JP2022182674A - Pattern film, roll film, and manufacturing method of pattern film - Google Patents

Abstract

To provide a pattern film capable of preventing dielectric breakdown due to potential differences between wires in the manufacturing process.SOLUTION: The pattern film includes: a film substrate 10; and a conductive pattern 20 arranged on the surface of the film substrate 10. The conductive pattern 20 includes: a Y-direction electrode 21; a first wiring 23a; a second wiring 24 connected to the Y-direction electrode 21; and a third wiring 25 connected to the first wiring 23a. Each of the second wiring 24 and the third wiring 25 extends to downstream of the first wiring 23a in a carrying direction, and the position of the downstream end of the second wiring 24 and the third wiring 25 in the carrying direction is aligned.SELECTED DRAWING: Figure 3

Description

The present disclosure relates to a pattern film for a touch sensor used for input operations of various electronic devices, a roll film obtained by winding the pattern film, and a method for manufacturing the pattern film.

2. Description of the Related Art Conventionally, touch sensors applied to display devices such as liquid crystal displays (LCDs) are known, for example, as disclosed in Patent Documents 1 and 2.

Further, Patent Document 3 discloses a method using roll-to-roll electroless plating as a method for producing a roll film having a conductive pattern. In the technique disclosed in Patent Document 3, as shown in FIGS. 1 and 4, a plurality of touch sensors are arranged in rows and columns in the direction in which the support is conveyed and in the direction perpendicular thereto.

JP 2017-151575 A JP 2020-021184 A JP 2021-055162 A

Here, in the roll-to-roll type manufacturing apparatus, in the process of transporting the film, an electrode (Patent Document 3 corresponds to the functional pattern portion) may come into contact with the conductive pattern.

Then, for example, as in Patent Document 3, when a plurality of electrodes are extended in a direction perpendicular to the transport direction of the film, the plurality of electrodes come into contact with the equipment in order.

The electrodes are electrically insulated from each other, and equipment such as the transport rollers is grounded. Therefore, the wiring that touches the equipment is connected to the ground through the equipment, while the adjacent wiring does not touch the equipment and is in a floating state. In this case, the wiring connected to the ground and the wiring with remaining charge are adjacent to each other, so that a potential difference occurs between the wirings, and there is a possibility that dielectric breakdown occurs at a position where the wiring spacing is narrow.

The present disclosure has been made in view of such points, and an object thereof is to avoid dielectric breakdown due to a potential difference between wirings in the manufacturing process of the pattern film.

To achieve the above object, a patterned film according to one embodiment of the present disclosure includes a film substrate and a conductive pattern disposed on a surface of the film substrate, the conductive pattern being formed on the film substrate. a first wiring extending in the orthogonal direction downstream of the electrode in the conveying direction; a second wiring connected to the electrode; and the first wiring and a third wiring connected to the second wiring and the third wiring, wherein the second wiring and the third wiring extend to a downstream side in the conveying direction from the first wiring, and the second wiring and the third wiring are connected to the The positions of the downstream ends in the transport direction are aligned.

According to the present disclosure, it is possible to avoid dielectric breakdown due to a potential difference between wirings in the process of manufacturing a patterned film.

FIG. 1 is a conceptual diagram showing a state in which a film is transported in a roll-to-roll manufacturing apparatus. FIG. 2 is a schematic view showing the conductive pattern arranged on the first electrode surface as viewed from the first electrode surface side in the first embodiment. 3 is a partially enlarged view enlarging the periphery of the additional pattern in FIG. 2. FIG. FIG. 4 is a schematic perspective view of the conductive pattern arranged on the second electrode surface, viewed from the first electrode surface side, in the first embodiment. FIG. 5 is a perspective view schematically showing each configuration provided on the film substrate in the first embodiment, viewed from the first electrode surface side. FIG. 6 is a sectional view taken along line VI-VI of FIG. FIG. 7 is a diagram for explaining the production process of the pattern film according to the first embodiment. FIG. 8 is a schematic diagram showing the conductive pattern arranged on the first electrode surface as viewed from the first electrode surface side in the second embodiment. FIG. 9 is a perspective view schematically showing the conductive pattern arranged on the second electrode surface, viewed from the first electrode surface side, in the second embodiment. FIG. 10 is a perspective view schematically showing each configuration provided on the film substrate in the second embodiment, viewed from the first electrode surface side. FIG. 11 is a perspective view showing a configuration example of a roll film. 12 is a diagram showing another example of the conductive pattern of FIG. 2. FIG.

Hereinafter, each embodiment of the present disclosure will be described in detail based on the drawings. The description of each embodiment below is merely illustrative in nature, and is not intended to limit the present disclosure, its applications, or its uses.

[First embodiment]
FIG. 1 shows a state in which a film is transported in a roll-to-roll manufacturing apparatus 60 . The manufacturing device 60 includes a delivery roller 62 , a transport roller 63 provided on a transport path, and a winding roller 64 .

In the present disclosure, the direction in which the film substrate 10 is transported in the manufacturing apparatus 60 is referred to as the transport direction or the X direction. The destination side of the film substrate 10 is referred to as the "downstream side in the transport direction".

Also, the direction orthogonal to the transport direction on the surface of the film substrate 10 is called the orthogonal direction or the Y direction. It should be noted that the “perpendicular direction” in the present disclosure means that the substantial directions are perpendicular to each other. In other words, the "perpendicular direction" includes a range in which the angle is slightly deviated from the perpendicular direction in addition to the case in which the direction is perpendicular to the conveying direction of the film substrate 10 . The above-described slight deviation may occur due to, for example, manufacturing errors in the pattern, bending or tilting of the film during transport, or the like.

A direction orthogonal to the X direction and the Y direction is called a Z direction. The Z direction corresponds to the thickness direction of the film substrate 10 .

In the manufacturing apparatus 60 , the film substrate 10 wound into a roll is conveyed between a delivery roller 62 and a winding roller 64 while being stretched by roll-to-roll.

The transport roller 63 is provided on the transport path between the delivery roller 62 and the take-up roller 64 . The transport roller 63 is brought into contact with the surface of the film substrate 10 in the transport path, and rotates along the transport direction to feed the film substrate 10 in the transport direction. The transport roller 63 is grounded to the ground potential.

In the present disclosure, a film on which conductive patterns 20 and 30 for touch sensors, which will be described later, are formed is referred to as a "pattern film". A roll-shaped film formed by winding the pattern film 1 around the core 18 is called a "roll film". FIG. 11 shows a configuration example of the roll film RF. A method of manufacturing the pattern film 1 and the roll film RF using the manufacturing apparatus 60 will be described later.

(pattern film)
As shown in FIGS. 1 to 6, the pattern film 1 includes a film substrate 10 and conductive patterns 20 and 30 arranged on the surface of the film substrate 10. FIG. Specifically, the film substrate 10 is provided with the pattern forming regions 2 at a predetermined interval P. As shown in FIG. Touch sensors 3 are arranged in a matrix in the pattern formation region 2 . Each touch sensor 3 is arranged so that the X direction is the long side direction and the Y direction is the short side direction.

FIG. 1 shows an example in which the pattern formation region 2 is provided with three rows of touch sensors in the X direction and three rows in the Y direction. In FIG. 1, X1 is the length of the pattern formation region 2 in the X direction, and Y1 is the length of the pattern formation region 2 in the Y direction. TD is the width of the pattern film 1 in the short side direction. Note that the interval P, the lengths X1 and Y1, and the number of touch sensors 3 in each pattern forming region 2 are not limited to the configuration shown in FIG. 1, and can be set arbitrarily.

－Touch sensor－
FIG. 5 is a perspective view schematically showing each configuration provided on the film substrate 10 as viewed from the side of a first electrode surface 12a, which will be described later.

As shown in FIG. 5, a plurality of Y-direction electrodes 21 as receiving electrodes and a plurality of X-direction electrodes 31 as transmitting electrodes are arranged so as to intersect (perpendicularly) each other in plan view. A node is formed in a region where each Y-direction electrode 21 and each X-direction electrode 31 overlap. This node is configured as a region capable of generating capacitance.

Each transmission electrode is connected to a driving circuit (not shown) via a flexible wiring board (not shown), for example. Each transmitting electrode is configured to radiate an electric field to its surroundings by this drive circuit. On the other hand, each receiving electrode is connected to a detection circuit (not shown) through a flexible wiring board (not shown). Each receiving electrode is configured to receive the electric field radiated from each transmitting electrode.

Each configuration will be specifically described below.

－Film Substrate－
As shown in FIG. 6 , the film substrate 10 includes a base film 11 and imprint resin layers 12 and 13 arranged on both sides of the base film 11 .

Examples of the base film 11 include a stretched film formed by uniaxially or biaxially stretching a polymer material. Examples of materials for the base film 11 include resin materials such as cycloolefin resins, polycarbonate resins, and acrylic resins. A thickness W1 of the base film 11 is not particularly limited, but is, for example, 50 μm.

The imprint resin layers 12 and 13 are layers for forming a plurality of grooves 12b and 13b, which will be described later. The imprint resin layers 12 and 13 are made of an insulating and transparent resin material. The thicknesses W2 and W3 of the imprint resin layers 12 and 13 are not particularly limited, but are, for example, 1.8 to 4.2 μm.

A conductive pattern 20 is arranged on the outer surface of one imprint resin layer 12 (hereinafter referred to as first electrode surface 12a). A conductive pattern 30 is arranged on the outer surface of the other imprint resin layer 13 (hereinafter referred to as a second electrode surface 13a). A bottomed groove portion 12b for forming the conductive pattern 20 is formed in the first electrode surface 12a of the imprint resin layer 12 . Similarly, on the second electrode surface 13a of the imprint resin layer 13, a bottomed groove 13b for forming the conductive pattern 20 is formed. The depth of each groove 12b, 13b is, for example, 0.5 to 3.0 μm.

-Conductive pattern-
2 and 3 show the configuration of the conductive pattern 20 arranged on the first electrode surface 12a.

The conductive pattern 20 includes a plurality of Y-direction electrodes 21, a peripheral wiring 23 including first wirings 23a, a plurality of second wirings 24, and a third wiring 25 (see FIG. 3). A plurality of Y-direction electrodes 21 and peripheral wiring 23 are arranged inside the product outline 15 . The product contour line 15 is a line that defines the contour of the product, and is a cutting line for cutting out the product from the pattern film 1 . For example, when it is mounted on a product (not shown) such as a liquid crystal display, the pattern film 1 is cut out along the product outline 15 and used. In the following description, the area surrounded by the product outline 15 will be referred to as "area MA".

A suitable conductive material for the conductive pattern 20 is a conductive metal such as copper (Cu) or silver (Ag). In place of the conductive metal, for example, a transparent conductive material having light transmittance such as a conductive resin material, indium tin oxide, or tin oxide may be used. The same applies to the conductive pattern 30 as well.

A plurality of Y-direction electrodes 21 are arranged side by side in the X-direction at a predetermined pitch. Each of the Y-direction electrodes 21 includes a mesh pattern of a mesh structure in which a plurality of cells each having a plurality of fine lines 22 extending obliquely to each of the X and Y directions are regularly arranged. The plurality of cells, for example, each have a rhombus shape in plan view and are formed to have the same size as each other. The line width of the fine lines 22 forming each of the Y-direction electrodes 21 is preferably set to 0.5 to 2.0 μm. In FIG. 6, the illustration of the fine lines 22 is omitted, and the regions where the Y-direction electrodes 21 are provided are indicated by hatching. The same applies to thin wires 32 to be described later.

The surrounding wiring 23 is arranged so as to surround the outer periphery of the plurality of Y-direction electrodes 21 in a rectangular shape. The peripheral wiring 23 includes a first wiring 23a extending in the Y direction further downstream in the transport direction than the electrode 21a positioned most downstream in the transport direction among the Y-direction electrodes 21 . A specific wiring shape of the peripheral wiring 23 is not particularly limited. For example, it may be a normal linear wiring, or it may be configured with a mesh pattern of a network structure like the Y-direction electrodes 21 .

A second wiring 24 is connected to each Y-direction electrode 21 . A third wiring 25 is connected to the peripheral wiring 23 .

Each of the second wirings 24 includes a connection wiring 24a connecting between the Y-direction electrode 21 and the connection terminal 26, and a connection wiring 24a that is drawn out of the area MA along the Y direction, and outside the area MA on the downstream side in the transport direction ( and an additional pattern 24b extending in the X direction).

The third wiring 25 is drawn out of the area MA along the Y direction and the connection wiring 25a connecting between the peripheral wiring 23 and the connection terminal 26, and is located on the downstream side in the transport direction (X direction) outside the area MA. ) and an additional pattern 25b extending toward .

Each connection terminal 26 is a substantially rectangular terminal that extends in the Y direction and is wider than the connection wiring 24 in plan view. The plurality of connection terminals 26 are provided inside the area MA and are arranged at predetermined intervals in the Y direction from the plurality of Y-direction electrodes 21 . The plurality of connection terminals 26 are concentrated near the center in the X direction and arranged side by side in the X direction at a pitch narrower than the interval between the plurality of Y direction electrodes 21 . Of the connection terminals 26, terminals positioned on both outer sides in the X direction are connected to the third wirings 25, and the remaining terminals are connected to respective connection wirings 24a.

Each connection wiring 24a connects the ends of the Y-direction electrodes 21 and the connection terminals 26 facing each other. More specifically, the connection wirings 24a connected to the ends of the Y-direction electrodes 21 are concentrated near the center in the X-direction, and one end of the corresponding connection terminal 26 (the end on the Y-direction electrode 21 side) , extending in parallel with the Y direction.

The connection wiring 25a is an L-shaped wiring extending in the Y direction after extending toward the center in the X direction, and is connected to one end of the connection terminal 26 (the end on the electrode side in the Y direction).

Note that the connection terminal 26 may not be provided. In that case, the connection wires 24a and 25a are formed to extend to the end of the connection terminal 26 on the product outline 15 side (hereinafter referred to as the other end).

As shown in FIG. 3, additional patterns 24b and 25b are connected to the other end of each connection terminal 26, respectively. More specifically, each of the additional patterns 24b and 25b extends from the other end of each connection terminal 26 so as to be parallel to the Y direction and is pulled out to the outside of the area MA. direction and extends parallel to the X direction. The additional patterns 24b and 25b extend to the downstream side in the transport direction from the first wiring 23a. Further, all the additional patterns 24b and 25b are arranged so that their downstream ends are aligned. The second wirings 24 and the second wirings 24 and the third wirings 25 are laid apart from each other and insulated from each other.

A distance A from the most downstream position of the first wiring 23a to the downstream ends of the additional patterns 24b and 25b is preferably 1 mm or more. Moreover, it is preferable that the distance B between the product outline 15 and the wiring pattern extending in the X direction of the additional patterns 24b and 25b is 1 mm or more.

Further, for example, as shown in FIG. 1, when a plurality of conductive patterns 20 are arranged in a matrix along the X direction on the film substrate 10, the plurality of conductive patterns 20 arranged in the Y direction , the positions of the downstream ends in the X direction of all the second wirings 24 and the third wirings 25 are preferably aligned. Specifically, for example, in FIG. 1, three conductive patterns 20 are arranged side by side in the Y direction. In this case, it is preferable that the positions of the downstream ends of the additional patterns 24b and 25b of all the three conductive patterns 20 are aligned.

FIG. 4 shows the configuration of the conductive pattern 30 arranged on the second electrode surface 13a.

The conductive pattern 30 includes a plurality of X-direction electrodes 31 , a peripheral wiring 33 , a plurality of connection wirings 34 and 35 and a connection terminal 36 . A plurality of X-direction electrodes 31 and peripheral wiring 33 are arranged in the area MA inside the product outline 15 .

The plurality of X-direction electrodes 31 are arranged side by side in the Y-direction at a predetermined pitch. Each of the X-direction electrodes 31 includes a mesh pattern of a mesh structure in which a plurality of cells each formed by a plurality of fine lines 32 extending obliquely to each of the X-direction and the Y-direction are regularly arranged. The plurality of cells, for example, each have a rhombus shape in plan view and are formed to have the same size as each other. The line width of the fine lines 32 forming each of the X-direction electrodes 31 is preferably set to 0.5 to 2.0 μm.

The surrounding wiring 33 is arranged so as to surround the outer periphery of the plurality of X-direction electrodes 31 in a rectangular shape. As shown in FIG. 5, the peripheral wiring 33 is arranged so as to overlap the peripheral wiring 23 of the conductive pattern 20 described above in plan view. A specific wiring shape of the peripheral wiring 33 is not particularly limited. For example, it may be normal straight wiring, or it may be configured with a mesh pattern of a mesh structure like the X-direction electrodes 31 .

The connection terminal 36 is a substantially rectangular terminal that extends in the Y direction and is wider than the connection wiring 34 in plan view. The plurality of connection terminals 36 are arranged side by side in the X direction at a predetermined pitch on both sides of the connection terminal 26 in the X direction. Of the connection terminals 36 , the terminals positioned on both sides in the X direction are connected to the connection wires 35 to which the peripheral wires 33 are connected, and the other terminals are connected to the connection wires 34 connected to the respective X direction electrodes 31 . are connected respectively.

As shown in FIG. 6, a protective film layer 14 is provided on the surface of the imprint resin layer 13 on the second electrode surface 13a side.

(Manufacturing method of pattern film)
A method for manufacturing the pattern film 1 will be described with reference to FIGS. 1 and 7. FIG.

The method for manufacturing the pattern film 1 comprises a pattern arrangement step of arranging the conductive patterns 20 and 30 on the surface of the film substrate 10, and the pattern film 1 while rotating the transport roller 63 in contact with the surface on which the conductive pattern 20 is formed. is conveyed in the conveying direction.

Each step will be specifically described below.

-Pattern placement process-
The pattern arrangement process of the conductive pattern 20 will be described below.

First, the groove portion 12b is formed in the first electrode surface 12a of the imprint resin layer 12 . In the step of forming the groove portion 12b, a fillet may be formed at the corner portion between the side surface and the bottom surface of the groove portion 12b.

Next, on the first electrode surface 12a, for example, a metal layer composed of a metal nitride or a metal oxide containing a metal such as Ti or Al is formed in a thin film form. By this film formation, an adhesion layer is formed in the groove portion 12b. After the formation of the adhesion layer, a conductive metal layer such as Cu or Ag is formed as a thin film on the first electrode surface 12a. By this film formation, a conductive layer is formed in the groove portion 12b. For example, a sputtering method, a vapor deposition method, a plating method, or the like is used for forming the adhesion layer and the conductive layer. After laminating a predetermined amount of the conductive layer, the surplus conductive metal film laminated on the first electrode surface 12a (on the groove portion 12b) is removed.

Through the above steps, the conductive pattern 20 is formed and arranged.

The conductive pattern 30 is also formed and arranged in the same manner as the conductive pattern 20 described above.

After that, the protective film layer 14 is formed on the surface of the imprint resin layer 13 on the second electrode surface 13a side.

－Conveyance process－
In the transporting step, the manufacturing apparatus 60 is used to transport the film substrate 10 wound into a roll between a feed roller 62 and a take-up roller 64 while being stretched roll-to-roll. That is, the film substrate 10 is conveyed while being stretched in the long side direction (X direction). Then, as described above, the conductive pattern 20 such as electrodes and wiring may be formed on the surface of the film substrate 10 during the transportation process from the delivery roller 62 to the take-up roller 64 .

In the transport step, after the conductive pattern 20 is arranged on the film substrate 10 in the pattern arrangement step, the pattern film 1 is transported while rotating the transport roller 63 in contact with the first electrode surface 12a on which the conductive pattern 20 is arranged. is conveyed in the conveying direction. When the pattern film 1 wound on the winding roller 64 is pulled out together with the winding core 18, the roll film RF shown in FIG. 11 is completed.

FIG. 7 shows how the film substrate 10 is conveyed after the conductive pattern 20 is arranged.

In FIG. 7, X21 indicates the contact position between the transport roller 63 and the first electrode surface 12a at time T1. In other words, at time T1, film substrate 10 is transported until the relative position between film substrate 10 and transport roller 63 reaches position X21. Similarly, X22 to X24 indicate contact positions between the transport roller 63 and the first electrode surface 12a at times T2 to T4 (T1<T2<T3<T4), respectively.

At time T1, when the film substrate 10 is transported to the position X21, the transport roller 63 contacts the additional patterns 24b and 25b. That is, the transport roller 63 contacts the additional patterns 24 b and 25 b before contacting the Y-direction electrodes 21 and the peripheral wiring 23 .

As described above, the transport roller 63 is grounded, and the downstream ends of the additional patterns 24b and 25b are aligned in the transport direction. Therefore, the additional patterns 24b and 25b are simultaneously grounded to the ground potential. Then, the Y-direction electrodes 21 and the peripheral wiring 23 connected to the additional patterns 24b and 25b are simultaneously grounded to the ground potential.

At time T2, the film substrate 10 is transported to the position X22, the transport roller 63 contacts the peripheral wiring 23, and the peripheral wiring 23 is grounded to the ground potential. At this time, the Y direction electrode 21a adjacent to the first wiring 23a of the surrounding wiring 23 is already grounded to the ground potential. Therefore, no potential difference occurs between the peripheral wiring 23 and the Y-direction electrodes 21a. As a result, for example, it is possible to avoid problems such as dielectric breakdown occurring between the connection wiring 24a and the connection wiring 25a that are close to each other.

The same applies to time T3 and time T4. For example, when the film substrate 10 is transported to the respective positions X23 and X24, contact with the transport roller 63 causes the Y-direction electrodes 21 to be grounded to the ground potential in order from the downstream side in the transport direction. At this time, since the Y-direction electrodes 21 adjacent to each other are already grounded to the ground potential, no potential difference occurs between the adjacent Y-direction electrodes 21 . As a result, for example, it is possible to avoid problems such as dielectric breakdown occurring between the connection wirings 24a that are close to each other.

[Action and effect of the first embodiment]
In summary, the pattern film 1 according to this embodiment includes a film substrate 10 and a conductive pattern 20 arranged on the surface of the film substrate 10 . The conductive pattern 20 includes Y-direction electrodes 21 (including electrodes 21a) extending in the orthogonal direction (Y-direction) perpendicular to the conveying direction (X-direction) of the film substrate 10, and Y-direction electrodes 21 extending in the conveying direction from the Y-direction electrodes 21. On the downstream side, there are provided first wirings 23a extending in the orthogonal direction, second wirings 24 connected to the Y-direction electrodes 21, and third wirings 25 connected to the first wirings 23a. The second wiring 24 and the third wiring 25 extend further downstream in the transport direction than the first wiring 23a. ing. As described above, the orthogonal direction here means that the directions are substantially orthogonal, and includes a range in which the angle with respect to the conveying direction of the film substrate is slightly deviated from the orthogonal direction. That is, the orthogonal direction is a concept including substantially orthogonal directions.

As a result, when the surface of the film substrate 10 comes into contact with a portion of the manufacturing apparatus 60 such as the carrying roller 63 during the process of transporting the film substrate 10 in the transport direction, that is, the conductive pattern 20 comes into contact with the surface of the film substrate 10 . Even in such a case, it is possible to avoid problems such as dielectric breakdown due to the potential difference occurring between adjacent wirings.

For example, in a conventional configuration such as that disclosed in Patent Document 3, when the electrode surface is in an exposed state and sequentially contacts a portion of the manufacturing apparatus 60 such as a conveying roller, one electrode between the adjacent electrodes is grounded first. In this case, if an electric charge remains in the other of the adjacent electrodes, a potential difference may occur between the electrodes or between the wirings, which may cause problems such as dielectric breakdown. can be avoided.

Further, in the first embodiment, the Y-direction electrodes 21 and the first wirings 23a are arranged within the area MA. The second wiring 24 and the third wiring 25 include additional patterns 24b and 25b, respectively, which are pulled out of the area MA and extend to a position downstream of the first wiring 23a in the transport direction outside the area MA. I'm in.

By adopting such a configuration, it is possible to obtain the effect of preventing problems such as dielectric breakdown due to the occurrence of a potential difference between mutually adjacent wirings without hindering product miniaturization. The same applies to other embodiments described later.

[Second embodiment]
8 to 10 show the configuration of the conductive pattern according to the second embodiment. In the following description, differences from the first embodiment will be mainly described.

The pattern film 1 includes a film substrate 10 and conductive patterns 40 and 50 arranged on the surface of the film substrate 10 . As in the first embodiment, pattern formation regions 2 are provided at predetermined intervals P, and touch sensors 3 configured by conductive patterns 40 and 50 are arranged in a matrix in the pattern formation regions 2 . In this embodiment, each touch sensor 3 is arranged so that the X direction is the short side direction and the Y direction is the long side direction.

－Touch sensor－
FIG. 10 is a perspective view schematically showing each configuration of the touch sensor 3 provided on the film substrate 10, viewed from the side of a first electrode surface 12a, which will be described later.

As shown in FIG. 10, a plurality of Y-direction electrodes 41 as transmitting electrodes and a plurality of X-direction electrodes 51 as receiving electrodes are arranged so as to intersect (perpendicularly) each other in plan view. A node is formed in a region where each Y-direction electrode 41 and each X-direction electrode 51 overlap. This node is configured as a region capable of generating capacitance.

In the following, each configuration will be described more specifically, focusing on differences from the first embodiment. Since the configuration of the film substrate 10 is the same as that of the first embodiment, description thereof is omitted here.

-Conductive pattern-
FIG. 8 shows a plan view of the pattern film 1 from the side of the first electrode surface 12a. In other words, FIG. 8 shows the configuration of the conductive pattern 40 arranged on the first electrode surface 12a.

The conductive pattern 40 includes a plurality of Y-direction electrodes 41 , a peripheral wiring 43 , a plurality of connection wirings 44 and 45 and a connection terminal 46 . A plurality of Y-direction electrodes 41 and peripheral wirings 43 are arranged in a region MA inside the product outline 15 .

A plurality of Y-direction electrodes 41 are arranged side by side in the X-direction at a predetermined pitch. Each of the Y-direction electrodes 41 includes a mesh pattern of a mesh structure in which a plurality of cells each having a plurality of fine lines 42 extending obliquely to each of the X and Y directions are regularly arranged. The plurality of cells, for example, each have a rhombus shape in plan view and are formed to have the same size as each other.

The surrounding wiring 43 is arranged so as to surround the outer periphery of the plurality of Y-direction electrodes 41 in a rectangular shape. A specific wiring shape of the peripheral wiring 33 is not particularly limited. For example, it may be ordinary straight wiring, or it may be configured with a mesh pattern of a network structure like the Y-direction electrode 41 .

The connection terminal 46 is a substantially rectangular terminal that extends in the X direction and is wider than the connection wiring 44 in plan view. The plurality of connection terminals 46 are arranged side by side in the Y direction at a predetermined pitch on both sides of the connection terminal 56 described later in the Y direction. Of the connection terminals 46 , the terminals positioned on both outer sides in the Y direction are terminals to which the connection wires 45 to which the peripheral wires 43 are connected are connected, and the terminals positioned on the inner side are connected to the respective Y direction electrodes 41 . It is a terminal to which the connected connection wiring 44 is connected. The connection wiring 45 includes a first wiring 45 a extending in the Y direction downstream of all the Y direction electrodes 41 in the transport direction (X direction).

The connection terminal 46 extends to the downstream side in the transport direction from the first wiring 45a. In addition, all the connection terminals 46 are aligned at the downstream ends in the conveying direction. Here, the connection terminal 46 connected to the Y-direction electrode 41 via the connection wiring 44 corresponds to the second wiring. A connection terminal 46 connected to the peripheral wiring 43 via the connection wiring 45 corresponds to a third wiring.

FIG. 9 shows the configuration of the conductive pattern 50 arranged on the second electrode surface 13a.

The conductive pattern 50 includes a plurality of X-direction electrodes 51 , a peripheral wiring 53 , a plurality of connection wirings 54 and 55 and a connection terminal 56 . A plurality of X-direction electrodes 51 and surrounding wiring 53 are arranged in the area MA inside the product outline 15 .

A plurality of X-direction electrodes 51 are arranged side by side in the Y-direction at a predetermined pitch. Each of the X-direction electrodes 51 includes a mesh pattern of a network structure in which a plurality of cells each formed by a plurality of fine lines 52 extending obliquely to each of the X-direction and the Y-direction are regularly arranged. The plurality of cells, for example, each have a rhombus shape in plan view and are formed to have the same size as each other.

The surrounding wiring 53 is arranged so as to surround the outer periphery of the plurality of X-direction electrodes 51 in a rectangular shape. As shown in FIG. 10, the peripheral wiring 53 is arranged so as to overlap the peripheral wiring 43 of the conductive pattern 40 described above in plan view. A specific wiring shape of the peripheral wiring 53 is not particularly limited. For example, it may be a normal linear wiring, or it may be configured with a mesh pattern of a network structure like the X-direction electrodes 51 .

The connection terminal 56 is a substantially rectangular terminal that extends in the X direction and is wider than the connection wiring 54 in plan view. Of the connection terminals 56 , the terminals positioned on both outer sides in the Y direction are connected to the connection wirings 55 to which the peripheral wirings 53 are connected, and the other terminals are connected to the connection wirings 54 connected to the respective X-direction electrodes 51 . is connected.

(Manufacturing method of pattern film)
As in the first embodiment, the patterning method of the present embodiment includes a pattern arrangement step of arranging the conductive patterns 40 and 50 on the surface of the film substrate 10, and a transport roller 63 on the surface on which the conductive pattern 40 is formed. and a step of conveying the pattern film 1 in the conveying direction while rotating it in contact. Note that the basic operations of the pattern arrangement process and the transport process are the same as those of the first embodiment, and descriptions thereof are omitted here.

In the transport step, after the conductive pattern 40 is arranged on the film substrate 10 in the pattern arrangement step, the pattern film 1 is transported while rotating the transport roller 63 in contact with the first electrode surface 12a on which the conductive pattern 40 is arranged. direction.

In this embodiment, the transport roller 63 contacts the downstream end of the connection terminal 46 in the transport direction before the Y-direction electrode 41 , the surrounding wiring 43 and the connection wirings 44 and 45 .

As described above, the transport roller 63 is grounded, and the positions of the downstream ends of the connection terminals 46 in the transport direction are aligned. Therefore, the connection terminal 46 is simultaneously grounded to the ground potential. Then, the Y-direction electrode 41 and the peripheral wiring 43 connected to the connection terminal 46 are simultaneously grounded to the ground potential. As a result, even when the conveying roller 63 contacts any one of the Y-direction electrode 41, the surrounding wiring 43, and the connection wirings 44 and 45, there is no contact between the other wiring on the first electrode surface 12a and the other Y-direction electrode 41. no potential difference occurs. As a result, for example, it is possible to avoid problems such as dielectric breakdown occurring between the connection wiring 44 and the connection wiring 45 that are close to each other. In the process of transporting the film substrate 10 in the transport direction, even when the surface of the film substrate abuts against a part of the manufacturing apparatus 60 such as the transport roller 63, that is, when the conductive pattern 40 abuts, It is possible to avoid problems such as dielectric breakdown caused by the potential difference occurring between adjacent wirings.

[Action and effect of the second embodiment]
In summary, in the present embodiment, as in the first embodiment, during the process in which the film substrate 10 is conveyed in the conveying direction, a portion of the manufacturing apparatus 60 such as the conveying roller 63 is attached to the surface of the film substrate 10 . Even when the conductive patterns 40 abut against each other, it is possible to avoid problems such as dielectric breakdown caused by a potential difference occurring between adjacent wirings.

[Other embodiments]
As described above, the embodiments have been described as examples of the technology disclosed in the present application. However, the technology in the present disclosure is not limited to this, and can be applied to embodiments in which modifications, replacements, additions, omissions, etc. are made as appropriate. Further, it is also possible to combine the components described in the above embodiments to form new embodiments.

For example, in the first embodiment described above, the peripheral wiring 23 may not be provided on the first electrode surface 12a of the imprint resin layer 12 . FIG. 12 shows a configuration example in which the peripheral wiring 23 is omitted from FIG. 2. Here, differences from the first embodiment will be mainly described.

In FIG. 12 , the conductive pattern 20 includes a plurality of Y-direction electrodes 21 and a plurality of second wirings 24 . The configurations of the Y-direction electrodes 21 and the second wirings 24 are the same as in the first embodiment.

The multiple Y-direction electrodes 21 include first electrodes and second electrodes extending in the Y-direction in parallel with each other. The second electrode is provided downstream of the first electrode in the transport direction. The second wiring 24 includes a first wiring connected to the first electrode and a second wiring connected to the second electrode.

For example, in FIG. 12, the Y-direction electrode 21 denoted by 21c corresponds to the first electrode, and the second wiring 24 denoted by 24c corresponds to "the first wiring connected to the first electrode". do. Similarly, the Y direction electrode denoted by 21d corresponds to the second electrode, and the second wiring 24 denoted by 24d corresponds to "the second wiring connected to the second electrode".

Also in FIG. 12, each second wiring 24 includes a connection wiring 24a and an additional pattern 24b. The second wirings 24 are laid apart from each other and insulated from each other.

The connection wiring 24 a connects between the Y-direction electrode 21 and one end of the connection terminal 26 . The additional pattern 24b is pulled out from the other end of the connection terminal 26 along the Y direction to the outside of the area MA, and extends toward the downstream side (X direction) in the transport direction outside the area MA. All the additional patterns 24b extend to the downstream side in the transport direction from the first wirings 23a, and are arranged such that their downstream ends are aligned.

A distance A1 from the downstream end of the electrode 21d positioned most downstream in the transport direction among the Y-direction electrodes 21 to the downstream end of the additional pattern 24b is preferably 1 mm or more. Moreover, it is preferable that the distance B1 between the product outline 15 and the wiring pattern extending in the X direction of the additional pattern 24b is 1 mm or more.

Since the "method for manufacturing a pattern film" is the same as in the first embodiment, the description thereof is omitted here.

As described above, the same effect as in the first embodiment can be obtained even in the case of omitting the peripheral wiring 23 from FIG. More specifically, in the configuration of FIG. 12 as well, the conveying roller 63 simultaneously contacts the tips of all the additional patterns 24b prior to contacting the Y-direction electrodes 21. As shown in FIG. As a result, since the Y-direction electrodes 21 are grounded to the ground potential at the same time, it is possible to avoid problems such as dielectric breakdown caused by the potential difference occurring between adjacent wirings.

Although not shown, when a plurality of conductive patterns 20 are arranged in a matrix along the X direction on the film substrate 10 as in the first embodiment described above, a plurality of conductive patterns 20 arranged in the Y direction are arranged. In the conductive pattern 20, the downstream ends in the X direction of all the second wirings 24 (corresponding to the first wirings and the second wirings) may be aligned. That is, when a plurality of conductive patterns 20 are arranged in the Y direction, the positions of the downstream ends of the additional patterns 24b of all of the plurality of conductive patterns 20 may be aligned.

INDUSTRIAL APPLICABILITY The present disclosure can be industrially applied as a pattern film for touch sensors used for input operations of various electronic devices.

1: pattern film 10: film substrate 20: conductive pattern 21a: electrode 21c: first electrode 21d: second electrode 23a: first wiring 24: second wiring 25: third wiring RF: roll film MA: area

Claims (8)

a film substrate;
A conductive pattern disposed on the surface of the film substrate,
The conductive pattern is
an electrode extending in an orthogonal direction orthogonal to the transport direction of the film substrate;
a first wiring extending in the orthogonal direction downstream of the electrode in the transport direction;
a second wiring connected to the electrode;
and a third wiring connected to the first wiring,
The second wiring and the third wiring extend further downstream in the transport direction than the first wiring, and downstream ends of the second wiring and the third wiring in the transport direction are aligned. , pattern film. a film substrate;
A conductive pattern formed on the surface of the film substrate,
The conductive pattern is
a first electrode extending in an orthogonal direction perpendicular to the transport direction of the film substrate;
a second electrode extending in the orthogonal direction downstream of the first electrode in the transport direction;
a first wiring connected to the first electrode;
and a second wiring connected to the second electrode,
The first wiring and the second wiring extend further downstream in the transport direction than the second electrode, and downstream ends of the first wiring and the second wiring in the transport direction are aligned. , pattern film. In the patterned film according to claim 1,
the electrode and the first wiring are arranged in a predetermined area,
The pattern film, wherein the second wiring and the third wiring each include an additional pattern drawn outside the region and extending to a position of a downstream end in the transport direction outside the region. In the pattern film according to claim 2,
The first electrode and the second electrode are arranged within a predetermined area,
The pattern film, wherein the first wiring and the second wiring each include an additional pattern drawn outside the region and extending to a position of a downstream end in the transport direction outside the region. In the pattern film according to claim 1 or 3,
A plurality of the conductive patterns are arranged in a matrix on the film substrate along the transport direction,
The pattern film, wherein in the plurality of conductive patterns arranged in the orthogonal direction, downstream ends of all of the second wirings and the third wirings are aligned in the conveying direction. In the pattern film according to claim 2 or 4,
A plurality of the conductive patterns are arranged in a matrix on the film substrate along the transport direction,
The pattern film, wherein in the plurality of conductive patterns arranged in the orthogonal direction, positions of downstream ends of all of the first wirings and the second wirings in the conveying direction are aligned. A roll film obtained by winding the pattern film according to any one of claims 1 to 6. A method for manufacturing a pattern film,
The pattern film comprises the film substrate according to claim 1 and the conductive pattern formed on the surface of the film substrate,
disposing the conductive pattern on the surface of the film substrate;
A method for producing a patterned film, comprising a step of conveying the patterned film in the conveying direction while bringing a conveying roller into contact with the surface on which the conductive pattern is arranged.

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