JP2022056866A - Polyimide, polyimide solution, polyimide film, adhesive film, laminate, coverlay film, copper foil with resin, metal-clad laminate, circuit board, and multilayer circuit board - Google Patents

Abstract

To further improve dielectric characteristics and more effectively reduce a transfer loss of a high-frequency signal, in an adhesive layer using polyimide using aliphatic diamine as a raw material.SOLUTION: Polyimide satisfies the following a) to c): a) containing a tetracarboxylic acid residue containing a fluorine atom and/or a diamine residue containing a fluorine atom, and having the total content of the fluorine atom with respect to the total content of the total atoms in the polyimide of 1 wt.% or more and 20 wt.% or less; b) containing 40 mol% or more of the diamine residue derived from aliphatic diamine with respect to the total diamine residues; and c) being thermoplastic polyimide.SELECTED DRAWING: None

Description

The present invention relates to a polyimide useful as a material for electronic components, an adhesive film using the polyimide, a laminate, a coverlay film, a copper foil with resin, a metal-clad laminate, a circuit board, and a multilayer circuit board.

In recent years, with the progress of miniaturization, weight reduction, and space saving of electronic devices, a flexible printed wiring board (FPC) that is thin and lightweight, has flexibility, and has excellent durability even after repeated bending. The demand for Circuits) is increasing. Since FPC can be mounted three-dimensionally and at high density even in a limited space, its use is expanded to, for example, wiring of moving parts of electronic devices such as HDDs, DVDs, and smartphones, and parts such as cables and connectors. I'm doing it.

As one aspect of FPC, there is a structure in which a circuit pattern is formed on a polyimide film having excellent heat resistance and flexibility, and a coverlay film having an adhesive layer is bonded to the surface thereof. Polyimide is used as the material of the adhesive layer of the coverlay film having such a structure. For example, a crosslinked polyimide obtained by reacting a polyimide made from an aliphatic diamine compound derived from dimer acid and an amino compound having at least two primary amino groups as functional groups can be obtained from a coverlay film. It has been proposed to be applied to an adhesive layer (for example, Patent Document 1).

Further, in a three-layer metal-clad laminate in which a metal layer to be wired and an insulating resin layer are bonded via an adhesive layer, which is a metal-clad laminate used as a material for a circuit board such as an FPC, an adhesive is used. A polyimide containing a predetermined amount or more of an aliphatic diamine residue derived from a diamine diamine in which the two terminal carboxylic acid groups of the dimer acid are replaced with a primary aminomethyl group or an amino group can be applied to the layer. It has been proposed (eg, Patent Document 2).

By the way, in addition to the above-mentioned high density, the high performance of the equipment has been advanced, so that it is also necessary to cope with the high frequency of the transmission signal. When transmitting a high-frequency signal, if the transmission loss in the transmission path is large, inconveniences such as loss of electric signal and long delay time of the signal occur. Therefore, it will be important to reduce transmission loss in FPC in the future. Therefore, in a circuit board provided with a polyimide insulating layer, a circuit wiring layer laminated on at least one surface thereof, and a coverlay film laminated on the circuit wiring layer, the thickness of the polyimide insulating layer and the coverlay film is increased. , It has been proposed to consider the relationship between the relative permittivity and the dielectric tangent (for example, Patent Document 3).

Japanese Unexamined Patent Publication No. 2013-1730 Japanese Unexamined Patent Publication No. 2018-140544 Japanese Unexamined Patent Publication No. 2016-192531

The adhesive layer using polyimide made from an aliphatic diamine as in Patent Documents 1 and 2 exhibits excellent adhesiveness, low relative permittivity, and dielectric loss tangent, but it can cope with high frequency transmission signals. Therefore, further improvement of the dielectric property is required.

Therefore, an object of the present invention is to further improve the dielectric property of the adhesive layer using polyimide made of an aliphatic diamine as a raw material, and to more effectively reduce the transmission loss of a high frequency signal.

As a result of diligent research, the present inventors have noticeably improved the dielectric properties of polyimide by introducing residues having fluorine atoms into polyimide using an aliphatic diamine as a raw material and controlling the content of fluorine atoms. We found that it could be improved and completed the present invention.

The polyimide of the present invention is a polyimide containing a tetracarboxylic acid residue derived from a tetracarboxylic acid anhydride component and a diamine residue derived from a diamine component. The polyimide of the present invention has the following conditions a to c;
a) A tetracarboxylic acid residue containing a fluorine atom and / or a diamine residue containing a fluorine atom is contained, and the total content of the fluorine atom with respect to the total content of all the atoms in the polyimide is 1% by weight or more 20. Must be in the range of% by weight or less;
b) Contains 40 mol% or more of diamine residues derived from aliphatic diamines with respect to all diamine residues;
c) Being a thermoplastic polyimide;
It is characterized by satisfying.

The polyimide of the present invention may be a diamine diamine composition containing dimer diamine as a main component, wherein the aliphatic diamine is composed of a primary aminomethyl group or an amino group in which two terminal carboxylic acid groups of dimer acid are substituted. good.

The polyimide of the present invention may have a weight average molecular weight in the range of 5,000 to 200,000.

In the polyimide of the present invention, the content of carbon atoms derived from a 6-membered aromatic ring (excluding the carbon atoms of the 6-membered aromatic ring derived from the dimerdiamine composition) with respect to the total content of all atoms in the polyimide is 12 to 40. It may be in the range of% by weight.

The polyimide of the present invention has the following mathematical formula (i),
CM value = (C / Mw) x 10 ⁴ ... (i)
[In the formula, C means the weight content of the carbon atom derived from the 6-membered aromatic ring (excluding the carbon atom of the 6-membered aromatic ring derived from the dimerdiamine composition) with respect to the total content of all the atoms in the polyimide. Mw means the weight average molecular weight of polyimide]
The CM value, which is an index indicating the amount of the 6-membered aromatic ring contained in the polyimide, calculated based on the above, may be in the range of 3 to 38.

The polyimide solution of the present invention contains any of the above-mentioned polyimides and a solvent capable of dissolving the polyimide.

The polyimide film of the present invention is a polyimide film containing a polyimide containing a tetracarboxylic acid residue derived from a tetracarboxylic acid anhydride component and a diamine residue derived from a diamine component as a resin component. In the polyimide film of the present invention, the polyimide contains a tetracarboxylic acid residue containing a fluorine atom and / or a diamine residue containing a fluorine atom, and the polyimide has the above-mentioned relative to the total content of all atoms in the polyimide. The total content of fluorine atoms is in the range of 1% by weight or more and 20% by weight or less.
The polyimide film of the present invention has a dielectric loss tangent (Tanδ) at 10 GHz measured by a split post dielectric resonator (SPDR) after humidity control for 24 hours under a constant temperature and humidity condition (normal condition) of 23 ° C. and 50% RH. May be less than 0.002.

In the polyimide film of the present invention, the polyimide may contain 40 mol% or more of diamine residues derived from an aliphatic diamine with respect to all diamine residues.

The polyimide film of the present invention is a dimerdiamine composition containing dimerdiamine as a main component, wherein the aliphatic diamine is composed of two terminal carboxylic acid groups of dimer acid substituted with a primary aminomethyl group or an amino group. May be good.

The polyimide film of the present invention may have a weight average molecular weight of the polyimide in the range of 5,000 to 200,000.

The polyimide film of the present invention has a content of carbon atoms derived from a 6-membered aromatic ring (excluding carbon atoms of a 6-membered aromatic ring derived from a dimerdiamine composition) with respect to the total content of all atoms in the polyimide. It may be in the range of ~ 40% by weight.

The polyimide film of the present invention has the following mathematical formula (i),
CM value = (C / Mw) x 10 ⁴ ... (i)
[In the formula, C means the weight content of the carbon atom derived from the 6-membered aromatic ring (excluding the carbon atom of the 6-membered aromatic ring derived from the dimerdiamine composition) with respect to the total content of all the atoms in the polyimide. Mw means the weight average molecular weight of polyimide]
The CM value, which is an index indicating the amount of the 6-membered aromatic ring contained in the polyimide, calculated based on the above, may be in the range of 3 to 38.

The adhesive film of the present invention comprises the above-mentioned polyimide film.

The laminate of the present invention is a laminate having a base material and an adhesive layer laminated on at least one surface of the base material, and the adhesive layer is made of the adhesive film. It is a feature.

The coverlay film of the present invention is a coverlay film having a coverlay film material layer and an adhesive layer laminated on the coverlay film material layer, and the adhesive layer is the adhesive film. It is characterized by being composed of.

The copper foil with resin of the present invention is a copper foil with resin in which an adhesive layer and a copper foil are laminated, and the adhesive layer is made of the adhesive film.

The metal-clad laminate of the present invention is a metal-clad laminate having an insulating resin layer and a metal layer laminated on at least one surface of the insulating resin layer, and at least one layer of the insulating resin layer is It is characterized by being made of the above-mentioned adhesive film.

The metal-clad laminate of the present invention includes an insulating resin layer, an adhesive layer laminated on at least one surface of the insulating resin layer, and a metal layer laminated on the insulating resin layer via the adhesive layer. The adhesive layer is made of the adhesive film.

The metal-clad laminate of the present invention is a first single-sided metal-clad laminate having a first metal layer and a first insulating resin layer laminated on at least one surface of the first metal layer. ,
A second single-sided metal-clad laminate having a second metal layer and a second insulating resin layer laminated on at least one surface of the second metal layer.
It was arranged so as to be in contact with the first insulating resin layer and the second insulating resin layer, and was laminated between the first single-sided metal-clad laminate and the second single-sided metal-clad laminate. A metal-clad laminate with an adhesive layer,
The adhesive layer is characterized by being made of the adhesive film.

The metal-clad laminate of the present invention has a single-sided metal-clad laminate having an insulating resin layer and a metal layer laminated on one surface of the insulating resin layer, and is laminated on the other surface of the insulating resin layer. It is characterized in that the adhesive layer is provided with the adhesive layer, and the adhesive layer is made of the adhesive film.

The circuit board of the present invention is formed by wiring processing the metal layer of the metal-clad laminate.

The circuit board of the present invention has a first base material, a wiring layer laminated on at least one surface of the first base material, and the wiring layer on the surface of the first base material on the side of the wiring layer. A circuit board comprising an adhesive layer laminated so as to cover the adhesive layer, wherein the adhesive layer is made of the adhesive film.

The circuit board of the present invention has a first base material, a wiring layer laminated on at least one surface of the first base material, and the wiring layer on the surface of the first base material on the side of the wiring layer. A circuit board comprising an adhesive layer laminated so as to cover the adhesive layer and a second base material laminated on a surface of the adhesive layer opposite to the first base material. The adhesive layer is characterized by being made of the above-mentioned adhesive film.

The circuit board of the present invention has a first base material, an adhesive layer laminated on at least one surface of the first base material, and an adhesive layer on the opposite side of the first base material. A circuit board comprising a second base material laminated on a surface and a wiring layer laminated on a surface of the first base material and the second base material opposite to the adhesive layer. The adhesive layer is made of the adhesive film.

The multilayer circuit board of the present invention is a multilayer circuit board including a laminate including a plurality of laminated insulating resin layers and at least one or more wiring layers embedded inside the laminate.
At least one layer or more of the plurality of insulating resin layers is formed of an adhesive layer having adhesiveness and covering the wiring layer, and the adhesive layer is characterized by being made of the adhesive film. do.

Since the amount of fluorine atoms contained in the polyimide made from an aliphatic diamine is controlled in the polyimide of the present invention, by forming this into a film, the dielectric loss tangent is remarkable while having excellent adhesiveness. Can form a low polyimide film.
Therefore, the polyimide film of the present invention can effectively reduce the transmission loss in high-frequency signal transmission when applied to a circuit board or the like that transmits a high-frequency signal having a frequency in the GHz band (for example, 1 to 20 GHz). Become.

It is a schematic diagram which shows the structure of the cross section of the laminated body which concerns on embodiment of this invention. It is a schematic diagram which shows the structure of the cross section of the metal-clad laminated board which concerns on embodiment of this invention. It is a schematic diagram which shows the structure of the cross section of the metal-clad laminated board which concerns on another embodiment of this invention. It is a schematic diagram which shows the structure of the cross section of the metal-clad laminated board which concerns on still another Embodiment of this invention. It is a schematic diagram which shows the structure of the cross section of the circuit board which concerns on embodiment of this invention. It is a schematic diagram which shows the structure of the cross section of the circuit board which concerns on another Embodiment of this invention. It is a schematic diagram which shows the structure of the cross section of the circuit board which concerns on still another Embodiment of this invention. It is a schematic diagram which shows the structure of the cross section of the multilayer circuit board which concerns on embodiment of this invention.

Embodiments of the present invention will be described with reference to the drawings as appropriate.

The polyimide according to the embodiment of the present invention is a polyimide having adhesiveness. Hereinafter, the polyimide of the present embodiment may be referred to as "adhesive polyimide". The adhesive polyimide contains a tetracarboxylic acid residue derived from the tetracarboxylic acid anhydride component and a diamine residue derived from the diamine component. In the present invention, the "tetracarboxylic acid residue" represents a tetravalent group derived from tetracarboxylic acid dianhydride, and the "diamine residue" is a divalent group derived from a diamine compound. Represents a group. When the tetracarboxylic acid anhydride and the diamine compound, which are the raw materials, are reacted in approximately equimolar amounts, the types of the tetracarboxylic acid residues and the diamine residues contained in the polyimide are determined with respect to the type and molar ratio of the raw materials. The molar ratio can be almost made to correspond.
The term "polyimide" in the present invention means a resin composed of a polymer having an imide group in its molecular structure, such as polyamideimide, polyetherimide, polyesterimide, polysiloxaneimide, and polybenzimidazoleimide, in addition to polyimide. ..

The adhesive polyimide is a polyimide containing a tetracarboxylic acid residue derived from the tetracarboxylic acid anhydride component and a diamine residue derived from the diamine component, and satisfies the following conditions a to c.

a) A tetracarboxylic acid residue containing a fluorine atom (fluorine-containing tetracarboxylic acid residue) and / or a diamine residue containing a fluorine atom (fluorine-containing diamine residue), and the total number of all atoms in the polyimide. The total content of the fluorine atoms with respect to the content is 1% by weight or more and 20% by weight or less.
By containing the fluorine-containing tetracarboxylic acid residue and / or the fluorine-containing diamine residue, the adhesive polyimide has a total content of fluorine atoms of 1% by weight or more with respect to the total content of all atoms in the adhesive polyimide. It is controlled within the range of 20% by weight or less, preferably within the range of 1% by weight or more and 15% by weight or less, and more preferably within the range of 1% by weight or more and 12% by weight or less. If the total content of fluorine atoms is less than 1% by weight, the effect of lowering the dielectric loss tangent cannot be obtained, and if it exceeds 20% by weight, the amount of residues derived from the aliphatic diamine is relatively small and the adhesiveness is lowered. Therefore, the thermocompression bonding workability is impaired. The reason why the dielectric adjacency is lowered by keeping the content of fluorine atoms within the above range has not been completely elucidated, but fluorine atoms are highly hydrophobic, have low polarity, and have molecular motility. In combination with a high aliphatic diamine, the introduction of a bulky fluorine substituent can be expected to have an effect of suppressing molecular motility, which is presumed to be due to the effect of lowering the dielectric positive contact.
Further, in the adhesive polyimide of the present embodiment, an aliphatic diamine is used as a raw material diamine compound in order to maintain the adhesiveness as a thermoplastic resin and the solvent solubility while reducing the dielectric loss tangent. By controlling the concentration of fluorine atoms derived from the raw material monomer as well as the amount of residues derived from the aliphatic diamine, a sufficient amount of the aliphatic diamine is secured to ensure adhesiveness and solvent solubility as a thermoplastic resin. While maintaining it, it is possible to suppress the dielectric positive contact to an extremely low level.

The fluorine-containing tetracarboxylic acid residue may be an aromatic tetracarboxylic acid dianhydride residue or an aliphatic tetracarboxylic acid dianhydride residue as long as it is a residue of a tetracarboxylic acid dianhydride containing a fluorine atom. It must be a residue of aromatic tetracarboxylic acid dianhydride containing a fluorine atom in the substituent in order to adjust the content of aromatic ring (aromatic ring concentration) contained in the adhesive polyimide and lower the dielectric positive contact. Is preferable. Examples of such tetracarboxylic acid dianhydride include 4,4'-(2,2'-hexafluoroisopropylidene) diphthalic acid dianhydride (6FDA) and (trifluoromethyl) pyromellitic dianhydride. , Di (trifluoromethyl) pyromellitic dianhydride, di (heptafluoropropyl) pyromellitic dianhydride, pentafluoroethyl pyromellitic dianhydride, bis {3,5-di (trifluoromethyl) phenoxy } Pyromellitic dianhydride, 5,5'-bis (trifluoromethyl) -3,3', 4,4'-tetracarboxybiphenyl dianhydride, 2,2', 5,5'-tetrakis (tri) Fluoromethyl) -3,3', 4,4'-tetracarboxybiphenyl dianhydride, 5,5'-bis (trifluoromethyl) -3,3', 4,4'-tetracarboxydiphenyl ether dianhydride, 5,5'-bis (trifluoromethyl) -3,3', 4,4'-tetracarboxybenzophenone dianhydride, bis {(trifluoromethyl) dicarboxyphenoxy} benzene dianhydride, bis {(trifluoromethyl) Methyl) dicarboxyphenoxy} trifluoromethylbenzene dianhydride, bis (dicarboxyphenoxy) trifluoromethylbenzene dianhydride, bis (dicarboxyphenoxy) bis (trifluoromethyl) benzene dianhydride, bis (dicarboxyphenoxy) ) Tetrax (trifluoromethyl) benzene dianhydride, 2,2-bis {4- (3,4-dicarboxyphenoxy) phenyl} hexafluoropropane dianhydride, bis {(trifluoromethyl) dicarboxyphenoxy} biphenyl Dianhydride, bis {(trifluoromethyl) dicarboxyphenoxy} bis (trifluoromethyl) biphenyl dianhydride, bis {(trifluoromethyl) dicarboxyphenoxy} diphenyl ether dianhydride, bis (dicarboxyphenoxy) bis ( Examples thereof include trifluoromethyl) biphenyl dianhydride. These tetracarboxylic dianhydrides may be used alone or in combination of two or more. Among the above-mentioned tetracarboxylic acid dianhydrides containing fluorine atoms, 6FDA, 5, 5'-bis (trifluoromethyl) -3,3', 4,4'-tetracarboxybiphenyl dianhydride, 5,5'-bis (trifluoromethyl) -3,3', 4,4'-tetra It is preferable to use carboxydiphenyl ether dianhydride, 5,5'-bis (trifluoromethyl) -3,3', 4,4'-tetracarboxybenzophenone dianhydride, and more preferably 6FDA.

The fluorine-containing diamine residue is not particularly limited as long as it is a residue of a diamine compound containing a fluorine atom, and may be an aromatic diamine residue or an aliphatic diamine, but the aromatic ring contained in the adhesive polyimide may be used. In order to adjust the content (aromatic ring concentration) and lower the dielectric positive contact, it is preferable that the residue is an aromatic diamine containing a fluorine atom in the substituent. Examples of such aromatic diamines include 2,2-bis- [4- (4-aminophenoxy) phenyl] hexafluoropropane (HFBAPP) and 2,2-bis- [4- (3-aminophenoxy). Phenyl] Hexafluoropropane, 4,4'-diamino-2,2'-bis (trifluoromethyl) biphenyl (TFMB), 3,4-diamino-2,2'-bis (trifluoromethyl) biphenyl, 1, 4-Bis (4-amino-2-trifluoromethylphenoxy) benzene, 4,4'-bis (2- (trifluoromethyl) -4-aminophenoxy) biphenyl, 2,2-bis (4- (2- (2-) (Trifluoromethyl) -4-aminophenoxy) Phenyl) Hexafluoropropane, 4,4'-bis (3- (trifluoromethyl) -4-aminophenoxy) biphenyl, p-bis (2-trifluoromethyl)- 4-Aminophenoxy] Benzene, 9,9-bis (3-fluoro-4-aminophenyl) fluorene and the like are preferable. These diamine compounds may be used alone or in combination of two or more. Among the above-mentioned diamine compounds containing a fluorine atom, HFBAPP, 2,2-bis (4- (2- (2-) It is preferable to use (trifluoromethyl) -4-aminophenoxy) phenyl) hexafluoropropane, and it is more preferable to use TFMB from the viewpoint of increasing the content of fluorine atoms in the polyimide.

b) The total diamine residue should contain 40 mol% or more of the diamine residue derived from the aliphatic diamine.
The content of the diamine residue derived from the aliphatic diamine is 40 mol% or more, preferably 60 mol% or more, more preferably 60 to 99 mol%, still more preferably 70 to 90, based on all the diamine residues. By setting it in the range of mol%, the relative permittivity and the dielectric adjunct of the polyimide can be lowered. When the content of the diamine residue derived from the aliphatic diamine is less than 40 mol%, the relative permittivity and the dielectric loss tangent tend to increase due to the relative increase in the polar groups contained in the polyimide. Further, by containing the diamine residue derived from the aliphatic diamine in the above amount, the thermocompression bonding property is improved by lowering the glass transition temperature (lower Tg) of the polyimide, and the internal stress is relaxed by lowering the elastic modulus. Will be possible. On the other hand, when the content of the diamine residue derived from the aliphatic diamine exceeds 99 mol% with respect to the total diamine residue, the mobility of the molecular chain of the polyimide may be excessively increased and the dielectric loss tangent may be increased. As the aliphatic diamine, one containing a fluorine atom may be used, but one containing no fluorine atom is preferable. The details of the aliphatic diamine will be described later.

c) Being a thermoplastic polyimide.
Since the adhesive polyimide is thermoplastic, it is provided with high adhesiveness and thermocompression bonding workability, and can be applied as an adhesive layer. Here, the "thermoplastic polyimide" generally refers to a polyimide that is softened by heating, solidified by cooling, and this can be repeated, and the glass transition temperature can be clearly confirmed, but in the present invention, it is less than 150 ° C. It means a polyimide in which the glass transition temperature can be clearly confirmed in the temperature range. Further, the thermoplastic polyimide is preferably a polyimide in which the glass transition temperature can be clearly confirmed in a temperature range of less than 100 ° C. from the viewpoint of thermal pressure bonding at a low temperature, and is measured using a dynamic viscoelastic modulus measuring device (DMA). It is more preferable that the storage elastic modulus at 30 ° C. is 1.0 × 10 ⁸ Pa or more and the storage elastic modulus at the glass transition temperature + 30 ° C. is less than 1.0 × 10 ⁷ Pa. On the other hand, "non-thermoplastic polyimide" refers to a polyimide that does not soften or show adhesiveness even when heated, but in the present invention, it was measured using a dynamic viscoelasticity measuring device (DMA) 30. It means that the storage elastic modulus at ° C. is 1.0 × 10 ⁹ Pa or more and the storage elastic modulus at 300 ° C. is 1.0 × 10 ⁸ Pa or more.

The adhesive polyimide is a solvent-soluble polyimide that is soluble in an organic solvent such as N-methyl-2-pyrrolidone (NMP) by containing a certain amount or more of a residue derived from an aliphatic diamine, and is a metal. It is suitable for use when applied to a substrate such as foil.

The adhesive polyimide further preferably satisfies the following conditions d to h.

Condition d)
The content of carbon atoms derived from the 6-membered aromatic ring (excluding the carbon atoms of the 6-membered aromatic ring derived from the dimerdiamine composition) with respect to the total content of all the atoms in the polyimide is in the range of 12 to 40% by weight. There is.
The content of carbon atoms derived from the 6-membered aromatic ring means the content of the aromatic ring contained in the adhesive polyimide (aromatic ring concentration). By setting the content of carbon atoms derived from the 6-membered aromatic ring to the range of 12 to 40% by weight, the movement of the molecule is restricted by the interaction between the aromatic rings in the polyimide, and the effect of low dielectric loss tangent is exhibited. do. If the content of the carbon atom derived from the 6-membered aromatic ring is less than 12% by weight, the movement of the molecular chain of the polyimide cannot be suppressed, so that the dielectric loss tangent becomes high. When the content of carbon atoms derived from the 6-membered aromatic ring exceeds 40% by weight, the polarity of the molecule becomes large and the dielectric loss tangent becomes high. The content of carbon atoms derived from the 6-membered aromatic ring is preferably in the range of 17 to 38% by weight, more preferably in the range of 20 to 30% by weight.

Condition e)
The weight average molecular weight is in the range of 5,000 to 200,000.
When the weight average molecular weight of the adhesive polyimide is less than 5,000, it tends to be fragile when formed into a film. On the other hand, when the weight average molecular weight exceeds 200,000, the viscosity becomes high when the varnish is used, and the thickness unevenness tends to occur at the time of coating.
The weight average molecular weight of the adhesive polyimide is preferably in the range of 10,000 to 60,000, more preferably in the range of 20,000 to 55,000. When the weight average molecular weight is less than 10,000, the relative permittivity and the dielectric loss tangent may easily increase due to the increase in the highly polar ends in the polyimide molecular chain. When the weight average molecular weight exceeds 60,000, the molecular chain length becomes long and it becomes difficult to form an ordered structure, so that the relative permittivity and the dielectric loss tangent may easily increase.

Condition f)
The following formula (i),
CM value = (C / Mw) x 10 ⁴ ... (i)
[In the formula, C means the weight content of the carbon atom derived from the 6-membered aromatic ring (excluding the carbon atom of the 6-membered aromatic ring derived from the dimerdiamine composition) with respect to the total content of all the atoms in the polyimide. Mw means the weight average molecular weight of polyimide]
The CM value, which is an index indicating the amount of the 6-membered aromatic ring contained in the polyimide, calculated based on the above, is in the range of 3 to 38.
Keeping the CM value within an appropriate range is effective for reducing the dielectric loss tangent of the polyimide. When the CM value is less than 3, the aromatic ring concentration is reduced, so that the molecular mobility is increased and the dielectric loss tangent is increased. do. On the other hand, when the CM value exceeds 38, the aromatic ring concentration becomes excessive, the polarity becomes high, and the dielectric loss tangent increases.

Condition g)
The weight content of carbon atoms derived from the 6-membered aromatic ring (excluding the carbon atoms of the 6-membered aromatic ring derived from the dimerdiamine composition) with respect to the total content of all atoms in the total diamine component of the raw material exceeds 0 to 32 weights. Must be within the range of% or less.
In the adhesive polyimide, by controlling the content of the aromatic ring within an appropriate range, the movement of the molecule is restricted by the interaction between the aromatic rings in the polyimide, and the effect of low dielectric loss tangent is exhibited. For this purpose, it is effective to keep the content of carbon atoms derived from the 6-membered aromatic ring within the above range with respect to the total content of carbon atoms in the diamine component of the raw material. When the content of the carbon atom derived from the 6-membered aromatic ring exceeds 32% by weight with respect to the total content of all the atoms in the total diamine component of the raw material, the polarity of the obtained polyimide molecule becomes large and the dielectric loss tangent becomes high.

Condition h)
The following formula (ii),
DM value = (D / Mw) x 10 ⁴ ... (ii)
[In the formula, D is the weight content of the carbon atom derived from the 6-membered aromatic ring (excluding the carbon atom of the 6-membered aromatic ring derived from the diamine diamine composition) with respect to the total content of all the atoms in the total diamine residue. Means, Mw means the weight average molecular weight of polyimide]
The DM value, which is an index indicating the amount of the 6-membered aromatic ring derived from the diamine component contained in the polyimide, which is calculated based on the above, is in the range of more than 0 and 32 or less.
For the same reason as the condition g, it is effective to keep the content of carbon atoms derived from the 6-membered aromatic ring in the diamine residue within the above range with respect to the total content of all atoms in the polyimide.

Next, the acid anhydride residue and the diamine residue constituting the adhesive polyimide will be described. As described above, the adhesive polyimide contains a fluorine-containing tetracarboxylic acid residue and / or a fluorine-containing diamine residue, and can further contain another tetracarboxylic acid residue and / or a diamine residue. .. Hereinafter, tetracarboxylic acid residues other than the fluorine-containing tetracarboxylic acid residue and diamine residues other than the fluorine-containing diamine residue will be described.

(Acid anhydride)
As the adhesive polyimide, a tetracarboxylic acid anhydride generally used for thermoplastic polyimide can be used as a raw material without particular limitation, but the following general formula (1) and / or (for all tetracarboxylic acid anhydride components) It is preferable to use a raw material containing 50 mol% or more of the tetracarboxylic acid anhydride represented by 2) in total. In other words, the adhesive polyimide is a tetracarboxylic acid residue derived from the tetracarboxylic acid anhydride represented by the following general formulas (1) and / or (2) for all tetracarboxylic acid residues. Is preferably contained in an amount of 50 mol% or more in total. A total of 90 mol% or more of tetracarboxylic acid residues derived from the tetracarboxylic acid anhydride represented by the following general formulas (1) and / or (2) is contained in the total tetracarboxylic acid residues. This is preferable because it is easy to achieve both the flexibility and heat resistance of the adhesive polyimide. If the total amount of tetracarboxylic acid residues derived from the tetracarboxylic dianhydride represented by the following general formulas (1) and / or (2) is less than 50 mol%, the solvent solubility of the adhesive polyimide is lowered. It becomes a tendency.

In the general formula (1), X represents a single bond or a divalent group selected from the following formula, and in the general formula (2), the cyclic portion represented by Y is a 4-membered ring or a 5-membered ring. , 6-membered ring, 7-membered ring or 8-membered ring.

In the above equation, Z indicates -C ₆ H ₄ -,-(CH ₂ ) n- or -CH ₂ -CH (-OC (= O) -CH ₃ ) -CH _2- , where n is 1. Indicates an integer of ~ 20.

Examples of the tetracarboxylic acid anhydride represented by the general formula (1) include 3,3', 4,4'-biphenyltetracarboxylic acid dianhydride (BPDA), 3,3', 4,4'. -Benzophenone tetracarboxylic acid dianhydride (BTDA), 3,3', 4,4'-diphenylsulfone tetracarboxylic acid dianhydride (DSDA), 4,4'-oxydiphthalic acid anhydride (ODPA), 2,2 -Bis [4- (3,4-dicarboxyphenoxy) phenyl] Propane dianhydride (BPADA), p-phenylene bis (trimellitic acid monoesteric anhydride) (TAHQ), ethylene glycol bisanhydrotrimeritate (TMEG) and the like can be mentioned. Of these, 3,3', 4,4'-benzophenone tetracarboxylic dianhydride (BTDA) is particularly preferable. When BTDA is used, the carbonyl group (ketone group) contributes to the adhesiveness, so that the adhesiveness of the adhesive polyimide can be improved. Further, in BTDA, a ketone group existing in the molecular skeleton may react with an amino group of an amino compound for forming a crosslink, which will be described later, to form a C = N bond, and the effect of improving heat resistance is likely to be exhibited. .. From such a viewpoint, the total tetracarboxylic acid residue may contain preferably 50 mol% or more, more preferably 60 mol% or more of the tetracarboxylic acid residue derived from BTDA.

Examples of the tetracarboxylic acid anhydride represented by the general formula (2) include 1,2,3,4-cyclobutanetetracarboxylic acid dianhydride and 1,2,3,4-cyclopentanetetracarboxylic acid. Dianhydride, 1,2,4,5-cyclohexanetetracarboxylic acid dianhydride, 1,2,4,5-cycloheptanetetracarboxylic acid dianhydride, 1,2,5,6-cyclooctanetetracarboxylic acid (2) Anhydrous and the like can be mentioned.

The adhesive polyimide contains tetracarboxylic acid residues derived from acid anhydrides other than the tetracarboxylic acid anhydrides represented by the general formulas (1) and (2) above, as long as the effects of the invention are not impaired. Can be contained. The tetracarboxylic acid residue is not particularly limited, but for example, pyromellitic acid dianhydride, 2,3', 3,4'-biphenyltetracarboxylic acid dianhydride, 2,2', 3 , 3'-or 2,3,3', 4'-benzophenone tetracarboxylic acid dianhydride, 2,3', 3,4'-diphenyl ether tetracarboxylic acid dianhydride, bis (2,3-dicarboxyphenyl) ) Ether dianhydride, 3,3'', 4,4''-, 2,3,3'', 4''-or 2,2'',3,3''-p-terphenyltetracarboxylic Acid dianhydride, 2,2-bis (2,3- or 3,4-dicarboxyphenyl) -propane dianhydride, bis (2,3- or 3,4-dicarboxyphenyl) methane dianhydride, Bis (2,3- or 3,4-dicarboxyphenyl) sulfonate dianhydride, 1,1-bis (2,3- or 3,4-dicarboxyphenyl) ethane dianhydride, 1,2,7, 8-1,2,6,7-or 1,2,9,10-phenanthrene-tetracarboxylic dianhydride 2,3,6,7-anthracene tetracarboxylic dianhydride 1,2,5 , 6-Naphthalenetetracarboxylic acid dianhydride, 1,4,5,8-Naphthalenetetracarboxylic acid dianhydride, 2,3,6,7-Naphthalenetetracarboxylic acid dianhydride, 4,8-dimethyl-1 , 2,3,5,6,7-Hexahydronaphthalene-1,2,5,6-tetracarboxylic dianhydride 2,6- or 2,7-dichloronaphthalene-1,4,5,8- Tetracarboxylic Acid Dianhydride 2,3,6,7-(or 1,4,5,8-) Tetrachloronaphthalene-1,4,5,8-(or 2,3,6,7-) Tetra Carboxydic dianhydride, 2,3,8,9-,3,4,9,10-,4,5,10,11-or 5,6,11,12-perylene-tetracarboxylic dianhydride, Pyrazine-2,3,5,6-tetracarboxylic acid dianhydride, pyrrolidine-2,3,4,5-tetracarboxylic acid dianhydride, thiophene-2,3,4,5-tetracarboxylic acid dianhydride Examples thereof include tetracarboxylic acid residues derived from aromatic tetracarboxylic acid dianhydrides such as 4,4'-bis (2,3-dicarboxyphenoxy) diphenylmethane dianhydride.

(Diamine)
As the adhesive polyimide, a diamine compound generally used for thermoplastic polyimide can be used as a raw material without particular limitation, but a raw material containing 40 mol% or more of an aliphatic diamine with respect to the total diamine component is used. In other words, as described in the above condition b, the adhesive polyimide contains 40 mol% or more of the diamine residue derived from the aliphatic diamine with respect to the total diamine residue. As the aliphatic diamine, it is preferable to use a dimerdiamine composition containing dimerdiamine as a main component, which is obtained by substituting a primary aminomethyl group or an amino group with two terminal carboxylic acid groups of dimer acid.

The diamine diamine composition is a purified product containing the following component (a) as a main component and in which the amounts of the components (b) and (c) are controlled.

(A) Dimer diamine;
In the diamine diamine of the component (a), the two terminal carboxylic acid groups (-COOH) of the dimer acid are replaced with a primary aminomethyl group ( _-CH2 -NH ₂ ) or an amino group (-NH ₂ ). Means diamine. Dimeric acid is a known dibasic acid obtained by the intermolecular polymerization reaction of unsaturated fatty acids, and its industrial production process is almost standardized in the industry, and unsaturated fatty acids having 11 to 22 carbon atoms are clay-catalyzed. It is obtained by quantifying it with the like. The industrially obtained dimer acid is mainly composed of a dibasic acid having 36 carbon atoms obtained by dimerizing an unsaturated fatty acid having 18 carbon atoms such as oleic acid, linolenic acid and linolenic acid. Depending on the degree, it contains an arbitrary amount of monomeric acid (18 carbon atoms), trimeric acid (54 carbon atoms), and other polymerized fatty acids having 20 to 54 carbon atoms. Further, although the double bond remains after the dimerization reaction, in the present invention, the dimer acid is also included in which the degree of unsaturation is further reduced by the hydrogenation reaction. In the component dimer diamine, the terminal carboxylic acid group of the dibasic acid compound in the range of 18 to 54 carbon atoms, preferably 22 to 44 carbon atoms is replaced with a primary aminomethyl group or an amino group. It can be defined as the resulting diamine compound.

As a characteristic of dimer diamine, the property derived from the skeleton of dimer acid can be imparted. That is, since dimer diamine is an aliphatic of macromolecules having a molecular weight of about 560 to 620, the molar volume of the molecule can be increased and the polar groups of polyimide can be relatively reduced. It is considered that such a characteristic of the dimer acid type diamine contributes to improving the dielectric property by reducing the relative permittivity and the dielectric loss tangent while suppressing the decrease in the heat resistance of the polyimide. In addition, since it has two freely moving hydrophobic chains having 7 to 9 carbon atoms and two chain-like aliphatic amino groups having a length close to 18 carbon atoms, it not only gives the polyimide flexibility but also gives it flexibility. Since the polyimide can have an asymmetrical chemical structure or a non-planar chemical structure, it is considered that the polyimide can have a low dielectric constant.

As the diamine diamine composition, the diamine diamine content of the component (a) is increased to 96% by weight or more, preferably 97% by weight or more, more preferably 98% by weight or more by a purification method such as molecular distillation. That's good. By setting the diamine diamine content of the component (a) to 96% by weight or more, it is possible to suppress the spread of the molecular weight distribution of the polyimide. If technically possible, it is best that all (100% by weight) of the diamine diamine composition is composed of the diamine diamine of the component (a). The diamine diamine composition may contain a diamine diamine having a 6-membered aromatic ring as a molecular skeleton. In the polyimide of the present embodiment, attention is paid to the ratio of the aromatic monomer directly connected to the imide bond site, and the control is made. However, in the dimer diamine having a 6-membered aromatic ring, the 6-membered aromatic ring has 7 or more carbon atoms. Since it is an imide bond via a fat chain having a length of, it is not a target for controlling a 6-membered aromatic ring in the polyimide of the present embodiment. Therefore, the 6-membered aromatic ring derived from dimer diamine is excluded from the conditions d, f, g and h in the adhesive polyimide. The proportion of aromatic rings derived from dimerdiamine is preferably 20 mol% or less with respect to 1 mol of amino groups by quantification by 1H-NMR.

(B) A monoamine compound obtained by substituting a terminal carboxylic acid group of a monobasic acid compound having 10 to 40 carbon atoms with a primary aminomethyl group or an amino group;
The monobasic acid compound in the range of 10 to 40 carbon atoms is a monobasic unsaturated fatty acid in the range of 10 to 20 carbon atoms derived from the raw material of dimer acid, and a by-product during the production of dimer acid. It is a mixture of monobasic acid compounds in the range of 21 to 40 carbon atoms. The monoamine compound is obtained by substituting the terminal carboxylic acid group of these monobasic acid compounds with a primary aminomethyl group or an amino group.

The monoamine compound of the component (b) is a component that suppresses an increase in the molecular weight of polyimide. During the polymerization of polyamic acid or polyimide, the monofunctional amino group of the monoamine compound reacts with the terminal acid anhydride group of the polyamic acid or polyimide to seal the terminal acid anhydride group, and the molecular weight of the polyamic acid or polyimide is sealed. Suppress the increase.

(C) An amine compound obtained by substituting a terminal carboxylic acid group of a polybasic acid compound having a hydrocarbon group in the range of 41 to 80 carbon atoms with a primary aminomethyl group or an amino group (however, the dimerdiamine). except for);
The polybasic acid compound having a hydrocarbon group having a carbon number of 41 to 80 is mainly composed of a tribasic acid compound having a carbon number of 41 to 80, which is a by-product during the production of dimer acid. It is a polybasic acid compound. Further, it may contain a polymerized fatty acid other than dimer acid having 41 to 80 carbon atoms. The amine compound is obtained by substituting the terminal carboxylic acid group of these polybasic acid compounds with a primary aminomethyl group or an amino group.

The amine compound of the component (c) is a component that promotes an increase in the molecular weight of polyimide. A trifunctional or higher amino group containing a triamine derived from trimeric acid as a main component reacts with a polyamic acid or a terminal acid anhydride group of polyimide to rapidly increase the molecular weight of polyimide. Further, an amine compound derived from a polymerized fatty acid other than dimer acid having 41 to 80 carbon atoms also increases the molecular weight of the polyimide and causes gelation of the polyamic acid or the polyimide.

When quantifying each component by measurement using gel permeation chromatography (GPC), diamine diamine composition should be used to facilitate peak start, peak top and peak end confirmation of each component of the diamine diamine composition. Samples treated with acetic anhydride and pyridine are used and cyclohexanone is used as an internal standard. Using the sample prepared in this way, each component is quantified by the area percentage of the chromatogram of GPC. The peak start and peak end of each component are set to the minimum value of each peak curve, and the area percentage of the chromatogram can be calculated based on this.

Further, the diamine diamine composition is preferably an area percent of the chromatogram obtained by GPC measurement, and the total of the components (b) and (c) is 4% or less, preferably less than 4%. By setting the total of the components (b) and (c) to 4% or less, it is possible to suppress the spread of the molecular weight distribution of the polyimide.

The area percentage of the chromatogram of the component (b) is preferably 3% or less, more preferably 2% or less, still more preferably 1% or less. By setting it in such a range, it is possible to suppress a decrease in the molecular weight of the polyimide, and further widen the range of the molar ratio of the tetracarboxylic acid anhydride component and the diamine component. The component (b) may not be contained in the diamine diamine composition.

The area percentage of the chromatogram of the component (c) is 2% or less, preferably 1.8% or less, and more preferably 1.5% or less. Within such a range, it is possible to suppress a rapid increase in the molecular weight of the polyimide, and further suppress an increase in the dielectric loss tangent of the resin film at a wide frequency range. The component (c) may not be contained in the diamine diamine composition.

When the area percent ratio (b / c) of the chromatograms of the components (b) and (c) is 1 or more, the molar ratio of the tetracarboxylic acid anhydride component and the diamine component (tetracarboxylic acid anhydride component /). The diamine component) is preferably 0.97 or more and less than 1.0, and such a molar ratio makes it easier to control the molecular weight of the polyimide.

Further, when the ratio (b / c) of the area percent of the chromatograms of the components (b) and (c) is less than 1, the molar ratio of the tetracarboxylic acid anhydride component and the diamine component (tetracarboxylic acid anhydride component). The / diamine component) is preferably 0.97 or more and 1.1 or less, and by setting such a molar ratio, it becomes easier to control the molecular weight of the polyimide.

As the diamine diamine composition, a commercially available product can be used, and it is preferable to purify the diamine diamine composition for the purpose of reducing the components other than the diamine diamine of the component (a). For example, the component may be 96% by weight or more in (a). preferable. The purification method is not particularly limited, but a known method such as a distillation method or precipitation purification is preferable. Examples of commercially available products of the diamine diamine composition include PRIAMINE 1073 (trade name), PRIAMINE 1074 (trade name), and PRIAMINE 1075 (trade name) manufactured by Croda Japan.

The adhesive polyimide may contain a diamine residue derived from a diamine component other than the above. Examples of such diamine residues include bisaniline fluorene (BAFL), 9,9-bis (3-methyl-4-aminophenyl) fluorene, and 9,9-bis [4- (aminophenoxy) phenyl] fluorene. Alternatively, diamine residues derived from the diamine compounds represented by the general formulas (B1) to (B7) are preferable. In particular, a diamine having a fluorene skeleton typified by BAFL contains four aromatic rings and can be advantageously used for the purpose of adjusting the aromatic ring concentration.

In the formulas (B1) to (B7), R ₁ independently represents a monovalent hydrocarbon group or an alkoxy group having 1 to 6 carbon atoms, and the linking group A is independently -O-, -S-, -CO-. , -SO-, -SO _2- , -COO-, -CH _2- , -C (CH ₃ ) _2- , -NH- or -CONH- indicates a divalent group, n ₁ is independent. Indicates an integer from 0 to 4. However, the formula (B3) that overlaps with the formula (B2) is excluded, and the formula (B5) that overlaps with the formula (B4) is excluded. Here, "independently" means that, in one of the above formulas (B1) to (B7), or in two or more, a plurality of linking groups A, a plurality of _R1s , or a plurality of _n1s are the same. But it means that it can be different. In the above formulas (B1) to (B7), the hydrogen atom in the two terminal amino groups may be substituted, for example, -NR ₂ R ₃ (here, R ₂ and R ₃ are independently. It may mean any substituent such as an alkyl group).

The diamine represented by the formula (B1) (hereinafter, may be referred to as "diamine (B1)") is an aromatic diamine having two benzene rings. This diamine (B1) has a high degree of flexibility due to an increase in the degree of freedom of the polyimide molecular chain by having an amino group directly connected to at least one benzene ring and a divalent linking group A at the meta position. It is considered that this contributes to the improvement of the flexibility of the polyimide molecular chain. Therefore, the use of diamine (B1) enhances the thermoplasticity of the polyimide. Here, as the linking group A, —O—, —CH _2- , —C (CH ₃ ) _2- , —CO−, _—SO2- , —S— are preferable.

Examples of the diamine (B1) include 3,3'-diaminodiphenylmethane, 3,3'-diaminodiphenylpropane, 3,3'-diaminodiphenylsulfide, 3,3'-diaminodiphenylsulfone, and 3,3'-diamino. Diphenyl ether, 3,4'-diaminodiphenyl ether, 3,4'-diaminodiphenylmethane, 3,4'-diaminodiphenylpropane, 3,4'-diaminodiphenylsulfide, 3,3'-diaminobenzophenone, (3,3'- Bisamino) diphenylamine and the like can be mentioned.

The diamine represented by the formula (B2) (hereinafter, may be referred to as "diamine (B2)") is an aromatic diamine having three benzene rings. This diamine (B2) has a high degree of flexibility due to an increase in the degree of freedom of the polyimide molecular chain by having an amino group directly connected to at least one benzene ring and a divalent linking group A at the meta position. It is considered that this contributes to the improvement of the flexibility of the polyimide molecular chain. Therefore, the use of diamine (B2) enhances the thermoplasticity of the polyimide. Here, —O— is preferable as the linking group A.

Examples of the diamine (B2) include 1,4-bis (3-aminophenoxy) benzene, 3- [4- (4-aminophenoxy) phenoxy] benzeneamine, and 3- [3- (4-aminophenoxy) phenoxy]. Benzene amine and the like can be mentioned.

The diamine represented by the formula (B3) (hereinafter, may be referred to as "diamine (B3)") is an aromatic diamine having three benzene rings. This diamine (B3) has two divalent linking groups A directly linked to one benzene ring at the meta position of each other, so that the degree of freedom of the polyimide molecular chain is increased and it has high flexibility. Therefore, it is considered that it contributes to the improvement of the flexibility of the polyimide molecular chain. Therefore, the use of diamine (B3) enhances the thermoplasticity of the polyimide. Here, —O— is preferable as the linking group A.

Examples of the diamine (B3) include 1,3-bis (4-aminophenoxy) benzene (TPE-R), 1,3-bis (3-aminophenoxy) benzene (APB), and 4,4'-[2- [2-. Methyl- (1,3-phenylene) bisoxy] bisaniline, 4,4'-[4-methyl- (1,3-phenylene) bisoxy] bisaniline, 4,4'-[5-methyl-(1,3-phenylene) ) Bisoxy] Bisaniline and the like can be mentioned.

The diamine represented by the formula (B4) (hereinafter, may be referred to as "diamine (B4)") is an aromatic diamine having four benzene rings. This diamine (B4) has high flexibility because the amino group directly linked to at least one benzene ring and the divalent linking group A are in the meta position, and it improves the flexibility of the polyimide molecular chain. It is thought to contribute. Therefore, the use of diamine (B4) enhances the thermoplasticity of the polyimide. Here, as the linking group A, -O-, -CH _2- , -C (CH ₃ ) _2- , -SO _2- , -CO-, and -CONH- are preferable.

Diamines (B4) include bis [4- (3-aminophenoxy) phenyl] methane, bis [4- (3-aminophenoxy) phenyl] propane, bis [4- (3-aminophenoxy) phenyl] ether, and bis. Examples thereof include [4- (3-aminophenoxy) phenyl] sulfone, bis [4- (3-aminophenoxy)] benzophenone, and bis [4,4'-(3-aminophenoxy)] benzanilide.

The diamine represented by the formula (B5) (hereinafter, may be referred to as "diamine (B5)") is an aromatic diamine having four benzene rings. This diamine (B5) has two divalent linking groups A directly linked to at least one benzene ring at the meta position of each other, so that the degree of freedom of the polyimide molecular chain is increased and the diamine has high flexibility. It is considered that this contributes to the improvement of the flexibility of the polyimide molecular chain. Therefore, the use of diamine (B5) enhances the thermoplasticity of the polyimide. Here, —O— is preferable as the linking group A.

Examples of the diamine (B5) include 4- [3- [4- (4-aminophenoxy) phenoxy] phenoxy] aniline, 4,4'-[oxybis (3,1-phenyleneoxy)] bisaniline and the like. ..

The diamine represented by the formula (B6) (hereinafter, may be referred to as "diamine (B6)") is an aromatic diamine having four benzene rings. This diamine (B6) has high flexibility by having at least two ether bonds, and is considered to contribute to the improvement of the flexibility of the polyimide molecular chain. Therefore, the use of diamine (B6) enhances the thermoplasticity of the polyimide. Here, as the linking group A, -C (CH ₃ ) _2- , -O-, -SO _2- , and -CO- are preferable.

Examples of the diamine (B6) include 2,2-bis [4- (4-aminophenoxy) phenyl] propane (BAPP), bis [4- (4-aminophenoxy) phenyl] ether (BAPE), and bis [4). -(4-Aminophenoxy) phenyl] sulfone (BAPS), bis [4- (4-aminophenoxy) phenyl] ketone (BADK) and the like can be mentioned.

The diamine represented by the formula (B7) (hereinafter, may be referred to as “diamine (B7)”) is an aromatic diamine having four benzene rings. Since this diamine (B7) has a highly flexible divalent linking group A on both sides of the diphenyl skeleton, it is considered to contribute to the improvement of the flexibility of the polyimide molecular chain. Therefore, the use of diamine (B7) enhances the thermoplasticity of the polyimide. Here, —O— is preferable as the linking group A.

Examples of the diamine (B7) include bis [4- (3-aminophenoxy)] biphenyl, bis [4- (4-aminophenoxy)] biphenyl and the like.

The adhesive polyimide has a diamine residue derived from at least one diamine compound selected from diamine (B1) to diamine (B7), preferably 1 mol% or more and 40 mol% or less, based on all diamine residues. It is preferably contained within the range, more preferably within the range of 5 mol% or more and 35 mol% or less. Since diamines (B1) to diamines (B7) have a molecular structure having flexibility, the flexibility of the polyimide molecular chain is improved by using at least one diamine compound selected from these in an amount within the above range. And can impart thermoplasticity.

The adhesive polyimide can further contain diamine residues other than the above as long as the effects of the invention are not impaired.

The adhesive polyimide can be produced by reacting the above acid anhydride component and the diamine component in a solvent to generate a polyamic acid, and then heating and closing the ring. For example, the acid anhydride component and the diamine component are dissolved in an organic solvent in approximately equal molar amounts, and the mixture is stirred at a temperature in the range of 0 to 100 ° C. for 30 minutes to 24 hours to carry out a polymerization reaction to obtain a polyimide precursor. Polyimide is obtained. In the reaction, the reaction components are dissolved in the organic solvent so that the precursor to be produced is in the range of 5 to 50% by weight, preferably in the range of 10 to 40% by weight. Examples of the organic solvent used in the polymerization reaction include N, N-dimethylformamide (DMF), N, N-dimethylacetamide (DMAc), N, N-diethylacetamide, N-methyl-2-pyrrolidone (NMP), 2 -Butanone, dimethyl sulfoxide (DMSO), hexamethylphosphoramide, N-methylcaprolactam, dimethylsulfate, cyclohexanone, methylcyclohexane, dioxane, tetrahydrofuran, diglime, triglime, methanol, ethanol, benzyl alcohol, cresol and the like can be mentioned. Two or more of these solvents can be used in combination, and aromatic hydrocarbons such as xylene and toluene can be used in combination. The amount of such an organic solvent used is not particularly limited, but it should be adjusted so that the concentration of the polyamic acid solution obtained by the polymerization reaction is about 5 to 50% by weight. Is preferable.

The synthesized polyamic acid is usually advantageous to be used as a reaction solvent solution, but can be concentrated, diluted or replaced with another organic solvent if necessary. In addition, polyamic acid is generally excellent in solvent solubility, and is therefore advantageously used. The viscosity of the polyamic acid solution is preferably in the range of 500 mPa · s to 100,000 mPa · s. If it is out of this range, defects such as uneven thickness and streaks are likely to occur in the film during coating work by a coater or the like.

The method of imidizing the polyamic acid to form the polyimide is not particularly limited, and for example, a heat treatment such as heating in the solvent at a temperature in the range of 80 to 400 ° C. for 1 to 24 hours is preferably adopted. Will be done. Further, the temperature may be heated under a constant temperature condition, or the temperature may be changed in the middle of the process.

By selecting the types of the acid anhydride component and the diamine component and the molar ratio of each of the two or more acid anhydride components or the diamine component in the adhesive polyimide, the dielectric property and the coefficient of thermal expansion can be determined. Physical properties such as tensile elastic modulus and glass transition temperature can be controlled. When the adhesive polyimide has a plurality of structural units, it may exist as a block or randomly, but it is preferable that the adhesive polyimide exists randomly.

The imide group concentration of the adhesive polyimide is preferably 22% by weight or less, more preferably 20% by weight or less. Here, the "imide group concentration" means a value obtained by dividing the molecular weight of the imide base portion (-(CO) ₂ -N-) in the polyimide by the molecular weight of the entire structure of the polyimide. When the imide group concentration exceeds 22% by weight, the molecular weight of the resin itself becomes small, the low hygroscopicity deteriorates due to the increase in polar groups, and the Tg and elastic modulus increase.

The adhesive polyimide is most preferably a completely imidized structure. However, a part of the polyimide may be an amic acid. The imidization rate is around 1015 cm ^-1 by measuring the infrared absorption spectrum of the polyimide thin film by the single reflection ATR method using a Fourier transform infrared spectrophotometer (commercially available: FT / IR620 manufactured by Nippon Spectroscopy). It can be calculated from the absorbance of C = O expansion and contraction derived from the imide group of 1780 cm ^-1 based on the benzene ring absorber of.

The adhesive polyimide is appropriately blended with other curing resin components such as a plasticizer and an epoxy resin, a curing agent, a curing accelerator, an organic filler, an inorganic filler, a coupling agent, a solvent, a flame retardant, and the like as optional components. Can be used as an adhesive composition.

(Crosslink formation of adhesive polyimide)
When the adhesive polyimide has a ketone group, the amino of the amino compound having the ketone group and at least two primary amino groups as functional groups (hereinafter, may be referred to as "crosslink-forming amino compound"). A crosslinked structure can be formed by reacting the groups to form a C = N bond. The polyimide having such a crosslinked structure (hereinafter, may be referred to as “crosslinked polyimide”) is an application example of the adhesive polyimide and is in a preferable form. Since the weight average molecular weight fluctuates greatly due to the formation of the crosslink, the adhesive polyimide before the formation of the crosslink may satisfy the conditions a to c and, if necessary, the conditions d to h, and the crosslinked polyimide satisfies these conditions. It does not have to be. Further, an adhesive composition in which a cross-linking agent is blended with an adhesive polyimide having a ketone group is another application example of the adhesive polyimide, and is in a preferable form. By forming the crosslinked structure, the heat resistance of the adhesive polyimide can be improved. Preferred tetracarboxylic acid anhydrides for forming an adhesive polyimide having a ketone group include, for example, 3,3', 4,4'-benzophenone tetracarboxylic acid dianhydride (BTDA), and diamine compounds include, for example. Aromatic diamines such as 4,4'-bis (3-aminophenoxy) benzophenone (BABP), 1,3-bis [4- (3-aminophenoxy) benzoyl] benzene (BABB) can be mentioned.

For the purpose of forming a crosslinked structure, the above-mentioned adhesiveness containing BTDA residues derived from BTDA in an amount of preferably 50 mol% or more, more preferably 60 mol% or more, particularly with respect to all tetracarboxylic acid residues. It is preferable to allow the amino compound for forming a crosslink to act on the polyimide. In the present invention, the "BTDA residue" means a tetravalent group derived from BTDA.

Examples of the crosslink-forming amino compound include (I) a dihydrazide compound, (II) an aromatic diamine, and (III) an aliphatic amine. Among these, the dihydrazide compound is preferable. Aliphatic amines other than dihydrazide compounds tend to form crosslinked structures even at room temperature, and there is a concern about the storage stability of varnishes, while aromatic diamines need to be heated to a high temperature in order to form crosslinked structures. As described above, when the dihydrazide compound is used, both the storage stability of the varnish and the shortening of the curing time can be achieved at the same time. Examples of the dihydrazide compound include dihydrazide oxalic acid, dihydrazide malonate, dihydrazide succinic acid, dihydrazide glutaric acid, dihydrazide adipic acid, dihydrazide pymeric acid, dihydrazide dihydric acid, dihydrazide azeline acid, dihydrazide sevacinate, and dihydrazide sevacinate. Dihydrazide, dihydrazide humalic acid, diglycolic acid dihydrazide, tartrate dihydrazide, apple acid dihydrazide, phthalic acid dihydrazide, isophthalic acid dihydrazide, terephthalic acid dihydrazide, 2,6-naphthoediodic acid dihydrazide, 4,4-bisbenzenedihydrazide, 1,4 -Dihydrazide compounds such as naphthoic acid dihydrazide, 2,6-pyridinediacid dihydrazide, and itaconic acid dihydrazide are preferable. The above dihydrazide compounds may be used alone or in combination of two or more.

Further, the amino compounds such as (I) dihydrazide compound, (II) aromatic diamine, and (III) aliphatic amine are, for example, a combination of (I) and (II), a combination of (I) and (III), and the like. It is also possible to use two or more kinds in combination across categories, such as the combination of (I), (II) and (III).

Further, from the viewpoint of making the network-like structure formed by the cross-linking by the cross-linking amino compound more dense, the cross-linking amino compound used in the present invention has a molecular weight (when the cross-linking amino compound is an oligomer). The weight average molecular weight) is preferably 5,000 or less, more preferably 90 to 2,000, still more preferably 100 to 1,500. Among these, an amino compound for forming a crosslink having a molecular weight of 100 to 1,000 is particularly preferable. When the molecular weight of the cross-linking amino compound is less than 90, one amino group of the cross-linking amino compound only forms a C = N bond with the ketone group of the adhesive polyimide, and the periphery of the remaining amino groups is steric. Since it becomes bulky, the remaining amino groups tend to be difficult to form a C = N bond.

When cross-linking the ketone group in the adhesive polyimide and the cross-linking amino compound, the above-mentioned cross-linking amino compound is added to the resin solution containing the adhesive polyimide to form a cross-link with the ketone group in the adhesive polyimide. A condensation reaction is carried out with the primary amino group of the amino compound for use. By this condensation reaction, the resin solution is cured to become a cured product. In this case, the amount of the amino compound for forming a bridge is 0.004 mol to 1.5 mol, preferably 0.005 mol to 1.2 mol, in total for the primary amino group with respect to 1 mol of the ketone group. It can be more preferably 0.03 mol to 0.9 mol, and most preferably 0.04 mol to 0.6 mol. If the amount of the cross-linking amino compound added so that the total number of primary amino groups is less than 0.004 mol per 1 mol of ketone group, the cross-linking by the cross-linking amino compound is not sufficient, so that after curing, the cross-linking is not sufficient. When the amount of the cross-linking amino compound added exceeds 1.5 mol, the unreacted cross-linking amino compound acts as a thermoplastic and the heat resistance of the adhesive layer is lowered. Tend to let.

The conditions for the condensation reaction for crosslink formation are as long as the ketone group in the adhesive polyimide reacts with the primary amino group of the crosslink-forming amino compound to form an imine bond (C = N bond). There are no particular restrictions. The temperature of the heat condensation is, for example, 120 for the purpose of releasing the water generated by the condensation to the outside of the system, or for simplifying the condensation step when the heat condensation reaction is subsequently performed after the synthesis of the adhesive polyimide. The range of about 220 ° C. is preferable, and the range of 140 to 200 ° C. is more preferable. The reaction time is preferably about 30 minutes to 24 hours. The end point of the reaction is the absorption derived from the ketone group in the polyimide resin near 1670 cm ^-1 by measuring the infrared absorption spectrum using, for example, a Fourier transform infrared spectrophotometer (commercially available product: FT / IR620 manufactured by Nippon Spectroscopy). It can be confirmed by the decrease or disappearance of the peak and the appearance of the absorption peak derived from the imine group near 1635 cm ^-1 .

The heat condensation between the ketone group of the adhesive polyimide and the primary amino group of the above-mentioned crosslink-forming amino compound is, for example,
(1) A method in which an amino compound for forming a crosslink is added and heated following the synthesis (imidization) of the adhesive polyimide.
(2) An excess amount of an amino compound is charged in advance as a diamine component, and following the synthesis (imidization) of the adhesive polyimide, the remaining amino compound that is not involved in imidization or amidation is used as an amino compound for cross-linking formation. How to heat with adhesive polyimide,
Or,
(3) After processing the adhesive polyimide solution (adhesive composition) to which the above-mentioned crosslink-forming amino compound is added into a predetermined shape (for example, after applying it to an arbitrary substrate or forming it into a film). How to heat to
It can be done by such as.

In order to impart heat resistance to the adhesive polyimide, an example of a crosslinked polyimide having a crosslinked structure by forming an imine bond has been described, but the present invention is not limited to this, and examples of the polyimide curing method include epoxy resin and epoxy. It is also possible to blend and cure a compound having an unsaturated bond such as a resin curing agent, maleimide, an activated ester resin, and a resin having a styrene skeleton.

[Adhesive composition]
Since the adhesive polyimide is solvent-soluble, it can be used in the form of an adhesive composition (polyimide solution) containing a solvent. That is, the adhesive composition contains an adhesive polyimide and a solvent capable of dissolving the adhesive polyimide. Further, the adhesive composition can contain an amino compound for forming a crosslink as an optional component. The adhesive composition contains, as the main component of the resin component, preferably 70% by weight or more of the resin component, more preferably 90% by weight or more of the resin component, and most preferably the adhesive polyimide as all of the resin components. The main component of the resin component means a component contained in an amount of 50% by weight or more with respect to the total resin component.

The solvent is not particularly limited as long as it can dissolve the adhesive polyimide. For example, N, N-dimethylformamide (DMF), N, N-dimethylacetamide (DMAc), N, N-diethylacetamide, N- Methyl-2-pyrrolidone (NMP), 2-butanone, dimethyl sulfoxide (DMSO), hexamethylphosphoramide, N-methylcaprolactum, dimethylsulfate, cyclohexanone, methylcyclohexane, dioxane, tetrahydrofuran, diglime, triglime, methanol, ethanol, Examples thereof include benzyl alcohol, cresol, acetone and the like. Two or more of these solvents can be used in combination, and aromatic hydrocarbons such as xylene and toluene can be used in combination.

In the adhesive composition, the blending ratio of the adhesive polyimide and the solvent is not particularly limited as long as the composition can be maintained at a viscosity sufficient to be coated. The viscosity of the adhesive composition is preferably in the range of, for example, 500 mPa · s to 100,000 mPa · s. If it is out of this range, defects such as uneven thickness and streaks are likely to occur in the resin film during the coating work.

The adhesive composition may contain, as an optional component, other curing resin components such as a plasticizer and an epoxy resin, a curing agent, a curing accelerator, an organic filler, an inorganic filler, and a coupling agent, as long as the effects of the invention are not impaired. A solvent, a flame retardant, etc. can be appropriately blended.

[Polyimide film / adhesive film]
The polyimide film according to the embodiment of the present invention is the adhesive polyimide or the crosslinked polyimide processed into a film. The polyimide film contains a fluorine-containing tetracarboxylic acid residue and / or a fluorine-containing diamine residue, and the total content of fluorine atoms is 1% by weight or more and 20% by weight with respect to the total content of all atoms in the polyimide. It is within the following range.

The polyimide film has a dielectric loss tangent (Tanδ) of 0. It is preferably less than 002 and the relative permittivity (ε) is 3.0 or less. If the dielectric loss tangent (Tanδ) and the relative permittivity (ε) exceed the above values, the dielectric loss will increase when applied to a circuit board, causing inconveniences such as electrical signal loss on the high frequency signal transmission path. It will be easier.

An adhesive film can be mentioned as a preferable form of the polyimide film. The adhesive film contains the above-mentioned adhesive polyimide or crosslinked polyimide as the main component of the resin component, preferably 70% by weight or more of the resin component, more preferably 90% by weight or more of the resin component, and most preferably all of the resin components. The film contained is not particularly limited. The main component of the resin component means a component contained in an amount of 50% by weight or more with respect to the total resin component. The adhesive film may be a film (sheet) made of adhesive polyimide or crosslinked polyimide, and for example, a base material of an inorganic material such as a copper foil or a glass plate, a polyimide film, a polyamide film, or a polyester film. It may be in a state of being laminated on a resin base material such as a film. The adhesive film may appropriately contain, for example, other curing resin components such as a plasticizer and an epoxy resin, a curing agent, a curing accelerator, an organic filler, an inorganic filler, a coupling agent, a flame retardant, and the like as optional components. ..

The tensile elastic modulus of the adhesive film is preferably 3000 MPa or less, preferably 100 MPa or more and 2500 MPa or less, and more preferably 200 MPa or more and 2000 MPa or less. When the tensile elastic modulus is less than 100 MPa, the film is likely to be wrinkled, and the handleability may be deteriorated due to the occurrence of air biting during laminating. Further, if the tensile elastic modulus exceeds 3000 MPa, warpage occurs and dimensional stability is lowered when the base material and the adhesive layer film are laminated. By setting the tensile elastic modulus as described above, it is possible to obtain a laminated body having good handleability, suppressing warpage, and excellent dimensional stability.

The method for producing the adhesive film of the present embodiment is not particularly limited, and the following methods [1] to [3] can be exemplified.
[1] An adhesive polyimide is applied to an arbitrary substrate in a solution state (for example, in the state of an adhesive composition) to form a coating film, which is dried at a temperature of, for example, 80 to 180 ° C. to form a film. A method of peeling from the substrate as needed after the conversion.
[2] A method in which a solution of polyamic acid, which is a precursor of adhesive polyimide, is applied to an arbitrary base material, dried, imidized to form a film, and then peeled off from the base material as necessary.
[3] A method in which a solution of polyamic acid, which is a precursor of adhesive polyimide, is applied to an arbitrary substrate, dried, and then the gel film of polyamic acid is peeled off from the substrate and imidized to obtain an adhesive film.
The method of applying the adhesive polyimide solution (or polyamic acid solution) on the substrate is not particularly limited, and for example, it can be applied with a coater such as a comma, a die, a knife, or a lip.

Next, a laminate, a metal-clad laminate, a circuit board, and a multilayer circuit board, which are preferred embodiments to which a resin film is applied, will be described with reference to specific examples.

[Laminate]
The laminated body 100 according to the embodiment of the present invention has, for example, as shown in FIG. 1, a base material 10 and an adhesive layer 20 laminated on at least one surface of the base material 10. The adhesive layer 20 is made of the above-mentioned adhesive film. The laminated body 100 may include any layer other than the above. Examples of the base material 10 in the laminate 100 include a base material of an inorganic material such as a copper foil and a glass plate, and a base material of a resin material such as a polyimide film, a polyamide film, and a polyester film. The laminate 100 can be manufactured according to any one of [1] to [3] of the above-mentioned method for manufacturing an adhesive film, except that it does not peel off from the base material 10. Further, the laminate 100 may be manufactured by separately preparing the base material 10 and the adhesive film and bonding them together.
Preferred embodiments of the laminate 100 include a coverlay film, a copper foil with a resin, and the like.

[Coverlay film]
Although not shown, the coverlay film which is one aspect of the laminated body 100 is a coverlay film material layer as a base material 10 and an adhesive layer laminated on one side of the coverlay film material layer. The adhesive layer 20 is made of the above-mentioned adhesive film. The coverlay film may contain any layer other than the above.

The material of the coverlay film material layer is not particularly limited, and for example, a polyimide-based film such as a polyimide resin, a polyetherimide resin, or a polyamide-imide resin, a polyamide-based film, or a polyester-based film can be used. Among these, it is preferable to use a polyimide film having excellent heat resistance. Further, the coverlay film material may contain a black pigment in order to effectively exhibit light-shielding property, concealing property, design property, etc., and the surface of the film material may contain a black pigment as long as the effect of improving the dielectric property is not impaired. It can contain any component such as a matte pigment that suppresses gloss.

The thickness of the coverlay film material layer is not particularly limited, but is preferably in the range of, for example, 5 μm or more and 100 μm or less.
The thickness of the adhesive layer 20 is not particularly limited, but is preferably in the range of, for example, 10 μm or more and 75 μm or less.

The coverlay film of the present embodiment can be manufactured by the method exemplified below.
First, as a first method, a polyimide to be an adhesive layer 20 is put on one side of a film material layer for a coverlay in a solution state (for example, a varnish containing a solvent is preferable, and an adhesive composition is preferable). The coverlay film having the coverlay film material layer and the adhesive layer 20 can be formed by, for example, drying at a temperature of 80 to 180 ° C. to form the adhesive layer 20.

Further, as a second method, the polyimide for the adhesive layer 20 is applied on an arbitrary substrate in a solution state (for example, a varnish containing a solvent is preferable, and an adhesive composition is preferable). A resin film for the adhesive layer 20 is formed by peeling after drying at a temperature of, for example, 80 to 180 ° C., and this resin film is used with a film material layer for coverlay, for example, at a temperature of 60 to 220 ° C. A coverlay film can be formed by thermocompression bonding with.

[Copper foil with resin]
Although not shown, the copper foil with resin, which is another aspect of the laminated body 100, is obtained by laminating the adhesive layer 20 on at least one side of the copper foil as the base material 10, and the adhesive layer 20 adheres to the above. It consists of an agent film. The copper foil with resin of the present embodiment may contain any layer other than the above.

The thickness of the adhesive layer 20 in the resin-attached copper foil is preferably in the range of, for example, 0.1 to 125 μm, more preferably in the range of 0.3 to 100 μm. If the thickness of the adhesive layer 20 does not reach the above lower limit value, there may be a problem that sufficient adhesiveness cannot be guaranteed. On the other hand, if the thickness of the adhesive layer 20 exceeds the above upper limit value, problems such as deterioration of dimensional stability occur. Further, from the viewpoint of low dielectric constant and low dielectric loss tangent, the thickness of the adhesive layer 20 is preferably 3 μm or more.

The material of the copper foil in the copper foil with resin is preferably one containing copper or a copper alloy as a main component. The thickness of the copper foil is preferably 35 μm or less, more preferably in the range of 5 to 25 μm. From the viewpoint of production stability and handleability, the lower limit of the thickness of the copper foil is preferably 5 μm. The copper foil may be rolled copper foil or electrolytic copper foil. Further, as the copper foil, a commercially available copper foil can be used.

The copper foil with resin may be prepared, for example, by sputtering a metal on an adhesive film to form a seed layer and then forming a copper layer by, for example, copper plating, or the adhesive film and the copper foil. May be prepared by laminating by a method such as thermocompression bonding. Further, in the copper foil with resin, in order to form the adhesive layer 20 on the copper foil, a coating liquid of adhesive polyimide or its precursor is cast, dried to form a coating film, and then subjected to necessary heat treatment. May be prepared.

[Metal-clad laminate]
(First aspect)
The metal-clad laminate according to the embodiment of the present invention includes an insulating resin layer and a metal layer laminated on at least one surface of the insulating resin layer, and at least one layer of the insulating resin layer is described above. It consists of an adhesive film. The metal-clad laminate of the present embodiment may include any layer other than the above.

(Second aspect)
The metal-clad laminate according to another embodiment of the present invention includes, for example, an insulating resin layer 30, an adhesive layer 20 laminated on at least one surface of the insulating resin layer 30, and the adhesive layer 20 as shown in FIG. It is a so-called three-layer metal-clad laminate 101 provided with a metal layer M laminated on the insulating resin layer 30 via an adhesive layer 20, and the adhesive layer 20 is made of the above-mentioned adhesive film. .. The three-layer metal-clad laminate 101 may include any layer other than the above. In the three-layer metal-clad laminate 101, the adhesive layer 20 may be provided on one side or both sides of the insulating resin layer 30, and the metal layer M may be provided on one side or one side of the insulating resin layer 30 via the adhesive layer 20. It suffices if it is provided on both sides. That is, the three-layer metal-clad laminate 101 may be a single-sided metal-clad laminate or a double-sided metal-clad laminate. A single-sided FPC or a double-sided FPC can be manufactured by processing a wiring circuit by etching the metal layer M of the three-layer metal-clad laminate 101 or the like.

The insulating resin layer 30 in the three-layer metal-clad laminate 101 is not particularly limited as long as it is made of a resin having electrical insulating properties, and is, for example, polyimide, epoxy resin, phenol resin, polyethylene, polypropylene, or polytetra. Fluoroethylene, silicone, ETFE and the like can be mentioned, but it is preferably composed of polyimide. The polyimide layer constituting the insulating resin layer 30 may be a single layer or a plurality of layers, but preferably includes a non-thermoplastic polyimide layer.

The thickness of the insulating resin layer 30 in the three-layer metal-clad laminate 101 is preferably in the range of, for example, 1 to 125 μm, and more preferably in the range of 5 to 100 μm. If the thickness of the insulating resin layer 30 does not reach the above lower limit value, there may be a problem that sufficient electrical insulation cannot be guaranteed. On the other hand, if the thickness of the insulating resin layer 30 exceeds the above upper limit value, problems such as warpage of the metal-clad laminated board are likely to occur.

The thickness of the adhesive layer 20 in the three-layer metal-clad laminate 101 is preferably in the range of, for example, 0.1 to 125 μm, more preferably in the range of 0.3 to 100 μm. In the three-layer metal-clad laminate 101 of the present embodiment, if the thickness of the adhesive layer 20 does not reach the above lower limit value, there may be a problem that sufficient adhesiveness cannot be guaranteed. On the other hand, if the thickness of the adhesive layer 20 exceeds the above upper limit value, problems such as deterioration of dimensional stability occur. Further, from the viewpoint of reducing the dielectric constant and the low dielectric loss tangent of the entire insulating layer, which is a laminate of the insulating resin layer 30 and the adhesive layer 20, the thickness of the adhesive layer 20 is preferably 3 μm or more.

The ratio of the thickness of the insulating resin layer 30 to the thickness of the adhesive layer 20 (thickness of the insulating resin layer 30 / thickness of the adhesive layer 20) is preferably in the range of, for example, 0.1 to 3.0, and is 0. The range of .15 to 2.0 is more preferable. By setting such a ratio, the warp of the three-layer metal-clad laminate 101 can be suppressed. Further, the insulating resin layer 30 may contain a filler, if necessary. Examples of the filler include silicon dioxide, aluminum oxide, magnesium oxide, beryllium oxide, boron nitride, aluminum nitride, silicon nitride, aluminum fluoride, calcium fluoride, and metal salts of organic phosphinic acid. These can be used alone or in admixture of two or more.

(Third aspect)
The metal-clad laminate according to still another embodiment of the present invention is, for example, as shown in FIG. 3, a bonded metal in which at least two single-sided metal-clad laminates are bonded via an adhesive layer 20. It is a stretch laminated plate 102. The bonded type metal-clad laminate 102 includes a first single-sided metal-clad laminate 41, a second single-sided metal-clad laminate 42, a first single-sided metal-clad laminate 41, and a second single-sided metal-clad laminate. An adhesive layer 20 laminated between the 42 and the adhesive layer 20 is provided, and the adhesive layer 20 is made of the above-mentioned adhesive film.
Here, the first single-sided metal-clad laminate 41 has a first metal layer M1 and a first insulating resin layer 31 laminated on at least one surface of the first metal layer M1. ing. The second single-sided metal-clad laminate 42 has a second metal layer M2 and a second insulating resin layer 32 laminated on at least one surface of the second metal layer M2. The adhesive layer 20 is arranged so as to come into contact with the first insulating resin layer 31 and the second insulating resin layer 32. The laminated metal-clad laminate 102 may include any layer other than the above.

The first insulating resin layer 31 and the second insulating resin layer 32 in the laminated metal-clad laminate 102 have the same configuration as the insulating resin layer 30 of the three-layer metal-clad laminate 101 of the second aspect. good.
In the bonded type metal-clad laminate 102, a first single-sided metal-clad laminate 41 and a second single-sided metal-clad laminate 42 are prepared, respectively, and the first insulating resin layer 31 and the second insulating resin layer 32 are formed. It can be manufactured by arranging and adhering an adhesive film between the two.

(Fourth aspect)
In the metal-clad laminate according to still another embodiment of the present invention, for example, as shown in FIG. 4, the insulating resin layer 33 and the metal layer M laminated on one surface of the insulating resin layer 33 are provided. A single-sided metal-clad laminate 103 with an adhesive layer comprising a single-sided metal-clad laminate having an adhesive layer 20 laminated on the other surface of the insulating resin layer 33, wherein the adhesive layer 20 is described above. It consists of an adhesive film. The metal-clad laminate 103 with an adhesive layer may contain any layer other than the above.
The insulating resin layer 33 in the metal-clad laminate 103 with an adhesive layer may have the same configuration as the insulating resin layer 30 in the three-layer metal-clad laminate 101 of the second aspect.
The metal-clad laminate 103 with an adhesive layer can be manufactured by preparing a single-sided metal-clad laminate having an insulating resin layer 33 and a metal layer M, and adhering an adhesive film to the side of the insulating resin layer 33.

In any of the above-exemplified metal-clad laminates of the first to fourth aspects, the material of the metal layer M (including the first metal layer M1 and the second metal layer M2; the same applies hereinafter) is used. The present invention is not particularly limited, and examples thereof include copper, stainless steel, iron, nickel, beryllium, aluminum, zinc, indium, silver, gold, tin, zirconium, tantalum, titanium, lead, magnesium, manganese, and alloys thereof. Of these, copper or a copper alloy is particularly preferable. The material of the wiring layer in the circuit board described later is also the same as that of the metal layer M.

The thickness of the metal layer M is not particularly limited, but when a metal foil such as a copper foil is used, it is preferably 35 μm or less, and more preferably 5 to 25 μm. From the viewpoint of production stability and handleability, the lower limit of the thickness of the metal foil is preferably 5 μm. When copper foil is used, either rolled copper foil or electrolytic copper foil may be used. Further, as the copper foil, a commercially available copper foil can be used. Further, the metal foil may be subjected to surface treatment with, for example, siding, aluminum alcoholate, aluminum chelate, silane coupling agent, etc. for the purpose of rust prevention treatment and improvement of adhesive strength.

[Circuit board]
(First aspect)
The circuit board according to the embodiment of the present invention is formed by wiring the metal layer of the metal-clad laminate according to any one of the above embodiments. A circuit board such as an FPC can be manufactured by processing one or more metal layers of a metal-clad laminate into a pattern by a conventional method to form a wiring layer (conductor circuit layer). The circuit board may include a coverlay film that covers the wiring layer.

(Second aspect)
The circuit board 200 according to another embodiment of the present invention includes, for example, as shown in FIG. 5, a first base material 11 and a wiring layer 50 laminated on at least one surface of the first base material 11. The adhesive layer 20 is laminated so as to cover the wiring layer 50 on the surface of the first base material 11 on the wiring layer 50 side, and the adhesive layer 20 is made of the adhesive film. .. The circuit board 200 may include any layer other than the above.
The first base material 11 in the circuit board 200 may have the same structure as the insulating resin layer of the metal-clad laminate. The circuit board 200 attaches an adhesive film to the wiring layer 50 side of the circuit board including the first base material 11 and the wiring layer 50 laminated on at least one surface of the first base material 11. Can be manufactured by

(Third aspect)
In the circuit board 201 according to still another embodiment of the present invention, for example, as shown in FIG. 6, the wiring layer 50 laminated on at least one surface of the first base material 11 and the first base material 11 And, on the surface of the first base material 11 on the side of the wiring layer 50, the adhesive layer 20 laminated so as to cover the wiring layer 50, and on the surface of the adhesive layer 20 on the side opposite to the first base material 11. The second base material 12 and the laminated second base material 12 are provided, and the adhesive layer 20 is made of the above-mentioned adhesive film. The circuit board 201 may include any layer other than the above. The first base material 11 and the second base material 12 in the circuit board 201 may have the same configuration as the insulating resin layer of the metal-clad laminate.
The circuit board 201 is provided via an adhesive film on the wiring layer 50 side of the circuit board including the first base material 11 and the wiring layer 50 laminated on at least one surface of the first base material 11. It can be manufactured by laminating the second base material 12.

(Fourth aspect)
The circuit board 202 according to still another embodiment of the present invention has an adhesive layer laminated on at least one surface of the first base material 11 and the first base material 11, as shown in FIG. 7, for example. 20 and the second base material 12 laminated on the surface of the adhesive layer 20 opposite to the first base material 11, and the adhesive layer of the first base material 11 and the second base material 12. The wiring layers 50 and 50 laminated on the surface opposite to the 20 are provided, and the adhesive layer 20 is made of the adhesive film. The circuit board 202 may include any layer other than the above. The first base material 11 and the second base material 12 in the circuit board 202 may have the same configuration as the insulating resin layer of the metal-clad laminate.
The circuit board 202 includes a first circuit board including a first base material 11, a wiring layer 50 laminated on at least one surface of the first base material 11, and a second base material 12. A second circuit board having a wiring layer 50 laminated on at least one surface of the second base material 12 is prepared, and the first base material 11 of the first circuit board and the first base material 12 are prepared. It can be manufactured by arranging and adhering an adhesive film between the second base material 12 of the circuit board 2 and the second base material 12.

[Multilayer circuit board]
The multilayer circuit board according to the embodiment of the present invention includes a laminate in which a plurality of insulating resin layers are laminated, and one or more wiring layers embedded in the laminate, and has a plurality of insulations. At least one or more of the resin layers are formed of an adhesive layer 20 having adhesiveness and covering the wiring layer, and the adhesive layer 20 is made of the above-mentioned adhesive film. The multilayer circuit board of the present embodiment may include any layer other than the above.
For example, as shown in FIG. 8, the multilayer circuit board 203 of the present embodiment has at least two or more insulating resin layers 34 and at least two or more wiring layers 50, and at least one of the wiring layers 50. The layer is covered with the adhesive layer 20. The adhesive layer 20 that covers the wiring layer 50 may partially cover the surface of the wiring layer 50, or may cover the entire surface of the wiring layer 50. Further, the multilayer circuit board 203 may optionally have a wiring layer 50 exposed on the surface of the multilayer circuit board 203. Further, it may have an interlayer connection electrode (via electrode) in contact with the wiring layer 50. The wiring layer 50 has a conductor circuit formed in a predetermined pattern on one side or both sides of the insulating resin layer 34. The conductor circuit may be patterned on the surface of the insulating resin layer 34, or may be patterned in a damascene (embedded) manner. The insulating resin layer 34 in the circuit board 203 may have the same configuration as the insulating resin layer of the metal-clad laminate.

Since the circuit board and the multilayer circuit board of each of the above embodiments include the adhesive layer 20 containing the adhesive polyimide whose aromatic ring concentration is controlled, it is possible to reduce the transmission loss even in high frequency transmission.

Examples are shown below, and the features of the present invention will be described more specifically. However, the scope of the present invention is not limited to the examples. In the following examples, various measurements and evaluations are as follows unless otherwise specified.

[Measuring method of amine value]
Approximately 2 g of the dimerdiamine composition is weighed in a 200-250 mL triangular flask, using phenolphthalein as an indicator, and a 0.1 mol / L ethanolic potassium hydroxide solution is added dropwise until the solution turns pale pink. Dissolve in about 100 mL of neutralized butanol. Add 3 to 7 drops of phenolphthalein solution to it, and titrate with stirring with 0.1 mol / L ethanolic potassium hydroxide solution until the sample solution turns pale pink. Add 5 drops of bromophenol blue solution to it, and titrate with stirring with 0.2 mol / L hydrochloric acid / isopropanol solution until the sample solution turns yellow.
The amine value is calculated by the following formula (1).
Amine value = {(V ₂ x C ₂ )-(V ₁ x C ₁ )} x M _KOH / m ... (1)
Here, the amine value is a value expressed in mg-KOH / g, and M _KOH has a molecular weight of potassium hydroxide of 56.1. V and C are the volumes and concentrations of the solutions used for titration, respectively, and the subscripts 1 and 2 are 0.1 mol / L ethanolic potassium hydroxide solution and 0.2 mol / L hydrochloric acid / isopropanol solution, respectively. Represents. Further, m is the sample weight expressed in grams.

[Measurement of Weight Average Molecular Weight (Mw) and Number Average Molecular Weight (Mn) of Polyimide]
It was measured by a gel permeation chromatograph (manufactured by Tosoh Corporation, trade name; HLC-8220GPC was used). Polystyrene was used as a standard substance, and tetrahydrofuran (THF) was used as a developing solvent.

[Calculation method of fluorine concentration]
The fluorine concentration means a percentage of the value obtained by dividing [atomic weight of fluorine atom x number of fluorine atoms] by the molecular weight of the entire structure of polyimide based on the molar ratio of the monomers in the polyimide.

[Calculation method of CM value]
Weight content of carbon atoms derived from a 6-membered aromatic ring (excluding carbon atoms of a 6-membered aromatic ring derived from a dimerdiamine composition) with respect to the weight average molecular weight (Mw) of the polyimide and the total content of all atoms in the polyimide ( From the relationship with C _p ), the CM value was calculated based on the following equation.
CM = (C _p / Mw) x 10 ⁴ ... (i)

[Calculation of aromatic ring ratio of diamine diamine composition]
The aromatic ring ratio of the diamine diamine composition was calculated by the following procedure. First, about 50 μl of the diamine diamine composition was dissolved in 550 μl of THF-d8 to prepare a sample. The prepared sample was subjected to liquid 1H-NMR measurement at room temperature using an FT-NMR apparatus (manufactured by JEOL Ltd., trade name; JNM-ECA400). The integrated value of the 1H peak derived from the aromatic ring found at 6.6 to 7.2 ppm, as opposed to the integrated value of the 1H peak derived from the CH ₂ group directly connected to the NH ₂ group observed at 2.6 to 2.9 ppm. From the ratio, the aromatic ring ratio was calculated as shown in the following formula.
Aromatic ring ratio [mol%] = (Z / Y) x 100
[Here, Y means the integral value of the 1H peak (derived from the CH ₂ group directly connected to the NH ₂ group) at 2.6 to 2.9 ppm, and Z means the integrated value at 6.6 to 7.2 ppm (derived from the aromatic ring). ) Means the integral value of the 1H peak. ]

[Calculation of area percentage of GPC and chromatogram]
(A) Dimerdiamine (b) A monoamine compound obtained by substituting a terminal carboxylic acid group of a monobasic acid compound in the range of 10 to 40 carbon atoms with a primary aminomethyl group or an amino group (c) 41 carbon atoms. An amine compound obtained by substituting a primary aminomethyl group or an amino group with a terminal carboxylic acid group of a polybasic acid compound having a hydrocarbon group in the range of -80 (excluding the dimerdiamine).

GPC prepared a sample by diluting a 100 mg solution of 20 mg dimerdiamine composition pretreated with 200 μL acetic anhydride, 200 μL pyridine and 2 mL THF with 10 mL THF (containing 1000 ppm cyclohexanone). The prepared sample was manufactured by Tosoh Corporation, trade name; HLC-8220GPC, column: TSK-gel G2000HXL, G1000HXL, G1000HXL, flow volume: 1 mL / min, column (oven) temperature: 40 ° C., injection volume: 50 μL. It was measured under the condition of. Cyclohexanone was treated as a standard substance for the correction of outflow time.

At this time, the peak top of the main peak of cyclohexanone is adjusted so that the retention time is from 27 minutes to 31 minutes, and the peak end is 2 minutes from the peak start of the main peak of cyclohexanone, and the peak of cyclohexanone is excluded. Each of the above components (a) is provided so that the peak top of the main peak is 18 minutes to 19 minutes and the peak start to peak end of the main peak excluding the cyclohexanone peak is 2 minutes to 4 minutes 30 seconds. )-(C)
(A) Component represented by the main peak;
(B) A component represented by a GPC peak detected at a time later than the minimum value on the time side where the retention time at the main peak is late;
(C) A component represented by a GPC peak detected earlier than the minimum value on the time side where the retention time at the main peak is earlier;
Was detected.

[Measurement of relative permittivity and dielectric loss tangent]
The adhesive film was allowed to stand for 24 hours under the conditions of temperature; 23 ° C., humidity; 50 RH% using a vector network analyzer (manufactured by Agilent, trade name; vector network analyzer E8633C) and an SPDR resonator, and then at a frequency of 10 GHz. Relative permittivity (ε) and dielectric loss tangent (Tanδ) were measured.

[Glass transition temperature (Tg)]
The glass transition temperature (Tg) is a temperature rise rate of 5 ° C. from 0 ° C. to 300 ° C. using a thermomechanical analyzer (TMA: manufactured by Netch Co., Ltd., trade name; TMA4000SA) for an adhesive film having a size of 5 mm × 20 mm. The measurement was performed at / minute. The temperature at which the inflection of elongation at the time of temperature rise becomes the glass transition temperature was defined as the glass transition temperature.

[Tension modulus]
The tensile modulus was measured by the following procedure. First, a test piece (width 12.7 mm × length 127 mm) was prepared from an adhesive film using a tension tester (manufactured by Orientec, trade name; Tensilon). Using this test piece, a tensile test was performed at 50 mm / min to determine the tensile elastic modulus at 25 ° C.

[Warp evaluation method]
The warp was evaluated by the following method. A polyimide film having a thickness of 25 μm (manufactured by Toray DuPont, trade name; Kapton 100EN) or a copper foil of 12 μm is coated with a polyimide solution so that the thickness after drying becomes 25 μm, and a test piece is obtained. Was produced. In this state, place the polyimide film or copper foil on the lower surface, measure the average of the warped heights at the four corners of the test piece, and measure 5 mm or less as "good" and 5 mm or more as "impossible". bottom.

[Measurement of storage elastic modulus]
The measurement was performed using a dynamic viscoelasticity measuring device (DMA: manufactured by TA Instruments, trade name: RSA-G2).

The abbreviations used in this example indicate the following compounds.
BTDA: 3,3', 4,4'-benzophenone tetracarboxylic acid dianhydride 6 FDA: 4,4'-(hexafluoroisopropylidene) diphthalic acid anhydride DDA: Aliphatic diamine with 36 carbon atoms (Cloder Japan Co., Ltd.) Manufactured by, trade name: PRIAMINE 1074 distilled and purified, amine value: 210 mgKOH / g, molecular weight: 534.29 (calculated from amine value), mixture of cyclic and chain diamine diamines, component (a); 97. 9% by weight, component (b); 0.3%, component (c); 1.8%, aromatic ring ratio; 8.2 mol%)
BAPP: 2,2-bis [4- (4-aminophenoxy) phenyl] propane HFBAPP: 2,2-bis [4- (4-aminophenoxy) phenyl] hexafluoropropane TFMB: 4,4'-diamino-2 , 2'-Bis (trifluoromethyl) biphenyl N-12: dodecane diacid dihydrazide NMP: N-methyl-2-pyrrolidone OP935: aluminum salt of phosphinic acid (manufactured by Clariant, trade name; Exolit OP935, aluminum diethylphosphinate) , Lin content 23%, average particle size 2 μm)
SR-3000: Phosphoric acid ester (manufactured by Daihachi Chemical Industry Co., Ltd., trade name; SR-3000, non-halogen aromatic condensed phosphoric acid ester, phosphorus content; 7.0%)
The molecular weight of the DDA was calculated by the following formula.
Molecular weight = 56.1 × 2 × 1000 / amine value

[Example 1]
36.23 g BTDA (0.1122 mol), 53.95 g DDA (0.1010 mol), 5.82 g HFBAPP (0.0112 mol), 134.4 g NMP and 89 in a 1000 ml separable flask. A 1.6 g of xylene was charged and mixed well at 40 ° C. for 1 hour to prepare a polyamic acid solution. This polyamic acid solution was heated to 190 ° C., heated for 5 hours, stirred, and 80.1 g of xylene was added to complete imidization of polyimide solution 1 (solid content; 30% by weight, weight average molecular weight; 47,617). , Fluorine concentration; 1.4, C _p ; 21.12%, CM value; 4.4) was prepared.

[Examples 2 to 8]
Polyimide solutions 2 to 8 were prepared in the same manner as in Example 1 except that the raw material compositions shown in Table 1 were used.

[Comparative Example 1]
A polyimide solution 9 was prepared in the same manner as in Example 1 except that the raw material compositions shown in Table 1 were used.

[Example 9]
The polyimide solution 1 was applied to one side of a release PET film 1 (manufactured by Higashiyama Film Co., Ltd., trade name; HY-S05, length x width x thickness = 200 mm x 300 mm x 25 μm), dried at 120 ° C. for 10 minutes, and dried. By peeling the adhesive layer from the release PET film 1, an adhesive film 9 having a thickness of 25 μm was obtained. The various evaluation results of the adhesive film 9 are as follows.
ε; 2.7, Tanδ; 0.0016, Tg; 44 ° C, tensile modulus; 440 MPa, thermoplastic

[Examples 10 to 16]
Adhesive films 10 to 16 were obtained in the same manner as in Example 9 except that the polyimide solutions 2 to 8 were used. The results of various characteristic evaluations are shown in Table 2.

[Comparative Example 2]
An adhesive film 17 was obtained in the same manner as in Example 9 except that the polyimide solution 9 was used. The results of various characteristic evaluations are shown in Table 2.

[Example 17]
Add 1.1 g of N-12 (0.004 mol) to 100 g of polyimide solution 1 (30 g as solid content), add 7.5 g of OP935 and 14.0 g of xylene to dilute, and stir for another 1 hour. The adhesive composition 17 was prepared by the above.

[Examples 18 to 23]
Adhesive compositions 18 to 23 were prepared in the same manner as in Example 17, except that polyimide solutions 2 to 7 were used.

[Example 24]
Add 1.1 g of N-12 (0.004 mol) to 100 g of polyimide solution 5 (30 g as solid content), add 6.0 g of SR-3000 and 14.0 g of xylene to dilute, and further 1 The adhesive composition 24 was prepared by stirring for hours.

[Example 25]
The adhesive composition 17 is applied to one side of the release PET film 1 and dried at 80 ° C. for 15 minutes to obtain a resin sheet 24 having an adhesive layer thickness of 25 μm, and then the adhesive layer is released from the release PET. By peeling from the film 1, an adhesive film 25 having a thickness of 25 μm was obtained.

[Examples 26 to 32]
Resin sheets 26 to 32 were obtained in the same manner as in Example 25, except that the adhesive compositions 18 to 24 were used, and then adhesive films 26 to 32 were obtained.

[Example 33]
Adhesive composition 17 is applied to one side of polyimide film 1 (manufactured by Toray DuPont, trade name; Kapton 50EN, ε = 3.6, tanδ = 0.0084, length x width x thickness = 200 mm x 300 mm x 12 μm). The film was applied and dried at 80 ° C. for 15 minutes to obtain a coverlay film 33 having an adhesive layer thickness of 25 μm. The warped state of the obtained coverlay film 33 was "good".

[Examples 34 and 35]
Coverlay films 34 and 35 were obtained in the same manner as in Example 33 except that the adhesive composition 19 or 24 was used. The warped state of the obtained coverlay films 34 and 35 was "good".

[Example 36]
The release PET film 1 was laminated on the adhesive layer side of the coverlay film 33 so as to be in contact with the adhesive layer, and pressure-bonded at a temperature of 160 ° C. and a pressure of 0.8 MPa for 2 minutes using a vacuum laminator. Then, the adhesive composition 17 was applied to the polyimide film 1 side of the coverlay film 33 in which the release PET film 1 was crimped so that the thickness after drying was 25 μm, and dried at 80 ° C. for 15 minutes. rice field. Then, the adhesive composition 17 was applied and laminated on the dried surface so that the release PET film 1 was in contact with the surface, and pressure-bonded to both sides of the polyimide film at a temperature of 160 ° C. and a pressure of 0.8 MPa for 2 minutes using a vacuum laminator. A polyimide adhesive laminate 36 provided with an adhesive was obtained.

[Examples 37 and 38]
Polyimide adhesive laminates 37 and 38 were obtained in the same manner as in Example 36 except that the coverlay films 34 and 35 were used and the adhesive composition 19 or 24 was applied.

[Example 39]
The adhesive composition 17 was applied to one side of an electrolytic copper foil having a thickness of 12 μm and dried at 80 ° C. for 15 minutes to obtain a copper foil 39 with a resin having an adhesive layer thickness of 25 μm. The warped state of the obtained copper foil 39 with resin was "good".

[Examples 40 and 41]
Copper foils 40 and 41 with resin were obtained in the same manner as in Example 39 except that the adhesive composition 19 or 24 was used. The warped states of the obtained resin-attached copper foils 40 and 41 were all "good".

[Example 42]
The adhesive composition 17 was applied to one side of an electrolytic copper foil having a thickness of 12 μm and dried at 80 ° C. for 30 minutes to obtain a copper foil 42 with a resin having an adhesive layer thickness of 50 μm. The warped state of the obtained copper foil 42 with resin was "good".

[Example 43]
The adhesive composition 17 was further applied to the surface of the adhesive layer of the resin-attached copper foil 42 and dried at 80 ° C. for 30 minutes to obtain a resin-attached copper foil 43 having a total thickness of the adhesive layer of 100 μm. .. The warped state of the obtained copper foil 43 with resin was "good".

[Example 44]
The adhesive composition 17 is applied to one side of the release PET film 1, dried at 80 ° C. for 30 minutes, and the adhesive layer is peeled off from the release PET film 1 to obtain an adhesive film 44 having a thickness of 50 μm. Got

[Example 45]
Adhesive film 44, polyimide film 2 (manufactured by DuPont, trade name; Kapton 100-EN, thickness 25 μm, ε ₁ = 3.6, tan δ ₁ = 0.0084), adhesive on an electrolytic copper foil with a thickness of 12 μm. The film 44 and the electrolytic copper foil having a thickness of 12 μm are sequentially laminated, pressure-bonded at a temperature of 160 ° C. and a pressure of 0.8 MPa for 2 minutes using a vacuum laminator, then heated from room temperature to 160 ° C. and heat-treated at 160 ° C. for 4 hours. A copper-clad laminate 45 was obtained.

[Examples 46 and 47]
Adhesive films 46 and 47 having a thickness of 50 μm were obtained in the same manner as in Example 44 except that the adhesive composition 19 or 24 was used.

[Examples 48 and 49]
Copper-clad laminates 48 and 49 were obtained in the same manner as in Example 45 except that the adhesive films 46 and 47 were used.

[Example 50]
Laminated on an electrolytic copper foil with a thickness of 12 μm so that the adhesive layer side of the coverlay film 33 is in contact with the copper foil, pressure-bonded at a temperature of 160 ° C. and a pressure of 0.8 MPa for 2 minutes using a vacuum laminator, and then from room temperature to 160. The temperature was raised to ° C. and heat treatment was performed at 160 ° C. for 2 hours to obtain a copper-clad laminate 50.

[Examples 51 and 52]
Copper-clad laminates 51 and 52 were obtained in the same manner as in Example 50 except that the coverlay films 34 and 35 were used.

[Example 53]
An adhesive film 25 is laminated on a rolled copper foil having a thickness of 12 μm, laminated so that the polyimide film side of the coverlay film 33 is in contact with the adhesive film 25, and further, a thickness of 12 μm is formed on the adhesive layer side of the coverlay film 33. Rolled copper foils are sequentially laminated, pressure-bonded at a temperature of 160 ° C. and a pressure of 0.8 MPa for 2 minutes using a vacuum laminator, then heated from room temperature to 160 ° C. and heat-treated at 160 ° C. for 2 hours to form a copper-clad laminate. I got 53.

[Examples 54 and 55]
Copper-clad in the same manner as in Example 51, except that the adhesive films 27 and 32 were used instead of the adhesive film 25 and the coverlay films 34 and 35 were used instead of the coverlay film 33, respectively. Laminated plates 54 and 55 were manufactured.

[Example 56]
Two sheets of copper foil 43 with resin are prepared, and polyimide film 3 (manufactured by DuPont, trade name; Kapton 200-EN, thickness 50 μm, ε = 3.6,) is placed on the adhesive layer side of the two sheets of copper foil 43 with resin. Laminated so that tan δ = 0.0084) is in contact with each other, crimped with a vacuum laminator at a temperature of 160 ° C. and a pressure of 0.8 MPa for 5 minutes, then heated from room temperature to 160 ° C. and heat-treated at 160 ° C. for 4 hours. , A copper-clad laminate 56 was obtained.

[Example 57]
The adhesive composition 24 is applied to the polyimide side of a single-sided copper-clad laminate 1 (manufactured by Nittetsu Chemical & Materials Co., Ltd., trade name; Espanex MC12-25-00UEM, length x width x thickness = 200 mm x 300 mm x 25 μm). Then, it was dried at 80 ° C. for 30 minutes to obtain a copper-clad laminate 57 with an adhesive having an adhesive layer thickness of 50 μm. Laminate the copper-clad laminate 57 with adhesive so that the surface of the single-sided copper-clad laminate 1 is in contact with the resin layer side, and use a small precision press machine at a temperature of 160 ° C. and a pressure of 4.0 MPa. The pressure was applied for 120 minutes to obtain a copper-clad laminate 57.

[Example 58]
Two copper-clad laminates with adhesives 57 are laminated so that the surfaces on the adhesive layer side are in contact with each other, and pressure-bonded at a temperature of 160 ° C., a pressure of 4.0 MPa, and 120 minutes using a small precision press to laminate the copper-clad laminates. I got a plate 58.

[Example 59]
An adhesive film 44 is laminated on the resin layer side of the single-sided copper-clad laminate 1, and further laminated on the adhesive film 44 so that the resin layer side of the single-sided copper-clad laminate 1 is in contact with the adhesive film 44. A copper-clad laminate 59 was obtained by pressure-bonding at a temperature of 160 ° C. and a pressure of 4.0 MPa for 120 minutes.

[Example 60]
The adhesive composition 17 is applied to one side of the release PET film 1, dried at 80 ° C. for 15 minutes, and the adhesive layer is peeled off from the release PET film 1 to obtain an adhesive film 60 having a thickness of 15 μm. Got

[Example 61]
An adhesive film 60 is laminated on the resin layer side of the single-sided copper-clad laminate 1, and further laminated on the adhesive film 60 so that the resin layer side of the single-sided copper-clad laminate 1 is in contact with the adhesive film 60. A copper-clad laminate 61 was obtained by crimping at a temperature of 160 ° C., a pressure of 4.0 MPa, and 120 minutes for 120 minutes.

[Example 62]
A double-sided copper-clad laminate 2 (manufactured by Nittetsu Chemical & Materials Co., Ltd., trade name; Espanex MB12-25-00UEG) was prepared, and the copper foil on one side was subjected to circuit processing by etching to form a conductor circuit layer. A wiring board 62A was obtained.

The copper foil on one side of the double-sided copper-clad laminate 2 was removed by etching to obtain a copper-clad laminate 62B.

The adhesive film 25 is sandwiched between the surface of the wiring board 62A on the conductor circuit layer side and the surface of the copper-clad laminate 62B on the resin layer side, and in a laminated state, the temperature is 160 ° C., the pressure is 4.0 MPa, and the pressure is 120 minutes. Thermocompression bonding was performed to obtain a multilayer circuit board 62.

[Example 63]
Insulating substrate made of liquid crystal polymer film (manufactured by Kuraray, trade name; CTZ, thickness; 50 μm, CTE; 18 ppm / K, heat distortion temperature; 300 ° C., ε = 3.40, tan δ = 0.0022) A copper-clad laminate 63 provided with an electrolytic copper foil having a thickness of 18 μm on both sides thereof was prepared, and the copper foil on one surface was subjected to circuit processing by etching to obtain a wiring board 63A having a conductor circuit layer formed therein. rice field.

The copper foil on one side of the copper-clad laminate 63 was removed by etching to obtain a copper-clad laminate 63B.

The adhesive film 44 is sandwiched between the surface of the wiring board 63A on the conductor circuit layer side and the surface of the copper-clad laminate 63B on the insulating substrate layer side, and in a laminated state, the temperature is 160 ° C. and the pressure is 4.0 MPa. , Thermocompression bonding for 120 minutes to obtain a multilayer circuit board 63.

Although the embodiments of the present invention have been described in detail for the purpose of illustration, the present invention is not limited to the above embodiments and can be modified in various ways.

10 ... base material, 11 ... first base material, 12 ... second base material, 20 ... adhesive layer, 30, 33, 34 ... insulating resin layer, 31 ... first insulating resin layer, 32 ... second Insulation resin layer, 41 ... first single-sided metal-clad laminate, 42 ... second single-sided metal-clad laminate, 50 ... wiring layer, M ... metal layer, M1 ... first metal layer, M2 ... second Metal layer, 100 ... Laminate, 101 ... Three-layer metal-clad laminate, 102 ... Laminated metal-clad laminate, 103 ... Metal-clad laminate with adhesive layer, 200, 201, 202 ... Circuit board, 203 ... Multilayer Circuit board

Claims (25)

A polyimide containing a tetracarboxylic acid residue derived from a tetracarboxylic acid anhydride component and a diamine residue derived from a diamine component.
The following conditions a to c;
a) A tetracarboxylic acid residue containing a fluorine atom and / or a diamine residue containing a fluorine atom is contained, and the total content of the fluorine atom with respect to the total content of all the atoms in the polyimide is 1% by weight or more 20. Must be in the range of% by weight or less;
b) Contains 40 mol% or more of diamine residues derived from aliphatic diamines with respect to all diamine residues;
c) Being a thermoplastic polyimide;
Polyimide characterized by satisfying. The polyimide according to claim 1, wherein the aliphatic diamine is a dimerdiamine composition containing a dimerdiamine as a main component, wherein the two terminal carboxylic acid groups of the dimer acid are replaced with a primary aminomethyl group or an amino group. The polyimide according to claim 1, wherein the weight average molecular weight is in the range of 5,000 to 200,000. The content of carbon atoms derived from the 6-membered aromatic ring (excluding the carbon atom of the 6-membered aromatic ring derived from the dimerdiamine composition) with respect to the total content of all the atoms in the polyimide is in the range of 12 to 40% by weight. The polyimide according to claim 1. The following formula (i),
CM value = (C / Mw) x 10 ⁴ ... (i)
[In the formula, C means the weight content of the carbon atom derived from the 6-membered aromatic ring (excluding the carbon atom of the 6-membered aromatic ring derived from the dimerdiamine composition) with respect to the total content of all the atoms in the polyimide. Mw means the weight average molecular weight of polyimide]
The polyimide according to claim 1, wherein the CM value, which is an index indicating the amount of the 6-membered aromatic ring contained in the polyimide, is in the range of 3 to 38, which is calculated based on the above. A polyimide solution containing the polyimide according to any one of claims 1 to 5 and a solvent capable of dissolving the polyimide. A polyimide film containing a polyimide containing a tetracarboxylic acid residue derived from a tetracarboxylic acid anhydride component and a diamine residue derived from a diamine component as a resin component.
The polyimide contains a tetracarboxylic acid residue containing a fluorine atom and / or a diamine residue containing a fluorine atom, and the total content of the fluorine atom is higher than the total content of all the atoms in the polyimide. Within the range of 1% by weight or more and 20% by weight or less,
The dielectric loss tangent (Tanδ) at 10 GHz measured by a split post dielectric resonator (SPDR) after 24 hours humidity control under constant temperature and humidity conditions (normal condition) of 23 ° C. and 50% RH is less than 0.002. A polyimide film characterized by this. The polyimide film according to claim 7, wherein the polyimide contains 40 mol% or more of a diamine residue derived from an aliphatic diamine with respect to all diamine residues. The polyimide film according to claim 8, wherein the aliphatic diamine is a diamine diamine composition containing a diamine diamine as a main component, wherein the two terminal carboxylic acid groups of the dimer acid are replaced with a primary aminomethyl group or an amino group. .. The polyimide film according to claim 7, wherein the polyimide has a weight average molecular weight in the range of 5,000 to 200,000. The content of carbon atoms derived from the 6-membered aromatic ring (excluding the carbon atoms of the 6-membered aromatic ring derived from the dimerdiamine composition) with respect to the total content of all the atoms in the polyimide is within the range of 12 to 40% by weight. The polyimide film according to claim 7. The following formula (i),
CM value = (C / Mw) x 10 ⁴ ... (i)
[In the formula, C means the weight content of the carbon atom derived from the 6-membered aromatic ring (excluding the carbon atom of the 6-membered aromatic ring derived from the dimerdiamine composition) with respect to the total content of all the atoms in the polyimide. Mw means the weight average molecular weight of polyimide]
The polyimide film according to claim 7, wherein the CM value, which is an index indicating the amount of the 6-membered aromatic ring contained in the polyimide, is in the range of 3 to 38, which is calculated based on the above. An adhesive film made of the polyimide film according to claim 7. A laminate having a substrate and an adhesive layer laminated on at least one surface of the substrate.
A laminate characterized in that the adhesive layer is made of the adhesive film according to claim 13. A coverlay film having a coverlay film material layer and an adhesive layer laminated on the coverlay film material layer.
A coverlay film comprising the adhesive film according to claim 13. A copper foil with a resin in which an adhesive layer and a copper foil are laminated.
A copper foil with a resin, wherein the adhesive layer is made of the adhesive film according to claim 13. A metal-clad laminate having an insulating resin layer and a metal layer laminated on at least one surface of the insulating resin layer.
A metal-clad laminate characterized in that at least one layer of the insulating resin layer is made of the adhesive film according to claim 13. A metal-clad laminate having an insulating resin layer, an adhesive layer laminated on at least one surface of the insulating resin layer, and a metal layer laminated on the insulating resin layer via the adhesive layer. ,
A metal-clad laminate characterized in that the adhesive layer is made of the adhesive film according to claim 13. A first single-sided metal-clad laminate having a first metal layer and a first insulating resin layer laminated on at least one surface of the first metal layer.
A second single-sided metal-clad laminate having a second metal layer and a second insulating resin layer laminated on at least one surface of the second metal layer.
It was arranged so as to be in contact with the first insulating resin layer and the second insulating resin layer, and was laminated between the first single-sided metal-clad laminate and the second single-sided metal-clad laminate. A metal-clad laminate with an adhesive layer,
A metal-clad laminate characterized in that the adhesive layer is made of the adhesive film according to claim 13. A single-sided metal-clad laminate having an insulating resin layer, a metal layer laminated on one surface of the insulating resin layer, and an adhesive layer laminated on the other surface of the insulating resin layer are provided. The metal-clad laminate, wherein the adhesive layer is made of the adhesive film according to claim 13. A circuit board obtained by wiring processing the metal layer of the metal-clad laminate according to claim 17. The first base material, the wiring layer laminated on at least one surface of the first base material, and the surface of the first base material on the side of the wiring layer were laminated so as to cover the wiring layer. A circuit board with an adhesive layer,
A circuit board characterized in that the adhesive layer is made of the adhesive film according to claim 13. The first base material, the wiring layer laminated on at least one surface of the first base material, and the surface of the first base material on the side of the wiring layer were laminated so as to cover the wiring layer. A circuit board comprising an adhesive layer and a second substrate laminated on a surface of the adhesive layer opposite to the first substrate.
A circuit board characterized in that the adhesive layer is made of the adhesive film according to claim 13. A second base material, an adhesive layer laminated on at least one surface of the first base material, and a second base material laminated on the surface of the adhesive layer opposite to the first base material. A circuit board comprising the base material of the above, and a wiring layer laminated on a surface of the first base material and the second base material opposite to the adhesive layer.
A circuit board characterized in that the adhesive layer is made of the adhesive film according to claim 13. A multilayer circuit board comprising a laminate including a plurality of laminated insulating resin layers and at least one or more wiring layers embedded inside the laminate.
At least one layer or more of the plurality of insulating resin layers is formed of an adhesive layer having adhesiveness and covering the wiring layer.
A multilayer circuit board characterized in that the adhesive layer is made of the adhesive film according to claim 13.

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