JP2022038445A - Light shielding layer lamination type substrate - Google Patents

Abstract

To prevent, when dividing a mother board by irradiation with a laser beam during the manufacture of a tiling panel, the influence of heat generated in a laser beam irradiation unit to prevent a sublimate generated by the irradiation with the laser beam from attaching to surrounding wires.SOLUTION: A light shielding layer lamination type substrate comprises: a substrate 2 that has a first face 2a and a second face 2b on the opposite side of the first face 2a; a first metal light shielding layer 31 that is laminated at an end edge on one side on the first face 2a; a first insulating layer 31i that is laminated on the first metal light shielding layer 31 and a portion 2a1 on the first face 2a exposed from the first metal light shielding layer 31: a second metal light shielding layer 32 that is laminated on a portion 2a1 on the first insulating layer 31i not overlapping the first metal light shielding layer 31; and a second insulating layer 32i that is laminated on the second metal light shielding layer 32 and a portion 23a on the first insulating layer 31i overlapping the first metal light shielding layer 31.SELECTED DRAWING: Figure 2

Description

The present disclosure relates to a light-shielding layer laminated substrate which is suitably used for manufacturing a composite display device by connecting (tiling) the side surfaces of the substrate.

Conventionally, there has been known a method of tying a plurality of display panels side by side side by side to manufacture one large composite display device also called a multi-display or a tiling panel. In the plurality of display panels constituting the composite display device, it is necessary to make the frame portion, which is a non-display area outside the effective display area, as small as possible or eliminate it. In addition, each display panel is arranged on the side surface of the substrate by electrically connecting the substrate for mounting the light emitting element on the front surface side, the drive unit installed on the back surface side of the substrate, and the light emitting element and the drive unit. May be provided with side wiring. In this case, the side wiring pad on the front surface side connected to the side wiring is located at the edge portion on the front surface of the board, and the side wiring on the back surface side connected to the side wiring is located at the edge portion on the back surface of the board. The pad is located.

Further, each display panel is manufactured by using a substrate formed by a so-called laser cutting method, in which a large-area mother substrate is irradiated with laser light and divided into individual substrates. When the mother substrate is irradiated with laser light, the heat generated in the irradiated portion of the laser beam, that is, the edge portion of the substrate, which is the cutting portion, causes an insulating layer on the substrate near the edge portion of the substrate, particularly an organic resin. An organic insulating layer made of the above sublimated and adhered to the substrate. There is a demand for a technique capable of preventing this adhesion.

A conventional technique for preventing such adhesion is described in, for example, Patent Document 1. In this conventional technique, the light emitting element is sandwiched between the element substrate and the facing substrate, and a light shielding layer is provided on the facing substrate side. In the light-shielding layer, the light-shielding layer provided in the pixel area and the light-shielding layer provided in the peripheral area of the outer periphery of the pixel area have different thermal resistances. Has been proposed to dissipate heat to the outside.

Further, for example, Patent Document 2 describes a method for manufacturing a substrate for cutting a substrate having an organic layer by a laser beam. This conventional technique is a method for manufacturing a substrate that cuts a substrate having an organic layer arranged on one main surface side and a virtual cutting line provided on the other main surface side by a laser beam, and is an organic layer. Is arranged away from the virtual cutting line position, a laser shading layer is provided on the other main surface side or between the organic layer and the other main surface, and the laser beam is emitted from the other main surface side. It is configured to irradiate toward the surface and reduce the heat damage to the organic layer by the laser shading layer.

Japanese Unexamined Patent Publication No. 2008-234841 Japanese Unexamined Patent Publication No. 2019-179175

In the prior art described in Patent Documents 1 and 2, in a normal state, the cutting position when cutting the substrate by laser irradiation at the time of manufacturing the tiling panel, that is, the variation of the cutting position with respect to the preset cutting line, causes the normal state. The end face of a metal shading layer made of a metal such as Mo, which should be covered by the insulating layer, may be exposed. In that case, when the above side wiring is formed from the side wiring pad on the edge on the front surface of the board to the side wiring pad on the edge on the back surface of the board via the side surface of the board, the side wiring is metal-shielded. The side wiring pads that come into contact with the exposed portion of the layer and transmit different signals through the exposed portion may be electrically short-circuited. Further, since the metal light-shielding layer is connected to the entire circumference of the insulating substrate to form a pattern, a large capacity is formed between the metal light-shielding layer and the conductive member when an external conductive member such as a jig approaches. It becomes easier to form a capacitor. Then, the static electricity (charge) generated in the metal light-shielding layer may be discharged to the conductive member or the like, and in that case, an electrostatic discharge (ESD) that causes a malfunction of the display device is generated.

Therefore, conventionally, when the mother substrate is divided by laser light irradiation at the time of manufacturing a tyling panel, the influence of heat generated in the laser light irradiation portion is suppressed, and the sublimation substance adheres to the surrounding wiring or the like by laser light irradiation. There is a demand for technology that can suppress the problem. Further, there is a demand for a technique capable of suppressing short-circuiting of side wiring pads that transmit different signals through the exposed portion of the metal light-shielding layer due to variations in the cutting position due to the laser beam. Further, there is a demand for a metal light-shielding layer having a structure in which electrostatic discharge is unlikely to occur.

The light-shielding layer laminated substrate of the present disclosure is laminated on a substrate having a first surface, a second surface opposite to the first surface, and an edge portion on one side of the first surface. The first insulating layer laminated on the first metal light-shielding layer and the portion exposed from the first metal light-shielding layer on the first metal light-shielding layer and the first insulating layer. It is laminated on the second metal light-shielding layer that is laminated on the portion that does not overlap the first metal light-shielding layer, and on the portion that overlaps the first metal light-shielding layer on the second metal light-shielding layer and the first insulating layer. It is provided with a second insulating layer.

According to the light-shielding layer laminated substrate of the present disclosure, a first metal light-shielding layer and a second metal light-shielding layer located above the light-shielding layer of the first metal light-shielding layer are provided. It is possible to effectively suppress the influence of heat generated on the irradiated portion of the laser beam on the insulating layer when the mother substrate is divided by the laser beam irradiation. As a result, it is possible to prevent the sublimation substance of the insulating layer due to laser light irradiation from adhering to the surrounding wiring or the like. Further, it is possible to prevent the side wiring pads having different side wirings from being short-circuited through the exposed portion of the first metal light-shielding layer due to the influence of heat generated in the irradiation portion of the laser beam. Further, since the metal light-shielding layer is divided into a first metal light-shielding layer and a second metal light-shielding layer, the metal light-shielding layer has a structure in which electrostatic discharge is unlikely to occur.

It is a part of the plan view schematically showing the structure of the light-shielding layer laminated substrate of the embodiment of this disclosure. FIG. 3 is an enlarged cross-sectional view of the light-shielding layer laminated substrate of FIG. 1 as viewed from the cut surface line II-II. FIG. 3 is an enlarged cross-sectional view of the light-shielding layer laminated substrate of FIG. 1 as viewed from the cut plane line III-III. It is a block circuit diagram schematically showing the circuit configuration on the 1st surface side of the light-shielding layer laminated board shown in FIG. 1. It is a block circuit diagram schematically showing the circuit structure on the 2nd surface side of a light-shielding layer laminated board.

Hereinafter, embodiments of the light-shielding layer laminated substrate of the present disclosure will be described with reference to the accompanying drawings.

FIG. 1 is a partial plan view schematically showing the configuration of the light-shielding layer laminated substrate 1 of the embodiment of the present disclosure, and FIG. 2 shows the light-shielding layer laminated substrate 1 of FIG. 1 from the cut surface line II-II. It is an enlarged cross-sectional view as seen, and FIG. 3 is an enlarged cross-sectional view of the light-shielding layer laminated substrate 1 of FIG. 1 as seen from the cut plane line III-III. In addition, in FIG. 2 and FIG. 3, the circuit configuration on the second surface 2b side of the substrate 2 is omitted in order to facilitate the illustration. The light-shielding layer laminated substrate 1 of the present embodiment is realized as a substrate for a plurality of display devices having a narrow frame for tiling, in which a mother substrate is cut from the back surface side by laser light irradiation and a plurality of metal light-shielding layers are provided. Will be done. As the laser beam for cutting the mother substrate, a high-power CO ₂ laser, a YAG laser, or the like can be adopted. The beam diameter of the laser beam L (shown in FIG. 3) is about 5 μm to 5 mm. The symbol "-" means "to".

The light-shielding layer laminated substrate 1 is laminated on a substrate 2 having a first surface 2a and a second surface 2b opposite to the first surface 2a, and an edge portion W on one side on the first surface 2a. The first insulating layer 31i and the first insulating layer 31i laminated on the first metal light-shielding layer 31 and the portion 2a1 exposed from the first metal light-shielding layer 31 on the first metal light-shielding layer 31 and on the first surface 2a. On the second metal light-shielding layer 32 laminated on the portion 2a1 not overlapping the first metal light-shielding layer 31 on the layer 31i, on the second metal light-shielding layer 32, and on the first metal light-shielding layer 31 on the first insulating layer 31i. The second insulating layer 32i to be laminated is provided on the overlapping portion 23a. This configuration produces the following effects. Since the first metal light-shielding layer 31 and the second metal light-shielding layer 32 located at the portion 2a1 not overlapping the first metal light-shielding layer 31 are provided above the first metal light-shielding layer 31, from the back surface side of the mother substrate at the time of manufacturing the tiling panel. It is possible to effectively suppress the influence of heat generated on the irradiated portion of the laser beam on the insulating layer (particularly, the second insulating layer 32i) when the mother substrate is divided by the laser beam irradiation. As a result, it is possible to prevent the sublimation substance of the insulating layer due to laser light irradiation from adhering to the surrounding wiring or the like. Further, it is possible to prevent the side wiring 10 from short-circuiting the side wiring pads that transmit different signals through the exposed portion of the first metal light-shielding layer 31 due to the variation in the cutting position due to the laser beam. Further, since the metal light-shielding layer is divided into the first metal light-shielding layer 31 and the second metal light-shielding layer 32, the metal light-shielding layer has a structure in which electrostatic discharge is unlikely to occur.

Further, the light-shielding layer laminated substrate 1 includes pixel portions 3 arranged in a matrix on the first surface 2a of the substrate 2, a power supply circuit 7 located on the second surface 2b of the substrate 2, and a second substrate 2. A plurality of first wiring pads (first side wiring pads) 8 located near the edge portion W on the one surface 2a and electrically connected to the side wiring 10, and the end on the second surface 2b of the substrate 2. A plurality of second wiring pads (second side surface wiring pads) 9 located near the edge portion W and electrically connected to the side surface wiring 10 may be provided, and a plurality of side surface wirings 10 may be provided. The width of the first metal light-shielding layer 31 and the second metal light-shielding layer 32 is, for example, about 50 μm to 200 μm.

The material of the first metal light-shielding layer 31 and the second metal light-shielding layer 32 as the light-shielding layer of the laser beam L may be aluminum, chromium, molybdenum, or an alloy of these metals. Further, the first metal light-shielding layer 31 and the second metal light-shielding layer 32 may each have a single layer, but may have a laminated structure in which a plurality of layers are laminated. When the materials of the first and second metal light-shielding layers 31 and 32 are aluminum having high reflectance, a transparent insulating layer is provided on the irradiation side of the laser beam L of the first and second metal light-shielding layers 31 and 32. You may. In this case, the laser beam L is reflected by the first and second metal shading layers 31 and 32 without lowering the reflectance, and the heat absorption is reduced by the transparent insulating layer. As a result, the laser beam L is efficiently reflected to the outside of the second surface 2b side of the substrate 2 while suppressing heat absorption. Therefore, the effect of reducing thermal damage to the second insulating layer 32i, the organic insulating layers 24, 26, and the like is increased.

Further, the material of the first metal light-shielding layer 31 and the second metal light-shielding layer 32 may be more preferably molybdenum or the like. Since molybdenum efficiently absorbs and transfers heat from the laser beam, the intensity of the reflected light can be suppressed and the temperature rise of the light-shielding layer laminated substrate 1 can be suppressed. That is, it is possible to increase the effect of reducing thermal damage due to the secondary reflection and absorption of the reflected light reflected by the first and second metal shading layers 31 and 32.

Further, the first metal light-shielding layer 31 and the second metal light-shielding layer 32 may be configured to be composed of "Mo / Al / Mo", "MoNd / AlNd / MoNd" and the like. Here, "Mo / Al / Mo" indicates a laminated structure in which the Al layer is laminated on the Mo layer and the Mo layer is laminated on the Al layer.

Further, the material of the first metal light-shielding layer 31 and the second metal light-shielding layer 32 may be chromium oxide exhibiting black color. That is, it may be a layer that absorbs and attenuates the laser beam L.

Further, as shown in FIG. 1, the light-shielding layer laminated substrate 1 has a plurality of first metal light-shielding layers 31, and each of the first metal light-shielding layers 31 has one side (for example, the second side 2ab) on the edge portion W. The second metal light-shielding layer 32 is laminated on the first insulating layer 31i at the portion 2a1 between the adjacent first metal light-shielding layers 31. You may. The portion 2a1 is also a portion that does not overlap with the first metal light-shielding layer 31. In this case, since the first metal light-shielding layer 31 and the second metal light-shielding layer 32 are further divided into smaller areas, the metal light-shielding layer has a structure in which electrostatic discharge is less likely to occur.

The first metal light-shielding layer 31 and the second metal light-shielding layer 32 may be in a series in a plan view. In this case, it is possible to further suppress the light (laser light) incident from the side of the second surface 2b of the substrate 2 from reaching the second insulating layer 32i. As a result, it is possible to more effectively suppress the influence of the heat generated by the irradiation of the laser beam on the second insulating layer 32i.

The second metal light-shielding layer 32 may have an overlapping portion (overlap portion) LW that overlaps with the first metal light-shielding layer 31 in a plan view. In this case, it is possible to further suppress the light (laser light) incident from the side of the second surface 2b of the substrate 2 from reaching the second insulating layer 32i. As a result, it is possible to more effectively suppress the influence of the heat of the laser beam on the second insulating layer 32i. The length of the superimposing portion LW may be about 5 μm to 500 μm.

Further, the superimposed portion LW has a length such that the diffracted light (laser light) incident from the side of the second surface 2b of the substrate 2 diffracted at the end of the first metal shading layer 31 does not reach the second insulating layer 32i. You may have. In this case as well, the same effect as described above is obtained. In this case, the length of the superimposed portion LW is about 20 μm to 700 μm.

The first metal light-shielding layer 31 and the second metal light-shielding layer 32 may have a structure having light reflectivity. In this case, since the light (laser light) incident from the side of the second surface 2b of the substrate 2 is reflected by the first metal light-shielding layer 31 and the second metal light-shielding layer 32, the second insulating layer 32i is the laser light. The influence of heat can be suppressed more effectively. The first metal light-shielding layer 31 and the second metal light-shielding layer 32 may be made of, for example, a metal material, an alloy material, or the like having a high light reflectance of visible light. Examples of the metal material include aluminum (Al), silver (Ag), gold (Au), chromium (Cr), nickel (Ni), platinum (Pt), tin (Sn) and the like. Further, as the alloy material, there are duralmin (Al—Cu alloy, Al—Cu—Mg alloy, Al—Zn—Mg—Cu alloy) which is an aluminum alloy containing aluminum as a main component. The light reflectance of these materials is about 90% to 95% for aluminum, about 93% for silver, about 60% to 70% for gold, about 60% to 70% for chromium, and about 60% to 70% for nickel. Platinum is about 60% to 70%, tin is about 60% to 70%, and aluminum alloy is about 80% to 85%. Therefore, examples of suitable materials for the first metal light-shielding layer 31 and the second metal light-shielding layer 32 having light reflectivity include aluminum, silver, gold, and aluminum alloys.

The first metal light-shielding layer 31 and the second metal light-shielding layer 32 may have a light scattering property. In this case, in general, the surface roughness such that the surface of the thin film and the surface of the substrate are optical mirror surfaces is about 1/10 of the wavelength used in the arithmetic mean roughness. Therefore, in the case of light having a wavelength of 550 nm, which has the highest sensitivity of the human eye, a surface having an arithmetic mean roughness of 55 nm or less tends to be an optical mirror surface. Therefore, since the surface having an arithmetic average roughness of 55 nm or more tends to be a light scattering surface, the surfaces of the first metal light-shielding layer 31 and the second metal light-shielding layer 32, which have light scattering properties, are 55 nm to 10 μm. It may be an arithmetic average roughness of degree. It may be preferably about 1 μm to 10 μm, and more preferably about 2 μm to 7 μm.

The first insulating layer 31i may be configured to include light-scattering particles. In this case, the light (laser light) incident from the side of the second surface 2b of the substrate 2 is scattered by the light scattering particles contained in the first insulating layer 31i, and the second insulating layer 32i is heated by the irradiation of the laser light. It can effectively suppress the influence. The light scattering particles are made of, for example, a metal material, an alloy material, a glass material, a ceramic material, a metal oxide material, and the like. Examples of the metal material include aluminum (Al), silver (Ag), gold (Au), chromium (Cr), nickel (Ni), platinum (Pt), tin (Sn) and the like. Further, as the alloy material, there are duralmin (Al—Cu alloy, Al—Cu—Mg alloy, Al—Zn—Mg—Cu alloy) which is an aluminum alloy containing aluminum as a main component. Examples of the glass material include borosilicate glass, crystallized glass, quartz, soda glass and the like. Examples of the ceramic material include alumina, aluminum nitride, silicon nitride and the like. Examples of the metal oxide material include titanium oxide. When the light-scattering particles are made of a transparent material such as a glass material or a metal oxide material, the light-scattering particles scatter and refract the laser light incident from the side of the second surface 2b of the substrate 2 to the side of the second insulating layer 32i. It can be difficult to reach. Further, when the light-scattering particles have light reflectivity such as metallic luster color of a metal material, an alloy material, etc., the light-scattering particles reflect and scatter the laser light incident from the side of the second surface 2b of the substrate 2 to provide the second insulation. It is possible to make it difficult to reach the side of the layer 32i.

The average particle size of the light-scattering particles may be about 55 nm to 10 μm. It may be preferably about 1 μm to 10 μm, and more preferably about 2 μm to 7 μm.

The first insulating layer 31i may be made of an inorganic material such as silicon oxide (SiO ₂ ) or silicon nitride (Si ₃ N ₄ ). In this case, the laser light incident from the side of the second surface 2b of the substrate 2 improves the laser resistance of the first insulating layer 31i that is incident before the second insulating layer 32i.

The second insulating layer 32i may be made of an organic material such as an acrylic resin or a polycarbonate resin. In this case, the second insulating layer 32i, which is not easily affected by the heat of the laser beam incident from the side of the second surface 2b of the substrate 2, can form a thick flattening layer or the like.

Further, the second insulating layer 32i may be a light-shielding layer made of a blackening resin, so-called black matrix, or the like. In this case, when the display device is manufactured using the light-shielding layer laminated substrate 1, the light-shielding layer becomes a black background color, and the contrast of the displayed image is improved.

The side wiring 10 is provided from the edge portion W of the first surface 2a of the substrate 2 to the side of the second surface 2b via the side surface of the substrate 2, and the side wiring 10 is the first metal shading layer 31 and / or the second. The configuration may be such that it overlaps with the metal light-shielding layer 32. In this case, it is possible to prevent the adjacent side wirings 10 from being short-circuited via the exposed portion of the first metal light-shielding layer 31 and / or the exposed portion of the second metal light-shielding layer 32. The side wiring 10 is formed by applying a conductive paste containing conductive particles such as Ag, Cu, Al, and stainless steel, an uncured resin component, an alcohol solvent, water, and the like from the first surface 2a to the side surface and the second surface of the substrate 2. It can be formed by a method such as a heating method, a photo-curing method of curing by light irradiation such as ultraviolet rays, a photo-curing heating method, or the like after applying to a desired portion of 2b. The side wiring 10 can also be formed by a thin film forming method such as a plating method, a vapor deposition method, or a CVD (Chemical Vapor Deposition) method. Further, a groove may be formed in advance in a portion of the substrate 2 on the first surface 2a, the side surface, and the second surface 2b where the side surface wiring 10 is formed. As a result, the conductive paste serving as the side wiring 10 can be easily arranged at a desired portion on the substrate.

The first metal light-shielding layer 31 and the second metal light-shielding layer 32 may be electrically floating (floating state). That is, the first metal shading layer 31 and the second metal shading layer 32 may be in a non-connected state to specific potential portions such as the anode potential portion and the cathode potential portion. In this case, the first metal shading layer 31 and the second metal due to the potential gradient generated from the connection portion with the specific potential portion to the opposite end portion of the first metal shading layer 31 and the second metal shading layer 32. It is possible to prevent the light-shielding layer 32 from being deteriorated by electrolytic corrosion.

Further, the first metal light-shielding layer 31 and the second metal light-shielding layer 32 may be arranged over the entire circumference of the substrate 2. For example, when the substrate 2 has a rectangular shape, if all the sides (4 sides) are laser-cut, the first metal light-shielding layer 31 and the second metal light-shielding layer 32 are arranged on all the sides. May be good. When the substrate 2 has a side that is laser-cut and a side that is not laser-cut, the first metal light-shielding layer 31 and the second metal light-shielding layer 32 may be arranged at least on the laser-cut side.

On the first surface 2a of the substrate 2, a light emitting element 61, a TFT that drives and controls the light emitting element 61, and a wiring layer such as a gate signal line 4 and a source signal line 5 described later that connect the light emitting element 61 and the TFT are provided. , And at least one of the first metal light-shielding layer 31 and the second metal light-shielding layer 32 may be made of the same material as the wiring layer. In this case, the number of steps can be reduced.

FIG. 4 is a block circuit diagram schematically showing a circuit configuration on the first surface 2a side of the light-shielding layer laminated board shown in FIG. 1, and FIG. 5 shows a circuit configuration on the second surface 2b side of the light-shielding layer laminated board. It is a block circuit diagram schematically shown. The substrate 2 is, for example, a transparent or opaque glass substrate, a plastic substrate, a ceramic substrate, or the like. The substrate 2 has a first surface 2a, a second surface 2b opposite to the first surface 2a, and a third surface (hereinafter, also referred to as a side surface) 2c connecting the first surface 2a and the second surface 2b. is doing. The shape of the substrate 2 may be a triangular plate shape, a rectangular plate shape, a trapezoidal plate shape, a circular plate shape, an elliptical plate shape, a hexagonal plate shape, or the like, or may have other shapes. When the shape of the substrate 2 is a triangular plate shape, a rectangular plate shape, a hexagonal plate shape, or the like, a plurality of light-shielding layer laminated substrates 1 are tiling to form a composite and large-sized display device (hereinafter,). , Also called multi-display) becomes easy to manufacture. In the present embodiment, for example, as shown in FIGS. 1 and 2, the substrate 2 has a rectangular plate-like shape, and the first surface 2a is a second side connected to the first side 2aa and the first side 2aa. It has an edge of 2ab.

A plurality of pixel portions 3 are arranged in a matrix on the first surface 2a of the substrate 2 at a predetermined pitch. The plurality of pixel units 3 are arranged corresponding to the intersections of the plurality of gate signal lines 4 and the plurality of source signal lines 5, and each pixel unit 3 has a light emitting element 6. The plurality of gate signal lines 4 are arranged along a predetermined direction (the left-right direction in FIG. 1, for example, the row direction). The plurality of source signal lines 5 are arranged so as to intersect the plurality of gate signal lines 4 in a direction intersecting a predetermined direction (for example, a column direction).

Each of the plurality of pixel portions 3 has a light emitting element 6 and an electrode pad 62. The light emitting element 6 is a self-luminous element such as a light emitting diode (LED) element, an organic electroluminescence element, or a semiconductor laser element. In this embodiment, an LED element is used as the light emitting element 6. The light emitting element 6 may be a micro LED element. When the light emitting element 6 is a micro LED element, the light emitting element 6 has a rectangular shape having a side length of about 1 μm or more and about 100 μm or less or about 3 μm or more and about 10 μm or less in a state of being arranged on the first surface 2a. It may have a plan view shape of.

The light emitting element 6 has an anode terminal and a cathode terminal, and the electrode pad 62 has an anode pad 62a and a cathode pad 62b. The anode terminal and the cathode terminal of the light emitting element 6 are electrically connected to the anode pad 62a and the cathode pad 62b, respectively, via a conductive bonding material such as a conductive adhesive or solder.

Each pixel unit 3 may have a plurality of light emitting elements 6, a plurality of anode pads 62a, and a plurality of cathode pads 62b. The plurality of anode terminals of the plurality of light emitting elements 6 are electrically connected to the plurality of anode pads 62a, and the plurality of cathode terminals of the plurality of light emitting elements 6 are electrically connected to the plurality of cathode pads 62b. To. The plurality of light emitting elements 6 may be a light emitting element 61R that emits red light, a light emitting element 61G that emits green light, and a light emitting element 61B that emits blue light. In this case, each pixel unit 3 can display color gradation. Each pixel unit 3 may have a light emitting element that emits orange light, red-orange light, magenta light, or purple light instead of the light emitting element 61R that emits red light. Further, each pixel unit 3 may have a light emitting element that emits yellowish green light instead of the light emitting element 61G that emits green light.

The power supply circuit 7 as the power supply unit is arranged on the second surface 2b, for example, as shown in FIG. The power supply circuit 7 generates the first power supply voltage VDD and the second power supply voltage VSS supplied to the plurality of pixel units 3. The power supply circuit 7 has a VDD terminal that outputs the first power supply voltage VDD and a VSS terminal that outputs the second power supply voltage VSS. The first power supply voltage VDD is, for example, an anode voltage of about 10V to 15V. The second power supply voltage VSS is lower than the first power supply voltage VDD, and is, for example, a cathode voltage of about 0V to 3V. The power supply circuit 7 may be configured by, for example, a flexible circuit board (FPC). The power supply unit may be a circuit module including a semiconductor element such as an IC or LSI for controlling the power supply voltage. Further, the power supply unit has a power supply circuit 7 and a light emission control element configured by an IC chip for generating a control signal for controlling light emission, non-light emission, light emission intensity, etc. of the light emission element 6. You may.

Further, the drive circuit unit 13 is arranged on the second surface 2b. The drive circuit unit 13 electrically connects to the source signal line 5 arranged on the first surface 2a via the second source signal line 17 (shown in FIGS. 3 and 5) arranged on the second surface 2b. It is connected. The drive circuit unit 13 and the power supply circuit 7 may be electrically connected in order to synchronize their operations.

As shown in FIG. 4, for example, the plurality of first wiring pads 8 are arranged at the edge portion W on the first side 2aa side on the first surface 2a. The edge portion W is an edge portion along the first side 2aa, and is a portion having a width of about 10 μm to 500 μm from the first side 2aa on the first surface 2a toward the center side of the first surface 2a. There is, but it is not limited to the value of this width. The plurality of first wiring pads 8 have a plurality of first pads 81 and a plurality of second pads 82. The first pad 81 is a wiring pad for supplying the first power supply voltage VDD to the plurality of pixel portions 3, and the second pad 82 is a wiring for supplying the second power supply voltage VSS to the plurality of pixel portions 3. It is a pad. The first wiring pad 8 has a rectangular shape with a side length of about 50 μm to 500 μm, preferably about 70 μm to 300 μm, but the length of one side is not limited to these values, and the shape is also a pentagonal shape. It may have various shapes such as a polygonal shape such as a trapezoidal shape, a circular shape, and an elliptical shape. Hereinafter, the same configuration can be adopted for the wiring pad.

As shown in FIG. 4, for example, the light-shielding layer laminated substrate 1 has a first routing wiring 11a and a second routing wiring 11b. The first routing wiring 11a and the second routing wiring 11b are located on the first surface 2a. The first routing wiring 11a and the second routing wiring 11b are composed of, for example, "Mo / Al / Mo", "MoNd / AlNd / MoNd", and the like. Here, "Mo / Al / Mo" indicates a laminated structure in which the Al layer is laminated on the Mo layer and the Mo layer is laminated on the Al layer. The same applies to others. The first routing wiring 11a connects the anode terminal of the light emitting element 6 and the plurality of first pads 81. The second routing wiring 11b connects the cathode terminal of the light emitting element 6 and the plurality of second pads 82.

The plurality of second wiring pads 9 are located on the second surface 2b. As shown in FIG. 5, for example, the plurality of second wiring pads 9 may be arranged at the end edge portion on the first side 2aa side. This edge portion may have the same configuration as the edge portion W described above. The plurality of second wiring pads 9 have a plurality of third pads 91 and a plurality of fourth pads 92. The third pad 91 is a wiring pad for supplying the first power supply voltage VDD to the plurality of pixel portions 3, and the fourth pad 92 is a wiring for supplying the second power supply voltage VSS to the plurality of pixel portions 3. It is a pad.

The light-shielding layer laminated substrate 1 has a configuration in which the number of the plurality of first pads 81 and the number of the plurality of third pads 91 are equal, and the number of the plurality of second pads 82 and the number of the plurality of fourth pads 92 are equal. Is. The plurality of first pads 81 and the plurality of third pads 91 may overlap each other in a plan view, that is, when viewed from a direction orthogonal to the first surface 2a. The plurality of second pads 82 and the plurality of fourth pads 92 may overlap each other in a plan view.

The light-shielding layer laminated substrate 1 has a third routing wiring 12. The third routing wiring 12 is located on the second surface 2b. The third routing wiring 12 is composed of, for example, “Mo / Al / Mo”, “MoNd / AlNd / MoNd”, Ag, and the like. For example, as shown in FIG. 5, in the third routing wiring 12, the VDD terminal of the power supply circuit 7 and the plurality of third pads 91 are connected, and the VSS terminal of the power supply circuit 7 and the plurality of fourth pads 92 are connected to each other. You are connected.

The plurality of side wirings 10 are arranged from the top of the first surface 2a to the top of the second surface 2b via the third surface 2c which is the side surface of the substrate 2. In the present embodiment, for example, as shown in FIGS. 4 and 5, the plurality of side wirings 10 are arranged from the first surface 2a to the third surface 2c and the second surface 2b. The plurality of side wirings 10 connect the plurality of first wiring pads 8 and the plurality of second wiring pads 9, respectively. The plurality of side wirings 10 connect the plurality of first pads 81 and the plurality of third pads 91, respectively, and connect the plurality of second pads 82 and the plurality of fourth pads 92, respectively.

The light-shielding layer laminated substrate 1 penetrates from the first surface 2a to the second surface 2b instead of the plurality of side wiring 10, and connects the plurality of first wiring pads and the plurality of second wiring pads, respectively. It may be configured to have a through conductor. Further, the configuration may have a plurality of side wirings 10 and a plurality of through conductors. The light-shielding layer laminated substrate 1 of the present embodiment may preferably have at least a plurality of side wirings 10.

The light-shielding layer laminated substrate 1 is arranged from the first surface 2a to the second surface 2b, and has a gate wiring for connecting a plurality of gate signal lines 4 and a control element of the power supply circuit 7. As shown in FIGS. 4 and 5, the gate wiring includes a fifth wiring pad 18, a sixth wiring pad 19, a first gate wiring 20, a second gate wiring 21, and a third gate wiring 22.

As shown in FIG. 4, for example, the fifth wiring pad 18 is arranged at the end edge portion on the first surface 2a on the first side 2aa side. As shown in FIG. 5, for example, the sixth wiring pad 19 is arranged at the end edge portion on the second surface 2b on the first side 2aa side. The fifth wiring pad 18 and the sixth wiring pad 19 may overlap each other in a plan view. As shown in FIG. 4, for example, the first gate wiring 20 is arranged on the first surface 2a and connects a plurality of gate signal lines 4 and the fifth wiring pad 18. The second gate wiring 21 is arranged on the second surface 2b, for example, as shown in FIG. 5, and connects the control element of the power supply circuit 7 and the sixth wiring pad 19. As shown in FIGS. 4 and 5, for example, the third gate wiring 22 is arranged from the first surface 2a to the third surface 2c and the second surface 2b, and the fifth wiring pad 18 and the sixth wiring pad 19 are arranged. Is connected to.

The first wiring pad 8 and the second wiring pad 9 are made of a conductive material. The first wiring pad 8 and the second wiring pad 9 may be made of a single metal layer, or may be made by laminating a plurality of metal layers. The first wiring pad 8 and the second wiring pad 9 are, for example, Al, "Al / Ti", "Ti / Al / Ti", Mo, "Mo / Al / Mo", "MoNd / AlNd / MoNd", Cu. , Cr, Ni, Ag and the like.

As shown in FIG. 3, the first wiring pad 8 is formed by laminating two conductor layers 8a and 8b. The conductor layer 8a is composed of Al, "Al / Ti", "Ti / Al / Ti", Mo, "Mo / Al / Mo", "MoNd / AlNd / MoNd", Cu, Cr, Ni, Ag and the like. The conductor layer 8b on the conductor layer 8a may be composed of a transparent conductive layer made of ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or the like. Further, the insulating layers 25 and 26 may be arranged at the inner end of the first surface 2a of the first wiring pad 8. As a result, it is possible to prevent the first wiring pad 8 from being short-circuited with the wiring conductor or the like arranged on the inner side of the first surface 2a. The insulating layers 25 and 26 are made of a polymer material such as SiO ₂ , Si ₃ N ₄ , acrylic resin or the like. The surface of the second wiring pad 9 may be covered with a transparent conductive layer made of ITO, IZO, or the like.

Each pixel unit 3 has a first thin film (Thin Film Transistor: TFT) as a switch element for inputting a light emitting signal to each of the light emitting elements 6 on the substrate 2, and a level (voltage) of the light emitting control signal. A second thin film as a driving element for driving the light emitting element 6 with a current by a potential difference (emission signal) between a positive voltage (anode voltage: about 10V to 15V) and a negative voltage (cathode voltage: about 0V to 3V). And, including.

The first and second TFTs have a semiconductor film made of, for example, amorphous silicon (a-Si), low-Temperature Poly Silicon (LTPS), etc., and are used for a gate electrode, a source electrode, and a drain electrode. It has a configuration having three terminals. Further, as the first and second TFTs, a configuration in which both are n-channel TFTs, a configuration in which both are p-channel TFTs, and a configuration in which one is an n-channel TFT and the other is a p-channel TFT can be adopted. Then, by applying a voltage (about 2.5V to 3.5V) of a predetermined potential to the gate electrode, a current flows through the semiconductor film (channel) between the source electrode and the drain electrode, a switching element (gate transfer element). Functions as. When the substrate 2 is a drive circuit composed of a glass substrate and the drive element is a drive circuit configured by using a TFT having a semiconductor film made of LTPS, the TFT is formed on the substrate 2 by a thin film forming method such as a CVD (Chemical Vapor Deposition) method. Can be formed directly by.

According to the present embodiment, when a plurality of light-shielding layer laminated substrates 1 are tiling to produce a composite display device, the front surface side and the back surface side of each light-shielding layer laminated substrate 1 are side surfaces made of Ag or the like. It is electrically connected by wiring 10. When a single metal light-shielding layer that blocks laser light is arranged at the formation portion of the side wiring 10 of the substrate 2 as in the conventional case, there is a possibility that adjacent side wiring 10s may be short-circuited via the metal light-shielding layer. However, in the present embodiment, since the metal light-shielding layer is separated into the first metal light-shielding layer 31 and the second metal light-shielding layer 32 at different positions in the stacking direction, the adjacent side wirings 10 are second to each other. 1 It is possible to prevent short-circuiting via the metal light-shielding layer 31. Further, in the present embodiment, when the overlapping portion LW is provided so that the first metal light-shielding layer 31 and the second metal light-shielding layer 32 are in a series in a plan view, from the side of the second surface 2b of the substrate 2. Even if the laser beam is irradiated, the second insulating layer 32i and the like can be effectively suppressed from being affected by the heat of the laser beam. Further, when the first metal light-shielding layer 31 and the second metal light-shielding layer 32 are electrically floating (floating state), the first metal light-shielding layer 31 and the second metal light-shielding layer 32 are deteriorated by electrolytic corrosion. You can prevent that. Further, since the metal light-shielding layer is divided into the first metal light-shielding layer 31 and the second metal light-shielding layer 32, the metal light-shielding layer has a structure in which electrostatic discharge is unlikely to occur.

Further, as shown in FIG. 2, the first metal light-shielding layer 31 and the second metal light-shielding layer 32 are not only the second insulating layer 32i but also an insulating layer (organic insulation) which is an organic layer as a thick flattening layer or the like. Since the layer) is located closer to the laser beam L than the layers 24 and 26, the influence of the heat of the laser beam L on not only the second insulating layer 32i but also the organic insulating layers 24 and 26 can be suppressed. That is, it is possible to prevent the organic insulating layers 24 and 26 from sublimating due to the heat of the laser beam L and then solidifying and adhering to the wiring or the like on the first surface 2a as foreign matter.

The thickness of each of the first metal light-shielding layer 31 and the second metal light-shielding layer 32 is about 50 nm to 1 μm, but even if the thickness of the first metal light-shielding layer 31 is made thicker than the thickness of the second metal light-shielding layer 32. good. In this case, the first metal light-shielding layer 31 on the side closer to the laser light L can efficiently absorb the heat of the laser light, and the second metal light-shielding layer 32 can be less affected by the heat of the laser light. The thickness of the first metal light-shielding layer 31 may be more than 1 times and 5 times or less the thickness of the second metal light-shielding layer 32, but is not limited to this value. If it exceeds 5 times, it tends to hinder the thinning of the light-shielding layer laminated substrate 1.

Although the embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above-described embodiments, and various changes, improvements, etc. may be made without departing from the gist of the present disclosure. It is possible. Needless to say, all or part of each of the above embodiments can be combined as appropriate and within a consistent range.

The light-shielding layer laminated substrate of the present disclosure can be configured as a light emitting display device such as an LED display device and an organic EL display device, and a liquid crystal display display device. Further, the light-shielding layer laminated substrate of the present disclosure can be applied to various electronic devices. The electronic devices include a complex and large display device (multi-display), an automobile route guidance system (car navigation system), a ship route guidance system, an aircraft route guidance system, a smartphone terminal, a mobile phone, a tablet terminal, and a personal digital assistant. (PDAs), video cameras, digital still cameras, electronic notebooks, electronic books, electronic dictionaries, personal computers, copying machines, game equipment terminals, televisions, product display tags, price display tags, industrial programmable display devices, Car audio, digital audio players, facsimiles, printers, automated cash deposit and payment machines (ATMs), vending machines, head-mounted displays (HMDs), digital display watches, smart watches, etc.

1 Light-shielding layer laminated board 2 Board 2a 1st surface 2b 2nd surface 2c 3rd surface (side surface)
2aa 1st side 2ab 2nd side 3 pixel part 4 gate signal line 5 source signal line 6 light emitting element 61R red light emitting element 61G green light emitting element 61B blue light emitting element 62 electrode pad 7 power supply circuit 8 first wiring pad 81 first pad 82 2nd pad 9 2nd wiring pad 91 3rd pad 92 4th pad 10 Side wiring 11a 1st wiring wiring 11b 2nd wiring wiring 12 3rd wiring wiring 18 5th wiring pad 19 6th wiring pad 20 1st gate wiring 21 2nd gate wiring 22 3rd gate wiring 24, 25, 26 Insulation layer 31 1st metal light-shielding layer 31i 1st insulation layer 32 2nd metal light-shielding layer 32i 2nd insulation layer

Claims (13)

A substrate having a first surface and a second surface opposite to the first surface,
The first metal light-shielding layer laminated on the edge portion on one side of the first surface,
A first insulating layer laminated on the first metal light-shielding layer and on a portion of the first surface exposed from the first metal light-shielding layer.
A second metal shading layer laminated on a portion of the first insulating layer that does not overlap with the first metal shading layer,
A light-shielding layer laminated substrate comprising a second insulating layer laminated on the second metal light-shielding layer and on a portion of the first insulating layer overlapping the first metal light-shielding layer. There are a plurality of the first metal light-shielding layers, and each of the first metal light-shielding layers is laminated on the edge portion at intervals in a direction parallel to the one side.
The light-shielding layer laminated substrate according to claim 1, wherein the second metal light-shielding layer is laminated on a portion of the adjacent first metal light-shielding layer on the first insulating layer. The light-shielding layer laminated substrate according to claim 1 or 2, wherein the first metal light-shielding layer and the second metal light-shielding layer are a series in a plan view. The light-shielding layer laminated substrate according to any one of claims 1 to 3, wherein the second metal light-shielding layer has an overlapping portion overlapping with the first metal light-shielding layer. The superimposing portion has a length such that the diffracted light diffracted by the light incident from the side of the second surface at the end of the first metal light-shielding layer does not reach the second insulating layer. The light-shielding layer laminated substrate according to the above. The light-shielding layer laminated substrate according to any one of claims 1 to 5, wherein the first metal light-shielding layer and the second metal light-shielding layer have light reflectivity. The light-shielding layer laminated substrate according to any one of claims 1 to 5, wherein the first metal light-shielding layer and the second metal light-shielding layer have light scattering properties. The light-shielding layer laminated substrate according to any one of claims 1 to 7, wherein the first insulating layer contains light-scattering particles. The light-shielding layer laminated substrate according to any one of claims 1 to 8, wherein the first insulating layer is made of an inorganic material. The light-shielding layer laminated substrate according to any one of claims 1 to 9, wherein the second insulating layer is made of an organic material. It is provided with side wiring located from the edge portion of the first surface to the side of the second surface via the side surface of the substrate.
The light-shielding layer laminated substrate according to any one of claims 1 to 10, wherein the side wiring is located at a position overlapping the first metal light-shielding layer and / or the second metal light-shielding layer. The light-shielding layer laminated substrate according to any one of claims 1 to 11, wherein the first metal light-shielding layer and the second metal light-shielding layer are electrically floating. A light emitting element, a thin film transistor for driving and controlling the light emitting element, and a wiring layer for connecting the light emitting element and the thin film transistor are provided on the first surface.
The light-shielding layer laminated substrate according to any one of claims 1 to 12, wherein at least one of the first metal light-shielding layer and the second metal light-shielding layer is made of the same material as the wiring layer.

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