JP2022093571A - Package and light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package, a light-emitting device, and a manufacturing method thereof which have sufficient adhesive strength between leads.

SOLUTION: A package 1 includes: a first lead 10 having first through holes 14; a first molded body 61 holding the first lead 10; a second lead 20 having second recesses 22a that communicate with the first through holes 14 on the surface side that faces and joins the first lead 10; and a second molded body 62 holding the second lead 20, and parts of the second molded body 62 are continuously filled in the first through holes 14 and the second recesses 22a, respectively.

SELECTED DRAWING: Figure 2B

COPYRIGHT: (C)2022,JPO&INPIT

Description

The present disclosure relates to packages, light emitting devices and their respective manufacturing methods.

Conventionally, as a package for mounting a flip chip on which a light emitting element is mounted, a package having a structure in which two leads are overlapped is known (see, for example, Patent Documents 1 to 3).

Utility Model Registration No. 3192859 Gazette Japanese Unexamined Patent Publication No. 2010-021231 Japanese Unexamined Patent Publication No. 2007-300878

In a conventional package, two leads are bonded with resin, solder, or the like. However, such a package has a problem that the adhesive strength between leads is insufficient.

Therefore, it is an object of the present embodiment to provide a package having sufficient adhesive strength between leads, a light emitting device, and a method for manufacturing each of them.

In order to solve the above problems, the package according to the embodiment of the present disclosure includes a first lead having a first through hole or a first recess in a first portion, a first molded body holding the first lead, and a first molded body. On the surface side facing and joining the first lead, the second portion overlapping the first portion of the first lead communicates with the second recess that communicates with the first through hole, or communicates with the first recess. It has a second lead having a second through hole and a second molded body holding the second lead, and the first portion of the first lead and the second portion of the second lead are electrode terminals. In the second through hole communicating with the first through hole and the first through hole, or with the second through hole communicating with the first recess and the first recess, the second molded body is formed. Part of it is continuously filled.

Further, the package according to the embodiment of the present disclosure includes a first lead having a first recess in a first portion, a first molded body holding the first lead, and a surface for facing and joining the first lead. On the side, a second lead having a second recess communicating with the first recess in a second portion overlapping the first portion of the first lead, and a second molded body holding the second lead are provided. The first portion of the first lead and the second portion of the second lead are electrode terminals, and the second molding is formed in the second recess communicating with the first recess and the first recess. Part of the body is continuously filled.

Further, the light emitting device according to the embodiment of the present disclosure includes the package and a light emitting element mounted on the package.

Further, in the method for manufacturing a package according to the embodiment of the present disclosure, a first molded body holding the first lead is provided in a first lead having a first through hole or a first recess in a first portion as an electrode terminal. A second recess that communicates with the first through hole in a second portion that is an electrode terminal that overlaps with the first portion of the first lead on the surface side that faces and joins the first lead. Alternatively, a step of preparing a second lead having a second through hole communicating with the first recess, a second molded body holding the second lead, and the first through hole and the first through hole are formed. A step of filling the second recess that communicates with one through hole or the second through hole that communicates with the first recess and the first recess so that a part of the second molded body is continuous. including.

Further, in the method for manufacturing a package according to the embodiment of the present disclosure, a first lead having a first recess in a first portion as an electrode terminal is provided with a first molded body for holding the first lead. A second lead having a second recess communicating with the first recess in the second portion as an electrode terminal overlapping the first portion of the first lead on the surface side to be joined facing the first lead. A part of the second molded body is continuously formed in the second recess that communicates with the first recess and the first recess while molding the second molded body that holds the second lead. Includes a step of filling to do so.

Further, in the package according to the embodiment of the present disclosure, the first lead having the first through hole or the first recess in the first portion and the first lead on the surface side facing and joining the first lead of the first lead. A second lead having a second recess that communicates with the first through hole or a second through hole that communicates with the first recess in a second portion that overlaps with the first portion, and the first lead and the second lead. It has a molded body that holds the leads, and the first portion of the first lead and the second portion of the second lead are electrode terminals, and are formed in the first through hole and the first through hole. A part of the molded body is continuously filled in the second recess that communicates with the second recess, or the second through hole that communicates with the first recess and the first recess.

Further, in the package according to the embodiment of the present disclosure, the first lead having the first recess in the first portion and the first portion of the first lead on the surface side facing and joining the first lead. The first of the first leads, which has a second lead having a second recess communicating with the first recess in the overlapping second portion, and a molded body holding the first lead and the second lead. The portion and the second portion of the second lead are electrode terminals, and the second recess communicating with the first recess and the first recess is continuously filled with a part of the molded body. ..

Further, in the method for manufacturing a package according to the embodiment of the present disclosure, a first lead having a first through hole or a first recess in a first portion as an electrode terminal is joined to a surface side facing the first lead. A second portion having a second recess communicating with the first through hole or a second through hole communicating with the first recess in the second portion serving as an electrode terminal overlapping the first portion of the first lead. The step of preparing the leads, the second recess that forms the first lead and the molded body that holds the second lead, and the second recess that communicates with the first through hole and the first through hole, or the said. The second through hole communicating with the first concave portion and the first concave portion is filled with a step of filling a part of the molded product so as to be continuous.

Further, in the method for manufacturing a package according to the embodiment of the present disclosure, the first lead having a first recess in the first portion as an electrode terminal and the first lead on the surface side facing and joining the first lead are described. A step of preparing a second lead having a second recess communicating with the first recess in a second portion as an electrode terminal overlapping the first portion of the lead, and holding the first lead and the second lead. This includes a step of molding the molded body to be molded and filling the second recess, which communicates with the first recess and the first recess, so that a part of the molded body is continuous.

Further, the method for manufacturing a light emitting device according to the embodiment of the present disclosure includes a step of mounting a light emitting element on the package manufactured by the method for manufacturing the package.

According to the package and the light emitting device according to the embodiment of the present disclosure, the adhesive strength between the leads is sufficient. Further, according to the package manufacturing method according to the embodiment of the present disclosure, a package having sufficient adhesive strength between leads can be manufactured. Further, according to the method for manufacturing a light emitting device according to the embodiment of the present disclosure, it is possible to manufacture a light emitting device having a package having sufficient adhesive strength between leads.

It is a perspective view which shows typically the structure of the package and the light emitting device which concerns on 1st Embodiment. It is a top view which shows typically the structure of the package and the light emitting device which concerns on 1st Embodiment. FIG. 1B is a cross-sectional view taken along the line IIA-IIA of FIG. 1B. FIG. 1B is a cross-sectional view taken along the line IIB-IIB of FIG. 1B. It is sectional drawing in the IIC-IIC line of FIG. 1B. It is a top view which shows typically the structure of the 1st lead which concerns on 1st Embodiment. It is a top view which shows typically the structure of the 2nd read which concerns on 1st Embodiment. It is a perspective view which shows the structure schematically in the 1st lead which concerns on 1st Embodiment which provided the 1st molded body. It is a perspective view which shows typically the structure of the 2nd lead which concerns on the 1st Embodiment which provided the 2nd molded body. It is sectional drawing which shows the step of forming the 1st molded article on the 1st lead in the manufacturing method of the package which concerns on 1st Embodiment. It is sectional drawing which shows the step of forming the 2nd molded body in the 2nd lead in the manufacturing method of the package which concerns on 1st Embodiment. It is sectional drawing which shows the process of placing a light emitting element in the manufacturing method of a light emitting device which concerns on 1st Embodiment. It is sectional drawing which shows the process of forming an underfill in the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is sectional drawing which shows the process of forming a frame body in the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is sectional drawing which shows the process of forming a covering member in the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is sectional drawing which shows typically the structure of the package and the light emitting device which concerns on 2nd Embodiment, and is the sectional drawing corresponding to line IIA-IIA of FIG. 1B. It is sectional drawing which shows typically the structure of the package and the light emitting device which concerns on 2nd Embodiment, and is the sectional drawing corresponding to line IIB-IIB of FIG. It is sectional drawing which shows typically the structure of the package and the light emitting device which concerns on 2nd Embodiment, and is the sectional drawing corresponding to the IIC-IIC line of FIG. 1B. It is sectional drawing which shows the state which arranged the 2nd lead on the 1st lead in the manufacturing method of the package which concerns on 2nd Embodiment. It is sectional drawing which shows the step of forming a molded body on a 1st lead and a 2nd lead in the package manufacturing method which concerns on 2nd Embodiment. It is a top view which shows typically the structure of the 1st lead which concerns on other embodiment. It is a top view which shows typically the structure of the 2nd lead which concerns on other embodiment. It is sectional drawing which shows typically the structure of the package which concerns on other embodiment, and is the sectional drawing corresponding to line IIB-IIB of FIG. 1B. It is sectional drawing which shows typically the structure of the package which concerns on other embodiment, and is the sectional drawing corresponding to line IIB-IIB of FIG. 1B. It is a top view which shows typically the structure of the 1st lead which concerns on other embodiment. It is a top view which shows typically the structure of the 2nd lead which concerns on other embodiment. It is sectional drawing which shows typically the structure of the package which concerns on other embodiment, and is the sectional drawing corresponding to line IIB-IIB of FIG. 1B. It is a top view which shows typically the structure of the light emitting device which concerns on other embodiment. It is a top view which shows typically the structure of the 1st lead which concerns on other embodiment. It is a top view which shows typically the structure of the 2nd lead which concerns on other embodiment. It is a top view which shows typically the structure of the light emitting device which concerns on other embodiment. It is sectional drawing of the 1st lead which concerns on other embodiment, and is the sectional drawing corresponding to the XIV-XIV line of FIG. 3A. It is sectional drawing which shows the process of forming a sheet member in the manufacturing method of the light emitting device which concerns on another embodiment. It is sectional drawing which shows the process of forming the side wall member in the manufacturing method of the light emitting device which concerns on another embodiment.

The embodiments will be described below with reference to the drawings. However, the embodiments shown below exemplify packages, light emitting devices, and methods for manufacturing them for embodying the technical idea of the present embodiment, and are not limited to the following. Further, the dimensions, materials, shapes, relative arrangements, etc. of the components described in the embodiments are not intended to limit the scope of the present invention to the specific description, but are merely examples. It's just that. The size and positional relationship of the members shown in each drawing may be exaggerated for the sake of clarity.

<< First Embodiment >>
FIG. 1A is a perspective view schematically showing the configuration of the package and the light emitting device according to the first embodiment. FIG. 1B is a plan view schematically showing the configuration of the package and the light emitting device according to the first embodiment. FIG. 2A is a cross-sectional view taken along the line IIA-IIA of FIG. 1B. FIG. 2B is a cross-sectional view taken along the line IIB-IIB of FIG. 1B. FIG. 2C is a cross-sectional view taken along the line IIC-IIC of FIG. 1B. FIG. 3A is a plan view schematically showing the configuration of the first lead according to the first embodiment. FIG. 3B is a plan view schematically showing the configuration of the second lead according to the first embodiment. FIG. 4A is a perspective view schematically showing the configuration of the first lead according to the first embodiment provided with the first molded body. FIG. 4B is a perspective view schematically showing the configuration of the second lead according to the first embodiment provided with the second molded body.
The light emitting device 100 includes a package 1 and a light emitting element 2 mounted on the package 1. The light emitting device 100 further includes a frame body 4 formed so as to surround the light emitting element 2, and a covering member 5 formed in the frame body 4 so as to cover the light emitting element 2.

[package]
First, package 1 will be described.
Package 1 has a first lead 10, a first molded body 61, a second lead 20, and a second molded body 62.
The package 1 has a first lead 10 having a first through hole 14 in the first portions 11 and 12, a first molded body 61 holding the first lead 10, and a surface side to face-to-face and join the first lead 10. The second lead 20 having the second recesses 21a and 22a communicating with the first through hole 14 and the second lead 20 are held in the second portions 21 and 22 overlapping the first portions 11 and 12 of the first lead 10. The second molded body 62 and the like.
The first portions 11 and 12 of the first lead 10 and the second portions 21 and 22 of the second lead 20 are electrode terminals, and the second recesses 21a and 22a communicating with the first through hole 14 and the first through hole 14 are used. Is continuously filled with a part of the second molded body 62.

(1st lead)
The first lead 10 is held by the first molded body 61. The first lead 10 has a predetermined wiring pattern. The first lead 10 has a P-side first portion (hereinafter, appropriately referred to as a first P-side electrode terminal) 11 which is a P-side electrode terminal and an N-side first portion (hereinafter, appropriately referred to as an N-side electrode terminal) which is an N-side electrode terminal. The first N-side electrode terminal) 12 is arranged in parallel, and the third portion (hereinafter, appropriately referred to as a heat-drawing terminal) 13 which is preferably a heat-drawing terminal is provided with the first P-side electrode terminal 11. It is provided apart from the first N side electrode terminal 12 and the first N side electrode terminal 12.

The first P-side electrode terminal 11 is a member that joins and conducts with the P-side electrode terminal (hereinafter, appropriately referred to as a second P-side electrode terminal) 21 of the second lead 20. The first P-side electrode terminal 11 is located on the left side of the center of the first lead 10 in a plan view and is formed in a rectangular shape. Further, the first P-side electrode terminal 11 has two first through holes 14 penetrating in the plate thickness direction on one side and the other side in the longitudinal direction.

The first N-side electrode terminal 12 is a member that joins and conducts with the N-side electrode terminal (hereinafter, appropriately referred to as a second N-side electrode terminal) 22 of the second lead 20. The first N-side electrode terminal 12 is located on the right side of the center of the first lead 10 in a plan view and is formed in a rectangular shape. Further, the first N-side electrode terminal 12 has one first through hole 14 penetrating in the plate thickness direction on the center side in the longitudinal direction.

The first P-side electrode terminal 11 and the first N-side electrode terminal 12 are both exposed from the first molded body 61 holding the first lead 10. Then, after the first lead 10 is joined to the second lead 20, on the front surface side and the back surface side, the first lead 10 is formed in each of the first through holes 14 formed in the first P side electrode terminal 11 and the first N side electrode terminal 12. Is filled with a part of the second molded body 62 that holds the second lead 20 through the second recesses 21a and 22a of the second lead 20.

The heat drawing terminal 13 is a member for efficiently drawing out the heat generated from the light emitting element 2 to the outside and improving the heat drawing of the light emitting device 100. The heat drawing terminal 13 is formed in a rectangular shape at the center of the first lead 10 in a plan view. The heat drawing terminal 13 is provided apart from the first P side electrode terminal 11 and the first N side electrode terminal 12, and is electrically independent from the first P side electrode terminal 11 and the first N side electrode terminal 12. ing.

The heat-drawing terminal 13 is etched to a thickness of about half on the surface side at a portion overlapping the P-side fourth portion 23 and the N-side fourth portion 24 of the second lead 20 in a plan view (hereinafter, appropriately referred to as half-etching). Has been done. The heat drawing terminal 13 is half-etched to form a plurality of third recesses 13a. Although three third recesses 13a are formed here corresponding to the number of electrodes of the light emitting element 2, the number of the third recesses 13a may be increased or decreased. For example, only two of the three third recesses 13a may be used at both ends. At this time, the portion in the middle of the heat drawing terminal 13 is electrically connected to the second P side electrode terminal 21. This is because the portion in the center of the heat-drawing terminal 13 and the two ends of the heat-drawing terminal 13 may not be short-circuited. The third recess 13a is a groove portion continuous in the plate width direction up to the side surface of the heat drawing terminal 13, and the third recess 13a, which is the groove portion, is filled with the first molded body 61. Of both sides of the heat drawing terminal 13, all but the third recess 13a are exposed from the first molded body 61.
Steps and dents may be provided on the side surfaces of the first lead 10 and the second lead 20 by pressing, etching, or the like. As a result, the adhesion and moldability between the first lead 10 and the first molded body 61 and the second lead 20 and the second formed body 62 can be improved.

(2nd lead)
The second lead 20 is held by the second molded body 62. The second lead 20 is provided on the first lead 10 and is joined to face the first lead 10. The second lead 20 has a wiring pattern different in shape from the first lead 10. The second lead 20 has a second portion 21 on the P side, which is the second P side electrode terminal, and a second portion 22 on the N side, which is the second N side electrode terminal, arranged in parallel, and further has P. The P-side fourth portion (hereinafter, appropriately referred to as P-side terminal branch) 23, which is the side terminal branch, and the N-side fourth portion (hereinafter, appropriately referred to as N-side terminal branch), which is the N-side terminal branch. It has 24 and.

The second P-side electrode terminal 21 overlaps with the first P-side electrode terminal 11 of the first lead 10 in a plan view. The second P-side electrode terminal 21 has two second recesses 21a communicating with the first through hole 14 on the back surface side by being half-etched. Each of the second recesses 21a is a groove portion continuous in the plate width direction to the side surface of the second P side electrode terminal 21. After the second lead 20 is joined to the first lead 10, each of the second recesses 21a, which is a groove portion, is filled with a part of the second molded body 62 that holds the second lead 20. .. Of both sides of the second P-side electrode terminal 21, all but the second recess 21a are exposed from the second molded body 62.

The second N-side electrode terminal 22 overlaps with the first N-side electrode terminal 12 of the first lead 10 in a plan view. The second N-side electrode terminal 22 has a second recess 22a on the back surface side that communicates with the first through hole 14 by being half-etched. The second recess 22a is a groove portion continuous in the plate width direction up to the side surface of the second N side electrode terminal 22. After the second lead 20 is joined to the first lead 10, the second recess 22a, which is a groove portion, is filled with a part of the second molded body 62. Of both sides of the second N-side electrode terminal 22, all but the second recess 22a are exposed from the second molded body 62.

Since the first through hole 14 and the second recesses 21a and 22a are partially filled with the second molded body 62, the joint area between the first lead 10 and the second lead 20 increases, so that the first lead The 10 and the second lead 20 are more firmly joined.

Further, the first through hole 14 and the second recesses 21a and 22a are not filled with the first molded body 61 in advance. As a result, the subsequent filling of the first through hole 14 with the second molded body 62 is not hindered by the first molded body 61. Therefore, the first lead 10 is also held by the second molded body 62 via the first through hole 14 and the second recesses 21a and 22a, and the first lead 10 and the second lead 20 are more firmly joined.

The shape of the first through hole 14 is not particularly limited as long as the first lead 10 and the second lead 20 can be firmly joined by communicating with the second recesses 21a and 22a and filling the second molded body 62. The first through hole 14 may have a cylindrical shape, a frustum shape, or an uneven inner surface. It has a circular shape, an elliptical shape, a square shape, or the like in a plan view, and a circular shape is preferable. Similarly, the shapes of the second recesses 21a and 22a are not particularly limited as long as they can communicate with the first through hole 14 and firmly join the first lead 10 and the second lead 20, and are semicircular and square. , Square shape and the like are preferable.

The number of the first through holes 14 is not particularly limited as long as the first lead 10 and the second lead 20 can be firmly joined, and three or more are preferable. Since the number of the second recesses 21a and 22a is formed corresponding to the number of the first through holes 14, it is preferable that the number is the same as that of the first through holes 14, but the number may be increased or decreased.

In the first P side electrode terminal 11 and the second P side electrode terminal 21, a portion exposed from the first molded body 61 on the front surface side of the first lead 10 and a portion exposed from the second molded body 62 on the back surface side of the second lead 20. The first lead 10 and the second lead 20 are directly joined or joined by using a joining member such as an adhesive or solder.

In the first N side electrode terminal 12 and the second N side electrode terminal 22, a portion exposed from the first molded body 61 on the front surface side of the first lead 10 and a portion exposed from the second molded body 62 on the back surface side of the second lead 20. The first lead 10 and the second lead 20 are directly joined or joined by using a joining member such as an adhesive or solder.

The first lead 10 and the second lead 20 are preferably joined by direct joining.
Here, direct joining means that they are joined without using other members such as an adhesive. The direct bonding is preferably a diffusion bonding. Diffusion bonding is "a method in which the base metal is brought into close contact with each other, pressed under temperature conditions below the melting point of the base metal to the extent that plastic deformation does not occur as much as possible, and then bonded using the diffusion of atoms generated between the bonding surfaces." Is. Direct bonding improves thermal and electrical conductivity.

The P-side terminal branch portion 23 is a portion to which the P-side electrode 72 of the light emitting element 2 is joined. The P-side terminal branch portion 23 is formed in a direction continuously orthogonal to the second P-side electrode terminal 21, and extends toward the center of the second lead 20 in a plan view. The P-side terminal branch portion 23 is formed at a position where a part thereof overlaps with the heat drawing terminal 13 of the first lead 10 in a plan view. A part of the P-side terminal branch portion 23 overlaps with the heat drawing terminal 13 in a plan view. The heat-drawing terminal 13 of the first lead 10 has a third recess 13a facing a portion overlapping a part of the P-side terminal branch portion 23. Therefore, in the heat drawing terminal 13 and the P-side terminal branch portion 23, the first lead 10 and the second lead 20 are separated from each other via the third recess 13a. Since there is a third recess 13a between the heat drawing terminal 13 and the P-side terminal branch portion 23, a part of the first molded body 61 is continuously filled, and the first lead 10 and the second lead There is no contact with 20.

The N-side terminal branch portion 24 is a portion to which the N-side electrode 71 of the light emitting element 2 is joined. The N-side terminal branch portion 24 is formed in a direction continuously orthogonal to the second N-side electrode terminal 22 and extends toward the center of the second lead 20 in a plan view. The N-side terminal branch portion 24 is formed at a position where a part thereof overlaps with the heat-drawing terminal 13 of the first lead 10 in a plan view. A part of the N-side terminal branch portion 24 overlaps with the heat-drawing terminal 13 in a plan view. The heat-drawing terminal 13 of the first lead 10 has a third recess 13a facing a portion overlapping a part of the N-side terminal branch portion 24. Therefore, in the heat drawing terminal 13 and the N-side terminal branch portion 24, the first lead 10 and the second lead 20 are separated from each other via the third recess 13a. Since there is a third recess 13a between the heat drawing terminal 13 and the N-side terminal branch portion 24, a part of the first molded body 61 is continuously filled, and the first lead 10 and the second lead There is no contact with 20.

Since the heat-drawing terminal 13 and the P-side terminal branching portion 23 and the N-side terminal branching portion 24 are separated from each other, the P-side terminal branching portion 23 on which the light emitting element is placed is placed on the upper surface of the heat-drawing terminal 13. And the N-side terminal branch portion 24 can be arranged. Therefore, different electrode patterns can be formed on the front surface and the back surface of the package 1. As a result, a mounting board having the same wiring pattern as the wiring pattern on the back surface of the package 1 can be used, and light emitting elements having different numbers of terminals such as 3 terminals can be used.

Further, since the P-side terminal branch portion 23 and the N-side terminal branch portion 24 are orthogonal to the heat-drawing terminal 13 in a plan view, the light emitting element 2 can be easily mounted. In addition, the package 1 can be easily manufactured.

Examples of the material of the first lead 10 and the second lead 20 include copper, a copper alloy, iron, and an iron alloy.
The first lead 10 and the second lead 20 may be plated. By plating, the reflectance of light from the light emitting element 2 can be increased.

Plating includes, for example, gold, silver, copper, platinum, or alloys containing one of these. If the plating is made of these metals, the reflectance of light from the light emitting element 2 can be further increased.

(1st molded body, 2nd molded body)
The first molded body 61 is a member that holds the first lead 10. The first molded body 61 is formed to have the same thickness as the first lead 10. The second molded body 62 is a member that holds the second lead 20. The second molded body 62 is formed to have the same thickness as the second lead 20.

Examples of the material of the first molded body 61 and the second molded body 62 include a thermoplastic resin and a thermosetting resin. In the case of the thermoplastic resin, for example, polyphthalamide resin, liquid crystal polymer, polybutylene terephthalate (PBT), unsaturated polyester and the like can be used. In the case of a thermosetting resin, for example, an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, or the like can be used.

[Light emitting device]
Next, the light emitting device 100 will be described.
The light emitting device 100 includes a package 1, a light emitting element 2, an underfill 3, a frame body 4, and a covering member 5. By having the package 1, the light emitting device 100 can improve the bonding strength between the leads. Since the package 1 is the same as described above, the description thereof will be omitted.

(Light emitting element)
The light emitting element 2 has two N-side electrodes 71 and one P-side electrode 72 formed between the two N-side electrodes 71.
In the light emitting element 2, two N-side electrodes 71 are connected to two N-side terminal branch portions 24 of the second lead 20, respectively, and one P-side electrode 72 is a P-side terminal branch portion of the second lead 20. It is connected to 23. As a result, the light emitting element 2 is mounted on the second lead 20 of the package 1. The shape, size, and the like of the light emitting element 2 used here are not particularly limited. As the emission color of the light emitting element 2, one having an arbitrary wavelength can be selected depending on the intended use. For example, a GaN system or an InGaN system can be used as the blue light emitting element 2 (light having a wavelength of 430 to 490 nm). As the InGaN system, In _X Al _Y Ga _1-XY N (0 ≦ X ≦ 1, 0 ≦ Y ≦ 1, X + Y ≦ 1) or the like can be used.

(Underfill)
The underfill 3 is a member that absorbs stress due to the difference in thermal expansion coefficient between the light emitting element 2 and the package 1 and enhances heat dissipation.
The underfill 3 is formed in the gap between the package 1 and the light emitting element 2. Examples of the material of the underfill 3 include thermosetting resins such as silicone resin and epoxy resin. By using a light-reflecting member such as a white resin as the material of the underfill 3, the light emitted from the light emitting element 2 in the package 1 direction can be reflected and the luminous flux can be increased.

(Frame body)
The frame body 4 is a member constituting the wall portion of the light emitting device 100. The frame body 4 is formed so as to surround the light emitting element 2.
The frame 4 can be formed of a thermoplastic resin, a thermosetting resin, a modified resin thereof, or a hybrid resin containing one or more of these resins. Examples of the thermoplastic resin include polyamide resin, polyphthalamide resin, polycarbonate resin, polyphenylene sulfide resin, ABS resin, acrylic resin, polybutylene terephthalate resin, polyethylene terephthalate resin, polycyclohexane terephthalate resin, and liquid crystal polymer. Examples of the thermosetting resin include epoxy resin, silicone resin, urea resin, phenol resin, BT resin, polyimide resin, polyurethane resin and the like. Further, these base materials may contain colorants, fillers, reinforcing fibers, fluorescent substances described later, and the like known in the art. In particular, as the colorant, a material having good reflectance is preferable, and a white material such as titanium oxide or zinc oxide is preferable. Examples of the filler include silica, alumina and the like. Examples of the reinforcing fiber include glass, calcium silicate, potassium titanate and the like.

(Coating member)
The covering member 5 is a member that covers the light emitting element 2.
The covering member 5 is provided so as to cover the light emitting element 2 in the frame body 4 of the package 1. The covering member 5 is provided to protect the light emitting element 2 from external force, dust, moisture, etc., and to improve the heat resistance, weather resistance, and light resistance of the light emitting element 2. Examples of the material of the covering member 5 include a thermosetting resin, for example, a transparent material such as a silicone resin, an epoxy resin, and a urea resin. In addition to such a material, a filler such as a phosphor or a substance having a high light reflectance may be contained in order to have a predetermined function.

The covering member 5 can easily adjust the color tone of the light emitting device 100 by, for example, mixing a phosphor. As the phosphor, a phosphor having a higher specific gravity than the covering member 5 and absorbing light from the light emitting element 2 and converting the wavelength can be used. It is preferable that the phosphor has a higher specific gravity than that of the covering member 5 because it precipitates on the side of the package 1. Specifically, for example, a yellow phosphor such as YAG (Y ₃ Al ₅ O ₁₂ : Ce) or silicate, a red phosphor such as CASN (CaAlSiN ₃ : Eu) or KSF (K ₂ SiF ₆ : Mn), or , Chlorosilicate and green phosphors such as BaSiO ₄ : Eu ²⁺ .

As the filler contained in the covering member 5, for example, a substance having a high light reflectance such as SiO ₂ , TiO ₂ , Al ₂ O ₃ , ZrO ₂ , and MgO can be preferably used. Further, for the purpose of cutting an undesired wavelength, for example, an organic or inorganic coloring dye or coloring pigment can be used.

[Package manufacturing method]
Next, the manufacturing method of the package 1 will be described.
FIG. 5A is a cross-sectional view showing a step of forming a first molded body on a first lead in the package manufacturing method according to the first embodiment. FIG. 5B is a cross-sectional view showing a step of forming a second molded body on a second lead in the package manufacturing method according to the first embodiment. Note that FIGS. 5A and 5B schematically show one package when a plurality of packages are manufactured at the same time.

The method for manufacturing a package includes a step of preparing a first lead and a second lead and a step of filling a second molded product, and the process is performed in this order. Since the materials and arrangement of each member are as described in the above description of the package 1, the description thereof will be omitted here as appropriate.

(Step of preparing the first lead and the second lead)
The step of preparing the first lead and the second lead includes a step of arranging the second lead 20 on the first lead 10 provided with the first molded body 61, and the first lead 10 and the second lead 20. This is the process of joining.

In the arranging step, first, a first lead 10 having a predetermined wiring pattern and a second lead 20 having a predetermined wiring pattern are prepared. At this time, the first lead 10 may be half-etched at a predetermined position using a mask to form the third recess 13a. Further, if necessary, plating is performed on the non-joining surface side of the first lead 10 and the second lead 20.

Next, the first molded body 61 is formed on the first lead 10. To form the first molded body 61, first, the first lead 10 is sandwiched between the upper mold 81 and the lower mold 82, and the resin is injected. Next, the resin injected into the mold is cured to form the first molded body 61. After that, deburring is performed and the shape is adjusted. Further, the second lead 20 is arranged on the first lead 10 so that the first through hole 14 and the second recesses 21a and 22a communicate with each other.

The joining step is a step of joining the first lead 10 and the second lead 20. In this joining step, the first P side electrode terminal 11 and the second P side electrode terminal 21 (see FIGS. 3A and 3B), and the first N side electrode terminal 12 and the second N side electrode terminal 22 (see FIGS. 3A and 3B). ) And join.

Further, in the joining step, in the first P side electrode terminal 11 and the second P side electrode terminal 21, and in the first N side electrode terminal 12 and the second N side electrode terminal 22, the first through hole 14 and the second recess 21a, The first lead 10 and the second lead 20 are joined so as to communicate with the 22a.
Further, in the step of joining, the first step is to separate the heat-pulling terminal 13 and the P-side terminal branch portion 23, and the heat-pulling terminal 13 and the N-side terminal branch portion 24 by the third recess 13a. The lead 10 and the second lead 20 are joined.

The first lead 10 and the second lead 20 are joined by direct joining or by using a joining member such as an adhesive or solder. For example, when the first lead 10 and the second lead 20 are directly joined, the second lead 20 is arranged on the first lead 10, and the first lead 10 and the second lead 20 are placed below the upper mold 81. It is sandwiched between dies 82, heated at a predetermined temperature, and pressed at a predetermined pressure. As a result, the first P-side electrode terminal 11 and the second P-side electrode terminal 21, and the first N-side electrode terminal 12 and the second N-side electrode terminal 22 are directly bonded.

(Step of filling the second molded product)
In the step of filling the second molded body, the second molded body 62 holding the second lead 20 is formed, and a part of the second molded body 62 is formed in the first through hole 14 and the second recesses 21a and 22a. This is a step of filling the 1 lead 10 so as to be continuous and holding the 1st lead 10 even in the second molded body 62.

In this step, the resin is injected with the first lead 10 and the second lead 20 sandwiched between the upper mold 81 and the lower mold 82. As a result, the resin is also injected into the through hole 14 via the second recesses 21a and 22a. Next, the resin injected into the mold is cured to form the second molded body 62. After that, deburring is performed and the shape is adjusted.

In this step, the second molded body 62 is formed in the through hole 14, so that the bonding area of the first lead 10 and the second lead 20 is increased, and the package 1 having improved bonding strength between the leads is obtained. Can be done.

[Manufacturing method of light emitting device]
Next, a method of manufacturing the light emitting device 100 will be described.

FIG. 6A is a cross-sectional view showing a step of mounting a light emitting element in the method of manufacturing a light emitting device according to the first embodiment. FIG. 6B is a cross-sectional view showing a step of forming an underfill in the method for manufacturing a light emitting device according to the first embodiment. FIG. 6C is a cross-sectional view showing a step of forming a frame in the method for manufacturing a light emitting device according to the first embodiment. FIG. 6D is a cross-sectional view showing a step of forming a covering member in the method for manufacturing a light emitting device according to the first embodiment. 6A to 6D schematically show one light emitting device when a plurality of light emitting devices are manufactured at the same time.

The method for manufacturing a light emitting device includes a step of mounting a light emitting element, a step of forming an underfill, a step of forming a frame, a step of forming a covering member, and a step of individualizing. Do this in this order. Since the materials and arrangements of the respective members are as described in the above description of the light emitting device 100, the description thereof will be omitted here as appropriate.

(Process for mounting the light emitting element)
The step of mounting the light emitting element is a step of mounting the light emitting element 2 on the package 1 manufactured by the above-mentioned manufacturing method.
In this step, the P-side electrode 72 of the light emitting element 2 is bonded to the P-side terminal branch portion 23 of the second lead 20, and the N-side electrode 71 of the light-emitting element 2 is bonded to the N-side terminal branch portion 24 of the second lead 20. (See FIGS. 1B and 3B). For joining, for example, solder paste or the like may be used.

In this step, by using the package 1 manufactured by the above-mentioned manufacturing method, it is possible to obtain a light emitting device 100 having improved bonding strength between leads.

(Step of forming underfill)
The step of forming the underfill is a step of forming the underfill 3 in the gap between the package 1 and the light emitting element 2.
To form the underfill 3, first, the material of the underfill 3 is injected between the package 1 and the light emitting element 2, and the gap formed between the package 1 and the light emitting element 2 is filled. Next, the material of the injected underfill 3 is thermoset. As a result, the underfill 3 is formed between the package 1 and the light emitting element 2. The underfill 3 may be formed by providing the material of the underfill 3 on the package 1 before mounting the light emitting element 2 and thermally curing it after mounting the light emitting element 2.

(Step of forming a frame)
The step of forming the frame is a step of forming the frame 4 so as to surround the light emitting element 2.
The frame 4 is formed, for example, by using a discharger (dispenser) capable of moving (moving) the frame 4 in the vertical direction or the horizontal direction with respect to the second lead 20 on the upper side of the fixed second lead 20. It can be carried out.

(Step of forming a covering member)
The step of forming the covering member is a step of forming the covering member 5 in the frame body 4.
The covering member 5 can be formed by applying the covering member 5 to the inside of the frame body 4. For the formation of the covering member 5, for example, injection, compression, extrusion, or the like can be used.

(Process to separate into individual pieces)
The step of individualizing is a step of cutting an aggregate of the light emitting device 100 and individualizing it.
The individualization of the aggregate can be performed by a conventionally known method such as a dicing method of cutting with a blade.

<< Second Embodiment >>
FIG. 7A is a cross-sectional view schematically showing the configuration of the package and the light emitting device according to the second embodiment, and is a cross-sectional view corresponding to the line IIA-IIA of FIG. 1B. FIG. 7B is a cross-sectional view schematically showing the configuration of the package and the light emitting device according to the second embodiment, and is a cross-sectional view corresponding to the line IIB-IIB of FIG. 1B. FIG. 7C is a cross-sectional view schematically showing the configuration of the package and the light emitting device according to the second embodiment, and is a cross-sectional view corresponding to the IIC-IIC line of FIG. 1B.

[Package and light emitting device]
First, the package 1A and the light emitting device 100A will be described.
Package 1A has a first lead 10, a second lead 20, and a molded body 6.
The package 1A has a first lead 10 having a first through hole 14 in the first portion and a second portion overlapping the first portion of the first lead 10 on the surface side facing and joining the first lead 10. It has a second lead 20 having second recesses 21a and 22a communicating with one through hole 14, and a molded body 6 holding the first lead 10 and the second lead 20.
The first portion of the first lead 10 and the second portion of the second lead 20 are electrode terminals, and one of the molded bodies 6 is formed in the second recesses 21a and 22a communicating with the first through hole 14 and the first through hole 14. The portions are continuously filled.
The light emitting device 100A includes a package 1A, a light emitting element 2, an underfill 3, a frame body 4, and a covering member 5.

In the package 1A and the light emitting device 100A according to the second embodiment, the molded body holding the first lead 10 and the molded body holding the second lead 20 are integrally formed to form one molded body 6. .. Other matters are the same as those of the package 1 and the light emitting device 100 according to the first embodiment.

[Package manufacturing method]
Next, a method for manufacturing the package 1A will be described.
FIG. 8A is a cross-sectional view showing a state in which the second lead is arranged on the first lead in the package manufacturing method according to the second embodiment. FIG. 8B is a cross-sectional view showing a step of forming a molded body on the first lead and the second lead in the package manufacturing method according to the second embodiment. Note that FIGS. 8A and 8B schematically show one package when a plurality of packages are manufactured at the same time.

The method for manufacturing a package includes a step of preparing a first lead and a second lead and a step of filling a molded product, and the process is performed in this order. Since the materials and arrangement of each member of the package 1A are as described in the above description of the package 1, the description thereof will be omitted here as appropriate.

(Step of preparing the first lead and the second lead)
In the package manufacturing method according to the first embodiment, the first molded body 61 was formed on the first lead 10 as shown in FIG. 5A, but in the package manufacturing method according to the second embodiment, as shown in FIG. 8A. The first molded body 61 is not formed on the first lead 10. Other matters are the same as the package manufacturing method according to the first embodiment.

(Step of filling the molded product)
The step of filling the molded body is a step of joining the first lead 10 and the second lead 20 and then forming the molded body 6 holding the first lead 10 and the second lead 20.
In this step, the resin is injected into the first lead 10 and the second lead 20 with the first lead 10 and the second lead 20 sandwiched between the upper mold 81 and the lower mold 82. As a result, the resin is injected into the through hole 14 via the second recesses 21a and 22a. Next, the resin injected into the mold is cured to form the molded body 6. After that, deburring is performed and the shape is adjusted.

[Manufacturing method of light emitting device]
Next, a method of manufacturing the light emitting device 100A will be described.
The method for manufacturing the light emitting device 100A is to manufacture the light emitting device 100 according to the first embodiment, except that the package 1A in which the molded body 6 of the first lead 10 and the molded body 6 of the second lead 20 are integrated is used. Similar to the method.

<< Other Embodiments >>
First, the package 1B and its manufacturing method will be described.
FIG. 9A is a plan view schematically showing the configuration of the first lead according to another embodiment. FIG. 9B is a plan view schematically showing the configuration of the second lead according to another embodiment. FIG. 9C is a cross-sectional view schematically showing the configuration of the package according to another embodiment, and is a cross-sectional view corresponding to the line IIB-IIB of FIG. 1B.

As shown in FIG. 9A, the package 1B may have the first lead as the first lead 10A having the first recesses 11a and 12a in the first P-side electrode terminal 11 and the first N-side electrode terminal 12. Further, as shown in FIG. 9B, the package 1B may have the second lead as the second lead 20A having the second through hole 15 in the second P side electrode terminal 21 and the second N side electrode terminal 22. Then, as shown in FIG. 9C, in the package 1B, a part of the second molded body 62 is continuously filled in the first recesses 11a and 12a and the second through hole 15. Further, it may be a molded body in which the first molded body 61 and the second molded body 62 are integrated. The shapes, numbers, and the like of the first recesses 11a and 12a and the second through holes 15 are the same as those of the second recesses 21a and 22a and the first through holes 14 of the first embodiment.

In the package 1B, the first recesses 11a and 12a and the second through hole 15 are continuously filled with a part of the second molded body 62, so that the bonding strength between the first lead 10A and the second lead 20A is increased. improves.

The manufacturing method of the package 1B is the same as the manufacturing method of the packages 1 and 1A described above. Further, by using the package 1B in the manufacture of the light emitting devices 100 and 100A, it is possible to obtain a light emitting device having improved bonding strength between leads.

Next, the package 1C and its manufacturing method will be described.
FIG. 10 is a cross-sectional view schematically showing the configuration of the package according to another embodiment, and is a cross-sectional view corresponding to the line IIB-IIB of FIG. 1B.
In the package 1C, the first lead is the first lead 10A (see FIG. 9A) having the first recesses 11a and 12a in the first P side electrode terminal 11 and the first N side electrode terminal 12, and the second lead is on the second P side. The second lead 20 (see FIG. 3B) having the second recesses 21a and 22a in the electrode terminal 21 and the second N-side electrode terminal 22 may be used. Then, in the package 1C, a part of the second molded body 62 is continuously filled in the first recesses 11a and 12a and the second recesses 21a and 22a. Further, it may be a molded body in which the first molded body 61 and the second molded body 62 are integrated. The shapes, numbers, and the like of the first recesses 11a, 12a and the second recesses 21a, 22a are the same as those of the second recesses 21a, 22a of the first embodiment.

In the package 1C, the first recesses 11a and 12a and the second recesses 21a and 22a are continuously filled with a part of the second molded body 62, so that the bonding strength between the first lead 10A and the second lead 20A Is improved.

The manufacturing method of the package 1C is the same as the manufacturing method of the packages 1 and 1A described above. Further, by using the package 1C in the manufacture of the light emitting devices 100 and 100A, it is possible to obtain a light emitting device having improved bonding strength between leads.

Next, the package 1D and its manufacturing method will be described.
FIG. 11A is a plan view schematically showing the configuration of the first lead according to another embodiment. FIG. 11B is a plan view schematically showing the configuration of the second lead according to another embodiment. FIG. 11C is a cross-sectional view schematically showing the configuration of the package according to another embodiment, and is a cross-sectional view corresponding to the line IIB-IIB of FIG. 1B.

As shown in FIG. 11A, the package 1D may have the first lead 10B as the first lead 10B having no third recess 13a in the heat drawing terminal 13. Further, as shown in FIG. 11B, the package 1D may have the second lead 20B having the fourth recesses 23a and 24a on the back surface side of the P-side terminal branch portion 23 and the N-side terminal branch portion 24. .. Then, as shown in FIG. 11C, in the package 1D, a part of the second molded body 62 is continuously filled in the fourth recesses 23a and 24a. Further, it may be a molded body in which the first molded body 61 and the second molded body 62 are integrated. The shapes, numbers, and the like of the fourth recesses 23a and 24a are the same as those of the third recess 13a of the first embodiment.

Since the package 1D has the fourth recesses 23a and 24a, the heat drawing terminal 13 and the P-side terminal branch portion 23 and the N-side terminal branch portion 24 are separated from each other. As a result, the P-side terminal branching portion 23 and the N-side terminal branching portion 24 on which the light emitting element is placed can be arranged on the upper surface of the heat-drawing terminal 13. Therefore, different electrode patterns can be formed on the front surface and the back surface of the package 1D. Further, a mounting board having the same wiring pattern as the wiring pattern on the back surface of the package 1D can be used, and a light emitting element having three terminals can be used.

The manufacturing method of the package 1D is the same as the manufacturing method of the packages 1 and 1A described above. Further, by using the package 1D in the manufacture of the light emitting devices 100 and 100A, it is possible to obtain a light emitting device having improved bonding strength between leads.

Next, the light emitting device 100B will be described.
FIG. 12 is a plan view schematically showing the configuration of the light emitting device according to another embodiment. As in the light emitting device 100B shown in FIG. 12, the light emitting element may be a hexagonal light emitting element 2B in a plan view. By using the hexagonal light emitting element 2B in a plan view, the distance from the side surface of the light emitting element 2B to the frame body 4 becomes short, and the light extraction efficiency is improved. Further, the light emitting element may be another polygon in a plan view. Further, the manufacturing method of the light emitting device 100B is the same as that of the above-mentioned light emitting devices 100 and 100A.

Next, the package 1E, the light emitting device 100C, and a method for manufacturing the same will be described.
FIG. 13A is a plan view schematically showing the configuration of the first lead according to another embodiment. FIG. 13B is a plan view schematically showing the configuration of the second lead according to another embodiment. FIG. 13C is a plan view schematically showing the configuration of the light emitting device according to another embodiment.

As shown in FIG. 13A, the package 1E may be the first lead 10C in which the first lead forms one third recess 13a in a region excluding the upper and lower ends of the heat drawing terminal 13. Further, in the package 1E, as shown in FIG. 13B, it is assumed that the second lead has two P-side terminal branch portions 23, and two P-side terminals are provided between the two N-side terminal branch portions 24. It may be the second lead 20C in which the branch portion 23 is arranged. Then, as shown in FIG. 13C, the light emitting device prepares two light emitting elements 2B including one N side electrode 71 and one P side electrode 72, and mounts the two light emitting elements 2B on the package 1E. The light emitting device 100C may be used.

The manufacturing method of the package 1E is the same as the manufacturing method of the packages 1 and 1A described above. Further, by using the package 1E in the manufacture of the light emitting devices 100 and 100A, it is possible to obtain the light emitting device 100C having improved bonding strength between the leads.

Next, other forms of through holes in the package will be described.
FIG. 14 is a cross-sectional view of the first lead according to another embodiment, and is a cross-sectional view corresponding to the XIV-XIV line of FIG. 3A.
In the package 1, the through hole 14 of the first P side electrode terminal 11 of the first lead 10 is composed of two holes having different inner diameters, and the inner diameter of the hole 14b on the back surface side is larger than the inner diameter of the hole 14a on the front surface side. Is preferable. As a result, the resin of the second molded body filled in the through hole 14 can be prevented from falling off from the back surface side, and the bonding force of the first lead 10 is further improved. Further, the other through holes 14 of the first lead 10 are also preferably composed of two holes 14a and 14b. Further, the through hole 14 of the package 1A shown in FIGS. 7A and 7B, the package 1D shown in FIG. 11C, and the package 1E shown in FIGS. 13A and 13C is preferably composed of two holes 14a and 14b.

Next, other forms of the package will be described.
In the packages 1, 1A to 1E as shown in FIGS. 2B, 7B, 9C, 10, 11C, 13A, and 13C, the first leads 10, 10A to 10C do not have the heat drawing terminal 13. May be.
Further, the packages 1, 1A to 1E do not have a recess due to half etching in any of the heat drawing terminal 13, the P side terminal branch portion 23 and the N side terminal branch portion 24, and the heat drawing terminal 13 and the P side. A part of the first molded body 61, the second molded body 62, or the molded body 6 may not be filled between the terminal branch portion 23 and the N-side terminal branch portion 24.

Next, other manufacturing methods of the package will be described.
FIG. 15A is a cross-sectional view showing a step of forming a sheet member in the method for manufacturing a light emitting device according to another embodiment. FIG. 15B is a cross-sectional view showing a step of forming a side wall member in the method of manufacturing a light emitting device according to another embodiment.

As shown in FIG. 15B, the light emitting device includes a sheet member 7 provided on the upper surface of the light emitting element 2, a side wall member provided on the side surface of the sheet member 7, the side surface of the light emitting element 2, and the side wall member provided on the side surface of the underfill 3. 8 and the light emitting device 100D having the same may be used.
As the material of the sheet member 7, the same material as that of the covering member can be used. The sheet member 7 can also contain a filler such as a phosphor or a substance having a high light reflectance. As the material of the side wall member, the same material as the frame body can be used.

The method for manufacturing the light emitting device 100D can be performed as follows, for example, after the step of forming the underfill 3.
First, as shown in FIG. 15A, a sheet member 7 having a predetermined size is attached to the upper surface of the light emitting element 2 with an adhesive resin or the like (step of forming the sheet member). Next, as shown in FIG. 15B, the side wall member 8 is applied around the light emitting element 2 and the like (step of forming the side wall member). After that, the aggregate of the light emitting device 100D is cut and separated into individual pieces. Other matters are the same as the manufacturing method of the light emitting device 100 according to the first embodiment.

Although the package, the light emitting device, and the method for manufacturing the same according to the present embodiment have been specifically described above in terms of embodiments for carrying out the invention, the gist of the present invention is not limited to these descriptions, and the patent. It must be broadly interpreted based on the statement of claims. Further, various changes and modifications based on these descriptions are also included in the gist of the present invention.

For example, the method for manufacturing a package and the method for manufacturing a light emitting device may include other steps during or before and after each of the steps as long as the steps are not adversely affected. For example, a foreign matter removing step of removing foreign matter mixed in during manufacturing may be included.

1,1A, 1B, 1C, 1D, 1E Package 2,2A, 2B Light emitting element 3 Underfill 4 Frame 5 Covering member 6 Molded body 7 Sheet member 8 Side wall member 10, 10A, 10B, 10C 1st lead 11 1st P Side electrode terminal (1st part)
11a 1st recess 12 1st N side electrode terminal (1st part)
12a 1st recess 13 Heat-drawing terminal (3rd part)
13a 3rd recess 14 1st through hole 15 2nd through hole 20, 20A, 20B, 20C, 20D 2nd lead 21 2nd P side electrode terminal (second part)
21a 2nd recess 22 2nd N side electrode terminal (2nd part)
22a 2nd recess 23 P side terminal branch (4th part)
23a 4th recess 24 N side terminal branch (4th part)
24a 4th recess 61 1st molded body 62 2nd molded body 71 N side electrode 72 P side electrode 81 Upper mold 82 Lower mold 100, 100A, 100B, 100C, 100D Light emitting device

Claims (18)

A first lead having a first through hole or a first recess in the first portion,
The first molded body holding the first lead and
On the surface side that faces and joins the first lead, the second portion that overlaps the first portion of the first lead communicates with the second recess that communicates with the first through hole, or communicates with the first recess. A second lead with a second through hole and
It has a second molded body that holds the second lead, and has.
The first portion of the first lead and the second portion of the second lead are electrode terminals.
A part of the second molded body is continuous in the second recess that communicates with the first through hole and the first through hole, or in the second through hole that communicates with the first recess and the first recess. And filled the package. A first lead having a first recess in the first portion,
The first molded body holding the first lead and
A second lead having a second recess communicating with the first recess in a second portion that overlaps the first portion of the first lead on the surface side that faces and joins the first lead.
It has a second molded body that holds the second lead, and has.
The first portion of the first lead and the second portion of the second lead are electrode terminals.
A package in which a part of the second molded product is continuously filled in the first recess and the second recess communicating with the first recess. The package according to claim 1, wherein the first through hole or the first recess is not filled with the first molded product. The package according to claim 2, wherein the first recess is not filled with the first molded product. The package according to any one of claims 1 to 4, wherein the first molded body has the same thickness as the first lead, and the second molded body has the same thickness as the second lead. When the first recess is provided, the first recess is a groove continuous to the side surface of the first lead, and when the second recess is provided, the second recess is the side surface of the second lead. The package according to any one of claims 1 to 5, which is a groove portion continuous to. The first lead has a third recess in a third portion that is separated from the first portion and overlaps with the second lead.
The third portion of the first lead is a terminal electrically independent of the electrode terminal, and the fourth portion of the second lead overlapping the third portion is a terminal branch portion continuous with the electrode terminal. The third recess is a groove portion continuous to the side surface of the first lead, and a part of the first molded body is continuously filled between the third recess and the fourth portion. The package according to any one of claims 1 to 6. The second lead has a fourth recess in a fourth portion that is continuous with the second portion and overlaps with the first lead.
The fourth portion of the second lead is a terminal branch portion continuous with the electrode terminal, and the third portion of the first lead overlapping the fourth portion is a terminal electrically independent of the electrode terminal. The fourth recess is a groove portion continuous to the side surface of the second lead, and a part of the second molded body is continuously filled between the fourth recess and the third portion. The package according to any one of claims 1 to 6. The package according to any one of claims 1 to 8 and the package.
A light emitting device having a light emitting element mounted on the package. The light emitting device according to claim 9, further comprising a frame body formed so as to surround the light emitting element and a covering member formed so as to cover the light emitting element in the frame body. The light emitting device according to claim 9 or 10, wherein the light emitting element is a polygon in a plan view. A first lead having a first through hole or a first recess in the first portion to be an electrode terminal is joined with a first molded body holding the first lead facing the first lead. On the surface side, the second portion as an electrode terminal that overlaps with the first portion of the first lead has a second recess that communicates with the first through hole or a second through hole that communicates with the first recess. The process of preparing the second lead, and
The second molded body that holds the second lead is molded, and the second recess that communicates with the first through hole or the first through hole, or the first recess and the first recess that communicate with each other. A method for manufacturing a package, comprising a step of filling the second through hole so that a part of the second molded body is continuous. The first lead having the first recess in the first portion as the electrode terminal is provided with the first molded body for holding the first lead, and the surface side where the first lead is face-to-face and joined is described. A step of preparing a second lead having a second recess communicating with the first recess in a second portion as an electrode terminal overlapping the first portion of the first lead.
A step of molding a second molded body that holds the second lead and filling the second recess that communicates with the first recess so that a part of the second molded body is continuous. And how to make the package, including. A first lead having a first through hole or a first recess in the first portion,
A second recess that communicates with the first through hole in a second portion that overlaps with the first portion of the first lead on the surface side that faces and joins the first lead, or a second recess that communicates with the first recess. A second lead with two through holes and
It has the first lead and a molded body that holds the second lead, and has.
The first portion of the first lead and the second portion of the second lead are electrode terminals.
A part of the molded body is continuously formed in the second recess that communicates with the first through hole and the first through hole, or in the second through hole that communicates with the first recess and the first recess. The package that is filled. A first lead having a first recess in the first portion,
A second lead having a second recess communicating with the first recess in a second portion overlapping the first portion of the first lead on the surface side to face and join the first lead.
It has the first lead and a molded body that holds the second lead, and has.
The first portion of the first lead and the second portion of the second lead are electrode terminals.
A package in which a part of the molded product is continuously filled in the first recess and the second recess communicating with the first recess. An electrode terminal that overlaps with the first part of the first lead on the surface side that faces and joins the first lead having the first through hole or the first recess in the first portion as the electrode terminal. A step of preparing a second recess communicating with the first through hole or a second lead having a second through hole communicating with the first recess in the second portion.
A molded body that holds the first lead and the second lead is molded, and at the second recess that communicates with the first through hole or the first through hole, or in the first recess and the first recess. A method for manufacturing a package, comprising a step of filling the second through hole in communication with a part of the molded product so as to be continuous. A first lead having a first recess in the first portion to be an electrode terminal and a second portion to be an electrode terminal overlapping the first portion of the first lead on the surface side facing and joining the first lead. A step of preparing a second lead having a second recess communicating with the first recess, and
A molded body that holds the first lead and the second lead is molded, and the second recess that communicates with the first recess and the first recess is filled with a part of the molded body so as to be continuous. The process and how to manufacture the package, including. A method for manufacturing a light emitting device, which comprises a step of mounting a light emitting element on a package manufactured by the method for manufacturing a package according to any one of claims 12, 13, 16 and 17.

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