JP2022170673A - Cured film and display device - Google Patents

Abstract

To provide a cured film of a curable composition containing quantum dots, the cured film being strong against deformation and breakage, and to provide a method capable of producing the cured film.SOLUTION: There are provided: a cured film of a curable composition containing quantum dots (A) and a photopolymerizable compound (B), the cured film having a Martens hardness greater than 0.10 GPa; and a method for producing the cured film of the curable composition containing the quantum dots (A) and the photopolymerizable compound (B), the method including an exposure step of irradiating a film of the curable composition with light and a thermosetting step of thermosetting the film of the curable composition. When the amount of exposure in the exposure step is X (mJ/cm2) and the thermosetting temperature and the thermosetting time in the thermosetting step are Y(°C) and Z (hr) respectively, formula (1): X×Y×Z2≥6500 is satisfied.SELECTED DRAWING: None

Description

TECHNICAL FIELD The present invention relates to a cured film and a display device including the cured film.

Patent Document 1 describes a composition for forming a cured film containing a binder polymer, a polymerizable compound and semiconductor quantum dots, and a cured film formed from the composition.

JP 2017-025165 A

One object of the present invention is to provide a cured film of a curable composition containing quantum dots, which is resistant to deformation and damage, and a method capable of producing the cured film.
Another object of the present invention is to provide a display device including the cured film.

The present invention provides a cured film, a method for producing a cured film, and a display device described below.
[1] A cured film of a curable composition containing quantum dots (A) and a photopolymerizable compound (B),
A cured film having a Martens hardness of greater than 0.10 GPa.
[2] The cured film of [1], wherein the curable composition further contains a photopolymerization initiator (C).
[3] The cured film of [1] or [2], wherein the curable composition further contains a resin (D).
[4] The cured film according to any one of [1] to [3], wherein the curable composition further contains a light scattering agent (E).
[5] A method for producing a cured film of a curable composition containing quantum dots (A) and a photopolymerizable compound (B),
An exposure step of irradiating the film of the curable composition with light;
A thermosetting step of thermosetting the film of the curable composition;
including
The following formula ( ¹ ):
X×Y×Z ² ≧6500 (1)
A method for producing a cured film that satisfies
[6] The manufacturing method according to [5], wherein the thermosetting step is performed in a vacuum atmosphere.
[7] A display device comprising the cured film according to any one of [1] to [4].

It is possible to provide a cured film of a curable composition containing quantum dots, which is resistant to deformation and damage, a method capable of producing the cured film, and a display device containing the cured film.

<< Cured film >>
The cured film according to the present invention (hereinafter also simply referred to as “cured film”) is a cured film of a curable composition, and can be formed by curing the curable composition. The curable composition contains at least quantum dots (A) and a photopolymerizable compound (B).
A cured film formed from a curable composition containing quantum dots (A) can emit light having a wavelength different from that of the irradiated light by irradiation with ultraviolet light or visible light. Therefore, the cured film containing quantum dots (A) can be used as a wavelength conversion film.

The cured film has a Martens hardness of greater than 0.10 GPa, measured by the method described in the Examples below. The Martens hardness of the cured film is preferably 0.12 GPa or more, more preferably 0.15 GPa or more, still more preferably 0.20 GPa or more, even more preferably 0.22 GPa or more, particularly preferably 0.24 GPa or more, and most preferably is 0.25 GPa or more. Martens hardness is a hardness that includes both components of plastic deformation and elastic deformation of a cured film, and is a characteristic value that includes not only hardness and resistance to deformation of a cured film, but also flexibility. A cured film having a Martens hardness of greater than 0.10 GPa can enhance deformation resistance and breakage resistance of the cured film. When the cured film is used as a wavelength conversion film (especially as a cured pattern), deformation or breakage of the film can be prevented during manufacture or use of a device including the film.

Cured films can also have high abrasion resistance. The abrasion resistance of the cured film can be evaluated by pencil hardness. Specifically, the pencil hardness measured by the method described in the following examples is, for example, 3B or higher, preferably 2B or higher, more preferably H or higher, and even more preferably H or higher. is 2H or more, even more preferably 3H or more, particularly preferably 4H or more. According to the cured film having a pencil hardness of 2B or more, the surface of the cured film is less likely to be damaged during the manufacturing process of the display device, and the deterioration of the cured film during long-term use and reduction in the intensity of emitted light due to scratches on the surface can be prevented. can be suppressed.
According to the present invention, it is possible to provide a cured film having a pencil hardness of 2B or more and a high emitted light intensity.

The Martens hardness of the cured film is preferably 0.35 GPa or less, more preferably 0.32 GPa or less, still more preferably 0.30 GPa or less, even more preferably 0.30 GPa or less, and particularly preferably 0.28 GPa or less. . If the Martens hardness of the cured film is excessively high, the emitted light intensity may decrease when the cured film is used as a wavelength conversion film. The decrease in emitted light intensity is considered to be caused by, for example, quenching due to shrinkage of the cured film, which causes the distance between the particles of the quantum dots (A) in the cured film to become closer.
In one preferred embodiment, the cured film has a Martens hardness of more than 0.10 GPa and an emitted light intensity of 1000 μW or more as measured by the method described in the Examples below. In another preferred embodiment, the cured film has a Martens hardness of 0.20 GPa or more and an emitted light intensity of 1000 μW or more as measured by the method described in Examples below. In another preferred embodiment, the cured film has a Martens hardness of greater than 0.10 GPa, a pencil hardness of 2B or greater, and an emitted light intensity of 1000 μW or greater. The emitted light intensity is preferably 1100 μW or more, more preferably 1200 μW or more, and still more preferably 1300 μW or more.

The cured film according to the present invention is not particularly limited, but can be suitably produced by the method described in <<Method for Producing Cured Film>> below.

<Curable composition>
The curable composition contains quantum dots (A) and photopolymerizable compounds (B).

[1] Quantum dot (A)
Quantum dots (A) are semiconductor fine particles having a particle diameter of 1 nm or more and 100 nm or less, and are fine particles that emit light by absorbing ultraviolet light or visible light using the bandgap of semiconductors.
The quantum dots (A) include CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe, CdHgTe, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSTe, Group 12 elements such as GaN, Group 12 elements such as Gas and P; AlN, AlP, AlAs, InN, InP, InAs, GaNP, GaNAs, GaPAs, AlNP, AlNAs, AlPAs, InNP, InNAs, InPAs, GaAlNP, GaAlNAs, GaAlPAs, GaInNP, GaInNAs, GaInPAs, InAlNP, InAlNAs, InAlPAs, etc. 13 A compound of a group element and a group 15 element; a compound of a group 14 element such as PdS and PbSe and a group 16 element;

When the quantum dots (A) contain S or Se, quantum dots surface-modified with metal oxides or organic substances may be used. The use of surface-modified quantum dots can prevent the abstraction of S and Se by reactive components that are or may be included in the curable composition.

The quantum dot (A) may form a core-shell structure by combining the above compounds. Examples of such combinations include fine particles having a core of CdSe and a shell of ZnS, and fine particles having a core of InP and a shell of ZnSeS.

Since the energy state of the quantum dots (A) depends on their size, the emission wavelength can be freely selected by changing the particle diameter. For example, in the case of quantum dots composed only of CdSe, the peak wavelengths of fluorescence spectra when the particle diameters are 2.3 nm, 3.0 nm, 3.8 nm, and 4.6 nm are 528 nm, 570 nm, 592 nm, and 637 nm, respectively. is.
In addition, the light emission from the quantum dots (A) has a narrow spectrum width, and by combining light having such a sharp peak, a display device including a cured film formed from a curable composition can display colors. area can be expanded. Furthermore, the quantum dots (A) have high responsiveness and can efficiently utilize the light emitted from the light source.

The curable composition may contain only one type of quantum dot that emits light of a specific wavelength by light emitted from the light source, and contains two or more types of quantum dots that emit light of different wavelengths in combination. You may have Examples of the light of the specific wavelength include red light, green light, and blue light.

The content of the quantum dots (A) in the curable composition is, for example, 1% by mass or more and 60% by mass or less, preferably 10% by mass or more and 50% by mass or less, with respect to the total solid content of the curable composition. It is preferably 15% by mass or more and 50% by mass or less, more preferably 20% by mass or more and 50% by mass or less, and even more preferably 20% by mass or more and 40% by mass or less.
As used herein, the total amount of solids means the total amount of components excluding the solvent (I) among the components contained in the curable composition. The content of each component in the solid content of the curable composition can be measured by known analytical means such as liquid chromatography or gas chromatography. The content of each component in the solid content of the curable composition may be calculated from the formulation during preparation of the curable composition.

[2] ligand (H)
The curable composition may contain a compound (hereinafter also referred to as “ligand”) having coordinating ability with respect to the quantum dots (A). A ligand is, for example, an organic compound having a polar group capable of coordinating semiconductor particles. The curable composition can contain one or more ligands.

The polar group is preferably at least one group selected from the group consisting of a thiol group (--SH), a carboxyl group (--COOH) and an amino group ( _--NH.sub.2 ). A polar group selected from the group can be advantageous in enhancing the coordinating ability to semiconductor particles. A high coordinating ability can contribute to improvement in color unevenness of the cured film and/or improvement in patterning properties of the curable composition. Among them, the polar group is more preferably at least one group selected from the group consisting of a thiol group and a carboxyl group, from the viewpoint of obtaining a cured film having excellent emitted light properties. Ligands may have one or more polar groups.

The ligand is, for example, the following formula (I):
X ^A -R ^X (I)
It can be an organic compound represented by In the formula, X ^A is the above polar group, and R ^X is a monovalent hydrocarbon group optionally containing a heteroatom (N, O, S, halogen atom, etc.). The hydrocarbon group may have one or more unsaturated bonds such as carbon-carbon double bonds. The hydrocarbon group may have a linear, branched or cyclic structure. The number of carbon atoms in the hydrocarbon group is, for example, 1 or more and 40 or less, and may be 1 or more and 30 or less. The methylene group contained in the hydrocarbon group is -O-, -S-, -C(=O)-, -C(=O)-O-, -OC(=O)-, -C( ═O) may be substituted with —NH—, —NH— and the like.

The group R ^X may contain a polar group. For specific examples of the polar group, the above description of the polar group ^XA is cited.

Specific examples of ligands having a carboxy group as the polar group X ^A include formic acid, acetic acid, propionic acid, and saturated or unsaturated fatty acids. Specific examples of saturated or unsaturated fatty acids include butyric acid, pentanoic acid, caproic acid, caprylic acid, capric acid, lauric acid, myristic acid, pentadecylic acid, palmitic acid, margaric acid, stearic acid, arachidic acid, behenic acid, and lignoserine. saturated fatty acids such as acids; monounsaturated fatty acids such as myristoleic acid, palmitoleic acid, oleic acid, icosenoic acid, erucic acid, nervonic acid; linoleic acid, α-linolenic acid, γ-linolenic acid, stearic acid, dihomo- It contains polyunsaturated fatty acids such as γ-linolenic acid, arachidonic acid, eicosatetraenoic acid, docosadienoic acid and adrenic acid (docosatetraenoic acid).

^A specific example of the ligand having a thiol group or an amino group as the polar group XA is a coordination in which the carboxy group of the ligand having a carboxy group as the polar group ^XA is replaced with a thiol group or an amino group. Including children.

Preferred examples of the ligand represented by formula (I) above include compound (J-1) and compound (J-2).

[Compound (J-1)]
Compound (J-1) is a compound having a first functional group and a second functional group. The first functional group is a carboxy group (--COOH) and the second functional group is a carboxy group or a thiol group (--SH). Since the compound (J-1) has a carboxy group and/or a thiol group, it can serve as a ligand capable of coordinating the quantum dots (A). The curable composition may contain only one compound (J-1) or two or more compounds (J-1).

By including the compound (J-1) in the curable composition, the development speed of the curable composition can be sufficiently increased, and the emitted light intensity of the cured film formed from the curable composition can be increased. can increase This is because both the carboxyl group and thiol group of the compound (J-1) can impart high developability with an alkaline developer to the curable composition and coordinate well with the quantum dots (A). This is believed to be because the dispersibility of the quantum dots (A) in the curable composition can be enhanced. In particular, the carboxyl group has a higher effect of enhancing developability with an alkaline developer, and the thiol group has a higher effect of enhancing the dispersibility of the quantum dots (A).

The term "output light intensity" as used herein refers to the intensity of light emitted from the cured film, and may be measured as luminance. For example, the “output light intensity” is the incident light that has entered the cured film from the light source, and is emitted from the side on which the incident light is incident to the opposite side of the main surface of the cured film opposite to the light source (for example, back The fluorescence emitted by the quantum dots (A) inside the cured film due to the intensity of the light (the incident light that entered the cured film from the light source of the light unit is emitted to the display side) and the excitation light that entered the cured film from the light source (internal light emission) from the cured film to one side of the opposing main surface of the cured film (for example, when the display is placed above the cured film in a backlight unit, the display side). Both may be included.

Increasing the development speed of the curable composition can also contribute to increasing the emitted light intensity of the cured film. It is considered that this is because the permeation of water into the cured film during the development process can be suppressed.

An example of compound (J-1) is a compound represented by the following formula (J-1a). Compound (J-1) may be an acid anhydride of the compound represented by formula (J-1a).

［式中、Ｒ^Ｂは、２価の炭化水素基を表す。複数のＲ^Ｂが存在する場合、それらは同一でも異なっていてもよい。上記炭化水素基は１以上の置換基を有していてもよい。置換基が複数存在する場合、それらは同一でも異なっていてもよく、それらは互いに結合して、それぞれが結合する原子とともに環を形成していてもよい。上記炭化水素基に含まれる－ＣＨ_２－は－Ｏ－、－Ｓ－、－ＳＯ_２－、－ＣＯ－及び－ＮＨ－の少なくとも１つに置き換わっていてもよい。
ｐは、１～１０の整数を表す。］

[In the formula, ^RB represents a divalent hydrocarbon group. When multiple ^RBs are present, they may be the same or different. The hydrocarbon group may have one or more substituents. When there are multiple substituents, they may be the same or different, and they may be bonded together to form a ring with the atoms to which each is attached. -CH ₂ - contained in the above hydrocarbon group may be replaced with at least one of -O-, -S-, -SO ₂ -, -CO- and -NH-.
p represents an integer from 1 to 10; ]

Examples of the divalent hydrocarbon group represented by ^RB include chain hydrocarbon groups, alicyclic hydrocarbon groups and aromatic hydrocarbon groups. The chain hydrocarbon group includes, for example, a linear or branched alkanediyl group, and usually has 1 to 50 carbon atoms, preferably 1 to 20 carbon atoms, more preferably 1 to 10 carbon atoms. is. The alicyclic hydrocarbon group includes, for example, a monocyclic or polycyclic cycloalkanediyl group, which usually has 3 to 50 carbon atoms, preferably 3 to 20 carbon atoms, more preferably 3 to 10. The aromatic hydrocarbon group includes, for example, a monocyclic or polycyclic arenediyl group, which usually has 6 to 20 carbon atoms.

Examples of the substituent that the hydrocarbon group may have include an alkyl group having 1 to 50 carbon atoms, a cycloalkyl group having 3 to 50 carbon atoms, an aryl group having 6 to 20 carbon atoms, a carboxy group, an amino groups, halogen atoms, and the like. The substituent which the hydrocarbon group may have is preferably a carboxy group, an amino group or a halogen atom.

When —CH ₂ — contained in the hydrocarbon group is replaced with at least one of —O—, —CO— and —NH—, —CH ₂ — is preferably replaced with —CO— and —NH—. It is at least one, more preferably -NH-.
p is preferably 1 or 2;

Examples of the compound represented by the formula (J-1a) include compounds represented by the following formulas (1-1) to (1-9).

Specific examples of the compound represented by formula (J-1a) are represented by chemical names such as mercaptoacetic acid, 2-mercaptopropionic acid, 3-mercaptopropionic acid, 3-mercaptobutanoic acid, 4-mercaptobutanoic acid, mercaptosuccinic acid, mercaptostearic acid, mercaptooctanoic acid, 4-mercaptobenzoic acid, 2,3,5,6-tetrafluoro-4-mercaptobenzoic acid, L-cysteine, N-acetyl-L-cysteine, 3-mercapto 3-methoxybutyl propionate, 3-mercapto-2-methylpropionic acid and the like. Among them, 3-mercaptopropionic acid and mercaptosuccinic acid are preferred.

Another example of the compound (J-1) is a polyvalent carboxylic acid compound, preferably a compound represented by the above formula (J-1a), wherein —SH in formula (J-1a) is a carboxy group ( —COOH) is substituted with a compound (J-1b).

Examples of compound (J-1b) include the following compounds.
Succinic acid, glutaric acid, adipic acid, octafluoroadipic acid, azelaic acid, dodecanedioic acid, tetradecanedioic acid, hexadecanedioic acid, heptadecanedioic acid, octadecanedioic acid, nonadecanedioic acid, dodecanedioic acid, 3-ethyl- 3-methylglutaric acid, hexafluoroglutaric acid, trans-3-hexenedioic acid, sebacic acid, hexadecafluorosebacic acid, acetylenedicarboxylic acid, trans-aconitic acid, 1,3-adamantanedicarboxylic acid, bicyclo [2.2 .2] octane-1,4-dicarboxylic acid, cis-4-cyclohexene-1,2-dicarboxylic acid, 1,1-cyclopropanedicarboxylic acid, 1,1-cyclobutanedicarboxylic acid, cis- or trans-1,3 -cyclohexanedicarboxylic acid, cis- or trans-1,4-cyclohexanedicarboxylic acid, 1,1-cyclopentanediacetic acid, 1,2,3,4-cyclopentanetetracarboxylic acid, decahydro-1,4-naphthalenedicarboxylic acid , 2,3-norbornanedicarboxylic acid, 5-norbornene-2,3-dicarboxylic acid, phthalic acid, 3-fluorophthalic acid, isophthalic acid, tetrafluoroisophthalic acid, terephthalic acid, tetrafluoroterephthalic acid, 2,5-dimethyl terephthalic acid, 2,6-naphthalenedicarboxylic acid, 2,3-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,1'-ferrocenedicarboxylic acid, 2,2'-biphenyldicarboxylic acid, 4,4'- Biphenyldicarboxylic acid, 2,5-furandicarboxylic acid, benzophenone-2,4'-dicarboxylic acid monohydrate, benzophenone-4,4'-dicarboxylic acid, 2,3-pyrazinedicarboxylic acid, 2,3-pyridinedicarboxylic acid acid, 2,4-pyridinedicarboxylic acid, 3,5-pyridinedicarboxylic acid, 2,5-pyridinedicarboxylic acid, 2,6-pyridinedicarboxylic acid, 3,4-pyridinedicarboxylic acid, pyrazole-3,5-dicarboxylic acid monohydrate, 4,4'-stilbenedicarboxylic acid, anthraquinone-2,3-dicarboxylic acid, 4-(carboxymethyl)benzoic acid, chelidonic acid monohydrate, azobenzene-4,4'-dicarboxylic acid, azobenzene -3,3′-dicarboxylic acid, chlorendic acid, 1H-imidazole-4,5-dicarboxylic acid, 2,2-bis(4-carboxyphenyl)hexafluoropropane, 1,10-bis(4-carboxyphenoxy)decane , dipropyl Malonic acid, dithiodiglycolic acid, 3,3'-dithiodipropionic acid, 4,4'-dithiodibutanoic acid, 4,4'-dicarboxydiphenyl ether, 4,4'-dicarboxydiphenyl sulfone, ethylene glycol bis(4 -carboxyphenyl)ether, 3,4-ethylenedioxythiophene-2,5-dicarboxylic acid, 4,4'-isopropylidenediphenoxyacetic acid, 1,3-acetonedicarboxylic acid, methylenedisalicylic acid, 5,5'- Thiodisalicylic acid, tris(2-carboxyethyl)isocyanurate, tetrafluorosuccinic acid, α,α,α',α'-tetramethyl-1,3-benzenedipropionic acid, 1,3,5-benzenetricarboxylic acid etc.

From the viewpoint of increasing the development speed of the curable composition and increasing the intensity of light emitted from the cured film, the molecular weight of compound (J-1) is preferably 3,000 or less, more preferably 2,000 or less, and still more preferably 1,000 or less. Still more preferably 800 or less, particularly preferably 500 or less. The molecular weight of compound (J-1) is usually 100 or more.

The molecular weight may be a number average molecular weight or a weight average molecular weight. In this case, the number-average molecular weight and weight-average molecular weight are the number-average molecular weight and weight-average molecular weight in terms of standard polystyrene measured by GPC, respectively.

When the curable composition contains the quantum dots (A) and the compound (J-1), the content ratio of the compound (J-1) to the quantum dots (A) in the curable composition is a mass ratio, preferably is 0.001 or more and 1 or less, more preferably 0.01 or more and 0.5 or less, and still more preferably 0.02 or more and 0.1 or less. When the content ratio is in this range, it can be advantageous from the viewpoint of increasing the development speed of the curable composition and from the viewpoint of increasing the emitted light intensity of the cured film.

When the curable composition contains the compound (J-1), the content of the compound (J-1) in the curable composition is from the viewpoint of increasing the development speed of the curable composition and the emitted light intensity of the cured film. From the viewpoint of increasing the amount of % by mass or more and 8% by mass or less, more preferably 0.2% by mass or more and 5% by mass or less, and particularly preferably 0.5% by mass or more and 4% by mass or less.

[Compound (J-2)]
The compound (J-2) is a compound (J-2) different from the compound (J-1), containing a polyalkylene glycol structure and having a polar group at the molecular end. The molecular end is preferably the end of the longest carbon chain (a carbon atom in the carbon chain may be replaced with another atom such as an oxygen atom) in compound (J-2). The curable composition may contain one kind of compound (J-2) or two or more kinds thereof.
The compound containing a polyalkylene glycol structure and having the first functional group and the second functional group belongs to the compound (J-1).

From the viewpoint of increasing the development speed of the curable composition and the viewpoint of increasing the emitted light intensity of the cured film, the curable composition may contain a compound (J-1) or a compound (J-2), It may contain compound (J-1) and compound (J-2).

The polyalkylene glycol structure is the following formula:

(n is an integer of 2 or more). In the formula, R ^C is an alkylene group such as ethylene group and propylene group.
Specific examples of the compound (J-2) include polyalkylene glycol compounds represented by the following formula (J-2a).

In formula (J-2a), X is a polar group, Y is a monovalent group, and Z ^C is a divalent or trivalent group. n is an integer of 2 or more. m is 1 or 2; R ^C is an alkylene group.

The polar group X is preferably at least one group selected from the group consisting of a thiol group (--SH), a carboxy group (--COOH) and an amino group ( _--NH.sub.2 ). A polar group selected from the group can be advantageous in enhancing coordination ability with respect to the quantum dot (A). Among them, the polar group X is more preferably at least one group selected from the group consisting of a thiol group and a carboxyl group, from the viewpoint of increasing the intensity of emitted light from the cured film.

The group Y is a monovalent group. The group Y is not particularly limited, and may be a monovalent hydrocarbon group optionally having a substituent (N, O, S, halogen atom, etc.). —CH ₂ — contained in the hydrocarbon group is —O—, —S—, —C(=O)—, —C(=O)—O—, —OC(=O)—, — It may be substituted with C(=O)--NH--, --NH-- or the like.

The number of carbon atoms in the hydrocarbon group is, for example, 1 or more and 12 or less. The hydrocarbon group may have an unsaturated bond.
Examples of the group Y include an alkyl group having 1 to 12 carbon atoms having a linear, branched or cyclic structure; an alkoxy group having 1 to 12 carbon atoms having a linear, branched or cyclic structure, and the like. mentioned. The number of carbon atoms in the alkyl group and alkoxy group is preferably 1 or more and 8 or less, more preferably 1 or more and 6 or less, and still more preferably 1 or more and 4 or less. —CH ₂ — contained in the alkyl group and alkoxy group is —O—, —S—, —C(=O)—, —C(=O)—O—, —OC(=O)— , —C(=O)—NH—, —NH— and the like. Among them, the group Y is preferably a linear or branched alkoxy group having 1 to 4 carbon atoms, and is preferably a linear alkoxy group having 1 to 4 carbon atoms. more preferred.

Group Y may contain a polar group. The polar group includes at least one group selected from the group consisting of a thiol group (--SH), a carboxy group (--COOH) and an amino group ( _--NH.sub.2 ). However, as described above, the compound containing the polyalkylene glycol structure and having the first functional group and the second functional group belongs to the compound (J-1). The polar group is preferably arranged at the end of the group Y.

The group Z ^C is a divalent or trivalent group. The group Z ^C is not particularly limited, and may be a divalent or trivalent hydrocarbon group optionally containing a heteroatom (N, O, S, halogen atom, etc.). The carbon number of the hydrocarbon group is, for example, 1 or more and 24 or less. The hydrocarbon group may have an unsaturated bond.

The divalent group Z ^C is an alkylene group having 1 to 24 carbon atoms having a linear, branched or cyclic structure; and 1 or more carbon atoms having a linear, branched or cyclic structure. Examples include alkenylene groups of 24 or less. The number of carbon atoms in the alkyl group and alkenylene group is preferably 1 or more and 12 or less, more preferably 1 or more and 8 or less, and still more preferably 1 or more and 4 or less. —CH ₂ — contained in the alkyl group and alkenylene group includes —O—, —S—, —C(═O)—, —C(═O)—O—, and —OC(═O)— , —C(=O)—NH—, —NH— and the like. Examples of the trivalent group Z ^C include groups obtained by removing one hydrogen atom from the above divalent group Z ^C .

The group Z ^C may have a branched structure. The group Z ^C having a branched structure has a polyalkylene glycol structure represented by the above formula (J-2a) in a branched chain different from the branched chain containing the polyalkylene glycol structure represented by the above formula (J-2a). may have another polyalkylene glycol structure.

Among them, the group Z ^C is preferably a linear or branched alkylene group having 1 to 6 carbon atoms, and is a linear alkylene group having 1 to 4 carbon atoms. is more preferred.

R ^C is an alkylene group, preferably a linear or branched alkylene group having 1 to 6 carbon atoms, and a linear alkylene group having 1 to 4 carbon atoms. is more preferable.

n in formula (J-2a) is an integer of 2 or more, preferably 2 or more and 540 or less, more preferably 2 or more and 120 or less, still more preferably 2 or more and 60 or less.

The molecular weight of the compound (J-2) may be, for example, about 150 to 10,000, preferably 150 to 5,000 from the viewpoint of increasing the development speed of the curable composition and increasing the intensity of the emitted light of the cured film. , more preferably 150 or more and 4000 or less.

The molecular weight may be a number average molecular weight or a weight average molecular weight. In this case, the number-average molecular weight and weight-average molecular weight are the number-average molecular weight and weight-average molecular weight in terms of standard polystyrene measured by GPC, respectively.

When the curable composition contains the quantum dots (A) and the compound (J-2), the content ratio of the compound (J-2) to the quantum dots (A) in the curable composition is a mass ratio, preferably is 0.001 or more and 2 or less, more preferably 0.01 or more and 1.5 or less, and still more preferably 0.1 or more and 1 or less. When the content ratio is in this range, it can be advantageous from the viewpoint of increasing the development speed of the curable composition and from the viewpoint of increasing the emitted light intensity of the cured film.

When the curable composition contains the compound (J-2), the content of the compound (J-2) in the curable composition is from the viewpoint of increasing the development speed of the curable composition and the emitted light intensity of the cured film. From the viewpoint of increasing the total solid content of the curable composition, preferably 0.1% by mass or more and 40% by mass or less, more preferably 0.1% by mass or more and 20% by mass or less, still more preferably 1% by mass 15 mass % or less, and more preferably 2 mass % or more and 10 mass % or less.

When the curable composition contains the compound (J-1) and the compound (J-2), the content ratio of the compound (J-2) to the compound (J-1) in the curable composition is the mass ratio , preferably 1 or more and 50 or less, more preferably 5 or more and 40 or less, still more preferably 10 or more and 25 or less. When the content ratio is in this range, it can be advantageous from the viewpoint of increasing the development speed of the curable composition and from the viewpoint of increasing the emitted light intensity of the cured film.

The curable composition can further contain a compound (J-3), which is a compound other than the compound (J-1) and the compound (J-2) and has the ability to coordinate with the quantum dot (A). Examples of the compound (J-3) include organic acids, organic amine compounds, thiol compounds and the like.

[3] Photopolymerizable compound (B)
The curable composition contains one or more photopolymerizable compounds (B). The photopolymerizable compound (B) is a compound that can be polymerized by an active radical generated from the photopolymerization initiator (C) described below, an acid, or the like. Examples of the photopolymerizable compound (B) include photoradical polymerizable compounds that cure by radical polymerization reaction upon irradiation with light, and photocationically polymerizable compounds that cure through cationic polymerization reaction upon irradiation of light. The photopolymerizable compound (B) is preferably a photoradical polymerizable compound.

The weight average molecular weight of the photopolymerizable compound (B) is, for example, 150 or more and 3000 or less, preferably 150 or more and 2900 or less, more preferably 250 or more and 1500 or less.

Examples of photoradical polymerizable compounds include compounds having a polymerizable ethylenically unsaturated bond, among which (meth)acrylate compounds are preferred. As the (meth) acrylate compound, a monofunctional (meth) acrylate monomer having one (meth) acryloyloxy group in the molecule (hereinafter also referred to as "compound (B-1)"), two in the molecule A bifunctional (meth)acrylate monomer having a (meth)acryloyloxy group (hereinafter also referred to as “compound (B-2)”), and a multifunctional compound having 3 or more (meth)acryloyloxy groups in the molecule A functional (meth)acrylate monomer (hereinafter also referred to as “compound (B-3)”) may be mentioned.
As used herein, "(meth)acrylate" means acrylate and/or methacrylate. The same applies to "(meth)acryloyl", "(meth)acrylic acid" and the like.

Compound (B-1) includes, for example, methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, amyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, octyl (meth)acrylate, nonyl (meth)acrylate, dodecyl (meth)acrylate (lauryl (meth)acrylate), hexadecyl (meth)acrylate, octadecyl (meth)acrylate, cyclohexyl (meth)acrylate, methoxyethyl (meth)acrylate, butoxyethyl (meth)acrylate, phenoxyethyl (meth)acrylate, nonylphenoxyethyl (meth)acrylate, glycidyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, isobornyl (meth)acrylate meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate ) acrylate, 2-hydroxyethyl (meth) acrylate, benzyl (meth) acrylate, phenyl (meth) acrylate, mono(2-acryloyloxyethyl) succinate, N-[2-(acryloyloxy)ethyl]phthalimide, N- [2-(Acryloyloxy)ethyl]tetrahydrophthalimide, 2-(2-vinyloxyethoxy)ethyl (meth)acrylate, ω-carboxy-polycaprolactone monoacrylate, ethyl carbitol (meth)acrylate (ethoxyethoxyethyl (meth) acrylate), 3,3,5-trimethylcyclohexyl (meth)acrylate and the like.

As the compound (B-2), 1,3-butylene glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,5-pentanediol di(meth)acrylate, 3-methyl-1 ,5-pentanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, tricyclodecanedimethanol di(meth)acrylate, ethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate, Two hydroxyl groups of tripropylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, neopentylglycol hydroxypivalic acid ester di(meth)acrylate, and tris(2-hydroxyethyl)isocyanurate are (meth) Di(meth)acrylate substituted with acryloyloxy group, diol obtained by adding 4 mol or more of ethylene oxide or propylene oxide to 1 mol of neopentyl glycol, two hydroxyl groups of which are substituted with (meth)acryloyloxy group Di(meth)acrylate, di(meth)acrylate obtained by adding 2 mol of ethylene oxide or propylene oxide to 1 mol of bisphenol A, in which two hydroxyl groups of the diol are substituted with (meth)acryloyloxy groups, trimethylolpropane 1 Di(meth)acrylate obtained by adding 3 mol or more of ethylene oxide or propylene oxide per mol, and two hydroxyl groups of the triol are substituted by (meth)acryloyloxy groups, 4 mol or more of ethylene oxide per 1 mol of bisphenol A or A di(meth)acrylate in which two hydroxyl groups of a diol obtained by adding propylene oxide are substituted with a (meth)acryloyloxy group.

Examples of the compound (B-3) include glycerin tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, Dipentaerythritol hexa (meth) acrylate, tripentaerythritol octa (meth) acrylate, tripentaerythritol hepta (meth) acrylate, tetrapentaerythritol deca (meth) acrylate, tetrapentaerythritol nona (meth) acrylate, tris (2-( meth)acryloyloxyethyl)isocyanurate, ethylene glycol-modified pentaerythritol tetra(meth)acrylate, ethylene glycol-modified dipentaerythritol hexa(meth)acrylate, propylene glycol-modified pentaerythritol tetra(meth)acrylate, propylene glycol-modified dipentaerythritol hexa (Meth)acrylate, caprolactone-modified pentaerythritol tetra(meth)acrylate, caprolactone-modified dipentaerythritol hexa(meth)acrylate, pentaerythritol triacrylate succinic acid monoester, dipentaerythritol pentaacrylate succinic acid monoester, pentaerythritol triacrylate malein acid monoesters, dipentaerythritol pentaacrylate maleic acid monoesters, and the like.

Examples of photocationically polymerizable compounds include compounds having at least one oxetane ring (four-membered ring ether) in the molecule (hereinafter also simply referred to as "oxetane compound"), at least one oxirane ring (3 (Membered ring ether) (hereinafter also simply referred to as "epoxy compound"), vinyl ether compounds, and the like.

Oxetane compounds include 3-ethyl-3-hydroxymethyloxetane, 1,4-bis[(3-ethyl-3-oxetanyl)methoxymethyl]benzene, 3-ethyl-3-(phenoxymethyl)oxetane, di[( 3-ethyl-3-oxetanyl)methyl]ether, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, phenol novolak oxetane and the like. These oxetane compounds can be easily obtained as commercial products, and as commercial products, all of them are sold by Toagosei Co., Ltd. under the trade name of "Aron Oxetane (registered trademark) OXT-101. ”, “Aron Oxetane (registered trademark) OXT-121”, “Aron Oxetane (registered trademark) OXT-211”, “Aron Oxetane (registered trademark) OXT-221”, “Aron Oxetane (registered trademark) OXT-212”, etc. is mentioned.

Examples of epoxy compounds include aromatic epoxy compounds, glycidyl ethers of polyols having alicyclic rings, aliphatic epoxy compounds, and alicyclic epoxy compounds.

Examples of aromatic epoxy compounds include bisphenol-type epoxy resins such as diglycidyl ether of bisphenol A, diglycidyl ether of bisphenol F and diglycidyl ether of bisphenol S; Novolac type epoxy resins such as resins; polyfunctional epoxy resins such as glycidyl ether of tetrahydroxyphenylmethane, glycidyl ether of tetrahydroxybenzophenone, and epoxidized polyvinylphenol;

As the glycidyl ether of a polyol having an alicyclic ring, a nucleus-hydrogenated polyhydroxy compound obtained by selectively hydrogenating the aromatic ring of an aromatic polyol under pressure in the presence of a catalyst is used as glycidyl ether. One that has been made is mentioned. Examples of aromatic polyols include bisphenol type compounds such as bisphenol A, bisphenol F and bisphenol S; novolac type resins such as phenol novolak resin, cresol novolak resin and hydroxybenzaldehyde phenol novolak resin; tetrahydroxydiphenylmethane, tetrahydroxybenzophenone and polyvinylphenol. and polyfunctional compounds such as. A glycidyl ether can be obtained by reacting epichlorohydrin with an alicyclic polyol obtained by hydrogenating the aromatic ring of these aromatic polyols. Among the glycidyl ethers of polyols having such alicyclic rings, hydrogenated diglycidyl ethers of bisphenol A are preferred.

Aliphatic epoxy compounds include polyglycidyl ethers of aliphatic polyhydric alcohols and their alkylene oxide adducts. Specifically, diglycidyl ether of 1,4-butanediol; diglycidyl ether of 1,6-hexanediol; triglycidyl ether of glycerin; triglycidyl ether of trimethylolpropane; diglycidyl ether of polyethylene glycol; diglycidyl ether of neopentyl glycol; obtained by adding one or more alkylene oxides (ethylene oxide or propylene oxide) to an aliphatic polyhydric alcohol such as ethylene glycol, propylene glycol or glycerin and polyglycidyl ether of polyether polyol.

Alicyclic epoxy compounds are compounds that have at least one structure in the molecule that forms an oxirane ring with the carbon atoms of the alicyclic ring. (manufactured by Dow Chemical Co.), "Cyracure UVR" series (manufactured by Dow Chemical Co.), etc. can be used.

Vinyl ether compounds include 2-hydroxyethyl vinyl ether, triethylene glycol vinyl monoether, tetraethylene glycol divinyl ether, trimethylolpropane trivinyl ether and the like.

The photopolymerizable compound (B) preferably contains a polyfunctional (meth)acrylate monomer (compound (B-3)) having 3 or more (meth)acryloyloxy groups in the molecule. When the curable composition contains the compound (B-3), the heat resistance and mechanical strength of the curable composition and the cured film can be increased, and it is also advantageous for improving the emitted light intensity of the cured film. can be. In addition, when the curable composition contains the compound (B-3), the curability of the curable composition can be improved.

As the compound (B-3), a compound (B-3a) having 3 or more (meth)acryloyloxy groups in the molecule and having an acidic functional group, and 3 or more (meth) in the molecule A compound (B-3b) having an acryloyloxy group and no acidic functional group can be mentioned. The photopolymerizable compound (B) preferably contains at least one of compound (B-3a) and compound (B-3b), two or more kinds of compound (B-3a), and compound (B-3b). It may contain two or more kinds, or at least one kind of compound (B-3a) and at least one kind of compound (B-3b).

The curable composition preferably contains compound (B-3a) as a photopolymerizable compound. By the curable composition containing the compound (B-3a), the aggregation of the quantum dots (A) can be suppressed, the dispersibility of the quantum dots (A) is improved, and as a result, the curing obtained from the curable composition The outgoing light intensity of the film can be improved. In addition, when the curable composition contains the compound (B-3a), the curability of the curable composition can be improved. Furthermore, by including the compound (B-3a) in the curable composition, the heat resistance of the curable composition and the cured film can be improved.
In one embodiment, from the viewpoint of improving the development speed of the curable composition, the photopolymerizable compound (B) is the total amount of the photopolymerizable compound (B) contained in the curable composition, the compound Contains 50% by mass or more of (B-3b). In another embodiment, the photopolymerizable compound (B) includes compound (B-3a) and compound (B-3b) from the viewpoint of improving the solvent resistance (remaining film rate) of the cured film.

Examples of the acidic functional group include a carboxy group, a sulfonic acid group, a phosphoric acid group, and the like. Among them, the acidic functional group is preferably a carboxy group.

The number of (meth)acryloyloxy groups possessed by one molecule of the compound (B-3) is, for example, 3 or more and 6 or less, preferably 3 or more and 5 or less, more preferably 3. The number of acidic functional groups per molecule of compound (B-3a) is one or more, preferably one. When it has two or more acidic functional groups, each acidic functional group may be different or the same, but preferably has at least one carboxy group.

As the compound (B-3a), a compound having three or more (meth)acryloyloxy groups and hydroxy groups, such as pentaerythritol tri(meth)acrylate or dipentaerythritol penta(meth)acrylate, is esterified with a dicarboxylic acid. and a compound obtained by the conversion. Examples of the compound include a compound obtained by monoesterifying pentaerythritol tri(meth)acrylate and succinic acid, a compound obtained by monoesterifying dipentaerythritol penta(meth)acrylate and succinic acid, and pentaerythritol tri(meth) A compound obtained by monoesterifying acrylate and maleic acid, a compound obtained by monoesterifying dipentaerythritol penta(meth)acrylate and maleic acid, and the like can be mentioned. Among them, a compound obtained by monoesterifying pentaerythritol tri(meth)acrylate and succinic acid is preferable.

Commercially available products of the compound (B-3a) include, for example, "Aronix M-510" manufactured by Toagosei Co., Ltd., which contains a dibasic acid anhydride adduct of pentaerythritol tri(meth)acrylate as a main component, and dipentaerythritol. "Aronix M-520D" manufactured by Toagosei Co., Ltd., which contains a dibasic acid anhydride adduct of penta(meth)acrylate as a main component, and the like can be mentioned. These commercial products have a carboxy group as an acidic functional group.

When the photopolymerizable compound (B) contains the compound (B-3) (preferably the compound (B-3a)), the content of the compound (B-3) is the curability of the curable composition and the cured film. From the viewpoint of enhancing heat resistance and emitted light intensity, the amount is preferably 5% by mass or more, more preferably 10% by mass or more, and still more preferably 20% by mass or more, relative to the total amount of the photopolymerizable compound (B). and is preferably 70% by mass or less, more preferably 60% by mass or less, still more preferably 50% by mass or less, even more preferably 40% by mass or less, and particularly preferably 30% by mass or less.

When the photopolymerizable compound (B) contains the compound (B-3) (preferably the compound (B-3a)), the content of the compound (B-3) is the curability of the curable composition and the cured film. From the viewpoint of enhancing heat resistance and emitted light intensity, etc., the total amount of the curable composition or the total amount of solid content of the curable composition is preferably 0.1% by mass or more and 50% by mass or less, more preferably 1% by mass. % or more and 40 mass % or less, more preferably 2 mass % or more and 30 mass % or less, still more preferably 5 mass % or more and 20 mass % or less, and particularly preferably 5 mass % or more and 15 mass % or less.

When the photopolymerizable compound (B) contains the compound (B-3) (preferably the compound (B-3a)), the content of the compound (B-3) is relative to 100 parts by mass of the quantum dots (A). , preferably 20 parts by mass or more, more preferably 25 parts by mass or more, still more preferably 30 parts by mass or more, still more preferably 35 parts by mass or more, and preferably 110 parts by mass or less, more preferably It is 100 parts by mass or less, more preferably 85 parts by mass or less, and even more preferably 70 parts by mass or less.

The photopolymerizable compound (B) is a (meth)acrylate monomer having a vinyl ether group and a (meth)acryloyl group (preferably a (meth)acryloyloxy group) in the same molecule (hereinafter, “compound (B-4)” Also called.) is preferably included. By the curable composition containing the compound (B-4), the aggregation of the quantum dots (A) can be suppressed, the dispersibility of the semiconductor particles (A) is improved, and as a result, the curing obtained from the curable composition The outgoing light intensity of the film can be improved. In addition, by including the compound (B-4) in the curable composition, the viscosity of the curable composition can be reduced and the coatability can be improved. Compound (B-4) can be a compound belonging to any one of compounds (B-1) to (B-3).

The number of vinyl ether groups possessed by the compound (B-4) is preferably 1 or more and 4 or less, more preferably 1 or more and 2 or less, and particularly preferably 1. The number of (meth)acryloyl groups possessed by the compound (B-4) is preferably 1 or more and 4 or less, more preferably 1 or more and 2 or less, and particularly preferably 1.

Examples of the compound (B-4) include 2-vinyloxyethyl (meth)acrylate, 3-vinyloxypropyl (meth)acrylate, 2-vinyloxypropyl (meth)acrylate, 1-vinyloxypropyl (meth)acrylate, 1-methyl -2-vinyloxyethyl (meth)acrylate, 4-vinyloxybutyl (meth)acrylate, 3-vinyloxybutyl (meth)acrylate, 2-vinyloxybutyl (meth)acrylate, 1-methyl-3-vinyloxypropyl (meth)acrylate, 2-methyl -3-vinyloxypropyl (meth)acrylate, 1-methyl-2-vinyloxypropyl (meth)acrylate, 1,1-dimethyl-2-vinyloxyethyl (meth)acrylate, 6-vinyloxyhexyl (meth)acrylate, 4 - vinyloxycyclohexyl (meth)acrylate, (4-vinyloxymethylcyclohexyl)methyl (meth)acrylate, (3-vinyloxymethylcyclohexyl)methyl (meth)acrylate, (2-vinyloxymethylcyclohexyl)methyl (meth)acrylate , (4-vinyloxymethylphenyl)methyl (meth)acrylate, (3-vinyloxymethylphenyl)methyl (meth)acrylate, 2-vinyloxymethylphenylmethyl (meth)acrylate, 2-(2-vinyloxyisopropoxy ) ethyl (meth) acrylate, 2-(2-vinyloxyethoxy) ethyl (meth) acrylate, 2-(2-vinyloxyethoxy) propyl (meth) acrylate, 2-(2-vinyloxyisopropoxy) propyl (meth) ) acrylate, 2-(2-vinyloxyethoxy) isopropyl (meth) acrylate, 2-(2-vinyloxyisopropoxy) isopropyl (meth) acrylate, 2-{2-(2-vinyloxyethoxy) ethoxy} ethyl ( meth)acrylate, 2-{2-(2-vinyloxyisopropoxy)ethoxy}ethyl (meth)acrylate, 2-{2-(2-vinyloxyisopropoxy)isopropoxy}ethyl (meth)acrylate, 2-{ 2-(2-vinyloxyethoxy)ethoxy}propyl (meth)acrylate, 2-{2-(2-vinyloxyethoxy)isopropoxy}propyl (meth)acrylate, 2-{2-(2-vinyloxyisopropoxy) ) ethoxy} propyl (meth) acrylate, 2-{2-(2-vinyloxy isopropoxy) isopropoxy} prop pyr (meth) acrylate, 2-{2-(2-vinyloxyethoxy) ethoxy} isopropyl (meth) acrylate, 2-{2-(2-vinyloxyethoxy) isopropoxy} isopropyl (meth) acrylate, 2-{ 2-(2-vinyloxyisopropoxy)ethoxy}isopropyl (meth)acrylate, 2-{2-(2-vinyloxyisopropoxy)isopropoxy}isopropyl (meth)acrylate, 2-[2-{2-(2 -vinyloxyethoxy)ethoxy}ethoxy]ethyl (meth)acrylate, 2-[2-{2-(2-vinyloxyisopropoxy)ethoxy}ethoxy]ethyl (meth)acrylate, 2-(2-[2-{ 2-(2-vinyloxyethoxy)ethoxy}ethoxy]ethoxy)ethyl (meth)acrylate and the like.

The compound (B-4) is preferably vinyloxy C _1-6 alkyl (meth)acrylate or (vinyloxy C _1-4 alkoxy) C _1-4 alkyl (meth) acrylate, and (vinyloxy C _1-4 alkoxy) C _{1 -4} Alkyl (meth)acrylates are more preferred, and 2-(2-vinyloxyethoxy)ethyl (meth)acrylate is particularly preferred.

When the photopolymerizable compound (B) contains the compound (B-4), the content of the compound (B-4) is from the viewpoint of reducing the viscosity of the curable composition and the viewpoint of increasing the emitted light intensity of the cured film. Therefore, the total amount of the photopolymerizable compound (B) is preferably 5% by mass or more, more preferably 10% by mass or more, still more preferably 20% by mass or more, and even more preferably 25% by mass or more. Also, it is preferably 85% by mass or less, more preferably 75% by mass or less, still more preferably 65% by mass or less, even more preferably 60% by mass or less, and particularly preferably 55% by mass or less.

When the photopolymerizable compound (B) contains the compound (B-4), the content of the compound (B-4) is from the viewpoint of reducing the viscosity of the curable composition and the viewpoint of increasing the emitted light intensity of the cured film. From, relative to the total amount of the curable composition or the total amount of solid content of the curable composition, preferably 3% by mass or more and 50% by mass or less, more preferably 5% by mass or more and 45% by mass or less, more preferably 10% by mass % or more and 40 mass % or less, and still more preferably 10 mass % or more and 35 mass % or less.

When the photopolymerizable compound (B) contains the compound (B-4), the content of the compound (B-4) is preferably 20 parts by mass or more, more preferably 100 parts by mass of the quantum dots (A). is 25 parts by mass or more, more preferably 30 parts by mass or more, still more preferably 35 parts by mass or more, and is preferably 110 parts by mass or less, more preferably 100 parts by mass or less, and still more preferably 85 parts by mass parts or less, more preferably 70 parts by mass or less.

The photopolymerizable compound (B) preferably contains a monofunctional (meth)acrylate monomer (compound (B-1)) having one (meth)acryloyloxy group in the molecule. By including the compound (B-1) in the curable composition, the viscosity of the curable composition can be reduced and the coatability can be improved.

From the viewpoint of suppressing outgassing from the cured film due to heat load and reduced pressure in the post-process (formation of barrier layer, etc.) of forming the color conversion layer of the display device described later, the curable composition has a temperature of 1 at 80°C. It preferably contains a polymerizable compound having a volatilization amount of 10% by mass or less when heated for a period of time. From the same point of view, the photopolymerizable compound (B) more preferably contains compound (B-1) having a volatilization amount of 10% by mass or less when heated at 80° C. for 1 hour. The volatilization amount is preferably 8% by mass or less, more preferably 7% by mass or less, still more preferably 5% by mass or less, even more preferably 3% by mass or less, still more preferably 2% by mass or less, particularly preferably 1% by mass or less. % by mass or less, and may be 0.01% by mass or more, or 0.1% by mass or more. The volatilization amount after heating at 80° C. for 1 hour can be determined by the dry weight method in the following procedure.
5 g of the photopolymerizable compound (B) is weighed on an aluminum cup, and then placed on a hot plate at 80° C. for 1 hour. From the initial weight (W0) and the weight after 1 hour (W1), the volatilization amount (% by mass) is calculated according to the following formula.
Volatile amount (mass%) = 100 × (W0-W1) / W0

From the viewpoint of obtaining a cured film with good emitted light intensity, the curable composition preferably contains a polymerizable compound whose homopolymer has a glass transition temperature of −50° C. or higher. From the same point of view, the photopolymerizable compound more preferably contains a compound (B-1) whose homopolymer has a glass transition temperature of −50° C. or higher. The glass transition temperature is preferably −30° C. or higher, more preferably −20° C. or higher, and may be 0° C. or higher or 200° C. or lower. The glass transition temperature may be a catalog value or a numerical value described in a general physical property table, or may be measured by a commercially available differential scanning calorimeter or the like.

From the viewpoint of obtaining a cured film with good emitted light intensity, the curable composition is a compound (B-1) in which the group bonded to the (meth)acryloyloxy group is an oxygen atom, a heteroatom such as a nitrogen atom. It is preferred to include a compound that is a hydrocarbon group that does not contain The hydrocarbon group is more preferably a chain hydrocarbon group or an alicyclic hydrocarbon group.

When the photopolymerizable compound (B) contains the compound (B-1), the content of the compound (B-1) is, from the viewpoint of reducing the viscosity of the curable composition, the photopolymerizable compound (B). It is preferably 5% by mass or more, more preferably 10% by mass or more, still more preferably 15% by mass or more, still more preferably 20% by mass or more, and particularly preferably 25% by mass or more, based on the total amount. Also, it is preferably 75% by mass or less, more preferably 65% by mass or less, still more preferably 60% by mass or less, even more preferably 55% by mass or less, and particularly preferably 50% by mass or less.

When the photopolymerizable compound (B) contains the compound (B-1), the content of the compound (B-1) is, from the viewpoint of reducing the viscosity of the curable composition, the total amount of the curable composition or curing preferably 5% by mass or more and 50% by mass or less, more preferably 8% by mass or more and 45% by mass or less, still more preferably 10% by mass or more and 40% by mass or less, still more preferably is 15% by mass or more and 35% by mass or less.

The content of the photopolymerizable compound (B) in the curable composition is, for example, 5% by mass or more and 70% by mass or less, preferably 7% by mass or more and 60% by mass or less, relative to the total solid content of the curable composition. , more preferably 10% by mass or more and 45% by mass or less, and still more preferably 13% by mass or more and 40% by mass or less. When the content of the photopolymerizable compound (B) is within the above range, the solvent resistance (residual film ratio) of the cured film tends to be improved.

From the viewpoint of improving the development speed of the curable composition, the content of the photopolymerizable compound (B) is preferably 13% by mass or more, more preferably 15% by mass, based on the total solid content of the curable composition. It is at least 20% by mass, more preferably at least 20% by mass.

[4] Photoinitiator (C)
The curable composition can further contain one or more photoinitiators (C). The photopolymerization initiator (C) is a compound capable of initiating polymerization by generating active radicals, acids, etc. by the action of light or heat.

The photopolymerization initiator (C) preferably contains an oxime compound having a first molecular structure represented by the following formula (1). Hereinafter, the oxime compound is also referred to as "oxime compound (1)".

Inclusion of the oxime compound (1) as the photopolymerization initiator (C) can be advantageous from the viewpoint of increasing the emitted light intensity of the cured film. One of the reasons why such an effect can be exhibited is that the oxime compound (1) is necessary when the oxime compound (1) initiates photopolymerization due to the unique molecular structure of the oxime compound (1). Since the absorption wavelength of the oxime compound (1) changes greatly before and after the cleavage (decomposition) of the oxime compound (1), it is presumed that the oxime compound (1) has a high ability to initiate radical photopolymerization.

In formula (1), R ¹ represents R ¹¹ , OR ¹¹ , COR ¹¹ , SR ¹¹ , CONR ¹² R ¹³ or CN.
R ¹¹ , R ¹² and R ¹³ each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms or an aralkyl group having 2 to 20 carbon atoms. represents a heterocyclic group.
The hydrogen atoms of the groups represented by R ¹¹ , R ¹² or R ¹³ are OR ²¹ , COR ²¹ , SR ²¹ , NR ²² Ra ²³ , CONR ²² R ²³ , -NR ²² -OR ²³ , -N(COR ²² )- OCOR ²³ , -C(=N-OR ²¹ )-R ²² , -C(=N-OCOR ²¹ )-R ²² , CN, a halogen atom, or COOR ²¹ may be substituted.
R ²¹ , R ²² and R ²³ each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms or an aralkyl group having 2 to 20 carbon atoms. represents a heterocyclic group.
A hydrogen atom in the group represented by R ²¹ , R ²² or R ²³ may be substituted with CN, a halogen atom, a hydroxy group or a carboxy group.
When the group represented by R ¹¹ , R ¹² , R ¹³ , R ²¹ , R ²² or R ²³ has an alkylene moiety, the alkylene moiety is -O-, -S-, -COO-, -OCO-, It may be interrupted 1 to 5 times by -NR ²⁴ -, -NR ²⁴ CO-, -NR ²⁴ COO-, -OCONR ²⁴ -, -SCO-, -COS-, -OCS- or -CSO-.
R ²⁴ represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms or a heterocyclic group having 2 to 20 carbon atoms.
When the group represented by R ¹¹ , R ¹² , R ¹³ , R ²¹ , R ²² or R ²³ has an alkyl moiety, the alkyl moiety may be branched or cyclic. , and R ¹² and R ¹³ and R ²² and R ²³ may together form a ring.
* represents a bond with the second molecular structure, which is a molecular structure other than the first molecular structure of the oxime compound (1).

Examples of alkyl groups having 1 to 20 carbon atoms represented by R ¹¹ , R ¹² , R ¹³ , R ²¹ , R ²² , R ²³ and R ²⁴ in formula (1) include methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, sec-butyl group, tert-butyl group, pentyl group, isopentyl group, tert-pentyl group, hexyl group, heptyl group, octyl group, isooctyl group, 2-ethylhexyl group, tert -octyl group, nonyl group, isononyl group, decyl group, isodecyl group, undecyl group, dodecyl group, tetradecyl group, hexadecyl group, octadecyl group, icosyl group, cyclopentyl group, cyclohexyl group, cyclohexylmethyl, cyclohexylethyl group, etc. .

Examples of aryl groups having 6 to 30 carbon atoms represented by R ¹¹ , R ¹² , R ¹³ , R ²¹ , R ²² , R ²³ and R ²⁴ in formula (1) include phenyl, tolyl and xylyl. group, ethylphenyl group, naphthyl group, anthryl group, phenanthryl group, phenyl group substituted with one or more of the above alkyl groups, biphenylyl group, naphthyl group, anthryl group, and the like.

Examples of aralkyl groups having 7 to 30 carbon atoms represented by R ¹¹ , R ¹² , R ¹³ , R ²¹ , R ²² , R ²³ and R ²⁴ in formula (1) include benzyl group, α-methylbenzyl group, α,α-dimethylbenzyl group, phenylethyl group and the like.

Examples of the heterocyclic group having 2 to 20 carbon atoms represented by R ¹¹ , R ¹² , R ¹³ , R ²¹ , R ²² , R ²³ and R ²⁴ in formula (1) include pyridyl group, pyrimidyl group, furyl group, thienyl group, tetrahydrofuryl group, dioxolanyl group, benzoxazol-2-yl group, tetrahydropyranyl group, pyrrolidyl group, imidazolidyl group, pyrazolidyl group, thiazolidyl group, isothiazolidyl group, oxazolidyl group, isoxazolidyl group, A piperidyl group, a piperazyl group, a morpholinyl group, etc., and preferably a 5- to 7-membered heterocyclic ring.

R ¹² and R ¹³ and R ²² and R ²³ in formula (1) may together form a ring means that R ¹² and R ¹³ and R ²² and R ²³ may together It means that a ring may be formed together with the nitrogen atom, carbon atom or oxygen atom to which it is connected.
Examples of rings that can be formed by Ra ¹² and Ra ¹³ and Ra ²² and Ra ²³ together in formula (1) include a cyclopentane ring, a cyclohexane ring, a cyclopentene ring, a benzene ring, a piperidine ring, a morpholine ring, A lactone ring, a lactam ring and the like can be mentioned, and a 5- to 7-membered ring is preferred.

The halogen atoms which R ¹¹ , R ¹² , R ¹³ , R ²¹ , R ²² and R ²³ in formula (1) may have as substituents include fluorine, chlorine, bromine and iodine atoms. be done.

R ¹ in formula (1) is preferably R ¹¹ , more preferably an alkyl group having 1 to 20 carbon atoms, still more preferably an alkyl group having 1 to 10 carbon atoms, and even more preferably 1 ∼6 alkyl groups.

An example of the second molecular structure linked to the first molecular structure represented by Formula (1) is the structure represented by Formula (2) below. The second molecular structure means a portion of the molecular structure other than the first molecular structure of the oxime compound (1).
The bond represented by "*" in formula (2) is directly bonded to the bond represented by "*" in formula (1). That is, when the second molecular structure is a structure represented by formula (2), the benzene ring having "-*" in formula (2) and the carbonyl group having "-*" in formula (1) are directly connected.

In formula (2), R ² and R ³ are each independently R ¹¹ , OR ¹¹ , SR ¹¹ , COR ¹¹ , CONR ¹² R ¹³ , NR ¹² COR ¹¹ , OCOR ¹¹ , COOR ¹¹ , SCOR ¹¹ , OCSR ¹¹ , COSR ¹¹ , CSOR ¹¹ , CN or a halogen atom.
When multiple R ² are present, they may be the same or different.
When two or more R3 ^are present, they may be the same or different.
R ¹¹ , R ¹² and R ¹³ have the same meanings as above.
s and t each independently represent an integer of 0 to 4;
L represents a sulfur atom, CR ³¹ R ³² , CO or NR ³³ ;
R ³¹ , R ³² and R ³³ each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms or an aralkyl group having 7 to 30 carbon atoms.
When the group represented by R ³¹ , R ³² or R ³³ has an alkyl moiety, the alkyl moiety may be branched or cyclic, and R ³¹ , R ³² and R ³³ may each independently form a ring together with either adjacent benzene ring.
R ⁴ is a hydroxy group, a carboxy group or the following formula (2-1)

（式（２－１）中、Ｌ^１は、－Ｏ－、－Ｓ－、－ＮＲ^２２－、－ＮＲ^２２ＣＯ－、－ＳＯ_２－、－ＣＳ－、－ＯＣＯ－又は－ＣＯＯ－を表す。
Ｒ^２２は、上記と同じ意味を表す。
Ｌ^２は、炭素数１～２０のアルキル基からｖ個の水素原子を除いた基、炭素数６～３０のアリール基からｖ個の水素原子を除いた基、炭素数７～３０のアラルキル基からｖ個の水素原子を除いた基又は炭素数２～２０の複素環基からｖ個の水素原子を除いた基を表す。
Ｌ^２で表される基がアルキレン部分を有する場合、該アルキレン部分は、－Ｏ－、－Ｓ－、－ＣＯＯ－、－ＯＣＯ－、－ＮＲ^２２－、－ＮＲ^２２ＣＯＯ－、－ＯＣＯＮＲ^２２－、－ＳＣＯ－、－ＣＯＳ－、－ＯＣＳ－又は－ＣＳＯ－により１～５回中断されていてもよく、該アルキレン部分は分枝鎖状であってもよく、環状であってもよい。
Ｒ^４ａは、ＯＲ^４１、ＳＲ^４１、ＣＯＮＲ^４２Ｒ^４３、ＮＲ^４２ＣＯＲ^４３、ＯＣＯＲ^４１、ＣＯＯＲ^４１、ＳＣＯＲ^４１、ＯＣＳＲ^４１、ＣＯＳＲ^４１、ＣＳＯＲ^４１、ＣＮ又はハロゲン原子を表す。
Ｒ^４ａが複数存在するとき、それらは同じであっても異なっていてもよい。
Ｒ^４１、Ｒ^４２及びＲ^４３は、それぞれ独立に、水素原子、炭素数１～２０のアルキル基、炭素数６～３０のアリール基又は炭素数７～３０のアラルキル基を表し、Ｒ^４１、Ｒ^４２及びＲ^４３で表される基がアルキル部分を有する場合、該アルキル部分は分枝鎖状であってもよく、環状であってもよく、Ｒ^４２とＲ^４３は、一緒になって環を形成していてもよい。
ｖは１～３の整数を表す。）
で表される基を表す。
＊は、オキシム化合物（１）が有する第１分子構造との結合手を表す。

(In formula (2-1), L ¹ represents -O-, -S-, -NR ²² -, -NR ²² CO-, -SO ₂ -, -CS-, -OCO- or -COO- .
^R22 has the same meaning as above.
L ² is a group obtained by removing v hydrogen atoms from an alkyl group having 1 to 20 carbon atoms, a group obtained by removing v hydrogen atoms from an aryl group having 6 to 30 carbon atoms, and an aralkyl group having 7 to 30 carbon atoms. represents a group obtained by removing v hydrogen atoms from or a group obtained by removing v hydrogen atoms from a heterocyclic group having 2 to 20 carbon atoms.
When the group represented by L ² has an alkylene moiety, the alkylene moiety is -O-, -S-, -COO-, -OCO-, -NR ²² -, -NR ²² COO-, -OCONR ²² - , -SCO-, -COS-, -OCS- or -CSO- may be interrupted 1 to 5 times, and the alkylene moiety may be branched or cyclic.
^R4a represents ^OR41 , ^SR41 , ^CONR42R43 , ^NR42COR43 , ^OCOR41 , ^COOR41 , ^SCOR41 , ^OCSR41 , ^COSR41 , ^CSOR41 , ^CN or a ^halogen atom.
When multiple R ^4a are present, they may be the same or different.
R ⁴¹ , R ⁴² and R ⁴³ each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms or an aralkyl group having 7 to 30 carbon ^atoms ; When the group represented by ⁴² and R ⁴³ has an alkyl moiety, the alkyl moiety may be branched or cyclic, and R ⁴² and R ⁴³ together form a ring. may be formed.
v represents an integer of 1 to 3; )
Represents a group represented by
* represents a bond with the first molecular structure of the oxime compound (1).

R ¹¹ , R ¹² , R ¹³ , R ²¹ , R ²² , R ²³ , R ²⁴ , R ³¹ , R ³² and R ³³ in formula (2), and R ²² and R in formula (2-1) above Examples of alkyl groups having 1 to 20 carbon atoms, aryl groups having 6 to 30 carbon atoms, and aralkyl groups having 7 to 30 carbon atoms represented by ⁴¹ , R ⁴² and R ⁴³ are R ¹¹ , Similar to the examples for R ¹² , R ¹³ , R ²¹ , R ²² , R ²³ and R ²⁴ .

Complex compounds having 2 to 20 carbon atoms represented by R ¹¹ , R ¹² , R ¹³ , R ²¹ , R ²² , R ²³ , R ²⁴ in formula (2) and R ²² in formula (2-1) above Examples of the cyclic group are the same as those for R ¹¹ , R ¹² , R ¹³ , R ²¹ , R ²² , R ²³ and R ²⁴ in formula (1).

R ³¹ , R ³² and R ³³ in formula (2) may each independently form a ring together with any adjacent benzene ring means that R ³¹ , R ³² and R ³³ means that each independently may form a ring together with either adjacent benzene ring together with the connecting nitrogen atom.
Examples of rings that can be formed together with any of the adjacent benzene rings of R ³¹ , R ³² and R ³³ in formula (2) are Ra ¹² , Ra ¹³ and Ra ²² in formula (1). It is the same as the example for the ring that Ra ²³ can form together.

L ² in the above formula (2-1) is an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. represents a group excluding v hydrogen atoms.

The group obtained by removing v hydrogen atoms from an alkyl group having 1 to 20 carbon atoms, for example, when v is 1, methylene group, ethylene group, propylene group, methylethylene group, butylene group, 1-methylpropylene group , 2-methylpropylene group, 1,2-dimethylpropylene group, 1,3-dimethylpropylene group, 1-methylbutylene group, 2-methylbutylene group, 3-methylbutylene group, 4-methylbutylene group, 2,4 -dimethylbutylene group, 1,3-dimethylbutylene group, pentylene group, hexylene group, heptylene group, octylene group, nonylene group, decylene group, dodecylene group, tridecylene group, tetradecylene group, pentadecylene group, ethane-1,1- Alkylene groups such as a diyl group and a propane-2,2-diyl group can be mentioned.

Examples of groups obtained by removing v hydrogen atoms from an aryl group having 6 to 30 carbon atoms include, for example, when v is 1, a 1,2-phenylene group, a 1,3-phenylene group, a 1,4-phenylene group, 2,6-naphthylene group, 1,4-naphthylene group, 2,5-dimethyl-1,4-phenylene group, diphenylmethane-4,4'-diyl group, 2,2-diphenylpropane-4,4'-diyl and arylene groups such as diphenylsulfide-4,4'-diyl group and diphenylsulfone-4,4'-diyl group.

The group obtained by removing v hydrogen atoms from an aralkyl group having 7 to 30 carbon atoms, for example, when v is 1, a group represented by the following formula (a) and a group represented by the following formula (b) etc.

［式（ａ）及び（ｂ）中、Ｌ^３及びＬ^５は、炭素数１～１０のアルキレン基を表し、Ｌ^４及びＬ^６は、単結合又は炭素数１～１０のアルキレン基を表す。］

[In formulas (a) and (b), L ³ and L ⁵ represent an alkylene group having 1 to 10 carbon atoms, and L ⁴ and L ⁶ represent a single bond or an alkylene group having 1 to 10 carbon atoms. ]

Examples of the alkylene group having 1 to 10 carbon atoms include methylene group, ethylene group, propylene group, methylethylene group, butylene group, 1-methylpropylene group, 2-methylpropylene group, 1,2-dimethylpropylene group, 1 , 3-dimethylpropylene group, 1-methylbutylene group, 2-methylbutylene group, 3-methylbutylene group, 4-methylbutylene group, 2,4-dimethylbutylene group, 1,3-dimethylbutylene group, pentylene group, A hexylene group, a heptylene group, an octylene group, a nonylene group, a decylene group and the like can be mentioned.

Examples of groups obtained by removing v hydrogen atoms from a heterocyclic group having 2 to 20 carbon atoms include, for example, when v is 1, a 2,5-pyridinediyl group, a 2,6-pyridinediyl group, a 2,5- pyrimidinediyl group, 2,5-thiophenediyl group, 3,4-tetrahydrofurandiyl group, 2,5-tetrahydrofurandiyl group, 2,5-furandiyl group, 3,4-thiazoldiyl group, 2,5-benzofurandiyl group 2,5-benzothiophenediyl group, N-methylindole-2,5-diyl group, 2,5-benzothiazoldiyl group, and 2,5-benzoxazoldiyl group. be done.

Examples of halogen atoms represented by R ² and R ³ in formula (2) and R ^4a in formula (2-1) above include fluorine, chlorine, bromine and iodine atoms.

From the viewpoint of the solubility in the solvent (I) and/or the development speed of the curable composition, a preferred example of the structure represented by formula (2) is the structure represented by formula (2a) below. .

［式（２ａ）中、Ｌ’は、硫黄原子又はＮＲ^５０を表し、Ｒ^５０は、直鎖状、分枝鎖状又は環状の炭素数１～２０のアルキル基を表し、Ｒ^２、Ｒ^３、Ｒ^４、ｓ及びｔは、前記と同じ意味を表す。］

[In formula (2a), L′ represents a sulfur atom or NR ⁵⁰ , R ⁵⁰ represents a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, and R ² , R ³ , R ⁴ , s and t have the same meanings as above. ]

From the same viewpoint as above, another preferred example of the structure represented by formula (2) is the structure represented by formula (2b) below.

［式（２ｂ）中、Ｒ^４４は、ヒドロキシ基、カルボキシ基又は下記式（２－２）

[In the formula (2b), R ⁴⁴ is a hydroxy group, a carboxy group, or the following formula (2-2)

（式（２－２）中、Ｌ^１１は、－Ｏ－又は＊－ＯＣＯ－を表し、＊はＬ^１２との結合手を表し、Ｌ^１２は、炭素数１～２０のアルキレン基を表し、該アルキレン基は、１～３個の－Ｏ－により中断されていてもよく、Ｒ^４４ａは、ＯＲ^５５又はＣＯＯＲ^５５を表し、Ｒ^５５は、水素原子又は炭素数１～６のアルキル基を表す。）
で表される基を表す。］

(In formula (2-2), L ¹¹ represents —O— or *—OCO—, * represents a bond with L ¹² , L ¹² represents an alkylene group having 1 to 20 carbon atoms, The alkylene group may be interrupted by 1 to 3 —O—, R ^44a represents OR ⁵⁵ or COOR ⁵⁵ , and R ⁵⁵ represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms .)
Represents a group represented by ]

R ⁴⁴ is preferably a group represented by formula (2-2). In this case, it is advantageous in terms of the solubility of the oxime compound (1) in the solvent (I) and the development speed of the curable composition.

The alkylene group represented by L ¹² preferably has 1 to 10 carbon atoms, more preferably 1 to 4 carbon atoms.
R ^44a is preferably a hydroxy group or a carboxy group, more preferably a hydroxy group.

Although the method for producing the oxime compound (1) having the second molecular structure represented by formula (2) is not particularly limited, it can be produced, for example, by the method described in JP-A-2011-132215.

Another example of the second molecular structure linked to the first molecular structure represented by Formula (1) is the structure represented by Formula (3) below.
The bond represented by "*" in formula (3) is directly bonded to the bond represented by "*" in formula (1). That is, when the second molecular structure is a structure represented by formula (3), the benzene ring having "-*" in formula (3) and the carbonyl group having "-*" in formula (1) are directly connected.

In formula (3), R ⁵ is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. represents
When the group represented by R ⁵ has an alkyl moiety, the alkyl moiety may be branched or cyclic.
The hydrogen atoms of the group represented by R ⁵ are R ²¹ , OR ²¹ , COR ²¹ , SR ²¹ , NR ²² R ²³ , CONR ²² R ²³ , -NR ²² -OR ²³ , -N(COR ²² )-OCOR ²³ , NR ²² COR ²¹ , OCOR ²¹ , COOR ²¹ , -C(=N-OR ²¹ )-R ²² , -C(=N-OCOR ²¹ )-R ²² , SCOR ²¹ , OCSR ²¹ , COSR ²¹ , CSOR ²¹ , It may be substituted with a hydroxyl group, a nitro group, CN, a halogen atom, or ^COOR21 .
R ²¹ , R ²² and R ²³ have the same meanings as above.
A hydrogen atom in the group represented by R ²¹ , R ²² or R ²³ may be substituted with CN, a halogen atom, a hydroxy group or a carboxy group.
When the groups represented by R ²¹ , R ²² and R ²³ have an alkylene moiety, the alkylene moiety is -O-, -S-, -COO-, -OCO-, -NR ²⁴ -, -NR ²⁴ CO It may be interrupted 1 to 5 times by -, -NR ²⁴ COO-, -OCONR ²⁴ -, -SCO-, -COS-, -OCS- or -CSO-.
R ²⁴ has the same meaning as above.
When the groups represented by R ²¹ , R ²² and R ²³ have an alkyl moiety, the alkyl moiety may be branched or cyclic, and R ²² and R ²³ are Together they may form a ring.
^R6 , ^R7 , ^R8 and ^R9 are each independently ^R61 , ^OR61 , ^SR61 , ^COR62 , ^CONR63R64 , ^NR65COR61 , ^OCOR61 , ^{COOR62 , SCOR61 , OCSR61} , COSR ⁶² , CSOR ⁶¹ , a hydroxyl group, a nitro group, CN or a halogen atom.
R ⁶¹ , R ⁶² , R ⁶³ , R ⁶⁴ and R ⁶⁵ are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms or represents a heterocyclic group having 2 to 20 carbon atoms.
The hydrogen atoms of the groups represented by R ⁶¹ , R ⁶² , R ⁶³ , R ⁶⁴ or R ⁶⁵ are OR ²¹ , COR ²¹ , SR ²¹ , NR ²² Ra ²³ , CONR ²² R ²³ , —NR ²² —OR ²³ , — optionally substituted with N(COR ²² )-OCOR ²³ , -C(=N-OR ²¹ )-R ²² , -C(=N-OCOR ²¹ )-R ²² , CN, a halogen atom, or COOR ²¹ .
R ⁶ and R ⁷ , R ⁷ and R ⁸ , and R ⁸ and R ⁹ may together form a ring.
* represents a bond with the first molecular structure of the oxime compound (1).

an alkyl group having 1 to 20 carbon atoms represented by R ⁵ , R ²¹ , R ²² , R ²³ , R ²⁴ , R ⁶¹ , R ⁶² , R ⁶³ , R ⁶⁴ and R ⁶⁵ in formula (3); Examples of the aryl group having 6 to 30 carbon atoms, the aralkyl group having 7 to 30 carbon atoms, and the heterocyclic group having 2 to 20 carbon atoms are R ¹¹ , R ¹² , R ¹³ , R ²¹ , R ²² , Similar to the examples for R ²³ and R ²⁴ .

R ²² and R ²³ in formula (3) may together form a ring means that R ²² and R ²³ together form a ring together with the connecting nitrogen atom, carbon atom or oxygen atom. It means that it may be formed.
Examples of rings that can be formed together by R ²² and R ²³ in formula (3) are rings that can be formed together by Ra ¹² and Ra ¹³ and Ra ²² and Ra ²³ in formula (1) Similar to the example for

Halogen atoms represented by R ⁶ , R ⁷ , R ⁸ and R ⁹ in formula (3), R ⁵ , R ²¹ , R ²² , R ²³ , R ⁶¹ , R ⁶² , R ⁶³ , R ⁶⁴ and R ⁶⁵ Examples of halogen atoms which may substitute the hydrogen atoms of include fluorine, chlorine, bromine and iodine atoms.

From the viewpoint of the solubility in the solvent (I) and/or the development speed of the curable composition, in one preferred embodiment, R ⁵ is a group represented by the following formula (3-1).

［式（３－１）中、Ｚは、炭素数１～２０のアルキル基から１個の水素原子を除いた基、炭素数６～３０のアリール基から１個の水素原子を除いた基、炭素数７～３０のアラルキル基から１個の水素原子を除いた基又は炭素数２～２０の複素環基から１個の水素原子を除いた基を表し、
Ｚで表される基がアルキレン部分を有する場合、該アルキレン部分は、－Ｏ－、－Ｓ－、－ＣＯＯ－、－ＯＣＯ－、－ＮＲ^２４－、－ＮＲ^２４ＣＯＯ－、－ＯＣＯＮＲ^２４－、－ＳＣＯ－、－ＣＯＳ－、－ＯＣＳ－又は－ＣＳＯ－により１～５回中断されていてもよく、該アルキレン部分は分枝鎖状であってもよく、環状であってもよく、
Ｒ^２１、Ｒ^２２及びＲ^２４は、前記と同じ意味を表す。］

[In the formula (3-1), Z is a group obtained by removing one hydrogen atom from an alkyl group having 1 to 20 carbon atoms, a group obtained by removing one hydrogen atom from an aryl group having 6 to 30 carbon atoms, represents a group obtained by removing one hydrogen atom from an aralkyl group having 7 to 30 carbon atoms or a group obtained by removing one hydrogen atom from a heterocyclic group having 2 to 20 carbon atoms,
When the group represented by Z has an alkylene portion, the alkylene portion is -O-, -S-, -COO-, -OCO-, -NR ²⁴ -, -NR ²⁴ COO-, -OCONR ²⁴ -, optionally interrupted 1 to 5 times by -SCO-, -COS-, -OCS- or -CSO-, the alkylene moiety may be branched or cyclic;
R ²¹ , R ²² and R ²⁴ have the same meanings as above. ]

Z in formula (3-1) is preferably a methylene group, ethylene or phenylene group from the same viewpoint as above.
From the same viewpoint as above, R ²¹ and R ²² in formula (3-1) are preferably an alkyl group having 1 to 20 carbon atoms or an aryl group having 6 to 30 carbon atoms, more preferably methyl group, ethyl group or phenyl group.

From the same viewpoint as above, in another preferred embodiment, ^R7 is a nitro group.

The method for producing the oxime compound (1) having the second molecular structure represented by formula (3) is not particularly limited, but for example, the methods described in JP-A-2000-80068 and JP-A-2011-178776. can be manufactured in

Yet another example of the second molecular structure linked to the first molecular structure represented by Formula (1) is the structure represented by Formula (4) below.
The bond represented by "*" in formula (4) is directly bonded to the bond represented by "*" in formula (1). That is, when the second molecular structure is a structure represented by formula (4), the benzene ring having "-*" in formula (4) and the carbonyl group having "-*" in formula (1) are directly connected.

In formula (4), R ⁷¹ is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. show.
When the group represented by R ⁷¹ has an alkyl moiety, the alkyl moiety may be branched or cyclic.
The hydrogen atoms of the group represented by R ⁷¹ are R ²¹ , OR ²¹ , COR ²¹ , SR ²¹ , NR ²² R ²³ , CONR ²² R ²³ , -NR ²² -OR ²³ , -N(COR ²² )-OCOR ²³ , NR ²² COR ²¹ , OCOR ²¹ , COOR ²¹ , -C(=N-OR ²¹ )-R ²² , -C(=N-OCOR ²¹ )-R ²² , SCOR ²¹ , OCSR ²¹ , COSR ²¹ , CSOR ²¹ , It may be substituted with a hydroxyl group, a nitro group, CN, a halogen atom, or ^COOR21 .
R ²¹ , R ²² and R ²³ have the same meanings as above.
A hydrogen atom in the group represented by R ²¹ , R ²² or R ²³ may be substituted with CN, a halogen atom, a hydroxy group or a carboxy group.
When the groups represented by R ²¹ , R ²² and R ²³ have an alkylene moiety, the alkylene moiety is -O-, -S-, -COO-, -OCO-, -NR ²⁴ -, -NR ²⁴ CO It may be interrupted 1 to 5 times by -, -NR ²⁴ COO-, -OCONR ²⁴ -, -SCO-, -COS-, -OCS- or -CSO-.
R ²⁴ has the same meaning as above.
When the groups represented by R ²¹ , R ²² and R ²³ have an alkyl moiety, the alkyl moiety may be branched or cyclic, and R ²² and R ²³ are Together they may form a ring.
R ⁷² , R ⁷³ and three R ⁷⁴ are each independently R ⁶¹ , OR ⁶¹ , SR ⁶¹ , COR ⁶² , CONR ⁶³ R ⁶⁴ , NR ⁶⁵ COR ⁶¹ , OCOR ⁶¹ , COOR ⁶² , SCOR ⁶¹ , OCSR ⁶¹ , COSR ⁶² , CSOR ⁶¹ , a hydroxyl group, a nitro group, CN or a halogen atom.
R ⁶¹ , R ⁶² , R ⁶³ , R ⁶⁴ and R ⁶⁵ are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms or represents a heterocyclic group having 2 to 20 carbon atoms.
The hydrogen atoms of the groups represented by R ⁶¹ , R ⁶² , R ⁶³ , R ⁶⁴ or R ⁶⁵ are OR ²¹ , COR ²¹ , SR ²¹ , NR ²² Ra ²³ , CONR ²² R ²³ , —NR ²² —OR ²³ , — optionally substituted with N(COR ²² )-OCOR ²³ , -C(=N-OR ²¹ )-R ²² , -C(=N-OCOR ²¹ )-R ²² , CN, a halogen atom, or COOR ²¹ .
R ⁷² and R ⁷³ and two R ⁷⁴ may together form a ring.
* represents a bond with the first molecular structure of the oxime compound (1).

an alkyl group having 1 to 20 carbon atoms represented by R ⁷¹ , R ²¹ , R ²² , R ²³ , R ²⁴ , R ⁶¹ , R ⁶² , R ⁶³ , R ⁶⁴ and R ⁶⁵ in formula (4); Examples of aryl groups having 6 to 30 carbon atoms, aralkyl groups having 7 to 30 carbon atoms, and heterocyclic groups having 2 to 20 carbon atoms are R ¹¹ , R ¹² , R ¹³ , R ²¹ , R ²² , Similar to the examples for R ²³ and R ²⁴ .

R ²² and R ²³ in formula (4) may together form a ring means that R ²² and R ²³ together form a ring together with the connecting nitrogen atom, carbon atom or oxygen atom. It means that it may be formed.
Examples of rings that can be formed together by R ²² and R ²³ in formula (4) are rings that can be formed together by Ra ¹² and Ra ¹³ and Ra ²² and Ra ²³ in formula (1) Similar to the example for

^{halogen atoms represented} by ^{R 72} , ^{R 73} and ^{R 74} in ^{formula (} 4) ^; Examples of halogen atoms which may be substituted for include fluorine, chlorine, bromine and iodine atoms.

Although the method for producing the oxime compound (1) having the second molecular structure represented by formula (4) is not particularly limited, for example, the methods described in WO2017/051680 and WO2020/004601. can be manufactured in

Yet another example of the second molecular structure linked to the first molecular structure represented by Formula (1) is the structure represented by Formula (5) below.
The bond represented by "*" in formula (5) is directly bonded to the bond represented by "*" in formula (1). That is, when the second molecular structure is a structure represented by formula (5), the pyrrole ring having "-*" in formula (5) and the carbonyl group having "-*" in formula (1) are directly connected.

In formula (5), R ⁸¹ is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. show.
When the group represented by R ⁸¹ has an alkyl moiety, the alkyl moiety may be branched or cyclic.
The hydrogen atoms of the group represented by R ⁸¹ are R ²¹ , OR ²¹ , COR ²¹ , SR ²¹ , NR ²² R ²³ , CONR ²² R ²³ , -NR ²² -OR ²³ , -N(COR ²² )-OCOR ²³ , NR ²² COR ²¹ , OCOR ²¹ , COOR ²¹ , -C(=N-OR ²¹ )-R ²² , -C(=N-OCOR ²¹ )-R ²² , SCOR ²¹ , OCSR ²¹ , COSR ²¹ , CSOR ²¹ , It may be substituted with a hydroxyl group, a nitro group, CN, a halogen atom, or ^COOR21 .
R ²¹ , R ²² and R ²³ have the same meanings as above.
A hydrogen atom in the group represented by R ²¹ , R ²² or R ²³ may be substituted with CN, a halogen atom, a hydroxy group or a carboxy group.
When the groups represented by R ²¹ , R ²² and R ²³ have an alkylene moiety, the alkylene moiety is -O-, -S-, -COO-, -OCO-, -NR ²⁴ -, -NR ²⁴ CO It may be interrupted 1 to 5 times by -, -NR ²⁴ COO-, -OCONR ²⁴ -, -SCO-, -COS-, -OCS- or -CSO-.
R ²⁴ has the same meaning as above.
When the groups represented by R ²¹ , R ²² and R ²³ have an alkyl moiety, the alkyl moiety may be branched or cyclic, and R ²² and R ²³ are Together they may form a ring.
R ⁸² , R ⁸³ , R ⁸⁴ , R ⁸⁵ and R ⁸⁶ are each independently R ⁶¹ , OR ⁶¹ , SR ⁶¹ , COR ⁶² , CONR ⁶³ R ⁶⁴ , NR ⁶⁵ COR ⁶¹ , OCOR ⁶¹ , COOR ⁶² , SCOR ⁶¹ , OCSR ⁶¹ , COSR ⁶² , CSOR ⁶¹ , a hydroxyl group, a nitro group, CN or a halogen atom.
R ⁶¹ , R ⁶² , R ⁶³ , R ⁶⁴ and R ⁶⁵ are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms or represents a heterocyclic group having 2 to 20 carbon atoms.
The hydrogen atoms of the groups represented by R ⁶¹ , R ⁶² , R ⁶³ , R ⁶⁴ or R ⁶⁵ are OR ²¹ , COR ²¹ , SR ²¹ , NR ²² Ra ²³ , CONR ²² R ²³ , —NR ²² —OR ²³ , — optionally substituted with N(COR ²² )-OCOR ²³ , -C(=N-OR ²¹ )-R ²² , -C(=N-OCOR ²¹ )-R ²² , CN, a halogen atom, or COOR ²¹ .
R ⁸³ and R ⁸⁴ , R ⁸⁴ and R ⁸⁵ , and R ⁸⁵ and R ⁸⁶ may each combine to form a ring.
* represents a bond with the first molecular structure of the oxime compound (1).

an alkyl group having 1 to 20 carbon atoms represented by R ⁸¹ , R ²¹ , R ²² , R ²³ , R ²⁴ , R ⁶¹ , R ⁶² , R ⁶³ , R ⁶⁴ and R ⁶⁵ in formula (5); Examples of aryl groups having 6 to 30 carbon atoms, aralkyl groups having 7 to 30 carbon atoms, and heterocyclic groups having 2 to 20 carbon atoms are R ¹¹ , R ¹² , R ¹³ , R ²¹ , R ²² , Similar to the examples for R ²³ and R ²⁴ .

R ²² and R ²³ in formula (5) may together form a ring means that R ²² and R ²³ together form a ring together with the connecting nitrogen atom, carbon atom or oxygen atom. It means that it may be formed.
Examples of rings that can be formed together by R ²² and R ²³ in formula (5) are rings that can be formed together by Ra ¹² and Ra ¹³ and Ra ²² and Ra ²³ in formula (1) Similar to the example for

Halogen atoms represented by ^R82 , ^R83 , ^R84 , ^R85 and R86 in formula ⁽ 5), ^R81 , ^R21 , ^R22 , ^R23 , ^R61 , ^R62 , ^R63 , ^R64 and examples of the halogen atom which may substitute the hydrogen atom of R ⁶⁵ include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom.

Although the method for producing the oxime compound (1) having the second molecular structure represented by formula (5) is not particularly limited, for example, the methods described in WO 2017/051680 and WO 2020/004601. can be manufactured in

Yet another example of the second molecular structure linked to the first molecular structure represented by Formula (1) is the structure represented by Formula (6) below.
The bond represented by "*" in formula (6) is directly bonded to the bond represented by "*" in formula (1). That is, when the second molecular structure is a structure represented by formula (6), the benzene ring having "-*" in formula (6) and the carbonyl group having "-*" in formula (1) are directly connected.

In formula (6), four R ⁹¹ , R ⁹² , R ⁹³ , R ⁹⁴ , R ⁹⁵ , R ⁹⁶ and R ⁹⁷ are each independently R ⁶¹ , OR ⁶¹ , SR ⁶¹ , COR ⁶² , CONR ⁶³ R ⁶⁴ , NR ⁶⁵ COR ⁶¹ , OCOR ⁶¹ , COOR ⁶² , SCOR ⁶¹ , OCSR ⁶¹ , COSR ⁶² , CSOR ⁶¹ , hydroxyl group, nitro group, CN or halogen atom;
R ⁶¹ , R ⁶² , R ⁶³ , R ⁶⁴ and R ⁶⁵ are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms or represents a heterocyclic group having 2 to 20 carbon atoms.
The hydrogen atoms of the groups represented by R ⁶¹ , R ⁶² , R ⁶³ , R ⁶⁴ or R ⁶⁵ are OR ²¹ , COR ²¹ , SR ²¹ , NR ²² Ra ²³ , CONR ²² R ²³ , —NR ²² —OR ²³ , — optionally substituted with N(COR ²² )-OCOR ²³ , -C(=N-OR ²¹ )-R ²² , -C(=N-OCOR ²¹ )-R ²² , CN, a halogen atom, or COOR ²¹ .
R ²¹ , R ²² and R ²³ have the same meanings as above.
R ⁹² and R ⁹³ , R ⁹⁴ and R ⁹⁵ , R ⁹⁵ and R ⁹⁶ and R ⁹⁶ and R ⁹⁷ may each combine to form a ring.
* represents a bond with the first molecular structure of the oxime compound (1).

Alkyl groups having 1 to 20 carbon atoms and aryl groups having 6 to 30 carbon atoms represented by R ²¹ , R ²² , R ²³ , R ⁶¹ , R ⁶² , R ⁶³ , R ⁶⁴ and R ⁶⁵ in formula (6) , an aralkyl group having 7 to 30 carbon atoms, and a heterocyclic group having 2 to 20 carbon atoms are the examples of R ¹¹ , R ¹² , R ¹³ , R ²¹ , R ²² and R ²³ in formula (1) and It is the same.

R ²² and R ²³ in formula (6) may together form a ring means that R ²² and R ²³ together form a ring together with the connecting nitrogen atom, carbon atom or oxygen atom. It means that it may be formed.
Examples of rings that can be formed together by R ²² and R ²³ in formula (6) are rings that can be formed together by Ra ¹² and Ra ¹³ and Ra ²² and Ra ²³ in formula (1) Similar to the example for

Halogen atoms represented by R ⁹¹ , R ⁹² , R ⁹³ , R ⁹⁴ , R ⁹⁵ , R ⁹⁶ and R ⁹⁷ in formula (6), R ²¹ , R ²² , R ²³ , R ⁶¹ , R ⁶² and R ⁶³ , R ⁶⁴ and R ⁶⁵ , the hydrogen atoms may be substituted with a fluorine atom, a chlorine atom, a bromine atom and an iodine atom.

Although the method for producing the oxime compound (1) having the second molecular structure represented by formula (6) is not particularly limited, for example, the methods described in WO 2017/051680 and WO 2020/004601. can be manufactured in

The photopolymerization initiator (C) can further contain photopolymerization initiators other than the oxime compound (1).
Other photopolymerization initiators include oxime compounds other than oxime compound (1), alkylphenone compounds, biimidazole compounds, triazine compounds and acylphosphine compounds.

Oxime compounds other than the oxime compound (1) include oxime compounds having a partial structure represented by the following formula (d1). * represents a bond.

Examples of the oxime compound having a partial structure represented by formula (d1) include N-benzoyloxy-1-(4-phenylsulfanylphenyl)butan-1-one-2-imine, N-benzoyloxy-1- (4-phenylsulfanylphenyl) octan-1-one-2-imine, N-benzoyloxy-1-(4-phenylsulfanylphenyl)-3-cyclopentylpropan-1-one-2-imine, N-acetoxy-1 -[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethan-1-imine, N-acetoxy-1-[9-ethyl-6-{2-methyl-4-( 3,3-dimethyl-2,4-dioxacyclopentanylmethyloxy)benzoyl}-9H-carbazol-3-yl]ethan-1-imine, N-acetoxy-1-[9-ethyl-6-(2 -methylbenzoyl)-9H-carbazol-3-yl]-3-cyclopentylpropan-1-imine, N-benzoyloxy-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3- yl]-3-cyclopentylpropan-1-one-2-imine; compounds described in JP-A-2011-132215, WO2008/78678, WO2008/78686, and WO2012/132558; be done. Commercially available products such as Irgacure OXE01 and OXE02 (manufactured by BASF) and N-1919 (manufactured by ADEKA) may also be used.

Among them, oxime compounds having a partial structure represented by formula (d1) include N-benzoyloxy-1-(4-phenylsulfanylphenyl)butan-1-one-2-imine, N-benzoyloxy-1-( At least selected from the group consisting of 4-phenylsulfanylphenyl)octan-1-one-2-imine and N-benzoyloxy-1-(4-phenylsulfanylphenyl)-3-cyclopentylpropan-1-one-2-imine One is preferred, and N-benzoyloxy-1-(4-phenylsulfanylphenyl)octan-1-one-2-imine is more preferred.

The alkylphenone compound is a compound having a partial structure represented by the following formula (d4) or a partial structure represented by the following formula (d5). In these partial structures, the benzene ring may have a substituent.

Examples of compounds having a structure represented by formula (d4) include 2-methyl-2-morpholino-1-(4-methylsulfanylphenyl)propan-1-one, 2-dimethylamino-1-(4-morpholinophenyl )-2-benzylbutan-1-one, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]butan-1-one and the like be done. Commercially available products such as OMNIRAD 369, OMNIRAD 907 and OMNIRAD 379 (manufactured by IGM Resins) may also be used.

Compounds having a structure represented by formula (d5) include 2-hydroxy-2-methyl-1-phenylpropan-1-one, 2-hydroxy-2-methyl-1-[4-(2-hydroxyethoxy ) Phenyl]propan-1-one, 1-hydroxycyclohexylphenyl ketone, oligomers of 2-hydroxy-2-methyl-1-(4-isopropenylphenyl)propan-1-one, α,α-diethoxyacetophenone, benzyl dimethyl ketal and the like.
From the viewpoint of sensitivity, the alkylphenone compound is preferably a compound having a structure represented by formula (d4).

Examples of biimidazole compounds include compounds represented by formula (d6).

［式（ｄ６）中、Ｒ^Ｅ～Ｒ^Ｊは、置換基を有していてもよい炭素数６～１０のアリール基を表す。］

[In the formula (d6), R ^E to R ^J represent an aryl group having 6 to 10 carbon atoms which may have a substituent. ]

The aryl group having 6 to 10 carbon atoms includes, for example, phenyl group, toluyl group, xylyl group, ethylphenyl group and naphthyl group, preferably phenyl group.
Examples of substituents include halogen atoms and alkoxy groups having 1 to 4 carbon atoms. The halogen atom includes, for example, a fluorine atom, a chlorine atom, a bromine atom and an iodine atom, preferably a chlorine atom. Examples of the alkoxy group having 1 to 4 carbon atoms include methoxy group, ethoxy group, propoxy group, butoxy group and the like, preferably methoxy group.

Biimidazole compounds include, for example, 2,2′-bis(2-chlorophenyl)-4,4′,5,5′-tetraphenylbiimidazole, 2,2′-bis(2,3-dichlorophenyl)-4 ,4′,5,5′-tetraphenylbiimidazole (see, for example, JP-A-06-75372 and JP-A-06-75373), 2,2′-bis(2-chlorophenyl)-4, 4′,5,5′-tetraphenylbiimidazole, 2,2′-bis(2-chlorophenyl)-4,4′,5,5′-tetra(alkoxyphenyl)biimidazole, 2,2′-bis( 2-chlorophenyl)-4,4',5,5'-tetra(dialkoxyphenyl)biimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(trialkoxy phenyl)biimidazole (see, for example, JP-B-48-38403, JP-A-62-174204, etc.), the phenyl group at the 4,4'5,5'-position is substituted with a carboalkoxy group Examples thereof include imidazole compounds (see, for example, JP-A-7-10913). Among them, compounds represented by the following formulas or mixtures thereof are preferable.

Examples of triazine compounds include 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxy naphthyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-piperonyl-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxystyryl )-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(5-methylfuran-2-yl)ethenyl]-1,3,5-triazine, 2,4- Bis(trichloromethyl)-6-[2-(furan-2-yl)ethenyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(4-diylamino-2 -methylphenyl)ethenyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(3,4-dimethoxyphenyl)ethenyl]-1,3,5-triazine, etc. mentioned. Among them, 2,4-bis(trichloromethyl)-6-piperonyl-1,3,5-triazine is preferred.

Examples of acylphosphine compounds include bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide and (2,4,6-trimethylbenzoyl)diphenylphosphine oxide.

Other examples of photopolymerization initiators other than the oxime compound (1) include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and benzoin isobutyl ether; benzophenone, o-benzoyl benzoin. methyl acid, 4-phenylbenzophenone, 4-benzoyl-4'-methyldiphenylsulfide, 3,3',4,4'-tetra(tert-butylperoxycarbonyl)benzophenone, 2,4,6-trimethylbenzophenone, 4 benzophenone compounds such as ,4'-bis(diethylamino)benzophenone; quinone compounds such as 9,10-phenanthrenequinone, 2-ethylanthraquinone and camphorquinone; 10-butyl-2-chloroacridone, benzyl, phenylglyoxylic acid Examples include methyl and titanocene compounds.

Photopolymerization initiators other than the oxime compound (1) may be used alone, or two or more photopolymerization initiators may be used in combination. When a photopolymerization initiator other than the oxime compound (1) is used together with the oxime compound (1), the other photopolymerization initiator includes an oxime compound other than the oxime compound (1) described above, an alkylphenone compound, Biimidazole compounds, triazine compounds, acylphosphine compounds, and the like.

When the curable composition contains a photopolymerization initiator (C), the content of the photopolymerization initiator (C) in the curable composition is preferably 0 with respect to 100 parts by mass of the photopolymerizable compound (B). .1 parts by mass or more and 300 parts by mass or less, more preferably 0.1 parts by mass or more and 200 parts by mass or less. When the content of the photopolymerization initiator (C) is within the above range, the productivity of the cured film tends to improve.

[5] Resin (D)
The curable composition can further contain a resin (D). The resin (D) can further contain one or more resins. Examples of the resin (D) include the following resins [K1] to [K4].
Resin [K1]; at least one (a) selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic acid anhydrides (hereinafter also referred to as "(a)"), and copolymerizable with (a) A copolymer with a monomer (c) (but different from (a)) (hereinafter also referred to as "(c)");
Resin [K2]; a monomer (b) having a cyclic ether structure having 2 to 4 carbon atoms and an ethylenically unsaturated bond in a copolymer of (a) and (c) (hereinafter referred to as "(b)" Also called.) reacted resin;
Resin [K3]; a resin obtained by reacting (a) with a copolymer of (b) and (c);
Resin [K4]: A resin obtained by reacting a copolymer of (b) and (c) with (a) and further with a carboxylic anhydride.

(a) includes, for example, (meth)acrylic acid, crotonic acid, and unsaturated monocarboxylic acids such as o-, m-, and p-vinylbenzoic acid;
Maleic acid, fumaric acid, citraconic acid, mesaconic acid, itaconic acid, 3-vinyl phthalic acid, 4-vinyl phthalic acid, 3,4,5,6-tetrahydrophthalic acid, 1,2,3,6-tetrahydrophthalic acid, dimethyl Unsaturated dicarboxylic acids such as tetrahydrophthalic acid and 1,4-cyclohexenedicarboxylic acid;
methyl-5-norbornene-2,3-dicarboxylic acid, 5-carboxybicyclo[2.2.1]hept-2-ene, 5,6-dicarboxybicyclo[2.2.1]hept-2-ene, 5-carboxy-5-methylbicyclo[2.2.1]hept-2-ene, 5-carboxy-5-ethylbicyclo[2.2.1]hept-2-ene, 5-carboxy-6-methylbicyclo [2.2.1]hept-2-ene, 5-carboxy-6-ethylbicyclo[2.2.1]hept-2-ene and other bicyclounsaturated compounds containing a carboxy group;
Maleic anhydride, citraconic anhydride, itaconic anhydride, 3-vinyl phthalic anhydride, 4-vinyl phthalic anhydride, 3,4,5,6-tetrahydrophthalic anhydride, 1,2,3,6- unsaturated dicarboxylic anhydrides such as tetrahydrophthalic anhydride, dimethyltetrahydrophthalic anhydride, 5,6-dicarboxybicyclo[2.2.1]hept-2-ene anhydride;
Unsaturated mono[(meth)acryloyloxyalkyl] esters of divalent or higher polyvalent carboxylic acids such as mono[2-(meth)acryloyloxyethyl] succinate, mono[2-(meth)acryloyloxyethyl] phthalate ;
Unsaturated (meth)acrylates containing a hydroxy group and a carboxy group in the same molecule, such as α-(hydroxymethyl) (meth)acrylic acid, and the like.
Among these, (meth)acrylic acid, maleic anhydride, and the like are preferable from the viewpoint of copolymerization reactivity and the solubility of the obtained resin (D) in an alkaline aqueous solution.

(b) is, for example, a monomer having a cyclic ether structure having 2 to 4 carbon atoms (eg, at least one selected from the group consisting of an oxirane ring, an oxetane ring and a tetrahydrofuran ring) and an ethylenically unsaturated bond; be. (b) is preferably a monomer having a cyclic ether structure with 2 to 4 carbon atoms and a (meth)acryloyloxy group.

Examples of (b) include glycidyl (meth)acrylate, β-methylglycidyl (meth)acrylate, β-ethylglycidyl (meth)acrylate, glycidyl vinyl ether, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p -vinylbenzyl glycidyl ether, α-methyl-o-vinylbenzyl glycidyl ether, α-methyl-m-vinylbenzyl glycidyl ether, α-methyl-p-vinylbenzyl glycidyl ether, 2,3-bis(glycidyloxymethyl)styrene , 2,4-bis(glycidyloxymethyl)styrene, 2,5-bis(glycidyloxymethyl)styrene, 2,6-bis(glycidyloxymethyl)styrene, 2,3,4-tris(glycidyloxymethyl)styrene , 2,3,5-tris(glycidyloxymethyl)styrene, 2,3,6-tris(glycidyloxymethyl)styrene, 3,4,5-tris(glycidyloxymethyl)styrene, 2,4,6-tris (glycidyloxymethyl)monomers having an oxirane ring and an ethylenically unsaturated bond such as styrene;
3-methyl-3-methacryloyloxymethyloxetane, 3-methyl-3-acryloyloxymethyloxetane, 3-ethyl-3-methacryloyloxymethyloxetane, 3-ethyl-3-acryloyloxymethyloxetane, 3-methyl-3 - Methacryloyloxyethyloxetane, 3-methyl-3-acryloyloxyethyloxetane, 3-ethyl-3-methacryloyloxyethyloxetane, 3-ethyl-3-acryloyloxyethyloxetane and other oxetane rings and ethylenically unsaturated bonds a monomer having;
Examples include monomers having a tetrahydrofuran ring and an ethylenically unsaturated bond, such as tetrahydrofurfuryl acrylate (eg, Viscoat V#150, manufactured by Osaka Organic Chemical Industry Co., Ltd.) and tetrahydrofurfuryl methacrylate.
Since the resins [K2] to [K4] have high reactivity during production, and unreacted (b) is unlikely to remain, (b) is a monomer having an oxirane ring and an ethylenically unsaturated bond. is preferred.

(c) includes, for example, methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, 2-ethylhexyl (meth) Acrylate, dodecyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate, cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, 2-methylcyclohexyl (meth)acrylate, tricyclo[5.2.1.0 ^2,6 ]decane-8-yl (meth)acrylate (in the technical field, it is commonly referred to as "dicyclopentanyl (meth)acrylate". Also, when it is referred to as "tricyclodecyl (meth)acrylate" ), tricyclo[5.2.1.0 ^2,6 ]decen-8-yl (meth)acrylate (in the art, it is commonly called “dicyclopentenyl (meth)acrylate”. ), dicyclopentanyloxyethyl (meth)acrylate, isobornyl (meth)acrylate, adamantyl (meth)acrylate, allyl (meth)acrylate, propargyl (meth)acrylate, phenyl (meth)acrylate, naphthyl (meth)acrylate, benzyl (meth)acrylic acid ester such as (meth)acrylate;
Hydroxy group-containing (meth)acrylic acid esters such as 2-hydroxyethyl (meth)acrylate and 2-hydroxypropyl (meth)acrylate;
Dicarboxylic acid diesters such as diethyl maleate, diethyl fumarate, and diethyl itaconate;
bicyclo[2.2.1]hept-2-ene, 5-methylbicyclo[2.2.1]hept-2-ene, 5-ethylbicyclo[2.2.1]hept-2-ene, 5- Hydroxybicyclo[2.2.1]hept-2-ene, 5-hydroxymethylbicyclo[2.2.1]hept-2-ene, 5-(2′-hydroxyethyl)bicyclo[2.2.1] Hept-2-ene, 5-methoxybicyclo[2.2.1]hept-2-ene, 5-ethoxybicyclo[2.2.1]hept-2-ene, 5,6-dihydroxybicyclo[2.2 .1]hept-2-ene, 5,6-di(hydroxymethyl)bicyclo[2.2.1]hept-2-ene, 5,6-di(2′-hydroxyethyl)bicyclo[2.2. 1]hept-2-ene, 5,6-dimethoxybicyclo[2.2.1]hept-2-ene, 5,6-diethoxybicyclo[2.2.1]hept-2-ene, 5-hydroxy -5-methylbicyclo[2.2.1]hept-2-ene, 5-hydroxy-5-ethylbicyclo[2.2.1]hept-2-ene, 5-hydroxymethyl-5-methylbicyclo[2 .2.1]hept-2-ene, 5-tert-butoxycarbonylbicyclo[2.2.1]hept-2-ene, 5-cyclohexyloxycarbonylbicyclo[2.2.1]hept-2-ene, 5-phenoxycarbonylbicyclo[2.2.1]hept-2-ene, 5,6-bis(tert-butoxycarbonyl)bicyclo[2.2.1]hept-2-ene, 5,6-bis(cyclohexyl oxycarbonyl)bicyclo[2.2.1]hept-2-ene and other bicyclounsaturated compounds;
N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide, N-succinimidyl-3-maleimidobenzoate, N-succinimidyl-4-maleimidobutyrate, N-succinimidyl-6-maleimidocaproate, N-succinimidyl-3 - dicarbonylimide derivatives such as maleimidopropionate, N-(9-acridinyl)maleimide;
Styrene, α-methylstyrene, m-methylstyrene, p-methylstyrene, vinyltoluene, p-methoxystyrene, acrylonitrile, methacrylonitrile, vinyl chloride, vinylidene chloride, acrylamide, methacrylamide, vinyl acetate, 1,3-butadiene Examples include isoprene and 2,3-dimethyl-1,3-butadiene.
Among these, styrene, vinyltoluene, N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide, bicyclo[2.2.1]hept- 2-ene and the like are preferred.

In the resin [K1], the ratio of structural units derived from each of the total structural units constituting the resin [K1] is
Structural units derived from (a); 2 mol% or more and 60 mol% or less Structural units derived from (c); preferably 40 mol% or more and 98 mol% or less,
Structural units derived from (a): 10 mol % or more and 50 mol % or less Structural units derived from (c): More preferably 50 mol % or more and 90 mol % or less.
When the ratio of the constituent units of the resin [K1] is within the above range, the storage stability of the curable composition and the developability and solvent resistance of the cured film tend to be excellent.

The resin [K1] is, for example, the method described in the document "Experimental Method for Polymer Synthesis" (written by Takayuki Otsu, published by Kagaku Dojin, 1st edition, 1st edition, published on March 1, 1972) and the literature It can be manufactured with reference to the cited document described in .

Specifically, predetermined amounts of (a) and (c), a polymerization initiator, a solvent, and the like are placed in a reaction vessel, and, for example, by replacing oxygen with nitrogen, a deoxygenated atmosphere is created, and while stirring, A method of heating and keeping warm can be mentioned.
The polymerization initiator, solvent, and the like used here are not particularly limited, and those commonly used in the field can be used. For example, polymerization initiators include azo compounds (2,2′-azobisisobutyronitrile, 2,2′-azobis(2,4-dimethylvaleronitrile), etc.) and organic peroxides (benzoyl peroxide, etc.). As the solvent, any solvent can be used as long as it dissolves each monomer, and examples of the solvent (I) contained in the curable composition include the solvents described later.

The obtained copolymer may be used as a solution after the reaction as it is, may be used as a concentrated or diluted solution, or may be obtained as a solid (powder) by a method such as reprecipitation. may be used. If the solvent (I) described later is used as a solvent for polymerization, the solution after the reaction can be used as it is for preparing the curable composition, thus simplifying the production process of the curable composition. can.

Resin [K2] is a copolymer of (a) and (c), and the cyclic ether having 2 to 4 carbon atoms of (b) is added to the carboxylic acid and/or carboxylic anhydride of (a). It can be manufactured by
First, a copolymer of (a) and (c) is produced in the same manner as the method for producing resin [K1]. In this case, the ratio of structural units derived from each is preferably the same as the ratio described for resin [K1].

Next, part of the carboxylic acid and/or carboxylic acid anhydride derived from (a) in the copolymer is reacted with the cyclic ether having 2 to 4 carbon atoms of (b).
Following the production of the copolymer of (a) and (c), the atmosphere in the flask was replaced from nitrogen to air, and (b) a reaction catalyst (e.g., organic phosphorus compound, metal complex, amine compound, etc.) and a polymerization inhibitor (e.g., hydroquinone, etc.), for example, at a temperature of 60° C. or higher and 130° C. or lower for 1 to 10 hours to produce the resin [K2]. can.

The amount of (b) used is preferably 5 mol or more and 80 mol or less, more preferably 10 mol or more and 75 mol or less, per 100 mol of (a). Within this range, the storage stability of the curable composition, the developability of the cured film, and the solvent resistance, heat resistance and mechanical strength of the cured film tend to be well balanced.

Examples of organic phosphorus compounds as reaction catalysts include triphenylphosphine and the like. As the amine compound as the reaction catalyst, for example, an aliphatic tertiary amine compound or an aliphatic quaternary ammonium salt compound can be used. Specific examples thereof include tris(dimethylaminomethyl)phenol, triethylamine, tetrabutylammonium bromide, tetrabutylammonium chloride and the like. From the viewpoint of the developability of the cured film and the intensity of emitted light from the cured film, the reaction catalyst is preferably an organic phosphorus compound.

The amount of the reaction catalyst used is preferably 0.001 parts by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the total amount of (a), (b) and (c).
The amount of the polymerization inhibitor used is preferably 0.001 parts by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the total amount of (a), (b) and (c).

Reaction conditions such as the charging method, reaction temperature and time can be appropriately adjusted in consideration of the production equipment, the amount of heat generated by polymerization, and the like. As with the polymerization conditions, the charging method and the reaction temperature can be appropriately adjusted in consideration of the production equipment, the amount of heat generated by the polymerization, and the like.

For resin [K3], as the first step, a copolymer of (b) and (c) is obtained in the same manner as in the method for producing resin [K1] described above. In the same manner as described above, the obtained copolymer may be used as a solution after the reaction as it is, may be used as a concentrated or diluted solution, or may be converted into a solid (powder) by a method such as reprecipitation. You may use what was taken out as.

The ratio of structural units derived from (b) and (c) to the total number of moles of all structural units constituting the copolymer, respectively,
Structural units derived from (b); 5 mol% or more and 95 mol% or less Structural units derived from (c); preferably 5 mol% or more and 95 mol% or less,
Structural units derived from (b): 10 mol % or more and 90 mol % or less Structural units derived from (c): More preferably 10 mol % or more and 90 mol % or less.

Resin [K3] is prepared by adding a carboxylic acid or It can be obtained by reacting a carboxylic acid anhydride.
The amount of (a) to be reacted with the copolymer is preferably 5 mol or more and 80 mol or less per 100 mol of (b).

Resin [K4] is a resin obtained by reacting resin [K3] with a carboxylic acid anhydride. The hydroxy group generated by the reaction of the cyclic ether with the carboxylic acid or carboxylic anhydride is reacted with the carboxylic anhydride.
Examples of carboxylic anhydrides include maleic anhydride, citraconic anhydride, itaconic anhydride, 3-vinyl phthalic anhydride, 4-vinyl phthalic anhydride, and 3,4,5,6-tetrahydrophthalic anhydride. , 1,2,3,6-tetrahydrophthalic anhydride, dimethyltetrahydrophthalic anhydride, 5,6-dicarboxybicyclo[2.2.1]hept-2-ene anhydride and the like.
The amount of the carboxylic anhydride used is preferably 0.5 mol or more and 1 mol or less per 1 mol of the amount of (a) used.

Examples of resin [K1], resin [K2], resin [K3] and resin [K4] include benzyl (meth)acrylate/(meth)acrylic acid copolymer, styrene/(meth)acrylic acid copolymer, etc. resin [K1];
Resin obtained by adding glycidyl (meth)acrylate to benzyl (meth)acrylate/(meth)acrylic acid copolymer, glycidyl (meth)acrylate added to tricyclodecyl (meth)acrylate/styrene/(meth)acrylic acid copolymer resins such as tricyclodecyl (meth) acrylate / benzyl (meth) acrylate / (meth) acrylic acid copolymer with glycidyl (meth) acrylate added [K2]; tricyclodecyl ( (Meth)acrylate/glycidyl (meth)acrylate copolymer reacted with (meth)acrylic acid, tricyclodecyl (meth)acrylate/styrene/glycidyl (meth)acrylate copolymer with (meth)acrylic acid resin [K3] such as a resin obtained by reacting with tetrahydrophthalic anhydride; resin [K4] such as a resin such as
Among them, the resin (D) preferably contains at least one selected from the group consisting of resin [K2], resin [K3] and resin [K4].

Further examples of the resin (D) include alkali-soluble resins described in JP-A-2018-123274. The alkali-soluble resin has a double bond in the side chain and has a structural unit (α) represented by the following formula (I) and a structural unit (β ) and further containing an acid group (hereinafter also referred to as “resin (Da)”).
The acid group is, for example, a resin (Da) that is introduced into the resin by including a structural unit (γ) derived from an acid group-containing monomer (for example, (meth)acrylic acid, etc.). can. The resin (Da) preferably contains structural units (α), (β) and (γ) in its main chain skeleton.

［式中、Ｒ^Ａ及びＲ^Ｂは、同一又は異なって、水素原子又は炭素数１～２５の炭化水素基を表す。ｎは、式（Ｉ）で表される構成単位の平均繰り返し単位数を表し、１以上の数である。］

[In the formula, R ^A and R ^B are the same or different and represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms. n represents the average number of repeating units of the structural unit represented by formula (I), and is a number of 1 or more. ]

［式中、Ｒ^Ｃは、同一又は異なって、水素原子又はメチル基を表す。Ｒ^Ｄは、同一又は異なって、炭素数４～２０の直鎖状又は分岐鎖状炭化水素基を表す。ｍは、式（ＩＩ）で表される構成単位の平均繰り返し単位数を表し、１以上の数である。］

[In the formula, R 2 ^C is the same or different and represents a hydrogen atom or a methyl group. ^RD , which may be the same or different, represents a linear or branched hydrocarbon group having 4 to 20 carbon atoms. m represents the average number of repeating units of the structural unit represented by formula (II), and is a number of 1 or more. ]

In the resin (Da), from the viewpoint of the heat resistance and storage stability of the resin (Da), the content of the structural unit (α) is 100 mass of the total amount of all monomer units that provide the main chain skeleton of the resin (Da). %, for example, 0.5% by mass or more and 50% by mass or less, preferably 1% by mass or more and 40% by mass or less, more preferably 5% by mass or more and 30% by mass or less. n in formula (I) represents the average number of repeating units of the structural unit (α) in the resin (Da), and n can be set so that the content of the structural unit (α) is within the above range. can.

From the viewpoint of the solvent resistance of the cured film, the content of the structural unit (β) is, for example, 10% by mass or more and 90% by mass with respect to 100% by mass of the total amount of all monomer units that provide the main chain skeleton of the resin (Da). %, preferably 20% by mass or more and 80% by mass or less, more preferably 30% by mass or more and 75% by mass or less. m in the formula (II) represents the average number of repeating units of the structural unit (β) in the resin (Da), and is set so that the content of the structural unit (β) is within the range described above. can be done.

From the viewpoint of the solubility of the resin (Da) in alkaline substances and the solubility of the resin (Da) in the solvent (I), the content ratio of the structural unit (γ) is the total amount of monomers that provide the main chain skeleton of the resin (Da). For example, it is 0.5% by mass or more and 50% by mass or less, preferably 2% by mass or more and 50% by mass or less, more preferably 5% by mass or more and 45% by mass or less, relative to 100% by mass of the total amount of the units.

The resin (D) is one or more selected from the group consisting of the above resin [K1], resin [K2], resin [K3], resin [K4] and alkali-soluble resins described in JP-A-2018-123274. can include

Further examples of resin (D) include polyalkylene glycol compounds. Examples of polyalkylene glycol compounds include polyethylene glycol and polypropylene glycol. A polyalkylene glycol compound is advantageous in increasing the dispersibility of the quantum dots (A) in the curable composition.

The resin (D) preferably has a weight average molecular weight (Mw) in terms of standard polystyrene measured by gel permeation chromatography (GPC) of 9000 or less. When the resin (D) has the above Mw, it tends to be possible to improve the development speed of the cured film and to obtain a cured film with high emitted light intensity.
Mw of the resin (D) in terms of standard polystyrene is, for example, 1000 or more and 9000 or less, preferably 2000 or more and 8500 or less, more preferably 3000 or more and 8500 or less, from the viewpoint of the development speed of the cured film and the emitted light intensity.
In order to make the Mw of the resin (D) within the above range, reaction conditions such as selection of raw materials to be used, charging method, reaction temperature and time can be appropriately combined and adjusted.

The molecular weight distribution [weight average molecular weight (Mw)/number average molecular weight (Mn)] of the resin (D) measured by GPC is, for example, 1.0 or more and 6.0 or less. It is preferably 1.2 or more and 4.0 or less.

The acid value of the resin (D) is preferably 90 mgKOH/g or more and 150 mgKOH/g or less based on the solid content. If the acid value is less than 90 mgKOH/g, the solubility of the cured film in an alkaline developer may be low, which may leave a residue on the substrate. There is a high possibility that peeling of the cured pattern will occur.

The acid value of the resin (D) is preferably 95 mgKOH/g or more and 140 mgKOH/g or less, more preferably 100 mgKOH/g or more and 130 mgKOH/g or less, from the viewpoint of the developability of the cured film.

The acid value is a value measured as the amount (mg) of potassium hydroxide required to neutralize 1 g of resin (D), and can be determined, for example, by titration using an aqueous potassium hydroxide solution.

The resin (D) may contain a resin having a double bond equivalent of, for example, 300 g/eq or more and 2000 g/eq or less, preferably 500 g/eq or more and 1500 g/eq or less. When the resin (D) contains a resin having a double bond equivalent of 300 g/eq or more and 2000 g/eq or less, the phenomenon of quenching during the process of producing a cured pattern, which will be described later, tends to be easily prevented. If the resin (D) contains a resin having a double bond equivalent weight of more than 2000 g/eq, the resin (D) tends to be less effective at protecting the quantum dots (A). When the resin (D) contains a resin having a double bond equivalent weight of less than 300 g/eq, the cured pattern tends to peel off without being dissolved during development.
Resins having a double bond equivalent weight of 300 g/eq or more and 2000 g/eq or less include (meth)acrylic resins. The resin (D) preferably consists of a (meth)acrylic resin.

When the curable composition contains the resin (D), the content of the resin (D) in the curable composition is, for example, 5% by mass or more and 80% by mass or less with respect to the total solid content of the curable composition. , preferably 10% by mass or more and 65% by mass or less, more preferably 15% by mass or more and 45% by mass or less. When the content of the resin (D) is within the above range, the quantum dots (A) tend to be easily dispersed, and the emitted light intensity tends to be easily maintained at a high level during the step of producing a cured pattern described later. .

When the curable composition contains the resin (D), the mass ratio (solid content ratio) of the resin (D) to the photopolymerizable compound (B) is, for example, 1 or more, and from the viewpoint of the developability of the cured film , preferably 1.2 or more and 7.0 or less, more preferably 1.5 or more and 6.0 or less, and still more preferably 1.7 or more and 5.5 or less.

[6] Light scattering agent (E)
The curable composition can further comprise one or more light scattering agents (E). A cured film formed from the curable composition can exhibit light scattering properties. By including the light scattering agent (E) in the cured film, the light transmittance and viewing angle characteristics of the cured film can be controlled, and the intensity of light emitted from the cured film can be improved.

As the light scattering agent (E), inorganic particles such as metal or metal oxide particles and glass particles can be mentioned. particles. Examples of metal oxides include TiO ₂ , SiO ₂ , BaTiO ₃ , ZnO, etc. TiO ₂ particles are preferable because they efficiently scatter light. In general, the inorganic particles are difficult to disperse in a solvent as they are, so a dispersant, which will be described later, is usually used.

The particle size of the light scattering agent (E) is, for example, approximately 0.03 μm or more and 20 μm or less, and is preferably 0.05 μm or more and 1 μm or less from the viewpoint of improving the light scattering ability and dispersibility in the curable composition. and more preferably 0.05 μm or more and 0.5 μm or less.

As the light scattering agent (E), a dispersing agent may be used in which the light scattering agent is previously dispersed in part or all of the solvent (I). A commercial item can be used as a dispersing agent.
Examples of commercially available products include:
BYK-Chemie Japan DISPERBYK-101, 102, 103, 106, 107, 108, 109, 110, 111, 116, 118, 130, 140, 154, 161, 162, 163, 164, 165, 166, 170, 171, 174, 180, 181, 182, 183, 184, 185, 190, 192, 2000, 2001, 2020, 2025, 2050, 2070, 2095, 2150, 2155; ANTI-TERRA-U, U100, 203, 204, 250,; BYK-P104, P104S, P105, 220S, 6919; BYK-LPN6919, 21116; LACTIMON, LACTIMON-WS;
SOLSPERSE-3000, 9000, 13000, 13240, 13650, 13940, 16000, 17000, 18000, 20000, 21000, 24000, 26000, 27000, 28000, 31845, 32000, 32500, 325050, 325050, 325050, 325050, 325050 34750, 35100, 36600, 38500, 41000, 41090, 53095, 55000, 76500 etc.;
EFKA-46, 47, 48, 452, 4008, 4009, 4010, 4015, 4020, 4047, 4050, 4055, 4060, 4080, 4400, 4401, 4402, 4403, 4406, 4408, 4300, 4310 manufactured by BASF, 4320, 4330, 4340, 450, 451, 453, 4540, 4550, 4560, 4800, 5010, 5065, 5066, 5070, 7500, 7554, 1101, 120, 150, 1501, 1502, 1503, etc.;
Ajinomoto Fine-Techno Co., Ltd. Ajisper PA111, PB711, PB821, PB822, PB824, and the like.

When the curable composition contains a light scattering agent (E), the content of the light scattering agent (E) in the curable composition is, for example, 0.001% by mass or more with respect to the total solid content of the curable composition. 50% by mass or less, preferably 1% by mass or more and 30% by mass or less, more preferably 2% by mass, from the viewpoint of the developability of the cured film, the viewpoint of improving the light scattering ability, and the viewpoint of improving the emitted light intensity of the cured film. 10 mass % or less, more preferably 3 mass % or more and 8 mass % or less.

[7] Antioxidant (F)
The curable composition may further comprise one or more antioxidants (F).
The antioxidant (F) is not particularly limited as long as it is an antioxidant that is commonly used industrially, and includes phenol antioxidants, phosphorus antioxidants, phosphorus/phenol composite antioxidants and sulfur antioxidants. An antioxidant or the like can be used.

The phosphorus/phenol composite antioxidant can be a compound having one or more phosphorus atoms and one or more phenol structures in the molecule. From the viewpoint of the developability of the cured film and the intensity of emitted light, the antioxidant (F) preferably contains a phosphorus/phenol composite antioxidant.

Phenolic antioxidants include, for example, Irganox (registered trademark) 1010 (Irganox 1010: pentaerythritol tetrakis [3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate], BASF Corporation). ), 1076 (Irganox 1076: octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, manufactured by BASF Corporation), 1330 (Irganox 1330: 3,3′,3 '',5,5',5''-hexa-tert-butyl-a,a',a''-(mesitylene-2,4,6-triyl)tri-p-cresol, manufactured by BASF Corporation) , 3114 (Irganox 3114: 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H )-trione, manufactured by BASF Corporation), 3790 (Irganox 3790: 1,3,5-tris((4-tert-butyl-3-hydroxy-2,6-xylyl)methyl)-1,3,5 -triazine-2,4,6(1H,3H,5H)-trione, manufactured by BASF Corporation), 1035 (Irganox 1035: thiodiethylenebis[3-(3,5-di-tert-butyl-4- Hydroxyphenyl) propionate], manufactured by BASF Corporation), Irganox 1135: 3,5-bis(1,1-dimethylethyl)-4-hydroxy-C7-C9 side chain alkyl ester of benzenepropanoic acid, BASF Co., Ltd.), 1520L (Irganox 1520L: 4,6-bis(octylthiomethyl)-o-cresol, manufactured by BASF), 3125 (Irganox 3125, manufactured by BASF), 565 ( Irganox 565: 2,4-bis(n-octylthio)-6-(4-hydroxy-3',5'-di-tert-butylanilino)-1,3,5-triazine, manufactured by BASF Corporation), Adekastab (registered trademark) AO-80 (ADEKA STAB AO-80: 3,9-bis(2-(3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionyloxy)-1,1-dimethylethyl )-2,4,8,10-tetraoxaspiro(5,5)undecane, manufactured by ADEKA Co., Ltd.), Sumilizer (registered trademark) BHT, GA-80 of the same , GS (manufactured by Sumitomo Chemical Co., Ltd.), Cyanox (registered trademark) 1790 (manufactured by Cytec Co., Ltd.), vitamin E (manufactured by Eisai Co., Ltd.), and the like.

Examples of phosphorus antioxidants include Irgafos (registered trademark) 168 (Irgafos 168: tris (2,4-di-tert-butylphenyl) phosphite, manufactured by BASF Corporation), Irgafos 12 (Irgafos 12: tris [2-[[2,4,8,10-tetra-tert-butyldibenzo[d,f][1,3,2]dioxaphosphine-6-yl]oxy]ethyl]amine, BASF Corporation ), 38 (Irgafos 38: bis(2,4-bis(1,1-dimethylethyl)-6-methylphenyl)ethyl ester phosphorous acid, manufactured by BASF Corporation), Adekastab (registered trademark) 329K, PEP36, PEP-8 (manufactured by ADEKA Co., Ltd.), Sandstab P-EPQ (manufactured by Clariant), Weston (registered trademark) 618, 619G (manufactured by GE), Ultranox 626 (manufactured by GE) etc.

Phosphorus/phenol composite antioxidants include, for example, Sumilizer (registered trademark) GP (6-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propoxy]-2,4,8, 10-tetra-tert-butyldibenz[d,f][1.3.2]dioxaphosphepin) (manufactured by Sumitomo Chemical Co., Ltd.) and the like.

Examples of sulfur-based antioxidants include dialkylthiodipropionate compounds such as dilauryl thiodipropionate, dimyristyl or distearyl, and β-alkylmercaptopropionate esters of polyols such as tetrakis[methylene(3-dodecylthio)propionate]methane. compounds and the like.

When the curable composition contains an antioxidant (F), the content of the antioxidant (F) in the curable composition is, for example, 1 part by mass or more with respect to 100 parts by mass of the resin (D), From the viewpoint of easily increasing the heat resistance of the cured film, it is preferably 2 parts by mass or more, more preferably 3 parts by mass or more, even more preferably 5 parts by mass or more, particularly preferably 7 parts by mass or more, for example 50 parts by mass or less. From the viewpoint of easily increasing the mechanical strength of the cured film, it is preferably 40 parts by mass or less, more preferably 30 parts by mass or less, and even more preferably 25 parts by mass or less.

[8] Leveling agent (G)
The curable composition can further comprise one or more leveling agents (G). By containing the leveling agent (G), the flatness of the cured film can be improved.
Examples of the leveling agent (G) include silicone-based surfactants, fluorine-based surfactants, and silicone-based surfactants having fluorine atoms. These may have a polymerizable group in the side chain. The leveling agent (G) is preferably a fluorosurfactant from the viewpoint of the developability of the cured film and the intensity of emitted light.

Examples of silicone-based surfactants include surfactants having a siloxane bond in the molecule. Specifically, Toray Silicone DC3PA, Toray SH7PA, Toray DC11PA, Toray SH21PA, Toray SH28PA, Toray SH29PA, Toray SH30PA, Toray SH8400 (trade name: Dow Corning Toray Co., Ltd.), KP321, KP322, KP323, KP324 , KP326, KP340, KP341 (manufactured by Shin-Etsu Chemical Co., Ltd.), TSF400, TSF401, TSF410, TSF4300, TSF4440, TSF4445, TSF4446, TSF4452 and TSF4460 (manufactured by Momentive Performance Materials Japan LLC), etc. .

Examples of fluorine-based surfactants include surfactants having a fluorocarbon chain in the molecule. Specifically, Florard (registered trademark) FC430, Florard FC431 (manufactured by Sumitomo 3M Co., Ltd.), Megafac (registered trademark) F142D, Florado F171, Flora F172, Flora F173, Flora F177, Flora F183, Flora F554 F575, R30, RS-718-K (manufactured by DIC Corporation), F-top (registered trademark) EF301, EF303, EF351, EF352 (manufactured by Mitsubishi Materials Electronic Chemicals Co., Ltd.), Surflon (registered trademark) ) S381, S382, SC101, SC105 (manufactured by Asahi Glass Co., Ltd.) and E5844 (manufactured by Daikin Fine Chemicals Laboratory Co., Ltd.).

Examples of fluorine atom-containing silicone-based surfactants include surfactants having siloxane bonds and fluorocarbon chains in the molecule. Specifically, Megafac (registered trademark) R08, Megafac BL20, Megafac F475, F477 and F443 (manufactured by DIC Corporation) and the like can be mentioned.

When the curable composition contains a leveling agent (G), the content of the leveling agent (G) in the curable composition is, for example, 0.001% by mass or more and 1.0% by mass with respect to the total amount of the curable composition % or less, preferably 0.005% by mass or more and 0.75% by mass or less, more preferably 0.01% by mass or more and 0.5% by mass or less, still more preferably 0.05% by mass or more and 0.5% by mass or less It is below. When the content of the leveling agent (G) is within the above range, the flatness of the cured film can be improved.

The curable composition may optionally contain photopolymerization initiation aids, polymerization inhibitors, fillers, other polymer compounds, adhesion promoters, light stabilizers, chain transfer agents, etc. known in the art. Additives may also be included.

[9] Solvent (I)
The curable composition can further comprise one or more solvents (I). The solvent (I) is not particularly limited as long as it dissolves the photopolymerizable compound (B), and solvents commonly used in the art can be used. For example, ester solvent (solvent containing -COO- in the molecule but not containing -O-), ether solvent (solvent containing -O- in the molecule but not containing -COO-), ether ester solvent (solvent containing -COO- in the molecule solvent containing -COO- and -O-), ketone solvent (solvent containing -CO- in the molecule and not containing -COO-), alcohol solvent (containing OH in the molecule, -O-, - solvents containing no CO- and COO-), aromatic hydrocarbon solvents, amide solvents, dimethyl sulfoxide and the like.
When the curable composition further contains the photopolymerization initiator (C) and/or the resin (D), the solvent (I) is preferably one that dissolves them.

Ester solvents include methyl lactate, ethyl lactate, n-butyl lactate, methyl 2-hydroxyisobutanoate, ethyl acetate, n-butyl acetate, isobutyl acetate, n-pentyl formate, isopentyl acetate, n-butyl propionate, and isopropyl butyrate. , ethyl butyrate, n-butyl butyrate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, cyclohexanol acetate and γ-butyrolactone.

Ether solvents include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, and propylene glycol monoethyl ether. , propylene glycol monopropyl ether, propylene glycol monobutyl ether, 3-methoxy-1-butanol, 3-methoxy-3-methylbutanol, tetrahydrofuran, tetrahydropyran, 1,4-dioxane, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, anisole, phenetol, methylanisole and the like.

Ether ester solvents include methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, 3-ethoxy ethyl propionate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, methyl 2-methoxy-2-methylpropionate, Ethyl 2-ethoxy-2-methylpropionate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, ethylene glycol monomethyl Ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate and the like.

Ketone solvents include 4-hydroxy-4-methyl-2-pentanone, acetone, 2-butanone, 2-heptanone, 3-heptanone, 4-heptanone, 4-methyl-2-pentanone, cyclopentanone, cyclohexanone and isophorone. etc.

Alcohol solvents include methanol, ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, propylene glycol and glycerin. Aromatic hydrocarbon solvents include benzene, toluene, xylene and mesitylene. Amide solvents include N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, and the like.

Examples of the solvent (I) include propylene glycol monomethyl ether acetate, ethyl lactate, propylene glycol monomethyl ether, ethyl 3-ethoxypropionate, ethylene glycol monomethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, 4-hydroxy-4- Methyl-2-pentanone, toluene, or mixtures of two or more thereof are preferred, more preferably propylene glycol monomethyl ether acetate.

The solvent (I) is a component other than the solid content of the curable composition, and the solvent contained in the quantum dots (A), the resin (D), the light scattering agent (E), etc. is also included in the solvent (I). .

<Method for producing curable composition>
The curable composition can be prepared by a process that includes mixing the given ingredients, as well as other optional ingredients. The method for producing the curable composition can further include the step of preparing resin (D).

The curable composition (hereinafter also referred to as “curable composition M”) according to the first embodiment contains a resin (D). The curable composition M contains quantum dots (A), a photopolymerizable compound (B) and a resin (D), and preferably further contains a photopolymerization initiator (C). The curable composition M preferably contains a solvent (I) in order to improve the coatability of the composition and the flatness of the composition layer during coating.

The content of the photopolymerizable compound (B) in the curable composition M is, for example, 5% by mass or more and 50% by mass or less, preferably 7% by mass or more and 40% by mass, based on the total solid content of the curable composition. Below, it is more preferably 10% by mass or more and 35% by mass or less, still more preferably 13% by mass or more and 30% by mass or less, and even more preferably 15% by mass or more and 30% by mass or less.

The content of the solvent (I) in the curable composition M is, for example, 40% by mass or more and 95% by mass or less, preferably 45% by mass or more and 90% by mass or less, more preferably It is 50 mass % or more and 80 mass % or less.

The curable composition according to the second embodiment (hereinafter also referred to as “curable composition N”) does not contain resin (D). The curable composition N contains quantum dots (A) and a photopolymerizable compound (B), and preferably further contains a photopolymerization initiator (C). The curable composition N may contain the solvent (I), but preferably does not contain the solvent (I) or contains a small amount of the solvent (I).

The content of the photopolymerizable compound (B) in the curable composition N is, for example, 10% by mass or more and 70% by mass or less, preferably 15% by mass or more and 60% by mass, based on the total solid content of the curable composition. Below, it is more preferably 20% by mass or more and 45% by mass or less, still more preferably 25% by mass or more and 40% by mass or less, and even more preferably 30% by mass or more and 40% by mass or less.

The content of the solvent (I) in the curable composition N is preferably 10% by mass or less, more preferably 5% by mass or less, still more preferably 3% by mass or less, and more preferably 3% by mass or less, relative to the total amount of the curable composition N. It is preferably 2% by mass or less, particularly preferably 1% by mass or less, and may be 0% by mass or 0.5% by mass or more. By reducing the content of the solvent (I), it becomes easier to control the film thickness when forming a cured film, and it is possible to reduce the production cost and the load on the global environment and working environment caused by the solvent. The curable composition N can be suitably used as an ink for inkjet printers.

<<Method for producing cured film>>
The production method according to the present invention is a method for producing a cured film of a curable composition, and the curable composition contains at least quantum dots (A) and a photopolymerizable compound (B).
The production method according to the present invention is suitable as a method for producing a cured film having a high Martens hardness, and is a cured film of a curable composition containing quantum dots (A) and a photopolymerizable compound (B). Therefore, it is suitable as a method for producing a cured film having a Martens hardness of more than 0.10 GPa. As for the preferable range of the Martens hardness of the cured film obtained by the production method according to the present invention, the description in the above <<cured film>> is cited.

A manufacturing method according to the present invention includes the following steps.
A film of a curable composition containing quantum dots (A) and a photopolymerizable compound (B) (hereinafter also referred to as a "composition layer") is exposed to light, and the composition layer is heat-cured. heat curing process.
It is preferable to carry out a heat curing process after the exposure process.

The method for producing a cured film can include steps other than the above steps. Other steps include, for example, a coating step of applying the curable composition to the substrate, a discharging step of discharging the curable composition onto regions of the substrate formed with banks and partitioned by the banks, a coating step, or a discharging step. Examples include a drying step of drying the composition layer that has been exposed, and a developing step that is performed on the composition layer after the exposure step. The cured film may be formed on the entire surface of the substrate, or may be formed as a cured pattern on a part of the substrate surface. In the present specification, the cured pattern is one aspect of a cured film, and refers to a cured film formed in a pattern.

The curable composition used for forming the cured film contains the quantum dots (A) and the photopolymerizable compound (B), examples of which include the curable composition described in <Curable composition> above. is.

The application step is a step of applying a curable composition to a substrate to form a composition layer. Examples of coating methods include a spin coating method, a slit coating method, a slit and spin coating method, and the like. The ejection step may be a step of selectively ejecting and adhering the curable composition to regions defined by the banks by, for example, an inkjet method.

Examples of the substrate include glass plates such as quartz glass, borosilicate glass, alumina silicate glass, and soda-lime glass whose surface is coated with silica; resin plates such as polycarbonate, polymethyl methacrylate, and polyethylene terephthalate; and aluminum, silver, silver/copper/palladium alloy thin films, and the like. The substrate is preferably a glass plate, a silicon substrate, or the like.

The substrate may be pretreated to adjust the wettability of the substrate surface. Examples of the pretreatment include washing with a solvent such as alcohol or acetone, acid treatment, alkali treatment, plasma treatment, corona treatment, and the like. By selecting an appropriate pretreatment for the substrate on which the cured film is to be laminated, the coatability of the curable composition can be improved over the untreated substrate.

When the curable composition contains the solvent (I), it is preferable to carry out a drying step for removing volatile components such as the solvent (I) from the composition layer after the coating step. The drying step may include heat drying (pre-baking) treatment, may include vacuum drying treatment, or may include both of them.
The temperature for heat drying is preferably 30° C. or higher and 120° C. or lower, more preferably 50° C. or higher and 110° C. or lower. The heating time is preferably 10 seconds or more and 60 minutes or less, more preferably 30 seconds or more and 30 minutes or less.
When drying under reduced pressure, it is preferable to carry out under a pressure of 50 Pa or more and 150 Pa or less in a temperature range of 20° C. or more and 25° C. or less.

The thickness of the composition layer after the coating step, after the discharging step, or after the drying step is not particularly limited, and may be appropriately selected according to the desired thickness of the cured film. It is preferably 1.5 μm or more and 18 μm or less, more preferably 2 μm or more and 14 μm or less, and still more preferably 2 μm or more and 12 μm or less. The film thickness of the finally obtained cured film may also be the same as described above.

Next, an exposure process is performed on the composition layer after the coating process, after the discharging process, or after the drying process. The exposed composition layer is cured by polymerization of the photopolymerizable compound (B) and the like contained in the composition layer. A light source used for exposure is preferably a light source that emits light having a wavelength of 250 nm or more and 450 nm or less. When the curable composition contains the photoinitiator (C), from the light of the above wavelengths, bandpass light around 436 nm, around 408 nm, or around 365 nm, depending on the absorption wavelength of the photoinitiator (C). It may be selectively taken out by a filter. Specific examples of light sources include mercury lamps, light-emitting diodes, metal halide lamps, and halogen lamps.

The exposure amount X in the exposure step is preferably 50 mJ/cm ² or more, more preferably 80 mJ/cm ² or more, still more preferably 100 mJ/cm ² or more, from the viewpoint of increasing the Martens hardness of the resulting cured film. It is preferably 150 mJ/cm ² or more. The exposure dose X is usually 1000 mJ/cm ² or less, preferably 800 mJ/cm ² or less, more preferably 700 mJ/cm ² or less. When the exposure dose X in the exposure step is 1000 mJ/cm ² or less, the cured film can be prevented from shrinking excessively, so the quantum dots (A) can be prevented from coming close to each other in the film due to the shrinkage of the cured film, and the emitted light can be A decrease in strength can be prevented.

The exposure amount X is the exposure amount at a wavelength of 365 nm, and can be measured using an ultraviolet integrating photometer (UIT-250, manufactured by Ushio Inc.).

An example of a method for forming a cured pattern, which is one aspect of a cured film, is a photolithographic method. Photolithography is a method of exposing and developing a composition layer through a photomask for forming a desired cured pattern. In this case, it is possible to uniformly irradiate the entire exposure surface with parallel light rays, and to perform accurate alignment between the photomask and the substrate on which the composition layer is formed. is preferably used.

By subjecting the composition layer after the exposure step to a development step in which the composition layer is brought into contact with a developer for development, the unexposed portion of the composition layer is dissolved in the developer and removed, thereby imparting a pattern to the composition layer. . Examples of the developer include aqueous solutions of alkaline compounds such as potassium hydroxide, sodium hydrogen carbonate, sodium carbonate, tetramethylammonium hydroxide, and organic solvents. The concentration of the alkaline compound in the aqueous solution is preferably 0.01% by mass or more and 10% by mass or less, more preferably 0.03% by mass or more and 5% by mass or less. Examples of the organic solvent include those similar to the solvent (I) described above. The developer may contain a surfactant.
The developing method may be any of a puddle method, a dipping method, a spray method, and the like. Furthermore, the substrate may be tilted at any angle during development.

The composition layer after the exposure step or after the development step is thermally cured (post-baked) in the thermal curing step. Polymerization of the photopolymerizable compound (B) and the like can be further advanced by the heat curing step.

The thermosetting temperature Y in the thermosetting step is preferably 90° C. or higher, more preferably 100° C. or higher, still more preferably 120° C. or higher, still more preferably 150° C., from the viewpoint of increasing the Martens hardness of the resulting cured film. That's it. The thermosetting temperature Y is usually 250° C. or lower, preferably 240° C. or lower, more preferably 235° C. or lower. When the thermosetting temperature Y in the thermosetting step is 250 ° C. or less, the cured film can be prevented from shrinking too much, so the quantum dots (A) can be prevented from coming close to each other in the film due to the shrinkage of the cured film. A decrease in strength can be prevented.

The thermosetting time Z in the thermosetting step is preferably 0.1 hr or longer, more preferably 0.2 hr or longer, still more preferably 0.4 hr or longer, and even more preferably, from the viewpoint of increasing the Martens hardness of the resulting cured film. is 0.5 hr or more. The heat curing time Z is usually 2 hours or less, preferably 1.5 hours or less, more preferably 1.2 hours or less.

The thermosetting process can be performed in an air atmosphere or in a vacuum atmosphere. From the viewpoint of increasing the Martens hardness of the cured film to be obtained and from the viewpoint of increasing the emitted light intensity of the cured film, the heat curing step is preferably performed in a vacuum atmosphere. A vacuum atmosphere refers to a pressure range of 150 Pa or less, preferably 120 Pa or less, more preferably 100 Pa or less, and may be 50 Pa or more.

Other examples of the method for forming a cured pattern, which is one aspect of the cured film, include an inkjet method and a printing method. As a method for forming a cured pattern by an inkjet method, for example, after forming a bank on a substrate, a curable composition is selectively adhered to the regions of the substrate defined by the bank by an inkjet method, followed by an exposure step. A method of curing the curable composition by heat-curing in the exposure and/or heat-curing step. As a method for forming the bank, a photolithographic method, an inkjet method, and the like can be mentioned, and the bank is preferably formed by the inkjet method.

The exposure amount X (mJ/cm ² ) in the exposure step, the thermosetting temperature Y (° C.) in the thermosetting step, and the thermosetting time Z (hr) are given by the following formula (1):
X×Y×Z ² ≧6500 (1)
meet.
By performing the exposure step and the heat curing step so as to satisfy the formula (1), a cured film having a high Martens hardness can be produced, and a cured film having a Martens hardness of greater than 0.10 GPa can be produced. becomes possible. Hereinafter, X×Y× ^Z2 is also referred to as a P value.

From the viewpoint of producing a cured film having a high Martens hardness, the P value is preferably 7,000 or more, more preferably 8,000 or more, still more preferably 10,000 or more, even more preferably 15,000 or more, particularly preferably 17,500 or more, and particularly preferably 17,500 or more. Preferably it is 20000 or more. From the viewpoint of suppressing a decrease in the emitted light intensity of the cured film, the P value is preferably 150,000 or less, more preferably 140,000 or less, and even more preferably 120,000 or less. Further, when the P value is within the above range, the dispersibility of the quantum dots (A) and the light scattering agent (E) in the cured film increases, so that it is easy to obtain a cured film with small variations in emitted light intensity.

<<Display Device>>
Since the cured film has a function of converting the wavelength of irradiated light, it can be used as a color conversion layer (wavelength conversion film) of a display device. Examples of such display devices include, for example, JP-A-2006-309219, JP-A-2006-310303, JP-A-2013-15812, JP-A-2009-251129, JP-A-2014-2363, etc. and the display device described in .
The cured film according to the present invention is useful as a color conversion layer (wavelength conversion film) for display devices, particularly liquid crystal display devices, organic EL display devices or inorganic EL display devices.

The present invention will be described in more detail below with reference to examples. Unless otherwise specified, "%" and "parts" in the examples are % by mass and parts by mass.

[Measurement of Martens hardness of cured film]
The cured film formed on the substrate was subjected to a load-unload test by attaching a Berkovich pyramidal indenter to an ultra-micro hardness tester (ENT-2100, manufactured by Elionix) to measure the load/indentation curve. The measurement temperature was room temperature. Here, the maximum test load was 6 mN and unloaded to 0 mN without holding time. ENT-Win ver. 7.50 (manufactured by Elionix) to determine the indentation hardness and Martens hardness (GPa).

[Measurement of outgoing light intensity of cured film]
An LED lamp with an emission wavelength of 444 nm and a narrow directivity angle type sensing backlight (OPF series; manufactured by Optex FA Co., Ltd.) equipped with a scratch-resistant cover were prepared as a backlight. A backlight was placed with the scratch-resistant cover facing upward, and an optical fiber for detecting light emission connected to the spectrometer described below was installed at a height of 4 cm from the surface of the scratch-resistant cover. A glass substrate (Eagle 2000; manufactured by Corning Incorporated) was placed as a reference on the surface of the scratch-resistant cover of the backlight. In this state, the backlight was turned on, and the light amount of the backlight was adjusted so that the total radiant flux (μW) of the backlight was 5000 μW through the reference glass substrate (Eagle 2000; manufactured by Corning Incorporated).

Next, a substrate having a cured film was placed on the surface of the reference glass substrate. In this state, the backlight was turned on, and the emitted light intensity (unit: μW) was measured as the integrated radiant flux in the wavelength range of 485 nm to 780 nm for the light emitted from the cured film. A spectrometer Spectrum meter (manufactured by Ocean Optics) was used to measure the emitted light intensity.

[Measurement of pencil hardness of cured film]
Using a tribogear reciprocating abrasion tester (TYPE: 30, manufactured by HEIDON), JIS K5600-5-4: 1999 "Paint general test method-Part 5: Mechanical properties of coating film-Section 4: Scratch hardness ( The pencil hardness of the surface of the cured film formed on the substrate was measured according to the pencil hardness test specified in "Pencil Method". The load in the measurement was 500 g, and the speed was 40 mm/sec.

[Weight average molecular weight]
The weight average molecular weight (Mw) of resin (D1) was measured by GPC under the following conditions.
Apparatus; K2479 (manufactured by Shimadzu Corporation)
Column; SHIMADZU Shim-pack GPC-80M
Column temperature; 40°C
Solvent; Tetrahydrofuran Flow rate; 1.0 mL/min
detector; RI
Calibration standard material; TSK STANDARD POLYSTYRENE F-40, F-4, F-288, A-2500, A-500 (manufactured by Tosoh Corporation)

[Acid value]
Accurately weigh 3 g of the resin (D1) solution, dissolve it in a mixed solvent of 90 g of acetone and 10 g of water, and use a 0.1 N KOH aqueous solution as a titrant, using an automatic titrator (manufactured by Hiranuma Sangyo Co., Ltd., trade name: COM-555), the acid value of the resin (D1) solution was measured, and the acid value (AV) per 1 g of solid content was determined from the acid value of the solution and the solid content of the solution.

[Solid content]
About 1 g of the resin (D1) solution was weighed into an aluminum cup, dried at 180° C. for 1 hour, and then weighed. The solid content (% by mass) of the resin (D1) solution was calculated from the amount of mass reduction.

(Production Example 1: Preparation of dispersion liquid c of quantum dots (A1))
A toluene dispersion a of InP/ZnSeS quantum dots (A1) coordinated with oleic acid as a ligand (H2) was prepared. Dispersion a was distilled under reduced pressure to remove toluene. 70 parts of cyclohexyl acetate was added to 30 parts of solid content to obtain dispersion b (30% solid content). A predetermined amount of ligand (H1) is added to dispersion b and stirred at 80° C. for 2 hours to obtain a dispersion of quantum dots (A1) containing ligand (H1) and ligand (H2). obtained c.

(Production Example 2: Preparation of dispersion liquid of light scattering agent (E1))
To 70 parts of _TiO2 nanoparticles, 3 parts of DISPERBYK21116 (manufactured by BYK-Chemie Japan) in terms of solid content and propylene glycol monomethyl ether acetate (hereinafter referred to as "PGMEA") were added so that the total amount was 100 parts, and then the paint was applied. The mixture was stirred with a shaker until it was sufficiently dispersed to obtain a dispersion of the scattering agent (E1) (solid content: 73%).

(Production Example 3: Preparation of resin (D1) solution)
After putting 110 parts of PGMEA into a flask equipped with a stirrer, a reflux condenser with a thermometer, a dropping funnel and a nitrogen introduction tube, the mixture was stirred while being replaced with nitrogen, and the temperature was raised to 80°C. A solution of 25 parts of dicyclopentanyl methacrylate, 23 parts of methyl methacrylate, 19 parts of methacrylic acid, and 10 parts of 2,2′-azobis(2,4-dimethylvaleronitrile) dissolved in 110 parts of PGMEA was added from the dropping funnel into the flask. After dropping, the mixture was stirred at 80° C. for 3 hours.
Next, 16 parts of glycidyl methacrylate, 0.4 parts of 2,2'-methylenebis(4-methyl-6-tert-butylphenol), and 0.8 parts of triphenylphosphine are put into the flask and heated to 110°C. Stirring for 8 hours allowed the carboxylic acid in the polymer to react with the epoxy group to introduce a polymerizable unsaturated bond. Then, 17 parts of 1,2,3,6-tetrahydrophthalic anhydride was added and the reaction was continued for 3 hours to introduce a carboxylic acid group into the side chain. A resin (D1) solution was obtained by cooling the reaction solution to room temperature.
The resin (D1) had a weight average molecular weight converted to standard polystyrene of 8400 and an acid value of 120 mgKOH/g, and the solid content in the resin (D1) solution was 40% by mass.

(Production Example 4: Preparation of curable composition 1)
The dispersion liquid c obtained in Production Example 1, the dispersion liquid of the light scattering agent (E1) obtained in Production Example 2, the resin (D1) solution obtained in Production Example 3, and other components shown in Table 1 A curable composition 1 was prepared by mixing predetermined amounts of each component. In addition, in examples other than Example 3 described later, as the InP/ZnSeS quantum dots (A1), the curability using dispersion c containing quantum dots having an emission spectrum with a maximum peak wavelength of 530 nm and a full width at half maximum of 42 nm A cured film was formed from Composition 1. In Example 3, as the InP/ZnSeS quantum dots (A1), a cured film was formed from the curable composition 1 using dispersion c containing quantum dots having an emission spectrum with a maximum peak wavelength of 630 nm and a full width at half maximum of 42 nm. formed.
The emission spectrum of the quantum dot (A1) was measured using an absolute PL quantum yield measurement device ("C9920-02" manufactured by Hamamatsu Photonics, excitation light 450 nm, room temperature, in the atmosphere), and the absorbance at a wavelength of 450 nm was 0.4. A dispersion liquid of quantum dots (A1) diluted so as to be measured as a measurement sample.

Table 1 shows the composition of the obtained curable composition 1. In Table 1, the contents of the components other than the solvent (I) are in terms of solid content (unit: parts by mass). The unit for the content of solvent (I) is parts by mass. For example, the quantum dots (A1) are blended as a dispersion c of the quantum dots (A1) in the preparation of the curable composition 1, but the content shown in Table 1 is the quantum dots contained in the dispersion ( A1) It is a quantity in itself. Solvent (I) in Table 1 includes the solvent contained in the dispersion or solution used in the preparation of curable composition 1.

Details of the abbreviations of the components shown in Table 1 are as follows.
[1] Photopolymerizable compound (B1): M-510 (carboxy group-containing polyfunctional (meth)acrylate, trade name "Aronix M-510" manufactured by Toagosei Co., Ltd., solid content 100%). This compound corresponds to the photopolymerizable compound (B-3a) described above.
[2] Photopolymerizable compound (B2): A-9550 (dipentaerythritol polyacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd., solid content 100%). This compound corresponds to the photopolymerizable compound (B-3b) described above.
[3] Photopolymerization initiator (C1): a compound represented by the following formula. It was produced by the method described in JP-A-2011-132215 (solid content 100%).

[4] Antioxidant (F1): Sumilizer-GP (phosphorus/phenol composite antioxidant, manufactured by Sumitomo Chemical Co., Ltd., solid content 100%)
[5] Leveling agent (G1): F-575 (fluorine-based leveling agent, manufactured by DIC Corporation, solid content 10%, containing PGMEA)
[6] Ligand (H1): 3-mercaptopropionic acid (manufactured by Tokyo Chemical Industry Co., Ltd., solid content 100%)
[7] Ligand (H2): oleic acid [8] Solvent (I1): PGMEA (propylene glycol monomethyl ether acetate)
[9] Solvent (I2): cyclohexyl acetate

(Production Example 5: Preparation of quantum dot (A1) dried product)
A toluene dispersion a of InP/ZnSeS quantum dots (A1) coordinated with oleic acid as a ligand (H2) was prepared. The dispersion liquid a was distilled under reduced pressure to remove toluene to obtain a dried quantum dot (A1).

(Production Example 6: Preparation of dispersion liquid of light scattering agent (E2))
DISPERBYK21116 (manufactured by BYK-Chemie Japan) was added to 60 parts of _TiO2 nanoparticles in a solid content of 10 parts, and PGMEA was added so that the total amount was 100 parts. A dispersion of (E2) (solid content 70%) was obtained.

(Production Example 7: Preparation of curable composition 2)
Quantum dot (A1) dried product obtained in Production Example 5, photopolymerizable compound (B1), 2-(2-vinyloxyethoxy) ethyl acrylate (manufactured by Nippon Shokubai Co., Ltd. VEEA (registered trademark)) and ethyl methacrylate (Light Ester E manufactured by Kyoeisha Chemical Co., Ltd.) as a photopolymerizable compound (B4) were added in a predetermined amount shown in Table 2, and the solid matter was removed with an ultrasonic cleaner and a touch mixer. A quantum dot monomer dispersion was obtained by stirring until it disappeared. The photopolymerizable compound (B3) corresponds to the photopolymerizable compound (B-4) described above, and the photopolymerizable compound (B4) corresponds to the photopolymerizable compound (B-1) described above.

A dispersion of the light scattering agent (E2), a photopolymerization initiator, an antioxidant, and a leveling agent were added to the obtained dispersion so as to have the formulation shown in Table 2, and the mixture was stirred with a touch mixer. A curable composition 2 was prepared. In Example 6, as the InP/ZnSeS quantum dots (A-1), a cured film was formed from the curable composition 2 containing quantum dots having an emission spectrum with a maximum peak wavelength of 630 nm and a full width at half maximum of 42 nm.

Table 2 shows the composition of the obtained curable composition 2. In Table 2, the contents of the components other than the solvent (I) are in terms of solid content (unit: parts by mass). The unit for the content of solvent (I) is parts by mass. Solvent (I) in Table 2 includes the solvent contained in the dispersion or solution used in the preparation of curable composition 2. In addition, the content of quantum dots (A) in Table 2 also includes the ligand (H2).

Details of the abbreviations for the components shown in Table 2 are as follows.
[10] Photopolymerization initiator (C2): OMNIRAD (registered trademark) 907 (manufactured by IGM Resins)
[11] Leveling agent (G2): Megafac (registered trademark) F-554 (manufactured by DIC)

<Example 1>
On a 5 cm square glass substrate (Eagle 2000; manufactured by Corning), the curable composition 1 obtained in Production Example 4 was applied by spin coating to a thickness of 10 μm, and then heated at 100° C. for 3 minutes. A film of the curable composition 1 was formed by performing the drying step (pre-baking). This film is exposed to light at an exposure dose of 200 mJ/cm ² (365 nm standard) using an exposure machine (TME-150RSK; manufactured by Topcon Corporation) in an air atmosphere, After the development, a heat curing process (post-baking) was performed at 180° C. for 1 hour in a vacuum atmosphere (pressure: 100 kPa) to obtain a substrate having a cured film.

<Examples 2 to 5, Comparative Example 1>
Example except that the exposure amount X (mJ/cm ² ) in the exposure step, the thermosetting temperature Y (°C) in the thermosetting step, the thermosetting time Z (hr), and the thermosetting atmosphere were as shown in Table 3. A substrate having a cured film was obtained by carrying out the drying step, the exposure step and the heat curing step in the same manner as in 1.

<Example 6>
Using the curable composition 2 obtained in Production Example 7, the exposure amount X (mJ/cm ² ) in the exposure step, the thermosetting temperature Y (°C) in the thermosetting step, the thermosetting time Z (hr), the thermosetting A substrate having a cured film was obtained by carrying out the drying process, the exposure process and the thermal curing process in the same manner as in Example 1 except that the atmosphere was as shown in Table 3.

Table 3 also shows the P value, the measurement results of Martens hardness, the measurement results of pencil hardness, and the measurement results of emitted light intensity.

Claims (7)

A cured film of a curable composition containing quantum dots (A) and a photopolymerizable compound (B),
A cured film having a Martens hardness of greater than 0.10 GPa. The cured film according to claim 1, wherein the curable composition further comprises a photoinitiator (C). The cured film according to claim 1 or 2, wherein the curable composition further contains a resin (D). The cured film according to any one of claims 1 to 3, wherein the curable composition further comprises a light scattering agent (E). A method for producing a cured film of a curable composition containing quantum dots (A) and a photopolymerizable compound (B),
An exposure step of irradiating the film of the curable composition with light;
A thermosetting step of thermosetting the film of the curable composition;
including
The following formula ( ¹ ):
X×Y×Z ² ≧6500 (1)
A method for producing a cured film that satisfies 6. The manufacturing method according to claim 5, wherein said thermosetting step is performed under a vacuum atmosphere. A display device comprising the cured film according to any one of claims 1 to 4.