JP2022145929A5 - - Google Patents
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- Publication number
- JP2022145929A5 JP2022145929A5 JP2022128266A JP2022128266A JP2022145929A5 JP 2022145929 A5 JP2022145929 A5 JP 2022145929A5 JP 2022128266 A JP2022128266 A JP 2022128266A JP 2022128266 A JP2022128266 A JP 2022128266A JP 2022145929 A5 JP2022145929 A5 JP 2022145929A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- interlayer conductive
- substrate
- wiring layers
- gaming machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011229 interlayer Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
Description
本発明は、複数の配線層と、それら複数の配線層を互いに導通させるための板厚方向の層間導通部とを有する基板を備え、前記基板上に、第１電子部品と第２電子部品とを配置した遊技機において、前記複数の層間導通部のうち、前記第２電子部品の配置領域内に配置される特定層間導通部を介して前記第１電子部品と前記第２電子部品とを接続したものである。 The present invention comprises a substrate having a plurality of wiring layers and an interlayer conductive portion in the plate thickness direction for connecting the plurality of wiring layers to each other, and a first electronic component and a second electronic component are mounted on the substrate. in a gaming machine in which the first electronic component and the second electronic component are connected via a specific interlayer conductive portion among the plurality of interlayer conductive portions arranged within the arrangement region of the second electronic component. It is what I did .
Claims (1)
前記基板上に、第１電子部品と第２電子部品とを配置した
遊技機において、
前記複数の層間導通部のうち、前記第２電子部品の配置領域内に配置される特定層間導通部を介して前記第１電子部品と前記第２電子部品とを接続した
ことを特徴とする遊技機。 A substrate having a plurality of wiring layers and an interlayer conductive portion in the plate thickness direction for connecting the plurality of wiring layers to each other,
A gaming machine in which a first electronic component and a second electronic component are arranged on the substrate,
The first electronic component and the second electronic component are connected via a specific interlayer conductive portion among the plurality of interlayer conductive portions that is arranged within an arrangement region of the second electronic component.
A gaming machine characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022128266A JP7438291B2 (en) | 2020-03-30 | 2022-08-10 | gaming machine |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020061264A JP7123999B2 (en) | 2020-03-30 | 2020-03-30 | game machine |
| JP2022128266A JP7438291B2 (en) | 2020-03-30 | 2022-08-10 | gaming machine |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020061264A Division JP7123999B2 (en) | 2020-03-30 | 2020-03-30 | game machine |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022145929A JP2022145929A (en) | 2022-10-04 |
| JP2022145929A5 true JP2022145929A5 (en) | 2023-03-31 |
| JP7438291B2 JP7438291B2 (en) | 2024-02-26 |
Family
ID=78001597
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020061264A Active JP7123999B2 (en) | 2020-03-30 | 2020-03-30 | game machine |
| JP2022128266A Active JP7438291B2 (en) | 2020-03-30 | 2022-08-10 | gaming machine |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020061264A Active JP7123999B2 (en) | 2020-03-30 | 2020-03-30 | game machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JP7123999B2 (en) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4389228B2 (en) * | 2006-11-29 | 2009-12-24 | エルピーダメモリ株式会社 | Memory module |
| JP4659802B2 (en) * | 2007-09-25 | 2011-03-30 | シャープ株式会社 | Insulating wiring board, semiconductor package using the same, and manufacturing method of insulating wiring board |
| JP2009297345A (en) * | 2008-06-16 | 2009-12-24 | Daito Giken:Kk | Board for game table, and game table equipped with the board |
| JP5665931B1 (en) * | 2013-07-31 | 2015-02-04 | 株式会社大都技研 | Amusement stand |
| JP5629878B1 (en) * | 2013-12-27 | 2014-11-26 | 株式会社大都技研 | Amusement stand |
| JP2018198844A (en) * | 2017-05-29 | 2018-12-20 | 株式会社三共 | Game machine |
| JP2019005197A (en) * | 2017-06-23 | 2019-01-17 | 株式会社三共 | Game machine |
| JP7289151B2 (en) * | 2021-02-22 | 2023-06-09 | 株式会社サンセイアールアンドディ | game machine |
| JP6936459B1 (en) * | 2021-02-22 | 2021-09-15 | 株式会社Ｔｏｒｅｒｕ | Trademark use detection device, trademark use detection method and trademark use detection program |
| JP2022128263A (en) * | 2021-02-22 | 2022-09-01 | トヨタ自動車株式会社 | Vehicle control device |
| JP2022128267A (en) * | 2021-02-22 | 2022-09-01 | 株式会社エーディエフ | Infection prevention device for bed |
| JP2022128265A (en) * | 2021-02-22 | 2022-09-01 | 古河電気工業株式会社 | protector |
-
2020
- 2020-03-30 JP JP2020061264A patent/JP7123999B2/en active Active
-
2022
- 2022-08-10 JP JP2022128266A patent/JP7438291B2/en active Active
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