JP2022138305A - Electronic component and manufacturing method thereof - Google Patents

Abstract

To achieve highly reliable hermetic sealing and to improve production efficiency and reduce costs.SOLUTION: An electronic component 1 includes an electronic element 2, a base 3 on which the electronic element is mounted, and a lid portion 4 that is joined to the base via a thermosetting adhesive 5 and hermetically seals the electronic element in the cavity 6, and a vent hole 30 communicating between the cavity and the outside is formed in the base or the lid portion, and the vent hole is airtightly sealed by curing an ultraviolet curable adhesive 40 filled in the vent hole.SELECTED DRAWING: Figure 1

Description

The present invention relates to electronic components and methods of manufacturing electronic components.

2. Description of the Related Art Conventionally, as an electronic component, there has been known a hollow package having a cavity inside and an electronic element hermetically sealed (see Patent Document 1 below).
For example, in the case of a sensor element, which is one of electronic elements, it is required to hermetically seal the sensor element in a hollow package in a vacuum state in order to improve sensing accuracy. In addition, for example, in order to improve the vibration characteristics, there is a case where it is hermetically sealed in a hollow package.

Various methods have been conventionally proposed as techniques for hermetically sealing an electronic element in a hollow package. For example, as a general method, after mounting an electronic element on a mounting substrate or lead frame, a frame portion as a side wall surrounding the electronic element is formed on the mounting substrate or lead frame (in this case, for example, affixing a pre-molded frame, or molding the frame using a mold for molding, etc.). Then, a cover material is put on the frame so as to close the opening of the frame and is adhered.
Furthermore, there is also known a method of mounting an electronic element on a bottomed tubular base plate in which a mounting substrate and a frame are integrally formed in advance, and then adhering a cover member so as to close the opening of the base plate. ing.

In any of the above-described methods, when a lid material is attached, a thermosetting adhesive is used to cover the lid material, and then the thermosetting adhesive is applied while pressing the lid material in a vacuum atmosphere. A method of thermally curing the agent is generally employed.

JP 2009-69629 A

However, thermosetting adhesives have the property that their viscosity decreases once during the process of thermosetting and then increases and then hardens. Therefore, when the viscosity of the thermosetting adhesive decreases, the lid material is likely to move as the lid material is pressed, and the thermosetting adhesive hardens while the lid body is displaced. There was a risk of malfunction. As a result, the quality and performance of the electronic component are likely to be degraded, leading to a decrease in reliability.
Furthermore, the process of pressure-bonding the cover material using a thermosetting adhesive must be performed in a vacuum atmosphere, which complicates the manufacturing process and tends to result in a decrease in production efficiency and an increase in manufacturing costs. , there was room for improvement.

The present invention has been made in consideration of such circumstances, and an object of the present invention is to provide an electronic device that can perform hermetic sealing with high reliability and that can improve production efficiency and reduce costs. It is an object of the present invention to provide a method for manufacturing a component and an electronic component.

(1) The electronic component according to the present invention includes an electronic element, a base on which the electronic element is mounted, and a thermosetting adhesive that is bonded to the base to airtightly seal the electronic element in a cavity. and a lid portion, wherein the base portion or the lid portion is formed with a vent that communicates the inside of the cavity with the outside, and the vent is used to cure the ultraviolet curable adhesive filled in the vent. characterized by being airtightly sealed by

According to the electronic component according to the present invention, since the base or the lid is provided with a ventilation hole that communicates the inside of the cavity with the outside, the electronic element is mounted on the base, and the base is mounted via the thermosetting adhesive. After combining the lid portion with the lid portion, the thermosetting adhesive can be heated by using, for example, a vacuum heating furnace while exhausting the gas in the cavity through the air vent. As a result, the inside of the cavity can be decompressed to a predetermined degree of vacuum, and the decompression can be used to suck the lid, so that the lid can be pressed against the base. In particular, since the lid can be maintained in a state of being evenly pressed against the base, heat curing of the thermosetting adhesive allows the base and lid to be adhered together with high precision without displacement. be able to.

After the base part and the lid part are fixed, the inside of the vent hole is airtightly sealed by filling the inside of the vent hole with an ultraviolet curable adhesive and curing the ultraviolet curable adhesive by irradiating the ultraviolet ray. In particular, since an ultraviolet curable adhesive is used, it can be cured in a short time (instantaneously) by irradiating ultraviolet rays, unlike the case where a thermosetting adhesive is used. Therefore, it is possible to improve the hermetic sealing property in the cavity, and it is possible to obtain an electronic component having improved moisture resistance and operational reliability. Furthermore, since a mechanism or the like for pressurizing the lid portion as in the prior art is not required, it is possible to improve the production efficiency and reduce the cost.

(2) The ultraviolet curable adhesive may contain at least one of an anaerobic catalyst and a thermosetting catalyst in a base resin having a modified acrylate.

In this case, since the base resin, which is the main component of the UV-curable adhesive, contains at least one of an anaerobic catalyst and a thermosetting catalyst, in addition to curing by irradiation with UV rays, pressure reduction in the cavity is reduced. Curing of the UV curable adhesive can be accelerated by the accompanying effect of blocking oxygen and the effect of heat curing. Therefore, when the UV-curable adhesive filled in the ventilation holes is irradiated with UV rays, even if there are, for example, portions where it is difficult for UV rays to pass through or portions where UV rays cannot easily reach, these portions can be cured appropriately. . Therefore, the entire UV curable adhesive can be reliably cured, and the hermetic sealing performance of the ventilation holes can be further improved.

(3) The ultraviolet curable adhesive may have a viscosity within the range of 100 mPa·s (millipascal seconds) to 100000 mPa·s before curing.

In this case, since the UV curable adhesive has a certain viscosity, when the UV curable adhesive is filled in the vent, the UV curable adhesive flows from the vent to the cavity side. can be suppressed. Therefore, it is possible to suppress inconveniences such as dripping or dripping of the ultraviolet curable adhesive into the cavity, and it is easy to further improve operational reliability by eliminating the influence on the electronic elements.

(4) The ultraviolet curing adhesive may contain a photopolymerization initiator having a reaction wavelength within the range of 300 nm to 500 nm.

In this case, since the UV curable adhesive contains a photopolymerization initiator having a reaction wavelength within the above range, visible light ( In addition, it is possible to effectively use the wavelength of 365 nm, which has the largest amount of light in the spot irradiation by the generally used UV LED. Therefore, the production efficiency can be further improved, and the ultraviolet curing adhesive can be easily cured in a shorter time.

(5) The vent hole may be formed so that the opening diameter of the outer opening that opens to the outside is within the range of 0.05 mm to 1.0 mm.

In this case, since the vent holes are formed so that the opening diameter of the outer opening is within the above range, the vent holes can be made micro-sized, and the UV curable adhesive can be quickly placed in the vent holes. can be filled, and it is easy to fill the air holes with the ultraviolet curable adhesive without gaps. Therefore, it is possible to further improve the airtightness of the ventilation hole.

(6) The ventilation hole may have a length of 5 mm or less between an outer opening that opens to the outside and an inner opening that opens to the cavity.

In this case, since the length of the ventilation hole is 5 mm or less, the irradiated ultraviolet rays can appropriately reach the entire UV-curable adhesive filled in the ventilation hole. Therefore, it is possible to further improve the airtightness of the ventilation hole.

(7) The vent hole may be formed to have a tapered cross-section whose diameter gradually decreases from an outer opening that opens to the outside toward an inner opening that opens to the cavity.

In this case, since the vent hole is formed in a tapered cross-section whose diameter gradually decreases toward the cavity side, it is easy to fill the vent hole with the ultraviolet curable adhesive, and there is no gap in the vent hole. Easy to fill. Therefore, it is possible to further improve the airtightness of the ventilation hole.

(8) The cavity may be filled with an inert gas.

In this case, since the cavity is filled with an inert gas such as nitrogen or a rare gas, it is possible to improve, for example, moisture resistance and corrosion resistance, thereby further improving operational reliability.

(9) The base has a frame surrounding the electronic element, the air vent is formed in the frame, the lid is made of an optically transparent material, and the electronic element may be an optical element.

In this case, since the ventilation holes are formed in the frame, light can enter the optical element in the cavity through the optically transparent lid, and light can be emitted from the optical element in the cavity to the outside through the lid. can be emitted, and can be suitably used, for example, as an optical electronic component such as an image sensor.

(10) A method for manufacturing an electronic component according to the present invention includes: an electronic element; a base on which the electronic element is mounted; a sealing lid portion, comprising: a mounting step of mounting the electronic element on the base portion; A stacking step of stacking the lids on each other with the thermosetting adhesive interposed therebetween, and discharging the gas in the cavity to the outside through the vent hole to decompress the inside of the cavity to a predetermined degree of vacuum, a first sealing step of curing the thermosetting adhesive by heating; a filling step of filling an ultraviolet curable adhesive into the vent while maintaining the degree of vacuum in the cavity; and a second sealing step of curing the UV curable adhesive filled in the space by irradiating the UV ray to airtightly seal the air vent.

According to the method for manufacturing an electronic component according to the present invention, when performing the first sealing step, after the base portion and the lid portion are overlapped via the thermosetting adhesive, for example, a vacuum heating furnace is used. , the thermosetting adhesive can be heated while the gas in the cavity is discharged through the vent. As a result, the inside of the cavity can be decompressed to a predetermined degree of vacuum, and the decompression can be used to suck the lid, so that the lid can be pressed against the base. In particular, since the lid can be maintained in a state of being evenly pressed against the base, the base and the lid can be fixed together with high accuracy by heating and hardening the thermosetting adhesive without misalignment. be able to.

Next, in the filling step, the ultraviolet curable adhesive is filled into the air holes while maintaining the degree of vacuum in the cavity. Then, in the second sealing step, the inside of the ventilation hole can be hermetically sealed by irradiating the ultraviolet curing adhesive filled in the ventilation hole with ultraviolet rays to cure the adhesive. In particular, since an ultraviolet curable adhesive is used, it can be cured in a short time (instantaneously) by irradiating ultraviolet rays, unlike the case where a thermosetting adhesive is used. Therefore, it is possible to improve the hermetic sealing property in the cavity, and it is possible to obtain an electronic component having improved moisture resistance and operational reliability. Furthermore, since a mechanism or the like for pressurizing the lid portion as in the prior art is not required, it is possible to improve the production efficiency and reduce the cost.

(11) In the filling step, a discharge nozzle for discharging the ultraviolet curable adhesive is set so as to face an outer opening of the ventilation hole, which is open to the outside, with a predetermined clearance provided therebetween. a setting step; and a discharging step of discharging and filling the ultraviolet curable adhesive into the vent hole so that the ultraviolet curable adhesive is in contact with the entire periphery of the outer opening. You can prepare.

In this case, the discharge nozzle is set so as to face the outer opening of the vent with a predetermined clearance, and then the ultraviolet curable adhesive is discharged from the discharge nozzle into the vent. let it fill. In particular, since the ultraviolet curing adhesive is discharged from the discharge nozzle so that the ultraviolet curing adhesive is in contact with the entire circumference of the opening periphery of the outer opening of the vent hole, the ultraviolet curing that is in contact with the opening periphery of the outer opening is prevented. The adhesive can be guided into the vent hole using surface tension in addition to the force of ejection. Therefore, even if the opening size of the air hole is small, the ultraviolet curable adhesive can be efficiently discharged and filled into the air hole, and workability can be improved. Furthermore, since the discharge nozzle is set with a predetermined clearance with respect to the outer opening of the vent, for example, the ultraviolet curable adhesive will not adhere unintentionally around the vent before discharge. can be suppressed. Therefore, it is easy to efficiently discharge the ultraviolet curable adhesive only to the inside of the ventilation hole without waste.

(12) In the ejection step, the ejection nozzle is inclined such that the nozzle axis of the ejection nozzle has an inclination angle within the range of 20 degrees to 70 degrees with respect to the center line of the vent hole. You may perform discharge by .

In this case, the ultraviolet curable adhesive is discharged into the vent while tilting the discharge nozzle at the above-mentioned angle with respect to the center line of the vent. Even if the ultraviolet curable adhesive exhibits a behavior of dripping from the discharge nozzle under the influence, it is possible to bring the ultraviolet curable adhesive in a dripping state into contact with the entire circumference of the opening peripheral edge of the outer opening of the vent hole. Therefore, even under the influence of gravity, the UV-curable adhesive can be properly guided into the vent.

(13) In the discharge step, the discharge nozzle may be moved along the opening surface of the outer opening while discharging the ultraviolet curing adhesive.

In this case, since the discharge nozzle is slid in the opening plane of the outer opening while discharging the ultraviolet curing adhesive, the ultraviolet curing adhesive behaves as if it drips from the discharge nozzle due to the influence of gravity, for example. Even so, it is easy to make contact over the entire periphery of the outer opening. Therefore, even under the influence of gravity, the UV curable adhesive can be guided into the vent.

According to the present invention, airtight sealing can be performed with high reliability, and improvement in production efficiency and cost reduction can be achieved.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows embodiment which concerns on this invention, Comprising: It is a longitudinal cross-sectional view of the electronic component for optics (electronic component). 2 is an external perspective view of the optical electronic component shown in FIG. 1. FIG. 2 is an enlarged cross-sectional view of the periphery of the vent shown in FIG. 1; FIG. FIG. 2 is a process diagram for manufacturing the optical electronic component shown in FIG. 1, and is a cross-sectional view showing an optical element mounted on a die pad portion of a lead frame; FIG. 5 is a cross-sectional view showing a state in which a base is created by combining the lead frame shown in FIG. 4 with a base and a peripheral wall having a ventilation hole; FIG. 6 is a cross-sectional view showing a state in which a lid portion is overlaid on the base portion shown in FIG. 5 with a thermosetting adhesive interposed therebetween; FIG. 7 is a cross-sectional view showing a state in which a discharge nozzle is set in the ventilation hole shown in FIG. 6; FIG. 8 is a cross-sectional view showing a state in which an ultraviolet curable adhesive is being discharged from the discharge nozzle shown in FIG. 7 into a ventilation hole; FIG. 9 is a cross-sectional view showing a state in which an ultraviolet curing adhesive filled in the ventilation holes shown in FIG. 8 is irradiated with ultraviolet rays; It is a longitudinal cross-sectional view showing a modification of the optical electronic component. FIG. 11 is a perspective view showing another modified example of the electronic component for optics; FIG. 12 is a perspective view showing a vent hole in the optical electronic component shown in FIG. 11; FIG. 10 is a longitudinal sectional view showing still another modified example of the electronic component; FIG. 10 is a longitudinal sectional view showing still another modified example of the electronic component;

DESCRIPTION OF THE PREFERRED EMBODIMENTS Electronic components and electronic components according to embodiments of the present invention will be described below with reference to the drawings. In this embodiment, an optical electronic component in which an optical element is sealed in a cavity will be described as an example of the electronic component.

As shown in FIGS. 1 and 2, the optical electronic component 1 of this embodiment includes an optical element (electronic element according to the present invention) 2, a base 3 on which the optical element 2 is mounted, and a thermosetting adhesive. a lid portion 4 that is joined to the base portion 3 via 5 and hermetically seals the optical element 2 within the cavity 6 ;

The optical electronic component 1 of the present embodiment is a chip component formed in a thin rectangular parallelepiped shape with a length along the front-rear direction L1 equal to a length along the left-right direction L2. However, the shape of the optical electronic component 1 is not limited to this case, and may be changed as appropriate according to the application, the size of the optical element 2, and the like.
In the present embodiment, in the thickness direction of the optical electronic component 1, the direction from the base portion 3 to the lid portion 4 is called upward, and the opposite direction is called downward. Furthermore, one direction of the front-rear direction L1 is called forward, and the other direction is called rearward.

The base portion 3 is formed in a bottomed cylindrical shape that is open upward. Specifically, the base portion 3 includes a lead frame 10 and a base portion 20 and a peripheral wall portion (a frame portion according to the present invention) 25 integrally combined with the lead frame 10 .

The lead frame 10 is a component that supports and fixes the optical element 2 and provides electrical connection to external wiring (not shown). Mainly prepared.

The die pad portion 11 is formed, for example, in a square shape or a rectangular shape in plan view. The optical element 2 is mounted on the die pad portion 11 by, for example, a conductive adhesive or soldering.
The lead portion 12 includes an inner lead portion 12a electrically connected to an electrode (not shown) of the optical element 2 via a metal wire 7, and an outer end portion of the inner lead portion 12a which is bent downward. and an outer lead portion 12c further bent from the lower end of the bent portion 12b and electrically connected to an external wiring (not shown). Therefore, the outer lead portion 12c functions as an external connection terminal of the optical electronic component 1. As shown in FIG.

The lead portions 12 having the inner lead portions 12a, the bent portions 12b and the outer lead portions 12c are arranged so as to surround the die pad portion 11 and are spaced apart in, for example, the front-rear direction L1 and the left-right direction L2. (See Figure 2). As a result, the outer ends of the outer lead portions 12c are exposed to the outside while being spaced apart in the front-rear direction L1 and the left-right direction L2. However, the shape of the lead portion 12 is not limited to this case.

In addition, the lead frame 10 is a thin plate made of metal (for example, Cu alloy material, iron alloy material, etc.) excellent in mechanical strength, electrical conductivity, heat transfer, corrosion resistance, etc., and is punched (pressed) or etched. It is formed by processing or the like.

The base portion 20 is, for example, an insulating substrate, and is incorporated below the die pad portion 11 and inside the bent portions 12b of the plurality of lead portions 12 without gaps. As a result, high sealing performance is ensured between the base portion 20 and the lead portions 12, and communication between the inside of the cavity 6 and the outside through the base portion 20 and the lead portions 12 is blocked.
Although the base portion 20 is not limited to a specific material, it is possible to use, for example, an inorganic material such as ceramic, a heat-resistant resin material, or a fiber-reinforced resin material in which a heat-resistant resin material is reinforced with reinforcing fibers. is. Furthermore, the base portion 20 may be formed integrally with the lead frame 10 by, for example, molding a synthetic resin.

The peripheral wall portion 25 is formed in a frame shape so as to surround the periphery of the optical element 2, and is integrated with the outer lead portions 12c so as to surround the bent portions 12b of the plurality of lead frames 10 from the outside so as to overlap the outer lead portions 12c from above. properly combined.
Specifically, the peripheral wall portion 25 is arranged to face a front wall 26 and a rear wall 27 which are arranged to face each other with the optical element 2 interposed therebetween in the front-rear direction L1, and to face each other with the optical element 2 interposed therebetween in the left-right direction L2. A pair of side walls 28 are formed in a rectangular frame shape in a plan view. The peripheral wall portion 25 is incorporated without a gap between the inside of the bent portion 12b and the outer lead portion 12c. As a result, high sealing performance is ensured between the peripheral wall portion 25 and the lead portion 12, and communication between the inside of the cavity 6 and the outside through the peripheral wall portion 25 and the lead portion 12 is blocked.

Although the peripheral wall portion 25 is not limited to a specific material, it is possible to use, for example, an inorganic material such as ceramic, a heat-resistant resin material, or a fiber-reinforced resin material in which a heat-resistant resin material is reinforced with reinforcing fibers. is. Note that the peripheral wall portion 25 may be formed in advance in a frame shape separately from the lead frame 10, or may be a resin mold formed in a frame shape using a molding die. .
The thickness (wall thickness) of the peripheral wall portion 25 is not particularly limited, but is, for example, within the range of 0.5 mm to 1.0 mm, and is formed thin. However, in each drawing, the thickness of the peripheral wall portion 25 is exaggerated for easy viewing.

As described above, the base portion 3 of the present embodiment includes the lead frame 10, and the base portion 20 and the peripheral wall portion 25 that are integrally combined with the lead frame 10. As a whole, the base portion 3 has a bottom that opens upward. It is formed in a cylindrical shape.

The lid portion 4 is formed in the shape of a thin plate that closes the opening of the base portion 3 from above. The lid portion 4 is formed with an outer shape corresponding to the outer shape of the peripheral wall portion 25 . Therefore, the lid portion 4 is formed in a quadrangular shape in a plan view so that the length along the front-rear direction L1 and the length along the left-right direction L2 are the same. Furthermore, in this embodiment, the lid portion 4 is an optically transparent glass substrate.

The lid portion 4 has an outer peripheral edge portion that extends over the entire circumference, with the thermosetting adhesive 5 interposed between the upper end opening edges of the peripheral wall portion 25 , that is, the upper end opening edges of the front wall 26 , the rear wall 27 and the pair of side walls 28 . They are arranged so as to overlap each other and are firmly fixed by curing of the thermosetting adhesive 5 . As a result, high sealing performance is ensured between the lid portion 4 and the peripheral wall portion 25, and communication between the inside of the cavity 6 and the outside through the lid portion 4 and the peripheral wall portion 25 is blocked.

By integrally combining the lid portion 4 with the base portion 3 in this manner, the internal space surrounded by the lid portion 4, the peripheral wall portion 25, and the lead frame 10 functions as an airtightly sealed cavity 6. The optical element 2 is then placed in the hermetically sealed cavity 6 . The base 3 and lid 4 thus function as a hollow package 8 enclosing the optical element 2 within a cavity 6 formed therein.

Although the thermosetting adhesive 5 is not particularly limited, for example, a general epoxy resin can be used. In this case, it is preferred that the epoxy resin contains a silica filler. As a ratio, for example, it is preferable to contain 80 to 90% of the silica filler with respect to 10 to 20% of the epoxy resin.
Thus, by containing a silica filler, the thermal conductivity of the thermosetting adhesive 5 can be enhanced, and when the optical element 2 sealed in the cavity 6 is, for example, a silicon semiconductor element, the silicon semiconductor It is possible to match the thermal expansion coefficient of the element.

Furthermore, the thermosetting adhesive 5 is formed with a uniform thickness over the entire circumference of the upper open end of the peripheral wall portion 25 . At this time, the minimum thickness of the thermosetting adhesive 5 is, for example, 0.3 mm, preferably 0.5 mm or more. In order to reduce the thickness of the optical electronic component 1 while suppressing warping of the lid portion 4, it is preferable to set the minimum thickness of the thermosetting adhesive 5 to 0.3 mm. Therefore, it is preferable that the thickness of the thermosetting adhesive 5 is 0.5 mm or more.

One of the base portion 3 and the lid portion 4 configured as described above is formed with a vent hole 30 that communicates the inside of the cavity 6 with the outside.
In this embodiment, a ventilation hole 30 is formed in the front wall 26 of the peripheral wall portion 25 that constitutes the base portion 3 . The vent hole 30 is formed to penetrate the front wall 26 in the front-rear direction L1. Specifically, one vent hole 30 is formed in a central portion of the front wall 26 in the left-right direction L2 and located near the upper edge of the opening (see FIG. 2). However, the formation position of the ventilation hole 30 is not limited to this case.
The ventilation hole 30 is formed at the stage of forming the peripheral wall portion 25 before the peripheral wall portion 25 is combined with the lead frame 10 .

As shown in FIGS. 1 and 3, the vent hole 30 is formed to penetrate the front wall 26 in the front-rear direction L1, so that an outer opening 31 that opens to the outside (front side) and the cavity 6 It has an inner opening 32 open to the side. The length of vent 30 corresponds to the wall thickness of front wall 26 . That is, the vent hole 30 has a length of 0.5 mm to 1.0 mm along the front-rear direction L1 between the outer opening 31 and the inner opening 32 .
Further, the vent hole 30 is formed to have a tapered cross-section whose diameter gradually decreases from the outer opening 31 toward the inner opening 32 . At this time, the opening diameter of the outer opening 31 is formed, for example, within the range of 0.05 mm to 1.00 mm. Among these, it is preferable to set the opening diameter of the outer opening 31 within the range of 0.1 mm to 0.4 mm.

The vent hole 30 formed as described above is airtightly sealed by curing the UV curable adhesive 40 filled in the vent hole 30 .
The ultraviolet curable adhesive 40 is discharged into the vent hole 30 in a paste state from a discharge nozzle 51 of a dispenser 50 to be described later. hardened by the irradiation of
As a result, the communication between the inside of the cavity 6 and the outside through the ventilation hole 30 is blocked, and the inside of the cavity 6 is maintained in a sealed state.

As the ultraviolet curable adhesive 40, it is preferable to adopt an adhesive that has characteristics such as not exhibiting toxicity and mutagenicity. In particular, it is preferable that the ultraviolet curable adhesive 40 has a base resin containing a modified acrylate as a main component and contains at least one of an anaerobic catalyst and a thermosetting catalyst in the base resin. Specifically, as the ultraviolet-curing adhesive 40, it is preferable to use an anaerobic-imparting modified acrylate or a thermosetting-imparting modified acrylate.

When an anaerobic-imparting modified acrylate is adopted as the ultraviolet curing adhesive 40, it is possible to impart an anaerobic curing function in addition to ultraviolet curing. As a result, it is possible to cure even a portion that is difficult to be irradiated with ultraviolet rays by the action of anaerobic curing. In order to impart the function of anaerobic adhesive curing to the modified acrylate, it is necessary to use a dimethacrylate having an acryloyl group or a methacryloyl group as a component.
When a thermosetting modified acrylate is employed as the ultraviolet curable adhesive 40, it is possible to impart a thermosetting function in addition to ultraviolet curing. As a result, it becomes possible to cure even a portion which is difficult to be irradiated with ultraviolet rays by the effect of heat curing.

As for the viscosity of the ultraviolet curable adhesive 40 before curing, the optimum viscosity varies depending on the size of the air hole 30, but for example, at room temperature (around 25 degrees), it is possible to use from 1 mPa·s (millipascal seconds). be.
However, from the viewpoint of properly airtightly sealing the ventilation holes 30, the viscosity of the ultraviolet curable adhesive 40 is preferably within the range of 100 mPa·s to 100000 mPa·s. Among them, the viscosity is preferably within the range of 500 mPa·s to 20000 mPa·s, more preferably within the range of 1000 mPa·s to 15000 Pa·s.

Further, the ultraviolet curing adhesive 40 preferably contains a photopolymerization initiator (eg, benzoin ethers, amines, etc.) having a reaction wavelength in the range of 300 nm to 500 nm, for example. Among them, it is more preferable that the ultraviolet ray irradiator 55 contains a photopolymerization initiator having maximum absorption near the wavelength of 365 nm, which has the highest amount of light in spot irradiation by a generally used LED-UV irradiator. .

(Manufacturing method of optical electronic component)
Next, a method for manufacturing the optical electronic component 1 configured as described above will be described.
First, as shown in FIG. 4, the step of mounting the optical element 2 on the die pad portion 11 of the lead frame 10 (having an outer shape formed in advance by press working or the like) constituting the base portion 3 (mounting step according to the present invention). I do. Specifically, the optical element 2 is mounted on the die pad portion 11 by, for example, a conductive adhesive or soldering, and the electrode (not shown) of the optical element 2 and the inner lead portion 12a are electrically connected using the metal wire 7. properly connected.

Next, a step of stacking the base portion 3 or the lid portion 4 provided with the vent hole 30 with the thermosetting adhesive 5 is performed (stacking step according to the present invention).
In this step, as shown in FIG. 5, the base portion 20 is combined with the lead frame 10 on which the optical element 2 is mounted, and the peripheral wall portion 25 having the ventilation holes 30 formed in advance is combined with the lead frame 10 . .

At this time, as described above, the lead frame 10 may be integrally combined with the pre-formed base portion 20 and the peripheral wall portion 25 having the ventilation holes 30 formed therein. Alternatively, the base portion 20 and the peripheral wall portion 25 may be integrally combined by molding a synthetic resin using a molding die or the like. When the peripheral wall portion 25 is formed by molding, the ventilation holes 30 may be formed after molding.
As a result, it is possible to obtain the bottomed cylindrical base portion 3 including the lead frame 10, the base portion 20, and the peripheral wall portion 25 in which the ventilation holes 30 are formed.

Next, as shown in FIG. 6, after the thermosetting adhesive 5 is applied to the upper edge of the opening of the peripheral wall portion 25 with a uniform thickness over the entire circumference, the lid portion is closed so as to close the opening of the base portion 3. Next, as shown in FIG. Overlap 4 from above. As a result, the cavity 6 in which the optical element 2 is arranged can be closed, and a temporary part 45 composed of the base portion 3 and the lid portion 4 which are superimposed with the thermosetting adhesive 5 interposed therebetween is completed.
At the stage of the temporary part 45 , the inside of the cavity 6 communicates with the outside through the ventilation holes 30 .

Next, a step of curing the thermosetting adhesive 5 by heating while decompressing the inside of the cavity 6 to a predetermined degree of vacuum by discharging the gas (air) in the cavity 6 to the outside through the ventilation hole 30 (in the present invention, first sealing step) is performed.
Specifically, the temporary part 45 shown in FIG. 6 is put into a vacuum heating furnace (not shown). After charging, the inside of the vacuum heating furnace is gradually decompressed and the temperature is raised. As a result, the thermosetting adhesive 5 can be heated while the gas inside the cavity 6 is discharged through the ventilation holes 30 . Therefore, the inside of the cavity 6 can be decompressed to a predetermined degree of vacuum, and the lid portion 4 can be sucked using the decompression, and the lid portion 4 can be pressed against the base portion 3 from above. can be done.

In particular, since the lid portion 4 can be maintained in a state of being evenly pressed against the peripheral wall portion 25 constituting the base portion 3 from above, the heat curing of the thermosetting adhesive 5 causes the base portion 3 and the peripheral wall portion 25 to be separated. can be integrally fixed (adhesively fixed) with high accuracy without causing positional deviation.

Next, while maintaining the degree of vacuum in the cavity 6, a step of filling the air hole 30 with the ultraviolet curable adhesive 40 (filling step according to the present invention) is performed.
This process is performed using a dispenser 50 filled with a paste-like ultraviolet curable adhesive 40 . Specifically, as shown in FIG. 7 , the discharge nozzle of the dispenser 50 is opened with a predetermined clearance H with respect to the outer opening 31 of the ventilation hole 30 that opens in the front wall 26 of the peripheral wall 25 . 51 are set so as to face each other (setting process according to the present invention). At this time, the clearance H is, for example, about 50 μm to 100 μm. However, the clearance H is not limited to this case, and may be changed as appropriate.

The discharge nozzle 51 is formed in a cylindrical shape centered on the nozzle axis O1, has an outer diameter larger than the diameter of the outer opening 31 of the air hole 30, and an inner diameter smaller than the diameter of the outer opening 31. is preferably used. For example, the inner diameter of the discharge nozzle 51 is preferably 0.08 mm to 1 mm, more preferably 0.1 mm to 0.4 mm.

Next, after setting the ejection nozzle 51 , an ultraviolet curable adhesive is applied from the ejection nozzle 51 into the vent hole 30 so that the ultraviolet curable adhesive 40 is in contact with the entire periphery of the outer opening 31 of the vent hole 30 . The step of discharging and filling the agent 40 (the discharging step according to the present invention) is performed.
Specifically, as shown in FIG. 8, the discharge nozzle 51 is positioned so that the nozzle axis O1 of the discharge nozzle 51 has an inclination angle .theta. Discharge is performed while tilting downward.

As a result, the ultraviolet curable adhesive 40 can be discharged into the ventilation hole 30 without waste and efficiently filled. This point will be described in detail.
When the ultraviolet curable adhesive 40 is discharged from the discharge nozzle 51 into the vent hole 30 , the ultraviolet curable adhesive 40 is discharged so as to be in contact with the entire periphery of the outer opening 31 of the vent hole 30 . Therefore, the UV curable adhesive 40 in contact with the periphery of the outer opening 31 can be guided into the ventilation hole 30 by using surface tension in addition to the force of ejection. Therefore, even if the opening size of the vent hole 30 is small, the ultraviolet curing adhesive 40 can be efficiently discharged and filled in the vent hole 30, and workability can be improved.

In particular, the ultraviolet curable adhesive 40 is discharged into the vent hole 30 while the discharge nozzle 51 is inclined downward with respect to the center line O2 of the vent hole 30 at the inclination angle θ. Therefore, even if the ultraviolet curable adhesive 40 discharged from the discharge nozzle 51 exhibits a behavior such that it drips from the discharge nozzle 51 due to the influence of gravity, for example, the dripping ultraviolet curable adhesive 40 is removed from the outer opening of the air hole 30 . It is possible to make contact over the entire periphery of the opening edge at 31 . Therefore, the UV-curable adhesive 40 can be appropriately guided into the vent hole 30 even under the influence of gravity.

Furthermore, since the discharge nozzle 51 is set with a predetermined clearance H with respect to the outer opening 31 of the vent hole 30, for example, the UV curable adhesive 40 may be unintentionally placed around the vent hole 30 before discharge. It is possible to suppress the inconvenience of adhering to. Therefore, it is easy to efficiently discharge the ultraviolet curable adhesive 40 only into the target air holes 30 without waste.

As described above, after the ultraviolet curable adhesive 40 has been filled into the vent holes 30, as shown in FIG. The step of hermetically sealing (second sealing step according to the present invention) is performed. Specifically, the ultraviolet ray irradiator 55 is used to irradiate the ultraviolet curing adhesive 40 with ultraviolet rays UV from the front of the front wall 26 of the peripheral wall portion 25 . As a result, the ultraviolet curable adhesive 40 can be cured inside the vent hole 30, and the vent hole 30 can be hermetically sealed.
In particular, since the ultraviolet curable adhesive 40 is used, it can be cured in a short time (instantaneously) by irradiation with ultraviolet UV, unlike the case where the thermosetting adhesive 5 or the like is used. Therefore, it is possible to improve the hermetic sealing property in the cavity 6, and it is possible to provide the optical electronic component 1 with improved moisture resistance and operational reliability.

According to the optical electronic component 1 manufactured as described above and shown in FIGS. 1 and 2, the cavity 6 can be hermetically sealed with high reliability, and a high-quality electronic component with improved operational reliability can be obtained. can be parts. Therefore, light can enter the optical element 2 in the cavity 6 from the outside through the optically transparent lid 4, and light can be emitted from the optical element 2 in the cavity 6 to the outside through the lid 4. For example, it can be suitably used as an optical electronic component 1 such as an image sensor.
Furthermore, since the lid portion 4 can be pressed against the base portion 3 by utilizing the pressure reduction in the cavity 6 through the vent hole 30, a conventional mechanism or the like for pressurizing the lid portion 4 is not required. . Therefore, the manufacturing process can be simplified, and the production efficiency can be improved and the cost can be reduced.

Furthermore, since an anaerobic-imparting modified acrylate or a heat-curing-imparting modified acrylate can be used as the ultraviolet-curing adhesive 40, in addition to curing by irradiation with ultraviolet rays, there is an effect of blocking oxygen accompanying pressure reduction in the cavity 6, and , the curing of the UV curing adhesive 40 can be accelerated by the effect of heat curing.
Therefore, when the ultraviolet curable adhesive 40 filled in the ventilation hole 30 is irradiated with ultraviolet rays, even if there are portions where it is difficult for the ultraviolet rays to pass through or portions where the ultraviolet rays cannot reach, these portions can be removed appropriately. Can be cured. Therefore, the entire UV curable adhesive 40 can be reliably cured, and the hermetic sealing performance of the vent hole 30 can be further improved.

Furthermore, since the UV curable adhesive 40 has a certain viscosity (within the range of 100 mPa·s to 100000 mPa·s), when the UV curable adhesive 40 is filled in the vent hole 30, the It is possible to suppress the ultraviolet curable adhesive 40 from flowing from the inside to the inside of the cavity 6. - 特許庁Therefore, it is possible to prevent the UV curable adhesive 40 from dripping or dropping into the cavity 6, thereby eliminating the influence on the optical element 2 and further improving the operational reliability.

Furthermore, when the ultraviolet curable adhesive 40 contains a photopolymerization initiator having a reaction wavelength in the range of 300 nm to 500 nm, when the ultraviolet curable adhesive 40 filled in the vent 30 is irradiated with ultraviolet UV In addition, it is easy to avoid the influence of visible light (indoor scattered light), for example. In addition, by spot irradiation using a generally used LED-UV irradiator as the ultraviolet ray irradiator 55, the wavelength of 365 nm, which has the highest amount of light, is used to effectively produce an ultraviolet curable adhesive. 40 can be accelerated. Therefore, production efficiency can be further improved, and the ultraviolet curing adhesive 40 can be easily cured in a shorter time.

When the ultraviolet curable adhesive 40 is used, for example, a one-liquid adhesive with a pot life of six months can be used, so there is no need for strict deadline control, and workability is excellent. Furthermore, the ultraviolet curable adhesive 40 is reliable in terms of safety, durability, heat resistance, etc., and is less likely to deteriorate, so that it is easy to use and excellent in convenience.
Furthermore, the UV-curable adhesive 40 containing a photopolymerization initiator having a maximum absorption near a wavelength of 365 nm is the most efficient in terms of UV-curing, is inexpensive, and can be most preferably employed from the viewpoint of resource saving. .

Furthermore, since the vent hole 30 is formed so that the opening diameter of the outer opening 31 that opens to the front wall 26 in the peripheral wall part 25 is within the range of 0.05 mm to 1.00 mm, the vent hole 30 can be made very small. As a result, the UV curable adhesive 40 can be filled in the vent hole 30 in a short time, and the UV curable adhesive 40 can be easily filled in the vent hole 30 without gaps.
In addition, since the vent hole 30 is formed to have a tapered cross-section whose diameter gradually decreases toward the cavity 6 side, it is easy to fill the vent hole 30 with the ultraviolet curing adhesive 40, and the inside of the vent hole 30 is Easy to fill without gaps. Therefore, by these things, the airtight sealing property of the vent hole 30 can be improved further.

Furthermore, since the vent hole 30 has a length within the range of 0.5 mm to 1.0 mm corresponding to the wall thickness of the peripheral wall part 25, the entire UV curable adhesive 40 filled in the vent hole 30 is On the other hand, the irradiated ultraviolet rays UV can be appropriately reached. Therefore, the airtightness of the vent hole 30 can be further improved.

(Modification)
In the above embodiment, the length of the ventilation hole 30 is set within the range of 0.5 mm to 1.0 mm corresponding to the wall thickness of the peripheral wall portion 25, but it is not limited to this case. As for the length of the vent hole 30, the upper limit value is determined based on the film thickness curing performance of the ultraviolet curable adhesive 40, and the lower limit value is determined based on the adhesive strength between the material of the hollow package 8 and the ultraviolet curable adhesive 40. do it. In the case of a general ultraviolet curable adhesive 40, the value of the film thickness curing performance depends on the reaching limit of ultraviolet rays UV, so it can be said that the thickness is preferably 5 mm or less. Therefore, it is preferable that the length of the ventilation hole 30 is 5 mm or less.

In this case, it is not always necessary to fill the entire inside of the vent hole 30 with the ultraviolet curable adhesive 40, and it is sufficient to fill the ultraviolet curable adhesive 40 so as to cover at least a certain distance from the outer opening 31. . As for the fixed distance, it is necessary to secure at least 0.3 mm, for example, in order to ensure reliable curing by irradiation of ultraviolet UV for several seconds, and to obtain reliability of hermetic sealing of the ventilation holes 30 by curing. It is more preferable to secure 0.5 mm.

Furthermore, in the above embodiment, when the ultraviolet curing adhesive 40 is discharged from the discharge nozzle 51 into the vent hole 30, the nozzle axis O1 of the discharge nozzle 51 is in the range of 20 to 70 degrees with respect to the center line O2 of the vent hole 30. Although the ejection nozzle 51 is inclined downward so as to have the inclination angle θ inside, the ejection nozzle 51 may alternatively be inclined upward.
Even in this case, the same action and effect can be achieved. The cured adhesive 40 can be easily brought into contact with the entire periphery of the outer opening 31 of the ventilation hole 30 and can be appropriately guided into the ventilation hole 30 .

However, when the ultraviolet curable adhesive 40 is discharged from the discharge nozzle 51, if the ultraviolet curable adhesive 40 can be discharged over the entire circumference of the opening peripheral edge of the outer opening 31 of the vent hole 30, It is not always necessary to incline the ejection nozzle 51 .

For example, the discharge nozzle 51 is horizontally arranged so that the nozzle axis O1 is parallel to the center line O2 of the air hole 30, and the ultraviolet curing adhesive 40 is discharged. It may be moved in (the direction along the inside of the opening plane of the outer opening 31).
In this case, the ejection nozzle 51 is slid while ejecting the ultraviolet curable adhesive 40. Therefore, even if the ultraviolet curable adhesive 40 hangs down from the ejection nozzle 51 due to the influence of gravity, the outer opening does not move. It is possible to make contact over the entire periphery of the opening edge at 31 . Therefore, similar effects can be achieved.
In this case, an operation of sliding the discharge nozzle 51 in the vertical direction while tilting the discharge nozzle 51 downward or upward may be combined.

Furthermore, in the above-described embodiment, the vent holes 30 are formed in a tapered shape in cross section, but are not limited to this case, and may be formed in a straight shape, for example. Furthermore, the straight ventilation hole 30 may be formed obliquely.

Furthermore, in the above embodiment, the case of manufacturing one optical electronic component 1 has been described as an example, but in the actual manufacturing process, in order to reduce costs, etc., a large number (for example, several hundred to tens of thousands of It is conceivable to simultaneously manufacture the optical electronic component 1 of the order of magnitude). Even in such a case, it is possible to employ the manufacturing method according to the present invention.
In this case, a lead frame assembly is prepared in which a plurality of lead frames 10 including die pad portions 11 corresponding to the number of optical electronic components 1 are connected by a connecting frame or the like. After the provisional parts 45 are produced for each lead frame 10 based on the above-described manufacturing method, the lead frame assembly is put into a vacuum heating furnace to depressurize and heat. After that, the ultraviolet curing adhesive 40 is filled in the ventilation hole 30 for each of the temporary parts 45 and cured by ultraviolet radiation. Finally, it is possible to obtain a plurality of optical electronic components 1 at a time by cutting the lead frame assembly and separating the plurality of optical electronic components 1 into small portions.

Next, the result of a confirmation test in which the optical electronic component 1 was actually manufactured based on the above embodiment and the filling workability of the ultraviolet curable adhesive 40 was confirmed will be described.
In this confirmation test, the opening diameter of the outer opening 31 of the vent hole 30, the inner diameter of the discharge nozzle 51 of the dispenser 50, and the inclination angle θ of the discharge nozzle 51 with respect to the center line O2 of the vent hole 30 were changed. Optical electronic components 1 were manufactured, and workability of filling the ultraviolet curable adhesive 40 for each optical electronic component 1 was confirmed.

In manufacturing each optical electronic component 1, manufacturing was performed under common conditions for the following.
As the ultraviolet curable adhesive 40, an anaerobic-imparting modified acrylate that exerts an anaerobic curing function is employed. Further, an ultraviolet curable adhesive 40 having a viscosity of 10000 mPa·s (millipascal seconds) and containing a photopolymerization initiator having an absorption maximum at 365 nm was used.
As the ultraviolet ray irradiator 55, an LED-UV irradiator that irradiates ultraviolet rays UV having a wavelength of 365 nm, which has the largest amount of light, was used to spot-irradiate the ultraviolet curing adhesive 40 with the ultraviolet rays UV.

(First confirmation test)
As a first confirmation test, when performing the filling step (the step of filling the vent hole 30 with the ultraviolet curing adhesive 40 while maintaining the degree of vacuum in the cavity 6) in the above-described embodiment, the outer opening in the vent hole 30 The opening diameter of the portion 31 is in three modes: a mode within the range of 0.05 mm to 0.1 mm, a mode within the range of 0.1 mm to 0.4 mm, and a mode within the range of 0.4 mm to 1.0 mm. did the test.
For each of the three modes, the inner diameter of the discharge nozzle 51 of the dispenser 50 is 0.08 mm to 0.1 mm, 0.1 mm to 0.4 mm, and 0.4 mm to 1.0 mm. The discharge nozzle 51 was used to fill the ultraviolet curing adhesive 40 .

The results are shown below.
(1) Aspect in which the opening diameter of the outer opening 31 of the air vent 30 is 0.05 mm to 0.1 mm ・When the inner diameter of the discharge nozzle 51 is 0.08 mm to 0.1 mm, the ultraviolet curing agent is placed inside the air vent 30. The adhesive 40 could be filled in a short time, and the filling process could be performed satisfactorily.
・When the inner diameter of the discharge nozzle 51 was 0.1 mm to 0.4 mm, the UV curable adhesive 40 could be filled in the air hole 30, and the filling process could be properly performed. In particular, when the inner diameter of the discharge nozzle 51 was 0.1 mm, the ultraviolet curable adhesive 40 could be filled in a short time, and the filling process could be performed satisfactorily.
・When the inner diameter of the discharge nozzle 51 is 0.4 mm to 1.0 mm, the UV curable adhesive 40 can be filled in the vent hole 30, and the filling process can be performed appropriately. The ultraviolet curable adhesive 40 easily adheres to the periphery of the , and discharge traces tend to remain.

(2) Aspect in which the opening diameter of the outer opening 31 in the air hole 30 is 0.1 mm to 0.4 mm ・When the inner diameter of the discharge nozzle 51 is 0.08 mm to 0.1 mm, ultraviolet curing is placed inside the air hole 30. The adhesive 40 could be filled, and the filling process could be performed satisfactorily. The filling time was slightly longer than when the diameter of the outer opening 31 was 0.05 mm to 0.1 mm.
・When the inner diameter of the ejection nozzle 51 was 0.1 mm to 0.4 mm, the ultraviolet curable adhesive 40 could be filled in the air hole 30 in a short time, and the filling process could be performed satisfactorily.
・When the inner diameter of the discharge nozzle 51 is 0.4 mm to 1.0 mm, the UV curable adhesive 40 can be filled in the vent hole 30, and the filling process can be performed appropriately. The ultraviolet curable adhesive 40 easily adheres to the periphery of the , and discharge traces tend to remain.

(3) Aspect in which the opening diameter of the outer opening 31 of the ventilation hole 30 is 0.4 mm to 1.0 mm ・When the inner diameter of the discharge nozzle 51 is 0.08 mm to 0.1 mm, ultraviolet curing is applied to the ventilation hole 30. The adhesive 40 could be filled, and the filling process could be performed satisfactorily. The filling time was slightly longer than when the diameter of the outer opening 31 was 0.1 mm to 0.4 mm.
・When the inner diameter of the discharge nozzle 51 was 0.1 mm to 0.4 mm, the ultraviolet curable adhesive 40 could be filled in the air hole 30, and the filling process could be performed satisfactorily.
・When the inner diameter of the discharge nozzle 51 was 0.4 mm to 1.4 mm, the ultraviolet curable adhesive 40 could be filled in the air hole 30, and the filling process could be performed satisfactorily.

From the above, as a result of the first confirmation test, when the inner diameter of the ejection nozzle 51 is equal to or smaller than the opening diameter of the vent hole 30, the ultraviolet curing adhesive 40 smoothly flows into the vent hole 30. It was confirmed that the filling could be completed in a short period of time and that the filling process could be carried out satisfactorily.
Therefore, when the opening diameter of the outer opening 31 of the vent hole 30 is within the range of 0.05 mm to 1.0 mm, the discharge nozzle 51 has an inner diameter of 0.08 mm to 1.0 mm. It was confirmed that it is preferable to use the nozzle 51, and it is more preferable to use the discharge nozzle 51 having an inner diameter within the range of 0.1 mm to 0.4 mm.

After the first confirmation test, for all the optical electronic components 1, an LED-UV irradiator was used to spot-irradiate the ultraviolet curing adhesive 40 with ultraviolet UV (minimum curing time: 2 seconds), and ultraviolet curing was performed. The optical electronic component 1 was completed by curing the adhesive 40 . Thereafter, the optical electronic component 1 was subjected to a pressure resistance test in which 2 atm was applied under high temperature and high humidity for 200 hours, and a reliability test was performed to confirm the function of the optical electronic component 1 after 200 hours. This reliability test corresponds to a test after 2000 hours in a hot and humid environment (85%, 85°C). As a result, it was confirmed that any of the optical electronic components 1 operated satisfactorily. It could be confirmed that this would actually lead to the manufacture of the electronic component 1 for use.

(Second confirmation test)
As a second confirmation test, when performing the filling step in the above-described embodiment, the opening diameter of the outer opening 31 in the vent 30 was set to a range of 0.05 mm to 0.1 mm, 0.1 mm to 0.4 mm. and a mode within the range of 0.4 mm to 1.0 mm.
For each of the three aspects, the inclination angle θ (downward inclination angle θ) of the ejection nozzle 51 of the dispenser 50 is less than 20 degrees, 20 to 30 degrees, and 30 to 60 degrees. , and the discharge nozzle 51 of 60 to 70 degrees, the ultraviolet curable adhesive 40 was filled.

The results are shown below.
(1) A mode in which the opening diameter of the outer opening 31 of the ventilation hole 30 is 0.05 mm to 0.1 mm ・When the inclination angle θ of the discharge nozzle 51 is less than 20 degrees, the ultraviolet curable adhesive 40 could be filled, but a phenomenon was confirmed in which a small amount of the UV curable adhesive 40 leaked out of the air vent 30 .
・When the inclination angle θ of the discharge nozzle 51 was 20 degrees to 30 degrees, the UV-curing adhesive 40 could be filled in the vent hole 30, and the filling process could be properly performed.
・When the inclination angle θ of the ejection nozzle 51 was 30 degrees to 60 degrees, the ultraviolet curable adhesive 40 could be filled in the vent hole 30, and the filling process could be performed properly. It should be noted that the filling time was shorter than when the inclination angle θ was 20 to 30 degrees.
・When the inclination angle θ of the discharge nozzle 51 was 60 degrees to 70 degrees, the UV-curing adhesive 40 could be filled in the air hole 30, and the filling process could be properly performed. The filling time was the same as when the inclination angle θ was 20 degrees to 30 degrees.

(2) Aspect in which the opening diameter of the outer opening 31 of the air vent 30 is 0.1 mm to 0.4 mm When the inclination angle θ of the ejection nozzle 51 is less than 20 degrees, the ultraviolet curable adhesive 40 could be filled, but a phenomenon was confirmed in which a small amount of the UV curable adhesive 40 leaked out of the air vent 30 .
・When the inclination angle θ of the discharge nozzle 51 was 20 degrees to 30 degrees, the UV-curing adhesive 40 could be filled in the vent hole 30, and the filling process could be properly performed.
・When the inclination angle θ of the ejection nozzle 51 was 30 degrees to 60 degrees, the ultraviolet curable adhesive 40 could be filled in the vent hole 30, and the filling process could be performed appropriately. It should be noted that the filling time was shorter than when the inclination angle θ was 20 to 30 degrees. In particular, it could be performed in the shortest filling time of the entire second confirmation test.
・When the inclination angle θ of the discharge nozzle 51 was 60 degrees to 70 degrees, the UV-curing adhesive 40 could be filled in the air hole 30, and the filling process could be properly performed. The filling time was the same as when the inclination angle θ was 20 degrees to 30 degrees.

(3) Aspect in which the opening diameter of the outer opening 31 in the vent 30 is 0.4 mm to 1.0 mm ・When the inclination angle θ of the ejection nozzle 51 is less than 20 degrees, the UV curable adhesive 40 could be filled, but a phenomenon was confirmed in which a small amount of the UV curable adhesive 40 leaked out of the air vent 30 .
・When the inclination angle θ of the discharge nozzle 51 was 20 degrees to 30 degrees, the UV-curing adhesive 40 could be filled in the vent hole 30, and the filling process could be properly performed.
・When the inclination angle θ of the ejection nozzle 51 was 30 degrees to 60 degrees, the ultraviolet curable adhesive 40 could be filled in the vent hole 30, and the filling process could be performed properly. The filling time was the same as when the inclination angle θ was 20 degrees to 30 degrees.
・When the inclination angle θ of the discharge nozzle 51 was 60 degrees to 70 degrees, the UV-curing adhesive 40 could be filled in the air hole 30, and the filling process could be properly performed. The filling time was the same as when the inclination angle θ was 20 degrees to 30 degrees.

From the above, as a result of the second confirmation test, the nozzle axis O1 of the discharge nozzle 51 with respect to the center line O2 of the vent hole 30 was set at an inclination angle θ within the range of 20 degrees to 70 degrees. It was confirmed that it is effective to incline 51, and that it is preferable to incline it within the range of 30 degrees to 60 degrees.
As a result of conducting the reliability test described above after the second confirmation test, it was confirmed that all the optical electronic components 1 operated satisfactorily.

Although embodiments of the present invention have been described above, these embodiments are presented as examples and are not intended to limit the scope of the invention. Embodiments can be implemented in various other forms, and various omissions, replacements, and modifications can be made without departing from the scope of the invention. Embodiments and modifications thereof include, for example, those that can be easily imagined by those skilled in the art, those that are substantially the same, and those within an equivalent range.

For example, in the above embodiment, as shown in FIG. 10, the cavity 6 may be filled with an inert gas G such as nitrogen or rare gas. In this case, after reducing the pressure in the cavity 6 by using, for example, a vacuum heating furnace, the step of replacing with the inert gas G is performed to fill the cavity 6 with the inert gas G. After that, the ventilation holes 30 may be air-tightly sealed by filling the ventilation holes 30 with the ultraviolet curable adhesive 40 and hardening it by irradiation with ultraviolet rays UV.
In the case of such a configuration, it is possible to further improve moisture resistance, corrosion resistance, etc., and it is possible to contribute to improvement in operation reliability.

Furthermore, in the above-described embodiment, the ventilation hole 30 is formed so as to penetrate the front wall 26 of the peripheral wall portion 25 in the front-rear direction L1. However, a vent hole 60 may be formed in a concave shape at the upper open end of the front wall 26 so as to open further upward.
Even in this case, it is possible to achieve similar effects.

Furthermore, in the above embodiment, the case where the ventilation holes 30 are formed in the front wall 26 of the peripheral wall portion 25 constituting the base portion 3 has been described as an example, but the present invention is not limited to this case. As shown, the electronic component 70 may have a ventilation hole 30 formed in the lid portion 4 .
In this case, the electronic element sealed in the cavity 6 is preferably an electronic element 71 such as a semiconductor chip instead of an optical element. Further, in order to form the ventilation holes 30 in the lid portion 4, the lid portion 4 may be made of, for example, a synthetic resin substrate having a certain rigidity, instead of an optically transparent material such as glass.
Even with the electronic component 70 configured in this manner, it is possible to achieve the same effects as those of the above-described embodiment. Even when the lid portion 4 is formed with the vent hole 30, it is preferable to incline the discharge nozzle 51 in the front-rear direction L1 or in the left-right direction L2.

Furthermore, in the above-described embodiment, the lead frame 10, the base portion 20, and the peripheral wall portion 25 form the cylindrical base portion 3 with a bottom, but the lead frame 10 is not an essential component and may be omitted.

Further, as shown in FIG. 14, a flat plate-shaped base portion 81 and a capped cylindrical lid portion 83 having a peripheral wall portion 25 and a ceiling wall portion 82 are provided. may be used as the electronic component 80 formed with the . In this case, for example, the extraction electrodes 84 and the like may be formed on the base 81 , and the extraction electrodes 84 and the electronic element 71 may be electrically connected by the metal wires 7 .
Note that the lid portion 83 is fixed to the base portion 81 via the thermosetting adhesive 5 . Furthermore, the base portion 81 and the lid portion 83 function as the hollow package 8 .
Even with the electronic component 80 configured in this way, it is possible to achieve the same effects as those of the above-described embodiment.

G... Inert gas O1... Nozzle axis of ejection nozzle O2... Center line of air hole 1... Optical electronic component (electronic component)
2... Optical element (electronic element)
Reference Signs List 3, 81 Base portion 4, 83 Lid portion 5 Thermosetting adhesive 6 Cavity 25 Peripheral wall portion (frame portion)
REFERENCE SIGNS LIST 30, 60 Vent 31 Outer opening of vent 32 Inner opening of vent 40 Ultraviolet curing adhesive 51 Discharge nozzle 70, 80 Electronic component 71 Electronic element

Claims (13)

an electronic element;
a base on which the electronic element is mounted;
a lid that is joined to the base via a thermosetting adhesive and hermetically seals the electronic element within the cavity;
The base portion or the lid portion is formed with a vent hole communicating between the inside of the cavity and the outside,
1. An electronic component according to claim 1, wherein said vent is hermetically sealed by curing an ultraviolet curable adhesive filled in said vent. The electronic component according to claim 1,
The electronic component, wherein the ultraviolet curable adhesive contains at least one of an anaerobic catalyst and a thermosetting catalyst in a base resin having a modified acrylate. The electronic component according to claim 1 or 2,
The electronic component, wherein the ultraviolet curable adhesive has a viscosity within a range of 100 mPa·s (millipascal seconds) to 100000 mPa·s before curing. In the electronic component according to any one of claims 1 to 3,
The electronic component, wherein the ultraviolet curable adhesive contains a photopolymerization initiator having a reaction wavelength within the range of 300 nm to 500 nm. In the electronic component according to any one of claims 1 to 4,
The electronic component according to claim 1, wherein the ventilation hole is formed with an opening diameter of an outer opening that opens to the outside in a range of 0.05 mm to 1.0 mm. In the electronic component according to any one of claims 1 to 5,
The electronic component according to claim 1, wherein the ventilation hole has a length of 5 mm or less between an outer opening that opens to the outside and an inner opening that opens to the cavity. In the electronic component according to any one of claims 1 to 6,
The electronic component according to claim 1, wherein the air hole has a tapered cross-section whose diameter gradually decreases from an outer opening that opens to the outside toward an inner opening that opens to the cavity. In the electronic component according to any one of claims 1 to 7,
The electronic component, wherein the cavity is filled with an inert gas. In the electronic component according to any one of claims 1 to 8,
The base has a frame surrounding the electronic element,
The vent hole is formed in the frame,
The lid is made of an optically transparent material,
An electronic component, wherein the electronic element is an optical element. Manufacture of an electronic component comprising an electronic element, a base on which the electronic element is mounted, and a lid joined to the base with a thermosetting adhesive to hermetically seal the electronic element in a cavity a method,
a mounting step of mounting the electronic element on the base;
a stacking step of stacking the base portion or the lid portion provided with a vent hole communicating between the inside of the cavity and the outside, with the thermosetting adhesive interposed therebetween;
a first sealing step of curing the thermosetting adhesive by heating while reducing the pressure in the cavity to a predetermined degree of vacuum by discharging the gas in the cavity to the outside through the vent;
a filling step of filling an ultraviolet curable adhesive into the vent while maintaining the degree of vacuum in the cavity;
and a second sealing step of curing the ultraviolet curable adhesive filled in the ventilation hole by irradiating it with ultraviolet rays to airtightly seal the ventilation hole. Method. In the method for manufacturing an electronic component according to claim 10,
The filling step includes
a setting step of setting a discharge nozzle for discharging the ultraviolet curable adhesive so as to face an outer opening of the vent hole that is open to the outside, with a predetermined clearance left therebetween;
A discharging step of discharging and filling the ultraviolet curable adhesive into the vent hole so that the ultraviolet curable adhesive is in contact with the entire circumference of the opening peripheral edge of the outer opening. A method of manufacturing electronic components. In the method for manufacturing an electronic component according to claim 11,
During the ejection step, ejection is performed while the ejection nozzle is inclined such that the nozzle axis of the ejection nozzle has an inclination angle within the range of 20 degrees to 70 degrees with respect to the center line of the vent hole. method of manufacturing electronic components. In the method for manufacturing an electronic component according to claim 11 or 12,
The method of manufacturing an electronic component, wherein during the ejection step, the ejection nozzle is moved along the opening surface of the outer opening while ejecting the ultraviolet curable adhesive.

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