JP2022082191A - Thermally-expandable putty composition - Google Patents
Thermally-expandable putty composition Download PDFInfo
- Publication number
- JP2022082191A JP2022082191A JP2020193604A JP2020193604A JP2022082191A JP 2022082191 A JP2022082191 A JP 2022082191A JP 2020193604 A JP2020193604 A JP 2020193604A JP 2020193604 A JP2020193604 A JP 2020193604A JP 2022082191 A JP2022082191 A JP 2022082191A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- mass
- expandable
- inorganic
- based compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 39
- 150000001875 compounds Chemical class 0.000 claims abstract description 56
- 150000002484 inorganic compounds Chemical class 0.000 claims abstract description 25
- 229910010272 inorganic material Inorganic materials 0.000 claims abstract description 25
- 239000011230 binding agent Substances 0.000 claims abstract description 21
- -1 phosphoric acid compound Chemical class 0.000 claims abstract description 16
- NBIIXXVUZAFLBC-UHFFFAOYSA-N phosphoric acid Substances OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims abstract description 6
- 229920000137 polyphosphoric acid Polymers 0.000 claims abstract description 4
- 239000011574 phosphorus Substances 0.000 claims description 24
- 229910052698 phosphorus Inorganic materials 0.000 claims description 24
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 229920001276 ammonium polyphosphate Polymers 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- 239000004114 Ammonium polyphosphate Substances 0.000 claims description 5
- 239000005696 Diammonium phosphate Substances 0.000 claims description 4
- 235000019826 ammonium polyphosphate Nutrition 0.000 claims description 4
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 claims description 4
- 229910000388 diammonium phosphate Inorganic materials 0.000 claims description 4
- 235000019838 diammonium phosphate Nutrition 0.000 claims description 4
- TVZISJTYELEYPI-UHFFFAOYSA-N hypodiphosphoric acid Chemical compound OP(O)(=O)P(O)(O)=O TVZISJTYELEYPI-UHFFFAOYSA-N 0.000 claims description 4
- LFVGISIMTYGQHF-UHFFFAOYSA-N ammonium dihydrogen phosphate Chemical compound [NH4+].OP(O)([O-])=O LFVGISIMTYGQHF-UHFFFAOYSA-N 0.000 claims description 3
- 229910000387 ammonium dihydrogen phosphate Inorganic materials 0.000 claims description 3
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 claims description 3
- 229920001477 hydrophilic polymer Polymers 0.000 claims description 3
- 239000006012 monoammonium phosphate Substances 0.000 claims description 3
- 235000019837 monoammonium phosphate Nutrition 0.000 claims description 3
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 claims description 3
- UEZVMMHDMIWARA-UHFFFAOYSA-N Metaphosphoric acid Chemical compound OP(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-N 0.000 claims description 2
- DNCQWNWCEBTKGC-UHFFFAOYSA-N azane;phosphorous acid Chemical compound N.N.OP(O)O DNCQWNWCEBTKGC-UHFFFAOYSA-N 0.000 claims description 2
- 229940005657 pyrophosphoric acid Drugs 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 17
- 239000011521 glass Substances 0.000 abstract description 13
- 239000004744 fabric Substances 0.000 abstract description 12
- 150000003018 phosphorus compounds Chemical class 0.000 abstract description 9
- 235000011180 diphosphates Nutrition 0.000 abstract description 3
- 229940125904 compound 1 Drugs 0.000 abstract description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 13
- 238000012360 testing method Methods 0.000 description 11
- 239000010439 graphite Substances 0.000 description 10
- 229910002804 graphite Inorganic materials 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 238000013001 point bending Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910019142 PO4 Inorganic materials 0.000 description 6
- 239000001768 carboxy methyl cellulose Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 239000010452 phosphate Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 4
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 239000001488 sodium phosphate Substances 0.000 description 4
- 229910000162 sodium phosphate Inorganic materials 0.000 description 4
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- ILRRQNADMUWWFW-UHFFFAOYSA-K aluminium phosphate Chemical compound O1[Al]2OP1(=O)O2 ILRRQNADMUWWFW-UHFFFAOYSA-K 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
- 239000011819 refractory material Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 3
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 3
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- DPXJVFZANSGRMM-UHFFFAOYSA-N acetic acid;2,3,4,5,6-pentahydroxyhexanal;sodium Chemical compound [Na].CC(O)=O.OCC(O)C(O)C(O)C(O)C=O DPXJVFZANSGRMM-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000005396 acrylic acid ester group Chemical group 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- HJJOHHHEKFECQI-UHFFFAOYSA-N aluminum;phosphite Chemical compound [Al+3].[O-]P([O-])[O-] HJJOHHHEKFECQI-UHFFFAOYSA-N 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- AYJRCSIUFZENHW-UHFFFAOYSA-L barium carbonate Chemical compound [Ba+2].[O-]C([O-])=O AYJRCSIUFZENHW-UHFFFAOYSA-L 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000001506 calcium phosphate Substances 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 2
- 239000001095 magnesium carbonate Substances 0.000 description 2
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 2
- 125000005341 metaphosphate group Chemical group 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910021382 natural graphite Inorganic materials 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229940048084 pyrophosphate Drugs 0.000 description 2
- 239000011435 rock Substances 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 235000019812 sodium carboxymethyl cellulose Nutrition 0.000 description 2
- 229920001027 sodium carboxymethylcellulose Polymers 0.000 description 2
- GCLGEJMYGQKIIW-UHFFFAOYSA-H sodium hexametaphosphate Chemical compound [Na]OP1(=O)OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])O1 GCLGEJMYGQKIIW-UHFFFAOYSA-H 0.000 description 2
- 235000019982 sodium hexametaphosphate Nutrition 0.000 description 2
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 2
- 239000002689 soil Substances 0.000 description 2
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 2
- NCPXQVVMIXIKTN-UHFFFAOYSA-N trisodium;phosphite Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])[O-] NCPXQVVMIXIKTN-UHFFFAOYSA-N 0.000 description 2
- 239000010455 vermiculite Substances 0.000 description 2
- 229910052902 vermiculite Inorganic materials 0.000 description 2
- 235000019354 vermiculite Nutrition 0.000 description 2
- MOMKYJPSVWEWPM-UHFFFAOYSA-N 4-(chloromethyl)-2-(4-methylphenyl)-1,3-thiazole Chemical compound C1=CC(C)=CC=C1C1=NC(CCl)=CS1 MOMKYJPSVWEWPM-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 239000004135 Bone phosphate Substances 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- MEBUWQMNCCPUOK-UHFFFAOYSA-N C(C=C)(=O)O.C(C=C)(=O)N.C(C=C)(=O)OCCS(=O)(=O)O Chemical class C(C=C)(=O)O.C(C=C)(=O)N.C(C=C)(=O)OCCS(=O)(=O)O MEBUWQMNCCPUOK-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 241000195493 Cryptophyta Species 0.000 description 1
- DMHWOVJCMTWFMF-UHFFFAOYSA-N O.[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] Chemical compound O.[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] DMHWOVJCMTWFMF-UHFFFAOYSA-N 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 229920000388 Polyphosphate Polymers 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 239000005819 Potassium phosphonate Substances 0.000 description 1
- 239000004113 Sepiolite Substances 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 239000000783 alginic acid Substances 0.000 description 1
- 235000010443 alginic acid Nutrition 0.000 description 1
- 229920000615 alginic acid Polymers 0.000 description 1
- 229960001126 alginic acid Drugs 0.000 description 1
- 150000004781 alginic acids Chemical class 0.000 description 1
- DHAHRLDIUIPTCJ-UHFFFAOYSA-K aluminium metaphosphate Chemical compound [Al+3].[O-]P(=O)=O.[O-]P(=O)=O.[O-]P(=O)=O DHAHRLDIUIPTCJ-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 229910001377 aluminum hypophosphite Inorganic materials 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 239000007798 antifreeze agent Substances 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- FUFJGUQYACFECW-UHFFFAOYSA-L calcium hydrogenphosphate Chemical compound [Ca+2].OP([O-])([O-])=O FUFJGUQYACFECW-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 229910001382 calcium hypophosphite Inorganic materials 0.000 description 1
- 229940064002 calcium hypophosphite Drugs 0.000 description 1
- ROPDWRCJTIRLTR-UHFFFAOYSA-L calcium metaphosphate Chemical compound [Ca+2].[O-]P(=O)=O.[O-]P(=O)=O ROPDWRCJTIRLTR-UHFFFAOYSA-L 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 159000000007 calcium salts Chemical class 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 125000002057 carboxymethyl group Chemical group [H]OC(=O)C([H])([H])[*] 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- TWSNDAGGXNPFMX-UHFFFAOYSA-N dialuminum hydrogen phosphite Chemical compound [Al+3].[Al+3].OP([O-])[O-].OP([O-])[O-].OP([O-])[O-] TWSNDAGGXNPFMX-UHFFFAOYSA-N 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- YXXXKCDYKKSZHL-UHFFFAOYSA-M dipotassium;dioxido(oxo)phosphanium Chemical compound [K+].[K+].[O-][P+]([O-])=O YXXXKCDYKKSZHL-UHFFFAOYSA-M 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
- GBHRVZIGDIUCJB-UHFFFAOYSA-N hydrogenphosphite Chemical compound OP([O-])[O-] GBHRVZIGDIUCJB-UHFFFAOYSA-N 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- BDAGIHXWWSANSR-NJFSPNSNSA-N hydroxyformaldehyde Chemical compound O[14CH]=O BDAGIHXWWSANSR-NJFSPNSNSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000006247 magnetic powder Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 229910001562 pearlite Inorganic materials 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920006149 polyester-amide block copolymer Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 239000001205 polyphosphate Substances 0.000 description 1
- 235000011176 polyphosphates Nutrition 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910001380 potassium hypophosphite Inorganic materials 0.000 description 1
- OQZCJRJRGMMSGK-UHFFFAOYSA-M potassium metaphosphate Chemical compound [K+].[O-]P(=O)=O OQZCJRJRGMMSGK-UHFFFAOYSA-M 0.000 description 1
- 229940099402 potassium metaphosphate Drugs 0.000 description 1
- 229910000160 potassium phosphate Inorganic materials 0.000 description 1
- 235000011009 potassium phosphates Nutrition 0.000 description 1
- CRGPNLUFHHUKCM-UHFFFAOYSA-M potassium phosphinate Chemical compound [K+].[O-]P=O CRGPNLUFHHUKCM-UHFFFAOYSA-M 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 229910052624 sepiolite Inorganic materials 0.000 description 1
- 235000019355 sepiolite Nutrition 0.000 description 1
- 239000010802 sludge Substances 0.000 description 1
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 description 1
- 235000019983 sodium metaphosphate Nutrition 0.000 description 1
- 229940048086 sodium pyrophosphate Drugs 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910000018 strontium carbonate Inorganic materials 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- CNALVHVMBXLLIY-IUCAKERBSA-N tert-butyl n-[(3s,5s)-5-methylpiperidin-3-yl]carbamate Chemical compound C[C@@H]1CNC[C@@H](NC(=O)OC(C)(C)C)C1 CNALVHVMBXLLIY-IUCAKERBSA-N 0.000 description 1
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 1
- 235000019818 tetrasodium diphosphate Nutrition 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910000391 tricalcium phosphate Inorganic materials 0.000 description 1
- 235000019731 tricalcium phosphate Nutrition 0.000 description 1
- 229940078499 tricalcium phosphate Drugs 0.000 description 1
- XWKBMOUUGHARTI-UHFFFAOYSA-N tricalcium;diphosphite Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])[O-].[O-]P([O-])[O-] XWKBMOUUGHARTI-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- AUTOISGCBLBLBA-UHFFFAOYSA-N trizinc;diphosphite Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])[O-].[O-]P([O-])[O-] AUTOISGCBLBLBA-UHFFFAOYSA-N 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
- 239000011667 zinc carbonate Substances 0.000 description 1
- 229910000010 zinc carbonate Inorganic materials 0.000 description 1
- 235000004416 zinc carbonate Nutrition 0.000 description 1
- VUDJAFZYSMINQA-UHFFFAOYSA-L zinc metaphosphate Chemical compound [Zn+2].[O-]P(=O)=O.[O-]P(=O)=O VUDJAFZYSMINQA-UHFFFAOYSA-L 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 1
- 229910000165 zinc phosphate Inorganic materials 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Abstract
Description
本発明は、熱膨張性パテ組成物に関する。 The present invention relates to a heat-expandable putty composition.
一般に、建築物等において建築基準法で定められた防火区画等に配管類や電力ケーブルや通信ケーブル等のケーブル類を貫通させる場合、延焼防止等の観点から防火区画等には一定の耐火性能が求められている。そのため、建築物内の配管類・ケーブル類と防火壁等との間には、防火性能を付与した防火用目地材として、液状ポリマーに金属水和物等を配合したパテ状の耐火材が用いられている（特許文献１参照）。 Generally, when cables such as pipes, power cables, and communication cables are penetrated through the fire protection section specified by the Building Standards Act in buildings, etc., the fire protection section has a certain level of fire resistance from the viewpoint of preventing the spread of fire. It has been demanded. Therefore, putty-like fire-resistant material, which is a mixture of liquid polymer and metal hydrate, is used as a fire-prevention joint material with fire-prevention performance between the pipes / cables in the building and the fire-prevention wall. (See Patent Document 1).
また、火災時に配管類が変形したり、ケーブル被覆材が燃焼したりすることで生じた隙間を塞ぐことが出来るパテ状耐火材として、バーミキュライトや、熱膨張性黒鉛や、マイクロカプセル化したポリリン酸アンモニウムを有機樹脂に混合した樹脂組成物（例えば、特許文献２参照）や、ベース樹脂に熱膨張性黒鉛と共にポリカーボネート樹脂やポリフェニレンサルファイド樹脂等の形崩れ防止用樹脂を配合した熱膨張性の組成物（例えば、特許文献３参照）も提案されている。 In addition, vermiculite, thermally expandable graphite, and microencapsulated polycarbonate are used as putty-like fireproof materials that can close the gaps created by the deformation of pipes and the burning of cable coating materials during a fire. A resin composition in which ammonium is mixed with an organic resin (see, for example, Patent Document 2), or a heat-expandable composition in which a base resin is blended with a heat-expandable graphite and a resin for preventing shape loss such as a polycarbonate resin or a polyphenylene sulfide resin. (See, for example, Patent Document 3) have also been proposed.
ところで、住宅の断熱材としてアルミガラスクロスが壁に施工されることがある。この場合、アルミガラスクロスのアルミ面がパテ状耐火材の被着体となるため、パテ状耐火材には、アルミガラスクロスへの密着性が求められる。また、パテ状耐火材には、加工性、作業時の非付着性、熱膨張性、形状保持性も求められている。 By the way, aluminum glass cloth may be installed on the wall as a heat insulating material for a house. In this case, since the aluminum surface of the aluminum glass cloth becomes the adherend of the putty-like refractory material, the putty-like refractory material is required to have adhesion to the aluminum glass cloth. Further, the putty-like refractory material is also required to have workability, non-adhesiveness during work, thermal expansion property, and shape retention.
本発明はこのような事情に鑑みてなされたものであり、十分な加工性、非付着性、熱膨張性、形状保持性を有しつつ、アルミガラスクロス面への優れた密着性を有する熱膨張性パテ組成物を提供するものである。 The present invention has been made in view of such circumstances, and has sufficient workability, non-adhesiveness, thermal expansion property, and shape retention, and has excellent heat adhesion to the aluminum glass cloth surface. It provides a swelling putty composition.
本発明によれば、有機バインダ、熱膨張性化合物、無機リン系化合物、前記無機リン系化合物以外のその他無機化合物、を含む熱膨張性パテ組成物であって、前記有機バインダ、前記熱膨張性化合物、前記無機リン系化合物、前記その他無機化合物の４成分の合計を１００質量％としたときの各成分の割合が、前記有機バインダ０．５～２０質量％、前記熱膨張性化合物０．５～５０質量％、前記無機リン系化合物１～９９質量％、前記その他無機化合物０～９２．５質量％を含有し、前記無機リン系化合物が、リン酸系化合物、亜リン酸系化合物、次亜リン酸系化合物、メタリン酸系化合物、ピロリン酸系化合物及びポリリン酸系化合物のうちの少なくとも１種を含む、熱膨張性パテ組成物が提供される。 According to the present invention, the heat-expandable putty composition comprising an organic binder, a heat-expandable compound, an inorganic phosphorus-based compound, and other inorganic compounds other than the inorganic phosphorus-based compound, wherein the organic binder and the heat-expandable. When the total of the four components of the compound, the inorganic phosphorus compound, and the other inorganic compound is 100% by mass, the ratio of each component is 0.5 to 20% by mass of the organic binder and 0.5 of the heat-expandable compound. It contains ~ 50% by mass, the above-mentioned inorganic phosphorus-based compound 1 to 99% by mass, and the above-mentioned other inorganic compounds 0 to 92.5% by mass, and the said inorganic phosphorus-based compound is a phosphoric acid-based compound, a phobic acid-based compound, and the following. A heat-expandable putty composition containing at least one of a hypophosphate-based compound, a metaphosphate-based compound, a pyrophosphate-based compound, and a polyphosphate-based compound is provided.
本発明者が鋭意検討を行ったところ、各成分を上記の割合で含有する熱膨張性パテ組成物が上記課題を解決可能であることを見出し、本発明の完成に到った。 As a result of diligent studies by the present inventor, it has been found that a heat-expandable putty composition containing each component in the above-mentioned ratio can solve the above-mentioned problems, and the present invention has been completed.
１．熱膨張性パテ組成物の組成
本発明の熱膨張性パテ組成物（以下、パテ組成物）は、有機バインダ、熱膨張性化合物、無機リン系化合物、無機リン系化合物以外の無機化合物を含有する。
1. 1. Composition of Heat-Expandable Putty Composition The heat-expandable putty composition of the present invention (hereinafter referred to as putty composition) contains an organic binder, a heat-expandable compound, an inorganic phosphorus-based compound, and an inorganic compound other than the inorganic phosphorus-based compound. ..
＜有機バインダ＞
有機バインダは、有機化合物からなる結合剤であり、有機バインダを適量配合することによって、パテ組成物を施工に適した硬さにすることができる。
<Organic binder>
The organic binder is a binder composed of an organic compound, and the putty composition can be made into a hardness suitable for construction by blending an appropriate amount of the organic binder.
有機バインダは、ポリオレフィン、ポリエステル、ポリアミドなどの有機高分子を含むことが好ましい。有機高分子としては、親水性高分子が好ましい。親水性高分子としては、水に可溶な水溶性高分子や、水を吸収して膨張可能な吸水性高分子が挙げられ、具体的には、例えば、澱粉、セルロース誘導体、ポリビニルアルコール、変性アクリル酸エステル系共重合体、ポリエチレンオキサイド、ポリプロピレンオキサイド、エチレンオキサイド・プロピレンオキサイド共重合体、エチレンオキサイド・プロピレンオキサイド・フェニルグリシジルエーテル共重合体、エチレンオキサイド・プロピレンオキサイド・アリルグリシジルエーテル共重合体、アルギン酸ソーダなどが挙げられる。 The organic binder preferably contains an organic polymer such as polyolefin, polyester or polyamide. As the organic polymer, a hydrophilic polymer is preferable. Examples of the hydrophilic polymer include a water-soluble polymer that is soluble in water and a water-absorbent polymer that can be expanded by absorbing water. Specific examples thereof include starch, cellulose derivatives, polyvinyl alcohol, and modifications. Acrylic acid ester-based copolymer, polyethylene oxide, polypropylene oxide, ethylene oxide / propylene oxide copolymer, ethylene oxide / propylene oxide / phenylglycidyl ether copolymer, ethylene oxide / propylene oxide / allylglycidyl ether copolymer, alginic acid Examples include soda.
セルロース誘導体としては、カルボキシメチルセルロースやヒドロキシエチルセルロール、その誘導体が挙げられ、カルボキシメチルセルロースの誘導体としては、カルボキシメチルセルロースナトリウム、カルボキシメチルセルロースアンモニウムなどの塩が挙げられる。変性アクリル酸エステル系共重合体としては、スルホエチルアクリレート－アクリルアミド－アクリル酸共重合体ナトリウム塩の架橋物が挙げられる。 Examples of the cellulose derivative include carboxymethyl cellulose, hydroxyethyl cell roll, and its derivatives, and examples of the derivative of carboxymethyl cellulose include salts such as sodium carboxymethyl cellulose and ammonium carboxymethyl cellulose. Examples of the modified acrylic acid ester-based copolymer include crosslinked products of sodium salts of sulfoethyl acrylate-acrylamide-acrylic acid copolymer.
有機バインダ、熱膨張性化合物、無機リン系化合物、無機リン系化合物以外のその他無機化合物（以下、「４成分」）の合計を１００質量％としたときの、有機バインダの割合は、０．５～２０質量％であって、１．５～１４質量％が好ましく、２～９質量％がより好ましい。有機バインダの割合が小さすぎると、パテ組成物が軟らかすぎて、加工性又は非付着性が不十分になる場合がある。有機バインダの割合が大きすぎると、パテ組成物が硬くなりすぎて、加工性が不十分になる場合がある。この割合は例えば、０．５、１．０、１．５、２．０、２．５、３．０、３．５、４．０、４．５、５、６、７、８、９、１０、１１、１２、１３、１４、１５、１６、１７、１８、１９、２０質量％であり、ここで例示した数値の何れか２つの間の範囲内であってもよい。 When the total of the organic binder, the heat-expandable compound, the inorganic phosphorus compound, and other inorganic compounds other than the inorganic phosphorus compound (hereinafter, “4 components”) is 100% by mass, the ratio of the organic binder is 0.5. It is -20% by mass, preferably 1.5 to 14% by mass, more preferably 2 to 9% by mass. If the proportion of organic binder is too small, the putty composition may be too soft and the processability or non-adhesiveness may be insufficient. If the proportion of the organic binder is too large, the putty composition may become too hard and the processability may be insufficient. This ratio is, for example, 0.5, 1.0, 1.5, 2.0, 2.5, 3.0, 3.5, 4.0, 4.5, 5, 6, 7, 8, 9 It is 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20% by mass, and may be within the range between any two of the numerical values exemplified here.
＜熱膨張性化合物＞
熱膨張性化合物としては、加熱時に膨張するものであれば特に限定はないが、例えば、バーミキュライト、カオリン、マイカ、熱膨張性黒鉛等が挙げられる。これらの中でも、膨張開始温度が低いことから熱膨張性黒鉛が好ましい。
<Thermal expandable compound>
The heat-expandable compound is not particularly limited as long as it expands when heated, and examples thereof include vermiculite, kaolin, mica, and heat-expandable graphite. Among these, thermally expandable graphite is preferable because the expansion start temperature is low.
熱膨張性黒鉛とは、天然グラファイト、熱分解グラファイト等のグラファイト粉末を、硫酸や硝酸等の無機酸と、濃硝酸や過マンガン酸塩等の強酸化剤とを用いて表面処理したものであり、かつグラファイト層状構造を維持した結晶化合物である。これらは常圧下で膨張開始温度（２００℃程度）以上の温度に曝されると、１００倍以上に熱膨張する。なお、前記天然グラファイト、熱分解グラファイト等のグラファイト粉末は、脱酸処理を施したものや、更に中和処理したもの等であってもよい。 The heat-expandable graphite is a surface-treated graphite powder such as natural graphite and thermally decomposed graphite with an inorganic acid such as sulfuric acid and nitric acid and a strong oxidizing agent such as concentrated nitric acid and permanganate. , And a crystalline compound that maintains a graphite layered structure. When they are exposed to a temperature of the expansion start temperature (about 200 ° C.) or higher under normal pressure, they thermally expand 100 times or more. The graphite powder such as natural graphite and pyrolytic graphite may be deoxidized or further neutralized.
上記４成分の合計を１００質量％としたときの、熱膨張性化合物の割合は、０．５～５０質量％であって、１～３５質量％が好ましく、２～２０質量％がより好ましい。熱膨張性化合物の割合が小さすぎると、熱膨張性が不十分になる場合がある。熱膨張性化合物の割合が大きすぎると、熱膨張後の形状安定性が悪くなる場合がある。この割合は例えば、０．５、１．０、１．５、２．０、２．５、３．０、３．５、４．０、４．５、５、６、７、８、９、１０、１５、２０、２５、３０、３５、４０、４５、５０質量％であり、ここで例示した数値の何れか２つの間の範囲内であってもよい。 When the total of the above four components is 100% by mass, the ratio of the heat-expandable compound is 0.5 to 50% by mass, preferably 1 to 35% by mass, and more preferably 2 to 20% by mass. If the proportion of the heat-expandable compound is too small, the heat-expandability may be insufficient. If the proportion of the heat-expandable compound is too large, the shape stability after the heat expansion may deteriorate. This ratio is, for example, 0.5, 1.0, 1.5, 2.0, 2.5, 3.0, 3.5, 4.0, 4.5, 5, 6, 7, 8, 9 It is 10, 15, 20, 25, 30, 35, 40, 45, 50% by mass, and may be within the range between any two of the numerical values exemplified here.
＜無機リン系化合物＞
無機リン系化合物は、リン酸系化合物、亜リン酸系化合物、次亜リン酸系化合物、メタリン酸系化合物、ピロリン酸系化合物及びポリリン酸系化合物のうちの少なくとも１種を含む。パテ組成物が無機リン系化合物を含むことで、パテ組成物と金属との密着性が向上する。無機リン系化合物としては、無機リン系の金属塩又はアンモニウム塩が好ましい。金属塩の金属としては、アルミニウム、ナトリウム、カリウム、カルシウム、マグネシウム、亜鉛等が好ましい。
<Inorganic phosphorus compound>
The inorganic phosphorus-based compound includes at least one of a phosphoric acid-based compound, a phosphite-based compound, a hypophosphoric acid-based compound, a meta-phosphoric acid-based compound, a pyrophosphoric acid-based compound, and a polyphosphoric acid-based compound. When the putty composition contains an inorganic phosphorus compound, the adhesion between the putty composition and the metal is improved. As the inorganic phosphorus-based compound, an inorganic phosphorus-based metal salt or an ammonium salt is preferable. As the metal of the metal salt, aluminum, sodium, potassium, calcium, magnesium, zinc and the like are preferable.
リン酸系化合物としては、例えば、第１リン酸アルミニウム、第１リン酸ナトリウム、第１リン酸カリウム、第１リン酸カルシウム、第１リン酸亜鉛、第２リン酸アルミニウム、第２リン酸ナトリウム、第２リン酸カリウム、第２リン酸カルシウム、第２リン酸亜鉛、第３リン酸アルミニウム、第３リン酸ナトリウム、第３リン酸カリウム、第３リン酸カルシウム、第３リン酸亜鉛、第３リン酸マグネシウム、リン酸一アンモニウム、リン酸二アンモニウム、リン酸三カルシウム、リン酸アルミニウム等が挙げられる。 Examples of the phosphoric acid-based compound include first aluminum phosphate, first sodium phosphate, first potassium phosphate, first calcium phosphate, first zinc phosphate, second aluminum phosphate, second sodium phosphate, and the first. Potassium diphosphate, calcium dibasic phosphate, zinc dibasic phosphate, aluminum tertiary phosphate, sodium tertiary phosphate, potassium tertiary phosphate, calcium tertiary phosphate, zinc tertiary phosphate, magnesium tribasic phosphate, phosphorus Examples thereof include monoammonium acid, diammonium phosphate, tricalcium phosphate, and aluminum phosphate.
亜リン酸系化合物としては、例えば、亜リン酸アルミニウム、亜リン酸水素アルミニウム、亜リン酸ナトリウム、亜リン酸カリウム、亜リン酸カルシウム、亜リン酸亜鉛などが挙げられる。 Examples of the phosphite-based compound include aluminum phosphite, aluminum hydrogen phosphite, sodium phosphite, potassium phosphite, calcium phosphite, zinc phosphite and the like.
次亜リン酸系化合物としては、例えば、次亜リン酸アルミニウム、次亜リン酸ナトリウム、次亜リン酸カリウム、次亜リン酸カルシウム、次亜リン酸亜鉛などが挙げられる。 Examples of the hypophosphoric acid-based compound include aluminum hypophosphite, sodium hypophosphite, potassium hypophosphite, calcium hypophosphite, zinc hypophosphite and the like.
メタリン酸系化合物としては、例えば、メタリン酸アルミニウム、メタリン酸ナトリウム、メタリン酸カリウム、メタリン酸カルシウム、メタリン酸亜鉛、ヘキサメタリン酸ナトリウムなどが挙げられる。 Examples of the metaphosphate-based compound include aluminum metaphosphate, sodium metaphosphate, potassium metaphosphate, calcium metaphosphate, zinc metaphosphate, sodium hexametaphosphate and the like.
ピロリン酸系化合物としては、例えば、ピロリン酸ナトリウムが挙げられる。 Examples of the pyrophosphate compound include sodium pyrophosphate.
ポリリン酸系化合物としては、例えば、ポリリン酸アンモニウム、メラミン変性ポリリン酸アンモニウムなどが挙げられる。 Examples of the polyphosphoric acid-based compound include ammonium polyphosphate and melamine-modified ammonium polyphosphate.
この中で、亜リン酸水素アンモニウム、ポリリン酸アンモニウム、リン酸一アンモニウム、リン酸二アンモニウムが好ましく、無機リン酸系化合物は、これらのうちの少なくとも１種を含むことが好ましい。 Among these, ammonium hydrogenphosphite, ammonium polyphosphate, monoammonium phosphate, and diammonium phosphate are preferable, and the inorganic phosphoric acid-based compound preferably contains at least one of these.
上記４成分の合計を１００質量％としたときの、無機リン系化合物の割合は、１～９９質量％であって、２～４０質量％が好ましく、３～３５質量％がより好ましい。この割合が１質量％より小さいと形状保持性やアルミニウムへの密着性が悪くなる傾向がある。この割合は、例えば、１、２、３、４、５、６、７、８、９、１０、１５、２０、２５、３０、３５、４０、４５、５０、５５、６０、６５、７０、７５、８０、８５、９０、９５、９９質量％であり、ここで例示した数値の何れか２つの間の範囲内であってもよい。 When the total of the above four components is 100% by mass, the proportion of the inorganic phosphorus compound is 1 to 99% by mass, preferably 2 to 40% by mass, and more preferably 3 to 35% by mass. If this ratio is less than 1% by mass, the shape retention and the adhesion to aluminum tend to deteriorate. This ratio is, for example, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, It is 75, 80, 85, 90, 95, 99% by mass, and may be within the range between any two of the numerical values exemplified here.
＜無機リン系化合物以外のその他無機化合物＞
その他無機化合物は、無機リン系化合物以外の無機化合物である。その他無機化合物の形状は、特に限定されず、繊維状であっても粒子状であってもよく、例えば、球状、楕円球状、立方体状、直方体状、ランダム形状などが挙げられる。その他無機化合物は、中空であっても中実であってもよい。その他無機化合物の平均粒子径は、例えば１０～１０００μｍであり、２０～８００μｍが好ましく、３０～５００μｍがさらに好ましく、４０～２００μｍがさらに好ましい。「平均粒子径」は、レーザー回折・散乱法によって求めた粒度分布における積算値５０％での粒径を意味する。
<Other inorganic compounds other than inorganic phosphorus compounds>
Other inorganic compounds are inorganic compounds other than inorganic phosphorus compounds. The shape of the other inorganic compound is not particularly limited and may be fibrous or particulate, and examples thereof include a spherical shape, an elliptical spherical shape, a cubic shape, a rectangular parallelepiped shape, and a random shape. The other inorganic compound may be hollow or solid. The average particle size of the other inorganic compound is, for example, 10 to 1000 μm, preferably 20 to 800 μm, more preferably 30 to 500 μm, still more preferably 40 to 200 μm. The "average particle size" means the particle size at an integrated value of 50% in the particle size distribution obtained by the laser diffraction / scattering method.
その他無機化合物としては、例えば、アルミナ、シリカ、アルミノシリケート、酸化亜鉛、酸化チタン、酸化カルシウム、酸化マグネシウム、酸化鉄、酸化錫、酸化アンチモン、亜リン酸アルミニウム、水酸化アルミニウム、フェライト類等の金属酸化物；水酸化カルシウム、水酸化マグネシウム、水酸化アルミニウム、ハイドロタルサイト等の含水無機物；塩基性炭酸マグネシウム、炭酸カルシウム、炭酸マグネシウム、炭酸亜鉛、炭酸ストロンチウム、炭酸バリウム等の金属炭酸塩；硫酸カルシウム、けい酸カルシウム等のカルシウム塩；珪藻土、ドーソナイト、硫酸バリウム、タルク、クレー、マイカ、モンモリロナイト、ベントナイト、活性白土、セピオライト、イモゴライト、セリサイト、ガラスビーズ、シリカ系バルン、窒化アルミニウム、窒化ホウ素、窒化けい素、カーボンブラック、グラファイト、炭素バルン、木炭粉末、各種金属粉、チタン酸カリウム、硫酸マグネシウム、チタン酸ジルコン酸鉛、アルミニウムボレート、硫化モリブデン、炭化けい素、ホウ酸亜鉛、各種磁性粉、フライアッシュ、無機中空フィラー、パーライト、黒曜岩、真珠岩、松脂岩、珪藻土、脱水汚泥、ホウ素、四ホウ酸ナトリウム水和物（ホウ砂）などが挙げられる。 Examples of other inorganic compounds include metals such as alumina, silica, aluminosilicate, zinc oxide, titanium oxide, calcium oxide, magnesium oxide, iron oxide, tin oxide, antimony oxide, aluminum phosphite, aluminum hydroxide, and ferrites. Oxides; Hydroinorganic substances such as calcium hydroxide, magnesium hydroxide, aluminum hydroxide, hydrotalcite; Metallic carbonates such as basic magnesium carbonate, calcium carbonate, magnesium carbonate, zinc carbonate, strontium carbonate, barium carbonate; calcium sulfate , Calcium salts such as calcium silicate; diatomaceous soil, dosonite, barium sulfate, talc, clay, mica, montmorillonite, bentonite, active white clay, sepiolite, imogolite, sericite, glass beads, silica-based balun, aluminum nitride, boron nitride, nitride. Silica, carbon black, graphite, carbon balun, charcoal powder, various metal powders, potassium titanate, magnesium sulfate, lead zirconate titanate, aluminum borate, molybdenum sulfide, silica carbide, zinc borate, various magnetic powders, frying Examples include ash, inorganic hollow filler, pearlite, black rock, pearl rock, pine algae, diatomaceous soil, dehydrated sludge, boron, sodium tetraborate hydrate (hosago) and the like.
上記４成分の合計を１００質量％としたときのその他無機化合物の割合は、０～９２．５質量％であって、２８～９１質量％が好ましく、５５～９０質量％がより好ましい。その他無機化合物の割合が高すぎると、非付着性が不十分になる場合がある。この割合は、例えば、０、０．５、１、２、３、４、５、６、７、８、９、１０、１５、２０、２５、３０、３５、４０、４５、５０、５５、６０、６５、７０、７５、８０、８５、９０、９２．５質量％であり、ここで例示した数値の何れか２つの間の範囲内であってもよい。 When the total of the above four components is 100% by mass, the ratio of other inorganic compounds is 0 to 92.5% by mass, preferably 28 to 91% by mass, and more preferably 55 to 90% by mass. If the proportion of other inorganic compounds is too high, the non-adhesiveness may be insufficient. This ratio is, for example, 0, 0.5, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, It is 60, 65, 70, 75, 80, 85, 90, 92.5% by mass, and may be in the range between any two of the numerical values exemplified here.
上記４成分の合計を１００質量％としたときの、全無機化合物の割合（つまり、無機リン系化合物の割合とその他無機化合物の割合の合計）は、例えば、１～９９質量％であり、具体的には、１、２、３、４、５、６、７、８、９、１０、１５、２０、２５、３０、３５、４０、４５、５０、５５、６０、６５、７０、７５、８０、８５、９０、９５、９９質量％であり、ここで例示した数値の何れか２つの間の範囲内であってもよい。 When the total of the above four components is 100% by mass, the ratio of all inorganic compounds (that is, the total of the ratio of inorganic phosphorus compounds and the ratio of other inorganic compounds) is, for example, 1 to 99% by mass. In terms of 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, It is 80, 85, 90, 95, 99% by mass, and may be within the range between any two of the numerical values exemplified here.
全無機化合物中の無機リン系化合物の割合(質量％)は、例えば、１～１００質量％であり、具体的には、１、２、３、４、５、６、７、８、９、１０、１５、２０、２５、３０、３５、４０、４５、５０、５５、６０、６５、７０、７５、８０、８５、９０、９５、１００質量％であり、ここで例示した数値の何れか２つの間の範囲内であってもよい。 The proportion (mass%) of the inorganic phosphorus-based compound in the total inorganic compounds is, for example, 1 to 100% by mass, specifically 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100% by mass, and any of the numerical values exemplified here. It may be within the range between the two.
その他、物性の損なわれない程度で酸化防止剤、軟化剤、粘着付与剤、凍結防止剤等の添加剤を適宜添加できる。 In addition, additives such as antioxidants, softeners, tackifiers, and antifreeze agents can be appropriately added to the extent that the physical properties are not impaired.
本発明のパテ組成物は、建築物内の配管類・ケーブル類と防火壁等との間の隙間をふさぐ際には、その作業を容易にする観点から、水を含有することが好ましい。パテ組成物が水を含有する場合、水以外の固形分の割合は、３０～７０質量％であることが好ましく、３５～６５質量％であることがより好ましい。水の割合が小さい（固形分の含有量が多い）と、ボソボソになりパテとして作業性が悪い場合がある。水の割合が大きい（固形分の含有量が少ない）と、柔らかすぎてパテとしての形状を保てない場合がある。 The putty composition of the present invention preferably contains water from the viewpoint of facilitating the work when closing the gap between the pipes / cables in the building and the fire wall or the like. When the putty composition contains water, the proportion of solids other than water is preferably 30 to 70% by mass, more preferably 35 to 65% by mass. If the proportion of water is small (the content of solid content is high), it may become lumpy and workability may be poor as a putty. If the proportion of water is large (the content of solid content is low), it may be too soft to maintain its shape as a putty.
本発明のパテ組成物の固形分中の上記４成分の割合は、例えば５０～１００質量％であり、８０～１００質量％が好ましい。この割合は、例えば、５０、６０、７０、８０、９０、１００質量％であり、ここで例示した数値の何れか２つの間の範囲内であってもよい。 The ratio of the above four components to the solid content of the putty composition of the present invention is, for example, 50 to 100% by mass, preferably 80 to 100% by mass. This ratio is, for example, 50, 60, 70, 80, 90, 100% by mass, and may be in the range between any two of the numerical values exemplified here.
本発明のパテ組成物は、建築物内の配管類・ケーブル類と防火壁等との間の隙間をふさぐ目地材に用いることができる。 The putty composition of the present invention can be used as a joint material for closing a gap between pipes / cables in a building and a fire wall or the like.
２．熱膨張性パテ組成物の製造方法
本発明のパテ組成物は、ミキサーなどを用いて、上記４成分、必要に応じて添加剤、及び水を混合・撹拌することによって製造することができる。
2. 2. Method for Producing Thermally Expandable Putty Composition The putty composition of the present invention can be produced by mixing and stirring the above four components, if necessary, additives and water using a mixer or the like.
１．熱膨張性パテ組成物の作製
表１～表５に示す各成分を当該表中の組成（単位は質量％）に従って、ミキサーを用いて混合・撹拌して、実施例・比較例のパテ組成物を作製した。
1. 1. Preparation of heat-expandable putty composition Each component shown in Tables 1 to 5 is mixed and stirred using a mixer according to the composition in the table (unit is mass%), and putty compositions of Examples and Comparative Examples are used. Was produced.
表中の成分の詳細は、以下の通りである。
＜有機バインダ＞
・カルボキシメチルセルロースナトリウム：林純薬工業(株)製
・カルボキシメチルセルロースアンモニウム：ニチリン化学工業(株)製
・変性ポリアクリル系架橋物：(株)日本触媒製、アクアリックＣＳ６Ｓ
The details of the components in the table are as follows.
<Organic binder>
・ Sodium carboxymethyl cellulose: manufactured by Hayashi Junyaku Kogyo Co., Ltd. ・ Ammonium carboxymethyl cellulose: manufactured by Nichirin Chemical Industry Co., Ltd. ・ Modified polyacrylic crosslinked product: Nippon Shokubai Co., Ltd., Aquaric CS6S
＜熱膨張性化合物＞
・熱膨張性黒鉛：エア・ウオーター・ケミカル（株）製、ＳＳ－３
<Thermal expandable compound>
-Thermal expandable graphite: Air Water Chemical Co., Ltd., SS-3
＜無機リン系化合物＞
・亜リン酸水素アルミニウム：太平化学産業（株）製、ＮＳＦ
・ポリリン酸アンモニウム：ＳＣＭ Ｉｎｄｕｓｔｒｉａｌ Ｃｈｅｍｉｃａｌ Ｃｏ．，Ｌｔｄ．製、ＨＰ－ＡＰＰ II
・第１リン酸ナトリウム：純正化学（株）製
・第２リン酸ナトリウム：純正化学（株）製
・亜リン酸ナトリウム：米山化学工業（株）製
・次亜リン酸ナトリウム：米山化学工業（株）製
・リン酸一アンモニウム：米山化学工業（株）製
・リン酸二アンモニウム：米山化学工業（株）製
・ヘキサメタリン酸ナトリウム：米山薬品工業（株）製
・ピロリン酸ナトリウム：純正化学（株）製
＜その他無機化合物（無機リン系化合物以外の無機化合物）＞
・水酸化アルミニウム：住友化学（株）製、Ｃ－３０１Ｎ
<Inorganic phosphorus compound>
-Aluminum hydrogen phosphite: manufactured by Taihei Kagaku Sangyo Co., Ltd., NSF
-Ammonium polyphosphate: SCM Industrial Chemical Co., Ltd. , Ltd. Made by HP-APP II
・ 1st sodium phosphate: manufactured by Genuine Chemical Co., Ltd. ・ 2nd sodium phosphate: manufactured by Genuine Chemical Co., Ltd. ・ Sodium phosphite: manufactured by Yoneyama Chemical Industry Co., Ltd. ・ Sodium hypophosphite: manufactured by Yoneyama Chemical Industry Co., Ltd. ( Monoammonium Phosphate: Yoneyama Chemical Industry Co., Ltd. ・ Diammonium Phosphate: Yoneyama Chemical Industry Co., Ltd. ・ Sodium hexametaphosphate: Yoneyama Pharmaceutical Co., Ltd. ) <Other inorganic compounds (inorganic compounds other than inorganic phosphorus compounds)>
-Aluminum hydroxide: manufactured by Sumitomo Chemical Co., Ltd., C-301N
２．各種評価
実施例・比較例のパテ組成物について、以下に示す各種評価を行った。その結果を表１～表５に示す。表に示すように、全ての実施例では、アルミガラスクロスに対する密着性と熱膨張性の評価項目において良好な結果が得られた。一方、全ての比較例では、アルミガラスクロスに対する密着性と熱膨張性の一方又は両方での結果が悪かった。
2. 2. Various evaluations The putty compositions of Examples and Comparative Examples were evaluated as shown below. The results are shown in Tables 1 to 5. As shown in the table, in all the examples, good results were obtained in the evaluation items of the adhesion to the aluminum glass cloth and the thermal expansion property. On the other hand, in all the comparative examples, the results of adhesion to the aluminum glass cloth and / or thermal expansion were poor.
・加工性
乾燥前のパテ組成物をＪＩＳ Ａ５７５２に準拠し荷重１５０ｇ、温度２１℃において軟度の測定を行った。規定の円錐を試験片に垂直に貫入させ、その貫入深さを０．１ｍｍ単位で測定した。そして、貫入深さに基づいて、加工性を以下の基準で判定した。
◎：１２０［１／１０ｍｍ］以上２００未満［１／１０ｍｍ］
○：７０［１／１０ｍｍ］以上１２０［１／１０ｍｍ］未満、又は、２００［１／１０ｍｍ］以上２３０［１／１０ｍｍ］未満
×：７０［１／１０ｍｍ］未満、又は、２３０［１／１０ｍｍ］以上
-Workability The softness of the putty composition before drying was measured at a load of 150 g and a temperature of 21 ° C. in accordance with JIS A5752. The specified cone was penetrated vertically into the test piece, and the penetration depth was measured in units of 0.1 mm. Then, based on the penetration depth, the workability was determined according to the following criteria.
⊚: 120 [1/10 mm] or more and less than 200 [1/10 mm]
◯: 70 [1/10 mm] or more and less than 120 [1/10 mm], or 200 [1/10 mm] or more and less than 230 [1/10 mm] ×: 70 [1/10 mm] or less, or 230 [1/10 mm] ]that's all
・非付着性
ラテックスゴム手袋を装着し、パテを１０回握った後の手袋の付着物の重量を測定し、以下の式に基づいて付着物重量を算出した。そして、付着物重量に基づいて、非付着性を以下の基準で判定した。
付着物重量（ｇ）＝（パテを１０回握った後の手袋の重量）－（元の手袋の重量）
◎：０．２０［ｇ］未満
○：０．２０［ｇ］以上０．５０［ｇ］未満
×：０．５０［ｇ］以上
-The weight of the deposits on the gloves was measured after wearing the non-adhesive latex rubber gloves and holding the putty 10 times, and the weight of the deposits was calculated based on the following formula. Then, based on the weight of the deposit, the non-adhesiveness was determined according to the following criteria.
Adhesive weight (g) = (weight of gloves after gripping putty 10 times)-(weight of original gloves)
⊚: less than 0.20 [g] ○: 0.20 [g] or more and less than 0.50 [g] ×: 0.50 [g] or more
・対アルミガラスクロス密着性
アルミガラスクロスを２０ｍｍ幅×２０ｃｍ長さの短冊状に切断し、そのアルミ面に乾燥前のパテ組成物を塗り、その上に固定用のＳＵＳ板を貼り付ける。これを１１０℃・２４時間の条件で乾燥させた後にアルミガラスクロスを３００ｍｍ／分の速度で１８０度方向に剥離し、剥離力を測定した。ここで、剥離力が大きいほど、アルミガラスクロスに対する密着性が高いことを示す。そして、剥離力に基づいて、対アルミガラスクロス密着性を以下の基準で判定した。
◎：０．５［Ｎ／２０ｍｍ］以上
○：０．３［Ｎ／２０ｍｍ］以上０．５［Ｎ／２０ｍｍ］未満
×：０．３［Ｎ／２０ｍｍ］未満
-Adhesion to aluminum glass cloth Cut the aluminum glass cloth into strips with a width of 20 mm and a length of 20 cm, apply the putty composition before drying to the aluminum surface, and attach a SUS plate for fixing on it. After drying this at 110 ° C. for 24 hours, the aluminum glass cloth was peeled off at a speed of 300 mm / min in the 180 degree direction, and the peeling force was measured. Here, it is shown that the larger the peeling force is, the higher the adhesion to the aluminum glass cloth is. Then, based on the peeling force, the adhesiveness to the aluminum glass cloth was determined according to the following criteria.
⊚: 0.5 [N / 20 mm] or more ○: 0.3 [N / 20 mm] or more and less than 0.5 [N / 20 mm] ×: 0.3 [N / 20 mm] or less
・熱膨張性
実施例・比較例のパテ組成物を用いて、縦３０ｍｍ×横３０ｍｍ×厚み４ｍｍの試験片を作製し、これを１１０℃・２４時間の条件で乾燥させた。そして、乾燥後の試験片を３００℃で保持された雰囲気内に０．５時間放置した後の体積を測定し、その体積から膨張倍率を算出した。そして、体積膨張倍率に基づいて、熱膨張性を以下の基準で判定した。
◎：２．０倍以上
○：１．５倍以上、２．０倍未満
×：１．５倍未満
-Thermal expandability Using the putty compositions of Examples and Comparative Examples, test pieces having a length of 30 mm, a width of 30 mm and a thickness of 4 mm were prepared, and dried at 110 ° C. for 24 hours. Then, the volume of the dried test piece after being left in an atmosphere maintained at 300 ° C. for 0.5 hours was measured, and the expansion ratio was calculated from the volume. Then, based on the coefficient of thermal expansion, the thermal expandability was determined according to the following criteria.
⊚: 2.0 times or more ○: 1.5 times or more, less than 2.0 times ×: less than 1.5 times
・乾燥後の形状安定性
実施例・比較例のパテ組成物を用いて、縦３０ｍｍ×横３０ｍｍ×厚み４ｍｍの試験片を作製し、これを１１０℃・２４時間の条件で乾燥させた。その試験片を３点曲げ試験治具（上部押し側先端Ｒ１ｍｍおよび幅８０ｍｍ、下部２点支点側Ｒ１ｍｍ、幅８０ｍｍ、支点間距離２０ｍｍ）を用い、試験片を圧縮速度５０ｍｍ／ｍｉｎの条件にて破壊した際の強度（３点曲げ破壊強度）を測定し、試験片の断面積で除した。ここで、３点曲げ破壊強度が大きいほど、乾燥後の形状安定性が高いことを示す。そして、３点曲げ破壊強度に基づいて、乾燥後の形状安定性を以下の基準で判定した。
◎：７００［Ｎ／ｍｍ２］以上
○：５００［Ｎ／ｍｍ２］以上、７００［Ｎ／ｍｍ２］未満
×：５００［Ｎ／ｍｍ２］未満
-Shape stability after drying Using the putty compositions of Examples and Comparative Examples, test pieces having a length of 30 mm, a width of 30 mm, and a thickness of 4 mm were prepared, and dried at 110 ° C. for 24 hours. Using a 3-point bending test jig (upper push side tip R1 mm and width 80 mm, lower 2 point fulcrum side R1 mm, width 80 mm, distance between fulcrums 20 mm), the test piece was placed under the condition of compression speed of 50 mm / min. The strength at the time of fracture (three-point bending fracture strength) was measured and divided by the cross-sectional area of the test piece. Here, it is shown that the larger the three-point bending fracture strength, the higher the shape stability after drying. Then, based on the three-point bending fracture strength, the shape stability after drying was determined according to the following criteria.
⊚: 700 [N / mm 2 ] or more ○: 500 [N / mm 2 ] or more, less than 700 [N / mm 2 ] ×: less than 500 [N / mm 2 ]
・熱膨張後の形状安定性
実施例・比較例のパテ組成物を用いて、縦３０ｍｍ×横３０ｍｍ×厚み４ｍｍの試験片を作製し、これを１１０℃・２４時間の条件で乾燥させた。乾燥後の試験片を３００℃で保持された雰囲気内に０．５時間放置した後、３点曲げ試験治具（上部押し側先端Ｒ１ｍｍおよび幅８０ｍｍ、下部２点支点側Ｒ１ｍｍ、幅８０ｍｍ、支点間距離２０ｍｍ）を用い、試験片を圧縮速度５０ｍｍ／ｍｉｎの条件にて破壊した際の強度（３点曲げ破壊強度）を測定した。ここで、３点曲げ破壊強度が大きいほど、熱膨張後の強度が高いことを示す。そして、３点曲げ破壊強度に基づいて、熱膨張後の形状安定性を以下の基準で判定した。
◎：２．０［Ｎ／ｍｍ２］以上
○：１．０［Ｎ／ｍｍ２］以上、２．０［Ｎ／ｍｍ２］未満
×：１．０［Ｎ／ｍｍ２］未満
-Shape stability after thermal expansion Using the putty compositions of Examples and Comparative Examples, test pieces having a length of 30 mm, a width of 30 mm, and a thickness of 4 mm were prepared, and dried at 110 ° C. for 24 hours. After the dried test piece was left in an atmosphere held at 300 ° C. for 0.5 hours, a 3-point bending test jig (upper push side tip R1 mm and width 80 mm, lower 2 point fulcrum side R1 mm, width 80 mm, fulcrum) Using a distance of 20 mm), the strength (three-point bending fracture strength) when the test piece was fractured under the condition of a compression speed of 50 mm / min was measured. Here, it is shown that the larger the three-point bending fracture strength is, the higher the strength after thermal expansion is. Then, based on the three-point bending fracture strength, the shape stability after thermal expansion was determined according to the following criteria.
⊚: 2.0 [N / mm 2 ] or more ○: 1.0 [N / mm 2 ] or more, less than 2.0 [N / mm 2 ] ×: less than 1.0 [N / mm 2 ]
Claims (4)
前記有機バインダ、前記熱膨張性化合物、前記無機リン系化合物、前記その他無機化合物の４成分の合計を１００質量％としたときの各成分の割合が、前記有機バインダ０．５～２０質量％、前記熱膨張性化合物０．５～５０質量％、前記無機リン系化合物１～９９質量％、前記その他無機化合物０～９２．５質量％を含有し、
前記無機リン系化合物が、リン酸系化合物、亜リン酸系化合物、次亜リン酸系化合物、メタリン酸系化合物、ピロリン酸系化合物及びポリリン酸系化合物のうちの少なくとも１種を含む、熱膨張性パテ組成物。 A heat-expandable putty composition containing an organic binder, a heat-expandable compound, an inorganic phosphorus-based compound, and other inorganic compounds other than the inorganic phosphorus-based compound.
When the total of the four components of the organic binder, the heat-expandable compound, the inorganic phosphorus-based compound, and the other inorganic compound is 100% by mass, the ratio of each component is 0.5 to 20% by mass of the organic binder. It contains 0.5 to 50% by mass of the heat-expandable compound, 1 to 99% by mass of the inorganic phosphorus-based compound, and 0 to 92.5% by mass of the other inorganic compound.
The inorganic phosphorus-based compound contains at least one of a phosphoric acid-based compound, a phosphite-based compound, a hypophosphoric acid-based compound, a metaphosphoric acid-based compound, a pyrophosphoric acid-based compound, and a polyphosphoric acid-based compound, and thermally expands. Sex putty composition.
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