interpret and determine the position of the first carriage 122 along the first linear guidance system 120, including. For example, in FIG. 13, the first carriage position sensor 1298 may generate data indicating that the first carriage 122 is closest to the semiconductor processing chamber 104A and closest to the semiconductor processing chamber 104B. The position of the carriage may allow a determination as to which semiconductor processing chamber the hoisting arm can access. In the embodiment in FIG. 6A, the carriage position sensor 1298 has a given first carriage 122 next to both semiconductor processing chambers 104A and 104B, with a first hoisting arm removing both of these processing chambers. It may indicate that the possible components may be accessible.

In some implementations, the tool may also include a first arm position sensor configured to generate data regarding the position of the first hoisting arm with respect to the semiconductor processing chamber. In FIG. 13, the first arm position sensor 12100 is positioned on the first hoisting arm 130 and is wired so that the controller 1292 can receive the data generated by the first arm position sensor 12100. Alternatively, it is communicably connected to the controller 1292 through a wireless connection. The controller 1292 also assumes which hoisting feature the first hoisting arm 130 can engage with, given the position of the first carriage 122, which one or more processing chambers 104 are the first hoisting. Close to or next to the upper arm 130, or the location of the pivot compartment (ie, shoulder) of the first hoisting arm 130 with respect to each semiconductor processing chamber 104, each removable on each semiconductor processing chamber 104. Positioning of the first hoisting arm 130 with respect to the hoisting feature of the component, and position of the first hoisting arm 130 along the vertical axis (eg, first hoisting with respect to the hoisting feature of the removable component). Vertical Position of Arms and Hoisting Features The position of the first hoisting arm 130 with respect to each semiconductor processing chamber 104, including determining the vertical position of the engagement interface), is interpreted and determined from the carriage position data and / or the arm position data. can do. The data may also include the distance from various features of the tool to the mode of the first hoisting arm 130 (this may be done, for example, by using adjacent sensors). In some embodiments, the tool may also include an arm position sensor configured to generate data about the position of the hoisting arm rotated about a vertical axis. From this data, the controller may determine, for example, whether the arm is properly positioned to avoid known injuries when translating vertically or whether its hoisting features engage. The controller may also include instructions that the vertical translation system translates the arm vertically above or below a certain height, or does not translate.

For example, the first arm position sensor 12100 determines the position of the first hoisting arm, including the horizontal and vertical positions of the hoisting feature engagement interface of the first hoisting arm with respect to the hoisting feature of the semiconductor processing chamber. The indicated data may be generated and this position data can be used to determine which hoisting feature the first hoisting arm 130 can engage with. For example, in FIG. 6A, the first arm position sensor 12100 can be used by the controller to determine that the hoisting feature engagement interface can engage the hoisting feature of the semiconductor processing chamber 104A. May be generated. As pointed out above, the controller may determine the position of the first arm 130 along the vertical axis to further determine the positioning of the first arm 130 with respect to the hoisting features of the removable component. .. In some embodiments, the tool may have two or more arm position sensors that generate all the information about the position of the first hoisting arm with respect to one or more processing chambers.

In some embodiments, the tool also has an engagement sensor configured to generate data as to whether the hoisting feature engagement interface has engaged any hoisting feature in the semiconductor processing chamber. May include. In FIG. 13, the engagement sensor 12102 is positioned on the first hoisting arm 130 and the controller 1292 is connected through a wired or wireless connection so that the data generated by the engagement sensor 12102 can be received by the controller 1292. Connected to communicable. From this data, controller 1292 can also interpret and determine whether the hoisting feature engagement interface has engaged any of the hoisting features. For example, the engagement sensor 12102 has another conductivity on the hoisting feature such that when the hoisting feature engaging interface engages the hoisting feature, electrical continuity is created between these conductive surfaces. It may be a conductive surface configured to be in electrical contact with the surface. Looking back at FIGS. 4A and 4B, for example, the first conductive surface is the underside of the saddle plates 150A and 150B when the hoisting feature engaging interface 152 engages with the hoisting features 142A and 142B. It may be positioned above the top surface of the first structure 138 which can contact the second conductive surface. Controller 1292 may detect the presence of an electrical community between these two surfaces to determine the engagement between the hoisting feature engagement interface and the hoisting feature. The engagement sensor may be another type of sensor such as a proximity sensor, a contact switch, a visual sensor, and the like. In some embodiments, the controller 1292 prevents the vertical translation system from translating the first arm vertically, or when the hoisting feature engagement interface is not engaged with any of the hoisting features. Do not translate above a certain height (resulting in sufficient vertical translation to cause engagement between the hoisting feature and hoisting feature engagement interface, but with a lifting load on the removable component. It may include instructions (to prevent further translations that act to actually add).

In some embodiments, the tool also includes an alignment sensor configured to generate data as to whether the hoisting feature engagement interface is aligned with any hoisting feature in the semiconductor processing chamber. It's fine. In some embodiments, this data may be used to determine if the vertical movement of the first hoisting arm 130 results in an engagement between the hoisting feature and the hoisting feature engagement interface. .. The alignment sensor is positioned on the first hoisting arm 130, removable components, or both so that the controller 1292 can receive the data generated by the alignment sensor in a wired or wireless connection. It may be communicably connected to the controller 1292 through. Therefore, from this data, the controller 1292 is suitable with the hoisting features of any removable component such that the vertical movement of the first hoisting arm engages these items. Can be interpreted and determined whether or not they are engaged in. For example, referring back to FIGS. 4A and 4B, the alignment sensor causes the upward movement of the first hoisting arm 130 to insert the second mechanical interface features 151A and 151B into the holes 144A and 144B. Generates data so that the controller 1292 can determine whether holes 144A and 144B are directly below the second mechanical interface features 151A and 151B and are aligned with the second mechanical interface features 151A and 151B. You may be able to. Such alignment sensors may be, for example, visual sensors, magnetic sensors, or proximity sensors.

The controller may utilize data from any of the sensors referenced above to implement movement of the first carriage and removable components, as described above. For example, with reference to FIG. 13, controller 1292 may first determine the positioning and alignment of the first carriage 122, and as shown in FIG. 13, these determinations are such that the first carriage 122 is the semiconductor processing chamber. Positioned closest to 104B, the first hoisting arm 130 was positioned closest to the semiconductor processing chamber 104C, and the hoisting feature engagement interface was not engaged with any hoisting feature. .. If it is desirable to move the removable components of the semiconductor processing chamber 104A, the controller 1292 uses these judgments and data to allow the first hoisting arm 130 to engage with the hoisting features of the semiconductor processing chamber 104A. The first carriage 122 and / or the first hoisting arm 130 may be moved so that they can be fitted. This movement commands the carriage translation system 1288 to move the first carriage 122 closer to the semiconductor processing chamber 104A, as well as the first hoisting arm 130 to the semiconductor processing chamber 104A than depicted in FIG. It may include rotating the first hoisting arm 130 so that it is close to, for example, by approximately 180 ° in a clockwise direction.

In some embodiments, the tool may have various safety features. For example, the controller may be configured to receive information about the operating state of each semiconductor processing chamber. This operating condition includes whether the semiconductor processing chamber is actively processing the substrate, the chamber is unpowered, the pressure is ambient pressure, and volatile chemicals have been removed from the chamber. It may be whether the semiconductor processing chamber is in a safe condition for human access to the chamber. If the controller receives or determines that one of the semiconductor processing chambers is in a human-safe state, the carriage translation system, hoisting arm movement system, and / or vertical translation system The removable components of the semiconductor processing chamber may be allowed to operate and move. Similarly, if the controller receives or determines that one of the semiconductor processing chambers is not in a human-safe state, it receives a carriage translation system, a hoisting arm movement system, and / or vertical. The translational system may be prevented from operating to operate the removable components of its semiconductor processing chamber (although the controller may be on other tools in safe conditions for such activities. It may allow the movement of removable components of the chamber).

In some embodiments, each semiconductor processing chamber may have an electrical interface, such as an electrical outlet, configured to be connectable to the electrical cable of the first carriage, such electrical interface. , May be placed on the removable portion of each semiconductor processing chamber. This electrical cable may be electrically connected to a power source on the first carriage or to another power source on the tool such as the system power distribution box (SPDB) of the tool. The power may be routed from the SPDB to the first carriage along a linear guide, terminated by a hoisting mechanism, and further routed along the first hoisting arm by an electrical cable. The electrical cable may be terminated by a connector configured to connect to any of the electrical interfaces in the removable component, and when powered and the connector connected, to such component. It may be configured to supply power. By powering the removable components, the motors located on the removable top cover are driven during calibration for the removed removable components, and the removable top cover. It will be possible to carry out inspection work such as shortening the inspection recovery time by keeping the equipment (pressure gauge, etc.) located above in a warm state by being supplied with electric power.

In some embodiments, the electrical interface may be used as part of a safety protection device. For example, the controller may include instructions for determining electrical continuity between an electrical cable and an electrical interface. If this electrical continuity is determined to exist, the controller may allow the vertical translation mechanism or other moving mechanism to operate on the first carriage. Additionally, the controller may be able to determine if the chamber is in atmospheric condition and allow the movement of removable components such as the top plate if the chamber is in atmospheric condition. In some embodiments, the chamber produces an atmospheric signal that can be detected by the controller and relays it through an electrical interface and electrical cable. Atmospheric signals may indicate that the chamber is in and is not in atmospheric conditions.

In some embodiments, the electrical cable may be routed along the first hoisting arm, the connector, and the hoisting feature engagement interface of the first hoisting arm, respectively, in the semiconductor processing chamber at once. It may consist of only one electrical interface and a length that can be engaged simultaneously with the hoisting feature. For example, going back and referring to FIG. 5, the first carriage 122 is routed along the first hoisting arm 130 and the connector 1106 can be connected to the electrical interface 1108 of the removable top cover 118. Includes an electrical cable 1104 of such length. Also, the length of the electrical cable 1104 is removable when the connector 1106 is simultaneously connected to the electrical interface 1108 and the hoisting feature engagement interface of its semiconductor processing chamber, as described in FIGS. 4A and 4B. Allows engagement with the hoisting feature of the top cover 118, but any other removable while the hoisting feature of the drawn removable top cover 118 and the first hoisting arm are engaged. Prevents the connector 1106 from being connected to a similar electrical interface on the top cover. For example, referring to FIG. 12, the length of the electrical cable 1104 is such that the semiconductor processing chamber 104B is removable when the hoisting feature and hoisting feature engagement interface of the removable top cover 118 of the semiconductor processing chamber 104A are engaged. It prevents the electrical interface 1108 and the connector 1106 of the upper cover 118 from being connected at the same time.

In some other embodiments, the electrical interface may provide power to the components on the carriage. The electrical interface may be positioned on a fixed location in each semiconductor processing chamber, or on a removable top component, the electrical cable is the motor of the vertical translation system and (if present). Is configured to be connected to one or more of the motors of the first carriage, such as the motor of a hoisting arm transfer system, and to any electrical interface among the removable components. It may be terminated by a connector and may be configured to power such components when powered and connected.

In some implementations, the controller may also include instructions for powering the electrical interface of the semiconductor processing chamber based on data obtained from one or more of the sensors mentioned above. For example, in some embodiments, the controller is based on the determination of the position of the first carriage to only the electrical interface of one semiconductor processing chamber in the first plurality of semiconductor processing chambers at a time. Power may be supplied only when it is determined that it is safe to remove the cup cover. If multiple carriage / hoisting devices are included for a single multiple semiconductor processing chamber, such functionality may be extended to include only the electrical interface of a particular semiconductor processing chamber of the carriage / hoisting arm. Only when one is determined to be in a suitable position to remove the removable component from its semiconductor processing chamber, and also when it is determined that the semiconductor processing chamber is in an operational safe state. , May be able to supply power. Referring to FIG. 13, as an example, the controller 1292 receives data from the first carriage position sensor 1298 regarding the position of the first carriage 122, determines the position of the first carriage based on this data, and then determines the position of the first carriage. Since the hoisting feature of the arm 130 of 1 can reach only the removable components of the semiconductor processing chamber 104A1, only the electrical interface of the semiconductor processing chamber 104B (when the chamber is in a "safe" state). Supply power (after being determined). As pointed out above, this "safe" condition is any volatility when the chamber is unpowered, the chamber pressure is ambient pressure, and the temperature at which the removable component is handled by a person is low enough. When a person can safely access the chamber, such as when sexual or harmful chemicals are also removed from the chamber, and when removable components are unstrapped or unbolted from the chamber. May be.

Similarly, the controller 1292 controls the processor 1296 by the hoisting feature engagement interface 152 of the first hoisting arm 130 based on the determination of the positions of the first hoisting arm 130 and the first carriage 122. It may include an instruction to power only the electrical interface 1108 of the semiconductor processing chamber among the first plurality of semiconductor processing chambers having an engageable hoisting feature. Again, for example in FIG. 13, these determinations are that the hoisting features of the removable components of the semiconductor processing chamber 104A are engageable by the hoisting feature engaging interface of the first hoisting arm 130. For this reason, the controller 1292 may then indicate that it may power the electrical interface 1108 of the semiconductor processing chamber 104C.

In addition or instead, the controller, as described above, has a hoisting feature engagement interface in one hoisting in the removable top cover of the semiconductor processing chamber in the first plurality of semiconductor processing chambers. In response to determining that the feature is engaged, only the electrical interface of the semiconductor processing chamber in the first plurality of semiconductor processing chambers including its removable top cover may be powered. In FIG. 13 as an example, based on the data generated by the engagement sensor 12104, the first arm position sensor 12100, and the carriage position sensor 1298, the hoisting feature engagement interface of the first hoisting arm 130 is semiconductor processed. It may be determined that it is engaged with the hoisting feature of the removable component of chamber 104C, and based on that determination, controller 1292 may determine that power may be supplied only to the electrical interface of semiconductor processing chamber 104C. It's okay.

In some embodiments, the engagement sensor may be thought of as a first interlock sensor configured to generate data as to whether the hoisting feature engages the hoisting feature engaging interface. .. The instruction causes the controller to control the processor, and based on the data generated by the first interlock sensor, one of the hoisting features and hoisting features among the removable components of the first plurality of semiconductor processing chambers. It may be made to determine whether the engagement interface is engaged. The instruction not only received the first input signal to operate the vertical translation system, but also determined that one hoisting feature in the removable top cover and the hoisting feature engaging interface were engaged. In response, the vertical translation system may translate the first hoist arm vertically. The instruction not only received the first input signal to operate the vertical translation system, but also said that one hoisting feature in the removable top cover and the hoisting feature engaging interface were not engaged. In response to the determination, the vertical translation system may prevent the first hoisting arm from being translated vertically.

In some embodiments, another safety feature that may be included is that the movement of the first hoisting arm is, for example, substantially (substantially meaning within ± 10 °) 180 °. Alternatively, the fan shape may be limited to less than 360 °, such as within the fan shape range of 270 °. This limitation is provided by using one or more physical hard stops, such as one or more pins, which prevent the first hoisting arm from rotating to a location outside the sector. If good or present, it may be provided by a command inside the controller that prevents the motor from rotating the first hoisting arm to a position outside the sector. In some embodiments, the first hoisting arm, restricted so that it can move only on the first side of the vertical plane passing through the first carriage, is parallel to the vertical axis and the second axis. Is perpendicular to. For example, reference to FIG. 6B shows a vertical plane 1110, which is substantially perpendicular (eg, parallel within ± 5 °) to a second axis 124 that is substantially parallel to the vertical axis 134 (eg, parallel within ± 5 °). For example, it is vertical within a range of ± 5 °), and the vertical plane 1110 passes through the first carriage 122. In this case, the first hoisting arm 130 can rotate only at a position arranged on the left side of the vertical surface 1110. As stated above, the instruction may control one or more processors to move the first hoisting arm 130 only on the first side of this vertical plane 1110, i.e. only on the left side. Alternatively, such rotation limiting features may operate to limit the rotational movement of the hoisting arm only to the right position.

To avoid any possibility of confusion, the carriages and hoisting arms discussed herein are not equivalent to robotic arms or end effectors intended or configured to transfer the substrate. Please note. Moreover, the removable components of the semiconductor processing chamber described herein should not be viewed as a substrate, and the hoisting arms described herein may be configured to support the substrate or. It is not intended, as well as the hoisting feature engagement interface is configured or not intended to support the substrate.

In some implementations, the winding is intended to be permanently mounted on the semiconductor processing tool and can be separated from the semiconductor processing tool instead of the carriage and hoisting arm system fully supported by the attached linear guidance system. The above system may be used. In such an alternative system, the hoisting arm may be attached to a removable vertical member equipped with a vertical translational system (a reference to "vertical" in this embodiment is that the hoisting system is on a semiconductor processing tool. It should be understood that it refers to the orientation of the components when installed, apparently when such a hoisting system is removed from the semiconductor processing tool, rotated 90 ° and placed horizontally on the floor. , The parts previously described as "vertical" are technically horizontal and vice versa, and for the purposes of the present disclosure, such components are still potentially "vertical". It can be described as "na"). The removable vertical member is the corresponding attachment point where the removable vertical member is placed at various locations on the semiconductor processing tool, such as the upper support framework or the other lower part of the tool, such as the lower framework. May include one or more mechanical interfaces that allow connection with. The bottom of the vertical member is a roller or wheel that is positioned to rotate the vertical member within a semiconductor processing facility and to be positioned where different semiconductor processing tools and vertical members can interface. You may equip it. The vertical member itself may have one or more arm links supported by a vertical translation system mounted on it. Once the vertical member is attached to the top support framework for the semiconductor processing tool, a vertical translation system may be used to vertically drive one or more arm links up and down.

Such hoisting systems are removable so that they cannot be self-supporting and / or, for example, through attachment points on the upper support framework, without attaching to any form of support on the tool. It may be designed so that it cannot support the components. Thus, for example, in some embodiments, the hoisting system generally reaches a location beneath the hoisting arm and is due to the weight of the hoisting arm (and whatever the hoisting system is lifting). It may lack support legs (as already discussed in this disclosure) that act to prevent the hoisting system from falling. In another example, the hoisting system may have a lightweight support system that can only support the weight of the hoisting system itself, but not the weight of removable components. Existing self-supporting hoisting systems generally include legs or equivalent structures that extend directly below the hoisting arm. In contrast, the removable hoisting systems discussed herein are unable to support the weight of hoisting arms and / or removable components without some form of external support.

When the hoisting system adheres to a semiconductor processing tool through one or more attachment points, the attachment points primarily serve to receive lateral loads, whereas axial (vertical) loads are rather removable. Out through the length of the vertical member and through the bottom of the removable vertical member (perhaps through wheels that may be placed at the base of the removable vertical member, for example in some examples). It may be routed to the floor of the equipment, so any torque resulting from vertical loads applied off the centerline of the removable vertical member is applied by one or more attachment points to which the hoisting system adheres. It may be invalidated by the resistance force that is applied. In some embodiments, the attachment point may receive a lateral load, and some or all of the vertical load. In this case, the tool is the lateral load of the hoisting system, and vertical. It may include upper and lower attachment points that can support some or all of the load. The torque described above can be nullified by these numerous attachment points at the ends of the vertical members of the hoisting system. Vertical loads can also be routed to vertical members, to upper attachment points and upper support frames, as well as to lower attachment points, and finally to the floor as opposed to passing through the wheels of the hoisting system. This allows the vertical member and its moving mechanism to be lighter and have a smaller load-bearing structure.

Such hoisting systems may have a very small footprint and may be lighter than self-contained hoisting systems, as they do not need to support themselves. This makes the hoisting system easier for humans to handle and can be used in tighter locations.

Accordingly, the present disclosure includes additional alternative embodiments of another example of a semiconductor processing tool that does not have the linear guidance system and carriage described above but rather has a separable hoisting system. In these alternative hoisting system embodiments, the tool still includes a top support framework, multiple semiconductor processing chambers arranged along a first axis, and a base portion fixed and attached to the top support framework. It's fine. In some such implementations, the semiconductor chambers may be arranged in a circular arrangement, eg, in a manner other than along a linear axis.

In some of these alternative embodiments, the separable hoisting system is supported by the Fab floor, can be connected to the support frame at a high point of attachment, and has a hoisting arm. The separable hoisting system is mobile so that it can be moved alongside the tool on the Fab floor inside the inspection area and then secured to the top support framework at a point of attachment on the top support framework. Is. Once connected to the top support framework in place, a hoisting arm and vertical translation system are used to lift, lower, and move one or more removable components of the semiconductor processing tool. As discussed in more detail below, the hoisting arm and vertical translation system may be the same as or similar to the hoisting arm and vertical translation system discussed above.

FIG. 14 depicts another example of a semiconductor processing tool, which is similar to FIG. 2, but with significant differences. In these embodiments, another example 1400 of the tool as described above is a semiconductor in a first plurality of semiconductor processing chambers 1402 arranged along a top support framework 1414, a first axis 1406. A removable top cover 1418 and the like, with hoisting features such as a second structure 1442 as described above, as well as a base portion 1416 fixed and attached to the processing chamber 1404 and the top support framework 1414. Also includes removable components of.

In contrast to the tool 100, another tool 1400 includes an attachment system that may include one or more attachment points 14112 secured and supported by the upper support framework 1414. In some embodiments, the two or more attachment points 14112 may be connected to the top support framework 1414 in a fixed position with respect to the top support framework 1414 along the second axis 1424. In some other embodiments, the attachment system may include a guide rail to which one or more attachment points are movably connected. For example, the shaded and highlighted guide rail 14114 in FIG. 14 extends along a second axis 1424 similar to the first linear guidance system described above and has one or more attachment points. The 14112 is movably connected to the guide rail 14114 so that it can be translated along the second axis 1424 as indicated by the arrow 1428. In some such implementations, the attachment point is to be fastened so that it is secured in space with respect to the guide rail when tightened, or to be slidable along the guide rail when loosened. It may be loosened to allow new tool configurations or modifications to be adapted to maintenance procedures by readjusting the location of the attachment points. As discussed above, one or more attachment points 14112 of the attachment system serve as a place where the separable hoisting system can be attached to or attached to the top support framework 1414, i.e., a high attachment point. Fulfill.

15A and 15B depict side views of another example of the semiconductor processing tool of FIG. 14 and a first example of a separable hoisting system. In FIG. 15A, one base portion 1416 is visible attached to the top support framework 1414 and has a removable component 1418. One attachment point 14112 is also seen to be connected to the top support framework 1414, which attachment point may be a mobile connection point as discussed above or a fixed connection point. good. A first example 14116 of a separable hoisting system is also visible and includes a vertical member 14118 having an upper end 14120 to which a complementary attachment point 14122 is attached and a lower end 14124 to which a moving mechanism 14126 such as a wheel or track is attached. The moving mechanism 14126 may be positioned and supported by the Fab floor 14128 so that the first example 14116 of the separable hoisting system can move in different directions around the Fab floor. do. Complementary attachment points 14122 are configured to be connected to or adhere to attachment points 14112 of the attachment system as illustrated in FIG. 15B, and complementary attachment points 14122 and attachment points 14112 are exemplified by identifier 14127. The first example 14116 of the separable hoisting system attaches to the top support framework 1414 when connected. This adhesion allows the first example 14116 of a separable hoisting system to have a relatively small footprint within the inspection area 1415 that can be fitted in the immediate vicinity of the tool 1400, and the heavy removal of the tool 1400. A side support that allows the possible components to be lifted, lowered and supported is provided in the first example 14116 of a separable hoisting system. Without this high adhesion between the top support framework 1414 and the separable hoisting system 14116, the first example 14116 of the separable hoisting system could lift, move and support the removable components. Rather, it would fall without a support feature that extends along the Fab floor, such as a leg that extends from a conventional lifting mechanism, which may be wider than the area allowed between the tools.

A first example 14116 of a separable hoisting system also includes a hoisting arm 14130 which may be the same as or similar to the first hoisting arm described above. For example, the hoisting arm 14130 may include a hoisting feature engagement interface as described above, a vertical extending through a vertical member 14118 perpendicular to a second axis 1424 and a first axis 1406. It may be configured to pivot around a shaft 1434. In some embodiments, the first example 14116 of a separable hoisting system is also configured to translate the hoisting arm 14130 along the vertical axis 1434 in the direction of arrow 1464 as described above. A vertical translation system 14132 may be included. As mentioned above, the vertical load of the removable component is transferred to the Fab floor by the hoisting arm 14130, and the first example 14116 of the separable hoisting system and the Fab floor connection. Retained by 14118.

The vertical translation system 14132 may be motor driven or manually powered by a hand-cranked crank, cable and winch, as depicted in FIG. 15B. In some embodiments, when the complementary attachment point 14122 of the first example 14116 of the separable hoisting system is connected to the top support framework 1414 at the attachment point 14112, the hoisting arm 14130 is a first plurality. The hoisting feature engagement interface is movable so as to engage one of the hoisting features in the removable components of the semiconductor processing chamber 1404 in the semiconductor processing chamber 1402. The mobility of the hoisting arm 14130 may be the same as described above, including, for example, the mobility depicted in FIGS. 6A-6E, and as a result, the hoisting arm 14130 may be horizontal or vertical axis 1434. Can be moved inside a plane perpendicular to.

In some embodiments, the first example 14116 of a separable hoisting system is configured to translate along a second axis 1424. In some such embodiments, the attachment system is a movable attachment point 14112 that is movable along a guide rail 14114 and a second axis 1424 connected to the guide rail 14114, as described above. As a result, when the complementary attachment point 14122 of the first example 14116 of the separable hoisting system is connected to the top support framework 1414 at the attachment point 14112, the first example of the separable hoisting system. Example 14116 and attachment point 14112 of 1 can move together along a second second axis 1424 as indicated by arrow 1428 in FIG. In FIGS. 15A and 15B, this movement can be considered to be in and out of the page. This movement allows the first example 14116 of the separable hoisting system to connect to any of the removable components of the first plurality of semiconductor processing chambers 1402 and lift, move and lower it. become. In such an embodiment, the moving mechanism 14124 is in contact with the floor 14128 of the Fab, with the vertical member 14118 along the second axis 1424 along with the rest of the first example 14116 of the separable hoisting system. Allows you to move.

In some embodiments, a second example of a separable hoisting system that is configured similar to the first example of a separable hoisting system but differs in some respects may be provided. This second example of a separable hoisting system is a vertical member, a hoisting arm, at least one attachment point for connecting to a tool, and this second example of a separable hoisting system is a semiconductor processing facility. Includes wheels or rollers that allow them to move around, and additional features and configurations described herein. In some examples, a second example of a separable hoisting system can support the load of removable components without being connected to a tool, even if it cannot stand on its own. It does not have to be. FIG. 16 includes a vertical member 16118 with an upper end 16120 having a high attachment point 16121 (also referred to herein as a complementary attachment point) and a lower end 16124 having a movement mechanism 16126 such as a wheel or track, and hoisting. Draw a perspective view of a second example 16116 of a separable hoisting system further comprising an arm 16130 and a vertical translation system 16132.

In some embodiments, the hoisting arm 16130 may be the same as or similar to the first hoisting arm and hoisting arm 14130 described above. In some embodiments, the hoisting arm 16130 may include two or more links as depicted in FIG. In FIG. 16, the hoisting arm 16130 has three links, the first link 16131 and the second link 16133 are parallel to each other and together with the third link 16139 the double shoulder joint 16135 and the double elbow. The joint 16137 is formed. The hoisting arm 16130 is centered on a vertical axis 1634 that is substantially parallel to the longitudinal axis of the vertical member 16118 (meaning that it is substantially parallel, eg, within a range of about 5% or 1%). It is configured to be pivotally driven by a double shoulder joint 16135. The longitudinal axis is drawn in FIG. 21 and extends along the length of the vertical member 16118 and intersects the first end 16120 and the second end 16124. The hoisting arm 16130 is also configured to rotate about another shaft 16141 parallel to the vertical shaft 1634 at the elbow joint 16137. The distal end of the third link 16139 of the hoisting arm 16130 is configured above to engage any hoisting feature among the removable components described herein. It may have any of the hoisting feature engagement interfaces described in. Depending on the configuration of the hoisting arm, the hoisting arm may be movable, eg, as depicted in FIGS. 6A-6E, so that it can move horizontally or within a plane perpendicular to the vertical axis 1634. It may include and be mobile as described above. This movement is also illustrated in FIGS. 20A and 20B.

As shown in FIG. 16, the vertical translation system 16132 may be motor-driven by a motor 16166, a drive screw 16167, or the like, or may be manually powered. The vertical translation system 16132 is configured to translate the hoisting arm 16130 along the vertical axis 1634. As described above, this allows the hoisting arm 16130 to lift and lower the removable components of the tool.

A second example of a separable hoisting system may be attached to the tool in various ways. A second example of a separable hoisting system, such as the first example of a separable hoisting system, may be connected to the tool at a single high point of attachment, while the separable hoisting system. The bottom of the second example of is positioned and supported on the floor of the production facility. In some embodiments, a second example of a separable hoisting system may be connected to the tool at two different attachment points, such as an upper attachment point and a lower attachment point. FIG. 17 depicts yet another example of a semiconductor processing tool. Similar to the other figures above, example 1700 of the tool is an upper support framework 1714, a semiconductor processing chamber 1704 in a first plurality of semiconductor processing chambers 1702 arranged along a first axis 1706, Removable components such as the removable top cover 1718 with hoisting features as described above, as well as the base portion 1716 fixed and attached directly or indirectly to the top support framework 1714. Also includes. The tool also has one or more upper attachment points 17112A-17112D fixed and attached to the upper support framework 1714, and one or more fixed and attached to the lower element of the tool such as the lower frame or plate 17115. Includes lower attachment points 17113A-17113D. In some embodiments, as illustrated in FIG. 17, each upper attachment point has a corresponding lower attachment point and each pair is along an axis perpendicular to the first axis 1706, such as vertical axis 1634. May be positioned parallel to each other.

18A and 18B depict side views of the adhesion sequence between the tool and the second example of the separable hoisting system of FIGS. 16 and 17. In FIG. 18A, in the second example 16116 of the separable hoisting system, the upper point of attachment 17112 of the tool 1700 connects to the high point of attachment 16121 of the second example 16116 of the hoisting system, as indicated by the dashed double-sided arrows. Separated from the tool 1700 so that the bottom attachment point 16123 of the second example 16116 of a capable and separable hoisting system and the bottom attachment point 17113 of the tool can be connected, but aligned with the tool 1700. .. The bottom attachment point 17113 is to support the weight of the second example 16116 of the hoisting system, such as having a U-shaped receptacle that accepts the horizontal bar of the bottom attachment point 16123, as can be seen in FIG. 18A. May be configured.

In FIG. 18B, a second example 16116 of a separable hoisting system is connected to the tool 1700 at the upper attachment point 17112 and the lower attachment point 17113 of the tool 1700. This adhesion allows the second example 17116 of the separable hoisting system to have a relatively small footprint within the inspection area that can be fitted in the immediate vicinity of the tool 1700, and the heavy removal of the tool 1700. A second example 17116 of a separable hoisting system provides side supports and vertical supports that allow the possible components to be lifted, lowered and supported. Without these upper and lower attachment points, the second example 17116 of the separable hoisting system would not be able to lift, move and support the removable components without potentially dropping them. In some embodiments, as depicted in FIG. 18B, a second example 16116 of a separable hoisting system when connected to the tool 1700 is thereby without direct contact with the floor of the production facility. It does not have to be supported. In some such embodiments, the vertical load supported by the second example 16116 of the separable hoisting system is transmitted to the tool 1700 through the upper attachment point 17112 and the lower attachment point 17113, and these loads are It is not directly transmitted to the floor through direct contact between the floor and the second example 16116 of the separable hoisting system. In some other embodiments, the second example 16116 of the separable hoisting system is made so that the vertical load supported by the second example 16116 of the separable hoisting system is directly transmitted to the floor. It may be in direct contact with the floor of the facility and thereby supported.

Once connected to the tool, the hoisting arm 16130 will move the hoisting feature engagement interface of the hoisting arm 16130 to engage with one of the hoisting features among the removable components, as described above. It is movable so that it can move to fit. FIG. 19 depicts a perspective view of a second example 16116 of a separable hoisting system connected to the tool 1700 of FIGS. 17-18B. As depicted in FIG. 19, the hoisting arm 16130 is moved such that its hoisting feature engaging interface 1652 can engage the hoisting feature 1942 of the removable component 1718. When these items are engaged, the hoisting arm 16130 moves in a plane perpendicular to the vertical axis 1634 in the x-axis and y-axis depicted in the figure to move the removable component 1718. Can be done. The vertical translation system 16132 also raises and lowers removable components along a drawn z-axis, i.e., vertical axis 1634, which may be substantially parallel to each other (eg, parallel within ± 5%). be able to.

20A and 20B depict a sequence of movements of an example of removable components according to a second example 16116 of a separable hoisting system. These figures, together with FIGS. 6A-6E, are simplified top surfaces of the tool of FIG. 1700 of FIGS. 17-19, to which a second example 16116 of a separable hoisting system is attached to the tool 1700, as described above. It is a diagram, viewed at an angle parallel to the vertical axis 1634 of FIGS. 16, 18A, and 19, so that the vertical axis 1634 is perpendicular to the page and extends into the page. The semiconductor processing chamber 1704 in the first plurality of semiconductor processing chambers 1702 also engages with the hoisting feature 1742 of the base portion 1716, hoisting arm 1730, and removable component 1718 of these chambers. Features Seen with the engagement interface 1752. As can be seen in FIG. 20B, the hoisting arm 16130 has the removable component 1718 from the processing chamber 1704 in a direction at least perpendicular to the axis 1706, as indicated by the arrow on the removable component 1718. It is movable so that it can be moved apart. This movement is made possible by the movement of the links and fittings of the hoisting arm 16130, including rotation about the vertical axis 1634 and the other axis 16141. In some embodiments, the hoisting arm 16130 may have only one link and the removable component 1718 includes an example in which the first carriage remained stationary and is described above. As such, it may still be mobile within a plane perpendicular to the vertical axis 1634. This movement of the hoisting arm also causes the removable component engaged with the hoisting arm to move outside the envelope surface 20170 of the tool, as described above and partially depicted in FIG. 20B. to enable.

In some embodiments, a second example of a separable hoisting system may be configured such that the vertical translation system and hoisting arm can be moved together as a single unit along a vertical member. This may allow a second example of a separable hoisting system to move easily around the manufacturing facility and be stored without taking up space when not in use. This also favorably moves the vertical translation system out of the way during installation and removal of the tool so that the vertical translation system does not interfere with or interfere with access to high attachment points. Will be able to. FIG. 21 depicts another configuration of a second example of the separable hoisting system of FIG. In FIG. 21, a second example 16116 of a separable hoisting system is a vertical translation system 16132 and a hoisting arm 16130 together as a single unit along the longitudinal axis 16147 of the vertical member 16118 along the vertical member 16118. Includes a slide rail 16145 configured to allow movement. As can be seen in FIG. 21, the vertical translation system 16132 and the hoisting arm 16130 are moved together towards the lower end of the vertical member 16118. This movement may be unpowered in some embodiments, while in other embodiments it may be powered by a motor, linear actuator, or other mechanism described herein.

As mentioned above, the second example 16116 of the separable hoisting system can be moved around the floor of the production facility by positioning the moving mechanism 16126 on the floor of the production facility. In some embodiments, the moving mechanism 16126 may include a set of collapsible wheels 16149 visible in FIG. In FIG. 21, a set of foldable wheels 16149 is not folded so that all four wheels of the second example 16116 of the separable hoisting system are positioned on the floor and supported by the floor. You can move around on the floor as you can. The foldable set of wheels 16149 is not intended to support the load of the removable components of the tool, but rather to help move the second example 16116 of the separable hoisting system. Intended. In FIG. 18A, a set of foldable wheels 16149 appears to be folded or folded to reduce the occupied area of the second example 16116 of the installed separable hoisting system.

As stated above, the tool has an additional top so that a second example of a separable hoisting system can be positioned at different locations in the tool to access all of the tool's semiconductor processing chambers. The attachment point and the lower attachment point may be included. For example, referring to FIG. 20B, the tool 1700 may include additional top and bottom attachment points around some or all of the semiconductor processing chamber, such as around location 20150. Thereby, a second example 16116 of the separable hoisting system is attached to the tool 1700 at each of these locations 20150 so that the removable components on all of the semiconductor processing chambers 1704A-1704E can be accessed. It will be possible to connect in a separable manner. In some embodiments, each pair of upper and lower attachment points is a removable component of both side-by-side chambers, with a second example 16116 of separable hoisting systems positioned in one place. It may be positioned approximately between two side-by-side chambers for access to. For example, referring to FIG. 20A, the upper and lower attachment points to which the second example 16116 of the separable hoisting system adheres are such that the second example 16116 of the separable hoisting system has the semiconductor processing chambers 1704D and 1704E. Allow access to both removable components. Therefore, in some such embodiments, the number of pairs of upper and lower attachment points may be one less than the number of multiple semiconductor processing chambers. As an example, in FIGS. 20A and 20B, the plurality of semiconductor processing chambers 1702 have five chambers 1704A-1704E and draws four pairs of upper and lower attachment points pairs 17112A-17112D and 17113A-17113D. As can be seen in 17, the four pairs of upper and lower attachment points may be positioned approximately between each of these chambers at location 20150, respectively.

As stated above, the connection between the separable hoisting system and the tool is reconfigurable so that the system can attach the tool and remove the system from the tool without destructive means. Become. This may include using bolts, pins, screws, clamps, or other features that can be fixed together and removed without breaking the tool or system, for example may be caused by welding. Therefore, the separable hoisting system can be moved into the position and attached to the tool for a limited time, such as the time required for inspection or repair, and then removed, It can be moved to other tools or to a separate storage location inside the facility.

The separable hoisting system may also include any of the safety features described above, such as a hoisting arm and a power cord routed along the safety protection device.

In addition to the claims listed in this disclosure, the following additional implementations are to be understood to fall within the scope of this disclosure.

Embodiment 1: A semiconductor processing tool, a support framework, a first plurality of semiconductor processing chambers arranged along a first axis, and a first attachment point connected to the support framework. With a first separable hoisting system, each semiconductor processing chamber has a base portion fixedly mounted to a support framework and has a removable top cover with one or more hoisting features. The first separable hoisting system comprises a vertical member with an upper end having a complementary attachment point and a lower end having a moving mechanism so that the complementary attachment point can be separated into a first attachment point. Connected to, the moving mechanism is supported by the floor, the first separable hoisting system further comprises a hoisting arm with one or more links connected to a vertical member, the hoisting arm is a second. Configured to pivot about a vertical axis that is substantially perpendicular to one axis, the hoisting arm is hoisting any of the removable top covers of the first plurality of semiconductor processing chambers. A semiconductor processing tool that includes a hoist feature engagement interface configured to engage the feature.

Mounting Form 2: The semiconductor processing tool of Mounting Form 1, the first separable hoisting system, is configured to translate the hoisting arm in a direction parallel to the vertical axis and perpendicular to the support framework. A semiconductor processing tool that further includes a vertical translational system.

Mount 3: The semiconductor processing tool of Mount 2, wherein the first vertical translation system includes a motor configured to provide a first mechanical input to the first vertical translation system, the first. The mechanical input is a semiconductor processing tool that translates the hoisting arm along a vertical member.

Mounting Form 4: The semiconductor processing tool according to the mounting form 2, wherein the first vertical translation system is a semiconductor processing tool configured to move together with a hoisting arm as a single body along a vertical member.

Mounting form 5: The semiconductor processing tool of mounting form 1, wherein the moving mechanism is a semiconductor processing tool including a foldable wheel.

Embodiment 6: A semiconductor processing tool, a support framework having an upper attachment point, a lower attachment point vertically offset below the upper attachment point, and a first plurality arranged along a first axis. A separable winding having a semiconductor processing chamber and a base portion where each semiconductor processing chamber is fixedly mounted to a support framework and has removable components with one or more hoisting features. The hoisting system, including and separable from the upper system, includes an upper end with a high attachment point, a lower end with a bottom attachment point, and a vertical member with a moving mechanism, with the high attachment point separated into an upper attachment point. Connected so that the bottom attachment point is separably connected to the bottom attachment point, and the separable hoisting system is pivoted around a vertical axis that is substantially perpendicular to the first axis. A hoisting arm with one or more links configured in a vertical translation system configured to translate the hoisting arm perpendicular to the support framework and in a direction parallel to the vertical axis. Further included, the hoisting arm comprises a hoisting feature engaging interface configured to engage any hoisting feature among the removable components of the first plurality of semiconductor processing chambers. tool.

Mount 7: A semiconductor processing tool of mount 6, wherein the vertical translation system includes a motor configured to provide a first mechanical input to the vertical translation system, where the first mechanical input is. A semiconductor processing tool that translates the hoisting arm in a direction parallel to the vertical axis.

Mount 8: The semiconductor processing tool of mount 7, the hoisting system further including and separable from the power supply, is electrical connected to the power supply and routed along the hoisting arm and terminated by a connector. It further includes a control cable, each removable component further including an electrical interface configured to connect to the connector, the electrical control cable has a connector, and a hoisting arm hoisting feature engagement interface. A semiconductor processing tool consisting of a length that can be simultaneously engaged with only one electrical interface and hoisting feature of the semiconductor processing chamber, each at a time.

Embodiment 9: The semiconductor processing tool of Embodiment 8, further comprising a controller comprising one or more processors and one or more non-temporary storage elements, one non-temporary storage element. Or control multiple processors to receive information about the operating state of each semiconductor processing chamber, and use an electrical interface to tell one of the semiconductor processing chambers that the semiconductor processing chamber is in a human-safe state. A semiconductor processing tool that stores instructions that provide a first operating signal to operate a vertical translational system only when information about the operating state of the processing chamber indicates.

Mounting Form 10: The semiconductor processing tool according to the mounting form 8, the removable component is a semiconductor processing tool that receives electric power from a power source through an electric cable.

Mounting Form 11: The semiconductor processing tool according to the mounting form 7, wherein the vertical translation system is a linear ball screw actuator, a hydraulic actuator, an actuator using a rack and a pinion, and a cable hoisting device.

Mount 12: The semiconductor processing tool of mounting form 6, the separable hoisting system, engages with any hoisting feature among the removable components of the first plurality of semiconductor processing chambers. And prevent the first vertical translation system from vertically translating the first hoisting arm when not engaging with one hoisting feature in the removable top cover of the first plurality of semiconductor processing chambers. A semiconductor processing tool further comprising a first interlock configured to do so.

Mounting form 13: A semiconductor processing tool according to mounting form 6, wherein the moving mechanism is a semiconductor processing tool including four wheels.

Mounting form 14: A semiconductor processing tool according to mounting form 6, wherein the moving mechanism is a semiconductor processing tool including a set of foldable wheels.

Mounting Form 15: The semiconductor processing tool of mounting form 6, wherein the first vertical translation system is a semiconductor processing tool configured to move together with a hoisting arm as a single body along a vertical member.

Mounting Form 16: A semiconductor processing tool according to mounting form 15, wherein the vertical member further includes a slide rail configured to move a first vertical translation system.

Mounting Form 17: A semiconductor processing tool according to mounting form 6, wherein the moving mechanism is not supported by the floor when connected to the lower attachment point and the upper attachment point.

Mounting Form 18: A semiconductor processing tool according to mounting form 6, wherein the moving mechanism is a semiconductor processing tool supported by a floor when connected to a lower attachment point and an upper attachment point.

Mounting Form 19: A semiconductor processing tool according to mounting form 6, wherein the lower attachment point is vertically displaced below the base portion of a plurality of processing chambers.

Mount 20: The semiconductor processing tool of mounting form 6, wherein the support framework further comprises a plurality of top tack points, and the tool further comprises a plurality of bottom tack points displaced below the plurality of top tack points. , The plurality of semiconductor processing chambers includes N processing chambers, the plurality of upper attachment points includes the upper attachment points of N-1, and the plurality of lower attachment points includes the lower attachment points of N-1. tool.

Mount 21: A semiconductor processing tool according to mounting form 6, wherein the hoisting arm is a semiconductor processing tool further including three or more links, a double shoulder joint, and a double elbow joint.

Mounting form 22: A semiconductor processing tool according to mounting form 6, wherein the removable component is not a substrate.

Mounting form 23: A semiconductor processing tool according to mounting form 6, wherein the hoisting arm is not configured to support a substrate.

Mounting Form 24: A semiconductor processing tool according to mounting form 23, wherein the hoisting feature engagement interface is not configured to support a substrate.

The features of the tools described herein provide a number of advantages for lifting and moving removable components as compared to conventional lifting mechanisms. These features allow the cluster tools to be positioned closer together, requiring no additional Fab floor space to accommodate the self-contained hoisting mechanism, and the tool's footprint is these. Detachable components, neither extended by including features, nor even slightly expanded, are easily accessible and quick to move, thereby for inspection and maintenance. This is because the inoperability time of the tool is reduced. The ability to control the movement of the carriage and hoisting arm using a moving mechanism and controller may also enable more efficient, faster and safer control and movement of removable components.

Unless the content of this disclosure explicitly requires otherwise, terms such as "comprise" and "comprising" are exclusive or exhaustive throughout the specification and claims. In contrast to meaning, it should be interpreted in a comprehensive sense, i.e., in the sense of "including but not limiting". Words that use singular or plural also generally include plural or singular, respectively. In addition, the words "within the present specification", "under the present specification", "above", "below", and words with similar meanings refer to the present application as a whole and are optional in the present application. It does not refer to a specific part of. When the word "or (or)" is used with reference to a list of two or more items, the word is the following interpretation of the word, that is, any of the items in the list is all of the items in the list. , And any combination of items in the list. The term "implementation" is a physical object that embodies the structure and / or incorporates the techniques and / or methods described herein, as well as the implementation forms of the techniques and methods described herein. Also refers to things. As used herein, the term "substantially" means within 5% of the reference value unless otherwise noted. For example, substantially vertical means vertical within a range of ± 5%.

Claims (37)

It ’s a semiconductor processing tool.
Top support framework and
A first plurality of semiconductor processing chambers arranged along a first axis, and
A first linear guidance system fixed and supported by the upper support framework and extending along a second axis substantially parallel to the first axis.
Equipped with a first carriage
Each said semiconductor processing chamber has a base portion fixed and mounted relative to the top support framework and has a removable top cover with one or more hoisting features.
The first carriage comprises a first hoisting arm with one or more links.
The first hoisting arm is configured to pivot about a vertical axis that is substantially perpendicular to the second axis.
The first carriage is configured to movably engage the first linear guidance system and translate along the second axis with respect to the first linear guidance system.
The first hoisting arm is a hoisting feature engaging interface configured to engage any of the hoisting features in the removable top cover of the first plurality of semiconductor processing chambers. Including
The first carriage and the first hoisting arm are hoisted so as to engage any of the hoisting features in the removable top cover of the first plurality of semiconductor processing chambers. Features A semiconductor processing tool that is movable so that the engagement interface can be moved. The semiconductor processing tool according to claim 1, wherein the first carriage translates the first hoisting arm perpendicular to the first linear guidance system and in a direction parallel to the vertical axis. A semiconductor processing tool that further includes a first vertical translation system to make it. The semiconductor processing tool according to claim 2, further comprising a power source.
The first vertical translation system includes a motor configured to provide a first mechanical input to the first vertical translation system, the first mechanical input being the first hoisting. Translate the arm vertically, in a direction parallel to the vertical axis,
The first carriage further comprises an electrical control cable connected to the power source and routed along the first hoisting arm and terminated by a connector.
Each removable top cover further includes an electrical interface configured to connect with the connector.
The electrical control cable is such that the connector and the hoisting feature engaging interface of the first hoisting arm are each with only one electrical interface and the hoisting feature in the semiconductor processing chamber at a time. A semiconductor processing tool consisting of a length that can only be engaged at the same time. The semiconductor processing tool according to claim 3, further comprising a controller including one or more processors and one or more non-temporary storage elements, said one or more non-temporary storage elements. Controls the one or more processors
Receives information about the operating state of each semiconductor processing chamber,
The first vertical only when the information about the operating state of the semiconductor processing chamber indicates to one of the semiconductor processing chambers by the electrical interface that the semiconductor processing chamber is in a human-safe state. A semiconductor processing tool that stores instructions for providing a first actuation signal to operate a translational system. The semiconductor processing tool according to claim 3.
A first carriage position sensor configured to generate data about the position of the first carriage along the first linear guidance system.
A controller comprising one or more processors and one or more non-temporary storage elements, wherein the one or more non-temporary storage elements control the one or more processors. ,
Based on the data generated by the first carriage position sensor, the position of the first carriage along the first linear guidance system is determined.
Based on the determination of the position of the first carriage, a command for supplying power to only the electrical interface of one of the first semiconductor processing chambers at a time is stored. A semiconductor processing tool further equipped with a controller. The semiconductor processing tool according to claim 5, wherein the arm is configured to generate data regarding the position of the first hoisting arm with respect to the semiconductor processing chamber among the first plurality of semiconductor processing chambers. It further comprises a position sensor, wherein the one or more non-temporary storage elements control the one or more processors.
Based on the data generated by the arm position sensor, the position of the first hoisting arm is determined for each of the semiconductor processing chambers in the first plurality of semiconductor processing chambers.
Based on the determination of the position of the first hoisting arm and the determination of the position of the first carriage, the first hoisting feature closest to the hoisting feature engagement interface of the first hoisting arm. A semiconductor processing tool that further stores instructions for supplying power only to the electrical interface of the semiconductor processing chamber among a plurality of semiconductor processing chambers. The semiconductor processing tool according to claim 5, wherein the one or more non-temporary storage elements control the one or more processors to pass through the first carriage and the vertical. A semiconductor processing tool that further stores commands for moving the first hoisting arm only on the first side of a vertical plane parallel to the axis and perpendicular to the second axis. The semiconductor processing tool according to claim 3.
An engagement sensor configured to generate data as to whether one of the hoisting features in the removable top cover and the hoisting feature engaging interface of the first hoisting arm are engaged. When,
A controller comprising one or more processors and one or more non-temporary storage elements, wherein the one or more non-temporary storage elements control the one or more processors. ,
Based on the data generated by the engagement sensor, one of the hoisting features in the removable top cover of the first plurality of semiconductor processing chambers and the hoisting feature of the first hoisting arm. Determine if the engagement interface is engaged and
The removable top cover of the first plurality of semiconductor processing chambers is removable in response to the determination that one of the hoisting features and the hoisting feature engaging interface is engaged. A semiconductor processing tool further comprising a controller for storing instructions for supplying power only to the electrical interface of the semiconductor processing chamber among the first plurality of semiconductor processing chambers including the top cover. The semiconductor processing tool according to claim 3, wherein the removable upper cover is a semiconductor processing tool that receives electric power from the power source through the electric cable. The semiconductor processing tool according to claim 2, wherein the first carriage is
Engage with the hoisting feature of any of the removable top covers of the first plurality of semiconductor processing chambers.
The first vertical translation system translates the first hoisting arm vertically when it does not engage one of the hoisting features in the removable top cover of the first plurality of semiconductor processing chambers. A semiconductor processing tool that further includes a first interlock configured to prevent it from happening. The semiconductor processing tool according to claim 2, wherein the first vertical translation system is selected from a group consisting of a linear ball screw actuator, a hydraulic actuator, an actuator using a rack and a pinion, and a cable hoisting device. Semiconductor processing tool. The semiconductor processing tool according to claim 2, further comprising a controller including one or more processors and one or more non-temporary storage elements.
The first linear guidance system further comprises a carriage translation system configured to translate the first carriage along the second axis.
The first carriage further comprises a hoisting arm movement system configured to move the first hoisting arm in a plane perpendicular to the vertical axis.
The one or more non-temporary storage elements control the one or more processors.
The carriage translation system is made to move the first carriage along the second axis.
One of the windings in the removable top cover of the first plurality of semiconductor processing chambers by moving the first hoisting arm into the hoisting arm moving system and the first vertical translation system. Engage the upper feature with the hoist feature engagement interface.
When the one hoisting feature in the removable top cover engages with the hoisting feature engaging interface, the removable top cover is vertically translated into the first vertical translation system. Let me
When the one hoisting feature in the removable top cover and the hoisting feature engaging interface are engaged, the hoisting arm moving system has its said in a plane perpendicular to the vertical axis. A semiconductor processing tool that stores instructions for translating the removable top cover. The semiconductor processing tool according to claim 12, wherein the one or more non-temporary storage elements control the one or more processors.
When the one hoisting feature in the removable top cover and the hoisting feature engaging interface are engaged, the first vertical translation system is associated with the hoisting arm moving system and the first vertical translation system. A semiconductor processing tool that further stores instructions for moving the hoisting arm to disconnect the hoisting feature engagement interface from the hoisting feature of its removable top cover. The semiconductor processing tool according to claim 12, wherein the one or more non-temporary storage elements control the one or more processors.
When the one hoisting feature in the removable top cover and the hoisting feature engaging interface are engaged, the carriage translation system and the hoisting arm moving system are perpendicular to the vertical axis. A semiconductor processing tool that further stores instructions for translating its removable top cover in a plane. The semiconductor processing tool according to claim 1.
The semiconductor processing chambers among the first plurality of semiconductor processing chambers are all arranged inside the tool envelope surface.
The first hoisting arm is a semiconductor processing tool that is movable such that any of the removable top covers of the first plurality of semiconductor processing chambers can be moved outside the tool envelope. .. The semiconductor processing tool according to claim 1.
The first linear guidance system further comprises a first rail and a second rail that are parallel to each other and offset from each other in a direction parallel to the vertical axis.
The first rail is engaged simultaneously with the first rail and the second rail, and while simultaneously engaged with the first rail and the second rail, the first straight line. A semiconductor processing tool configured to translate along the second axis with respect to the guidance system. The semiconductor processing tool according to claim 16, wherein the first carriage is below the first linear guidance system and above the base portion of the first plurality of semiconductor processing chambers. A semiconductor processing tool further comprising a first vertical translation system configured to translate the hoisting arm perpendicular to the first linear guidance system and in a direction parallel to the vertical axis. 17. The semiconductor processing tool of claim 17, wherein the first vertical translation system is further configured to vertically translate the first hoisting arm above the first linear guidance system. Semiconductor processing tool. The semiconductor processing tool according to claim 1.
The first linear guidance system is displaced vertically above the first plurality of semiconductor processing chambers and in a direction parallel to the vertical axis.
The first carriage is a semiconductor processing tool that is vertically offset beneath the first linear guidance system. The semiconductor processing tool according to claim 1, wherein the hoisting feature engaging interface allows the hoisting feature engaging interface to rotate about two or more axes perpendicular to the vertical axis. A semiconductor processing tool connected to the distal end of the first hoisting arm using a joint configured as described above. The semiconductor processing tool according to claim 20, wherein the joint is a spherical joint. The semiconductor processing tool according to claim 20, wherein the joint is further configured to allow the hoisting feature engagement interface to rotate about an axis parallel to the vertical axis. .. The semiconductor processing tool according to claim 1.
The hoisting feature of each of the removable top covers includes a pair of saddleposts.
Each said saddlepost includes a pair of vertical riser rods, and a saddle plate extending between the riser rods, each said saddle plate comprises a first mechanical interface feature.
The saddleposts of each of the hoisting features are positioned such that the first mechanical interface features are spaced apart from each other by a first distance.
The hoisting feature engaging interface comprises a beam with two second mechanical interface features spaced apart by the first distance.
Each pre-first mechanical interface feature is a semiconductor processing tool that is complementary to one of the second mechanical interface features. The semiconductor processing tool according to claim 1.
Each of the semiconductor processing chambers in the first plurality of semiconductor processing chambers is removable and is selected from a group consisting of one of a radio frequency (radio frequency, RF) generator, a pump, and a low temperature pump. Including components,
Each removable component comprises one or more second hoisting features.
The hoisting feature engagement interface of the hoisting arm further engages with the second hoisting feature of any of the removable components of the first plurality of semiconductor processing chambers. Configured,
The first carriage and the first hoisting arm are such that they engage the second hoisting feature of any of the removable components of the first plurality of semiconductor processing chambers. A semiconductor processing tool that is movable so that the hoisting feature engagement interface can be moved. The semiconductor processing tool according to claim 1, wherein the first hoisting arm is a semiconductor processing tool including a linear section including the hoisting feature engaging interface perpendicular to the vertical axis. The semiconductor processing tool according to claim 25.
The first hoisting arm includes a pivot compartment configured such that the first hoisting arm pivots about the vertical axis.
The first hoisting arm is a semiconductor processing tool comprising an angled compartment that extends between the pivot compartment and the linear compartment and is oriented at an angle tilted with respect to the vertical axis. The semiconductor processing tool according to claim 1, wherein the first plurality of semiconductor processing chambers are semiconductor processing tools including two semiconductor processing chambers. The semiconductor processing tool according to claim 27, wherein the first plurality of semiconductor processing chambers are semiconductor processing tools including three semiconductor processing chambers. The semiconductor processing tool according to claim 28, wherein the first plurality of semiconductor processing chambers are semiconductor processing tools including five semiconductor processing chambers. The semiconductor processing tool according to claim 1.
A second plurality of semiconductor processing chambers arranged along a third axis offset from the first axis, substantially parallel to the first axis.
An internal region arranged between the first plurality of semiconductor processing chambers and the second plurality of semiconductor processing chambers,
A second linear guidance system fixed and supported by the upper support framework and extending along a fourth axis substantially parallel to the third axis.
Further equipped with a second carriage,
The first linear guidance system and the second linear guidance system are positioned outside the internal region.
Each of the semiconductor processing chambers in the second plurality of semiconductor processing chambers has a second base portion fixedly mounted with respect to the upper support framework, and one or more second. Has a second removable top cover with hoisting features,
The second carriage comprises a second hoisting arm with one or more links.
The second hoisting arm is configured to pivot about a second vertical axis perpendicular to the fourth axis.
The second carriage is configured to movably engage the second linear guidance system and translate along the fourth axis with respect to the second linear guidance system.
The second hoisting arm relates to any of the second hoisting features in the second removable top cover of the semiconductor processing chamber in the second plurality of semiconductor processing chambers. Includes a second hoisting feature engagement interface configured to fit
The second carriage and the second hoisting arm are the hoisting of any of the second removable top covers of the semiconductor processing chamber in the second plurality of semiconductor processing chambers. A semiconductor processing tool that is movable so that the second hoisting feature engagement interface can be moved to engage the feature. The semiconductor processing tool according to claim 30.
The basal portion of the first plurality of semiconductor processing chambers, the second basal portion of the second plurality of semiconductor processing chambers, and the internal region are all arranged inside the second envelope surface.
The first hoisting arm is movable so that any of the removable top covers in the first plurality of semiconductor processing chambers can be moved outside the second envelope. ,
The second hoisting arm moves such that any of the second removable top covers in the second plurality of semiconductor processing chambers can be moved outside the second envelope. Possible semiconductor processing tools. The semiconductor processing tool according to claim 30.
The second removable top cover is of the same type as the removable top cover.
The second hoisting feature engaging interface is of the same type as the hoisting feature engaging interface.
The second hoisting feature is a semiconductor processing tool of the same type as the hoisting feature. The semiconductor processing tool according to claim 1, wherein when the first carriage engages with the first linear guidance system, a seal is provided at the interface between the first carriage and the first linear guidance system. A semiconductor processing tool with more bellows to produce. The semiconductor processing tool according to claim 1.
With a second carriage
The second carriage comprises a second hoisting arm with one or more links, the second hoisting arm being centered on a second vertical axis perpendicular to the second axis. Configured to be pivotal
The second carriage is configured to movably engage the first linear guidance system and translate along the second axis with respect to the first linear guidance system.
The second hoisting arm is configured to engage any of the hoisting features in the removable top cover of the first plurality of semiconductor processing chambers. Including engagement interface
The second carriage and the second hoisting arm engage with any of the hoisting features in the removable top cover of the first plurality of semiconductor processing chambers. Hoisting features Movable so that the engagement interface can be moved,
The first linear guidance system allows the first carriage and the second carriage to simultaneously engage the first linear guidance system and be movable along the second axis. Further configured in the semiconductor processing tool. The semiconductor processing tool according to claim 1, wherein the removable top cover is not a substrate. The semiconductor processing tool according to claim 1, wherein the first hoisting arm is not configured to support a substrate. The semiconductor processing tool according to claim 36, wherein the hoisting feature engagement interface is not configured to support the substrate.

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