JP2022082331A - Device and method for displaying inspection results - Google Patents

Abstract

To provide an inspection result display device which allows an operator to easily remove a foreign matter from an object under inspection upon detection of the foreign matter that can be contained in the object under inspection.SOLUTION: An inspection result display device is provided, comprising: an acquisition unit configured to acquire a two-dimensional image, including an inspection result image showing the position of a foreign matter that can be contained in an object under inspection and a contour image showing at least a portion of a contour of the object under inspection, from an inspection device, and a projection unit configured to actually or virtually project the two dimensional image onto the object under inspection as a projection surface.SELECTED DRAWING: Figure 13

Description

The present invention relates to a technique for displaying the result of an inspection for detecting a foreign substance that may be contained in an object to be inspected.

Conventionally, various inspection devices for detecting foreign substances that may be contained in an object to be inspected have been developed. For example, the inspection device disclosed in Patent Document 1 detects an highlighted line from an X-ray transmission image of an inspected object, and detects a foreign substance based on the highlighted line.

Japanese Unexamined Patent Publication No. 2016-156647 (paragraph 0042)

In Patent Document 1, the inspection result is displayed on a display such as a liquid crystal display. However, since the worker must remove the foreign matter from the object to be inspected while looking at the display, it may take a very long time for an inexperienced worker to remove the foreign matter.

In view of the above situation, the present invention provides an inspection result display device and an inspection result display method that help an operator to easily remove a foreign substance from the inspected object when a foreign substance that may be contained in the inspected object is detected. It is intended to be provided.

In order to achieve the above object, the inspection result display device according to the present invention includes an inspection result image showing the position of a foreign substance that may be contained in the inspected object and a contour image showing at least a part of the outline of the inspected object. The configuration includes an acquisition unit that acquires a dimensional image from an inspection device and a projection unit that actually or virtually projects the two-dimensional image using the object to be inspected as a projection surface (first configuration).

In the inspection result display device of the first configuration, the contour image may have a configuration (second configuration) showing all of the contours.

In order to achieve the above object, the inspection result display method according to the present invention includes an inspection result image showing the position of a foreign substance that can be contained in the inspected object and a contour image showing at least a part of the outline of the inspected object. The configuration (third configuration) includes an acquisition step of acquiring a dimensional image from an inspection device and a projection step of actually or virtually projecting the two-dimensional image using the object to be inspected as a projection surface.

According to the present invention, it is possible to provide an inspection result display device and an inspection result display method that help an operator to easily remove a foreign substance from an inspected object when a foreign substance that may be contained in the inspected object is detected. ..

The figure which shows the schematic structure of the inspection apparatus which concerns on embodiment. A flowchart showing the schematic operation of the inspection device according to the embodiment. Diagram to illustrate the relationship between coordinates and pixels in a projected image Figure showing projection on a plane in the X-axis direction The figure which shows the projection to the plane in the Y-axis direction. The figure which shows the positional relationship between the area of the image projected on the kth plane and the area of the image projected on the (k-1) plane. A flowchart showing an example of a process for identifying the position of a foreign object for each projected image. The figure which shows the 1st modification of the inspection apparatus. The figure which shows the 2nd modification of the inspection apparatus. The figure which shows the 3rd modification of the inspection apparatus. The figure which shows the 3rd modification of the inspection apparatus. The figure which shows the 4th modification of the inspection apparatus. The figure which shows the 4th modification of the inspection apparatus. The figure which shows the arrangement example of a projector Diagram showing other arrangement examples of projectors The figure which shows the configuration example of a projector Diagram showing the object to be inspected Diagram showing a two-dimensional image Diagram showing the object to be inspected and a two-dimensional image

Embodiments of the present invention will be described below with reference to the drawings. In the present specification, as the definition of the term, in an image generated on a plane set at a predetermined position excluding the position of the X-ray detection unit, at least one of the X-axis direction and the Y-axis direction is two. For convenience, the image generated on the plane is a binarized radiographed image or a two-dimensional radiographed image even when the length is not changed only by moving the valued radiographed image or the two-dimensional radiographed image in parallel. Is obtained by the process of "projecting" on a plane, and the image generated on that plane is called a "projected image".

<1. Outline configuration of inspection equipment>
FIG. 1 is a diagram showing a schematic configuration of an inspection device according to an embodiment. The inspection device 100 shown in FIG. 1 includes a first X-ray irradiation unit 1A, a second X-ray irradiation unit 1B, a first X-ray detection unit 2A, a second X-ray detection unit 2B, a belt conveyor 3, a CPU 4, and a ROM 5. , RAM 6, VRAM 7, transmission unit 8, HDD 9, and input unit 10. In the present embodiment, the image processing device for processing the image is composed of the CPU 4, the ROM 5, the RAM 6, and the HDD 9.

The first X-ray irradiation unit 1A and the second X-ray irradiation unit 1B each irradiate the inspected object T1 with X-rays. The X-rays emitted from the first X-ray irradiation unit 1A and the X-rays emitted from the second X-ray irradiation unit 1B each have a fan beam shape extending along the Y axis, and more specifically, a narrow fan beam shape. The first X-ray irradiation unit 1A and the second X-ray irradiation unit 1B may be shared to form a single X-ray irradiation unit. The X-rays emitted from the single X-ray irradiation unit may have a wide fan beam shape or a cone beam shape.

The irradiation direction of X-rays emitted from the first X-ray irradiation unit 1A to the first X-ray detection unit 2A and the irradiation direction of X-rays emitted from the second X-ray irradiation unit 1B to the second X-ray detection unit 2B are different from each other. .. In the present embodiment, the irradiation direction of the X-rays emitted from the first X-ray irradiation unit 1A to the first X-ray detection unit 2A is a direction orthogonal to the X-axis and the Y-axis, and the second X-ray irradiation unit 1B to the second X-ray. The irradiation direction of the X-rays irradiated to the detection unit 2B is a direction inclined from the direction orthogonal to the X-axis and the Y-axis.

The first X-ray detection unit 2A and the second X-ray detection unit 2B each output a digital amount of electric signals corresponding to incident X-rays at a constant frame rate (line rate). The first X-ray detection unit 2A and the second X-ray detection unit 2B are line sensors extending along the Y axis, respectively. The line sensor may be a single-line line sensor or a plurality of line line sensors. The first X-ray detection unit 2A and the second X-ray detection unit 2B can each collect incident X-rays at a predetermined frame rate as image data of a digital electric amount corresponding to the amount of the X-rays. Hereinafter, this collected data will be referred to as "frame data". The first X-ray detection unit 2A and the second X-ray detection unit 2B may be shared to form a single X-ray detection unit. However, when the first X-ray irradiation unit 1A and the second X-ray irradiation unit 1B are shared, the first X-ray detection unit 2A and the second X-ray detection unit 2B are not shared.

The belt conveyor 3 is an object to be inspected placed on the belt with respect to the pair of the first X-ray irradiation unit 1A and the first X-ray detection unit 2A and the pair of the second X-ray irradiation unit 1B and the second X-ray detection unit 2B. Move T1 toward the negative side of the X-axis. That is, the longitudinal direction of the belt, which is a component of the belt conveyor 3, is along the X axis, and the width direction of the belt, which is a component of the belt conveyor 3, is along the Y axis. In this embodiment, the inspected object T1 is placed on the X-axis for the pair of the first X-ray irradiation unit 1A and the first X-ray detection unit 2A and the pair of the second X-ray irradiation unit 1B and the second X-ray detection unit 2B. The first moving mechanism (belt conveyor 3) that moves toward the negative side was used, but instead of the first moving mechanism, the pair of the first X-ray irradiation unit 1A and the first X-ray detection unit 2A and the second X-ray irradiation unit 1B were used. A second movement mechanism that moves the pair of the second X-ray detection unit 2B and the second X-ray detection unit 2B toward the positive side of the X-axis with respect to the object T1 to be inspected may be used.

The CPU 4 controls the entire inspection device 100 according to the programs and data stored in the ROM 5 and the HDD 9. ROM 5 records fixed programs and data. The RAM 6 provides a working memory. The CPU operates so as to perform a function of generating an image according to a program stored in the HDD 9. That is, the CPU 41 also serves as an image generation unit that generates an image.

The VRAM 7 temporarily stores image data. The transmission unit 8 transmits the image data stored in the VRAM 7 to the inspection result display device 200.

When the HDD 9 executes various programs such as an imaging control program for controlling X-ray imaging operation, an image processing program for processing an image, a foreign object position specifying processing program for specifying the position of a foreign object, and various programs. Stores various data such as setting values of various parameters and image data used in the above.

The input unit 10 is, for example, a keyboard, a pointing device, or the like, and inputs the content of the user operation.

<2. Approximate operation of inspection equipment>
The schematic operation of the inspection device 100 will be described with reference to the flowchart of FIG. First, the inspection device 100 performs X-ray imaging (step S1). Specifically, while the belt conveyor 3 is moving the object T1 to be inspected, X-rays are exposed from the first X-ray irradiation unit 1A and the second X-ray irradiation unit 1B. When the first X-ray detection unit 2A and the second X-ray detection unit 2B are single-line line sensors, the pixel size of the line sensor and the movement amount of the inspected object per frame are matched. When the first X-ray detection unit 2A and the second X-ray detection unit 2B are line sensors of a plurality of lines, it is not always necessary to match the pixel size of the line sensor with the movement amount of the object to be inspected per frame. The amount of movement of the object to be inspected per frame may be a multiple of the pixel size of the line sensor. However, the multiple shall be less than or equal to the number of lines of the line sensor. The X-rays emitted from the first X-ray irradiation unit 1A pass through the imaging region of the inspected object T1 and enter the first X-ray detection unit 2A, and the X-rays emitted from the second X-ray irradiation unit 1B are the inspected objects. It passes through the imaging region of T1 and is incident on the second X-ray detection unit 2B. As described above, the first X-ray detection unit 2A and the second X-ray detection unit 2B detect incident X-rays at a predetermined frame rate, and sequentially output frame data of the corresponding digital electric amount in frame units. This frame data is stored in the HDD 9. Two-dimensional digital data is obtained by arranging the frame data obtained by the line sensor in order. When the first X-ray detection unit 2A and the second X-ray detection unit 2B are line sensors having a plurality of lines, the data of each pixel is the sum of the data of a plurality of frames.

Next, the inspection device 100 projects on a plane set at a predetermined position excluding the positions of the X-ray detection units 2A and 2B to generate a projected image (step S2). Specifically, the inspection device 100 projects two-dimensional digital data onto each of 60 planes set at predetermined positions other than the positions of the X-ray detectors 2A and 2B to generate a projected image. In the present embodiment, the first X-ray detection unit 2A and the second X-ray detection unit are from the first X-ray irradiation unit 1A and the second X-ray irradiation unit 1B side along the direction perpendicular to the X-axis and the Y-axis (Z-axis direction). A plurality of planes are set on the 2B side at a predetermined pitch at a predetermined position excluding the positions of the X-ray detectors 2A and 2B. In the present embodiment, the predetermined positions other than the positions of the X-ray detection units 2A and 2B include the position of the object to be inspected T1, but the configuration of the inspection device is not limited to this.

The 60 projected images derived from the first X-ray irradiation unit 1A and the first X-ray detection unit 2A are stored in the HDD 9. Similarly, 60 projected images derived from the second X-ray irradiation unit 1B and the second X-ray detection unit 2B are also stored in the HDD 9.

Next, the inspection device 100 identifies the position of the foreign matter for each projected image (step S3). The details of the method for identifying the position of the foreign matter will be described later. By specifying the position of the foreign matter for each projected image, it is possible to improve the detection accuracy of the foreign matter as compared with the case of specifying the position of the foreign matter in an X-ray image such as a simple X-ray transmission image. The result of specifying the foreign matter position can be, for example, a binarized image showing the position of the foreign matter and the position of the non-foreign matter with different luminance values.

Next, the inspection device 100 removes the erroneous detection portion for specifying the position of the foreign matter (step S4). As shown in FIG. 3, the coordinates are fixed, and the position of the projected image F1 obtained by projecting the two-dimensional digital data DD based on the output of the first X-ray detection unit 2A onto a certain plane and the second X-ray. The positions of the projected image F2 obtained by projecting the two-dimensional digital data DD based on the output of the detection unit 2B onto the above-mentioned plane are deviated from each other. Therefore, when focusing on the same coordinates, the pixel position of the projected image F1 (on the projected image determined by determining the number in the pixel unit in the horizontal direction and determining the number in the pixel unit in the vertical direction). Position) and the pixel position of the projected image F2 are different. The foreign matter T2 of the object T1 to be inspected located on a certain plane does not become a false detection portion. In FIG. 3, the projected image F1 and the projected image F2 are shown so as to be displaced in the Z-axis direction, but the Z coordinates of the projected image F1 and the projected image F2 are actually the same. In the process of step S4, specifically, the inspection device 100 includes the projected image derived from the first X-ray irradiation unit 1A and the first X-ray detection unit 2A at the same position in the Z-axis direction, the second X-ray irradiation unit 1B, and the second X-ray irradiation unit. Regarding the projected image derived from the 2X-ray detection unit 2B, the position of the foreign matter specified based on the projected images derived from the first X-ray irradiation unit 1A and the first X-ray detection unit 2A, and the second X-ray irradiation unit 1B and the second X-ray detection unit. The position of the foreign matter specified based on the projected image derived from 2B is compared, and the erroneous detection portion of the foreign matter is removed based on the comparison result. More specifically, for example, the first method, the second method, and the like are carried out. In the first method, the inspection device 100 determines only the pixels that are identified as the positions of foreign objects in both projected images by the above comparison and that correspond to the same coordinates on the projected plane. Even if the pixel is specified as the position of the foreign object in both projected images, the pixel that does not correspond to the same coordinates on the projected plane is not adopted as the position of the foreign object. In the second method, the inspection device 100 stores a pixel identified as the position of a foreign object in one projected image, and in the other projected image, the stored pixel and the projected coordinate on the plane are the same. If a pixel identified as the position of a foreign object exists within a certain range from the pixel, the stored pixel is adopted as the position of the foreign object. In the process of step S4, the foreign matter existing on the plane to be processed is detected at the pixels corresponding to the same coordinates on the projected plane even if the irradiation angles of the X-rays are different, whereas it is the processing target. This is an erroneous detection partial removal process utilizing the fact that when foreign matter or the like that does not exist on the plane is projected in the irradiation direction of X-rays, it is not detected by the pixels corresponding to the same coordinates on the projected plane. The inspection device 100 executes this false detection partial removal process on all planes.

Finally, the inspection device 100 generates an output image, and the transmission unit 8 transmits the output image to the inspection result display device (step S5). As the output image, for example, an inspection result image (position of foreign matter that can be contained in the inspected object T1) obtained by adding all the projected images showing the positions of foreign matter reflecting the false detection portion removal process and the position correction. An inspection result image) and a two-dimensional image including a contour image showing the entire contour of the object T1 to be inspected can be mentioned. The contour of the object to be inspected T1 can be specified by the edge extraction process in the X-ray image. Further, the contour image may be an image showing a part of the contour of the object T1 to be inspected (for example, four points of the upper end, the lower end, the left end, and the right end of the contour). However, if the contour image is the entire contour of the object T1 to be inspected, the alignment between the object T1 to be inspected and the two-dimensional image becomes easier.

<3. Projection image>
The process of step S2 described above, that is, the process of generating a projected image from two-dimensional digital data will be described.

The area where the projected image can be included is long enough in the X-axis direction. As a result, in the X-axis direction, as shown in FIG. 4A, the object to be inspected T1 is stationary and the X-ray irradiation unit 1 and the X-ray detection unit 2 are moved in the direction opposite to the movement direction of the belt conveyor 3. Can be thought of as being. Therefore, the projection of the two-dimensional digital data DD onto each plane is translated in the X-axis direction. Since it is only translated in the X-axis direction, the X-axis direction distance between the centers of the pixels adjacent to the X-axis direction in the two-dimensional digital data DD and the pixels adjacent to the X-axis direction in the projected image The distance between the centers in the X-axis direction is the same. On the other hand, in the Y-axis direction, as shown in FIG. 4B, a geometrically reduced two-dimensional digital data DD is a projected image on each plane.

As described above, the positional relationship between the region Rk of the projected image on the k-th plane and the region R (k-1) of the projected image on the (k-1) plane is shown in FIG.

Here, the pixel shift in the projected image on each plane will be described. In the present embodiment, the above deviation is considered with reference to the pixel projected on the kmax plane shown in FIG. 4A without considering the coordinates of the pixel. The pixel shift in the X-axis direction in the k-th plane is represented by tanθ · (kmax−k) · pd. The distance between the 0th plane and the kmax plane is kmax · pd, and the distance between the 0th plane and the kth plane is k · pd. Then, assuming that the pixel size of the line sensor is pp, the irradiation angle of the first X-ray irradiation unit 1A is θ ₁ , and the irradiation angle of the second X-ray irradiation unit 1B is θ ₂ (> θ ₁ ), the first X-ray irradiation unit 1A and Derived from the second X-ray irradiation unit 1B and the second X-ray detection unit 2B, where the pixel located at the i-th position in the X-axis direction of the projected image derived from the first X-ray detection unit 2A and the coordinates of the pixel match. The value Δi showing the deviation from the i'th pixel located in the X-axis direction of the projected image in terms of the number of pixels is expressed by the following equation (1).
Δi = (tanθ ₂ -tanθ ₁ ) ・ (kmax－k) ・ pd / pp… (1)

When Δi is an integer, the pixels of the projected image derived from the first X-ray irradiation unit 1A and the first X-ray detection unit 2A and the pixels of the projected image derived from the second X-ray irradiation unit 1B and the second X-ray detection unit 2B are Exact match. On the other hand, when Δi is not an integer, the projected image derived from the second X-ray irradiation unit 1B and the second X-ray detection unit 2B corresponding to the pixels of the projected image derived from the first X-ray irradiation unit 1A and the first X-ray detection unit 2A. Will have two pixels. Therefore, if Δi is not an integer, for example, it is considered to correspond to the pixel that occupies a large proportion of the pixels that straddle the two projection images derived from the second X-ray irradiation unit 1B and the second X-ray detection unit 2B. May be good.

<4. Positioning of foreign matter>
An example of the process of step S3 described above, that is, the process of specifying the position of a foreign object for each projected image will be described with reference to the flowchart of FIG.

First, the CPU 4 divides the projected image into predetermined regions (for example, a region of 16 pixels × 16 pixels) (step S31). If there is a part of the projected image that is not filled with a predetermined area, the edge of the projected image is excluded from the inspection target, and the position of the predetermined area group is set so that the predetermined area group is located in the center of the projected image. It may be set.

Next, the CPU 4 calculates the average luminance value L1 in each of the predetermined regions (step S32).

After that, the CPU 4 determines whether or not the luminance value L2 of the pixel of interest is smaller than the average luminance value L1 in the predetermined region to which the pixel of interest belongs by a predetermined value V1 or more (step S33). As the predetermined value V1, for example, the standard deviation of the luminance value of each pixel in the predetermined region to which the pixel of interest belongs can be mentioned.

When it is not determined that the luminance value L2 of the pixel of interest is smaller than the average luminance value L1 in the predetermined region to which the pixel of interest belongs by a predetermined value V1 or more (NO in step S33), the CPU 4 places the pixel of interest at the position of a foreign object. Not specified as.

On the other hand, when it is determined that the luminance value L2 of the pixel of interest is smaller than the average luminance value L1 in the predetermined region to which the pixel of interest belongs by a predetermined value V1 or more (YES in step S33), the process proceeds to step S34.

In step S34, the CPU 4 calculates the maximum first brightness value among the first set number of pixels arranged on the negative side in the horizontal direction of the pixel of interest, and the second set number of pixels arranged on the positive side in the horizontal direction of the pixel of interest. The second brightness value that becomes the maximum in the The fourth brightness value that becomes the maximum in the fourth set number of pixels is calculated. The first set number to the fourth set number may all have the same value, or may have two or more types and four or less different values. If a predetermined area is located at the edge of the projected image and at least one of the first set number to the fourth set number cannot be secured, the number of pixels that can be secured is used, and if it cannot be secured at all. The pixel is excluded from inspection.

Next, the CPU 4 determines whether or not the ratio of the brightness value L2 of the pixel of interest to the first luminance value and the ratio of the luminance value L2 of the pixel of interest to the second luminance value are equal to or less than the threshold value TH1 (step S35). ..

When it is determined that the ratio of the brightness value L2 of the pixel of interest to the first luminance value and the luminance value L2 of the pixel of interest to the second luminance value are each equal to or less than the threshold value TH1 (YES in step S35), step S37 described later. Move to.

On the other hand, when it is not determined that the ratio of the brightness value L2 of the pixel of interest to the first luminance value and the luminance value L2 of the pixel of interest to the second luminance value are each equal to or less than the threshold value TH1 (NO in step S35), step. Move to S36.

In step S36, the CPU 4 determines whether or not the ratio of the brightness value L2 of the pixel of interest to the third luminance value and the ratio of the luminance value L2 of the pixel of interest to the fourth luminance value are each equal to or less than the threshold value TH1 (step S36). ). In the present embodiment, the threshold value used in step S35 and the threshold value used in step S36 are set to the same value, but may be different from each other. Further, unlike the present embodiment, in step S35, it may be determined only whether or not the ratio of the luminance value L2 of the pixel of interest to the first luminance value is equal to or less than the threshold value TH1. On the contrary, in step S35, it may be determined only whether or not the ratio of the luminance value L2 of the pixel of interest to the second luminance value is equal to or less than the threshold value TH1. The same modification may be performed for step S36. In step S36, it may be determined only whether or not the ratio of the luminance value L2 of the pixel of interest to the third luminance value is equal to or less than the threshold value TH1. On the contrary, in step S36, it may be determined only whether or not the ratio of the luminance value L2 of the pixel of interest to the fourth luminance value is equal to or less than the threshold value TH1.

When it is determined that the ratio of the brightness value L2 of the pixel of interest to the third luminance value and the luminance value L2 of the pixel of interest to the fourth luminance value are each equal to or less than the threshold value TH1 (YES in step S36), step S37 described later. Move to.

On the other hand, when it is not determined that the ratio of the brightness value L2 of the pixel of interest to the third luminance value and the luminance value L2 of the pixel of interest to the fourth luminance value are each equal to or less than the threshold TH1 (NO in step S36), the CPU 4 Does not specify the pixel of interest as the position of the foreign object. It should be noted that instead of immediately determining that the pixel of interest is not specified as the position of the foreign object, the size of the predetermined region and the value of the threshold value TH1 are changed to return to step S35, and the process proceeds from step S35 or step S36 to step S37. You may try to do it. The size of the predetermined region and the value of the threshold value TH1 may be changed not only once but also twice or more.

In step S37, the CPU 4 identifies the pixel of interest as the position of the foreign object.

Then, all the pixels belonging to the predetermined area are sequentially set as "pixels of interest" one by one, and the processing after step S33 is repeated. Further, all the predetermined areas are sequentially set as "predetermined areas to which the pixel of interest belongs" one by one, and the processing after step S32 is repeated.

According to the flowchart of FIG. 6, since the position of the foreign matter is specified based on the luminance characteristic of the entire minute region in a predetermined region, that is, the minute region, the detection accuracy of the foreign matter can be improved.

As the object to be inspected T1, for example, "fish" can be mentioned. When the object to be inspected T1 is a "fish", the foreign substance is a "small bone". The processing of the flowchart of FIG. 6 can be applied when the attenuation coefficient of the foreign matter is larger than the attenuation coefficient of the object T1 to be inspected (excluding the foreign matter). However, when the projected image is a black-and-white inverted image, in the processing of the flowchart of FIG. 6, "small" is replaced with "large", "maximum" is replaced with "minimum", and "threshold value TH1 or less" is replaced. It may be replaced with "threshold value TH1 or higher".

When the attenuation coefficient of the foreign matter is smaller than the attenuation coefficient of the object T1 to be inspected (excluding the foreign matter), the processing of the flowchart of FIG. 6 is not applied as it is, but is “small” in the processing of the flowchart of FIG. Is replaced with "large", "maximum" is replaced with "minimum", and "threshold TH1 or less" is replaced with "threshold TH1 or more". However, when the projected image is a black-and-white inverted image, the process of the flowchart of FIG. 6 may be applied as it is.

<5. Others>
In the above-described embodiment, the erroneous detection partial removal process of step S4 is executed, but if the specification that requires the detection accuracy of foreign matter is satisfied without executing the erroneous detection partial removal process of step S4, step S4 The false detection portion removal process may be omitted. When omitting the erroneous detection portion removal process in step S4, either the pair of the first X-ray irradiation unit 1A and the first X-ray detection unit 2A or the pair of the second X-ray irradiation unit 1B and the second X-ray detection unit 2B is used. It should be removed from the inspection device 100. In this case, a single or a plurality of planes may be set at predetermined positions other than the position of the X-ray detection unit, and a binarized image or a two-dimensional X-ray image may be projected on the plane.

In the above-described embodiment, in the erroneous detection portion removal process in step S4, the position of the foreign matter specified based on the projected images derived from the first X-ray irradiation unit 1A and the first X-ray detection unit 2A, and the second X-ray irradiation unit 1B and the second X-ray irradiation unit 1B. The position of the foreign matter specified based on the projected image derived from the 2X-ray detection unit 2B was compared, and the false detection part of the foreign matter was removed based on the comparison result, but this false detection part removal process is only an example. Is.

Therefore, the inspection device 100 is provided with a first to m (m is a natural number of 3 or more) X-ray irradiation units having different X-ray irradiation directions and first to mX-ray detection units, and k (k is). Any natural number of m or less) X-rays irradiated from the X-ray irradiation unit and transmitted through the inspected object T1 may be incident on the kX-ray detection unit. In this case, the position of the foreign matter is specified based on the k-th projection image, which is the projection image obtained by the X-rays emitted from the kX-ray irradiation unit, and the projection images of the same depth are shown in the first to mth projection images, respectively. The positions of the foreign matter specified based on the above are compared with each other, and the erroneous detection portion of the foreign matter can be removed based on the comparison result.

In the above-described embodiment, in step S34, the CPU 4 calculates the maximum first brightness value within the first set number of pixels arranged on the horizontal negative side of the pixel of interest, and arranges them on the positive side of the horizontal direction of the pixel of interest. The second brightness value that is the maximum in the second set number of pixels is calculated, the third brightness value that is the maximum in the third set number of pixels arranged on the negative side in the vertical direction of the pixel of interest is calculated, and the pixel of interest is calculated. The maximum fourth brightness value within the fourth set number of pixels arranged on the positive side in the vertical direction was calculated, but this calculation process is only an example. That is, the above-mentioned "horizontal negative side", "horizontal positive side", "vertical negative side", and "vertical positive side" are "first direction one side" and "first direction other side", respectively. , "Second direction one side", and "second direction other side" can be generalized. The first direction and the second direction are different directions from each other. The first direction and the second direction do not have to be orthogonal to each other.

Further, the first luminance value is not the maximum luminance value among the first set number of pixels arranged on one side of the first direction of the pixel of interest, but the first set number of pixels arranged on one side of the first direction of the pixel of interest. The luminance value of the pixel having a larger luminance value than the pixel of interest and being as far away as possible from the pixel of interest may be used, and the same substitution may be performed for the second to fourth luminance values. That is, the second brightness value is not the maximum brightness value among the pixels of the second set number arranged on the other side of the first direction of the pixel of interest, but the pixels of the second set number arranged on the other side of the first direction of the pixel of interest. The brightness value of the pixel whose brightness value is larger than that of the pixel of interest and is as far away as possible from the pixel of interest is used. Further, the third brightness value is not the maximum brightness value among the pixels of the third set number arranged on one side of the second direction of the pixel of interest, but the pixels of the third set number arranged on one side of the second direction of the pixel of interest. The brightness value of the pixel whose brightness value is larger than that of the pixel of interest and is as far away as possible from the pixel of interest is used. Further, the fourth luminance value is not the maximum luminance value among the fourth set number of pixels arranged on the other side of the second direction of the pixel of interest, but the fourth set number of pixels arranged on the other side of the second direction of the pixel of interest. The brightness value of the pixel whose brightness value is larger than that of the pixel of interest and is as far away as possible from the pixel of interest is used. Even when the above substitution is performed, since the position of the foreign matter is specified based on the luminance characteristics of the entire minute region as in the above-described embodiment, the detection accuracy of the foreign matter can be improved. However, in the case of performing the above substitution, when the attenuation coefficient of the foreign substance is smaller than the attenuation coefficient of the object T1 to be inspected (excluding the foreign substance), "small" is changed to "large" in the process of step S33. In the process of replacing step S34, "large" may be replaced with "small", and "threshold TH1 or less" may be replaced with "threshold TH1 or more". Further, instead of the above-mentioned "luminance value of a pixel as far as possible from the pixel of interest", "luminance value of a pixel as close as possible to the pixel of interest" may be used.

Further, the first brightness value is not the maximum brightness value among the first set number of pixels arranged on one side in the first direction of the pixel of interest, but the first predetermined position from the pixel of interest on one side of the first direction of the pixel of interest. The first set number of pixels lined up apart (for example, in the case of four pixels lined up 3 pixels away from the pixel of interest, the third to sixth pixels lined up on one side in the first direction from the pixel of interest) and the focus It is the average brightness value of the second set number of pixels arranged on the other side of the first direction of the pixel at a second predetermined position away from the pixel of interest. Then, in steps S34 to S36, the processing related to the second luminance value is not performed. Further, the third luminance value is not the maximum luminance value among the pixels of the third set number arranged on one side of the second direction of the pixel of interest, but the third predetermined position from the pixel of interest on one side of the second direction of the pixel of interest. The average luminance value of the third set number of pixels arranged apart and the fourth set number of pixels arranged four predetermined positions away from the pixel of interest on the other side of the second direction of the pixel of interest (“second luminance value” in claim 8”. Equivalent to). Then, in steps S34 to S36, the processing related to the fourth luminance value is not performed. Even when the above substitution is performed, since the position of the foreign matter is specified based on the luminance characteristics of the entire minute region as in the above-described embodiment, the detection accuracy of the foreign matter can be improved. However, in the case of performing the above substitution, when the attenuation coefficient of the foreign substance is smaller than the attenuation coefficient of the object T1 to be inspected (excluding the foreign substance), "small" is changed to "large" in the process of step S33. In the process of replacing step S34, "threshold value TH1 or less" may be replaced with "threshold value TH1 or more".

The CPU 4 may specify the position of the foreign object by using artificial intelligence learned from the two-dimensional digital data (two-dimensional X-ray photographed image) of the inspected object T1 inspected in the past. By using artificial intelligence, the detection accuracy of foreign substances can be further improved. The place where artificial intelligence is provided is not particularly limited. For example, the CPU 4 may be provided with artificial intelligence. Further, for example, artificial intelligence may be provided on a cloud accessible by the inspection device 100 via a communication network.

Unlike the above-described embodiment, in step S5, an image obtained by adding all the projected images showing the positions of the foreign matter reflecting the false detection portion removal process, that is, an image displaying the position of the foreign matter in two dimensions is output. It may be generated as an image.

Due to structural restrictions of the inspection device 100, the first X-ray detection unit 2A and the second X-ray detection unit 2B may not be arranged at the same height. In this case, as shown in FIG. 7, the Z-axis direction position of the first X-ray detection unit 2A and the Z-axis direction position of the second X-ray detection unit 2B are different, and X-rays passing through the same position of the inspected object T1 are incident. The pixels to be generated are shifted between the first X-ray detection unit 2A and the second X-ray detection unit 2B. Therefore, in consideration of this deviation, the second X-ray irradiation unit 1B and the second X-ray detection unit corresponding to the pixels of the projected image derived from the first X-ray irradiation unit 1A and the first X-ray detection unit 2A in the Y-axis direction. The pixels of the projected image derived from 2B may be specified.

Instead of generating a captured image (two-dimensional digital data) by simply arranging pixel data (data obtained by a line sensor) or simply integrating them as in the above-described embodiment, it is possible to use original image processing. The captured image may be generated based on the above. When the captured image is generated based on the original image processing, it is not always necessary to match the moving speed of the object to be inspected T1 with the pixel size of the line sensor.

In the above-described embodiment, a projected image is generated from two-dimensional digital data, the position of a foreign substance is specified for each projected image, and two projected images (binarized projected images) in which the position of the foreign substance is specified are compared. The inspected object T1 is inspected by a procedure of removing a false detection portion for specifying the position of a foreign substance from the result. On the other hand, unlike the above-described embodiment, the position of the foreign object is specified for each two-dimensional digital data, and the projected image is generated from the two-dimensional binarized digital data obtained by specifying the position of the foreign substance, and the two-dimensional image is generated. The object T1 to be inspected may be inspected by a procedure of removing an erroneous detection portion for specifying the position of a foreign object from the comparison result of two projected images generated from the binarized digital data of. In this modification, the CPU 4 identifies the position of the foreign object by using artificial intelligence learned from the projected image (projected image generated from the two-dimensional binarized digital data) of the inspected object T1 inspected in the past. You may. The inspection device is not limited to a form in which the erroneous detection portion for specifying the position of the foreign matter is removed from the comparison result of the two projected images, and the two images can be generalized to a plurality of images. Therefore, it may be in the form of removing the erroneous detection portion for specifying the position of the foreign matter from the comparison result of three or more projected images.

Further, instead of the first X-ray detection unit 2A and the second X-ray detection unit 2B which are line sensors, a two-dimensional detector 2C may be used as shown in FIG. By using the detection result of the shaded area of the two-dimensional detector 2C (see FIG. 8), the two-dimensional detector 2C can be used as a pseudo two-line sensor. In the configuration shown in FIG. 8, similarly to the configuration shown in FIG. 1, the first X-ray irradiation unit 1A and the second X-ray irradiation unit 1B may be shared to form a single X-ray irradiation unit.

In addition, by using a plurality of two-dimensional detectors instead of the single two-dimensional detector 2C and using the detection results of a part of each of the plurality of two-dimensional detectors, a plurality of two-dimensional detectors can be simulated. Can be multiple line sensors.

In addition, by using a single line sensor instead of the single two-dimensional detector 2C and using the detection results of multiple regions of the single line sensor as in the case of the single two-dimensional detector 2C, A single line sensor can be a pseudo plurality of line sensors. The single line sensor is a line sensor having a plurality of lines extending along the Y-axis direction.

Further, instead of the first X-ray detection unit 2A and the second X-ray detection unit 2B which are line sensors, two-dimensional detectors 2D and 2E may be used as shown in FIGS. 9 and 10. The inspection device 100 shown in FIGS. 9 and 10 may perform the following operations, for example. The object T1 to be inspected is moved by the drive of the belt conveyor 3 to a position where the image can be taken by the second X-ray irradiation unit 1B and the two-dimensional detector 2E, and then the belt conveyor 3 is stopped, and the second X-ray irradiation unit 1B and the two-dimensional The object to be inspected T1 is stationary at a position where the image can be taken by the detector 2E (see FIG. 9). In the stationary state shown in FIG. 9, one shot of the object to be inspected T1 is taken by the second X-ray irradiation unit 1B and the two-dimensional detector 2E. Then, the object T1 to be inspected is moved by the drive of the belt conveyor 3 to a position where the image can be taken by the first X-ray irradiation unit 1A and the two-dimensional detector 2D, and then the belt conveyor 3 is stopped, and the first X-ray irradiation unit 1A and the first X-ray irradiation unit 1A and The object to be inspected T1 is stationary at a position where it can be photographed by the two-dimensional detector 2D (see FIG. 10). In the stationary state shown in FIG. 10, one shot of the object to be inspected T1 is photographed by the first X-ray irradiation unit 1A and the two-dimensional detector 2D.

Further, instead of the first X-ray irradiation unit 1A, the second X-ray irradiation unit 1B, and the line sensors the first X-ray detection unit 2A and the second X-ray detection unit 2B, X-ray irradiation is performed as shown in FIGS. 11 and 12. The unit 1C and the two-dimensional detector 2F may be used. The inspection device 100 shown in FIGS. 11 and 12 may perform the following operations, for example. The object to be inspected T1 is moved to the first predetermined position by driving the belt conveyor 3. At this time, the two-dimensional detector 2F is also moved by a movement mechanism (not shown) in conjunction with the movement of the object T1 to be inspected. After that, the belt conveyor 3 and the moving mechanism (not shown) are stopped, the object T1 to be inspected is stopped at the first predetermined position, and the two-dimensional detector 2F is stopped at the position corresponding to the first predetermined position (see FIG. 11). ). In the stationary state shown in FIG. 11, one shot of the object to be inspected T1 is taken by the X-ray irradiation unit 1C and the two-dimensional detector 2F. Then, the object to be inspected T1 is moved to a second predetermined position by driving the belt conveyor 3. At this time, the two-dimensional detector 2F is also moved by a movement mechanism (not shown) in conjunction with the movement of the object T1 to be inspected. After that, the belt conveyor 3 and the moving mechanism (not shown) are stopped, the object T1 to be inspected is stopped at the second predetermined position, and the two-dimensional detector 2F is stopped at the position corresponding to the second predetermined position (see FIG. 12). ). In the stationary state shown in FIG. 12, one shot of the object to be inspected T1 is taken by the X-ray irradiation unit 1C and the two-dimensional detector 2F.

In the above description, a plurality of two-dimensional X-ray images in which the positional relationship between the X-ray object T1 and the X-ray irradiation unit used for X-ray photography are different only in the X-axis direction are generated. A plurality of two-dimensional X-ray images may be generated in which the positional relationship between the X-ray and the X-ray irradiation unit used for X-ray photography is different only in the Y-axis direction. A plurality of two-dimensional radiographed images may be generated in which the positional relationship with the line irradiation unit is different in both the X-axis direction and the Y-axis direction.

Further, the configuration of the inspection device is not limited to the above-described embodiment and modification, and may be a known configuration as described in, for example, Patent Document 1.

<6. Inspection result display device>
FIG. 13 is a diagram showing an arrangement example of the projector 200, which is an example of the inspection result display device. The object T1 to be inspected is placed on the workbench 300. A projector 200 is arranged above the workbench 300, and the projector 200 projects a two-dimensional image using the object T1 to be inspected as a projection surface.

When the worker performs the foreign matter removal work, the worker's hand may get in between the object to be inspected T1 and the projector 200, and the two-dimensional image may not be sufficiently projected on the object to be inspected T1. Therefore, as shown in FIG. 14, another projector 200 is arranged below the workbench 300, and the other projector 200 also projects a two-dimensional image using the object T1 to be inspected as a projection surface. You may do it. However, when another projector 200 is arranged below the workbench 300, the workbench 300 and the object T1 to be inspected need to have a certain degree of translucency with respect to visible light.

FIG. 15 is a diagram showing a configuration example of the projector 200. The projector 200 includes an acquisition unit 201, a microcomputer 202, a liquid crystal display drive unit 203, an optical system 204, and a lamp 205. The liquid crystal display drive unit 203, the optical system 204, and the lamp 205 correspond to a projection unit that projects a two-dimensional image with the object T1 to be inspected as a projection surface.

The acquisition unit 201 acquires a two-dimensional image transmitted from the transmission unit 8 of the inspection device. That is, the acquisition unit 201 is a reception unit that receives a two-dimensional image transmitted from the transmission unit 8 of the inspection device. The data communication method between the transmission unit 8 and the acquisition unit 201 of the inspection device is not particularly limited.

A substantially parallel light is emitted from the lamp 205 to the liquid crystal display drive unit 203.

The liquid crystal display drive unit 203 includes an optical system including a lens and a prism (not shown), and liquid crystal panels R, G, and B. In the liquid crystal display drive unit 203, the light from the lamp 205 that has passed through a lens system (not shown) inside the liquid crystal display drive unit 203 is incident on each of the liquid crystal panels R, G, and B so that the light amount distribution is uniform. Of the light incident through the lens system, the blue wavelength band light (B light), the red wavelength band light (R light), and the green wavelength band light (G light) are substantially parallel light, R and G. , B incident on each liquid crystal panel. Each liquid crystal panel is driven according to the video signals corresponding to R, G, and B output from the acquisition unit 201, and the light is modulated according to the driving state. The R light, G light, and B light modulated by the liquid crystal panel are color-synthesized and then magnified and projected onto the object T1 to be inspected by the optical system 204. The optical system 204 includes a lens group for forming an image of the projected light on the object T1 to be inspected, and an actuator for adjusting a part of these lens groups in the optical axis direction to adjust the zoom state and the focus state of the projected image. To prepare for.

The operator fine-tunes the position of the object to be inspected T1 with reference to the outline image, and obtains the outline of the object to be inspected T1 shown in FIG. 16 and the outline 400 of the outline image included in the two-dimensional image shown in FIG. , Match as shown in FIG. As a result, the operator can easily remove the foreign matter from the inspected object T1 by using the inspection result image 500 as a clue.

The inspection result display device is not limited to the projector, and is a display device that virtually projects a two-dimensional image using an object to be inspected such as VR (Virtual Reality) glasses and VR goggles as a projection surface. May be good.

1 X-ray irradiation unit 1A 1st X-ray irradiation unit 1B 2nd X-ray irradiation unit 1C X-ray irradiation unit 2 X-ray detection unit 2A 1st X-ray detection unit 2B 2nd X-ray detection unit 2C-2F Two-dimensional detector 3 Belt conveyor 4 CPU
5 ROM
6 RAM
7 VRAM
8 Transmitter 9 HDD
10 Input unit 100 Inspection device 200 Projector 201 Acquisition unit 202 Microcomputer 203 Liquid crystal display drive unit 204 Optical system 205 Lamp 300 Workbench

Claims (3)

An acquisition unit that acquires a two-dimensional image including an inspection result image showing the position of a foreign substance that can be contained in the inspected object and a contour image showing at least a part of the contour of the inspected object from the inspection device.
A projection unit that actually or virtually projects the two-dimensional image using the object to be inspected as a projection surface.
An inspection result display device. The inspection result display device according to claim 1, wherein the contour image shows the entire contour. An acquisition step of acquiring a two-dimensional image including an inspection result image showing the position of a foreign substance that can be contained in the inspected object and a contour image showing at least a part of the contour of the inspected object from the inspection device.
A projection step that actually or virtually projects the two-dimensional image using the object to be inspected as a projection surface.
A method of displaying inspection results.

Images