JP2022143624A - Package, electronic component, and manufacturing method - Google Patents

Abstract

To provide a package in which an inspector can easily see a bonding point, an electronic component, and a manufacturing method.SOLUTION: The package includes a housing portion having a peripheral wall with a mounting surface surrounding an opening of a housing space capable of housing an electronic element, a cap having a slit surrounding the opening and placed on the mounting surface, and a sealing portion that is bonded to the mounting surface to fill a slit and hermetically sealing the cap in the housing portion.SELECTED DRAWING: Figure 11

Description

The present disclosure relates to packages, electronic components, and manufacturing methods.

2. Description of the Related Art Among components such as electronic components, there are known components in which an element is airtightly housed in a package.
For example, Patent Literature 1 discloses an airtightly sealed housing that airtightly accommodates a semiconductor chip.

JP 2013-258435 A

In the airtightly sealed housing disclosed in Patent Document 1, a metal lid for airtight sealing is joined to the upper surface of the opening edge of the housing body.
However, in the hermetic sealing disclosed in Patent Literature 1, since the joints are hidden by the metal lid for hermetic sealing, it is difficult for the inspector to visually recognize the joints after sealing.

In view of any of the above problems, an object of the present disclosure is to provide a package, an electronic component, and a manufacturing method that allow an inspector to easily visually recognize joints.

A package according to an aspect of the present disclosure includes a housing portion including a peripheral wall having a joint surface surrounding an opening of a housing space capable of housing an electronic element, and a slit surrounding the opening, and is mounted on the mounting surface. and a sealing portion that is joined to the mounting surface so as to fill the slit and hermetically seals the cap to the accommodating portion.

A manufacturing method according to an aspect of the present disclosure stores the electronic device in a housing portion including a peripheral wall having a mounting surface surrounding an opening of a housing space capable of housing the electronic device, and includes a plurality of pre-processing slits. The cap is placed on the mounting surface so that the plurality of pre-processing slits surround the opening, the pre-processing cap is airtightly sealed in the storage section, and the plurality of processing is performed in the airtight sealing. While forming a slit along the front slit, the sealing portion is joined to the mounting surface so as to fill the slit.

According to the above aspect, the inspector can easily visually recognize the joint.

1 is a plan view of a package according to a first embodiment; FIG. FIG. 2 is a cross-sectional view taken along line II-II of FIG. 1; It is a flow chart of a manufacturing method concerning a first embodiment. FIG. 10 is a plan view of a housing section housing an electronic element in a step of housing the electronic element according to the first embodiment; FIG. 5 is a cross-sectional view taken along line VV of FIG. 4; FIG. 10 is a plan view of the accommodating portion on which the unprocessed cap is placed in the step of placing the unprocessed cap of the first embodiment; FIG. 7 is a cross-sectional view taken along line VII-VII of FIG. 6; FIG. 10 is a plan view of the accommodating portion in which the pre-processing cap is sealed in the airtight sealing step of the first embodiment; FIG. 4 is a plan view of a package according to a comparative example; FIG. 10 is a cross-sectional view taken along line XX of FIG. 9; It is a top view of the package concerning a second embodiment. It is a flow chart of the manufacturing method concerning a third embodiment.

Various embodiments according to the present disclosure will be described below with reference to the drawings.

<First embodiment>
A first embodiment according to the present disclosure will be described below with reference to FIGS. 1 to 8. FIG.

(Construction of electronic components and packages)
As shown in FIGS. 1 and 2, the electronic component 9 has a package 8 .
The package 8 includes a housing portion 1 , a cap 2 and a sealing portion 3 .
For example, electronic component 9 may further comprise electronic element 4 within package 8 .
For example, the electronic component 9 may include a hybrid IC for microwave communication equipment as the electronic element 4 .

(Accommodation part)
The housing portion 1 includes a peripheral wall 11 having a mounting surface SA.
The placement surface SA surrounds the opening OP of the accommodation space VV that can accommodate the electronic element 4 .

For example, the container 1 may be made of metal.
For example, the housing portion 1 may have an opening OP on the +Z direction side.
For example, the mounting surface SA may be the surface of the peripheral wall 11 on the +Z direction side.
For example, the housing portion 1 may have the placement surface SA on the +Z direction side and the bottom surface S2 on the -Z direction side.
Note that the +Z direction may be the upward direction and the −Z direction may be the downward direction.

For example, the accommodation space VV may be a space defined by the bottom surface S<b>2 and the inner peripheral surface S<b>1 of the peripheral wall 11 .
For example, the bottom surface S2 may be connected to the inner peripheral surface S1.
For example, the accommodation space VV may have a rectangular parallelepiped shape.

For example, the placement surface SA may surround the opening OP when viewed from the cap 2 side.
For example, the opening OP may have a rectangular shape.

For example, the placement surface SA may be a surface facing the cap 2 .
For example, the placement surface SA may be a surface facing the +Z direction.

(cap)
The cap 2 has a slit SLM surrounding the opening OP.
The cap 2 is mounted on the mounting surface SA.

For example, the cap 2 may be metal.
For example, the cap 2 may have a plate shape with plate thicknesses in the ±Z directions and a rectangular plate surface.

For example, the slits SLM may be formed by processing a plurality of pre-machining slits SL of a pre-machining cap, which is a base material before processing the cap 2 .
For example, the slit SLM may be a trace of the pre-processing slit SL formed by irradiating the pre-processing slit SL of the pre-processing cap with a laser to melt the pre-processing cap.
For example, the slit SLM may extend so as to connect a plurality of pre-machining slits SL in the pre-machining cap.
For example, the slit SLM may have a ring shape surrounding the opening OP when the cap 2 is viewed from the +Z direction side.
For example, the slit SLM may be positioned slightly outside the inner peripheral surface S1 of the peripheral wall 11 .

(sealing part)
The sealing portion 3 is joined to the mounting surface SA so as to fill the slit SLM.
The sealing portion 3 hermetically seals the cap 2 to the housing portion 1 .

For example, the inner peripheral surface S<b>3 of the sealing portion 3 may be substantially flush with the inner peripheral surface S<b>1 of the peripheral wall 11 .
For example, the sealing portion 3 may contain an alloy of the cap 2 and the housing portion 1 .
For example, the sealing portion 3 may be formed by irradiating a plurality of pre-processing slits SL of the pre-processing cap with a laser to melt the pre-processing cap and fill the pre-processing slits SL.
For example, the sealing portion 3 may be exposed to the +Z direction side surface of the package 8 so as to be visible from the +Z direction side.

(Production method)
A method for manufacturing the electronic component 9 in this embodiment will be described.
The method for manufacturing the electronic component 9 in this embodiment is carried out according to the flow shown in FIG.

First, as shown in FIGS. 4 and 5, an operator places the electronic element 4 in the housing portion 1 having the peripheral wall 11 having the mounting surface SA surrounding the opening OP of the housing space VV capable of housing the electronic element 4. Store (ST01: step of storing electronic elements).

Next, as shown in FIGS. 6 and 7, the operator places the pre-processing cap 2a having the plurality of pre-processing slits SL on the mounting surface SA so that the plurality of pre-processing slits SL surrounds the opening OP. Place (ST02: step of placing the pre-processing cap).

For example, when viewing the pre-processing cap 2a from the +Z direction side, a plurality of pre-processing slits SL may be arranged so as to surround the opening OP.
For example, the plurality of pre-machining slits SL may be arranged slightly outside the inner peripheral surface S<b>1 of the peripheral wall 11 .

For example, the pre-machining cap 2a may include a thin portion 21 having a small plate thickness between the plurality of pre-machining slits SL.
For example, in the unprocessed cap 2a, the plate thickness of the thin portion 21 may be thinner than the plate thickness of the regions outside and inside the region where the plurality of pre-process slits SL are arranged.

For example, each pre-processing slit SL may have a shape extending toward another adjacent pre-processing slit SL.
For example, a plurality of pre-processing slits SL may be arranged on each side of the rectangular shape with the thin portion 21 interposed therebetween.

Next, as shown in FIG. 8, the operator hermetically seals the pre-processing cap 2a to the housing portion 1 (ST03: step of hermetically sealing).
In ST03, the operator joins the sealing portion 3 to the mounting surface SA so as to fill the slits SLM while forming the slits SLM along the plurality of pre-processing slits SL (ST03A: Place the sealing portion surface).
Here, the cap 2 is formed by hermetically sealing the pre-processing cap 2a.

For example, in ST03, the operator irradiates a laser across a plurality of pre-processing slits SL to melt the pre-processing cap 2a to form the slits SLM, while filling the formed slits SLM with the sealing portion 3. It may be bonded to the mounting surface SA.
For example, in ST03, the slit SLM may be formed by melting the thin portion 21 with a laser and connecting the adjacent pre-processing slit SL to another pre-processing slit SL.
At that time, the slit width of the pre-processing slit SL in the pre-processing cap 2a, the number of the pre-processing slit SL, the thin portion 21, and the like may be optimized in advance according to the irradiation energy of the laser.

For example, an electronic component 9 comprising a package 8 may be manufactured as a result of ST03 being performed.

(Action and effect)
According to the package 8 of this embodiment, the inspector can visually recognize the state of the sealing portion 3 filling the slit SLM from the cap 2 side of the package 8 .
Therefore, the inspector can easily visually recognize the joint.

As a comparative example, the boundary between the housing portion and the pre-processing cap is irradiated with a laser LB from an oblique angle of 45 degrees to melt the pre-processing cap and create an alloy with the housing portion, resulting in airtight sealing as shown in FIG. is performed.
In this case, after airtight sealing, an inspector needs to visually confirm the appearance of the interface from an oblique direction, which is difficult.
For this reason, it may flow to the post-process while the sealing is insufficient, and a defect may be found in the subsequent airtightness test.

In contrast to this comparative example, according to the present embodiment, as described above, the inspector can easily visually recognize the joint.
Furthermore, according to this embodiment, the yield is improved by improving the visibility.
As in this embodiment, for example, if the degree of filling in the slit SLM can be visually recognized from directly above, the inspector can easily identify the location where the airtightness is not achieved, and the location where the airtightness is not achieved can be resealed. yield is improved.

Further, according to one example of the present embodiment, the inner peripheral surface S3 of the sealing portion 3 is substantially flush with the inner peripheral surface S1 of the peripheral wall 11 .
Therefore, the cutoff frequency of the package 8 can be related to the size of the opening OP of the accommodation space VV.

In the case of the comparative example described above, as shown in FIG. 10, the boundary between the housing portion and the cap where the laser LB hits is joined, but the area immediately inside the boundary is affected by the thermal stress caused by the laser LB and the flatness of the housing portion and the cap. , a gap is likely to occur between the accommodating portion and the cap.
Originally, the cutoff frequency is determined by the width of W1, but if a gap occurs between the receiving portion and the cap as in the comparative example, the cutoff frequency is determined by the width of W2 due to the effect of the gap between the receiving portion and the cap. and causes the cutoff frequency to drop.
Due to such a decrease in the cutoff frequency, the frequency propagating through space also decreases in the comparative example.
In general, the lower the frequency, the higher the gain of the amplifier. Therefore, if the frequency propagating in space decreases as in the comparative example, for example, if the amplifier is placed in a package, oscillation or It causes resonance.

In contrast to this comparative example, according to one example of the present embodiment, as described above, the cutoff frequency in the package 8 can be substantially related to the size of the opening OP of the accommodation space VV.
Therefore, the package 8 can suppress a decrease in cutoff frequency during hermetic sealing.

Further, according to the example of the present embodiment, since the sealing portion 3 contains an alloy of the housing portion 1 and the cap 2 , the housing portion 1 and the cap 2 can be integrated through the sealing portion 3 .
Therefore, the package 8 can hermetically seal the gap between the housing portion 1 and the cap 2 .

Further, according to one example of the present embodiment, the pre-machining cap 2a includes the thin portion 21 having a small plate thickness between the plurality of pre-machining slits SL. It is easy to provide the crossover sealing portion 3 .

Further, according to the example of the present embodiment, since the thin portion 21 is melted by the laser, the package 8 can be hermetically sealed on substantially the same surface as the inner peripheral surface S1 of the peripheral wall 11 .
Therefore, in the manufactured package 8, it is difficult to form a gap between the accommodating portion 1 and the cap 2, and the inner wall of the package 8 is difficult to widen, so that the cutoff frequency can be suppressed from being lowered.

Further, according to one example of the present embodiment, the electronic component 9 includes a hybrid IC for microwave communication equipment as the electronic element 4 inside the package 8 capable of suppressing a decrease in cutoff frequency. Oscillation and resonance in the hybrid IC for equipment can be suppressed.

<Modification>
In the example of the above-described embodiment, the electronic component 9 includes a hybrid IC for microwave communication equipment as the electronic element 4, but may include any electronic element as long as it is an electronic element. It may be applied to general package products used in

In the example of the embodiment described above, the accommodation space VV has a rectangular parallelepiped shape, but may be any space as long as it can accommodate the electronic element 4 .
As a variant, the accommodation space VV may have a cubic shape.

In the example of the embodiment described above, the cap 2 has a rectangular plate surface, but may have any shape.
As a modification, the cap 2 may have a square plate surface.

In the example embodiment described above, the slit SLM is filled with the encapsulation 3, but in the slit SLM filled with the encapsulation 3, the package 8 may have any appearance.
Alternatively, in a slit SLM filled with encapsulation 3, the package 8 may have grooves or steps.
As another variant, in a slit SLM filled with encapsulant 3, the package 8 may have regions of discontinuity in color, material and surface roughness.

<Second embodiment>
Hereinafter, as a second embodiment, an embodiment of the minimum configuration of the package according to the present disclosure will be described with reference to FIG. 11 .

The package 108 includes a housing portion 101 , a cap 102 and a sealing portion 103 .
The housing portion 101 includes a peripheral wall 111 having a mounting surface SA surrounding an opening OP of a housing space VV capable of housing an electronic element.
The cap 102 has a slit SLM1 surrounding the opening OP1 and is mounted on the mounting surface SA1.
The sealing portion 103 is joined to the mounting surface SA1 so as to fill the slit SLM1, and hermetically seals the cap 102 to the accommodating portion 101. As shown in FIG.

According to the package 108 of this embodiment, the state of the sealing portion 103 filling the slit SLM1 can be visually recognized from the cap 102 side.
Therefore, the inspector can easily visually recognize the joint.

<Third Embodiment>
Hereinafter, an embodiment of the minimum configuration of the manufacturing method according to the present disclosure will be described as a third embodiment.
The manufacturing method in this embodiment is carried out according to the flow shown in FIG.

First, an operator puts an electronic element into a housing portion having a peripheral wall having a mounting surface surrounding an opening of a housing space capable of housing the electronic element (ST101).
Next, the operator places the pre-machining cap having a plurality of pre-machining slits on the mounting surface so that the plurality of pre-machining slits surrounds the opening (ST102).
Next, the operator hermetically seals the pre-processing cap in the housing (ST103).
In the airtight sealing, the operator forms slits along the plurality of pre-processing slits and joins the sealing portion to the mounting surface so as to fill the slits (ST103A).

According to the manufacturing method of the present embodiment, the state of the sealing portion that fills the slit can be visually recognized from the cap side of the manufactured product.
Therefore, the inspector can easily visually recognize the joint.

Although the embodiment of the present disclosure has been described above, the embodiment is shown as an example and is not intended to limit the scope of the present disclosure. This embodiment can be implemented in various other forms, and various omissions, replacements, and modifications can be made without departing from the gist of the present disclosure.

1 Accommodating portion 2 Cap 2a Pre-processing cap 3 Sealing portion 4 Electronic element 8 Package 9 Electronic component 11 Peripheral wall 21 Thin portion 101 Accommodating portion 102 Cap 103 Sealing portion 108 Package 111 Peripheral wall LB Laser OP Opening OP1 Opening S1 Inner peripheral surface S2 Bottom surface S3 Inner circumferential surface SA Mounting surface SA1 Mounting surface SL Pre-processing slit SLM Slit SLM1 Slit VV Accommodating space VV1 Accommodating space

Claims (8)

a housing portion including a peripheral wall having a mounting surface surrounding an opening of a housing space capable of housing an electronic element;
a cap having a slit surrounding the opening and mounted on the mounting surface;
A package, comprising: a sealing portion that is joined to the mounting surface so as to fill the slit and hermetically seals the cap to the accommodating portion. 2. The package according to claim 1, wherein the inner circumference of said sealing portion is substantially flush with the inner circumference of said peripheral wall. 3. A package according to claim 1 or 2, wherein the sealing portion comprises an alloy of the containing portion and the cap. 4. A package according to any one of claims 1 to 3, wherein the seal encloses the opening all around. 5. The package according to any one of claims 1 to 4, wherein the electronic element is a hybrid IC for microwave communication equipment. a package according to any one of claims 1 to 5;
and the electronic element in the package. The electronic device is housed in a housing portion having a peripheral wall having a mounting surface surrounding an opening of a housing space capable of housing the electronic device,
placing a pre-processing cap having a plurality of pre-processing slits on the mounting surface such that the plurality of pre-processing slits surrounds the opening;
airtightly sealing the pre-processing cap in the housing part;
In the airtight sealing, while forming slits along the plurality of pre-processing slits, the sealing portion is joined to the mounting surface so as to fill the slits. 8. The manufacturing method according to claim 7, wherein the pre-machining cap has thin portions between the plurality of pre-machining slits.

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