JP2022166670A - Resin composition, resin film, metal foil with resin, prepreg, laminate sheet, multilayer printed wiring board and semiconductor package - Google Patents

Abstract

To provide resin compositions, resin films, metal foils with resin, prepregs, laminate sheets, multilayer printed wiring boards, and semiconductor packages that exhibit excellent dielectric properties in the high frequency band of 10 GHz or more.SOLUTION: A resin composition contains an alicyclic hydrocarbon skeleton-containing polymer (A) having a glass transition temperature of 220°C or lower and a maleimide compound (B). Further, a resin film contains the resin composition, a metal foil with resin has a layer of the resin composition on the metal foil, and a prepreg contains the resin composition and a sheet-type fiber-reinforced base material, and a laminate sheet, a multilayer printed circuit board, and a semiconductor package contains any of the foregoing.SELECTED DRAWING: None

Description

The present disclosure relates to resin compositions, resin films, resin-coated metal foils, prepregs, laminates, multilayer printed wiring boards, and semiconductor packages.

2. Description of the Related Art Mobile communication devices such as mobile phones, network infrastructure devices such as base station devices, servers, routers, and large computers use signals with higher speeds and larger capacities year by year. Along with this, the printed wiring boards mounted on these electronic devices are required to be compatible with high frequencies, and there is a demand for substrate materials that have excellent dielectric properties in high frequency bands that can reduce transmission loss. In recent years, in addition to the above-mentioned electronic devices, as applications that handle such high-frequency signals, implementation plans and practical implementation of new systems that handle high-frequency wireless signals also exist in the ITS field (related to automobiles and transportation systems) and in the indoor short-distance communication field. is progressing. Therefore, it is expected that low transmission loss substrate materials will be required for printed wiring boards mounted on these devices in the future.

Conventionally, resin compositions containing polyphenylene ether and cyanate resin (see, for example, Patent Document 1), fluororesins (see, for example, Patent Document 2), and the like are known as materials having excellent high-frequency characteristics.

Japanese Patent Publication No. 61-018937 JP 2018-014387 A

In recent years, dielectric in the 10 GHz band and above, which can be used for fifth-generation mobile communication system (5G) antennas that use radio waves in the frequency band over 6 GHz and millimeter-wave radar that uses radio waves in the 30 to 300 GHz frequency band Development of a resin composition with further improved properties (low dielectric constant and low dielectric loss tangent; hereinafter sometimes referred to as high frequency properties) is desired.
Although the fluororesin described in Patent Document 2 has excellent high-frequency characteristics, the molding temperature is 300° C., which is a high temperature. Not only the fluororesin described in Patent Document 2, but also other fluororesins generally require high-temperature molding at about 300 to 360°C.

In view of such circumstances, the present disclosure provides resin compositions, resin films, resin-coated metal foils, prepregs, laminates, multilayer printed wiring boards, and semiconductor packages that exhibit excellent dielectric properties in a high frequency band of 10 GHz or higher. intended to provide

The present inventors have made intensive studies to achieve the above object, and as a result, have completed the resin composition disclosed in the present specification.

The present disclosure includes the following [1] to [15].
[1] A resin composition containing an alicyclic hydrocarbon skeleton-containing polymer (A) having a glass transition temperature of 220°C or less and a maleimide compound (B).
[2] The resin composition according to [1] above, wherein the component (A) has an alicyclic hydrocarbon skeleton with 3 to 12 ring-forming carbon atoms.
[3] The resin composition according to [1] or [2] above, wherein in the component (A), the alicyclic hydrocarbon skeleton is monocyclic or bicyclic.
[4] The resin composition according to any one of [1] to [3] above, wherein the content of component (A) is 1 to 80 parts by mass per 100 parts by mass of the total resin components.
[5] The resin composition according to any one of [1] to [4] above, further comprising a flame retardant (C).
[6] The resin composition according to [5] above, wherein the component (C) is an organic phosphorus-based flame retardant.
[7] Any of the above [1] to [6], which does not contain a cyanate resin, or when it contains a cyanate resin, the content is 10% by mass or less relative to the solid content of the resin composition. The resin composition according to .
[8] The resin composition according to any one of [1] to [7] above, further comprising a curing accelerator (D).
[9] The resin composition according to any one of [1] to [8] above, further comprising an inorganic filler (E).
[10] A resin film comprising the resin composition according to any one of [1] to [9] above.
[11] A resin-coated metal foil comprising a layer of the resin composition according to any one of [1] to [9] above.
[12] A prepreg comprising the resin composition according to any one of [1] to [9] above and a sheet-like fiber-reinforced base material.
[13] (i) the resin film described in [10] above, (ii) the resin-coated metal foil described in [11] above, or (iii) the prepreg and metal foil described in [12] above. laminated board.
[14] (i) the resin film according to [10] above, (ii) the metal foil with resin according to [11] above, (iii) the prepreg according to [12] above, or (iv) [13] above A multilayer printed wiring board comprising the laminate according to 1.
[15] (v) A semiconductor package containing the multilayer printed wiring board according to [14] above and (vi) a semiconductor element.

The present disclosure can provide resin compositions, resin films, resin-coated metal foils, prepregs, laminates, multilayer printed wiring boards, and semiconductor packages that exhibit excellent dielectric properties in a high frequency band of 10 GHz or higher.

In the numerical ranges described herein, the upper or lower limits of the numerical ranges may be replaced with the values shown in the examples. Also, the lower and upper limits of a numerical range can be arbitrarily combined with the lower and upper limits of other numerical ranges, respectively. In the notation of a numerical range "AA to BB", both numerical values AA and BB are included in the numerical range as lower and upper limits, respectively.
In this specification, for example, the description of "10 or more" means 10 and a numerical value exceeding 10, and this also applies when the numerical values are different. Further, for example, the description "10 or less" means 10 and less than 10, and the same applies when the numerical values are different.
In addition, each component and material exemplified in this specification may be used alone or in combination of two or more unless otherwise specified. As used herein, the content of each component in the composition refers to the total amount of the multiple substances present in the composition when there are multiple substances corresponding to each component in the composition, unless otherwise specified. means

As used herein, "the number of ring-forming carbon atoms" is the number of carbon atoms required to form a ring, and does not include the number of carbon atoms of substituents on the ring. For example, both the cyclohexane skeleton and the methylcyclohexane skeleton have 6 ring-forming carbon atoms.
As used herein, the term “resin component” is defined as all components among the solid components constituting the resin composition, excluding inorganic compounds such as inorganic fillers, flame retardants, and flame retardant aids, which will be described later.
As used herein, the term “solid content” refers to components in the resin composition other than water and volatilizable substances such as solvents described later. That is, the solid content includes those that are liquid, syrup-like, or wax-like at room temperature around 25° C., and does not necessarily mean that they are solid.
Aspects in which the items described in this specification are arbitrarily combined are also included in the present disclosure and the embodiments.

[Resin composition]
The resin composition of the present embodiment is an alicyclic hydrocarbon skeleton-containing polymer (A) having a glass transition temperature of 220° C. or less [hereinafter simply referred to as “alicyclic hydrocarbon skeleton-containing polymer (A)” or “(A) component and a maleimide compound (B) [hereinafter sometimes abbreviated as "component (B)"]. The resin composition of the present embodiment is preferably a thermosetting resin composition.
In the resin composition of the present embodiment, the total content of the component (A) and the component (B) is preferably 30 parts by mass or more, more preferably 50 parts by mass, with respect to 100 parts by mass of the total resin components. Above, more preferably 80 parts by mass or more, particularly preferably 90 parts by mass or more. The upper limit of the total content of the component (A) and the component (B) is not particularly limited, and may be 99 parts by mass or less with respect to 100 parts by mass of the total amount of the resin components.

However, the resin composition of the present embodiment does not contain a cyanate resin, or when it contains a cyanate resin, the content is preferably 10% by mass or less with respect to the solid content of the resin composition. , is more preferably 5% by mass or less, and even more preferably 3% by mass or less. If the resin composition of the present embodiment does not contain a cyanate resin, or if it contains a cyanate resin but the content is within the above range, the high-frequency characteristics and insulation reliability tend to be even higher.
Each component contained in the resin composition of the present embodiment will be described below.

<Polymer (A) containing an alicyclic hydrocarbon skeleton having a glass transition temperature of 220°C or less>
By using the alicyclic hydrocarbon skeleton-containing polymer (A) having a glass transition temperature (Tg) of 220°C or less, a resin composition having excellent heat resistance and high frequency characteristics can be obtained. The Tg of component (A) is preferably 50 to 220°C, more preferably 70 to 200°C, even more preferably 100 to 200°C, and particularly preferably 130 to 180°C, from the viewpoint of heat resistance and high frequency characteristics, Most preferably it is 130-150°C. As for Tg, catalog values may be referred to in the case of commercially available alicyclic hydrocarbon skeleton-containing polymers. Moreover, Tg can also be measured by a thermomechanical measuring device while complying with the IPC (The Institute for Interconnecting and Packaging Electronic Circuits) standard.
(A) component may be used individually by 1 type, and may use 2 or more types together.

The alicyclic hydrocarbon skeleton contained in the component (A) is not particularly limited as long as the Tg is 220°C or lower. From the viewpoint of heat resistance and high frequency characteristics, component (A) preferably contains an alicyclic hydrocarbon skeleton having 3 to 12 ring carbon atoms, and an alicyclic hydrocarbon skeleton having 5 to 12 ring carbon atoms. More preferably, it contains an alicyclic hydrocarbon skeleton having 5 to 7 ring-forming carbon atoms, and may contain an alicyclic hydrocarbon skeleton having 5 ring-forming carbon atoms. , may contain an alicyclic hydrocarbon skeleton having 7 ring-forming carbon atoms. The alicyclic hydrocarbon skeleton may be monocyclic or polycyclic. In the case of polycyclic ring, bicyclic or tricyclic is preferable, and bicyclic is more preferable, from the viewpoint of Tg, heat resistance and high frequency characteristics. That is, it can be said that the alicyclic hydrocarbon skeleton is preferably monocyclic or bicyclic.
The alicyclic hydrocarbon skeleton may be a saturated alicyclic hydrocarbon skeleton or an unsaturated alicyclic hydrocarbon skeleton, but is preferably a saturated alicyclic hydrocarbon skeleton. .

Component (A) is at least one selected from the group consisting of polymers containing monocyclic alicyclic hydrocarbon skeletons and polymers containing polycyclic alicyclic hydrocarbon skeletons, from the viewpoint of heat resistance and high-frequency characteristics. is preferable, and from the viewpoint of Tg, a monocyclic alicyclic hydrocarbon skeleton-containing polymer is more preferable.
The monocyclic alicyclic hydrocarbon skeleton-containing polymer may contain a chain hydrocarbon skeleton. The chain hydrocarbon skeleton may be a chain hydrocarbon skeleton derived from ethylene or an α-olefin, and is preferably a chain hydrocarbon skeleton derived from ethylene. The same is true for The monocyclic alicyclic hydrocarbon skeleton-containing polymer may not contain a chain hydrocarbon skeleton.
The monocyclic alicyclic hydrocarbon skeleton-containing polymer includes a substituted or unsubstituted cyclobutane skeleton-containing polymer, a substituted or unsubstituted cyclopentane skeleton-containing polymer, a substituted or unsubstituted cyclooctane skeleton-containing polymer, and a substituted or unsubstituted cyclododecane skeleton-containing polymer. Among these, a substituted or unsubstituted cyclopentane skeleton-containing polymer is preferable as the monocyclic alicyclic hydrocarbon skeleton-containing polymer from the viewpoint of heat resistance and high-frequency characteristics.
Here, in the present specification, "substituted or unsubstituted" indicates that it may have a substituent or may be unsubstituted. Examples of such substituents include alkyl groups having 1 to 8 carbon atoms. The number of substituents is not particularly limited, but one or more is acceptable as long as it is substitutable. Hereinafter, all references to "substituted or unsubstituted" are defined similarly.

The polycyclic alicyclic hydrocarbon skeleton-containing polymer may contain a chain hydrocarbon skeleton, and the chain hydrocarbon skeleton may be a chain hydrocarbon skeleton derived from ethylene or an α-olefin. A chain hydrocarbon skeleton derived from ethylene is often preferred, and this also applies to the following specific examples. The polycyclic alicyclic hydrocarbon skeleton-containing polymer may not contain the chain hydrocarbon skeleton.
Examples of the polycyclic alicyclic hydrocarbon skeleton-containing polymer include substituted or unsubstituted bicycloheptane skeleton-containing polymers (that is, substituted or unsubstituted norbornane skeleton-containing polymers). From the viewpoint of heat resistance and high frequency characteristics, a substituted or unsubstituted bicycloheptane skeleton-containing polymer is preferable as the polycyclic alicyclic hydrocarbon skeleton-containing polymer.

The α-olefin may be an α-olefin having 3 to 20 carbon atoms, an α-olefin having 3 to 10 carbon atoms, or an α-olefin having 3 to 6 carbon atoms. may be α-olefins include propylene, 1-butene, 1-hexene, 4-methyl-pentene and the like.

Component (A) preferably has a refractive index of 1.290 to 1.640, more preferably 1.350 to 1.577, more preferably 1.500 to 1.550 at 25° C. for D line. is more preferable. When the refractive index of the component (A) is within the above range, the dielectric constant of the resin composition tends to be kept low. In addition, in this specification, the D-line means the D-line of a sodium atom.

There is no particular limitation on the method for producing component (A), and it can be produced by a known method. Moreover, a commercial item can also be used as (A) component. Commercially available monocyclic alicyclic hydrocarbon skeleton-containing polymers include "ZEONEX (registered trademark) K26R" (Tg = 143°C, refractive index = 1.535), "ZEONEX (registered trademark) K22R" (Tg = 143 °C, refractive index = 1.535), "ZEONEX (registered trademark) E48R" (Tg = 139 °C, refractive index = 1.531), "ZEONEX (registered trademark) F52R" (Tg = 156 °C, refractive index = 1 .535), "ZEONEX® T62R" (Tg = 154°C, refractive index = 1.536), "ZEONEX® 480R" (Tg = 138°C, refractive index = 1.525), "ZEONEX (registered trademark) 330R" (Tg = 123°C, refractive index = 1.509) (manufactured by Nippon Zeon Co., Ltd.).
Commercially available polycyclic alicyclic hydrocarbon skeleton-containing polymers include "APEL (registered trademark) 5014CL" (Tg = 135°C, refractive index = 1.54), "APEL (registered trademark) 5014DP" (Tg = 135°C, refractive index = 1.54), “APEL (registered trademark) 6015T” (Tg = 145°C, refractive index = 1.54), “APEL (registered trademark) 6013T” (Tg = 125°C, refractive index = 1.54), “APEL (registered trademark) 6011T” (Tg = 105°C, refractive index = 1.54), “APEL (registered trademark) 6509T” (Tg = 80°C, refractive index = 1.54) ( (manufactured by Mitsui Chemicals, Inc.), etc., "TOPAS (registered trademark) 5013L-10" (Tg = 134 ° C., refractive index = 1.533), "TOPAS (registered trademark) 8007S-04" (Tg = 78 ° C., refractive index = 1.53), "TOPAS (registered trademark) 6013M-07" (Tg = 142 ° C., refractive index = 1.53), "TOPAS (registered trademark) 6015S-04" (Tg = 158 ° C., refractive index = 1.53), “TOPAS (registered trademark) 6017S-04” (Tg = 178 ° C., refractive index = 1.53), “TOPAS (registered trademark) 8007X10” (Tg = 78 ° C., refractive index = 1.53 ) (manufactured by Polyplastics Co., Ltd.), etc., "ARTON (registered trademark) F4520" (Tg = 164 ° C., refractive index = 1.512), "ARTON (registered trademark) F3500" (Tg = 165 ° C., refractive index index = 1.513), "ARTON (registered trademark) D4000" (Tg = 151°C, refractive index = 1.516) (manufactured by JSR Corporation), and the like.
In addition, in the said commercial item, the described refractive index is a refractive index in D line and 25 degreeC.

(Content of component (A))
In the resin composition of the present embodiment, the content of component (A) is not particularly limited, but from the viewpoint of heat resistance and high frequency characteristics, it is preferably 1 part per 100 parts by mass of the total resin component. ~ 80 parts by mass, preferably 5 to 75 parts by mass, more preferably 10 to 70 parts by mass, particularly preferably 15 to 70 parts by mass, and may be 15 to 40 parts by mass, or 30 to 70 parts by mass may be

<Maleimide compound (B)>
The maleimide compound includes a maleimide compound (b1) having two or more N-substituted maleimide groups [hereinafter sometimes simply referred to as "maleimide compound (b1)" or "component (b1)". ] and derivatives thereof.
Examples of the above-mentioned "derivative thereof" include an addition reaction product of a maleimide compound having two or more N-substituted maleimide groups and an amine compound such as a diamine compound to be described later.

The maleimide compound (b1) is not particularly limited as long as it is a maleimide compound having two or more N-substituted maleimide groups. Specific examples of the maleimide compound (b1) include bis(4-maleimidophenyl)methane, polyphenylmethanemaleimide, bis(4-maleimidophenyl)ether, bis(4-maleimidophenyl)sulfone, 3,3′-dimethyl- 5,5'-diethyl-4,4'-diphenylmethanebismaleimide, 4-methyl-1,3-phenylenebismaleimide, m-phenylenebismaleimide, 2,2-bis[4-(4-maleimidophenoxy)phenyl] Aromatic maleimide compounds such as propane; aliphatic maleimide compounds such as 1,6-bismaleimide-(2,2,4-trimethyl)hexane and pyrrolonic acid binder type long-chain alkylbismaleimide. Among these, the maleimide compound (b1) is preferably an aromatic maleimide compound, more preferably an aromatic bismaleimide compound, and 2,2-bis[4-(4 -maleimidophenoxy)phenyl]propane, 3,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethanebismaleimide are more preferred, and 3,3′-dimethyl-5,5′-diethyl-4, 4'-Diphenylmethanebismaleimide is particularly preferred.

The maleimide compound (b1) is more preferably a compound represented by the following general formula (B1-1).

（式中、Ｘ^ｂ１は２価の有機基を示す。）

(In the formula, X ^b1 represents a divalent organic group.)

The divalent organic group represented by X ^b1 in the general formula (B1-1) is represented by the following general formula (B1-2), (B1-3), (B1-4) or (B1-5). and the group to be carried out.

（式中、Ｒ^ｂ１は、炭素数１～５の脂肪族炭化水素基又はハロゲン原子を示す。ｎ^ｂ１は、０～４の整数を示す。＊は結合位置を示す。）

(In the formula, R ^b1 represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. n ^b1 represents an integer of 0 to 4. * represents a bonding position.)

Examples of aliphatic hydrocarbon groups having 1 to 5 carbon atoms represented by R ^b1 include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, t-butyl group, n-pentyl group, and the like. is mentioned. The aliphatic hydrocarbon group is preferably an aliphatic hydrocarbon group having 1 to 3 carbon atoms, more preferably a methyl group.
^nb1 represents an integer of 0 to 4, preferably an integer of 0 to 2, more preferably 0, from the viewpoint of availability. When n ^b1 is an integer of 2 or more, a plurality of R ^b1 may be the same or different.

（式中、Ｒ^ｂ２及びＲ^ｂ３は、各々独立に、炭素数１～５の脂肪族炭化水素基又はハロゲン原子を示す。Ｘ^ｂ２は炭素数１～５のアルキレン基、炭素数２～５のアルキリデン基、エーテル基、スルフィド基、スルホニル基、カルボニルオキシ基、ケト基、単結合、又は下記一般式（Ｂ１－３－１）で表される２価の基を示す。ｎ^ｂ２及びｎ^ｂ３は、各々独立に、０～４の整数を示す。＊は結合位置を示す。）

(In the formula, R ^b2 and R ^b3 each independently represent an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; X ^b2 is an alkylene group having 1 to 5 carbon atoms; n ^b2 and n ^b3 are an alkylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, a single bond, or a divalent group represented by the following general formula (B1-3-1). , each independently represents an integer of 0 to 4. * represents a bonding position.)

The description of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by R ^b2 and R ^b3 refers to the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by R ^b1 in the general formula (B1-2). Same as description.
Examples of the alkylene group having 1 to 5 carbon atoms represented by X ^b2 include methylene group, 1,2-dimethylene group, 1,3-trimethylene group, 1,4-tetramethylene group and 1,5-pentamethylene group. be done. The alkylene group is preferably an alkylene group having 1 to 3 carbon atoms, more preferably a methylene group.
Examples of the alkylidene group having 2 to 5 carbon atoms represented by X ^b2 include ethylidene group, propylidene group, isopropylidene group, butylidene group, isobutylidene group, pentylidene group, isopentylidene group and the like. An isopropylidene group is preferable as the alkylidene group.
^nb2 and ^nb3 are integers of 0 to 4, preferably integers of 0 to 2, more preferably 0 or 2, from the viewpoint of availability. When n ^b2 is an integer of 2 or more, the plurality of R ^b2 may be the same or different. When n ^b3 is an integer of 2 or more, the plurality of R ^b3 may be the same or different.
The divalent group represented by the general formula (B1-3-1) represented by X ^b2 is as follows.

（式中、Ｒ^ｂ４及びＲ^ｂ５は、各々独立に、炭素数１～５の脂肪族炭化水素基又はハロゲン原子を示す。Ｘ^ｂ３は、炭素数１～５のアルキレン基、炭素数２～５のアルキリデン基、エーテル基、スルフィド基、スルホニル基、カルボニルオキシ基、ケト基又は単結合を示す。ｎ^ｂ４及びｎ^ｂ５は、各々独立に、０～４の整数を示す。＊は結合位置を示す。）

(In the formula, R ^b4 and R ^b5 each independently represent an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; X ^b3 is an alkylene group having 1 to 5 carbon atoms; represents an alkylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group or a single bond, ^nb4 and ^nb5 each independently represents an integer of 0 to 4. * represents a bonding position. .)

The description of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by R ^b4 and R ^b5 refers to the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by R ^b1 in the general formula (B1-2). Same as description.
The alkylene group having 1 to 5 carbon atoms and the alkylidene group having 2 to 5 carbon atoms represented by X ^b3 include the alkylene group having 1 to 5 carbon atoms and 2 carbon atoms represented by X ^b2 in the general formula (B1-3). The same as the alkylidene group of 1 to 5 can be mentioned. Among these, an isopropylidene group is preferable from the viewpoint of high-frequency characteristics, adhesion to conductors, heat resistance, glass transition temperature, and thermal expansion coefficient.
Among the groups represented by X ^b3 , an alkylidene group having 2 to 5 carbon atoms is preferred, and an isopropylidene group is more preferred.
^nb4 and ^nb5 are integers of 0 to 4, preferably integers of 0 to 2, more preferably 0, from the viewpoint of availability. When n ^b4 is an integer of 2 or more, the plurality of R ^b4 may be the same or different. When n ^b5 is an integer of 2 or more, the plurality of R ^b5 may be the same or different.

（式中、ｎ^ｂ６は、１～１０の整数を示す。＊は結合位置を示す。）

(Wherein, n ^b6 represents an integer of 1 to 10. * represents a binding position.)

^nb6 is preferably an integer of 1 to 5, more preferably an integer of 1 to 3, from the viewpoint of availability.

（式中、Ｒ^ｂ６及びＲ^ｂ７は、各々独立に、水素原子又は炭素数１～５の脂肪族炭化水素基を示す。ｎ^ｂ７は、１～８の整数を示す。＊は結合位置を示す。）

(In the formula, R ^b6 and R ^b7 each independently represent a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms. n ^b7 represents an integer of 1 to 8. * represents a bonding position. .)

The description of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by R ^b6 and R ^b7 refers to the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by R ^b1 in the general formula (B1-2). Same as description.
^nb7 represents an integer of 1 to 8, preferably an integer of 1 to 3, more preferably 1.
When n ^b7 is an integer of 2 or more, the plurality of R ^b6 may be the same or different, and the plurality of R ^b7 may be the same or different. may

X ^b1 in the general formula (B1-1) is a divalent group represented by any one of the following formulas (X ^b1 -1) to (X ^b1 -3) from the viewpoint of high frequency characteristics. is preferred, and a divalent group represented by the following formula (X ^b1 -2) or a divalent group represented by the following formula (X ^b1 -3) is more preferred, and a divalent group represented by the following formula (X ^b1 -2 ) is more preferably a divalent group represented by

（式中、＊は、マレイミド基中の窒素原子との結合位置を示す。）

(In the formula, * indicates the bonding position with the nitrogen atom in the maleimide group.)

The maleimide compound may be a derivative of the maleimide compound (b1) from the viewpoints of solubility in organic solvents, compatibility, adhesion to conductors, and high frequency characteristics.
Derivatives of the maleimide compound (b1) include structural units derived from the maleimide compound (b1) and an amine compound (b2) having a primary amino group [hereinafter referred to as "amine compound (b2)" or "(b2) component"]. may be abbreviated. ] and a modified maleimide compound (Z) [hereinafter sometimes abbreviated as “modified maleimide compound (Z)” or “(Z) component”. ] is preferable.
The structural unit derived from the component (b1) and the structural unit derived from the component (b2) contained in the modified maleimide compound (Z) may each be one type or a combination of two or more types. good.

（＊は他の構造への結合位置を示す。） The modified maleimide compound (Z) includes a structure represented by the following formula (B-1) obtained by an addition reaction between the maleimide group of the component (b1) and the primary amino group of the component (b2). A compound is preferred.

(* indicates the binding position to other structures.)

The structural unit derived from the component (b1) is, for example, one or more selected from the group consisting of a group represented by the following general formula (B1-6) and a group represented by the following general formula (B1-7). is mentioned.

（式中、Ｘ^ｂ１は前記一般式（Ｂ１－１）中のＸ^ｂ１と同じであり、＊は他の構造への結合位置を示す。）

(In the formula, X ^b1 is the same as X ^b1 in the general formula (B1-1), and * indicates the bonding position to another structure.)

The amine compound (b2) is preferably a compound having two or more amino groups, more preferably a diamine compound having two amino groups.
Examples of the amine compound (b2) include 4,4'-diaminodiphenylmethane, 4,4'-diamino-3,3'-dimethyldiphenylmethane, 3,3'-diethyl-4,4'-diaminodiphenylmethane, 4,4' -diaminodiphenyl ether, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl ketone, 4,4'-diaminobiphenyl, 3,3'-dimethyl-4,4' -diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, 2,2-bis(3-amino-4-hydroxyphenyl)propane, 3,3'-dimethyl -5,5′-diethyl-4,4′-diaminodiphenylmethane, 2,2-bis(4-aminophenyl)propane, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 1,3 - bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, 1,3-bis[1-[4-(4-aminophenoxy)phenyl]-1-methylethyl]benzene, 1,4-bis[1-[4-(4-aminophenoxy)phenyl]-1-methyl ethyl]benzene, 4,4'-[1,3-phenylenebis(1-methylethylidene)]bisaniline, 4,4'-[1,4-phenylenebis(1-methylethylidene)]bisaniline, 3,3' -[1,3-phenylenebis(1-methylethylidene)]bisaniline, bis[4-(4-aminophenoxy)phenyl]sulfone, bis[4-(3-aminophenoxy)phenyl]sulfone, 9,9-bis aromatic diamine compounds such as (4-aminophenyl)fluorene; and amine-modified siloxane compounds having a primary amino group.

As the amine compound (b2), compounds represented by the following general formula (B2-1) are preferred.

（式中、Ｘ^ｂ４は２価の有機基を示す。）

(In the formula, X ^b4 represents a divalent organic group.)

Component (b2) is an aromatic diamine compound in which X ^b4 in the general formula (B2-1) is a divalent group represented by the following general formula (B2-2) [hereinafter referred to as "aromatic diamine compound (B2-2)” may be abbreviated. ] is preferably contained.

（式中、Ｒ^ｂ１１及びＲ^ｂ１２は、各々独立に、炭素数１～５の脂肪族炭化水素基、炭素数１～５のアルコキシ基、水酸基又はハロゲン原子を示す。Ｘ^ｂ５は、炭素数１～５のアルキレン基、炭素数２～５のアルキリデン基、エーテル基、スルフィド基、スルホニル基、カルボニルオキシ基、ケト基、フルオレニレン基、単結合、又は下記一般式（Ｂ２－２－１）若しくは（Ｂ２－２－２）で表される２価の基を示す。ｎ^ｂ８及びｎ^ｂ９は、各々独立に、０～４の整数を示す。＊は結合位置を示す。）

(wherein R ^b11 and R ^b12 each independently represent an aliphatic hydrocarbon group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, a hydroxyl group or a halogen atom; X ^b5 represents 1 carbon atom; ~5 alkylene group, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, a fluorenylene group, a single bond, or the following general formula (B2-2-1) or ( B2-2-2) represents a divalent group, n ^b8 and n ^b9 each independently represents an integer of 0 to 4. * represents a bonding position.)

Examples of aliphatic hydrocarbon groups having 1 to 5 carbon atoms represented by R ^b11 and R ^b12 in general formula (B2-2) include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, t-butyl group, n-pentyl group and the like.
Examples of the alkylene group having 1 to 5 carbon atoms represented by X ^b5 include methylene group, 1,2-dimethylene group, 1,3-trimethylene group, 1,4-tetramethylene group and 1,5-pentamethylene group. be done.
The alkylidene group having 2 to 5 carbon atoms represented by X ^b5 includes ethylidene group, propylidene group, isopropylidene group, butylidene group, isobutylidene group, pentylidene group, isopentylidene group and the like.
n ^b8 and n ^b9 each represent an integer of 0 to 4, preferably 0 or 1 from the viewpoint of availability. When ^nb8 or ^nb9 is an integer of 2 or more, a plurality of ^Rb11 's or a plurality of ^Rb12 's may be the same or different.
The divalent group represented by general formula (B2-2-1) represented by X ^b5 in general formula (B2-2) is as follows.

（式中、Ｒ^ｂ１３及びＲ^ｂ１４は、各々独立に、炭素数１～５の脂肪族炭化水素基又はハロゲン原子を示す。Ｘ^ｂ６は炭素数１～５のアルキレン基、炭素数２～５のアルキリデン基、ｍ－フェニレンジイソプロピリデン基、ｐ－フェニレンジイソプロピリデン基、エーテル基、スルフィド基、スルホニル基、カルボニルオキシ基、ケト基又は単結合を示す。ｎ^ｂ１０及びｎ^ｂ１１は、各々独立に、０～４の整数を示す。＊は結合位置を示す。）

(wherein R ^b13 and R ^b14 each independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; X ^b6 is an alkylene group having 1 to 5 carbon atoms; an alkylidene group, a m-phenylenediisopropylidene group, a p-phenylenediisopropylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group or a single bond, ^nb10 and ^nb11 each independently , indicates an integer from 0 to 4. * indicates a binding position.)

The aliphatic hydrocarbon groups having 1 to 5 carbon atoms represented by R ^b13 and R ^b14 in general formula (B2-2-1) are described in terms of R ^b11 and R ^b12 in general formula (B2-2). is the same as the explanation for the aliphatic hydrocarbon group having 1 to 5 carbon atoms shown by .
The description of the alkylene group having 1 to 5 carbon atoms and the alkylidene group having 2 to 5 carbon atoms represented by X ^b6 refers to the alkylene group having 1 to 5 carbon atoms represented by X ^b5 in the general formula (B2-2), carbon The description is the same as for the alkylidene groups of numbers 2 to 5.
n ^b10 and n ^b11 each represent an integer of 0 to 4, preferably an integer of 0 to 2, more preferably 0, from the viewpoint of availability. When n ^b10 is an integer of 2 or more, the plurality of R ^b13 may be the same or different. When n ^b11 is an integer of 2 or more, the plurality of R ^b14 may be the same or different.
The divalent group represented by general formula (B2-2-2) represented by X ^b5 in general formula (B2-2) is as follows.

（式中、Ｒ^ｂ１５は、炭素数１～５の脂肪族炭化水素基又はハロゲン原子を示す。Ｘ^ｂ７及びＸ^ｂ８は、各々独立に、炭素数１～５のアルキレン基、炭素数２～５のアルキリデン基、エーテル基、スルフィド基、スルホニル基、カルボニルオキシ基、ケト基又は単結合を示す。ｎ^ｂ１２は、０～４の整数を示す。＊は結合位置を示す。）

(In the formula, R ^b15 represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; X ^b7 and X ^b8 each independently represent an alkylene group having 1 to 5 carbon atoms; represents an alkylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, or a single ^{bond.n b12} represents an integer of 0 to 4. * represents the bonding position.)

The description of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by R ^b15 in the general formula (B2-2-2) includes the carbon atoms represented by R ^b11 and R ^b12 in the general formula (B2-2). It is the same as the explanation for the aliphatic hydrocarbon groups of numbers 1 to 5.
The alkylene group having 1 to 5 carbon atoms and the alkylidene group having 2 to 5 carbon atoms represented by X ^b7 and X ^b8 include the alkylene group having 1 to 5 carbon atoms represented by X ^b5 in the general formula (B2-2), The same as the alkylidene group having 2 to 5 carbon atoms are exemplified. Among these, X ^b7 and X ^b8 are preferably alkylidene groups having 2 to 5 carbon atoms, and more preferably iropropylidene groups.
^nb12 represents an integer of 0 to 4, preferably an integer of 0 to 2, more preferably 0, from the viewpoint of availability. When n ^b12 is an integer of 2 or more, a plurality of R ^b15 may be the same or different.

Further, the component (b2) is an amine-modified siloxane compound in which X ^b4 in the general formula (B2-1) is a divalent group containing a structural unit represented by the following general formula (B2-3). may be contained, and X ^b4 in the general formula (B2-1) may contain a terminal amine-modified siloxane compound that is a divalent group represented by the following general formula (B2-4) good.

（式中、Ｒ^ｂ１６及びＲ^ｂ１７は、各々独立に、炭素数１～５のアルキル基、フェニル基又は置換フェニル基を表す。＊は結合位置を示す。）

(In the formula, R ^b16 and R ^b17 each independently represent an alkyl group having 1 to 5 carbon atoms, a phenyl group or a substituted phenyl group. * indicates a bonding position.)

（式中、Ｒ^ｂ１６及びＲ^ｂ１７は、前記一般式（Ｂ２－３）中のものと同じであり、Ｒ^ｂ１８及びＲ^ｂ１９は、各々独立に、炭素数１～５のアルキル基、フェニル基又は置換フェニル基を示す。Ｘ^ｂ９及びＸ^ｂ１０は、各々独立に、２価の有機基を示し、ｎ^ｂ１３は、２～１００の整数を示す。＊は結合位置を示す。）

(In the formula, R ^b16 and R ^b17 are the same as those in the general formula (B2-3), R ^b18 and R ^b19 are each independently an alkyl group having 1 to 5 carbon atoms, a phenyl group, or represents a substituted phenyl group, X ^b9 and X ^b10 each independently represents a divalent organic group, n ^b13 represents an integer of 2 to 100, * represents a bonding position.)

Examples of alkyl groups having 1 to 5 carbon atoms represented by R ^b16 to R ^b19 in general formulas (B2-3) and (B2-4) include methyl group, ethyl group, n-propyl group, isopropyl group, n- Examples include butyl group, isobutyl group, t-butyl group, n-pentyl group and the like. The alkyl group is preferably an alkyl group having 1 to 3 carbon atoms, more preferably a methyl group.
Examples of substituents possessed by the phenyl group in the substituted phenyl group represented by R ^b16 to R ^b19 include an alkyl group having 1 to 5 carbon atoms, an alkenyl group having 2 to 5 carbon atoms, an alkynyl group having 2 to 5 carbon atoms, and the like. . Examples of the alkyl group having 1 to 5 carbon atoms include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, t-butyl group and n-pentyl group. Examples of the alkenyl group having 2 to 5 carbon atoms include a vinyl group and an allyl group. Examples of the alkynyl group having 2 to 5 carbon atoms include an ethynyl group and a propargyl group.
The divalent organic group represented by X ^b9 and X ^b10 includes an alkylene group, an alkenylene group, an alkynylene group, an arylene group, —O—, a divalent linking group in which these are combined, and the like. Examples of the alkylene group include alkylene groups having 1 to 10 carbon atoms such as methylene group, ethylene group and propylene group. Examples of the alkenylene group include alkenylene groups having 2 to 10 carbon atoms. The alkynylene group includes an alkynylene group having 2 to 10 carbon atoms. Examples of the arylene group include arylene groups having 6 to 20 carbon atoms such as phenylene group and naphthylene group.
Among these, ^Xb9 and ^Xb10 are preferably an alkylene group or an arylene group, more preferably an alkylene group.
^nb13 represents an integer of 2 to 100, preferably an integer of 2 to 50, more preferably an integer of 3 to 40, and even more preferably an integer of 5 to 30. When n ^b13 is an integer of 2 or more, the plurality of R ^b16 or the plurality of R ^b17 may be the same or different.

（式中、Ｘ^ｂ４は前記一般式（Ｂ２－１）中のＸ^ｂ４と同じであり、＊は他の構造への結合位置を示す。） The structural unit derived from the component (b2) is, for example, one or more selected from the group consisting of a group represented by the following general formula (B2-5) and a group represented by the following general formula (B2-6). is mentioned.

(In the formula, X ^b4 is the same as X ^b4 in the general formula (B2-1), and * indicates the bonding position to another structure.)

The weight average molecular weight (Mw) of the modified maleimide compound (Z) is not particularly limited, but may be from 400 to 10,000, from 1,000 to 5,000, from 1,500 to 4,000. It may be 000, or 2,000 to 3,000.
A weight average molecular weight in this specification means a value measured in terms of polystyrene by gel permeation chromatography (GPC).

(Content of component (B))
In the resin composition of the present embodiment, the content of the maleimide compound (B) is not particularly limited. Parts by mass are preferable, 25 to 95 parts by mass are more preferable, 30 to 90 parts by mass are more preferable, 30 to 85 parts by mass are particularly preferable, and may be 60 to 85 parts by mass, or 30 to 70 parts by mass. may

<Flame retardant (C)>
The resin composition of the present embodiment preferably further contains a flame retardant (C) [hereinafter sometimes abbreviated as "component (C)"]. A flame retardant (C) may be used individually by 1 type, and may use 2 or more types together.
Examples of the flame retardant (C) include inorganic phosphorus-based flame retardants; organic phosphorus-based flame retardants; and metal hydrates such as aluminum hydroxide hydrate and magnesium hydroxide hydrate. Metal hydroxides can also correspond to inorganic fillers (E) described later, but in the case of metal hydroxides capable of imparting flame retardancy, they are classified as flame retardants (C). Among these, organic phosphorus-based flame retardants are preferable as the flame retardant (C).
Examples of inorganic phosphorus flame retardants include red phosphorus; ammonium phosphates such as monoammonium phosphate, diammonium phosphate, triammonium phosphate, and ammonium polyphosphate; inorganic nitrogen-containing phosphorus compounds such as phosphoramide; acid; phosphine oxide;
Examples of organic phosphorus-based flame retardants include aromatic phosphates, phosphonic acid diesters and phosphinic acid esters; metal salts of phosphinic acids, organic nitrogen-containing phosphorus compounds, and cyclic organic phosphorus compounds. Here, the "metal salt" includes lithium salt, sodium salt, potassium salt, calcium salt, magnesium salt, aluminum salt, titanium salt, zinc salt and the like. Among these, aromatic phosphoric acid esters are preferable as the organic phosphorus-based flame retardant. The aromatic phosphate ester is not particularly limited, but from the viewpoint of structure of high-frequency characteristics in addition to flame retardancy, an aromatic hydrocarbon group containing two or more aromatic ring structures [hereinafter, It may be abbreviated as "aromatic hydrocarbon group (c)". ] [hereinafter sometimes referred to as a phosphate ester flame retardant (C1). ] is preferable.

Since the resin composition of the present embodiment contains the phosphate ester flame retardant (C1), it tends to exhibit excellent high-frequency characteristics while having sufficient flame retardancy. Although the reason is not clear, it is presumed as follows.
The phosphate ester flame retardant (C1) has an aromatic hydrocarbon group containing two or more aromatic ring structures in the molecule. Therefore, the phosphate ester flame retardant (C1) has a highly crystalline structure in which the molecules are tightly packed due to the interaction of the two or more aromatic rings, which causes deterioration of dielectric properties. It is considered that the high-frequency characteristics are improved because the molecular vibration, which is one of them, is reduced.

The aromatic hydrocarbon group (c) of the phosphate ester flame retardant (C1) may be a monovalent group or a divalent or higher group, but it is a divalent group. is preferred. When the aromatic hydrocarbon group (c) is a divalent group, the divalent aromatic hydrocarbon group (c) is a divalent group connecting two phosphate ester bonds, i.e., =P (= It is preferably a group forming O)-O-aromatic hydrocarbon group (c)-OP(=O)=.

As the divalent aromatic hydrocarbon group (c), from the viewpoint of high frequency characteristics and flame retardancy, a divalent divalent hydrocarbon group in which two or more aromatic rings are bonded to each other by a single bond or a linking group having 5 or less carbon atoms Aromatic hydrocarbon group [hereinafter sometimes abbreviated as "aromatic hydrocarbon group (c1)". ], or a divalent condensed polycyclic aromatic hydrocarbon group containing two or more aromatic ring structures [hereinafter sometimes abbreviated as "aromatic hydrocarbon group (c2)". ], and more preferably the aromatic hydrocarbon group (c1).

(Aromatic hydrocarbon group (c1))
The two or more aromatic rings contained in the aromatic hydrocarbon group (c1) include benzene ring, naphthalene ring, anthracene ring, phenanthrene ring and the like. Among these, a benzene ring is preferable from the viewpoint of high-frequency characteristics, adhesion to conductors, and flame retardancy.
An aromatic hydrocarbon group formed from these aromatic rings may or may not be substituted with a substituent. Examples of the substituent include aliphatic hydrocarbon groups having 1 to 5 carbon atoms such as methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, t-butyl group and n-pentyl group. ; halogen atoms such as a fluorine atom, a chlorine atom, a bromine atom and an iodine atom;
The aromatic hydrocarbon group (c1) is preferably a substituted or unsubstituted phenylene group, more preferably an unsubstituted phenylene group, from the viewpoint of high frequency characteristics and flame retardancy.
Two or more aromatic rings contained in the aromatic hydrocarbon group (c1) may be the same or different.

As the linking group having 5 or less carbon atoms contained in the aromatic hydrocarbon group (c1), a divalent hydrocarbon group having 1 to 5 carbon atoms, a divalent heteroatom-containing group having 5 or less carbon atoms, carbonization Examples thereof include a divalent group having 1 to 5 carbon atoms in which a hydrogen group and a heteroatom-containing group are linked. In addition, "5 or less carbon atoms" here includes the case where the number of carbon atoms is 0.
Examples of the divalent hydrocarbon group having 1 to 5 carbon atoms include carbon atoms such as methylene group, 1,2-dimethylene group, 1,3-trimethylene group, 1,4-tetramethylene group, and 1,5-pentamethylene group. alkylene groups of number 1 to 5; alkylidene groups having 2 to 5 carbon atoms such as ethylidene group, propylidene group, isopropylidene group, butylidene group, isobutylidene group, pentylidene group and isopentylidene group. Examples of divalent heteroatom-containing groups having 5 or less carbon atoms include ether groups, sulfide groups, sulfonyl groups, carbonyloxy groups and keto groups.

The aromatic hydrocarbon group (c1) is preferably a divalent group represented by the following general formula (C-2) from the viewpoint of high frequency characteristics and flame retardancy.

（式中、Ｒ^ｃ５及びＲ^ｃ６は、各々独立に、炭素数１～５の脂肪族炭化水素基又はハロゲン原子を示す。Ｘ^ｃ２は、炭素数１～５のアルキレン基、炭素数２～５のアルキリデン基、エーテル基、スルフィド基、スルホニル基、カルボニルオキシ基、ケト基又は単結合を示す。ｎ^ｃ６及びｎ^ｃ７は、各々独立に、０～４の整数を示す。ｎ^ｃ８は、１～３の整数を示す。）

(In the formula, R ^c5 and R ^c6 each independently represent an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; X ^c2 is an alkylene group having 1 to 5 carbon atoms; an alkylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group or a single bond of n ^c6 and n ^c7 each independently represent an integer of 0 to 4. n ^c8 represents 1 to indicates an integer of 3.)

Examples of the alkylene group having 1 to 5 carbon atoms represented by X ^c2 in the general formula (C-2) include methylene group, 1,2-dimethylene group, 1,3-trimethylene group, 1,4-tetramethylene group, A 1,5-pentamethylene group and the like can be mentioned.
The alkylidene group having 2 to 5 carbon atoms represented by X ^c2 includes ethylidene group, propylidene group, isopropylidene group, butylidene group, isobutylidene group, pentylidene group, isopentylidene group and the like.
Among the groups represented by ^Xc2 , a methylene group, an isopropylidene group, and a single bond are preferable, and a single bond is more preferable, from the viewpoint of high frequency characteristics and flame retardancy.

Examples of aliphatic hydrocarbon groups having 1 to 5 carbon atoms represented by R ^c5 and R ^c6 in the general formula (C-2) include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, t-butyl group, n-pentyl group and the like.

n ^c6 and n ^c7 in the general formula (C-2) are preferably integers of 0 to 3, more preferably 0 or 1, and still more preferably 0, from the viewpoint of high-frequency characteristics and flame retardancy. When n ^c6 is an integer of 2 or more, the plurality of R ^c5 may be the same or different. When n ^c7 is an integer of 2 or more, the plurality of R ^c6 may be the same or different.

n ^c8 in the general formula (C-2) is preferably 1 or 2, more preferably 1. When n ^c8 is an integer of 2 or more, multiple X ^c2 may be the same or different, and multiple n ^c7 may be the same or different.

The divalent group represented by the general formula (C-2) is a divalent group represented by the following formula (C-2-1) or the following formula (C -2-2), and more preferably a divalent group represented by the following formula (C-2-2).

(Aromatic hydrocarbon group (c2))
The aromatic hydrocarbon group (c2) is a divalent condensed polycyclic aromatic hydrocarbon group containing two or more aromatic ring structures. In this embodiment, the term "fused polycyclic aromatic hydrocarbon" refers to an aromatic hydrocarbon having two or more ring structures, where the two or more rings share two or more atoms. It refers to those having a condensed ring, and includes naphthalene, anthracene, pyrene, and the like. Therefore, the aromatic hydrocarbon group (c2) includes divalent groups obtained by removing two hydrogen atoms from these condensed polycyclic aromatic hydrocarbons. These condensed polycyclic aromatic hydrocarbons may or may not be substituted with substituents. Examples of the substituent include the same substituents that the aromatic ring contained in the aromatic hydrocarbon group (c1) may have.

The number of phosphorus atoms that the phosphate ester flame retardant (C1) has in one molecule is not particularly limited, but from the viewpoint of high frequency characteristics and flame retardancy, it is preferably 1 to 10, more preferably 2 to 5, 2 or 3 is more preferred, and 2 is particularly preferred. When the phosphate ester flame retardant (C1) has two or more phosphorus atoms, the phosphate ester bond formed by one phosphorus atom and the phosphate ester bond formed by another phosphorus atom are the divalent aromatic Condensed phosphoric acid esters linked by group hydrocarbon groups (c) are preferred.

The phosphate ester flame retardant (C1) may be a monovalent phosphate, a divalent phosphate, or a trivalent phosphate. And from the viewpoint of flame retardancy, it is preferably a trivalent phosphate.

The phosphate group of the phosphate ester flame retardant (C1) may be any of an alkyl ester, an aryl ester, an aralkyl ester, and the like. is preferred. That is, the phosphate ester flame retardant (C1) is preferably an aromatic phosphate ester compound.
The aryl group constituting the aryl ester includes a substituted or unsubstituted phenyl group, a substituted or unsubstituted naphthyl group, and the like. Substituents for the aryl group include hydrocarbons having 1 to 5 carbon atoms such as methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, t-butyl group and n-pentyl group. group; halogen atom and the like. Among these, the aryl group is preferably an unsubstituted phenyl group or a 2,5-dimethylphenyl group.

The phosphate ester flame retardant (C1) is preferably a compound represented by the following general formula (C-1) from the viewpoint of high frequency characteristics and flame retardancy.

（式中、Ｒ^ｃ１～Ｒ^ｃ４は、各々独立に、炭素数１～５の脂肪族炭化水素基又はハロゲン原子を示す。Ｘ^ｃ１は、下記一般式（Ｃ－２）で表される２価の基又は２個以上の芳香環構造を含む２価の縮合多環式芳香族炭化水素基を示す。ｎ^ｃ１～ｎ^ｃ４は、各々独立に、０～５の整数を示し、ｎ^ｃ５は、０～５の整数を示す。）

(In the formula, R ^c1 to R ^c4 each independently represent an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. X ^c1 is a divalent represented by the following general formula (C-2). or a divalent condensed polycyclic aromatic hydrocarbon group containing two or more aromatic ring structures, n ^c1 to n ^c4 each independently represent an integer of 0 to 5, and n ^c5 is Indicates an integer from 0 to 5.)

（式中、Ｒ^ｃ５及びＲ^ｃ６は、各々独立に、炭素数１～５の脂肪族炭化水素基又はハロゲン原子を示す。Ｘ^ｃ２は、炭素数１～５のアルキレン基、炭素数２～５のアルキリデン基、エーテル基、スルフィド基、スルホニル基、カルボニルオキシ基、ケト基又は単結合を示す。ｎ^ｃ６及びｎ^ｃ７は、各々独立に、０～４の整数を示す。ｎ^ｃ８は、１～３の整数を示す。）

(In the formula, R ^c5 and R ^c6 each independently represent an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; X ^c2 is an alkylene group having 1 to 5 carbon atoms; an alkylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group or a single bond of n ^c6 and n ^c7 each independently represent an integer of 0 to 4. n ^c8 represents 1 to indicates an integer of 3.)

Examples of aliphatic hydrocarbon groups having 1 to 5 carbon atoms represented by R ^c1 to R ^c4 in general formula (C-1) include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, t-butyl group, n-pentyl group and the like. The aliphatic hydrocarbon group is preferably an aliphatic hydrocarbon group having 1 to 3 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and even more preferably a methyl group.
Each of n ^c1 to n ^c4 represents an integer of 0 to 5, preferably an integer of 0 to 2, more preferably 0 or 2, further preferably 2. When n ^c1 to n ^c4 are integers of 2 or more, a plurality of R ^c1s , R ^c2s , R ^c3s , or R ^c4s may be the same or different.
n ^c5 represents an integer of 0 to 5, preferably an integer of 1 to 3, more preferably 1 or 2, further preferably 1. When n ^c5 is an integer of 2 or more, multiple X ^c1 and multiple n ^c4 may be the same or different.

The aliphatic hydrocarbon groups having 1 to 5 carbon atoms represented by R ^c5 and R ^c6 in the general formula (C-2) are described by R ^c1 to R ^c4 in the general formula (C-1). The explanation is the same as for the aliphatic hydrocarbon group having 1 to 5 carbon atoms.
n ^c6 and n ^c7 represent an integer of 0 to 4, preferably an integer of 0 to 2, and more preferably 0. When n ^c6 or n ^c7 is an integer of 2 or more, the plurality of R ^c5 or the plurality of R ^c6 may be the same or different.

Examples of the alkylene group having 1 to 5 carbon atoms represented by X ^c2 include methylene group, 1,2-dimethylene group, 1,3-trimethylene group, 1,4-tetramethylene group, 1,5-pentamethylene group and the like. be done.
The alkylidene group having 2 to 5 carbon atoms represented by X ^c2 includes ethylidene group, propylidene group, isopropylidene group, butylidene group, isobutylidene group, pentylidene group, isopentylidene group and the like.
Among the groups represented by ^Xc2 , a methylene group, an isopropylidene group, and a single bond are preferable, and a single bond is more preferable, from the viewpoint of high frequency characteristics and flame retardancy.
X ^c2 is a divalent group represented by the following formula (C-2-1) or a divalent group represented by the following formula (C-2-2) from the viewpoint of high-frequency characteristics and flame retardancy. is preferred, and a divalent group represented by the following formula (C-2-2) is more preferred.

n ^c8 in the general formula (C-2) represents an integer of 1 to 3, preferably 1 or 2, more preferably 1. When n ^c8 is an integer of 2 or more, the plurality of X ^c2 may be the same or different, and the plurality of n ^c7 may be the same or different. may be

Examples of the divalent condensed polycyclic aromatic hydrocarbon group containing two or more aromatic ring structures represented by X ^c1 in the general formula (C-1) include condensed polycyclic aromatics such as naphthalene, anthracene and pyrene. divalent groups obtained by removing two hydrogen atoms from a group hydrocarbon. These condensed polycyclic aromatic hydrocarbon groups may or may not be substituted with a substituent. Substituents for the condensed polycyclic aromatic hydrocarbon group include carbon numbers such as methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, t-butyl group and n-pentyl group. 1 to 5 aliphatic hydrocarbon groups; and halogen atoms such as fluorine, chlorine, bromine and iodine atoms.

Phosphate ester flame retardants (C1) include 4,4'-biphenol-diphenyl phosphate, bisphenol A-diphenyl phosphate, 4,4'-biphenol-dicresyl phosphate, bisphenol A-dicresyl phosphate, 4,4'- Biphenol-di(2,6-xylenyl phosphate), bisphenol A-di(2,6-xylenyl phosphate), 4,4′-biphenol-polyphenyl phosphate, bisphenol A-polyphenyl phosphate, 4,4 '-biphenol-polycresyl phosphate, bisphenol A-polycresyl phosphate, 4,4'-biphenol-poly(2,6-xylenyl phosphate), bisphenol A-poly(2,6-xylenyl phosphate) etc. Among these, 4,4'-biphenol-di(2,6-xylenyl phosphate) is preferable from the viewpoint of high frequency characteristics, adhesion to conductors, and flame retardancy.
In addition, the "poly" in the exemplary compound regarding the phosphate ester flame retardant (C1) is a repeating unit composed of a structure derived from a dihydric phenol compound and a structure derived from phosphoric acid constituting a phosphate ester compound (e.g., the In the general formula (C-1), it means a structural unit whose number of structural units is indicated by n ^c5 .) means a compound having a number of 2 or more, and by containing the compound, the repeating In some cases, it means that the average value of the units exceeds 1.

(Content of flame retardant (C))
When the resin composition of the present embodiment contains the flame retardant (C), the content thereof is not particularly limited. It is preferably 1 to 40 parts by mass, may be 1 to 30 parts by mass, may be 5 to 25 parts by mass, or may be 10 to 20 parts by mass. When the content of the flame retardant (C) is at least the lower limit, better flame retardancy tends to be obtained. When it is at most the above upper limit, there is a tendency that better moldability, adhesiveness with a conductor, and better heat resistance can be obtained.
In particular, when the resin composition of the present embodiment contains an organic phosphorus-based flame retardant, the content of phosphorus atoms derived from the organic phosphorus-based flame retardant is not particularly limited, but the total sum of the resin components is 100 parts by mass. For, 0.2 to 5 parts by weight is preferable, 0.3 to 3 parts by weight is more preferable, 0.6 to 2.5 parts by weight is more preferable, 1.0 to 2.5 parts by weight is more 1.5 to 2.5 parts by weight is particularly preferred. When the content of the organic phosphorus-based flame retardant is at least the lower limit, there is a tendency to obtain better flame retardancy while suppressing deterioration of high-frequency characteristics. It tends to provide better moldability, adhesion to conductors, better heat resistance and high frequency properties.

(flame retardant aid)
The resin composition of the present embodiment may further contain a flame retardant aid.
Examples of flame retardant aids include inorganic flame retardant aids such as antimony trioxide and zinc molybdate.
When the resin composition of the present embodiment contains a flame retardant aid, the content thereof is not particularly limited, but is preferably 0.1 to 20 parts by mass with respect to 100 parts by mass of the total resin components. 1 to 10 parts by mass is more preferable. When the content of the flame retardant aid is within the above range, better chemical resistance tends to be obtained. Moreover, the resin composition of the present embodiment may not contain a flame retardant aid.

<Curing accelerator (D)>
The resin composition of this embodiment may further contain a curing accelerator (D).
By containing the curing accelerator (D), the resin composition of the present embodiment has improved curability, and has excellent high-frequency characteristics, heat resistance, adhesion to conductors, elastic modulus, and glass transition temperature. tend to be
A hardening accelerator (D) may be used individually by 1 type, and may use 2 or more types together.

Component (D) includes amine-based curing accelerators, imidazole-based curing accelerators, phosphorus-based curing accelerators, organic metal salts, acidic catalysts, organic peroxides, and the like. In this embodiment, imidazole-based curing accelerators are not classified as amine-based curing accelerators.
Amine curing accelerators include amine compounds having primary to tertiary amines such as triethylamine, pyridine, tributylamine and dicyandiamide; quaternary ammonium compounds and the like.
Examples of imidazole-based curing accelerators include imidazole compounds such as methylimidazole, phenylimidazole, 2-undecylimidazole, and isocyanate masked imidazole (for example, an addition reaction product of hexamethylene diisocyanate resin and 2-ethyl-4-methylimidazole). mentioned.
Phosphorus-based curing accelerators include tertiary phosphines such as triphenylphosphine; and quaternary phosphonium compounds such as tri-n-butylphosphine addition reaction product of p-benzoquinone.
Organic metal salts include carboxylates of manganese, cobalt, zinc and the like.
Examples of acidic catalysts include p-toluenesulfonic acid and the like.
Examples of organic peroxides include dicumyl peroxide, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexyne-3,2,5-dimethyl-2,5-bis(t-butylperoxy). oxy)hexane, t-butylperoxyisopropylmonocarbonate, α,α'-di(t-butylperoxy)diisopropylbenzene and the like. However, from the viewpoint of dielectric loss tangent (Df), the resin composition of the present embodiment may be in an aspect in which it does not contain an organic peroxide.
Among these, from the viewpoint of obtaining better high frequency characteristics and heat resistance, imidazole curing accelerators and phosphorus curing accelerators are preferable, imidazole curing accelerators and quaternary phosphonium compounds are more preferable, and imidazole curing accelerators are more preferable. It is more preferable to use a curing accelerator and a quaternary phosphonium compound together.

(Content of component (D))
When the resin composition of the present embodiment contains the curing accelerator (D), its content is not particularly limited, but is preferably 0.01 to 10 parts by mass with respect to 100 parts by mass of the maleimide compound (B). , more preferably 0.05 to 5 parts by mass, more preferably 0.1 to 5 parts by mass, and particularly preferably 0.5 to 4 parts by mass. When the content of the curing accelerator (D) is within the above range, better high frequency characteristics, heat resistance, storage stability and moldability tend to be obtained.

<Inorganic filler (E)>
The resin composition of this embodiment may further contain an inorganic filler (E). By containing the inorganic filler (E) in the resin composition of the present embodiment, there is a tendency that more excellent low thermal expansion, high elastic modulus, heat resistance and flame retardancy can be obtained.
An inorganic filler (E) may be used individually by 1 type, and may use 2 or more types together.

Inorganic fillers (E) include silica, alumina, titanium oxide, mica, beryllia, barium titanate, potassium titanate, strontium titanate, calcium titanate, aluminum carbonate, magnesium hydroxide, aluminum hydroxide, and aluminum silicate. , calcium carbonate, calcium silicate, magnesium silicate, silicon nitride, boron nitride, clay (eg, calcined clay, etc.), talc, aluminum borate, silicon carbide, and the like. Among these, from the viewpoint of thermal expansion coefficient, elastic modulus, heat resistance and flame retardancy, the inorganic filler (E) is preferably silica, alumina, mica, or talc, more preferably silica or alumina, and more preferably silica. preferable. Examples of silica include precipitated silica produced by a wet method and having a high moisture content, and dry-process silica produced by a dry method and containing almost no bound water or the like. Dry process silica is classified according to the manufacturing method, and includes crushed silica, fumed silica, fused silica (fused spherical silica), and the like. Among these, fused spherical silica is preferable as the inorganic filler (E).

The average particle size of the inorganic filler (E) is not particularly limited, but is preferably 0.01 to 20 μm, more preferably 0.1 to 10 μm, still more preferably 0.2 to 1 μm, and 0.3 to 0.8 μm. is particularly preferred. In the present specification, the average particle size is the particle size at the point corresponding to 50% of the volume when the cumulative frequency distribution curve of the particle size is obtained with the total volume of the particles being 100%.

When using the inorganic filler (E), for the purpose of improving the dispersibility of the inorganic filler (E) and the adhesion between the inorganic filler (E) and the organic component in the resin composition, if necessary, a cup A ring agent may be used in combination. The coupling agent may be a titanate coupling agent, a silane coupling agent, or the like.
Coupling agents may be used alone or in combination of two or more.
When a coupling agent is used, the processing method may be a so-called integral blend processing method in which the inorganic filler (E) is added to the resin composition and then the coupling agent is added. Alternatively, a wet method using an inorganic filler surface-treated with a coupling agent is preferable. By adopting this method, the features of the inorganic filler (E) can be exhibited more effectively.
In addition, the inorganic filler (E) may be used in the form of a slurry dispersed in an organic solvent in advance, if necessary.

(Content of component (E))
When the resin composition of the present embodiment contains the inorganic filler (E), the content is not particularly limited, but from the viewpoint of thermal expansion coefficient, elastic modulus, heat resistance and flame retardancy, the resin composition The solid content is preferably 1 to 60% by volume, more preferably 5 to 50% by volume, even more preferably 10 to 45% by volume, particularly preferably 15 to 40% by volume, and most preferably 20 to 30% by volume.

<Other ingredients>
Furthermore, the resin composition of the present embodiment may optionally include resin materials other than the above components, coupling agents, antioxidants, adhesion improvers, and heat stabilizers, as long as the effects of the present embodiment are not impaired. agents, antistatic agents, ultraviolet absorbers, pigments, colorants and lubricants [hereinafter sometimes abbreviated as "other components"]. ] may be contained. Each of these components may be used alone or in combination of two or more. Moreover, the resin composition of the present embodiment may not contain these components.
When the resin composition of the present embodiment contains the other components, the content of each is not particularly limited, but is, for example, 0.01 parts by mass or more with respect to 100 parts by mass of the total resin components. Also, it may be 10 parts by mass or less, 5 parts by mass or less, or 1 part by mass or less.

<Organic solvent>
The resin composition of the present embodiment may be a varnish-like resin composition containing an organic solvent from the viewpoint of facilitating handling and facilitating production of a prepreg described later.
The organic solvent is not particularly limited, but alcohol solvents such as ethanol, propanol, butanol, methyl cellosolve, butyl cellosolve, and propylene glycol monomethyl ether; ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; Ether solvents such as tetrahydrofuran; Aromatic solvents such as toluene, xylene and mesitylene; Nitrogen atom-containing solvents such as dimethylformamide, dimethylacetamide and N-methylpyrrolidone; Sulfur atom-containing solvents such as dimethyl sulfoxide; Ester-based solvents and the like are included. From the viewpoint of solubility of component (A), aromatic solvents are preferred, and toluene is particularly preferred. An organic solvent may be used individually by 1 type, and may use 2 or more types together.

When the resin composition of the present embodiment contains an organic solvent, the content is not particularly limited, but the solid content concentration of the resin composition of the present embodiment is preferably 30 to 90% by mass. An amount of up to 80% by mass is more preferable, and an amount of 40 to 60% by mass is even more preferable. When the content of the organic solvent is within the above range, the handleability of the resin composition is facilitated, and the impregnation of the base material and the appearance of the produced prepreg are improved. Furthermore, it becomes easier to adjust the solid content concentration of the resin in the prepreg, which will be described later, and it tends to become easier to manufacture a prepreg having a desired thickness.

<Dielectric characteristics (high frequency characteristics)>
The dielectric constant (Dk) at 10 GHz when the resin composition of the present embodiment is used as a test piece by the method described in Examples below is not particularly limited, but is preferably 3.0 or less, and 2.95 or less. More preferably, 2.85 or less is even more preferable. The dielectric constant (Dk) is preferably as small as possible, and the lower limit thereof is not particularly limited, but from the viewpoint of balance with other physical properties, for example, it may be 2.2 or more, or 2.4 or more. good too.
The dielectric loss tangent (Df) at 10 GHz when the resin composition of the present embodiment is used as a test piece by the method described in Examples below is not particularly limited, but is preferably 0.0030 or less, and 0.0025 or less. It is more preferably 0.0020 or less, and particularly preferably 0.0018 or less. The dielectric loss tangent (Df) is preferably as small as possible, and the lower limit thereof is not particularly limited. may be 0.0010 or more.
The dielectric constant (Dk) and the dielectric loss tangent (Df) are values based on the cavity resonator perturbation method, and more specifically, values measured by the method described in Examples. In this specification, permittivity means relative permittivity.

The resin composition of the present embodiment can be produced by mixing the (A) component, the (B) component, and optional components used in combination as necessary by a known method. At this time, each component may be dissolved or dispersed in the organic solvent with stirring. Conditions such as mixing order, temperature and time are not particularly limited and can be arbitrarily set.

Since the resin composition of the present embodiment exhibits excellent dielectric properties in a high frequency band of 10 GHz or higher, resin films, resin-coated metal foils, prepregs, and laminates obtained using the resin composition , multilayer printed wiring boards, semiconductor packages, and the like are suitable for use as electronic components that handle high-frequency signals.

[Resin film]
The resin film of this embodiment is a resin film containing the resin composition of this embodiment.
The resin film of the present embodiment can be produced, for example, by applying a resin composition containing an organic solvent, ie, a resin varnish, to a support and drying it by heating.
Examples of the support include polyolefin films such as polyethylene, polypropylene and polyvinyl chloride; polyester films such as polyethylene terephthalate (hereinafter also referred to as "PET") and polyethylene naphthalate; various plastic films such as polycarbonate films and polyimide films. is mentioned. The support may be subjected to surface treatment such as matte treatment, corona treatment, ozone treatment and plasma treatment. Further, the support may be subjected to release treatment with a silicone resin release agent, an alkyd resin release agent, a fluororesin release agent, or the like.
Although the thickness of the support is not particularly limited, it is preferably 10 to 150 μm, more preferably 25 to 80 μm.

The method of applying the resin varnish to the support is not particularly limited, but a coating apparatus known to those skilled in the art such as a comma coater, bar coater, kiss coater, roll coater, gravure coater, die coater, etc. may be used. can be done. The coating device may be appropriately selected according to the film thickness to be formed.
The drying temperature and drying time may be appropriately determined according to the amount of organic solvent used and the boiling point of the organic solvent used. A resin film can be preferably formed by drying at 50 to 150° C. for about 3 to 10 minutes.
Although the thickness of the resin film of this embodiment is not particularly limited, it is preferably 5 to 80 μm, more preferably 10 to 50 μm, still more preferably 15 to 35 μm. The thickness of the resin film is the thickness of the dried resin film. One sheet of the resin film may be used alone, or two or more sheets may be stacked and used.

[Metal foil with resin]
The resin-coated metal foil of the present embodiment has a layer of the resin composition of the present embodiment on the metal foil. Hereinafter, the "layer of the resin composition" may be referred to as a "resin layer".
Specifically, the resin composition of the present embodiment is applied on a metal foil, and the resin composition is B-staged in a drying oven to form a resin layer on the metal foil. ” can be manufactured. Here, in the present specification, B-staging is to bring to a state of B-stage defined in JIS K6900 (1994), and is also called semi-curing.
The drying conditions are not particularly limited, but the drying temperature is preferably 60 to 180°C, more preferably 80 to 140°C. The coating method is not particularly limited, but includes a method of coating using a known coating machine such as a die coater, a comma coater, a bar coater, a kiss coater, and a roll coater.

Examples of the metal foil of the resin-coated metal foil include copper foil, aluminum foil, tin foil, tin-lead alloy (solder) foil, and nickel foil, but other metal foils may also be used. Among these, copper foil is preferable as the metal foil. When the metal foil is a copper foil, the grade and thickness of the copper foil may be appropriately selected according to the circuit design of the semiconductor package to be manufactured, but the copper content is preferably 95% by mass or more. .
Of the two surfaces of the metal foil, the surface facing the resin layer may be roughened from the viewpoint of adhesion. The roughening treatment can be performed by forming roughening particles on the surface of the metal foil. The roughened particles are electrodeposited particles made of at least one element selected from the group consisting of copper, nickel, phosphorus, tungsten, arsenic, molybdenum, chromium, cobalt and zinc, or any one of these elements Electrodeposited grains made of an alloy containing at least one seed are preferred.
Further, after the roughening treatment, secondary particles, tertiary particles, A rust-preventive layer, a heat-resistant layer, or the like may be formed, and the surface thereof may be subjected to surface treatment such as chromate treatment or silane coupling treatment.
In the metal foil with resin of the present embodiment, the thickness of the resin layer is not particularly limited, but is preferably 5 to 200 μm, more preferably 10 to 100 μm, still more preferably 10 to 50 μm.
In the metal foil with resin of the present embodiment, the thickness of the metal foil is not particularly limited, but is preferably 3 to 40 μm, more preferably 5 to 35 μm, still more preferably 10 to 20 μm.

Examples of the resin-coated metal foil include a mode (A) of "resin layer/metal foil" and a mode (B) of "resin layer/ultra-thin metal foil/release layer/carrier".
The resin-coated metal foil of the aspect (A) can be mainly used in a subtractive method, and can be used in a semi-additive process (SAP) and a modified semi-additive process (MSAP). can also The metal foil with resin of the aspect (B) can be used mainly for the MSAP method because the ultra-thin metal foil remains on the thermosetting resin film and can function as a seed layer as it is. may be used.
The resin layer in the aspect (A) and the aspect (B) is the resin layer described above, and the types of the metal foil and the ultra-thin metal foil are described in the same manner as the metal foil described above. . The carrier in the aspect (B) may be the metal foil described above, or may be a resin film such as a polyimide film or a polyethylene terephthalate film.
The thickness of the metal foil in the aspect (A) is as described for the metal foil above. On the other hand, the ultra-thin metal foil in the aspect (B) is thinner than the metal foil described above, and its thickness may be 0.1 to 3 μm or 0.3 to 2.5 μm. The release layer of the aspect (B) enables smooth peeling at the interface between the release layer and the ultrathin metal foil when the carrier is peeled off. If the ultra-thin metal foil and the carrier can be easily separated, the separation layer may not be formed. The peeling layer is not particularly limited as long as it can be peeled off smoothly at the interface between the peeling layer and the ultrathin metal foil, and known ones can be used. The peeling layer may be an inorganic peeling layer or an organic peeling layer.

[Prepreg]
The prepreg of the present embodiment contains the resin composition of the present embodiment and a sheet-like fiber-reinforced base material.
The prepreg can be formed using the resin composition of the present embodiment and a sheet-like fiber-reinforced base material. For example, the resin composition of the present embodiment is impregnated or coated on the sheet-like fiber-reinforced base material. and heat-drying in a drying oven at 60 to 180° C. for 1 to 30 minutes to B-stage the resin composition.
The solid content derived from the resin composition in the prepreg of the present embodiment is not particularly limited, but is preferably 30 to 90% by mass, more preferably 35 to 85% by mass, further preferably 40 to 80% by mass, and 45% by mass. ~80% by weight is particularly preferred. When the content of solids derived from the resin composition in the prepreg is within the above range, there is a tendency that better moldability can be obtained when the prepreg is used as a laminate.

As the sheet-like fiber-reinforced base material of the prepreg, known materials used for various laminates for electrical insulating materials are used. Materials for the sheet-like fiber-reinforced base material include inorganic fibers such as E-glass, D-glass, S-glass, and Q-glass; organic fibers such as polyimide, polyester, and tetrafluoroethylene; and mixtures thereof. These sheet-like fiber-reinforced substrates have forms such as woven fabrics, non-woven fabrics, robinks, chopped strand mats, surfacing mats, and the like. Moreover, the thickness of the sheet-shaped fiber-reinforced base material is not particularly limited, and for example, a thickness of 5 to 160 μm can be used. In addition, from the viewpoint of the impregnating property of the resin composition, the heat resistance, moisture absorption resistance and workability of the laminated plate, those surface-treated with a coupling agent or the like, or mechanically fiber-opened, etc. Available.

As a method for impregnating or coating the sheet-like fiber-reinforced base material with the resin composition, the following hot-melt method or solvent method can be employed.
The hot-melt method is a method in which the resin composition does not contain an organic solvent, and (1) a coated paper having good releasability from the resin composition is once coated and then laminated to a sheet-like fiber-reinforced base material. or (2) a method of directly coating a sheet-like fiber-reinforced base material with a die coater.
On the other hand, in the solvent method, the resin composition is made to contain an organic solvent, and the sheet-like fiber-reinforced base material is immersed in the resulting resin composition to impregnate the sheet-like fiber-reinforced base material with the resin composition. It is a drying method.

The thickness of the prepreg of this embodiment is not particularly limited, and may be 10 to 170 μm, 10 to 120 μm, or 10 to 70 μm.

[Laminate]
The laminate of the present embodiment is a laminate containing (i) the resin film of the present embodiment, (ii) the resin-coated metal foil of the present embodiment, or (iii) the prepreg and metal foil of the present embodiment. be.
The laminated plate of this embodiment is formed by heating and pressurizing one or more resin films of this embodiment or one resin-coated metal foil of this embodiment, or two resin-coated metal foils with the metal foil serving as an outer layer. A laminated board can be obtained by heat-pressing after arranging in a state. Alternatively, a metal foil may be placed on one side or both sides of one resin film of the present embodiment or one side or both sides of one prepreg of the present embodiment, or two resin films of the present embodiment or two prepregs of the present embodiment may be used. A laminate can also be obtained by placing a metal foil on one side or both sides of the stack and then heat-pressing it. A laminate having metal foil is sometimes referred to as a metal-clad laminate.
As another method for manufacturing a laminated board, the metal foil with resin of this embodiment is superimposed on both sides or one side of the prepreg of this embodiment or other prepreg so that the resin surface faces the prepreg, and then heated and pressed. method. In this case, as the prepreg, as long as one or more prepregs of the present embodiment are used, one prepreg may be used, or two or more prepregs may be laminated and used. When two or more prepregs are laminated and used, different prepregs may be combined and laminated.
The metal of the metal foil is not particularly limited as long as it is used as an electrical insulating material, but from the viewpoint of conductivity, copper, gold, silver, nickel, platinum, molybdenum, ruthenium, aluminum, tungsten, iron, titanium. , chromium, or an alloy containing one or more of these metal elements, preferably copper or aluminum, more preferably copper.
From the viewpoint of productivity, the heating temperature during hot-press molding is preferably 185°C or higher, may be 200 to 300°C, or may be 220 to 250°C. When the heating temperature is within the above range, excellent dielectric properties and flame retardancy as well as good productivity tend to be obtained.
The pressure and time during the hot press molding are not particularly limited, but for example, the pressure can be in the range of 0.2 to 10 MPa and the time can be in the range of 0.1 to 5 hours. Also, for the heating and pressure molding, a method of maintaining a vacuum state for 0.5 to 5 hours using a vacuum press or the like may be employed. Under the above conditions, a sufficiently cured laminate can be obtained.

[Multilayer printed wiring board]
The multilayer printed wiring board of the present embodiment includes (i) the resin film of the present embodiment, (ii) the metal foil with resin of the present embodiment, (iii) the prepreg of the present embodiment, or (iv) the laminate of the present embodiment. , The multilayer printed wiring board of the present embodiment can be manufactured by using the resin film of the present embodiment, the resin-coated metal foil, the prepreg, or the laminate of the present embodiment, and performing hole drilling, metal plating, and metal foil processing by known methods. It can be manufactured by carrying out a circuit forming process by etching or the like, a multi-layer bonding process, or the like.

[Semiconductor package]
The semiconductor package of this embodiment is a semiconductor package containing (v) the multilayer printed wiring board of this embodiment and (vi) a semiconductor element.
In the semiconductor package of this embodiment, for example, semiconductor elements such as semiconductor chips and memories are mounted at predetermined positions on the multilayer printed wiring board of this embodiment by a known method, and the semiconductor elements are sealed with a sealing resin or the like. can be manufactured by

Although preferred embodiments have been described above, these are examples for explanation of the present disclosure, and are not intended to limit the scope of the present disclosure only to these embodiments. The present disclosure also includes various aspects different from the above-described embodiments without departing from the scope of the present disclosure.

EXAMPLES The present embodiment will be specifically described below with reference to Examples. However, this embodiment is not limited to the following examples.

[Examples 1-4, Comparative Examples 1-2]
(Preparation of resin composition)
A resin composition having a solid concentration of 45 to 55% by mass was prepared by mixing and stirring each component shown in Table 1 in toluene at room temperature according to the formulation shown in Table 1.
(Production of laminated plate and production of resin plate)
The resin composition obtained in each example was applied to a PET film having a thickness of 50 μm with a coating machine, and dried by heating at 110° C. for 3 minutes to prepare a resin-coated PET film having a resin layer having a thickness of 25 μm. A plurality of PET films with the resin were produced.
A resin film was obtained by peeling the PET film from the resin-coated PET film. The resin films obtained in this manner were laminated to a thickness of 325 μm to form a laminate of resin films. The laminate of the resin film is placed in a formwork with a thickness of 300 μm, and a low-profile copper foil with a thickness of 18 μm (BF-ANP18, Rz on the M surface: 1.5 μm, manufactured by CIRCUIT FOIL) is used. A laminate was obtained by laminating in a state in which the surfaces were in contact with each other. Then, a double-sided copper-clad laminate was produced by heat-press molding under conditions of a temperature of 230° C., a pressure of 3.0 MPa, and a time of 90 minutes. The obtained double-sided copper-clad laminate was immersed in a copper etching solution (10% by mass ammonium persulfate solution, manufactured by Mitsubishi Gas Chemical Company, Inc.) to remove the outer layer copper foil, thereby producing a resin plate having a thickness of 300 μm.

[Evaluation method]
High frequency characteristics were evaluated according to the following method. Table 1 shows the results.
(1. Evaluation of high frequency characteristics)
A test piece for measurement was produced by cutting the resin plate produced in each example into a length of 60 mm and a width of 2 mm. Using the test piece, the dielectric constant and dielectric loss tangent were measured by the cavity resonator perturbation method.
A vector network analyzer "N5227A" manufactured by Agilent Technologies Inc. was used as the measuring instrument, and a cavity resonator "CP129" (10 GHz band resonator) manufactured by Kanto Denshi Applied Development Co., Ltd. was used for measurement. "CPMA-V2" was used for the program. The measurement was performed under conditions of a frequency of 10 GHz and a measurement temperature of 25°C.

［（Ｄ）成分：硬化促進剤］
・硬化促進剤１；ｐ－ベンゾキノンのトリ－ｎ－ブチルホスフィン付加反応物
・硬化促進剤２；２－ウンデシルイミダゾール
・硬化促進剤３；１，３－ビス（２－ｔ－ブチルパーオキシイソプロピル）ベンゼン
［（Ｅ）成分：無機充填材］
・球状溶融シリカ：平均粒子径１．５μｍ、トルエン５０質量％スラリー The abbreviations and the like of each material in Table 1 are as follows.
[(A) component: alicyclic hydrocarbon skeleton-containing polymer having a Tg of 220°C or less]
・ "ZEONEX (registered trademark) 480R" (manufactured by Nippon Zeon Co., Ltd.), cyclopentane skeleton-containing polymer, Tg = 138 ° C. (catalog value), refractive index = 1.525 (catalog value)
[(B) component: maleimide compound]
- 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethanebismaleimide [other resin components: polyphenylene ether]
・ "NORYL (registered trademark) PPO630-111" (manufactured by SABIC Japan LLC), weight average molecular weight = 47,600
[(C) component: flame retardant]
・Phosphate ester flame retardant having the following structural formula

[(D) component: curing accelerator]
・Curing accelerator 1; tri-n-butylphosphine addition reaction product of p-benzoquinone ・Curing accelerator 2; 2-undecylimidazole ・Curing accelerator 3; 1,3-bis(2-t-butylperoxyisopropyl ) Benzene [(E) component: inorganic filler]
・Spherical fused silica: average particle size 1.5 μm, toluene 50% by mass slurry

As is clear from the results shown in Table 1, when the resin compositions prepared in Examples 1 to 4 are used, the resin plate has excellent high-frequency characteristics. In addition, since the component (A) contained in the resin compositions prepared in Examples 1 to 4 has structural units derived from cycloolefin, it is excellent in heat resistance. On the other hand, in Comparative Example 1 using polyphenylene ether instead of components (A) and (B), and in Comparative Example 2 using polyphenylene ether instead of component (A), compared to Example 3 that can be directly compared , the high-frequency characteristics of the resin plate were poor.

Claims (15)

A resin composition containing an alicyclic hydrocarbon skeleton-containing polymer (A) having a glass transition temperature of 220° C. or less and a maleimide compound (B). 2. The resin composition according to claim 1, wherein the component (A) has an alicyclic hydrocarbon skeleton with 3 to 12 ring-forming carbon atoms. 3. The resin composition according to claim 1, wherein the alicyclic hydrocarbon skeleton in component (A) is monocyclic or bicyclic. The resin composition according to any one of claims 1 to 3, wherein the content of component (A) is 1 to 80 parts by mass per 100 parts by mass of the total resin components. The resin composition according to any one of claims 1 to 4, further comprising a flame retardant (C). 6. The resin composition according to claim 5, wherein the component (C) is an organic phosphorus-based flame retardant. The composition according to any one of claims 1 to 6, which does not contain a cyanate resin, or when it contains a cyanate resin, the content is 10% by mass or less with respect to the solid content of the resin composition. Resin composition. The resin composition according to any one of claims 1 to 7, further comprising a curing accelerator (D). The resin composition according to any one of claims 1 to 8, further comprising an inorganic filler (E). A resin film comprising the resin composition according to any one of claims 1 to 9. A resin-coated metal foil comprising a layer of the resin composition according to any one of claims 1 to 9 on the metal foil. A prepreg comprising the resin composition according to any one of claims 1 to 9 and a sheet-like fiber-reinforced base material. A laminate comprising (i) the resin film according to claim 10, (ii) the resin-coated metal foil according to claim 11, or (iii) the prepreg and metal foil according to claim 12. (i) the resin film according to claim 10, (ii) the resin-coated metal foil according to claim 11, (iii) the prepreg according to claim 12, or (iv) the laminate according to claim 13. A multilayer printed wiring board comprising: (v) a multilayer printed wiring board according to claim 14 and (vi) a semiconductor package containing a semiconductor element.