JP2022037897A - Light-emitting device and method for manufacturing the same - Google Patents

Abstract

To provide a multi-color light-emitting device which can extract light with high efficiency and enables surface mounting.SOLUTION: A light-emitting device includes: a package 100 for surface mounting including a plurality of leads 10, in which the three leads among the plurality of leads each have a first recess 21, a second recess 22 and a third recess 23 exposed to a main surface; a first light-emitting element 51 for emitting first light, a second light-emitting element 52 for emitting second light and a third light-emitting element 53 for emitting third light that are arranged in the first recess, the second recess and the third recess, respectively; and a mold resin 60 including a first lens part 71 that overlaps the first recess and the first light-emitting element in plan view and is colored to a similar color to the first light, a second lens part 72 that overlaps the second recess and the second light-emitting element and is colored to a similar color to the second light, and a third lens part 73 that overlaps the third recess and the third light-emitting element and is colored to a similar color to the third light.SELECTED DRAWING: Figure 2A

Description

The present application relates to a light emitting device and a method for manufacturing the same.

As a light emitting device including a light emitting diode (LED), a bullet type (lamp type) light emitting device, a surface mount type (SMD type) light emitting device, and the like are known. Since the lamp type light emitting device has high directivity in the front direction, it is suitably used for a large display device in which light emitting devices are arranged in a matrix as pixels, such as an LED display.

The lamp type light emitting device is typically mounted on a printed circuit board or the like by flow solder. Therefore, when a lamp type light emitting device is used, the cost and man-hours required for mounting increase as compared with the SMD type light emitting device surface-mounted by reflow soldering.

Therefore, for example, Patent Document 1 proposes a light emitting device that can be mounted by reflow soldering.

Japanese Unexamined Patent Publication No. 7-21937

One non-limiting exemplary embodiment of the present disclosure provides a multicolored light emitting device capable of extracting light in the front direction with high efficiency and being surface mountable.

The light emitting device of one embodiment of the present disclosure is a package including a plurality of leads and a dark color resin for fixing at least a part of the plurality of leads, and three of the plurality of leads are composed of three leads. Each has an exposed region exposed from the dark-colored resin on the main surface of the package, and a first recess, a second recess, and a third recess are arranged in the exposed region of the three leads, respectively. The package for surface mounting, the first light emitting element arranged in the first concave portion and emitting the first light, and the second light emitting element arranged in the second concave portion and having a shorter wavelength side than the first light. A plurality of light emitting elements including a second light emitting element that emits light and a third light emitting element that is arranged in the third recess and emits a third light on a shorter wavelength side than the second light, and the plurality of light emitting elements. A mold resin for encapsulating an element is provided, and the mold resin includes a base portion that covers the main surface of the package and the plurality of light emitting elements, and a plurality of lens portions integrally formed with the base portion. , Each of the plurality of lens portions has a convex shape protruding upward from the base portion, and the plurality of lens portions have the first concave portion and the first light emitting element in a plan view. The first lens includes a first lens portion that overlaps, a second lens portion that overlaps the second concave portion and the second light emitting element, and a third lens portion that overlaps the third concave portion and the third light emitting element. The portion is colored in a color similar to that of the first light, the second lens portion is colored in a color similar to that of the second light, and the third lens portion is colored in a color similar to that of the third light.

The light emitting device of one embodiment of the present disclosure is a package including a plurality of leads and a dark color resin for fixing at least a part of the plurality of leads, and each of the plurality of leads is of the package. The main surface has an exposed region exposed from the dark-colored resin, and two of the first recess, the second recess, and the third recess are formed in the exposed region of one of the plurality of leads. Recesses are arranged and in the exposed area of the same or different leads as the one of the plurality of leads, other than the first recess, the second recess and the two recesses of the third recess. A package for surface mounting in which one recess is arranged, a first light emitting element arranged in the first recess and emitting a first light, and a first light emitting element arranged in the second recess, which is shorter than the first light. A plurality of light emitting elements including a second light emitting element that emits a second light on the wavelength side and a third light emitting element that is arranged in the third recess and emits a third light on the shorter wavelength side than the second light. , A mold resin for encapsulating the plurality of light emitting elements, and the mold resin is integrally formed with the main surface of the package, a base portion covering the plurality of light emitting elements, and the base portion. It has a plurality of lens portions, each of the plurality of lens portions has a convex shape protruding upward from the base portion, and the plurality of lens portions have the first concave portion and the said in plan view. Includes a first lens portion that overlaps the first light emitting element, a second lens portion that overlaps the second recess and the second light emitting element, and a third lens portion that overlaps the third recess and the third light emitting element. The first lens portion is colored in a color similar to that of the first light, the second lens portion is colored in a color similar to that of the second light, and the third lens portion is colored in a color similar to that of the third light.

The method for manufacturing a light emitting device according to an embodiment of the present disclosure includes a step of preparing a first structure including a package including a plurality of leads and a plurality of light emitting elements mounted on the main surface of the package, and the above-mentioned. The mold resin forming step of forming the mold resin for sealing the plurality of light emitting elements in the first structure is included, and the mold resin forming step includes the upper cavity and each of them downward from the bottom surface of the upper cavity. A step of preparing a casting case having a plurality of lower cavities protruding from the surface, and a step of injecting a first resin using a thermosetting resin as a base material into each of the plurality of lower cavities. The first resin injected into at least two lower cavities of the lower cavity is colored in a different color from each other in the first resin injection step and the curing temperature of the first resin. After the temporary curing step of temporarily curing by heating at a lower temperature and the temporary curing step, a second resin having the same or different heat-curable resin as the first resin as a base material is placed in the upper cavity. The plurality of light emitting elements and the plurality of light emitting elements in the first structure so that the second resin injection step of injection and each of the plurality of light emitting elements overlap with the corresponding one of the plurality of lower cavities in a plan view. This is a main curing step in which the main surface of the package is immersed in the second resin and the second resin and the temporarily cured first resin are cured in that state, whereby the second resin is cured. The mold resin was formed, including a base portion covering the main surface of the package and a plurality of lens portions made of the first resin, and the plurality of lens portions were colored in different colors from each other. The present curing step including at least two lens portions made of the first resin is included.

According to the embodiment of the present disclosure, it is possible to provide a multicolor light emitting device capable of extracting light with high efficiency in the front direction and being surface mountable.

FIG. 1 is a schematic perspective view of a light emitting device according to the present disclosure. FIG. 2A is a schematic top perspective view of the light emitting device shown in FIG. FIG. 2B is a schematic side view of the light emitting device shown in FIG. 1 when viewed from the y-axis direction. FIG. 2C is a schematic side view of the light emitting device shown in FIG. 1 when viewed from the x-axis direction. FIG. 2D is a schematic cross-sectional view taken along the line 2D-2D shown in FIG. 2A of the package in which the light emitting element is mounted. FIG. 3A is a process sectional view showing a manufacturing process of the light emitting device shown in FIG. 1. FIG. 3B is a process sectional view showing a manufacturing process of the light emitting device shown in FIG. 1. FIG. 3C is a process sectional view showing a manufacturing process of the light emitting device shown in FIG. 1. FIG. 4 is a schematic perspective view of a casting case used for manufacturing a light emitting device. FIG. 5A is a process sectional view showing a manufacturing process of the light emitting device shown in FIG. 1. FIG. 5B is a process sectional view showing a manufacturing process of the light emitting device shown in FIG. 1. FIG. 5C is a process sectional view showing a manufacturing process of the light emitting device shown in FIG. 1. FIG. 5D is a process sectional view showing a manufacturing process of the light emitting device shown in FIG. 1. FIG. 5E is a process sectional view showing a manufacturing process of the light emitting device shown in FIG. 1. FIG. 5F is a process sectional view showing a manufacturing process of the light emitting device shown in FIG. 1. FIG. 6A is a schematic top perspective view of another light emitting device according to the present disclosure. FIG. 6B is a schematic cross-sectional view taken along the line 6B-6B shown in FIG. 6A. FIG. 7 is a schematic top perspective view of another light emitting device 3000 according to the present disclosure. FIG. 8 is a schematic top perspective view of another light emitting device 4000 according to the present disclosure. FIG. 9 is a schematic cross-sectional view showing a method for measuring reflectance and glossiness.

Hereinafter, embodiments of the invention will be described with reference to the drawings as appropriate. However, the light emitting device described below is for embodying the technical idea of the present invention, and the present invention is not limited to the following unless otherwise specified. Further, the contents described in one embodiment can be applied to other embodiments and modifications. Further, the size and positional relationship of the members shown in the drawings may be exaggerated in order to clarify the explanation.

In the following description, components having substantially the same function are indicated by common reference numerals, and the description may be omitted. Alternatively, a reference code may not be attached to a component that is not referred to in the description. In the following description, terms indicating a specific direction or position (eg, "top", "bottom", "right", "left" and other terms including those terms) may be used. However, those terms use relative orientation or position in the referenced drawings for clarity only. If the relative directions or positional relationships in terms such as "upper" and "lower" in the referenced drawings are the same, the drawings other than the present disclosure, actual products, manufacturing equipment, etc. are the same as the referenced drawings. It does not have to be an arrangement.

(Embodiment)
FIG. 1 is a schematic perspective view of a light emitting device 1000 according to the present disclosure. FIG. 2A is a schematic top perspective view of the light emitting device 1000.

In FIG. 1, arrows indicating x-axis, y-axis, and z-axis orthogonal to each other are also shown. Other drawings of the present disclosure may also illustrate arrows pointing in these directions. In the configuration exemplified in FIG. 1, the outer shape of the light emitting device 1000 in the top view has a substantially rectangular shape. Each side of the rectangular outer shape is parallel to the x-axis or y-axis shown in the figure. The z-axis is perpendicular to the x-axis and the y-axis. The outer shape of the light emitting device 1000 in the top view does not have to be rectangular.

2B and 2C are schematic side views of the light emitting device 1000 when viewed from the y-axis direction and the x-axis direction shown in FIG. 1, respectively.

As shown in FIGS. 2B and 2C, the light emitting device 1000 includes a package 100 for surface mounting, a plurality of light emitting elements 50, and a mold resin 60 for sealing the plurality of light emitting elements 50.

Package 100 includes a plurality of leads 10 and a dark color resin 40. One or more of the plurality of leads 10 has a first recess 21, a second recess 22, and a third recess 23 (hereinafter, may be collectively referred to as “recess 20”) for arranging the light emitting element 50. Have. As shown in FIG. 1, three of the plurality of leads 10 may each have one recess 20. Alternatively, one lead may have two or more recesses 20.

Each of the plurality of light emitting elements 50 is arranged in one corresponding recess 20. The plurality of light emitting elements 50 include a first light emitting element 51 that emits the first light, a second light emitting element 52 that emits the second light on the shorter wavelength side than the first light, and a second light emitting element 52 on the shorter wavelength side than the second light. Includes a third light emitting element 53 that emits three lights. The first light emitting element 51 is arranged in the first recess 21. The second light emitting element 52 is arranged in the second recess 22. The third light emitting element 53 is arranged in the third recess 23.

The mold resin 60 has a base portion 61 and a plurality of lens portions 70 integrally formed with the base portion 61. Each of the plurality of lens portions 70 is arranged above (emission side) of one light emitting element among the plurality of light emitting elements 50, and is colored in a color similar to the color emitted by the light emitting element.

According to this embodiment, there is provided a multicolor light emitting device 1000 which is provided with a package 100 for surface mounting and which can be mounted by reflow soldering.

In the present embodiment, each light emitting element 50 is arranged in the recess 20 of the lead 10, and a lens portion 70 is provided on the emission side of each light emitting element 50. As a result, light can be extracted in the front direction with higher efficiency than the conventional SMD type light emitting device. Details will be described later.

Further, the lens portion 70 arranged on the emission side of each light emitting element 50 is colored in a color similar to the light emitting color of the light emitting element 50. As a result, it is possible to suppress a decrease in contrast due to reflection of external light around the recess 20 of the lead 10 when the light emitting element 50 is turned off without disturbing the light emitting color when the light emitting element 50 is turned on. Further, when the first light emitting element 51, the second light emitting element 52, and the third light emitting element 53 are all turned off, each lens unit 70 is made to have a colored color due to the subtractive color mixing of the colors of the three lens units 70. Also looks dark, that is, a color with low lightness. Such an effect is called a "dark color effect". Since the emission surface of the light emitting device 1000 looks dark due to the dark color effect, the display contrast can be further improved.

Hereinafter, each component will be described in detail.

[Package 100]
FIG. 2D is a schematic cross-sectional view showing the package 100 and the light emitting element 50 in the 2D-2D line shown in FIG. 2A.

The package 100 has a main surface 100a and a back surface 100b on the opposite side of the main surface 100a. In the configuration exemplified in FIG. 2A, the shape of the main surface 100a of the package 100 in the top view is a quadrangle. Each side of the quadrangle of the main surface 100a is parallel to the x-axis or the y-axis. The shape of the main surface 100a in the top view may have a shape other than a quadrangle, for example, a substantially triangular shape, a substantially quadrangular shape, a substantially pentagonal shape, a substantially hexagonal shape, or another polygonal shape, a circular shape, or an elliptical shape. It may have a shape having a curve such as.

The back surface 100b of the package 100 includes a mounting surface of each lead 10 when the light emitting device 1000 is fixed to the mounting substrate. A recess 102 may be provided on the back surface 100b of the package 100. Here, for example, a quadrangular pyramid trapezoidal recess 102 is provided.

The package 100 includes a plurality of leads 10 and a dark color resin 40 that fixes at least a part of the plurality of leads 10. The dark-colored resin 40 is integrally formed with the plurality of leads 10. The package 100 can be formed by transfer molding, insert molding, or the like.

[Lead 10]
Each of the plurality of leads 10 has conductivity and functions as an electrode for supplying power to the corresponding light emitting element 50.

In the configuration exemplified in FIG. 2D, each of the plurality of leads 10 has a first portion 91 including a portion exposed on the main surface 100a of the package 100, a third portion 93 located on the back surface 100b side of the package 100, and a first portion. It is located between the first portion 91 and the third portion 93 and is bent so as to have a second portion 92 extending along the side surface of the package 100. The third portion 93 may extend outward from the side surface of the package 100 or may extend inward. The back surface of the third portion 93 is exposed on the back surface 100b of the package 100, and serves as a mounting surface for fixing the light emitting device 1000 to the mounting substrate.

Each of the plurality of leads 10 has an exposed region 30 exposed from the dark-colored resin 40 on the main surface 100a of the package 100. The exposed region 30 is used for wire bonding for electrically connecting to the light emitting element 50.

One or more of the plurality of leads 10 has a first recess 21, a second recess 22, and a third recess 23. The first light emitting element 51 is mounted in the first recess 21. Similarly, the second light emitting element 52 is mounted on the second recess 22, and the third light emitting element 53 is mounted on the third recess 23.

The first recess 21, the second recess 22, and the third recess 23 are arranged in any one or more of the exposed regions 30 of the plurality of leads 10.

The first recess 21, the second recess 22, and the third recess 23 may be arranged in the exposed region 30 of the three different leads 10, respectively. As a result, the heat dissipation paths of the first light emitting element 51, the second light emitting element 52, and the third light emitting element 53 can be separated from each other, so that the heat generated by each light emitting element 50 can be efficiently dissipated.

Alternatively, at least two of the first recess 21, the second recess 22, and the third recess 23 may be arranged in the exposed region 30 of one lead 10. As a result, the distance between at least two recesses 20 can be narrowed, so that the size of the package 100 can be reduced. For example, the first recess 21, the second recess 22, and the third recess 23 may all be arranged in one lead 10. Two recesses of the first recess 21, the second recess 22, and the third recess 23 may be arranged in one lead 10 and the remaining one recess may be arranged in the other lead 10. In other words, in the exposed area 30 of one of the plurality of leads 10, two recesses of the first recess 21, the second recess 22, and the third recess 23 are arranged and are the same as or the same as the one lead. In the exposed area 30 of the different leads, another recess of the first recess 21, the second recess 22, and the third recess 23 (that is, one recess other than the above two recesses) may be arranged.

The shape of the recess 20 may be circular or elliptical in a plan view. In the example shown in FIG. 2A, the recess 20 has an elliptical shape having a long axis in the x-axis direction. Depending on the shape of the recess 20 and the lens portion 70 described later, the directivity can be made different in the x-axis direction and the y-axis direction. The shape of the recess 20 in a plan view may be a shape other than a circular shape and an elliptical shape.

Each of the plurality of leads 10 is electrically connected to at least one of the light emitting elements 50 via a wire. In the present specification, the portion of the exposed area 30 of the lead 10 to which the wire is connected is referred to as a “wire connection portion”. Each lead 10 has at least one wire connection portion in the exposed region 30 except for the first recess 21, the second recess 22, and the third recess 23. The wire connection portion may be arranged in a portion of the exposed region 30 of each lead 10 covered by the lens portion 70.

The surface roughness of the exposed region 30 of the plurality of leads 10 excluding the first recess 21, the second recess 22, and the third recess 23 is larger than the surface roughness of the region other than the exposed region 30 of the plurality of leads 10. May be. As a result, light such as external light incident on the main surface 100a of the package 100 can be scattered. As a result, the reflection of external light is suppressed, so that the decrease in contrast due to the reflection of external light can be suppressed.

The plurality of leads 10 may have a metal layer such as a plating layer on the surface. The glossiness of the lead 10 (in the case of having a metal layer such as a plating layer, the glossiness of the metal layer) is not particularly limited. For example, among the exposed areas 30 of the plurality of leads 10, the glossiness G1 of the first recess 21, the second recess 22, and the third recess 23, and the first recess 21, the second recess 22, and the third of the exposed areas 30. The glossiness G2 of the region excluding the recess 23 and the glossiness G3 of the region other than the exposed region 30 among the surfaces of the plurality of leads 10, that is, the region covered with the dark color resin 40 are set respectively. May be good. By adjusting the glossiness of each region of the lead 10, it is possible to improve the brightness while suppressing the reflection of external light of the light emitting device 1000. The glossiness of each region can be adjusted by, for example, the surface roughness of the region. Specifically, the glossiness of the region having a large surface roughness on the surface of the lead 10 is lower than the glossiness of the region having a small surface roughness. In the case of a plurality of leads 10 having a metal layer such as a plating layer on the surface, the glossiness of each region is added to, for example, the roughness of the base material (base of the plating layer) of the plurality of leads 10 or the plating solution. It can be adjusted by the amount of brightener.

The glossiness G1 of the first recess 21, the second recess 22, and the third recess 23 of the exposed region 30 is preferably selected from the range of 0 or more and 2.0 or less according to the desired directivity. When the glossiness G1 is low, the light emitted from the light emitting element 50 arranged in each recess 20 of the lead 10 is scattered on the surface of the recess 20, so that the directivity angle can be widened. In order to widen the directivity angle more effectively, the glossiness G1 is preferably 0 or more and less than 0.8, for example. On the other hand, when the glossiness G1 is high, the light emitted from the light emitting element 50 arranged in each recess 20 is less likely to be scattered on the surface of the recess 20, so that the directivity angle can be narrowed. By narrowing the pointing angle, it is possible to improve the efficiency of light extraction in the front direction. In order to more effectively increase the light extraction efficiency, the glossiness G1 is preferably 0.8 or more, for example.

The glossiness G2 of the exposed region 30 excluding the first recess 21, the second recess 22, and the third recess 23 is preferably set low from the viewpoint of improving the contrast. By setting the glossiness G2 low, external light such as sunlight can be scattered on the surface of the lead 10, so that it is possible to suppress a decrease in contrast due to external light reflection. The glossiness G2 is preferably 0 or more and 0.2 or less, for example. The glossiness G2 may be lower than the glossiness G1. For example, the glossiness G2 can be made lower than the glossiness G1 by making the surface roughness of the exposed region 30 excluding the recess 20 larger than the surface roughness of each recess 20. The method of partially differentizing the surface roughness of the lead 10 is not particularly limited. For example, the first plating layer is formed on a base material such as copper (hereinafter referred to as "lead base material"), and the surface roughness is different from that of the first plating layer only on a part of the first plating layer. A second plating layer may be formed. As a result, the surface roughness can be made different between the portion where the first plating layer is exposed and the portion where the second plating layer is formed. Details will be described later.

Of the surfaces of the plurality of leads 10, the region covered with the dark color resin 40 is preferably roughened to have a low glossiness G3. By roughening the region of the surface of the lead 10 covered with the dark-colored resin 40, the adhesion to the dark-colored resin 40 can be improved. The glossiness G3 may be lower than the glossiness G1. The glossiness G3 may be about the same as the glossiness G2. The glossiness G3 may be, for example, 0 or more and 0.2 or less.

The glossiness can be measured using various gloss meters. In the present specification, the reflectance Y on the surface of the lead 10 is measured according to the method specified in JIS Z 8722 condition a, and the glossiness is calculated from the reflectance Y. A micro-area colorimeter VSR-300A manufactured by Nippon Denshoku Kogyo is used to measure the reflectance Y.

FIG. 9 is a schematic cross-sectional view showing a method for measuring the reflectance Y. As shown in FIG. 9, the sample 161 to be measured (here, the lead 10) is installed, and the light source 163 is arranged in the directions inclined by plus 45 degrees and minus 45 degrees with respect to the normal of the surface of the sample 161, respectively. .. Further, the light receiver 165 is arranged in the normal direction of the sample 161 (angle with respect to the normal: 0 degrees). The reflectance Y is measured by incident light from the light source 163 onto the sample 161 and receiving the light reflected in the normal direction by the sample 161 with the light receiver 165. The reflectance Y is the ratio (%) of the light reflected in the normal direction by the sample 161 to the incident light. The glossiness can be determined by 2-LogY.

In this embodiment, the plurality of leads 10 includes a plurality of pairs of leads. One of each lead pair may have a recess 20 for arranging the light emitting element 50.

In the example shown in FIG. 2A, the plurality of leads 10 include a first lead 11a having a first recess 21, a second lead 12a having a second recess 22, and a third lead 13a having a third recess 23. ..

The plurality of leads 10 further include a fourth lead 11b, a fifth lead 12b, and a sixth lead 13b. The first lead 11a and the fourth lead 11b form a first lead pair, the second lead 12a and the fifth lead 12b form a second lead pair, and the third lead 13a and the sixth lead 13b form a third lead pair, respectively. .. The first lead pair is electrically connected to the first light emitting element 51 via the wires 81 and 84. The second lead pair is electrically connected to the second light emitting element 52 via the wires 82 and 85. The third lead pair is electrically connected to the third light emitting element 53 via the wires 83 and 86.

The first lead 11a, the second lead 12a, the third lead 13a, the fourth lead 11b, the fifth lead 12b, and the sixth lead 13b each have an exposed region 30 exposed on the main surface 100a of the package 100. .. In the present specification, the exposed regions 30 in the first lead 11a, the second lead 12a, the third lead 13a, the fourth lead 11b, the fifth lead 12b, and the sixth lead 13b are the first region 31 and the second region, respectively. 32, the third region 33, the fourth region 34, the fifth region 35 and the sixth region 36.

The first region 31 includes a first recess 21 and a peripheral portion 31r located around the first recess 21. The peripheral portion 31r refers to a region of the first region 31 excluding the first recess 21. Similarly, the second region 32 includes a second recess 22 and a peripheral portion 32r located around the second recess 22, and the second region 32 is located around the second recess 22 and the third recess 23. Includes a peripheral portion 33r located.

The surface roughness of the peripheral portion 31r of the first region 31 may be larger than the surface roughness of the region other than the first region 31 in the first lead 11a. Similarly, the surface roughness of the peripheral portion 32r of the second region 32 and the peripheral portion 33r of the third region 33 are the regions other than the second region 32 in the second lead 12a and the third region 33 in the third lead 13a, respectively. It may be larger than the surface roughness of the region other than the above.

The first recess 21, the second recess 22, and the third recess 23 may be arranged in the first direction (here, the y-axis direction) in a plan view. Alternatively, as illustrated in FIG. 2A, of the first recess 21, the second recess 22, and the third recess 23, the center of the recess (here, the second recess 22) located at the center in the x-axis direction or the y-axis direction. However, it may be arranged so as not to be located on the line connecting the centers of the other two recesses. As a result, the first light emitting element 51, the second light emitting element 52, and the third light emitting element 53 can be arranged closer to each other. Further, the area of the main surface 100a of the package 100 can be reduced.

In the configuration exemplified in FIG. 2A, the first read pair, the second read pair, and the third read pair are arranged in the y-axis direction on the main surface 100a of the package 100. On the main surface 100a, the ends of the two leads constituting each lead pair are arranged so as to face each other so as to be separated from each other. For example, on the main surface 100a, in the first lead pair, the first lead 11a having the first recess 21 is located on the left side (−x side) of the fourth lead 11b. Similarly, in the third lead pair, the third lead 13a having the third recess 23 is located on the left side (−x side) of the sixth lead 13b. On the other hand, in the second lead pair, the second lead 12a having the second recess 22 is located on the right side (+ x side) of the fifth lead 12b. In this way, by making the positional relationship between the two leads constituting each lead pair different from that of other adjacent lead pairs, it is possible to stagger the three recesses 20 on which the light emitting element 50 is mounted. be.

The lead 10 may be composed of a base material and a metal layer covering the surface of the base material. The substrate comprises, for example, copper, aluminum, gold, silver, iron, nickel, or an alloy thereof, a metal such as phosphor bronze, copper with iron. These may be a single layer or a laminated structure (for example, a clad material). Copper may be used as the base material. The metal layer is, for example, a plating layer. The metal layer includes, for example, silver, aluminum, nickel, palladium, rhodium, gold, copper, or alloys thereof. By having such a metal layer on the lead 10, it is possible to improve the light reflectivity and / or the bondability with a metal wire or the like described later.

[Dark color resin 40]
The dark-colored resin 40 has an insulating property in order to electrically block the light emitting element 50 from the outside. Of the dark-colored resin 40, at least the portion of the package 100 located on the main surface 100a side, that is, the emission observation surface side is colored in a dark color system such as black or gray. The entire dark-colored resin 40 may be colored dark-colored. As a result, it is possible to suppress a decrease in contrast due to reflection of external light or the like on the main surface 100a of the package 100. The "dark color system" in the present specification refers to a color having a lightness of 4.0 or less in the Munsell color system (20 hues). The hue is not particularly limited, and the saturation can be arbitrarily determined as needed.

As shown in FIG. 2D, the dark color resin 40 has, for example, a first resin portion 40a substantially parallel to the main surface 100a of the package 100, and a second resin portion 40b extending from the main surface 100a toward the back surface 100b. .. The first portion 91 of each lead 10 is held by the first resin portion 40a, and the second portion 92 is held by the second resin portion 40b. At least the mounting surface of the third portion 93 of each lead 10 is exposed from the dark-colored resin 40. The dark-colored resin 40 may have a shape capable of holding a plurality of leads 10, and is not limited to the shape shown in the figure.

The dark-colored resin 40 is arranged on the main surface 100a of the package 100 so as to expose the portion of each lead 10 used for wire bonding. In this example, as shown in FIG. 2A, the dark-colored resin 40 has the first region 31 of the first lead 11a, the second region 32 of the second lead 12a, and the third lead 13a on the main surface 100a of the package 100. The third region 33, the fourth region 34 of the fourth lead 11b, the fifth region 35 of the fifth lead 12b, and the sixth region 36 of the sixth lead 13b are arranged so as to be exposed. On the main surface 100a of the package 100, the dark-colored resin 40 may partially cover at least a part of the leads 10. In the configuration shown in FIG. 2A and the like, the dark-colored resin 40 has a convex portion 41 that covers a part of the fourth lead 11b, a part of the fifth lead 12b, and a part of the sixth lead 13b, respectively. As a result, the exposed area of the lead 10 can be reduced, so that external light reflection can be further suppressed. Instead, although not shown, the dark color resin 40 has a first region 31, a second region 32, a third region 33, a fourth region 34, a fifth region 35, and a sixth region 100a on the main surface 100a of the package 100. It may have an opening that exposes each of the regions 36.

As the material of the dark-colored resin 40, a material having a small thermal expansion rate and excellent adhesiveness to the mold resin 60 may be selected. The thermal expansion rate of the dark color resin 40 may be substantially equal to the thermal expansion rate of the mold resin 60, or may be smaller than the thermal expansion rate of the mold resin 60 in consideration of the influence of heat from the light emitting element 50. good.

The dark color resin 40 can be formed by using, for example, a thermoplastic resin. As the thermoplastic resin, aromatic polyamide resin, polyphthalamide resin (PPA), sulfone resin, polyamideimide resin (PAI), polyketone resin (PK), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP) , ABS resin, PBT resin and other thermoplastic resins can be used. In addition, those obtained by containing glass fiber in these thermoplastic resins may be used as the thermoplastic material. By containing the glass fiber in this way, it is possible to form a package having high rigidity and high strength. In the present specification, the thermoplastic resin refers to a substance having a linear polymer structure that softens and liquefies when heated and solidifies when cooled. Examples of such thermoplastic resins include styrene-based, acrylic-based, cellulose-based, polyethylene-based, vinyl-based, polyamide-based, and fluorinated carbon-based resins.

Alternatively, the dark color resin 40 may be formed by using a thermosetting resin such as a silicone resin or an epoxy resin, for example.

A colorant for coloring the dark color system may be added to the resin material of the dark color system resin 40. As the colorant, various dyes and pigments are preferably used. Specific examples thereof include Cr _{2O 3} , MnO ₂ , Fe ₂ O ₃ , and carbon black. The amount of the colorant added may be, for example, 0.3% or more and 1.5% or less, preferably 0.5% or more and 1.0% or less with respect to the resin material as the base material. As an example, as the thermoplastic resin material, for example, a material obtained by adding a small amount of dark-colored particles such as carbon to polyphthalamide (PPA) may be used.

[Light emitting element 50]
The light emitting element 50 is a semiconductor light emitting element such as a semiconductor laser or a light emitting diode. The emission wavelength of each light emitting element 50 can be arbitrarily selected. The emission wavelength of each light emitting element 50 may be selected so that white or light bulb-colored mixed light can be obtained when the plurality of light emitting elements 50 are lit. For example, the first light emitting element 51 is a red light emitting element that emits red, the second light emitting element 52 is a green light emitting element that emits green, and the third light emitting element 53 is a blue light emitting element that emits blue. May be good. The combination of the number of light emitting elements and the light emitting color is an example, and is not limited to this example.

As the blue and green light emitting elements, a light emitting element using ZnSe or a nitride semiconductor (In _X Al _Y Ga _1-XY N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) can be used. .. For example, a light emitting device in which a semiconductor layer containing GaN is formed on a support substrate such as sapphire may be used. As the red light emitting element, GaAs, AlInGaP, AlGaAs semiconductors and the like can be used. For example, a light emitting device in which a semiconductor layer containing AlInGaP is formed on a support substrate such as silicon, aluminum nitride, or sapphire may be used. Further, a semiconductor light emitting device made of a material other than this can also be used. The composition, emission color, size, number, etc. of the light emitting element can be appropriately selected according to the purpose.

Further, arbitrary light emission can be obtained by arranging a phosphor that converts the wavelength of the light emitted from the semiconductor chip around the semiconductor chip composed of a nitride semiconductor or the like. In the present specification, the "light emitting element 50" includes not only a semiconductor chip composed of a nitride semiconductor or the like, but also an element composed of a semiconductor chip and a phosphor. Specific examples of the phosphor include cerium-activated ittrium aluminum garnet, cerium-activated strontium aluminum garnet, europium and / or chromium-activated nitrogen-containing calcium aluminate (one of calcium). The part can be replaced with strontium), europium-activated sialon, europium-activated silicate, europium-activated strontium aluminate, manganese-activated potassium fluoride, and the like can be used. As an example, the first light emitting element 51, the second light emitting element 52, and the third light emitting element 53 may all have a semiconductor chip that emits blue light. In this case, in at least two of these light emitting elements, by arranging a phosphor around the semiconductor chip, the light emitting colors of the first light emitting element 51, the second light emitting element 52, and the third light emitting element 53 can be mutually changed. Can be different.

The first light emitting element 51, the second light emitting element 52, and the third light emitting element 53 are each made of a bonding member such as a resin, solder, or a conductive paste, and have a first recess in one or more of the plurality of leads 10. It is joined to the bottom surface of 21, the bottom surface of the second recess 22, and the bottom surface of the third recess 23.

The positive and negative electrodes of the first light emitting element 51 are electrically connected by wires 81 and 84 to the portions of the first lead 11a and the fourth lead 11b of the first lead pair exposed on the main surface 100a, respectively. For example, one end of the wire 81 is connected to a region other than the first recess 21 in the first region 31 of the first lead 11a, and the other end is connected to one of the positive and negative electrodes of the first light emitting element 51. Further, one end of the wire 84 is connected to the fourth region 34 of the fourth lead 11b, and the other end is connected to the other of the positive and negative electrodes of the first light emitting element 51. Similarly, the positive and negative electrodes of the second light emitting element 52 are connected to the second lead 12a and the fifth lead 12b in the second lead pair by wires 82 and 85, respectively. The positive and negative electrodes of the third light emitting element 53 are connected to the third lead 13a and the sixth lead 13b in the third lead pair by wires 83 and 86, respectively.

As the wires 81 to 86, metal wires of gold, silver, copper, platinum, aluminum or alloys thereof can be used. Among these, it is preferable to use a gold wire having excellent ductility or a gold-silver alloy wire having a higher reflectance than the gold wire.

[Mold resin]
The mold resin 60 includes a base portion 61 and a plurality of lens portions 70. The base portion 61 and the lens portion 70 are integrally molded. As will be described later, the base portion 61 and the lens portion 70 may be integrally formed by, for example, a casting molding method.

[Base portion 61]
The base portion 61 of the mold resin 60 covers the main surface 100a of the package 100 and the plurality of light emitting elements 50. The base portion 61 has a function of sealing the light emitting element 50 and holding the lens portion 70 integrally formed with the base portion 61 at a predetermined position.

In the present embodiment, the base portion 61 has, for example, an upper surface 61a located above the main surface 100a of the package 100 and a side surface 61b continuously formed from the upper surface 61a. In the illustrated example, the base portion 61 has a square pyramidal trapezoid having an upper surface 61a slightly larger than the upper surface of the dark color resin 40 of the package 100. The upper surface 61a of the base portion 61 includes a portion in contact with the lens portion 70 and a portion that does not overlap the plurality of lens portions 70 in a plan view. The base portion 61 may cover not only the main surface 100a of the package 100 but also at least a part of the back surface 100b. Here, a part of the base portion 61 is arranged in the recess 102 formed in the back surface 100b of the package 100, and is in contact with a part of the surface of the dark color resin 40 constituting the recess 102. By arranging the base portion 61 of the mold resin 60 also on the back surface 100b of the package 100 in this way, peeling, misalignment, etc. of the lens portion 70 can be suppressed, and the lens portion 70 can be held more stably. The shape of the base portion 61, the light transmittance, and the like are not particularly limited.

The surface roughness of the base portion 61 is not particularly limited, but a larger one is preferable from the viewpoint of improving the display contrast. For example, a part or the whole of the surface of the base portion 61 may be roughened. At least, the portion of the upper surface 61a of the base portion 61 that does not overlap the plurality of lens portions 70 in a plan view is preferably roughened. The side surface 61b of the base portion 61 may also be roughened. The surface roughness of the upper surface 61a and the surface roughness of the side surface 61b may be the same or different. From the viewpoint of ease of processing, it is preferable that the surface roughness of the upper surface 61a and the side surface 61b is the same. Since the surface roughness of the base portion 61 is large, external light such as sunlight can be scattered on the surface of the base portion 61, and the reflection intensity can be suppressed. As a result, it is possible to suppress a decrease in contrast due to external light reflection.

The surface roughness of the portion of the upper surface 61a of the base portion 61 that does not overlap with the plurality of lens portions 70 in a plan view may be larger than the surface roughness of the lens portion 70, for example. Such a structure can be obtained, for example, by forming a mold resin 60 including a base portion 61 and a lens portion 70, and then performing roughening processing such as blasting on a predetermined region on the surface of the base portion 61. Alternatively, a casting case (see FIG. 4) in which a part of the inner surface is roughened may be used for forming the mold resin 60. As will be described in detail later, for example, by roughening the portion of the inner surface of the casting case that forms the upper surface 61a of the base portion 61, a plurality of lenses in the upper surface 61a of the base portion 61 in a plan view can be obtained. The surface roughness of the portion that does not overlap with the portion 70 can be increased.

Ｒａの測定には、接触式表面粗さ測定機、レーザー顕微鏡などを用いることができる。本明細書では、キーエンス製レーザー顕微鏡ＶＫ－２５０を用いる。 The arithmetic average roughness Ra of the upper surface 61a of the base portion 61 is preferably 0.4 μm or more and 5 μm or less. More preferably, Ra is 0.8 μm or more and 3 μm or less. Ra of the side surface 61b of the base portion 61 may also be in the same range as described above. Ra can be measured according to the method for measuring the surface roughness of JIS B 0601-2001. Specifically, Ra extracts a portion having a measured length L from the roughness curve in the direction of the center line, the center line of the extracted portion is the X axis, and the direction of the vertical magnification is the Y axis, and the roughness curve is obtained. When y = f (x), it is expressed by the following equation.

A contact type surface roughness measuring device, a laser microscope, or the like can be used for Ra measurement. In the present specification, a laser microscope VK-250 manufactured by KEYENCE is used.

The base portion 61 preferably has a light transmittance of 90% or more at each peak wavelength of the plurality of light emitting elements 50. Thereby, the light extraction efficiency of the light emitting device 1000 can be further improved.

[Lens unit 70]
In the mold resin 60, each of the plurality of lens portions 70 has a convex shape protruding upward from the base portion 61.

Each of the plurality of lens portions 70 is arranged in association with one of the light emitting elements 50. In the present embodiment, the plurality of lens portions 70 have a first lens portion 71 that covers the first concave portion 21 and the first light emitting element 51, and a second lens that covers the second concave portion 22 and the second light emitting element 52 in a plan view. A portion 72 includes a third lens portion 73 that covers the third recess 23 and the third light emitting element 53. Therefore, in a plan view, the first lens portion 71 overlaps with the first recess 21 and the first light emitting element 51, and the second lens portion 72 overlaps with the second recess 22 and the second light emitting element 52, and the third lens. The portion 73 overlaps with the third recess 23 and the third light emitting element 53. Each lens portion 70 may further cover at least a part of the exposed region 30 in which the corresponding light emitting element 50 is arranged, except for the recess 20.

As shown in FIG. 2A, the first lens unit 71 covers the entire first region 31, the second lens unit 72 covers the entire second region 32, and the third lens unit 73 covers the entire third region 33. It may be covered. That is, in a plan view, the first lens unit 71 overlaps the entire first region 31, the second lens unit 72 overlaps the entire second region 32, and the third lens unit 73 overlaps the entire third region 33. May be. The first lens unit 71 may further cover at least a part of the fourth region 34 of the fourth lead 11b. Similarly, the second lens unit 72 covers at least a part of the fifth region 35 of the fifth lead 12b, and the third lens unit 73 covers at least a part of the sixth region 36 of the sixth lead 13b. May be good. That is, in a plan view, the first lens unit 71 further overlaps with at least a part of the fourth region 34 of the fourth lead 11b, and the second lens unit 72 is at least one of the fifth region 35 of the fifth lead 12b. The third lens portion 73 may overlap with at least a part of the sixth region 36 of the sixth lead 13b.

The first lens unit 71 is colored in a color similar to the first light emitted by the first light emitting element 51. The second lens portion 72 is colored in a color similar to the second light emitted by the second light emitting element 52. The third lens portion 73 is colored in a color similar to the third light emitted by the third light emitting element 53. The first light emitted by the first light emitting element 51 passes through the first lens unit 71 and is emitted from the emission surface of the light emitting device 1000. Similarly, the second light emitted by the second light emitting element 52 and the third light emitted by the third light emitting element 53 pass through the second lens unit 72 and the third lens unit 73, respectively, and the emission surface of the light emitting device 1000. Emit from.

As used herein, the term "similar color" means that in the Munsell color system (20 hues), the hue is within 3 ranges of the hue circle, the lightness is within 3 ranges, and the saturation is within 3 ranges. It means that it is within. That is, on the equihue plane of the Munsell color system (20 hues), the hue, the lightness, and the saturation are all similar colors up to both sides.

The first lens unit 71, the second lens unit 72, and the third lens unit 73 each have an elliptical shape in a plan view. The elliptical long axis has a long axis along a predetermined direction (here, the x-axis direction). The shape and arrangement of each lens unit 70 in a plan view can be appropriately selected in consideration of light distribution, light collection, and the like.

In the present embodiment, the directional characteristics of the light emitting device 1000 can be controlled to be wide in the horizontal direction and narrow in the vertical direction by the lens unit 70 arranged above (emission side) of each light emitting element 50. In the illustrated example, since the lens portion 70 has an elliptical shape having a long axis in the x-axis direction in a plan view, a directional characteristic wide in the x-axis direction and narrow in the y-axis direction can be obtained. The light emitting device 1000 having such a directivity can be particularly preferably used for a display device such as an LED display.

The optical axes of the first lens portion 71, the second lens portion 72, and the third lens portion 73 coincide with the centers of the first recess 21, the second recess 22, and the third recess 23, which have a circular or elliptical shape, respectively. You may. Thereby, the controllability of the directivity of the light emitting device 1000 can be further improved.

In a plan view, the first lens unit 71, the second lens unit 72, and the third lens unit 73 may be arranged in a row. Alternatively, as illustrated in FIG. 2A, the lens unit located at the center in the x-axis direction or the y-axis direction of the first lens unit 71, the second lens unit 72, and the third lens unit 73 (here, the second lens unit). The center of 72) does not have to be located on the line connecting the centers of the other two lens portions. By arranging the lens portions 70 in a staggered manner in this way, the light emitting device 1000 can be miniaturized. Further, since the first lens unit 71, the second lens unit 72, and the third lens unit 73 can be arranged closer to each other, the three colors of the first lens unit 71, the second lens unit 72, and the third lens unit 73 can be arranged. The dark color effect due to mixing can be further improved.

The surface roughness of the lens portion 70 is not particularly limited, but a smaller one is preferable in order to secure the efficiency of extracting light in the front direction. The surface roughness of the lens portion 70 may be smaller than the surface roughness of the upper surface 61a of the base portion 61. It is preferable that the lens portion 70 is not roughened. Ra of the lens unit 70 may be, for example, 0 μm or more and 0.2 μm or less.

[Material of mold resin 60]
As the base material of the mold resin 60, thermosetting resins such as epoxy resin, urea resin, and silicone resin, which are excellent in weather resistance and translucency, and glass are preferably used. The thermosetting resin in the present specification refers to a plastic that cures when heated under pressure. Thermosetting resins, once cured, cannot be remelted or remolded without compromising their original properties. Examples of such thermosetting resins include epoxy-based, melamine-based, phenol-based, and urea-based resins.

The resin materials used as the base material of the base portion 61 and the lens portion 70 may be the same or different. The material of the lens portion 70 includes a resin material as a base material and a colorant for coloring a predetermined color. The material of the base portion 61 does not have to contain the colorant used for the lens portion 70.

Various dyes, pigments and the like can be used as the colorant contained in the resin material of the lens portion 70. The colorant may be an inorganic member or an organic member. Specific examples thereof include perylene-based red, condensed azo-based red, quinacridone-based red, copper phthalosinian blue, copper phthalosinian green, curcumin, and coal tar dyes. The content of the colorant may be, for example, 0.1% or more, preferably 0.2% or more, based on the resin material as the base material. As a result, the display contrast can be improved more effectively by the dark color effect. On the other hand, if the content of the colorant is large, the efficiency of extracting light emission may decrease. Therefore, the content of the colorant may be 5% or less, preferably 1% or less. The content of the colorant is not limited to the above range, and is selected so as to realize high display contrast while ensuring the light extraction efficiency.

The mold resin 60 in the present embodiment may contain a light diffusing material in order to improve the uniformity of the light quality of the light emitting device 1000. By containing the light diffusing material in the mold resin 60, the light emitted from the light emitting element 50 can be diffused to suppress the unevenness of the light intensity. As such a light diffusing material, inorganic members such as barium oxide, barium titanate, barium oxide, silicon oxide, titanium oxide and aluminum oxide and organic members such as melamine resin, CTU guanamine resin and benzoguanamine resin are preferably used. ..

The mold resin 60 may contain various fillers that relieve the internal stress of the resin. The specific material is the same as that of the light diffusing material, but the central particle size (D ₅₀ ) is different from that of the light diffusing material. As used herein, the term "filler" refers to a filler having a central particle size of 100 nm or more and 100 μm or less. When a filler having such a particle size is contained in the translucent resin, the variation in chromaticity of the light emitting device 1000 is improved by the light scattering action, and the thermal shock resistance of the translucent resin can be enhanced.

[Effects, etc.]
The light emitting device 1000 of the present embodiment has a structure that can be surface-mounted by reflow soldering. Therefore, the mounting cost and the number of mounting steps can be reduced as compared with the conventional lamp type light emitting device mounted by flow solder.

Further, according to the present embodiment, light can be extracted with higher efficiency than the conventional SMD type light emitting device. In the conventional SMD type light emitting device, the light emitting element is arranged in a recess formed in, for example, a resin package. The bottom and sides of the recess are made of white resin. On the other hand, in the light emitting device 1000 of the present embodiment, each light emitting element 50 is arranged in the recess 20 of the lead 10 made of a metal such as Ag. The recess 20 made of metal has a higher reflectance than the recess made of white resin. Therefore, according to the present embodiment, the light emitted from the light emitting element 50 can be reflected in the front direction by the concave portion 20 made of metal, so that the conventional light emitting element is arranged in the concave portion made of white resin. It is possible to improve the efficiency of extracting light in the front direction as compared with the SMD type light emitting device. Therefore, a high-luminance light emitting device 1000 can be obtained. Further, since the same brightness can be realized with a smaller driving power as compared with the conventional SMD type light emitting device, the life of the light emitting device 1000 can be extended.

Further, in the present embodiment, the directivity can be controlled by the recess 20 in which the light emitting element 50 is arranged and the lens portion 70 provided on the emission side of the light emitting element 50. For example, in the configuration shown in FIG. 2A, in a plan view, the shapes of the recess 20 and the lens portion 70 are both elliptical with a long axis in the x-axis direction, so that they are wide in the x-axis direction and in the y-axis direction. A narrow directional characteristic can be obtained. By controlling the directivity in this way, the efficiency of extracting light in the front direction of the light emitting device 1000 can be further improved. Therefore, according to the present embodiment, the light emitting device has a directivity suitable for a display device such as an LED display, and the efficiency of extracting light in the front direction is further improved (that is, the brightness and the life are further improved). 1000 is obtained. In the configuration shown in FIG. 2A, the shapes of the recess 20 and the lens portion 70 are both elliptical, but if either the recess 20 or the lens portion 70 has an elliptical shape, the directional characteristics are controlled. It is possible to do.

In a conventional light emitting device, when the light emitting element is turned off, external light or the like incident on the light emitting device may be reflected around the light emitting element, thereby lowering the display contrast. This problem is particularly remarkable when the conventional light emitting device is used for a large display device used outdoors such as a billboard. On the other hand, according to the present embodiment, the display contrast can be improved. The reason will be explained below.

In the present embodiment, the first recess 21 and the first light emitting element 51 are covered with a first lens portion 71 colored in a similar color to the light emitting color of the first light emitting element 51. As a result, it is possible to suppress a decrease in display contrast due to external light reflection in the first region 31 when the first light emitting element 51 is turned off without disturbing the light emitting color when the light emitting element 50 is turned on. Similarly, since the second recess 22 and the second light emitting element 52 are covered with the second lens portion 72 colored in a similar color to the light emitting color of the second light emitting element 52, when the second light emitting element 52 is turned off. , It is possible to suppress a decrease in display contrast due to external light reflection in the second region 32. Further, since the third recess 23 and the third light emitting element 53 are covered with the third lens portion 73 colored in a similar color to the light emitting color of the third light emitting element 53, when the third light emitting element 53 is turned off, the third light emitting element 53 is turned off. It is possible to suppress a decrease in display contrast due to external light reflection in the third region 33.

Further, when the first light emitting element 51, the second light emitting element 52, and the third light emitting element 53 are turned off, the first lens is obtained by reducing the colors of the first lens unit 71, the second lens unit 72, and the third lens unit 73. The unit 71, the second lens unit 72, and the third lens unit 73 appear to be a darker color than the colored color, that is, a color having a lower brightness. As a result, the emission surface of the light emitting device 1000 looks dark, so that the display contrast can be further improved.

In the light emitting device 1000, the light transmitted through the first lens unit 71, the second lens unit 72, and the third lens unit 73 is mixed when the first light emitting element 51, the second light emitting element 52, and the third light emitting element 53 are lit. The emitted light may be, for example, white or light bulb color. On the other hand, when the first light emitting element 51, the second light emitting element 52, and the third light emitting element 53 are turned off, the first lens unit 71, the second lens unit 72, and the third lens unit 73 are each more than the colored color. It may appear to be a low-brightness color, such as a dark system such as gray or black.

[Manufacturing method of light emitting device 1000]
Hereinafter, an example of a method for manufacturing the light emitting device 1000 will be described.

3A to 3C and FIGS. 5A to 5C are process sectional views for explaining a manufacturing method of the light emitting device 1000, respectively, and one light emitting element 50 is shown in the top view of the light emitting device 1000 shown in FIG. 2A. The cross section crossing in the x-axis direction is shown. FIG. 4 is a perspective view of a casting case used for molding the mold resin 60.

(First step: Preparation of package 100)
In the first step, a package 100 including a dark color resin 40 and a plurality of leads 10 is prepared. Here, a method of forming the package 100 by the transfer molding method will be described.

First, as shown in FIG. 3A, a lead frame including a plurality of leads 10 is prepared. Here, a lead 10 is used in which copper is used as a base material (lead base material) and a silver plating layer is formed on the surface of the lead base material. The plurality of leads 10 includes at least two pairs of leads. Each lead pair includes leads 10a and 10b arranged apart from each other. In this example, one lead 10a of each lead pair has a recess 20. Here, an example will be described in which a plurality of leads 10 include three pairs of leads for one package.

As described above, the lead 10 may be formed by sequentially forming plating layers having different surface roughness on the lead base material. As a result, the surface roughness and glossiness of the leads 10 can be partially different. For example, first, a first plating layer having a large surface roughness (for example, a roughened plating layer) is formed on the surface of the lead base material having the recess 20 (including the surface of the recess and the surface of the region excluding the recess). .. The roughened plating layer refers to, for example, a plating layer having a glossiness of 0.2 or less. Next, a second plating layer (for example, a smooth plating layer) having a smoother surface than the first plating layer is formed in a state where at least a part of the region excluding the recess 20 is covered with a mask. The smooth plating layer refers to, for example, a plating layer having a glossiness of 0.8 or more. As a result, in each recess 20, the second plating layer is formed on the surface of the first plating layer, so that the surface roughness of the recess 20 is reduced. On the other hand, since the second plating layer is not formed in the region covered with the mask other than the recess 20, the surface roughness thereof becomes the surface roughness of the first plating layer, which is larger than the surface roughness of the recess 20. After that, the lead 10 is obtained by removing the mask. The method of forming and removing the mask is not particularly limited. Further, the mask may be formed so as to cover a region having a surface roughness larger than that of the recess 20, and may not cover the entire region excluding the recess 20. Further, the surface roughness can be made different by covering the area where the second plating layer is to be formed with a mask at the time of forming the first plating layer and covering the area where the first plating layer is formed with the mask at the time of forming the second plating layer. .. The materials of the first plating layer and the second plating layer may be the same (for example, a silver plating layer) or may be different. When the materials are different, for example, a gold-plated layer having a low reflectance may be formed on the roughened plating layer, and a silver-plated layer having a high reflectance may be formed on the smooth plating layer.

Next, the mold is prepared and the lead frame is placed in the mold. After that, the dark-colored thermoplastic resin material is injected into the mold and cooled to solidify. As a result, as shown in FIG. 3B, a dark-colored resin 40 that holds a plurality of leads 10 is formed. In this way, the package 100 is obtained.

The leads 10a and 10b have exposed regions 30a and 30b exposed on the main surface 100a of the package 100, respectively. The recess 20 is located in the exposed region 30a of the leads 10a in each lead pair.

(Second step: mounting of light emitting element 50)
In the second step, as shown in FIG. 3C, the light emitting element 50 is mounted on the package 100.

First, on the main surface 100a of the package 100, the light emitting element 50 is bonded to the recess 20 of one of the leads 10a in each lead pair by using, for example, a conductive paste.

Next, the positive and negative electrodes of each light emitting element 50 are electrically connected to the exposed regions 30a and 30b of the two leads 10a and 10b in the lead pair by the wires 80a and 80b, respectively. In this way, the first structure 110 including the package 100 and the light emitting element 50 mounted on the main surface 100a of the package 100 is formed.

In the present embodiment, the first structure 110 in which three light emitting elements 50 having different light emitting colors are mounted is formed on the package 100. The light emitting element 50 includes a first light emitting element that emits the first light, a second light emitting element that emits the second light, and a third light emitting element that emits the third light.

(Third step: Formation of mold resin 60)
In the third step, the mold resin 60 is formed by using, for example, a casting molding method.

Preparation of Casting Case 120 First, as shown in FIG. 4, a casting case 120 having an opening 120p, an upper cavity 121, and a plurality of lower cavities 130 is prepared. The opening 120p is located above the upper cavity 121. The upper cavity 121 has a bottom surface 121b and a side surface 121c formed continuously from the bottom surface 121b. Each lower cavity 130 projects downward from the bottom surface 121b of the upper cavity 121. The upper cavity 121 has a shape corresponding to the base portion. In this example, the bottom surface 121b of the upper cavity 121 has a shape corresponding to the upper surface of the base portion, and the side surface 121c has a shape corresponding to the side surface of the base portion. The lower cavity 130 has a shape corresponding to the lens portion. In this embodiment, the plurality of lower cavities 130 include a first cavity 131, a second cavity 132, and a third cavity 133.

As described above, at least a part of the inner surface of the upper cavity 121 of the casting case 120 may be roughened. For example, the inside of the bottom surface 121b and the side surface 121c of the upper cavity 121 of the casting case 120 may be roughened. The inner surface of the lower cavity 130 does not have to be roughened. The method of roughening the casting case 120 is not particularly limited. For example, the surface can be roughened by performing electric discharge machining or the like on the mold for molding the casting case 120.

First resin injection step Next, as shown in FIG. 5A, the first resin 141 containing a thermosetting resin as a base material is injected into each of the plurality of lower cavities 130. Here, an epoxy resin is used as the base material of the first resin 141. The first resin 141 injected into at least two lower cavities of the plurality of lower cavities 130 is colored differently from each other.

In the present embodiment, the first cavity 131 of the casting case 120 shown in FIG. 4 is injected with the first resin colored in the same color as the first light, and the second cavity 132 is colored in the same color as the second light. The first resin is injected, and the first resin colored in the same color as the third light is injected into the third cavity 133.

-Temporary curing step Subsequently, the first resin 141 injected into the casting case 120 is temporarily cured (primary curing). Here, the first resin 141 is heated at a temperature lower than the curing temperature of the thermosetting resin which is the base material of the first resin 141. As a result, as shown in FIG. 5B, the temporarily cured body 141a of the first resin 141 is formed in the lower cavity 130.

Second resin injection step After forming the temporarily cured body 141a, as shown in FIG. 5C, the second resin 142 using the thermosetting resin as a base material is injected into the upper cavity 121 of the casting case 120. The base material of the second resin 142 may be the same as or different from the base material of the first resin. Here, a second resin 142 using an epoxy resin as a base material is used. The second resin 142 does not have to be colored.

Immersion Step Next, as shown in FIG. 5D, the first structure 110 is turned downward, and a part of the first structure 110 is immersed in the second resin 142 in the casting case 120. Specifically, the main surface of the light emitting element 50 and the package 100 in the first structure 110 so that each of the plurality of light emitting elements 50 overlaps with the corresponding one of the plurality of lower cavities 130 in a plan view. The 100a is immersed in the second resin 142.

In the present embodiment, in a plan view, the first light emitting element, the second light emitting element, and the third light emitting element in the first structure 110 are the first cavity 131 and the second cavity 132 of the casting case 120 shown in FIG. 4, respectively. The first structure 110 is immersed in the second resin 142 so as to overlap the third cavity 133.

Main curing step In a state where the first structure 110 is immersed in the second resin 142, the temporarily cured body 141a of the first resin and the second resin 142 are cured. This curing step is performed at a temperature equal to or higher than the curing temperature of the base material of the first resin and the second resin 142. After this, the casting case 120 is removed. As a result, as shown in FIG. 5E, a mold resin 60 including a base portion 61 covering the main surface 100a of the package 100 and at least two lens portions 70 colored in different colors is formed. The lens portion 70 of the mold resin 60 is formed of the temporarily cured body 141a of the first resin, and the base portion 61 is formed of the second resin 142.

When the casting case 120 having a roughened inner surface of the upper cavity is used, a partially roughened mold resin 60 can be obtained, reflecting the roughened surface shape of the upper cavity. On the other hand, when the casting case 120 that has not been roughened is used, after the mold resin 60 is taken out from the casting case 120, at least a part of the surface of the base portion 61 in the mold resin 60 is roughened. You may go. For example, with the lens portion 70 masked, the portion of the upper surface 61a of the base portion 61 that does not overlap with the plurality of lens portions 70 in plan view and the side surface 61b of the base portion 61 are roughened by blasting or the like. Processing may be performed.

Subsequently, as shown in FIG. 5F, the lead 10 is cut from the lead frame and separated into individual pieces to obtain a light emitting device 1000. In this example, the outer shape of the light emitting device 1000 in the top view has a substantially square shape of, for example, 6 mm × 6 mm. The height h1 in the z-axis direction in the light emitting device 1000 is, for example, 4.2 mm, and the thicknesses h2 and h3 in the z-axis direction of the base portion 61 and the lens portion 70 are, for example, 1.5 mm, respectively.

According to the manufacturing method of the present embodiment, by performing the curing step for forming the mold resin 60 in two steps, the plurality of lens portions 70 and the base portion 61 colored in different colors are combined with the same casting case 120. Can be integrally molded using. Therefore, it is possible to suppress an increase in manufacturing cost and the number of manufacturing processes. Further, the plurality of lens portions 70 can be stably held at a predetermined position.

Although the manufacturing method of the light emitting device 1000 has been described above as an example, the manufacturing method of the present disclosure is applied to a light emitting device having at least two light emitting elements having different light emitting colors.

Various modifications are possible for the light emitting device. For example, the structure / arrangement of the light emitting element, the structure and form of the package, the structure of the mold resin, and the like are not limited to the forms described in the above-described embodiment. It is possible to suitably use a mode other than the mode described in the embodiment for the light emitting device of the present disclosure.

Hereinafter, a modified example of the light emitting device of the present disclosure will be described. Hereinafter, the differences from the light emitting device 1000 will be mainly described, and the description of the structure similar to that of the light emitting device 1000 will be omitted. Further, in each drawing showing a modified example, the same reference numerals are given to the same components as those of the light emitting device 1000 for the sake of clarity.

(Modification 1)
FIG. 6A is a schematic top perspective view of another light emitting device 2000 of the present embodiment. FIG. 6B is a schematic cross-sectional view taken along the line 6B-6B in FIG. 6A.

In the light emitting device 2000, on the main surface 100a of the package 100, the first recess 21, the second recess 22, and the third recess 23 are arranged along the first direction (here, the y-axis direction). Therefore, the first light emitting element 51, the second light emitting element 52, and the third light emitting element 53 are also arranged in substantially one line in the y-axis direction. Further, the centers of the first lens unit 71, the second lens unit 72, and the third lens unit 73 are arranged in substantially one line in the y-axis direction.

The plurality of leads 10 are bent inward on the back surface 100b of the package 100. The bent portion of each lead 10 is exposed on the back surface 100b and becomes a mounting surface.

The light emitting device 2000 may further include a second dark color resin 150 between the main surface 100a of the package 100 and the mold resin 60. The second dark-colored resin 150 is arranged so as to cover the portion (wire connecting portion) to which the wire is connected in each lead 10. As a result, it is possible to suppress a decrease in contrast caused by the connection portion between each lead 10 and the wire.

In the example shown in FIG. 6A, the peripheral portion 31r of the first lead 11a has a wire connecting portion w1 to which the wire 81 is connected. Similarly, the peripheral portion 32r of the second lead 12a and the peripheral portion 33r of the third lead 13a have wire connecting portions w2 and w3 to which the wires 82 and 83 are connected, respectively. Further, the 4th lead 11b, the 5th lead 12b, and the 6th lead 13b also have wire connecting portions w4, w5, and w6 to which the wires 84, 85, and 86 are connected, respectively.

The second dark-colored resin 150 may extend in the first direction (here, the y-axis direction) so as to cover the wire connection portions of the two or more (here, three) leads 10. For example, as illustrated, the second dark color resin 150 may include two portions 151, 152 that are spaced apart from each other and extend in the y-axis direction. The portion 151 of the second dark color resin 150 extends so as to cover the wire connecting portions w1, w2, and w3 in the first lead 11a, the second lead 12a, and the third lead 13a. The portion 152 extends so as to cover the wire connecting portions w4, w5, w6 in the fourth lead 11b, the fifth lead 12b, and the sixth lead 13b. The shape of the second dark color resin 150 is not limited to the shape shown in the figure. For example, the second dark color resin 150 may be separated into three or more portions.

The second dark-colored resin 150 may be formed by using the same resin material and colorant as the dark-colored resin 40. As the second dark-colored resin 150, for example, a silicone resin material to which carbon black is added can be used.

The light emitting device 2000 can be manufactured by the same method as the above-mentioned manufacturing method of the light emitting device 1000 with reference to FIGS. 3A to 5F. However, in this modification, after the light emitting element 50 is bonded to the package 100, the second dark color resin 150 is formed so as to cover the connection portion with the wire in each lead 10. Next, the mold resin 60 is formed by the casting molding method in the same manner as in the light emitting device 1000, and the lead 10 is cut. Each lead 10 is cut from the lead frame and then bent.

Also in the above-mentioned light emitting device 1000, a second dark color resin may be arranged on the main surface 100a of the package 100 so as to cover the connection portion between each lead 10 and the wire.

(Modification 2)
FIG. 7 is a schematic top perspective view of another light emitting device 3000 of the present embodiment.

The light emitting device 3000 differs from the light emitting device 2000 shown in FIGS. 6A and 6B in that the first recess 21, the second recess 22, and the third recess 23 are arranged on one lead 10.

In the light emitting device 3000, the first recess 21, the second recess 22, and the third recess 23 are arranged in the second region 32 of the second lead 12a. As shown in FIG. 7, in a plan view, the second region 32 extends in the y-axis direction, and the first recess 21, the second recess 22, and the third recess 23 may be arranged in the y-axis direction. As described above, the first recess 21, the second recess 22, and the third recess 23 do not have to be arranged in a row.

In the example shown in FIG. 7, in the main surface 100a of the package 100, the first region 31 of the first lead 11a and the fourth region 34 of the fourth lead 11b each have a first recess 21 in the second region 32. It is arranged on the left side (-x side) and the right side (x side). The fifth region 35 of the fifth lead 12b is arranged on the right side (x side) of the second recess 22 in the second region 32. The third region 33 of the third lead 13a and the sixth region 36 of the sixth lead 13b sandwich the third recess 23 in the second region 32, respectively, on the left side (-x side) and the right side (x side). Is located in. By arranging the exposed region 30 of each lead 10 close to the corresponding light emitting element 50 in this way, the lead 10 and the light emitting element 50 can be more easily connected.

A second dark color resin may be arranged on the main surface 100a of the package 100 in the light emitting device 3000 so as to cover the wire connection portion. Similar to the example shown in FIG. 6A, the second dark-colored resin has a portion extending in the y-axis direction so as to cover the wire connection portions of the first lead 11a, the second lead 12a, and the third lead 13a, and the fourth lead. It may include a portion extending in the y-axis direction so as to cover the wire connection portion of the leads 11b, the fifth lead 12b and the sixth lead 13b.

In the example shown in FIG. 7, three recesses 20 are arranged in one lead 10 (here, the second lead 12a), but two of the first recess 21, the second recess 22, and the third recess 23 are arranged. The recess may be located on one lead 10 and the remaining one recess may be located on the other lead 10.

According to this modification, the distance between the recesses 20 can be reduced by providing two or more recesses 20 in the exposed region 30 of one lead 10. Therefore, the package 100 can be further miniaturized.

(Modification 3)
FIG. 8 is a schematic top perspective view of another light emitting device 4000 of the present embodiment.

The light emitting device 4000 has a point having a common lead 14a electrically connected to the first light emitting element 51, the second light emitting element 52, and the third light emitting element 53, and the first recess 21, the second recess 22, and the third. It differs from the light emitting device 2000 shown in FIGS. 6A and 6B in that the recess 23 is arranged in the common lead 14a.

In the light emitting device 4000, the plurality of leads 10 include a common lead 14a, a fourth lead 11b, a fifth lead 12b, and a sixth lead 13b. On the back surface of the package 100, the ends of the common lead 14a, the fourth lead 11b, the fifth lead 12b, and the sixth lead 13b are exposed. The portion exposed on the back surface of the package 100 serves as a mounting surface for fixing the light emitting device 4000 to the mounting board (4 terminals).

The common lead 14a has a seventh region 37 exposed on the main surface 100a of the package 100. The seventh region 37 includes a first recess 21, a second recess 22, a third recess 23, and a peripheral portion 37r. The peripheral portion 37r is a region in the seventh region 37 excluding the first recess 21, the second recess 22, and the third recess 23, and is used for wire bonding.

As shown in FIG. 8, in a plan view, the seventh region 37 extends in the y-axis direction, and the first recess 21, the second recess 22, and the third recess 23 may be arranged in the y-axis direction. As described above, the first recess 21, the second recess 22, and the third recess 23 do not have to be arranged in a row.

In the example shown in FIG. 8, on the main surface 100a of the package 100, the fourth lead 11b is located on the right side (x side) of the common lead 14a. The fifth lead 12b and the sixth lead 13b are located on the right side (x side) and the left side (−x side), respectively, with the seventh region 37 of the common lead 14a interposed therebetween.

The positive and negative electrodes of the first light emitting element 51 are electrically connected to the peripheral portion 37r of the seventh region 37 of the common lead 14a and the fourth region 34 of the fourth lead 11b by wires 81 and 84, respectively. The positive and negative electrodes of the second light emitting element 52 are electrically connected to the peripheral portion 37r of the seventh region 37 of the common lead 14a and the fifth region 35 of the fifth lead 12b by wires 82 and 85, respectively. The positive and negative electrodes of the third light emitting element 53 are electrically connected to the peripheral portion 37r of the seventh region 37 of the common lead 14a and the sixth region 36 of the sixth lead 13b by wires 83 and 86, respectively.

A second dark color resin may be arranged on the main surface 100a of the package 100 in the light emitting device 4000. The second dark-colored resin may have the same shape as the example shown in FIG. 6A. For example, the second dark-colored resin covers a portion extending in the y-axis direction so as to cover the wire connection portion of the common lead 14a and the sixth lead 13b, and the wire connection portion of the fourth lead 11b and the fifth lead 12b. May include a portion extending in the y-axis direction.

In the example shown in FIG. 8, three recesses 20 are arranged in the common lead 14a, but two recesses 20 may be arranged in the common lead 14a and the remaining one recess 20 may be arranged in the other leads. ..

Further, in the example shown in FIG. 8, a common lead 14a electrically connected to the first light emitting element 51, the second light emitting element 52, and the third light emitting element 53 was used, but instead, among these light emitting elements, the common lead 14a was used. A common lead electrically connected to only two (for example, the first light emitting element 51 and the second light emitting element 52) may be used.

According to this modification, the number of leads 10 can be reduced by using common leads connected to two or more light emitting elements 50. Further, by providing two or more recesses 20 in one lead (here, the common lead 14a), the distance between the recesses 20 can be reduced. Therefore, the package 100 can be further miniaturized.

The light emitting device of the present disclosure can be suitably used for a light emitting device for various purposes. In particular, it is suitably used for display devices such as LED displays. LED displays are used, for example, in billboards, large televisions, advertisements, traffic information, stereoscopic displays, lighting fixtures, and the like.

10, 10a, 10b Lead 11a 1st lead 12a 2nd lead 13a 3rd lead 11b 4th lead 12b 5th lead 13b 6th lead 14a Common lead 20 recess 21 1st recess 22 2nd recess 23 3rd recess 30 Exposed area 31 1st region 32 2nd region 33 3rd region 34 4th region 35 5th region 36 6th region 37 7th region 40 Dark color resin 40a 1st resin part 40b 2nd resin part 41 Convex part 50 Light emitting element 51 1 Light emitting element 52 Second light emitting element 53 Third light emitting element 60 Molded resin 61 Base part 61a Top surface of base part 61b Side surface of base part 70 Lens part 71 First lens part 72 Second lens part 73 Third lens part 80a, 80b , 81, 82, 83, 84, 85, 86 Wire 100 Package 100a Package main surface 100b Package back surface 110 First structure 120 Casting case 121 Upper cavity 130 Lower cavity 131 First cavity 132 Second cavity 133 Third cavity 141 1st resin 141a Temporarily cured body of 1st resin 142 2nd resin 150 2nd dark color resin w1, w2, w3, w4, w5, w6 Wire connection part 1000, 2000, 3000, 4000 Light emitting device

Claims (20)

A package containing a plurality of leads and a dark-colored resin for fixing at least a part of the plurality of leads, and three of the plurality of leads each have the dark-colored resin on the main surface of the package. A package for surface mounting, which has an exposed area exposed from the resin, and a first recess, a second recess, and a third recess are arranged in the exposed area of the three leads, respectively.
A first light emitting element arranged in the first recess and emitting a first light, a second light emitting element arranged in the second recess and emitting a second light on a wavelength side shorter than that of the first light, and the first light emitting element. A plurality of light emitting elements including a third light emitting element arranged in the three recesses and emitting a third light on the shorter wavelength side than the second light, and a plurality of light emitting elements.
A mold resin for sealing the plurality of light emitting elements, and
The mold resin is
A base portion that covers the main surface of the package and the plurality of light emitting elements, and
It has a plurality of lens portions integrally formed with the base portion, and has.
Each of the plurality of lens portions has a convex shape protruding upward from the base portion.
In a plan view, the plurality of lens portions include a first lens portion that overlaps the first concave portion and the first light emitting element, a second lens portion that overlaps the second concave portion and the second light emitting element, and the third lens portion. Includes a recess and a third lens portion that overlaps the third light emitting element.
A light emitting device in which the first lens portion is colored in a color similar to the first light, the second lens portion is colored in a color similar to the second light, and the third lens portion is colored in a color similar to the third light. A package comprising a plurality of leads and a dark-colored resin for fixing at least a part of the plurality of leads, each of the plurality of leads being exposed on the main surface of the package from the dark-colored resin. It has a region, and two recesses of a first recess, a second recess and a third recess are arranged in the exposed region of one of the plurality of leads, and among the plurality of leads. In the exposed area of the same or different lead as the one lead, one recess other than the two recesses of the first recess, the second recess and the third recess is arranged on the surface. Package and
A first light emitting element arranged in the first recess and emitting a first light, a second light emitting element arranged in the second recess and emitting a second light on a wavelength side shorter than that of the first light, and the first light emitting element. A plurality of light emitting elements including a third light emitting element arranged in the three recesses and emitting a third light on the shorter wavelength side than the second light, and a plurality of light emitting elements.
A mold resin for sealing the plurality of light emitting elements, and
The mold resin is
A base portion that covers the main surface of the package and the plurality of light emitting elements, and
It has a plurality of lens portions integrally formed with the base portion, and has.
Each of the plurality of lens portions has a convex shape protruding upward from the base portion.
In a plan view, the plurality of lens portions include a first lens portion that overlaps the first concave portion and the first light emitting element, a second lens portion that overlaps the second concave portion and the second light emitting element, and the third lens portion. Includes a recess and a third lens portion that overlaps the third light emitting element.
A light emitting device in which the first lens portion is colored in a color similar to the first light, the second lens portion is colored in a color similar to the second light, and the third lens portion is colored in a color similar to the third light. The light emitting device according to claim 1 or 2, wherein the base portion of the molded resin has a light transmittance of 90% or more at the peak wavelength of each of the plurality of light emitting elements. The first recess, the second recess and the third recess have a circular or elliptical shape, respectively.
From claim 1, the center of the first concave portion, the second concave portion, and the third concave portion coincides with the optical axes of the first lens portion, the second lens portion, and the third lens portion, respectively. The light emitting device according to any one of 3. The light emitting device according to any one of claims 1 to 4, wherein a part of the base portion in the mold resin covers a surface opposite to the main surface of the package. In a plan view, the center of the lens portion located at the center of the first lens portion, the second lens portion, and the third lens portion is not located on the line connecting the centers of the other two lens portions. The light emitting device according to any one of claims 1 to 5. The light emitting device according to any one of claims 1 to 6, wherein the mold resin further contains a filler or a light diffusing material. When the first light emitting element, the second light emitting element, and the third light emitting element are lit, the light obtained by mixing the light transmitted through the first lens portion, the second lens portion, and the third lens portion is white. Or the color of the light bulb,
When the first light emitting element, the second light emitting element, and the third light emitting element are turned off, the first lens portion, the second lens portion, and the third lens portion are each brighter than the colored color. The light emitting device according to any one of claims 1 to 7, which looks like a low color. The base portion has an upper surface located above the main surface of the package, and a portion of the upper surface of the base portion that does not overlap the plurality of lens portions in a plan view is roughened. The light emitting device according to any one of claims 1 to 8. The light emitting device according to claim 9, wherein the surface roughness of the portion of the upper surface of the base portion that does not overlap with the plurality of lens portions in a plan view is larger than the surface roughness of the plurality of lens portions. A step of preparing a first structure including a package including a plurality of leads and a plurality of light emitting elements mounted on the main surface of the package.
A mold resin forming step of forming a mold resin for sealing the plurality of light emitting elements in the first structure is included.
The mold resin forming step is
A step of preparing a casting case having an upper cavity and a plurality of lower cavities each projecting downward from the bottom surface of the upper cavity.
A step of injecting a first resin having a thermosetting resin as a base material into each of the plurality of lower cavities, wherein the first resin is injected into at least two lower cavities of the plurality of lower cavities. The first resin injection step, which is colored differently from each other,
A temporary curing step of temporarily curing the first resin by heating it at a temperature lower than the curing temperature of the first resin.
After the temporary curing step, a second resin injection step of injecting a second resin having the same or different thermosetting resin as the first resin into the upper cavity is used.
The plurality of light emitting elements in the first structure and the main surface of the package are placed on the main surface of the first structure so that each of the plurality of light emitting elements overlaps with the corresponding one of the plurality of lower cavities in a plan view. This is a main curing step of immersing the second resin and the temporarily cured first resin in the state of being immersed in the two resins, whereby the second resin is formed and the main surface of the package is formed. The mold resin including the base portion covering the above and the plurality of lens portions made of the first resin is formed, and the plurality of lens portions are at least two made of the first resin colored in different colors from each other. This curing process, including the lens part,
A method for manufacturing a light emitting device. The plurality of light emitting elements include a first light emitting element that emits first light, a second light emitting element that emits second light on a wavelength side shorter than that of the first light, and a second light emitting element on a wavelength side shorter than that of the second light. Including a third light emitting element that emits three lights,
The at least two lower cavities include a first cavity, a second cavity, and a third cavity, and in the first resin injection step, the first cavity is colored in a color similar to that of the first light. The resin is injected, the first resin colored in the same color as the second light is injected into the second cavity, and the first cavity colored in the same color as the third light is injected into the third cavity. Inject the resin and
In the main curing step, the first light emitting element, the second light emitting element, and the third light emitting element are overlapped with the first cavity, the second cavity, and the third cavity, respectively, in a plan view. The method for manufacturing a light emitting device according to claim 11, wherein the first structure is immersed in the second resin. The method for manufacturing a light emitting device according to claim 11 or 12, wherein at least a part of the surface of the base portion is roughened after the main curing step. The method for manufacturing a light emitting device according to claim 11, wherein the step of preparing the casting case includes a step of roughening at least a part of the inner surface of the upper cavity. The light emitting device according to claim 1, wherein the plurality of leads are electrically connected to the plurality of light emitting elements via wires. The light emitting device according to claim 15, wherein the wire connecting portion to which the wire is connected is arranged in an area of the exposed area excluding the first recess, the second recess, and the third recess. The light emitting device according to claim 16, wherein the wire connecting portion overlaps with the plurality of lens portions in a plan view. Claim 1 in which the glossiness of the first recess, the second recess and the third recess is different from the gloss of the exposed area excluding the first recess, the second recess and the third recess. The light emitting device according to. The light emitting device according to claim 17, wherein the wire connecting portion is sandwiched apart from the dark-colored resin in a cross-sectional view. The light emitting device according to claim 1, wherein at least a part of the dark color resin protrudes from the lower surface of the base portion.

Images