JP2022054895A - Inspection device and processing device - Google Patents

Abstract

To provide an inspection device and a processing device that can shorten a measurement time by ultrasonic waves and miniaturize the devices.SOLUTION: An inspection device 1 includes: an ultrasonic unit 30 that transmits and receives ultrasonic waves to/from an inspected object on a holding table 10 rotated by a rotation mechanism 20; a liquid layer formation unit 40 that forms a liquid layer between the inspected object and the ultrasonic unit 30; a movement mechanism 50 that linearly and relatively moves the ultrasonic unit 30 and the inspected object in a direction parallel to a surface of the inspected object; and a control unit 80. The control unit 80 linearly and relatively moves the holding table 10 and the ultrasonic unit 30 along a linear region including the center of the inspected object while rotating the holding table 10 to obtain inspection information on the inspected object, images the inspection information based on the intensity of a reflected wave received by the ultrasonic unit 30, and performs control so that overlap of beams of the ultrasonic waves on the inspected object is the same over the entire surface of the inspected object.SELECTED DRAWING: Figure 1

Description

The present invention relates to an inspection device and a processing device.

In an ultrasonic imaging device (SAT: Scanning Acoustic Tomograph), ultrasonic measurement is performed while scanning an ultrasonic transmission / reception sensor (probe) along the surface of an object to be inspected such as a semiconductor or an integrated circuit installed in water. It is known to check for defects (peeling and voids) in the inspected object (see Patent Document 1).

Japanese Unexamined Patent Publication No. 2017-0758813

When using a configuration that scans the probe in the XY direction as in a conventional ultrasonic imaging device, ultrasonic waves are transmitted and received at equal intervals, so there is an advantage that there is no variation in the measurement position and the position accuracy is good. Since the acceleration / deceleration distance of the shaft is required for each line, there is a problem that it takes time and the size of the device becomes large.

The present invention has been made in view of such a problem, and an object of the present invention is to provide an inspection device and a processing device capable of shortening the measurement time by ultrasonic waves and reducing the size of the device.

In order to solve the above-mentioned problems and achieve the object, the inspection device of the present invention is an inspection device for inspecting a disk-shaped inspected object, and is a holding table having a holding surface for holding the inspected object. And a rotation mechanism that rotates the holding table, an ultrasonic unit that transmits and receives ultrasonic waves to the object to be inspected held in the holding table, and a liquid layer between the object to be inspected and the ultrasonic unit. A moving mechanism that linearly moves the ultrasonic unit and the object to be inspected held on the holding table in a direction parallel to the surface of the object to be inspected, and each component. The control unit comprises a control unit that controls the holding table while rotating the holding table in a state of holding the object to be inspected along a linear region including the center of the object to be inspected. The inspection information is based on the movement control unit that linearly and relatively moves the ultrasonic unit, the inspection information acquisition unit that acquires the inspection information of the inspected object, and the intensity of the reflected wave received by the ultrasonic unit. It has an imaging unit that images It is characterized by controlling.

In the inspection device of the present invention, the control unit is inspected in a state where the movement control unit fixes the rotation speed of the holding table and the relative movement speed between the holding table and the ultrasonic unit at a constant speed. The imaging unit acquires the inspection information in the inner peripheral portion so that the information acquisition unit acquires the inspection information and the overlap of the ultrasonic beams on the inspected object is the same in the inner peripheral portion and the outer peripheral portion. May be thinned out to form an image.

In the inspection device of the present invention, the control unit is inspected in a state where the movement control unit fixes the rotation speed of the holding table and the relative movement speed between the holding table and the ultrasonic unit at a constant speed. The oscillation frequency of the ultrasonic unit is set to the inspected object so that the information acquisition unit acquires the inspection information and the overlap of the ultrasonic beams on the inspected object is the same in the inner peripheral portion and the outer peripheral portion. It may be changed between the inner peripheral portion and the outer peripheral portion of the.

In the inspection device of the present invention, the ultrasonic unit is an ultrasonic unit for inner peripheral inspection that transmits and receives ultrasonic waves to the inner peripheral portion of the inspected object, and an ultrasonic unit for the outer peripheral portion of the inspected object. The ultrasonic unit for inspecting the inner peripheral portion and the ultrasonic unit for inspecting the outer peripheral portion include an ultrasonic unit for inspecting the outer peripheral portion that transmits and receives sound waves. They may be arranged side by side in the radial direction with an interval of / 2.

In the inspection device of the present invention, the oscillation frequency of the inner peripheral portion inspection ultrasonic unit may be set lower than the oscillation frequency of the outer peripheral portion inspection ultrasonic unit.

Further, the processing apparatus of the present invention is a processing apparatus for processing a workpiece, and the inspection apparatus for inspecting the workpiece and the workpiece held on the machining table after the inspection by the inspection apparatus. It is characterized by having a processing unit for processing.

According to the present invention, the measurement time by ultrasonic waves can be shortened and the device can be miniaturized.

FIG. 1 is a perspective view showing a configuration example of an inspection device according to an embodiment. FIG. 2 is a side view showing a state of a main part in the inspection operation by the inspection apparatus shown in FIG. 1 in a partial cross section. FIG. 3 is a diagram showing an example of a measurement position in which an ultrasonic wave is applied to an object to be inspected. FIG. 4 is a diagram in which inspection information is thinned out for the measurement positions shown in FIG. FIG. 5 is an image of an example of inspection information of a comparative example. FIG. 6 is a side view showing a state of a main part in the inspection operation by the inspection device according to the modified example in a partial cross section. FIG. 7 is a perspective view showing a configuration example of the processing apparatus according to the application form.

An embodiment (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Further, various omissions, substitutions or changes of the configuration can be made without departing from the gist of the present invention.

[Embodiment]
The inspection device 1 according to the embodiment of the present invention will be described with reference to the drawings. First, the overall configuration of the inspection device 1 according to the embodiment will be described. FIG. 1 is a perspective view showing a configuration example of the inspection device 1 according to the embodiment. FIG. 2 is a side view showing a state of a main part in the inspection operation by the inspection device 1 shown in FIG. 1 in a partial cross section. In the following description, the X-axis direction is one direction in the horizontal plane. The Y-axis direction is a direction orthogonal to the X-axis direction in the horizontal plane. The Z-axis direction is a direction orthogonal to the X-axis direction and the Y-axis direction.

The inspection device 1 is a device for inspecting a disk-shaped object to be inspected 100. The object to be inspected 100 is, for example, a TSV (Through-Silicon Via) wafer that enables connection of electrodes of both chips by bonding two chips to each other by means of through electrodes. The support wafer that is the base of the TSV wafer is, for example, a disk-shaped semiconductor wafer whose substrate is silicon (Si), sapphire (Al ₂ O ₃ ), gallium arsenide (GaAs), silicon carbide (SiC), or optical. Wafers such as device wafers. The diameter of the object to be inspected 100 is 4 inches in the embodiment.

The inspection device 1 confirms, for example, a defect in peeling or bonding such as voids at the interface of the TSV wafer. The inspection device 1 includes a holding table 10, a rotation mechanism 20, an ultrasonic unit 30, a liquid layer forming unit 40, a moving mechanism 50, and a control unit 80.

The holding table 10 holds the object to be inspected 100 on the holding surface 11. The holding surface 11 has a disk shape formed of, for example, porous ceramics or the like. In the embodiment, the holding surface 11 is a plane parallel to the horizontal direction. The holding surface 11 is connected to, for example, a vacuum suction source via a vacuum suction path, and sucks and holds the object to be inspected 100 placed on the holding surface 11. A dish-shaped liquid receiving portion 12 for receiving the liquid supplied from the liquid layer forming unit 40 to the inspected object 100 is provided around the holding table 10.

The rotation mechanism 20 is connected to the lower surface side of the holding table 10. The rotation mechanism 20 rotates the holding table 10 around an axis parallel to the Z-axis direction. The axis of the rotation mechanism 20 is fixed to the device main body 2 of the inspection device 1. The rotation speed of the holding table 10 by the rotation mechanism 20 can be controlled by the movement control unit 81 of the control unit 80 described later.

The ultrasonic unit 30 transmits and receives ultrasonic waves 31 to and from the object to be inspected 100 held on the holding table 10. The tip surface of the ultrasonic unit 30 faces the holding surface 11 of the holding table 10. The ultrasonic unit 30 includes, for example, a piezoelectric vibrator that oscillates an ultrasonic wave 31 having a predetermined frequency from a tip surface. The ultrasonic unit 30 receives the reflected wave of the ultrasonic wave 31. The ultrasonic unit 30 is supported vertically on the device main body 2 so as to be movable in the Z-axis direction and the Y-axis direction via the Z-axis movement mechanism 70 and the Y-axis movement mechanism 60 of the movement mechanism 50 described later. It is supported by the frame 3. In the embodiment, the ultrasonic unit 30 is fixed to the moving base 71 of the Z-axis moving mechanism 70.

The liquid layer forming unit 40 forms a liquid layer between the object to be inspected 100 and the ultrasonic unit 30. The liquid layer forming unit 40 includes a supply pipe 41 to which a liquid is supplied from a liquid supply source (not shown). The opening at the tip of the supply pipe 41 is provided adjacent to the ultrasonic unit 30. The liquid layer forming unit 40 supplies a liquid between the object to be inspected 100 and the ultrasonic unit 30 through the opening at the tip of the supply pipe 41, whereby the liquid is supplied between the object to be inspected 100 and the ultrasonic unit 30. Form a layer. The liquid is, for example, pure water. The liquid layer forming unit 40 is erected on the main body 2 of the apparatus so as to be movable in the Z-axis direction and the Y-axis direction via the Z-axis movement mechanism 70 and the Y-axis movement mechanism 60 of the movement mechanism 50 described later. It is supported by the support frame 3. In the embodiment, the liquid layer forming unit 40 is fixed to the moving base 71 of the Z-axis moving mechanism 70.

The moving mechanism 50 includes a Y-axis moving mechanism 60 and a Z-axis moving mechanism 70. The Y-axis moving mechanism 60 linearly and relatively moves the ultrasonic unit 30 and the object to be inspected 100 held on the holding table 10 in a direction parallel to the surface of the object to be inspected 100. In the embodiment, the Y-axis moving mechanism 60 moves the ultrasonic unit 30 and the liquid layer forming unit 40 in the Y-axis direction. The Y-axis moving mechanism 60 includes, for example, a well-known ball screw rotatably provided around the axis parallel to the Y-axis direction, a well-known motor that rotates the ball screw around the axis, and a moving base 61. It is equipped with a well-known guide rail that supports it so as to be movable in the Y-axis direction. In the embodiment, the guide rail of the Y-axis moving mechanism 60 is installed on a horizontal beam connecting the upper ends of the pair of pillars of the support frame 3 of the inspection device 1.

In the embodiment, the Z-axis moving mechanism 70 moves the ultrasonic unit 30 and the liquid layer forming unit 40 in the Z-axis direction. The Z-axis moving mechanism 70 includes, for example, a well-known ball screw rotatably provided around the axis parallel to the Z-axis direction, a well-known motor that rotates the ball screw around the axis, and a moving base 71. It is equipped with a well-known guide rail that supports it so as to be movable in the Y-axis direction. In the embodiment, the guide rail of the Z-axis moving mechanism 70 is installed on the moving base 61 of the Y-axis moving mechanism 60.

The control unit 80 controls each of the above-mentioned components of the inspection device 1. The control unit 80 is a computer including, for example, an arithmetic processing unit as an arithmetic means, a storage device as a storage means, and an input / output interface device as a communication means. The arithmetic processing unit includes, for example, a microprocessor such as a CPU (Central Processing Unit). The storage device has a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory). The arithmetic processing unit performs various operations based on a predetermined program stored in the storage device. The arithmetic processing unit outputs various control signals to the above-mentioned components via the input / output interface apparatus according to the arithmetic result, and controls the inspection apparatus 1. The control unit 80 includes a movement control unit 81, an inspection information acquisition unit 82, and an imaging unit 83.

The movement control unit 81 controls the rotation mechanism 20, the Y-axis movement mechanism 60 of the movement mechanism 50, and the Z-axis movement mechanism 70. The movement control unit 81 controls the rotation mechanism 20 so as to rotate the holding table 10 in a state of holding the object to be inspected 100, for example. The movement control unit 81 is, for example, the Y-axis movement mechanism 60 of the movement mechanism 50 so as to linearly move the holding table 10 and the ultrasonic unit 30 relative to each other along a linear region including the center of the object to be inspected 100. To control. In the embodiment, the movement control unit 81 controls the Y-axis movement mechanism 60 of the movement mechanism 50 so as to linearly move the ultrasonic unit 30 along a linear region including the center of the object to be inspected 100. do.

The inspection information acquisition unit 82 acquires the inspection information of the object to be inspected 100 by the ultrasonic unit 30. More specifically, the inspection information acquisition unit 82 acquires the intensity of the reflected wave of the ultrasonic wave 31 received by the ultrasonic unit 30 oscillating at a predetermined frequency. The imaging unit 83 images the inspection information based on the intensity of the reflected wave of the ultrasonic wave 31 received by the ultrasonic unit 30 (see, for example, FIGS. 3 and 4).

In the inspection device 1 of the embodiment, the ultrasonic unit 30 is linearly moved in a direction parallel to the surface of the object to be inspected 100 while rotating the holding table 10 by the control unit 80. More specifically, after the tip of the ultrasonic unit 30 is positioned at the center of the object to be inspected 100, the ultrasonic unit 30 is moved from the inner circumference to the outer circumference while rotating the holding table 10. 30 scans the inspected object 100. The ultrasonic unit 30 spirally scans the entire surface of the object to be inspected 100 without repeating acceleration and deceleration.

In the embodiment, for example, the rotation speed of the holding table 10 is 10 rpm, and the radial movement speed of the object 100 to be inspected of the ultrasonic unit 30 is 0.083 mm / s. The ultrasonic unit 30 may be positioned at the outer edge of the object to be inspected 100 and then moved from the outer circumference to the inner circumference.

FIG. 3 is a diagram showing an example of a measurement position where the ultrasonic wave 31 is irradiated on the object to be inspected 100. FIG. 3 shows the measurement positions when the rotation speed of the holding table 10, the moving speed of the ultrasonic unit 30, and the oscillation frequency of the ultrasonic 31 are constant during the inspection. As shown in FIG. 3, the beam spots 32 on the inspected object 100 of the ultrasonic wave 31 oscillated from the ultrasonic unit 30 are the beam spots 32 in the inner peripheral portion as compared with the outer peripheral portion of the inspected object 100. The overlap is dense. The outer peripheral portion indicates a predetermined region on the surface of the object to be inspected 100, which is radially outside the inner peripheral portion and includes the outer peripheral portion. The inner peripheral portion indicates a predetermined region on the surface of the object to be inspected 100, which is radially inside from the outer peripheral portion and includes the central portion. The size of the beam spot 32 on the surface of the object 100 to be inspected by the ultrasonic wave 31 is about 20 μm or more and 200 μm or less in diameter.

FIG. 4 is a diagram in which inspection information is thinned out for the measurement positions shown in FIG. As shown in FIG. 4, in the control unit 80, the overlap of the beam spots 32 on the inspected object 100 of the ultrasonic wave 31 oscillated from the ultrasonic unit 30 is equivalent over the entire surface of the inspected object 100. It is possible to control the output of the image. Equivalence includes those in which the overlap ratio of the beam spots 32 is within a predetermined range. The overlap ratio of the beam spot 32 is, for example, the ratio of the overlap width to the diameter of the beam spot 32. The predetermined range is set, for example, so that the overlap ratio of the beam spots 32 is 20% or more and 70% or less (a state in which about 1/2 or more and 3/2 or less of the radius of the beam spot 32 overlaps), and the control unit 80 is set. It is stored in the storage device in advance.

In the control unit 80, for example, the imaging unit 83 thins out the inspection information of the inner peripheral portion of the inspected object 100, so that the overlap of the beam spots 32 of the ultrasonic waves 31 on the inspected object 100 is the inner peripheral portion and the outer peripheral portion. Image so that it is equivalent to the part. In this case, when the inspection information acquisition unit 82 acquires the inspection information, the movement control unit 81 sets the rotation speed of the holding table 10 and the relative movement speed between the holding table 10 and the ultrasonic unit 30 at a constant speed. Maintain a fixed state. That is, in the embodiment, the movement control unit 81 maintains a state in which the rotation speed of the holding table 10 and the movement speed of the ultrasonic unit 30 are fixed at a constant speed. Further, the oscillation frequency of the ultrasonic wave 31 is constant. The control unit 80 is shown in FIG. 4, in which the inspection information acquisition unit 82 acquires the inspection information corresponding to the position of the beam spot 32 of the image shown in FIG. 3, and then the imaging unit 83 thins out the inspection information of the inner peripheral portion. An intensity distribution image of the ultrasonic wave 31 corresponding to the position of the beam spot 32 of the image is generated.

An example of a procedure for thinning out inspection information and forming an image will be described. First, the control unit 80 determines the relative moving speed of the ultrasonic unit 30 with respect to the inspected object 100 at the time of measurement, and the diameter of the beam spot 32 on the inspected object 100 of the ultrasonic wave 31 irradiated by the ultrasonic unit 30. , Are stored in advance.

The control unit 80 drives the ultrasonic unit 30, the liquid layer forming unit 40, and the moving mechanism 50 to perform ultrasonic measurement of the object to be inspected 100. More specifically, the intensity of the reflected ultrasonic wave 31 when the ultrasonic unit 30 irradiates the ultrasonic wave 31 is stored for each beam spot 32.

Next, based on the relative moving speed of the ultrasonic unit 30 stored in advance by the control unit 80, the position where each beam spot 32 that has acquired the intensity of the ultrasonic wave 31 is irradiated is specified. As a result, data indicating the measurement position of the ultrasonic wave 31 corresponding to the coordinates on the object to be inspected 100 as shown in FIG. 3 is generated. At this time, each beam spot 32 is associated with the intensity of the reflected ultrasonic wave 31 when the ultrasonic unit 30 irradiates the ultrasonic wave 31.

Next, among the data indicating the measurement position of the ultrasonic wave 31, the beam spot 32 located at the outermost periphery is used as a reference, and the beam spot 32 partially overlaps with the reference beam spot 32 and the scanning direction (spiral direction) is larger than that of the reference beam spot 32. ), The beam spot 32 on the inner peripheral side is extracted. Of the extracted beam spots 32, the beam spot 32 having an overlap rate of more than 70% with the reference beam spot 32 and the beam spot 32 having an overlap rate of less than 20% with the reference beam spot 32 are deleted. After that, among the remaining beam spots 32, only the beam spot 32 farthest from the reference beam spot 32 is left, and the other extracted beam spots 32 are deleted. When the overlap ratio between the beam spots 32 is small, that is, the beam spot 32 having the overlap ratio of a predetermined value (for example, 20% or more) does not exist in the outer peripheral portion on the object to be inspected 100, the control unit 80 has a control unit 80. Do not perform the above process. In this case, the control unit 80 executes the above processing only in the region where the beam spot 32 having the overlap ratio of a predetermined value (for example, 20% or more) exists.

Next, with the remaining beam spot 32 as a reference, the same process is repeatedly executed up to the beam spot 32 closest to the center of the object to be inspected 100. As a result, the measurement position of the ultrasonic wave 31 corresponding to the coordinates on the inspected object 100 as shown in FIG. 4 is shown, and the overlap of the beam spots 32 is made equal over the front surface of the inspected object 100. The thinned data is generated. Further, based on the intensity of the ultrasonic wave 31 associated with the beam spot 32 that remains after being thinned out, an intensity distribution image of the ultrasonic wave 31 corresponding to the position of the beam spot 32 in the image shown in FIG. 4 is generated. ..

The control unit 80 may, for example, change the oscillation frequency of the ultrasonic unit 30 between the inner peripheral portion and the outer peripheral portion of the inspected object 100 so that the beam spots 32 of the ultrasonic waves 31 on the inspected object 100 are aligned with each other. The image may be made so that the overlap is the same in the inner peripheral portion and the outer peripheral portion. More specifically, the control unit 80 changes the oscillation frequency of the ultrasonic wave 31 oscillated by the ultrasonic unit 30 so as to increase from the inner peripheral portion to the outer peripheral portion. In this case, when the inspection information acquisition unit 82 acquires the inspection information, the movement control unit 81 sets the rotation speed of the holding table 10 and the relative movement speed between the holding table 10 and the ultrasonic unit 30 at a constant speed. Maintain a fixed state. That is, in the embodiment, the movement control unit 81 maintains a state in which the rotation speed of the holding table 10 and the movement speed of the ultrasonic unit 30 are fixed at a constant speed. In the control unit 80, after the inspection information acquisition unit 82 acquires the inspection information corresponding to the position of the beam spot 32 of the image shown in FIG. 4, the imaging unit 83 generates an image including all the inspection information.

Further, in the control unit 80, for example, by shifting the rotation speed of the holding table 10 and the movement speed of the ultrasonic unit 30 by the movement control unit 81, the beam spots 32 of the ultrasonic waves 31 on the object to be inspected 100 are connected to each other. Inspection information may be acquired and imaged so that the overlap is equivalent between the inner peripheral portion and the outer peripheral portion.

FIG. 5 is an image of an example of inspection information of a comparative example. The inspection information of the comparative example is the information acquired by the conventional inspection apparatus that scans the probe in the XY direction. As shown in FIG. 5, when scanning the object 100 to be inspected by the linear beam line 33, the ultrasonic unit 30 that oscillates the ultrasonic wave 31 is decelerated in the acceleration / deceleration region 34 corresponding to both ends of the beam line 33. And need to accelerate. Therefore, the inspection by linear scanning by the conventional inspection device takes about 20 min for one inspected object 100. On the other hand, in the inspection by the spiral scanning by the inspection device 1 of the embodiment, it is not necessary to decelerate and accelerate the ultrasonic unit 30, so that the required time for one inspected object 100 is shortened to about 10 min.

Next, the inspection device 1-2 according to the modified example will be described with reference to the drawings. FIG. 6 is a side view showing a state of a main part in the inspection operation by the inspection device 1-2 according to the modified example in a partial cross section. In FIG. 6, the same parts as those in the embodiment are designated by the same reference numerals, and the description thereof will be omitted. Compared with the inspection device 1 of the embodiment, the inspection device 1-2 of the modified example has the ultrasonic unit 30-1 for inner peripheral inspection and the ultrasonic unit 30-for inspection of the outer peripheral portion instead of the ultrasonic unit 30. It differs in that it has 2.

The ultrasonic unit 30-1 for inspecting the inner peripheral portion transmits and receives ultrasonic waves 31 to and from the inner peripheral portion of the object to be inspected 100 held on the holding table 10. The tip surface of the ultrasonic unit 30-1 for inspecting the inner peripheral portion faces the holding surface 11 of the holding table 10. The ultrasonic unit 30-1 for inspecting the inner peripheral portion includes, for example, a piezoelectric vibrator that oscillates an ultrasonic wave 31 having a predetermined frequency from the front end surface. The ultrasonic unit 30-1 for inspection of the inner peripheral portion receives the reflected wave of the ultrasonic wave 31.

The ultrasonic unit 30-2 for inspecting the outer peripheral portion transmits and receives ultrasonic waves 31 to and from the outer peripheral portion of the object to be inspected 100 held on the holding table 10. The tip surface of the ultrasonic unit 30-2 for inspecting the outer peripheral portion faces the holding surface 11 of the holding table 10. The ultrasonic unit 30-2 for inspecting the outer peripheral portion includes, for example, a piezoelectric vibrator that oscillates an ultrasonic wave 31 having a predetermined frequency from the front end surface. The ultrasonic unit 30-2 for inspection of the outer peripheral portion receives the reflected wave of the ultrasonic wave 31.

The ultrasonic unit for inspection of the inner peripheral portion 30-1 and the ultrasonic unit for inspection of the outer peripheral portion 30-2 are arranged side by side in the radial direction of the object to be inspected with a predetermined interval 35. More specifically, the ultrasonic unit 30-1 for inspection of the inner peripheral portion and the ultrasonic unit 30-2 for inspection of the outer peripheral portion are arranged with an interval of r / 2 35 when the radius 101 of the object to be inspected 100 is r. Arranged in. The oscillation frequency of the ultrasonic unit for inspection of the inner peripheral portion 30-1 may be set lower than the oscillation frequency of the ultrasonic unit for inspection of the outer peripheral portion 30-2.

As shown in the modified example, the measurement time can be shortened by about half by providing two ultrasonic units (inner peripheral inspection ultrasonic unit 30-1 and outer peripheral inspection ultrasonic unit 30-2). Can be done. When imaging each inspection information acquired by the two ultrasonic units, the seams of the respective images may be combined by image processing. Further, at this time, the sensitivity of each image may be adjusted in order to obtain a uniform image over the entire surface of the object to be inspected 100.

Next, the processing apparatus 200 of the application form to which the inspection apparatus 1 is applied will be described with reference to the drawings. FIG. 7 is a perspective view showing a configuration example of the processing apparatus 200 according to the application form.

The processing device 200 is a processing device for processing the workpiece (object to be inspected 100), and in an applied form, the surface of the workpiece thinned by the grinding device is polished in order to be flattened with high accuracy. It is a polishing device. The processing device 200 to which the inspection device 1 is applied is not limited to the polishing device, and may be a cutting device that cuts the workpiece, a grinding device that grinds the workpiece, or the like.

In the application mode, the processing apparatus 200 includes a processing table 210, a processing unit 220, a cleaning unit 230, a moving unit 240, cassettes 204 and 205, an alignment unit 250, a loading unit 260, and a loading / unloading unit 270. The inspection device 1-3 and the control unit 280 are provided.

The processing table 210 holds the object to be inspected 100 (see FIG. 1 and the like) on the holding surface 211. The holding surface 211 has a disk shape formed of, for example, porous ceramics or the like. The holding surface 211 is a plane parallel to the horizontal direction in the applied embodiment. The holding surface 211 is connected to a vacuum suction source via, for example, a vacuum suction path, and sucks and holds the object to be inspected 100 placed on the holding surface 211.

The processing table 210 is supported by a support base 212 so as to be rotatable around an axis parallel to the Z-axis direction. The processing table 210 is provided by a Y-axis moving unit (not shown) of the moving unit 240 described later, over the loading / unloading position 213 near the loading / unloading unit 260 and the loading / unloading unit 270, and the machining position 214 below the machining unit 220. It is provided so as to be movable in the Y-axis direction.

The processing unit 220 processes the workpiece held on the processing table 210 after the inspection by the inspection device 1 described later. The processing unit 220 is a polishing unit that polishes the surface of the workpiece in the applied form. The machining unit 220 includes a spindle housing 221, a spindle 222, and a polishing tool 223. The spindle housing 221 is supported by a pillar 202 erected from the apparatus main body 201 so as to be movable in the Z-axis direction via the Z-axis moving unit 241 of the moving unit 240 described later.

The spindle 222 is rotatably provided around the axis in the spindle housing 221. The spindle 222 is arranged so that its axis is parallel to the Z-axis direction. The spindle 222 is rotated around the axis by the spindle motor 224. A disk-shaped tool mounting member 225 for mounting the polishing tool 223 is attached to the lower end of the spindle 222.

The polishing tool 223 is attached to the lower end of the spindle 222. The polishing tool 223 includes an annular support base 226 and an annular polishing pad 227. The support base 226 is formed of, for example, an aluminum alloy. The polishing pad 227 is attached to the lower surface of the support base 226 and polishes the surface of the workpiece held on the processing table 210. The polishing pad 227 is formed of, for example, abrasive grains such as a felt grindstone in which abrasive grains are dispersed and fixed in polyurethane or felt. The polishing tool 223 is mounted on the tool mounting member 225 by superimposing the support base 226 on the lower surface of the tool mounting member 225 and mounting the support base 226 on the tool mounting member 225 by a bolt (not shown).

When machining with the machining unit 220, first, the polishing pad 227 of the polishing tool 223 is arranged to face the holding surface 211 of the machining table 210 at the machining position 214. Next, the machining table 210 located at the machining position 214 is rotated around the axis, and the polishing tool 223 is rotated by the spindle 222, while the Z-axis moving unit 241 places the polishing pad 227 on the workpiece along the Z-axis direction. Press on. The processing unit 220 polishes the surface of the workpiece with the polishing pad 227 by pressing the polishing pad 227 of the polishing tool 223 against the surface of the workpiece along the Z-axis direction.

The cleaning unit 230 is a unit that cleans the workpiece after polishing. The cleaning unit 230 removes contamination such as polishing debris adhering to the ground and polished surface by cleaning the workpiece after polishing.

The moving unit 240 includes a Y-axis moving unit (not shown) and a Z-axis moving unit 241. The Y-axis moving unit is provided in the apparatus main body 201, and moves the machining table 210 along the Y-axis direction over the carry-in / carry-out position 213 and the machining position 214. The Z-axis moving unit 241 is provided on a pillar 202 erected from the apparatus main body 201, and moves the spindle housing 221 of the machining unit 220 along the Z-axis direction.

The cassettes 204 and 205 have a plurality of slots and are accommodators for accommodating the workpiece in each slot. For example, one cassette 204 contains a work piece before polishing, and the other cassette 205 contains a work piece after polishing.

The alignment unit 250 is a table on which the workpiece taken out from the cassette 204 is temporarily placed and the center alignment is performed.

The carry-in unit 260 has a suction pad. The carry-in unit 260 sucks and holds the work piece before polishing, which is aligned by the alignment unit 250, and carries it onto the processing table 210 located at the carry-in / carry-out position 213. The carry-in unit 260 sucks and holds the work piece after polishing held on the processing table 210 located at the carry-in / carry-out position 213 and carries it out to the cleaning unit 230.

The carry-in / out unit 270 is, for example, a robot pick provided with a U-shaped hand 271, and the U-shaped hand 271 sucks and holds the workpiece and conveys it. Specifically, the carry-in / out unit 270 carries out the work piece before polishing from the cassette 204 to the alignment unit 250, and carries in the work piece after polishing from the cleaning unit 230 to the cassette 205.

The inspection device 1-3 includes a holding table, an ultrasonic unit 30-3, a liquid layer forming unit (not shown), and a moving mechanism (not shown), similarly to the inspection device 1 of the embodiment. The inspected object 100 inspected by the inspection apparatus 1-3 is processed as an inspected object by the processing unit 220. In the applied form, the holding table for holding the object to be inspected 100 is common to the machining table 210 when machining by the machining unit 220, but is not limited to this, and is provided separately from the machining table 210 for inspection. It may be a holding table.

In the application mode, the ultrasonic unit 30-3 is supported by a support frame 203 erected from the apparatus main body 201 so as to straddle the processing table 210 located at the carry-in / carry-out position 213. In the inspection device 1-3, the ultrasonic unit 30-3 moves linearly relative to the machining table 210 in the Y-axis direction by the Y-axis moving unit (not shown) of the moving unit 240. The liquid layer forming unit of the inspection device 1-3 is provided adjacent to the ultrasonic unit 30-3.

The control unit 280 controls each of the above-mentioned components of the processing apparatus 200. The control unit 280 is a computer including, for example, an arithmetic processing unit as an arithmetic means, a storage device as a storage means, and an input / output interface device as a communication means. The arithmetic processing unit includes, for example, a microprocessor such as a CPU. The storage device has a memory such as ROM or RAM. The arithmetic processing unit performs various operations based on a predetermined program stored in the storage device. The arithmetic processing unit outputs various control signals to the above-mentioned components via the input / output interface apparatus according to the arithmetic result, and controls the processing apparatus 200. The control unit 280 includes a movement control unit 81, an inspection information acquisition unit 82, and an imaging unit 83. Since the movement control unit 81, the inspection information acquisition unit 82, and the imaging unit 83 have the same functions as those in the embodiment, the description thereof will be omitted.

As described above, the inspection devices 1, 1-2, and 1-3 according to the embodiment, the modified example, and the applied embodiment are superposed while rotating the holding table 10 (machining table 210) holding the object to be inspected 100. The sound wave units 30, 30-1, 30-2, and 30-3 are moved in one direction parallel to the holding surfaces 11, 211. As a result, unlike a conventional inspection device that scans linearly, it is not necessary to accelerate or decelerate each line, and since only the inside of the object to be inspected 100 can be scanned, the measurement time by the ultrasonic wave 31 is shortened and the device is used. Can be miniaturized. Further, the variation in the measurement pitch between the inner peripheral portion and the outer peripheral portion of the object to be inspected 100 is reduced by thinning out the inspection information of the inner peripheral portion, an image without spots is obtained, and the load of image processing and communication is reduced. This has the effect of improving the throughput.

The present invention is not limited to the above embodiment. That is, it can be variously modified and carried out within a range that does not deviate from the gist of the present invention. For example, the liquid layer forming unit 40 of the embodiment supplies the liquid from the supply pipe 41 adjacent to the ultrasonic unit 30, but even if it is a liquid tank in which the object 100 held on the holding table 10 is immersed in the liquid. good. Further, the inspection device 1 may include a notification unit that detects a defect such as when the void is at least a predetermined value and notifies an alarm.

1, 1-2, 1-3 Inspection device 10 Holding table 11 Holding surface 20 Rotation mechanism 30, 30-3 Ultrasonic unit 30-1 Ultrasonic unit for inner peripheral inspection 30-2 Ultrasonic unit for outer peripheral inspection 31 Ultrasonic wave 40 Liquid layer forming unit 50 Movement mechanism 60 Y-axis movement mechanism 70 Z-axis movement mechanism 80 Control unit 81 Movement control unit 82 Inspection information acquisition unit 83 Imaging unit 100 Inspected object 101 Radius 200 Processing equipment 210 Processing table 220 Processing unit

Claims (6)

It is an inspection device that inspects a disk-shaped object to be inspected.
A holding table having a holding surface for holding the inspected object,
A rotation mechanism for rotating the holding table and
An ultrasonic unit that transmits and receives ultrasonic waves to the object to be inspected held on the holding table, and
A liquid layer forming unit that forms a liquid layer between the object to be inspected and the ultrasonic unit,
A moving mechanism that linearly and relatively moves the ultrasonic unit and the object to be inspected held on the holding table in a direction parallel to the surface of the inspected object.
A control unit that controls each component and
Have,
The control unit is
A movement control unit that linearly moves the holding table and the ultrasonic unit along a linear region including the center of the inspected object while rotating the holding table in a state of holding the inspected object. ,
The inspection information acquisition unit that acquires the inspection information of the inspected object,
It has an imaging unit that images the inspection information based on the intensity of the reflected wave received by the ultrasonic unit.
An inspection device, characterized in that the overlap of beams of ultrasonic waves oscillated from the ultrasonic unit on the inspected object is controlled to be equal over the entire surface of the inspected object. The control unit is
The inspection information acquisition unit acquires inspection information in a state where the movement control unit fixes the rotation speed of the holding table and the relative movement speed between the holding table and the ultrasonic unit at a constant speed.
The feature is that the imaging unit thins out the inspection information on the inner peripheral portion and images it so that the overlap of the ultrasonic beams on the inspected object is the same in the inner peripheral portion and the outer peripheral portion. do,
The inspection device according to claim 1. The control unit is
The inspection information acquisition unit acquires inspection information in a state where the movement control unit fixes the rotation speed of the holding table and the relative movement speed between the holding table and the ultrasonic unit at a constant speed.
The oscillation frequency of the ultrasonic unit is changed between the inner peripheral portion and the outer peripheral portion of the inspected object so that the overlap of the ultrasonic beams on the inspected object is the same in the inner peripheral portion and the outer peripheral portion. Characterized by letting
The inspection device according to claim 1. The ultrasonic unit is
An ultrasonic unit for inspecting the inner circumference, which transmits and receives ultrasonic waves to the inner circumference of the object to be inspected,
An ultrasonic unit for inspection of the outer peripheral portion, which transmits and receives ultrasonic waves to the outer peripheral portion of the object to be inspected,
Including
When the radius of the object to be inspected is r, the ultrasonic unit for inspection of the inner peripheral portion and the ultrasonic unit for inspection of the outer peripheral portion are arranged side by side in the radial direction with an interval of r / 2. Characteristic,
The inspection device according to any one of claims 1 to 3. The oscillation frequency of the ultrasonic unit for inspection of the inner peripheral portion is set lower than the oscillation frequency of the ultrasonic unit for inspection of the outer peripheral portion.
The inspection device according to claim 4. It is a processing device that processes the workpiece,
The inspection device according to any one of claims 1 to 5 for inspecting the workpiece, and the inspection apparatus.
A processing unit that processes the workpiece held on the processing table after inspection by the inspection device, and
A processing device characterized by having.

Images