JP2021138849A - Resin composition, prepreg, laminate, resin film, printed wiring board, semiconductor package, and method for producing resin composition - Google Patents

Abstract

To provide a resin composition which has good heat resistance, is excellent in economical efficiency, and can exhibit excellent dielectric characteristics in a high-frequency band of 10 GHz band or higher and a method for producing the same, and a prepreg, a laminate, a resin film, a printed wiring board and a semiconductor package using the resin composition.SOLUTION: There are provided a resin composition contains (A) one or more selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof, (B) a polyphenylene ether-based resin, and (C) an organometallic compound having an alkoxy group bonded to a metal atom, and a method for producing the same; and a prepreg, a laminate, a resin film, a printed wiring board and a semiconductor package using the resin composition.SELECTED DRAWING: None

Description

The present invention relates to a method for producing a resin composition, a prepreg, a laminated board, a resin film, a printed wiring board, a semiconductor package, and a resin composition.

In mobile communication devices such as mobile phones, their base station devices, servers, network infrastructure devices such as routers, and large computers, the speed and capacity of signals used are increasing year by year. Along with this, the printed wiring boards mounted on these electronic devices need to be compatible with high frequencies, and the dielectric characteristics in the high frequency band that enable reduction of transmission loss (low dielectric constant and low dielectric loss tangent; hereinafter, " There is a demand for a substrate material having excellent "high frequency characteristics"). In recent years, as applications that handle such high-frequency signals, in addition to the above-mentioned electronic devices, practical application or practical planning of new systems that handle high-frequency wireless signals in the ITS field (automobiles, transportation system-related) and indoor short-range communication fields. Is progressing, and it is expected that low transmission loss will be further required for printed wiring boards mounted on these devices in the future.

Conventionally, polyphenylene ether (PPE) -based resin has been used as a heat-resistant thermoplastic polymer having excellent high-frequency characteristics for printed wiring boards that require low transmission loss. Specifically, a resin composition containing a polyphenylene ether and an epoxy resin (see, for example, Patent Document 1), and a resin composition containing a cyanate resin having a low dielectric constant among the polyphenylene ether and a thermosetting resin (for example, a patent). (See Document 2) and the like are disclosed.
However, the resin compositions described in Patent Documents 1 and 2 are generally insufficient in high frequency characteristics in the GHz region, adhesiveness to conductors, low coefficient of thermal expansion, flame retardancy, or thermosetting with polyphenylene ether. Due to the low compatibility with the resin, the heat resistance may decrease.

Under such circumstances, a resin having particularly good compatibility, dielectric properties in a high frequency band, high adhesion to a conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient, and high flame retardancy. A resin containing one or more thermosetting resins selected from the group consisting of polyphenylene ether derivatives having a specific structure, epoxy resins, cyanate resins, and maleimide compounds, and styrene-based thermoplastic elastomers, with the object of providing the composition. Compositions have been proposed (see, for example, Patent Document 3).

Japanese Unexamined Patent Publication No. 58-069046 Tokukousho 61-018937 Gazette International Publication No. 2016/175326

The resin composition described in Patent Document 3 certainly has excellent dielectric properties in the high frequency band. However, in recent years, the 10 GHz band can also be used for fifth-generation mobile communication system (5G) antennas that use radio waves in the frequency band exceeding 6 GHz and millimeter-wave radars that use radio waves in the frequency band of 30 to 300 GHz. The development of a resin composition having further improved dielectric properties is desired. Further, from the viewpoint of economy, it is desired to improve the dielectric property by a simple method without going through a complicated process.

In view of such a current situation, the present invention is excellent in economic efficiency, a resin composition capable of exhibiting excellent dielectric properties in a high frequency band of 10 GHz band or higher, a method for producing the same, a prepreg using the resin composition, and lamination. An object of the present invention is to provide a plate, a resin film, a printed wiring board, and a semiconductor package.

（上記一般式（Ｃ−１）及び（Ｃ−２）中、Ｒ^Ｃ１は、各々独立に、炭素数１〜１０の炭化水素基を示し、Ｍ^Ｃ１は、チタン原子又はジルコニウム原子を示す。上記一般式（Ｃ−２）中、Ｒ^Ｃ２は、各々独立に、水素原子又は炭素数１〜１０の炭化水素基を示す。）
［４］前記（Ｃ）金属原子に結合するアルコキシ基を有する有機金属化合物が、チタン原子に結合するアルコキシ基を有する有機チタン化合物である、上記［２］に記載の樹脂組成物。
［５］前記（Ｂ）ポリフェニレンエーテル系樹脂の数平均分子量が、１，０００〜２５，０００である、上記［１］〜［４］のいずれかに記載の樹脂組成物。
［６］前記（Ｂ）ポリフェニレンエーテル系樹脂が、エチレン性不飽和結合含有基を有するものである、上記［１］〜［５］のいずれかに記載の樹脂組成物。
［７］前記（Ｃ）金属原子に結合するアルコキシ基を有する有機金属化合物の含有量が、前記（Ｂ）ポリフェニレンエーテル系樹脂１００質量部に対して、０．０１〜２０質量部である、上記［１］〜［６］のいずれかに記載の樹脂組成物。
［８］上記［１］〜［７］のいずれかに記載の樹脂組成物を含有してなるプリプレグ。
［９］上記［８］に記載のプリプレグと金属箔とを含有してなる積層板。
［１０］上記［１］〜［７］のいずれかに記載の樹脂組成物を含有してなる樹脂フィルム。
［１１］上記［８］に記載のプリプレグ、上記［９］に記載の積層板及び上記［１０］に記載の樹脂フィルムからなる群から選択される１種以上を含有してなるプリント配線板。
［１２］上記［１１］に記載のプリント配線板に半導体素子を搭載してなる半導体パッケージ。
［１３］上記［１］〜［７］のいずれかに記載の樹脂組成物を製造する方法であって、
（Ａ）Ｎ−置換マレイミド基を２個以上有するマレイミド化合物及びその誘導体からなる群から選択される１種以上と、
（Ｂ）ポリフェニレンエーテル系樹脂と、
（Ｃ）金属原子に結合するアルコキシ基を有する有機金属化合物と、
を混合する、樹脂組成物の製造方法。 As a result of studying to solve the above problems, the present inventors have found that the following problems can be solved by the present invention.
That is, the present invention relates to the following [1] to [13].
[1] (A) One or more selected from the group consisting of maleimide compounds having two or more N-substituted maleimide groups and derivatives thereof, and
(B) Polyphenylene ether-based resin and
(C) An organometallic compound having an alkoxy group bonded to a metal atom,
A resin composition comprising.
[2] The organic metal compound having an alkoxy group bonded to the metal atom (C) is composed of an organic titanium compound having an alkoxy group bonded to the titanium atom and an organic zirconium compound having an alkoxy group bonded to the zirconium atom. The resin composition according to the above [1], which is one or more selected from the group.
[3] The organometallic compound having an alkoxy group bonded to the metal atom (C) is a compound represented by the following general formula (C-1) or the following general formula (C-2). Alternatively, the resin composition according to [2].

(In the general formula (C1) and ^{(C-2), R C1} are each independently a hydrocarbon group having 1 to 10 carbon ^{atoms, M C1} represents a titanium atom or zirconium atom. The above in formula ^{(C2), R C2} each independently represents a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms.)
[4] The resin composition according to the above [2], wherein the organic metal compound having an alkoxy group bonded to the metal atom (C) is an organic titanium compound having an alkoxy group bonded to a titanium atom.
[5] The resin composition according to any one of [1] to [4] above, wherein the polyphenylene ether-based resin (B) has a number average molecular weight of 1,000 to 25,000.
[6] The resin composition according to any one of the above [1] to [5], wherein the (B) polyphenylene ether-based resin has an ethylenically unsaturated bond-containing group.
[7] The content of the organometallic compound having an alkoxy group bonded to the (C) metal atom is 0.01 to 20 parts by mass with respect to 100 parts by mass of the (B) polyphenylene ether-based resin. The resin composition according to any one of [1] to [6].
[8] A prepreg containing the resin composition according to any one of the above [1] to [7].
[9] A laminated board containing the prepreg and metal leaf according to the above [8].
[10] A resin film containing the resin composition according to any one of the above [1] to [7].
[11] A printed wiring board containing at least one selected from the group consisting of the prepreg according to the above [8], the laminated board according to the above [9], and the resin film according to the above [10].
[12] A semiconductor package in which a semiconductor element is mounted on the printed wiring board according to the above [11].
[13] A method for producing the resin composition according to any one of the above [1] to [7].
(A) One or more selected from the group consisting of maleimide compounds having two or more N-substituted maleimide groups and derivatives thereof, and
(B) Polyphenylene ether-based resin and
(C) An organometallic compound having an alkoxy group bonded to a metal atom,
A method for producing a resin composition.

According to the present invention, a resin composition excellent in economy and capable of exhibiting excellent dielectric properties in a high frequency band of 10 GHz band or more and a method for producing the same, a prepreg, a laminated board, a resin film using the resin composition, and the like. Printed wiring boards and semiconductor packages can be provided.

In the numerical range described in the present specification, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples. Further, the lower limit value and the upper limit value of the numerical range are arbitrarily combined with the lower limit value or the upper limit value of the other numerical range, respectively.
Further, as for each component and material exemplified in this specification, one kind may be used alone or two or more kinds may be used in combination unless otherwise specified. In the present specification, the content of each component in the composition is the total amount of the plurality of substances present in the composition unless otherwise specified, when a plurality of substances corresponding to each component are present in the composition. Means.
The present invention also includes aspects in which the items described in the present specification are arbitrarily combined.

[Resin composition]
The resin composition of this embodiment is
(A) One or more selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof [hereinafter, abbreviated as "maleimide compound (A)" or "component (A)". be. ]When,
(B) Polyphenylene ether-based resin [Hereinafter, it may be abbreviated as "polyphenylene ether-based resin (B)" or "component (B)". ]When,
(C) An organometallic compound having an alkoxy group bonded to a metal atom [hereinafter, may be abbreviated as "organometallic compound (C)" or "component (C)". ]When,
It is a resin composition containing.
Hereinafter, each component will be described in detail in order.

<Component (A); Maleimide compound (A)>
The maleimide compound (A) is one or more selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof.
Examples of the "derivative of a maleimide compound having two or more N-substituted maleimide groups" include a maleimide compound having two or more N-substituted maleimide groups and an amine compound such as a diamine compound (a2) described later. Additive reactants and the like can be mentioned.
The maleimide compound (A) may be used alone or in combination of two or more.

The maleimide compound (A) is selected from the viewpoints of compatibility with other resins, adhesiveness with conductors, and dielectric properties.
(I) Maleimide compound (a1) having two or more N-substituted maleimide groups [hereinafter, may be simply abbreviated as "maleimide compound (a1)" or "component (a1)". ], And (ii) a polyaminobismaleimide compound having a structural unit derived from the maleimide compound (a1) and a structural unit derived from the diamine compound (a2) [hereinafter, "polyaminobismaleimide compound (A1)" or "(A1) component". May be abbreviated. ]
One or more selected from the group consisting of is preferable.

(Maleimide compound (a1))
The component (a1) is not particularly limited as long as it is a maleimide compound having two or more N-substituted maleimide groups, and for example, bis (4-maleimidephenyl) methane, bis (4-maleimidephenyl) ether, and bis (4). -Maleimidephenyl) sulfone, 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethanebismaleimide, 4-methyl-1,3-phenylenebismaleimide, m-phenylenebismaleimide, 2,2 -Bis [4- (4-maleimidephenoxy) phenyl] An aromatic maleimide compound having two N-substituted maleimide groups in the molecule such as propane; three or more in the molecule such as polyphenylmethane maleimide and biphenylaralkyl-type maleimide. Aromatic polymaleimide compounds having N-substituted maleimide groups; 1,6-bismaleimide- (2,2,4-trimethyl) hexane, aliphatic maleimide compounds such as pyrophosphate binder type long chain alkylbismaleimide, etc. Be done. Among these, from the viewpoints of compatibility with other resins, adhesion to conductors, heat resistance, low thermal expansion, and mechanical properties, 3,3'-dimethyl-5,5'-diethyl-4,4' -Diphenylmethane bismaleimide, 2,2-bis [4- (4-maleimide phenoxy) phenyl] propane, and biphenyl aralkyl type maleimide are preferable.
As the component (a1), one type may be used alone, or two or more types may be used in combination.

As the component (a1), a bismaleimide compound represented by the following general formula (a1-1) is preferable.

（式中、Ｘ^ａ１は２価の有機基である。）

(In the formula, X ^a1 is a divalent organic group.)

^{X a1} in the general formula (a1-1) is a divalent organic group and corresponds to the residue of the component (a1). The residue of the component (a1) refers to the structure of the portion obtained by removing the N-substituted maleimide group from the component (a1).
The ^{divalent organic group represented by X a1} is represented by, for example, the following general formulas (a1-2), (a1-3), (a1-4), (a1-5) or (a1-6). The group is mentioned.

（式中、Ｒ^ａ１は、炭素数１〜５の脂肪族炭化水素基又はハロゲン原子である。ｐ１は０〜４の整数である。）

^{(Wherein, R a1} is, .P1 an aliphatic hydrocarbon group, or a halogen atom having 1 to 5 carbon atoms is an integer of 0-4.)

^{Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by Ra1} include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group and an n-pentyl group. Group etc. can be mentioned. The aliphatic hydrocarbon group may be an aliphatic hydrocarbon group having 1 to 3 carbon atoms or a methyl group.
Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, an iodine atom and the like.
p1 is an integer of 0 to 4, and may be an integer of 0 to 2, 0 or 1, or 0 from the viewpoint of availability. When p1 is an integer of 2 or more, the plurality of ^Ra1s may be the same or different.

（式中、Ｒ^ａ２及びＲ^ａ３は、各々独立に、炭素数１〜５の脂肪族炭化水素基又はハロゲン原子である。Ｘ^ａ２は炭素数１〜５のアルキレン基、炭素数２〜５のアルキリデン基、エーテル基、スルフィド基、スルホニル基、カルボニルオキシ基、ケト基、単結合、又は下記一般式（ａ１−３−１）で表される２価の基である。ｐ２及びｐ３は、各々独立に、０〜４の整数である。）

(In the formula, R ^a2 and R ^a3 are independently aliphatic hydrocarbon groups or halogen atoms ^{having 1 to 5 carbon atoms. X a2} is an alkylene group having 1 to 5 carbon atoms and 2 to 5 carbon atoms. Alkylidene group, ether group, sulfide group, sulfonyl group, carbonyloxy group, keto group, single bond, or divalent group represented by the following general formula (a1-3-1). P2 and p3 are respectively. Independently, it is an integer from 0 to 4.)

Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms and the halogen atom represented by Ra ² and Ra ³ are the same as those in the case of ^{Ra 1.} The aliphatic hydrocarbon group may be an aliphatic hydrocarbon group having 1 to 3 carbon atoms, a methyl group, an ethyl group, or an ethyl group.
Examples of the alkylene group having 1 to 5 carbon atoms represented by X ^a2 include a methylene group, a 1,2-dimethylene group, a 1,3-trimethylene group, a 1,4-tetramethylene group, a 1,5-pentamethylene group and the like. Can be mentioned. The alkylene group may be an alkylene group having 1 to 3 carbon atoms from the viewpoint of compatibility with other resins, adhesion to a conductor, heat resistance, low thermal expansion, and mechanical properties, and may be a methylene group. It may be.
The alkylidene group having 2 to 5 carbon atoms which X ^a2 represents, for example, ethylidene group, propylidene group, isopropylidene group, butylidene group, isobutylidene group, pentylidene group, isopentylidene group, and the like. Among these, an isopropylidene group may be used from the viewpoints of compatibility with other resins, adhesion to conductors, heat resistance, low thermal expansion, and mechanical properties.
Among the above options, X ^a2 may be an alkylene group having 1 to 5 carbon atoms or an alkylidene group having 2 to 5 carbon atoms.
p2 and p3 are independently integers of 0 to 4, and from the viewpoint of availability, both may be integers of 0 to 2 and may be 0 or 2. When p2 or p3 is an integer of 2 or more, the plurality of ^Ra2s or ^Ra3s may be the same or different from each other.
The divalent group represented by the general formula (a1-3-1) represented by X ^{a2 is as follows.}

（式中、Ｒ^ａ４及びＲ^ａ５は、各々独立に、炭素数１〜５の脂肪族炭化水素基又はハロゲン原子である。Ｘ^ａ３は炭素数１〜５のアルキレン基、炭素数２〜５のアルキリデン基、エーテル基、スルフィド基、スルホニル基、カルボニルオキシ基、ケト基又は単結合である。ｐ４及びｐ５は、各々独立に、０〜４の整数である。）

(In the formula, R ^a4 and R ^a5 are independently aliphatic hydrocarbon groups or halogen atoms ^{having 1 to 5 carbon atoms. X a3} is an alkylene group having 1 to 5 carbon atoms and 2 to 5 carbon atoms. It is an alkylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group or a single bond. P4 and p5 are independently integers of 0 to 4).

The aliphatic hydrocarbon group having 1 to 5 carbon atoms and the halogen atom represented by R ^a4 and R ^a5 will be described in the same manner as in the case of ^{Ra 1.}
Examples of the alkylene group having 1 to 5 carbon atoms and the alkylidene group having 2 to 5 carbon atoms represented by X ^a3 include the same alkylene group having 1 to 5 carbon atoms and the alkylidene group having 2 to 5 carbon atoms represented ^{by X a2.} Be done.
From ^{the above options, X a3} may be an alkylidene group having 2 to 5 carbon atoms or an isopropylidene group.
p4 and p5 are each independently an integer of 0 to 4, and from the viewpoint of availability, both may be an integer of 0 to 2, may be 0 or 1, and may be 0. You may. When p4 or p5 is an integer of 2 or more, the plurality of ^Ra4s or ^Ra5s may be the same or different from each other.

（式中、ｐ６は０〜１０の整数である。）

(In the formula, p6 is an integer from 0 to 10.)

From the viewpoint of availability, p6 may be an integer of 0 to 5, or may be an integer of 0 to 3.

（式中、ｐ７は０〜５の数である。）

(In the formula, p7 is a number from 0 to 5.)

（式中、Ｒ^ａ６及びＲ^ａ７は、各々独立に、水素原子又は炭素数１〜５の脂肪族炭化水素基である。ｐ８は１〜８の整数である。）

(In the formula, R ^a6 and R ^a7 are each independently a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms. P8 is an integer of 1 to 8.)

Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms R ^a6 and ^{R a7 represent,} is described as in the case of ^{R a1.}
p8 is an integer of 1 to 8, and may be an integer of 1 to 3 or 1.
When p8 is an integer of 2 or more, a plurality of Ra ^6s or Ra ^7s may be the same or different from each other.

(Polyaminobismaleimide compound (A1))
The polyaminobismaleimide compound (A1) is a polyaminobismaleimide compound having a structural unit derived from the maleimide compound (a1) and a structural unit derived from the diamine compound (a2). As the component (A1), one type may be used alone, or two or more types may be used in combination.

Examples of the structural unit derived from the component (a1) include one or more selected from the group consisting of a group represented by the following general formula (a1-7) and a group represented by the following general formula (a1-8). Be done.

（式中、Ｘ^ａ１は２価の有機基であり、＊は他の構造への結合位置を示す。）

(In the formula, X ^a1 is a divalent organic group, and * indicates the bond position to another structure.)

^{The description of X a1} in the general formula (a1-7) and the general formula (a1-8) is the same as the description ^{of X a1} in the general formula (a1-1).
The content of the structural unit derived from the component (a1) in the polyaminobismaleimide compound (A1) is not particularly limited, but is preferably 5 to 95% by mass, more preferably 30 to 93% by mass, and further preferably 60 to 90. It is by mass, particularly preferably 75 to 90% by mass. When the content of the structural unit derived from the component (a1) is within the above range, the dielectric property in the high frequency band of 10 GHz band or higher tends to be better, and good film handling property tends to be obtained.

The component (a2) is not particularly limited as long as it is a compound having two amino groups. The amino group is preferably a primary amino group.
Examples of the component (a2) include 4,4'-diaminodiphenylmethane, 4,4'-diamino-3,3'-dimethyldiphenylmethane, 4,4'-diamino-3,3'-diethyldiphenylmethane, 4,4. '-Diaminodiphenyl ether, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl ketone, 4,4'-diaminobiphenyl, 3,3'-dimethyl-4,4 '-Diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzene, 2,2-bis (3-amino-4-hydroxyphenyl) propane, 3,3'- Dimethyl-5,5'-diethyl-4,4'-diaminodiphenylmethane, 2,2-bis (4-aminophenyl) propane, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 1, 3-Bis (3-Aminophenoxy) Benzene, 1,3-Bis (4-Aminophenoxy) Benzene, 1,4-Bis (4-Aminophenoxy) Benzene, 4,4'-Bis (4-Aminophenoxy) Biphenyl , 1,3-bis [1- [4- (4-aminophenoxy) phenyl] -1-methylethyl] benzene, 1,4-bis [1- [4- (4-aminophenoxy) phenyl] -1- Methylethyl] benzene, 4,4'-[1,3-phenylenebis (1-methylethylidene)] bisaniline, 4,4'-[1,4-phenylenebis (1-methylethylidene)] bisaniline, 3,3 '-[1,3-Phenylenebis (1-methylethylidene)] bisaniline, bis [4- (4-aminophenoxy) phenyl] sulfone, bis [4- (3-aminophenoxy) phenyl] sulfone, 9,9- Examples thereof include bis (4-aminophenyl) fluorene.
As the component (a2), one type may be used alone, or two or more types may be used in combination.

Among these, as the component (a2), 4,4'-diaminodiphenylmethane and 4,4'-diamino are excellent from the viewpoint of solubility in an organic solvent, reactivity with the component (a1), and heat resistance. -3,3'-dimethyldiphenylmethane, 4,4'-diamino-3,3'-diethyldiphenylmethane, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 4,4'-[1, 3-Phenylenebis (1-methylethylidene)] bisaniline and 4,4'-[1,4-phenylenebis (1-methylethylidene)] bisaniline are preferred. The component (a2) is preferably 3,3'-dimethyl-5,5'-diethyl-4,4'-diaminodiphenylmethane from the viewpoint of excellent dielectric properties and low water absorption. The component (a2) is preferably 2,2-bis [4- (4-aminophenoxy) phenyl] propane from the viewpoint of excellent mechanical properties such as high adhesiveness to a conductor, elongation, and breaking strength. Further, from the viewpoint of excellent solubility in the above-mentioned organic solvent, reactivity at the time of synthesis, heat resistance, high adhesiveness to the conductor, and excellent dielectric properties and low hygroscopicity, the component (a2) Is preferably 4,4'-[1,3-phenylenebis (1-methylethylidene)] bisaniline and 4,4'-[1,4-phenylenebis (1-methylethylidene)] bisaniline.

As the structural unit derived from the component (a2), for example, one or more selected from the group consisting of a group represented by the following general formula (a2-1) and a group represented by the following general formula (a2-2). Can be mentioned.

（式中、Ｘ^ａ４は２価の有機基であり、＊は他の構造への結合位置を示す。）

(In the formula, X ^a4 is a divalent organic group, and * indicates the bond position to another structure.)

^{X a4} in the general formulas (a2-1) and (a2-2) is a divalent organic group and corresponds to the residue of the component (a2). The residue of the component (a2) refers to the structure of the portion of the component (a2) excluding the functional group provided for binding, that is, the amino group.

^{It is preferable that X a4} in the general formula (a2-1) and the general formula (a2-2) is a divalent group represented by the following general formula (a2-3).

（式中、Ｒ^ａ１１及びＲ^ａ１２は、各々独立に、炭素数１〜５の脂肪族炭化水素基、炭素数１〜５のアルコキシ基、水酸基又はハロゲン原子である。Ｘ^ａ５は、炭素数１〜５のアルキレン基、炭素数２〜５のアルキリデン基、エーテル基、スルフィド基、スルホニル基、カルボニルオキシ基、ケト基、フルオレニレン基、単結合、又は下記一般式（ａ２−３−１）もしくは（ａ２−３−２）で表される２価の基である。ｑ１及びｑ２は、各々独立に、０〜４の整数である。）

(In the formula, R ^a11 and R ^a12 are independently aliphatic hydrocarbon groups having 1 to 5 carbon atoms, alkoxy groups having 1 to 5 carbon atoms, hydroxyl groups or halogen atoms. X ^a5 has 1 carbon atom. An alkylene group of ~ 5, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, a fluorenylene group, a single bond, or the following general formula (a2-3-1) or ( It is a divalent group represented by a2-3-2). Q1 and q2 are independently integers of 0 to 4).

（式中、Ｒ^ａ１３及びＲ^ａ１４は、各々独立に、炭素数１〜５の脂肪族炭化水素基又はハロゲン原子である。Ｘ^ａ６は炭素数１〜５のアルキレン基、炭素数２〜５のアルキリデン基、ｍ−フェニレンジイソプロピリデン基、ｐ−フェニレンジイソプロピリデン基、エーテル基、スルフィド基、スルホニル基、カルボニルオキシ基、ケト基又は単結合である。ｑ３及びｑ４は、各々独立に、０〜４の整数である。）

(In the formula, R ^a13 and R ^a14 are independently aliphatic hydrocarbon groups or halogen atoms ^{having 1 to 5 carbon atoms. X a6} is an alkylene group having 1 to 5 carbon atoms and 2 to 5 carbon atoms. Alkylidene group, m-phenylenediisopropylidene group, p-phenylenediisopropyridene group, ether group, sulfide group, sulfonyl group, carbonyloxy group, keto group or single bond. Q3 and q4 are 0 independently of each other. It is an integer of ~ 4.

（式中、Ｒ^ａ１５は、各々独立に、炭素数１〜５の脂肪族炭化水素基又はハロゲン原子である。Ｘ^ａ７及びＸ^ａ８は、各々独立に、炭素数１〜５のアルキレン基、炭素数２〜５のアルキリデン基、エーテル基、スルフィド基、スルホニル基、カルボニルオキシ基、ケト基又は単結合である。ｑ５は０〜４の整数である。）

(In the formula, R ^a15 is an aliphatic hydrocarbon group or a halogen atom ^{having 1 to 5 carbon atoms independently. X a7} and X ^a8 are independently alkylene groups and carbon atoms having 1 to 5 carbon atoms, respectively. The number 2 to 5 is an alkylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group or a single bond. Q5 is an integer of 0 to 4).

Aliphatic compounds having 1 to 5 carbon atoms represented ^{by R a11} , R ^a12 , R ^a13 , R ^a14 and R ^{a15 in the} above general formulas (a2-3), (a2-3-1) or (a2--3-2). the hydrocarbon group or a halogen atom include the same R ^a1 in the formula (a1-2). The aliphatic hydrocarbon group may be an aliphatic hydrocarbon group having 1 to 3 carbon atoms, or may be a methyl group or an ethyl group.
The number of carbon atoms represented by X ^{a5 in} the general formula (a2-3), X ^{a6 in the} general formula (a2-3-1), and X ^a7 and X ^{a8 in the general formula (a2-3-2) is 1.} The alkylene group of ~ 5 and the alkylidene group having 2 to 5 carbon atoms will be described in the same manner as in the case ^{of X a2 in the above general formula (a1-3).}
Q1 and q2 in the above general formula (a2-3) are independently integers of 0 to 4, and from the viewpoint of availability, both may be integers of 0 to 2 or 0 or. It may be 2. When q1 or q2 is an integer of 2 or more, the plurality of Ra ^11s or Ra ^12s may be the same or different from each other.
Q3 and q4 in the above general formula (a2-3-1) are independently integers of 0 to 4, and from the viewpoint of availability, both may be integers of 0 to 2. It may be 0 or 1, or it may be 0. If q3 or q4 is an integer of 2 or more, among the plurality of ^{R a13} each other or ^{R a14} may each be the same or different.
Q5 in the above general formula (a2-3-2) is an integer of 0 to 4, and may be an integer of 0 to 2 or 0 from the viewpoint of availability. When q5 is an integer of 2 or more, the plurality of Ra ^15s may be the same or different from each other.

The content of the structural unit derived from the component (a2) in the polyaminobismaleimide compound (A1) is not particularly limited, but is preferably 5 to 95% by mass, more preferably 7 to 70% by mass, and further preferably 10 to 40. It is by mass, particularly preferably 10 to 25% by mass. When the content of the structural unit derived from the component (a2) is within the above range, excellent dielectric properties and better heat resistance, flame retardancy and glass transition temperature tend to be obtained.

The total content of the structural unit derived from the component (a1) and the structural unit derived from the component (a2) in the polyaminobismaleimide compound (A1) is not particularly limited, but is preferably 80% by mass or more, more preferably 90% by mass. As mentioned above, it is more preferably 95% by mass or more, and particularly preferably 100% by mass.

The content ratio of the structural unit derived from the component (a1) in the polyaminobismaleimide compound (A1) to the structural unit derived from the component (a2) is -NH of the component (a2) in the polyaminobismaleimide compound (A1). the total equivalents of ₂ groups derived from groups (-NH ₂ including) (Ta2), the sum of the equivalents (Ta1) of (a1) (including N- substituted maleimide group) N- substituted maleimide groups derived from groups of component The content ratio is such that the equivalent ratio (Ta2 / Ta1) is preferably 0.05 to 10, more preferably 1 to 5. When the equivalent ratio (Ta2 / Ta1) is within the above range, excellent dielectric properties and better heat resistance, flame retardancy, and glass transition temperature tend to be obtained.

The polyaminobismaleimide compound (A1) is represented by the following general formula (a2-4) from the viewpoint of dielectric properties, solubility in an organic solvent, high adhesiveness to a conductor, moldability of a resin film, and the like. It is preferable to contain a polyaminobismaleimide compound.

（式中、Ｘ^ａ１及びＸ^ａ４は、上記で説明したとおりである。）

(In the formula, X ^a1 and X ^a4 are as described above.)

(Method for producing polyaminobismaleimide compound (A1))
The component (A1) can be produced, for example, by reacting the component (a1) with the component (a2).
The reaction between the component (a1) and the component (a2) is preferably carried out in an organic solvent, and a reaction catalyst can be used if necessary.
The reaction catalyst is not particularly limited, but for example, an acidic catalyst such as p-toluenesulfonic acid; amines such as triethylamine, pyridine and tributylamine; imidazoles such as methylimidazole and phenylimidazole; phosphorus-based such as triphenylphosphine. Examples include catalysts. One of these may be used alone, or two or more thereof may be used in combination.
The amount of the reaction catalyst to be blended is not particularly limited, but is, for example, 0.01 to 5 parts by mass with respect to 100 parts by mass of the total amount of the components (a1) and (a2).

The above polyaminobismaleimide compound is obtained by charging a predetermined amount of the component (a1), the component (a2), and if necessary other components in a synthetic kettle, and reacting the component (a1) with the component (a2). The reaction between the component (a1) and the component (a2) is a Michael addition reaction, and the reaction conditions are not particularly limited, but the reaction is, for example, from the viewpoint of workability such as reaction rate and suppression of gelation during the reaction. The temperature is preferably 50 to 160 ° C., and the reaction time is preferably 1 to 10 hours.
Further, in this step, the solid content concentration and the solution viscosity of the reaction raw material can be adjusted by adding or concentrating the organic solvent. The solid content concentration of the reaction raw material is not particularly limited, but is preferably 10 to 90% by mass, more preferably 20 to 80% by mass, for example. When the solid content concentration of the reaction raw material is 10% by mass or more, the reaction rate does not become too slow, which tends to be advantageous in terms of production cost. Further, when the solid content concentration of the reaction raw material is 90% by mass or less, better solubility is obtained, stirring efficiency is improved, and gelation tends to be difficult.

The number average molecular weight of the polyaminobismaleimide compound (A1) is not particularly limited, but is preferably 400 to 10,000, more preferably 500 to 5,000, still more preferably 600 to 2,000, and particularly preferably 700 to 1. , 500.
The number average molecular weight in the present specification means a value measured by gel permeation chromatography (GPC) in terms of polystyrene, and can be specifically measured by the method described in Examples.

The content of the component (A) in the resin composition of the present embodiment is not particularly limited, but the total of the resin components in the resin composition is 100 from the viewpoint of dielectric properties and moldability in a high frequency band of 10 GHz band or higher. It is preferably 10 to 90 parts by mass, more preferably 20 to 80 parts by mass, still more preferably 30 to 70 parts by mass, and particularly preferably 35 to 60 parts by mass with respect to parts by mass.
Here, in the present specification, the "resin component" means the component (A) and the component (B), and a resin arbitrarily used. The resin to be used arbitrarily is (D) component, (E) component and other resins, and (C) component, (F) component and (G) component are included in the resin component in the calculation of the content. Make it not exist.

<Component (B); Polyphenylene ether resin (B)>
The polyphenylene ether-based resin (B) is not particularly limited, and examples thereof include one or more selected from the group consisting of polyphenylene ether and polyphenylene ether derivatives.
As the component (B), one type may be used alone, or two or more types may be used in combination.

The component (B) preferably has a structural unit represented by the following general formula (B-1).

（式中、Ｒ^Ｂ１は、各々独立に、炭素数１〜５の脂肪族炭化水素基又はハロゲン原子である。ｎ^Ｂ１は０〜４の整数である。）

(In the formula, ^RB1 is an aliphatic hydrocarbon group or a halogen atom having 1 to 5 carbon atoms, respectively. N ^B1 is an integer of 0 to 4.)

^{R B1} in the general formula (B1) are each independently an aliphatic hydrocarbon group, or a halogen atom having 1 to 5 carbon atoms. Examples of the aliphatic hydrocarbon group include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group, an n-pentyl group and the like. As the aliphatic hydrocarbon group, an aliphatic hydrocarbon group having 1 to 3 carbon atoms is preferable, and a methyl group is more preferable. Further, examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, an iodine atom and the like.
Among the above, ^RB1 is preferably an aliphatic hydrocarbon group having 1 to 5 carbon atoms.
n ^B1 is an integer of 0 to 4, and may be an integer of 1 or 2, or may be 2. Note that when n ^B1 is 1 or 2, R ^B1 ortho-position on the benzene ring (provided that the basis of the substitution position of an oxygen atom.) May be substituted on. Further, when n ^B1 is 2 or more, the plurality of ^RB1s may be the same or different from each other.
Specifically, the structural unit represented by the general formula (B-1) may be a structural unit represented by the following general formula (B-1').

The number average molecular weight of the polyphenylene ether-based resin (B) is preferably 1,000 to 25,000. When the number average molecular weight of the polyphenylene ether-based resin (B) is 1,000 or more, the dielectric properties in the high frequency band of 10 GHz band or more tend to be further improved, and when it is 25,000 or less, the resin composition tends to be further improved. The compatibility of the substances is good, and it tends to be difficult to separate them even if they are left for a long period of time. From the same viewpoint, the number average molecular weight of the polyphenylene ether resin (B) is more preferably 2,000 to 20,000, further preferably 3,000 to 10,000, and particularly preferably 4,000 to 6,000. Is.

The polyphenylene ether-based resin (B) is a polyphenylene ether derivative having an ethylenically unsaturated bond-containing group [hereinafter, the polyphenylene ether derivative having an ethylenically unsaturated bond-containing group is referred to as “polyphenylene ether derivative (B1)” or “(B1)). It may be abbreviated as "ingredient". ] Is preferable.
In the present specification, the "ethylenically unsaturated bond" means a carbon-carbon double bond capable of an addition reaction, and does not include a double bond of an aromatic ring, and "an ethylenically unsaturated bond". The "containing group" means a substituent containing the ethylenically unsaturated bond.

In the polyphenylene ether derivative (B1), the position of the ethylenically unsaturated bond-containing group is not particularly limited, and may be present at one end or both ends, for example.
The component (B1) may be a mixture of a polyphenylene ether derivative having an ethylenically unsaturated bond-containing group at one end and a polyphenylene ether derivative having an ethylenically unsaturated bond-containing group at both ends, but at least It is preferable to contain a polyphenylene ether derivative having an ethylenically unsaturated bond-containing group at one end, and more preferably the polyphenylene ether derivative itself having an ethylenically unsaturated bond-containing group at one end.
When the component (B) contains a polyphenylene ether derivative (B1) having an ethylenically unsaturated bond-containing group at one end, the polyphenylene ether derivative having an ethylenically unsaturated bond-containing group at one end of the component (B) The content of (B1) is not particularly limited, but may be 30% by mass or more, 45% by mass or more, 55% by mass or more, or 70% by mass or more. It may be 90% by mass or more, and may be substantially 100% by mass.

Examples of the ethylenically unsaturated bond-containing group contained in the component (B1) include unsaturated aliphatic hydrocarbon groups such as vinyl group, isopropenyl group, allyl group, 1-methylallyl group and 3-butenyl group; maleimide group, Examples thereof include a substituent containing a hetero atom such as a (meth) acryloyl group. Among these, an unsaturated aliphatic hydrocarbon group or a maleimide group is preferable, an allyl group or a maleimide group is more preferable, and an allyl group is further preferable, from the viewpoint of dielectric properties in a high frequency band of 10 GHz band or more.
In the present specification, although a part of the group has an unsaturated aliphatic hydrocarbon group such as a maleimide group and a (meth) acryloyl group, the unsaturated aliphatic hydrocarbon is viewed as a whole. A group that cannot be said to be a hydrogen group shall not be included in the above-mentioned "unsaturated aliphatic hydrocarbon group".

The number of ethylenically unsaturated bond-containing groups contained in one molecule of the component (B1) is not particularly limited, but is preferably two or more, more preferably two or more, from the viewpoint of dielectric properties in a high frequency band of 10 GHz band or higher. The number may be 4 or more, 8 or less, or 6 or less. Furthermore, the number of ethylenically unsaturated bond-containing groups contained in the component (B1) at one end is preferably 2 or more, more preferably 4 or more, from the viewpoint of dielectric properties in the high frequency band of 10 GHz band or more. Yes, it may be 8 or less, or 6 or less.

The component (B1) preferably contains a structure represented by the following general formula (B-2) from the viewpoint of dielectric properties in a high frequency band of 10 GHz band or higher.

（式中、Ｒ^Ｂ２は、各々独立に、炭素数２〜１０の不飽和脂肪族炭化水素基である。ｎ^Ｂ２は１又は２であり、ｎ^Ｂ３は０又は１である。＊は、他の構造への結合位置を示す。）

^{(Wherein, R B2} are each independently, ^{.n B2} unsaturated aliphatic hydrocarbon group having 2 to 10 carbon atoms is 1 or ^{2, n B3} is 0 or 1. *, The other Indicates the position of connection to the structure of.)

In the general formula ^(B2), the unsaturated aliphatic hydrocarbon group having 2 to 10 carbon atoms ^{which R B2} represents, for example, vinyl group, isopropenyl group, allyl group, 1-methylallyl group, 3-butenyl The group etc. can be mentioned. Among these, an unsaturated aliphatic hydrocarbon group having 2 to 5 carbon atoms is preferable, and an allyl group is more preferable, from the viewpoint of dielectric properties in a high frequency band of 10 GHz band or more.

Further, from the viewpoint of the dielectric property in the high frequency band of 10 GHz band or higher, the component (B1) preferably includes a structure represented by the following general formula (B-3).

（式中、Ｒ^Ｂ３及びＲ^Ｂ４は、各々独立に、炭素数２〜１０の不飽和脂肪族炭化水素基である。＊は、他の構造への結合位置を示す。）

(In the formula, ^RB3 and ^RB4 are each independently unsaturated aliphatic hydrocarbon group having 2 to 10 carbon atoms. * Indicates the bond position to another structure.)

In the general formula ^(B3), unsaturated aliphatic hydrocarbon group having 2 to 10 carbon atoms represented by ^{R B3} and ^{R B4} same can be mentioned as ^{R B2} in the general formula (B2) , The same is preferable.

The component (B1) more preferably contains a structure represented by any of the following general formulas (B-4) to (B-6) from the viewpoint of dielectric properties in a high frequency band of 10 GHz band or higher, and is described below. It is more preferable to include a structure represented by the general formula (B-6).

（式中、Ｒ^Ｂ５は炭素数２〜１０の不飽和脂肪族炭化水素基である。＊は、他の構造への結合位置を示す。）

(Wherein, R ^B5 is an unsaturated aliphatic hydrocarbon group having 2 to 10 carbon atoms. * Denotes the point of attachment to other structures.)

（式中、Ｒ^Ｂ６及びＲ^Ｂ７は、各々独立に、炭素数２〜１０の不飽和脂肪族炭化水素基である。Ｘ^Ｂ１は、炭素数１〜６の２価の脂肪族炭化水素基である。＊は、他の構造への結合位置を示す。）

(In the formula, R ^B6 and R ^B7 are independently unsaturated aliphatic hydrocarbon groups having 2 to 10 carbon atoms. X ^B1 is a divalent aliphatic hydrocarbon group having 1 to 6 carbon atoms. * Indicates the position of connection to other structures.)

（式中、Ｒ^Ｂ８〜Ｒ^Ｂ１１は、各々独立に、炭素数２〜１０の不飽和脂肪族炭化水素基である。Ｘ^Ｂ２は２価の有機基である。＊は、他の構造への結合位置を示す。）

(In the formula, R ^{B8 to} R ^B11 are each independently unsaturated aliphatic hydrocarbon group having 2 to 10 carbon atoms. X ^B2 is a divalent organic group. * Is a divalent organic group. Indicates the bond position.)

As the general formula (B-4) ~ (B -6) unsaturated aliphatic hydrocarbon group having 2 to 10 carbon atoms represented by ^R B5 ^{to R B11} in, ^{R B2} in the general formula (B2) The same as in the case of, and the preferable one is also the same.
^{Examples of the divalent aliphatic hydrocarbon group having 1 to 6 carbon atoms represented by X B1} in the general formula (B-5) include alkylene groups having 1 to 6 carbon atoms such as a methylene group, an ethylene group and a trimethylene group. Group: An alkylidene group having 2 to 6 carbon atoms such as an isopropylidene group can be mentioned. Among these, a methylene group and an isopropylidene group are preferable, and an isopropylidene group is more preferable.
^{Examples of the divalent organic group represented by X B2} in the above general formula (B-6) include an aliphatic hydrocarbon group which may contain a heteroatom in part and a heteroatom in part. Examples thereof include an alicyclic hydrocarbon group which may be present, an aromatic hydrocarbon group which may contain a heteroatom in part, and a group composed of any combination thereof. Examples of the hetero atom include an oxygen atom, a nitrogen atom, a sulfur atom and the like. The ^{divalent organic group represented by X B2} is preferably a group that does not contain a heteroatom, an aliphatic hydrocarbon group that does not contain a heteroatom, and an alicyclic hydrocarbon that does not contain a heteroatom. A hydrogen group is more preferable, and a group composed of a combination of an aliphatic hydrocarbon group containing no heteroatom and an alicyclic hydrocarbon group not containing a heteroatom is further preferable.

More preferred embodiments of the structures represented by the general formulas (B-4), (B-5) or (B-6) are as follows from the viewpoint of dielectric properties in a high frequency band of 10 GHz band or higher. It is a structure represented by B-4'), (B-5') or (B-6'). Among these, from the viewpoint of the dielectric property in the high frequency band of 10 GHz band or higher, the structure represented by the following formula (B-5') or (B-6') is more preferable, and the following formula (B-6') is used. The structure represented by is more preferable.

（式中、Ｘ^Ｂ２は上記一般式（Ｂ−６）中のＸ^Ｂ２と同じである。＊は、他の構造への結合位置を示す。）

^{(Wherein, X B2} is the same as ^{X B2} in the general formula (B-6). * Indicates the point of attachment to other structures.)

The component (B) may contain a polyphenylene ether derivative represented by any of the following general formulas (B-7) to (B-9) as the component (B1), and in particular, the following general formula (B). It preferably contains the polyphenylene ether derivative represented by -8) or (B-9), and more preferably contains the polyphenylene ether derivative represented by the following general formula (B-9).

（式中、Ｘ^Ｂ２は上記一般式（Ｂ−６）中のＸ^Ｂ２と同じである。ｎ^Ｂ４〜ｎ^Ｂ６は、各々独立に、１〜２００の整数である。）

^{(Wherein, X B2} is ^.n B4 ^{~n B6} is the same as ^{X B2} in the general formula (B6) are each independently an integer of 1 to 200.)

In the above general formulas (B-7) to (B-9), n ^{B4 to} n ^B6 are independently integers of 1 to 200, and are viewpoints of dielectric properties and resin composition in a high frequency band of 10 GHz band or higher. From the viewpoint of compatibility of objects, it may be an integer of 1 or more, an integer of 10 or more, an integer of 20 or more, or an integer of 25 or more. From the same viewpoint, n ^{B4 to} n ^B6 may be independently an integer of 150 or less, an integer of 120 or less, or an integer of 100 or less.
In any of the above general formulas (B-7) to (B-9), ^{a mixture of polyphenylene ether derivatives having different values of n B4 to} n ^B6 may be used, and usually tends to be a mixture.

[Method for manufacturing component (B)]
Hereinafter, one aspect of the method for producing the component (B) will be described, but the method for producing the component (B) is not particularly limited to the following method.
The polyphenylene ether-based resin (B) can be prepared, for example, by redistributing the raw material polyphenylene ether and the phenol compound.
In the above redistribution reaction, for example, a phenol compound is mixed with a raw material polyphenylene ether already polymerized and produced in an organic solvent, and a reaction catalyst is added as necessary to generate oxyradicals of the phenol compound. This is a reaction in which the oxygen atom in the raw material polyphenylene ether attacks the carbon atom to which the oxygen atom is bonded, and the OC bond is broken there to reduce the molecular weight. At that time, the oxyradical of the attacked phenol compound is bonded to the broken carbon atom and incorporated into the structure of the polyphenylene ether. As the redistribution reaction, known methods can be used and applied.
As the raw material polyphenylene ether, for example, a polyphenylene ether having a number average molecular weight of 3,000 to 30,000 can be used.

The molecular weight of the polyphenylene ether-based resin (B) can be controlled by the amount of the phenol compound used, and the larger the amount of the phenol compound used, the lower the molecular weight of the component (B). That is, the amount of the phenol compound used may be appropriately adjusted so that the number average molecular weight of the component (B) finally produced is in a suitable range.
The amount of the phenol compound used is not particularly limited, but for example, if the number average molecular weight of the raw material polyphenylene ether to be reacted with the phenol compound is 3,000 to 30,000, the hydroxyl group of the phenol compound with respect to 1 mol of the raw material polyphenylene ether. By using the compound in an amount of 1 to 10 mol, preferably 4 to 7 mol, the component (B) having a number average molecular weight within the above-mentioned preferable range can be obtained.

When a polyphenylene ether derivative (B1) having an ethylenically unsaturated bond-containing group is prepared as the component (B), the phenol compound is an unsaturated aliphatic hydrocarbon group-containing phenol compound, specifically, for example. It is preferable to use a phenol compound containing a structure represented by any of the above general formulas (B-2) to (B-6).

The organic solvent used in the production process of the polyphenylene ether-based resin (B) is not particularly limited, and for example, alcohols such as methanol, ethanol, butanol, butyl cellosolve, ethylene glycol monomethyl ether, and propylene glycol monomethyl ether; acetone and methyl ethyl ketone. , Methylisobutylketone, ketones such as cyclohexanone; aromatic hydrocarbons such as toluene, xylene, mesitylene; esters such as methoxyethyl acetate, ethoxyethylacetate, butoxyethyl acetate, ethyl acetate; N, N-dimethylformamide, N, N Examples thereof include nitrogen-containing compounds such as −dimethylacetamide and N-methyl-2-pyrrolidone. One of these may be used alone, or two or more thereof may be used in combination.

Further, in the production process of the polyphenylene ether-based resin (B), as described above, a reaction catalyst can be used if necessary. Examples of this reaction catalyst include organic peroxides such as t-butylperoxyisopropyl monocarbonate and manganese naphthenate, manganese octylate, etc. from the viewpoint of obtaining the component (B) having a stable number average molecular weight with good reproducibility. It is preferable to use it in combination with a carboxylic acid metal salt.
The amount of the reaction catalyst used is not particularly limited, but from the viewpoint of the reaction rate and suppression of gelation when producing the component (B), for example, 100 parts by mass of the raw material polyphenylene ether to be reacted with the phenol compound is organically excess. The oxide may be 0.5 to 5 parts by mass and the carboxylic acid metal salt may be 0.05 to 0.5 parts by mass.

The reaction conditions such as the reaction temperature and the reaction time in the redistribution reaction may be appropriately adjusted according to the raw materials used, the structure of the target polyphenylene ether, etc., but from the viewpoint of workability and suppression of gelation, and the above desired From the viewpoint of obtaining the component (B) having a number average molecular weight, the conditions may be, for example, a reaction temperature of 70 to 110 ° C. and a reaction time of 1 to 8 hours.

(B) Solid content concentration during reaction in the production process of the component [hereinafter, also referred to as “reaction concentration”. ] Is not particularly limited, but may be, for example, 10 to 60% by mass or 20 to 50% by mass. When the reaction concentration is 10% by mass or more, the reaction rate does not become too slow and tends to be more advantageous in terms of production cost, and when it is 60% by mass or less, better solubility and low solution viscosity are obtained. It has good stirring efficiency and tends to be difficult to gel.

The solution of the polyphenylene ether-based resin (B) produced as described above may be concentrated as necessary to remove a part of the organic solvent, or may be diluted by adding an organic solvent. ..

The content of the component (B) in the resin composition of the present embodiment is not particularly limited, but from the viewpoint of dielectric properties in a high frequency band of 10 GHz band or higher, the total content of the resin components in the resin composition is 100 parts by mass. On the other hand, it is preferably 1 to 20 parts by mass, more preferably 1.5 to 10 parts by mass, and further preferably 2 to 5 parts by mass.

The content ratio [(B) / (A)] (mass ratio) of the component (A) and the component (B) is not particularly limited, but is preferably 1/99 to 80/20, more preferably 2/98 to. It is 75/25, more preferably 3/97 to 70/30, even more preferably 4/96 to 50/50, particularly preferably 4/96 to 20/80, and most preferably 4/96 to 10/80. .. When the content ratio [(B) / (A)] is 1/99 or more, excellent dielectric properties tend to be obtained in the high frequency band of 10 GHz band or more, and when it is 80/20 or less, heat resistance, It tends to be excellent in moldability and processability.

<(C) component; organometallic compound (C)>
The organometallic compound (C) is an organometallic compound having an alkoxy group bonded to a metal atom.
By containing the organometallic compound (C), the resin composition of the present embodiment can exhibit excellent dielectric properties in a high frequency band of 10 GHz band or higher. Although the reason is not clear, since the component (C) has an alkoxy group bonded to a metal atom, the hydroxyl group and the ligand of the component (B) in the alkoxy group of the component (C) It is considered that an exchange reaction occurs and the hydroxyl group of the component (B) is modified by the component (C). Since the hydroxyl group has a relatively high polarity in the system, it is considered that the dielectric loss tangent of the cured product is reduced by modifying the hydroxyl group. As described above, the resin composition of the present embodiment is economical in that it can easily achieve excellent dielectric properties only by blending the component (C).
Here, in the present embodiment, the alkoxy group bonded to a metal atom means a group in which a hydrocarbon group is bonded to a metal atom via an oxygen atom. However, when the hydrocarbon group forms a chelate bond with the metal atom via two oxygen atoms, the group is not included in the alkoxy group. The chelate bond here means a bond of a compound having two or more coordinated atoms in one molecule and coordinated so as to surround the metal atom to form a ring structure.
As the organometallic compound (C), one type may be used alone, or two or more types may be used in combination.

Examples of the metal atom contained in the organic metal compound (C) include a titanium atom, a zirconium atom, and an aluminum atom. Among these, the dielectric property in the high frequency band of 10 GHz or higher is further improved. A titanium atom or a zirconium atom is preferable, and a titanium atom is more preferable. That is, the component (C) is preferably one or more selected from the group consisting of an organic titanium compound having an alkoxy group bonded to a titanium atom and an organic zirconium compound having an alkoxy group bonded to a zirconium atom. More preferably, it is an organic titanium compound having an alkoxy group bonded to a titanium atom.

Examples of the alkoxy group contained in the component (C) include a group represented by the following general formula (C-3).

（式中、Ｒ^Ｃ１は、炭素数１〜１０の炭化水素基を示し、＊は金属原子への結合位置を示す。）

^{(Wherein, R C1} represents a hydrocarbon group having 1 to 10 carbon atoms, * represents a bonding position to the metal atom.)

In the above formula ^(C-3), the carbon number of the hydrocarbon group having 1 ^to 10 carbon atoms ^{R C1} represents preferably 2 to 8, 3 to 6 is more preferable.
Examples of the hydrocarbon group having 1 to 10 carbon atoms which R ^C1 represents, for example, a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, heptyl group, octyl group, nonyl group, alkyl and decyl groups Groups: Vinyl groups, propenyl groups, butenyl groups, pentenyl groups, hexenyl groups, heptenyl groups, octenyl groups, nonenyl groups, decenyl groups, alkenyl groups such as acetylacetonate groups; alkynyl groups and the like. These hydrocarbon groups may be substituted with a hetero atom such as an oxygen atom or a nitrogen atom, or may not be substituted. Further, among the above-mentioned hydrocarbon groups, the hydrocarbon group having 3 or more carbon atoms may be linear or branched.
Among these, an alkyl group and an alkenyl group are preferable, a propyl group and an acetylacetonate group are more preferable, and an isopropyl group is further preferable, from the viewpoint of reactivity and dielectric properties in a high frequency band of 10 GHz band or more.

The component (C) preferably has no hydroxyl group in the molecule from the viewpoint of dielectric properties in a high frequency band of 10 GHz band or higher.

The component (C) is preferably a compound represented by the following general formula (C-1) or the following general formula (C-2) from the viewpoint of dielectric properties in a high frequency band of 10 GHz band or higher.

（上記一般式（Ｃ−１）及び（Ｃ−２）中、Ｒ^Ｃ１は、上記で説明した通りである。Ｍ^Ｃ１は、チタン原子又はジルコニウム原子を示す。上記一般式（Ｃ−２）中、Ｒ^Ｃ２は、各々独立に、水素原子又は炭素数１〜１０の炭化水素基を示す。）

(In the general formula (C1) and ^{(C-2), R C1} is as described above ^{.M C1} represents titanium atom or zirconium atom. The above formula (C-2) in , ^{R C2} each independently represents a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms.)

For the general formula (C1) and general formula (C-2) in the ^{R C1} are as described in the above formula (C-3), preferable embodiments thereof are also the same.
The number of carbon atoms of the hydrocarbon group having 1 ^to 10 carbon atoms ^{R C2} in the general formula (C2) is represented is preferably 2-8, more preferably 3-6.
Examples of the hydrocarbon group having 1 to 10 carbon atoms which R ^C2 is represented, for example, a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, heptyl group, octyl group, nonyl group, alkyl and decyl groups Group; Alkyl group such as vinyl group, propenyl group, butenyl group, pentenyl group, hexenyl group, heptenyl group, octenyl group, nonenyl group, decenyl group; alkynyl group and the like. These hydrocarbon groups may be substituted with a hetero atom such as an oxygen atom or a nitrogen atom, or may not be substituted. Further, among the above-mentioned hydrocarbon groups, the hydrocarbon group having 3 or more carbon atoms may be linear or branched. Among these, an alkyl group and an alkenyl group are preferable, an alkyl group is more preferable, and a methyl group or an ethyl group is further preferable.
The general formula (C1) and general formula (C-2) in the ^{M C1} is titanium atom or zirconium atom, is preferably a titanium atom.

Examples of the component (C) include tetraethoxytitanium, tetraisopropoxytitanium, tetran-propoxytitanium, tetrabutoxytitanium, tetramethoxytitanium, titaniumdiisopropoxybis (acetylacetonate), and titaniumdiisopropoxybis (ethyl). Organic titanium compounds such as acetoacetate), titanium tetraacetylacetonate; tetraethoxyzirconium, tetraisopropoxyzirconium, tetran-propoxyzirconium, tetrabutoxyzirconium, tetramethoxyzirconium, zirconium diisopropoxybis (acetylacetonate), zirconium. Examples thereof include organic zirconium compounds such as diisopropoxybis (ethylacetacetate) and zirconium tetraacetylacetonate. Among these, titanium diisopropoxybis (acetylacetoneate) and titanium tetraacetylacetonate are preferable from the viewpoint of further improving the reactivity and the dielectric properties in the high frequency band.

The content of the component (C) in the resin composition of the present embodiment is not particularly limited, but is preferably 0.01 to 20 parts by mass, more preferably 0.1 with respect to 100 parts by mass of the component (B). It is 10 parts by mass, more preferably 1 to 5 parts by mass.

<Other ingredients>
The resin composition of the present embodiment may further contain other components. As other components, for example, the styrene-based thermoplastic elastomer (D) [hereinafter, may be abbreviated as "(D) component". ], Crosslinking agent (E) [Hereinafter, it may be abbreviated as "component (E)". ], Curing Accelerator (F) [Hereinafter, it may be abbreviated as "(F) component". ], Flame Retardant (G) [Hereinafter, it may be abbreviated as "(G) component". ] And the inorganic filler (H) [hereinafter, may be abbreviated as "(H) component". ], One or more selected from. By containing these, various characteristics when the laminated board is formed can be further improved. However, the resin composition of the present embodiment contains one or more selected from the components (D), (E), (F), (G) and (H) according to the desired performance. It may not be contained.
Hereinafter, these components will be described in detail.

<Component (D); Styrene-based thermoplastic elastomer (D)>
By containing the styrene-based thermoplastic elastomer (D) in the resin composition of the present embodiment, the dielectric properties, moldability, adhesion to the conductor, solder heat resistance, glass transition temperature, etc. in the high frequency band of 10 GHz band or higher can be determined. The balance between thermal expansion coefficient and flame retardancy tends to improve.
Examples of the component (D) include a thermoplastic elastomer having a structural unit derived from a styrene compound represented by the following general formula (D-1) (see below), and a structural unit derived from styrene ( ^RD1 =). It may be a thermoplastic elastomer having a hydrogen atom, k = 0).

（式中、Ｒ^Ｄ１は水素原子又は炭素数１〜５のアルキル基であり、Ｒ^Ｄ２は、炭素数１〜５のアルキル基である。ｋは、０〜５の整数である。）

^{(Wherein, R D1} is a hydrogen atom or an alkyl group of 1 to 5 carbon ^{atoms, R D2} is .k an alkyl group having 1 to 5 carbon atoms is an integer of 0-5.)

^{Examples of the alkyl group having 1 to 5 carbon atoms represented by RD1} and ^RD2 include a methyl group, an ethyl group, an n-propyl group and the like, and an alkyl group having 1 to 3 carbon atoms may be used. It may be a group.
k may be an integer of 0 to 2, 0 or 1, or 0.

Examples of the structural unit other than the structural unit derived from the styrene compound (D) include a structural unit derived from butadiene, a structural unit derived from isoprene, a structural unit derived from maleic acid, a structural unit derived from maleic anhydride, and the like. Can be mentioned.
As the component (D), one type may be used alone, or two or more types may be used in combination.
The structural unit derived from butadiene and the structural unit derived from isoprene may be hydrogenated. When hydrogenated, the structural unit derived from butadiene is a structural unit in which ethylene units and butylene units are mixed, and the structural unit derived from isoprene is a structural unit in which ethylene units and propylene units are mixed.

As the component (D), hydrogenation of a styrene-butadiene-styrene block copolymer is performed from the viewpoints of dielectric properties in a high frequency band of 10 GHz or higher, adhesion to a conductor, heat resistance, glass transition temperature and thermal expansion coefficient. One or more selected from the group consisting of (SEBS, SBBS), hydrogenated styrene-isoprene-styrene block copolymer (SEPS) and styrene-maleic anhydride copolymer (SMA) is preferable, and styrene-. One or more selected from the group consisting of the hydrogenated product of the butadiene-styrene block copolymer (SEBS) and the hydrogenated product of the styrene-isoprene-styrene block copolymer (SEPS) is more preferable, and styrene-butadiene-styrene is more preferable. A block copolymer hydrogenated product (SEBS) is more preferred.

In the above SEBS, the content of structural units derived from styrene [hereinafter, may be abbreviated as "styrene content". ] Is preferably 5 to 80% by mass, more preferably 10 to 75% by mass, from the viewpoints of dielectric properties in a high frequency band of 10 GHz band or higher, adhesion to a conductor, heat resistance, glass transition temperature and coefficient of thermal expansion. , More preferably 15 to 70% by mass, and particularly preferably 20 to 50% by mass.
As commercial products of SEBS, for example, Tough Tech (registered trademark) H series and M series manufactured by Asahi Kasei Corporation, Septon (registered trademark) series manufactured by Kuraray Co., Ltd., and Clayton (registered trademark) G manufactured by Clayton Polymer Japan Co., Ltd. Examples include the polymer series.

The weight average molecular weight (Mw) of the component (D) is not particularly limited, but is preferably 12,000 to 1,000,000, more preferably 20,000 to 500,000, and even more preferably 30,000 to 100. It is 000, particularly preferably 40,000 to 70,000. The weight average molecular weight (Mw) is measured by gel permeation chromatography (GPC) in terms of polystyrene.

When the resin composition of the present embodiment contains the component (D), the content of the component (D) is not particularly limited, but has dielectric properties in a high frequency band of 10 GHz band or higher, adhesion to a conductor, and heat resistance. From the viewpoint of the glass transition temperature and the thermal expansion coefficient, preferably 5 to 60 parts by mass, more preferably 10 to 55 parts by mass, and further preferably 15 to 15 parts by mass with respect to 100 parts by mass of the total resin components in the resin composition. It is 50 parts by mass, particularly preferably 20 to 45 parts by mass, and most preferably 25 to 40 parts by mass. When the content of the component (D) is 5 parts by mass or more, the dielectric properties and moisture absorption resistance in the high frequency band of 10 GHz band or more tend to be better, and when it is 60 parts by mass or less, the heat resistance tends to be better. , Moldability, processability and flame retardancy tend to be better.

<Component (E); Cross-linking agent>
The resin composition of the present embodiment tends to be further excellent in heat resistance and dielectric properties by containing the cross-linking agent (E).
As the cross-linking agent (E), one type may be used alone, or two or more types may be used in combination.

Examples of the cross-linking agent (E) include compounds having two or more ethylenically unsaturated bonds.
Examples of the ethylenically unsaturated bond include unsaturated aliphatic hydrocarbon groups such as vinyl group, isopropenyl group, allyl group, 1-methylallyl group and 3-butenyl group; maleimide group, (meth) acryloyl group and the like. It is an unsaturated bond contained in a substituent containing a hetero atom. Among these, the cross-linking agent (E) preferably has a vinyl group as an ethylenically unsaturated bond from the viewpoint of dielectric properties in a high frequency band of 10 GHz band or higher.
The number of ethylenically unsaturated bonds contained in one molecule of the cross-linking agent (E) is preferably 3 or more, more preferably 5 or more, still more preferably 10 or more from the viewpoint of obtaining excellent heat resistance. ..

As the cross-linking agent (E), a polymer having two or more ethylenically unsaturated bonds as a vinyl group is preferable from the viewpoint of compatibility with other resins, dielectric properties, low thermal expansion and heat resistance. Polybutadiene having two or more 2-vinyl groups and a butadiene-styrene copolymer having two or more 1,2-vinyl groups are more preferable, and polybutadiene having two or more 1,2-vinyl groups is further preferable.

When the cross-linking agent (E) is polybutadiene having two or more 1,2-vinyl groups, the content of the structural unit having a 1,2-vinyl structure with respect to all the structural units derived from butadiene constituting the polybutadiene [ Hereinafter, it may be abbreviated as vinyl group content. ] Is not particularly limited, but is preferably 50 mol% or more, more preferably 60 mol% or more, still more preferably 70 mol% or more, particularly preferably 80 mol% or more, and most preferably 85 mol% or more. From the same viewpoint, the polybutadiene having two or more 1,2-vinyl groups is preferably a 1,2-polybutadiene homopolymer.

The number average molecular weight of a polymer having two or more ethylenically unsaturated bonds, preferably polybutadiene having two or more 1,2-vinyl groups, has compatibility with other resins, dielectric properties, low thermal expansion and heat resistance. From this point of view, it is preferably 500 to 10,000, more preferably 800 to 5,000, and even more preferably 1,000 to 3,500. Further, from the viewpoint of compatibility, it may be 3,000 or less, or 2,500 or less. The number average molecular weight of a polymer having two or more ethylenically unsaturated bonds can be measured by the method described in Examples.

When the resin composition of the present embodiment contains the component (E), the content of the component (E) is not particularly limited, but from the viewpoint of obtaining excellent heat resistance and dielectric properties in a high frequency band of 10 GHz band or higher. From the viewpoint of the above, preferably 5 to 60 parts by mass, more preferably 7 to 40 parts by mass, still more preferably 10 to 30 parts by mass, and particularly preferably 13 parts by mass with respect to 100 parts by mass of the total resin components in the resin composition. ~ 20 parts by mass.

<(F) component; curing accelerator (F)>
By containing the curing accelerator (F) in the resin composition of the present embodiment, the curability of the resin composition is improved, and the dielectric properties, heat resistance, adhesion to the conductor in the high frequency band of 10 GHz band or higher, There is a tendency that the elastic modulus and the glass transition temperature can be improved.
The component (F) includes, for example, an acidic catalyst such as p-toluenesulfonic acid; an amine compound such as triethylamine, pyridine, and tributylamine; methylimidazole, phenylimidazole, isocyanate masked imidazole (for example, hexamethylenediisocyanate resin and 2-ethyl). Imidazole compounds such as -4-methylimidazole addition reaction products); tertiary amine compounds; quaternary ammonium compounds; phosphorus compounds such as triphenylphosphine; dicumyl peroxide, 2,5-dimethyl-2, 5-bis (t-butylperoxy) hexin-3,2,5-dimethyl-2,5-bis (t-butylperoxy) hexane, t-butylperoxyisopropyl monocarbonate, α, α'-bis ( Organic peroxides such as t-butylperoxy) diisopropylbenzene; carboxylates such as manganese, cobalt and zinc can be mentioned. One of these may be used alone, or two or more thereof may be used in combination.
Among these, imidazole compounds, organic peroxides, and carboxylates may be used from the viewpoints of heat resistance, glass transition temperature, and storage stability, and from the viewpoints of heat resistance, glass transition temperature, elasticity, and thermal expansion coefficient. Therefore, the imidazole compound and the organic peroxide may be used in combination. The imidazole compound is preferably isocyanate masked imidazole, and the organic peroxide is preferably α, α'-bis (t-butylperoxy) diisopropylbenzene.

When the resin composition of the present embodiment contains the component (F), the content of the component (F) is not particularly limited, but is preferable with respect to, for example, 100 parts by mass of the total resin components in the resin composition. Is 0.01 to 10 parts by mass, more preferably 0.05 to 8 parts by mass, still more preferably 0.1 to 6 parts by mass, and particularly preferably 0.5 to 5 parts by mass. When the content of the component (F) is within the above range, better heat resistance and storage stability tend to be obtained.

<(G) component; flame retardant (G)>
By containing the flame retardant (G) in the resin composition of the present embodiment, the flame retardancy of the resin composition tends to be improved.
Examples of the component (G) include phosphorus-based flame retardants, metal hydrates, halogen-based flame retardants, and the like. From the viewpoint of environmental problems, phosphorus-based flame retardants and metal hydrates may be used. As the flame retardant (G), one type may be used alone, or two or more types may be used in combination. Further, a flame retardant aid may be contained if necessary.

-Phosphorus flame retardant-
The phosphorus-based flame retardant is not particularly limited as long as it contains a phosphorus atom among those generally used as a flame retardant, and may be an inorganic phosphorus-based flame retardant or an organic-based flame retardant. It may be a phosphorus flame retardant. From the viewpoint of environmental problems, those containing no halogen atom are preferable. From the viewpoints of dielectric properties in a high frequency band of 10 GHz band or higher, adhesiveness to a conductor, heat resistance, glass transition temperature, coefficient of thermal expansion and flame retardancy, an organic phosphorus flame retardant may be used.
Examples of the inorganic phosphorus-based flame retardant include red phosphorus; ammonium phosphate such as monoammonium phosphate, diammonium phosphate, triammonium phosphate, and ammonium polyphosphate; and inorganic nitrogen-containing phosphorus compounds such as phosphate amide. ; Phosphoric acid; phosphine oxide and the like.
Examples of the organic phosphorus-based flame retardant include aromatic phosphoric acid ester, mono-substituted phosphonic acid diester, 2-substituted phosphinic acid ester, metal salt of 2-substituted phosphinic acid, organic nitrogen-containing phosphorus compound, and cyclic organic phosphorus compound. Can be mentioned. Among these, aromatic phosphoric acid ester compounds and metal salts of disubstituted phosphinic acid are preferable. Here, the metal salt may be any of a lithium salt, a sodium salt, a potassium salt, a calcium salt, a magnesium salt, an aluminum salt, a titanium salt, and a zinc salt, and may be an aluminum salt. Among the organic phosphorus-based flame retardants, aromatic phosphoric acid esters are preferable.

Examples of the aromatic phosphate ester include triphenyl phosphate, tricresyl phosphate, trixylenyl phosphate, cresildiphenyl phosphate, cresildi-2,6-xylenyl phosphate, resorcinolbis (diphenyl phosphate), 1,3. -Phenylene bis (di-2,6-xylenyl phosphate), bisphenol A-bis (diphenyl phosphate), 1,3-phenylene bis (diphenyl phosphate) and the like can be mentioned.
Examples of the mono-substituted phosphonic acid diester include divinyl phenylphosphonate, diallyl phenylphosphonate, and bis (1-butenyl) phenylphosphonate.
Examples of the disubstituted phosphinic acid ester include phenyl diphenylphosphine acid and methyl diphenylphosphine acid.
Examples of the metal salt of disubstituted phosphinic acid include a metal salt of dialkylphosphinic acid, a metal salt of diallylphosphinic acid, a metal salt of divinylphosphinic acid, and a metal salt of diarylphosphinic acid. These metal salts may be any of lithium salt, sodium salt, potassium salt, calcium salt, magnesium salt, aluminum salt, titanium salt and zinc salt, and aluminum salt may be selected.
Examples of the organic nitrogen-containing phosphorus compound include phosphazene compounds such as bis (2-allylphenoxy) phosphazene and dicredylphosphazene; melamine phosphate; melamine pyrophosphate; melamine polyphosphate; and melam polyphosphate.
Examples of the cyclic organic phosphorus compound include 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10- (2,5-dihydroxyphenyl) -9,10-dihydro-9-oxa-. Examples thereof include 10-phosphaphenanthrene-10-oxide.
Among these, aromatic phosphate ester and disubstituted phosphine are preferable, and aluminum salts of 1,3-phenylenebis (di-2,6-xylenyl phosphate) and dialkylphosphinic acid are preferable.

-Metal hydrate-
Examples of the metal hydrate include aluminum hydroxide hydrate and magnesium hydroxide hydrate. One of these may be used alone, or two or more thereof may be used in combination. The metal hydroxide may also correspond to an inorganic filler, but if it is a material that can impart flame retardancy, it is classified as a flame retardant.
-Halogen flame retardant-
Examples of the halogen-based flame retardant include chlorine-based flame retardants and brominated flame retardants. Examples of the chlorine-based flame retardant include chlorinated paraffin and the like.

When the resin composition of the present embodiment contains a phosphorus-based flame retardant as the component (G), the content of the phosphorus-based flame retardant in the resin composition is not particularly limited, but is the total of the resin components in the resin composition. With respect to 100 parts by mass, it is preferably 0.2 to 5 parts by mass, more preferably 1 to 4 parts by mass, and further preferably 2 to 3.5 parts by mass in terms of phosphorus atom. When the phosphorus atom content is 0.2 parts by mass or more, better flame retardancy tends to be obtained, and when it is 5 parts by mass or less, better moldability and high adhesion to the conductor are obtained. Excellent heat resistance and high glass transition temperature tend to be obtained.

<(H) component; inorganic filler (H)>
By containing the inorganic filler (H) in the resin composition of the present embodiment, there is a tendency that the low coefficient of thermal expansion, high elastic modulus, heat resistance and flame retardancy can be further improved.
The component (H) is not particularly limited, but is, for example, silica, alumina, titanium oxide, mica, beryllia, barium titanate, potassium titanate, strontium titanate, calcium titanate, aluminum carbonate, magnesium hydroxide, hydroxide. Examples thereof include aluminum, aluminum silicate, calcium carbonate, calcium silicate, magnesium silicate, silicon nitride, boron nitride, clay (baked clay, etc.), talc, aluminum borate, silicon carbide and the like. One of these may be used alone, or two or more thereof may be used in combination. Among these, silica, alumina, mica, and talc are preferable, silica and alumina are more preferable, and silica is further preferable, from the viewpoint of thermal expansion coefficient, elastic modulus, heat resistance, and flame retardancy. Examples of silica include precipitated silica manufactured by a wet method and having a high water content, and dry silica manufactured by a dry method and containing almost no bound water or the like. Further, as dry method silica, there is a difference in manufacturing method. Examples thereof include crushed silica, fumed silica, and fused silica (molten spherical silica).
The shape and particle size of the inorganic filler (H) are also not particularly limited. For example, the particle size is preferably 0.01 to 20 μm, more preferably 0.1 to 10 μm. Here, the particle size refers to the average particle size, and is the particle size of a point corresponding to a volume of 50% when the cumulative frequency distribution curve based on the particle size is obtained with the total volume of the particles as 100%. The particle size of the inorganic filler (H) can be measured by a particle size distribution measuring device or the like using a laser diffraction / scattering method.

When the resin composition of the present embodiment contains the component (H), the content of the component (H) in the resin composition is not particularly limited, but has a thermal expansion coefficient, an elastic coefficient, heat resistance and flame retardancy. From the viewpoint, it is preferably 10 to 200 parts by mass, more preferably 30 to 170 parts by mass, still more preferably 50 to 150 parts by mass, and particularly preferably 70 to 70 parts by mass with respect to 100 parts by mass of the total resin components in the resin composition. It is 130 parts by mass, most preferably 90 to 110 parts by mass.

When the component (H) is used, a coupling agent is used in combination as necessary for the purpose of improving the dispersibility of the component (H) and the adhesion between the component (H) and the organic component in the resin composition. You may. The coupling agent is not particularly limited, and for example, a silane coupling agent or a titanate coupling agent can be appropriately selected and used. One type of coupling agent may be used alone, or two or more types may be used in combination. Further, the amount of the coupling agent used is not particularly limited, and may be, for example, 0.1 to 5 parts by mass or 0.5 to 3 parts by mass with respect to 100 parts by mass of the component (H). .. When the content of the component (H) is within the above range, the deterioration of various properties is small, and the characteristics of the use of the component (H) tend to be effectively exhibited.
When a coupling agent is used, a so-called integral blend treatment method may be used in which the component (H) is blended in the resin composition and then the coupling agent is added, but the coupling agent is coupled to the inorganic filler in advance. A method using an inorganic filler in which the agent is surface-treated by a dry method or a wet method is preferable. By adopting this method, the features of the component (H) can be expressed more effectively.

When the component (H) is used in the present embodiment, the component (H) is used as a slurry in which the component (H) is previously dispersed in an organic solvent, if necessary, for the purpose of improving the dispersibility of the component (H) in the resin composition. be able to. As the organic solvent used when the component (H) is slurried, for example, the above-mentioned organic solvent can be applied. One of these may be used alone, or two or more thereof may be used in combination. Among these, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone are preferable from the viewpoint of dispersibility. The solid content (nonvolatile content) concentration of the slurry is not particularly limited, but is, for example, 50 to 80% by mass and 60 to 80% by mass from the viewpoint of sedimentation and dispersibility of the inorganic filler (H). May be%.

If necessary, the resin composition of the present embodiment includes a thermoplastic resin other than the above components, a resin material such as an elastomer, a coupling agent, an antioxidant, a heat stabilizer, an antistatic agent, and ultraviolet rays. Absorbents, pigments, colorants, flame retardant aids, lubricants and the like can be appropriately selected and contained. One of these may be used alone, or two or more thereof may be used in combination. The amount of these used is not particularly limited, and may be used within a range that does not impair the effects of the present invention.

<Organic solvent>
The resin composition of the present embodiment may contain an organic solvent from the viewpoint of facilitating handling by diluting and from the viewpoint of facilitating the production of a prepreg described later. The resin composition containing an organic solvent may be generally referred to as a resin varnish or a varnish.
The organic solvent used for the varnish is not particularly limited, but is, for example, an alcohol solvent such as ethanol, propanol, butanol, methyl cellosolve, butyl cellosolve, and propylene glycol monomethyl ether; a ketone solvent such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone. Ether-based solvent such as tetrahydrofuran; Aromatic solvent such as toluene, xylene, mesitylen; nitrogen atom-containing solvent such as dimethylformamide, dimethylacetamide, N-methylpyrrolidone; sulfur atom-containing solvent such as dimethylsulfooxide; γ-butyrolactone and the like Examples of the ester solvent of.
Among these, from the viewpoint of solubility, an alcohol solvent, a ketone solvent, and a nitrogen atom-containing solvent are preferable, a ketone solvent is more preferable, acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone are further preferable, and methyl ethyl ketone is particularly preferable.
As the organic solvent, one type may be used alone, or two or more types may be used in combination.

When the resin composition of the present embodiment contains an organic solvent, the solid content concentration thereof is, for example, 30 to 90% by mass, 35 to 80% by mass, or 40 to 60% by mass. May be good. When the solid content concentration is within the above range, the handleability tends to be easy, the impregnation property into the base material and the appearance of the produced prepreg tend to be good. Further, the solid content concentration of the resin in the prepreg, which will be described later, tends to be easily adjusted, and the production of the prepreg having a desired thickness tends to be easier.

<Manufacturing method of resin composition>
The resin composition of this embodiment is
(A) One or more selected from the group consisting of maleimide compounds having two or more N-substituted maleimide groups and derivatives thereof, and
(B) Polyphenylene ether-based resin and
(C) An organometallic compound having an alkoxy group bonded to a metal atom,
Can be produced by the method of mixing.
At the time of the above mixing, other components other than the components (A) to (C) that are used in combination may be mixed as needed. The mixing method is not particularly limited, and a known method using a mixer or the like can be applied.
Each component may be dissolved or dispersed in an organic solvent, or may be kneaded without a solvent. Conditions such as mixing order, temperature, and time are not particularly limited, and may be appropriately adjusted according to the type of raw material used.

<Physical properties of cured resin composition>
The dielectric constant (Dk) of the cured product of the resin composition of the present embodiment (a cured product of a laminate and a resin film that does not contain a fiber base material such as glass cloth) at 10 GHz is preferably 3.0 or less, more preferably. It is 2.9 or less. The smaller the dielectric constant (Dk) is, the more preferable it is, and the lower limit thereof is not particularly limited. However, in consideration of the balance with other physical properties, for example, it may be 2.4 or more, or 2.6 or more. May be good.
The dielectric loss tangent (Df) of the cured product of the resin composition of the present embodiment (a laminated body containing no fiber base material such as glass cloth and a cured product of a resin film) at 10 GHz is preferably 0.0024 or less, more preferably 0.0024 or less. It is 0.0023 or less. The smaller the dielectric loss tangent (Df) is, the more preferable it is, and the lower limit thereof is not particularly limited. However, in consideration of the balance with other physical properties, for example, it may be 0.0015 or more, or 0.0020 or more. May be good.
The dielectric constant (Dk) and the dielectric loss tangent (Df) are values based on the cavity resonator perturbation method, and more specifically, they are values measured by the method described in Examples. Further, in the present specification, the term "dielectric constant" means the relative permittivity.

[Prepreg]
The present invention also provides a prepreg containing the resin composition of the present embodiment.
The prepreg of the present embodiment contains, for example, the resin composition of the present embodiment and the sheet-shaped fiber reinforced base material, and the sheet-shaped fiber reinforced base material is impregnated or coated with the resin composition of the present embodiment. It can be manufactured by working and drying. More specifically, for example, the prepreg of the present embodiment can be produced by heating and drying in a drying oven at a temperature of 80 to 200 ° C. for 1 to 30 minutes and semi-curing (B-stage). can. The amount of the resin composition used is not particularly limited, but is, for example, an amount such that the solid content derived from the resin composition in the prepreg after drying is 30 to 90% by mass. When the amount of solid content derived from the resin composition is within the above range, better moldability tends to be obtained when the laminated board is formed.

As the sheet-shaped fiber reinforced base material of the prepreg, known materials used for various laminated boards for electrical insulating materials are used. Examples of the material of the sheet-shaped fiber reinforcing base material include inorganic fibers such as E glass, D glass, S glass and Q glass; organic fibers such as polyimide, polyester and tetrafluoroethylene; and a mixture thereof. These sheet-shaped fiber reinforced base materials have shapes such as woven fabrics, non-woven fabrics, robinks, chopped strand mats, and surfaced mats. The thickness of the sheet-shaped fiber reinforced base material is not particularly limited, but is, for example, 0.02 to 0.5 mm. Further, from the viewpoints of impregnation property of the resin composition, heat resistance when formed into a laminated board, moisture absorption resistance and processability, those surface-treated with a coupling agent or the like and those that have been mechanically opened. Can be used.

As a method of impregnating or coating the sheet-shaped fiber reinforced base material with the resin composition, for example, a hot melt method, a solvent method, or the like can be applied.
In the hot melt method, the resin composition does not contain an organic solvent, and (1) the resin composition is once coated on a coated paper having good peelability from the resin composition, and the sheet-like fiber reinforced base material is coated. This is a method of laminating the resin composition on the sheet or (2) a method of directly applying the resin composition to the sheet-shaped fiber reinforced base material with a die coater.
On the other hand, the solvent method is a method of impregnating a sheet-shaped fiber-reinforced base material with the resin composition by immersing the sheet-shaped fiber-reinforced base material in a resin varnish containing an organic solvent in the resin composition and then drying the sheet-shaped fiber-reinforced base material. Is.

[Resin film]
The present invention also provides a resin film containing the resin composition of the present embodiment.
The resin film of the present embodiment can be produced, for example, by applying a resin composition containing an organic solvent, that is, a resin varnish, to a support and heat-drying the support. Examples of the support include a polyolefin film such as polyethylene, polypropylene, and polyvinyl chloride; a polyester film such as polyethylene terephthalate (hereinafter, also referred to as “PET”) and polyethylene naphthalate; various plastics such as a polycarbonate film and a polyimide film. Examples include film. Further, as the support, a metal foil such as a copper foil or an aluminum foil, a paper pattern, or the like may be used. The support may be subjected to surface treatment such as matte treatment or corona treatment. Further, the support may be subjected to a mold release treatment with a silicone resin-based mold release agent, an alkyd resin-based mold release agent, a fluororesin-based mold release agent, or the like.
The thickness of the support is not particularly limited, but is preferably 10 to 150 μm, more preferably 25 to 50 μm.

The method of applying the resin varnish to the support is not particularly limited, and for example, a coating device known to those skilled in the art such as a comma coater, a bar coater, a kiss coater, a roll coater, a gravure coater, and a die coater can be used. .. These coating devices may be appropriately selected in consideration of the desired thickness of the resin film and the like.
The drying temperature and drying time may be appropriately determined according to the amount of the organic solvent used, the boiling point of the organic solvent used, and the like. For example, in the case of a resin varnish containing an organic solvent of about 40 to 60% by mass, the drying temperature and the drying time may be determined. A resin film can be suitably formed by drying at 50 to 150 ° C. for about 3 to 10 minutes.

[Laminated board]
The present invention also provides a laminated board containing the prepreg of the present embodiment and a metal foil.
The laminated plate of the present embodiment is, for example, arranged with metal foil on one side or both sides of one prepreg of the present embodiment, or metal on one side or both sides of a prepreg obtained by stacking two or more prepregs of the present embodiment. It can be produced by arranging the foil and then heat-press molding. The laminated board having a metal foil may be referred to as a metal-clad laminated board.
The metal of the metal foil is not particularly limited as long as it is used for electrical insulating material, but from the viewpoint of conductivity, copper, gold, silver, nickel, platinum, molybdenum, ruthenium, aluminum, tungsten, iron, titanium. , Chromium, or an alloy containing one or more of these metal elements, preferably copper and aluminum, and more preferably copper.
The conditions for heat-press molding are not particularly limited, but are, for example, in the range of a temperature of 100 to 300 ° C., a pressure of 0.2 to 10 MPa, and a time of 0.1 to 5 hours. Further, for the heat and pressure molding, a method of holding the vacuum state for 0.5 to 5 hours using a vacuum press or the like can be adopted.

[Printed wiring board]
The printed wiring board of the present embodiment contains one or more selected from the group consisting of the prepreg of the present embodiment, the resin film of the present embodiment, and the laminated board of the present embodiment. The printed wiring board of the present embodiment is drilled by a known method using one or more selected from the group consisting of the prepreg of the present embodiment, the resin film of the present embodiment, and the laminated board of the present embodiment. It can be manufactured by performing circuit forming processing such as metal plating processing, etching of metal foil, and multi-layer bonding processing.

[Semiconductor package]
The semiconductor package of this embodiment is formed by mounting a semiconductor on a printed wiring board of this embodiment. The semiconductor package of the present embodiment can be manufactured by mounting a semiconductor chip, a memory, or the like at a predetermined position on the printed wiring board of the present embodiment.

The resin composition, prepreg, laminated board, resin film, printed wiring board and semiconductor package of the present embodiment can be suitably used for electronic devices that handle high frequency signals of 10 GHz or higher. In particular, the printed wiring board is useful as a printed wiring board for millimeter-wave radar.

Although preferred embodiments of the present invention have been described above, these are examples for explaining the present invention, and the scope of the present invention is not limited to these embodiments. The present invention can be carried out in various aspects different from the above-described embodiment without departing from the gist thereof.

Hereinafter, the present invention will be specifically described with reference to examples. However, the present invention is not limited to the following examples.

In each example, the number average molecular weight was measured by the following procedure.
(Measurement method of number average molecular weight)
The number average molecular weight was converted from the calibration curve using standard polystyrene by gel permeation chromatography (GPC). The calibration curve is standard polystyrene: TSK standard POLYSTYRENE (Type; A-2500, A-5000, F-1, F-2, F-4, F-10, F-20, F-40) [manufactured by Tosoh Corporation, Product name] was used for approximation by a cubic equation. The measurement conditions of GPC are shown below.
Equipment: High-speed GPC equipment HLC-8320GPC
Detector: Ultraviolet absorption detector UV-8320 [manufactured by Tosoh Corporation]
Column: Guard column; TSK Guardcolum SuperHZ-L + column; TSKgel SuperHZM-N + TSKgel SuperHZM-M + TSKgel SuperH-RC (all manufactured by Tosoh Corporation, trade name)
Column size: 4.6 x 20 mm (guard column), 4.6 x 150 mm (column), 6.0 x 150 mm (reference column)
Eluent: Tetrahydrofuran Sample concentration: 10 mg / 5 mL
Injection volume: 25 μL
Flow rate: 1.00 mL / min Measurement temperature: 40 ° C

[Production Example 1: Production of polyaminobismaleimide compound (A-1)]
50 parts by mass of 2,2-bis [4- (4-maleimidephenoxy) phenyl] propane in a glass flask container with a volume of 1 L that can be heated and cooled equipped with a thermometer, a reflux cooling tube, and a stirrer. 50 parts by mass of 3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethanebismaleimide, 14 parts by mass of 4,4'-[1,3-phenylenebis (1-methylethylidene)] bisaniline, A polyaminobismaleimide compound having a number average molecular weight of 800 was added by adding 50 parts by mass of propylene glycol monomethyl ether, keeping the liquid temperature at 120 ° C., reacting for 3 hours with stirring, and then cooling and filtering through a 200 mesh filter. A-1) was manufactured.

[Production Example 2: Production of Polyphenylene Ether Derivative (B-1)]
Toluene, raw material polyphenylene ether "Zylon (registered trademark) S203A" (trade name, manufactured by Asahi Kasei Co., Ltd., number average) in a glass flask container with a volume of 2 L that can be heated and cooled equipped with a thermometer, a reflux condenser, and a stirrer. A molecular weight of 12,000) and an allyl group-containing compound represented by the following general formula (B-10) were added and dissolved with stirring at 90 to 100 ° C. The blending amount of the allyl group-containing compound was such that the hydroxyl group equivalent derived from the allyl group-containing compound was 6 (equivalent ratio) with respect to the hydroxyl group equivalent of the raw material polyphenylene ether. The amount of toluene used was such that the reaction concentration was 35% by mass.

（式中、Ｘ^Ｂ２は２価の有機基であり、上記一般式（Ｂ−６）中のＸ^Ｂ２と同様に説明される。）

(In the formula, X ^B2 is a divalent organic group and is described in the same manner as ^{X B2} in the above general formula (B-6).)

After visually confirming that the allyl group-containing compound was dissolved, 2 parts by mass of t-butylperoxyisopropylmonocarbonate was added to 100 parts by mass of the raw material polyphenylene ether, and manganese octylate was added to 100 parts by mass of the raw material polyphenylene ether. 0.11 part by mass was added, and the solution was redistributed at a solution temperature of 90 to 100 ° C. for 6 hours and then cooled to 40 ° C. to obtain a polyphenylene ether derivative (B-1) having an allyl group at the molecular terminal. .. When a small amount of this reaction solution was taken out and GPC measurement was performed, the double peak derived from the allyl group-containing compound became a single peak, and the number average molecular weight of the polyphenylene ether derivative (B-1) was 4,200.

[Preparation of resin composition]
Examples 1-3, Comparative Example 1
Each component shown in Table 1 is stirred and mixed while heating at room temperature or 50 to 80 ° C. according to the blending amount (unit: parts by mass) shown in Table 1, and the solid content (nonvolatile content) concentration is about 50% by mass. A resin composition was prepared.
The resin composition obtained in each example was applied to a PET film having a thickness of 38 μm (manufactured by Teijin Limited, trade name: G2-38), and then heated and dried at 170 ° C. for 5 minutes to obtain a resin in a B stage state. A film was made. This resin film was peeled off from the PET film and then pulverized to obtain a resin powder. Next, the above resin powder was put into a Teflon (registered trademark) sheet stamped to a size of 1 mm in thickness × 50 mm in length × 35 mm in width, and a low profile copper foil (Furukawa Denki Kogyo Co., Ltd.) having a thickness of 18 μm was placed above and below the sheet. A company-made product, trade name: BF-ANP18) is placed so that the M surface is in contact with the charged resin powder, and is heat-press molded under the conditions of a temperature of 230 ° C., a pressure of 2.0 MPa, and a time of 120 minutes to form a resin composition. The object was cured to prepare a resin plate with double-sided copper foil (resin plate thickness: 1 mm).

[Evaluation / measurement method]
Using the resin plates with double-sided copper foils obtained in the above Examples and Comparative Examples, each measurement and evaluation was carried out according to the following methods. The results are shown in Table 1.

(Evaluation of the dielectric properties (dielectric constant and dielectric loss tangent) of the resin plate)
Evaluation of 2 mm x 50 mm from the evaluation substrate from which the copper foil was removed by immersing the resin plate with double-sided copper foil obtained in each example in a 10% by mass solution of ammonium persulfate (manufactured by Mitsubishi Gas Chemical Company, Inc.), which is a copper etching solution. A substrate was prepared.
The evaluation substrate was measured for dielectric constant (Dk) and dielectric loss tangent (Df) in the 10 GHz band according to the cavity resonator perturbation method.

(Measurement method of glass transition temperature and coefficient of thermal expansion)
The coefficient of thermal expansion (plate thickness direction, temperature range: 30 to 120 ° C.) and glass transition temperature (Tg) are determined by using a 5 mm square test piece obtained by etching the copper foil on both sides of a resin plate with double-sided copper foil. It was measured by a measuring device (TMA) [manufactured by TA Instruments Japan Co., Ltd., Q400 (model number)] in accordance with the IPC (The Institute for Interconnecting and Packaging Electronic Circuits) standard.

(Measuring method of copper foil peel strength)
As for the copper foil peel strength, the peel strength between the resin plate and the copper foil was measured for the resin plate with double-sided copper foil obtained in each example in accordance with the copper-clad laminate test standard JIS C 6481.

The materials in Table 1 are as follows.
[(A) component: maleimide compound (A)]
-Polyaminobismaleimide compound (A-1): The polyaminobismaleimide compound (A-1) produced in Production Example 1 was used.

[Component (B): Polyphenylene ether-based resin (B)]
-Polyphenylene ether derivative (B-1): The polyphenylene ether derivative (B-1) produced in Production Example 2 was used.

[(C) component: organometallic compound (C)]
Organometallic compound (C-1): Titanium diisopropoxybis (acetylacetone)
Organometallic compound (C-2): Titanium tetraacetylacetone

[Component (D); Styrene-based thermoplastic elastomer (D)]
-Clayton (registered trademark) G1726: Hydrogenated styrene-based thermoplastic elastomer (SEBS) (manufactured by Kraton Polymer Japan Co., Ltd., trade name)

[(E) component; cross-linking agent (E)]
-B-1000: Polybutadiene, number average molecular weight: 1,200, vinyl group content: 85% or more (manufactured by Nippon Soda Co., Ltd., trade name)

[(F) component; curing accelerator (F)]
-Α, α'-bis (t-butylperoxy) diisopropylbenzene-G-8009L: Isocyanate mask imidazole (addition reaction product of hexamethylene diisocyanate resin and 2-ethyl-4-methylimidazole) (Daiichi Kogyo Seiyaku Co., Ltd.) Made, product name)

[(G) component; flame retardant (G)]
OP935: Aluminum salt of dialkylphosphinic acid, metal salt of disubstituted phosphinic acid, phosphorus content: 23.5% by mass (manufactured by Clariant, trade name)
-1,3-Phenylenebis (di2,6-xylenyl phosphate), phosphorus content: 9.0% by mass

[(H) component; inorganic filler (H)]
-Silica: Spherical molten silica, average particle size: 0.5 μm

As is clear from the results shown in Table 1, the cured product obtained from the resin compositions of Examples 1 to 3 of this embodiment is excellent in dielectric properties in a high frequency band of 10 GHz band or higher. I understand. From these results, it can be seen that in the resin composition of the present embodiment, the dielectric property of the cured product can be improved by a simple method of blending (C) an organometallic compound having an alkoxy group bonded to a metal atom.

Since the laminated board made from the resin composition of the present embodiment has excellent dielectric properties in a high frequency band of 10 GHz or higher, a fifth generation mobile communication system (5G) antenna in which radio waves in a frequency band exceeding 6 GHz are used. It is also useful for multi-layer printed wiring boards and the like used in millimeter-wave radars in which radio waves in the frequency band of 30 to 300 GHz are used.

Claims (13)

(A) One or more selected from the group consisting of maleimide compounds having two or more N-substituted maleimide groups and derivatives thereof, and
(B) Polyphenylene ether-based resin and
(C) An organometallic compound having an alkoxy group bonded to a metal atom,
A resin composition comprising. The organic metal compound having an alkoxy group bonded to the metal atom (C) is selected from the group consisting of an organic titanium compound having an alkoxy group bonded to a titanium atom and an organic zirconium compound having an alkoxy group bonded to a zirconium atom. The resin composition according to claim 1, which is one or more of the above-mentioned compounds. The invention according to claim 1 or 2, wherein the organometallic compound having an alkoxy group bonded to the metal atom (C) is a compound represented by the following general formula (C-1) or the following general formula (C-2). Resin composition.

(In the general formula (C1) and ^{(C-2), R C1} are each independently a hydrocarbon group having 1 to 10 carbon ^{atoms, M C1} represents a titanium atom or zirconium atom. The above in formula ^{(C2), R C2} each independently represents a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms.) The resin composition according to claim 2, wherein the organic metal compound having an alkoxy group bonded to the metal atom (C) is an organic titanium compound having an alkoxy group bonded to the titanium atom. The resin composition according to any one of claims 1 to 4, wherein the polyphenylene ether-based resin (B) has a number average molecular weight of 1,000 to 25,000. The resin composition according to any one of claims 1 to 5, wherein the polyphenylene ether-based resin (B) has an ethylenically unsaturated bond-containing group. Claims 1 to 2, wherein the content of the organometallic compound having an alkoxy group bonded to the metal atom (C) is 0.01 to 20 parts by mass with respect to 100 parts by mass of the polyphenylene ether-based resin (B). The resin composition according to any one of 6. A prepreg containing the resin composition according to any one of claims 1 to 7. A laminated board containing the prepreg according to claim 8 and a metal foil. A resin film containing the resin composition according to any one of claims 1 to 7. A printed wiring board containing at least one selected from the group consisting of the prepreg according to claim 8, the laminated board according to claim 9, and the resin film according to claim 10. A semiconductor package in which a semiconductor element is mounted on the printed wiring board according to claim 11. The method for producing the resin composition according to any one of claims 1 to 7.
(A) One or more selected from the group consisting of maleimide compounds having two or more N-substituted maleimide groups and derivatives thereof, and
(B) Polyphenylene ether-based resin and
(C) An organometallic compound having an alkoxy group bonded to a metal atom,
A method for producing a resin composition.