JP2022050434A5 - - Google Patents

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Publication number
JP2022050434A5
JP2022050434A5 JP2021205735A JP2021205735A JP2022050434A5 JP 2022050434 A5 JP2022050434 A5 JP 2022050434A5 JP 2021205735 A JP2021205735 A JP 2021205735A JP 2021205735 A JP2021205735 A JP 2021205735A JP 2022050434 A5 JP2022050434 A5 JP 2022050434A5
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JP
Japan
Prior art keywords
monomer
group derived
mol
adhesive composition
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021205735A
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Japanese (ja)
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JP7326417B2 (en
JP2022050434A (en
Filing date
Publication date
Priority claimed from PCT/JP2021/013041 external-priority patent/WO2021200715A1/en
Application filed filed Critical
Publication of JP2022050434A publication Critical patent/JP2022050434A/en
Publication of JP2022050434A5 publication Critical patent/JP2022050434A5/ja
Priority to JP2023079622A priority Critical patent/JP7405298B2/en
Priority to JP2023079621A priority patent/JP7405297B2/en
Application granted granted Critical
Publication of JP7326417B2 publication Critical patent/JP7326417B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (7)

構成単位として下記のモノマー（Ａ）由来の基およびモノマー（Ｂ）由来の基を含有し、全構成単位の合計量を１００モル％としたときに、モノマー（Ａ）由来の基を２５モル％以上、モノマー（Ｂ）由来の基を２０モル％以上含有し、かつモノマー（Ａ）由来の基およびモノマー（Ｂ）由来の基の合計が６０モル％以上であり、１０ＧＨｚにおける比誘電率（εｃ）が３．０以下、誘電正接（ｔａｎδ）が０．００８以下である、ポリエステル（ただし、粉体塗料用を除く）。
モノマー（Ａ）：多環式構造を有する、多価カルボン酸成分および／または多価アルコール成分
モノマー（Ｂ）：連続して１０以上の炭素鎖を有する、多価カルボン酸成分および／または多価アルコール成分 When the following group derived from the monomer (A) and the group derived from the monomer (B) are contained as the constituent units and the total amount of all the constituent units is 100 mol%, the group derived from the monomer (A) is 25 mol%. As described above, the specific dielectric constant at 10 GHz is 20 mol% or more containing the group derived from the monomer (B), and the total of the group derived from the monomer (A) and the group derived from the monomer (B) is 60 mol% or more. Polymer having an εc) of 3.0 or less and a dielectric positive contact (tan δ) of 0.008 or less (except for powder coating materials) .
Monomer (A): Polyvalent carboxylic acid component and / or polyhydric alcohol component having a polycyclic structure Monomer (B): Polyvalent carboxylic acid component and / or polyvalent having 10 or more consecutive carbon chains Alcohol component ガラス転移温度が－３０℃以上である請求項１に記載のポリエステル。 The polyester according to claim 1, wherein the glass transition temperature is −30 ° C. or higher. 請求項１または２に記載のポリエステルを含有するフィルム。 The film containing the polyester according to claim 1 or 2 . 請求項１または２に記載のポリエステルを含有する接着剤組成物。 The adhesive composition containing the polyester according to claim 1 or 2 . 請求項４に記載の接着剤組成物により形成された層を有する接着シート。 An adhesive sheet having a layer formed by the adhesive composition according to claim 4 . 請求項４に記載の接着剤組成物により形成された層を有する積層体。 A laminate having a layer formed by the adhesive composition according to claim 4 . 請求項６に記載の積層体を構成要素として含むプリント配線板。 A printed wiring board containing the laminate according to claim 6 as a component.
JP2021205735A 2020-03-30 2021-12-20 Polyesters, films and adhesive compositions, and adhesive sheets, laminates and printed wiring boards Active JP7326417B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023079622A JP7405298B2 (en) 2020-03-30 2023-05-12 Polyester, film and adhesive compositions, as well as adhesive sheets, laminates and printed wiring boards
JP2023079621A JP7405297B2 (en) 2020-03-30 2023-05-12 Polyester, film and adhesive compositions, as well as adhesive sheets, laminates and printed wiring boards

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020060687 2020-03-30
JP2020060687 2020-03-30
PCT/JP2021/013041 WO2021200715A1 (en) 2020-03-30 2021-03-26 Polyester, film, and adhesive composition, and adhesive sheet, laminate, and printed wiring board
JP2021538819A JP7001208B1 (en) 2020-03-30 2021-03-26 Polyester, film and adhesive compositions, as well as adhesive sheets, laminates and printed wiring boards

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2021538819A Division JP7001208B1 (en) 2020-03-30 2021-03-26 Polyester, film and adhesive compositions, as well as adhesive sheets, laminates and printed wiring boards

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2023079621A Division JP7405297B2 (en) 2020-03-30 2023-05-12 Polyester, film and adhesive compositions, as well as adhesive sheets, laminates and printed wiring boards
JP2023079622A Division JP7405298B2 (en) 2020-03-30 2023-05-12 Polyester, film and adhesive compositions, as well as adhesive sheets, laminates and printed wiring boards

Publications (3)

Publication Number Publication Date
JP2022050434A JP2022050434A (en) 2022-03-30
JP2022050434A5 true JP2022050434A5 (en) 2022-05-11
JP7326417B2 JP7326417B2 (en) 2023-08-15

Family

ID=77929980

Family Applications (4)

Application Number Title Priority Date Filing Date
JP2021538819A Active JP7001208B1 (en) 2020-03-30 2021-03-26 Polyester, film and adhesive compositions, as well as adhesive sheets, laminates and printed wiring boards
JP2021205735A Active JP7326417B2 (en) 2020-03-30 2021-12-20 Polyesters, films and adhesive compositions, and adhesive sheets, laminates and printed wiring boards
JP2023079621A Active JP7405297B2 (en) 2020-03-30 2023-05-12 Polyester, film and adhesive compositions, as well as adhesive sheets, laminates and printed wiring boards
JP2023079622A Active JP7405298B2 (en) 2020-03-30 2023-05-12 Polyester, film and adhesive compositions, as well as adhesive sheets, laminates and printed wiring boards

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2021538819A Active JP7001208B1 (en) 2020-03-30 2021-03-26 Polyester, film and adhesive compositions, as well as adhesive sheets, laminates and printed wiring boards

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2023079621A Active JP7405297B2 (en) 2020-03-30 2023-05-12 Polyester, film and adhesive compositions, as well as adhesive sheets, laminates and printed wiring boards
JP2023079622A Active JP7405298B2 (en) 2020-03-30 2023-05-12 Polyester, film and adhesive compositions, as well as adhesive sheets, laminates and printed wiring boards

Country Status (5)

Country Link
JP (4) JP7001208B1 (en)
KR (1) KR20220161323A (en)
CN (1) CN115298244B (en)
TW (1) TW202146514A (en)
WO (1) WO2021200715A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7223300B2 (en) * 2020-09-18 2023-02-16 三菱ケミカル株式会社 Polyester resin, adhesive composition and adhesive
JP7173252B2 (en) * 2020-09-24 2022-11-16 三菱ケミカル株式会社 Adhesive composition, adhesive and adhesive layer

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01221469A (en) * 1988-02-29 1989-09-04 Nippon Paint Co Ltd Powder coating resin composition
JPH06104813A (en) 1992-09-18 1994-04-15 Canon Inc Radio telephone set
JP3324159B2 (en) * 1992-10-16 2002-09-17 東洋紡績株式会社 Thermoplastic polyester elastomer
JP2011048926A (en) * 2009-08-25 2011-03-10 Teijin Fibers Ltd Wire coating material
JP5443099B2 (en) * 2009-08-25 2014-03-19 帝人株式会社 POLYESTER RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND MOLDED BODY
JP5657990B2 (en) * 2009-10-14 2015-01-21 三井化学株式会社 Laminating adhesive
JP6003089B2 (en) * 2011-03-16 2016-10-05 東洋紡株式会社 Biomass plastic paint
WO2016047289A1 (en) 2014-09-24 2016-03-31 東亞合成株式会社 Adhesive composition and laminate with adhesive layer using same
CA3065256A1 (en) * 2017-05-30 2018-12-06 Evonik Canada Inc. Prosthetic valves having a modified surface
KR102700336B1 (en) * 2017-05-30 2024-08-30 에보닉 캐나다 인크. Vascular graft with modified surface
WO2021079670A1 (en) * 2019-10-23 2021-04-29 三菱ケミカル株式会社 Adhesive composition for flexible printed wiring board, adhesive for flexible printed wiring board, and flexible printed wiring board

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