JP2022154232A - socket - Google Patents

Abstract

To make small a wiping quantity of a top part of a contact pin.SOLUTION: There is provided a socket that comprises a plurality of contact pins, a retention part which retains the plurality of contact pins, and a first projection part which projects upward from a first surface of the retention part, wherein the plurality of contact pins each comprise a raised part which penetrates the retention part from the first surface to a second surface, an inclined part which extends obliquely from an end of the raised part on the side of the first surface of the retention part to the first surface, and an extension part which has a top part coming into contact with a terminal of an electronic component and extends from the opposite end from the raised part of the inclined part to the top part obliquely upward to the first surface of the retention part toward the center axis of the raised part. The first projection part is provided between the inclined part and the first surface of the retention part.SELECTED DRAWING: Figure 7

Description

The present invention relates to sockets.

A socket for electrically connecting an electronic component and a circuit board is known. For example, by providing a pair of contacts on both sides of the bent apex of the contact pin, the displacement of the contacts in the direction perpendicular to the connection direction of the electronic component can be suppressed and the contact force between the electronic component and the electronic component can be strengthened. is known (for example, Patent Document 1).

JP-A-11-307209

In order to improve contactability and stabilize electrical resistance, the top of the contact pin is wiped with the terminal of the electronic component. However, as the number of contact pins increases and the pitch of the contact pins becomes narrower as electronic components become more sophisticated, the area where the tops of the contact pins can be wiped becomes smaller.

One aspect aims at minimizing the amount of wiping of the top of the contact pin.

In one aspect, the contact pin includes a plurality of contact pins, a holding portion that holds the plurality of contact pins, and a first protrusion that protrudes upward from a first surface of the holding portion, and the plurality of contact pins are: an upright portion passing through the holding portion from the first surface to the second surface; and an inclined portion extending obliquely upward with respect to the first surface from an end of the upright portion on the first surface side of the holding portion. , having a top portion that contacts a terminal of an electronic component, and is inclined with respect to the first surface of the holding portion toward the central axis of the upright portion from the end of the inclined portion opposite to the upright portion to the top portion. an upwardly extending extension, wherein the first projection is a socket provided between the ramp and the first surface of the retainer.

As one aspect, the amount of wiping at the top of the contact pin can be kept small.

FIG. 1(a) is a cross-sectional view of a socket according to Example 1, and FIG. 1(b) is an enlarged view of a region A in FIG. 1(a). FIG. 2 is a cross-sectional view showing a case of electrically connecting a circuit board and an electronic component using the socket according to the first embodiment. 3(a) is a cross-sectional view of a socket according to Comparative Example 1, and FIG. 3(b) is an enlarged view of region A in FIG. 3(a). 4A and 4B are cross-sectional views showing wiping of contact pins in Comparative Example 1. FIG. FIG. 5(a) is a cross-sectional view of a socket according to Comparative Example 2, and FIG. 5(b) is an enlarged view of region A in FIG. 5(a). 6A and 6B are cross-sectional views showing wiping of contact pins in Comparative Example 2. FIG. 7A to 7C are cross-sectional views showing wiping of the contact pin in Example 1. FIG. FIG. 8(a) is a cross section of a simulated model corresponding to Comparative Example 2, and FIG. 8(b) is a cross section of a simulated model corresponding to Example 1. FIG. 9A shows the simulation result of the model corresponding to Comparative Example 2, and FIG. 9B shows the simulation result of the model corresponding to Example 1. FIG. FIGS. 10(a) to 10(c) are simulation results of verifying the wiping of the bending top when the positions of the protrusions are changed. 11(a) is a cross-sectional view of a socket according to Example 2, and FIG. 11(b) is an enlarged view of region A in FIG. 11(a). FIGS. 12(a) to 12(c) are cross-sectional views showing wiping of contact pins in Example 2. FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1(a) is a cross-sectional view of a socket 100 according to Example 1, and FIG. 1(b) is an enlarged view of a region A in FIG. 1(a). As shown in FIG. 1A, the socket 100 includes a plurality of contact pins 10, a holding portion 30 that bundles and holds the plurality of contact pins 10, and a projection portion 40 that protrudes from an upper surface 32 of the holding portion 30. Prepare.

As shown in FIG. 1B, the contact pin 10 includes an upright portion 12, an inclined portion 14 extending from one end of the upright portion 12, an extending portion 16 extending from one end of the inclined portion 14, and and a joint portion 18 extending from the other end. The standing portion 12 penetrates the holding portion 30 from the upper surface 32 to the lower surface 34 and extends straight in a straight line. The standing portion 12 extends, for example, in a direction in which the upper surface 32 and the lower surface 34 of the holding portion 30 face each other, and is orthogonal to the upper surface 32 and the lower surface 34 . The inclined portion 14 straightly extends obliquely upward with respect to the upper surface 32 from the end 13 a of the standing portion 12 on the upper surface 32 side of the holding portion 30 . The extending portion 16 extends obliquely upward from the upper surface 32 of the holding portion 30 toward the central axis 22 of the standing portion 12 from the end 15 of the inclined portion 14 opposite to the standing portion 12 , and It extends obliquely downward to the boundary. The bent top portion 17 is a portion that becomes a point of contact that contacts the terminal of the electronic component. The center axis 22 is parallel to the direction in which the standing portion 12 extends through the holding portion 30 from the top surface 32 to the bottom surface 34 and is a center line passing through the center of the standing portion 12 . The joint portion 18 extends parallel to the lower surface 34 from the end 13 b of the standing portion 12 on the lower surface 34 side of the holding portion 30 . The joint portion 18 is joined to a terminal of a circuit board or the like by soldering or the like, for example.

Thus, the contact pin 10 is bent between the upright portion 12 and the inclined portion 14 and bent between the inclined portion 14 and the extension portion 16 .

The projecting portion 40 is located between the inclined portion 14 of the contact pin 10 and the upper surface 32 of the holding portion 30 . That is, the projecting portion 40 and the inclined portion 14 overlap each other in plan view. Preferably, at least a portion of the projection 40 is located between the end 15 of the inclined portion 14 and the upper surface 32 of the holding portion 30 . A gap is formed between the protrusion 40 and the inclined portion 14 .

The upper surface 42 of the protrusion 40 preferably forms an inclined surface 44 that is lower on the side closer to the central axis 22 and gradually higher on the side closer to the central axis 22 at least on the side of the central axis 22 of the upright portion 12 . The entire upper surface 42 of the protrusion 40 may be the inclined surface 44 . The inclined surface 44 is preferably parallel to the inclined portion 14 of the contact pin 10 .

The bent top portion 17 of the contact pin 10 is located closer to the protrusion 40 than the central axis 22 of the standing portion 12 , and the region between the central axis 22 of the standing portion 12 and the protrusion 40 is defined as the central axis 22 when viewed from the side. is located within a region 24 extending in a direction parallel to the . For example, the bending top portion 17 is located closer to the central axis 22 of the standing portion 12 than the intermediate line 26 between the central axis 22 of the standing portion 12 and the side surface of the protruding portion 40 on the central axis 22 side of the standing portion 12 . ing.

Contact pin 10 is made of metal such as copper or gold. The holding portion 30 is made of an insulating material such as resin (for example, polyethersulfone resin (PES resin), polyetherimide resin (PEI resin), polyamideimide resin (PAI resin)). The projecting portion 40 is formed by processing the upper surface 32 of the holding portion 30 into a projecting shape, for example, but may be formed by adhering an insulating material to the upper surface 32 of the holding portion 30 .

FIG. 2 is a cross-sectional view showing a case of electrically connecting the circuit board 70 and the electronic component 80 using the socket 100 according to the first embodiment. As shown in FIG. 2 , joint portions 18 of a plurality of contact pins 10 held by holding portion 30 are joined to terminals 72 of circuit board 70 by solder 60 . In this state, the electronic component 80 such as a semiconductor device is pressed from above so that the terminal 82 of the electronic component 80 contacts the bent top portion 17 of the contact pin 10, and is fixed to the circuit board 70 with the fixing member 62 such as a screw. Thereby, the circuit board 70 and the electronic component 80 are electrically connected through the contact pins 10 .

[Comparative Example 1]
3(a) is a cross-sectional view of a socket 500 according to Comparative Example 1, and FIG. 3(b) is an enlarged view of region A in FIG. 3(a). As shown in FIGS. 3A and 3B, the contact pin 110 in the socket 500 of Comparative Example 1 includes an upright portion 112, an extension portion 116, and a joint portion 118. As shown in FIGS. The standing portion 112 penetrates the holding portion 130 from the upper surface 132 to the lower surface 134 and extends straight in a straight line. The extending portion 116 extends obliquely upward from the end 113a of the standing portion 112 on the side of the upper surface 132 of the holding portion 130, and extends obliquely downward from the bent top portion 117 that contacts the terminal of the electronic component. Therefore, the bend apex 117 is offset from the central axis 122 of the upright portion 112 . Joint portion 118 extends parallel to lower surface 134 from end 113b of upstanding portion 112 on lower surface 134 side of holding portion 130 .

4A and 4B are sectional views showing wiping of contact pin 110 in Comparative Example 1. FIG. FIG. 4(a) shows the state before wiping is performed, and FIG. 4(b) shows the state after wiping is performed. As shown in FIG. 4A, the terminal 82 of the electronic component 80 is brought into contact with the bent top portion 117 of the contact pin 110 while the joint portion 118 of the contact pin 110 is joined to the terminal 72 of the circuit board 70 by the solder 60. start. Since the bent top portion 117 is located deviated from the central axis 122 of the upright portion 112, when the terminal 82 of the electronic component 80 pushes the bent top portion 117, the bent top portion 117 will move toward the electronic component as shown in FIG. wiping (see arrow) on terminal 82 of 80; As a result, the contact between the contact pin 110 and the terminal 82 of the electronic component 80 is improved, and the electrical resistance can be stabilized.

As the electronic component 80 becomes more sophisticated, the number of contact pins 110 increases and the pitch between the contact pins 110 becomes narrower. Therefore, the area where wiping can be performed is reduced. For example, if wiping is performed beyond a predetermined area, the bent top portion 117 of the contact pin 110 may be positioned away from the terminal 82 of the electronic component 80 and electrical continuity may not be established. Also, adjacent contact pins 110 may come into contact with each other.

In the contact pin 110 of Comparative Example 1, the wiping amount becomes large, and wiping may be performed beyond the predetermined wiping area.

[Comparative Example 2]
FIG. 5(a) is a cross-sectional view of a socket 600 according to Comparative Example 2, and FIG. 5(b) is an enlarged view of region A in FIG. 5(a). As shown in FIGS. 5A and 5B, the contact pin 110a in the socket 600 according to Comparative Example 2 has the same shape as the contact pin 10 in the socket 100 according to Example 1. FIG. That is, the contact pin 110a includes an upright portion 112, an inclined portion 114, an extending portion 116 having a bent top portion 117 that contacts a terminal of an electronic component, and a joint portion 118 that is joined to a terminal of a circuit board or the like. have. However, in the socket 600 according to Comparative Example 2, no protrusion is provided between the inclined portion 114 of the contact pin 110 a and the upper surface 132 of the holding portion 130 .

6(a) and 6(b) are cross-sectional views showing wiping of the contact pin 110a in Comparative Example 2. FIG. FIG. 6(a) shows the state before wiping is performed, and FIG. 6(b) shows the state after wiping is performed. As shown in FIGS. 6(a) and 6(b), the bent top portion 117 of the contact pin 110a is positioned away from the central axis 122 of the upright portion 112, so that the terminal 82 of the electronic component 80 bends over the bent top portion 117. As it is pushed, the bend top 117 wipes (see arrow) over the terminals 82 of the electronic component 80 . As a result, the contact between the contact pin 110a and the terminal 82 of the electronic component 80 is improved, and the electrical resistance can be stabilized.

The contact pin 110a in Comparative Example 2 has more bending points than the contact pin 110 in Comparative Example 1. FIG. That is, while the contact pin 110 is bent at one point between the standing portion 112 and the extending portion 116, the contact pin 110a is bent between the standing portion 112 and the inclined portion 114 and between the inclined portion 114 and the extending portion 116. It is bent at two places between It was expected that the wiping amount would be suppressed due to bending deformation by increasing the number of bends. Sometimes.

Since the wiping amount tends to increase as the bending top portion 117 is further away from the central axis 122 of the standing portion 112 before wiping, the bending top portion 117 is held closer to the central axis 122 in order to suppress the wiping amount. It is conceivable that However, due to manufacturing errors of the contact pins 110a, warping of the electronic component 80 and/or the circuit board 70, etc., the wiping amount is suppressed by controlling the position of the bending top portion 117 with respect to the central axis 122 of the standing portion 112. It is difficult.

[Description of the effects of Example 1]
7A to 7C are cross-sectional views showing wiping of the contact pin 10 in Example 1. FIG. FIG. 7(a) shows the state before wiping is performed, and FIGS. 7(b) and 7(c) show the states after wiping is performed. As shown in FIG. 7A, the terminal 82 of the electronic component 80 is brought into contact with the bent top portion 17 of the contact pin 10 while the joint portion 18 of the contact pin 10 is joined to the terminal 72 of the circuit board 70 by the solder 60. start.

Since the bent top portion 17 is positioned deviated from the central axis 22 of the upright portion 12, when the terminal 82 of the electronic component 80 pushes the bent top portion 17, the bent top portion 17 will move toward the electronic component as shown in FIG. 7(b). The terminal 82 of 80 is wiped away from the central axis 22 of the upright portion 12 (see arrow). Since the protrusion 40 is between the inclined portion 14 and the upper surface 32 of the holding portion 30 , when the terminal 82 of the electronic component 80 pushes the bent top portion 17 , the inclined portion 14 is formed on the upper surface of the protrusion 40 . It comes to abut against surface 44 .

As shown in FIG. 7C , when the terminal 82 of the electronic component 80 further pushes the bent top portion 17 , the inclined portion 14 abuts against the projection 40 , so that the extension portion 16 is bent against the inclined portion 14 . transform. As a result, the bending top 17 wipes (see the arrow) toward the central axis 22 of the upright portion 12 in the opposite direction. As a result, the final wiping amount can be kept small.

[Simulation 1]
FIG. 8(a) is a cross section of a simulated model corresponding to Comparative Example 2, and FIG. 8(b) is a cross section of a simulated model corresponding to Example 1. FIG. 8A and 8B, the direction in which the holding portion 230 and the rigid body 280 face each other is defined as the Y-axis direction, and the direction perpendicular to the Y-axis direction and in which the inclined portion 214 is bent with respect to the upright portion 212 is defined as the X direction. Axial direction. In the simulation, the displacement amount of the contact pin 210 in the X-axis direction was measured when the contact pin 210 whose bottom was fixed to the holding portion 230 was pressed from above with a pressure of 4 MPa by the rigid body 280 . It is assumed that the contact pin 210 is made of copper, the holding portion 230 is made of PES resin, and the rigid body 280 is a non-deformable member.

The shape of the contact pin 210 is as follows. Note that the reference numerals (L1, etc.) indicating each dimension of the contact pin 210 are shown only in FIG. 8(a), and are omitted in FIG. 8(b) for the sake of clarity.
Y-axis length L1 of standing portion 212: 0.28 mm
Length L2 in the X-axis direction from the standing portion 212 to the end of the inclined portion 214: 0.22 mm
Length L3 in the Y-axis direction from the inclined portion 214 to the vertex of the bending top portion 217: 0.31 mm
Length L4 in the X-axis direction from the vertex of the bending top portion 217 to the tip of the extension portion 216: 0.12 mm
Width W1 of contact pin 210: 0.05 mm
The length of the contact pin 210 in the depth direction of the paper surface (the direction perpendicular to the X-axis and the Y-axis): 0.2 mm
Angle α between standing portion 212 and inclined portion 214: 110°
Angle β between inclined portion 214 and extended portion 216: 98°
Angle γ at bending top 217 of extension 216: 90°

In the model corresponding to the first embodiment shown in FIG. 8B, the protrusion 240 between the inclined portion 214 and the holding portion 230 is made of the same PES resin as the holding portion 230, and the entire upper surface is an inclined surface. and the shape is as follows.
Width W2 of gap between protrusion 240 and standing portion 212: 0.02 mm
Width W3 of projection 240 in X-axis direction: 0.2 mm
Length L5 of the shortest part of the protrusion 240 in the Y-axis direction: 0.24 mm
Length L6 of the longest part of the protrusion 240 in the Y-axis direction: 0.3 mm

9A shows the simulation result of the model corresponding to Comparative Example 2, and FIG. 9B shows the simulation result of the model corresponding to Example 1. FIG. 9(a) and 9(b), the position of the bending top 217 in the initial state before the contact pin 210 is pushed by the rigid body 280 is indicated by a dashed line. The amount of displacement in the X-axis direction is the amount of displacement from this initial state, and the darker the hatched area, the greater the amount of displacement in the X-axis direction.

As shown in FIGS. 9A and 9B, the model corresponding to Example 1 has a smaller amount of displacement in the X-axis direction near the bending top 217 than the model corresponding to Comparative Example 2. became. It is considered that this is due to the reason described above. That is, when the rigid body 280 pushes the contact pin 210, the bend top 217 wipes in the +X direction. In the model corresponding to the first embodiment, since there is a projection 240 between the inclined portion 214 and the holding portion 230, when the rigid body 280 pushes the contact pin 210, the inclined portion 214 abuts against and is supported by the projection 240. become. As a result, the bend top 217 is wiping in the -X direction, which is the opposite of the wiping direction up to now, and as a result, in the model corresponding to Example 1, the displacement of the bend top 217 in the X-axis direction is small. presumably resulted in

As described above, according to the first embodiment, the contact pin 10 includes the standing portion 12, the inclined portion 14, and the extending portion 16, as shown in FIG. 1(b). The standing portion 12 extends through the holding portion 30 from an upper surface 32 (first surface) to a lower surface 34 (second surface). The inclined portion 14 extends obliquely upward with respect to the upper surface 32 from the end 13 a of the standing portion 12 on the upper surface 32 side of the holding portion 30 . The extension 16 has a bent top 17 that contacts a terminal 82 of the electronic component 80 and extends from the end 15 of the ramp 14 opposite the upright 12 to the bent top 17 toward the central axis 22 of the upright 12 . It extends obliquely upward with respect to the upper surface 32 of the holding portion 30 . A projecting portion 40 (first projecting portion) is provided between the inclined portion 14 and the upper surface 32 of the holding portion 30 . 7(a) to 7(c), when the bent top portion 17 is pushed by the terminal 82 of the electronic component 80, the inclined portion 14 comes into contact with the projection portion 40, thereby wiping the bent top portion 17. The direction will now flip in the opposite direction. Therefore, the final wiping amount of the bending top portion 17 can be kept small. Moreover, since the bent top portion 17 wipes the top of the terminal 82 of the electronic component 80, the contact between the bent top portion 17 and the terminal 82 of the electronic component 80 is improved, and the electrical resistance can be stabilized.

In addition, in Example 1, as shown in FIG. 1B, the bending top portion 17 is located closer to the protrusion 40 than the central axis 22 of the standing portion 12 . As a result, after the bending top portion 17 is wiped in the direction away from the central axis 22 of the standing portion 12, the inclined portion 14 abuts against the projection portion 40, thereby wiping in the direction of the central axis 22 more reliably. be able to.

[Simulation 2]
FIGS. 10A to 10C are simulation results of wiping of the bending top portion 217 when the positions of the protrusions 240 are changed. 10(a) to 10(c) show the state at the moment when the contact pin 210 contacts the projection 240 after being pushed by the rigid body 280 and starting wiping. 10(a) to 10(c) show the state when the rigid body 280 further pushes the contact pin 210 from the state shown in the upper drawing. In each figure, the position where the bending top 217 and the rigid body 280 are in contact is indicated by a dashed line, and in the lower drawings of FIGS. is shown.

In Simulation 2, the contact pin 210 had the same shape as in Simulation 1 above, and the rigid body 280 pressed the contact pin 210 with a pressure of 4 MPa as in Simulation 1 above.

In FIG. 10(a), the protrusion 240 is placed closer to the upright portion 212 of the contact pin 210 and has the following shape.
Width W2 of gap between protrusion 240 and standing portion 212: 0.01 mm
Width W3 of projection 240 in X-axis direction: 0.1 mm
Length L5 of the shortest part of the protrusion 240 in the Y-axis direction: 0.24 mm
Length L6 of the longest part in the Y-axis direction of the protrusion 240: 0.27 mm

In FIG. 10(b), the protrusion 240 is arranged near the end 215 of the inclined portion 214 opposite to the upright portion 212, and has the following shape.
Width W2 of gap between protrusion 240 and standing portion 212: 0.11 mm
Width W3 of projection 240 in X-axis direction: 0.1 mm
Length L5 of the shortest part of the protrusion 240 in the Y-axis direction: 0.27 mm
Length L6 of the longest part of the protrusion 240 in the Y-axis direction: 0.3 mm

In FIG. 10(c), similarly to FIG. 10(b), the protruding portion 240 is placed closer to the end 215 of the inclined portion 214 opposite to the upright portion 212, and the shape is as follows.
Width W2 of gap between protrusion 240 and standing portion 212: 0.17 mm
Width W3 of projection 240 in X-axis direction: 0.05 mm
Length L5 of the shortest part of the protrusion 240 in the Y-axis direction: 0.29 mm
Length L6 of the longest part of the protrusion 240 in the Y-axis direction: 0.3 mm

As shown in FIG. 10( a ), when the protrusion 240 is not positioned between the end 215 of the inclined portion 214 and the holding portion 230 , when the rigid body 280 pushes the top of the bend 217 , the top of the bend 217 was difficult to wipe in the -X direction. On the other hand, as shown in FIGS. 10(b) and 10(c), at least a portion of the protrusion 240 is positioned between the end 215 of the inclined portion 214 and the holding portion 230 so that the rigid body 280 is bent at the top portion 217. The end 215 of the ramp 214 is supported by the projection 240 when the is pushed. As a result, the bend top 217 is easily wiped in the -X direction.

From this result, in order to reverse the wiping direction of the bending top portion 217 and suppress the wiping amount, it is preferable to arrange at least a part of the projection portion 240 between the end 215 of the inclined portion 214 and the holding portion 230 . I understand.

In Example 1, as shown in FIG. 1B, at least a portion of the protrusion 40 is located between the end 15 of the inclined portion 14 and the upper surface 32 of the holding portion 30 . As a result, when the bent top portion 17 is pushed by the terminal 82 of the electronic component 80 and the inclined portion 14 comes into contact with the projection portion 40 , the end 15 of the inclined portion 14 is supported by the projection portion 40 . The wiping direction is easily reversed. Therefore, the final wiping amount of the bending top portion 17 can be kept small.

Further, in Example 1, a gap is formed between the inclined surface 44 of the protrusion 40 and the inclined portion 14 as shown in FIG. 1B. 7(a) to 7(c), when the terminal 82 of the electronic component 80 presses the bent top portion 17, the bent top portion 17 initially moves away from the central axis 22 of the upright portion 12. After moving, it becomes easier to move toward the center axis 22 . Therefore, the final wiping amount of the bending top portion 17 can be kept small.

Moreover, in Example 1, as shown in FIG. As a result, when the bent top portion 17 is pushed by the terminal 82 of the electronic component 80 and the inclined portion 14 abuts against the projecting portion 40 , the inclined portion 14 comes into contact with the inclined surface 44 . Therefore, it is possible to reduce the damage caused by the inclined portion 14 coming into contact with the protrusion 40 . It is preferable that the inclined surface 44 of the protrusion 40 is parallel to the inclined portion 14 in order to reduce damage to the inclined portion 14 . The term "parallel" is not limited to being completely parallel, but also includes deviation from parallel due to a manufacturing error.

11(a) is a cross-sectional view of a socket 200 according to Example 2, and FIG. 11(b) is an enlarged view of area A in FIG. 11(a). As shown in FIGS. 11( a ) and 11 ( b ), the socket 200 has projections 50 projecting from the upper surface 32 of the holding portion 30 . The height from the upper surface 32 of the holding portion 30 to the upper surface 52 of the protrusion 50 is higher than the height from the upper surface 32 of the holding portion 30 to the upper surface 42 of the protrusion 40, and the height from the upper surface 32 of the holding portion 30 to the bent top portion 17. lower than the height of The projecting portion 50 is formed by processing the upper surface 32 of the holding portion 30 into a projecting shape, for example, but may be formed by adhering an insulating material to the upper surface 32 of the holding portion 30 . Since other configurations are the same as those of the first embodiment, description thereof is omitted.

FIGS. 12(a) to 12(c) are cross-sectional views showing wiping of the contact pin 10 in Example 2. FIG. As shown in FIGS. 12A to 12C, in the second embodiment, as in the first embodiment, when the terminal 82 of the electronic component 80 pushes the bent top portion 17, the wiping direction of the bent top portion 17 changes halfway. Flip. Therefore, the final wiping amount of the bending top portion 17 can be reduced. In addition, since the projection 50 is provided on the upper surface 32 of the holding portion 30 , the projection 50 limits the pushing amount when the contact pin 10 is pushed by the electronic component 80 .

According to the second embodiment, as shown in FIG. 11B, a protrusion 50 (second protrusion) protruding from the upper surface 32 of the holding section 30 is provided. The height from the upper surface 32 of the holding portion 30 increases in the order of the upper surface 42 of the protrusion 40, the upper surface 52 of the protrusion 50, and the bent top portion 17. As shown in FIG. As a result, as shown in FIGS. 12A to 12C, the amount of pushing of the contact pin 10 by the electronic component 80 is limited by the protrusion 50, so that the distance between the electronic component 80 and the holding portion 30 is appropriately set. easily controllable in size,

Although the embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and various modifications and variations can be made within the scope of the gist of the present invention described in the scope of claims. Change is possible.

REFERENCE SIGNS LIST 10 contact pin 12 upright portion 13a, 13b end 14 inclined portion 15 end 16 extended portion 17 bent top portion 18 joint portion 22 central axis 24 area 26 intermediate line 30 holding portion 32 upper surface 34 lower surface 40 protrusion 42 upper surface 44 inclined surface 50 protrusion Part 52 Upper surface 60 Solder 62 Fixing member 70 Circuit board 72 Terminal 80 Electronic component 82 Terminal 110, 110a, 210 Contact pin 112, 212 Upright part 114, 214 Inclined part 116, 216 Extension part 117, 217 Bent top part 118 Joint part 122 Central shaft 130, 230 Holding part 240 Protruding part 280 Rigid body 100, 200, 500, 600 Socket

Claims (8)

a plurality of contact pins;
a holding portion that holds the plurality of contact pins;
a first projecting portion projecting upward from the first surface of the holding portion;
The plurality of contact pins includes an upright portion passing through the holding portion from the first surface to the second surface, and an end of the upright portion on the first surface side of the holding portion that is inclined with respect to the first surface. The holder has an upwardly extending sloping portion and a top portion that contacts a terminal of an electronic component, and extends from the end of the sloping portion opposite to the upright portion to the top portion toward the central axis of the upright portion. an extension extending obliquely upward with respect to the first surface,
The socket, wherein the first protrusion is provided between the inclined portion and the first surface of the holding portion. 2. The socket according to claim 1, wherein said top portion is located closer to said first projection than a central axis of said standing portion. 3. The socket according to claim 1 or 2, wherein at least a portion of said first protrusion is located between said end of said inclined portion and said first surface of said holding portion. 4. The socket according to any one of claims 1 to 3, wherein a gap is formed between the upper surface of the first protrusion and the inclined portion. 5. The socket according to any one of claims 1 to 4, wherein the upper surface of the first protrusion has a sloped surface that is lower on the side closer to the upright portion. 6. The socket according to claim 5, wherein said slanted surface of said first protrusion is parallel to said slanted portion. comprising a second projecting portion projecting upward from the first surface of the holding portion;
The socket according to any one of claims 1 to 6, wherein the upper surface of the first protrusion, the upper surface of the second protrusion, and the top are separated from the first surface of the holding portion in this order. 8. The socket according to any one of claims 1 to 7, wherein said plurality of contact pins are made of gold or copper.

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