JP2022092205A - Electronic apparatus and display device - Google Patents

Abstract

To commonalize a heat sink for various kinds of substrates.SOLUTION: An electronic apparatus (1) includes: a BL chassis (2); a heat sink (3) supported by the BL chassis; and a substrate (4) supported by the heat sink and disposed while being spaced from the BL chassis.SELECTED DRAWING: Figure 1

Description

The present invention relates to electronic devices and display devices.

In electronic devices, heat sinks for dissipating heat from substrates and the like are known. For example, Patent Document 1 discloses a configuration in which an upper heat sink 107, a single-layer wiring board 103, and a chassis 501 are connected by a connecting member 111 in a semiconductor device.

Japanese Unexamined Patent Publication No. 2008-203376

In the prior art, the dimensions and shape of the heat sink provided on the substrate are determined according to the dimensions and shape of the substrate. On the other hand, the size of the board differs depending on the manufacturer, model, and the like. Therefore, if the substrate is changed, there is a problem that the heat sink needs to be redesigned.

One aspect of the present invention is to share a heat sink for various types of substrates.

In order to solve the above problems, the electronic device according to one aspect of the present invention is separated from the housing, the heat sink supported by the housing, and the heat sink supported by the heat sink. It is provided with a substrate to be arranged.

According to one aspect of the present invention, heat sinks for various types of substrates can be shared.

It is sectional drawing which shows the structure of the electronic device which concerns on Embodiment 1 of this invention, and is the top view of the heat sink. It is a top view which shows the appearance of the heat sink and the substrate which concerns on Embodiment 1 of this invention. It is sectional drawing which shows the structure of the electronic device which concerns on Embodiment 2 of this invention. It is sectional drawing which shows the structure of the electronic device which concerns on Embodiment 3 of this invention. It is sectional drawing which shows the structure of the electronic device which concerns on Embodiment 4 of this invention.

[Embodiment 1]
Hereinafter, Embodiment 1 of the present invention will be described in detail.

FIG. 1 is a cross-sectional view showing the configuration of the electronic device 1 according to the present embodiment and a top view of the heat sink 3.

As shown in the upper figure of FIG. 1, the electronic device 1 includes a BL (Back Light) chassis (housing) 2, a heat sink 3, a substrate 4, a TCONIC (Timing CONtroller IC) 5, and a heat dissipation sheet 6. .. The electronic device 1 is, for example, a part of a display (display device) 100 of a television receiver. That is, the display 100 includes the electronic device 1.

The BL chassis 2 is a chassis that holds a backlight for a liquid crystal television. The BL chassis 2 is made of iron, for example, and supports the heat sink 3. The chassis is not limited to the BL chassis 2, and may be another chassis. For example, when the display device is a self-luminous device that does not use a backlight, an example of a housing that replaces the BL chassis 2 may be a structural frame for holding a display unit, or a heat sink 3 may be used. It may be a resin structure prepared for supporting.

The heat sink 3 is a metal plate member installed for heat dissipation of the substrate 4 and the TCONIC 5. The heat radiating plate 3 is made of, for example, aluminum, copper, iron, or the like, and is supported by the BL chassis 2. The board 4 is, for example, a PCB (Printed Circuit Board) board. The substrate 4 is supported by the heat sink 3 and is arranged apart from the housing 2.

The TCONIC 5 is an IC of a liquid crystal timing controller and is installed on the substrate 4. TCONIC5 is the main heat source. The heat radiating sheet 6 is a sheet for radiating heat from the substrate 4, and is interposed between the TCONIC 5 and the heat radiating plate 3.

This makes it possible to standardize the heat sink 3 for various types of substrates 4. Therefore, the mold of the heat sink 3 can be shared.

Next, in the electronic device 1, the heat sink 3 has a plurality of insertion holes 31. The substrate 4 has an insertion hole 41 corresponding to a part of the insertion holes 31 among the plurality of insertion holes 31. The electronic device 1 further includes an insertion member 7 that fits into the insertion hole 31 of the heat sink 3 and the insertion hole 41 of the substrate 4 corresponding to the insertion hole 31. The insertion member 7 is, for example, a screw, a rivet, a resin, or the like.

As shown in the upper figure of FIG. 1, the heat sink 3 has four insertion holes 31. The substrate 4 has an insertion hole 41 corresponding to two insertion holes 31a on the inner side of the four insertion holes 31.

As a result, the substrate 4 can be fixed to the heat sink 3.

Then, in the electronic device 1, the BL chassis 2 has a boss portion B projecting from the surface of the BL chassis 2. The boss portion B is a convex member having a screw hole, a hole into which a pin is fitted, and the like. The heat sink 3 has an insertion hole 31. The electronic device 1 further includes an insertion member 8 that fits into the boss portion B and the insertion hole 31.

In the upper figure of FIG. 1, the insertion member 8 fits into the boss portion B1 arranged on the outside and the insertion hole 31b of the heat radiating plate 3. On the other hand, in the middle figure of FIG. 1, the boss portion B2 arranged inside the boss portion B1 and the insertion hole 31c of the heat radiating plate 3 are fitted. As described above, the boss portion B can be arranged at an arbitrary position on the BL chassis 2 as long as it is within the range of the heat sink 3.

By providing the boss portion B on the BL chassis 2, it is possible to secure a distance between the substrate 4 supported by the heat radiating plate 3 and the BL chassis 2. Since the position of the boss B is not limited and the insertion hole 31 can be formed at any position of the heat sink 3, the heat sink 3 should be arranged according to the position of the boss B on the BL chassis 2. Can be done. Therefore, the position where the heat sink 3 and the substrate 4 are fixed can be arbitrarily set. As a result, the positions of the boss B on the BL chassis 2 can be made common.

The lower figure of FIG. 1 is a top view showing an example of the heat sink 3. As shown in the lower figure of FIG. 1, the heat sink 3 has a plurality of insertion holes 31 in the vertical direction and the horizontal direction.

FIG. 2 is a top view showing the appearance of the heat sink 3 and the substrate 4 according to the present embodiment. As shown in the middle of FIG. 2, the heat sink 3 is larger than the substrate 4a, that is, longer than the substrate 4a in both the vertical and horizontal directions, and covers the entire substrate 4a. On the other hand, as shown in the lower figure of FIG. 2, the heat sink 3 is shorter than the substrate 4b in the vertical direction, but longer than the substrate 4b in the horizontal direction. Therefore, the heat sink 3 does not cover the entire substrate 4b, but covers most of the substrate 4b. The heat radiating plate 3 may substantially cover the substrate 4.

Further, by providing a plurality of insertion holes 31 in advance in the heat radiating plate 3 in accordance with the insertion holes 41 provided in each of the plurality of substrates 4 for which the heat radiating plate 3 is to be shared, one heat radiating plate 3 is provided. Can be used to fix any of the plurality of substrates 4.

Note that FIG. 1 shows a configuration in which the substrate 4 is arranged between the BL chassis 2 and the heat sink 3 in the electronic device 1, but the substrate 4 is on the opposite side of the heat sink 3 from the BL chassis 2. (In FIG. 1, the configuration may be arranged on the upper side of the heat sink 3.).

(Effect of Embodiment 1)
The substrate 4 is fixed to the heat sink 3 by inserting the insertion member 7 into the insertion hole 31 of the heat sink 3 and the insertion hole 41 of the substrate 4. Further, the heat sink 3 is fixed to the BL chassis 2 by inserting the insertion member 8 into another insertion hole 31 of the heat sink 3 and the BL chassis 2.

As a result, since the substrate 4 and the insertion member 7 do not come into direct contact with the BL chassis 2, the friction caused by the substrate 4 and the insertion member 7 coming into contact with the BL chassis 2 does not occur. Therefore, the quality of the BL chassis 2 is not deteriorated due to the friction between the substrate 4 and the insertion member 7 and the BL chassis 2.

Further, since the heat sink 3 has a plurality of insertion holes 31, it can be shared with the substrates 4 having various sizes. Therefore, the mold of the heat sink 3 can be shared.

[Embodiment 2]
The second embodiment of the present invention will be described below. For convenience of explanation, the same reference numerals are given to the members having the same functions as the members described in the first embodiment, and the description thereof will not be repeated.

FIG. 3 is a cross-sectional view showing the configuration of the electronic device 1 according to the present embodiment. As shown in FIG. 3, in the electronic device 1, a spacer S through which the insertion member 7 penetrates is interposed between the heat sink 3 and the substrate 4.

By providing the spacer S around the insertion member 7, the heat sink 3 and the substrate 4 are separated from each other, so that the space for installing the TCONIC 5 and the heat sink 6 is maintained between them.

Regarding the insertion holes 31 of the heat sink 3, a plurality of insertion holes 31 may be cut in advance so as to correspond to the plurality of substrates 4, and the heat sink 3 may be shared. Further, the insertion hole 31 may be threaded each time according to the substrate 4.

(Effect of Embodiment 2)
According to the above, by providing the spacer S between the heat sink 3 and the substrate 4, the contact position between the heat sink 3 and the substrate 4 is limited, and the contact position between the heat sink 3 and the substrate 4 is limited. The distance is kept good. Thereby, the portion where the heat radiating plate 3 and the substrate 4 rub against each other can be limited. Further, the voltage drop caused by the contact between the heat sink 3 and the substrate 4 does not occur.

[Embodiment 3]
Embodiment 3 of the present invention will be described below. For convenience of explanation, the same reference numerals are given to the members having the same functions as the members described in the first and second embodiments, and the description thereof will not be repeated.

FIG. 4 is a cross-sectional view showing the configuration of the electronic device 1 according to the present embodiment. As shown in FIG. 4, the heat sink 3 has a plurality of connecting portions R. Specifically, the connecting portion R projects downward from the lower surface of the heat radiating plate 3 and has a shape in which the insertion member 7a is fitted. The connecting portion R is provided at a position of the heat radiating plate 3 that overlaps with the insertion hole 41 of the substrate 4.

The connecting portion R is, for example, a drawing, and is compressed by hitting a metal plate with a mallet or a mallet, a pad, etc. It is shaped to have holes and the like.

The substrate 4 has an insertion hole 41 corresponding to a part of the connecting portions R among the plurality of connecting portions R. The electronic device 1 further includes an insertion member 7a that fits into the connecting portion R and the insertion hole 41 corresponding to the connecting portion R.

By drawing the heat radiating plate 3 each time, the space for installing the TCONIC 5 and the heat radiating sheet 6 is maintained between the heat radiating plate 3 and the substrate 4. The number of parts of the electronic device 1 can be reduced by the number of connecting portions R. However, it is necessary to carry out drawing processing each time according to the substrate 4.

(Effect of Embodiment 3)
Since the shape of the heat radiating plate 3 limits the contact position with the substrate 4 and keeps the distance from the substrate 4, the number of parts can be reduced as compared with the first embodiment. Further, a plurality of connecting portions R may be provided in the heat radiating plate 3, whereby the substrate 4 having different positions of the insertion holes 41 can be fixed, so that the heat radiating plate 3 can be shared. Therefore, the mold of the heat sink 3 can be shared.

[Embodiment 4]
Embodiment 4 of the present invention will be described below. For convenience of explanation, the same reference numerals are added to the members having the same functions as the members described in the first to third embodiments, and the description thereof will not be repeated.

FIG. 5 is a cross-sectional view showing the configuration of the electronic device 1 according to the present embodiment. The electronic device 1 further includes a conductive sheet C overlaid on the surface of the heat sink 3. Then, in the electronic device 1, the BL chassis 2 and the ground G of the substrate 4 are electrically connected via the conductive sheet C. As shown in FIG. 5, the conductive sheet C covers from the contact position between the BL chassis 2 and the heat sink 3 to the contact position between the heat sink 3 and the substrate 4. In addition, instead of the conductive sheet C, a conductive tape, a conductive resin, a metal plate material, or the like may be used.

In FIG. 5, the BL chassis 2 and the conductive sheet C are connected via the boss B, but may be directly connected. Further, in FIG. 5, the conductive sheet C and the ground G of the substrate are directly connected, but they may be connected via other conductive members.

(Effect of Embodiment 4)
The board 4 is separated from the BL chassis 2 and is not directly connected to the BL chassis 2. Then, for example, if the heat sink 3 is made of aluminum, the conductivity is poor, so that the grounding stability of the substrate 4 may deteriorate. Therefore, the grounding stability of the substrate 4 can be ensured by attaching the conductive sheet C between the portion where the substrate 4 contacts the heat sink 3 and the portion where the BL chassis 2 contacts the heat sink 3. can.

[Other embodiments]
In the above embodiment, in the electronic device 1, one substrate 4 is supported by one heat sink 3, but a plurality of substrates 4 are supported by one heat sink 3. You may.

In the manufacturing process of the electronic device 1, after the substrate 4 is attached to the heat sink 3, the heat sink 3 is attached to the BL chassis 2.

〔summary〕
The electronic device according to the first aspect of the present invention includes a housing, a heat sink supported by the housing, and a substrate supported by the heat sink and arranged apart from the housing. ..

According to the above configuration, it is possible to standardize the heat sink for various types of substrates. Therefore, the mold of the heat sink can be standardized.

In the electronic device according to the second aspect of the present invention, in the first aspect, the heat sink has a plurality of insertion holes, and the substrate has the insertion holes corresponding to some of the insertion holes among the plurality of insertion holes. An insertion member having a hole and fitting into the insertion hole of the heat sink and the insertion hole of the corresponding substrate may be further provided.

According to the above configuration, since the heat sink has a plurality of insertion holes, it can be shared with substrates of various sizes. Therefore, the mold of the heat sink can be standardized.

In the electronic device according to the third aspect of the present invention, in the first aspect, the heat sink has a plurality of connecting portions, and the substrate is inserted corresponding to a partial connecting portion among the plurality of connecting portions. An insertion member having a hole and fitting to the connecting portion and the corresponding insertion hole may be further provided.

According to the above configuration, since the heat sink has a plurality of connecting portions, it can be shared with substrates of various sizes.

The electronic device according to the fourth aspect of the present invention further includes a conductive sheet overlaid on the surface of the heat radiating plate in the first to third aspects, and the housing and the ground of the substrate are conductive. It may be electrically connected via a seat.

According to the above configuration, since the ground of the board is electrically connected to the housing, the grounding stability of the board can be ensured.

In the electronic device according to the fifth aspect of the present invention, in the first to fourth aspects, the housing has a boss portion projecting from the surface of the housing, and the heat radiating plate has an insertion hole. An insertion member that fits into the boss portion and the insertion hole may be further provided.

According to the above configuration, since the housing has a boss portion, it is possible to secure a distance between the substrate supported by the heat sink and the housing.

In the electronic device according to the sixth aspect of the present invention, in the second aspect, a spacer through which the insertion member penetrates may be interposed between the heat sink and the substrate.

According to the above configuration, since the distance between the heat radiating plate and the substrate is kept good, the portion where the heat radiating plate and the substrate rub against each other can be limited.

The display device according to the seventh aspect of the present invention includes the electronic device according to the first to sixth aspects.

The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and the embodiments obtained by appropriately combining the technical means disclosed in the different embodiments. Is also included in the technical scope of the present invention. Further, by combining the technical means disclosed in each embodiment, new technical features can be formed.

1 Electronic device 2 BL chassis (housing)
3 Heat sink 4, 4a, 4b board 5 TCONIC
6 Heat dissipation sheet 7, 7a, 8 Insertion member 31, 31a, 31b, 31c, 41 Insertion hole 100 Display C Conductive sheet B, B1, B2 Boss part G Ground R Connection part S Spacer

Claims (7)

With the housing
The heat sink supported by the above housing and
A substrate that is supported by the heat sink and is arranged away from the housing.
An electronic device characterized by being equipped with. The heat sink has a plurality of insertion holes and has a plurality of insertion holes.
The substrate has insertion holes corresponding to some of the insertion holes among the plurality of insertion holes.
The electronic device according to claim 1, further comprising an insertion member that fits into the insertion hole of the heat radiating plate and the insertion hole of the corresponding substrate. The heat sink has a plurality of connecting portions and has a plurality of connecting portions.
The substrate has an insertion hole corresponding to a part of the connection portions among the plurality of connection portions.
The electronic device according to claim 1, further comprising an insertion member that fits the connecting portion and the corresponding insertion hole. Further provided with a conductive sheet covered on the surface of the heat sink,
The electronic device according to any one of claims 1 to 3, wherein the housing and the ground of the substrate are electrically connected via the conductive sheet. The housing has a boss portion protruding from the surface of the housing, and has a boss portion.
The heat sink has an insertion hole and has an insertion hole.
The electronic device according to any one of claims 1 to 4, further comprising an insertion member that fits into the boss portion and the insertion hole. The electronic device according to claim 2, wherein a spacer through which the insertion member penetrates is interposed between the heat radiating plate and the substrate. A display device including the electronic device according to any one of claims 1 to 6.

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