JP2022190738A5 - - Google Patents

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Publication number
JP2022190738A5
JP2022190738A5 JP2021099133A JP2021099133A JP2022190738A5 JP 2022190738 A5 JP2022190738 A5 JP 2022190738A5 JP 2021099133 A JP2021099133 A JP 2021099133A JP 2021099133 A JP2021099133 A JP 2021099133A JP 2022190738 A5 JP2022190738 A5 JP 2022190738A5
Authority
JP
Japan
Prior art keywords
bump
hole
diameter
cross
substantially circular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021099133A
Other languages
English (en)
Japanese (ja)
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JP2022190738A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2021099133A priority Critical patent/JP2022190738A/ja
Priority claimed from JP2021099133A external-priority patent/JP2022190738A/ja
Priority to CN202210338284.XA priority patent/CN114629464A/zh
Publication of JP2022190738A publication Critical patent/JP2022190738A/ja
Publication of JP2022190738A5 publication Critical patent/JP2022190738A5/ja
Pending legal-status Critical Current

Links

JP2021099133A 2021-06-15 2021-06-15 弾性波デバイスパッケージ、および弾性波デバイスを含むモジュール Pending JP2022190738A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021099133A JP2022190738A (ja) 2021-06-15 2021-06-15 弾性波デバイスパッケージ、および弾性波デバイスを含むモジュール
CN202210338284.XA CN114629464A (zh) 2021-06-15 2022-04-01 弹性波装置封装及包含弹性波装置的模块

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021099133A JP2022190738A (ja) 2021-06-15 2021-06-15 弾性波デバイスパッケージ、および弾性波デバイスを含むモジュール

Publications (2)

Publication Number Publication Date
JP2022190738A JP2022190738A (ja) 2022-12-27
JP2022190738A5 true JP2022190738A5 (enrdf_load_stackoverflow) 2024-06-28

Family

ID=81905542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021099133A Pending JP2022190738A (ja) 2021-06-15 2021-06-15 弾性波デバイスパッケージ、および弾性波デバイスを含むモジュール

Country Status (2)

Country Link
JP (1) JP2022190738A (enrdf_load_stackoverflow)
CN (1) CN114629464A (enrdf_load_stackoverflow)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000091380A (ja) * 1998-09-09 2000-03-31 Mitsubishi Electric Corp フリップチップの実装構造
DE10104574A1 (de) * 2001-02-01 2002-08-08 Epcos Ag Substrat für ein elektrisches Bauelement und Verfahren zur Herstellung
DE10164494B9 (de) * 2001-12-28 2014-08-21 Epcos Ag Verkapseltes Bauelement mit geringer Bauhöhe sowie Verfahren zur Herstellung
JP4238668B2 (ja) * 2003-08-07 2009-03-18 ソニー株式会社 半導体装置の製造方法
JP4551255B2 (ja) * 2005-03-31 2010-09-22 ルネサスエレクトロニクス株式会社 半導体装置
JP2008166884A (ja) * 2006-12-27 2008-07-17 Daishinku Corp 圧電振動デバイスの製造方法、およびその製造方法による圧電振動デバイス
JP2013225749A (ja) * 2012-04-20 2013-10-31 Kyocera Corp 圧電デバイス及びモジュール部品
JP6407102B2 (ja) * 2014-07-30 2018-10-17 太陽誘電株式会社 弾性波デバイス及びその製造方法
JP7262743B2 (ja) * 2018-12-20 2023-04-24 三安ジャパンテクノロジー株式会社 弾性波デバイスを含むモジュール

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