JP2022192012A - Photosensitive composition, cured film using the same, optical filter, image display device, solid imaging element, and infrared sensor - Google Patents

Abstract

To provide a photosensitive composition having excellent developability and capable of forming a cured film having excellent adhesion, heat cycle resistance, and solvent resistance.SOLUTION: Provided is a photosensitive composition comprising a near-infrared absorption dye (A), an alkali-soluble resin (B), a polymerizable compound (C), and a photoinitiator (D), where the alkali-soluble resin (B) comprises an alkali-soluble resin (B1) having a glass transition temperature of -10 to 40°C and an alkali-soluble resin (B2) having a glass transition temperature of 60 to 150°C.SELECTED DRAWING: None

Description

The present invention relates to photosensitive compositions and uses thereof.

2. Description of the Related Art CCDs (charge-coupled devices) and CMOSs (complementary metal oxide semiconductors), which are solid-state imaging devices for color images, are used in video cameras, digital cameras, mobile devices with camera functions, and the like. Since silicon photodiodes sensitive to infrared rays are used in the light receiving portions of these solid-state imaging devices, it is necessary to perform visibility correction, and an infrared cut filter or the like is arranged. An infrared cut filter is manufactured, for example, using a composition containing a near-infrared absorbing dye.

Conventionally, an infrared cut filter has been used as a flat film, but in recent years, it has been studied to form a pattern on the infrared cut filter by photolithography. Resins with high heat resistance have been used for infrared cut filters. However, resins with high heat resistance have poor adhesion to substrates, causing problems such as peeling and chipping during the development process during pattern formation (adhesion). (developability). In addition, there are other problems such as peeling and cracking due to temperature differences in the environment in which they are used (heat cycle resistance) and poor resistance to solvents (solvent resistance).

In order to solve the above problems, for example, in Patent Document 1, a near-infrared absorbing material containing a phthalocyanine compound having an absorption maximum wavelength in the near-infrared region, a binder resin, a photopolymerizable compound, a photopolymerization initiator and a solvent A photosensitive resin composition is disclosed. Further, Patent Document 2 discloses a pattern-forming composition containing an infrared absorbing dye and a resin having a glass transition temperature of 150 to 300°C.

Japanese Patent Application Laid-Open No. 2010-160380 WO2019/058882

However, the compositions of Patent Documents 1 and 2 could not satisfy all of developability, adhesion, heat cycle resistance, and solvent resistance.

An object of the present invention is to provide a photosensitive composition capable of forming a cured film having excellent developability, adhesion, heat cycle resistance, and solvent resistance.

The present invention is a photosensitive composition comprising a near-infrared absorbing dye (A), an alkali-soluble resin (B), a polymerizable compound (C), and a photopolymerization initiator (D),
The alkali-soluble resin (B) is a photosensitive composition containing an alkali-soluble resin (B1) having a glass transition temperature of −10 to 40° C. and an alkali-soluble resin (B2) having a glass transition temperature of 60 to 150° C. is.

ADVANTAGE OF THE INVENTION According to said invention, the photosensitive composition which is excellent in developability and can form the cured film which is excellent in adhesiveness, heat-cycle resistance, and solvent resistance can be provided. Moreover, the present invention can provide a cured film, an optical filter, an image display device, a solid-state imaging device, and an infrared sensor.

FIG. 1 shows a schematic cross-sectional view of an image display device provided with the cured film of the present invention. FIG. 2 shows a schematic cross-sectional view of a solid-state imaging device provided with the cured film of the present invention. FIG. 3 shows a schematic cross-sectional view of an infrared sensor provided with the cured film of the present invention.

Hereinafter, embodiments for implementing the photosensitive composition of the present invention will be described in detail. It should be noted that the present invention is not limited to the following embodiments, and can be modified and implemented within a range that can solve the problems.

In the present invention, "(meth)acryloyl", "(meth)acryl", "(meth)acrylic acid", "(meth)acrylate", or "(meth)acrylamide" are each unless otherwise specified. , “acryloyl and/or methacryloyl”, “acrylic and/or methacrylic”, “acrylic acid and/or methacrylic acid”, “acrylate and/or methacrylate”, or “acrylamide and/or methacrylamide” . "C.I." means a color index (C.I.; published by The Society of Dyers and Colorists). A polymerizable unsaturated group is an ethylenically unsaturated double bond.
Regarding the molecular weight of the compound in the present invention, for a low molecular weight compound whose molecular weight can be specified, it is a value calculated by calculation or a molecular weight measured by ESI-MS (electrospray ionization mass spectrometry), and a compound having a molecular weight distribution. is the polystyrene equivalent weight average molecular weight measured by gel permeation chromatography using tetrahydrofuran as a solvent.
A monomer is a compound that forms a resin upon polymerization. A monomer is an unreacted state and a monomeric unit is a state in which a monomer forms a resin after polymerization.

<Photosensitive composition>
One embodiment of the invention relates to a photosensitive composition. The photosensitive composition of the present invention is a photosensitive composition comprising a near-infrared absorbing dye (A), an alkali-soluble resin (B), a polymerizable compound (C), and a photopolymerization initiator (D),
The alkali-soluble resin (B) comprises an alkali-soluble resin (B1) having a glass transition temperature of -10 to 40°C and an alkali-soluble resin (B2) having a glass transition temperature of 60 to 150°C. do.

Although the mechanism by which the photosensitive composition having the above structure can solve the problems of the present invention is not clear, it is speculated as follows.
By using both a resin with a low glass transition temperature and a resin with a high glass transition temperature, the coating film has a portion with a low glass transition temperature (flexible portion) and a portion with a high glass transition temperature (rigid portion). Therefore, compared to a uniform coating film using one type of resin, external stress or internal stress can be effectively relieved, and excellent developability, adhesion, heat cycle resistance, and solvent resistance are excellent. It is assumed that a coating film can be formed.

The components that are or can be included in the photosensitive composition of one embodiment are described in detail below.

[Near-infrared absorbing dye (A)]
The photosensitive composition of the present invention contains a near-infrared absorbing dye (A).

The near-infrared absorbing dye (A) is a compound having maximum absorption at a wavelength of 700 to 2,000 nm, and is a pigment (also referred to as a near-infrared absorbing pigment) or a dye (also referred to as a near-infrared absorbing dye). Also, a near-infrared absorbing pigment and a near-infrared absorbing dye may be used in combination. Near-infrared absorbing pigments are preferred from the viewpoint of heat resistance.
In the present invention, the solubility of the near-infrared absorbing pigment in 100 g of propylene glycol monomethyl ether acetate at 25° C. is preferably less than 2 g, more preferably less than 1 g, and particularly preferably 0.5 g or less. .

Examples of the near-infrared absorbing dye (A) include cyanine compounds, phthalocyanine compounds, naphthalocyanine compounds, indigo compounds, immonium compounds, anthraquinone compounds, pyrrolopyrrole compounds, squarylium compounds, and croconium compounds. Among these, naphthalocyanine compounds, pyrrolopyrrole compounds, squarylium compounds, and indigo compounds are preferred, and naphthalocyanine compounds and indigo compounds are more preferred, from the viewpoint of heat resistance.

Cyanine compounds, WO 2006/006573, WO 2010/073857, JP 2013-241598, JP 2016-113501, JP 2016-113504, etc.; JP-A-4-23868, JP-A-06-192584, JP-A-2000-63691, International Publication No. 2014/208514, etc.; JP, JP 2009-29955 A, International Publication No. 2018/186490, etc.; Indigo compounds, JP 2013-230412, etc.; 197492, JP 2008-88426, etc.; anthraquinone compounds, JP 62-903, JP 1-172458, etc.; pyrrolopyrrole compounds, JP 2009-263614, JP 2010-90313, JP-A-2011-068731; the squarylium compound is disclosed in JP-A-2011-132361, JP-A-2016-142891, WO 2017/135359, WO 2018/225837, Japanese Patent Application Laid-Open No. 2019-001987, International Publication No. 2020/054718, etc.; croconium compounds include compounds described in International Publication No. 2019/021767, etc.

(squarylium compound)
The squarylium compound is preferably a compound represented by the following general formula (1).

General formula (1)

In general formula (1), R ¹ to R ⁴ each independently represent a hydrogen atom, a halogen atom, a cyano group, a nitro group, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, an aralkyl group, and —OR. ¹⁰ , -COR ¹¹ , -COOR ¹² , -OCOR ¹³ , -NR ¹⁴ R ¹⁵ , -NHCOR ¹⁶ , -CONR ¹⁷ R ¹⁸ , -NHCONR ¹⁹ R ²⁰ , -NHCOOR ²¹ , -SR ²² , -SO ₂ R ²³ , Represents —SO ₂ OR ²⁴ , —NHSO ₂ R ²⁵ , —SO ₂ NR ²⁶ R ²⁷ , —B(OR ²⁸ ) ₂ , and —NHBR ²⁹ R ³⁰ . R ¹⁰ to R ³⁰ each independently represent a hydrogen atom, an optionally substituted alkyl group, alkenyl group, alkynyl group, aryl group, heteroaryl group and aralkyl group. When R ¹² of —COOR ¹² is hydrogen (ie, carboxyl group), the hydrogen atom may be dissociated (ie, carbonate group), or may be in the form of a salt. In addition, when R ²⁴ of —SO ₂ OR ²⁴ is a hydrogen atom (ie sulfo group), the hydrogen atom may be dissociated (ie sulfonate group) or in a salt state. In addition, R ¹ and R ² , R ³ and R ⁴ may combine with each other to form a ring.

The "substituent" includes a halogen atom, a cyano group, a nitro group, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, an aralkyl group,
—OR ¹⁰⁰ , —COR ¹⁰¹ , —COOR ¹⁰² , —OCOR ¹⁰³ , —NR ¹⁰⁴ R ¹⁰⁵ , —NHCOR ¹⁰⁶ , —CONR ¹⁰⁷ R ¹⁰⁸ , —NHCONR ¹⁰⁹ R ¹¹⁰ , —NHCOOR ¹¹¹ , —SR ¹¹² , —SO ₂ R ¹¹³ , —SO ₂ OR ¹¹⁴ , —NHSO ₂ R ¹¹⁵ or —SO ₂ NR ¹¹⁶ R ¹¹⁷ .
R ¹⁰⁰ to R ¹¹⁷ each independently represent a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group or an aralkyl group. When R ¹⁰² of —COOR ¹⁰² is hydrogen (ie, carboxyl group), the hydrogen atom may be dissociated (ie, carbonate group), or may be in a salt state. In addition, when R ¹¹⁴ of —SO ₂ OR ¹¹⁴ is a hydrogen atom (ie, sulfo group), the hydrogen atom may be dissociated (ie, sulfonate group) or in a salt state.

Halogen atoms include fluorine, chlorine, bromine and iodine atoms.
The number of carbon atoms in the alkyl group is preferably 1-20, more preferably 1-12, and particularly preferably 1-8. The alkyl group may be linear, branched or cyclic.
The alkenyl group preferably has 2 to 20 carbon atoms, more preferably 2 to 12 carbon atoms, and particularly preferably 2 to 8 carbon atoms. Alkenyl groups may be linear, branched or cyclic.
The alkynyl group preferably has 2 to 20 carbon atoms, more preferably 2 to 12 carbon atoms, and particularly preferably 2 to 8 carbon atoms. Alkynyl groups may be linear, branched or cyclic.
The aryl group preferably has 6 to 25 carbon atoms, more preferably 6 to 15 carbon atoms, and particularly preferably 6 to 10 carbon atoms.
The alkyl portion of the aralkyl group is the same as the alkyl group described above. The aryl portion of the aralkyl group is the same as the above aryl group. The aralkyl group preferably has 7 to 40 carbon atoms, more preferably 7 to 30 carbon atoms, and particularly preferably 7 to 25 carbon atoms.
The heteroaryl group is preferably a single ring or a condensed ring, more preferably a single ring or a condensed ring with 2 to 8 condensed numbers, and particularly preferably a monocyclic ring or a condensed ring with 2 to 4 condensed numbers. The number of heteroatoms constituting the ring of the heteroaryl group is preferably 1-3. A heteroatom constituting the ring of the heteroaryl group is preferably a nitrogen atom, an oxygen atom, or a sulfur atom. A heteroaryl group is preferably a 5- or 6-membered ring. The number of carbon atoms constituting the ring of the heteroaryl group is preferably 3-30, more preferably 3-18, particularly preferably 3-12.
Alkyl groups, alkenyl groups, alkynyl groups, aryl groups, heteroaryl groups, and aralkyl groups may have a substituent or may be unsubstituted. Examples of the substituent include the "substituent" described above.

From the viewpoint of light resistance and heat resistance, the squarylium compound is more preferably a compound represented by the following general formula (2).
general formula (2)

In general formula (2), R ⁵ to R ⁸ each independently represent a hydrogen atom, a halogen atom, a cyano group, a nitro group, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, an aralkyl group, and —OR. ⁵⁰ , -COR ⁵¹ , -COOR ⁵² , -OCOR ⁵³ , -NR ⁵⁴ R ⁵⁵ , -NHCOR ⁵⁶ , -CONR ⁵⁷ R ⁵⁸ , -NHCONR ⁵⁹ R ⁶⁰ , -NHCOOR ⁶¹ , -SR ⁶² , -SO ₂ R ⁶³ , represents -SO ₂ OR ⁶⁴ , -NHSO ₂ R ⁶⁵ or -SO ₂ NR ⁶⁶ R ⁶⁷ , -B(OR ⁶⁸ ) ₂ and -NHBR ⁶⁹ R ⁷⁰ ; R ⁵⁰ to R ⁷⁰ each independently represent a hydrogen atom, an optionally substituted alkyl group, alkenyl group, alkynyl group, aryl group, heteroaryl group and aralkyl group. When R ⁵² of —COOR ⁵² is hydrogen (ie, carboxyl group), the hydrogen atom may be dissociated (ie, carbonate group), or it may be in the form of a salt. In addition, when R ⁶⁴ of —SO ₂ OR ⁶⁴ is a hydrogen atom (ie, sulfo group), the hydrogen atom may be dissociated (ie, sulfonate group) or in a salt state. Also, R ⁵ and R ⁶ and R ⁷ and R ⁸ may combine with each other to form a ring.

A "substituent" has the same meaning as the above-mentioned "substituent".

Specific examples of the compound represented by formula (2) are shown below. In addition, this invention is not limited to these.

(Pyrrolopyrrole compound)
The pyrrolopyrrole compound is preferably a compound represented by the following general formula (3).

General formula (3)

In general formula (3), R ^1x and R ^1y each independently represent an alkyl group, an aryl group or a heteroaryl group, R ² and R ³ each independently represent a hydrogen atom or a substituent, and R ² and R ³ may combine with each other to form a ring, R ⁴ represents a hydrogen atom, an alkyl group, an aryl group, a heteroaryl group, -BR ^4x R ^4y or a metal atom, and R ⁴ is It may be covalently or coordinately bonded to at least one selected from the group consisting of R ^1x , R ^1y and R ³ , and each of R ^4x and R ^4y independently represents a substituent. Details of the general formula (3) can be referred to the descriptions of JP-A-2009-263614, JP-A-2011-68731, and WO 2015/166873, the contents of which are incorporated herein.

R ^1x and R ^1y are each independently preferably an aryl group or a heteroaryl group, more preferably an aryl group. In addition, the alkyl group, aryl group and heteroaryl group represented by R ^1x and R ^1y may have a substituent or may be unsubstituted. Examples of substituents include alkoxy groups, hydroxy groups, halogen atoms, cyano groups, nitro groups, —OCOR ¹¹ , —SOR ¹² , —SO ₂ R ¹³ and the like. R ¹¹ to R ¹³ each independently represent a hydrocarbon group or a heteroaryl group. Further, examples of substituents include substituents described in paragraphs 0020 to 0022 of JP-A-2009-263614. Among them, preferred substituents are alkoxy groups, hydroxy groups, halogen atoms, cyano groups, nitro groups, -OCOR ¹¹ , -SOR ¹² and -SO ₂ R ¹³ . The group represented by R ^1x and R ^1y is preferably an alkoxy group having a branched alkyl group or an aryl group having a group represented by —OCOR ¹¹ as a substituent. The branched alkyl group preferably has 3 to 30 carbon atoms, more preferably 3 to 20 carbon atoms.

At least one of R ² and R ³ is preferably an electron-withdrawing group, more preferably R ² represents an electron-withdrawing group and R ³ represents a heteroaryl group. A heteroaryl group is preferably a 5- or 6-membered ring. The heteroaryl group is preferably a single ring or a condensed ring, preferably a single ring or a condensed ring with 2 to 8 condensed numbers, more preferably a monocyclic ring or a condensed ring with 2 to 4 condensed numbers. The number of heteroatoms constituting the heteroaryl group is preferably 1-3, more preferably 1-2. Heteroatoms include, for example, nitrogen atoms, oxygen atoms, and sulfur atoms. Heteroaryl groups preferably have one or more nitrogen atoms. Two R ² groups in general formula (3) may be the same or different. Two R ³ groups in formula (3) may be the same or different.

R ⁴ is preferably a hydrogen atom, an alkyl group, an aryl group, a heteroaryl group, or a group represented by -BR ^4x R ^4y , and is preferably a hydrogen atom, an alkyl group, an aryl group, or -BR ^4x R ^4y A group represented by —BR ^4x R ^4y is particularly preferable. The substituent represented by R ^4x R ^4y is preferably a halogen atom, an alkyl group, an alkoxy group, an aryl group, or a heteroaryl group, more preferably an alkyl group, an aryl group, or a heteroaryl group, and particularly preferably an aryl group. These groups may further have a substituent. Two R ⁴ groups in general formula (3) may be the same or different.

Specific examples of the compound represented by formula (3) are shown below. In the following structural formulas, Me represents a methyl group and Ph represents a phenyl group. Further, as the pyrrolopyrrole compound, paragraphs 0016 to 0058 of JP-A-2009-263614, paragraphs 0037-0052 of JP-A-2011-68731, paragraphs 0014-0027 of JP-A-2014-130343, International Publication No. 2015/166873, paragraphs 0010-0033. In addition, this invention is not limited to these.

(naphthalocyanine compound)
The naphthalocyanine compound is preferably a compound represented by the following general formula (4).

general formula (4)

In general formula (4), X ₁ to X ₈ and Y ₁ to Y ₈ each independently represent a hydrogen atom, a halogen atom, a nitro group, a sulfone group, an optionally substituted alkyl group, or a substituent. optionally substituted aryl group, optionally substituted cycloalkyl group, optionally substituted heterocyclic group, optionally substituted alkoxyl group, optionally substituted aryloxy group, optionally substituted alkylthio group, optionally substituted arylthio group, optionally substituted phthalimidomethyl group, or optionally substituted sulfamoyl represents a group. In addition, X ₁ to X ₈ may each independently combine with each other to form an aromatic ring which may have a substituent. However, any one or more of X ₁ and X ₂ , X ₃ and X ₄ , X ₅ and X ₆ , X ₇ and X ₈ are bonded to each other to form an aromatic ring which may have a substituent.
Z is a polymer site containing a monomer unit represented by the following general formula (5) or a phosphorus compound site represented by the following general formula (6), and * is a bond with Al.

The "alkyl group" of the alkyl group optionally having a substituent is, for example, a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a tert-butyl group, a neopentyl group, and an n-hexyl group. , n-octyl group, stearyl group, 2-ethylhexyl group, and other linear or branched alkyl groups. "Alkyl group having a substituent" includes, for example, trichloromethyl group, trifluoromethyl group, 2,2,2-trifluoroethyl group, 2,2-dibromoethyl group, 2,2,3,3-tetrafluoro propyl group, 2-ethoxyethyl group, 2-butoxyethyl group, 2-nitropropyl group, benzyl group, 4-methylbenzyl group, 4-tert-butylbenzyl group, 4-methoxybenzyl group, 4-nitrobenzyl group, 2,4-dichlorobenzyl group and the like.

The "aryl group" of the aryl group optionally having a substituent includes, for example, a phenyl group, a naphthyl group, an anthryl group and the like.
"Aryl group having a substituent" includes, for example, p-methylphenyl group, p-bromophenyl group, p-nitrophenyl group, p-methoxyphenyl group, 2,4-dichlorophenyl group, pentafluorophenyl group, 2- aminophenyl group, 2-methyl-4-chlorophenyl group, 4-hydroxy-1-naphthyl group, 6-methyl-2-naphthyl group, 4,5,8-trichloro-2-naphthyl group, anthraquinonyl group, 2-amino Anthraquinonyl group and the like can be mentioned.

The "cycloalkyl group" of the cycloalkyl group which may have a substituent includes, for example, a cyclopentyl group, a cyclohexyl group, an adamantyl group and the like.
Examples of "substituted cycloalkyl group" include 2,5-dimethylcyclopentyl group, 4-tert-butylcyclohexyl group and the like.

The "heterocyclic group" of the optionally substituted heterocyclic group includes pyridyl group, pyrazyl group, piperidino group, pyranyl group, morpholino group, acridinyl group and the like. The "heterocyclic group having a substituent" includes 3-methylpyridyl group, N-methylpiperidyl group, N-methylpyrrolyl group and the like.

The "alkoxyl group" of the alkoxyl group which may have a substituent is, for example, a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, an n-butoxy group, an isobutoxy group, a tert-butoxy group, a neopentyloxy group, Linear or branched alkoxyl groups such as 2,3-dimethyl-3-pentyloxy, n-hexyloxy, n-octyloxy, stearyloxy and 2-ethylhexyloxy groups can be mentioned.
The "substituted alkoxyl group" includes, for example, a trichloromethoxy group, a trifluoromethoxy group, a 2,2,2-trifluoroethoxy group, a 2,2,3,3-tetrafluoropropoxy group, a 2,2-ditri fluoromethylpropoxy group, 2-ethoxyethoxy group, 2-butoxyethoxy group, 2-nitropropoxy group, benzyloxy group and the like.

The "aryloxy group" of the aryloxy group optionally having a substituent includes, for example, a phenoxy group, a naphthoxy group, an anthryloxy group, etc.
"Aryloxy group having a substituent" includes, for example, p-methylphenoxy group, p-nitrophenoxy group, p-methoxyphenoxy group, 2,4-dichlorophenoxy group, pentafluorophenoxy group, 2-methyl-4- A chlorophenoxy group and the like can be mentioned.

The "alkylthio group" of the alkylthio group optionally having a substituent is, for example, a methylthio group, an ethylthio group, a propylthio group, a butylthio group, a pentylthio group, a hexylthio group, an octylthio group, a decylthio group, a dodecylthio group, an octadecylthio group, etc. is mentioned.
Examples of the "substituted alkylthio group" include a methoxyethylthio group, an aminoethylthio group, a benzylaminoethylthio group, a methylcarbonylaminoethylthio group, a phenylcarbonylaminoethylthio group and the like.

The "arylthio group" of the arylthio group optionally having a substituent includes, for example, a phenylthio group, a 1-naphthylthio group, a 2-naphthylthio group, a 9-anthrylthio group and the like.
"Arylthio group having a substituent" includes, for example, a chlorophenylthio group, a trifluoromethylphenylthio group, a cyanophenylthio group, a nitrophenylthio group, a 2-aminophenylthio group, a 2-hydroxyphenylthio group, and the like. .

The substituents of the aromatic ring which may have a substituent include a halogen atom, a nitro group, a nitrile group, a carboxyl group, a sulfone group, an alkyl group which may have a substituent, and a substituent which may have aryl group, optionally substituted cycloalkyl group, optionally substituted alkoxyl group, optionally substituted aryloxy group, optionally substituted alkylthio group, substituted An arylthio group optionally having a group is exemplified.

general formula (5)

In general formula (5), X is -CONH-R ²⁵ -, -COO-R ²⁶ -, -CONH-R ²⁷ -O-, -COO-R ²⁸ -O-. R ²⁵ to R ²⁸ are an alkylene group optionally linked by —O—, —CO—, —COO—, —OCO—, —CONH—, or —NHCO— between carbon atoms, or represents an arylene group. R ³¹ represents hydrogen or a methyl group. * is a bond with Al.

Examples of the alkylene group include methylene group, ethylene group, propylene group and butylene group. Arylene groups include, for example, phenylene, naphthylene, biphenylene, terphenylene and anthrylene groups.

The monomer units represented by the general formula (5) are, for example, (2-(meth)acryloyloxyethyl)acid phosphate, (2-(meth)acryloyloxypropyl)acid phosphate, (2-(meth)acryloyloxyisopropyl ) obtained by polymerizing a monomer such as acid phosphate. In addition, monomers other than these monomers (hereinafter also referred to as other monomers) can be used in combination for copolymerization.

Other monomers include, for example, (meth)acrylic acid esters, crotonic acid esters, vinyl esters, maleic acid diesters, fumaric acid diesters, itaconic acid diesters, (meth)acrylamides, vinyl ethers, vinyl Alcohol esters, styrenes, (meth)acrylonitrile, acid group-containing monomers, thermally crosslinkable group-containing monomers, and the like can be mentioned.

The weight average molecular weight of the polymer portion is preferably 5,000 to 20,000, more preferably 8,000 to 15,000. Having an appropriate molecular weight improves optical properties and heat resistance.

The glass transition temperature (Tg) of the polymer portion is preferably -50 to 150°C, more preferably 20 to 80°C. An appropriate Tg improves optical properties.

general formula (6)

In general formula (6), R ²⁹ and R ³⁰ each independently represent a hydroxyl group, an optionally substituted alkyl group, an optionally substituted aryl group, or an optionally substituted It represents an alkoxyl group or an optionally substituted aryloxy group, and R ²⁹ and R ³⁰ may combine with each other to form a ring. * is a bond with Al.

"Alkyl group" of alkyl group optionally having substituent(s), "aryl group" of aryl group optionally having substituent(s), "alkoxyl group" of alkoxyl group optionally having substituent(s), substituent Examples of the "aryloxy group" of the aryloxy group which may have are the same groups as those exemplified in the explanation of the above general formula (4).

In general formula (6), from the viewpoint of dispersibility and color characteristics, at least one of R ²⁹ and R ³⁰ is an aryl group optionally having a substituent or an aryloxy group optionally having a substituent is preferred, both R ²⁹ and R ³⁰ are more preferably an aryl group or an aryloxy group, and both R ²⁹ and R ³⁰ are more preferably a phenyl group or a phenoxy group.

Specific examples of the compound represented by formula (4) are shown below. In addition, this invention is not limited to these.

From the viewpoint of light resistance and heat resistance, the compound represented by the general formula (4) has two or more of X ₁ and X ₂ , X ₃ and X ₄ , X ₅ and X ₆ , X ₇ and X ₈ preferably contain a compound that bonds to each other to form an optionally substituted aromatic ring, and three or more bond to each other to form an optionally substituted aromatic ring. is more preferred.

(indigo compound)
The indigo compound is preferably a compound represented by the following general formula (7) or general formula (8).

In general formulas (7) and (8), X ₁ to X ₄₀ are each independently a hydrogen atom, an optionally substituted alkyl group, an optionally substituted aryl group, alkoxyl group optionally having substituent(s), aryloxy group optionally having substituent(s), arylalkyl group optionally having substituent(s), cycloalkyl group optionally having substituent(s) , optionally substituted alkylthio group, optionally substituted arylthio group, amino group, optionally substituted alkylamino group, optionally substituted represents an arylamino group, a cyano group, a halogen atom, a nitro group, a hydroxyl group, --SO ₃ H; --COOH; and monovalent to trivalent metal salts of these acidic groups; and alkylammonium salts. M represents a metal atom.

The "alkyl group" of the alkyl group optionally having a substituent is, for example, a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a tert-butyl group, a neopentyl group, and an n-hexyl group. , n-octyl group, stearyl group, 2-ethylhexyl group, and other linear or branched alkyl groups. "Alkyl group having a substituent" includes, for example, trichloromethyl group, trifluoromethyl group, 2,2,2-trifluoroethyl group, 2,2-dibromoethyl group, 2,2,3,3-tetrafluoro propyl group, 2-ethoxyethyl group, 2-butoxyethyl group, 2-nitropropyl group, benzyl group, 4-methylbenzyl group, 4-tert-butylbenzyl group, 4-methoxybenzyl group, 4-nitrobenzyl group, 2,4-dichlorobenzyl group and the like.

The "aryl group" of the aryl group optionally having a substituent includes, for example, a phenyl group, a naphthyl group, an anthryl group and the like.
"Aryl group having a substituent" includes, for example, p-methylphenyl group, p-bromophenyl group, p-nitrophenyl group, p-methoxyphenyl group, 2,4-dichlorophenyl group, pentafluorophenyl group, 2- aminophenyl group, 2-methyl-4-chlorophenyl group, 4-hydroxy-1-naphthyl group, 6-methyl-2-naphthyl group, 4,5,8-trichloro-2-naphthyl group, anthraquinonyl group, 2-amino Anthraquinonyl group and the like can be mentioned.

The "alkoxyl group" of the alkoxyl group which may have a substituent is, for example, a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, an n-butoxy group, an isobutoxy group, a tert-butoxy group, a neopentyloxy group, Linear or branched alkoxyl groups such as 2,3-dimethyl-3-pentyloxy, n-hexyloxy, n-octyloxy, stearyloxy and 2-ethylhexyloxy groups can be mentioned.
The "substituted alkoxyl group" includes, for example, a trichloromethoxy group, a trifluoromethoxy group, a 2,2,2-trifluoroethoxy group, a 2,2,3,3-tetrafluoropropoxy group, a 2,2-ditri fluoromethylpropoxy group, 2-ethoxyethoxy group, 2-butoxyethoxy group, 2-nitropropoxy group, benzyloxy group and the like.

The "aryloxy group" of the aryloxy group which may have a substituent includes, for example, a phenoxy group, a naphthoxy group, an anthryloxy group, and the like. -methylphenoxy group, p-nitrophenoxy group, p-methoxyphenoxy group, 2,4-dichlorophenoxy group, pentafluorophenoxy group, 2-methyl-4-chlorophenoxy group and the like.

"Optionally substituted arylalkyl group" includes, for example, benzyl group, 2-phenylpropan-yl group, styryl group, diphenylmethyl group, triphenylmethyl group and the like.

The "cycloalkyl group" of the cycloalkyl group which may have a substituent includes, for example, a cyclopentyl group, a cyclohexyl group, an adamantyl group and the like. Examples of "substituted cycloalkyl group" include 2,5-dimethylcyclopentyl group, 4-tert-butylcyclohexyl group and the like.

The "alkylthio group" of the alkylthio group optionally having a substituent is, for example, a methylthio group, an ethylthio group, a propylthio group, a butylthio group, a pentylthio group, a hexylthio group, an octylthio group, a decylthio group, a dodecylthio group, an octadecylthio group, etc. is mentioned.
Examples of the "substituted alkylthio group" include a methoxyethylthio group, an aminoethylthio group, a benzylaminoethylthio group, a methylcarbonylaminoethylthio group, a phenylcarbonylaminoethylthio group and the like.

The "arylthio group" of the arylthio group optionally having a substituent includes, for example, a phenylthio group, a 1-naphthylthio group, a 2-naphthylthio group, a 9-anthrylthio group and the like.
"Arylthio group having a substituent" includes, for example, a chlorophenylthio group, a trifluoromethylphenylthio group, a cyanophenylthio group, a nitrophenylthio group, a 2-aminophenylthio group, a 2-hydroxyphenylthio group, and the like. .

The "alkylamino group" of the optionally substituted alkylamino group includes, for example, methylamino group, ethylamino group, propylamino group, butylamino group, pentylamino group, hexylamino group, heptylamino group, Octylamino group, nonylamino group, decylamino group, dodecylamino group, octadecylamino group, isopropylamino group, isobutylamino group, isopentylamino group, sec-butylamino group, tert-butylamino group, sec-pentylamino group, tert -pentylamino group, tert-octylamino group, neopentylamino group, cyclopropylamino group, cyclobutylamino group, cyclopentylamino group, cyclohexylamino group, cycloheptylamino group, cyclooctylamino group, cyclododecylamino group, 1 -adamantamino group, 2-adamantamino group and the like.

The "arylamino group" of the arylamino group optionally having a substituent is, for example, anilino group, 1-naphthylamino group, 2-naphthylamino group, o-toluidino group, m-toluidino group, p-toluidino group, 2-biphenylamino group, 3-biphenylamino group, 4-biphenylamino group, 1-fluoreneamino group, 2-fluoreneamino group, 2-thiazoleamino group, p-terphenylamino group and the like.

Halogen atoms include fluorine, chlorine, bromine and iodine.

Acidic groups include —SO ₃ H and —COOH. Examples of monovalent to trivalent metal salts of these acidic groups include sodium salts, potassium salts, magnesium salts, calcium salts, iron salts and aluminum salts. Examples of alkylammonium salts of acidic groups include ammonium salts of long-chain monoalkylamines such as octylamine, laurylamine and stearylamine, palmityltrimethylammonium, lauryltrimethylammonium, dilauryldimethylammonium and distearyldimethylammonium salts. and quaternary alkylammonium salts of.

Preferred substituents for X ₁ to X ₄₀ among the above substituents include a hydrogen atom, a methyl group, a methoxy group, a fluorine atom, a chlorine atom, a bromine atom, and --SO ₃ H.

M represents a metal atom. Metal atoms include Zn, Co, Ni, Ru, Pt, Mn, Sn, Ti, Ba, and the like. Among them, a divalent metal atom is preferable, and Zn, Co, and Ni are more preferable.

Specific examples of the compound represented by the general formula (7) or the compound represented by the general formula (8) are shown below. In addition, this invention is not limited to these.

The near-infrared absorbing dye (A) can be used alone or in combination of two or more. When two or more types are used in combination, it is preferable to use at least two types of compounds having different maximum absorption wavelengths. As a result, the waveform of the absorption spectrum is broadened compared to the case where one kind of near-infrared absorbing dye (A) is used, and near-infrared rays in a wide wavelength range can be absorbed.

From the viewpoint of near-infrared absorption, the content of the near-infrared absorbing dye (A) is preferably 0.5 to 70% by mass, more preferably 1 to 50% by mass, based on 100% by mass of non-volatile matter in the photosensitive composition.

[Alkali-soluble resin (B)]
The photosensitive composition of the present invention includes, as the alkali-soluble resin (B), an alkali-soluble resin (B1) having a glass transition temperature of −10 to 40° C., and an alkali-soluble resin (B1) having a glass transition temperature of 60 to 150° C. B2). As a result, a cured film having excellent developability, adhesion, heat cycle resistance, and solvent resistance can be obtained.

As the glass transition temperature (hereinafter also referred to as Tg), a measured Tg obtained by actual measurement can be applied. Specifically, the measured Tg can use a value measured by differential scanning calorimetry (DSC).
However, if measurement is difficult due to decomposition of the resin, etc., the calculated Tg obtained by the following formula is applied.
₁ /Tg ₌ W1 _/ Tg1 ₊ W2/Tg2+...+ _Wn / _Tgn
Here, the resin to be calculated is assumed to be a copolymer of n kinds of monomer components from W ₁ to W _n , W _n is the weight fraction of the n-th monomer, Tg _n is n is the glass transition temperature (absolute temperature) of the homopolymer of the first monomer. The value of the glass transition temperature of a homopolymer (hereinafter also referred to as a homopolymer) of each monomer is described in Brandrup, J.; Immergut, E.; H. The values given in the ed. "Polymer Handbook, Third edition, John wiley & sons, 1989" are used.

(Alkali-soluble resin (B1) having a glass transition temperature of −10 to 40° C.)
The alkali-soluble resin (B1) having a glass transition temperature of -10 to 40°C (hereinafter also simply referred to as the alkali-soluble resin (B1)) may have a glass transition temperature of -10 to 40°C, and may be a known resin. Available.

The glass transition temperature of the alkali-soluble resin (B1) is preferably 0 to 30° C. from the viewpoint of developability, adhesion and heat cycle resistance.

Examples of the alkali-soluble resin (B1) include (meth)acrylic resins, styrene resins, epoxy resins, urethane resins, polycarbonate resins, polyester resins, polyether resins, polyimide resins, polyamideimide resins, cyclic olefin resins, and the like.

The weight average molecular weight (Mw) of the alkali-soluble resin (B1) is preferably 5,000 to 40,000, more preferably 5,000 to 30,000, from the viewpoint of developability, adhesion and heat cycle resistance.

From the standpoint of developability, the alkali-soluble resin (B1) is preferably a resin having an acid group in its side chain. Examples of acid groups include carboxyl groups, phosphoric acid groups, sulfo groups, and phenolic hydroxy groups. Among these, a carboxyl group is preferred.
The alkali-soluble resin (B1) is, for example, an acrylic acid copolymer, a methacrylic acid copolymer, a maleic acid copolymer, a partially esterified maleic acid copolymer, an alkali-soluble phenolic resin such as a novolak resin, or a hydroxy group-containing resin. Examples thereof include resins obtained by adding acid anhydrides to resins. Among these, copolymers of (meth)acrylic acid and other monomers copolymerizable therewith are preferred. Other monomers copolymerizable with (meth)acrylic acid include, for example, methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) ) acrylate, 2-hydroxyethyl (meth) acrylate, cyclohexanedimethanol mono (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, cyclohexyl (meth) acrylate, stearyl (meth)acrylate, lauryl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, isobornyl (meth)acrylate, phenyl (meth)acrylate, benzyl (meth)acrylate, phenoxyethyl (meth)acrylate, adamantyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentanyl (meth)acrylate, phenoxydiethylene glycol (meth)acrylate, methoxypolypropylene glycol (meth)acrylate, ethoxypolyethylene glycol (meth)acrylate, ethylene oxide (EO)-modified cresol acrylate, n - nonylphenoxy polyethylene glycol acrylate, phenoxyethyl acrylate, ethoxylated phenyl acrylate, EO-modified (meth)acrylates of phenol, EO- or propylene oxide (PO)-modified (meth)acrylates of paracumylphenol, EO-modified (meth)acrylates of nonylphenol , PO-modified (meth)acrylate of nonylphenol, glycidyl (meth)acrylate, methylglycidyl (meth)acrylate, 2-glycidoxyethyl (meth)acrylate, 3,4-epoxybutyl (meth)acrylate, and 3,4- (meth)acrylates such as epoxycyclohexyl (meth)acrylate;
(Meth)acrylamide, N,N-dimethyl(meth)acrylamide, N,N-diethyl(meth)acrylamide, N-isopropyl(meth)acrylamide, diacetone (meth)acrylamide, or (meth)acrylamides such as acryloylmorpholine ;
styrene or styrenes such as α-methylstyrene;
vinyl ethers such as ethyl vinyl ether, n-propyl vinyl ether, isopropyl vinyl ether, n-butyl vinyl ether, or isobutyl vinyl ether;
Fatty acid vinyls such as vinyl acetate or vinyl propionate;
cyclohexylmaleimide, phenylmaleimide, methylmaleimide, ethylmaleimide, 1,2-bismaleimidoethane, 1,6-bismaleimidohexane, 3-maleimidopropionic acid, 6,7-methylenedioxy-4-methyl-3-maleimidocoumarin, 4,4'-bismaleimidodiphenylmethane, bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, N,N'-1,3-phenylenedimaleimide, N,N'-1,4-phenylenedi maleimide, N-(1-pyrenyl)maleimide, N-(2,4,6-trichlorophenyl)maleimide, N-(4-aminophenyl)maleimide, N-(4-nitrophenyl)maleimide, N-benzylmaleimide, N-bromomethyl-2,3-dichloromaleimide, N-succinimidyl-3-maleimidobenzoate, N-succinimidyl-3-maleimidopropionate, N-succinimidyl-4-maleimidobutyrate, N-succinimidyl-6-maleimidohexano N-substituted maleimides such as art, N-[4-(2-benzimidazolyl)phenyl]maleimide, 9-maleimidoacridine;
Dimethyl-2,2'-[oxybis(methylene)]bis-2-propenoate, diethyl-2,2'-[oxybis(methylene)]bis-2-propenoate, di(n-propyl)-2,2'- [oxybis(methylene)]bis-2-propenoate, di(isopropyl)-2,2'-[oxybis(methylene)]bis-2-propenoate, di(2-ethylhexyl)-2,2'-[oxybis(methylene) )] and bis-2-propenoate. These monomers can be used alone or in combination of two or more.

The acid value of the alkali-soluble resin (B1) is preferably 30 to 200 mgKOH/g, more preferably 60 to 150 mgKOH/g, from the viewpoint of developability.

From the viewpoint of solvent resistance, the alkali-soluble resin (B1) preferably contains a polymerizable unsaturated group. A vinyl group, a (meth)allyl group, a (meth)acryloyl group, etc. are mentioned as a polymerizable unsaturated group. Methods for introducing a polymerizable unsaturated group include, for example, methods (i) and (ii) shown below.

[Method (i)]
Method (i), for example, first synthesizes a polymer (precursor) of a carboxyl group-containing monomer and other monomers. Next, an epoxy group-containing monomer (modified compound) is added to the carboxyl group of the precursor.

Carboxyl group-containing monomers include, for example, (meth)acrylic acid, crotonic acid, o-, m-, p-vinylbenzoic acid, α-position haloalkyl, alkoxyl, halogen, nitro, and cyano-substituted (meth)acrylic acid. and the like, which can be used singly or in combination of two or more.

Epoxy group-containing monomers include, for example, glycidyl (meth)acrylate, methylglycidyl (meth)acrylate, 2-glycidoxyethyl (meth)acrylate, 3,4-epoxybutyl (meth)acrylate, and 3,4- Epoxycyclohexyl (meth)acrylates can be mentioned. Among these, glycidyl (meth)acrylate is preferable from the viewpoint of reactivity.

Other monomers include the above-mentioned monomers, etc., and can be used singly or in combination of two or more.

As a method similar to method (i), for example, first, a polymer (precursor) of an epoxy group-containing monomer and other monomers is synthesized. Next, a carboxyl group-containing monomer (modifying compound) is added to the epoxy group of the precursor, and the resulting hydroxyl group is reacted with a polybasic acid anhydride (modifying compound).

Examples of polybasic acid anhydrides include tetrahydrophthalic anhydride, phthalic anhydride, hexahydrophthalic anhydride, succinic anhydride, maleic anhydride and the like. Tetracarboxylic dianhydrides such as acid dianhydrides and pyromellitic anhydrides can also be used to hydrolyze residual anhydride groups.

[Method (ii)]
Method (ii), for example, first synthesizes a polymer (precursor) of a hydroxyl group-containing monomer, a carboxyl group-containing monomer, and other monomers. Next, the hydroxyl group of the precursor is reacted with the isocyanate group of the isocyanate group-containing monomer (modified compound).

Hydroxyl group-containing monomers, for example, 2-hydroxyethyl (meth) acrylate, 2- or 3-hydroxypropyl (meth) acrylate, 2- or 3- or 4-hydroxybutyl (meth) acrylate, glycerol mono (meth) acrylates or hydroxyalkyl methacrylates such as cyclohexanedimethanol mono(meth)acrylate; In addition, polyether mono(meth)acrylate obtained by addition polymerization of ethylene oxide, propylene oxide, and/or butylene oxide to hydroxyalkyl (meth)acrylate, poly γ-valerolactone, poly ε-caprolactone, and/or poly Polyester mono(meth)acrylates to which 12-hydroxystearic acid or the like is added are also included.

Isocyanate group-containing monomers include 2-(meth)acryloylethyl isocyanate, 2-(meth)acryloyloxyethyl isocyanate, 1,1-bis[methacryloyloxy]ethyl isocyanate, and the like.

The double bond equivalent of the alkali-soluble resin (B1) is preferably 100 to 2,000 g/mol, more preferably 200 to 1,000, from the viewpoint of developability, adhesion, heat cycle resistance, and solvent resistance.
The double bond equivalent is the mass per mole of ethylenically unsaturated double bond of the resin, and can be calculated by the following formula.
Double bond equivalent = mass of resin (g) / amount of ethylenically unsaturated double bonds in resin (mol)

From the viewpoint of adhesion, the alkali-soluble resin (B1) preferably contains a hydroxyl group. The method of introducing a hydroxyl group is not particularly limited, but for example, a method of copolymerizing the hydroxyl group-containing monomer, the carboxyl group-containing monomer, and other monomers described above, the above-described methods (i) and (ii) ).

The hydroxyl value of the alkali-soluble resin (B1) is preferably 10 to 200 mgKOH/g, more preferably 30 to 150 mgKOH/g, from the viewpoint of adhesion.

Also, the alkali-soluble resin (B1) can contain thermosetting groups such as epoxy groups, oxetanyl groups, and isocyanate groups. The isocyanate group is preferably protected with a thermally detachable compound (blocking agent).

Alkali-soluble resin (B1) can be used alone or in combination of two or more.

The content of the alkali-soluble resin (B1) is preferably 30 to 70% by mass in 100% by mass of the alkali-soluble resin (B) from the viewpoint of developability, adhesion, heat cycle resistance, and solvent resistance. It is more preferably 40 to 60% by mass.

(Alkali-soluble resin (B2) having a glass transition temperature of 60 to 150°C)
The alkali-soluble resin (B2) having a glass transition temperature of 60 to 150° C. (hereinafter also simply referred to as the alkali-soluble resin (B2)) may have a glass transition temperature of 60 to 150° C., and the alkali-soluble resin ( The same kind of resin as B1) can be used.

The glass transition temperature of the alkali-soluble resin (B2) is preferably 70 to 120°C, more preferably 70 to 100°C, from the viewpoints of developability, adhesion, heat cycle resistance and solvent resistance.

The alkali-soluble resin (B2) preferably does not contain a polymerizable unsaturated group from the viewpoint of developability, adhesion and heat cycle resistance.

The acid value of the alkali-soluble resin (B2) is preferably 30 to 200 mgKOH/g, more preferably 60 to 150 mgKOH/g, from the viewpoint of developability.

The weight average molecular weight (Mw) of the alkali-soluble resin (B2) is preferably 5,000 to 40,000, more preferably 5,000 to 30,000, from the viewpoint of developability, adhesion, heat cycle resistance, and solvent resistance. more preferred.

Alkali-soluble resin (B2) can be used alone or in combination of two or more.

The content of the alkali-soluble resin (B2) is preferably 30 to 70% by mass in 100% by mass of the alkali-soluble resin (B) from the viewpoint of developability, adhesion, heat cycle resistance, and solvent resistance. It is more preferably 40 to 60% by mass.

The total content of the alkali-soluble resin (B1) and the alkali-soluble resin (B2) is 90% by mass in 100% by mass of the alkali-soluble resin (B) from the viewpoint of developability, adhesion, heat resistance, and heat cycle resistance. The above is preferable.

(Alkali-soluble resin (B3))
The photosensitive composition of the present invention can contain an alkali-soluble resin (B3) other than the alkali-soluble resin (B1) and the alkali-soluble resin (B2) as long as the effects of the present invention are not impaired.

The content of the alkali-soluble resin (B) is preferably 1 to 80% by mass, more preferably 5 to 60% by mass, and even more preferably 10 to 50% by mass based on 100% by mass of the non-volatile matter of the photosensitive composition.

[Polymerizable compound (C)]
The photosensitive composition of the invention contains a polymerizable compound (C).

The polymerizable compound (C) includes monomers and oligomers. Examples of polymerizable unsaturated groups include vinyl groups, (meth)allyl groups, (meth)acryloyl groups, and (meth)acryloyloxy groups. Examples of the polymerizable compound (C) include a lactone-modified polymerizable compound, a polymerizable compound having an acid group, a polymerizable compound having a urethane bond, and other polymerizable compounds.

(Lactone-modified polymerizable compound)
From the viewpoint of solvent resistance, the photosensitive composition of the present invention preferably contains a lactone-modified polymerizable compound.

A lactone-modified polymerizable compound is a compound having a lactone-modified structure in its molecule. The lactone-modified polymerizable compound includes polyhydric alcohols such as trimethylolethane, ditrimethylolethane, trimethylolpropane, ditrimethylolpropane, pentaethritol, tripentaerythritol, glycerin, diglycerol, and trimetholmelamine, and ( It is obtained by esterifying meth)acrylic acid and ε-caprolactone or other lactone compounds. The lactone-modified polymerizable compound is preferably a compound represented by the following general formula (9).

general formula (9)

In general formula (9), all six R are groups represented by the following general formula (10), or 1 to 5 of the six R are groups represented by the following general formula (10) , and the rest are groups represented by the following general formula (11).

general formula (10)

In general formula (10), R ¹ represents a hydrogen atom or a methyl group, m is an integer of 1 or 2, and * is a bond that bonds to the oxygen atom in general formula (9).

general formula (11)

In general formula (11), R ¹ represents a hydrogen atom or a methyl group, and * is a bond that bonds with the oxygen atom in general formula (9).

Lactone-modified polymerizable compounds are commercially available, for example, as KAYARAD DPCA series manufactured by Nippon Kayaku Co., Ltd. DPCA-20 (in the above general formulas (9) to (11), m = 1, general formula (10 ) = 2, R ¹ are all hydrogen atoms), DPCA-30 (in the above general formulas (9) to (11), m = 1, represented by general formula (10) DPCA ^- 60 (in the above general formulas (9) to (11), m = 1, the number of groups represented by general formula (10) = 6, a compound in which all R ¹ are hydrogen atoms), DPCA-120 (in the above general formulas (9) to (11), m = 2, the number of groups represented by the general formula (10) = 6, R ¹ are all hydrogen atoms), and the like.

From the viewpoint of coating film resistance, the lactone-modified polymerizable compound has m = 1 in the general formulas (9) to (11), the number of groups represented by the general formula (10) = 2 to 6, R A compound in which all ¹ are hydrogen atoms is preferable, and in the above general formulas (9) to (11), m = 1, the number of groups represented by general formula (10) = 2 or 3, and all R ¹ are hydrogen atoms. is more preferred.

From the viewpoint of solvent resistance, the content of the lactone-modified polymerizable compound is preferably 5 to 80% by mass, more preferably 10 to 70% by mass, more preferably 20 to 60% by mass, based on 100% by mass of the polymerizable compound (C). % is more preferred.

(Polymerizable compound having acid group)
From the viewpoint of developability, the photosensitive composition of the present invention preferably contains a polymerizable compound having an acid group. Examples of the acid group of the polymerizable compound having an acid group include a sulfonic acid group, a carboxyl group, and a phosphoric acid group. Among these, a carboxyl group is preferred.

Polymerizable compounds having an acid group include, for example, esters of free hydroxyl group-containing poly(meth)acrylates of polyhydric alcohol and (meth)acrylic acid, and dicarboxylic acids; Examples thereof include esterified products with meth)acrylates.
Examples of polyhydric alcohols include ethylene glycol, propylene glycol, polyethylene glycol, polypropylene glycol, glycerin, trimethylolpropane, ditrimethylolpropane, pentaerythritol and dipentaerythritol.
Examples of dicarboxylic acids include malonic acid, succinic acid, maleic acid, glutaric acid, and itaconic phthalate.
Examples of polyvalent carboxylic acids include trimellitic acid and pyromellitic acid.
Monohydroxyalkyl (meth)acrylates, for example, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, pentaerythritol triacrylate, 2-hydroxy-3-acryloyloxypropyl methacrylate and the like.

Commercial products of polymerizable compounds having an acid group include Viscoat #2500P manufactured by Osaka Organic Chemical Industry Co., Ltd., Aronix M-5300, M-5400, M-5700, M-510, M-520, M- manufactured by Toagosei Co., Ltd. 521 and the like.

The content of the polymerizable compound having an acid group is preferably 5 to 80% by mass, more preferably 10 to 70% by mass, more preferably 20 to 60% by mass in 100% by mass of the polymerizable compound (C) from the viewpoint of developability. % is more preferred.

(Polymerizable compound having urethane bond)
From the viewpoint of heat cycle resistance, the photosensitive composition of the present invention preferably contains a polymerizable compound having a urethane bond as the polymerizable compound (C).

The polymerizable compound having a urethane bond is, for example, a urethane (meth)acrylate obtained by reacting a (meth)acrylate having a hydroxyl group with a polyfunctional isocyanate, or a polyhydric alcohol reacted with a polyfunctional isocyanate and further having a hydroxyl group. Urethane (meth)acrylate obtained by reacting (meth)acrylate, and the like.

(Meth)acrylates having a hydroxyl group include, for example, 2-hydroxyethyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, trimethylolpropane di(meth)acrylate, pentaerythritol tri(meth)acrylate, ditrimethylolpropane tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol ethylene oxide-modified penta(meth)acrylate, dipentaerythritol propylene oxide-modified penta(meth)acrylate, dipentaerythritol caprolactone-modified penta(meth)acrylate, Glycerol tri(meth)acrylate, glycerol di(meth)acrylate, glycerol mono(meth)acrylate, 2-hydroxy-3-acryloylpropyl methacrylate, reaction product of epoxy group-containing compound and carboxy(meth)acrylate, hydroxyl group-containing polyol polyacrylate etc.

Examples of the polyfunctional isocyanate include aromatic diisocyanates such as tolylene diisocyanate, diphenylmethylene diisocyanate, and xylene diisocyanate; aliphatic diisocyanates such as trimethylene diisocyanate, tetramethylene diisocyanate, and hexamethylene diisocyanate; and alicyclic diisocyanates such as isophorone diisocyanate. , their burettes, isocyanate nurates, trimethylolpropane adducts, and the like.

From the viewpoint of developability, the polymerizable compound having a urethane bond preferably further has an acid group. Examples of acid groups include sulfonic acid groups, carboxyl groups, and phosphoric acid groups. Among them, a carboxyl group is preferred.

In the method of introducing an acid group into a polymerizable compound having a urethane bond, for example, first, the (meth)acrylate having a hydroxyl group and the polyfunctional isocyanate are reacted. Then, it can be synthesized by adding a mercapto compound having a carboxyl group to the product.

Mercapto compounds having a carboxyl group include, for example, mercaptoacetic acid, 2-mercaptopropionic acid, 3-mercaptopropionic acid, o-mercaptobenzoic acid, 2-mercaptonicotinic acid, and mercaptosuccinic acid.

The number of polymerizable unsaturated groups in the polymerizable compound having a urethane bond is preferably 3-15, more preferably 5-12.

From the viewpoint of heat cycle resistance, the content of the polymerizable compound having a urethane bond is preferably 5 to 80% by mass, more preferably 10 to 70% by mass, more preferably 20 to 60% in 100% by mass of the polymerizable compound (C). % by weight is particularly preferred.

(Other polymerizable compounds)
Other polymerizable compounds, for example, methyl (meth) acrylate, ethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, cyclohexyl (meth) acrylate, polyethylene glycol di (meth) Acrylates, 1,6-hexanediol di(meth)acrylate, triethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, phenoxytetraethyleneglycol (meth)acrylate, phenoxy Hexaethylene glycol (meth)acrylate, trimethylolpropane PO-modified tri(meth)acrylate, trimethylolpropane EO-modified tri(meth)acrylate, isocyanurate EO-modified di(meth)acrylate, isocyanurate EO-modified tri(meth)acrylate, Ditrimethylolpropane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, 1,6-hexanediol diglycidyl ether di(meth)acrylate, bisphenol A diglycidyl ether di(meth)acrylate , neopentyl glycol diglycidyl ether di(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, tricyclodecanyl (meth)acrylate, methylolated melamine (meth)acrylate , Various acrylic and methacrylic acid esters such as epoxy (meth)acrylate, styrene, vinyl acetate, hydroxyethyl vinyl ether, ethylene glycol divinyl ether, pentaerythritol trivinyl ether, (meth)acrylamide, N-hydroxymethyl (meth)acrylamide, Examples include N-vinylformamide and acrylonitrile.

Other commercially available polymerizable compounds include, for example, KAYARAD R-128H, R526, PEG400DA, MAND, NPGDA, R-167, HX-220, R-551, R712, R-604, R-manufactured by Nippon Kayaku Co., Ltd. 684, GPO-303, TMPTA, DPHA, DPEA-12, DPHA-2C, D-310, D-330, Toagosei Aronix M-303, M-305, M-306, M-309, M- 310, M-321, M-325, M-350, M-360, M-313, M-315, M-400, M-402, M-403, M-404, M-405, M-406, M-450, M-452, M-408, M-211B, M-101A, Viscoat #310HP, #335HP, #700, #295, #330, #360, #GPT, # manufactured by Osaka Organic Chemical Industry Co., Ltd. 400, #405, NK Ester A-9300, ABE-300, A-DOG, A-DCP, A-BPE-4 manufactured by Shin Nakamura Chemical Co., Ltd., EBECRY40, 130, 140, 145 manufactured by Daicel Allnex, Kyoeisha AH-600, AT-600 manufactured by Kagaku Co., Ltd., and OGSOL EA-0200, 0300 manufactured by Osaka Gas Chemicals Co., Ltd., etc.

The polymerizable compound (C) can be used alone or in combination of two or more.

From the viewpoint of developability, adhesion, heat cycle resistance, and solvent resistance, the polymerizable compound (C) is a lactone-modified polymerizable compound, a polymerizable compound having an acid group, and a polymerizable compound having a urethane bond. It is preferable to include any one or more selected from the group consisting of. Among them, from the viewpoint of developability, adhesion, and heat cycle resistance, it is more preferable to contain a polymer compound having an acid group represented by the following general formula (12).

general formula (12)

In general formula (12), each R ₁ independently represents a hydrogen atom or a methyl group, and L represents a divalent linking group.

Specific examples of the polymerizable compound having an acid group represented by formula (12) are shown below. In addition, this invention is not limited to these.

The content of the polymerizable compound (C) is preferably 1 to 60% by mass, more preferably 2 to 50% by mass, based on 100% by mass of the non-volatile matter of the photosensitive composition.

[Photoinitiator (D)]
The photosensitive composition of the present invention contains a photoinitiator (D). Thereby, the photosensitive composition can be cured by irradiation with active energy rays to form a cured film.

The photopolymerization initiator (D) is, for example, 4-phenoxydichloroacetophenone, 4-t-butyl-dichloroacetophenone, diethoxyacetophenone, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropane-1- one, 1-hydroxycyclohexylphenyl ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-(dimethylamino)-1-[4-(4-morpholino ) phenyl]-2-(phenylmethyl)-1-butanone, or 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1- Acetophenone compounds such as butanone;
2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s -triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-piperonyl-4,6-bis(trichloromethyl)-s-triazine, 2,4-bis(trichloro methyl)-6-styryl-s-triazine, 2-(naphth-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxy-naphth-1-yl)-4 ,6-bis(trichloromethyl)-s-triazine, 2,4-trichloromethyl-(piperonyl)-6-triazine, or triazines such as 2,4-trichloromethyl-(4′-methoxystyryl)-6-triazine system compound;
1,2-octanedione, 1-[4-(phenylthio)phenyl-,2-(O-benzoyloxime)], or ethanol, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole oxime ester compounds such as 3-yl]-, 1-(O-acetyloxime);
Acylphosphine compounds such as bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide or diphenyl-2,4,6-trimethylbenzoylphosphine oxide;
quinone compounds such as 9,10-phenanthrenequinone, camphorquinone, and ethylanthraquinone; borate compounds; carbazole compounds; imidazole compounds;

Commercially available products include Omnirad 907, 369E, 379EG manufactured by IGM Resins as acetophenone compounds, Omnirad 819 and TPO manufactured by IGM Resins as acylphosphine compounds, and IRGACURE OXE-01 manufactured by BASF Japan as oxime compounds. 02, 03, 04, N-1919 manufactured by ADEKA, NCI-730, 831, 930, TRONLY TR-PBG-301, 304, 305, 309, 314, 345, 358, 380 manufactured by Changzhou Tenryu New Material Co., Ltd. 365, 610, 3054, 3057, Omnirad 1312, 1314, 1316 manufactured by IGM Resins, SPI-02, 03, 04, 05, 06, 07 manufactured by Samyang Corporation, DFI-020, 306 manufactured by Daito Chemix, EOX- 01 and the like.
In addition, JP 2007-210991, JP 2009-179619, JP 2010-037223, JP 2010-215575, JP 2011-020998, International Publication No. 2015/036910, Also included are compounds described in Japanese Patent Publication No. 2017-523465, Japanese Patent Publication No. 2019-507108, Japanese Patent Publication No. 2019-528331, and International Publication No. 2021/175855. Among these, oxime compounds are preferable from the viewpoint of reactivity.

From the viewpoint of adhesion, heat cycle resistance, and solvent resistance, the oxime compound preferably contains one or more selected from the group consisting of compounds represented by the following chemical formulas (16) to (18), It is more preferable to include any two or more of them.

Methods for producing compounds represented by chemical formulas (16) to (18) are, for example, International Publication No. 2015/036910, Japanese Patent Publication No. 2012-526185, and International Publication No. 2015/152153. .

A photoinitiator (D) can be used individually or in combination of 2 or more types.

The content of the photopolymerization initiator (D) is preferably 2 to 50 parts by mass, based on 100 parts by mass of the near-infrared absorbing dye (A), from the viewpoint of photocurability and developability, and 2 to 30 parts by mass. Parts by mass are more preferred.

[Sensitizer (E)]
From the viewpoint of developability, the photosensitive composition of the present invention preferably contains a sensitizer (E).

Sensitizers (E) include, for example, chalcone compounds, unsaturated ketones such as dibenzalacetone, 1,2-diketone compounds such as benzyl and camphorquinone, benzoin compounds, and fluorene. Polymethines such as polymethine-based compounds, naphthoquinone-based compounds, anthraquinone-based compounds, xanthene-based compounds, thioxanthene-based compounds, xanthone-based compounds, thioxanthone-based compounds, coumarin-based compounds, ketocoumarin-based compounds, cyanine-based compounds, merocyanine-based compounds, and oxonol-based compounds dyes, acridine-based compounds, azine-based compounds, thiazine-based compounds, oxazine-based compounds, indoline-based compounds, azulene-based compounds, azulenium-based compounds, squarylium-based compounds, porphyrin-based compounds, tetraphenylporphyrin-based compounds, triarylmethane-based compounds, Tetrabenzoporphyrin compounds, tetrapyrazinoporphyrazine compounds, phthalocyanine compounds, tetraazaporphyrazine compounds, tetraquinoxalyloporphyrazine compounds, naphthalocyanine compounds, subphthalocyanine compounds, pyrylium compounds, thiopyrylium compounds compounds, tetraphylline-based compounds, annulene-based compounds, spiropyran-based compounds, spirooxazine-based compounds, thiospiropyran-based compounds, metal arene complexes, organic ruthenium complexes, benzophenone-based compounds, and the like. Among these, the thioxanthone-based compound (E1) or the benzophenone-based compound (E2) is preferred, and the benzophenone-based compound (E2) is more preferred, from the viewpoint of developability.

(Thioxanthone-based compound (E1))
Thioxanthone compounds (E1) include, for example, 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-dichlorothioxanthone, 2-isopropylthioxanthone, 4-isopropylthioxanthone, 1-chloro-4-propoxythioxanthone, and the like. be done. Among these, 2,4-diethylthioxanthone is preferred.

(Benzophenone compound (E2))
Benzophenone compounds (E2) include, for example, 4,4′-bis(dimethylamino)benzophenone, 4,4′-bis(diethylamino)benzophenone, 2-aminobenzophenone and the like. Among these, 4,4'-bis(diethylamino)benzophenone is preferred.

The sensitizer (E) can be used alone or in combination of two or more.

From the viewpoint of developability, the content of the sensitizer (E) is preferably 150 to 400 parts by mass, more preferably 150 to 300 parts by mass, relative to 100 parts by mass of the photopolymerization initiator (D).

[Colorant (F)]
The photosensitive composition of the present invention can contain a coloring agent (F). Thereby, the transmittance of each wavelength region can be controlled, and the color separation property of the color filter is improved.

The coloring agent (F) may be either a pigment or a dye, and can be used in combination.

(pigment)
A pigment is a compound classified as a pigment in the Color Index.
Red pigments include, for example, C.I. I. Pigment Red 1, 2, 3, 4, 5, 6, 7, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 37, 38, 41, 47, 48, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 50:1, 52:1, 52:2, 53, 53:1, 53:2, 53: 3,57,57:1,57:2,58:4,60,63,63:1,63:2,64,64:1,68,69,81,81:1,81:2,81: 3,81:4,83,88,90:1,101,101:1,104,108,108:1,109,112,113,114,122,123,144,146,147,149,151, 166, 168, 169, 170, 172, 173, 174, 175, 176, 177, 178, 179, 181, 184, 185, 187, 188, 190, 193, 194, 200, 202, 206, 207, 208, 209, 210, 214, 216, 220, 221, 224, 230, 231, 232, 233, 235, 236, 237, 238, 239, 242, 243, 245, 247, 249, 250, 251, 253, 254, 255,256,257,258,259,260,262,263,264,265,266,267,268,269,270,271,272,273,274,275,276,277,278,279,280, 281,282,283,284,285,286,287,291,295,296, pigments described in JP-A-2014-134712, pigments described in Japanese Patent No. 6368844, and the like. Among these, from the viewpoint of heat resistance, light resistance and transmittance, C.I. I. Pigment Red 48: 1,122,177,224,242,269,254,291,295,296, the pigment described in JP-A-2014-134712, the pigment described in Patent No. 6368844 is preferable, C. I. Pigment Red 177, 254, 291, 295, 296, pigments described in JP-A-2014-134712, and pigments described in Japanese Patent No. 6368844 are more preferred.

Orange pigments include, for example, C.I. I. Pigment Orange 36, 38, 43, 64, 71, 73 and the like.

Yellow pigments include, for example, C.I. I. Pigment Yellow 1,2,3,4,5,6,10,12,13,14,15,16,17,18,24,31,32,34,35,35:1,36,36:1, 37, 37: 1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 126, 127, 128, 129, 138, 139, 147, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 179, 180, 181, 182, 185, 187, 188, 192, 193, 194, 196, 198, 199, 213, 214, 231, 233, and pigments described in JP-A-2012-226110. Among these, C.I. I. Pigment Yellow 138, 139, 150, 185, 231, 233 and the pigments described in JP-A-2012-226110 are preferred.

Green pigments include, for example, C.I. I. Pigment Green 1, 2, 4, 7, 8, 10, 13, 14, 15, 17, 18, 19, 26, 36, 37, 45, 48, 50, 51, 54, 55, 58, 59, 62, 63 and the like. Among these, C.I. I. Pigment Green 36, 58, 59, 62, 63 are preferred.

Blue pigments include, for example, C.I. I. Pigment Blue 1, 1: 2, 9, 14, 15, 15: 1, 15: 2, 15: 3, 15: 4, 15: 6, 16, 17, 19, 25, 27, 28, 29, 33, 35, 36, 56, 56: 1, 60, 61, 61: 1, 62, 63, 66, 67, 68, 71, 72, 73, 74, 75, 76, 78, 79 and the like. Among these, C.I. I. Pigment Blue 15, 15:1, 15:2, 15:3, 15:4, 15:6 are preferred.

Purple pigments include, for example, C.I. I. Pigment Violet 1, 1: 1, 2, 2: 2, 3, 3: 1, 3: 3, 5, 5: 1, 14, 15, 16, 19, 23, 25, 27, 29, 31, 32, 37, 39, 42, 44, 47, 49, 50 and the like. Among these, C.I. I. Pigment Violet 19, 23 are preferred.

Specifically, the black pigment is C.I. I. Pigment Black 1, 6, 7, 12, 20, 31 and the like. At least two pigments selected from red pigments, yellow pigments, blue pigments, green pigments, and violet pigments may be used as the black colorant.

Among pigments, inorganic pigments include, for example, titanium oxide, barium sulfate, zinc white, lead sulfate, yellow lead, zinc yellow, red iron oxide (III), cadmium red, ultramarine blue, Prussian blue, chromium oxide green, cobalt green, umber, synthetic iron black, and the like.

(dye)
Dyes include, for example, acid dyes, direct dyes, basic dyes, salt-forming dyes, oil-soluble dyes, disperse dyes, reactive dyes, mordant dyes, vat dyes, and sulfur dyes. Moreover, these derivatives and lake pigments obtained by turning dyes into lakes are also included.

The acid dye preferably has an acidic group such as sulfonic acid or carboxylic acid. Salt-forming compounds, which are salts of acid dyes and nitrogen-containing compounds such as quaternary ammonium salt compounds, tertiary amine compounds, secondary amine compounds, or primary amine compounds, are also preferred. A salt-forming compound, which is a salt of a resin component having these functional groups and an acid dye, is also preferred. Moreover, the salt-forming compound is sulfonamidated to be modified into a sulfonic acid amide compound, thereby easily obtaining a photosensitive composition having excellent resistance (light resistance and solvent resistance).
A salt-forming compound of an acid dye and a compound having an onium base is also preferable because of its excellent resistance (light resistance and solvent resistance). The compound having an onium base is preferably a resin having a cationic group.

Although the basic dye can be used as it is, a salt-forming compound that forms a salt with an organic acid, perchloric acid, or a metal salt thereof is preferred. Salt-forming compounds of basic dyes are preferable because they have excellent resistance (light resistance and solvent resistance) and affinity with pigments. In salt-forming compounds of basic dyes, anion components that act as counter ions include organic sulfonic acids, organic sulfuric acids, fluorine group-containing phosphorus anion compounds, fluorine group-containing boron anion compounds, cyano group-containing nitrogen anion compounds, and halogenated carbonization compounds. A salt-forming compound obtained by salt-forming an anion compound having a conjugate base of an organic acid having a hydrogen group and an acid dye is preferred. It should be noted that the resistance of the salt-forming compound is further improved when it contains a polymerizable unsaturated group in the molecule.

Chemical structures of dyes include, for example, azo dyes, disazo dyes, azomethine dyes (indoaniline dyes, indophenol dyes, etc.), dipyrromethene dyes, quinone dyes (benzoquinone dyes, naphthoquinone dyes, anthraquinone dyes, etc.). dyes, anthrapyridone dyes, etc.), carbonium dyes (diphenylmethane dyes, triphenylmethane dyes, xanthene dyes, acridine dyes, etc.), quinoneimine dyes (oxazine dyes, thiazine dyes, etc.), azine dyes , polymethine dyes (oxonol dyes, merocyanine dyes, arylidene dyes, styryl dyes, cyanine dyes, squarylium dyes, croconium dyes, etc.), quinophthalone dyes, phthalocyanine dyes, subphthalocyanine dyes, perinone dyes Dye structures derived from dyes selected from dyes, indigo dyes, thioindigo dyes, quinoline dyes, nitro dyes, nitroso dyes, rhodamine dyes, metal complex dyes thereof, and the like.

Among these, azo dyes, xanthene dyes, cyanine dyes, triphenylmethane dyes, anthraquinone dyes, dipyrromethene dyes, squarylium dyes, A dye structure derived from a dye selected from quinophthalone dyes, phthalocyanine dyes, and subphthalocyanine dyes is preferable, and from xanthene dyes, cyanine dyes, triphenylmethane dyes, anthraquinone dyes, dipyrromethene dyes, and phthalocyanine dyes. A dye structure derived from the selected dye is more preferred.

Colorant (F) can be used alone or in combination of two or more.

The content of the coloring agent (F) is preferably 5 to 70% by mass, more preferably 10 to 60% by mass, based on 100% by mass of the non-volatile matter of the photosensitive composition.

(Refinement of pigment)
It is preferable to use the pigment after miniaturization. The method of refining is not particularly limited, and for example, any of wet grinding, dry grinding, and dissolution-precipitation can be used. Among these, the salt milling treatment by the kneader method, which is one type of wet grinding, is preferable. The average primary particle size of the finely divided pigment determined by TEM (transmission electron microscope) is preferably 5 to 90 nm. From the viewpoint of dispersibility and contrast ratio, the average primary particle size is more preferably 10 to 70 nm.

The salt milling process involves milling a mixture of a pigment, a water-soluble inorganic salt, and a water-soluble organic solvent while heating using a kneader such as a kneader, two-roll mill, three-roll mill, ball mill, attritor, and sand mill. This is a treatment in which water-soluble inorganic salts and water-soluble organic solvents are removed by washing with water after kneading to a certain extent. The water-soluble inorganic salt functions as a crushing aid, and the high hardness of the inorganic salt is used to crush the pigment during salt milling. By optimizing the conditions for the salt milling treatment of the pigment, it is possible to obtain a pigment having a very fine primary particle size, a narrow distribution width, and a sharp particle size distribution.

If necessary, a resin may be added to the salt milling treatment. The type of the resin is not particularly limited, and includes natural resins, modified natural resins, synthetic resins, synthetic resins modified with natural resins, and the like. Among these, it is preferable that they are solid at room temperature, insoluble in water, and partially soluble in the above organic solvents. The amount of the resin to be added is preferably 2 to 200 parts by mass with respect to 100 parts by mass of the pigment.

[Dispersion resin (G)]
The photosensitive composition of the present invention can contain a dispersing resin (G).

The dispersing resin (G) is preferably a resin having an adsorptive group that has a high affinity for the near-infrared absorbing dye (A). The adsorptive group preferably has one or more of a basic group and an acidic group.

Basic groups include, for example, groups containing nitrogen atoms such as primary amino groups, secondary amino groups, tertiary amino groups, quaternary ammonium bases, and nitrogen-containing heterocycles.

Examples of acidic groups include carboxyl groups, phosphoric acid groups, and sulfonic acid groups.

Resin species of the dispersing resin (G) include, for example, urethane resins, polycarboxylic acid esters such as polyacrylates, unsaturated polyamides, polycarboxylic acids, polycarboxylic acid (partial) amine salts, polycarboxylic acid ammonium salts, polycarboxylic acid Alkylamine salts, polysiloxanes, long-chain polyaminoamide phosphates, hydroxyl group-containing polycarboxylic acid esters, modified products thereof, amides formed by the reaction of poly(lower alkyleneimine) with polyesters having free carboxyl groups and salts thereof, (meth)acrylic acid-styrene copolymer, (meth)acrylic acid-(meth)acrylic acid ester copolymer, styrene-maleic acid copolymer, polyvinyl alcohol, polyvinylpyrrolidone, etc. soluble resins, water-soluble polymer compounds, polyesters, modified polyacrylates, ethylene oxide/propylene oxide adducts, phosphoric acid esters, and the like.

Examples of the structure of the dispersing resin (G) include random structure, block structure, graft structure, comb structure, and star structure. Among these, a block structure or a comb structure is preferable from the viewpoint of dispersion stability.

Commercial products of the dispersing resin (G) include, for example, Disperbyk-101, 103, 107, 108, 110, 111, 116, 130, 140, 154, 161, 162, 163, 164, 165, manufactured by BYK-Chemie Japan. 166, 167, 168, 170, 171, 174, 180, 181, 182, 183, 184, 185, 190, 2000, 2001, 2009, 2010, 2020, 2025, 2050, 2070, 2095, 2150, 2155, 2163, 2164, or Anti-Terra-U203, 204, or BYK-P104, P104S, 220S, or Lactimon, Lactimon-WS, or Bykumen, SOLSPERSE-3000, 9000, 13000, 13240, 13650, 13940 manufactured by Nippon Lubrizol Co., Ltd. ，１６０００，１７０００，１８０００，２００００，２１０００，２４０００，２６０００，２７０００，２８０００，３１８４５，３２０００，３２５００，３２５５０，３３５００，３２６００，３４７５０，３５１００，３６６００，３８５００，４１０００，４１０９０，５３０９５，５５０００，５６０００，７６５００ Etc., EFKA-46, 47, 48, 452, 4008, 4009, 4010, 4015, 4020, 4047, 4050, 4055, 4060, 4080, 4400, 4401, 4402, 4403, 4406, 4408, 4300 manufactured by BASF Japan Ajinomoto Fine Techno's Ajisuper PA111, PB711, PB821, PB822, PB824, etc., JP 2008-029901, JP 2009-155406, JP 2010-185934, JP 2011-157416, International Publication 2008/007776, JP 2008-029901, JP 2009-155406, JP 2010-185934, JP 2011-157416, JP 2009-251481, JP 2007- 23195, JP-A-1996-143651, and the like.

Dispersing resin (G) can be used alone or in combination of two or more.

From the viewpoint of dispersion stability, the content of the dispersing resin (G) is preferably 3 to 200 parts by mass, more preferably 5 to 100 parts by mass, relative to 100 parts by mass of the near-infrared absorbing dye (A).

[Dye derivative (H)]
The photosensitive composition of the invention can contain a dye derivative (H).

The dye derivative (H) is not particularly limited, and examples thereof include dye derivatives having an acidic group, a basic group, a neutral group, or the like in an organic dye residue. The dye derivative (H) is, for example, a compound having an acidic substituent such as a sulfo group, a carboxyl group, or a phosphoric acid group; and compounds having a neutral substituent such as a phenyl group or a phthalimidoalkyl group.
Organic dyes include, for example, diketopyrrolopyrrole pigments, anthraquinone pigments, quinacridone pigments, dioxazine pigments, perinone pigments, perylene pigments, thiazineindigo pigments, triazine pigments, benzimidazolone pigments, benzoiso Examples include indole pigments such as indole, isoindoline pigments, isoindolinone pigments, quinophthalone pigments, naphthol pigments, threne pigments, metal complex pigments, and azo pigments such as azo, disazo and polyazo.

Specifically, as diketopyrrolopyrrole dye derivatives, JP 2001-220520, WO 2009/081930, WO 2011/052617, WO 2012/102399, JP 2017 -156397, as phthalocyanine dye derivatives, JP 2007-226161, WO 2016/163351, JP 2017-165820, JP 5753266, as anthraquinone dye derivatives, JP-A-63-264674, JP-A-09-272812, JP-A-10-245501, JP-A-10-265697, JP-A-2007-079094, WO 2009/025325, quinacridone system As dye derivatives, JP-A-48-54128, JP-A-03-9961, JP-A-2000-273383, as dioxazine-based dye derivatives, JP-A-2011-162662, thiazine indigo dyes As a derivative, JP-A-2007-314785, as a triazine dye derivative, JP-A-61-246261, JP-A-11-199796, JP-A-2003-165922, JP-A-2003-168208 Publications, JP-A-2004-217842, JP-A-2007-314681, JP-A-2009-57478 as a benzoisoindole dye derivative, JP-A-2003-167112 as a quinophthalone dye derivative, JP-A-2006-291194, JP-A-2008-31281, JP-A-2012-226110, naphthol dye derivatives, JP-A-2012-208329, JP-A-2014-5439, azo dyes Derivatives include JP-A-2001-172520 and JP-A-2012-172092; acidic substituents include JP-A-2004-307854; Examples thereof include known dye derivatives described in JP-A-2003-171594, JP-A-2005-181383, JP-A-2005-213404, and the like. In these documents, the dye derivative may be described as a derivative, a pigment derivative, a dispersant, a pigment dispersant, or simply as a compound. A compound having a substituent such as a neutral group is synonymous with a dye derivative.

The dye derivative (H) can be used alone or in combination of two or more.

The content of the dye derivative (H) is preferably 1 to 20 parts by mass, more preferably 2 to 10 parts by mass, per 100 parts by mass of the near-infrared absorbing dye (A).

[Thermosetting compound (I)]
The photosensitive composition of the present invention can contain thermosetting compound (I). As a result, the thermosetting compound (I) reacts in the heating step, increasing the crosslink density and improving the heat resistance.

Thermosetting compound (I) may be a low-molecular-weight compound or a high-molecular-weight compound such as a resin. Thermosetting compounds (I) include, for example, epoxy compounds, oxetane compounds, benzoguanamine compounds, rosin-modified maleic acid compounds, rosin-modified fumaric acid compounds, melamine compounds, urea compounds, and phenolic compounds. Among these, epoxy compounds and oxetane compounds are preferred.

(Epoxy compound (I1))
Epoxy compounds (I1) include, for example, bisphenols (bisphenol A, bisphenol F, bisphenol S, biphenol, bisphenol AD, etc.), phenols (phenol, alkyl-substituted phenol, aromatic-substituted phenol, naphthol, alkyl-substituted naphthol, dihydroxybenzene , alkyl-substituted dihydroxybenzene, dihydroxynaphthalene, etc.) and various aldehydes (formaldehyde, acetaldehyde, alkylaldehyde, benzaldehyde, alkyl-substituted benzaldehyde, hydroxybenzaldehyde, naphthaldehyde, glutaraldehyde, phthalaldehyde, crotonaldehyde, cinnamaldehyde, etc.) Polymerization of phenols and various diene compounds (dicyclopentadiene, terpenes, vinylcyclohexene, norbornadiene, vinylnorbornene, tetrahydroindene, divinylbenzene, divinylbiphenyl, diisopropenylbiphenyl, butadiene, isoprene, etc.) polycondensates of phenols and ketones (acetone, methyl ethyl ketone, methyl isobutyl ketone, acetophenone, benzophenone, etc.), phenols and aromatic dimethanols (benzenedimethanol, α, α, α', α'- benzenedimethanol, biphenyldimethanol, α,α,α',α'-biphenyldimethanol, etc.), phenols and aromatic dichloromethyls (α,α'-dichloroxylene, bischloromethylbiphenyl etc.), polycondensates of bisphenols and various aldehydes, glycidyl ether-based epoxy resins obtained by glycidylating alcohols, etc., alicyclic epoxy resins, heterocyclic epoxy resins, aliphatic epoxy resins, glycidylamine type epoxy resins, glycidyl ester type epoxy resins, and the like.

Commercially available products include, for example, EPICOAT 807, 815, 825, 827, 828, 190P, 191P manufactured by Yuka Shell Epoxy Co., Ltd., TECHMORE VG3101L manufactured by Mitsui Chemicals, EPPN-201, 501H, 502H manufactured by Nippon Kayaku, EOCN-102S, 103S, 104S, 1020 Epikote 1004, 1256 manufactured by Japan Epoxy Resin Co., Ltd., JER1032H60, 157S65, 157S70, 152, 154, Celoxide 2021 manufactured by Daicel Chemical Industries, EHPE-3150, Denacol manufactured by Nagase ChemteX Corporation EX-211, 212, 252, 313, 314, 321, 411, 421, 512, 521, 611, 612, 614, 614B, 622, 711, 721, Nissan Chemical Industries TEPIC-L, H, S, etc. is mentioned.

The content of the epoxy compound (I1) is preferably 0.5 to 300 parts by mass, preferably 1.0 to 50 parts by mass, with respect to 100 parts by mass of the near-infrared absorbing dye (A) from the viewpoint of heat resistance of the cured film. is more preferred.

(Oxetane compound (I2))
Oxetane compound (I2) is a known compound having an oxetane group. Oxetane compounds include monofunctional oxetane compounds, bifunctional oxetane compounds, and trifunctional or higher oxetane compounds.

Monofunctional oxetane compounds include, for example, (3-ethyloxetan-3-yl)methyl acrylate, (3-ethyloxetan-3-yl)methyl methacrylate, 3-ethyl-3-hydroxymethyloxetane, 3-ethyl-3- (2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(phenoxymethyl)oxetane, 3-ethyl-3-(2-methacryloxymethyl)oxetane, 3-ethyl-3-{[3-(triethoxy silyl)propoxy]methyl}oxetane and the like.

Examples of commercially available products include OXE-10 and 30 manufactured by Osaka Organic Chemical Industry Co., Ltd., OXT-101 and 212 manufactured by Toagosei Co., Ltd., and the like.

Bifunctional oxetane compounds include, for example, 4,4′-bis[(3-ethyl-3-oxetanyl)methoxymethyl]biphenyl), 1,4-bis[(3-ethyl-3-oxetanyl)methoxymethyl]benzene, 1,4-bis{[(3-ethyl-3-oxetanyl)methoxy]methyl}benzene, di[1-ethyl(3-oxetanyl)]methyl ether, di[1-ethyl(3-oxetanyl)]methyl ether 3 -ethyl-3-hydroxymethyloxetane, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(2-phenoxymethyl)oxetane, 3,7-bis(3-oxetanyl)- 5-oxa-nonane, 1,2-bis[(3-ethyl-3-oxetanylmethoxy)methyl]ethane, 1,3-bis[(3-ethyl-3-oxetanylmethoxy)methyl]propane, ethylene glycol-bis (3-ethyl-3-oxetanylmethyl) ether, dicyclopentenyl bis(3-ethyl-3-oxetanylmethyl) ether, triethylene glycol bis(3-ethyl-3-oxetanylmethyl) ether, tetraethylene glycol bis(3 -ethyl-3-oxetanylmethyl)ether, 1,4-bis(3-ethyl-3-oxetanylmethoxy)butane, 1,6-bis(3-ethyl-3-oxetanylmethoxy)hexane, polyethylene glycol bis(3- ethyl-3-oxetanylmethyl) ether, ethylene oxide (EO)-modified bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, propylene oxide (PO)-modified bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, EO-modified hydrogenated bisphenol A bis (3-ethyl-3-oxetanylmethyl) ether, PO-modified hydrogenated bisphenol A bis (3-ethyl-3-oxetanylmethyl) ether, EO-modified bisphenol F (3-ethyl-3-oxetanyl) methyl) ether and the like.

Commercially available products include, for example, OXBP and OXTP manufactured by Ube Industries, and OXT-121 and 221 manufactured by Toagosei.

Trifunctional or higher oxetane compounds include, for example, pentaerythritol tris(3-ethyl-3-oxetanylmethyl) ether, pentaerythritol tetrakis(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol hexa(3-ethyl-3 -oxetanylmethyl) ether, dipentaerythritol pentakis(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol tetrakis(3-ethyl-3-oxetanylmethyl) ether, caprolactone-modified dipentaerythritol hexa(3-ethyl- 3-oxetanylmethyl) ether, caprolactone-modified dipentaerythritol pentakis (3-ethyl-3-oxetanylmethyl) ether, ditrimethylolpropane tetrakis (3-ethyl-3-oxetanylmethyl) ether, resins containing oxetane groups ( For example, oxetane-modified phenolic novolak resins described in Japanese Patent No. 3783462) and polymers obtained by radical polymerization of (meth)acrylic monomers such as the aforementioned OXE-30 can be mentioned.

The content of the oxetane compound (I2) is preferably 0.5 to 50% by mass, more preferably 1 to 40% by mass, based on 100% by mass of non-volatile matter in the photosensitive composition.

A melamine compound is a compound having a melamine ring structure. The melamine compound is preferably a methylol type or ether type compound, more preferably a melamine compound having an average number of methylol groups and/or ether groups per melamine ring of 5.0 or more. If it has an appropriate number of methylol groups and ether groups, it is easy to obtain just the right amount of heat resistance.

Commercially available products include, for example, Nikalac MW-30HM, MW-390, MW-100LM, MX-750LM, MW-30M, MW-30, MW-22, MS-21, MS-11, MW manufactured by Sanwa Chemical Co., Ltd. -24X, MS-001, MX-002, MX-730, MX-750, MX-708, MX-706, MX-042, MX-45, MX-500, MX-520, MX-43, MX-417 , MX-410, Cymel 232, 235, 236, 238, 285, 300, 301, 303, 350, 370 manufactured by Nippon Cytec Industries.

Among these, Nikalac MW-30HM, MW-390, MW-100LM and MX-750LM manufactured by Sanwa Chemical Co., Ltd., having an average number of methylol groups and/or ether groups per melamine ring of 5.0 or more. , MW-30M, MW-30, MW-22, MS-21, MS-11, MW-24X, MX-45, Cymel 232, 235, 236, 238, 300, 301 manufactured by Nippon Cytec Industries Co., Ltd. , 303, 350 and the like are preferable in terms of increasing the crosslink density.

Thermosetting compound (I) can be used alone or in combination of two or more.

[Curing agent (curing accelerator)]
The photosensitive composition of the present invention can be used together with a curing agent (curing accelerator) to assist curing of the thermosetting compound (I). Curing agents include, for example, amine compounds, acid anhydrides, active esters, carboxylic acid compounds, sulfonic acid compounds and the like. Curing agents include, for example, amine compounds (eg, dicyandiamide, benzyldimethylamine, 4-(dimethylamino)-N,N-dimethylbenzylamine, 4-methoxy-N,N-dimethylbenzylamine, 4-methyl-N, N-dimethylbenzylamine, etc.), quaternary ammonium salt compounds (e.g., triethylbenzylammonium chloride, etc.), blocked isocyanate compounds (e.g., dimethylamine, etc.), imidazole derivatives bicyclic amidine compounds and their salts (e.g., imidazole, 2 -methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 4-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-(2-cyanoethyl)-2-ethyl-4 -methylimidazole, etc.), phosphorus compounds (e.g., triphenylphosphine, etc.), S-triazine derivatives (e.g., 2,4-diamino-6-methacryloyloxyethyl-S-triazine, 2-vinyl-2,4-diamino- S-triazine, 2-vinyl-4,6-diamino-S-triazine/isocyanuric acid adduct, 2,4-diamino-6-methacryloyloxyethyl-S-triazine/isocyanuric acid adduct, etc.).

Curing agents can be used alone or in combination of two or more.

The content of the curing agent is preferably 0.01 to 15 parts by mass with respect to 100 parts by mass of the thermosetting compound (I).

[thiol-based chain transfer agent (J)]
The photosensitive composition of the present invention can contain a thiol chain transfer agent (J). When the thiol-based chain transfer agent (J) is used in combination with the photopolymerization initiator (D), thiyl radicals that are less susceptible to polymerization inhibition by oxygen are generated during radical polymerization after light irradiation, and the photosensitivity of the photosensitive composition is improved. do.

The thiol-based chain transfer agent (J) is preferably a polyfunctional thiol having two or more thiol groups (SH groups), more preferably a polyfunctional thiol having four or more. As the number of functional groups increases, photocuring becomes easier from the surface to the deepest part of the film.

Polyfunctional thiols are, for example, hexanedithiol, decanedithiol, 1,4-butanedi-rubisthiopropionate, 1,4-butanedi-rubisthioglycolate, ethylene glycol bisthioglycolate, ethylene glycol bisthiopropionate. , trimethylolpropane tristhioglycolate, trimethylolpropane tristhiopropionate, trimethylolpropane tris(3-mercaptobutyrate), pentaerythritol tetrakisthioglycolate, pentaerythritol tetrakisthiopropionate, trimercaptopropionate acid tris(2-hydroxyethyl)isocyanurate, 1,4-dimethylmercaptobenzene, 2,4,6-trimercapto-s-triazine, 2-(N,N-dibutylamino)-4,6-dimercapto-s -triazine, preferably ethylene glycol bisthiopropionate, trimethylolpropane tristhiopropionate, pentaerythritol tetrakisthiopropionate, and the like.

Thiol-based chain transfer agents (J) can be used alone or in combination of two or more.

The content of the thiol-based chain transfer agent (J) is preferably 1 to 10 parts by mass, more preferably 2 to 8 parts by mass, per 100 parts by mass of the nonvolatile matter of the photosensitive composition. When contained in an appropriate amount, the photosensitivity is improved and wrinkles are less likely to occur on the surface of the cured film.

[Polymerization inhibitor (K)]
The photosensitive composition of the present invention can contain a polymerization inhibitor (K).

The polymerization inhibitor (K) is, for example, catechol, resorcinol, 1,4-hydroquinone, 2-methylcatechol, 3-methylcatechol, 4-methylcatechol, 2-ethylcatechol, 3-ethylcatechol, 4-ethylcatechol , 2-propylcatechol, 3-propylcatechol, 4-propylcatechol, 2-n-butylcatechol, 3-n-butylcatechol, 4-n-butylcatechol, 2-t-butylcatechol, 3-t-butylcatechol , 4-t-butylcatechol, 3,5-di-t-butylcatechol and other alkylcatechol compounds, 2-methylresorcinol, 4-methylresorcinol, 2-ethylresorcinol, 4-ethylresorcinol, 2 alkylresorcinol compounds such as -propylresorcinol, 4-propylresorcinol, 2-n-butylresorcinol, 4-n-butylresorcinol, 2-t-butylresorcinol, and 4-t-butylresorcinol; Alkylhydroquinone compounds such as methylhydroquinone, ethylhydroquinone, propylhydroquinone, t-butylhydroquinone, 2,5-di-t-butylhydroquinone, tributylphosphine, trioctylphosphine, tricyclohexylphosphine, triphenylphosphine, tribenzyl phosphine compounds such as phosphine; phosphine oxide compounds such as trioctylphosphine oxide and triphenylphosphine oxide; phosphite compounds such as triphenylphosphite and trisnonylphenylphosphite;

The content of the polymerization inhibitor (K) is preferably 0.01 to 0.4% by mass based on 100% by mass of non-volatile matter in the photosensitive composition.

[Ultraviolet absorber (L)]
The photosensitive composition of the present invention can contain an ultraviolet absorber (L).

The ultraviolet absorber (L) is an organic compound having an ultraviolet absorption function, and includes benzotriazole-based organic compounds, triazine-based organic compounds, benzophenone-based organic compounds, salicylate-based organic compounds, cyanoacrylate-based organic compounds, and salicylate-based organic compounds. compounds and the like.

Benzotriazole compounds include, for example, 2-(5methyl-2-hydroxyphenyl)benzotriazole, 2-(2-hydroxy-5-t-butylphenyl)-2H-benzotriazole, 2-[2-hydroxy-3 ,5-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole, 2-(3-tbutyl-5-methyl-2-hydroxyphenyl)-5-chlorobenzotriazole, 2-(2′- Hydroxy-5′-t-octylphenyl)benzotriazole, 5% 2-methoxy-1-methylethyl acetate and 95% benzenepropanoic acid, 3-(2H-benzotriazol-2-yl)-(1,1- dimethylethyl)-4-hydroxy, a mixture of C7-9 side chain and linear alkyl esters, 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol, 2-(2H-benzotriazol-2-yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol, methyl 3-(3-(2H -benzotriazol-2-yl)-5-t-butyl-4-hydroxyphenyl)propionate/polyethylene glycol 300 reaction product, 2-(2H-benzotriazol-2-yl)-4-(1,1,3, 3-tetramethylbutyl)phenol, 2,2′-methylenebis[6-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol], 2-(2H- benzotriazol-2-yl)-p-cresol, 2-(5-chloro-2H-benzotriazol-2-yl)-6-t-butyl-4-methylphenol, 2-(3,5-di-t-amyl -2-hydroxyphenyl)benzotriazole, 2-[2-hydroxy-5-[2-(methacryloyloxy)ethyl]phenyl]-2H-benzotriazole, octyl-3-[3-tert-butyl-4-hydroxy- 5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propionate, 2-ethylhexyl-3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl ) phenyl]propionate.

Commercially available products are, for example, TINUVIN P, PS, 234, 326, 329, 384-2, 900, 928, 99-2, 1130 manufactured by BASF Japan, and Adekastab LA-29, LA-31RG, LA manufactured by ADEKA. -32, LA-36, KEMISORB71, 73, 74, 79, 279 manufactured by Chemipro Kasei Co., Ltd., RUVA-93 manufactured by Otsuka Chemical Co., Ltd., and the like.

Triazine compounds include, for example, 2,4-bis(2,4-dimethylphenyl)-6-(2-hydroxy-4-n-octyloxyphenyl)-1,3,5-triazine, 2-[4, 6-bis(2,4-dimethylphenyl)-1,3,5-triazin-2-yl]-5-[3-(dodecyloxy)-2-hydroxypropoxy]phenol, 2-(2,4-dihydroxy Reaction product of phenyl)-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine and (2-ethylhexyl)-glycidate, 2,4-bis'2-hydroxy-4 -butoxyphenyl"-6-(2,4-dibutoxyphenyl)-1,3,5-triazine, 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-( hexyloxy)phenol, 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-[2-(2-ethylhexanoyloxy)ethoxy]phenol, 2,4,6- and tris(2-hydroxy-4-hexyloxy-3-methylphenyl)-1,3,5-triazine.

Commercially available products include, for example, KEMISORB 102 manufactured by Chemipro Kasei Co., Ltd., TINUVIN 400, 405, 460, 477, 479, 1577ED manufactured by BASF Japan, Adekastab LA-46, LA-F70 manufactured by ADEKA, and Sun Chemical Co., Ltd. CYASORB UV-1164 and the like.

Benzophenone compounds include, for example, 2,4-di-hydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 5-sulfonic acid-3, water temperature, 2-hydroxy-4-n-octo xybenzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 4-dodecyloxy-2-hydroxybenzophenone, 2-hydroxy-4-octa decyloxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 2,2',4,4'-tetrahydroxybenzophenone, 2-hydroxy-4-methoxy-2'-carboxybenzophenone and the like. .

Commercially available products include, for example, KEMISORB 10, 11, 11S, 12, 111 manufactured by Chemipro Chemicals, SEESORB 101, 107 manufactured by Shipro Chemicals, Adekastab 1413 manufactured by ADEKA, and UV-12 manufactured by Sun Chemical. be done.

Examples of salicylate compounds include phenyl salicylate, p-octylphenyl salicylate, p-tertbutylphenyl salicylate, and the like.

The content of the ultraviolet absorber (L) is preferably 5 to 70% by weight based on the total 100% by weight of the photopolymerization initiator (D) and the ultraviolet absorber (L).

[Antioxidant (M)]
The photosensitive composition of the invention can contain an antioxidant (M). The antioxidant (M) prevents the photopolymerization initiator (D) and the thermosetting compound (I) in the photosensitive composition from oxidizing and yellowing due to thermal curing and thermal processes during ITO annealing. In particular, when the concentration of the near-infrared absorbing dye (A) of the photosensitive composition is high, the content of the polymerizable compound (C) is relatively decreased, so that the amount of the photopolymerization initiator (D) is increased, and the thermosetting The cured film tends to turn yellow if it is handled by compounding the compound. Therefore, by including an antioxidant, yellowing of the cured film due to oxidation during the heating process is prevented. Antioxidant (M) is preferably a compound containing no halogen atom.

Antioxidants (M) include, for example, hindered phenol-based, hindered amine-based, phosphorus-based, sulfur-based, and hydroxylamine-based compounds. Among these, hindered phenol-based antioxidants, hindered amine-based antioxidants, phosphorus-based antioxidants, and sulfur-based antioxidants are preferred.

Hindered phenol antioxidants include, for example, 1,3,5-tris(3,5-di-t-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H ,3H,5H)-trione, 1,1,3-tris-(2′-methyl-4′-hydroxy-5′-t-butylphenyl)-butane, 4,4′-butylidene-bis-(2- t-butyl-5-methylphenol), 3-(3,5-di-t-butyl-4-hydroxyphenyl)stearylpropionate, pentaerythritol tetrakis [3-(3,5-di-t-butyl-4 -hydroxyphenyl)propionate, 3,9-bis[2-[3-(3-t-butyl-4-hydroxy-5-methylphenyl)propionyloxy]-1,1-dimethylethyl]-2,4,8 , 10-tetraoxaspiro[5.5]undecane, 1,3,5-tris(3,5-di-t-butyl-4-hydroxyphenylmethyl)-2,4,6-trimethylbenzene, 1,3 ,5-tris(3-hydroxy-4-t-butyl-2,6-dimethylbenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,2′ -methylenebis(6-t-butyl-4-ethylphenol), 2,2′-thiodiethylbis-(3,5-di-t-butyl-4-hydroxyphenyl)-propionate, N,N-hexamethylenebis (3,5-di-t-butyl-4-hydroxy-hydrocinnamamide), i-octyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 4,6-bis (dodecylthiomethyl)-o-cresol, calcium salt of 3,5-di-t-butyl-4-hydroxybenzylphosphonic acid monoethyl ester, 4,6-bis(octylthiomethyl)-o-cresol, bis[ 3-(3-methyl-4-hydroxy-5-t-butylphenyl)propionic acid]ethylenebisoxybisethylene, 1,6-hexanediol bis[3-(3,5-di-t-butyl-4- hydroxyphenyl)propionate, 2,4-bis-(n-octylthio)-6-(4-hydroxy-3,5-di-t-butylanilino)-1,3,5-triazine, 2,2'-thio- Bis-(6-t-butyl-4-methylphenol), 2,5-di-t-amyl-hydroquinone, 2,6-di-t-butyl-4-nonylphenol, 2,2′-isobutylidene-bis- (4, 6-dimethyl-phenol), 2,2′-methylene-bis-(6-(1-methyl-cyclohexyl)-p-cresol), 2,4-dimethyl-6-(1-methyl-cyclohexyl)-phenol, etc. is mentioned.

Commercially available products include, for example, ADEKA's Adekastab AO-20, AO-30, AO-40, AO-50, AO-60, AO-80, AO-330, and Chemipro's KEMINOX 101, 179, 76, 9425. , IRGANOX 1010, 1035, 1076, 1098, 1135, 1330, 1726, 1425WL, 1520L, 245, 259, 3114, 5057, 565 manufactured by BASF Japan, Cyanox CY-1790, CY-2777 manufactured by Sun Chemical Co., etc. mentioned.

Hindered amine antioxidants include, for example, tetrakis(1,2,2,6,6-pentamethyl-4-piperidyl)-1,2,3,4-butanetetracarboxylate, tetrakis(2,2,6,6 -tetramethyl-4-piperidyl) 1,2,3,4-butane tetracarboxylate, bis(1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, bis(2,2,6,6 -tetramethyl-4-piperidyl) sebacate, bis(1-undecanoxy-2,2,6,6-tetramethylpiperidin-4-yl) carbonate, 1,2,2,6,6-pentamethyl-4-piperidyl methacrylate , 2,2,6,6-tetramethyl-4-piperidyl methacrylate, polycondensates of dimethyl succinate and 1-(2-hydroxyethyl)-4-hydroxy-2,2,6,6-tetramethylpiperidine , Poly[[6-[(1,1,3,3-tetramethylbutyl)amino]-s-triazine-2,4-diyl]-[(2,2,6,6-tetramethyl-4-piperidyl ) imino]-hexamethylene-[(2,2,6,6-tetramethyl-4-piperidyl)imino]], 4-hydroxy-2,2,6,6-tetramethyl-1-piperidineethanol and 3, Ester of 5,5-trimethylhexanoic acid, N,N'-4,7-tetrakis[4,6-bis{N-butyl-N-(1,2,2,6,6-pentamethyl-4-piperidyl) Amino}-1,3,5-triazin-2-yl]-4,7-diazadecane-1,10-diamine, bis(2,2,6,6-tetramethyl-1-(octyloxy)decanedioate -4-piperidinyl) ester, the reaction product of 1,1-dimethylethyl hydroperoxide and octane, bis(1,2,2,6,6-pentamethyl-4-pyliperidyl)[[3,5-bis(1, 1 dimethylethyl)-4-hydroxyphenyl]methyl]butylmalonate methyl 1,2,2,6,6-pentamethyl-4-pyriperidyl sebacate, poly[[6-morpholino-s-triazine-2,4 -diyl]-[(2,2,6,6-tetramethyl-4-piperidyl)imino]-hexamethylene-[(2,2,6,6-tetramethyl-4-piperidyl)imino]], 2, 2,6,6-tetramethyl-4-piperidyl-C12-21 and C18 unsaturated fatty acid esters, N,N'-bis(2,2,6,6-tetramethyl-4-piperidyl)-1, 6-hexamethylenediamine, 2-methyl-2-(2,2,6,6-tetramethyl-4-piperidyl)amino-N-(2,2,6,6-tetramethyl-4-piperidyl)propionamide etc.

Commercially available products are, for example, ADEKA's ADEKA STAB LA-52, LA-57, LA-63P, LA-68, LA-72, LA-77Y, LA-77G, LA-81, LA-82, LA-87 , LA-402F, LA-502XP, KAMISTAB 29, 62, 77, 94 manufactured by Chemipro Kasei Co., Ltd., Tinuvin 111FDL, 123, 144, 249, 292, 5100 manufactured by BASF Japan, Cyasorb UV-3346, UV manufactured by Sun Chemical Co., Ltd. -3529, UV-3853 and the like.

Phosphorus antioxidants include, for example, di(2,6-di-t-butyl-4-methylphenyl)pentaerythritol diphosphite, distearylpentaerythritol diphosphite, 2,2′-methylenebis(4,6 -di-t-butylphenyl)2-ethylhexylphosphite, tris(2,4-di-t-butylphenyl)phosphite, tris(nonylphenyl)phosphite, tetra(C12-C15alkyl)-4,4' -Isopropylidenediphenyldiphosphite, diphenylmono(2-ethylhexyl)phosphite, diphenylisodecylphosphite, tris(isodecyl)phosphite, triphenylphosphite, tetrakis(2,4-di-t-butylphenyl)- 4,4-biphenyldiphosphonate, tris(tridecyl)phosphite, phenylisooctylphosphite, phenylisodecylphosphite, phenyldi(tridecyl)phosphite, diphenylisooctylphosphite, diphenyltridecylphosphite, 4,4 '-isopropylidenediphenol alkyl phosphite, trisnonylphenyl phosphite, trisdinonylphenyl phosphite, tris(biphenyl) phosphite, di(2,4-di-t-butylphenyl) pentaerythritol diphosphite, di (nonylphenyl) pentaerythritol diphosphite, phenylbisphenol A pentaerythritol diphosphite, tetratridecyl 4,4'-butylidenebis(3-methyl-6-t-butylphenol) diphosphite, hexatridecyl 1,1,3- Tris(2-methyl-4-hydroxy-5-t-butylphenyl)butane triphosphite, 3,5-di-t-butyl-4-hydroxybenzylphosphite diethyl ester, sodium bis(4-t-butylphenyl)phosphite Phyto, sodium-2,2-methylene-bis(4,6-di-t-butylphenyl)-phosphite, 1,3-bis(diphenoxyphosphonyloxy)-benzene, ethyl bis(2,4 -di-t-butyl-6-methylphenyl) and the like.

Commercial products include, for example, Adekastab PEP-36, PEP-8, HP-10, 2112, 1178, 1500, C, 135A, 3010, TPP manufactured by ADEKA, IRGAFOS168 manufactured by BASF Japan, and HostanoxP manufactured by Clariant Chemicals. -EPQ and the like.

Sulfur antioxidants include, for example, 2,2-bis{[3-(dodecylthio)-1-oxopropoxy]methyl}propane-1,3-diylbis[3-(dodecylthio)propionate], 3,3′- ditridecyl thiobispropionate, 2,2-thio-diethylenebis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], 2,4-bis[(octylthio)methyl]-o- cresol, 2,4-bis[(laurylthio)methyl]-o-cresol and the like.

Commercially available products include, for example, ADEKA STAB AO-412S and AO-503 manufactured by ADEKA, and KEMINOXPLS manufactured by Chemipro Kasei.

Antioxidants (M) can be used alone or in combination of two or more.

The content of the antioxidant (M) is preferably 0.5 to 5.0% by mass based on 100% by mass of non-volatile matter in the photosensitive composition. When contained in an appropriate amount, transmittance, spectral characteristics, and sensitivity are improved.

[Leveling agent (N)]
The photosensitive composition of the invention can contain a leveling agent (N). This further improves the wettability and dryability of the substrate during coating. Examples of the leveling agent (N) include silicone surfactants, fluorosurfactants, nonionic surfactants, cationic surfactants, anionic surfactants and amphoteric surfactants.

Examples of silicone-based surfactants include linear polymers composed of siloxane bonds and modified siloxane polymers in which organic groups are introduced into side chains or terminals.

Commercially available products are, for example, BYK-300, 306, 310, 313, 315N, 320, 322, 323, 330, 331, 333, 342, 345, 346, 347, 348, 349, 370, 377 manufactured by BYK Chemie, 378, 3455, UV3510, 3570, FZ-7002, 2110, 2122, 2123, 2191, 5609 manufactured by Dow Corning Toray Co., Ltd., X-22-4952, X-22-4272, X-22 manufactured by Shin-Etsu Chemical Co., Ltd. -6266, KF-351A, KF-354L, KF-355A, KF-945, KF-640, KF-642, KF-643, X-22-4515, KF-6004, KP-341 and the like.

Fluorosurfactants include, for example, surfactants or leveling agents having fluorocarbon chains.

Commercially available products are, for example, Surflon S-242, 243, 420, 611, 651, 386 manufactured by AGC Seimi Chemical Co., Ltd., and Megafac F-253, 477, 551, 552, 555, 558, 560, 570 manufactured by DIC Corporation. , 575, 576, R-40-LM, R-41, RS-72-K, DS-21, Sumitomo 3M FC-4430, 4432, Mitsubishi Materials Electronic Chemicals EF-PP31N09, EF-PP33G1 , EF-PP32C1, and Ftergent 602A manufactured by Neos.

Nonionic surfactants include, for example, polyoxyethylene lauryl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene alkyl ether, polyoxyethylene myrister ether, polyoxyethylene octyl Dodecyl ether, polyoxyalkylene alkyl ether, polyoxyphenylene distyrenated phenyl ether, polyoxyethylene tribenzylphenyl ether, polyoxyethylene polyoxypropylene glycol, polyoxyalkylene alkenyl ether, polyoxyethylene nonylphenyl ether, polyoxyethylene Alkyl ether phosphate, sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan distearate, sorbitan tristearate, sorbitan monooleate, sorbitan trioleate, sorbitan sesquioleate, polyoxyethylene sorbitan mono Laurate, polyoxyethylene sorbitan monopalmitate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan tristearate, polyoxyethylene sorbitan monooleate, polyoxyethylene sorbitan triisostearate, polyoxytetraoleic acid Ethylene sorbitol, glycerol monostearate, glycerol monooleate, polyethylene glycol monolaurate, polyethylene glycol monostearate, polyethylene glycol distearate, polyethylene glycol monooleate, polyoxyethylene hydrogenated castor oil, polyoxyethylene alkylamine, alkyl alkanolamides, alkylimidazolines, and the like.

Commercially available products are, for example, Kao Emulgen 103, 104P, 106, 108, 109P, 120, 123P, 130K, 147, 150, 210P, 220, 306P, 320P, 350, 404, 408, 409PV, 420, 430 , 705, 707, 709, 1108, 1118S-70, 1135S-70, 1150S-60, 2020G-HA, 2025G, LS-106, LS-110, LS-114, MS-110, A-60, A-90 , B-66, PP-290, Latemul PD-420, PD-430, PD-430S, PD-450, Rhodol SP-L10, SP-P10, SP-S10V, SP-S20, SP-S30V, SP-O10V , SP-O30V, Super SP-L10, AS-10V, AO-10V, AO-15V, TW-L120, TW-L106, TW-P120, TW-S120V, TW-S320V, TW-O120V, TW-O106V, TW-IS399C, Super TW-L120, 430V, 440V, 460V, MS-50, MS-60, MO-60, MS-165V, Emanon 1112, 3199V, 3299V, 3299RV, 4110, CH-25, CH-40, CH-60 (K), Amit 102, 105, 105A, 302, 320, Aminone PK-02S, L-02, Homogenol L-95, Adeka Pluronic (registered trademark) L-23, 31 manufactured by ADEKA, 44, 61, 62, 64, 71, 72, 101, 121, TR-701, 702, 704, 913R, Kyoeisha Chemical Co., Ltd. (meth)acrylic acid-based (co)polymer Polyflow-No. 75, No. 90, No. 95 and the like.

Examples of cationic surfactants include alkylamine salts, alkyl quaternary ammonium salts such as lauryltrimethylammonium chloride, stearyltrimethylammonium chloride and cetyltrimethylammonium chloride, and their ethylene oxide adducts.

Commercially available products include, for example, Acetamine 24, Kotamine 24P, 60W, 86P conch manufactured by Kao Corporation.

Anionic surfactants include, for example, polyoxyethylene alkyl ether sulfates, sodium dodecylbenzenesulfonate, alkali salts of styrene-acrylic acid copolymers, sodium alkylnaphthalenesulfonates, sodium alkyldiphenylether disulfonates, and monoethanol lauryl sulfate. amine, triethanolamine lauryl sulfate, ammonium lauryl sulfate, monoethanolamine stearate, sodium stearate, sodium lauryl sulfate, monoethanolamine of styrene-acrylic acid copolymer, polyoxyethylene alkyl ether phosphate, and the like.

Commercially available products include, for example, Futergent 100 and 150 manufactured by Neos, Adeka Hope YES-25, Adekacol TS-230E, PS-440E and EC-8600 manufactured by ADEKA.

Amphoteric surfactants include, for example, lauramidopropyl betaine, lauryl betaine, cocamidopropyl betaine, stearyl betaine, alkylbetaines such as alkyldimethylaminoacetic acid betaine, and alkylamine oxides such as lauryldimethylamine oxide.

Commercially available products include Amphithol 20AB, 20BS, 24B, 55AB, 86B, 20Y-B, 20N manufactured by Kao Corporation.

A leveling agent (N) can be used individually or in combination of 2 or more types.

The content of the leveling agent (N) is preferably 0.001 to 2.0% by mass, more preferably 0.005 to 1.0% by mass, based on 100% by mass of non-volatile matter in the photosensitive composition. When it is contained in an appropriate amount, the balance between coatability and adhesion of the photosensitive composition is further improved.

[Storage stabilizer (O)]
The photosensitive composition of the present invention can contain a storage stabilizer (O). This stabilizes the viscosity of the photosensitive composition over time. Storage stabilizers (O) include, for example, benzyltrimethyl chloride, quaternary ammonium chloride such as diethylhydroxyamine, organic acids such as lactic acid and oxalic acid and their methyl ethers, t-butylpyrocatechol, tetraethylphosphine, tetraphenyl and the like. organic phosphines, phosphites, and the like.

The content of the storage stabilizer (O) is preferably 0.1 to 10 parts by mass with respect to 100 parts by mass of the near-infrared absorbing dye (A).

[Adhesion improver (P)]
The photosensitive composition of the present invention can contain an adhesion improver (P). This improves the adhesion between the cured film and the substrate. In addition, it becomes easier to form a narrow pattern by photolithography.

Examples of the adhesion improver (P) include silane coupling agents and the like. Examples of silane coupling agents include vinylsilanes such as vinyltrimethoxysilane and vinyltriethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, (Meth)acrylsilanes such as 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane , 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane and other epoxysilanes, N-2-(aminoethyl)-3-aminopropyl methyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3- dimethyl-butylidene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane, aminosilanes such as hydrochloride of N-(vinylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane, 3-mercaptopropyl mercaptos such as methyldimethoxysilane and 3-mercaptopropyltrimethoxysilane; styryls such as p-styryltrimethoxysilane; ureides such as 3-ureidopropyltriethoxysilane; Examples include silane coupling agents such as sulfides and isocyanates such as 3-isocyanatopropyltriethoxysilane.

The adhesion improver (P) can be used alone or in combination of two or more.

The content of the adhesion improver (P) is preferably 0.01 to 10 parts by mass, more preferably 0.05 to 5 parts by mass, per 100 parts by mass of the near-infrared absorbing dye (A).

[Organic solvent (Q)]
The photosensitive composition of the invention can contain an organic solvent (Q).

Organic solvent (Q) is, for example, 1,2,3-trichloropropane, 1-methoxy-2-propanol, ethyl lactate, 1,3-butanediol, 1,3-butylene glycol, 1,3-butylene glycol Diacetate, 1,4-dioxane, 2-heptanone, 2-methyl-1,3-propanediol, 3,5,5-trimethyl-2-cyclohexen-1-one, 3,3,5-trimethylcyclohexanone , ethyl 3-ethoxypropionate, 3-methyl-1,3-butanediol, 3-methoxy-3-methyl-1-butanol, 3-methoxy-3-methylbutyl acetate, 3-methoxybutanol, 3-methoxy Butyl acetate, 4-heptanone, m-xylene, m-diethylbenzene, m-dichlorobenzene, N,N-dimethylacetamide, N,N-dimethylformamide, n-butyl alcohol, n-butylbenzene, n-propyl acetate, N -methylpyrrolidone, o-xylene, o-chlorotoluene, o-diethylbenzene, o-dichlorobenzene, p-chlorotoluene, p-diethylbenzene, sec-butylbenzene, tert-butylbenzene, γ-butyrolactone, isobutyl alcohol, isophorone, ethylene glycol diethyl ether, ethylene glycol dibutyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monoethyl ether, ethylene glycol monoethyl ether acetate, ethylene glycol monotertiary butyl ether, ethylene glycol monobutyl ether, ethylene glycol monobutyl ether acetate, ethylene Glycol monopropyl ether, ethylene glycol monohexyl ether, ethylene glycol monomethyl ether, ethylene glycol monomethyl ether acetate, diisobutyl ketone, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol monoisopropyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether Acetate, diethylene glycol monomethyl ether, cyclohexanol, cyclohexanol acetate, cyclohexanone, dipropylene glycol dimethyl ether, dipropylene glycol methyl ether acetate dipropylene glycol monoethyl ether, dipropylene glycol monobutyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monomethyl ether, diacetone alcohol, triacetin, tripropylene glycol monobutyl ether, tripropylene glycol monomethyl ether, propylene glycol diacetate , propylene glycol phenyl ether, propylene glycol monoethyl ether, propylene glycol monoethyl ether acetate, propylene glycol monobutyl ether, propylene glycol monopropyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether propionate, benzyl alcohol, methyl isobutyl ketone, methyl cyclohexanol, n-amyl acetate, n-butyl acetate, isoamyl acetate, isobutyl acetate, propyl acetate, dibasic acid ester and the like. Among these, ethyl lactate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate and the like are preferred from the viewpoint of pigment dispersibility and alkali-soluble resin solubility. Alcohols such as glycol acetates, benzyl alcohol and diacetone alcohol, and ketones such as cyclohexanone are preferred.

The organic solvent (Q) can be used alone or in combination of two or more.

[Method for producing photosensitive composition]
The photosensitive composition of the present invention is prepared into a dispersion by, for example, adding a near-infrared absorbing dye (A), a dispersing resin (G), an organic solvent (Q), and the like and performing a dispersion treatment. After that, the dispersion can be produced by blending and mixing the alkali-soluble resin (B), the polymerizable compound (C), the photopolymerization initiator (D), and the like. The timing of blending each material is arbitrary. Moreover, a dispersion|distribution process can also be performed in multiple times.

A dispersing machine for performing dispersion treatment includes, for example, a two-roll mill, a three-roll mill, a ball mill, a horizontal sand mill, a vertical sand mill, an annular bead mill, or an attritor.

The average dispersed particle size (secondary particle size) of the near-infrared absorbing dye (A) in the dispersion is preferably 30 to 200 nm, more preferably 40 to 200 nm. A suitable particle size facilitates obtaining a photosensitive composition with high dispersion stability.

The method for measuring the average dispersed particle size (secondary particle size) is, for example, using a Microtrac UPA-EX150 manufactured by Nikkiso Co., Ltd., which employs the dynamic light scattering method (FFT power spectrum method), and the particle permeability is measured by the absorption mode. The particle shape is assumed to be non-spherical, and the D50 particle diameter is defined as the average diameter. It is preferable to use the organic solvent used for dispersion as the diluent solvent for the measurement, and to measure the ultrasonically treated sample immediately after the sample preparation, because it is easy to obtain results with little variation.

The photosensitive composition is separated by means of centrifugation, filtration with a sintered filter, membrane filter, or the like to remove coarse particles of 5 μm or more, preferably 1 μm or more, more preferably 0.5 μm or more, and contaminants. It is preferable to remove the dust that has accumulated. The photosensitive composition of the present invention preferably contains substantially no particles of 0.5 μm or more, more preferably no particles of 0.3 μm or less.

<Cured film>
The cured film of the present invention can be obtained by curing the film formed using the photosensitive composition of the present invention by treatment such as exposure.

[Method for producing cured film]
The method for producing the cured film is not particularly limited. For example, the step (1) of applying a photosensitive composition on a substrate to form a layer of the composition, and the step of patternwise exposing the layer through a mask. (2), the step (3) of forming a patterned cured film by developing the unexposed portion with alkali, and the step (4) of heat-treating (post-baking) the pattern.

The method for producing a cured film will be described in detail below.
(Step (1))
In the step (1) of forming a layer of the composition, the photosensitive composition is applied onto the substrate by a method such as spin coating, roll coating, slit coating, casting coating, or inkjet coating, and if necessary It is dried (pre-baked) at a temperature of 50 to 120° C. for 10 to 120 seconds using an oven, a hot plate, or the like.
Examples of the substrate include a glass substrate and a silicon substrate. The silicon substrate may have, for example, an imaging element such as a CCD or CMOS formed on its surface. In addition, if necessary, an undercoat layer may be provided on the substrate for improving adhesion with the upper layer, preventing diffusion of substances, and flattening the surface of the substrate.
The thickness of the layer after drying is preferably 0.05 to 10.0 μm, more preferably 0.3 to 5 μm.

(Step (2))
In the exposure step, the layer obtained in step (1) is exposed to a specific pattern through a mask using an exposure device such as a stepper. A cured film is thus obtained.
Radiation used for exposure includes, for example, ultraviolet rays such as g-line, h-line and i-line. Light with a wavelength of 300 nm or less can also be used. Light with a wavelength of 300 nm or less includes KrF rays (wavelength: 248 nm), ArF rays (wavelength: 193 nm), and the like.
Further, the exposure may be performed by continuously irradiating the light, or by repeating the irradiation and resting of the light in a cycle of a short time (for example, millisecond level or less) (pulse exposure). .

(Step (3))
The cured film obtained in step (2) is subjected to alkali development treatment, whereby the layer of the composition in the unexposed portions is eluted into the alkaline developer, leaving only the cured portions to obtain a patterned cured film.
Alkaline developers include, for example, sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, aqueous ammonia, ethylamine, diethylamine, dimethylethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, choline , pyrrole, piperidine, and 1,8-diazabicyclo-[5.4.0]-7-undecene.
The concentration of the alkaline developer is preferably 0.001 to 10% by mass, more preferably 0.01 to 1% by mass.
The pH of the alkaline developer is preferably 11-13, more preferably 11.5-12.5. When used at an appropriate pH, pattern roughness and peeling can be suppressed, and the residual film rate after development can be improved.

The developing method includes, for example, a dip method, a spray method, a paddle method, and the like. The developing temperature is preferably 15 to 40°C. In addition, it is preferable to wash with pure water after alkali development.

(Step (4))
In the heat treatment (post-baking), the patterned cured film obtained in step (3) is sufficiently cured by heating. The heating temperature for post-baking is preferably 80 to 300.degree. The heating time is preferably about 2 minutes to 1 hour, more preferably about 3 minutes to 30 minutes. The temperature is preferably 150° C. or lower, more preferably 130° C. or lower, when a material having low heat resistance is used for the substrate, or when an organic electroluminescence element is used as the light emission source.

<Optical filter>
The optical filter of the present invention contains a cured film. Among others, it can be preferably used as an infrared cut filter. It can also be used as an infrared transmission filter. The optical filter of the present invention can be manufactured by the same method as the cured film described above.

<Image display device>
The image display device of the present invention contains a cured film. The form used for the image display device is not particularly limited, but it can be used as a color filter or a black matrix.
The black matrix is a solid-state imaging device, a black edge provided at the periphery of an image display device such as a liquid crystal display device, a grid-shaped and / or striped black portion between red, blue, and green pixels, Dot and/or linear black patterns for TFT light shielding may be used.

An example of the image display device of the present invention will be described.
An image display device comprises the cured film of the present invention and a light source. As a light source, a cold cathode fluorescent lamp (CCFL) and a white LED can be used. In the present invention, it is preferable to use a white LED in terms of widening the reproduction range of red. FIG. 1 is a schematic cross-sectional view showing a configuration example of an image display device provided with the cured film of the present invention. The image display device 10 shown in FIG. 1 includes a pair of transparent substrates 11 and 21 arranged facing each other with a gap between them, and a liquid crystal LC is enclosed between them.

A TFT (thin film transistor) array 12 is formed on the inner surface of the first transparent substrate 11, and a transparent electrode layer 13 made of ITO, for example, is formed thereon. An alignment layer 14 is provided on the transparent electrode layer 13 . A polarizing plate 15 is formed on the outer surface of the transparent substrate 11 .

On the other hand, a color filter 22 is formed on the inner surface of the second transparent substrate 21 . The red, green and blue filter segments that make up color filter 22 are separated by a black matrix (not shown).

A transparent protective film (not shown) is formed as necessary to cover the color filters 22, and a transparent electrode layer 23 made of, for example, ITO is formed thereon. is provided.

A polarizing plate 25 is formed on the outer surface of the transparent substrate 21 . A backlight unit 30 is provided below the polarizing plate 15 .

The liquid crystal LC is aligned according to drive modes such as TN (Twisted Nematic), STN (Super Twisted Nematic), IPS (In-Plane Switching), VA (Vertical Alignment), and OCB (Optically Compensated Birefringence). A TFT (thin film transistor) array 12 is formed on the inner surface of the first transparent substrate 11, and a transparent electrode layer 13 made of ITO, for example, is formed thereon. An alignment layer 14 is provided on the transparent electrode layer 13 . A polarizing plate 15 is formed on the outer surface of the transparent substrate 11 .

White LED light sources include those in which a fluorescent filter is formed on the surface of a blue LED and those in which a phosphor is contained in a resin package of a blue LED. λ3), has a wavelength (λ4) at which the emission intensity is maximum within the range of 530 nm to 580 nm, has a wavelength (λ5) at which the emission intensity is maximum within the range of 600 nm to 650 nm, and has a wavelength The ratio (I4/I3) of the emission intensity I3 at λ3 to the emission intensity I4 at wavelength λ4 is 0.2 or more and 0.4 or less, and the ratio of the emission intensity I3 at wavelength λ3 to the emission intensity I5 at wavelength λ5 (I5/I3 ) has a spectral characteristic of 0.1 to 1.3, and a wavelength (λ1) at which the emission intensity is maximized in the range of 430 nm to 485 nm, and the range of 530 nm to 580 nm has a second emission intensity peak wavelength (λ2) within, and the ratio (I2/I1) of the emission intensity I1 at the wavelength λ1 to the emission intensity I2 at the wavelength λ2 is 0.2 or more and 0.7 or less A white LED light source (LED2) with a is preferred.

Specific examples of the LED 1 include NSSW306D-HG-V1 (manufactured by Nichia Corporation), NSSW304D-HG-V1 (manufactured by Nichia Corporation), and the like.

Specific examples of the LED 2 include NSSW440 (manufactured by Nichia Corporation) and NSSW304D (manufactured by Nichia Corporation).

<Solid-state image sensor>
The solid-state imaging device of the present invention has a cured film. The form used for the solid-state imaging device is not particularly limited. A mode having a light-receiving element made of a diode and polysilicon or the like and having the cured film of the present invention on the light-receiving element formation surface side or the opposite side of the formation surface can be exemplified. FIG. 2 is a schematic cross-sectional view showing a configuration example of a solid-state imaging device provided with the cured film of the present invention.

As shown in FIG. 2, the solid-state imaging device 200 includes a rectangular solid-state imaging device 201 and a transparent cover glass 203 that is held above the solid-state imaging device 201 and seals the solid-state imaging device 201. there is Furthermore, a lens layer 211 is provided over the cover glass 203 via a spacer 204 . The lens layer 211 is composed of a support 213 and a lens material 212 . When stray light enters the peripheral region of the lens layer 211 , light diffusion weakens the light condensing effect of the lens material 212 , reducing the amount of light that reaches the imaging unit 202 . Also, noise is generated due to stray light. Therefore, the peripheral region of the lens layer 211 is provided with the cured film 214 of the present invention to shield light.

The solid-state imaging device 201 photoelectrically converts an optical image formed by an imaging unit 202 serving as a light-receiving surface thereof, and outputs it as an image signal. This solid-state imaging device 201 has a laminated substrate 205 in which two substrates are laminated. The laminated substrate 205 is composed of a rectangular chip substrate 206 and a circuit substrate 207 of the same size.

An imaging unit 202 is provided in the central portion of the surface of the chip substrate 206 . In addition, when stray light is incident on the peripheral region of the imaging unit 202, dark current (noise) is generated from circuits in this peripheral region. It is

A plurality of electrode pads 208 are provided on the surface edge of the chip substrate 206 . The electrode pads 208 are electrically connected to the imaging section 202 via signal lines (not shown) provided on the surface of the chip substrate 206 .

External connection terminals 209 are provided on the rear surface of the circuit board 207 at positions substantially below the respective electrode pads 208 . Each external connection terminal 209 is connected to an electrode pad 208 via a through electrode 210 vertically penetrating through the laminated substrate 205 . In addition, each external connection terminal 209 is connected to a control circuit for controlling driving of the solid-state imaging device 201 and an image processing circuit for performing image processing on an imaging signal output from the solid-state imaging device 201 via wiring (not shown). It is connected.

<Infrared sensor>
The infrared sensor of the present invention contains a cured film. FIG. 3 is a schematic cross-sectional view showing a configuration example of an infrared sensor provided with the cured film of the present invention. The infrared sensor 300 shown in FIG.

An imaging area provided on the solid-state imaging device 310 is configured by combining an infrared cut filter 311 and a color filter 312 .
The infrared cut filter 311 transmits light in the visible light region (e.g., light with a wavelength of 400 to 700 nm) and blocks light in the infrared region (e.g., light with a wavelength of 800 to 1,300 nm). Membranes can be used.
The color filter 312 is a color filter formed with pixels that transmit and absorb light of specific wavelengths in the visible light region. For example, pixels of red (R), green (G), and blue (B) are formed. A color filter or the like is used.

Between the infrared transmission filter 313 and the solid-state imaging device 310, a resin film 314 is arranged that allows transmission of the light of the wavelength that has passed through the infrared transmission filter 313. As shown in FIG.
The infrared transmission filter 313 is a filter that has visible light shielding properties and transmits infrared rays of a specific wavelength, and the cured film of the present invention can be used. The infrared transmission filter 313 preferably blocks light with a wavelength of 400 to 830 nm and transmits light with a wavelength of 900 to 1,300 nm, for example.

A microlens 315 is arranged on the incident light side of the color filter 312 and the infrared transmission filter 313 . A planarization film 316 is formed to cover the microlenses 315 .

Although the resin film 314 is arranged in the form shown in FIG.

The cured film of the present invention can be used as a light shielding film such as the edge and / or side of the surface of the infrared cut filter 311, and if it is used for the inner wall of the infrared sensor device, it can be used for internal reflection and / or meaningless light to the light receiving part. can be prevented from entering, and the sensitivity can be improved.

According to this infrared sensor, since image information can be captured at the same time, it is possible to perform motion sensing, etc., by recognizing an object whose motion is to be detected. In addition, since distance information can be obtained with this infrared sensor, it is possible to take an image including 3D information. Furthermore, this infrared sensor can also be used as a biometric sensor.

Moreover, the cured film of the present invention can also be used as a colored spacer. For example, when spacers are used in a TFT-type LCD, light incident on the TFT may cause the TFT to malfunction as a switching element, and the colored spacer is used to prevent this. The colored spacers can be formed in the same manner as the black matrix described above, except that a mask for colored spacers is used.

The cured film of the present invention can also be used for applications such as micro LEDs (Light Emitting Diodes) and micro OLEDs (Organic Light Emitting Diodes). Although not particularly limited, it is used for optical filters and optical films used in micro LEDs and micro OLEDs, as well as members that impart light shielding and antireflection properties.
Micro LEDs and micro OLEDs are described, for example, in Japanese Patent Publication No. 2015-500562 and Japanese Patent Publication No. 2014-533890.

Moreover, the cured film of the present invention can also be used for applications such as quantum dot displays. Although not particularly limited, it is used for optical filters and optical films used in quantum dot displays, as well as members imparting light shielding properties and antireflection properties.

EXAMPLES Hereinafter, the present invention will be described in more detail with reference to Examples. However, the present invention is not limited to these. In addition, "part" is "mass part" and "%" is "mass%".
In addition, in the present invention, non-volatile matter or non-volatile matter concentration refers to the mass residue after standing in an oven at 280° C. for 30 minutes.

Prior to Examples, each measuring method will be described.

The weight average molecular weight (Mw), number average molecular weight (Mn), acid value (mgKOH/g), hydroxyl value (mgKOH/g), amine value (mgKOH/g), and glass transition temperature (Tg) of the resin are measured. , as follows.

(Average molecular weight of resin)
The number average molecular weight (Mn) and weight average molecular weight (Mw) of the resin were measured by gel permeation chromatography (GPC) equipped with an RI detector. HLC-8220GPC (manufactured by Tosoh Corporation) was used as the apparatus, two separation columns were connected in series, and "TSK-GEL SUPER HZM-N" was used as both packing materials, and the oven temperature was 40 ° C. , using a tetrahydrofuran (THF) solution as an eluent and measuring at a flow rate of 0.35 ml/min. Samples were dissolved in a solvent consisting of 1 wt % of the above eluent and injected at 20 microliters. A molecular weight is a polystyrene conversion value.

(Acid value of resin)
Add 80 ml of acetone and 10 ml of water to 0.5 to 1 g of the resin solution and stir to dissolve uniformly. (manufactured) to measure the acid value (mgKOH/g). Then, the acid value per nonvolatile content of the resin was calculated from the acid value of the resin solution and the concentration of the nonvolatile content of the resin solution.

(Resin hydroxyl value)
This solution in which the resin was dissolved in the acetylating reagent and the blank acetylating reagent were refluxed for 30 minutes. The condenser was rinsed with water and the rinse added to the reaction. The resulting solution was neutralized and titrated with 0.1 mol/L sodium hydroxide solution at 25° C. using a potentiometric titrator (trade name: AT-510, manufactured by Kyoto Electronics Industry Co., Ltd.). Using the inflection point of the titration pH curve as the titration end point, the hydroxyl value per non-volatile content of the resin was calculated by the following formula.
Hydroxyl value (mgKOH/g) = 56.11 x (V1-V2) x 0.1 x f/w
V1: Amount (mL) of 0.1 mol/L sodium hydroxide aqueous solution required for titration in blank test
V2: Amount (mL) of 0.1 mol/L sodium hydroxide aqueous solution required for titration
f: titer of 0.1 mol/L sodium hydroxide aqueous solution w: mass of resin (g) (converted to non-volatile content)

(Amine value of resin)
The amine value of the resin is a value obtained by converting the total amine value (mgKOH/g) measured according to the method of ASTM D 2074 into non-volatile matter.

(Glass-transition temperature)
The glass transition temperature (° C.) of the resin was measured by weighing 5 mg of a sample in a sample pan using a differential scanning calorimeter, and measuring the temperature from −20 to 200° C. at a heating rate of 10° C./min under a nitrogen stream.

<Production of near-infrared absorbing dye (A)>
(Near-infrared absorbing dye (A-1))
40.0 parts of 1,8-diaminonaphthalene, 32.2 parts of 3,5-dimethylcyclohexanone, and 0.087 parts of p-toluenesulfonic acid monohydrate are mixed with 400 parts of toluene and mixed in a nitrogen gas atmosphere. The mixture was heated with stirring and refluxed for 3 hours. Water generated during the reaction was removed from the reaction system by azeotropic distillation. After completion of the reaction, a dark brown solid obtained by distilling toluene was extracted with acetone and purified by recrystallization from a mixed solvent of acetone and ethanol. The resulting brown solid was dissolved in a mixed solvent of 240 parts of toluene and 160 parts of n-butanol, 13.8 parts of 3,4-dihydroxy-3-cyclobutene-1,2-dione was added, and the mixture was stirred in a nitrogen gas atmosphere. The mixture was heated and stirred in the medium, and the reaction was carried out under reflux for 8 hours. Water generated during the reaction was removed from the reaction system by azeotropic distillation.
After completion of the reaction, the solvent was distilled off, and 200 parts of hexane was added while stirring the resulting reaction mixture. After filtering off the resulting black-brown precipitate, it was washed with hexane, ethanol and acetone successively and dried under reduced pressure to obtain a near-infrared absorbing dye (A-1) represented by the following chemical formula (19). rice field.
50 parts of the near-infrared absorbing dye (A-1) thus obtained, 500 parts of sodium chloride and 60 parts of diethylene glycol were placed in a stainless steel gallon kneader (manufactured by Inoue Seisakusho) and kneaded at 60° C. for 12 hours. Next, the kneaded mixture is poured into hot water, stirred for 1 hour while heating to about 80°C to form a slurry, filtered and washed with water to remove sodium chloride and diethylene glycol, dried at 80°C for a day and night, and pulverized. Thus, a fine near-infrared absorbing dye (A-1) was obtained.

chemical formula (19)

(Near-infrared absorbing dye (A-2))
40.0 parts of 1,8-diaminonaphthalene, 50.1 parts of 2-hydroxy-9-fluorenone, and 0.087 parts of p-toluenesulfonic acid monohydrate are mixed with 400 parts of toluene and mixed in a nitrogen gas atmosphere. The mixture was heated and stirred at , and refluxed for 3 hours. Water generated during the reaction was removed from the system by azeotropic distillation. After completion of the reaction, a dark brown solid obtained by distilling toluene was extracted with acetone and purified by recrystallization from a mixed solvent of acetone and ethanol. The resulting brown solid was dissolved in a mixed solvent of 240 parts of toluene and 160 parts of n-butanol, 13.8 parts of 3,4-dihydroxy-3-cyclobutene-1,2-dione was added, and the mixture was stirred in a nitrogen gas atmosphere. The mixture was heated and stirred in the medium, and the reaction was carried out under reflux for 8 hours. Water generated during the reaction was removed from the system by azeotropic distillation. After completion of the reaction, the solvent was distilled off, and 200 parts of hexane was added while stirring the resulting reaction mixture. After filtering the resulting black-brown precipitate, it is washed with hexane, ethanol and acetone in sequence and dried under reduced pressure to obtain a near-infrared absorbing dye (A-2) represented by the following chemical formula (20). rice field.
A micronized near-infrared absorbing dye (A-2) was obtained in the same manner as the near-infrared absorbing dye (A-1).

chemical formula (20)

(Near-infrared absorbing dye (A-3))
In a reaction vessel, 178 parts of 2,3-dicyanonaphthalene, 890 parts of n-amyl alcohol, 137 parts of DBU (1,8-Diazabicyclo [5.4.0] undec-7-ene) and 40 parts of aluminum chloride anhydride were mixed and stirred, and after the temperature was raised, the mixture was refluxed at 136° C. for 5 hours. The reaction solution cooled to 30° C. while being stirred was poured into a mixed solvent consisting of 5,000 parts of methanol and 10,000 parts of water with stirring to obtain a blue slurry. This slurry was filtered, washed with a mixed solvent of 2,000 parts of methanol and 4,000 parts of water, and dried to obtain compound a.
Next, 10 parts of compound a was added to 100 parts of concentrated sulfuric acid in a reaction vessel under an ice bath, and the mixture was stirred for 1 hour. Subsequently, this sulfuric acid solution is poured into 1,000 parts of cold water at 3°C, and the precipitate formed is filtered, washed with water, washed with an aqueous 2.5% sodium hydroxide solution, washed with water in that order, and dried to obtain a compound. obtained b.
5 parts of diphenylphosphoric acid was added to 200 parts of N-methylpyrrolidone, and the mixture was sufficiently stirred and mixed, and then heated to 50°C. After adding 10 parts of compound b little by little to this solution, the mixture was stirred at 90° C. for 120 minutes. For confirmation of the end point of the reaction, for example, the reaction liquid was dropped onto a filter paper, and the end point was set at the point where the bleeding disappeared. Subsequently, this reaction solution is poured into 2,000 parts of ion-exchanged water, and the resulting precipitate is filtered, washed with water, and dried to obtain a near-infrared absorbing dye represented by the following chemical formula (21). (A-3) was obtained.
A micronized near-infrared absorbing dye (A-3) was obtained in the same manner as the near-infrared absorbing dye (A-1).

chemical formula (21)

(Near-infrared absorbing dye (A-4))
A near-infrared absorbing dye (A-4) represented by the following chemical formula (22) was obtained according to the description of International Publication No. 2019/058882.
A fine near-infrared absorbing dye (A-4) was obtained in the same manner as the near-infrared absorbing dye (A-1).

chemical formula (22)

(Near-infrared absorbing dye (A-5))
In a reaction vessel, 26 parts of phthalonitrile, 143 parts of 2,3-dicyanonaphthalene, 890 parts of n-amyl alcohol, 137 parts of DBU (1,8-Diazabicyclo[5.4.0]undec-7-ene) and three 34 parts of aluminum chloride was mixed and stirred, and after the temperature was raised, the mixture was refluxed at 136° C. for 5 hours. The reaction solution cooled to 30° C. while stirring was poured into a mixed solvent consisting of 5,000 parts of methanol and 10,000 parts of ion-exchanged water while stirring to obtain a blue slurry. This slurry was filtered, washed with a mixed solvent of 2,000 parts of methanol and 4,000 parts of ion-exchanged water, and dried to obtain compound c.
Next, 140 parts of compound c was added to 1,500 parts of concentrated sulfuric acid in a reaction vessel under an ice bath, and the mixture was stirred for 1 hour. Subsequently, this sulfuric acid solution is poured into 1,000 parts of cold water at 3°C, and the formed precipitate is filtered, washed with water, washed with a 2.5% sodium hydroxide aqueous solution, washed with water in this order, dried, and dried. Compound d was obtained.
5 parts of diphenylphosphoric acid was added to 200 parts of N-methylpyrrolidone, and the mixture was sufficiently stirred and mixed, and then heated to 50°C. After adding 10 parts of compound d little by little to this solution, the mixture was stirred at 90° C. for 120 minutes. For confirmation of the end point of the reaction, for example, the reaction liquid was dropped onto a filter paper, and the end point was set at the point where the bleeding disappeared. Subsequently, this reaction solution is poured into 2,000 parts of ion-exchanged water, and the resulting precipitate is filtered, washed with water, and dried to obtain a mixture of compounds represented by the following chemical formula (23) ( A near-infrared absorbing dye (A-5) having a mass ratio of n1:n2:n3:n4=7:19:59:15 was obtained.
A fine near-infrared absorbing dye (A-5) was obtained in the same manner as the near-infrared absorbing dye (A-1).

chemical formula (23)

(Near-infrared absorbing dye (A-6))
In a reactor, 10.7 parts of aniline, 120 parts of bromobenzene, and 25.7 parts of diazabicyclooctane were added and stirred. After that, 95.2 parts of a 1 mol/1 toluene solution of titanium tetrachloride was added dropwise. After dropping, 10.0 parts of indigo was added and refluxed for 10 hours. After completion of the reaction, methanol was added and filtered to obtain a green powder. 14.6 parts of compound e was obtained by liquid-separating this with a dichloromethane and water and concentrating an organic layer.
In a reaction vessel, 13.5 parts of compound e, 9.0 parts of bis(2,4-pentanedionato)zinc(II), and 120 parts of tetrahydrofuran were mixed and stirred, and the temperature was raised to 40° C. for 5 hours. Stirred. The reaction solution cooled to 30° C. with stirring was poured into 500 parts of methanol with stirring to obtain a blue slurry. This slurry is filtered, washed with 500 parts of methanol, washed with 500 parts of water, dried, and mixed with a compound represented by the following chemical formula (24) (mass ratio: dimer: trimer: 4 A near-infrared absorbing dye (A-6) having a monomer ratio of 81:17:2 was obtained.
A fine near-infrared absorbing dye (A-6) was obtained in the same manner as the near-infrared absorbing dye (A-1).

chemical formula (24)

<Production of alkali-soluble resin (B)>
(Alkali-soluble resin (B1-1) solution)
262.0 parts of propylene glycol monomethyl ether acetate (hereinafter referred to as PGMAc) was placed in a reaction vessel equipped with a separable four-necked flask, a thermometer, a condenser, a nitrogen gas introduction tube, and a stirring device, and 120 parts of nitrogen gas was introduced into the vessel. ° C., and at the same temperature, 49.7 parts (0.27 mol) of 2-ethylhexyl acrylate, 99.4 parts (0.7 mol) of glycidyl methacrylate, 6.6 parts of dicyclopentanyl methacrylate ( 0.03 mol), 19.0 parts of t-butylperoxy-2-ethylhexanoate as a polymerization initiator, and PGMAc were added dropwise over 2.5 hours.
After the dropwise addition was completed, the mixture was further stirred at 120° C. for 2 hours to obtain a precursor. After that, the inside of the flask was replaced with air, and 50.4 parts (0.7 mol) of acrylic acid as a modified compound, 0.6 parts of triphenylphosphine and 0.2 parts of methylhydroquinone as catalysts were added, and the temperature was raised to 110°C. for 10 hours. As a result, the epoxy group of glycidyl methacrylate reacted with the carboxyl group of acrylic acid, and the hydroxyl group was generated by cleavage of the epoxy group of glycidyl methacrylate, and at the same time, a polymerizable unsaturated group was introduced.
Then, 21.3 parts (0.14 mol) of tetrahydrophthalic anhydride was added as a modified compound and reacted at 110° C. for 4 hours. As a result, part of the hydroxyl groups produced by the cleavage of the epoxy groups of glycidyl methacrylate reacted with tetrahydrophthalic anhydride to introduce carboxyl groups. After that, PGMAc was added so that the non-volatile content was 20% by mass to prepare an alkali-soluble resin (B1-1) solution. The alkali-soluble resin (B1-1) had a Tg of -10°C, an acid value of 32 mgKOH/g, a hydroxyl value of 127 mgKOH/g and a weight average molecular weight of 6,400.

(Alkali-soluble resin (B1-2) to (B1-6) solution)
Alkali-soluble resins (B1-2) to (B1-6) are prepared in the same manner as the alkali-soluble resin (B1-1) by changing the raw materials, composition ratios, and amounts shown in Table 1. After synthesis, PGMAc was added to adjust the non-volatile content to 20% by mass.

(Alkali-soluble resin (B2-1) solution)
Put 160 parts of PGMAc in a reaction vessel equipped with a separable 4-necked flask, a thermometer, a cooling tube, a nitrogen gas introduction tube, and a stirring device, heat to 120 ° C. while injecting nitrogen gas into the vessel, and drop at the same temperature. 109.25 parts (0.62 mol) of benzyl methacrylate, 24.1 parts (0.28 mol) of methacrylic acid, 22.03 parts (0.10 mol) of dicyclopentanyl methacrylate, and Zobis as a polymerization initiator A mixture of 1.0 parts of isobutyronitrile and PGMAc was added dropwise over 2.5 hours.
After the dropwise addition was completed, the mixture was stirred at 120° C. for another 2 hours. After that, PGMAc was added so that the non-volatile content was 20% by mass to prepare an alkali-soluble resin (B2-1) solution. The alkali-soluble resin (B2-1) had a Tg of 75° C., an acid value of 98 mgKOH/g and a weight average molecular weight of 17,500.

(Alkali-soluble resin (B2-2) to (B2-6) solution)
Alkali-soluble resins (B2-2) to (B2-6) are prepared in the same manner as the alkali-soluble resin (B2-1) by changing the raw materials, composition ratios, and amounts shown in Table 2. After synthesis, PGMAc was added to adjust the non-volatile content to 20% by mass.

(Alkali-soluble resin (B3-1) to (B3-3) solution)
Alkali-soluble resins (B3-1) to (B3-3) described in Table 3 are synthesized in the same manner as the alkali-soluble resin (B1-1) or (B2-1), and PGMAc is added to remove the non-volatile matter. 20% by mass.

<Production of polymerizable compound (C)>
(Polymerizable compound (C-1) having a urethane bond)
400 parts of dipentaerythritol pentaacrylate, 100 parts of PGMAc, and 0.5 parts of N,N-dimethylbenzylamine were charged into a 5-necked flask equipped with a stirrer, reflux condenser, nitrogen inlet tube, thermometer, and dropping tube. C., and a mixture of 66 parts of toluene diisocyanate and 66 parts of PGMAc was dropped from the dropping tube over 2 hours. After dropping, reaction was carried out at a temperature of 50 to 70° C. for 8 hours, and disappearance of absorption of isocyanate at 2180 cm ⁻¹ was confirmed by IR. Then, 35 parts of mercaptoacetic acid and 0.6 parts of 4-methoxyphenol were charged and reacted at a temperature of 50-60° C. for 6 hours. A solution of polymerizable compound (C-1) having a urethane bond with an average number of polymerizable unsaturated groups of 9 was obtained by adjusting the non-volatile content to 50% by mass.

<Production of colorant (F)>
(Micronized green pigment (F-1))
C. I. 100 parts of Pigment Green 58, 1,200 parts of sodium chloride, and 120 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Seisakusho) and kneaded at 70° C. for 6 hours. This kneaded product is put into 3000 parts of hot water, stirred for 1 hour with a high-speed mixer while heating to 70° C. to form a slurry, filtered and washed repeatedly to remove sodium chloride and diethylene glycol, and then kept at 80° C. for a day and night. A fine green pigment (F-1) was obtained by drying and pulverizing.

(Refined red pigment (F-2))
C. I. Pigment Red 254 (100 parts), sodium chloride (1,200 parts) and diethylene glycol (120 parts) were placed in a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho) and kneaded at 60° C. for 6 hours. Next, the kneaded mixture is put into hot water, heated to about 80°C and stirred with a high-speed mixer for 1 hour to form a slurry, filtered and washed with water to remove sodium chloride and diethylene glycol, and then heated to 80°C. It was dried for a whole day and night and pulverized to obtain a fine red pigment (F-2).

(Micronized blue pigment (F-3))
C. I. Pigment Blue 15:6 (100 parts), sodium chloride (1,000 parts) and diethylene glycol (100 parts) were placed in a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho) and kneaded at 50° C. for 12 hours. This mixture is poured into 3,000 parts of warm water, heated to about 70°C and stirred with a high-speed mixer for about 1 hour to form a slurry, which is repeatedly filtered and washed with water to remove sodium chloride and diethylene glycol. was dried for 24 hours and pulverized to obtain a finely divided blue pigment (F-3).

(Micronized yellow pigment (F-4))
C. I. Pigment Yellow 138 (100 parts), sodium chloride (800 parts) and diethylene glycol (100 parts) were placed in a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho) and kneaded at 70° C. for 12 hours. This mixture is poured into 3000 parts of hot water, heated to about 70°C and stirred with a high-speed mixer for about 1 hour to form a slurry, which is repeatedly filtered and washed with water to remove sodium chloride and diethylene glycol, and then kept at 80°C for a day and night. By drying and pulverizing, a finely divided yellow pigment (F-4) was obtained.

(Micronized purple pigment (F-5))
C. I. Pigment Violet 23 (100 parts), sodium chloride (800 parts) and diethylene glycol (100 parts) were placed in a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho) and kneaded at 70° C. for 12 hours. This mixture is poured into 3000 parts of hot water, heated to about 70°C and stirred with a high-speed mixer for about 1 hour to form a slurry, which is repeatedly filtered and washed with water to remove sodium chloride and diethylene glycol, and then kept at 80°C for a day and night. A finely divided purple pigment (F-5) was obtained by drying and pulverizing.

<Production of dispersion resin (G)>
(Dispersion resin (G-1) solution)
40 parts of methyl methacrylate, 10 parts of n-butyl methacrylate, and 13.2 parts of tetramethylethylenediamine as a catalyst were charged into a reactor equipped with a gas inlet tube, a condenser, a stirring blade, and a thermometer, and the mixture was heated at 50°C while flowing nitrogen. After stirring for 1 hour, the inside of the system was replaced with nitrogen. Next, 9.3 parts of ethyl bromoisobutyrate as an initiator, 5.6 parts of cuprous chloride as a catalyst, and 100 parts of PGMAc are charged, and the temperature is raised to 110° C. under a nitrogen stream to form the first block (B block). Polymerization started. After polymerization for 4 hours, the polymerization solution was sampled and the non-volatile content was measured, and it was confirmed that the polymerization conversion rate was 98% or more in terms of the non-volatile content. Next, 50 parts of PGMAc, 40 parts of dimethylaminoethyl methacrylate as a second block (A block) monomer, and 10 parts of methacryloyloxyethylbenzyldimethylammonium chloride were added to this reactor, and the temperature was maintained at 110° C. under a nitrogen atmosphere. Stir and continue the reaction. After 2 hours from the addition, the polymerization solution was sampled and nonvolatile content was measured to confirm that the polymerization conversion rate of the second block (A block) was 98% or more in terms of nonvolatile content, and the reaction solution was cooled to room temperature. Polymerization was stopped by cooling. As a result of GPC measurement, the polymer had a mass average molecular weight of 20,000, a molecular weight distribution Mw/Mn of 1.4, and a reaction conversion rate of 98.5%. Thus, a dispersion resin (G-1) having an amine value per non-volatile content of 169.8 mgKOH/g was obtained. A dispersion resin (G-1) solution was prepared by adding PGMAc so that the non-volatile content was 30% by mass.

(Dispersion resin (G-2) solution)
30 parts of methyl methacrylate, 30 parts of n-butyl methacrylate, 20 parts of hydroxyethyl methacrylate, and 13.2 parts of tetramethylethylenediamine were charged into a reaction apparatus equipped with a gas inlet tube, condenser, stirring blade, and thermometer, and nitrogen was flowed. While stirring at 50° C. for 1 hour, the inside of the system was replaced with nitrogen. Next, 9.3 parts of ethyl bromoisobutyrate, 5.6 parts of cuprous chloride, and 133 parts of PGMAc were charged, and the temperature was raised to 110° C. under a nitrogen stream to initiate polymerization of the first block (B block). After polymerization for 4 hours, the polymerization solution was sampled and the non-volatile content was measured, and it was confirmed that the polymerization conversion rate was 98% or more in terms of the non-volatile content.
Next, 61 parts of PGMAc and 20 parts of 1,2,2,6,6-pentamethylpiperidyl methacrylate (manufactured by Hitachi Chemical Co., Ltd., Fancryl FA-711MM) as a second block (A block) monomer were added to the reactor. The reaction was continued by stirring while maintaining the temperature at 110° C. under a nitrogen atmosphere. Two hours after the addition of 1,2,2,6,6-pentamethylpiperidyl methacrylate, the polymerization solution was sampled and the nonvolatile content was measured. % or more, the reaction solution was cooled to room temperature to terminate the polymerization. PGMAc was added to dilute the nonvolatile content to 30% to obtain a dispersion resin (G-2) solution having an amine value per nonvolatile content of 57 mgKOH/g and a number average molecular weight of 4,500 (Mn).

(Dispersion resin (G-3) solution)
10 parts of methacrylic acid, 100 parts of methyl methacrylate, 70 parts of i-butyl methacrylate, 20 parts of benzyl methacrylate and 50 parts of PGMAc were introduced into a reaction vessel equipped with a gas inlet tube, a temperature control, a condenser and a stirrer, and the atmosphere was purged with nitrogen gas. The inside of the reaction vessel was heated to 50° C. with stirring, and 12 parts of 3-mercapto-1,2-propanediol was added. The temperature was raised to 90° C., and the mixture was reacted for 7 hours while adding a solution of 0.1 part of 2,2′-azobisisobutyronitrile to 90 parts of PGMAc. It was confirmed by measuring the non-volatile content that 95% had reacted. 19 parts of pyromellitic anhydride, 50 parts of PGMAc, 50 parts of cyclohexanone, and 0.4 parts of 1,8-diazabicyclo-[5.4.0]-7-undecene as a catalyst were added and reacted at 100° C. for 7 hours. . After confirming that 98% or more of the acid anhydride is half-esterified by acid value measurement, the reaction is terminated, and PGMAc is added to dilute so that the nonvolatile content is 30%, and the acid value is 70 mgKOH / g and the weight average molecular weight. A dispersion resin (G-3) solution of 8,500 was obtained.

<Production of dispersion>
(Dispersion 1)
After stirring and mixing the following raw materials uniformly, using zirconia beads with a diameter of 0.5 mm, after dispersing for 3 hours with an Eiger mill (manufactured by Eiger Japan Co., Ltd. "Mini Model M-250 MKII"), the pore size It was filtered through a 1.0 μm filter to prepare Dispersion 1. Organic solvent (Q-1) is PGMAc.
Near infrared absorbing dye (A-1): 15.0 parts Dispersion resin (G-1) solution: 20.0 parts Organic solvent (Q-1): 65.0 parts

(Dispersions 2 to 11)
Dispersions 2 to 11 were prepared in the same manner as Dispersion 1 except that the raw materials and amounts shown in Table 4 were changed.

<Production of photosensitive composition>
[Example 1]
(Photosensitive composition 1)
The following raw materials were mixed, stirred, and filtered through a filter with a pore size of 1.0 μm to obtain a photosensitive composition 1.
Dispersion 1: 15.0 parts Dispersion 3: 20.0 parts Alkali-soluble resin (B1-1) solution: 15.0 parts Alkali-soluble resin (B2-1) solution: 15.0 parts Polymerizable compound (C- 1): 3.0 parts Polymerizable compound (C-2): 3.5 parts Polymerizable compound (C-4): 3.5 parts Photopolymerization initiator (D-2): 0.25 parts Photopolymerization initiation Agent (D-3): 0.25 parts Benzophenone compound (E2-1): 0.75 parts Leveling agent (N): 1.0 parts Organic solvent (Q): 22.25 parts

[Examples 2 to 48, Comparative Examples 1 to 4]
(Photosensitive compositions 2 to 52)
Photosensitive compositions 2 to 52 were prepared in the same manner as in Example 1 except that the photosensitive composition 1 of Example 1 was changed to the raw materials and amounts shown in Tables 5-1 to 5-5.

The raw materials listed in Tables 5-1 to 5-5 are as follows.

[Polymerizable compound (C)]
C-1: Polymerizable compound having the above urethane bond C-2: Polymerizable compound having an acid group of the above chemical formula (13) C-3: Aronix M-520 (manufactured by Toagosei Co., Ltd., polymerization having an acid group compound)
C-4: KAYARAD DPCA-30 (Nippon Kayaku Co., Ltd., lactone-modified polymerizable compound)

[Photoinitiator (D)]
D-1: Photopolymerization initiator of the above chemical formula (16) D-2: Photopolymerization initiator of the above chemical formula (17) D-3: Photopolymerization initiator of the above chemical formula (18) D-4: Irgacure OXE-02 (manufactured by BASF Japan, oxime compound)

[Sensitizer (E)]
(Thioxanthone-based compound (E1))
E1-1: 2,4-diethylthioxanthone (benzophenone compound (E2))
E2-1: 4,4'-bis(diethylamino)benzophenone

[Leveling agent (N)]
N-1: BYK-330 (manufactured by BYK-Chemie)
N-2: Megafac F-551 (manufactured by DIC)
1 part of each of (N-1) and (N-2) above was mixed and dissolved in 98 parts of PGMAc to prepare a mixed solution as a leveling agent (N).

[Organic solvent (Q)]
Q-1: 30 parts of propylene glycol monomethyl ether acetate Q-2: 30 parts of cyclohexanone Q-3: 10 parts of ethyl 3-ethoxypropionate Q-4: 10 parts of propylene glycol monomethyl ether Q-5: 10 parts of cyclohexanol acetate Q -6: Dipropylene glycol methyl ether acetate 10 parts The above (Q-1) to (Q-6) were mixed in the above parts by mass to prepare an organic solvent (Q).

<Evaluation of photosensitive composition>
The resulting photosensitive compositions 1 to 52 (Examples 1 to 48, Comparative Examples 1 to 4) were evaluated for developability, adhesion, heat cycle resistance, and solvent resistance by the following methods. Table 6 shows the evaluation results.

[Evaluation of developability]
The obtained photosensitive composition was coated on a glass substrate (Eagle 2000 manufactured by Corning Inc.) of 100 mm long×100 mm wide and 0.7 mm thick using a spin coater so that the dry film thickness would be 2.0 μm. and dried on a hot plate at 70° C. for 1 minute. Then, using an ultra-high pressure mercury lamp, the film was exposed to ultraviolet rays through a photomask having a stripe pattern of 100 μm width at an illumination intensity of 30 mW/cm ² and 50 mJ/cm ² . Further, after cooling this substrate to room temperature, it was spray-developed using an aqueous developer containing 0.12% nonionic surfactant and 0.04% potassium hydroxide at 23° C., and washed with deionized water. and air-dried. The resulting substrate was post-baked in a clean oven at 200° C. for 15 minutes to form a striped pattern on the substrate. The pattern was observed with an optical microscope, and the amount of residue remaining in the unexposed area was evaluated by image binarization processing. The evaluation criteria are as follows, and 2 or more is practical.
3: Development residue is less than 1.5% of the unexposed area 2: Development residue is 1.5% or more and less than 3% of the unexposed area 1: Development residue is 3% or more of the unexposed area

[Adhesion evaluation]
The resulting photosensitive composition was applied to a glass substrate (Eagle 2000 manufactured by Corning) of 100 mm long, 100 mm wide and 0.7 mm thick by a spin coating method so that the film thickness after drying was 2.0 μm. and dried on a hot plate at 70°C for 1 minute. Then, after cooling the substrate to room temperature, it was exposed at an illumination intensity of 30 mW/cm ² and 50 mJ/cm ² using a high-pressure mercury lamp through a photomask having a stripe pattern of 5 μm to 25 μm in increments of 5 μm. Thereafter, the substrate was developed by spraying with an aqueous developer containing 0.12% nonionic surfactant and 0.04% potassium hydroxide at 23° C., washed with deionized water, air-dried, and cleaned. Post-baking was performed in an oven at 200° C. for 15 minutes to obtain a substrate for adhesion evaluation. Spray development was carried out for the shortest time for pattern formation without development residue for each photosensitive composition film, and this was taken as the proper development time.
A thin line pattern with a width of 5 to 25 μm among the patterns of the adhesion evaluation substrate was observed with an optical microscope to confirm the minimum line width of the remaining thin line pattern. The evaluation criteria are as follows, and 3 or more is practical.
5: Fine lines of 10 μm or less remain.
4: Fine lines of 15 μm or more remain.
3: Fine lines of 20 μm or more remain.
2: Fine lines of 25 μm remain.
1: Fine lines do not remain.

[Solvent resistance evaluation]
The obtained photosensitive composition was coated on a glass substrate (Eagle 2000 manufactured by Corning Inc.) of 100 mm long×100 mm wide and 0.7 mm thick using a spin coater so that the dry film thickness would be 2.0 μm. and dried on a hot plate at 70° C. for 1 minute. Then, using an ultra-high pressure mercury lamp, the film was exposed to ultraviolet rays through a photomask having a stripe pattern of 100 μm width at an illumination intensity of 30 mW/cm ² and 50 mJ/cm ² . Further, after cooling this substrate to room temperature, it was spray-developed using an aqueous developer containing 0.12% nonionic surfactant and 0.04% potassium hydroxide at 23° C., and washed with deionized water. and air-dried. The resulting substrate was post-baked in a clean oven at 200° C. for 15 minutes to obtain a solvent resistance evaluation substrate.
The resulting substrate was immersed in N-methylpyrrolidone at room temperature for 30 minutes, washed with deionized water, air-dried, and a stripe pattern portion with a width of 100 μm was observed with an optical microscope. The evaluation criteria are as follows, and 3 or more is regarded as practical.
5: No change in appearance and color.
4: Slight wrinkles, etc., but no change in color.
3: Some wrinkles or the like occur, but there is no change in color.
2: Wrinkles and the like are generated on the entire surface, and the color is slightly faded.
1: Peeling and discoloration occurred.

[Heat cycle resistance evaluation]
The obtained photosensitive composition was coated on a glass substrate (Eagle 2000 manufactured by Corning Inc.) of 100 mm long×100 mm wide and 0.7 mm thick using a spin coater so that the dry film thickness would be 2.0 μm. and dried on a hot plate at 70° C. for 1 minute. Then, after cooling the substrate to room temperature, it was exposed through a photomask with a stripe pattern of 100 μm using a high-pressure mercury lamp at an illumination intensity of 30 mW/cm ² and 50 mJ/cm ² . Thereafter, the substrate was developed by spraying with an aqueous developer containing 0.12% nonionic surfactant and 0.04% potassium hydroxide at 23° C., washed with deionized water, air-dried, and cleaned. Post-baking was performed in an oven at 200° C. for 15 minutes to obtain a heat cycle resistance evaluation substrate.
After that, the heat cycle resistance evaluation substrate was repeatedly subjected to 500 cycles of temperature rise/fall cycles of −20° C. for 10 minutes and 100° C. for 10 minutes. The evaluation criteria are as follows, and 3 or more is practical.
5: No abnormality in appearance at 500 cycles 4: Slight cracking and/or peeling at 500 cycles 3: Partial cracking and/or peeling at 500 cycles 2: Cracks and/or at 200 cycles or peeling occurs Cracking and/or peeling occurs at 1:100 cycles

10 image display device 11 transparent substrate 12 TFT array 13 transparent electrode layer 14 orientation layer 15 polarizing plate 21 transparent substrate 22 color filter 23 transparent electrode layer 24 orientation layer 25 polarizing plate 30 backlight unit 31 white LED light source LC liquid crystal 200 solid-state imaging device 201 Solid-state imaging device 202 Imaging unit 203 Cover glass 204 Spacer 205 Laminated substrate 206 Chip substrate 207 Circuit substrate 208 Electrode pad 209 External connection terminal 210 Through electrode 211 Lens layer 212 Lens material 213 Support 214 Hardened film 215 Hardened film 300 Infrared sensor 310 Solid-state imaging device 311 Infrared cut filter 312 Color filter 313 Infrared transmission filter 314 Resin film 315 Microlens 316 Flat film

Claims (13)

A photosensitive composition comprising a near-infrared absorbing dye (A), an alkali-soluble resin (B), a polymerizable compound (C), and a photopolymerization initiator (D),
The alkali-soluble resin (B) is a photosensitive composition containing an alkali-soluble resin (B1) having a glass transition temperature of −10 to 40° C. and an alkali-soluble resin (B2) having a glass transition temperature of 60 to 150° C. . 2. The photosensitive composition according to claim 1, further comprising a coloring agent (F). 3. The photosensitive composition according to claim 1, wherein the alkali-soluble resin (B1) is a resin containing a polymerizable unsaturated group. 3. The photosensitive composition according to claim 1, wherein the alkali-soluble resin (B1) is a resin containing a hydroxyl group. 3. The photosensitive composition according to claim 1, wherein the content of the alkali-soluble resin (B1) is 30 to 70% by mass based on 100% by mass of the alkali-soluble resin (B). 3. The photosensitive composition according to claim 1, wherein the alkali-soluble resin (B2) is a resin containing no polymerizable unsaturated group. 3. The photosensitive composition according to claim 1, further comprising a sensitizer (E). The photosensitive composition according to claim 7, wherein the content of the sensitizer (E) is 150 to 400 parts by mass with respect to 100 parts by mass of the photopolymerization initiator (D). A cured film obtained by curing the photosensitive composition according to claim 1 . An optical filter comprising the cured film according to claim 9 . An image display device comprising the cured film according to claim 9 . A solid-state imaging device comprising the cured film according to claim 9 . An infrared sensor comprising the cured film according to claim 9 .

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