JP2022144070A - Manufacturing method of semiconductor component - Google Patents

Abstract

To provide a manufacturing method of a semiconductor component capable of accurately and easily soldering and fixing the solder surfaces of a plurality of terminals to a fixing portion on a semiconductor circuit pattern.SOLUTION: A manufacturing method of a semiconductor component includes a preparation step of forming a plurality of terminals, a coupling portion that couples upper end portions of the plurality of terminals, and a connection portion positioned near a solder surface and connecting the plurality of terminals by processing a metal plate, a fixing step of soldering and fixing the solder surfaces of the plurality of terminals to a fixing portion, and a removing step of removing the coupling portion and the connecting portion. In the preparation step, the connection portion is formed at a position that does not overlap the range of the plurality of terminals in the vertical projection direction.SELECTED DRAWING: Figure 2

Description

The present invention relates to a method of manufacturing a semiconductor component in which the solder surfaces of a plurality of terminals are fixed by soldering to fixing portions on a semiconductor circuit pattern.

A semiconductor component includes a circuit pattern formed on a substrate, an electronic component such as a semiconductor mounted on the substrate, and a plurality of terminals soldered and fixed to the circuit pattern. The plurality of terminals typically includes an input/output terminal through which a relatively large current flows and a signal terminal such as a control terminal through which a small current flows. In order to make the overall size of the circuit pattern as small as possible, the terminal width of each of the plurality of terminals is designed in consideration of the magnitude of the flowing current. The line width of the fixed portion of the circuit pattern to which each terminal is soldered is also designed in consideration of the magnitude of the flowing current. That is, the line width of the signal terminal is designed to be narrower than the line width of the input/output terminal. Further, the line width of the fixed portion to which the signal terminal is soldered is narrow, and the distance between the adjacent fixed portions is short. In addition, the signal terminal has a characteristic of being easily bent due to its narrow line width and thinness.

For this reason, it is required to accurately position the signal terminal on the fixing portion to be soldered on the circuit pattern and to securely solder and fix the signal terminal.

Conventionally, in order to meet the above demands, there has been proposed a method of positioning a signal terminal by using an insulating case or a lid when soldering the signal terminal (Patent Document 1).

Japanese Utility Model Laid-Open No. 05-15446

In the method disclosed in Patent Document 1, a terminal is temporarily fixed to an insulating case or a lid, positioned, and then soldered.

However, the method of positioning the terminals using an insulating case or lid requires dedicated parts (case, lid, etc.). Moreover, after the terminals are temporarily fixed to the case or lid, it is necessary to solder the terminals and the pattern, which hinders the simplification of the work process. It is not possible to meet the need to easily solder a plurality of terminals to a circuit pattern at the same time.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a method of manufacturing a semiconductor component that can accurately and easily fix the solder surfaces of a plurality of terminals to a fixing portion on a semiconductor circuit pattern.

A method for manufacturing a semiconductor component according to one aspect of the present invention includes:
In a method for manufacturing a semiconductor component in which the solder surfaces of a plurality of terminals are fixed by soldering to a fixing portion on a semiconductor circuit pattern,
Preparation for forming the plurality of terminals, a connecting portion connecting upper end portions of the plurality of terminals, and a connection portion positioned near the solder surface and connecting the plurality of terminals by processing a metal plate. process and
a fixing step of soldering and fixing the solder surfaces of the plurality of terminals to the fixing portion;
A removing step of removing the connecting portion and the connecting portion,
In the preparation step, the connection portion is formed at a position that does not overlap the range of the plurality of terminals in the vertical projection direction.

Also, in a method of manufacturing a semiconductor component according to another aspect of the present invention, the plurality of terminals are parallel.
Further, in a method of manufacturing a semiconductor component according to still another aspect of the present invention, the plurality of terminals are control terminals through which a control current for the electronic semiconductor component flows.

Further, in the method of manufacturing a semiconductor component according to still another aspect of the present invention, in the preparation step, the connecting portion is formed so as to have an inclination angle of 30 degrees to 60 degrees with respect to the horizontal plane.

According to the manufacturing method of the present invention, a plurality of terminals having a small line width, such as signal terminals, can be accurately and easily soldered to fixed portions on a semiconductor circuit pattern without any other means for positioning. can be fixed.

FIG. 1 is a plan view of a semiconductor component 1 in which control terminals and input/output terminals are fixed by soldering and unnecessary parts are removed. FIG. 2 is a plan view of the semiconductor component 1 before the control terminal metal piece is fixed by soldering. FIG. 3 is a plan view of the semiconductor component 1 after the solder surfaces of the control terminals 15 and 16 are fixed by soldering. 4A and 4B are a perspective view and a cross-sectional view in the Y-axis direction of the control terminal metal piece 100. FIG.

A semiconductor component 1 according to one embodiment of the present invention will be described with reference to FIG.

FIG. 1 is a plan view of a semiconductor component 1 in which control terminals and input/output terminals are fixed by soldering and unnecessary parts are removed. The figure shows a state in which the semiconductor component 1 is completed. In FIG. 1, the X-axis direction is the right direction of the semiconductor component 1, the Y-axis direction is the upward direction of the short side of the semiconductor component 1, and the Z-axis direction is the direction toward the front of the semiconductor component 1 on the paper.

The semiconductor component 1 includes a metal plate 10 made of Al (aluminum), Cu (copper), or the like having good thermal conductivity, and a semiconductor circuit pattern (hereinafter referred to as circuit pattern) disposed on the metal plate 10 with an insulator 11 interposed therebetween. 12 and an electronic component 13 such as a semiconductor element mounted on the circuit pattern 12 . The semiconductor component 1 also has an input/output terminal 14 which is soldered to the circuit pattern 12 and led out, and control terminals 15 and 16 which are signal terminals.

The input/output terminal 14 is composed of input terminals 14a and 14c and an output terminal 14b. The control terminals 15 and 16 are arranged in the Y-axis direction on the left side of the semiconductor component 1, and each control terminal 15 and 16 is composed of two terminals. The control terminal 15 is composed of a first terminal 15a and a second terminal 15b, and the control terminal 16 is composed of a first terminal 16a and a second terminal 16b. The control terminals 15 and 16 correspond to the terminals of the present invention.

The input terminals 14a and 14c and the output terminal 14b are terminals through which an input current from a power supply and an output current to the outside flow. Therefore, the input/output terminal 14 has a large line width and a certain thickness.

Control terminals 15 and 16 are terminals for externally inputting a small current such as a control current (control signal) for an electronic semiconductor component. Therefore, the line width of the control terminals 15 and 16 is smaller than that of the input/output terminal 14 and the thickness thereof is thinner than that of the input/output terminal 14 .

The circuit pattern 12 includes fixing portions 12a and 12b for soldering and fixing the solder surfaces formed near the lower ends of the first terminal 15a and the second terminal 15b of the control terminal 15, respectively. Similarly, the circuit pattern 12 includes fixing portions 12c and 12d for soldering and fixing the solder surfaces formed near the lower ends of the first terminal 16a and the second terminal 16b of the control terminal 16, respectively.

The first terminal 15a and the second terminal 15b of the control terminal 15 are parallel, and the distance between them and the distance between the fixing portions 12a and 12b of the circuit pattern 12 are close as shown. In addition, these control terminals 15 are thin and easily bent, and the relative positions of the first terminal 15a and the second terminal 15b are easily changed. As will be described later, even with the control terminals 15 having such characteristics, the solder surfaces of these terminals can be accurately aligned with the fixing portions 12a and 12b and soldered reliably. The same applies to the first terminal 16a and the second terminal 16b of the control terminal 16. FIG.
The input/output terminal 14 and the control terminals 15 and 16 are formed by punching and bending a metal plate with good electrical properties such as copper alloy, and then soldered and fixed at predetermined locations.

FIG. 2 is a plan view of the semiconductor component 1 before the control terminal metal piece is fixed by soldering.

As will be described later in detail, the control terminal metal piece 100 is formed by punching and bending a single metal plate in a preparatory step.

The control terminal metal piece 100 is composed of a control terminal 15 composed of a first terminal 15a and a second terminal 15b, and a connecting portion 20 and a connecting portion 21 that connect the control terminals 15 together. The connecting portion 20 connects the upper ends of the control terminals 15 , and the connecting portion 21 connects the lower ends of the control terminals 15 . Similarly, the control terminal metal piece 101 is also composed of a control terminal 16 consisting of a first terminal 16a and a second terminal 16b, and a connecting portion 22 and a connecting portion 23 that connect the control terminals 16 to each other.

In this way, since the control terminal 15 is connected to the connecting portion 20 and the connecting portion 21, the mutual positional relationship (parallel relationship and spacing) between the first terminal 15a and the second terminal 15b constituting the control terminal 15 is determined. ) is stable without fluctuations. The control terminal 16 is also the same.

The control terminal metal strips 100 and 101 are lowered from the top as indicated by arrows in the above-described connected state and positioned at predetermined positions on the circuit pattern 12 . After that, the solder surfaces formed near the lower ends of the control terminals 15 and 16 are soldered and fixed to the fixing portions 12a and 12b and the fixing portions 12c and 12d.

FIG. 3 is a plan view of the semiconductor component 1 after the solder surfaces of the control terminals 15 and 16 are fixed by soldering.

As shown, control terminal metal pieces 100 and 101 are soldered onto the circuit pattern. At the time of soldering, the connecting portion 20 and connecting portion 21 connecting the control terminals 15 and the connecting portion 22 and connecting portion 23 connecting the control terminals 16 are not removed. Therefore, in this state, the connecting portions 20, 22 and the connecting portions 21, 23 are removed by a cutter jig or the like. After these removals are performed, the completed state of FIG. 1 is obtained.

In FIG. 2, the input/output terminals 14 are completely fixed by soldering, but unnecessary parts of these terminals are not removed. Therefore, in FIG. 3, the removal of those unnecessary portions is performed simultaneously or separately when the connecting portions 20 and 22 and the connecting portions 21 and 23 are removed.

Next, the shapes of the control terminal metal pieces 100 and 101 including the control terminals 15 and 16 will be described. Since the control terminal metal piece 100 is symmetrical with the control terminal metal piece 101, the control terminal metal piece 100 will be described below.

4A and 4B are a perspective view and a cross-sectional view in the Y-axis direction of the control terminal metal piece 100. FIG. In FIG. 4A, the portion surrounded by the dotted line is a front view of the connecting portion 21 in the normal direction.

In FIG. 4, the control terminal metal piece 100 formed by punching and bending in the preparation process includes the first terminal 15a and the second terminal 15b, the connecting portion 20, and the connecting portion, which constitute the control terminal 15. 21. A solder surface 15 e and a solder surface 15 f are formed under the first terminal 15 a and the second terminal 15 b that constitute the control terminal 15 .

The first terminal 15a and the second terminal 15b are parallel. The first terminal 15a is bent substantially vertically downward in the middle when viewed from above, and further bent substantially vertically downward near the lower end to form a flat soldering surface 15e for soldering. Similarly, a flat solder surface 15f is also formed on the second terminal 15b.

The control terminal metal piece 101 also has a similar configuration.

The connecting portion 20 is left to connect the upper ends of the first terminal 15a and the second terminal 15b during punching. The connecting portion 21 is left so as to connect (connect) the lower end portions of the first terminal 15a and the second terminal 15b during the punching process. Specifically, the connecting portion 21 is located near the solder surfaces 15e and 15f and connects the lower ends of the first terminal 15a and the second terminal 15b. The connecting portion 20 and the solder surfaces 15e and 15f are parallel to the horizontal plane H, and the connecting portion 21 is bent upward and to the left at an angle α of 45 degrees with respect to the horizontal plane H. .

As shown in FIG. 4B, the configuration of the control terminal metal piece 100 including the control terminal 15 is such that, in its cross section, a range A1 of the first terminal 15a and the second terminal 15b in the vertical projection direction and a range A1 of the first terminal 15a and the second terminal 15b It can be divided into a range A2 that does not overlap with the first terminal 15a and the second terminal 15b in the vertical projection direction. When divided in this way, the first terminal 15a and the second terminal 15b are positioned within the range A1, and the connection portion 21 is inclined upward and to the left at an angle α of 45 degrees with respect to the horizontal plane H. , within the range A2.

In the preparation process, the control terminal metal strips 100 and 101 having the above configuration are each formed by processing one metal plate.

The control terminal metal pieces 100 and 101 having the above configuration formed in the preparation process are soldered and fixed to the fixing portions 12a to 12d in the next fixing process (FIG. 2). That is, as shown in FIGS. 2 and 4, the solder surface 15e of the first terminal 15a is aligned with the fixed portion 12a of the circuit pattern 12, and at the same time, the solder surface 15f of the second terminal 15b is aligned with the circuit pattern 12. They are aligned with the fixing portion 12d and then fixed by soldering their solder surfaces.

After the fixing process is completed, the removal process is started.

FIG. 3 shows the state after the fixing step, and in the state shown in FIG. 3, the connecting portion 20 and the connecting portion 21 are removed by a cutting jig such as a cutter. In FIG. 4, the five cutting lines of the connecting portion 20 by the cutting jig are the cutting lines C1, and the cutting lines of the connecting portion 21 are the cutting lines C2. Note that the connecting portion 20 only needs to connect the ends of the first terminal 15a and the second terminal 15b. It's fine if you have it.

In cutting the connecting portion 21, the connecting portion 21 is inclined upward and leftward by 45 degrees with respect to the horizontal plane H as shown in FIG. Therefore, a wide space is formed around the connecting portion 21 into which the cutting jig can be inserted. Thereby, the workability of removing the connecting portion 21 is improved. Since the connecting portion 20 protrudes outside the metal plate 10, it can be easily removed. In this removing process, unnecessary portions protruding to the sides of the input/output terminals 14 are also removed.

As described above, the control terminal metal strips 100 and 101 including the control terminals 15 and 16 are formed in advance by metal working a single metal plate (preparation step). Metal pieces 100 and 101 are fixed by soldering (fixing step). Subsequently, in FIG. 3, the connecting portions 20 and 22, the connecting portions 21 and 23, and other unnecessary portions are removed (removal step).

Among the above steps, in the fixing step, the first terminal 15a and the second terminal 15b constituting the control terminal 15 are connected at two points, the connecting portion 20 and the connecting portion 21, so that the terminals 15a and 15b are relative position does not change. Therefore, the positional relationship does not change during soldering. Therefore, alignment during soldering is accurate and easy.

In addition, in the removing step, a wide space is formed around the connecting portion 21 into which a cutting jig can be inserted, so the workability of removing the connecting portion 21 is improved.

The same applies to the control terminal 16 as well.

As described above, according to the method of the present embodiment, a plurality of terminals having a small line width, such as signal terminals, can be accurately and easily fixed to the fixing portion on the semiconductor circuit pattern by soldering.

In this embodiment, the control terminal 15 is configured by arranging two terminals 15a and 15b in parallel, but three or more control terminals may be arranged in parallel. In this case, in the preparation process, three or more control terminals are connected by one connecting portion and one connecting portion.

Further, in the present embodiment, the connecting portion 21 is inclined 45 degrees to the upper left with respect to the horizontal plane H. However, if the angle .alpha. good. Therefore, depending on the type of cutting jig, this angle α can be selected from the range of 30 to 60 degrees with respect to the horizontal plane.

10: metal plates 15, 16: control terminals (terminals of the present invention)
15a, 16a: first terminals 15b, 16b: second terminals 20, 22: connection portion 21: connection portion 15e, 15f: solder surfaces 100, 101: control terminal metal pieces C1, C2: cutting line

Claims (4)

In a method for manufacturing a semiconductor component in which the solder surfaces of a plurality of terminals are fixed by soldering to a fixing portion on a semiconductor circuit pattern,
Preparation for forming the plurality of terminals, a connecting portion connecting upper end portions of the plurality of terminals, and a connection portion positioned near the solder surface and connecting the plurality of terminals by processing a metal plate. process and
a fixing step of fixing the solder surfaces of the plurality of terminals to the fixing portion by soldering;
A removing step of removing the connecting portion and the connecting portion,
A method of manufacturing a semiconductor component, wherein, in the preparation step, the connecting portion is formed at a position that does not overlap a range of the plurality of terminals in a vertical projection direction. 2. The method of manufacturing a semiconductor component according to claim 1, wherein said plurality of terminals are parallel. 3. The method of manufacturing a semiconductor component according to claim 1, wherein said plurality of terminals are control terminals through which a control current of said electronic semiconductor component flows. 4. The method of manufacturing a semiconductor component according to claim 1, wherein in said preparing step, said connecting portion is formed so as to have an inclination angle of 30 degrees to 60 degrees with respect to a horizontal plane.

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