JP2022179103A - Substrate positioning structure - Google Patents

Substrate positioning structure Download PDF

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JP2022179103A
JP2022179103A JP2021086360A JP2021086360A JP2022179103A JP 2022179103 A JP2022179103 A JP 2022179103A JP 2021086360 A JP2021086360 A JP 2021086360A JP 2021086360 A JP2021086360 A JP 2021086360A JP 2022179103 A JP2022179103 A JP 2022179103A
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substrate
housing
pressing
reference pin
peripheral wall
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直輝 松村
Naoki Matsumura
英利 矢田
Hidetoshi Yada
寛人 大森
Hiroto Omori
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Aisin Corp
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Aisin Corp
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Abstract

To provide a substrate positioning structure capable of easily improving substrate positioning accuracy stored in a housing.SOLUTION: A substrate positioning structure includes a substrate 2 and a resin-made housing 1 in which the substrate 2 is stored, wherein the housing 1 has an opening to which the substrate 2 can be inserted, a bottom surface facing the opening, a peripheral wall 13 erected from the circumference of the bottom surface, a reference pin 14 erected from the bottom surface, and a plurality of pressing parts 15 which are provided so as to project inward from the inner surface of the peripheral wall 13, are brought into contact with a part of the circumference 2a of the substrate 2 stored in the housing 1 and press the substrate 2 to the inside of the peripheral wall 13, and act pressing forces P1 and P2, the substrate 2 has a through hole 22 to which the reference pin 14 is inserted, and a resultant force P3 of the plurality of pressing forces P1 and P2 acted by each of the plurality of pressing parts 15 acts on the reference pin 14 in the state where the reference pin 14 is inserted to the through hole 22, and the substrate 2 is stored in the housing 1.SELECTED DRAWING: Figure 4

Description

本発明は、筐体に収納される基板の位置決め構造に関する。 The present invention relates to a positioning structure for substrates housed in a housing.

例えば、車両に搭載されたECU(Electronic Control Unit)等の電子機器においては、基板が筐体内に収納されている。特許文献1には、基板が収納される電子機器収納ケースの構成が開示されている。特許文献1に記載の電子機器収納ケースでは、基板を収納する筐体が底面と側壁とを有する箱形状であり、側壁には内面に基板を固定するための潰しリブが分散配置されている。潰しリブは、筐体の底面に向かうにつれて内方への突出量が増大するように傾斜している。このような構成により、特許文献1の電子機器収納ケースでは、基板が筐体に形成された開口から筐体に挿入されて、基板の周縁が潰しリブの傾斜に案内されつつ潰しリブを潰すことで、当該基板は筐体の所定位置に位置決めされる。 For example, in an electronic device such as an ECU (Electronic Control Unit) mounted on a vehicle, a substrate is housed in a housing. Patent Literature 1 discloses the configuration of an electronic device storage case that stores a substrate. In the electronic device storage case described in Patent Document 1, the housing for storing the board has a box shape having a bottom surface and side walls, and crushing ribs for fixing the board to the inner surface are distributed on the side walls. The crushing rib is inclined so that the amount of inward projection increases toward the bottom surface of the housing. With such a configuration, in the electronic device storage case of Patent Document 1, the board is inserted into the housing from the opening formed in the housing, and the peripheral edge of the board is guided by the inclination of the crushing rib to crush the crushing rib. , the substrate is positioned at a predetermined position of the housing.

特開2012-9748号公報Japanese Unexamined Patent Application Publication No. 2012-9748

特許文献1に記載の電子機器収納ケースでは、潰しリブが対向する側壁に夫々配置されている。このため、対向する側壁に配置される潰しリブの一方と他方との間で潰し量に差があると、筐体に収納された基板において筐体の底面に沿う方向における収納位置にバラツキが生じる。そのため、筐体に対して基板を精度よく位置決めすることができない。 In the electronic device storage case described in Patent Document 1, the crushing ribs are arranged on the side walls facing each other. Therefore, if there is a difference in the amount of crushing between one and the other of the crushing ribs arranged on the opposing side walls, the substrates accommodated in the housing will vary in the housing position in the direction along the bottom surface of the housing. . Therefore, the substrate cannot be accurately positioned with respect to the housing.

上記実情に鑑み、筐体に収納される基板の位置精度を簡易に向上させることができる基板の位置決め構造が望まれている。 In view of the above circumstances, there is a demand for a substrate positioning structure that can easily improve the positional accuracy of substrates housed in a housing.

本発明に係る基板の位置決め構造の特徴は、基板と、前記基板が収納される樹脂製の筐体と、を備え、前記筐体は、前記基板を挿入可能な開口と、当該開口に対向する底面と、前記底面の周縁から立設される周壁と、前記底面から立設される基準ピンと、前記周壁の内面から内方に突出して設けられ、当該筐体に収納された前記基板の周縁の一部に当接して前記基板を前記周壁の前記内方に押圧して押圧力を作用させる複数の押圧部と、を有し、前記基板は、前記基準ピンが挿通される貫通孔を有し、前記貫通孔に前記基準ピンが挿通されて前記基板が前記筐体に収納された状態で、複数の前記押圧部の夫々が作用させる複数の前記押圧力の合力が前記基準ピンに作用する点にある。 A feature of the substrate positioning structure according to the present invention is that it includes a substrate and a housing made of resin in which the substrate is accommodated, and the housing has an opening into which the substrate can be inserted, and faces the opening. a bottom surface, a peripheral wall erected from a peripheral edge of the bottom surface, a reference pin erected from the bottom surface, and a peripheral edge of the substrate housed in the housing, provided so as to protrude inward from the inner surface of the peripheral wall. and a plurality of pressing portions that partly contact and press the substrate toward the inner side of the peripheral wall to apply a pressing force, and the substrate has a through hole through which the reference pin is inserted. , in a state in which the reference pin is inserted through the through hole and the substrate is accommodated in the housing, a resultant force of the plurality of pressing forces exerted by each of the plurality of pressing portions acts on the reference pin; It is in.

本構成では、筐体に収納された基板には、周縁において筐体の周壁の内側に設けられる複数の押圧部からの押圧力が作用し、更に複数の押圧部からの押圧力の合力が基板の貫通孔に挿通された基準ピンに作用する。これにより、基板は、複数の押圧部が基準ピンを押圧した状態で筐体に位置決めされる。すなわち、筐体に収納された基板は押圧部及び基準ピンに常時当接した状態で保持されるため、筐体内において基板は位置ずれし難くなる。したがって、本構成によれば、筐体に配置される基板の位置精度を容易に向上させることができる。また、本構成は、筐体に設けられた基準ピンと、筐体に設けられた複数の押圧部と、基板に形成された貫通孔のみを用いて筐体に収納される基板を位置決めする構成であるので、筐体に収納される基板の位置決め構造を簡素な構成で実現することができる。 In this configuration, the substrate accommodated in the housing is subjected to a pressing force from a plurality of pressing portions provided inside the peripheral wall of the housing at the peripheral edge, and the resultant force of the pressing forces from the plurality of pressing portions acts on the substrate. acts on the reference pin inserted through the through hole of As a result, the substrate is positioned in the housing with the plurality of pressing portions pressing the reference pins. That is, the substrate accommodated in the housing is held in contact with the pressing portion and the reference pin at all times. Therefore, according to this configuration, it is possible to easily improve the positional accuracy of the substrate arranged in the housing. Further, in this configuration, the substrate housed in the housing is positioned using only the reference pins provided in the housing, the plurality of pressing portions provided in the housing, and the through holes formed in the substrate. Therefore, the structure for positioning the substrates housed in the housing can be realized with a simple configuration.

他の特徴構成は、複数の前記押圧部は、潰しリブによって構成されている点にある。 Another characteristic configuration is that the plurality of pressing portions are configured by crushing ribs.

本構成のように、複数の押圧部が潰しリブによって構成されていると、潰しリブの潰れ量に応じて基板又は筐体の寸法公差を容易に吸収することができ、筐体における基板の保持状態を容易に安定させることができる。 As in this configuration, when the plurality of pressing portions are composed of crushing ribs, the dimensional tolerance of the substrate or the housing can be easily absorbed according to the amount of crushing of the crushing ribs, and the substrate is held in the housing. The state can be easily stabilized.

他の特徴構成は、複数の前記押圧部は、前記周壁において前記開口の側に切り込みを設けることで形成されるスナップフィットによって構成されている点にある。 Another characteristic configuration is that the plurality of pressing portions are configured by a snap fit formed by providing a notch in the peripheral wall on the side of the opening.

本構成によれば、複数の押圧部がスナップフィットによって構成されていると、スナップフィットの変形量に応じて基板又は筐体の寸法公差を容易に吸収することができ、筐体における基板の保持状態を容易に安定させることができる。 According to this configuration, when the plurality of pressing portions are configured by snap-fitting, it is possible to easily absorb the dimensional tolerance of the substrate or the housing according to the amount of deformation of the snap-fitting, thereby holding the substrate in the housing. The state can be easily stabilized.

他の特徴構成は、前記筐体の前記周壁は、平面視において多角形状であり、複数の前記押圧部は、前記周壁のうち少なくとも非平行な二つの壁部の前記内面に配置されている点にある。 Another characteristic configuration is that the peripheral wall of the housing has a polygonal shape in a plan view, and the plurality of pressing portions are arranged on the inner surfaces of at least two non-parallel wall portions of the peripheral wall. It is in.

本構成によれば、筐体の周壁が平面視において多角形状であるので、筐体に多角形状の基板を容易に収納することができる。また、複数の押圧部が周壁のうち少なくとも非平行な二つの壁部の内面に配置されると、複数の押圧部の夫々が基板を押圧することで作用する複数の押圧力の合力は一方向に作用する押圧力となる。したがって、当該合力を基準ピンに確実に作用させて基板を精度よく位置決めすることができる。また、複数の押圧部は周壁のうち少なくとも非平行な二つの壁部の内面に配置すればよいので、筐体において押圧部の数を少なくして筐体の形状を簡素にすることもできる。 According to this configuration, since the peripheral wall of the housing has a polygonal shape in a plan view, a polygonal substrate can be easily accommodated in the housing. Further, when the plurality of pressing portions are arranged on the inner surfaces of at least two non-parallel wall portions of the peripheral wall, the resultant force of the plurality of pressing forces acting when each of the plurality of pressing portions presses the substrate is unidirectional. It becomes the pressing force acting on Therefore, the resultant force can be reliably applied to the reference pin to accurately position the substrate. Moreover, since the plurality of pressing portions may be arranged on the inner surfaces of at least two non-parallel wall portions of the peripheral wall, the number of pressing portions in the housing can be reduced and the shape of the housing can be simplified.

第1実施形態に係る電子機器の斜視図である。1 is a perspective view of an electronic device according to a first embodiment; FIG. 電子機器の分解斜視図である。1 is an exploded perspective view of an electronic device; FIG. 電子機器の筐体側の平面図である。2 is a plan view of the housing side of the electronic device; FIG. 電子機器を筐体の開口側から見た平面図である。It is the top view which looked at the electronic device from the opening side of a housing|casing. 電子機器の部分断面図である。1 is a partial cross-sectional view of an electronic device; FIG. 第1実施形態の変形例における筐体の部分斜視図である。FIG. 4 is a partial perspective view of a housing in a modified example of the first embodiment; 第1実施形態の変形例の部分断面図である。It is a fragmentary sectional view of the modification of 1st Embodiment. 第2実施形態に係る電子機器を筐体の開口側から見た平面図である。It is the top view which looked at the electronic device which concerns on 2nd Embodiment from the opening side of a housing|casing. 第3実施形態に係る電子機器を筐体の開口側から見た平面図である。It is the top view which looked at the electronic device which concerns on 3rd Embodiment from the opening side of a housing|casing.

以下に、本発明に係る基板の位置決め構造の実施形態について、図面に基づいて説明する。本実施形態では、基板として回路基板を用いて説明する。ただし、以下の実施形態に限定されることなく、その要旨を逸脱しない範囲内で種々の変形が可能である。 BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of a substrate positioning structure according to the present invention will be described below with reference to the drawings. In this embodiment, a circuit board is used as a substrate for explanation. However, without being limited to the following embodiments, various modifications are possible without departing from the scope of the invention.

〔第1実施形態〕
図1~図5に示される電子機器100は、例えば、車両に搭載されるECU等である。図1に示される電子機器100は、筐体1、回路基板2(以下、「基板2」と称する。図2参照)、コネクタ3、及び、蓋体4を備えて構成される。以下では、図面に記したXを筐体1及び基板2の長手方向、Yを筐体1及び基板2の短手方向、Zを筐体1及び基板2の厚み方向として説明する。
[First Embodiment]
The electronic device 100 shown in FIGS. 1 to 5 is, for example, an ECU or the like mounted on a vehicle. An electronic device 100 shown in FIG. 1 includes a housing 1 , a circuit board 2 (hereinafter referred to as “board 2 ”; see FIG. 2 ), a connector 3 , and a lid 4 . In the following description, X is the longitudinal direction of the housing 1 and the substrate 2, Y is the lateral direction of the housing 1 and the substrate 2, and Z is the thickness direction of the housing 1 and the substrate 2.

電子機器100は、筐体1、基板2、及び蓋体4が平面視(Z方向視)において矩形状に形成されている。図2に示されるように、筐体1は、基板2を挿入可能な開口11と、開口11に対向する底面12と、底面12の周縁から底面12に対して略垂直に立設される周壁13と、を有する。開口11は周壁13の底面12とは反対の側の端部13aによって形成されている。筐体1において開口11及び底面12は矩形状に形成されている。基板2は、平面視において開口11及び底面12の面積よりも小さく、筐体1に収納可能に形成されている。 In the electronic device 100, the housing 1, the substrate 2, and the lid 4 are formed in a rectangular shape in plan view (Z direction view). As shown in FIG. 2, the housing 1 includes an opening 11 into which the substrate 2 can be inserted, a bottom surface 12 facing the opening 11, and a peripheral wall extending substantially perpendicularly from the periphery of the bottom surface 12 to the bottom surface 12. 13 and. The opening 11 is formed by an end portion 13 a of the peripheral wall 13 on the side opposite to the bottom surface 12 . The opening 11 and the bottom surface 12 of the housing 1 are formed in a rectangular shape. The substrate 2 is smaller than the area of the opening 11 and the bottom surface 12 in plan view, and is formed so as to be accommodated in the housing 1 .

基板2は、例えば樹脂製であって、入出力回路、通信回路、マイコン、電源回路などの電子部品を、板面上に備えている。基板2には、複数の接続端子32を圧入してピンヘッダ30を構成するための複数の装着孔21と、後述の基準ピン14に挿通される1つの貫通孔22と、が形成されている。 The substrate 2 is made of resin, for example, and has electronic components such as an input/output circuit, a communication circuit, a microcomputer, and a power supply circuit on its surface. The substrate 2 is formed with a plurality of mounting holes 21 into which a plurality of connection terminals 32 are press-fitted to form the pin header 30, and one through hole 22 through which a reference pin 14, which will be described later, is inserted.

コネクタ3は、基板2に圧入されたピンヘッダ30と、筐体1に設けられたコネクタハウジング部31とによって構成される。電子機器100において、コネクタ3は基板2を外部装置(不図示)に電気的に接続するために備えられている。筐体1の底面12には、開口部33を有し外方に突設する筒状のコネクタハウジング部31が形成されている。図1~図3に示されるように、本実施形態では、基板2に3つのピンヘッダ30が形成され、筐体1には各々のピンヘッダ30に対応する3つのコネクタハウジング部31が設けられることにより、3つのコネクタ3が構成されている。ピンヘッダ30を構成する複数の接続端子32の一方端が複数の装着孔21に圧入されて基板2上に形成された電気回路と接続され、接続端子32の他方端が対応するコネクタハウジング部31の開口部33から露出することにより、コネクタ3を介して基板2と外部装置(不図示)とが電気的に接続可能に構成されている(図3参照)。 The connector 3 is composed of a pin header 30 press-fitted into the substrate 2 and a connector housing portion 31 provided in the housing 1 . In the electronic device 100, the connector 3 is provided for electrically connecting the board 2 to an external device (not shown). A tubular connector housing portion 31 having an opening 33 and projecting outward is formed on the bottom surface 12 of the housing 1 . As shown in FIGS. 1 to 3, in this embodiment, the board 2 is formed with three pin headers 30, and the housing 1 is provided with three connector housing portions 31 corresponding to the respective pin headers 30. , three connectors 3 are configured. One ends of the plurality of connection terminals 32 forming the pin header 30 are press-fitted into the plurality of mounting holes 21 to be connected to the electric circuit formed on the substrate 2 , and the other ends of the connection terminals 32 are connected to the corresponding connector housing portion 31 . By exposing from the opening 33, the board 2 and an external device (not shown) can be electrically connected via the connector 3 (see FIG. 3).

図1及び図2に示されるように、蓋体4は筐体1の開口11を覆うために設けられている。互いに対向する蓋体4と筐体1には、例えば一方に係合部(不図示)が設けられ他方に被係合部(不図示)が設けられ、蓋体4は係合部と被係合部との係合により筐体1に固定可能に構成されている。 As shown in FIGS. 1 and 2, the lid 4 is provided to cover the opening 11 of the housing 1. As shown in FIG. The lid body 4 and the housing 1 facing each other are provided with, for example, an engaging part (not shown) on one side and an engaged part (not shown) on the other side, and the lid body 4 is engaged with the engaging part. It is configured to be fixable to the housing 1 by engagement with the joint.

筐体1は、例えば、PBT樹脂等で形成され、蓋体4は、例えば、アルミニウム、ステンレス鋼、PBT樹脂等で形成される。筐体1の底面12には補強用のリブ12aが格子状に形成されている。また、筐体1の底面12には、基板2の板面が当接可能な受けリブ(不図示)が分散配置されている。 The housing 1 is made of, for example, PBT resin, and the lid 4 is made of, for example, aluminum, stainless steel, PBT resin, or the like. A reinforcing rib 12a is formed in a lattice on the bottom surface 12 of the housing 1. As shown in FIG. Further, on the bottom surface 12 of the housing 1, receiving ribs (not shown) with which the plate surface of the substrate 2 can come into contact are distributed.

図2及び図4に示されるように、筐体1は平面視において周壁13が矩形状に形成されており、周壁13は矩形の辺部に相当する位置に4つの壁部13A~13Dを有する。基板2は、周縁2aとして、図4に示される平面視において、上辺部分に相当する第1辺部2A、右辺部分に相当する第2辺部2B、下辺部分に相当する第3辺部2C、及び、左辺部分に相当する第4辺部2Dを、夫々有する。周壁13の4つの壁部13A~13Dと基板2の周縁2aの4つの辺部2A~2Dとは、基板2が筐体1に収納された状態で、第1壁部13Aと第1辺部2A、第2壁部13Bと第2辺部2B、第3壁部13Cと第3辺部2C、第4壁部13Dと第4辺部2Dとが夫々対向する。第1壁部13Aと第1辺部2A、及び、第3壁部13Cと第3辺部2CはX方向に沿って延出し、第2壁部13Bと第2辺部2B、及び、第4壁部13Dと第4辺部2DはY方向に沿って延出している。 As shown in FIGS. 2 and 4, the housing 1 has a peripheral wall 13 formed in a rectangular shape in plan view, and the peripheral wall 13 has four walls 13A to 13D at positions corresponding to sides of the rectangle. . The substrate 2 has, as the peripheral edge 2a, a first side portion 2A corresponding to the upper side portion, a second side portion 2B corresponding to the right side portion, a third side portion 2C corresponding to the lower side portion, in plan view shown in FIG. and a fourth side portion 2D corresponding to the left side portion. The four wall portions 13A to 13D of the peripheral wall 13 and the four side portions 2A to 2D of the peripheral edge 2a of the substrate 2 are arranged to form the first wall portion 13A and the first side portion when the substrate 2 is accommodated in the housing 1. 2A, the second wall portion 13B and the second side portion 2B, the third wall portion 13C and the third side portion 2C, and the fourth wall portion 13D and the fourth side portion 2D face each other. The first wall portion 13A and the first side portion 2A, the third wall portion 13C and the third side portion 2C extend along the X direction, the second wall portion 13B and the second side portion 2B, and the fourth side portion 13B extend along the X direction. The wall portion 13D and the fourth side portion 2D extend along the Y direction.

筐体1は、底面12から立設される基準ピン14と、周壁13の内面から内方に突出して設けられる複数の押圧部15と、を有する。基準ピン14は、基板2に形成された貫通孔22に挿通可能な位置に形成されている。ここで、図4に示すように、X方向のうち、第4壁部13Dと第4辺部2Dに向かう方向をX1方向、第2壁部13Bと第2辺部2Bに向かう方向をX2方向と称し、Y方向のうち、第3壁部13Cと第3辺部2Cに向かう方向をY1方向、第1壁部13Aと第1辺部2Aに向かう方向をY2方向と称する。そして、平面視で筐体1、基板2の中心からX1方向に位置する部分をX1側、X2方向に位置する部分をX2側と称し、平面視で筐体1、基板2の中心からY1方向に位置する部分をY1側、Y2方向に位置する部分をY2側と称する。本実施形態では、図2及び図4に示されるように、基準ピン14は、底面12におけるX方向のX1側の第4壁部13D近くであってY方向のY2側の位置に配置されている。また、基板2の貫通孔22は、第1辺部2AのX1側であって第4辺部2DのY2側の位置に配置されており、基準ピン14に対応する位置に形成されている。基準ピン14は例えば筐体1に一体成形されている。基準ピン14は、筐体1とは別材料(例えば金属)で構成されて筐体1に埋設された状態で設けられてもよい。 The housing 1 has a reference pin 14 erected from the bottom surface 12 and a plurality of pressing portions 15 protruding inward from the inner surface of the peripheral wall 13 . The reference pin 14 is formed at a position that can be inserted through a through hole 22 formed in the substrate 2 . Here, as shown in FIG. 4, of the X directions, the direction toward the fourth wall portion 13D and the fourth side portion 2D is the X1 direction, and the direction toward the second wall portion 13B and the second side portion 2B is the X2 direction. Among the Y directions, the direction toward the third wall portion 13C and the third side portion 2C is called the Y1 direction, and the direction toward the first wall portion 13A and the first side portion 2A is called the Y2 direction. A portion located in the X1 direction from the center of the housing 1 and the substrate 2 in plan view is called the X1 side, and a portion located in the X2 direction is called the X2 side. The portion located in the Y1 direction is called the Y1 side, and the portion located in the Y2 direction is called the Y2 side. In this embodiment, as shown in FIGS. 2 and 4, the reference pin 14 is arranged at a position on the bottom surface 12 near the fourth wall portion 13D on the X1 side in the X direction and on the Y2 side in the Y direction. there is The through-hole 22 of the substrate 2 is arranged on the X1 side of the first side portion 2A and on the Y2 side of the fourth side portion 2D, and is formed at a position corresponding to the reference pin 14 . The reference pin 14 is integrally formed with the housing 1, for example. The reference pin 14 may be made of a material (for example, metal) different from that of the housing 1 and may be embedded in the housing 1 .

複数の押圧部15は、筐体1に収納された基板2の周縁2aの一部に当接して基板2を周壁13の内方に押圧して押圧力Pを作用させる。本実施形態では、複数の押圧部15は、4つの壁部13A~13Dのうち第2壁部13B及び第3壁部13Cに1つずつ設けられている。具体的には、第2壁部13Bの内面に1つの押圧部15aが設けられ、第3壁部13Cの内面に1つの押圧部15bが設けられている。すなわち、複数の押圧部15は、非平行な二つの壁部13B,13Cの内面に配置されている。本実施形態では、二つの壁部13B,13Cは直交する関係にある。 The plurality of pressing portions 15 abut against a portion of the peripheral edge 2a of the substrate 2 accommodated in the housing 1 to press the substrate 2 inward of the peripheral wall 13 to apply a pressing force P. As shown in FIG. In this embodiment, the plurality of pressing portions 15 are provided one each on the second wall portion 13B and the third wall portion 13C among the four wall portions 13A to 13D. Specifically, one pressing portion 15a is provided on the inner surface of the second wall portion 13B, and one pressing portion 15b is provided on the inner surface of the third wall portion 13C. That is, the plurality of pressing portions 15 are arranged on the inner surfaces of the two non-parallel wall portions 13B and 13C. In this embodiment, the two walls 13B and 13C are orthogonal to each other.

図2に示されるように、押圧部15は潰しリブによって構成されている。潰しリブである押圧部15は、底面12から立設されて角柱状に形成されており、開口11側の上部に開口11から底面12に向かうほど周壁13の内方に向かう傾斜部16が設けられている。複数の押圧部15が潰しリブによって構成されていると、潰しリブの潰れ量に応じて基板2又は筐体1の寸法公差を容易に吸収することができ、筐体1における基板2の保持状態を容易に安定させることができる。 As shown in FIG. 2, the pressing portion 15 is composed of crushing ribs. The pressing portion 15, which is a crushing rib, is erected from the bottom surface 12 and formed in a prism shape, and an inclined portion 16 directed inward of the peripheral wall 13 from the opening 11 toward the bottom surface 12 is provided on the upper portion of the opening 11 side. It is When the plurality of pressing portions 15 are composed of crushing ribs, the dimensional tolerance of the substrate 2 or the housing 1 can be easily absorbed according to the amount of crushing of the crushing ribs, and the substrate 2 is held in the housing 1. can be easily stabilized.

次に、筐体1に対する基板2の組付け手順について説明する。基板2は、筐体1の開口11から筐体1内へ挿入され、基板2の貫通孔22に基準ピン14が挿通されつつ、底面12に向けて押し付けられる。その際、基準ピン14の先端を先細り形状にすると、基板2の貫通孔22に基準ピン14を容易に挿し込むことができる。 Next, a procedure for assembling the substrate 2 to the housing 1 will be described. The substrate 2 is inserted into the housing 1 through the opening 11 of the housing 1 and pressed toward the bottom surface 12 while the reference pins 14 are inserted through the through holes 22 of the substrate 2 . At that time, if the tip of the reference pin 14 is tapered, the reference pin 14 can be easily inserted into the through hole 22 of the substrate 2 .

基板2は、基準ピン14に挿通されてから不図示の受けリブ上に載置されるまで、基板2の周縁2aが押圧部15の傾斜部16を潰しつつ、底面12側へ向かって嵌め込まれる。図5は、基板2が受けリブ上に載置された状態を示す。このとき、複数の押圧部15(傾斜部16)は、筐体1に収納された基板2の周縁2aの一部に当接して基板2を周壁13の内方に押圧する。図4に示すように、複数の押圧部15のうち、第2壁部13Bの内側に設けられた押圧部15aによる押圧力P1は、X1方向に向けて作用し、第3壁部13Cの内側に設けられた押圧部15bによる押圧力P2は、Y2方向に向けて作用する。したがって、押圧力P1と押圧力P2との合力P3(=P1+P2)は一方向(図4における左上方向)に作用する押圧力となる。 The substrate 2 is fitted toward the bottom surface 12 while the peripheral edge 2a of the substrate 2 crushes the inclined portion 16 of the pressing portion 15 until it is placed on the receiving rib (not shown) after it is inserted through the reference pin 14. . FIG. 5 shows the substrate 2 placed on the receiving ribs. At this time, the plurality of pressing portions 15 (inclined portions 16 ) come into contact with part of the peripheral edge 2 a of the substrate 2 accommodated in the housing 1 and press the substrate 2 inward of the peripheral wall 13 . As shown in FIG. 4, the pressing force P1 by the pressing portion 15a provided inside the second wall portion 13B among the plurality of pressing portions 15 acts in the X1 direction, A pressing force P2 by the pressing portion 15b provided at 1 acts in the Y2 direction. Therefore, the resultant force P3 (=P1+P2) of the pressing force P1 and the pressing force P2 is a pressing force acting in one direction (upper left direction in FIG. 4).

基板2は、貫通孔22に基準ピン14が挿通されて筐体1に収納された状態で、押圧力P1と押圧力P2との合力P3が基準ピン14に作用する。ここで、図4を参照し、基準ピン14(貫通孔22)と複数の押圧部15a,15bとの位置関係を見ると、基準ピン14(貫通孔22)は、第2壁部13Bの押圧部15aよりもY2側に位置し、第3壁部13Cの押圧部15bよりもX1側に位置する。この位置に基準ピン14を設けると、合力P3と同じ大きさで逆方向の力(反力P4)を基準ピン14から基板2に作用させることができる。したがって、押圧力P1と押圧力P2との合力P3は、基準ピン14周りに基板2を回動させるようには作用せず、反力P4と釣り合うように作用する。したがって、基準ピン14と基板2とが押し合った状態で力が釣り合うので、筐体1に対して基板2は動くことなく、保持状態が維持される。 The substrate 2 is accommodated in the housing 1 with the reference pin 14 inserted through the through hole 22 , and the resultant force P 3 of the pressing force P 1 and the pressing force P 2 acts on the reference pin 14 . Here, referring to FIG. 4, looking at the positional relationship between the reference pin 14 (through hole 22) and the plurality of pressing portions 15a and 15b, the reference pin 14 (through hole 22) presses the second wall portion 13B. It is located on the Y2 side of the portion 15a, and is located on the X1 side of the pressing portion 15b of the third wall portion 13C. If the reference pin 14 is provided at this position, a force (reaction force P4) of the same magnitude as the resultant force P3 and in the opposite direction can be applied from the reference pin 14 to the substrate 2. FIG. Therefore, the resultant force P3 of the pressing force P1 and the pressing force P2 does not act to rotate the substrate 2 around the reference pin 14, but acts so as to balance with the reaction force P4. Therefore, since the forces are balanced when the reference pin 14 and the substrate 2 are pressed against each other, the substrate 2 does not move with respect to the housing 1 and the held state is maintained.

このように、基板2は、複数の押圧部15a,15bからの押圧力P(P1,P2)を受けて基準ピン14に押し付けられた状態で筐体1に位置決めされる。すなわち、筐体1に収納された基板2は押圧部15a,15b及び基準ピン14に常時当接した状態で合力P3と反力P4とが釣り合うため、基板2は位置ずれし難くなる。したがって、筐体1に配置される基板2の位置精度を向上させることができる。その結果、本実施形態の電子機器100では、筐体1に設けられたコネクタハウジング部31に、基板2に装着されたピンヘッダ30を精度よく位置合わせすることができる。また、本実施形態は、筐体1に設けられた基準ピン14と、筐体1に設けられた複数の押圧部15a,15bと、基板2に形成された貫通孔22のみを用いて筐体1に収納される基板2を位置決めする構成であるので、基板2の位置決め構造を簡素な構成で実現することができる。 Thus, the substrate 2 is positioned in the housing 1 while being pressed against the reference pins 14 by receiving the pressing forces P (P1, P2) from the plurality of pressing portions 15a, 15b. That is, since the resultant force P3 and the reaction force P4 are balanced while the substrate 2 accommodated in the housing 1 is in constant contact with the pressing portions 15a and 15b and the reference pin 14, the substrate 2 is less likely to be displaced. Therefore, it is possible to improve the positional accuracy of the substrate 2 arranged in the housing 1 . As a result, in the electronic device 100 of the present embodiment, the pin header 30 mounted on the board 2 can be aligned with the connector housing portion 31 provided on the housing 1 with high accuracy. Further, in the present embodiment, only the reference pin 14 provided in the housing 1, the plurality of pressing portions 15a and 15b provided in the housing 1, and the through hole 22 formed in the substrate 2 are used to adjust the housing. 1, the positioning structure of the substrate 2 can be realized with a simple configuration.

また、複数の押圧部15a,15bが周壁13のうち非平行な二つの壁部13B、13Cの内面に配置されることで、複数の押圧部15a,15bの夫々が基板2を押圧することで作用する複数の押圧力P1,P2の合力P3は、確実に一方向に作用する押圧力となる。そして、合力P3に対する反力P4を基板2に作用させることができる位置に基準ピン14を設けることにより、当該合力P3を基準ピン14に確実に作用させ且つ基準ピン14から基板2に反力P4を作用させて、基板2を筐体1に対して精度よく位置決めすることができる。また、複数の押圧部15a、15bは周壁13のうち少なくとも非平行な二つの壁部13B,13Cの内面に配置すればよいので、筐体1において押圧部15の数を少なくして筐体1の形状を簡素にすることもできる。 Further, by arranging the plurality of pressing portions 15a and 15b on the inner surfaces of the two non-parallel wall portions 13B and 13C of the peripheral wall 13, the plurality of pressing portions 15a and 15b press the substrate 2, respectively. A resultant force P3 of a plurality of acting pressing forces P1 and P2 is a pressing force that reliably acts in one direction. By providing the reference pin 14 at a position where the reaction force P4 to the resultant force P3 can be applied to the substrate 2, the resultant force P3 can be reliably applied to the reference pin 14 and the reaction force P4 from the reference pin 14 to the substrate 2 can be applied. can be applied to accurately position the substrate 2 with respect to the housing 1 . Further, since the plurality of pressing portions 15a and 15b can be arranged on the inner surfaces of at least two non-parallel wall portions 13B and 13C of the peripheral wall 13, the number of pressing portions 15 in the housing 1 can be reduced and the housing 1 can be can be simplified.

〔第1実施形態の変形例〕
図6及び図7に示されるように、複数の押圧部15は、周壁13において開口11の側に切り込み17を設けることで形成されるスナップフィット18によって構成されてもよい。図6に示されるように、スナップフィット18を形成する2つの切り込み17は底面12に向けて直線状に設けられている。2つの切り込み17の間に形成されるスナップフィット18は、開口11の側に周壁13の内面よりも内方に突出する直方体状の押圧部分19を有する。押圧部分19は開口11の側に底面12に向かうほど周壁13の内方に向かう傾斜部19aと、傾斜部19aに連続し底面12に対して垂直方向に延設される当接部19bと、を有する。
[Modification of First Embodiment]
As shown in FIGS. 6 and 7 , the plurality of pressing portions 15 may be configured by snap fits 18 formed by providing cuts 17 in the peripheral wall 13 on the side of the opening 11 . As shown in FIG. 6, two notches 17 forming snap fits 18 are provided in a straight line toward the bottom surface 12 . A snap fit 18 formed between the two cuts 17 has a rectangular parallelepiped pressing portion 19 protruding inwardly from the inner surface of the peripheral wall 13 on the opening 11 side. The pressing portion 19 has an inclined portion 19a extending toward the inner side of the peripheral wall 13 toward the bottom surface 12 on the side of the opening 11, a contact portion 19b continuing from the inclined portion 19a and extending in a direction perpendicular to the bottom surface 12, have

図7に示されるように、筐体1に収容されて不図示の受けリブ上に載置された状態の基板2は、周縁2aが筐体1においてスナップフィット18の当接部19bに当接した状態で保持される。このように、複数の押圧部15がスナップフィット18によって構成されていると、スナップフィット18の変形量に応じて基板2又は筐体1の寸法公差を容易に吸収することができ、筐体1における基板2の保持状態を容易に安定させることができる。 As shown in FIG. 7, the substrate 2 accommodated in the housing 1 and placed on receiving ribs (not shown) has its peripheral edge 2a contact the contact portion 19b of the snap fit 18 in the housing 1. It is kept in the same state. In this way, when the plurality of pressing portions 15 are configured by the snap-fits 18, the dimensional tolerance of the substrate 2 or the housing 1 can be easily absorbed according to the deformation amount of the snap-fits 18, and the housing 1 can be can easily stabilize the holding state of the substrate 2 in .

〔第2実施形態〕
第1実施形態では、筐体1において、複数の押圧部15として、第2壁部13Bの内面に1つの押圧部15aを設け、第3壁部13Cの内面に1つの押圧部15bを設ける例を示したが、図8に示されるように、第2壁部13B及び第3壁部13Cの内面に押圧部15を複数ずつ設けてもよい。なお、図8に示される第2実施形態は、筐体1及び基板2がコネクタ3を有しない構成であり、基準ピン14の位置及び押圧部15の数以外の構成については第1実施形態と同様である。第2実施形態では、第2壁部13Bの内面に2つの押圧部15a1、15a2が間隔を空けて設けられ、第3壁部13Cの内面に2つの押圧部15b1、15b2が間隔を空けて設けられている。
[Second embodiment]
In the first embodiment, as the plurality of pressing portions 15 in the housing 1, one pressing portion 15a is provided on the inner surface of the second wall portion 13B, and one pressing portion 15b is provided on the inner surface of the third wall portion 13C. However, as shown in FIG. 8, a plurality of pressing portions 15 may be provided on each of the inner surfaces of the second wall portion 13B and the third wall portion 13C. The second embodiment shown in FIG. 8 has a configuration in which the housing 1 and the substrate 2 do not have the connector 3, and the configuration other than the position of the reference pin 14 and the number of the pressing portions 15 is the same as in the first embodiment. It is the same. In the second embodiment, two pressing portions 15a1 and 15a2 are provided at intervals on the inner surface of the second wall portion 13B, and two pressing portions 15b1 and 15b2 are provided at intervals on the inner surface of the third wall portion 13C. It is

図8に示されるように、筐体1には、X方向のX1側及びY方向のY2側の角部に基準ピン14が設けられ、基板2においても基準ピン14に対応する位置に貫通孔22が形成されている。第2実施形態においても、基板2は、基準ピン14に挿通されてから不図示の受けリブ上に載置されるまで、基板2の周縁2a(第2辺部2B及び第3辺部2C)が押圧部15を潰しつつ、底面12側へ嵌め込まれる。このとき、複数の押圧部15の傾斜部16は、筐体1に収納された基板2の周縁2a(第2辺部2B及び第3辺部2C)の一部に当接して基板2を周壁13の内方に押圧する。複数の押圧部15のうち、第2壁部13Bの内側に設けられた押圧部15a1,15a2による押圧力P1は、X1方向に向けて作用し、第3壁部13Cの内側に設けられた押圧部15b1,15b2による押圧力P2は、Y2方向に向けて作用する。したがって、押圧力P1と押圧力P2との合力P3は一方向に作用する押圧力となる。 As shown in FIG. 8, the housing 1 is provided with reference pins 14 at the corners on the X1 side in the X direction and the Y2 side in the Y direction. 22 are formed. Also in the second embodiment, the peripheral edge 2a (the second side portion 2B and the third side portion 2C) of the substrate 2 is maintained until the substrate 2 is placed on receiving ribs (not shown) after the substrate 2 is inserted through the reference pins 14. is fitted to the bottom surface 12 side while crushing the pressing portion 15 . At this time, the inclined portions 16 of the plurality of pressing portions 15 come into contact with part of the peripheral edge 2a (the second side portion 2B and the third side portion 2C) of the substrate 2 housed in the housing 1, thereby pushing the substrate 2 into the peripheral wall. 13 is pressed inward. Of the plurality of pressing portions 15, the pressing force P1 by the pressing portions 15a1 and 15a2 provided inside the second wall portion 13B acts in the X1 direction, and the pressing force P1 provided inside the third wall portion 13C is applied. A pressing force P2 by the portions 15b1 and 15b2 acts in the Y2 direction. Therefore, the resultant force P3 of the pressing force P1 and the pressing force P2 is a pressing force acting in one direction.

こうして、基板2は、貫通孔22に基準ピン14が挿通されて筐体1に収納された状態で、押圧力P1と押圧力P2との合力P3が基準ピン14に作用する。ここで、図8を参照し、基準ピン14(貫通孔22)と複数の押圧部15a1,15a2,15b1,15b2との位置関係を見ると、基準ピン14(貫通孔22)は、第2壁部13Bの押圧部15a1と押圧部15a2との中間位置Q1よりもY2側に位置し、第3壁部13Cの押圧部15b1と押圧部15b2との中間位置Q2よりもX1側に位置する。この位置に基準ピン14を設けると、合力P3と同じ大きさで逆方向の力(反力P4)を基準ピン14から基板2に作用させることができる。したがって、押圧力P1と押圧力P2との合力P3は、基準ピン14周りに基板2を回動させるようには作用せず、反力P4と釣り合うように作用する。したがって、基準ピン14と基板2とが押し合った状態で力が釣り合うので、筐体1に対して基板2は動くことなく、保持状態が維持される。 In this way, the board 2 is accommodated in the housing 1 with the reference pin 14 inserted through the through hole 22 , and the resultant force P3 of the pressing force P1 and the pressing force P2 acts on the reference pin 14 . Here, referring to FIG. 8, looking at the positional relationship between the reference pin 14 (through hole 22) and the plurality of pressing portions 15a1, 15a2, 15b1, and 15b2, the reference pin 14 (through hole 22) It is located on the Y2 side of the intermediate position Q1 between the pressing portions 15a1 and 15a2 of the portion 13B, and is located on the X1 side of the intermediate position Q2 between the pressing portions 15b1 and 15b2 of the third wall portion 13C. If the reference pin 14 is provided at this position, a force (reaction force P4) of the same magnitude as the resultant force P3 and in the opposite direction can be applied from the reference pin 14 to the substrate 2. FIG. Therefore, the resultant force P3 of the pressing force P1 and the pressing force P2 does not act to rotate the substrate 2 around the reference pin 14, but acts so as to balance with the reaction force P4. Therefore, since the forces are balanced when the reference pin 14 and the substrate 2 are pressed against each other, the substrate 2 does not move with respect to the housing 1 and the held state is maintained.

このように、第2実施形態においても、基板2は、複数の押圧部15からの押圧力Pを受けて基準ピン14に押し付けられた状態で筐体1に位置決めされる。すなわち、筐体1に収納された基板2は押圧部15a1,15a2,15b1,15b2及び基準ピン14に常時当接した状態で合力P3と反力P4とが釣り合うため、基板2は位置ずれし難くなる。したがって、筐体1に配置される基板2の位置精度を向上させることができる。 Thus, also in the second embodiment, the substrate 2 is positioned in the housing 1 while being pressed against the reference pins 14 by receiving the pressing force P from the plurality of pressing portions 15 . That is, since the resultant force P3 and the reaction force P4 are balanced in a state in which the substrate 2 accommodated in the housing 1 is always in contact with the pressing portions 15a1, 15a2, 15b1, 15b2 and the reference pin 14, the substrate 2 is difficult to be displaced. Become. Therefore, it is possible to improve the positional accuracy of the substrate 2 arranged in the housing 1 .

〔第3実施形態〕
第1実施形態及び第2実施形態では、筐体1に基準ピン14を1つ設ける例を示したが、図9に示されるように、基準ピン14は2つであってもよい。なお、図9に示される第3実施形態は、基準ピン14及び貫通孔22以外の構成については第2実施形態と同様である。第3実施形態では、筐体1には2つの基準ピン14a,14bが設けられ、基板2には第1基準ピン14aが挿通される第1貫通孔22aと、第2基準ピン14bが挿通される第2貫通孔22bとが形成されている。第1貫通孔22aは、X1側であってY2側の第1辺部2A近くに配置され、X方向に沿って延びる長円形状に形成されている。第2貫通孔22bは、X1側の第4辺部2D近くでY方向の中央付近に配置され、Y方向に沿って延びる長円形状に形成されている。これにより、基準ピン14a,14bは貫通孔22a,22bに挿通され易くなる。
[Third Embodiment]
In the first and second embodiments, an example in which one reference pin 14 is provided on the housing 1 is shown, but two reference pins 14 may be provided as shown in FIG. The third embodiment shown in FIG. 9 has the same configuration as the second embodiment except for the reference pin 14 and the through hole 22. As shown in FIG. In the third embodiment, the housing 1 is provided with two reference pins 14a and 14b, and the substrate 2 is provided with a first through hole 22a through which the first reference pin 14a is inserted and a second reference pin 14b. and a second through hole 22b are formed. The first through hole 22a is arranged on the X1 side and near the first side portion 2A on the Y2 side, and is formed in an oval shape extending along the X direction. The second through-hole 22b is arranged in the vicinity of the center in the Y direction near the fourth side 2D on the X1 side, and is formed in an oval shape extending along the Y direction. This facilitates insertion of the reference pins 14a and 14b into the through holes 22a and 22b.

本実施形態では、基板2は、第1貫通孔22aに第1基準ピン14aが挿通され、第2貫通孔22bに第2基準ピン14bが挿通されて筐体1に収納された状態で、押圧部15a1,15a2による押圧力P1を第2基準ピン14bに作用させることができ、押圧部15b1、15b2による押圧力P2を第1基準ピン14aに作用させることができる。この位置に第1基準ピン14aを設けると、押圧力P2と同じ大きさで逆方向の力(反力P5)を第1基準ピン14aから基板2に作用させることができる。また、この位置に第2基準ピン14bを設けると、押圧力P1と同じ大きさで逆方向の力(反力P6)を第2基準ピン14bから基板2に作用させることができる。これにより、基板2は、筐体1内において、複数の押圧部15及び2つの基準ピン14a,14bによって底面12に沿う方向の移動が規制され、筐体1の内部において精度よく位置決めすることができる。 In this embodiment, the substrate 2 is housed in the housing 1 with the first reference pin 14a inserted through the first through hole 22a and the second reference pin 14b inserted through the second through hole 22b. A pressing force P1 by the portions 15a1 and 15a2 can be applied to the second reference pin 14b, and a pressing force P2 by the pressing portions 15b1 and 15b2 can be applied to the first reference pin 14a. If the first reference pin 14a is provided at this position, a force (reaction force P5) having the same magnitude as the pressing force P2 and in the opposite direction can be applied from the first reference pin 14a to the substrate 2. FIG. Further, if the second reference pin 14b is provided at this position, a force (reaction force P6) having the same magnitude as the pressing force P1 and in the opposite direction can be applied to the substrate 2 from the second reference pin 14b. As a result, the movement of the substrate 2 in the direction along the bottom surface 12 is restricted by the plurality of pressing portions 15 and the two reference pins 14a and 14b inside the housing 1, so that the substrate 2 can be accurately positioned inside the housing 1. can.

また、基準ピン14として筐体1に2つの基準ピン14a,14bを設け、基準ピン14が挿通される貫通孔22として基板2に2つの貫通孔22a、22bを形成することで、基準ピン14及び貫通孔22の耐久性を向上させることもできる。 Two reference pins 14 a and 14 b are provided in the housing 1 as the reference pins 14 , and two through holes 22 a and 22 b are formed in the substrate 2 as the through holes 22 through which the reference pins 14 are inserted. And the durability of the through-holes 22 can also be improved.

〔他の実施形態〕
(1)上記の実施形態では、筐体1の周壁13が平面視において矩形状に形成される例を示したが、筐体1の周壁13の形状は平面視において矩形状に限定されず、三角形や五角形以上の多角形状でもよい。また、複数の押圧部15は周壁13のうち少なくとも非平行な二つの壁部の内面に配置されていればよい。
[Other embodiments]
(1) In the above embodiment, an example in which the peripheral wall 13 of the housing 1 is formed in a rectangular shape in plan view is shown, but the shape of the peripheral wall 13 of the housing 1 is not limited to a rectangular shape in plan view. A polygonal shape such as a triangle or a pentagon or more may be used. Moreover, the plurality of pressing portions 15 may be arranged on the inner surfaces of at least two non-parallel wall portions of the peripheral wall 13 .

筐体1の周壁13を平面視において多角形状にすることで、筐体1に多角形状の基板2を収納し易くなる。また、複数の押圧部15が周壁13のうち少なくとも非平行な二つの壁部の内面に配置されると、複数の押圧部15の夫々が基板2を押圧することで作用する複数の押圧力Pの合力は、ゼロとはならず一方向に作用する押圧力となる。したがって、当該合力を基準ピン14に確実に作用させて基板2を精度よく位置決めすることができる。また、複数の押圧部15は周壁13のうち少なくとも非平行な二つの壁部の内面に配置すればよいので、筐体1の周壁13に設ける押圧部15の数を少なくして筐体1の形状を簡素にすることもできる。なお、筐体1の周壁13の形状が五角形以上の多角形状である場合には、複数の押圧部15の夫々が基板2に作用させる複数の押圧力Pの合力が一方向に作用する押圧力であれば、複数の押圧部15が周壁13のうち非平行な3つ以上の壁部の内面に配置されていてもよい。 By forming the peripheral wall 13 of the housing 1 into a polygonal shape in a plan view, it becomes easy to accommodate the polygonal substrate 2 in the housing 1 . Further, when the plurality of pressing portions 15 are arranged on the inner surfaces of at least two non-parallel wall portions of the peripheral wall 13 , the plurality of pressing portions 15 press the substrate 2 to generate a plurality of pressing forces P is a pressing force that acts in one direction and does not become zero. Therefore, the resultant force can be reliably applied to the reference pin 14 to accurately position the substrate 2 . In addition, since the plurality of pressing portions 15 may be arranged on the inner surfaces of at least two non-parallel wall portions of the peripheral wall 13, the number of pressing portions 15 provided on the peripheral wall 13 of the housing 1 can be reduced. The shape can also be simplified. When the shape of the peripheral wall 13 of the housing 1 is a polygonal shape of a pentagon or more, the resultant force of the plurality of pressing forces P applied to the substrate 2 by each of the plurality of pressing portions 15 acts in one direction. If so, the plurality of pressing portions 15 may be arranged on the inner surfaces of three or more non-parallel wall portions of the peripheral wall 13 .

(2)上記の実施形態では、筐体1に形成された基準ピン14が円柱状である例を示したが、基準ピン14は角柱状、楕円柱状、扇形柱状等、他の形状であってもよい。 (2) In the above-described embodiment, the reference pin 14 formed in the housing 1 has a columnar shape. good too.

(3)上記の実施形態では、複数の押圧部15として、第2壁部13Bの内面に1つ又は2つの押圧部15a(15a1,15a2)を設け、第3壁部13Cの内面に1つ又は2つの押圧部15b(15b1,15b2)を設ける例を示したが、第2壁部13B及び第3壁部13Cの内面に押圧部15を3つ以上配置してもよいし、第2壁部13B及び第3壁部13Cの内面において異なる数の押圧部15を配置してもよい。 (3) In the above embodiment, as the plurality of pressing portions 15, one or two pressing portions 15a (15a1, 15a2) are provided on the inner surface of the second wall portion 13B, and one pressing portion 15a (15a1, 15a2) is provided on the inner surface of the third wall portion 13C. Alternatively, although an example in which two pressing portions 15b (15b1, 15b2) are provided has been shown, three or more pressing portions 15 may be arranged on the inner surfaces of the second wall portion 13B and the third wall portion 13C. A different number of pressing portions 15 may be arranged on the inner surfaces of the portion 13B and the third wall portion 13C.

(4)上記の実施形態では、基板2が樹脂製の回路基板である例を示したが、基板2は金属等樹脂以外で構成されていてもよく回路基板以外であってもよい。第1実施形態では、コネクタ3として、筐体1にコネクタハウジング部31を設けて基板2にピンヘッダ30を圧入する例に示したが、筐体1及び基板2はコネクタ3に係る構成を有しない形態であってもよい。 (4) In the above embodiment, the board 2 is a circuit board made of resin. In the first embodiment, the case 1 is provided with the connector housing portion 31 and the board 2 is press-fitted with the pin header 30 as the connector 3 . may be in the form

本発明は、筐体に対する各種基板の位置決めにおいて広く利用可能である。 INDUSTRIAL APPLICABILITY The present invention can be widely used in positioning various substrates with respect to a housing.

1 :筐体
2 :回路基板(基板)
2a :周縁
2A,2B,2C,2D:辺部
3 :コネクタ
4 :蓋体
11 :開口
12 :底面
13 :周壁
13a :端部
13A,13B,13C,13D:壁部
14 :基準ピン
15 :押圧部
15a,15a1,15a2:押圧部
15b,15b1,15b2:押圧部
16 :傾斜部
17 :切り込み
18 :スナップフィット
19 :押圧部分
19a :傾斜部
19b :当接部
22 :貫通孔
31 :コネクタハウジング部
100 :電子機器
P,P1,P2:押圧力
P3 :合力
1: housing 2: circuit board (substrate)
2a: peripheral edges 2A, 2B, 2C, 2D: side portion 3: connector 4: cover 11: opening 12: bottom surface 13: peripheral wall 13a: end portions 13A, 13B, 13C, 13D: wall portion 14: reference pin 15: pressure Portions 15a, 15a1, 15a2: Pressing portions 15b, 15b1, 15b2: Pressing portion 16: Inclined portion 17: Notch 18: Snap fit 19: Pressing portion 19a: Inclined portion 19b: Contact portion 22: Through hole 31: Connector housing portion 100: electronic devices P, P1, P2: pressing force P3: resultant force

Claims (4)

基板と、
前記基板が収納される樹脂製の筐体と、を備え、
前記筐体は、前記基板を挿入可能な開口と、当該開口に対向する底面と、前記底面の周縁から立設される周壁と、前記底面から立設される基準ピンと、前記周壁の内面から内方に突出して設けられ、当該筐体に収納された前記基板の周縁の一部に当接して前記基板を前記周壁の前記内方に押圧して押圧力を作用させる複数の押圧部と、を有し、
前記基板は、前記基準ピンが挿通される貫通孔を有し、
前記貫通孔に前記基準ピンが挿通されて前記基板が前記筐体に収納された状態で、複数の前記押圧部の夫々が作用させる複数の前記押圧力の合力が前記基準ピンに作用する基板の位置決め構造。
a substrate;
a resin housing in which the substrate is housed,
The housing includes an opening into which the substrate can be inserted, a bottom surface facing the opening, a peripheral wall erected from a peripheral edge of the bottom surface, a reference pin erected from the bottom surface, and an inner surface of the peripheral wall. a plurality of pressing parts protruding in the direction, contacting a part of the peripheral edge of the substrate housed in the housing and pressing the substrate inwardly of the peripheral wall to apply a pressing force; have
the substrate has a through hole through which the reference pin is inserted;
In a state in which the reference pin is inserted through the through hole and the substrate is accommodated in the housing, a resultant force of the plurality of pressing forces applied by the plurality of pressing portions acts on the reference pin. positioning structure.
複数の前記押圧部は、潰しリブによって構成されている請求項1に記載の基板の位置決め構造。 2. The substrate positioning structure according to claim 1, wherein the plurality of pressing portions are composed of crushing ribs. 複数の前記押圧部は、前記周壁において前記開口の側に切り込みを設けることで形成されるスナップフィットによって構成されている請求項1に記載の基板の位置決め構造。 2. The substrate positioning structure according to claim 1, wherein the plurality of pressing portions are configured by snap-fits formed by providing cuts in the peripheral wall on the side of the opening. 前記筐体の前記周壁は、平面視において多角形状であり、
複数の前記押圧部は、前記周壁のうち少なくとも非平行な二つの壁部の前記内面に配置されている請求項1から3のいずれか一項に記載の基板の位置決め構造。
The peripheral wall of the housing is polygonal in plan view,
The substrate positioning structure according to any one of claims 1 to 3, wherein the plurality of pressing portions are arranged on the inner surfaces of at least two non-parallel wall portions of the peripheral wall.
JP2021086360A 2021-05-21 2021-05-21 Substrate positioning structure Pending JP2022179103A (en)

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