JP2022087971A - connector - Google Patents

Abstract

To provide a connector which allows reduction in its size and height.SOLUTION: A connector 11 comprises: an insulative connector housing 20; a plurality of conductive pin-shaped terminals 21; and a circuit board 22 having a desired circuit pattern. Each of the plurality of pin-shaped terminals 21 has a board connection part 40 extending straight from a terminal lead-out part 32 of the connector housing 20. Each of the plurality of pin-shaped terminals 21 is connected by soldering in such a manner that a tip end 41 of the board connection part 40 is inserted into a through-hole 45 on the circuit board 22 so as to make contact with the circuit pattern. The circuit board 22 has a solder fillet 46 formed by soldering on a surface on the terminal lead-out part 32 side. Meanwhile, the terminal lead-out part 32 has a recessed fillet avoiding part 37 formed for the solder fillet 46 at a lead-out position of the board connection part 40. The fillet avoiding part 37 is shaped so as to be recessed for each board connection part 40.SELECTED DRAWING: Figure 5

Description

The present invention relates to a connector comprising a connector housing, a plurality of pin-shaped terminals and a circuit board.

The connector disclosed in Patent Document 1 below includes a connector housing having insulation, a plurality of pin-shaped terminals having conductivity, a circuit board having a desired circuit pattern, and a connector housing so as to cover the circuit board. It is configured with an insulating cover that can be assembled. The connector housing has a connector fitting portion into which a mating connector is fitted, a substrate accommodating portion in which a circuit board is accommodated, and a partition wall in which a plurality of pin-shaped terminals are arranged between them. The circuit board is electrically connected by solder after being inserted into a plurality of pin-shaped terminals. The cover is fixed to the substrate accommodating portion by fitting.

Japanese Unexamined Patent Publication No. 2010-140775

In the above-mentioned prior art, when a through hole of a circuit board is inserted into a plurality of pin-shaped terminals and then soldered to an insertion portion between the back surface of the circuit board and the pin-shaped terminal, the above-mentioned Solder fillets are formed in the insertion part in a mountain shape with a wide hem. In the above-mentioned prior art, the solder fillet is formed on the back surface side of the circuit board, but conversely, the solder fillet may be formed on the front surface side of the circuit board. In this case, it is necessary to avoid the thermal influence on the connector housing made of resin, and it is also necessary to maintain the shape (quality) of the solder fillet, so that the connector housing should be sufficiently separated from the circuit board. As a result, there is a problem that the size of the connector is increased. In addition, there is a problem that it is difficult to reduce the height by sufficiently separating the connector housing from the circuit board.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a connector capable of reducing the size and height.

The connector of the present invention according to claim 1, which has been made to solve the above problems, comprises a connector housing having insulation, a plurality of pin-shaped terminals having conductivity, and a circuit board having a desired circuit pattern. The plurality of pin-shaped terminals have a board connection portion that extends straight from the terminal lead-out portion of the connector housing, and the tip of the board connection portion is inserted into a through hole of the circuit board so as to be in contact with the circuit pattern. A solder fillet formed by soldering is formed on the surface of the circuit board on the side of the terminal lead-out portion, and the terminal lead-out portion is connected to the terminal lead-out portion at the lead-out position of the board connection portion. It is characterized in that a concave fillet avoidance portion is formed with respect to the fillet.

According to the present invention having such a feature of claim 1, since the concave fillet avoiding portion with respect to the solder fillet is formed in the terminal lead-out portion of the connector housing, the solder fillet exists on the surface side of the circuit board. Also, the distance between the circuit board and the connector housing can be narrowed. In other words, since the concave fillet avoiding portion is formed so as to secure the distance from the solder fillet, the circuit board and the connector housing can be arranged close to each other. Therefore, according to the present invention, it is possible to reduce the size and height of the connector by forming the fillet avoidance portion.

According to the second aspect of the present invention, in the connector according to the first aspect, the fillet avoiding portion is formed in a concave shape for each substrate connecting portion and in a shape surrounding the substrate connecting portion with a slope. It is characterized by.

According to the present invention having such a feature of claim 2, since the fillet avoidance portion is formed for each board connection portion of the plurality of pin-shaped terminals, it is only necessary to avoid the solder fillet and the connector. It does not interfere with the function of the terminal lead-out part of the housing. Further, since the fillet avoiding portion is formed in a shape that surrounds the substrate connecting portion with a slope, the shape may be adjusted to match the solder fillet, and it is not necessary to make the concave portion larger than necessary. Therefore, according to the present invention, it is possible to provide a better form of the fillet avoidance portion. It should be noted that since the terminal lead-out portion is recessed into a shape that does not deteriorate the function, it naturally contributes to the reduction of the material cost of the connector housing.

According to a third aspect of the present invention, in the connector according to the first or second aspect, the surface of the circuit board abuts on the terminal lead-out portion, and the surface and the terminal lead-out portion are spaced apart from each other at a predetermined distance. It is characterized in that a substrate contact portion is formed so as to project.

According to the present invention having such a feature of claim 3, since the substrate contact portion is formed in the terminal lead-out portion, the terminal lead-out portion and the surface side of the circuit board (the surface on the side of the terminal lead-out portion) Can be kept constant at the substrate contact portion. According to the present invention, as described above according to claim 1, since the distance between the circuit board and the connector housing can be narrowed by forming the fillet avoidance portion, it is possible to reduce the protruding height of the substrate contact portion. Of course you can.

According to the present invention, it is possible to reduce the size and height of the connector.

It is a figure which shows one Embodiment of the connector of this invention, (a) is the whole perspective view, (b) is the perspective view in the state which the protector and the mating connector are removed from (a). It is a perspective view of the state which removed the cover from FIG. It is a perspective view of the state seen from the arrow A direction of FIG. FIG. 3 is a perspective view showing a state in which the circuit board is removed from FIG. 3 (the inside of the circle is an enlarged view of the fillet avoidance portion). FIG. 2 is a cross-sectional view taken along the line BB of FIG. 2 (the inside of the circle is an enlarged view of the solder fillet and the fillet avoidance portion).

The connector comprises a connector housing having insulation, a plurality of pin-shaped terminals having conductivity, and a circuit board having a desired circuit pattern. The plurality of pin-shaped terminals have a board connection portion that extends straight from the terminal outlet portion of the connector housing. Further, the plurality of pin-shaped terminals are connected by soldering so that the tip of the board connection portion is inserted into the through hole of the circuit board and is in contact with the circuit pattern. On the circuit board, a solder fillet is formed by soldering on the surface on the side of the terminal lead-out portion. On the other hand, in the terminal lead-out portion, a concave fillet avoidance portion with respect to the solder fillet is formed at the lead-out position of the board connection portion. The fillet avoiding portion is formed in a concave shape for each substrate connecting portion. The fillet avoidance portion is also formed so as to surround the substrate connection portion with a slope.

Hereinafter, examples will be described with reference to the drawings. 1A and 1B are views showing an embodiment of the connector of the present invention, where FIG. 1A is an overall perspective view and FIG. 1B is a perspective view showing a state in which the protector and the mating connector are removed from FIG. 1A. 2 is a perspective view of the cover removed from FIG. 1, and FIG. 3 is a perspective view of the state seen from the direction of arrow A in FIG. Further, FIG. 4 is a perspective view of a state in which the circuit board is removed from FIG. 3, and the inside of the circle is an enlarged view of the fillet avoidance portion. Further, FIG. 5 is a cross-sectional view taken along the line BB of FIG. 2, and the inside of the circle is an enlarged view of the solder fillet and the fillet avoidance portion.

<About connector 11>
In FIG. 1A, the connector 11 is fixed to a predetermined position of an automobile, for example, by a protector 13 in a state where a plurality of mating connectors 12 are connected. The connector 11 of this embodiment is formed so that six mating connectors 12 can be connected side by side (the number of mating connectors 12 is an example). Explaining the one on the leftmost side of FIG. 1A as a representative example, the mating connector 12 includes a mating connector housing 14 and a plurality of mating female terminals (not shown) provided at each terminal of the plurality of electric wires 15. Be prepared to be configured. The mating connector housing 14 has a known lock arm. The mating female terminal is formed so as to be able to be connected to the pin-shaped terminal 21 described later. On the other hand, the protector 13 has a bottomed box-shaped connector accommodating portion 16, a plurality of connector lock portions 17, and a vehicle body fixing portion 18 and is formed in the illustrated shape. A bolt insertion hole 19 for inserting a bolt (not shown) used for fixing is formed through the vehicle body fixing portion 18 in a circular shape.

1 to 4, the connector 11 includes a connector housing 20, a plurality of pin-shaped terminals 21, a circuit board 22, and a cover 23. As can be seen from the above configuration and drawings, the connector 11 is a board built-in type. The connector 11 is formed so as to be able to reduce its size and height.

<About connector housing 20>
In FIGS. 1 to 5, the connector housing 20 is a resin molded product having an insulating property, and has a plurality of connector fitting portions 24 to 29 which are fitting portions with a plurality of mating connectors 12. The connector fitting portions 24 to 29 are arranged and formed side by side so as to be continuous. A plurality of pin-shaped terminals 21 are fixed to the partition wall 30 located on the back side of the openings of the connector fitting portions 24 to 29 in an aligned state. A plurality of terminal fixing portions 31 are integrally formed on the outer surface of the partition wall 30. Here, if the portion including the outer surface of the terminal fixing portion 31 and the partition wall 30 (the portion on the side where the plurality of pin-shaped terminals 21 are pulled out) is referred to as the terminal lead-out portion 32, the terminal lead-out portion 32 is in contact with the substrate. Two portions 33 and 34 are formed, respectively. The substrate contact portions 33 and 34 are formed at a portion where the surface 43 described later of the circuit board 22 abuts. Of these four contact portions, the two board contact portions 33 are arranged at the left and right ends of the connector housing 20. Further, the two substrate contact portions 34 are arranged at predetermined intervals between the substrate contact portions 33 and 33.

In addition to the substrate contact portions 33 and 34 described above, the terminal lead-out portion 32 is also formed with two positioning convex portions 35. The two positioning convex portions 35 are formed in a columnar shape protruding from the terminal lead-out portion 32. The two positioning protrusions 35 are formed as positioning portions for determining the positions of the circuit board 22 and the plurality of pin-shaped terminals 21.

<About the terminal fixing part 31>
In FIGS. 4 and 5, the terminal fixing portion 31 is formed in a rectangular convex shape (a rectangular parallelepiped shape) protruding from the outer surface of the partition wall 30 toward the circuit board 22. The terminal fixing portion 31 is formed so that the middle of the plurality of pin-shaped terminals 21 (intermediate fixing portion 39 described later) can be fixed by press fitting or insert molding together with the partition wall 30. The terminal fixing portion 31 is formed so that the fixed state of the pin-shaped terminal 21 can be improved in a stable direction as compared with the case where only the partition wall 30 is used. If the partition wall 30 is formed in a sufficiently thick state, the terminal fixing portion 31 may be formed arbitrarily. In the case of the thick partition wall 30, the outer surface of the thick partition wall 30 corresponds to the protruding tip surface 36 described later.

The terminal fixing portion 31 is formed with a protruding tip surface 36 parallel to the surface 43 described later of the circuit board 22 at the protruding tip. A plurality of pin-shaped terminals 21 are derived from the protruding tip surface 36. Specifically, the substrate connection portion 40, which will be described later, is derived so as to extend straight. A fillet avoiding portion 37 is formed on the protruding tip surface 36 for each substrate connecting portion 40.

<About fillet avoidance part 37>
In FIGS. 4 and 5, the fillet avoiding portion 37 is formed to avoid the solder fillet 46 described later. In other words, the fillet avoidance portion 37 is formed so that the creepage distance from the solder fillet 46 can be increased. The fillet avoiding portion 37 is formed in a concave shape and in a shape surrounding the substrate connecting portion 40, which will be described later, with a slope. Since the solder fillet 46 is formed in a mountain shape with a wide hem, the fillet avoidance portion 37 is formed in a valley shape corresponding to the mountain shape. In this embodiment, the mountain-shaped and valley-shaped slopes have the same inclination angle. As can be seen from the figure, the fillet avoiding portion 37 is a small recessed portion for each board connecting portion 40, so that the function as the terminal fixing portion 31 is not impaired, of course. Since there are dozens of fillet avoidance portions 37 in this embodiment, it is needless to say that the number of fillet avoidance portions 37 contributes to the reduction of material cost as compared with the case where the fillet avoidance portion 37 is not formed.

<About a plurality of pin-shaped terminals 21>
In FIGS. 2 to 5, the plurality of pin-shaped terminals 21 are pin-shaped male terminals having conductivity, and the electrical contact portion 38 protruding into the connector fitting portions 24 to 29, the partition wall 30 and the terminals. It has an intermediate fixing portion 39 fixed to the fixing portion 31, and a substrate connecting portion 40 extending straight from the terminal lead-out portion 32. The board connection portion 40 is inserted from the tip 41 into a through hole 45 described later in the circuit board 22. The board connection portion 40 is electrically connected to a circuit pattern (not shown) of the circuit board 22 by soldering. The substrate connection portion 40 is formed in a rectangular cross section in this embodiment.

<About the circuit board 22>
In FIGS. 2, 3, and 5, the circuit board 22 is formed to have a rectangular outer shape (rectangular or strip-shaped) according to the size of the terminal lead-out portion 32 of the connector housing 20. In such a circuit board 22, positioning recesses 42 are formed at the positions of the two corners, respectively. The two positioning recesses 42 are formed so that the corners thereof are recessed inward of the substrate. Specifically, the positioning recesses 42 are formed in the notches having an L-shape in a plan view. The circuit board 22 is formed in a plate shape having a front surface 43 and a back surface 44. A circuit pattern (not shown) is formed on the circuit board 22. Further, a plurality of through holes 45 penetrating in a circle are also formed.

When the two positioning recesses 42 of the circuit board 22 and the two positioning protrusions 35 of the terminal lead-out portion 32 of the connector housing 20 engage with each other, the positions of the through holes 45 of the circuit board 22 and the plurality of pin-shaped terminals 21 are determined. It will be like. As a result, the circuit board 22 can be smoothly inserted into the plurality of pin-shaped terminals 21. The circuit board 22 is inserted until the surface 43 abuts on the board contact portions 33 and 34 of the connector housing 20.

<About the solder fillet 46>
In FIG. 5, after the circuit board 22 is inserted into the plurality of pin-shaped terminals 21, the molten solder is moved from the back surface 44 side to the front surface 43 side of the circuit board 22 through the through holes 45, and then cooled. A solder fillet 46 is formed by soldering between the surface 43 of the circuit board 22 and the board connection portion 40 of the pin-shaped terminal 21, that is, at the insertion portion. The solder fillet 46 is formed in a mountain shape with a wide hem. A fillet avoidance portion 37 is arranged directly above the solder fillet 46. Even if the solder fillet 46 is present on the surface 43 side, the circuit board 22 can be arranged at a position close to the connector housing 20 by forming the fillet avoiding portion 37. In other words, the connector housing 20 is located close to the circuit board 22 because the fillet avoidance portion 37 is formed on the connector housing 20 even if the solder fillet 46 is present on the surface 43 side of the circuit board 22. Can be placed in.

<About cover 23>
In FIG. 1B, the cover 23 is an insulating resin molded product that covers the circuit board 22 and is assembled to the connector housing 20, and is formed in a bottomed box shape. When assembling the cover 23, the guide groove 48 of the cover 23 is guided to the guide rib 47 of the connector housing 20. Further, the locking frame portion 50 of the cover 23 is locked to the locking projection 49 of the connector housing 20.

<About the effect of connector 11>
As described above with reference to FIGS. 1 to 5, according to the connector 11 according to the embodiment of the present invention, the concave fillet avoidance portion 37 with respect to the solder fillet 46 is the terminal lead-out portion 32 of the connector housing 20. Since it is formed on the (terminal fixing portion 31), even if the solder fillet 46 is present on the surface 43 side of the circuit board 22, the distance between the circuit board 22 and the connector housing 20 can be narrowed. In other words, since the concave fillet avoiding portion 37 that secures the distance from the solder fillet 46 is formed, the circuit board 22 and the connector housing 20 can be arranged close to each other. Therefore, according to the connector 11, by forming the fillet avoiding portion 37, it is possible to reduce the size and height of the connector 11.

It goes without saying that the present invention can be modified in various ways without changing the gist of the present invention.

11 ... Connector, 12 ... Mating connector, 13 ... Protector, 14 ... Mating connector housing, 15 ... Wire, 16 ... Connector housing, 17 ... Connector lock, 18 ... Body fixing part, 19 ... Bolt insertion hole, 20 ... Connector Housing, 21 ... pin-shaped terminal, 22 ... circuit board, 23 ... cover, 24-29 ... connector fitting part, 30 ... partition wall, 31 ... terminal fixing part, 32 ... terminal lead-out part, 33, 34 ... board contact part , 35 ... Positioning convex part, 36 ... Protruding tip surface, 37 ... Fillet avoidance part, 38 ... Electrical contact part, 39 ... Intermediate fixing part, 40 ... Board connection part, 41 ... Tip, 42 ... Positioning concave part, 43 ... Surface ( Surface), 44 ... Back surface, 45 ... Through hole, 46 ... Solder fillet, 47 ... Guide rib, 48 ... Guide groove, 49 ... Locking protrusion, 50 ... Locking frame

Claims (3)

It comprises a connector housing having insulation, a plurality of pin-shaped terminals having conductivity, and a circuit board having a desired circuit pattern.
The plurality of pin-shaped terminals have a board connection portion that extends straight from the terminal lead-out portion of the connector housing, and the tip of the board connection portion is inserted into a through hole of the circuit board and soldered so as to be in contact with the circuit pattern. Connected by soldering
On the circuit board, a solder fillet is formed by soldering on the surface on the side of the terminal lead-out portion.
A connector characterized in that a concave fillet avoidance portion with respect to the solder fillet is formed in the terminal lead-out portion at the lead-out position of the board connection portion. In the connector according to claim 1,
The fillet avoiding portion is a connector characterized in that each of the board connecting portions is formed in a concave shape and the substrate connecting portion is surrounded by a slope. In the connector according to claim 1 or 2.
A connector characterized in that a substrate contact portion is formed so as to abut on the terminal lead-out portion so that the surface of the circuit board comes into contact with the terminal lead-out portion so as to have a predetermined distance between the surface and the terminal lead-out portion.

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