JP2022122942A - Processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing device which can be installed with space-saving, and performs continuous wafer grinding with simple configuration.

SOLUTION: A processing device comprises: a plurality of chucks 22 for adsorbing and holding a wafer; an index table 21 which locates the plurality of chucks 22 on a concentric circle, and transports the plurality of chucks 22 between rough grinding means, medium grinding means, and fine grinding means; and a plurality of tilt mechanisms which respectively tilt each rotation axis of the plurality of chucks 22. Each perpendicular line L2 with respect to each of tilt shafts L1 of the plurality of tilt mechanisms passing through each of rotation centers O1 of the plurality of chucks 22 in a planar view is so set as to pass through a rotation center O2 of the index table 21. Further, a mechanism for tilting a rough grinding grindstone 41, a medium grinding grindstone 51, and a fine grinding grindstone 61 are not provided.

SELECTED DRAWING: Figure 8

COPYRIGHT: (C)2022,JPO&INPIT

Description

The present invention relates to a processing apparatus for grinding wafers.

2. Description of the Related Art In the field of semiconductor manufacturing, back surface grinding is performed to grind the back surface of a semiconductor wafer such as a silicon wafer (hereinafter referred to as “wafer”) in order to form a thin film.

Patent Document 1 discloses a mechanism for tilting the rotation axis of a rough grinding wheel for rough grinding of a wafer and a mechanism for tilting the rotation axis of a chuck. Disclosed is a processing apparatus for carrying out precision grinding subsequent to the above.

It is generally known that when the grindstone is properly pressed against the wafer, it is preferable that the rotation axis of the grindstone and the rotation axis of the chuck are slightly inclined.

In the above-described processing apparatus, the degree of contact between the rough grinding wheel and the wafer differs from that between the fine grinding wheel and the wafer. By adjusting the tilt of the chuck with respect to the fine grinding wheel and then adjusting the tilt of the rough grinding wheel with respect to the chuck, variations in wafer in-plane flatness (TTV) between chucks are reduced. there is

Japanese Patent No. 6283081

However, in the above-described processing apparatus, it is necessary to provide a mechanism for tilting the rotating shaft of the rough grinding wheel so as to reproduce the contact state between the fine grinding wheel and the chuck, which complicates the configuration of the apparatus.

Also, it is conceivable to change the layout of the rough grinding wheel and the fine grinding wheel according to the arrangement of the chuck. There is a problem that the space between the coarse grinding wheel and the fine grinding wheel increases, resulting in an increase in the size of the apparatus.

Therefore, the technical problem to be solved arises that the wafer grinding process can be continuously performed with a space-saving installation and a simple configuration, and the object of the present invention is to solve this problem. .

In order to achieve the above object, a processing apparatus according to the present invention is a processing apparatus for continuously grinding a wafer by a plurality of processing means, comprising: a plurality of chucks for sucking and holding the wafer; arranged concentrically on an index table for transporting the plurality of chucks between the plurality of processing means, and a plurality of tilt mechanisms for tilting the rotation axes of the plurality of chucks, A mechanism for tilting each grindstone of each of the processing means, wherein a perpendicular line to each tilt axis of each of the plurality of tilt mechanisms passing through each of the rotation centers of the plurality of chucks is set to pass through the rotation center of the index table, Not provided.

According to this configuration, by adjusting the degree of contact by appropriately inclining the chuck with respect to one processing means, it is possible to save the trouble of adjusting the degree of contact between the other processing means and the chuck, and to rotate the processing means. Without providing a mechanism for tilting the axis, it is possible to appropriately adjust the degree of contact between each processing means and the chuck while maintaining the size of the device.

Further, in the processing apparatus according to the present invention, the plurality of processing means includes three or more processing means, and the plurality of processing means are arranged on the outer peripheral side of the plurality of chucks in the radial direction of the index table. Preferably, each distance between two adjacent processing means among the plurality of processing means is different.

Further, in the processing apparatus according to the present invention, the plurality of processing means includes three or more processing means, and the plurality of processing means are arranged on the inner peripheral side of the plurality of chucks in the radial direction of the index table. It is preferable that distances between two adjacent processing means among the plurality of processing means are different from each other.

According to the present invention, adjusting the contact state by appropriately inclining the chuck with respect to one processing means can save the trouble of adjusting the contact state between the other processing means and the chuck, and the rotation axis of the processing means can be adjusted. The degree of contact between each processing means and the chuck can be appropriately adjusted while maintaining the size of the device without providing a tilting mechanism.

The perspective view which shows the processing apparatus which concerns on one Example of this invention. The perspective view which shows a processing apparatus. The front view which shows a processing apparatus. The top view which shows a processing apparatus. The top view which abbreviate|omitted the column of FIG. 4, and various grinding apparatuses. FIG. 6 is a cross-sectional view taken along the line AA in FIG. 5; FIG. 2 is a plan view schematically showing the positional relationship between grinding wheels and chucks in a conventional processing apparatus; FIG. 2 is a plan view schematically showing the arrangement relationship between grinding wheels and chucks; The top view which shows the other arrangement position of a grinding wheel.

An embodiment of the present invention will be described based on the drawings. In addition, hereinafter, when referring to the number, numerical value, amount, range, etc. of the constituent elements, unless otherwise specified or clearly limited to a specific number in principle, it is limited to the specific number It does not matter if the number is greater than or less than a certain number.

In addition, when referring to the shape or positional relationship of components, etc., unless otherwise specified or in principle clearly considered otherwise, etc. include.

In addition, the drawings may exaggerate characteristic parts by enlarging them in order to make the characteristics easier to understand. In addition, in cross-sectional views, hatching of some components may be omitted in order to facilitate understanding of the cross-sectional structure of the components.

FIG. 1 is a perspective view showing the processing apparatus 1 viewed from one side. FIG. 2 is a perspective view showing the processing apparatus 1 seen from the other side. FIG. 3 is a front view of the processing device 1. FIG. FIG. 4 is a plan view of the processing device 1. FIG. FIG. 5 is a plan view in which the column 3 and various grinding devices are omitted.

The processing apparatus 1 continuously grinds the wafer W with three grindstones. The processing apparatus 1 may continuously process the wafers W with two grindstones or may continuously process the wafers W with four or more grindstones. The processing apparatus 1 grinds the back surface of the wafer W to form a thin film. The wafer W to be ground using the processing apparatus 1 is preferably a silicon wafer, a silicon carbide wafer or the like having high hardness and high brittleness, but is not limited to these. The processing apparatus 1 includes holding means 2 and a main unit arranged above the holding means 2 .

The holding means 2 includes an index table 21 rotatable around a rotation axis a1 connected to a motor (not shown) and four chucks 22 placed on the index table 21 .

The chucks 22 are arranged at intervals of 90 degrees on the circumference around the rotation axis a1. The chuck 22 has an adsorbent made of ceramic with a porous structure embedded in the upper surface. A conduit formed in the chuck 22 is connected to a vacuum source (not shown), and the wafer W placed on the chuck 22 is sucked under negative pressure. The chuck 22 is connected to a motor (not shown) and is rotatable around the rotation axis a2.

The holding means 2 is divided into an alignment stage S1, a rough grinding stage S2, a medium grinding stage S3, and a fine grinding stage S4.

On the alignment stage S1, the wafer W is transferred onto the chuck 22 by a transfer device (not shown) or the like, and aligned at a predetermined position. The wafer W sucked and held on the chuck 22 is sent to the rough grinding stage S2.

In the rough grinding stage S2, the wafer W is rough ground. The rotation speed of the chuck 22 in the rough grinding stage S2 is set to 310 rpm, for example. The rough-ground wafer W is sent to the medium-grinding stage S3.

In the intermediate grinding stage S3, the wafer W is intermediately ground. The rotation speed of the chuck 22 in the intermediate grinding stage S3 is set to 320 rpm, for example. The medium ground wafer W is sent to the fine grinding stage S4.

In the fine grinding stage S4, the wafer W is fine ground. The rotational speed of the chuck 22 in the fine grinding stage S4 is set to 300 rpm, for example. The precisely ground wafer W is sent to the alignment stage S1 and accommodated in a rack (not shown) or the like from the chuck 22 by a transfer device (not shown) or the like.

The main unit comprises an arch-shaped column 3 straddling the index table 21, a rough grinding means 4 attached to the column 3 above the rough grinding stage S2, and an intermediate grinding stage S3. It comprises an attached intermediate grinding means 5 and a fine grinding means 6 attached to the column 3 above the fine grinding stage S4.

The column 3 includes a base portion 31 formed in a U shape when viewed from the front, and central column portions 32 and 33 projecting forward and backward from the center of the base portion 31 .

The base 31 is provided so as to straddle the rough grinding stage S2, the intermediate grinding stage S3, and the fine grinding stage S4. As a result, the alignment stage S1 is exposed to the side of the column 3 in plan view. Therefore, when transferring the wafer W to the chuck 22 or unloading it from the chuck 22 , the transfer device or the like can access the chuck 22 without being interfered by the column 3 . The rigidity of the base portion 31 is increased by connecting two supports 31a erected on the outer periphery of the index table 21 .

The central column portion 32 is arranged on the opposite side of the column 31a across the rough grinding stage S2 in plan view. Further, the central column portion 33 is arranged between the intermediate grinding stage S3 and the fine grinding stage S4 in plan view. The lower ends of the central pillars 32 and 33 extend above the index table 21 .

The front surface 3a of the column 3 is provided with a groove 3b recessed in the vertical direction V. As shown in FIG. The rough grinding means 4 is accommodated in the groove 3b. In the rear surface 3c of the column 3, grooves 3d and 3e which are recessed in the vertical direction V are arranged side by side. The intermediate grinding means 5 is accommodated in the groove 3d. The fine grinding means 6 is accommodated in the groove 3e.

The rough grinding means 4 includes a rough grinding wheel 41, a first spindle 42 having the rough grinding wheel 41 attached to its lower end, a first spindle feed mechanism 43 that moves the first spindle 42 up and down in the vertical direction V, It has

The rough grinding wheel 41 is configured by arranging a plurality of cup-shaped grindstones at the lower end in the circumferential direction. The grit of the rough grinding wheel 41 is set to #2000, for example.

The first spindle 42 includes a saddle 42a having a rough grinding wheel 41 attached to its lower end, and a motor (not shown) provided in the saddle 42a for rotating the rough grinding wheel 41. As shown in FIG. The rotation speed of the rough grinding wheel 41 is set to 3000 rpm, for example.

The first spindle feed mechanism 43 connects the saddle 42a and a rear guide 72, which will be described later, and feeds the first spindle 42 in the vertical direction V. As shown in FIG. Although the first spindle feeding mechanism 43 does not include an elevating means for feeding the first spindle 42, the elevating means may be, for example, a motor-driven ball screw.

The intermediate grinding means 5 includes a intermediate grinding wheel 51, a second spindle 52 having the intermediate grinding wheel 51 attached to its lower end, a second spindle feed mechanism 53 that moves the second spindle 52 up and down in the vertical direction V, It has

The medium grinding wheel 51 is configured by arranging a plurality of cup-shaped grinding wheels at the lower end in the circumferential direction. The number of the medium grinding wheel 51 is set to #4000, for example.

The second spindle 52 includes a saddle 52a having a medium grinding wheel 51 attached to its lower end, and a motor (not shown) provided in the saddle 52a for rotating the medium grinding wheel 51. The number of revolutions of the medium grinding wheel 51 is set to 2000 rpm, for example.

The second spindle feed mechanism 53 has the same configuration as the first spindle feed mechanism 43, connects the saddle 52a and a later-described rear guide 82, and feeds the second spindle 52 in the vertical direction V. As shown in FIG.

The fine grinding means 6 includes a fine grinding wheel 61, a third spindle 62 to which the fine grinding wheel 61 is attached at the lower end, a third spindle feed mechanism 63 that moves the third spindle 62 up and down in the vertical direction V, It has

The fine grinding wheel 61 is configured by arranging a plurality of cup-shaped wheels in the circumferential direction at the lower end. The number of the fine grinding wheel 61 is set to #8000, for example.

The third spindle 62 includes a saddle 62a having a fine grinding wheel 61 attached to its lower end, and a motor (not shown) provided in the saddle 62a for rotating the fine grinding wheel 61. The rotation speed of the fine grinding wheel 61 is set to 2000 rpm, for example.

The third spindle feed mechanism 63 has the same configuration as the first spindle feed mechanism 43, connects the saddle 62a and a later-described rear guide 92, and feeds the third spindle 62 in the vertical direction V. As shown in FIG.

The processing apparatus 1 is provided with an in-process gauge (not shown) for measuring the thickness of the wafer W being processed. The in-process gauges are arranged on the rough grinding stage S2, the intermediate grinding stage S3, and the fine grinding stage S4, respectively. The operations of the first spindle feed mechanism 43, the second spindle feed mechanism 53, and the third spindle feed mechanism 63 are controlled based on the film thickness measured by the in-process gauge.

Specifically, when the thickness of the wafer W measured by the in-process gauge provided on the rough grinding stage S2 reaches a desired value, the first spindle feed mechanism 43 is driven to raise the saddle 42a, The wafer W and the rough grinding wheel 41 are separated. Similarly, when the thickness of the wafer W measured by the in-process gauge provided on the intermediate grinding stage S3 reaches a desired value, the wafer W and the intermediate grinding wheel 51 are separated, and the fine grinding stage S4 is provided. When the thickness of the wafer W measured by the in-process gauge reaches a desired value, the wafer W and the precision grinding wheel 61 are separated.

The processing apparatus 1 includes a first guide 7 that supports the first spindle 42 slidably in the vertical direction V, and a second guide 8 that supports the second spindle 52 slidably in the vertical direction V. and a third guide 9 that supports the third spindle 62 so as to be slidable in the vertical direction V are provided.

The first guide 7 is composed of a front guide 71 arranged on each front surface of the base portion 31 and the central column portion 32, and a rear guide 72 arranged in the groove 3b. The front guide 71 and the rear guide 72 are linear guides, for example. A saddle 42 a is directly attached to the slider 71 a of the front guide 71 . A saddle 42 a is attached to the rear guide 72 via the first spindle feed mechanism 43 .

The front guide 71 and the rear guide 72 are provided parallel to each other along the vertical direction V. As shown in FIG. Thereby, the front guide 71 and the rear guide 72 regulate the movement of the saddle 42a along the vertical direction V. As shown in FIG.

The second guide 8 is composed of a front guide 81 arranged on the rear surface of the base 31 and the central column 33, respectively, and a rear guide 82 arranged in the groove 3d. The front guide 81 and the rear guide 82 are linear guides, for example. A saddle 52 a is directly attached to the slider 81 a of the front guide 81 . A saddle 52 a is attached to the rear guide 82 via a second spindle feed mechanism 53 .

The front guide 81 and the rear guide 82 are provided parallel to each other along the vertical direction V. As shown in FIG. Thereby, the front guide 81 and the rear guide 82 regulate the movement of the saddle 52a along the vertical direction V. As shown in FIG.

The third guide 9 includes a front guide 91 arranged on the rear surface of the base portion 31 and the central column portion 33, respectively, and a rear guide 92 arranged in the groove 3e. The front guide 91 and the rear guide 92 are linear guides, for example. A saddle 62 a is directly attached to the slider 91 a of the front guide 91 . A saddle 62 a is attached to the rear guide 92 via a third spindle feed mechanism 63 .

The front guide 91 and the rear guide 92 are provided parallel to each other along the vertical direction V. As shown in FIG. Thereby, the front guide 91 and the rear guide 92 regulate the movement of the saddle 62a along the vertical direction V. As shown in FIG.

Operations of the processing apparatus 1 are controlled by a control unit (not shown). The control unit controls each of the constituent elements that constitute the processing apparatus 1 . The control unit is composed of, for example, a CPU, a memory, and the like. The functions of the control unit may be realized by controlling using software, or may be realized by operating using hardware.

In this manner, the processing apparatus 1 performs the coarse grinding stage S2, the intermediate grinding stage S3, and the fine grinding stage S4 in this order while the wafer W suction-held by the chuck 22 of the alignment stage S1 is placed on the same chuck 22. send continuously. Further, the chuck 22 that holds the wafer W by suction can be formed with higher rigidity than other wafer holding devices such as belt conveyors. Thereby, the throughput of the grinding process is improved, and the wafer W can be ground with high quality.

In addition, since the column 3 can be formed to have a larger diameter and higher rigidity than the index table 21, the resonance of the rough grinding means 4, intermediate grinding means 5, and fine grinding means 6 caused by the normal force generated during the grinding of the wafer W can be prevented. In addition, the axial inclination is suppressed, and the wafer W can be ground with high quality.

Next, the tilt mechanism of the holding means 2 will be explained. The holding means 2 comprises two movable supports 24 and one fixed support 25 arranged around the chuck 22, as shown in FIGS. The movable support portion 24 is arranged on the radially outer peripheral side of the index table 21 with respect to the chuck 22 . The fixed support portion 25 is arranged on the radially inner peripheral side of the index table 21 with respect to the chuck 22 .

As shown in FIG. 6, the movable support 24 is a differential screw mechanism including a slide block 24a, a fixed block 24b, and an adjustment screw 24c.

The slide block 24a is joined to the index table 21. As shown in FIG. The slide block 24a has a threaded portion at its center, and the pitch of the threaded portion of the slide block 24a is set to, for example, 1.25 mm.

The fixed block 24b is joined to a tilt table 26 on which the chuck 22 is placed. The fixed block 24b has a threaded portion at its center, and the pitch of the threaded portion of the fixed block 24b is set to, for example, 1.00 mm, which is smaller than that of the threaded portion 24d.

The adjustment screw 24c is screwed into the threaded portion of the slide block 24a and the threaded portion of the fixed block 24b. The adjusting screw 24c is rotated forward or backward by a drive motor (not shown). One rotation of the adjusting screw 24c moves the chuck 22 up and down by the pitch difference (0.25 mm) between the slide block 24a and the fixed block 24b.

The fixed support portion 25 is a bolt that fastens the tilt table 26 to the index table 21 .

In this manner, the movable support portion 24 raises and lowers the tilt table 26 and the fixed support portion 25 fixes the tilt table 26 in the vertical direction V. can be tilted. The configuration of the tilt mechanism is not limited to the one using the differential screw mechanism and the bolt described above, and any configuration may be used.

Next, the layout of the chuck 22 will be described with reference to the drawings.

As shown in FIG. 7A, in the conventional processing apparatus 100, the rough grinding wheel 101, the medium grinding wheel 102, and the fine grinding wheel 103 are offset outside the chuck 104. As shown in FIG. When the tilt mechanism for tilting the chuck 104 is operated, the inner side of the tilt shaft 106 passes through the rotation center 105 of the chuck 104 and is parallel to two movable support portions (not shown). It tilts so that the outside of the tilt axis 106 is high and low. A perpendicular line 107 to the tilt axis 106 of the chuck 104 is arranged so as not to pass through the center of rotation 109 of the index table 108 when viewed from above.

Both ends of the processing regions 110 of the rough grinding wheel 101 and fine grinding wheel 103 are arranged on the tilt axis 106 , but the processing region 110 of the medium grinding wheel 102 intersects with the tilt axis 106 at the center of rotation 105 . That is, since the contact between the wafer W and the rough grinding wheel 101 and the fine grinding wheel 103 and the contact between the wafer W and the medium grinding wheel 102 are different, the contact between the fine grinding wheel 103 and the chuck 104 is reproduced. , the coarse grinding wheel 101 and the medium grinding wheel 102 must be tilted with respect to the chuck 104 .

Further, as shown in FIG. 7(b), the rough grinding wheel 101, the medium grinding wheel 102 and the fine grinding wheel 103 are arranged so that the rough grinding wheel 101, the medium grinding wheel 102 and the fine grinding wheel 103 are in contact with the chuck 104 as well. It is also conceivable to arrange the fine grinding wheels 103 so as to be rotationally symmetrical.

However, in such a processing apparatus 100, when the outer diameters of the rough grinding wheel 101, the medium grinding wheel 102, and the fine grinding wheel 103 are set to 300 mm, the distance from the outer circumference of the medium grinding wheel 102 to the outer circumference of the fine grinding wheel 103 is L is about 925 mm, and compared with the distance L (810 mm) from the outer circumference of the medium grinding wheel 102 to the outer circumference of the fine grinding wheel 103 in the processing apparatus 100 shown in FIG. The size of the apparatus increases by the amount of movement to the left side of the paper.

On the other hand, in the processing apparatus 1 according to the present embodiment, as shown in FIG. 8, when the tilt mechanism is operated, the chuck 22 moves along the tilt axis parallel to the two movable support portions 24 through the rotation center O1 of the chuck 22. With L1 as a reference, tilting is performed so that the inner side of the tilt axis L1 is higher and the outer side of the tilt axis L1 is lower. That is, the tilt axis L1 is at substantially the same height as the center of rotation O1 on the upper surface of the chuck 22 .

The chuck 22 is arranged so that a perpendicular line L2 to the tilt axis L1 passes through the rotation center O1 of the index table 21 when viewed from above. That is, the chuck 22 is arranged rotationally symmetrical with respect to the rotation center O2.

The rough grinding wheel 41 , the medium grinding wheel 51 and the fine grinding wheel 61 are offset to the outside of the chuck 22 . Further, the rough grinding wheel 41, the medium grinding wheel 51, and the fine grinding wheel 61 are arranged on the wafer W in an arc C whose endpoint is the rotation center O1, the tilt axis L1, and the intersection P of the outer circumference of the chuck 22 when viewed from above. Contact.

Therefore, since the rough grinding wheel 41, the medium grinding wheel 51 and the fine grinding wheel 61 are in contact with any chuck 22 in the same way, any one of the rough grinding wheel 41, the medium grinding wheel 51 or the fine grinding wheel 61 If the chuck 22 is tilted with respect to one to adjust the degree of contact, there is no need to adjust the degree of contact between the chuck 22 and the other whetstones. That is, the degree of contact between each grindstone and the chuck 22 can be appropriately adjusted without providing a mechanism for tilting the rough grinding grindstone 41, the medium grinding grindstone 51, and the fine grinding grindstone 61. FIG.

Further, the distance L from the outer circumference of the rough grinding wheel 41 to the outer circumference of the medium grinding wheel 51 is approximately 864 mm. can.

As shown in FIG. 8, the coarse grinding wheel 41, the medium grinding wheel 51 and the fine grinding wheel 61 are arranged so that each wheel is offset to the outside of the chuck 22, and the medium grinding wheel 51 and the fine grinding wheel 61 are offset from each other. The grindstone 61 is not limited to the spaced one.

For example, as shown in FIG. 9(a), each whetstone may be arranged inside the chuck 22, and the medium grinding whetstone 51 and the fine medium grinding whetstone 61 may be close to each other. At this time, the distance from the outer circumference of the medium grinding wheel 51 to the outer circumference of the fine grinding wheel 61 is approximately 558 mm.

Further, as shown in FIG. 9(b), each whetstone may be arranged inside the chuck 22, and the whetstone 41 for rough grinding and the whetstone 51 for medium grinding may be close to each other. At this time, the distance from the outer circumference of the medium grinding wheel 51 to the outer circumference of the fine grinding wheel 61 is approximately 735 mm.

Furthermore, as shown in FIG. 9(c), each grindstone may be arranged outside the chuck 22, and the medium grinding grindstone 51 and the fine grinding grindstone 61 may be separated from each other. At this time, the distance from the outer circumference of the medium grinding wheel 51 to the outer circumference of the fine grinding wheel 61 is about 1041 mm.

It should be noted that the present invention can be modified in various ways without departing from the spirit of the present invention, and it is a matter of course that the present invention extends to the modified ones.

REFERENCE SIGNS LIST 1 processing device 2 holding means 21 index table 22 chuck 24 movable support portion 25 fixed support portion 26 tilt table 3 column 41 Rough grinding wheel 51 Medium grinding wheel 61 Fine grinding wheel 7 First guide 8 Second guide 9 Third guide L1 Tilt axis L2 ... Perpendicular O1 ... Rotation center O2 (of chuck) ... Rotation center (of index table) W ... Wafer a1 ... Rotation axis a2 (of index table) ... Rotation (of chuck) shaft

Claims (3)

A processing apparatus for continuously grinding a wafer by a plurality of processing means,
a plurality of chucks for sucking and holding the wafer;
an index table for arranging the plurality of chucks concentrically and transporting the plurality of chucks between the plurality of processing means;
a plurality of tilting mechanisms for tilting respective rotation axes of the plurality of chucks;
with
each perpendicular line to each tilt axis of each of the plurality of tilt mechanisms passing through each rotation center of each of the plurality of chucks in plan view is set to pass through each rotation center of the index table;
A processing apparatus, wherein a mechanism for tilting each grinding wheel of each processing means is not provided. The plurality of processing means includes three or more processing means,
The plurality of processing means are arranged on the outer peripheral side of the plurality of chucks in the radial direction of the index table,
2. The processing apparatus according to claim 1, wherein distances between two adjacent processing units among said plurality of processing units are different from each other. The plurality of processing means includes three or more processing means,
The plurality of processing means are arranged on the inner peripheral side of the plurality of chucks in the radial direction of the index table,
2. The processing apparatus according to claim 1, wherein distances between two adjacent processing units among said plurality of processing units are different from each other.

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