JP2022097763A - Electronic component manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component manufacturing method that comprises a prepress process capable of aligning a position of each side face of multiple electronic component bodies being bonded in a jig.

SOLUTION: A prepress process has: a first step of making each first end 12A of multiple electronic component bodies 10 adhere to a bonding surface in an exposed surface of a flat plate material 22 provided at a jig 20; a second step of relatively moving the jig 20 to a surface table 30; a third step of aligning the position of the side face 12B1 of each second end 12B by deforming the flat plate material 22 by a second end 12B of each at the side opposite to each first end 12A of the multiple electronic component bodies 10 coming in contact with a surface table 30, when the flat plate material 22 is in a softening state; a fourth step of curing the flat plate material 22 in the state where the position of the side face 12B1 is aligned; and then, a fifth step of relatively moving the jig 20 to the surface table 30, and separating the multiple electronic component bodies 10 where the position of the side face 12B1 is aligned from the surface table 30.

SELECTED DRAWING: Figure 6

COPYRIGHT: (C)2022,JPO&INPIT

Description

The present invention relates to a method for manufacturing an electronic component including a coating step of applying a conductive paste to a plurality of electronic component bodies and a prepress step performed before the coating step.

The applicant of the present application has provided an apparatus and method for manufacturing an electronic component by dipping and coating a conductive paste layer on the end face of an electronic component body such as a laminated ceramic capacitor, an inductor, a thermistor, etc. to form an external electrode on the electronic component body. It has been proposed (Patent Document 1). FIG. 1B of Patent Document 1 discloses a prepress method as a prepress step of a coating step of dipping and coating a conductive paste layer on an end surface of an electronic component body. As shown in FIG. 19, in the prepress process, the electronic component main body 3 is lowered with respect to the surface plate 2 in which the conductive paste is not spread on the main surface 1, and the end surface 4 of the electronic component main body 3 is used as the main surface plate 2. Contact surface 1. After that, the electronic component body 3 is raised. The jig (carrier plate) 5 for holding the plurality of electronic component main bodies 3 to be prepressed at the same time has, for example, a through hole 7 into which the electronic component main body 3 is fitted into the rubber jig main body 6. The total lengths of the plurality of electronic component main bodies 3 are different from those of L1 and L2, and the total length difference ΔL varies. By carrying out the prepress process, the length L at which each of the plurality of electronic component main bodies 3 protrudes from the through hole 7, that is, the height L from the jig main body 6 to the end faces 4 of each of the plurality of electronic component main bodies 3 is uniform. become. Thereby, regardless of the existence of the total length difference ΔL, the positions of the end faces 4 of the plurality of electronic component main bodies 3 can be aligned.

Japanese Patent No. 6633829

When the number of the electronic component main bodies 3 to be batch-processed at the same time increases, it becomes difficult to fit the electronic component main body 3 into the hole 7 of the jig main body 6 shown in FIG. Therefore, as another jig for holding the plurality of electronic component main bodies 3, it is conceivable to attach and hold the electronic component main body 3 to the adhesive layer formed on the rigid base material. However, even if the end surface 4 of the electronic component main body 3 adhered and held by the jig is brought into contact with the surface plate 2 and prepressed, the hole 7 of the jig 5 shown in FIG. 19 does not have the function, so that the plurality of electronic component main bodies are present. The positions of the end faces 4 of 3 cannot be aligned.

It is an object of some aspects of the present invention to provide a method for manufacturing an electronic component capable of aligning the positions of the end faces of each of the plurality of electronic component bodies while adhering and holding the plurality of electronic component bodies. do.

(1) One aspect of the present invention is
A method for manufacturing an electronic component, which includes a coating step of applying a paste to each of a plurality of electronic component bodies and a prepress step performed before the coating step.
The prepress process is
The first step of adhering the first end of each of the plurality of electronic component bodies to the adhesive surface on the exposed surface of the flat plate material provided on the jig.
The second step of moving the jig relative to the surface plate and
The flat plate material is deformed by softening the flat plate material and bringing each second end portion of the plurality of electronic component bodies opposite to the first end portion into contact with the surface plate. In the third step of aligning the positions of the end faces of the second ends of each of the above,
The fourth step of curing the flat plate material in a state where the positions of the end faces of the second end portions are aligned, and the fourth step.
After that, the jig is moved relative to the surface plate, and the present invention relates to a method for manufacturing an electronic component having the end.

According to one aspect of the present invention, when the flat plate material provided on the jig is in a softened state, the positions of the end faces of the second ends of each of the plurality of electronic component bodies that come into contact with the surface plate can be aligned. After that, the flat plate material is cured. As a result, the plurality of electronic component bodies held by the jig by adhesion are held by the jig with the positions of the end faces of the second end portions aligned. In this way, it is possible to align the positions of the end faces of the plurality of electronic component bodies while adhering and holding the plurality of electronic component bodies. When the coating process is performed after this prepressing process, the film thickness of the paste applied to each end face of the plurality of electronic component bodies can be made uniform. As a flat plate material that undergoes phase change between softening and curing, a thermoplastic resin (thermoplastic adhesive), a thermosetting resin, a thermoplastic estramer, a thermosetting estramer, or the like can be used. Further, among these resins or elastomers, in particular, shape memory resins, stimulus-responsive materials capable of softening and curing (gels, resins, elastomers, etc.) and the like can be used.

(2) In one aspect (1) of the present invention, after the coating step, an excess paste is applied from the paste applied to the second end of each of the plurality of electronic component bodies held by the jig. It may further have a paste removing step of removing to form a paste layer. By adding this step, the uniformity of the film thickness of the paste applied and formed on a plurality of electronic component bodies can be improved.

(3) In one aspect (1) or (2) of the present invention, the removal step further comprises a removal step of removing the plurality of electronic component bodies from the jig after the coating step or the paste removing step, and the removing step is described. By softening the flat plate material deformed in the third step and cured in the fourth step again, the plurality of electronic component bodies can be made removable from the jig. This makes it possible to reduce the load when removing a plurality of electronic component bodies from the jig. In order to reuse the flat plate material softened by the removal step, for example, it can be shaped into the original shape (for example, a flat plate) used in the previous first step and cured. When the thermosetting resin does not have a reversible phase of softening and curing, the flat plate material after the removal of the electronic component body may be recycled without being reused. If the flat plate material is disposable as described above, the flat plate material may be forcibly deformed to break its shape. Therefore, it is not essential to soften the flat plate material again in the removal process.

(4) In one aspect (1) or (2) of the present invention, the removal step further comprises a removal step of removing the plurality of electronic component bodies from the jig after the coating step or the paste removing step, and the removing step is described. The flat plate material deformed in the third step and cured in the fourth step is in a state in which the plurality of electronic component bodies can be removed from the jig, except in the softened state and the cured state. It can be transformed into a shape-retaining state. By doing so, the flat plate material after the removal process can be reused as it is.

(5) In one aspect (4) of the present invention, the flat plate material can be a shape memory resin, and the shape memory resin is shape-memorized in the first step, the second step, and the removal step. In the third step, the fourth step, and the fifth step, the shape memory resin is set to a flat plate shape which is a primary shaping, and the shape memory resin is in the softened state in which the positions of the end faces of the second ends of each are aligned. It can be set to any secondary shaping that is in the cured state. The shape memory state (primary shaping) of the shape memory resin can be effectively used as a shape-retaining state other than the softened state and the cured state (secondary shaping).

(6) In one aspect (5) of the present invention, in the second step, the transition of the shape memory resin to the softened state may be started. By doing so, the shape memory resin is deformed at the same time when the main body of the electronic component comes into contact with the surface plate, so that the prepress process can be shortened. Of course, the transition of the shape memory resin to the softened state may be started in the first step before the second step.

(7) In one aspect (3) of the present invention, the flat plate material can be a thermoplastic resin, and the thermoplastic resin is in a cured state in the first step and the second step, and the third step. In the removal step, the temperature is set to a temperature equal to or higher than the glass transition point and the thermoplastic resin is in a softened state, and in the fourth step and the fifth step, the thermoplastic resin can be in a cured state. A thermoplastic resin provided on the market and easily available can be effectively used as a deformable member in a jig.

(8) In one aspect (5) to (7) of the present invention, the jig includes a base material and an adhesive layer forming the adhesive surface, and the flat plate material comprises the base material and the adhesive layer. The third step can deform the adhesive layer in accordance with the deformation of the flat plate material. By deforming the adhesive layer in this way, the positions of the end faces of the plurality of electronic component bodies that are adhered and held can be aligned.

(9) In one aspect (7) of the present invention, the thermoplastic resin can be a thermoplastic adhesive. If a thermoplastic adhesive is used as the flat plate material, it is not necessary to have a two-layer structure of the flat plate material and the adhesive layer.

(10) In one aspect (7) or (9) of the present invention, the removal step can soften the thermoplastic resin in the mold material. In this way, the thermoplastic resin can be reliably restored to a reusable shape.

(11) In one aspect (1) to (10) of the present invention, the flat plate material is brought into the softened state and the cured state by the temperature control portion provided on the jig or the base holding the jig. It may be set. The temperature control unit may have both a heating unit and a cooling unit, or may be used as both a heating unit and a cooling unit, such as a Pelche element. By providing the temperature control portion on the jig or the base, the temperature of the flat plate material can be efficiently controlled.

(12) In one aspect (5) or (6) of the present invention, the shape memory resin is subjected to the primary shaping and the second shaping by the temperature control portion provided on the jig or the base holding the jig. It may be set to each state of the next shaping. By providing the temperature control portion on the jig or the base, the temperature can be controlled so that the shape memory resin is switched between the primary shaping and the secondary shaping.

(13) In one aspect (1) to (10) of the present invention, the flat plate material is set to the softened state by the jig or a heating portion provided on the base for holding the jig, and the fixed plate material is set to the softened state. The flat plate material may be set to the cured state by a cooling unit provided on the panel. By providing the heating unit on the jig or the substrate, the flat plate material can be efficiently heated, and by providing the cooling unit on the surface plate, the flat plate material can be cooled via a plurality of electronic component bodies. Moreover, by arranging the heating unit and the cooling unit apart from each other, the adverse effect of one on the other can be reduced.

(14) In one aspect (5) or (6) of the present invention, the shape memory resin is in the softened state and the primary shaping by the heating portion provided on the jig or the base holding the jig. The shape memory resin may be set to the cured state by the cooling unit provided on the surface plate. By providing the heating part on the jig or the base, the shape memory resin can be efficiently heated and set to the softened state or the primary shaping, and by providing the cooling part on the surface plate, the shape memory resin can be set via a plurality of electronic component bodies. The shape memory resin can be cooled and cured.

1 (A) and 1 (B) are views showing a prepress process. 2 (A) to 2 (C) are views showing a coating process. 3 (A) to 3 (C) are views showing a step of removing excess paste. It is a figure which shows the 1st process of 1st and 3rd Embodiment. It is a figure which shows the 2nd process of 1st and 3rd Embodiment. It is a figure which shows the 3rd and 4th steps of 1st and 3rd Embodiment. It is a figure which shows the 5th process of 1st and 3rd Embodiment. It is a figure which shows the removal process of 1st Embodiment. 9 (A) and 9 (B) are views showing the film thickness of the paste layer produced according to the first embodiment. It is a figure which shows the 1st process of 1st and 3rd Embodiment. It is a figure which shows the 2nd process of 2nd Embodiment. It is a figure which shows the 3rd and 4th steps of 2nd Embodiment. It is a figure which shows the 5th process of 2nd Embodiment. It is a figure which shows the removal process of 2nd Embodiment. It is a figure which shows the manufacturing apparatus which provided the temperature control part on the base material of a jig. It is a figure which shows the manufacturing apparatus which provided the temperature control part on the base which fixes a jig. It is a figure which shows the manufacturing apparatus which provided the heating part on the base material of a jig, and the cooling part on a surface plate. It is a figure which shows the manufacturing apparatus which provided the heating part on the base which fixes a jig, and the cooling part on a surface plate. It is a figure which shows the conventional prepress method.

The following disclosures provide many different embodiments and examples for implementing the different features of the presented subject matter. Of course, these are just examples and are not intended to be limited. In addition, the present disclosure may repeat reference numbers and / or letters in various examples. This repetition is for brevity and clarity and does not itself require a connection to the various embodiments and / or the configurations described. Further, when the first element is described as "connected" or "connected" to the second element, such a description is such that the first element and the second element are directly connected to each other. An embodiment in which the first element and the second element are indirectly connected or connected to each other with one or more other elements intervening between them, including embodiments connected or connected to. Including morphology. Also, when the first element is described as "moving" with respect to the second element, such a description is relative to the movement of at least one of the first element and the second element with respect to the other. Includes embodiments of various movements.

1. 1. Manufacturing Method of Electronic Parts The manufacturing method of electronic parts according to the present embodiment includes a prepress step and a coating step carried out by holding the main body of the electronic parts in a jig, and if necessary, paste removal carried out after the coating step. Can include steps. After the coating step or the paste removing step, the electronic component body is removed from the jig. Hereinafter, each process will be outlined.

1 to 3 schematically show a main step of a method of forming an external electrode of a capacitor as a method of manufacturing an electronic component. The surface plate 30 that can be used for both the prepress process, the coating process, and the paste removing process of the electronic component body 10 is formed of, for example, ceramic, granite, metal, or the like. A squeegee unit 40 is provided on the surface plate 30. The squeegee unit 40 can move along the surface 31 of the surface plate 30. In the squeegee unit 40, for example, a metal blade 42 for spreading the dip layer 50 of the conductive paste at a uniform height and for example a rubber blade 44 for scraping the conductive paste from the surface 31 of the surface plate 30 are independent of each other. It supports ascending and descending.

Above the surface plate 30, a movable plate 32 that can be raised and lowered with respect to the fixed plate 34 is arranged. Since the jig 20 is detachably supported by the movable plate 32, the movable plate 32 is also referred to as a base. An elevating motor 36 is supported on the fixed plate 34, and the movable plate 32 is moved up and down by a screw shaft 38 that is rotationally driven by the elevating motor 36.

1.1. Prepress process As shown in FIG. 1A, a jig 20 in which a plurality of electronic component main bodies 10 are held in advance is carried into an external electrode forming apparatus. In the electronic component main body 10, the first end portion 12A is a fixed end portion held by the jig 20, and the second end portion 12B is a free end. The carried-in jig 20 is fixed to the movable plate 32. FIG. 1B shows an end face height adjusting step (prepress step) of the electronic component main body 10. In FIG. 1B, the electronic component main body 10 is relatively lowered by the movable plate 32 with respect to the surface plate 30 on which the conductive paste is not spread, and the end surface 12B1 of the second end portion 12B of the electronic component main body 10 is formed. Contact the surface plate 30. After that, the electronic component main body 10 is relatively raised by the movable plate 32. As a result, the height of the end face 12B1 of the electronic component main body 10 becomes uniform.

1.2. Coating Process FIGS. 2 (A) to 2 (C) show a coating process of the conductive paste. In FIG. 2A, the blade 42 set to a predetermined height is horizontally moved by the squeegee unit 40 to form a dip layer 50 having a constant height on the surface plate 30 by the conductive paste. In FIG. 2B, the electronic component main body 10 is lowered by the movable plate 32, and the second end portion 12B of the electronic component main body 10 is immersed in the dip layer 50 on the surface plate 30. At this time, the end surface 12B1 of the electronic component main body 10 may or may not be brought into contact with the surface 31 of the surface plate 30. After that, the electronic component main body 10 is raised by the movable plate 32. As a result, the conductive paste layer 14 is formed on the second end portion 12B of the electronic component main body 10.

1.3. Paste removing step FIGS. 3 (A) to 3 (C) show a paste removing step (belotment step). FIG. 3A shows a step of horizontally moving the blade 44 lowered so as to come into contact with the surface 31 of the surface plate 30 by the squeegee unit 40 and scraping off the conductive paste on the surface plate 30. In FIG. 3B, the electronic component main body 10 is lowered by the movable plate 32, and the conductive paste layer 14 formed on the second end portion 12B of the electronic component main body 10 is brought into contact with the surface plate 30. After that, the electronic component main body 10 is raised by the movable plate 32. As a result, the excess paste of the second end portion 12B of the electronic component main body 10 is transferred to the surface plate 30, and the flattened conductive paste layer 14A is formed. In addition, instead of the conventional paste removing steps shown in FIGS. 3 (A) to 3 (C), Japanese Patent No. 6633829 (Note: slide blot), Japanese Patent Application No. 2019-125369 (Note:) proposed by the applicant of the present application. The conductive paste layer 14A is further improved by using the paste removal step described in Helical Blot) or PCT / JP2020 / 010448 and the like.

2. 2. First Embodiment Next, the details of the prepress step and the removal step according to the first embodiment will be described with reference to FIGS. 4 to 8. In FIG. 4, the jig 20 includes a base material 21 and a flat plate material 22. The base material 21 is a rigid body having a shape-retaining property, and is detachably supported by a movable plate 32 shown in FIG. 1 (A) and the like. The base material 21 also functions as a support portion for supporting the flat plate material 22. The base material 21 and the flat plate material 22 are arranged in parallel with the surface 31 of the surface plate 30. The flat plate material 22 can be, for example, a shape memory resin. When the shape memory resin 22 does not have an adhesive function, an adhesive layer 23 is formed on the exposed surface of the shape memory resin 22. The adhesive layer 23 forms an adhesive surface for adhering the first end portion 12A of the electronic component main body 10.

The shape memory resin 22 has two phases, a "fixed phase" that fixes the shape of the molded product when the shape memory resin is molded in the mold, and a "reversible phase" that softens and cures reversibly with temperature changes. It consists of a structure. Hereinafter, in the present specification, the stationary phase is referred to as a shape memory state, one of the reversible phases is referred to as a softened state, and the other of the reversible phases is referred to as a cured state. Further, the shape in the stationary phase is referred to as a primary shaping, and the shape when cured after softening is referred to as a secondary shaping. The shape memory resin 22 is formed into a primary shaped shape through a cooling step after heating and melting the resin supplied in the form of powder or pellets, injecting and shaping it into a mold or the like. The shape memory resin 22 is fixed in the form of a secondary shape when the primary shape is deformed into an arbitrary shape at an appropriate secondary shape temperature and cooled to room temperature while applying stress. When the shape memory resin 22 is secondarily shaped and heated to an appropriate temperature again, it recovers to the shape at the time of the primary shaping. The shape memory resin is described in, for example, Coloring Material, 63 [6] 353-359.1990.

2.1. First Step FIG. 4 shows a first step in the prepress step. In the first step, the first end portion 12A of the electronic component main body 10 is adhered to the adhesive layer 23 of the jig 20. In order to collectively bond the plurality of electronic component main bodies 10 to the adhesive layer 23 of the jig 20, an alignment jig that aligns and holds the plurality of electronic component main bodies 10 is used. Here, the shape memory resin 22 used in the present embodiment is a commercially available Jmade shape memory plastic (plane holding type, flat plate thickness 0.4 mm, shape recovery temperature 60 ° C.). In the first step carried out when the shape memory resin 22 is at room temperature, the shape of the shape memory resin 22 is a 0.4 mm thick flat plate (shape memory state) that is primarily shaped. The plurality of electronic component main bodies 10 held by the jig 20 may have a variation ΔL = L2-L1 in the length from the adhesive layer 23 to the end face 12B1 different from L1 and L2. In this case, the positions of the end faces 12B1 of the two electronic component main bodies 10 are not aligned.

2.2. Second Step FIG. 5 shows a second step in the prepress step. In the second step, the jig 20 is moved relative to the surface plate 30. In FIG. 5, the jig 20 is lowered with respect to the fixed surface plate 30. Also in this second step, the shape of the shape memory resin 22 is a primary shaped 0.4 mm thick flat plate (shape memory state).

2.3. Third Step and Fourth Step FIG. 6 shows the third step and the fourth step in the prepress step. In the third step, the shape memory resin 22 is heated to a temperature higher than the glass transition point, for example, 70 to 120 ° C. to be in a softened state, and the second end portion 12B of the electronic component body 10 is brought into contact with the surface plate 30 for a predetermined time. Let me. The softening temperature can be above the glass transition point and below the melting point. As a result, the shape memory resin 22 and the adhesive layer 23 are pressure-deformed. The shape of the shape memory resin 22 is a secondary shape. The forced heating of the shape memory resin 22 may be started during the second step. In the fourth step, the shape memory resin 22 is forcibly cooled from below the glass transition point to a room temperature range, for example, to be in a cured state while the second end portion 12B of the electronic component main body 10 is in contact with the surface plate 30. The shape memory resin 22 is cured as it is in the secondary shaping. By carrying out the third step and the fourth step, the position of the end surface 12B1 of the second end portion 12B of the electronic component main body 10 can be aligned with the surface of the surface plate 30.

2.4. Fifth Step FIG. 7 shows a fifth step in the prepress step. In the fifth step, the jig 20 is moved relative to the surface plate 30, and the electronic component main body 10 in which the positions of the end faces 12B1 are aligned is pulled away from the surface plate 30. This completes the prepress process. In FIG. 7, the jig 20 is raised with respect to the fixed surface plate 30. Further, this fifth step can be carried out at room temperature of the secondary shaped shape memory resin 22.

2.5. Removal step After completion of the prepress step, the above-mentioned coating step and, if necessary, a paste removing step are carried out. In any case, when the processing for the electronic component main body 10 held by the jig 20 is completed, the electronic component main body 10 is removed from the jig 20. Therefore, in the removal process, the shape memory resin 22 is deformed into a shape-retaining state other than the softened and cured shapes (secondary shaping) in which the electronic component body 10 can be removed from the jig 20. Let me. In the case of the shape memory resin 22, it can be restored to the primary shaping as a shape-retaining state other than the secondary shaping. The shape memory resin 22 recovers from the secondary shaping to the primary shaping by reheating to a shape recovery temperature of, for example, 60 ° C. or higher, and becomes a flat plate as shown in FIG. As a result, the adhesive layer 23 is also flattened, so that the electronic component main body 10 can be easily removed from the adhesive layer 23.

2.6. Evaluation The film thickness of the paste layer 14A formed on the second end portion 12B of the electronic component main body 10 manufactured by the manufacturing method of the first embodiment was evaluated. As the paste removing step carried out after the coating step, the blot step disclosed in Japanese Patent No. 6633829 proposed by the applicant of the present application was used.

In the evaluation, two types of ones having a standard length of 603 mm corresponding to the lengths L1 and L2 shown in FIG. 4A were prepared in pairs, and the variation in the film thickness of the paste layer 14A was evaluated for each pair. The film thickness (Example) of the paste layer 14A formed by using the manufacturing method of the first embodiment and the film thickness of the paste layer 14A formed by using the manufacturing method of the first embodiment for each of the two types of lengths of the electronic component main body 10 are formed without using the manufacturing method of the first embodiment. The film thickness of the paste layer 14A (comparative example) was compared with that of the paste layer 14A. In the comparative example, the heating / cooling of the shape memory resin 22 was stopped in the third and fourth steps in the prepress step of the first embodiment. The electronic component main body 10 having a length L1 shown in FIG. 4A is referred to as Comparative Example 1 or Example 1. The electronic component main body 10 having a length L2 shown in FIG. 4A is referred to as Comparative Example 2 or Example 2. In Comparative Examples 1 and 2, which are a pair of comparison targets, the variation ΔL of the lengths L1 and L2 of the electronic component main body 10 shown in FIG. 4A is also reflected in the paste layer 14A. In addition, in order to make a pair of evaluation targets having a large variation ΔL of the lengths L1 and L2 of the electronic component main body 10, products of different manufacturers were made a pair of evaluation targets.

The variation in the film thickness of the paste layer 14A was 39 to 88 μm between Comparative Examples 1 and 2, but was 2 to 18 μm between Examples 1 and 2. That is, even if the variation ΔL of the lengths L1 and L2 of the electronic component main body 10 shown in FIG. 4A is 39 to 88 μm, the film thickness variation of the paste layer 14A is 2 to 18 μm according to the method of the first embodiment. It turned out that it can be suppressed to.

As an example, the maximum film thickness of the paste layer 14A of Comparative Example 1 corresponding to the length L1 of FIG. 4 (A) was 79 μm, but in Example 1, as shown in FIG. 9 (A), the paste layer 14A The maximum film thickness was 37 μm. The maximum film thickness of the paste layer 14A of Comparative Example 2 corresponding to the length L2 of FIG. 4 (A) was 24 μm, but in Example 2, the maximum film thickness of the paste layer 14A is as shown in FIG. 9 (B). Was 38 μm. The variation of the paste layer 14A between the pair of Comparative Examples 1 and 2 was 55 μm (79-24), but the variation of the paste layer 14A between the pair of Examples 1 and 2 was only 1 μm (38-37). ) Was suppressed.

The above-mentioned evaluation relates to the paste layer 14A formed on the second end portion 12B of the electronic component main body 10 shown in FIG. 4 (A). The electronic component main body 10 having the paste layer 14A formed on the second end portion 12B is removed from the jig 20 by the removal step described above. After that, the second end portion 12B on which the paste layer 14A is formed is held by the jig 20, and the paste layer 14A is similarly formed on the first end portion 12A of the electronic component main body 10.

Therefore, the paste layer 14A formed on the first end portion 12A of the electronic component main body 10 shown in FIG. 4A was also evaluated. At that time, among the evaluation targets manufactured by the method of the first embodiment, the paste layer formed on the second end portion 12B of the electronic component main body 10 of the first embodiment corresponding to the length L1 of FIG. 4 (A). A film having a film thickness of 14A in the range of 32 to 40 μm was selected. The film thickness of the paste layer 14A formed on the first end portion 12A of the electronic component main body 10 of the first embodiment by the method of the first embodiment was 32 to 45 μm. That is, the variation in the film thickness of the paste layer 14A formed on the second end portion 12B is 8 μm (40-32), and the variation in the film thickness of the paste layer 14A formed on the first end portion 12A is 13 μm (45). -32), and the variation in the film thickness of the paste layer 14A formed on both ends 12A and 12B was about the same.

Next, the paste layer 14A formed on the second end portion 12B of the electronic component main body 10 of Example 2 corresponding to the length L2 of FIG. 4A is selected to have a film thickness in the range of 31 to 38 μm. did. The film thickness of the paste layer 14A formed on the first end portion 12A of the electronic component main body 10 of the second embodiment by the method of the first embodiment was 35 to 40 μm. That is, the variation in the film thickness of the paste layer 14A formed on the second end portion 12B is 7 μm (38-31), and the variation in the film thickness of the paste layer 14A formed on the first end portion 12A is 5 μm (40). -35), and the variation in the film thickness of the paste layer 14A formed on both ends 12A and 12B was about the same.

Based on the above evaluation results, according to the first embodiment, the variation ΔL of the lengths L1 and L2 of the plurality of electronic component bodies 10 shown in FIG. 4A is the first and second variations of the plurality of electronic component bodies 10. It can be seen that the degree of reflection in the film thickness difference of the paste layers 14A formed on the ends 12A and 12B can be reduced. Thereby, the film thickness difference of each paste layer 14A of the plurality of electronic component main bodies 10 can be significantly reduced.

3. 3. Second Embodiment Next, the details of the prepress step and the removal step according to the second embodiment will be described with reference to FIGS. 10 to 14. In FIG. 10, the jig 20 includes a base material 21 and a flat plate material 24. The flat plate material 24 can be, for example, a thermoplastic resin. The thermoplastic resin 24 can be a thermoplastic adhesive. Then, as shown in FIG. 4, the adhesive layer 23 becomes unnecessary, and the exposed surface of the thermoplastic adhesive 24 forms an adhesive surface for adhering the first end portion 12A of the electronic component main body 10.

The thermoplastic adhesive 24 has a "reversible phase" in which softening and curing occur reversibly with temperature changes. The thermoplastic adhesive 24 is deformed into an arbitrary shape at a temperature equal to or higher than the glass transition point, and is cured when cooled while applying stress. The thermoplastic adhesive 24 is obtained by melt-coating a solid adhesive whose main component is a thermoplastic resin, and is a hot-melt type such as a thermoplastic polyester-based hot-melt adhesive that solidifies when cooled and exhibits adhesive strength. Can be preferably used.

3.1. First Step FIG. 10 shows a first step in the prepress step. In the first step, the first end portion 12A of the electronic component main body 10 is adhered to the thermoplastic adhesive 24 of the jig 20. The thermoplastic adhesive 24 used in the first step is at room temperature and is solidified with a flat plate. The plurality of electronic component main bodies 10 held by the jig 20 may have a variation ΔL = L2-L1 in the length from the adhesive layer 23 to the end face 12B1 different from L1 and L2. In this case, the positions of the end faces 12B1 of the two electronic component main bodies 10 are not aligned.

3.2. Second Step FIG. 11 shows a second step in the prepress step. In the second step, the jig 20 is moved relative to the surface plate 30. In FIG. 5, the jig 20 is lowered with respect to the fixed surface plate 30. Also in this second step, the thermoplastic adhesive 24 is at room temperature and is solidified with a flat plate.

3.3. Third Step and Fourth Step FIG. 12 shows the third step and the fourth step in the prepress step. In the third step, the thermoplastic adhesive 24 is heated to a temperature equal to or higher than the glass transition point to be in a softened state, and the second end portion 12B of the electronic component main body 10 is brought into contact with the surface plate 30. Thereby, the thermoplastic adhesive 24 is deformed by pressure. In the fourth step, the thermoplastic adhesive 24 is forcibly cooled to a room temperature below the glass transition point, for example, to be in a cured state while the second end portion 12B of the electronic component main body 10 is in contact with the surface plate 30. The thermoplastic adhesive 24 is cured in the shape imparted in the third step. By carrying out the third step and the fourth step, the position of the end surface 12B1 of the second end portion 12B of the electronic component main body 10 can be aligned with the surface of the surface plate 30.

3.4. Fifth Step FIG. 13 shows a fifth step in the prepress step. In the fifth step, the jig 20 is moved relative to the surface plate 30, and the electronic component main body 10 in which the positions of the end faces 12B1 are aligned is pulled away from the surface plate 30. This completes the prepress process. In FIG. 7, the jig 20 is raised with respect to the fixed surface plate 30. Further, this fifth step can be carried out while maintaining the shape of the thermoplastic adhesive 24 deformed in the third step and the fourth step at room temperature.

3.5. Removal step In the removal step, the thermoplastic adhesive 24 is softened so that the electronic component body 10 can be removed from the jig 20. For this purpose, the thermoplastic adhesive 24 is heated to a temperature equal to or higher than the glass transition point. At that time, in order to prevent unexpected deformation of the thermoplastic adhesive 24, as shown in FIG. 14, the mold material 60 can be used. The mold material 60 can cover the exposed surface of the thermoplastic resin 24, particularly the lower surface of the thermoplastic adhesive 24 shown in FIG. The mold material 60 has a hole 61 for preventing interference with the electronic component main body 10. The thermoplastic adhesive 24 that softens in the mold material 60 recovers from the shape imparted in the third step and the fourth step to the original flat plate. Thereby, the electronic component body 10 can be easily removed from the flattened thermoplastic adhesive 24.

4. Third Embodiment In the third embodiment, the thermoplastic resin 25, which is not the thermoplastic adhesive 24, is used as the flat plate material in the jig 20. 4 to 9 show a state in which the thermoplastic resin 25 is arranged between the base material 21 and the adhesive layer 23 instead of the shape memory resin 22 of the first embodiment. Therefore, if the shape memory resin 22 in the first embodiment is changed to the thermoplastic resin 25, the thermoplastic resin 25 is phase-changed in the first to fifth steps in the same manner as in the second embodiment to perform the prepress step. Can be carried out.

The removal step can be carried out by arranging the mold material 60 shown in FIG. 14 so as to cover the adhesive layer 23 of FIG. Alternatively, the mold material 60 may not be arranged, and the adhesive layer 23 may perform the function of the mold material 60.

5. Fourth Embodiment Next, the temperature adjusting part of the flat plate material 22, 24 or 25 in the jig 20 will be described. Although FIGS. 15 to 18 describe the temperature control unit for the first embodiment, it can be similarly applied to the second actual view mode and the third embodiment.

In FIG. 15, the temperature control portion 100 is provided on the base material 21 of the jig 20. The temperature control unit 100 may have both a heating unit and a cooling unit, or may be used as both a heating unit and a cooling unit, such as a Pelche element. Then, the temperature control unit 100 can efficiently heat or cool the shape memory resin 22 via the base material 21 that can be formed of a highly conductive material such as metal. In FIG. 16, the temperature control unit 100 is provided on the base 32 for fixing the jig 20. Then, the temperature control unit 100 can efficiently heat or cool the shape memory resin 22 via the base material 32 and the base material 21 which can be formed of a highly conductive material such as metal. In this way, by providing the temperature control unit 100 on the jig 20 or the base 32, the shape memory resin 22 can be temperature-controlled so as to be switched between the primary shaping and the secondary shaping.

In the second and third embodiments, the thermoplastic resins (thermoplastic adhesives) 24 and 25 can be set to the softened state and the cured state by the temperature control portion 100 provided on the jig 20 or the base 32. ..

In FIG. 17, a heating unit 110 is provided on the base material 21 of the jig 20, and a cooling unit 120 is provided on the surface plate 30. In FIG. 18, a heating unit 110 is provided on the base 32 for fixing the jig 20, and a cooling unit 120 is provided on the surface plate 30. The shape memory resin 22 is set to the softened state and the shape memory state by the heating unit 110 provided on the jig 20 or the base 32. The shape memory resin 22 is cooled by the cooling unit 120 provided on the surface plate 30 via the plurality of electronic component main bodies 10 and set to a cured state. Moreover, by arranging the heating unit 110 and the cooling unit 120 apart from each other, the adverse effect of one on the other can be reduced.

In the second and third embodiments, the thermoplastic resins (thermoplastic adhesives) 24 and 25 can be set to the softened state by the heating unit 110 provided on the jig 20 or the base 32. The shape memory resin 22 is cooled by the cooling unit 120 provided on the surface plate 30 via the plurality of electronic component main bodies 10 and set to a cured state.

Although the present embodiment has been described in detail as described above, those skilled in the art will easily understand that many modifications that do not substantially deviate from the novel matters and effects of the present invention are possible. Therefore, all such modifications are included in the scope of the present invention.

For example, as a flat plate material that undergoes phase change between softening and curing, a thermosetting resin, a stimulus-responsive material capable of softening and curing, and the like are used in addition to a shape memory resin or a thermoplastic resin (thermoplastic adhesive). be able to. The stimulus-responsive resin is described in, for example, the Journal of the Japan Society of Mechanical Engineers 2004.11 Vol. 107 No. 1032. Stimulus-responsive materials are gels, resins, estramers, etc. whose properties change with physical stimuli (temperature, light, magnetic field, current), but in recent years, those that are reversibly softened / cured by physical stimuli have become industrial. It has been reported by the Institute of Technology, Hokkaido University, University of Tsukuba, Yamagata University, Keio University, etc. Therefore, a stimulus-responsive resin that reversibly softens / cures may be used as the flat plate material. In this case, the temperature control unit 100, the heating unit 110, and the cooling unit 120 shown in FIGS. 15 to 18 are each changed to a physical stimulation unit.

10 ... Electronic component body, 12A ... 1st end, 12B ... 2nd end, 12B1 ... End face, 14, 14A ... Paste layer, ... 20 ... Jigger, 21 ... Base material, 22 ... Flat plate material (shape memory resin) ), 23 ... Adhesive layer, 24 ... Flat plate material (thermoplastic adhesive), 25 ... Flat plate material (thermoplastic resin), 30 ... Plate, 32 ... Base (movable plate), 50 ... Mold material, 100 ... Temperature control part , 110 ... Heating part, 120 ... Cooling part

Claims (14)

A method for manufacturing an electronic component, which includes a coating step of applying a paste to each of a plurality of electronic component bodies and a prepress step performed before the coating step.
The prepress process is
The first step of adhering the first end of each of the plurality of electronic component bodies to the adhesive surface on the exposed surface of the flat plate material provided on the jig.
The second step of moving the jig relative to the surface plate and
The flat plate material is deformed by softening the flat plate material and bringing each second end portion of the plurality of electronic component bodies opposite to the first end portion thereof into contact with the surface plate. In the third step of aligning the positions of the end faces of the second ends of each of the above,
The fourth step of hardening the flat plate material with the positions of the end faces aligned, and
After that, the fifth step of moving the jig relative to the surface plate and pulling the plurality of electronic component bodies whose end faces are aligned from the surface plate.
A method of manufacturing an electronic component having. In claim 1,
After the coating step, a paste removing step of removing excess paste from the paste applied to the second end of each of the plurality of electronic component bodies held by the jig to form a paste layer is further performed. Manufacturing method of electronic parts to have. In claim 1 or 2,
It further comprises a removal step of removing the plurality of electronic component bodies from the jig after the coating step or the paste removing step.
In the removal step, the plurality of electronic component bodies can be removed from the jig by re-softening the flat plate material deformed in the third step and cured in the fourth step. Production method. In claim 1 or 2,
It further comprises a removal step of removing the plurality of electronic component bodies from the jig after the coating step or the paste removing step.
In the removal step, the flat plate material deformed in the third step and cured in the fourth step is in a state in which the plurality of electronic component bodies can be removed from the jig, and the softened state and the said. A method for manufacturing electronic components that transforms into a shape-retaining state other than the cured state. In claim 4,
The flat plate material is a shape memory resin, and in the first step, the second step, and the removal step, the shape memory resin is set to a flat plate shape which is a primary shape memorized, and the third step, In the fourth step and the fifth step, the shape memory resin is set to any secondary shaping which is the softened state or the cured state in which the positions of the end faces of the respective second end portions are aligned, respectively. Manufacturing method of electronic parts. In claim 5,
In the second step, a method for manufacturing an electronic component in which the transition of the shape memory resin to the softened state is started. In claim 3,
The flat plate material is a thermoplastic resin, the thermoplastic resin is in a cured state in the first step and the second step, and is set to a temperature equal to or higher than the glass transition point in the third step and the removal step. A method for manufacturing an electronic component in which the thermoplastic resin is in a softened state and the thermoplastic resin is in a cured state in the fourth step and the fifth step. In any one of claims 5 to 7,
The jig includes a base material and an adhesive layer forming the adhesive surface, and the flat plate material is interposed and arranged between the base material and the adhesive layer.
The third step is a method for manufacturing an electronic component in which the adhesive layer is deformed in accordance with the deformation of the flat plate material. In claim 7,
The thermoplastic resin is a method for manufacturing an electronic component which is a thermoplastic adhesive. In claim 7 or 9,
The removal step is a method for manufacturing an electronic component that softens the thermoplastic resin in a mold material. In any one of claims 1 to 10,
A method for manufacturing an electronic component in which the flat plate material is set to the softened state and the cured state by the temperature control portion provided on the jig or the base holding the jig. In claim 5 or 6,
A method for manufacturing an electronic component in which the shape memory resin is set to each of the primary shaping and the secondary shaping by a temperature control portion provided on the jig or a base for holding the jig. In any one of claims 1 to 10,
The flat plate material is set to the softened state by the jig or a heating portion provided on the substrate that holds the jig.
A method for manufacturing an electronic component in which the flat plate material is set to the cured state by a cooling unit provided on the surface plate. In claim 5 or 6,
The shape memory resin is set to the softened state and the primary shaping by the jig or the heating portion provided on the base holding the jig.
A method for manufacturing an electronic component in which the shape memory resin is set to the cured state by a cooling unit provided on the surface plate.

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