JP2022050170A - Gas feeder, lithography unit, and article manufacturing method - Google Patents

Abstract

To provide a technology advantageous for reducing a temperature distribution of a space with a simple configuration.SOLUTION: A gas feeder comprises a housing configuring a gas outlet of a gas, and a cover provided with a gap between itself and the housing to cover the housing. The cover has an opening through which the gas blown out from the gas outlet is passed. The opening is smaller than the gas outlet in a plane view when the gas outlet is seen from a front side, and is located in the region of the outlet. The cover has a first portion forming, in the plane view, a portion of the gas outlet and the opening facing a fist surface of the housing and a second portion that extends from the first portion and is opposed to a second surface which is different from the first side of the housing. The first portion guides a portion of the gas blown out of the gas outlet to the gap. The gap configures a flow path of the gas guided by the first portion.SELECTED DRAWING: Figure 1

Description

The present invention relates to a gas supply device, a lithography device, and a method for manufacturing an article.

In the exposure apparatus used in the manufacturing process (lithography process) of a liquid crystal panel or a semiconductor device, the original plate and the substrate are held on the original plate stage and the substrate stage, respectively, and scan movement is repeated. In order to improve the accuracy of exposure accompanied by scanning movement, it is necessary to accurately control the positions of the original stage and the substrate stage. Therefore, the positions of the original stage and the board stage are measured by a highly accurate measuring instrument. High-precision measuring instruments include encoders and interferometers. In these measuring instruments, when the refractive index of air in the optical path changes, the optical path length changes. Therefore, when high-precision position measurement is required, it is necessary to keep the refractive index of the air in the optical path unchanged (do not fluctuate the air). Since the refractive index changes depending on temperature, humidity, and pressure, it is important to keep these physical property values constant. Therefore, in the exposure apparatus, the temperature, humidity, and pressure of the optical path of the measuring instrument are kept constant by confining the substrate stage and its measuring instrument in one space (board stage space) and air-conditioning the substrate stage space. The structure to make is known. Further, as the structure, a method of rectifying the entire substrate stage space in one direction and a method of locally air-conditioning by concentrating on the optical path of the measuring instrument are known. The above applies to the air conditioning of the space including the original stage and its measuring instrument (original stage space).

However, when air-conditioning the substrate stage space or the original plate stage space, the refractive index of the optical path of the measuring instrument cannot be kept constant by simply flowing a gas. The reason is that there are many heat sources in the board stage space, and the heat can reach the optical path of the measuring instrument. For example, an actuator for driving a board stage, the board thereof, and electrical components provided in various measurement systems can be heat sources. There is also a system in which heat is transferred from a component connected to a space outside the board stage space to a component inside the board stage, and then diffused to the optical path of the measuring instrument to transfer heat. Further, by scanning and moving the substrate stage, even if the optical path of the measuring instrument is located upstream of the conditioned airflow, the heat downstream of the conditioned airflow may be diffused and reach the optical path of the measuring instrument. In addition, the housing of the air conditioner that supplies the gas may have a temperature distribution due to heat, and the air conditioning gas itself in the housing may have a temperature distribution. Due to the influence of heat as described above, temperature fluctuations occur in the optical path of the measuring instrument, and the measurement accuracy may decrease. The decrease in measurement accuracy leads to a decrease in exposure accuracy.

Patent Document 1 discloses a configuration in which the temperature of the wall surface of the substrate stage space is measured and a gas controlled to a temperature substantially equal to the temperature is supplied to the entire substrate stage space. According to this configuration, since the temperature of the air-conditioning gas is almost equal to the wall surface connected to the space outside the substrate stage space, the temperature gradient in the substrate stage space is reduced, and as a result, the temperature fluctuation in the optical path of the measuring instrument is reduced. Is reduced.

Patent Document 2 discloses a configuration in which an conditioned gas is drawn into a duct by the Bernoulli effect and the gas is blown out from the duct toward the optical path of the measuring instrument. According to this configuration, since the gas is blown out toward the optical path of the measuring instrument, the heat of the space where the substrate stage moves, for example, the heat generated by the actuator and the circuit parts driving the actuator, reaches the optical path of the measuring instrument. , It is possible to reduce the temperature fluctuation.

Further, in order to prevent the temperature distribution of the air conditioning gas in the housing from having the temperature distribution of the air conditioner housing itself due to the heat of the substrate stage space, a heat insulating material may be attached to the wall surface of the housing.

Further, Patent Document 3 discloses a configuration in which a closed space is formed on the wall surface of the housing and gas is individually supplied to the closed space. According to this configuration, by filling the closed space with gas, a heat transfer reducing portion is formed, and it is possible to reduce heat transfer from the outside of the housing to the inside of the housing.

Japanese Unexamined Patent Publication No. 9-82626 JP-A-2015-95503 Japanese Unexamined Patent Publication No. 2013-161991

However, in Patent Document 1, in order to measure the temperature of the wall surface and control the temperature of the gas of the entire air conditioner, the temperature of the gas for air conditioning is locally controlled with respect to the local temperature distribution of the space where the substrate stage moves. I can't control it. Therefore, the gas having a local temperature distribution reaches the optical path of the measuring instrument, and temperature fluctuation may occur.

In Patent Document 2, when heat is diffused around the duct due to the movement of the substrate stage, a local temperature distribution may be generated in the duct, and a local temperature distribution may be generated in the gas in the duct. As a result, a gas having a local temperature distribution is blown out into the optical path of the measuring instrument, and temperature fluctuation may occur. In addition, if a heat insulating material is attached to prevent heat from being transferred to the duct or housing, it will be difficult for the heat in the board stage space to be recovered, and the heat will diffuse, making it easier to reach the optical path of the measuring instrument. possible. In that case, it leads to the temperature fluctuation of the optical path of the measuring instrument.

When a closed space is provided on the wall surface as in Patent Document 3, it is necessary to provide a gas supply system for supplying the gas separately from the gas for air conditioning in the closed space, which complicates the structure.

The present invention provides an advantageous technique for reducing the temperature distribution in space with a simple configuration.

The gas supply device according to one aspect of the present invention includes a housing constituting a gas outlet and a cover having a gap between the housing and covering the housing, and the cover is the cover. It has an opening through which the gas blown out from the outlet passes, and the opening is smaller than the outlet and fits in the area of the outlet in a plan view when the outlet is viewed from the front. The cover extends from a part of the air outlet, a first portion facing the first surface of the housing and forming the opening, and the housing in the plan view. It has a second surface facing the second surface different from the first surface of the above, and the first portion guides a part of the gas blown out from the outlet to the gap, and the gap is the gap. It constitutes a gas flow path guided by the first part.

According to the present invention, it is possible to provide an advantageous technique for reducing the temperature distribution in a space with a simple configuration.

The figure which shows the structural example of the gas supply device. The figure which shows the structural example of the gas supply device. The figure which shows the arrangement example of the adjustment part in a gas supply device. The figure which shows the arrangement example of a gas supply device. The figure which shows the arrangement example of the exhaust mechanism in a gas supply device. The figure which shows the arrangement example of the exhaust mechanism in a gas supply device. The figure which shows the arrangement example of the gas supply device in an exposure apparatus. The figure which shows the arrangement example of the gas supply device in an exposure apparatus. The figure which shows the arrangement example of the gas supply device in an exposure apparatus. The figure which shows the structure of the gas supply device in the exposure apparatus. The figure which shows the structure of the gas supply device in the exposure apparatus. The figure which shows the structure of the exposure apparatus which includes the gas supply apparatus.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. The following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiment, not all of the plurality of features are essential for the invention, and the plurality of features may be arbitrarily combined. Further, in the attached drawings, the same or similar configurations are given the same reference numbers, and duplicate explanations are omitted.

The present invention relates to a gas supply device that is advantageous for reducing (uniformizing) the temperature distribution in space. Hereinafter, an example in which the gas supply device of the present invention is applied to a lithography device that forms a pattern on a substrate will be described. The lithography apparatus includes, for example, an exposure apparatus and an imprint apparatus. The exposure apparatus forms a latent image corresponding to the pattern of the original plate on the photoresist by exposing the photoresist supplied on the substrate through the original plate. In the imprint device, the moldable material (imprint material) supplied on the substrate is brought into contact with the mold, and energy for curing is given to the imprint material to transfer the uneven pattern of the mold to the cured product. Form a pattern.

In the following, an example in which a gas supply device is applied to an exposure device, which is an example of a lithography device, will be described.

<First Embodiment>
FIG. 1 shows the configuration of the gas supply device 10 in the embodiment. Further, FIG. 12 shows the configuration of the exposure apparatus including the gas supply device 10. In the present specification and drawings, the direction is shown in the XYZ coordinate system with the horizontal plane as the XY plane. Generally, the substrate W, which is the exposed substrate, is placed on the substrate stage 4 so that its surface is parallel to the horizontal plane (XY plane). Therefore, in the following, the directions orthogonal to each other in the plane along the surface of the substrate W are defined as the X-axis and the Y-axis, and the directions perpendicular to the X-axis and the Y-axis are defined as the Z-axis. Further, in the following, the directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are referred to as X-direction, Y-direction, and Z-direction, respectively.

The exposure apparatus includes an illumination optical system 1, an original plate stage 3, a projection optical system 2, a substrate stage 4, and a control unit 6. The illumination optical system 1 uses the light from the light source 5 to illuminate the original plate M held in the original plate stage 3. The projection optical system 2 projects the pattern of the original plate M onto the substrate W held on the substrate stage 4. The original plate stage 3 holds and moves the original plate. The board stage 4 holds and moves the board. The substrate stage 4 and the original plate stage 3 are scanned and driven by the control unit 6 based on their respective position information. The position of the substrate stage 4 is measured by the first measuring instrument 8a, and the position of the original plate stage 3 is measured by the second measuring instrument 8b. The first measuring instrument 8a and the second measuring instrument 8b can be an encoder or an interferometer. For example, when the first measuring instrument 8a is an interferometer, the first measuring instrument 8a emits measurement light toward the substrate stage 4 and is reflected by an interferometer mirror provided on the end face of the substrate stage 4. By detecting the measurement light, the position of the substrate stage 4 is measured. Although only one first measuring instrument 8a is shown in FIG. 12, a plurality of first measuring instruments 8a may be arranged so that the XY position, rotation amount, and tilt amount of the substrate stage 4 can be measured. .. The second measuring instrument 8b may be configured in the same manner as the first measuring instrument 8a.

The wall 30 separates the first space 21 and the second space 22. The first space 21 is, for example, a space inside an exposure apparatus, and in this case, the wall 30 may be composed of a structure or a chamber or the like that supports the projection optical system 2 and the substrate stage 4. The wall 30 may be configured by a rack in which a substrate is placed, a housing, a path for moving a gas such as a duct, or the like. Of the first space 21, the space air-conditioned by the gas supply device 10 arranged on the substrate stage 4 side is the first space 21a, and the space air-conditioned by the gas supply device 10 arranged on the original plate stage 3 side is the first space 21a. Notated as space 21b. The second space 22 means a space different from the first space 21, and is typically a space outside the exposure apparatus, but may be a space inside the exposure apparatus.

The substrate stage 4 and the first measuring instrument 8a are arranged in the first space 21a, and the original plate stage 3 and the second measuring instrument 8b are arranged in the first space 21b. The gas supply device 10 supplies the gas G whose temperature has been adjusted by the air conditioner 7 to the first spaces 21a and 21b. The housing 12a constitutes an outlet 11 so that the gas G is blown out to the first space 21a. Further, the housing 12c (second housing) extends from the outlet 11 onto the first optical path 34a, which is the optical path of the measurement light of the first measuring instrument 8a, and the gas G blown out from the outlet 11 is the first. It is formed so as to lead to one optical path 34a. Similarly, the housing 12b constitutes the outlet 11 so that the gas G is blown out to the first space 21b. Further, the housing 12d (second housing) extends from the outlet 11 onto the second optical path 34b, which is the optical path of the measurement light of the second measuring instrument 8b, and the gas G blown out from the outlet 11 is the first. It is formed so as to lead to two optical paths 34b.

The gas supply device 10 includes at least one of the housing 12a, the housing 12b, the housing 12c, and the housing 12d, and the gas G supplied from the air conditioner 7 is introduced into the first space 21a, 21b, and the first optical path. It supplies 34a and the second optical path 34b. The gas G in the first spaces 21a and 21b is discharged to the second space 22 by the exhaust mechanism 18, and a part of the gas G is returned to the air conditioner 7.

The air conditioner 7 supplies the gas G to the gas supply device 10. The air conditioner 7 may include a fan, a duct, a valve, a temperature measuring device for measuring the temperature of the gas G, a temperature regulator for adjusting the temperature of the gas G, and the like.

In the first spaces 21a and 21b, there is a heat source caused by the substrate stage 4 or the original plate stage 3. For example, an actuator for driving the substrate stage 4 or the original plate stage 3, a control board of the actuator, an electric component related to position control, and the like can be heat sources. Further, the wall 30 constituting the first space 21a and 21b, the members 32 and 33 connected to the wall 30, and the like can also receive heat from the second space 22 outside the wall 30 and become a heat source. Heat diffuses from those heat sources and reaches the first optical path 34a or the second optical path 34b, which may cause temperature fluctuations in the first optical path 34a or the second optical path 34b. Further, heat is transferred to the housing 12a, the housing 12b, the housing 12c, or the housing 12d, and the gas G in the housings 12a to 12d has a temperature distribution, and the gas G is the first optical path 34a. Alternatively, by being supplied to the second optical path 34b, temperature fluctuations can be generated. Further, the scanning movement of the substrate stage 4 or the original plate stage 3 disturbs the air conditioning of the first spaces 21a and 21b, diffuses heat, and can reach the first optical path 34a and the second optical path 34b. Similarly, heat reaches the housing 12a, the housing 12b, the housing 12c, or the housing 12d, and the gas G has a temperature distribution inside the housings 12a to 12d, and the gas G has a first optical path. By being supplied to 34a or the second optical path 34b, temperature fluctuations may occur. The gas supply device 10 supplies the gas G having a reduced temperature distribution to the first optical path 34a and the second optical path 34b in order to reduce the temperature fluctuation of the first optical path 34a or the second optical path 34b due to the influence of these heats. do. As a result, the temperature distribution of the first optical path 34a or the second optical path 34b can be reduced.

As shown in FIG. 1, the gas supply device 10 surrounds at least a part of the side surface of the housing 12 and the housing 12 that constitutes the gas outlet 11 for guiding the gas G to the first space 21. It has a cover 13 that covers the body 12. The cover 13 is arranged so as to cover the housing 12 with a gap 14 provided between the cover 13 and the housing 12. Further, the cover 13 has an opening 15 through which the gas blown out from the outlet 11 passes. In a plan view of the air outlet 11 when viewed from the front (viewed from the Y direction), the opening 15 is smaller than the air outlet 11 and is in a position within the region of the air outlet 11. The cover 13 has a part of the air outlet 11 and a wind guide member 16 which is a first part facing the end surface (first surface) of the housing 12 and forming an opening 15 in a plan view when viewed from the Y direction. .. The cover 13 further has a second portion 162 that extends from the air guide 16 and faces the outer surface (second surface) of the housing 12, which is different from the end face of the housing 12. The air guide member 16 guides a part of the gas G blown out from the air outlet 11 to the gap 14. The air guide member 16 is formed so as to shield a part of the gas G blown out from the air outlet 11, and the shielded gas is guided to the gap 14. The gap 14 constitutes a gas flow path guided by the air guide member 16.

The gas supply device 10 includes pipes such as fans, compressors, ducts and tubes, hoses, adjustment parts such as valves and throttles, regulators, temperature measuring instruments for measuring the temperature of gas G, temperature regulators for adjusting the temperature of gas G, and the like. Is connected to an external device including. Alternatively, the gas supply device 10 may include them inside the housing 12. The temperature of the gas G can be adjusted, for example, by a temperature measuring instrument and a temperature regulator.

In the present embodiment, when the gas G is blown out from the outlet 11, a part of the gas G flows into the gap 14 by the air guide member 16. As a result, with respect to the inside of the gas supply device 10, the gap 14 becomes an air layer having a heat insulating effect of reducing the influence of heat on the outside. Further, with respect to the outside of the gas supply device 10, the gap 14 is an air layer having a temperature adjusting effect. For example, it is assumed that the heat source is located outside the gas supply device 10, that is, in the first space 21. It is assumed that heat is diffused from the heat source and reaches the gas supply device 10. When the cover 13 is not provided, a temperature distribution is formed in the housing 12, and the temperature distribution also generates a temperature distribution in the gas G inside the housing 12. On the other hand, when there is a cover 13 and a part of the gas G is flowing in the gap 14 with the housing 12, the heat that has reached the cover 13 is recovered by the gas G and exits from the gap 14. As a result, it is possible to prevent heat from reaching the housing 12 and reduce the generation of the temperature distribution of the gas G.

The same can be said for the heat of the first space 21. The heat of the first space 21 is recovered by the gas G through the cover 13, and is discharged from the gap 14. This is an effect that cannot be obtained by a configuration such as attaching a heat insulating material to the housing 12.

As described above, in the present embodiment, since heat is recovered from the gap 14, the flow of the gas G, and the structure of the cover 13, it is preferable that the gap 14 is large and the flow of the gas G is fast. Further, since the heat recovered by the gas G is discharged from the gap 14, it is preferable that the outlet of the gap 14 is arranged so as to be away from the opening 15. Further, the shape of the opening 15 can be arbitrarily set, and the supply range of the gas G blown out from the outlet 11 can be adjusted to any range. Further, since the configuration uses a part of the gas G, it is not necessary to prepare a separate gas, and it is not necessary to add another gas supply device. Therefore, according to the present embodiment, effective air conditioning in the exposure apparatus can be realized with a simple configuration.

With reference to FIG. 2, some configuration examples of the gas supply device 10 will be described. In each of FIGS. 2A to 2C, the left figure is a cross-sectional view of the gas supply device 10 when viewed from the X direction, and the right figure is a front view of the gas supply device 10 when viewed from the Y direction.

The configuration shown in FIG. 2A is the same as that shown in FIG. The cover 13 is configured to cover the entire housing 12. In this case, the cover 13 can be formed, for example, according to the outer shape of the housing 12. However, the entire housing 12 may not be covered by the cover 13. Whether or not an effective air conditioning effect can be obtained can be determined by the temperature distribution in the first space 21. It is better to arrange the cover 13 at the place where the influence of heat is to be reduced from the first space 21. Preferably, the cover 13 may be enlarged and arranged within a range extending from the portion. Therefore, it is more preferable to cover the entire housing 12 because it can handle a wide range of temperature distributions in the first space 21.

In FIG. 2A, the gap 14 is provided between the end surface of the housing 12 and the air guiding member 16 (first portion) and between the outer surface of the housing 12 and the second portion 162. There is. The cover 13 is fixed to the housing 12 at several points by being bolted via spacers or the like. In the example of FIG. 2A, the outlets of the flow path due to the gap 14 are formed at both ends in the Z direction and both ends in the X direction. In this case, it is particularly effective for the temperature distribution in the vicinity of the air outlet 11 or in the Z direction of the housing 12.

On the other hand, FIG. 2B shows an example in which the cover 13 is arranged only on the front surface (the surface of the gas outlet) of the outlet 11. In FIG. 2B, the gap 14 is provided between the end surface of the housing 12 and the air guiding member 16 (first portion), but the outer surface of the housing 12 and the second portion 162. There is no space between them. Therefore, in the example of FIG. 2B, the exit of the flow path due to the gap 14 is not formed at the end in the Z direction, but is formed only at both ends in the X direction. The configuration of FIG. 2B is effective for the temperature distribution in the vicinity of the outlet 11. As described above, the configuration of the cover 13 may be arbitrarily set according to the temperature distribution of the first space 21.

Further, the shape of the opening 15 may be formed according to the shape of the region where the gas is blown out from the gas supply device 10. In FIG. 2A, the shape of the opening 15 is a quadrangular shape, but it may be a triangular shape, a trapezoidal shape, an uneven shape, or a shape in which a straight line and a curved line are combined. Further, the shape may have a plurality of openings. When the opening 15 has a complicated shape, the gas G may not be blown out from the opening 15 with a uniform flow velocity distribution. In that case, a filter, a sintered body, a punching metal, or the like is formed in the gas outlet portion of the outlet 11 to increase the pressure loss of the gas outlet so that the gas G is blown out with a uniform flow velocity distribution. You may do it.

The air guide member 16 is configured to shield a part of the gas G from the air outlet 11 so that the gas G can be guided to the gap 14. For example, as shown in FIGS. 2A and 2B, the opening 15 is smaller than the outlet 11 and is smaller than the outlet 11 in a plan view when the outlet 11 is viewed from the front (viewed from the Y direction). It is in a position that fits in the area of the outlet 11. Further, even if the shape of the opening 15 is a structure that is only partially smaller than the outlet 11, it is sufficient that a part of the gas G can be shielded and the gas G can be guided to the gap 14. Further, as shown in FIG. 2 (c), the cover 13 extends from the air guiding member 16 to the inside of the air outlet 11 and faces an inner surface (third surface) different from the end surface and the outer surface of the housing 12. A third portion 163 may be further provided. By extending the air guiding member 16 and allowing it to enter the inside of the housing 12 in this way, the gas can be more effectively guided to the gap 14.

In FIGS. 2A to 2C, the air guide member 16 is configured around the entire circumference of the air outlet 11, but the air guide member 16 may be configured only in a part of the air outlet 11. .. The gas G may be guided to a part of the gap 14 by the air guide member 16, but it is preferable to spread the gas G over the entire gap 14. The reason why it is better to spread it all over is that the gap 14 is made into an adiabatic air layer and a temperature control air layer by the gas G.

In order to distribute the gas G throughout the gap 14, the position of the cover 13 with respect to the housing 12 may be adjusted to adjust the size of the gap 14. As shown in FIGS. 3A and 3B, the gas supply device 10 may further include an adjusting unit 17 for adjusting the flow rate of the gas flowing through the flow path formed by the gap 14. The adjusting unit 17 has an adjusting function capable of increasing or decreasing a part of the size of the gap 14, and may be composed of, for example, a plate or a block that can move up and down with respect to the gap. As shown in FIG. 3A, the adjusting unit 17 is arranged at the outlet portion of the gap 14, and by adjusting the size of the gap 14b at that position, the flow rate or the flow velocity of the gas G flowing through the gap 14a Can be adjusted. Thereby, the gas G can be adjusted so as to spread over the entire gap 14. Further, the adjusting unit 17 is arranged in the middle of the path of the gap 14, for example, as shown in FIG. 3B, and by adjusting the size of the gap 14b at that position, the gas G flowing through the gap 14a The flow rate or flow rate may be adjusted. Further, in the case of adopting the configuration as shown in FIG. 2B, the adjusting portion 17 may be arranged at the X-direction end portion of the gap 14.

The heat insulating effect and the temperature control effect change depending on the size of the gap 14 and the flow rate or flow velocity of the gas G flowing through the gap 14. The size of the gap 14 is preferably large, and the flow rate or flow velocity of the gas G flowing through the gap 14 is also preferably large because the gap 14 is formed into a heat insulating air layer and a temperature control air layer by the gas G. However, it is important to balance the amount of gas G blown from the outlet 11 to the first space 21. The adjusting unit 17 is also effective for achieving this balance. For example, if the gap 14 is simply increased, the amount of gas G blown out from the outlet 11 to the first space 21 is reduced. In this case, the adjustment unit 17 adjusts the gap 14b so that it becomes smaller. By doing so, even if the gap 14 is increased, the amount of gas G blown out from the outlet 11 to the first space 21 can be prevented from being reduced by the adjusting unit 17. Further, when the housing 12 has a complicated structure, it may be difficult to control the size of the gap 14 due to the shape of the cover 13. Also in this case, by providing the adjusting unit 17, the flow rate of sending the gas G into the gap 14 can be adjusted.

The specific size of the gap 14 is determined by the temperature difference between the gas G and the first space 21, the temperature change that the gas G can tolerate, and the like. As an example, if the temperature difference between the gas G and the first space 21 and the tolerance of the temperature change of the gas G are, for example, 1/100 ° C to 1/10 ° C, the size of the gap 14 is, for example, 1/10 mm. It should be ~ 2 mm. When the temperature difference between the gas G and the first space 21 is, for example, 1/10 ° C to 1 ° C, the size of the gap 14 may be, for example, 2 mm to 20 mm.

<Second Embodiment>
FIG. 5 is a diagram showing the configuration of the gas supply device 10 in the second embodiment. The parts not specifically mentioned in the following description are the same as those in the first embodiment.

In the second embodiment, as shown in FIGS. 5A and 5B, the exhaust mechanism 18 is arranged in the vicinity of the housing 12. The exhaust mechanism 18 is connected to the second space 22, and discharges at least a part of the gas G in the first space 21 to the second space 22 separated from the first space 21. In particular, the exhaust mechanism 18 discharges at least a part of the gas G that has passed through the flow path of the gap 14 to the second space 22. As a result, the heat recovered from the first space 21 by the gas G passing through the gap 14 can be discharged to the second space 22 and not returned to the first space 21. When the recovered heat returns to the first space 21, the heat reaches the cover 13 again, which may create an opportunity to exert the influence of the heat on the inside of the housing 12. Therefore, not returning the recovered heat to the first space 21 has an effect of preventing the influence of the heat from being transmitted to the inside of the housing 12. Therefore, the configuration of the present embodiment has the effect of reducing the temperature distribution to the gas G in the housing 12 as compared with the case where the exhaust mechanism 18 is not provided.

The exhaust mechanism 18 may be arranged in the vicinity of the housing 12 from the viewpoint of discharging the gas G that has recovered heat through the gap 14 described above, but is preferably in the vicinity of the outlet of the flow path due to the gap 14. Further, the number of the exhaust mechanisms 18 may be one as shown in FIG. 5A, or may be a plurality as shown in FIG. 5B. From the viewpoint of discharging the gas G that has recovered heat through the gap 14, it is more preferable that a plurality of gas G can be arranged corresponding to the plurality of outlets of the gap 14. Further, as shown in FIG. 6, the exhaust mechanism 18 may be directly connected to the gap 14 at the outlet of the gap 14.

<Third Embodiment>
In the first and second embodiments described above, it has been described that all the covers 13 of the gas supply device 10 are included in the first space 21. However, the gas supply device 10 may be arranged so that a part of the cover 13 is located in the first space 21 and a part of the cover 13 is located in the second space 22. FIG. 4 is a modification of FIG. 1. In the example of FIG. 4, the front end portion of the cover 13 (that is, the entrance of the flow path due to the gap 14) communicates with the first space 21. On the other hand, the rear end portion of the cover 13 (that is, the exit of the flow path due to the gap 14) protrudes from the wall 31 separating the first space 21 and the second space 22 toward the second space 22 and communicates with the second space 22. ing. In this case, the heat recovered by the gas G passing through the gap 14 is discharged to the second space 22 as it is, which is more useful for reducing the heat effect in the first space 21.

FIG. 7 is a diagram showing an example of a gas supply device 10 arranged in the vicinity of the substrate stage 4 in order to air-condition the entire first space 21a in the exposure device. As shown in FIG. 7, the gas supply device 10 is arranged on the wall forming the first space 21a or the boundary surface between the first space 21a and the second space 22. A part of the gas G passes through the housing 12c and flows toward the first optical path 34a. A part of the gas G also flows through the housing 12c and between the projection optical system 2 and the substrate stage 4. Further, the gas supply device 10 may be arranged on one side surface and another side surface of the wall or the boundary surface forming the first space 21a, respectively. For example, as shown in FIG. 8, gas supply devices 10 may be arranged on walls orthogonal to each other. The gas G supplied from the gas supply device 10 is discharged to the second space 22 by the exhaust mechanism 18. Further, if the degree of sealing of the first space 21a is not high, the gas G may leak from the gap of the first space 21a to the second space 22. According to the present embodiment, the gas supply device 10 can reduce (uniformize) the temperature distribution of the gas G coming out of the gas outlet 11. As a result, the temperature distribution of the gas G passing through the housing 12c is reduced. Therefore, the temperature distribution in the first optical path 34a is reduced, and the temperature fluctuation is reduced.

An example of arrangement of the gas supply device 10 in the exposure device will be described with reference to FIGS. 9 (a) and 9 (b). In the example of FIG. 9A, the gas supply device 10 is arranged at the opening of the wall 31 that separates the first space 21a and the second space 22. In the example of FIG. 9A, the inlet of the flow path formed by the gap 14 formed by the cover 13 is located in the first space 21a, while the outlet of the flow path formed by the gap 14 formed by the cover 13 is located in the second space. It is located at 22. In the example of FIG. 9B, the entire gas supply device 10 is arranged in the second space 22. In this case, the gas outlet 11 (and the opening of the cover) is arranged close to the opening formed in the wall 31, and the gas supply device 10 enters the first space 21a through the opening. Supply gas. FIG. 9A shows a configuration in which the heat recovered by the gas G passing through the gap 14 can be discharged more efficiently. On the other hand, according to the configuration of FIG. 9B, the gas supply device 10 can effectively supply the gas G whose temperature distribution in the second space 22 is reduced to the first space 21a.

<Fourth Embodiment>
FIG. 10 shows a configuration example of the gas supply device 10 according to the fourth embodiment. FIG. 10 is a diagram showing an example of a gas supply device 10 arranged in the vicinity of the substrate stage 4 in order to air-condition the entire first space 21a in the exposure device. As shown in FIGS. 12 and 7, the gas supply device 10 extends from the outlet 11 onto the first optical path 34a, which is the optical path of the measurement light of the first measuring instrument 8a, and is blown out from the outlet 11. It has a housing 12c (second housing) formed so as to guide the gas G to the first optical path 34a.

Since the gas supply device 10 is arranged in the vicinity of the first optical path 34a, it is easily affected by a temperature change in the vicinity of the first optical path 34a. Therefore, in the fourth embodiment, as shown in FIG. 10, the cover 13a is arranged so as to surround a part of the outside of the housing 12c at the height position between the first optical path 34a and the housing 12c. The cover 13a may have the same configuration as the cover 13 described with reference to FIGS. 1, 2 and the like with respect to the outlet configured by the housing 12c. As a result, it is possible to reduce the occurrence of temperature distribution in the gas G inside the cover 13a (that is, inside the housing 12c).

<Fifth Embodiment>
The configuration example of the gas supply device shown in FIGS. 7 and 9 described above has described the gas supply device 10 arranged in the vicinity of the substrate stage 4 in order to air-condition the entire first space 21a in the exposure device. However, these configurations can also be applied to the gas supply device 10 arranged in the vicinity of the original plate stage 3 in order to air-condition the entire first space 21b in the exposure device.

As an example, FIG. 11 shows a configuration example of a gas supply device 10 arranged near the original plate stage 3 in order to air-condition the entire first space 21b in the exposure device. The original stage 3 and the second measuring instrument 8b are arranged in the first space 21b. The gas G from the air conditioner 7 is supplied to the first space 21b by the gas supply device 10. The gas G outlet 11 for the first space 21b is configured by the housing 12b, and the gas G outlet for the second optical path 34b of the second measuring instrument 8b is configured by the housing 12d. The gas G in the first space 21b is discharged to the second space 22 by the exhaust mechanism 18, and a part of the gas G is returned to the air conditioner 7. In the first space 21b, there is a heat source caused by an actuator or the like in the original stage 3.

In FIG. 11, the cover 13 is arranged so as to surround at least a part of the side surface of the housing 12b and cover the housing 12b. The cover 13 is arranged so as to cover the housing 12b with a gap 14 provided between the cover 13 and the housing 12b.

As described above, the gas supply device 10 arranged in the vicinity of the original plate stage 3 can be configured in the same manner as the configuration described with respect to FIG. 1, and can effectively deal with the heat caused by the original plate stage 3. ..

Further, the configuration of FIG. 10 according to the fourth embodiment can be applied to the gas supply device 10 arranged in the vicinity of the original plate stage 3. That is, the cover 13a may be arranged so as to surround a part of the outside of the housing 12d at the height position between the second optical path 34b and the housing 14d. As a result, it is possible to reduce the occurrence of a temperature distribution in the gas G inside the cover 13a (that is, inside the housing 12d) due to a temperature change in the vicinity of the second optical path 34b.

<Embodiment of article manufacturing method>
The article manufacturing method according to the embodiment of the present invention is suitable for manufacturing articles such as microdevices such as semiconductor devices and elements having a fine structure, for example. The article manufacturing method of the present embodiment includes a step of forming a pattern by transferring a pattern of an original plate to a substrate using the above-mentioned lithography apparatus (exposure apparatus, imprint apparatus, drawing apparatus, etc.), and a step of forming a pattern in such a step. It includes a step of processing the transferred substrate. Further, such a manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, flattening, etching, resist peeling, dicing, bonding, packaging, etc.). The article manufacturing method of the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

The invention is not limited to the above embodiment, and various modifications and modifications can be made without departing from the spirit and scope of the invention. Therefore, a claim is attached to publicize the scope of the invention.

10: Gas supply device, 11: Air outlet, 12: Housing, 13: Cover, 14: Gap, 15: Opening, 16: Air guide member

Claims (15)

The housing that constitutes the gas outlet and
A cover that covers the housing by providing a gap between the housing and the housing,
Equipped with
The cover has an opening through which the gas blown out from the outlet is allowed to pass.
In a plan view of the air outlet when viewed from the front, the opening is smaller than the air outlet and is in a position within the area of the air outlet.
The cover extends from a part of the air outlet, a first portion facing the first surface of the housing and forming the opening, and the first portion of the housing in the plan view. It has a second surface that is different from the first surface and a second portion that faces it.
The first portion guides a part of the gas blown out from the outlet to the gap, and the gap constitutes a flow path of the gas guided by the first portion.
A gas supply device characterized by that. Claim 1 is characterized in that the gap is provided between the first surface and the first portion, and between the second surface and the second portion of the housing. The gas supply device according to. The claim is characterized in that the gap is provided between the first surface and the first portion, and is not provided between the second surface and the second portion of the housing. The gas supply device according to 1. The cover is characterized by extending from the first portion to the inside of the outlet and further having a third portion facing the third surface of the housing, which is different from the first surface and the second surface. The gas supply device according to any one of claims 1 to 3. The gas supply device according to any one of claims 1 to 4, further comprising an adjusting unit for adjusting the flow rate of the gas flowing through the gap. A lithography device that forms a pattern on a substrate.
A board stage that holds and moves the board, and
A measuring instrument that emits measurement light and measures the position of the substrate stage with the measurement light reflected by the substrate stage.
The gas supply device according to any one of claims 1 to 5.
Have,
The lithography apparatus is characterized in that the gas supply device is arranged so as to supply the gas blown out from the outlet through the opening to the first space including the substrate stage and the measuring instrument. Device. A lithography device that forms a pattern on a substrate using an original plate.
The original stage that holds and moves the original, and
A measuring instrument that emits measurement light and measures the position of the original stage with the measurement light reflected by the original stage.
The gas supply device according to any one of claims 1 to 5.
Have,
The lithography apparatus is characterized in that the gas supply device is arranged so as to supply the gas blown out from the outlet through the opening to the first space including the original plate stage and the measuring instrument. Device. The lithography apparatus according to claim 6 or 7, further comprising an exhaust mechanism for discharging at least a part of the gas in the first space to a second space separated from the first space. The lithography device according to claim 8, wherein the gas supply device is arranged in the first space, and the exhaust mechanism discharges gas passing through the flow path to the second space. .. The lithography apparatus according to claim 9, wherein the outlet of the flow path is connected to the exhaust mechanism. 6. Lithography equipment. It has a wall that separates the first space from the second space,
The gas supply device is arranged in the second space, and supplies gas to the first space through an opening formed in the wall.
The lithography apparatus according to claim 6 or 7. The housing includes a second housing formed so as to extend from the outlet onto the optical path of the measurement light and guide the gas blown out from the outlet to the optical path.
The cover is further placed at a height position between the optical path and the second housing.
The lithography apparatus according to claim 6 or 7. The lithography device according to any one of claims 6 to 13, wherein the gas supply device supplies a gas whose temperature has been adjusted by an air conditioner to the first space. A step of forming a pattern on a substrate using the lithography apparatus according to any one of claims 6 to 14.
The process of processing the substrate on which the pattern is formed and
The article manufacturing method, wherein the article is manufactured from the processed substrate.

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