JP2022044643A - Radiation image photographing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a radiation image photographing device that can improve the resistance to a load or the like while reducing the weight of a support body for supporting a sensor panel.

SOLUTION: A radiation image photographing device includes: a sensor panel having, on its upper surface side, a sensor for detecting a radiation ray radiated to a subject; an electronic component disposed on the lower surface side of the sensor panel; a support body for supporting the sensor panel and the electronic component; and a housing for storing the sensor panel, electronic component, and support body. The support body has a cavity, and supports the lower surface of the sensor panel in the thickness direction and plane direction without a gap.

SELECTED DRAWING: Figure 4

COPYRIGHT: (C)2022,JPO&INPIT

Description

The present invention relates to a radiographic imaging apparatus.

There are various methods for diagnosis by photographing the inside of a subject using X-rays for medical use and industrial use. Conventionally, a method of obtaining an image by a film or a compute radiograph (CR) using a brilliant phosphor plate has been used. In recent years, a digital radiograph (DR) that receives an X-ray distribution with a sensor and converts it into image data with a processing circuit has become the mainstream as an X-ray imaging apparatus. In this DR, an X-ray imaging device called a flat panel detector (FPD) is used, and for convenience during imaging, a portable X-ray imaging device (hereinafter, also referred to as FPD) has been introduced in recent years. It has come to be widely used (see, for example, Patent Document 1 and Patent Document 2).

The FPD has a large number of built-in sensors (elements such as photodiodes) that detect the X-rays emitted to the subject and output them as electrical signals. These sensors are manufactured on a glass substrate from the viewpoint of thermal stability and are housed in a housing as a sensor panel. The sensor panel outputs the detected X-ray as an electric signal. Further, on the back surface (the surface opposite to the X-ray irradiation surface) of the sensor panel, a circuit board or a battery provided with an electronic device (element) for generating image data based on the output electric signal. Various electronic parts such as are arranged.

Japanese Unexamined Patent Publication No. 2004-184679 Japanese Unexamined Patent Publication No. 11-160439

By the way, in the FPD, a subject such as a human body may be placed on a housing to perform X-ray photography, and in this case, a large load of several tens of kg to 100 kg or more is applied. For this reason, FPDs require a structure that protects the sensor panel (particularly, a glass substrate that is easily damaged) from such external forces such as load and impact. Further, the above-mentioned electronic components, particularly the circuit board and the elements on the circuit board, also have a high need to be protected because they may be damaged by an external force such as a load or an impact. In recent FPDs, the thickness of the housing is often set to a size compliant with JIS standards (for example, 16 mm or less), and in such a thin FPD, a structure that protects the sensor panel, circuit board, etc. from loads and impacts. Building a very important task.

To solve this problem, in the conventional FPD, the sensor panel is supported by a highly rigid support such as metal, and a spacer or the like is provided between the back surface side of the sensor panel and the housing to form a space, and this space is formed. It accommodated various electronic components such as the circuit board described above.

On the other hand, the FPD is required to reduce the weight of the entire device in order to further improve convenience such as facilitation of transportation. Therefore, the weight of the above-mentioned support having a relatively large weight should be reduced. Is being considered. However, if the support is less rigid than metal, for example made of resin, both the sensor panel and the support may bend and the glass substrate may be distorted and cracked when the above-mentioned large load is applied. , The element on the circuit board may be damaged.

The technique described in Patent Document 1 describes that a curable resin such as epoxy is injected into a housing to form a filler in order to prevent the sensor panel from moving due to an impact. However, since such a filler is heavy, it cannot meet the demand for weight reduction. Further, in the technique described in Patent Document 2, in order to improve the bending rigidity while reducing the weight of the device, the base supporting the glass substrate of the sensor panel is configured to have a plurality of spaces partitioned by walls. However, the technique described in Patent Document 2 has a structure in which there is no support between the circuit board and the housing, and the support between the circuit board and the glass support base is weak, so that a load such as a human body is applied. In this case, distortion of the circuit board or sensor panel (glass substrate) may not be suppressed.

An object of the present invention is to provide a radiographic imaging apparatus having improved resistance to a load or the like while reducing the weight of a support supporting a sensor panel.

The radiographic imaging apparatus according to the present invention is
A sensor panel equipped with a sensor that detects the radiation radiated to the subject on the upper surface side, and
Electronic components arranged on the lower surface side of the sensor panel and
A support that supports the sensor panel and the electronic components,
A housing for accommodating the sensor panel, the electronic components, and the support,
Equipped with
The support has a gap and is configured to support the lower surface of the sensor panel without gaps in the thickness direction and the plane direction.

According to the present invention, it is possible to improve the resistance to a load or the like while reducing the weight of the support supporting the image pickup panel.

1A and 1B are schematic configuration diagrams of a radiation imaging system according to the present embodiment. 2A and 2B are diagrams illustrating an example of a support structure of an image pickup panel in a conventional FPD. 3A and 3B are views illustrating another example of the support structure of the imaging panel in a conventional FPD. It is sectional drawing explaining one structural example of FPD in this embodiment. It is sectional drawing explaining another structural example of FPD in this embodiment. It is sectional drawing explaining another structural example of FPD in this embodiment. It is sectional drawing explaining another structural example of FPD in this embodiment. It is sectional drawing explaining another structural example of FPD in this embodiment. It is sectional drawing explaining another structural example of FPD in this embodiment. It is sectional drawing explaining another structural example of FPD in this embodiment. It is a table which shows the experimental result about the durability of FPD in this embodiment.

Hereinafter, the present embodiment will be described in detail with reference to the drawings. First, before explaining the X-ray imaging apparatus (FPD) according to the present invention, an outline of an X-ray imaging system in which such an FPD is used will be described.

FIG. 1 (FIGS. 1A and 1B) shows the main configuration of an X-ray imaging system 100 as a radiographic imaging system. The X-ray imaging system 100 of the present embodiment is a system that irradiates a patient (hereinafter referred to as a subject) S with X-rays and photographs an X-ray image (radiation image) in a hospital.

The X-ray imaging system 100 detects an X-ray (radiation) irradiated to the subject S and outputs it as a radiation image (photographed image). It includes an X-ray irradiation device 8 that generates and outputs a line. Further, the X-ray imaging system 100 includes a console device 3 that displays captured images output from the FPD 1, and a cradle device (hereinafter, simply referred to as a cradle) 5 as a peripheral device that charges a battery described later in the FPD 1. , Includes a base station 7 for wireless communication between the above devices. Further, the X-ray imaging system 100 includes a host computer 4 that manages various data in the hospital. The above-mentioned devices constituting the X-ray imaging system 100 are connected to each other via the network N.

In the example shown in FIG. 1, the FPD 1, the base station 7, and the X-ray irradiation device 8 are installed in a photographing room 6 in which radiation leakage to the outside is prevented, for example, with lead or the like. On the other hand, the console device 3 and the cradle 5 are installed in the front chamber 9 of the photographing chamber 6. The user (doctor, etc.) and the subject S can move between the photographing room 6 and the anterior room 9 through the door 9b of the anterior room 9, and another hospital room through the door 6a of the photographing room 6 and the door 9a of the anterior room 9. You can move to etc. The host computer 4 is installed in a data management room (not shown) in the hospital.

The X-ray irradiation device 8 includes a known X-ray tube (vacuum tube) (not shown) and is used in close proximity to the subject S. X-ray irradiation unit 81 (see FIG. 1B), X-rays output from the X-ray irradiation unit 81. A control unit 82 or the like for controlling the above is provided. The control unit 82 includes a power supply unit that applies a voltage to the X-ray tube of the X-ray irradiation unit 81, a processor that controls the power supply unit, and the like. Among these, the power supply unit includes a filament power supply for heating the filament provided on the cathode of the X-ray tube, and a high-voltage power supply for accelerating electrons colliding with a target on the anode surface of the X-ray tube. The processor controls the X-rays output from the X-ray tube of the X-ray irradiation unit 81 by controlling the power supply of the filament power supply and the high voltage power supply.

The console device 3 is a computer that mainly controls radiographic imaging (hereinafter, also simply referred to as X-ray imaging), displays an X-ray image acquired from FPD 1, and gives instructions such as image processing contents related to the X-ray image data. Is. The console device 3 includes a processor, an operation input unit such as a mouse and a keyboard, and a display unit 36 such as an LCD (liquid crystal display), and the above-mentioned control and display are performed through various screens such as a menu screen displayed on the display unit 36. , Give instructions, etc.

The host computer 4 manages reservations for X-ray photography in the hospital, sends a shooting request (shooting order) instruction to the console device 3 when a shooting reservation is made, and a radiographic image transferred from the console device 3 after the X-ray shooting. Store data.

In the FPD 1, a sensor panel SP (see FIG. 1B) for detecting X-rays is housed in a housing 2 having a plate-shaped outer shape having a substantially rectangular plane. Although not shown in detail, the sensor panel SP of FPD1 has a configuration in which a plurality of radiation detection elements (sensors such as photodiodes) are arranged in a two-dimensional matrix of n × m on a glass substrate, and each radiation is emitted. The detection element detects the X-rays applied to the subject S. The radiation detection element of the sensor panel SP detects X-rays transmitted through the exposure surface R of the housing 2. Further, a plurality of layers such as a TFT layer are provided on the glass substrate of the sensor panel SP, and since these have known configurations, detailed description thereof will be omitted. In FIG. 1B and FIGS. 2 and below, which will be described later, the housing 2 is shown with the exposure surface R side facing up.

The FPD 1 has a conversion unit that converts X-rays detected by a radiation detection element into an electric signal, an A / D conversion unit that digitizes the converted electric signal, and outputs the digitized signal to the console device 3 as a captured image. It is equipped with an output unit and a battery that supplies power to each of these units. Other configurations of FPD1 will be described later.

The cradle 5 has a function as a peripheral device or an accessory device of the FPD 1, functions as a charging device for charging the battery of the FPD 1, and supplies power (charging current) to the FPD 1, such a power supply unit and a cradle. 5 It is equipped with a processor that controls the entire system.

Hereinafter, a schematic operation of the X-ray imaging system 100 will be described by taking an X-ray imaging of the chest of the subject S as an example.

Prior to this X-ray photography, a menu screen (not shown) is displayed on the display unit 36 of the console device 3. In the present embodiment, the patient database is accessed from the menu screen by operating the mouse or the like of the console device 3, and various information (patient ID, name, year of birth) regarding the patient to be the subject S (hereinafter, simply referred to as the subject S) is used. Enter the date, gender, name of the affected area to be photographed (chest in this example, etc.) in advance, and register or update the patient database.

Further, prior to the X-ray imaging, the position of the FPD1 attached to the recumbent table 6b is adjusted so as to be the position of the chest of the subject S. Subsequently, the subject S is laid on its back on the recumbent table 6b, the position of the subject S is adjusted so that the back of the subject S is in a position corresponding to FPD1, and the X-ray irradiation unit 81 is positioned facing the front of the patient's chest. Let me.

Further, an operation screen (not shown) for executing X-ray photography is displayed on the display unit 36 through the menu screen, and parameters such as the intensity of X-rays output from the X-ray irradiation unit 81 through the operation screen are displayed. It is input by an input operation such as a mouse of the console device 3. Subsequently, when a shooting button (not shown) displayed on the operation screen is selected, the X-ray irradiation device 8 is activated, and X-rays are output from the X-ray irradiation unit 81 according to the set parameters.

The X-rays output in this way pass through the affected part of the subject S and irradiate the sensor panel SP of the FPD1. The FPD1 detects the intensity (intensity / weakness distribution) of the X-rays transmitted through the affected part of the subject S by the sensor panel SP, converts the detected X-rays into an electric signal, and digitizes the converted electric signal. Generate a captured image. The generated captured image data is then transferred from the FPD 1 to the console device 3 and displayed as an X-ray image on the display unit 36. This X-ray image is appropriately processed by the console device 3 and then transferred to the host computer 4 and stored in the patient database or the like owned by the host computer 4.

In FIG. 1B, an example in which the back of the subject S is placed on the FPD1 and the chest is X-rayed is shown. There can be various imaging modes.

By the way, in the FPD 1, a large number of sensors (elements such as photodiodes) that detect X-rays and output them as electric signals are mounted on the sensor panel SP. Many of these sensors are manufactured on a glass substrate from the viewpoint of thermal stability and the like, and are housed in the housing 2 as a sensor panel SP (imaging panel).

Further, as shown in FIG. 1B, the FPD 1 may be photographed with the subject S such as a human body placed on the subject, and in such a case, for example, a large load of several tens of kilograms or more is applied, so that the FPD 1 is easily damaged. A structure that protects the sensor panel SP including the glass substrate is required. On the other hand, in the conventional FPD, the image pickup panel is supported by a highly rigid support such as metal, and a space is formed between the image panel and the housing by a spacer or the like, and a processor for data processing and various types are used in this space. It held various electronic components such as circuit boards and batteries on which elements were mounted. On the other hand, in such a conventional support structure, there is a problem that the strength is remarkably weakened when the material of the support is changed in order to meet the demand for weight reduction of the entire FPD.

Hereinafter, with reference to FIGS. 2 (2A and 2B) and 3 (FIGS. 3A and 3B), examples and problems of the internal structure of the housing (support structure of the sensor panel SP) in the conventional FPD. explain. For the sake of simplicity, the upper plate and the like of the housing are not shown in each of these figures.

FIG. 2A shows an example of the support structure of the sensor panel SP in the conventional FPD, and in the figure, only the bottom plate 2A side of the housing 2 accommodating the sensor panel SP is shown. In such a conventional example, the sensor panel SP is supported by a metal plate-shaped support 121 from below (back surface side) on substantially the entire surface of the support 121.

Further, in the conventional example, a plurality of spacers 122 are arranged between the bottom plate 2A of the housing 2 and the support 121 to provide a space for accommodating various other components of the FPD. In the example shown in FIG. 2A, a circuit board 126 on which a circuit element for data processing (hereinafter, simply referred to as an element) is mounted is fixed to the lower surface of the support 121 by screwing, an adhesive, or the like.

In such a conventional structure, no particular problem occurs in a normal use state such as when a subject S such as a human body is placed on the subject S. On the other hand, due to the demand for weight reduction of the entire device, it is necessary to make the support 121, which has a high weight ratio with respect to the entire device, into a lighter weight configuration.

However, if the thickness and material of the support 121 are changed to make the support 121 lighter, the rigidity of the support 121 becomes lower, so that the durability when the human body is placed on top of the support 121 is increased. It may not be possible to keep it. That is, when the rigidity of the support 121 becomes low, as shown in an exaggerated manner in FIG. 2B, both the sensor panel SP and the support 121 are subjected to an external force applied by a load or an impact when the subject S is placed on the subject S. Bending, and further, bending occurs in the circuit board 126. Here, depending on the magnitude of the external force applied (see the downward arrow in FIG. 2B), the glass substrate of the sensor panel SP may be distorted and cracked, the elements on the circuit board 126, and the circuit board 126 itself may be affected. There is a risk of damage.

FIG. 3A shows another example of the support structure of the sensor panel SP in the conventional FPD, and the same parts as those in FIG. 2A are designated by the same reference numerals. The example shown in FIG. 3A differs from the example of FIG. 2A in that an additional spacer 123 is arranged between the bottom plate 2A of the housing 2 and the circuit board 126.

In the structure shown in FIG. 2A described above, the central portion of the sensor panel SP in the figure is greatly bent by an external force. Therefore, in the example of FIG. 3A, the circuit board 126 and the housing 2 (bottom plate) are used in order to suppress such bending. A spacer 123 as a support is interposed between the 2A) and the spacer 123. On the other hand, the structure shown in FIG. 3A can be expected to have some improvement in durability as compared with the structure of FIG. 2A when the support 121 is made lighter and its rigidity is lowered, but there are the following restrictions and the like.

That is, in many FPDs, various elements are arranged on the lower surface of the circuit board 126. Therefore, the spacer 123 arranged under the circuit board 126 cannot be sized to support the entire circuit board 126 (entire surface). That is, if the planar shape of the spacer 123 is the same as the planar shape of the circuit board 126, when an external force such as the above-mentioned load or impact is applied, the external force acts on the element through the spacer 123, and the element is damaged. It will be easier to do. Therefore, the spacer 123 arranged under the circuit board 126 is configured to locally support a part of the circuit board 126 in which the element is not arranged (see FIG. 3A).

Thus, in the conventional support structure as shown in FIG. 3A, when a load is applied from above in the figure, as shown in an exaggerated manner in FIG. 3B, the sensor panel SP and the support are different from the structure of FIG. Both of 121 are bent, and the circuit board 126 is also bent. That is, in the conventional support structure shown in FIG. 3, a large distortion occurs in the vicinity of the boundary between the portion where the spacer (122 or 123) is present and the portion where the spacer (122 or 123) is not present. Then, depending on the magnitude of the applied external force (see the downward arrow in FIG. 3B), the glass substrate of the sensor panel SP may be distorted and cracked, or the circuit board 126 itself may be damaged.

As a result of conducting various experiments as described above, the present inventors have provided a support for supporting the sensor panel SP, the circuit board, etc. in the FPD on the back surface (the surface on the inner side of the housing) of the sensor panel SP. It was found that a structure that supports the entire surface and the entire surface of the circuit board is ideal. Then, they have found that by adopting such a support structure, damage to parts such as the sensor panel SP and the circuit board can be effectively suppressed even when the support is changed to a lightweight material.

A configuration example for supporting the sensor panel SP and various electronic components in FPD1 in the present embodiment will be described with reference to FIGS. 4 and below.

(First configuration example)
FIG. 4 is a schematic cross-sectional view of a first configuration example for supporting the sensor panel SP and the like. In the FPD 1 shown in FIG. 4, the housing 2 has a bottom plate 2A having a substantially rectangular plane, a top plate 2B having a plane shape substantially the same as the bottom plate 2A and having an exposure surface R to be irradiated with X-rays, and a bottom plate 2A. It also has side plates 2C and 2D interposed on both sides of the upper plate 2B. Of these, the upper plate 2B is molded from a material that transmits X-rays, and is, for example, a carbon plate that transmits radiation (carbon fibers hardened into a plate shape with resin or the like). The bottom plate 2A and the side plates 2C and 2D can be formed of the same material as the top plate 2B or a different material (for example, magnesium alloy).

The FPD 1 is a support in which the sensor panel SP and various electronic components are housed in a space surrounded by the plates 2A to 2D of the housing 2, and the sensor panel SP and various components are supported from the bottom plate 2A side. 20 is provided. Here, the sensor panel SP is arranged so that the upper surface (a surface on the side for detecting X-rays, also referred to as a “surface”) abuts on the inner surface of the upper plate 2B, and is an electronic component other than the sensor panel SP. Is placed at a predetermined position below the sensor panel SP. In FIG. 4, as electronic components other than the sensor panel SP, a circuit connected to the sensor panel SP from the left side via a battery 25 as a power supply unit for supplying power to the entire FPD 1, a main circuit board 26, and a flexible board 28. The substrate 27 is shown.

The battery 25 is a battery that can be repeatedly charged and discharged, such as a lithium-ion battery, and is supplied by the electric power supplied from the cradle 5 described above via a charging connector (not shown) provided on the side surface side of the housing 2. It will be charged. The circuit board 27 has the function of the above-mentioned A / D conversion unit, and A / D-converts the charge due to X-rays (the intensity state of the irradiated X-rays) detected by each sensor in the sensor panel SP. , The converted digital data is supplied to the main circuit board 26. The main circuit board 26 integrates digital data to generate X-ray image data (captured image data) of the entire affected portion of the subject, and temporarily stores the generated captured image data in the FPD 1. Further, the main circuit board 26 transfers the generated photographed image data (hereinafter, simply referred to as image data) to an external device such as the console device 3 described above through an input / output interface (not shown) provided on the side surface side of the housing 2. Output to.

In the present embodiment, the support 20 is configured to support the lower surface of the sensor panel SP without gaps in the thickness direction (vertical direction in FIG. 4) and the plane direction. The support 20 is arranged so as to substantially fill the space formed between the housing 2 and the sensor panel SP and the space between the housing 2 and the electronic component described above, and is for weight reduction. It has a void. Here, in the aspect of "void for weight reduction", (1) when a void is formed in the support 20 itself (that is, when the material of the support 20 is a foam (porous member)). And (2) the support 20 is a set of a large number of hard members, and the hard members are roughly classified into a case where they are arranged at intervals. In addition, one support may be configured to include both a "foam" and a "aggregate of hard members". The configuration example shown in FIG. 4 is a case where the entire support 20 is a foam (porous member) (an example of (1) above), and the material and the like of the support 20 will be described later. Further, the example of (2) above will be described later with reference to FIG. 7.

In the example shown in FIG. 4, the support 20 has a planar shape that is the same as or slightly larger than the planar shape of the sensor panel SP, and is in the vertical direction between the bottom plate 2A of the housing 2 and the back surface (lower surface) of the sensor panel SP. It is arranged to fill (fill) the space of.

From a functional point of view, the support 20 is arranged on the bottom plate 2A of the housing 2 and the first support 21 that contacts the back surface of the sensor panel SP to support the sensor panel SP, and is inside the housing 2. It is roughly classified into a second support 22 that supports the electronic components (25, 26, 27) of the above. Hereinafter, when the term "support 20" is simply referred to, both the first support 21 and the second support 22 may be included.

In the example shown in FIG. 4, the support 20 (first support 21 and second support 22) is a porous member having a large number of voids for weight reduction, and is, for example, acrylic. It is made of a foam of hard resin such as styrene. Since such a porous member has a significantly smaller specific gravity than that of a metal or the like, it can contribute to the weight reduction of the entire FPD1.

The first support 21 has a planar shape slightly larger than that of the sensor panel SP, and the side portions of the first support 21 are in contact with the side plates 2C and 2D so as not to shift in the housing 2. .. Further, the sensor panel SP is fixed to the first support 21 by applying an adhesive between the lower surface (back surface) of the sensor panel SP and the upper surface of the first support 21. On the other hand, in this example, the sensor panel SP is not fixed to the upper plate 2B of the housing 2. An elongated hole for passing the above-mentioned flexible substrate 28 is provided on the right end side of the first support 21 in the drawing.

The second support 22 has substantially the same planar shape as the sensor panel SP. Therefore, in the example shown in FIG. 4, there is a slight surplus space between the second support 22 and the side plates 2C and 2D of the housing 2, and other electronic components (not shown) such as wiring are placed in this surplus space. It can be placed. The upper surface of the second support 22 has a recess (first) having a shape corresponding to the planar shape of the electronic components (power supply unit 25, main circuit board 26, and circuit board 27 in the example of FIG. 4) housed in the FPD 1. Recessed portion) 22a is formed.

On the other hand, on the lower surface of the main circuit board 26 and the circuit board 27 facing the second support 22, various elements for processing the X-ray information detected by the sensor panel SP and generating an X-ray image are provided. Has been done. Therefore, the first recess 22a corresponding to the main circuit board 26 and the circuit board 27 in the second support 22 has a shape corresponding to the outer shape of various elements protruding from the lower surfaces of the boards 26 and 27. (A second recess for protecting the element) is provided. Hereinafter, the second recess for element protection provided in the first recess 22a for the main circuit board 26 will be described with reference to FIGS. 5A and 5B.

FIG. 5A is a cross-sectional view showing an example of a second recess 22b for element protection, which is configured in the first recess 22a of the second support 22 corresponding to the main circuit board 26. As shown in FIG. 5A, the second support 22 includes a second recess 22b into which the elements 261,262 protruding from the main circuit board 26 are inserted. Here, the depth of each of the second recesses 22b is formed to correspond to the height of the inserted elements 261,262.

Here, if the depth of the first recess 22a for the main circuit board 26 in the second support 22 is uniformly configured, the second support 22 is provided by the elements 261,262 protruding from the main circuit board 26. Is partially compressed, and there is a problem that an extra load is applied to these elements 261,262. On the other hand, in the example shown in FIG. 5A, the second recess 22b for element protection is provided so as to change the thickness of the corresponding portion of the second support 22 according to the height of the inserted elements 261,262. It is additionally formed. According to such a configuration, when a load or the like is applied to the housing 2, excessive force is not applied to these elements 261,262, and damage to the elements 261,262 is prevented.

FIG. 5B is a cross-sectional view showing another example of the second recess 22b for element protection in the first recess 22a of the second support 22 corresponding to the main circuit board 26. As shown in FIG. 5B, each of the second recesses 22b corresponding to the elements 261,262 protruding from the main circuit board 26 may have a through hole (that is, hollow) configuration. With such a configuration, the same effect as that of the configuration of FIG. 5A can be obtained, and the weight can be reduced as compared with the configuration of FIG. 5A. In addition, when there is an element having a large heat generation amount, the hollow surplus space in the second recess 22b (that is, the through hole) into which the element (for example, element 261) is inserted is used to utilize the hollow surplus space, and the bottom plate of the element 261 and the housing 2 is used. A heat transfer material (not shown) may be placed between the 2A and the heat transfer material. In this case, the element 261 and the bottom plate 2A are thermally connected via the heat transfer material, and the heat generated from the element 261 can be dissipated from the housing 2 (bottom plate 2A).

The second recess 22b for element protection shown in FIGS. 5A and 5B has the same configuration with respect to the circuit board 27, and illustration and description thereof will be omitted.

Since the second support 22 provided with the first recess 22a and the second recess 22b described above is in close contact with at least the region of the circuit boards 26 and 27 where the elements are not arranged and the housing 2 (bottom plate 2A). , Circuit boards 26, 27 can be uniformly supported. Therefore, according to the present embodiment, when a load or an impact is applied to the housing 2, distortion of the circuit boards 26 and 27 due to the conventional local support structure (see FIG. 3) is generated. In addition, the elements protruding from these circuit boards 26 and 27 can be protected.

Next, an example of the assembly method of FPD1 will be described. The flexible substrate 28 is passed through the elongated hole of the first support 21, and the back surface of the sensor panel SP and the upper surface of the first support 21 are attached with an adhesive. Further, the battery 25, the main circuit board 26, and the circuit board 27 are attached to the corresponding recesses of the second support 22, so that they are substantially flush with the upper surface of the second support 22 (in addition, the battery 25, the main circuit board 26, and the circuit board 27 are attached to the corresponding recesses of the second support 22. See FIG. 4). Subsequently, the upper surface of the second support 22 to which each component is attached and the lower surface of the first support 21 to which the sensor panel SP is fixed are aligned and stored in the housing 2. When aligning the upper surface of the second support 22 and the lower surface of the first support 21, for example, it may be temporarily fixed with an adhesive tape or the like. Alternatively, the lower surface of the first support 21 may be provided with a recess for embedding the upper surface side of the second support 22. As yet another example, the planar shape of the second support 22 may be the same as the planar shape of the first support 21.

Thus, the space inside the housing 2 is filled with the second support 22, various electronic components, the first support 21, and the sensor panel SP from the lower side of FIG. 4, and these are in close contact with each other. It becomes. Therefore, the space below the sensor panel SP in the housing 2 is supported by the support 20 so that there is no gap in the thickness direction.

As described above, in the FPD 1, the sensor panel SP is supported on the entire surface of the first support 21, and various electronic components such as the circuit boards 26 and 27 and the battery 25 are used on the entire surface of the second support 22. It has a structure that supports it uniformly. With this configuration, when a load or impact is applied to the housing 2, this external force (see the arrows in FIGS. 2B and 3B) is moderately absorbed by the support 20 made of a foam material, and as a result, the sensor panel SP Deflection and local distortion, as well as deflection of the circuit boards 26 and 27 are suppressed. Therefore, according to the present embodiment, it is possible to prevent the glass substrate of the sensor panel SP from being cracked and the elements on the circuit boards 26 and 27 from being damaged due to local strain or the like while reducing the weight of the entire FPD1. ..

Although not shown in FIG. 4, it is preferable to arrange conductive layers (such as a metal thin film or an ITO film) on the upper surface and the back surface of the sensor panel SP to connect or ground the FPD 1 to a predetermined potential when the FPD 1 is used. Specifically, depending on the degree of load applied from the outside of the housing 2 during use, the glass substrate of the sensor panel SP may not crack, but the entire sensor panel SP may temporarily bend slightly. .. Here, when the sensor panel SP is bent, the state of the element in the sensor panel SP (for example, the distance between the TFT layer and another charging layer) changes, and the capacitance changes, so that the sensor panel SP generates the data. The image data to be processed is likely to be affected by noise. Therefore, in order to ensure the quality of the image data generated by the sensor panel SP even if the sensor panel SP is slightly bent, the above-mentioned conductive layer may be arranged.

Further, although not shown in FIG. 4, it is preferable to provide a layer made of a material having a high magnetic permeability between the sensor panel SP and the circuit boards 26 and 27. That is, in the configuration example shown in FIG. 4, the distance between the sensor panel SP and the boards 26 and 27 is secured to some extent by interposing the first support 21 between the sensor panel SP and the boards 26 and 27. There is. On the other hand, depending on the size of the thickness of the first support 21, the distance between the sensor panel SP and the substrates 26 and 27 becomes small (see also FIG. 9 and the like described later). Here, the smaller the distance between the sensor panel SP and the boards 26 and 27, the more easily the sensor panel SP is affected by the magnetic field (magnetic field fluctuation) generated when the elements on the circuit boards 26 and 27 operate, and the generated image data. Is likely to be affected by noise. Therefore, in order to ensure the quality of the image data generated by the sensor panel SP regardless of the thickness of the first support 21, a high magnetic permeability is provided between the sensor panel SP and the substrates 26 and 27. It is desirable to provide a layer made of material.

Various porous materials can be applied to the support 20, and for example, a hard resin foam, a metal foam, or a ceramic foam may be used.

Alternatively, the support 20 may have antistatic properties, for example, kneaded with carbon or the like. When the support 20 is made of such a material, or when the support 20 is made of a metal foam, noise generation due to the charging of the support 20 is prevented, and the electric signal of the FPD 1 is affected. It is prevented from occurring.

Further, as a result of various experiments conducted by the present inventors, it is desirable that the support 20 is made of a material having a compressive elastic modulus of 10 MPa or more from the viewpoint of ensuring the durability of the sensor panel SP against a load or the like. Do you get it. Such an experiment will be described later.

(Second configuration example)
FIG. 6 is a schematic cross-sectional view of FPD1A as a second configuration example. Hereinafter, the parts described with reference to FIG. 4 are designated by the same reference numerals, and the description thereof will be omitted as appropriate.

In the FPD 1A, the support 20A has a first support 21A that supports the sensor panel SP and a second support 22A that supports each component located below the sensor panel SP. Hereinafter, the term support 20A may include both the first support 21A and the second support 22A.

The support 20A is a porous member having a large number of voids for weight reduction, and is made of a foaming material of a hard resin such as acrylic or styrene.

The upper surface of the first support 21A is attached to the back surface of the sensor panel SP with an adhesive or the like, as in the configuration described above in FIG.

The second support 22A is divided into regions corresponding to the respective electronic components such as the battery 25 and the circuit boards 26 and 27 described above, and each has a planar shape substantially the same as the corresponding electronic components. That is, the second support 22A is provided for each electronic component arranged under the sensor panel SP. Further, the second support 22A that supports the circuit boards 26 and 27 is provided with a second recess 22b (see FIGS. 5A and 5B) for element protection into which an element protruding from the circuit boards 26 and 27 is inserted. ing.

As shown in FIG. 6, in the region where the second support 22A is not arranged (that is, the region where the electronic components are not arranged) on the lower surface of the first support 21A, the bottom plate 2A (low) of the housing 2 is located. A leg portion 21a extending downward is formed so as to abut on the surface).

The second configuration example shown in FIG. 6 also supports the sensor panel SP on the entire surface of the first support 21A, similarly to the first configuration example described above. Further, various components such as the circuit boards 26 and 27 and the battery 25 are uniformly supported by using the entire surface of the corresponding second support 22A. Therefore, the same effect as that of the first configuration example can be obtained in the second configuration example.

(Third configuration example)
FIG. 7 is a schematic cross-sectional view of FPD1B as a third configuration example.

The FPD 1B in the third configuration example has a first support 21A that supports the sensor panel SP, and a second support 22B that supports each electronic component located below the sensor panel SP. Of these, the first support 21A has the same configuration as that described above in FIG. Further, the second support 22B is provided for each electronic component (25, 26, 27) as in the example of FIG.

On the other hand, the second support 22B is composed of a plurality of support members 220 arranged in regions corresponding to the respective components such as the battery 25 and the circuit boards 26 and 27 described above. These support members 220 are harder than the first support 21A, and the material of the support member 220 is, for example, resin. Further, each support member 220 is arranged so as to have a gap on the bottom plate 21A (that is, in the plane direction) of the housing 2 so as to have a gap for reducing the weight of the second support 22B as a whole. ing.

In the example shown in FIG. 7, each support member 220 is a columnar member having the same height as each other, and is between the bottom plate 2A and each component at a gap or interval (pitch) at a predetermined distance. Is located in. The interval between the support members 220 is an interval equal to or less than a predetermined value, and specifically, when an external force is applied to the housing 2, the corresponding component is not locally distorted. The spacing is set to 60 mm or less in this example. Further, in order to reduce the overall weight of the second support 22B as much as possible, the support members 220 are arranged at intervals of 30 mm or more. Further, each support member 220 in the region of the circuit boards 26 and 27 is provided at a position where it does not interfere with the element protruding from the circuit boards 26 and 27. The upper surface of each support member 220 is fixed to the lower surface of the corresponding electronic component (battery 25, circuit board 26, 27), for example, with an adhesive. Alternatively, vice versa, the lower surface of each support member 220 may be fixed to the bottom plate 2A of the housing 2.

According to the FPD 1B having such a configuration, various electronic components such as the circuit boards 26 and 27 and the battery 25 are uniformly supported by the corresponding support members 220, which are described above in FIG. It is possible to prevent distortion of electronic components due to such a local support structure. Further, in this configuration example as well, the sensor panel SP is supported by the entire surface of the first support 21A, as in the first and second configuration examples described above. Therefore, the same effect as that of the first configuration example can be obtained in the third configuration example.

The planar shape (pillar shape) of the support member 220 is not particularly limited, and may be various shapes such as a circle, a rectangle, and a hexagon, and further, a hollow cylindrical body may be used. good. Further, the arrangement of each support member 220 is also arbitrary, and may be arranged in a grid pattern or may be arranged in a honeycomb shape, for example.

In the third configuration example shown in FIG. 7, the first support 21A is formed of a porous member (foaming material), and each support member 220 constituting the second support 22B is supported by the first support. It was made of a member harder than the body 21A. There may be various modifications with respect to this third configuration example. For example, regarding the configuration of the second support 22B, the member that supports the battery 25 or the main circuit board 26 or the circuit board 27 has the configuration shown in FIG. 6, that is, is formed of a porous member (foam). May be good. Further, a part of the first support 21A may be formed of a member harder than the porous member (foaming material).

Alternatively, the first support 21A may be formed into a plurality of layers laminated in the vertical direction, and each layer may be composed of foams made of different materials.

In the first to third configuration examples described above, various parts in the housing 2 are fixed to the support 20 (20A, 20B) and fixed to the housing 2 (upper plate 2B or bottom plate 2A). The explanation was made on the assumption that it would not be allowed. On the other hand, in the first to third configuration examples, the sensor panel SP may be fixed to the upper plate 2B (inner surface) of the housing 2. In this case, the upper surface of the sensor panel SP and the upper plate 2B of the housing 2 are adhered to each other by using, for example, double-sided tape or an adhesive. With such a configuration, even when an external impact is applied to the housing 2, problems such as the sensor panel SP colliding with the side plate 2C or the side plate 2D of the housing 2 and being damaged can be prevented.

The configuration example described below suppresses the movement of all the parts housed in the housing 2 (a structure of all parts including a support and a cushioning material; hereinafter collectively referred to as an “internal module”). Therefore, the components of the internal module are fixed to the upper plate 2B side or the bottom plate 2A side.

(Fourth configuration example)
FIG. 8 is a schematic cross-sectional view of FPD1C as a fourth configuration example. In the fourth configuration example, the support 20 includes a first support 21 and a second support 22 similar to the first configuration example described above in FIG. On the other hand, as shown in FIG. 8, in the FPD1C in the fourth configuration example, the cushioning material 30 is arranged between the upper surface of the sensor panel SP and the upper plate 2B of the housing 2. The cushioning material 30 is not particularly limited as long as it is made of a material that transmits radiation, and various materials such as a foam sheet, a bubble wrap (air cushion), and corrugated cardboard can be used.

Both sides (upper surface and lower surface) of the cushioning material 30 are fixed to the upper plate 2B of the housing 2 and the upper surface of the sensor panel SP by a fixing layer such as an adhesive or double-sided tape. That is, a fixed layer 31 is provided between the upper plate 2B of the housing 2 and the upper surface of the cushioning material 30, and a fixed layer 32 is provided between the lower surface of the cushioning material 30 and the upper surface of the sensor panel SP. There is. Further, as in the first configuration example described above, the back surface of the sensor panel SP is fixed to the upper surface of the first support 21 by an adhesive.

With the above configuration, the same effect as the above-mentioned first to third configuration examples can be obtained, and further, the movement of the internal module can be suppressed and the protection against the sensor panel SP can be strengthened. can.

Specifically, in the fourth configuration example, the lower surface (back surface) and the upper surface (irradiated surface) of the sensor panel SP are fixed to the upper surface of the support 20 and the lower surface of the cushioning material 30, and the sensor panel SP is the housing 2. It is held so as to be sandwiched between the support 20 and the cushioning material 30 inside. Therefore, the sensor panel SP does not come into direct contact with any of the upper plate 2B, side plates 2C, and 2D of the housing 2, and is fixed to the upper plate 2B via the cushioning material 30.

With this configuration, even when a large load or a strong impact is applied from the vertical direction, the force is absorbed or alleviated by the cushioning material 30, so that the protection against the sensor panel SP is enhanced. Further, even when an impact in a direction parallel to the surface of the sensor panel SP is applied, for example, when the FPD 1C falls from the side plate 2C (or 2D) side, the sensor panel SP moves in the housing 2 and the side plate 2C. Alternatively, it can be prevented from colliding with the side plate 2D.

In the first to third configuration examples, for example, when the upper plate 2B of the housing 2 and the upper surface of the sensor panel SP are adhered to each other by using double-sided tape, the upper plate 2B and the sensor panel SP may be warped or wavy. If there is, there is a possibility that the state of the contact surface between the upper plate 2B and the sensor panel SP, and thus the state of adhesion, becomes non-uniform. On the other hand, in the fourth configuration example, since the cushioning material 30 is interposed between the upper plate 2B of the housing 2 and the upper surface of the sensor panel SP, the upper plate 2B and the sensor panel SP may be warped or wavy. Even in this case, the cushioning material 30 can absorb the non-uniformity of the distance between both sides due to the warp or swell. Therefore, according to the fourth configuration example, the upper plate 2B of the housing 2, the upper surface of the cushioning material 30, the lower surface of the cushioning material 30 and the lower surface of the sensor panel SP are uniformly adhered to each other by the fixing layers 31 and 32, respectively. In addition, the intervention of the cushioning material 30 enhances the protection of the sensor panel SP (glass substrate, etc.) against loads, impacts, and the like. As a whole, in the fourth configuration example, it is possible to strengthen the protection against the sensor panel SP and suppress the movement of all the parts (internal modules) in the housing 2.

(Fifth configuration example)
FIG. 9 is a schematic cross-sectional view of FPD1D as a fifth configuration example. As can be seen in comparison with FIG. 8, the fifth configuration example shown in FIG. 9 is a structure in which the first support 21 is removed from the fourth configuration example described above in FIG. In the fifth configuration example, electronic parts such as circuit boards 26 and 27 and the battery 25 are in contact with the back surface of the sensor panel SP, and each part in the housing 2 including the sensor panel SP is the second. It has a structure supported by the support 22 of the above. With such a configuration, the weight of the entire device can be further reduced.

On the other hand, in the fifth configuration example, since the distance between the sensor panel SP and other electronic components is short, it is easily affected by the magnetic field (magnetic field fluctuation) generated when the elements on the circuit boards 26 and 27 operate. .. Therefore, it is desirable to provide a layer made of a material having a high magnetic permeability between the sensor panel SP and the substrates 26 and 27.

In the fourth and fifth configuration examples described above, the cushioning material 30 is interposed between the upper plate 2B of the housing 2 and the upper surface of the sensor panel SP. As another example, the cushioning material 30 may not be used, and the upper plate 2B of the housing 2 itself may have a function as a cushioning material. In such a configuration, the upper plate 2B of the housing 2 has a laminated structure in which a plurality of plate materials are laminated, and one layer thereof, for example, the layer of the exposure surface R is made of a foaming material as described above. Form. Further, the bottom plate 2A and the side plates 2C (2D) of the housing 2 may have a similar laminated structure using a foaming material. With such a configuration, the load and impact applied to the housing 2 from the outside can be alleviated by the housing 2 itself, and the protection of the sensor panel SP, the circuit boards 26, 27, etc. can be strengthened. can.

(Sixth configuration example)
FIG. 10 is a schematic cross-sectional view of FPD1E as a sixth configuration example. As can be seen in comparison with FIG. 8, in the sixth configuration example, there are no fixed layers (31, 32) on both sides of the cushioning material 30, and the cushioning material 30 is the sensor panel SP and the housing 2 (upper plate 2B). It is not fixed (bonded) to either. On the other hand, in the sixth configuration example, a fixing layer 33 made of an adhesive, double-sided tape, or the like is provided between the bottom plate 2B of the housing 2 and the lower surface of the second support 22, and the second support is provided. Reference numeral 22 is fixed to the inner wall of the bottom plate 2B, which is a surface of the housing 2 opposite to the surface irradiated with radiation. That is, the fourth and fifth configuration examples (see FIGS. 8 and 9) have a structure in which the internal module in the housing 2 is fixed (held) to the surface on the exposure surface R side. The sixth configuration example shown in FIG. 10 has a structure in which the internal module in the housing 2 is fixed (held) to the surface opposite to the exposure surface R through the support 20. According to the sixth configuration example, the same effect as in the case of the fourth configuration example can be obtained.

Further, as described above, when an internal module in which each component housed in the housing 2 is integrated is configured and the internal module is housed so as not to move in the housing 2, the housing 2 It was found that the rigidity of the upper surface 2B may be made lower than before. Therefore, by reducing the weight of the upper surface 2B of the housing 2, further weight reduction and cost reduction can be achieved.

In the sixth configuration example, the bottom plate 2A of the housing 2 and the support 20 (second support 22) are fixed by using the fixing layer 33 with an adhesive, double-sided tape, or the like. Various modifications can be considered. For example, the lower surface of the second support 22 is not shaped like a plane as shown in FIG. 8, but has a shape in which one or more convex portions protrude from the lower surface, and the convex portions are located at the corresponding positions of the bottom plate 2A of the housing 2. A concave portion to be engaged may be provided, and a fixing structure may be formed by engaging the convex portion and the concave portion. Alternatively, a concave portion may be provided on the lower surface of the second support 22, and a convex portion with which the concave portion engages may be provided at a corresponding position of the bottom plate 2A of the housing 2.

Each of the above-mentioned configuration examples can be arbitrarily combined according to the purpose and the like.

[Example]
Hereinafter, an example of an experiment for confirming the effect performed by the present inventors will be described.

The present inventors changed the compressive elastic modulus of the support 20 (the first support 21 and the second support 22) to the housing 2 for the FPD 1 according to the first configuration example shown in FIG. An experiment and a simulation (estimation) were conducted to determine whether or not the glass substrate of the sensor panel SP was cracked by applying an impact. The thickness of the housing 2 was set to 16 mm or less in accordance with JIS. The inspection results are shown in a table in FIG.

As shown in the table in FIG. 11, when the compressive elastic modulus of the support 20 is 63 MPa, 29.3 MPa, and 10 MPa, the glass substrate of the sensor panel SP does not crack and the support 20 When the compressive elastic modulus was 7.4 MPa and 2 MPa, the glass substrate cracked. As a result, it was found that the material of the support 20 is preferably one having a compressive elastic modulus of 10 MPa or more.

As described above, according to the present embodiment, the support 20 (20A, 20B) for supporting the sensor panel SP and various electronic components is a low-density member having a gap, and thus the support and thus the support The weight of the entire FPD can be reduced. Further, since the support 20 (20A, 20B) according to the present embodiment is configured to support the lower surface of the sensor panel SP without gaps in the thickness direction and the plane direction, the sensor panel against loads, impacts, etc. The protection of SP is strengthened (improvement of resistance).

Further, according to the present embodiment, since the sensor panel SP and various electronic components are uniformly supported over a wide area, the housing 2 is subjected to a load such as a load or an impact applied to the housing 2. Local distortion is prevented or suppressed in the internal parts of the. Therefore, according to the present embodiment, the glass substrate of the sensor panel SP and the circuit boards 26 and 27 are effectively prevented from being cracked or damaged by a load such as a load or an impact. Further, according to the present embodiment, since the second support 22 is provided with a recess for protecting the element, the element on the circuit boards 26 and 27 is damaged by a load such as a load or an impact. Prevented or suppressed.

In addition, the above embodiments are merely examples of embodiment of the present invention, and the technical scope of the present invention should not be construed in a limited manner by these. That is, the present invention can be implemented in various forms without departing from its gist or its main features.

100 X-ray imaging system 1,1A to 1E FPD (radiation imaging device)
2 Housing 2A Bottom plate 2B Top plate 2C, 2D Side plate 20, 20A, 20B Support 21,21A First support 21a Legs 22, 22A, 22B Second support 22a First recess 22b Second recess 220 Support Members 25 Battery 26,27 Circuit board 261,262 Element 30 Cushioning material 31, 32, 33 Fixed layer SP Sensor panel S Subject

The radiographic imaging apparatus according to the present invention is
A sensor panel equipped with a sensor that detects the radiation radiated to the subject on the upper surface side, and
Electronic components arranged on the lower surface side of the sensor panel and
A support that supports the sensor panel and the electronic components,
A housing for accommodating the sensor panel, the electronic components, and the support,
Equipped with
The support is
It is a porous member with voids.
A first support portion that holds the sensor panel on one surface facing the sensor panel and holds the electronic component on the surface opposite to the one surface.
A second support portion arranged between the electronic component and the housing and supporting the electronic component,
Equipped with
The second support portion includes a recess having a shape corresponding to the shape of a circuit element in the circuit board included in the electronic component .

Claims (23)

A sensor panel equipped with a sensor on the top side that detects the radiation emitted to the subject, and
Electronic components arranged on the lower surface side of the sensor panel and
A support that supports the sensor panel and the electronic components,
A housing for accommodating the sensor panel, the electronic components, and the support,
Equipped with
The support has a gap and is configured to support the lower surface of the sensor panel without gaps in the thickness direction and the plane direction.
Radiation imaging device. The support is
A first support that holds the sensor panel on one side facing the sensor panel and holds the electronic component on the side opposite to the one side.
A second support, which is arranged between the electronic component and the housing and supports the electronic component,
To prepare
The radiographic imaging apparatus according to claim 1. The second support supports a region of the circuit board included in the electronic component in which the circuit element is not arranged.
The radiographic imaging apparatus according to claim 2. The second support has a first recess having a shape corresponding to the shape of the electronic component and a second recess formed in the first recess and having a shape corresponding to the shape of the circuit element in the circuit board. Prepare, prepare
The radiographic imaging apparatus according to claim 3. The second recess has a depth corresponding to the height of the circuit element.
The radiographic imaging apparatus according to claim 4. The second recess is a hole that penetrates the second support.
The radiographic imaging apparatus according to claim 4. A leg portion that abuts on the bottom surface of the housing is formed in a region on the lower surface of the first support where the electronic component is not arranged.
The radiographic imaging apparatus according to any one of claims 2 to 6. A plurality of the electronic components are provided, and the electronic components are provided.
The second support is provided for each of the electronic components.
The radiographic imaging apparatus according to claim 7. The support is a porous member.
The radiographic imaging apparatus according to any one of claims 1 to 8. The porous member is a member containing at least one of a resin foam, a metal foam, and a ceramic foam.
The radiographic imaging apparatus according to claim 9. The support has a plurality of support members arranged in a plane direction, and has a plurality of support members.
The gap includes a gap between the plurality of support members.
The radiographic imaging apparatus according to any one of claims 1 to 5. The second support is composed of a plurality of support members arranged in a plane direction.
The gap includes a gap between the plurality of support members.
The radiographic imaging apparatus according to claim 2 or 3. The support member has a pillar shape.
The radiographic imaging apparatus according to claim 11 or 12. The plurality of support members are arranged in a grid pattern.
The radiographic imaging apparatus according to any one of claims 11 to 13. The plurality of support members are arranged in a honeycomb shape.
The radiographic imaging apparatus according to any one of claims 11 to 13. The support is composed of a porous member and a plurality of support members.
The radiographic imaging apparatus according to any one of claims 1 to 15. The sensor panel is fixed to the inner surface of the housing.
The radiographic imaging apparatus according to any one of claims 1 to 16. The sensor panel is fixed to the irradiation surface side of the inner surface of the housing to which the radiation is irradiated.
The radiographic imaging apparatus according to claim 17. A cushioning material is provided between the sensor panel and the housing.
The radiographic imaging apparatus according to claim 18. At least on the irradiation surface side of the housing, a plurality of plate materials including a foaming material are laminated.
The radiographic imaging apparatus according to claim 18 or 19. The support is fixed to the opposite surface so that the sensor panel and the electronic components are held on the opposite surface of the housing to the radiation-irradiated surface.
The radiographic imaging apparatus according to claim 18. The support is adhered to the housing,
The radiographic imaging apparatus according to claim 21. The support has a convex or concave portion corresponding to the concave or convex portion provided on the inner wall of the housing.
The support is fixed to the housing by engaging the convex or concave portion of the support with the concave or convex portion of the housing.
The radiographic imaging apparatus according to any one of claims 1 to 22.

Images