JP2022125980A - Modified epoxy resin, resin composition, cured product, laminate for electric/electronic circuits, and method for producing modified epoxy resin - Google Patents

Abstract

To provide a modified epoxy resin having excellent solvent solubility and resin compatibility, a resin composition containing the same, a cured product thereof having excellent thermostability and dielectric properties, and a laminate for electric/electronic circuits.SOLUTION: The present invention relates to a modified epoxy resin represented by a formula (1) (where each X is a divalent group, including at least a divalent group represented by a formula (2)).SELECTED DRAWING: None

Description

The present invention provides a modified epoxy resin having excellent solvent solubility and resin compatibility, a resin composition containing the modified epoxy resin and a curing agent, a cured product thereof having excellent heat resistance and dielectric properties, and the resin composition. The present invention relates to a laminate for electric/electronic circuits.

Epoxy resins have excellent heat resistance, adhesiveness, chemical resistance, water resistance, mechanical strength and electrical properties, and are widely used in fields such as paints, civil engineering, adhesives, and electrical materials. Film formability is imparted by increasing the molecular weight by various methods. The high molecular weight epoxy resins are called phenoxy resins. In particular, bisphenol A type phenoxy resins are mainly used as base resins for paint varnishes, base resins for film molding, or added to epoxy resin varnishes to adjust fluidity, improve toughness when cured, and improve adhesiveness. Used for improvement purposes. Further, those having a phosphorus atom or a bromine atom in the skeleton are used as flame retardants blended in epoxy resin compositions and thermoplastic resins.

Epoxy resins used as electrical materials such as laminates for electrical and electronic circuits are required to have solvent solubility and resin compatibility in addition to heat resistance and the like. In recent years, the miniaturization and performance enhancement of information equipment have progressed rapidly, and along with this, materials used in the fields of semiconductors and electronic components are required to have higher performance than ever before. Low dielectric properties are also required along with high functionality.

In response to such demands, methods have been proposed to improve heat resistance by making molecular chains bulky and suppressing micro-Brownian motion. Patent Document 1 discloses a phenoxy resin having excellent heat resistance obtained by reacting a bulky bisphenol compound and a bifunctional epoxy resin, and a cured product thereof. However, although this method can impart excellent heat resistance to the phenoxy resin and its cured product, there is a problem that the dielectric properties are not improved.

On the other hand, there has been proposed a method of improving dielectric properties by converting hydroxyl groups present in side chains of phenoxy resins into esters using acetyl groups or benzoyl groups. Patent Document 2 discloses that a phenoxy resin obtained by reacting a difunctional epoxy resin and a diester compound and a cured product thereof have excellent dielectric properties, but there is a problem that heat resistance is still insufficient. Patent Document 3 discloses that a cured product of an epoxy resin obtained by reacting a diacylated bisphenol compound and a bisphenol type epoxy resin has low viscosity and high heat resistance. However, when a phenol-based curing agent is used, there is a problem of poor heat resistance.

Japanese Patent Application Laid-Open No. 2008-231428 JP 2016-089165 A JP-A-8-333437

An object of the present invention is to provide an epoxy resin excellent in solvent solubility and resin compatibility. Another object of the present invention is to provide a cured product excellent in heat resistance and dielectric properties by curing a resin composition containing the same.

In order to solve the above problems, the present inventors have made intensive studies on epoxy resins, and found that epoxy resins having a specific structure are excellent in solvent solubility and resin compatibility. The inventors have found that a cured product obtained by curing the above has excellent heat resistance and dielectric properties, and completed the present invention.

式中、Ｘは２価の基であり、上記式（２）で表される２価の基を少なくとも有する。Ｙは独立に、水素原子、炭素数２～２０のアシル基、又はグリシジル基である。Ｚは炭素数２～２０のアシル基又は水素原子であり、５モル％以上は上記アシル基である。ｎは繰り返し数の平均値であり、１以上５００以下である。Ａはアリーレン基であり、Ｒ^１及びＲ^２は独立に、活性水素を有さず、ヘテロ元素を有する二価の基である。 That is, the present invention is represented by the following formula (1) and has an epoxy equivalent of 400 to 100,000 g/eq. is a modified epoxy resin.

In the formula, X is a divalent group and has at least a divalent group represented by the above formula (2). Y is independently a hydrogen atom, an acyl group having 2 to 20 carbon atoms, or a glycidyl group. Z is an acyl group having 2 to 20 carbon atoms or a hydrogen atom, and 5 mol % or more is the acyl group. n is the average number of repetitions and is 1 or more and 500 or less. A is an arylene group, R ¹ and R ² are independently divalent groups having no active hydrogen and having a heteroatom.

Further, the present invention is a resin composition containing the above modified epoxy resin and a curing agent.
The resin composition preferably contains 0.1 to 100 parts by mass of a curing agent as a solid content with respect to 100 parts by mass of the solid content of the modified epoxy resin.

The resin composition contains the modified epoxy resin, another epoxy resin, and a curing agent, and the mass ratio of the solid content of the modified epoxy resin to the other epoxy resin is from 99/1 to 1/99. can.
This resin composition preferably contains 0.1 to 100 parts by mass of a curing agent as a solid content with respect to 100 parts by mass of the total solid content of the modified epoxy resin and the other epoxy resin.

Examples of the curing agent to be blended in the above resin composition include acrylic acid ester resins, melamine resins, urea resins, phenol resins, acid anhydride compounds, amine compounds, imidazole compounds, amide compounds, cationic polymerization initiators, There is at least one selected from the group consisting of organic phosphines, polyisocyanate compounds, blocked isocyanate compounds, carbodiimide compounds and active ester curing agents.

The present invention also provides a cured product obtained by curing the above resin composition.
Further, the present invention is a laminate for electric/electronic circuits using the above resin composition.

式中、Ｘ^１、Ｘ^２は２価の基であり、Ｘ^１及び／又はＸ^２は上記式（２）で表される２価の基を含む。Ｇはグリシジル基である。Ｑは炭素数２～２０のアシル基又は水素原子であり、５モル％以上は上記アシル基である。ここで、式（４）で表される化合物は、Ｑの両者がアシル基である化合物、一方がアシル基である化合物、及び両方が水素原子である化合物から選ばれる２種以上の混合物であってもよい。ｍは繰り返し数の平均値であり、０以上６以下である。 The present invention also provides a method for producing a modified epoxy resin, characterized by reacting a bifunctional epoxy resin represented by the following formula (3) with a compound represented by the following formula (4).

In the formula, X ¹ and X ² are divalent groups, and X ¹ and/or X ² includes a divalent group represented by formula (2) above. G is a glycidyl group. Q is an acyl group having 2 to 20 carbon atoms or a hydrogen atom, and 5 mol % or more is the acyl group. Here, the compound represented by formula (4) is a mixture of two or more selected from a compound in which both Q are acyl groups, a compound in which one of Q is an acyl group, and a compound in which both are hydrogen atoms. may m is the average value of the number of repetitions, and is 0 or more and 6 or less.

式中、Ｘは２価の基であり、上記式（２）で表される２価の基を含む。Ｌは独立に、水素原子又はグリシジル基である。Ｔは炭素数２～２０のアシル基である。ｎは繰り返し数の平均値であり、１以上５００以下である。 0.05 mol or more and 2.0 mol or less of the acid anhydride represented by the following formula (6) is reacted with 1 mol of the alcoholic hydroxyl equivalent of the epoxy resin represented by the following formula (5). A method for producing the above-described modified epoxy resin.

In the formula, X is a divalent group, including the divalent group represented by formula (2) above. L is independently a hydrogen atom or a glycidyl group. T is an acyl group having 2 to 20 carbon atoms. n is the average number of repetitions and is 1 or more and 500 or less.

ADVANTAGE OF THE INVENTION According to this invention, the modified epoxy resin excellent in a dielectric property and heat resistance can be provided. Moreover, a resin composition using this modified epoxy resin can provide a cured product having excellent dielectric properties and heat resistance. Therefore, the modified epoxy resin and resin composition of the present invention can be applied to various fields such as adhesives, paints, construction materials for civil engineering, and insulating materials for electrical and electronic parts. It is useful as a casting material, lamination material, sealing material, and the like. The phenoxy resin of the present invention and the resin composition containing the same can be used for multilayer printed wiring boards, laminates for electric and electronic circuits such as capacitors, adhesives such as film adhesives and liquid adhesives, semiconductor sealing materials, and underfills. materials, inter-chip fill materials for 3D-LSI, insulating sheets, prepregs, heat dissipation substrates, and the like.

1 is a GPC chart of the modified epoxy resin of Example 1. FIG. 1 is an IR chart of the modified epoxy resin of Example 1. FIG. 2 is a GPC chart of the modified epoxy resin of Example 8. FIG. 4 is an IR chart of the modified epoxy resin of Example 8. FIG. 2 is a GPC chart of the modified epoxy resin of Example 9. FIG. 10 is an IR chart of the modified epoxy resin of Example 9. FIG.

The modified epoxy resin of the present invention is represented by the above formula (1), is an epoxy resin having an epoxy equivalent (g/eq.) of 400 to 100,000, and has a structure represented by the above formula (2). Furthermore, it has a structure in which some or all of the hydrogen atoms in the hydroxyl groups are substituted (modified) with acyl groups (Z). If the epoxy equivalent is within the above range, the modified epoxy resin can participate in the curing reaction and be incorporated into the crosslinked structure. The epoxy equivalent is preferably 500 to 80,000, more preferably 600 to 70,000, even more preferably 700 to 60,000.
In film applications, since film forming properties are required, it is desirable that the epoxy equivalent is higher, 5,000 to 100,000, more preferably 10,000 to 100,000, and still more preferably 20,000 to 20,000. 100,000.
On the other hand, for substrate applications in which a base material is impregnated for use, good impregnability etc. are required. 000, more preferably 400 to 3,000.

The weight average molecular weight (Mw) of the modified epoxy resin of the present invention is preferably 500 or more and 200,000 or less. Here, if the Mw is less than 500, the introduction of the structure for improving the heat resistance of the cured product may decrease, which is not preferable. If Mw is more than 200,000, compatibility may be lowered and handling of the resin may become difficult, which is not preferable. Moreover, from the viewpoint of improving the film formability of the modified epoxy resin, Mw is preferably 5,000 or more, more preferably 10,000 or more, and even more preferably 15,000 or more. From the viewpoint of improving compatibility and handleability, Mw is more preferably 160,000 or less, even more preferably 120,000 or less, and particularly preferably 80,000 or less. For substrate applications in which a base material is impregnated, Mw may be 10,000 or less, more preferably 5,000 or less.
The Mw of the modified epoxy resin can be measured by the gel permeation chromatography method (GPC method) described in Examples.

The modified epoxy resin of the present invention has a structure in which the hydrogen atoms in the hydroxyl groups are substituted (modified) with acyl groups, so that it becomes low in polarity and has excellent dielectric properties, low hygroscopicity, solvent solubility, Better resin compatibility. Moreover, by having the structure represented by the above formula (2), an excellent effect of heat resistance can be obtained.

The modified epoxy resin of the present invention can be advantageously obtained by the production method of the present invention. In this specification, the modified epoxy resin obtained by the production method of the present invention is sometimes referred to as the "modified epoxy resin of the present invention", and the cured product obtained by curing the resin composition of the present invention is referred to as the "cured product of the present invention. , the method for producing the modified epoxy resin of the present invention may be referred to as the “production method of the present invention”.

In the above formula (1), X is a divalent group, either the divalent group represented by the above formula (2) or other divalent groups other than these, but as a whole, It necessarily contains a divalent group represented by formula (2). Further, the divalent group represented by formula (2) is preferably 1 mol% or more, more preferably 10 mol% or more, still more preferably 20 mol% or more, and 40 mol, relative to the total number of moles of X. % or more is particularly preferred. Outside this range, the heat resistance may deteriorate.

In formula (2), A is an arylene group, and this arylene group is not particularly limited. Examples of the arylene group include monocyclic aromatic groups such as a phenylene group and polycyclic aromatic groups such as a naphthalene ring. Further, in the arylene group, the hydrogen atom bonded to the aromatic ring is an alkyl group, an alkenyl group, an alkynyl group, a formyl group, an alkyloxy group, an alkenyloxy group, an alkynyloxy group, an alkylcarbonyl group, an alkenylcarbonyl group, Alternatively, derivatives substituted with functional groups such as alkynylcarbonyl groups are also included. In addition, the alkyl group is not particularly limited, and for example, an alkyl group having 1 to 18 carbon atoms is preferable, and an alkyl group having 1 to 10 carbon atoms is more preferable. Specific examples include methyl group, ethyl group, propyl group, butyl group, hexyl group, and decyl group. These arylene groups are preferably an unsubstituted phenylene group, an unsubstituted naphthylene group, a phenylene group having an alkyl group of 1 to 10 carbon atoms, or a naphthylene group having an alkyl group of 1 to 10 carbon atoms.

R ¹ and R ² in the above formula (2) are each independently a divalent group having no active hydrogen and having a hetero element, and at least one hetero element in the -R ¹ -R ² - structure. have

In the present invention, "active hydrogen" means a hydrogen atom directly bonded to any one of an oxygen atom, a sulfur atom and a nitrogen atom. These active hydrogens are highly reactive and react with various reagents. Examples of substituents having active hydrogen include -OH, -SH, -NH ₂ , -NH- and -COOH. If active hydrogen exists in at least one of R ¹ and R ² in formula (2), gelation during production and deterioration of stability during storage may occur. Therefore, the modified epoxy resin of the present invention does not have active hydrogen in R ¹ and R ² of formula (2).

In the present invention, "heteroelement" means nitrogen, phosphorus, arsenic, antimony, oxygen, sulfur, selenium and tellurium. R ¹ and R ² are preferably -O-, -N(R ³ )-(R ³ is a hydrocarbon group having 1 to 10 carbon atoms), -CO-, -SO ₂ -, -S-, -PO ₂ - and the like. Among these, R ¹ is preferably -O- or -N(Ph)- (Ph: phenyl group), and R ² is preferably -CO- or -SO ₂ -.

Examples of the divalent group represented by the above formula (2) include, but are not limited to, divalent groups represented by the following formulas (2a) to (2i). Among these, (2a), (2b), (2c), (2d), (2g), (2h), and (2i) are preferred, and (2
a), (2c), (2d), (2g), (2h) and (2i) are more preferred, and (2a), (2c), (2g), (2h) and (2i) are even more preferred.

The divalent group other than the divalent group structure represented by formula (2) is preferably a divalent hydrocarbon group or -O-, -CO-, -S-, - It is a hydrocarbon group which may have groups such as COO-, -SO-, and -SO ₂ -. These divalent groups include, for example, an aromatic skeleton representing a residual skeleton obtained by removing two hydroxyl groups from an aromatic diol compound, an aliphatic skeleton representing a residual skeleton obtained by removing two hydroxyl groups from an aliphatic diol compound, and an alicyclic skeleton representing a residual skeleton obtained by removing two hydroxyl groups from an alicyclic diol compound.
These groups are the residual skeleton obtained by removing two glycidyloxy groups from a bifunctional epoxy resin (diglycidyl ether compound), the residual skeleton obtained by removing two ester structures from a diester compound, and the two hydroxyl groups removed from a bifunctional phenol compound. It is derived from the residual skeleton.

Specifically, the aromatic skeleton having a structure obtained by removing two hydroxyl groups from an aromatic diol compound includes bisphenol A, bisphenolacetophenone, bisphenol AF, bisphenol AD, bisphenol B, bisphenol BP, bisphenol C, bisphenol E, bisphenol F, bisphenol G, bisphenol M, bisphenol S, bisphenol P, bisphenol PH, bisphenol trimethylcyclohexane and bisphenol type optionally having an alkyl group having 1 to 10 carbon atoms as a substituent such as bisphenol trimethylcyclohexane and bisphenol cyclohexane, hydroquinone, Benzene types such as dihydroxyphenyls optionally having an unsubstituted or C 1-10 alkyl group such as resorcinol and catechol as a substituent, or unsubstituted or substituted C 1-10 alkyl groups Naphthalene types such as dihydroxynaphthalenes which may have as a group, biphenyl types such as dihydroxybiphenyls which may have unsubstituted or an alkyl group having 1 to 10 carbon atoms as a substituent, and bisphenol fluorene and fluorene types such as bisphenol fluorenes and bisnaphthol fluorenes which may have an unsubstituted or C 1-10 alkyl group as a substituent such as biscresol fluorene, 10-(2,5-dihydroxy Phenyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO-HQ), 10-(2,7-dihydroxynaphthyl)-9,10-dihydro-9-oxa-10 - phosphaphenanthrene-10-oxide (DOPO-NQ), 10-(1,4-dihydroxy-2-naphthyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide, diphenylphosphinylhydroquinone, Diphenylphosphinyl-1,4-dioxynaphthalene, 1,4-cyclooctylenephosphinyl-1,4-phenyldiol, 1,5-cyclooctylenephosphinyl-1,4-phenyldiol, etc. Phosphorus-containing phenol types which may be unsubstituted or may have an alkyl group, an aryl group or an aralkyl group having 1 to 10 carbon atoms as a substituent.

Specific examples of the aliphatic skeleton include alkylene glycol skeletons such as ethylene glycol, propylene glycol and butylene glycol.

Specific examples of the alicyclic skeleton include hydrogenated bisphenol skeletons such as hydrogenated bisphenol A, hydrogenated bisphenol F, and hydrogenated bisphenolacetophenone.

In formula (1), Y is independently a hydrogen atom, an acyl group having 2 to 20 carbon atoms, or a glycidyl group. When Y is a hydrogen atom, it gives a hydroxyl group at the terminal, when it is an acyl group, it gives an ester group at the terminal, and when it is a glycidyl group, it gives an epoxy group at the terminal. An acyl group is represented by R--CO--, where R is a hydrocarbon group having 1 to 19 carbon atoms. It is preferable to control the ratio of these terminal groups according to the application.
In the acyl group (R—CO—), the hydrocarbon group having 1 to 19 carbon atoms represented by R includes an alkyl group having 1 to 12 carbon atoms, an aryl group having 6 to 12 carbon atoms, or 7 to 13 carbon atoms. is preferred.
The alkyl group having 1 to 12 carbon atoms may be linear, branched or cyclic, and examples thereof include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, sec-butyl group, t-butyl group, n-pentyl group, isopentyl group, neopentyl group, t-pentyl group, cyclopentyl group, n-hexyl group, isohexyl group, cyclohexyl group, n-heptyl group, cycloheptyl group, methylcyclohexyl group, n- octyl group, cyclooctyl group, n-nonyl group, 3,3,5-trimethylcyclohexyl group, n-decyl group, cyclodecyl group, n-undecyl group, n-dodecyl group, cyclododecyl group and the like.
Examples of the aryl group having 6 to 12 carbon atoms include phenyl group, tolyl group, ethylphenyl group, xylyl group, n-propylphenyl group, isopropylphenyl group, mesityl group, naphthyl group, methylnaphthyl group and the like.
Examples of the aralkyl group having 7 to 13 carbon atoms include, but are not limited to, benzyl group, methylbenzyl group, dimethylbenzyl group, trimethylbenzyl group, phenethyl group, 2-phenylisopropyl group, naphthylmethyl group and the like. .
Among these, an acyl group having a hydrocarbon group of 1 to 7 carbon atoms is more preferable, an acetyl group, propanoyl group, butanoyl group, benzoyl group and methylbenzoyl group are more preferable, and an acetyl group and benzoyl group are particularly preferable.

In formula (1), Z is an acyl group having 2 to 20 carbon atoms or a hydrogen atom. At least 5 mol % of Z are acyl groups and the rest are hydrogen atoms. 10 mol % or more, preferably 50 mol % or more, more preferably 70 mol % or more, and still more preferably 90 mol % or more of Z are acyl groups. On the other hand, although the upper limit is 100%, the reaction may be substantially about 95%. The acyl group is the same as those exemplified for Y above, and preferred acyl groups are also the same.
When all (100 mol %) of Z are acyl groups, the modified epoxy resin of the present invention does not contain secondary hydroxyl groups, and the dielectric properties and moisture resistance can be further improved. On the other hand, for example, when finely adjusting the adhesiveness to metal, by leaving a part of Z as a hydrogen atom, the modified epoxy of the present invention is used as long as it does not greatly affect other physical properties such as moisture resistance. A suitable amount of secondary hydroxyl groups can be intentionally present in the resin.

In formula (1), n is the number of repetitions and the average value. Its value ranges from 1 to 500. It is preferably 1 or more and 400 or less, more preferably 1 or more and 300 or less, from the viewpoint of moldability and handleability. The n number can be calculated from the number average molecular weight (Mn) obtained by the GPC method.

The modified epoxy resin of the present invention is obtained by acylating some or all of the secondary hydroxyl groups, and can be obtained by various methods. A preferable manufacturing method includes, for example, the following manufacturing method.
(A); A production method of reacting a bifunctional epoxy resin represented by the above formula (3) with a diester compound and/or a bifunctional phenol compound represented by the above formula (4). Hereinafter, this method may be referred to as manufacturing method (A).
(B); the epoxy resin represented by the above formula (5) (sometimes referred to as epoxy resin (a) to distinguish it from the modified epoxy resin of the present invention), an acid anhydride of an organic acid, an organic A production method in which an acid component (acylating agent) such as an acid halide or an organic acid ester is reacted. Hereinafter, this method may be referred to as manufacturing method (B).
The modified epoxy resins obtained by production methods (A) and (B) are the modified epoxy resins of the present invention and are represented by the same formula (1).

The production method (A) is a method of reacting a bifunctional epoxy resin represented by formula (3) with a compound represented by formula (4).
In the above formula (3), G is a glycidyl group, m is the number of repetitions, and the average value thereof is 0 or more and 6 or less, preferably 0 or more and 3 or less.
In formula (4), Q is an acyl group having 2 to 20 carbon atoms.
In formula (4), 5 mol % or more of Q are acyl groups having 2 to 20 carbon atoms, and the rest are hydrogen atoms. Here, the compounds represented by formula (4) include diester compounds in which both Q are acyl groups, monoester compounds in which one is an acyl group and the other is a hydrogen atom, and diphenols in which both are hydrogen atoms. It may be a mixture of two or more selected from compounds. A compound represented by the formula (4) is called a diester compound. The diester compound is preferably a diester compound in which both Qs are acyl groups or a compound (mixture) in which the compound is the main component (50% or more).

X ¹ in equation (3) and X ² in equation (4) are selected to give X in equation (1). Therefore, either one or both of the epoxy resin represented by formula (3) and the compound represented by formula (4) contain a divalent group represented by formula (2), and this group is X ¹ and X ² are preferably contained in an amount of 1 to 100 mol % based on the total number of moles of X 2 . From the viewpoint of sufficiently expressing the heat resistance attributed to the divalent group represented by formula (2), the content of the divalent group represented by formula (2) is more preferably 10 mol% or more, more preferably is 20 mol % or more, particularly preferably 40 mol % or more.
The modified epoxy resin of the present invention necessarily contains a divalent group represented by formula (2). Alternatively, it may be contained in any of the compounds represented by formula (4), and its proportion is not limited. In addition, when X ¹ in formula (3) or X ² in formula (4) does not contain a divalent group represented by formula (2), X ¹ or X ² is another divalent group can be introduced.

The bifunctional epoxy resin used in the production method (A) of the present invention is ^an epoxy resin represented by the above formula (3). and an epoxy resin obtained by reacting in the presence of an alkali metal compound. Here, X ¹ is the same as X ¹ in formula (3) above.

The raw material epoxy resin represented by formula (3) preferably has an epoxy equivalent of 100 to 400 g/eq. , more preferably 300 g/eq. It is below. The value of m in formula (3) is preferably 0 to 1, more preferably 0.3 or less.

Epihalohydrin includes, for example, epichlorohydrin and epibromohydrin.
Examples of alkali metal compounds include alkali metal hydroxides such as sodium hydroxide, lithium hydroxide and potassium hydroxide; alkali metal salts such as sodium carbonate, sodium bicarbonate, sodium chloride, lithium chloride and potassium chloride; Examples include alkali metal alkoxides such as sodium methoxide and sodium ethoxide, alkali metal salts of organic acids such as sodium acetate and sodium stearate, alkali metal phenoxides, sodium hydride and lithium hydride.

In the reaction of the bifunctional phenol compound and epihalohydrin for obtaining the raw material epoxy resin, the molar amount is 0.80 to 1.20 times, preferably 0.85 to 1.05 times the functional group in the bifunctional phenol compound. A mole of alkali metal compound is used. If it is less than this, the amount of residual hydrolyzable chlorine will increase, which is not preferable. Alkali metal compounds are used in the form of aqueous solutions, alcoholic solutions or solids.

In the epoxidation reaction, an excess amount of epihalohydrin is used with respect to the bifunctional phenol compound. Generally, epihalohydrin is used in an amount of 1.5 to 15 times mol, preferably 2 to 10 times mol, more preferably 5 to 8 times mol, per 1 mol of the functional group in the bifunctional phenol compound. If it is more than this, the production efficiency will be lowered, and if it is less than this, the amount of high molecular weight epoxy resin produced will increase, making it unsuitable as a raw material.

The epoxidation reaction is usually carried out at a temperature of 120°C or less. If the temperature is high during the reaction, the amount of so-called hardly hydrolyzable chlorine increases, making it difficult to achieve high purification. The temperature is preferably 100° C. or lower, more preferably 85° C. or lower.

When the bifunctional phenol compound and epihalohydrin are reacted, m is usually greater than 0. In order to make m 0, the epoxy resin produced by a known method is highly purified by techniques such as distillation and crystallization, or the bifunctional phenol compound is allylated and then the olefin portion is oxidized. There is a method to epoxidize with

Further, the diester compound used in the production method (A) of the present invention is, for example, the above-mentioned bifunctional phenol compound, an acid anhydride of an organic acid, a halide of an organic acid, or an acylated condensation reaction with an organic acid. obtained by

By using an epoxy resin in which m in formula (3) is 0 as a raw material, the modified epoxy resin of the present invention does not contain a secondary hydroxyl group, and the dielectric properties and moisture resistance can be further improved. Further, for example, when fine-tuning the adhesiveness to metal, by using an epoxy resin with an appropriate number of m, the modified resin of the present invention can be used within a range that does not significantly affect other physical properties such as moisture resistance. An appropriate amount of secondary hydroxyl groups can be intentionally present in the epoxy resin.

The amount of the above bifunctional epoxy resin and diester compound to be used should be appropriately changed depending on the epoxy equivalent weight of the modified epoxy resin of interest. Equivalent weight is preferred. With this equivalent ratio, it becomes easier to proceed with the increase in molecular weight while having an epoxy group at the molecular terminal. It is also possible to replace part of the diester compound with the bifunctional phenol compound. Accordingly, as described above, the physical properties can be finely adjusted by allowing an appropriate amount of secondary hydroxyl groups to exist in the modified epoxy resin of the present invention.
In the production method (A), a polymerization reaction and an esterification reaction of secondary hydroxyl groups occur to increase Mw and produce a modified epoxy resin.

In the production method (A), a catalyst may be used, and any catalyst may be used as long as it has a catalytic ability to promote the reaction between the epoxy group and the ester group. Examples include tertiary amines, cyclic amines, imidazoles, organophosphorus compounds, quaternary ammonium salts and the like. Moreover, these catalysts may be used alone or in combination of two or more.

Examples of tertiary amines include triethylamine, tri-n-propylamine, tri-n-butylamine, triethanolamine, benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol and the like. , but not limited to.

Examples of cyclic amines include 1,4-diazabicyclo[2,2,2]octane (DABCO), 1,8-diazabicyclo[5,4,0]undecene-7 (DBU), 1,5-diazabicyclo[ 4,3,0]nonene-5 (DBN), N-methylmorpholine, pyridine, N,N-dimethylaminopyridine (DMAP), and the like, but are not limited thereto.

Examples of imidazoles include 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2- Examples include, but are not limited to, phenylimidazole and the like.

Examples of organic phosphorus compounds include tri-n-propylphosphine, tri-n-butylphosphine, diphenylmethylphosphine, triphenylphosphine, tris(p-tolyl)phosphine, tricyclohexylphosphine, tri(t-butyl)phosphine, Phosphines such as tris(p-methoxyphenyl)phosphine, paramethylphosphine, 1,2-bis(dimethylphosphino)ethane, 1,4-bis(diphenylphosphino)butane, tetramethylphosphonium bromide, tetramethylphosphonium Iodide, tetramethylphosphonium hydroxide, tetrabutylphosphonium hydroxide, trimethylcyclohexylphosphonium chloride, trimethylcyclohexylphosphonium bromide, trimethylbenzylphosphonium chloride, trimethylbenzylphosphonium bromide, tetraphenylphosphonium bromide, triphenylmethylphosphonium bromide, triphenylmethylphosphonium Phosphonium salts such as iodide, triphenylethylphosphonium chloride, triphenylethylphosphonium bromide, triphenylethylphosphonium iodide, triphenylbenzylphosphonium chloride, triphenylbenzylphosphonium bromide, etc., but not limited thereto.

Examples of quaternary ammonium salts include tetramethylammonium chloride, tetramethylammonium bromide, tetramethylammonium hydroxide, triethylmethylammonium chloride, tetraethylammonium chloride, tetraethylammonium bromide, tetraethylammonium iodide, tetrapropylammonium bromide, tetramethylammonium bromide, propylammonium hydroxide, tetrabutylammonium chloride, tetrabutylammonium bromide, tetrabutylammonium iodide, benzyltrimethylammonium chloride, benzyltrimethylammonium bromide, benzyltrimethylammonium hydroxide, benzyltributylammonium chloride, phenyltrimethylammonium chloride and the like. but not limited to these.

Among the catalysts listed above, 4-(dimethylamino)pyridine, 1,4-diazabicyclo[2,2,2]octane, 1,8-diazabicyclo[5,4,0]undecene-7, 1,5- diazabicyclo[4,3,0]nonene-5,2-ethyl-4-methylimidazole, tris(p-tolyl)phosphine, tricyclohexylphosphine, tri(t-butyl)phosphine, tris(p-methoxyphenyl)phosphine preferably 4-(dimethylamino)pyridine, 1,8-diazabicyclo[5,4,0]undecene-7,1,5-diazabicyclo[4,3,0]nonene-5,2-ethyl-4- Methylimidazole is preferred.

The amount of the catalyst used is usually 0.001 to 1% by mass based on the reaction solid content. It may deteriorate the insulating properties of the wiring board or shorten the pot life of the composition. Therefore, the nitrogen content derived from the catalyst in the modified epoxy resin is preferably 0.5% by mass or less, more preferably 0.3% by mass or less. Further, the catalyst-derived phosphorus content in the modified epoxy resin is preferably 0.5% by mass or less, more preferably 0.3% by mass or less.

In the production method (A), a solvent for the reaction may be used, and any solvent that dissolves the modified epoxy resin may be used. Examples thereof include aromatic solvents, ketone solvents, amide solvents, glycol ether solvents, ester solvents and the like. Also, these solvents may be used alone or in combination of two or more.

Examples of aromatic solvents include benzene, toluene, and xylene.

Ketone solvents include, for example, acetone, methyl ethyl ketone (MEK), methyl isobutyl ketone, 2-heptanone, 4-heptanone, 2-octanone, cyclohexanone, acetylacetone, diisobutyl ketone, isophorone, methylcyclohexanone, acetophenone and the like.

Examples of amide solvents include formamide, N-methylformamide, N,N-dimethylformamide (DMF), acetamide, N-methylacetamide, N,N-dimethylacetamide, 2-pyrrolidone, N-methylpyrrolidone and the like. be done.

Examples of glycol ether solvents include ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether and ethylene glycol mono-n-butyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether and diethylene glycol mono-n. - Diethylene glycol dialkyl ethers such as butyl ether, propylene glycol monoalkyl ethers such as propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-butyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol di Ethylene glycol dialkyl ethers such as butyl ether, polyethylene glycol dialkyl ethers such as diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dibutyl ether, triethylene glycol dimethyl ether, triethylene glycol diethyl ether, triethylene glycol dibutyl ether, propylene glycol dimethyl ether, Propylene glycol dialkyl ethers such as propylene glycol diethyl ether and propylene glycol dibutyl ether, dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, dipropylene glycol dibutyl ether, tripropylene glycol dimethyl ether, tripropylene glycol diethyl ether, tripropylene glycol diethyl ether Polypropylene glycol dialkyl ethers such as butyl ether, ethylene glycol monoalkyl ether acetates such as ethylene glycol monoethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monoethyl ether Polyethylene glycol monoalkyl ether acetate such as acetate, diethylene glycol monobutyl ether acetate, triethylene glycol monomethyl ether acetate, triethylene glycol monoethyl ether acetate, triethylene glycol monobutyl ether acetate and propylene glycol monoalkyl ether acetates such as propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate and propylene glycol monobutyl ether acetate.

Examples of ester solvents include methyl acetate, ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, benzyl acetate, ethyl propionate, ethyl butyrate, butyl butyrate, valerolactone, butyrolactone and the like.

Other solvents include, for example, dioxane, dimethylsulfoxide, sulfolane, γ-butyrolactone and the like.

In the production method (A), the solid content concentration during the reaction is preferably 35 to 95% by mass. More preferably 50 to 90% by mass, still more preferably 70 to 90% by mass. If a highly viscous product is produced during the reaction, additional solvent may be added to continue the reaction. After completion of the reaction, the solvent can be removed or added as necessary.

The reaction temperature is within a temperature range that does not decompose the catalyst used. If the reaction temperature is too high, the catalyst may decompose to stop the reaction, or the resulting modified epoxy resin may deteriorate. If the reaction temperature is too low, the reaction may not proceed sufficiently and the desired molecular weight may not be obtained. Therefore, the reaction temperature is preferably 50 to 230°C, more preferably 120 to 200°C. The reaction time is usually 1 to 12 hours, preferably 3 to 10 hours. When using a low boiling point solvent such as acetone or methyl ethyl ketone, the reaction temperature can be ensured by using an autoclave to carry out the reaction under high pressure. When the heat of reaction needs to be removed, it is usually carried out by evaporation/condensation/reflux of the solvent used by the heat of reaction, indirect cooling, or a combination thereof.

Next, the production method (B) of the present invention will be described.
The production method (B) comprises the epoxy resin represented by the formula (5), and 0.05 mol or more of the acid anhydride represented by the formula (6) per 1 mol of the alcoholic hydroxyl group equivalent of the epoxy resin. .0 mol or less, and the epoxy equivalent is 400 to 100,000 g/eq. This is a method for obtaining the modified epoxy resin represented by the formula (1), that is, the modified epoxy resin of the present invention.

The raw material epoxy resin (a) represented by formula (5) essentially contains a divalent group represented by formula (2) in X of formula (5).
This epoxy resin (a) can be obtained by a conventionally known method. For example, a method of producing by reacting a bifunctional phenol compound (sometimes referred to as "bifunctional phenol compound (a)") having a structure represented by the above formula (2) with epihalohydrin in the presence of an alkali metal compound. (hereinafter referred to as "one-step method"), or a bifunctional epoxy resin and a bifunctional phenol compound having a structure represented by the above formula (2) are added to at least one of the bifunctional epoxy resin and the bifunctional phenol compound. A method of producing by reacting in the presence of a catalyst (hereinafter referred to as a “two-step method”) can be mentioned. The epoxy resin (a) may be obtained by any manufacturing method.

For the weight average molecular weight and epoxy equivalent of the epoxy resin (a), the molar ratio of epihalohydrin and the bifunctional phenol compound charged in the one-step method and the molar ratio of the bifunctional epoxy resin and the bifunctional phenol compound charged in the two-step method are appropriately adjusted. By doing so, it is possible to manufacture products within the desired range.

Examples of the bifunctional phenol compound (a) used in the production of the one-step method and the two-step method include phenolphthalein and phenolphthalein anilide containing a divalent group represented by the above formula (2). be done.

Further, other bifunctional phenol compounds may be used in combination as long as the object of the present invention is not impaired. Bifunctional phenol compounds that may be used in combination include, for example, bisphenols such as bisphenol A, bisphenol F, bisphenol S, bisphenol B, bisphenol E, bisphenol C, bisphenolacetophenone, bisphenolfluorene, dihydroxybiphenyl ether, and dihydroxybiphenylthioether; Biphenols such as 4,4'-biphenol and 2,4'-biphenol, dihydroxynaphthalene, hydroquinone, catechol, resorcin, 1,1-bi-2-naphthol, 10-(2,5-dihydroxyphenyl)-9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO-HQ), 10-(2,7-dihydroxynaphthyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene- 10-oxide (DOPO-NQ) and the like.
Moreover, these bifunctional phenol compounds may use multiple types together.

First, the one-stage method will be described.
In the case of the one-step method, the epoxy resin (a) can be obtained by reacting a bifunctional phenol compound and epihalohydrin in the presence of an alkali metal compound in a non-reactive solvent, consuming the epihalohydrin, and conducting a condensation reaction. can. After completion of the reaction, it is necessary to remove by-product salts by filtration or washing with water. Examples of the alkali metal compound include those similar to those used in the production of the bifunctional epoxy resin represented by the above formula (3) used in the production method (A) of the present invention.
The weight-average molecular weight and epoxy equivalent of the epoxy resin (a) can be set within the desired range by appropriately adjusting the charged molar ratio of the bifunctional phenol compound and the epihalohydrin.
For example, when the weight average molecular weight of the epoxy resin (a) is 10,000 or more, 0.985 to 1.015 mol, preferably 0.99 to 1.0 mol of epihalohydrin is added to 1 mol of the bifunctional phenol compound. 012 mol, more preferably 0.995 to 1.01 mol. Also, the epoxy equivalent of the epoxy resin (a) was set to 5,000 g/eq. In the case of the following, epihalohydrin may be adjusted to 1.015 to 8 mol, preferably 1.05 to 6 mol, more preferably 1.1 to 5 mol, per 1 mol of the bifunctional phenol compound.

The number of moles of the bifunctional phenol compound (a) used as a raw material is preferably 1 mol% or more, more preferably 10 mol% or more, still more preferably 20 mol% or more, and 40 mol% of all the bifunctional phenol compounds. The above are particularly preferred. Outside this range, the modified epoxy resin of the present invention may have poor heat resistance.

This reaction can be carried out under normal pressure or under reduced pressure. The reaction temperature is usually preferably from 20 to 200°C, more preferably from 30 to 170°C, even more preferably from 40 to 150°C, particularly preferably from 50 to 100°C, when the reaction is carried out under normal pressure. In the case of the reaction under reduced pressure, the temperature is preferably 20 to 100°C, more preferably 30 to 90°C, even more preferably 35 to 80°C. If the reaction temperature is within this range, side reactions are less likely to occur and the reaction is likely to proceed. The reaction pressure is usually normal pressure. When the heat of reaction needs to be removed, it is usually carried out by evaporation/condensation/reflux of the solvent used, indirect cooling, or a combination thereof.

As the reactive solvent, alcohols such as ethanol, isopropyl alcohol, and butyl alcohol can be used in addition to the reaction solvents exemplified in the production method (A) of the present invention. Only one type may be used, or two or more types may be used in combination.

Next, the two-step method will be explained.
As the bifunctional epoxy resin used as the raw material epoxy resin for the two-step method, the same bifunctional epoxy resin represented by the above formula (3) used in the production method (A) of the present invention is used.

The bifunctional epoxy resin represented by the above formula (3) is preferable as the bifunctional epoxy resin used as the raw material of the two-step method, but other bifunctional epoxy resins may be used in combination as long as the object of the present invention is not impaired. . Examples of bifunctional epoxy resins that can be used in combination include bisphenol type epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol acetophenone type epoxy resin, diphenyl sulfide type epoxy resin, and diphenyl ether type epoxy resin. resins, biphenol-type epoxy resins, diphenyldicyclopentadiene-type epoxy resins, alkylene glycol-type epoxy resins, aliphatic cyclic epoxy resins, and the like. These epoxy resins may be substituted with substituents having no adverse effects, such as alkyl groups and aryl groups. These epoxy resins may be used in combination of multiple types.

In the case of the two-step method, a catalyst can be used, and any compound can be used as long as it has a catalytic ability to promote the reaction between the epoxy group and the phenolic hydroxyl group. For example, the same catalyst as exemplified in the production method (A) of the present invention can be used. Alkali metal compounds used in the production of bifunctional epoxy resins represented by the above formula (3) can also be used. These catalysts may be used alone or in combination of two or more. Also, the amount used is the same as the amount used as an example in the production method (A) of the present invention.

In the case of the two-step method, a solvent may be used, and any solvent may be used as long as it dissolves the epoxy resin and does not adversely affect the reaction. Examples thereof include the same solvents as those exemplified in the production method (A) of the present invention. These solvents may be used alone or in combination of two or more.

The amount of the solvent to be used can be appropriately selected according to the reaction conditions. Further, when a highly viscous product is produced during the reaction, the solvent can be added during the reaction to continue the reaction. After completion of the reaction, the solvent can be removed by distillation or the like, if necessary, or can be further added.

The reaction temperature is within a temperature range that does not decompose the catalyst used. If the reaction temperature is too high, the catalyst may decompose to stop the reaction, or the resulting epoxy resin may deteriorate. If the reaction temperature is too low, the reaction may not proceed sufficiently and the desired molecular weight may not be obtained. Therefore, the reaction temperature is preferably 50 to 230°C, more preferably 100 to 210°C, even more preferably 120 to 200°C. The reaction time is usually 1 to 12 hours, preferably 3 to 10 hours. When using a low boiling point solvent such as acetone or methyl ethyl ketone, the reaction temperature can be ensured by using an autoclave to carry out the reaction under high pressure. When the heat of reaction needs to be removed, it is usually carried out by evaporation/condensation/reflux of the solvent used by the heat of reaction, indirect cooling, or a combination thereof.

The modified epoxy resin of the present invention can be obtained by acylating the hydroxyl groups in the epoxy resin (a) represented by the formula (5) thus obtained. Acylation may be performed not only by direct esterification, but also by methods such as transesterification.

Examples of acid components used for the acylation include acetic acid, propionic acid, butyric acid, isobutyric acid, pentanoic acid, octanoic acid, caprylic acid, lauric acid, stearic acid, oleic acid, benzoic acid, t-butylbenzoic acid, Organic acids such as hexahydrobenzoic acid, phenoxyacetic acid, acrylic acid and methacrylic acid, acid anhydrides of organic acids, halides of organic acids, esters of organic acids, and the like can be used.

Acid anhydrides of organic acids include, for example, acetic anhydride, benzoic anhydride, and phenoxyacetic anhydride.
Examples of esterified organic acids include methyl acetate, ethyl acetate, butyl acetate, methyl benzoate, and ethyl benzoate. Halides of organic acids include, for example, acetic acid chloride, benzoic acid chloride, phenoxyacetic acid chloride and the like.

Compounds used for esterification include halides of organic acids such as acetic acid chloride, benzoic acid chloride and phenoxyacetic acid chloride, acid halides such as acetic anhydride, benzoic acid anhydride and phenoxyacetic acid anhydride, and acid anhydrides of organic acids. Acid anhydrides such as acetic anhydride and benzoic anhydride are more preferable in the sense that washing with water after esterification is not required and contamination of halogen, which is disliked in electronic materials, is avoided.

The epoxy resin (a) is reacted with an acid component such as the above organic acid, an acid anhydride of an organic acid, a halide of an organic acid, or an esterified product of an organic acid used for esterifying the hydroxyl group of the epoxy resin (a). The charging ratio at the time may be the same charging ratio as the target esterification ratio, or if the reactivity is low, the acid component is charged in excess with respect to the hydroxyl groups, reacted to the target esterification ratio, and then The acid component of the reaction may be removed.

In the case of direct esterification with an acid component, for example, acid catalysts such as p-toluenesulfonic acid and phosphoric acid, and various esters such as metal catalysts such as tetraisopropyl titanate, tetrabutyl titanate, dibutyltin oxide, dioctyltin oxide, and zinc chloride. It can be carried out while dehydrating using a dehydration catalyst. Generally, the temperature is preferably 100 to 250°C, more preferably 130 to 230°C, in a nitrogen atmosphere.

When acid halides or acid anhydrides are used for esterification, the resulting acid can be removed by filtering the salt after neutralization using a basic compound, or by washing with water after neutralization using a basic compound. A method of washing with water without neutralization, or a method of removing by distillation, adsorption, or the like may be used, or both methods may be used. When removing an acid having a boiling point lower than that of the reaction solvent, it is preferably removed by distillation.

When the epoxy resin (a) is esterified by transesterification, generally under a nitrogen atmosphere, for example, dibutyltin oxide, dioctyltin oxide, stanoxane catalyst, tetraisopropyl titanate, tetrabutyl titanate, lead acetate, zinc acetate, trioxide It is desirable to carry out while dealcoholizing using known esterification catalysts such as organometallic catalysts such as antimony, acid catalysts such as hydrochloric acid, sulfuric acid, phosphoric acid and sulfonic acid, and basic catalysts such as lithium hydroxide and sodium hydroxide. .

In the production method (B) of the present invention, a solvent for reaction may be used, and any solvent may be used as long as it dissolves the epoxy resin. Examples thereof include the solvents exemplified in the production method (A) of the present invention. These solvents may be the same as those used in the preparation of the epoxy resin (a), or may be different. Moreover, you may use only 1 type and may use it in combination of 2 or more types. The solid content concentration during the reaction is also the same as in production method (A), preferably 35 to 95% by mass, more preferably 50 to 90% by mass, still more preferably 70 to 90% by mass.

The resin composition of the present invention is a resin composition containing at least the modified epoxy resin of the present invention and a curing agent. In addition, various additives such as epoxy resins, inorganic fillers, coupling agents, antioxidants, and the like can be appropriately blended into the resin composition of the present invention, if necessary. The resin composition of the present invention provides a cured product that satisfactorily satisfies various physical properties required for various uses.

A resin composition can be prepared by blending a curing agent with the modified epoxy resin of the present invention. In the present invention, the curing agent refers to a substance that contributes to the cross-linking reaction and/or chain extension reaction with the modified epoxy resin. In the present invention, even if a substance is usually called a "curing accelerator", it is regarded as a curing agent as long as it contributes to the cross-linking reaction and/or chain lengthening reaction of the modified epoxy resin.

The content of the curing agent in the resin composition of the present invention is preferably 0.1 to 100 parts by mass in terms of solid content with respect to 100 parts by mass of the solid content of the modified epoxy resin of the present invention. Also, it is more preferably 80 parts by mass or less, and still more preferably 60 parts by mass or less.

When the resin composition of the present invention contains other epoxy resins described later, the weight ratio of the solid content of the modified epoxy resin of the present invention to the other epoxy resins is 99/1 to 1/99. In the present invention, the term "solid content" means components excluding solvent, and includes not only solid modified epoxy resins and other epoxy resins, but also semi-solid and viscous liquid substances. Moreover, the "resin component" means the total of the modified epoxy resin of the present invention and other epoxy resins described later.

The curing agent used in the resin composition of the present invention is not particularly limited, and all those generally known as curing agents for epoxy resins can be used. Phenolic curing agents, amide curing agents, imidazoles, active ester curing agents, and the like are preferred from the viewpoint of enhancing heat resistance. These curing agents may be used alone or in combination of two or more.

Examples of phenol-based curing agents include bisphenol A, bisphenol F, 4,4′-dihydroxydiphenylmethane, 4,4′-dihydroxydiphenyl ether, 1,4-bis(4-hydroxyphenoxy)benzene, 1,3-bis( 4-hydroxyphenoxy)benzene, 4,4'-dihydroxydiphenyl sulfide, 4,4'-dihydroxydiphenyl ketone, 4,4'-dihydroxydiphenyl sulfone, 4,4'-dihydroxybiphenyl, 2,2'-dihydroxybiphenyl, 10-(2,5-dihydroxyphenyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide, phenol novolak, bisphenol A novolak, o-cresol novolak, m-cresol novolak, p-cresol novolak , xylenol novolak, poly-p-hydroxystyrene, hydroquinone, resorcinol, catechol, t-butylcatechol, t-butylhydroquinone, fluoroglycinol, pyrogallol, t-butylpyrogallol, allylated pyrogallol, polyallylated pyrogallol, 1,2, 4-benzenetriol, 2,3,4-trihydroxybenzophenone, 1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1,8-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2,4-dihydroxynaphthalene, 2,5-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 2 ,8-dihydroxynaphthalene, allylated or polyallylated dihydroxynaphthalene, allylated bisphenol A, allylated bisphenol F, allylated phenol novolak, allylated pyrogallol, and the like.

Examples of amide curing agents include dicyandiamide and derivatives thereof, and polyamide resins.

Examples of imidazoles include 2-phenylimidazole, 2-ethyl-4(5)methylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyano-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino -6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl- s-triazine, 2,4-diamino-6-[2′-methylimidazolyl-(1′)]-ethyl-s-triazine isocyanurate, 2-phenylimidazole isocyanurate, 2-phenyl-4, 5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, adducts of epoxy resins and the above imidazoles, and the like. Since imidazoles have catalytic activity, they can generally be classified as curing accelerators, which will be described later, but they are classified as curing agents in the present invention.

Active ester-based curing agents include, for example, phenol esters, thiophenol esters, N-hydroxyamine esters, esters of heterocyclic hydroxy compounds, and the like, which have two or more highly reactive ester groups per molecule. Compounds are preferred, and phenol esters obtained by reacting a carboxylic acid compound with an aromatic compound having a phenolic hydroxyl group are more preferred. Specific examples of carboxylic acid compounds include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid. Examples of aromatic compounds having a phenolic hydroxyl group include catechol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucine, benzenetriol, dicyclopentadienyl diphenol, phenol novolak, and the like.

Other curing agents that can be used in the resin composition of the present invention include, for example, amine-based curing agents, acid anhydride-based curing agents, tertiary amines, organic phosphines, phosphonium salts, tetraphenylboron salts, organic Acid dihydrazides, halogenated boron amine complexes, polymercaptan-based curing agents, isocyanate-based curing agents, blocked isocyanate-based curing agents, carbodiimide compounds, and the like can be mentioned. These other curing agents may be used alone, or two or more of them may be used in any combination and ratio.

The resin composition of the present invention can contain epoxy resins other than the modified epoxy resin of the present invention. By using other epoxy resins, it is possible to compensate for insufficient physical properties and improve various physical properties. The epoxy resin preferably has two or more epoxy groups in the molecule, more preferably three or more epoxy groups. Examples thereof include polyglycidyl ether compounds, polyglycidylamine compounds, polyglycidyl ester compounds, alicyclic epoxy compounds, and other modified epoxy resins. These epoxy resins may be used alone, or two or more of the same epoxy resins may be used in combination, or different epoxy resins may be used in combination.

Examples of polyglycidyl ether compounds include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin, bisphenol Z type epoxy resin, bisphenol fluorene type epoxy resin, and diphenyl sulfide type epoxy resin. , diphenyl ether type epoxy resin, naphthalene type epoxy resin, hydroquinone type epoxy resin, resorcinol type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, alkyl novolak type epoxy resin, styrenated phenol novolak type epoxy resin, bisphenol novolak type epoxy resins, naphthol novolak type epoxy resins, phenol aralkyl type epoxy resins, β-naphthol aralkyl type epoxy resins, naphthalenediol aralkyl type epoxy resins, α-naphthol aralkyl type epoxy resins, biphenyl aralkyl phenol type epoxy resins, biphenyl type epoxy resins, Various epoxy resins such as triphenylmethane type epoxy resin, dicyclopentadiene type epoxy resin, alkylene glycol type epoxy resin, and aliphatic cyclic epoxy resin can be used.

Examples of polyglycidylamine compounds include diaminodiphenylmethane-type epoxy resins, meta-xylenediamine-type epoxy resins, 1,3-bisaminomethylcyclohexane-type epoxy resins, isocyanurate-type epoxy resins, aniline-type epoxy resins, hydantoin-type epoxy resins, Aminophenol-type epoxy resins and the like are included.

Examples of polyglycidyl ester compounds include dimer acid type epoxy resins, hexahydrophthalic acid type epoxy resins, and trimellitic acid type epoxy resins.

Alicyclic epoxy compounds include aliphatic cyclic epoxy resins such as Celoxide 2021 (manufactured by Daicel Chemical Industries, Ltd.).

Other modified epoxy resins include, for example, urethane-modified epoxy resins, oxazolidone ring-containing epoxy resins, epoxy-modified polybutadiene rubber derivatives, carboxyl group-terminated butadiene nitrile rubber (CTBN)-modified epoxy resins, polyvinylarene polyoxides (e.g., divinylbenzene di oxide, trivinylnaphthalene trioxide, etc.), phenoxy resins, and the like.

When the modified epoxy resin of the present invention and another epoxy resin are used in the resin composition of the present invention, the amount of the modified epoxy resin in the total components of the modified epoxy resin and the epoxy resin as a solid content is preferably It is 1 to 99% by mass, more preferably 50% by mass or more, and still more preferably 80% by mass or more.

The resin composition of the present invention may contain a solvent or a reactive diluent in order to appropriately adjust the viscosity of the resin composition during handling during coating film formation. In the resin composition of the present invention, the solvent or reactive diluent is used to ensure handleability and workability in molding the resin composition, and there is no particular limitation on the amount used. In the present invention, the term "solvent" and the above-mentioned "solvent" are used separately depending on the mode of use, but the same type or different types may be used independently.

Examples of the solvent that the resin composition of the present invention may contain include ketones such as acetone, methyl ethyl ketone (MEK), methyl isobutyl ketone and cyclohexanone, esters such as ethyl acetate, ethers such as ethylene glycol monomethyl ether, N, Examples include amides such as N-dimethylformamide and N,N-dimethylacetamide, alcohols such as methanol and ethanol, alkanes such as hexane and cyclohexane, and aromatics such as toluene and xylene. The solvents listed above may be used alone, or two or more of them may be mixed and used in any combination and ratio.

Examples of reactive diluents include monofunctional glycidyl ethers such as allyl glycidyl ether, bifunctional glycidyl ethers such as propylene glycol diglycidyl ether, polyfunctional glycidyl ethers such as trimethylolpropane polyglycidyl ether, and glycidyl esters. , and glycidylamines.

These solvents or reactive diluents are preferably used at a non-volatile content of 90% by mass or less, and the appropriate type and amount to be used are appropriately selected depending on the application. For example, for printed wiring board applications, a polar solvent having a boiling point of 160° C. or less, such as methyl ethyl ketone, acetone, or 1-methoxy-2-propanol, is preferred, and the amount used is preferably 40 to 80% by mass in terms of non-volatile matter. In addition, for adhesive film applications, for example, it is preferable to use ketones, acetic esters, carbitols, aromatic hydrocarbons, dimethylformamide, dimethylacetamide, N-methylpyrrolidone, etc., and the amount used is nonvolatile is preferably 30 to 60% by mass.

The resin composition of the present invention may optionally contain a curing accelerator or catalyst. Examples of curing accelerators or catalysts include imidazoles, tertiary amines, phosphorus compounds such as phosphines, metal compounds, Lewis acids, and amine complex salts. These may be used alone or in combination of two or more.

The amount of the curing accelerator or catalyst to be blended may be appropriately selected according to the purpose of use. be done. It is preferably 0.01 to 10 parts by mass, more preferably 0.05 to 8 parts by mass, still more preferably 0.1 to 5 parts by mass, and particularly preferably 0.1 to 1.0 parts by mass. By using a curing accelerator or catalyst, the curing temperature can be lowered and the curing time can be shortened.

Various known flame retardants can be used in the resin composition of the present invention for the purpose of improving the flame retardancy of the resulting cured product, as long as the reliability is not lowered. Usable flame retardants include, for example, halogen flame retardants, phosphorus flame retardants, nitrogen flame retardants, silicone flame retardants, inorganic flame retardants, and organic metal salt flame retardants. From an environmental point of view, halogen-free flame retardants are preferred, and phosphorus-based flame retardants are particularly preferred. These flame retardants may be used alone, or two or more flame retardants of the same type may be used in combination, or flame retardants of different types may be used in combination.

The resin composition of the present invention may contain components other than those listed above (which may be referred to as "other components" in the present invention) for the purpose of further improving its functionality. . Such other components include fillers, thermoplastic resins, thermosetting resins, photocurable resins, UV inhibitors, antioxidants, coupling agents, plasticizers, fluxes, thixotropic agents, and smoothing agents. , coloring agents, pigments, dispersants, emulsifiers, elasticity reducing agents, release agents, antifoaming agents, ion trapping agents and the like.

Examples of fillers include fused silica, crystalline silica, alumina, silicon nitride, boron nitride, aluminum nitride, aluminum hydroxide, calcium hydroxide, magnesium hydroxide, boehmite, talc, mica, clay, calcium carbonate, magnesium carbonate, Barium carbonate, zinc oxide, titanium oxide, magnesium oxide, magnesium silicate, calcium silicate, zirconium silicate, barium sulfate, inorganic fillers such as carbon, carbon fiber, glass fiber, alumina fiber, silica alumina fiber, silicon carbide Examples include fibrous fillers such as fibers, polyester fibers, cellulose fibers, aramid fibers and ceramic fibers, and fine particle rubbers.

A thermoplastic resin other than the modified epoxy resin of the present invention may be used in combination with the resin composition of the present invention. Examples of thermoplastic resins include modified epoxy resins other than the present invention, phenoxy resins, polyurethane resins, polyester resins, polyethylene resins, polypropylene resins, polystyrene resins, ABS resins, AS resins, vinyl chloride resins, polyvinyl acetate resins, polyvinyl Methyl methacrylate resin, polycarbonate resin, polyacetal resin, cyclic polyolefin resin, polyamide resin, thermoplastic polyimide resin, polyamideimide resin, polytetrafluoroethylene resin, polyetherimide resin, polyphenylene ether resin, modified polyphenylene ether resin, polyether sulfone resins, polysulfone resins, polyetheretherketone resins, polyphenylene sulfide resins, polyvinyl formal resins, and the like. Modified epoxy resins and phenoxy resins other than those of the present invention are preferred from the viewpoint of compatibility, and polyphenylene ether resins and modified polyphenylene ether resins are preferred from the viewpoint of low dielectric properties.

Other ingredients include organic pigments such as quinacridone-based, azo-based, and phthalocyanine-based pigments, inorganic pigments such as titanium oxide, metal foil-like pigments, and rust-preventive pigments, and ultraviolet-absorbing pigments such as hindered amine-based, benzotriazole-based, and benzophenone-based pigments. antioxidants such as hindered phenol, phosphorus, sulfur, and hydrazide; release agents such as stearic acid, palmitic acid, zinc stearate, and calcium stearate; leveling agents; rheology control agents; and additives such as anti-cratering agents, anti-foaming agents, and the like. The blending amount of these other components is preferably in the range of 0.01 to 20% by mass based on the total solid content in the resin composition.

The resin composition of the present invention is obtained by uniformly mixing the above components. A resin composition containing a modified epoxy resin, a curing agent, and optionally various components can be easily cured by a conventionally known method. This cured product has an excellent balance of low hygroscopicity, dielectric properties, heat resistance, adhesion, etc., and exhibits good cured physical properties. The term "curing" as used herein means intentionally curing the resin composition with heat and/or light, and the degree of curing may be controlled according to desired physical properties and applications. The degree of progress may be complete curing or semi-curing, and is not particularly limited, but the reaction rate of the curing reaction between the epoxy group and the curing agent is usually 5 to 95%.

A cured product of the resin composition of the present invention can be obtained by curing in the same manner as for known epoxy resin compositions. As a method for obtaining a cured product, the same methods as those for known epoxy resin compositions can be used, such as casting, injection, potting, dipping, drip coating, transfer molding, compression molding, resin sheets, resins, etc. A method of forming a laminated plate by laminating a laminated copper foil, prepreg, or the like and curing under heat and pressure is preferably used. The curing temperature at that time is usually in the range of 80 to 300° C., and the curing time is usually about 10 to 360 minutes. This heating is preferably performed in a two-step process of primary heating at 80 to 180° C. for 10 to 90 minutes and secondary heating at 120 to 200° C. for 60 to 150 minutes. In a compounded system that exceeds the secondary heating temperature, it is preferable to further perform tertiary heating at 150 to 280° C. for 60 to 120 minutes. By performing such secondary heating and tertiary heating, poor curing can be reduced. When semi-cured resin products such as resin sheets, resin-coated copper foils, and prepregs are produced, the curing reaction of the resin composition is usually allowed to proceed by heating or the like to such an extent that the shape can be maintained. When the resin composition contains a solvent, most of the solvent is usually removed by heating, depressurization, air drying, or the like. good too.

A prepreg obtained using the resin composition of the present invention will be described. As the sheet-shaped substrate, inorganic fibers such as glass, and woven or non-woven fabrics of organic fibers such as polyester, polyamine, polyacryl, polyimide, Kevlar, cellulose, etc. can be used, but are limited to these. is not. The method for producing a prepreg from the resin composition and base material of the present invention is not particularly limited. After impregnation, it is obtained by heating and drying to semi-harden the resin component (B stage), and for example, it can be heated and dried at 100 to 200° C. for 1 to 40 minutes. Here, the resin content in the prepreg is preferably 30 to 80% by mass.

A method of manufacturing a laminate using prepregs and insulating adhesive sheets will be described. When forming a laminate using prepreg, one or more prepregs are laminated, metal foil is placed on one side or both sides to form a laminate, and this laminate is heated and pressed to be laminated and integrated. do. Here, as the metal foil, copper, aluminum, brass, nickel, or the like can be used alone, as an alloy, or as a composite metal foil. The conditions for heating and pressurizing the laminate may be appropriately adjusted so as to cure the resin composition, but if the pressure applied is too low, air bubbles will remain inside the resulting laminate. However, since the electrical characteristics may deteriorate, it is desirable to apply pressure under conditions that satisfy moldability. For example, the temperature can be set to 160 to 220° C., the pressure to 49 to 490 N/cm ² (5 to 50 kgf/cm ² ), and the heating time to 40 to 240 minutes.

Furthermore, a multi-layer board can be produced by using the single-layer laminate board thus obtained as an inner layer material. In this case, first, a circuit is formed on the laminate by an additive method, a subtractive method, or the like, and the surface of the formed circuit is treated with an acid solution for blackening to obtain an inner layer material. An insulating layer is formed on one or both sides of the inner layer material with a prepreg or an insulating adhesive sheet, and a conductor layer is formed on the surface of the insulating layer to form a multilayer board.

When the insulating adhesive sheet is used to form the insulating layer, the insulating adhesive sheet is arranged on the circuit-forming surface of a plurality of inner layer materials to form a laminate. Alternatively, a laminate is formed by placing an insulating adhesive sheet between the circuit forming surface of the inner layer material and the metal foil. Then, this laminate is heated and pressurized for integral molding, thereby forming a cured product of the insulating adhesive sheet as an insulating layer and forming a multi-layered inner layer material. Alternatively, the inner layer material and the metal foil, which is the conductor layer, are formed as an insulating layer by curing an insulating adhesive sheet. Here, as the metal foil, the same one as that used for the laminate used as the inner layer material can be used.
Further, the heat and pressure molding can be performed under the same conditions as the molding of the inner layer material. When a resin composition is applied to a laminate to form an insulating layer, the above resin composition is preferably applied to a thickness of 5 to 100 μm for the circuit forming surface resin of the outermost layer of the inner layer material, and then the thickness is 100 to 200 μm. It is dried by heating at ℃ for 1 to 90 minutes to form a sheet. It is formed by a method generally called a casting method. It is desirable that the thickness after drying is 5 to 80 μm. A printed wiring board can be formed by forming via holes and circuits on the surface of the multilayer laminate thus formed by an additive method or a subtractive method.
Furthermore, by repeating the above-described method using this printed wiring board as an inner layer material, it is possible to form a laminate having more layers.

When forming the insulating layer with prepreg, one or more prepreg layers are placed on the circuit forming surface of the inner layer material, and a metal foil is placed on the outer side to form a laminate. . By heating and pressurizing this laminate to integrally mold it, the cured prepreg is formed as an insulating layer, and the metal foil on the outside thereof is formed as a conductor layer.
Here, as the metal foil, the same one as that used for the laminate used as the inner layer material can also be used. Further, the heat and pressure molding can be performed under the same conditions as the molding of the inner layer material. A printed wiring board can be molded by forming via holes and circuits on the surface of the multilayer laminate thus molded by an additive method or a subtractive method.
Further, by repeating the above-described method using this printed wiring board as an inner layer material, a multilayer board having more layers can be formed.

Cured products and laminates for electric/electronic circuits obtained from the resin composition of the present invention have excellent dielectric properties and heat resistance.

EXAMPLES The present invention will be described in more detail based on Examples and Comparative Examples below, but the present invention is not limited thereto. Unless otherwise specified, parts represent "mass parts" and % represents "mass%". The analysis method and measurement method are shown below. Moreover, the units of various equivalents are all "g/eq.".

(1) Weight average molecular weight (Mw) and number average molecular weight (Mn):
Obtained by GPC measurement. Specifically, a column (TSKgel SuperH-H, SuperH2000, SuperHM-H, SuperHM-H, manufactured by Tosoh Corporation) is used in series with the main body HLC8320GPC (manufactured by Tosoh Corporation), and the column temperature is The temperature was brought to 40°C. Tetrahydrofuran (THF) was used as an eluent at a flow rate of 1.0 mL/min, and a differential refractive index detector was used as a detector. As a measurement sample, 0.1 g of solid content was dissolved in 10 mL of THF, filtered through a 0.45 μm microfilter, and 50 μL of the solution was used. For data processing, GPC8020 model II version 6.00 manufactured by Tosoh Corporation was used.

(2) IR (infrared absorption spectrum):
Using a Fourier transform infrared spectrophotometer (Perkin Elmer Precisely, Spectrum One FT-IR Spectrometer 1760X), sodium chloride is used for the cell, and a sample dissolved in chloroform is applied on the cell and dried. , and the transmittance at wavenumbers of 400 to 4000 cm ⁻¹ were measured.

(3) epoxy equivalent:
The measurement was performed according to JIS K 7236 standard. Specifically, a potentiometric titrator was used, cyclohexanone was used as a solvent, a tetraethylammonium bromide acetic acid solution was added, and a 0.1 mol/L perchloric acid-acetic acid solution was used. For the solvent-diluted product (resin varnish), the solid content conversion value was calculated from the non-volatile content.

(4) non-volatile content:
Measured according to JIS K 7235 standard. The drying temperature was 200° C. and the drying time was 60 minutes.

(5) Solvent solubility:
A modified epoxy resin was dissolved in methyl ethyl ketone (MEK) to obtain a resin varnish having a resin content of 40%, and the state after being kept in a constant temperature bath at 25° C. for 24 hours was judged visually.
Transparent: ○, Turbidity: △, Separation: ×

(6) Resin compatibility:
The modified epoxy resin was heated and mixed with A1, which is a bisphenol A type liquid epoxy resin, and the state after holding for 24 hours in a constant temperature bath at 25° C. was evaluated visually. The modified epoxy resin/A1 was mixed at a ratio of 50/50 (mass ratio).
Transparent: ○, Turbidity: △, Separation: ×

(7) Glass transition temperature (Tg):
IPC-TM-650 2.4.25. Measured according to the c standard. Specifically, a sample with a thickness of 4 mm and a diameter of 3 mm was heated to 20 to 280 ° C. using a differential scanning calorimeter EXSTAR6000 DSC6200 (manufactured by SII Nanotechnology Co., Ltd.) under a temperature increase condition of 10 ° C./min. was measured for 2 cycles in the range of , and represented by the midpoint glass transition temperature (Tmg) of the obtained second scan measurement chart.

(8) Dielectric properties:
Film-like samples were measured by the cavity resonator perturbation method, and plate-like samples were measured by the capacitance method.
Examples 14 to 19 and Comparative Examples 4 to 5 were evaluated by the dielectric loss tangent measured at 1 GHz by the cavity resonator perturbation method. Specifically, using a PNA network analyzer N5230A (manufactured by Agilent Technologies) and a cavity resonator CP431 (manufactured by Kanto Denshi Applied Development Co., Ltd.), the width The measurement was performed using a test piece of 1.5 mm×80 mm length×150 μm thickness.
Examples 20-21 and Comparative Examples 6-7 were evaluated by the dielectric loss tangent when measured at 1 GHz by the capacitance method. Specifically, in accordance with the IPC-TM-650 2.5.5.9 standard, using a material analyzer (manufactured by AGILENT Technologies), under a measurement environment of room temperature 23 ° C. and humidity 50% RH, 30 mm square × Measurements were carried out using 1 mm thick specimens.

(9) Formability:
A film was produced from the modified epoxy resin and a cured product thereof, the obtained film was bent 180 degrees, and the number of times of bending was evaluated.
10 times or more: ○, 1 to 9 times: △, 0 times: ×

Abbreviations used in Examples and Comparative Examples are as follows.

[Bifunctional epoxy resin]
A1: Bisphenol A type liquid epoxy resin (manufactured by Nippon Steel Chemical & Materials Co., Ltd., YD-128, epoxy equivalent 186, m ≈ 0.11)
A2: Fluorene type epoxy resin (manufactured by Nippon Steel Chemical & Materials Co., Ltd., ESF-300, epoxy equivalent 250, softening point 87 ° C., m ≈ 0.09)
A3: Biphenyl type epoxy resin (manufactured by Mitsubishi Chemical Corporation, YX-4000, epoxy equivalent 196, melting point 105° C., m≈0.13)
A4: Naphthalene-type liquid epoxy resin (manufactured by DIC Corporation, Epiclon HP4032D, epoxy equivalent 142, m≈0.06)
A5: Bisphenol A solid epoxy resin (manufactured by Nippon Steel Chemical & Materials Co., Ltd., YD-901, epoxy equivalent 410, m ≈ 1.7)
A6: Bisphenol A solid epoxy resin (Nippon Steel Chemical & Material Co., Ltd., YD-7910, epoxy equivalent 2500, m ≈ 16)
Here, m has the same meaning as m in the above formula (3).

[Diester compound]
B1: diacetoxyphenolphthalein obtained in Synthesis Example 1 (activity equivalent = 201)
B2: Diacetoxyphenolphthaleinanilide obtained in Synthesis Example 2 (activity equivalent = 261)
B3: 4,4'-diacetoxybiphenyl (manufactured by Tokyo Chemical Industry Co., Ltd., activity equivalent = 135)

[Bifunctional phenol compound]
C1: Phenolphthalein (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd., hydroxyl equivalent 159)
C2: Phenolphthalein anilide (manufactured by Shanxi Ryusei Pharmaceutical Co., Ltd., hydroxyl equivalent 219)
C3: 4,4'-dihydroxybiphenyl (manufactured by Tokyo Chemical Industry Co., Ltd., hydroxyl equivalent 93)

[catalyst]
D1: N,N'-dimethylaminopyridine (manufactured by Tokyo Chemical Industry Co., Ltd.)
D2: 2-ethyl-4-methylimidazole (manufactured by Shikoku Kasei Co., Ltd., Curesol 2E4MZ)

[Solvent/Solvent]
S1: cyclohexanone S2: methyl ethyl ketone (MEK)

[Acid anhydride]
E1: acetic anhydride (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)
E2: Benzoic anhydride (manufactured by Tokyo Chemical Industry Co., Ltd.)

[Curing agent]
H1: Phenol novolac resin (manufactured by Aica Kogyo Co., Ltd., Shaunol BRG-557, hydroxyl equivalent 105)

Synthesis example 1
100 parts of bifunctional phenol compound C1, 64 parts of acid anhydride E1, and 50 parts of pyridine are added to a glass reaction vessel equipped with a stirring device, thermometer, nitrogen gas introduction device, cooling tube, and dropping device at room temperature. The temperature was raised to 60° C. while stirring while flowing nitrogen gas, and the reaction was carried out for 2 hours. After that, it was dried under reduced pressure for 2 hours at 150° C. and 1.3 kPa (10 torr) to obtain 126 parts of diester compound B1.

Synthesis example 2
100 parts of bifunctional phenol compound C2, 47 parts of acid anhydride E1, and 36 parts of pyridine are added to a glass reaction vessel equipped with a stirrer, thermometer, nitrogen gas introduction device, cooling tube, and dropping device at room temperature. The temperature was raised to 60° C. while stirring while flowing nitrogen gas, and the reaction was carried out for 2 hours. After that, it was dried under reduced pressure for 2 hours at 150° C. and 1.3 kPa (10 torr) to obtain 119 parts of diester compound B2.

Example 1
100 parts of bifunctional epoxy resin A1, 103 parts of diester compound B1, and reaction solvent S1 are placed at room temperature in a glass reaction vessel equipped with a stirring device, a thermometer, a nitrogen gas introduction device, a cooling pipe, and a dropping device. and heated to 130° C. with nitrogen gas flow and stirring. After adding 0.2 part of catalyst D1, the temperature was raised to 145° C. and the reaction was carried out at the same temperature for 7 hours. 51 parts of the dilution solvent S1 and 203 parts of S2 were used to dilute and mix to obtain a resin varnish (R1) of a modified epoxy resin having a non-volatile content of 40%.

Examples 2-11, Comparative Examples 1-3
According to the charging amount (part) of each raw material shown in Table 1, the same operation as in Example 1 was performed to obtain a resin varnish. The "molar ratio" in the table represents the molar ratio of the bifunctional epoxy resin to the diester compound and the bifunctional phenol compound.

Example 12
100 parts of the resin varnish (HR3) obtained in Comparative Example 3 (40 parts in solid content) and 600 parts of the reaction solvent S1 were blended, heated to 100° C., and then 5 parts of the acid anhydride E1 were added for 4 hours. reacted. The resulting resin varnish was added to methanol, and the precipitated insoluble matter was filtered off, and the filtrate was dried in a vacuum dryer under conditions of 150° C. and 0.4 kPa (3 torr) for 1 hour to obtain a modified epoxy resin. rice field. 20 parts of dilution solvent S1 and 41 parts of S2 were added to the obtained modified epoxy resin and uniformly dissolved to obtain a resin varnish (R12) having a non-volatile content of 40%.

Example 13
A resin varnish (R13) was obtained in the same manner as in Example 11 except that 24 parts of acid anhydride E1, 22 parts of dilution solvent S1 and 44 parts of S2 were used.

Example 14
A resin varnish (R14) was obtained in the same manner as in Example 11 except that 52 parts of E2, 25 parts of diluted solution S1 and 52 parts of S2 were used instead of acid anhydride E1.

The resin varnishes R1 to R14 and HR1 to HR3 obtained in Examples 1 to 14 and Comparative Examples 1 to 3 were applied to an iron plate so that the film thickness after drying was 100 μm, and dried at 150 ° C. for 1 hour using a dryer. After drying, a resin film was obtained.
The resin varnish was measured for epoxy equivalent and Mw, and the resin film was measured for solvent solubility, resin compatibility and film formability (excluding low-molecular-weight epoxy). Table 2 shows the results. In the table, "acylation rate" is the content rate (mol%) of acyl groups in all Z, and "rate (2)" is the divalent group represented by formula (2) in all X. content (mol%), and "-" indicates unmeasured. Examples using resin varnishes HR1 to HR3 are comparative examples.

Examples 15-20, Comparative Examples 4 and 5
30 parts of modified epoxy resin varnish (R1-R5, R13, HR1-HR2) obtained in Examples 1-5, 13 and Comparative Examples 1-2 (solid content: 12 parts), 2 parts of other epoxy resin A1 , 2.5 parts of a 50% MEK solution of the curing agent H1 and 0.6 parts of a 20% MEK solution of the curing accelerator D2 were blended to obtain a resin composition. Furthermore, these were applied to an iron plate so that the film thickness after drying would be 100 μm and 150 μm, and dried at 150° C. for 1 hour using a dryer to obtain a cured product in the form of a polymer film. Tg, dielectric loss tangent, and film formability were measured respectively. Table 3 shows the results.

Example 21
250 parts of modified epoxy resin varnish R8 (solid content: 100 parts), 25.6 parts of curing agent H1, and 0.3 parts of curing accelerator D2 are blended, and MEK, propylene glycol monomethyl ether, N,N-dimethylformamide. A resin composition varnish was obtained by dissolving in the prepared mixed solvent. A glass cloth (WEA 7628 XS13, manufactured by Nitto Boseki Co., Ltd., 0.18 mm thick) was impregnated with the obtained resin composition varnish. The impregnated glass cloth was dried in a hot air circulating oven at 150° C. for 9 minutes to obtain a prepreg.

The obtained prepreg was loosened and passed through a sieve to obtain powdery prepreg powder with a 100-mesh pass. The obtained prepreg powder was placed in a fluororesin mold and vacuum pressed at 2 MPa under temperature conditions of 130° C.×15 minutes+190° C.×80 minutes to obtain a test piece of 30 mm square×1 mm thickness. Table 4 shows the results of Tg and dielectric loss tangent of the test piece.

Example 22, Comparative Examples 6 and 7
The amounts (parts) shown in Table 4 were blended, and the same operation as in Example 21 was performed to obtain a resin composition varnish, a prepreg, and a test piece. The same test as in Example 21 was conducted, and the results are shown in Table 4.

As can be seen from Table 2, the modified epoxy resins of the present invention are excellent in dielectric properties and heat resistance. Moreover, as can be seen from Tables 3 and 4, the cured products made from the resin composition of the present invention are also excellent in dielectric properties and heat resistance.

Claims (10)

It is represented by the following formula (1) and has an epoxy equivalent of 400 to 100,000 g/eq. A modified epoxy resin characterized by:

(Wherein, X is a divalent group and has at least a divalent group represented by the above formula (2).Y is independently a hydrogen atom, an acyl group having 2 to 20 carbon atoms, or a glycidyl group Z is an acyl group having 2 to 20 carbon atoms or a hydrogen atom, and 5 mol% or more is the above acyl group, n is the average number of repetitions, and is 1 or more and 500 or less, A is arylene and R ¹ and R ² are independently divalent groups having no active hydrogen and having a heteroatom.) A resin composition comprising the modified epoxy resin according to claim 1 and a curing agent. 3. The resin composition according to claim 2, which contains 0.1 to 100 parts by mass of a curing agent as a solid content with respect to 100 parts by mass of the solid content of the epoxy resin. Claim 2, which contains the modified epoxy resin according to claim 1, another epoxy resin, and a curing agent, and the weight ratio of the solid content of the modified epoxy resin to the other epoxy resin is 99/1 to 1/99, or 3. The resin composition according to 3. 5. The resin composition according to claim 4, which contains 0.1 to 100 parts by mass of a curing agent as a solid content with respect to a total of 100 parts by mass of the solid content of the modified epoxy resin and the other epoxy resin. Curing agents include acrylic acid ester resins, melamine resins, urea resins, phenolic resins, acid anhydride compounds, amine compounds, imidazole compounds, amide compounds, cationic polymerization initiators, organic phosphines, polyisocyanate compounds, and blocked isocyanates. The resin composition according to any one of claims 2 to 5, which is at least one selected from the group consisting of a compound, a carbodiimide compound and an active ester curing agent. A cured product obtained by curing the resin composition according to any one of claims 2 to 6. A laminate for electric/electronic circuits, which is obtained by using the resin composition according to any one of claims 2 to 6. A bifunctional epoxy resin represented by the following formula (3) is reacted with a compound represented by the following formula (4) to obtain an epoxy equivalent having an epoxy equivalent of 400 to 100,000 g/eq. A method for producing a modified epoxy resin, characterized by obtaining a modified epoxy resin represented by the following formula (1).

(Here, X ¹ and X ² are divalent groups, and X ¹ and/or X ² include a divalent group represented by the above formula (2). X is a divalent group, It has at least a divalent group represented by the above formula (2), G is a glycidyl group, Y is independently a hydrogen atom, an acyl group having 2 to 20 carbon atoms, or a glycidyl group, Z is carbon 2 to 20 acyl groups or hydrogen atoms, 5 mol% or more of which are the above acyl groups, Q is an acyl group of 2 to 20 carbon atoms or hydrogen atoms, 5 mol% or more of which are the above acyl groups Here, the compound represented by formula (4) is a mixture of two or more selected from compounds in which both Q are acyl groups, compounds in which one is an acyl group, and compounds in which both are hydrogen atoms. m is the average number of repetitions and is from 0 to 6. n is the average number of repetitions and is from 1 to 500. A is an arylene group, R ¹ and R ² is independently a divalent group having no active hydrogen and having a heteroatom.) 0.05 mol or more and 2.0 mol or less of an acid anhydride represented by the following formula (6) is reacted with 1 mol of the alcoholic hydroxyl equivalent of the epoxy resin represented by the following formula (5) to obtain an epoxy resin. equivalent weight of 400-100,000 g/eq. A method for producing a modified epoxy resin, characterized by obtaining a modified epoxy resin represented by the following formula (1).

(Wherein, X is a divalent group, including a divalent group represented by the above formula (2). L is independently a hydrogen atom or a glycidyl group. Y is independently a hydrogen atom, It is an acyl group having 2 to 20 carbon atoms or a glycidyl group, Z is an acyl group having 2 to 20 carbon atoms or a hydrogen atom, and 5 mol% or more is the above acyl group, T is an acyl group having 2 to 20 carbon atoms. is an acyl group, n is the average number of repetitions, and is 1 or more and 500 or less, A is an arylene group, and R ¹ and R ² is the base of the valence.)

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