JP2022044167A - Temperature sensor and heater - Google Patents

Abstract

To provide a temperature sensor capable of enhancing accuracy of a detection temperature.SOLUTION: A temperature sensor 30 is arranged so as to face a temperature measuring object 101, and detects a temperature of the temperature measuring object. The temperature sensor 30 includes a thermo-sensitive body 34, an elastic body 33A which supports the thermo-sensitive body 34 and is composed of a heat-resistant resin film, and a support 31 which supports the elastic body 33A and is composed of an electric insulation material. The support 31 supports the elastic body 33A while providing a gap A between the elastic body 33A and the support 31.SELECTED DRAWING: Figure 4

Description

The present invention relates to a temperature sensor capable of detecting the temperature of the bottom surface of a cooking utensil in a state where a cooking utensil such as a pot is mounted on an IH (Induction Heating) cooking heater or the like.

In an induction heating type heater such as an IH cooking heater, cooking is performed by heating the cooker with a pot or the like, which is a cooker, placed on the top plate of the heater. At this time, the temperature of the bottom of the pot is detected by the temperature sensor provided in the heater, and the temperature is monitored by the controller. By doing this, it is possible to monitor whether the inside of the pot is in a temperature state suitable for cooking during cooking, or whether the bottom of the pot is abnormally high, etc., adjust the degree of heating, and stop heating. Etc. are controlled.
Thermistor type is the mainstream of the temperature sensor used for such a purpose, and various types of temperature sensors have been conventionally proposed.

By the way, the temperature sensor of Patent Document 1 is known as a temperature sensor for measuring the temperature of the bottom of a pot via a top plate in an IH cooking heater without a trivet on which a pot is placed like a gas stove. The temperature sensor of Patent Document 1 is provided so as to cover a cushioning layer made of ceramic paper, a thermistor element supported by the cushioning layer, and a thermistor element. It is formed by laminating an element and a protective layer that covers a heat-sensitive layer. As described in Patent Document 1, the cushioning layer presses the thermistor element against the lower surface of the top plate.
According to the temperature sensor of Patent Document 1, it is said that the temperature detection accuracy can be improved.

Japanese Patent No. 4934168

In order to improve the quality of cooking in the IH cooking heater, the performance required for the IH cooking heater is also increased. Temperature control is one of its performances, and for that purpose, it is necessary to further improve the temperature detection accuracy.

The present invention has been made based on such a technical problem, and an object of the present invention is to provide a temperature sensor capable of increasing the accuracy of detection temperature.

The present invention relates to a temperature sensor that is arranged facing the temperature measurement target and detects the temperature of the temperature measurement target. The temperature sensor of the present invention includes and supports a heat-sensitive body that senses heat to be measured, an elastic body that supports the heat-sensitive body, and a support that supports the elastic body and is composed of an electrical insulating material. The body supports the elastic body while providing a gap between the body and the elastic body.

In the present invention, it is preferably composed of a heat-resistant resin film.

The voids in the present invention are preferably formed by being recessed in a direction away from the temperature measurement target from the reference plane facing the temperature measurement target of the support, and are formed in a storage chamber for accommodating the elastic body.

The elastic body in the present invention preferably has a top surface facing the temperature measurement target and exposed from the accommodation chamber, and the heat sensitive body is a front surface facing the temperature measurement target or a back surface facing the void in the top surface. It is provided in.

The elastic body in the present invention is preferably supported by the support in a state where internal stress is generated by being curved.
The elastic body in the present invention is preferably housed in a storage chamber in a state of being curved in a U shape.

The heat-resistant resin film in the present invention is preferably composed of any resin of polyimide, polyetheretherketone and polyphenylene sulfide.
The elastic body in the present invention is preferably composed of a film-like heat-resistant resin.

The support in the present invention preferably includes a first support portion facing the temperature measurement target and a second support portion orthogonal to the first support portion via the bent portion. The first support portion includes a storage chamber formed by being recessed in a direction away from the temperature measurement target.

The elastic body in the present invention preferably consists of a beam that is integrally formed with the support and is supported by the support.

The elastic body in the present invention preferably supports the beam while providing a gap between the elastic body and the beam.

The support in the present invention preferably has a reference plane facing the temperature measurement target, and the beam is formed following the reference plane.
The elastic body in the present invention preferably consists of a cantilever.

Further, the present invention preferably includes a top plate on which a heating target is placed, an annular coil provided on the back surface side of the top plate for heating the heating target by generating a magnetic field when energized, and a ceiling. It is carried out as a heater equipped with a temperature sensor, which measures the temperature of the plate.

According to the temperature sensor of the present invention, the heat sensitive body is elastically supported. Therefore, according to the temperature sensor of the present invention, even if it is applied to an IH cooking heater, for example, the heat sensitive body can be pressed against the measurement target at a pressure required in the applicable temperature range. Therefore, according to the temperature sensor of the present invention, the accuracy of the detected temperature can be improved.

It is sectional drawing which shows the structure of the heater in this embodiment. It is sectional drawing of the 1st sensor which concerns on 1st Embodiment applied to the heater of FIG. It is a perspective view which shows the support of the 2nd sensor which concerns on 1st Embodiment applied to the heater of FIG. 1 by itself. A second sensor according to the first embodiment is shown, (a) is a plan view of the second sensor, and (b) is a rear view. A second sensor according to the first embodiment is shown, (a) is a side view of the second sensor, and (b) is a front view. FIG. 5 (b) is a view taken along the line VI-VI. It is a figure which shows the connector which connected a plurality of second sensors. It is a figure which shows the support structure of the heat-sensitive body by the heat-resistant resin film in the 2nd sensor. It is a figure which shows the other support structure of the heat sensitive body by the heat-resistant resin film in the 2nd sensor. A second sensor according to the second embodiment is shown, (a) is a plan view of the second sensor, and (b) is a front view. A second sensor according to the second embodiment is shown, (a) is a side view of the second sensor, and (b) is a rear view. FIG. 11 (b) is a line arrow view of XII-XII.

Hereinafter, an embodiment of the temperature sensor of the present invention will be described in detail with reference to the accompanying drawings.
This embodiment, which will be described in detail later, is characterized by the configuration of the elastic body 33A of the temperature detection unit 32 in the second sensor 30. With this characteristic configuration, the accuracy of temperature sensing can be improved. The second sensor 30 is preferably used in the IH cooking heater 100 as a heater.

[Overall configuration of IH cooking heater 100: FIG. 1]
As shown in FIG. 1, the IH cooking heater 100 includes a top plate 101 forming the upper surface thereof and an annular coil 110 arranged on the lower surface side of the top plate 101 and located in a plane parallel to the lower surface of the top plate 101. , Is equipped. A cooking utensil 200 such as a pot to be heated is placed on the upper surface of the top plate 101. The coil 110 generates a magnetic field when it is energized from a power source (not shown), and the cooking utensil 200 is heated by this magnetic field.

[Temperature sensor 10: FIG. 1]
The IH cooking heater 100 includes a temperature sensor 10. The temperature sensor 10 includes a first sensor 20 provided in the central portion inside the coil 110, a second sensor 30 located on the outer peripheral side of the first sensor 20 and located on the inner peripheral edge portion of the coil 110, and the like. including. In the present embodiment, for example, four second sensors 30 are provided at equal intervals in the circumferential direction of the top plate 101, but the number thereof is not limited to this.

[First sensor 20: Fig. 2]
The first sensor 20 is connected to, for example, a ceramic protective tube 21, a first heat sensitive body 22 housed inside the protective tube 21, and a pair of electrodes of which the illustration of the first heat sensitive body 22 is omitted. It is provided with a pair of first Dumet wires 23, 23 and the like.
As the first heat sensitive body 22, a metal oxide or a metal having a characteristic that the electric resistance value changes with a temperature change can be used. Then, a constant current is passed through the pair of first Dumet wires 23, 23 and the first lead wires 27, 27 to the first heat sensitive body 22, and an electrode whose first heat sensitive body 22 is not shown in the measuring instrument is omitted. The voltage between them is measured, the resistance value is obtained from Ohm's law (E = IR), and the temperature is detected.
As the metal oxide, a thermistor (Thermally Sensitive Resistor) is preferably used, and typically an NTC thermistor (Negative Temperature Coefficient Thermistor) having a negative temperature coefficient is used. Platinum (for example, Pt100; JIS-C1604) is preferably used as the metal. The same applies to the second heat sensitive body 34 of the second sensor 30, which will be described later. Further, the Dumet Wire is a wire having a composite structure in which an iron-nickel alloy is used as a core metal and copper is coated on the core metal (JIS H4541).
An example of the first heat sensitive body 22 is shown in FIG. 2. The first heat sensitive body 22 includes, for example, a thermistor 22A, a pair of electrodes 22B and 22C formed on the front and back surfaces of the thermistor 22A, and the thermistor 22A and the electrode 22B. , 22D is provided with an insulating coating 22D made of glass that covers the periphery of 22C. As for the configuration of the first heat sensitive body 22, the second heat sensitive body 34, which will be described later, may have the same configuration.
Around the first heat sensitive body 22, an electrically insulating material, for example, a filler 28 made of resin or glass is filled, and a gap with the protective tube 21 is filled.
The first dumet wires 23, 23 are connected to one end of the first lead wires 27, 27 via the connectors 26, 26 in the insulating tube 24. The other ends of the first lead wires 27, 27 are connected to a connector (not shown) for connecting to the controller of the IH cooking heater 100.
In the first sensor 20, the protective tube 21 is attached and fixed to the frame of the IH cooking heater 100 (not shown) via a bracket or the like.

[Second sensor 30 (first embodiment): FIGS. 3 to 6]
As shown in FIGS. 3, 4, 5, and 6, the second sensor 30 has a support 31 made of an electrically insulating material such as resin and ceramics, and a temperature detection unit 32 supported by the support 31. And. The second sensor 30 is referred to as a second sensor according to the first embodiment in order to distinguish it from the second sensor 60 described later.
As shown in FIGS. 3 and 5A, the support 31 has an L-shape when viewed from the side. The support 31 includes a first support portion 31B extending to one side with the bent portion 31A as a boundary, and a second support portion 31C extending to the other side with the bent portion 31A as a boundary. The first support portion 31B is provided with a temperature detection unit 32, and the second support portion 31C is provided with a wiring connection portion 40.
As shown in FIG. 1, in the second sensor 30, the first support portion 31B of the support 31 is located above the inner peripheral edge portion of the coil 110 and faces the top plate 101 side of the IH cooking heater 100, and the temperature is increased. The detection unit 32 is arranged so as to be pressed against the lower surface of the top plate 101. The second support portion 31C of the support 31 is arranged so as to be orthogonal to the top plate 101.

As shown in FIGS. 3, 4 (a) and 6, the first support portion 31B includes a storage chamber 31E which is a rectangular parallelepiped void for accommodating the temperature detection unit 32. When the support 31 is incorporated into the IH cooking heater 100, the storage chamber 31E is formed by being recessed in a direction away from the top plate 101 from the reference surface 31H facing the lower surface of the top plate 101. Therefore, the accommodation chamber 31E includes a bottom floor 31F which is an open bottom portion facing the top plate 101 and a side wall 31G which rises from the bottom floor 31F. The rectangular parallelepiped storage chamber 31E is only an example of the present invention, and its form is not limited as long as the object is achieved.

As shown in FIGS. 3, 4 (b) and 6, the second support portion 31C has terminal connection paths 42, 42 and lead wire connection paths 43, 43 at positions corresponding to the connection terminals 41 described later. To prepare for. The other ends of the second dumet wires 37, 37 are inserted through the terminal connection paths 42, 42, and one end of the second lead wires 39, 39 is inserted through the lead wire connection paths 43, 43.
Further, the second support portion 31C includes electric wire accommodating paths 31D and 31D. One end (lower end in FIG. 3) of the electric wire accommodating paths 31D and 31D is connected to the terminal connection paths 42 and 42, and the other end (upper end in FIG. 3) is connected to the accommodating chamber 31E.

As shown in FIGS. 4A and 4B, the temperature detection unit 32 includes a second heat-sensitive body 34 having a thermistor as a main component and an elastic body 33A supporting the second heat-sensitive body 34. The second heat sensitive body 34 has the same configuration as the first heat sensitive body 22 described above.
The second dumet wires 37 and 37 pass through the electric wire accommodating path 31D formed in the support 31, and are guided from the first support 31B in which the second heat sensitive body 34 is arranged to the second support 31C.

The elastic body 33A is for pressing the second heat sensitive body 34 against the lower surface of the top plate 101 by the elasticity of the second sensor 30 when the second sensor 30 is attached to the IH cooking heater 100.
The elastic body 33A is made of a resin film having heat resistance capable of maintaining its characteristics even when continuously used in an environment of 200 ° C. As the resin having this heat resistance, the polyimide (PI) resin, the polyetheretherketone (PEEK) resin, and the polyphenylene sulfide (PPS) resin described below are suitable.

Polyimide: It is known that the temperature of thermal decomposition is 500 ° C. or higher, and it is sometimes called a super heat resistant engineering plastic. It has mechanical properties with a tensile strength of 6.3 (kgf ・ mm ^-2 ) and a bending strength of 10.5 to 12.0 (kgf ・ mm ^-2 ).
In the type filled with glass fiber, the tensile strength is as high as 19.0 (kgf ・ mm ^-2 ) and the bending strength is as high as 34.8 (kgf ・ mm ^-2 ).

Polyetheretherketone: It has a high melting point of 334 ° C., a tensile strength of 100 (kgf ・ mm ^-2 ), and a bending strength of 170 (kgf ・ mm ^-2 ), and is excellent in mechanical properties.
Polyphenylene sulfide: It has a melting point of 290 ° C. and a normal heat resistant temperature of around 220 ° C. to 240 ° C. It has mechanical properties with a tensile strength of 7.0 (kgf ・ mm ^-2 ) and a bending strength of 141 (kgf ・ mm ^-2 ).

There is no restriction on the thickness of the film made of the above resin materials as long as it can achieve the intended purpose. Here, if the film is too thin, the force for pressing the second heat sensitive body 34 against the lower surface of the top plate 101 is insufficient. On the other hand, if the film is too thick, the force for pressing the second heat sensitive body 34 against the lower surface of the top plate 101 becomes unnecessarily large, and the cost increases. Therefore, as an example, the thickness is selected from the range of 5 to 100 μm, preferably the range of 10 to 50 μm, and more preferably the range of 20 to 30 μm. However, as described above, since the mechanical properties differ depending on the type of resin material, the thickness of the resin film should be specified according to the type of resin material to be applied. Further, by specifying the thickness, the force of pressing the second heat sensitive body 34 against the top plate 101 can be adjusted.

The elastic body 33A is formed of, for example, a material obtained by cutting the above resin material in the form of a film into a rectangular shape. As shown in FIG. 6, the elastic body 33A has a pair of ends pressed against the bottom floor 31F of the storage chamber 31E in a state where the material is curved in a U shape. As a result, the elastic body 33A is accommodated in the accommodation chamber 31E while the curved state is maintained by the side walls 31G and 31G of the accommodation chamber 31E. Therefore, internal stress is stored in the elastic body 33A curved in a U shape, and the elastic body 33A is mechanically supported by the accommodating chamber 31E. In the elastic body 33A, the tallest top portion 33B is exposed to the outside of the storage chamber 31E, and the second heat sensitive body 34 is supported on the front surface of the top portion 33B facing the top plate 101. As a result, the second heat sensitive body 34 is located closer to the cooking utensil 200, which is the temperature measurement target, than other parts in the temperature detection unit 32.

The second heat sensitive body 34 is pressed against the top plate 101 with a stable pressure corresponding to the elastic force of the elastic body 33A while being supported by the top portion 33B. Moreover, behind the top 33B that supports the second heat sensitive body 34, a gap A that occupies the inside of the storage chamber 31E is provided. As is well known, air has a lower thermal conductivity than resin materials and rubber-based materials. Therefore, the heat conducted to the second heat sensitive body 34 is not easily discharged through the elastic body 33A.

[Wiring connection part 40]
As shown in FIG. 4B, the wiring connection portion 40 includes connection terminals 41, 41, terminal connection paths 42, 42 in which the connection terminals 41, 41 are accommodated, and one end of the second lead wires 39, 39. The lead wire connecting paths 43 and 43 to be inserted are provided. One end of the connection terminals 41, 41 is connected to the other end of the second dumet wires 37, 37, and the other end is connected to one end of the second lead wires 39, 39. The other ends of the second dumet wires 37, 37 and one ends of the second lead wires 39, 39 inserted into the lead wire connection path 43 are welded to the connection terminals 41, 41, respectively. As a result, the second dumet wires 37, 37 and the second lead wires 39, 39 are electrically connected via the connection terminals 41, 41. A resin material, for example, epoxy resin is filled around the connection terminals 41, 41 in the terminal connection paths 42, 42 and around the second lead wires 39, 39 in the lead wire connection paths 43, 43, and the connection terminals 41, 41, the second lead wires 39, 39 and the like are positioned.

Here, since the connection terminals 41 and 41 are made of a conductive material (metal), they are parallel to the coil 110 with respect to the magnetic field direction generated by the coil 110 so as not to impair the performance of the IH cooking heater. It is provided so as to be located in the plane, that is, in the plane orthogonal to the top plate 101.
Further, the connection terminals 41 and 41 are provided so as to be offset to one side (the side opposite to the top plate 101) of the coil 110.

[Connection example of the second sensor 30: FIG. 7]
FIG. 7 shows a connection example of a plurality of second sensors 30.
As shown in FIG. 7, a plurality of, for example, four second sensors 30 are connected to one connector 50 via the corresponding second lead wires 39, 39, respectively. Then, this connector 50 is connected to a connector on the controller side (not shown) of the IH cooking heater 100. In this way, if the second lead wires 39, 39 of the plurality of second sensors 30 are connected in advance to one connector 50, the second sensor 30 can be easily assembled and erroneous wiring can be prevented.

[effect]
Hereinafter, the effects of the present embodiment will be described.
[Effect of the configuration of the elastic body 33A]
According to the second sensor 30 according to the present embodiment, the second heat sensitive body 34 is elastically supported by the elastic body 33A made of only the heat-resistant resin film. Therefore, according to the second sensor 30, even if it is applied to the IH cooking heater, the second heat sensitive body 34 can be pressed against the top plate 101 to be measured at a required pressure in the applicable temperature range.
Further, according to the second sensor 30, a gap A occupied by air except for the elastic body 33A is provided behind the second heat sensitive body 34. Therefore, according to the second sensor 30, sufficient heat insulating properties can be maintained.
From the above, according to the second sensor 30, the accuracy of the detection temperature can be improved.

Further, the elastic body 33A is formed by bending a heat-resistant resin film having a predetermined size into a U shape, and internal stress is generated. Therefore, the pressure for pressing the second heat sensitive body 34 against the top plate 101 can be increased as compared with the elastic body 33A in which no internal stress is generated. Therefore, according to the second sensor 30, by reliably pressing the second heat sensitive body 34 against the top plate 101, it is possible to contribute to improving the accuracy of the detection temperature.

Further, the elastic body 33A can be obtained by bending a heat-resistant resin film having a predetermined size into a U shape and inserting it into the storage chamber 31E. Therefore, according to the second sensor 30, it contributes to the improvement of the accuracy of the detection temperature without causing the cost increase of the temperature detection unit 32 from the viewpoint of the material cost and the manufacturing cost.

Furthermore, in the second sensor 30, the accommodation chamber 31E realizes two functions, that is, the function of maintaining the U-shaped shape of the elastic body 33A and the function of forming the void A, in a simple form.

[Effect of L-shape of second sensor 30]
The second sensor 30 is L-shaped in a side view, and the first support portion 31B provided with the temperature detection portion 32 is arranged between the coil 110 and the top plate 101, and the second dumet wires 37 and 37 are arranged. The connection terminals 41, 41 connecting the second lead wires 39, 39 and the second lead wires 39, 39 are arranged so as to be located on the inner peripheral side of the coil 110 in a plane parallel to the direction of the magnetic field generated by the coil 110. ing.
As a result, the connection terminals 41 and 41 can be provided even on the inner peripheral side of the coil 110 where the magnetic flux density is higher than when the connection terminals 41 and 41 are arranged on the coil 110 in a plane orthogonal to the direction of the magnetic field. The number of magnetic lines of magnetic force that pass through can be significantly reduced, and heating of the connection terminals 41 and 41 can be suppressed.
As a result, the temperature detection accuracy of the second sensor 30 can be improved.

[Applicability of other configurations]
Although the preferred embodiment has been described above, the configuration described in the above embodiment can be selected or changed as appropriate without departing from the gist of the present invention.

[Morphology of elastic body]
For example, with respect to the elastic body 33A, an example of elastically supporting the second heat sensitive body 34 by bending it in a U shape has been described, but modified examples shown in FIGS. 8 and 9 can also be adopted. The heat-resistant resin film described above is used in each of the modified examples.

FIG. 8A shows an elastic body 33B obtained by forming a heat-resistant resin film in an annular shape. The elastic body 33B is supported so that both ends of the elastic body 33B in the width direction W are pressed against the side wall of the accommodation chamber 31E. Therefore, the elastic body 33B elastically supports the second heat sensitive body 34, and the second heat sensitive body 34 is pressed against the top plate 101 which is the temperature measurement target. Further, since the void A is formed in the inner region surrounded by the annular elastic body 33B, the transfer of heat to the back of the second heat sensitive body 34 is suppressed.

Next, FIG. 8B shows an elastic body 33C obtained by forming a heat-resistant resin film so as to meander in the width direction W. The elastic body 33C is supported so that its end in the height direction Y is pressed against the bottom wall 31F of the accommodation chamber 31E. Therefore, the elastic body 33 elastically supports the second heat sensitive body 34, and the second heat sensitive body 34 is pressed against the top plate 101 which is the temperature measurement target. Further, since the void A occupied by the air having a small thermal conductivity is provided between the elastic bodies 33B meandering and adjacent to the elastic body 33B in the height direction Y, the transfer of heat to the back of the second heat sensitive body 34 is suppressed. ..

Next, in FIG. 8C, the elastic body 33D is formed by fixing both ends of the heat-resistant resin film in the width direction W to the reference surface 31H. When the heat-resistant resin film is fixed in a state where tension is applied in the width direction W, internal stress is generated in the elastic body 33D and the second heat sensitive body 34 can be elastically supported. As a result, the second heat sensitive body 34 is pressed against the top plate 101, which is the temperature measurement target. Further, since the accommodation chamber 31E exists as the void A behind the elastic body 33D, the transfer of heat to the back of the second heat sensitive body 34 is suppressed.

FIG. 9A shows an elastic body 33E obtained by forming a heat-resistant resin film in a U shape. The elastic body 33E has a structure in which the upper piece 33E1 is supported at both ends by both sides 33E2 and 33E2 in the width direction W. Therefore, the elastic body 33E elastically supports the second heat sensitive body 34, and the second heat sensitive body 34 is pressed against the top plate 101. Further, since the internal region of the accommodation chamber 31E surrounded by the U-shaped elastic body 33E becomes the void A, the transfer of heat to the back of the second heat sensitive body 34 is suppressed.

FIG. 9B shows an elastic body 33F obtained by forming a heat-resistant resin film in a trapezoidal shape. The elastic body 33F also has a structure in which the upper piece 33F1 is supported at both ends. Therefore, the elastic body 33F elastically supports the second heat sensitive body 34, and the second heat sensitive body 34 is pressed against the top plate 101 which is the temperature measurement target. Further, since the internal region of the accommodation chamber 31E surrounded by the elastic body 33F becomes the void A, the transfer of heat to the back of the second heat sensitive body 34 is suppressed.

9 (c) shows that the heat-resistant resin film is curved in a U shape in the same manner as in FIGS. 4 to 6. However, in FIG. 9C, the arrangement of the second heat sensitive body 34 is different. That is, in FIG. 12 (c), the second heat sensitive body 34 is provided on the back surface of the top of the elastic body 33A facing the void A. If this arrangement is adopted, the elastic body 33A made of a heat-resistant resin film functions as an electrical insulator, so that the protective layer 36 can be omitted.

[Presence / absence of containment room 31E]
In the above embodiment, the existence of the accommodation chamber 31E is premised, but the present invention does not necessarily have to provide the accommodation chamber 31E. For example, assuming a U-shaped elastic body 33A, a groove is formed in the reference surface 31H of the first support portion 31B to insert both ends of the elastic body 33A, and the groove maintains the U-shaped shape of the elastic body 33A. Can be done. Also in this case, a gap A is provided between the reference surface 31H and the elastic body 33A.

[Second temperature sensor 60 provided with an elastic body other than the heat-resistant resin film: FIGS. 10 to 12]
The elastic body 33A of the second sensor 30 is made of a heat-resistant resin film, but the present invention is not limited to this, and for example, a part of the support 31 can be provided with the function of the elastic body (33A). Hereinafter, the second temperature sensor 60 having the function of the elastic body on the support 31 will be described with reference to FIGS. 10 to 12. Regarding the second temperature sensor 60, the same components as those of the second sensor 30 may be designated by the same reference numerals as those of the second sensor 30, and the description thereof may be omitted. Further, the second temperature sensor 60 is referred to as a second temperature sensor 60 according to the second embodiment in order to distinguish it from the second temperature sensor 30.

As shown in FIGS. 10, 11 and 12, the second temperature sensor 60 according to the second embodiment is supported by a support 31 made of an electrically insulating material, for example, resin or ceramics, and the support 31. A temperature detection unit 32 is provided.
As shown in FIGS. 10 (a) and 10 (b) and FIG. 12, the support 31 includes a beam 31J integrally formed with the first support portion 31B. The beam 31J has the same function as the elastic body 33A of the second temperature sensor 30 according to the first embodiment.

As shown in FIGS. 10A and 10B, the beam 31J is provided in the middle of the side walls 31G and 31G facing the width direction W in the first support portion 31B. Further, as shown in FIGS. 10A and 10B, the beam 31J extends from the tip end portion 31K of the first support portion 31B toward the base end portion 31L, and has a rectangular shape in a plan view. It is a member. The rectangular shape in a plan view is only an example in the present invention, and other plane shapes such as a triangle may be used.

The beam 31J includes a support surface 31M on which the second heat sensitive body 34 is placed and supported. The support surface 31M faces the lower surface of the top plate 101 when the second temperature sensor 60 is incorporated in the IH cooking heater 100, and in the second embodiment, the support surface 31M is a surface having no step following the reference surface 31H. Make one side. This surface is also only an example of the present invention, and the support surface 31M may protrude above the reference surface 31H as long as the second heat sensitive body 34 can be abutted against the lower surface of the top plate 101. On the contrary, the support surface 31M may be recessed below the reference surface 31H.

The beam 31J is supported by the tip portion 31K, while the side of the base end portion 31L is not supported and has a free end, so that the beam 31J constitutes a cantilever. Therefore, the beam 31J has elasticity in the height direction H of the second temperature sensor 60. Therefore, in the second temperature sensor 60 including the beam 31J, as in the second sensor 30, the second heat sensitive body 34 is supported by the beam 31J, and the top plate has a stable pressure corresponding to the elastic force of the beam 31J. It is pressed against 101. Moreover, since the void A is provided behind the beam 31J as an elastic body that supports the second heat-sensitive body 34, the heat conducted to the second heat-sensitive body 34, like the second sensor 30, causes the beam 31J. It is hard to be discharged through.

Further, in the second temperature sensor 60, since the beam 31J is formed integrally with the first support portion 31B, it is not necessary to use an elastic body as a separate body from the first support portion 31B. Therefore, the second temperature sensor 60 can reduce the number of constituent members.

In the second embodiment, a cantilever is taken as an example of the beam, but this is only an example in the present invention. If the desired elasticity can be obtained, the side of the base end portion 31L may also be a fixed-end beam fixed to the first support portion 31B. Further, the cantilever of the second embodiment shows an example in which the tip portion 31K of the first support portion 31B is a fixed end and extends in the front-rear direction L in FIG. 10A, but the present invention is not limited to this. , Cantilever extending in the width direction W in FIG. 10A, and fixed beam at both ends can be used.

[Structure of temperature sensor 10]
In the above embodiment, the configuration of each part of the temperature sensor 10 has been described in detail, but the number of the second sensors 30 and the like can be appropriately changed to other configurations.
Further, in the above description, the first sensor 20 and the second sensor 30 have different configurations, but the first sensor 20 may also have the same structure as the second sensor 30. ..
Furthermore, the temperature detection method in the temperature detection unit 32 of the second sensor 30 and the first sensor 20 can also be another method.

10 Temperature sensor 20 First sensor 21 Protective tube 22 First heat sensitive body 23 First Dumet wire 24 Insulated tube 26 Connector 27 First lead wire 30, 60 Second sensor 31 Support 31A Bending part 31B First support part 31C First (Ii) Support portion 31D Wire storage path 31E Storage chamber 31F Bottom floor 31G Side wall 31H Reference surface 31J Elastic body (cantilever)
31K Tip 31L Base 31M Support surface 32 Temperature detector 33A, 33B, 33C, 33D, 33E, 33F Elastic body 34 Second heat sensitive body 36 Protective layer 37 Second dumet wire 39 Second lead wire 40 Wiring connector 41 Connection terminal 42 Terminal connection path 43 Lead wire connection path 50 Connector 100 IH cooking heater 101 Top plate 110 Coil 200 Cookware A Void

Claims (14)

A temperature sensor that is placed facing the temperature measurement target and detects the temperature of the temperature measurement target.
A heat-sensitive body that senses the heat of the temperature measurement target,
An elastic body that supports the heat-sensitive body and
A support that supports the elastic body and is composed of an electrically insulating material.
The support supports the elastic body while providing a gap between the support and the elastic body.
A temperature sensor characterized by that.
The elastic body is made of a heat-resistant resin film.
The temperature sensor according to claim 1.
The void is
The support is formed by being recessed in a direction away from the temperature measurement target from the reference surface facing the temperature measurement target.
Formed in a containment chamber for accommodating the elastic body,
The temperature sensor according to claim 2.
The elastic body is
With a top facing the temperature measurement target and exposed from the containment chamber,
The heat sensitive body is
The top surface is provided on the front surface facing the temperature measurement target or the back surface facing the void.
The temperature sensor according to claim 3.
The elastic body is
It is supported by the support in a state where internal stress is generated by being curved.
The temperature sensor according to any one of claims 1 to 4.
The elastic body is
It is housed in the containment chamber in a U-shaped curve.
The temperature sensor according to any one of claims 3 to 5.
The heat-resistant resin film is composed of any resin of polyimide, polyetheretherketone and polyphenylene sulfide.
The temperature sensor according to any one of claims 2 to 6.
The elastic body is made of the heat-resistant resin in the form of a film.
The temperature sensor according to any one of claims 2 to 7.
The support is
A first support portion facing the temperature measurement target and a second support portion orthogonal to the first support portion via a bent portion are provided.
The first support portion is
The accommodation room is provided.
The temperature sensor according to any one of claims 3 to 8.
The elastic body is
It consists of a beam that is integrally formed with the support and is supported by the support.
The temperature sensor according to claim 1.
The support supports the beam while providing a gap between the support and the beam.
The temperature sensor according to claim 10.
The support includes a reference plane facing the temperature measurement target.
The beam is formed following the reference plane.
The temperature sensor according to claim 10 or 11.
The elastic body is composed of a cantilever.
The temperature sensor according to any one of claims 10 to 12.
The top plate on which the object to be heated is placed and
A coil provided on the back surface side of the top plate and for heating the heating target by generating a magnetic field when energized.
The heater according to claim 1, further comprising the temperature sensor according to any one of claims 1 to 13, which measures the temperature of the top plate.

Images