JP2022037702A - Light-emitting module - Google Patents

Abstract

To provide a reliable light-emitting module.SOLUTION: A light-emitting module 1 includes a light guide member 10, a first light source 20A and a second light source 20B at least a part of which is arranged in the light guide member 10 and which have electrodes on the lower surface thereof, a light reflective member 30 arranged under the light guide member 10, a first wiring layer 41 arranged under the light reflective member 30 and connecting the electrode 22Ab of the first light source 20A and the electrode 22Ba of the second light source 20B, and a second wiring layer 42 arranged under the first wiring layer 41. The first wiring layer 41 includes a first portion 41s in contact with the second wiring layer 42, and a second portion 41n not in contact with the second wiring layer 42. In a plan view, the second portion 41n is continuously arranged between the electrode 22Ab of the first light source 20 and the electrode 22Ba of the second light source 20B.SELECTED DRAWING: Figure 7

Description

The embodiment relates to a light emitting module.

In recent years, as a backlight of a display device, a planar light emitting module in which light emitting elements using light emitting diodes (LEDs) are arranged in a plane has been widely developed. In such a light emitting module, wiring for connecting a plurality of light emitting elements to a common power source is provided. For such wiring, it is required to realize high reliability at low cost.

Japanese Unexamined Patent Publication No. 2011-129646

It is an object of the present invention to provide a highly reliable light emitting module.

The light emitting module according to the embodiment of the present invention includes a light guide member, a first light source and a second light source having at least a part thereof arranged in the light guide member and having electrodes on the lower surface, and arranged under the light guide member. The light-reflecting member, the first wiring layer arranged under the light-reflecting member, and connecting the electrode of the first light source and the electrode of the second light source, and arranged under the first wiring layer. A second wiring layer is provided. The first wiring layer includes a first portion in contact with the second wiring layer and a second portion not in contact with the second wiring layer. In a plan view, the second portion is continuously arranged between the electrode of the first light source and the electrode of the second light source.

According to the embodiment of the present invention, a highly reliable light emitting module can be realized.

It is a perspective view which shows the light emitting module which concerns on 1st Embodiment. FIG. 2 is a cross-sectional view taken along the line II-II shown in FIG. It is a perspective view which shows the light source of the light emitting module which concerns on 1st Embodiment. It is a bottom view which shows the wiring of the light emitting module which concerns on 1st Embodiment. It is an enlarged view which shows the region A of FIG. FIG. 5 is a cross-sectional view taken along the line VI-VI shown in FIG. It is a bottom view schematically showing the positional relationship between each wiring layer and each light source in the current path of 1st Embodiment. It is sectional drawing which shows the manufacturing method of the light emitting module which concerns on 1st Embodiment. It is sectional drawing which shows the manufacturing method of the light emitting module which concerns on 1st Embodiment. It is sectional drawing which shows the manufacturing method of the light emitting module which concerns on 1st Embodiment. It is sectional drawing which shows the manufacturing method of the light emitting module which concerns on 1st Embodiment. It is sectional drawing which shows the manufacturing method of the light emitting module which concerns on 1st Embodiment. It is sectional drawing which shows the manufacturing method of the light emitting module which concerns on 1st Embodiment. It is sectional drawing which shows the manufacturing method of the light emitting module which concerns on 1st Embodiment. It is sectional drawing which shows the manufacturing method of the light emitting module which concerns on 1st Embodiment. It is a bottom view which shows the state of the 1st wiring layer in the manufacturing method of the light emitting module which concerns on 1st Embodiment. It is a bottom view which shows the wiring of the light emitting module which concerns on 2nd Embodiment. It is an enlarged view which shows the region B of FIG. It is sectional drawing by XIII-XIII line shown in FIG. It is a bottom view which shows the wiring of the light emitting module which concerns on 3rd Embodiment. It is a bottom view schematically showing the positional relationship between each wiring layer and each light source in the current path of the third embodiment. It is a bottom view which shows the wiring of the light emitting module which concerns on 4th Embodiment. It is a bottom view schematically showing the positional relationship between each wiring layer and each light source in the current path of 4th Embodiment. It is sectional drawing which shows the light emitting module which concerns on 5th Embodiment.

Embodiments of the present invention will be described in detail with reference to the drawings. The following embodiments are examples, and the light emitting module and the method for manufacturing the light emitting module according to the embodiment of the present invention are not limited to the following embodiments. For example, the numerical values, shapes, materials, processes, the order of the processes, and the like shown in the following embodiments are merely examples, and various modifications can be made as long as there is no technical contradiction. Each of the embodiments described below can be combined in various ways as long as there is no technical contradiction.

The dimensions, shapes, etc. of the components shown in the drawings may be exaggerated for the sake of clarity, and may not reflect the actual dimensions, shapes, and magnitude relationships between the components. Further, in order to avoid the drawing from becoming excessively complicated, a schematic view in which some elements are not shown may be used, or an end view showing only the cut surface may be used as the cross-sectional view.

<First Embodiment>
First, the first embodiment will be described.
FIG. 1 is a perspective view showing a light emitting module according to the present embodiment.
FIG. 2 is a cross-sectional view taken along the line II-II shown in FIG.

As shown in FIGS. 1 and 2, the light emitting module 1 according to the present embodiment includes a light guide member 10, a first light source 20A, a second light source 20B, a light reflective member 30, and a wiring structure 40. , And an insulating film 50. The shape of the light guide member 10 is substantially a plate shape. The light reflective member 30 is arranged below the light guide member 10. The wiring structure 40 is arranged under the light reflecting member 30. The insulating film 50 is arranged below the wiring structure 40. The upper part of the first light source 20A is arranged in the light guide member 10, and the lower part is arranged in the light reflecting member 30. The upper part of the second light source 20B is also arranged in the light guide member 10, and the lower part is arranged in the light reflecting member 30.

In the present specification, in the description of the configuration of the light emitting module, the direction from the insulating film 50 toward the light guide member 10 is referred to as "up", and the opposite direction is referred to as "down", but this expression is for convenience. Yes, it has nothing to do with the direction of gravity. Further, in the present specification, "planar view" means viewing from above or below.

The light emitting module 1 is divided into a plurality of units 100. The plurality of units 100 are arranged in a plane. The light guide member 10, the light reflective member 30, the wiring structure 40, and the insulating film 50 are commonly arranged in the plurality of units 100 throughout the light emitting module 1.

The first light source 20A and the second light source 20B are arranged for each unit 100. That is, the first light source 20A is arranged in one unit 100, and the second light source 20B is arranged in the other unit 100. For example, the configuration of the first light source 20A and the configuration of the second light source 20B are the same. Hereinafter, when it is not necessary to distinguish between the first light source 20A and the second light source 20B, the first light source 20A and the second light source 20B are collectively referred to as "light source 20".

The light source 20 is arranged near the center of each unit 100 in a plan view. The light reflecting member 30 is formed of, for example, a resin material containing a light diffusing material, and is white as a whole. As the light diffusing material, for example, titanium oxide, silica, alumina, zinc oxide, glass or the like can be used. Such a light-reflecting member 30 has a reflectance of 60% or more, preferably 90% or more, with respect to the light from the light source 20.

The light reflective member 30 includes a first portion 31 arranged around the lower portion of the light source 20 and a second portion 32 arranged on the first portion 31. For example, the first portion 31 and the second portion 32 are integrally formed. In this case, the boundary between the first portion 31 and the second portion 32 is not observed. The first portion 31 is arranged over the entire light emitting module 1 excluding at least the light source 20. The second portion 32 surrounds the light source 20 in a plan view and is located away from the light source 20. The upper surface of the second portion 32 is cross-sectionally viewed, and the height from the first portion 31 increases as the distance from the light source 20 increases. Each unit 100 is partitioned by the ridgeline of the second portion 32. As a result, the upper surface 30a of the light reflecting member 30 in the present embodiment constitutes a concave surface surrounding the light source 20.

The light guide member 10 is made of a translucent material, for example, a thermoplastic resin such as an acrylic resin, a polycarbonate resin, a cyclic polyolefin resin, a polyethylene terephthalate resin or a polyester resin, a thermosetting resin such as an epoxy resin or a silicone resin, and the like. Alternatively, a material such as glass can be used. At least the light source 20 and the light reflecting member 30 are arranged on the lower surface 10a of the light guide member 10. The upper surface 10b of the light guide member 10 is substantially flat, and a recess 10c is formed at a position overlapping the light source 20 in a plan view. Examples of the recess 10c include a polygonal pyramid such as a cone, a quadrangular pyramid or a hexagonal pyramid, or a truncated cone-shaped recess such as a truncated cone, a quadrangular pyramid or a hexagonal cone.

The light adjusting member 60 is arranged in the recess 10c. The light adjusting member 60 reflects a part of the light from the light source 20 and transmits the other part. For example, the light adjusting member 60 can have a reflectance of 70% or more, more preferably 80% or more, with respect to the light from the light source 20. The light adjusting member 60 in the present embodiment is arranged so that the inner side surface of the recess 10c is exposed on the upper surface 10b side of the light guide member 10, but it can also be arranged in the entire inside of the recess 10c. Further, at least a part of the light adjusting member 60 faces the light reflecting member 30 via the light guide member 10. As a result, the light from the light source 20 can be efficiently taken out from the upper surface 10b of the light guide member 10.

As the light adjusting member 60, for example, a resin material containing a light diffusing material can be used, similarly to the light reflecting member 30. The light adjusting member 60 may be, for example, a light-reflecting metal member such as aluminum (Al) or silver (Ag), or a DBR (Distributed Bragg Reflector). Further, the light adjusting member 60 may be used in combination of these.

FIG. 3 is a perspective view showing a light source of the light emitting module according to the present embodiment.
As shown in FIGS. 2 and 3, the shape of the light source 20 is generally a rectangular parallelepiped. The light source 20 includes at least a light emitting element 21. The light emitting element 21 includes a semiconductor structure and a pair of positive and negative electrodes electrically connected to the semiconductor structure. A pair of electrodes 22a and 22b connected to a pair of positive and negative electrodes are arranged on the lower surface side of the light emitting element 21 in the present embodiment. In the semiconductor structure, for example, a light emitting diode (LED) structure is realized by at least stacking a p-type semiconductor layer, a light emitting layer, and an n-type semiconductor layer.

The structure of the light emitting layer may be a structure having a single active layer such as a double heterostructure or a single quantum well structure (SQW), or a group of active layers such as a multiple quantum well structure (MQW). It may be a structure having. The light emitting layer can emit visible light or ultraviolet light. For example, as visible light, at least light from blue to red can be mentioned. As the semiconductor structure including such a light emitting layer, for example, In _x Aly Ga _{1-x-y N} (0 ≦ x, 0 ≦ y, x + y ≦ 1) can be included.

Further, the light emitting element 21 can include two or more light emitting layers in the semiconductor structure. For example, the semiconductor laminate may have a structure including two or more light emitting layers between the n-type semiconductor layer and the p-type semiconductor layer, or the n-type semiconductor layer, the light emitting layer, and the p-type semiconductor layer are sequentially arranged. The laminated structure may be repeated twice or more. The two or more light emitting layers may include, for example, light emitting layers having different light emitting colors, or may include light emitting layers having the same light emitting color. It should be noted that the same emission color may be any range as long as it can be regarded as the same emission color in use, and for example, the main wavelength of each emission color may vary by about several nm. The combination of emission colors can be appropriately selected. For example, when two emission layers are included, the combination includes blue light and blue light, green light and green light, red light and red light, and ultraviolet light and ultraviolet light. Examples thereof include blue light and green light, blue light and red light, or green light and red light.

A translucent member 24 is arranged on the light emitting element 21. In a plan view, the translucent member 24 is larger than the light emitting element 21. In the translucent member 24, for example, the phosphor is dispersed in a base material made of a translucent resin material. The phosphor absorbs a part of the light emitted from the light emitting element 21 and emits light having a different wavelength. In one example, the phosphor absorbs the blue light emitted from the light emitting element 21 and emits the yellow light. As a result, blue light and yellow light are mixed, and white light is emitted from the light source 20. The translucent member 24 may not contain a phosphor.

Examples of the phosphor include an yttrium aluminum garnet phosphor (for example, Y ₃ (Al, Ga) ₅ O ₁₂ : Ce) and a terbium aluminum garnet phosphor (for example, Lu ₃ (Al, Ga) ₅ O). ₁₂ : Ce), terbium aluminum garnet phosphor (eg, Tb ₃ (Al, Ga) ₅ O ₁₂ : Ce), β-sialon phosphor (eg, (Si, Al) ₃ (O, N) ₄ : Eu), α-sialon phosphor (eg, Mz (Si, Al) ₁₂ (O, N) ₁₆ (where 0 <z≤2, M excludes Li, Mg, Ca, Y, and La and Ce. Phosphorate element)), nitride-based phosphors such as CASN-based phosphors (eg, CaAlSiN ₃ : Eu) or SCASN-based phosphors (eg, (Sr, Ca) AlSiN ₃ : Eu), KSF-based phosphors (eg,). A fluoride-based phosphor such as K ₂ SiF ₆ : Mn) or an MGF-based phosphor (for example, 3.5 MgO, 0.5 MgF ₂ , GeO ₂ : Mn), a quantum dot phosphor, or the like can be used. As the fluorescent substance added to the translucent member 24, one type of fluorescent material may be used, or a plurality of types of fluorescent materials may be used.

A translucent layer 25 is arranged around the upper portion of the light emitting element 21 and between the light emitting element 21 and the translucent member 24. The translucent layer 25 is a solidified adhesive having a translucent resin material, for example, an epoxy resin or a silicone resin as a base material. The translucent layer 25 can contain particles or the like made of a resin material having a refractive index lower than that of the base material. The translucent layer 25 reflects the light emitted laterally from the light emitting element 21 on the inner surface and guides it upward. A sealing member 26 is arranged below the translucent member 24 and around the light emitting element 21, the electrodes 22a and 22b, and the translucent layer 25.

A light-reflecting material can be used for the sealing member 26, for example, a silicone resin or an epoxy resin containing a light diffusing material composed of particles such as titanium oxide, silica, alumina, zinc oxide or glass. Examples of the reflectance of such a sealing member 26 include those having a reflectance of 60% or more and those having a reflectance of 90% or more with respect to the light from the light emitting element 21. Electrodes 22a and 22b are exposed on the lower surface of the sealing member 26. On the lower surface of the sealing member 26, the shapes of the regions where the electrodes 22a and 22b are exposed are, for example, right-angled isosceles triangles, and the bases face each other.

As described above, the light source 20 in the present embodiment is composed of the light emitting element 21, the electrodes 22a and 22b, the translucent member 24, the translucent layer 25, and the sealing member 26, but is not limited thereto, for example. The light source 20 may be composed of only the light emitting element 21.

A fixing member 70 is arranged between the lower part of the light source 20 and the light reflecting member 30, and between the upper part of the light source 20 and the light guide member 10. That is, in a plan view, the fixing member 70 is arranged around the light source 20. The fixing member 70 is made of, for example, a translucent resin material, for example, an epoxy resin, a silicone resin, a resin in which these are mixed, or the like.

FIG. 4 is a bottom view showing the wiring of the light emitting module according to the present embodiment.
FIG. 5 is an enlarged view showing the region A of FIG.
FIG. 6 is a cross-sectional view taken along the line VI-VI shown in FIG.
As shown in FIGS. 4 to 6, the wiring structure 40 has a first wiring layer 41 and a second wiring layer 42. In FIGS. 4 and 5, the insulating film 50 is omitted, the first wiring layer 41 is shown in light gray, and the second wiring layer 42 is shown in dark gray in order to make the figure easier to see.

The first wiring layer 41 and the second wiring layer 42 are each formed by, for example, applying or printing a conductive paste. Therefore, the first wiring layer 41 includes a base material 41a made of a resin material and a plurality of conductive members 41b arranged in the base material 41a. Similarly, the second wiring layer 42 includes a base material 42a made of a resin material and a plurality of conductive members 42b arranged in the base material 42a. The base materials 41a and 41b are, for example, epoxy resin, modified epoxy resin, glass epoxy resin, silicone resin, modified silicone resin, polyolefin resin, polycarbonate resin, polystyrene resin, acrylic resin, acrylate resin, methacrylic resin (PMMA, etc.), and the like. It can be formed of a urethane resin, a polyimide resin, a polynorbornene resin, a fluororesin, or the like. The conductive members 41b and 42b are, for example, gold (Au), platinum (Pt), palladium (Pd), rhodium (Rh), nickel (Ni), tungsten (W), molybdenum (Mo), chromium (Cr) or titanium. Metal particles containing (Ti) and the like can be used.

The thickness of the first wiring layer 41 is preferably 3 μm to 20 μm, more preferably 5 μm to 10 μm. The thickness of the second wiring layer 42 is preferably 3 μm to 20 μm, more preferably 5 μm to 10 μm.

The first wiring layer 41 is arranged under the light reflecting member 30. The first wiring layer 41 is further arranged under the light source 20 and is electrically connected to the electrodes 22a and 22b of the light source 20. More specifically, the tip of the first wiring layer 41 is arranged so as to be in contact with at least the lower surface of the sealing member 26 of the light source 20 and the lower surfaces of the electrodes 22a and 22b of the light source 20. The first wiring layer 41 is electrically connected to the electrodes 22a and 22b by being in contact with the electrodes 22a and 22b of the light source 20.

A groove 41e is formed between a portion of the first wiring layer 41 that overlaps with the electrode 22a in a plan view and a portion that overlaps with the electrode 22b. The groove 41e is formed by, for example, laser etching. The groove 41e is also formed on the lower surface of the resin portion located above the first wiring layer 41, for example, the lower surface of the light reflective member 30 and the lower surface of the sealing member 26. Due to the presence of the groove 41e, the electrodes 22a and 22b of one light source 20 are not short-circuited depending on the wiring structure 40. 4 and 5 show the locus E of the laser beam during laser etching.

As shown in FIG. 6, the second wiring layer 42 is arranged below the first wiring layer 41. Since FIGS. 4 and 5 are bottom views, the second wiring layer 42 is shown on the front side of the drawing with respect to the first wiring layer 41. The first wiring layer 41 and the second wiring layer 42 are in contact with each other. In the present embodiment, the entire second wiring layer 42 overlaps a part of the first wiring layer 41 in a plan view. Therefore, the first wiring layer 41 includes a first portion 41s in contact with the second wiring layer 42 and a second portion 41n not in contact with the second wiring layer 42. On the other hand, the second wiring layer 42 is in contact with the first wiring layer 41 as a whole. Further, the second wiring layer 42 is separated from the electrodes 22a and 22b of the light source 20, and is electrically connected to the electrodes 22a and 22b via the first wiring layer 41. In a plan view, the second wiring layer 42 overlaps with the light source 20. As a result, the second wiring layer 42 can be arranged close to the electrodes 22a or 22b, and the resistance value of the wiring structure 40 can be reduced.

On the lower surface of the light emitting module 1, there are connection regions 49a and 49b in which the second wiring layer 42 is exposed from the insulating film 50. The connection areas 49a and 49b are areas in which the wiring structure 40 is electrically connected to the external wiring board. By arranging one or more light emitting modules 1 on such a wiring board, a planar light source is configured. In the example shown in FIG. 4, the first wiring layer 41 and the second wiring layer 42 form eight current paths between the connection region 49a and the connection region 49b. The eight current paths are connected in parallel with each other. In each current path, two light sources 20 are connected in series.

The configuration of each current path will be described. Hereinafter, one current path will be described, but the same applies to the other current paths.
FIG. 7 is a bottom view schematically showing the positional relationship between each wiring layer and each light source in the current path of the present embodiment, and the shape of each wiring layer is simplified and made linear. A more detailed shape is as shown in FIG.

In the description of FIG. 7, the first light source 20A and the second light source 20B will be described separately. Further, the electrodes 22a and 22b of the first light source 20A are referred to as "electrodes 22Aa" and "electrodes 22Ab", respectively, and the electrodes 22a and 22b of the second light source 20B are referred to as "electrodes 22Ba" and "electrodes 22Bb", respectively. ..

As shown in FIG. 7, the first light source 20A and the second light source 20B are connected in series between the connection area 49a and the connection area 49b. The first wiring layer 41 connects the electrode 22Ab of the first light source 20A and the electrode 22Ba of the second light source 20B. The second wiring layer 42 is arranged under the first wiring layer 41 and is not in contact with the electrode 22Ab and the electrode 22Ba. By arranging the second wiring layer 42, the first wiring layer 41 is reinforced and the wiring resistance is reduced.

As shown in FIGS. 4 and 7, in a plan view, the second portion 41n of the first wiring layer 41 that does not contact the second wiring layer 42 includes the electrode 22Ab of the first light source 20A and the electrode 22Ba of the second light source 20B. It is arranged continuously between. For example, the second portion 41n is arranged all around the first wiring layer 41. As a result, the second portion 41n is arranged on both sides of the first portion 41s in the current path connecting the electrode 22Ab and the electrode 22Ba.

Further, the light emitting module 1 is also provided with a third wiring layer 43, a fourth wiring layer 44, a fifth wiring layer 45, and a sixth wiring layer 46. In FIGS. 4 and 5, the first wiring layer 41, the third wiring layer 43, and the fifth wiring layer 45 are not distinguished from each other and are designated by the reference numeral “41”, and the second wiring layer 42 and the fourth wiring are attached. The layer 44 and the sixth wiring layer 46 are not distinguished from each other and are designated by the reference numeral "42", and the related description is also described as such.

The third wiring layer 43 is arranged under the light reflecting member 30 and is separated from the first wiring layer 41. The third wiring layer 43 is electrically connected to the electrode 22Aa by being in contact with the electrode 22Aa of the first light source 20A. The fourth wiring layer 44 is arranged below the third wiring layer 43. In a plan view, the fourth wiring layer 44 is arranged inside the third wiring layer 43. The fourth wiring layer 44 is not in contact with the electrode 22Aa of the first light source 20A.

The third wiring layer 43 includes a third portion 43s in contact with the fourth wiring layer 44 and a fourth portion 43n not in contact with the fourth wiring layer 44. In a plan view, the fourth portion 43n is continuously arranged between the connection region 49a and the electrode 22Aa of the first light source 20A, and is arranged, for example, all around the third wiring layer 43.

The fifth wiring layer 45 is arranged under the light reflecting member 30 and is separated from the first wiring layer 41 and the third wiring layer 43. The fifth wiring layer 45 is electrically connected to the electrode 22Bb by being in contact with the electrode 22Bb of the second light source 20B. The sixth wiring layer 46 is arranged below the fifth wiring layer 45. In a plan view, the sixth wiring layer 46 is arranged inside the fifth wiring layer 45. The sixth wiring layer 46 is not in contact with the electrode 22Bb of the second light source 20B.

The fifth wiring layer 45 includes a fifth portion 45s in contact with the sixth wiring layer 46 and a fourth portion 45n not in contact with the sixth wiring layer 46. In a plan view, the sixth portion 45n is continuously arranged between the electrode 22Bb of the second light source 20B and the connection region 49b, and is arranged, for example, all around the fifth wiring layer 45.

Next, a method of manufacturing the light emitting module according to the present embodiment will be described.
8A to 8D and FIGS. 9A to 9D are schematic cross-sectional views showing a method of manufacturing a light emitting module according to the present embodiment.
FIG. 10 is a bottom view showing a state of the first wiring layer in the method for manufacturing a light emitting module according to the present embodiment.

The light guide member 10 is prepared, and the light guide member 10 is arranged on the support tape 201 as shown in FIG. 8A. At this time, the lower surface 10a of the light guide member 10 is adhered to the upper surface of the support tape 201. A recess 10c (hereinafter referred to as a first recess) is formed on the upper surface 10b of the light guide member 10. A recess 10d (hereinafter referred to as a second recess) for arranging the light source 20 in a later step is formed on the lower surface 10a of the light guide member 10. Further, a groove 10e is formed between the second recesses 10d. In a plan view, the shape of the groove 10e is, for example, a grid pattern surrounding the second recess 10d. Light adjustment is performed by arranging a light-shielding resin material, for example, a resin material containing 10 wt% to 30 wt% of a light diffusing material in the first recess 10c, and heating it in an oven at about 60 ° C to 130 ° C to cure it. Form the member 60.

Next, as shown in FIG. 8B, the light guide member 10 is turned upside down and replaced with the support tape 202. Then, the light source 20 is arranged in the second recess 10d via the liquid resin material. Next, the resin material is heated in an oven at about 60 ° C to 130 ° C to cure. As a result, the resin material becomes the fixing member 70, and the light source 20 is fixed to the light guide member 10. A part of the light source 20 and a part of the fixing member 70 project from the lower surface 10a of the light guide member 10.

Next, a resin material containing 50 wt% to 70 wt% of the light diffusing material is arranged in the groove 10e. This resin material is also arranged above the light guide member 10 and covers the light source 20 as well. Next, the film 203 is attached to the resin material by a vacuum bonding method. At this time, a resin material is interposed between the light source 20 and the film 203. Next, as shown in FIG. 8C, the film 203 is pressed by the roller 204. As a result, the resin material is flattened via the film 203. Next, the film 203 is removed. Next, the white resin material is cured by heating in an oven at about 60 ° C to 130 ° C. As a result, the resin material containing the light diffusing material becomes the light reflecting member 30.

Next, as shown in FIG. 8D, the light reflective member 30 is ground by the grindstone 205. As a result, a part of the light reflecting member 30 is removed, and the electrodes 22a and 22b of the light source 20 are exposed.

Next, as shown in FIG. 9A, a conductive paste is placed on the lower surface of the light-reflecting member 30 by, for example, a printing method, and heated in an oven at about 100 ° C. to 130 ° C. to be cured. As a result, the first wiring layer 41 is formed. At this time, as the conductive paste cures, the conductive paste shrinks. At this stage, the first wiring layer 41 is continuously provided between the electrodes 22a and 22b of each light source 20. Next, the conductive paste is placed on the lower surface of the first wiring layer 41 by a printing method, and heated in an oven at about 100 ° C. to 130 ° C. to be cured. As a result, the second wiring layer 42 is formed. Also at this time, the conductive paste shrinks as the conductive paste cures. The second wiring layer 42 is provided with a portion of each light source 20 on the electrode 22a side and a portion on the electrode 22b side separately.

As shown in FIG. 10, the second wiring layer 42 contracts mainly along the longitudinal direction. Due to the contraction of the second wiring layer 42, a force is also applied to the first wiring layer 41. The amount of displacement due to the contraction of the second wiring layer 42 is large at the end portion in the longitudinal direction. Therefore, a large tensile stress is applied to the portion of the first wiring layer 41 arranged in the vicinity of the longitudinal end portion of the second wiring layer 42. As a result, a crack C may occur in the first wiring layer 41 near the end portion in the longitudinal direction of the second wiring layer 42.

However, in the present embodiment, the second portion 41n of the first wiring layer 41 that does not contact the second wiring layer 42 is continuously between the electrode 22Ab of the first light source 20A and the electrode 22Ba of the second light source 20B. Since it is arranged, continuity between the electrode 22Ab and the electrode 22Ba is ensured. Further, even if a crack C is generated, it is possible to suppress the extension of the first wiring layer 41 in the entire width direction, and it is possible to suppress the disconnection of the first wiring layer 41. In particular, since the second portion 41n of the first wiring layer 41 is arranged all around the first wiring layer 41, the effect of preventing disconnection due to the extension of the crack C can be obtained on both sides of the first wiring layer 41 in the width direction. Can be obtained at.

Next, as shown in FIG. 9B, the first wiring layer 41 is subjected to laser etching. Specifically, the laser is formed in the portion of the first wiring layer 41 between the portion electrically connected to the electrode 22Aa of the first light source 20A and the portion electrically connected to the electrode 22Ab of the first light source 20A. Light L is irradiated to remove this portion. As a result, a groove 41e is formed in the first wiring layer 41, and the portion of the first wiring layer 41 connected to the electrode 22Aa of the first light source 20A (third wiring layer 43) and the electrode 22Ab of the first light source 20A. The connected portion (first wiring layer 41) is separated. At this time, the second wiring layer 42 is not arranged in the locus E of the laser beam L. Therefore, the second wiring layer 42 is not laser-etched. Similarly, for the second light source 20B, the portion of the first wiring layer 41 connected to the electrode 22Ba (first wiring layer 41) and the portion connected to the electrode 22Bb (fifth wiring layer 45) are subjected to laser etching. Divide. In this way, the wiring structure 40 is formed.

Next, as shown in FIG. 9C, an insulating resin material is printed on the light reflective member 30 so as to cover the first wiring layer 41 and the second wiring layer 42, and cured. As a result, the insulating film 50 is formed.

Next, as shown in FIG. 9D, the structure including the light guide member 10, the light reflective member 30, the wiring structure 40, the insulating film 50, and the like is turned upside down, and the support tape 202 is replaced with the support tape 206. Then, the blade 207 cuts from the upper surface 10b side of the light guide member 10. As a result, the structure is individualized. In this way, the light emitting module 1 is manufactured.

The effect of this embodiment will be described.
In the present embodiment, the first wiring layer 41 and the second wiring layer 42 are formed by arranging the conductive paste by, for example, a printing method and curing it. Therefore, the cost of forming the wiring layer is lower than the cost of forming the wiring layer by, for example, a sputtering method or a plating method. Further, since the second wiring layer 42 is arranged so as to overlap the first wiring layer 41, the wiring resistance between the connection area 49a, the plurality of light sources 20, and the connection area 49b is low, and the reliability of operation is high. high.

Further, the second wiring layer 42 is not arranged in the vicinity of the electrodes 22a and 22b of the light source 20. Therefore, the second wiring layer 42 does not intervene in the locus E of the laser beam L. Therefore, when performing the laser etching shown in FIG. 9B, the laser beam L only needs to remove the first wiring layer 41, and the accuracy of the laser etching is high. As a result, defects such as short circuits are unlikely to occur in the light emitting module 1, and the reliability is high.

Further, in the present embodiment, in a plan view, the second portion 41n of the first wiring layer 41 that does not contact the second wiring layer 42 is between the electrodes of the two light sources 20, for example, the electrodes 20Ab of the first light source 20A. It is continuously arranged between the second light source 20B and the electrode 22Ba. Thereby, the continuity between the electrodes of the two light sources 20 can be ensured. Further, even if a crack C is generated in the first wiring layer 41 in the vicinity of the tip portion in the longitudinal direction of the second wiring layer 42, the crack C is suppressed from extending to both ends of the first wiring layer 41, and the second wiring layer 42 is prevented from extending to both ends. 1 It is possible to prevent the wiring layer 41 from being disconnected. As a result, a highly reliable light emitting module 1 can be realized.

<Second embodiment>
Next, the second embodiment will be described.
FIG. 11 is a bottom view showing the wiring of the light emitting module according to the present embodiment.
FIG. 12 is an enlarged view showing the region B of FIG.
FIG. 13 is a cross-sectional view taken along the line XIII-XIII shown in FIG.

As shown in FIGS. 11 and 12, in the light emitting module 2 according to the present embodiment, the second wiring layer 42 is separated from the light source 20 in a plan view. Further, the tip edge in the longitudinal direction of the second wiring layer 42, that is, the edge facing the electrode 22a or 22b is curved in a convex shape, for example, a semicircular arc shape. The "semicircular shape" is not limited to a mathematically exact semicircle, and includes a shape similar to a semicircle.

In the present embodiment, since the second wiring layer 42 is separated from the light source 20 in a plan view, the second wiring layer 42 can be further separated from the locus E of the laser beam L, and the laser etching can be performed more accurately. be able to.

Further, in the present embodiment, the tip edge of the second wiring layer 42 in the longitudinal direction is curved in a convex shape. As a result, even if the conductive paste shrinks when the second wiring layer 42 is formed, the stress applied to the first wiring layer 41 due to the shrinkage is dispersed, and cracks C are less likely to be formed in the first wiring layer 41. The configurations, manufacturing methods, and effects other than the above in the present embodiment are the same as those in the first embodiment.

<Third embodiment>
Next, a third embodiment will be described.
FIG. 14 is a bottom view showing the wiring of the light emitting module according to the present embodiment, and shows a region corresponding to FIG.
FIG. 15 is a bottom view schematically showing the positional relationship between each wiring layer and each light source in the current path of the present embodiment, and the shape of each wiring layer is simplified and made linear.

As shown in FIG. 14, in the light emitting module 3 according to the present embodiment, the second wiring layer 42 is arranged on one side of the first wiring layer 41 in a plan view. Therefore, in a plan view, the second portion 41n of the first wiring layer 41 that does not contact the second wiring layer 42 is arranged on one side of the first wiring layer 41. In addition, "one side" in this embodiment means one side with respect to the center line of a current path.

As shown in FIG. 15, in the light emitting module 3, the fourth portion 43n of the third wiring layer 43, which does not contact the fourth wiring layer 44, is also arranged on one side of the third wiring layer 43 in a plan view. Further, in a plan view, the sixth portion 45n of the fifth wiring layer 45, which does not contact the sixth wiring layer 46, is also arranged on one side of the fifth wiring layer 45.

According to the present embodiment, since the widths of the second wiring layer 42, the fourth wiring layer 44, and the sixth wiring layer 46 can be widened, the connection area 49a, the first light source 20A, the second light source 20B, and the connection area 49b Wiring resistance between the two can be reduced.

In the present embodiment, as in the first embodiment, the first portion 41s of the first wiring layer 41 overlaps with the light source 20 in a plan view. As in the second embodiment, the first portion 41s may be separated from the light source 20 in a plan view. The configurations, manufacturing methods, and effects other than the above in the present embodiment are the same as those in the first embodiment.

<Fourth Embodiment>
Next, a fourth embodiment will be described.
FIG. 16 is a bottom view showing the wiring of the light emitting module according to the present embodiment, and shows a region corresponding to FIG.
FIG. 17 is a bottom view schematically showing the positional relationship between each wiring layer and each light source in the current path of the present embodiment, and the shape of each wiring layer is simplified and made linear.

As shown in FIG. 16, in the light emitting module 4 according to the present embodiment, the second wiring layer 42 is arranged on one side of the first wiring layer 41 in a plan view as in the third embodiment. Therefore, in a plan view, the second portion 41n of the first wiring layer 41 that does not contact the second wiring layer 42 is arranged on one side of the first wiring layer 41.

However, in the light emitting module 4, a protruding portion 42p protruding toward the electrodes 22a or 22b of the light source 20 is formed in the central portion in the width direction of the second wiring layer 42. In a plan view, the shape of the protrusion 42p is, for example, a rectangle, but the shape is not limited to this, and may be any shape such as a triangle shape, a semicircle shape, an oval shape, or a comb shape.

As shown in FIG. 17, in the light emitting module 4, the fourth portion 43n of the third wiring layer 43, which does not contact the fourth wiring layer 44, is also arranged on one side of the third wiring layer 43 in a plan view. A protruding portion 44p protruding toward the electrode 22a or 22b of the light source 20 is formed in the central portion of the fourth wiring layer 44 in the width direction. Further, in a plan view, the sixth portion 45n of the fifth wiring layer 45, which does not contact the sixth wiring layer 46, is also arranged on one side of the fifth wiring layer 45. A protruding portion 46p protruding toward the electrodes 22a or 22b of the light source 20 is formed in the central portion of the sixth wiring layer 46 in the width direction. The shapes of the protrusions 44p and 46p are arbitrary as in the shape of the protrusions 42p.

According to this embodiment, both the effect of the first embodiment and the effect of the third embodiment can be obtained. That is, as in the third embodiment, in a plan view, the second portion 41n of the first wiring layer 41 is arranged on one side of the first wiring layer 41, so that the width of the second wiring layer 42 is widened. It is possible to reduce the wiring resistance. The same applies to the third wiring layer 43 and the fifth wiring layer 45.

Further, by forming the protruding portion 42p in the central portion in the width direction of the second wiring layer 42, the second portions 41n of the first wiring layer 41 are arranged on both sides of the protruding portion 42p in the width direction. As a result, as in the first embodiment, even if a crack C is generated in the first wiring layer 41 in the vicinity of the tip portion of the protruding portion 42p, the crack C is in the width direction of the first wiring layer 41. It is possible to prevent the first wiring layer 41 from being disconnected by reaching both ends.

If the shape of the protruding portion 42p of the second wiring layer 42 is semicircular, the stress can be dispersed as in the second embodiment.

In the present embodiment, as in the first embodiment, the first portion 41s of the first wiring layer 41 overlaps with the light source 20 in a plan view. As in the second embodiment, the first portion 41s may be separated from the light source 20 in a plan view. The configurations, manufacturing methods, and effects other than the above in the present embodiment are the same as those in the first embodiment.

<Fifth Embodiment>
Next, a fifth embodiment will be described.
FIG. 18 is an end view showing a light emitting module according to the present embodiment.
As shown in FIG. 18, the light emitting module 5 according to the present embodiment has a basic configuration different from that of the light emitting module 1 according to the first embodiment. Hereinafter, it will be described in detail.

In the light emitting module 5, the light guide member 10 is formed with a penetrating portion 10g penetrating in the thickness direction. The shape of the penetrating portion 10g is, for example, circular in a plan view. Further, the shape of the penetrating portion 10g may be another shape such as a quadrangle in a plan view or a quadrangle with rounded corners. The entire light source 20 is arranged in the penetrating portion 10g. Within the penetrating portion 10g, a fixing member 70 is arranged between the inner surface of the penetrating portion 10g and the light source 20. A light adjusting member 60 (hereinafter referred to as a first light adjusting member) is arranged on the fixing member 70. The first light adjusting member 60 is a member that reflects a part of the light from the light source 20 and transmits the other part.

The reflectance of the first light adjusting member 60 is preferably, for example, 20% or more and 90% or less, and more preferably 30% or more and 85% or less with respect to the light from the light source 20. As the first light adjusting member 60, for example, a resin material such as a silicone resin, an epoxy resin or an acrylic resin containing a light diffusing material such as TiO ₂ , SiO ₂ , Al ₂ O ₃ or ZnO or glass can be used. .. Further, as the first light adjusting member 60, for example, a metal material such as aluminum (Al) or silver (Ag), or a dielectric multilayer film may be used. The shape of the first light adjusting member 60 is, for example, a quadrangle in a plan view. Further, the shape of the first light adjusting member 60 may be another shape such as a circle, a triangle, a hexagon, or an octagon in a plan view. The end portion of the first light adjusting member 60 is arranged on the light guide member 10.

The light guide member 10 is formed with a partition groove 10h along the boundary between the units 100. In the present embodiment, the partition groove 10h penetrates from the lower surface 10a to the upper surface 10b of the light guide member 10, but may be concave so as to open only to the lower surface 10a or the upper surface 10b of the light guide member 10. A light reflecting film 81 is arranged on the inner surface of the partition groove 10h. As the light reflecting film 81, for example, a resin material containing a light diffusing material or a metal material can be used as in the case of the light reflecting member 30.

In the light source 20, the light emitting element 21 is arranged in the translucent member 24. A light adjusting member 27 (hereinafter referred to as a second light adjusting member) is arranged on the light transmitting member 24. The second light adjusting member 27 reflects a part of the light emitted in the direction directly above the light source 20 and transmits the other part. The transmittance of the second light adjusting member 27 is, for example, preferably 1% or more and 50% or more, and more preferably 3% or more and 30% or less. As the second light adjusting member 27, for example, a resin material or a metal material containing a light diffusing material can be used in the same manner as the first light adjusting member.

In the present embodiment, the light source 20 does not have the translucent layer 25. Further, the sealing member 26 is located below the light emitting element 21 and is arranged around the electrodes 22a and 22b. A transparent resin layer 82 is arranged between the light source 20 and the light reflecting member 30. Further, only the first portion 31 is arranged on the light reflecting member 30, and the second portion 32 is not arranged. The first portion 31 of the light reflective member 30 is also arranged under the light source 20. The electrodes 22a and 22b of the light source 20 are connected to the first wiring layer 41 via the metal layers 83a and 83b, respectively.

Then, in the light emitting module 5, the second wiring layer 42 has a wiring portion 42c and a connection portion 42d. The connection portion 42d projects upward from the wiring portion 42c. The wiring portion 42c and the connection portion 42d are integrally formed of the conductive paste. The wiring portion 42c is separated from the first wiring layer 41, and the upper surface of the connection portion 42d is in contact with the first wiring layer 41. Therefore, in the present embodiment, the contact surface between the first wiring layer 41 and the second wiring layer 42 is the contact surface between the first wiring layer 41 and the connecting portion 42d. In a plan view, a part of the second wiring layer 42 is located outside the first wiring layer 41.

The positional relationship between the first wiring layer 41 and the second wiring layer 42, particularly the arrangement of the second portion 41n in the first wiring layer 41 that does not contact the second wiring layer 42, is the above-mentioned first to fourth embodiments. It may be the same as any of the above. In this case, in a plan view, the second portion 41n of the first wiring layer 41 is continuously arranged between the electrode 22Ab of the first light source 20A and the electrode 22Ba of the second light source 20B. The configurations, manufacturing methods, and effects other than the above in the present embodiment are the same as those in the first embodiment.

Each of the above embodiments is an example embodying the present invention, and the present invention is not limited to these embodiments. For example, in each of the above-described embodiments, the present invention also includes additions, deletions, or changes of some components or steps. In addition, each of the above-described embodiments can be implemented in combination with each other.

The present invention can be used, for example, as a light source for a display device.

1, 2, 3, 4, 5: Light emitting module 10: Light guide member 10a: Bottom surface 10b: Top surface 10c: Recessed portion (first recessed portion)
10d: Recess (second recess)
10e: Groove 10g: Penetration part 10h: Partition groove 20, 20A, 20B: Light source 21: Light emitting element 22a, 22b, 22Aa, 22Ab, 22Ba, 22Bb: Electrode 24: Translucent member 25: Translucent layer 26: Sealing member 27: Light adjustment member (second light adjustment member)
30: Light-reflecting member 30a: Top surface 31: First part 32: Second part 40: Wiring structure 41: First wiring layer 41a: Base material 41b: Conductive member 41e: Groove 41s: First part 41n: Second Part 42: Second wiring layer 42a: Base material 42b: Conductive member 42c: Wiring part 42d: Connection part 42p: Protruding part 43: Third wiring layer 43s: Third part 43n: Fourth part 44: Fourth wiring layer 44p : Protruding part 45: Fifth wiring layer 45s: Fifth part 45n: Sixth part 46: Sixth wiring layer 46p: Protruding parts 49a, 49b: Connection area 50: Insulation film 60: Optical adjustment member (first optical adjustment member) )
70: Fixing member 81: Light reflecting film 82: Transparent resin layer 83a, 83b: Metal layer 100: Unit 201, 202: Supporting tape 203: Film 204: Roller 205: Grindstone 206: Supporting tape 207: Blades A, B: Area C: Crack E: Laser light trajectory L: Laser light

Claims (12)

Light guide member and
A first light source and a second light source having at least a part thereof arranged in the light guide member and having electrodes on the lower surface,
The light-reflecting member arranged under the light guide member and
A first wiring layer arranged under the light-reflecting member and connecting the electrode of the first light source and the electrode of the second light source,
The second wiring layer arranged under the first wiring layer and
Equipped with
The first wiring layer includes a first portion in contact with the second wiring layer and a second portion not in contact with the second wiring layer.
A light emitting module in which the second portion is continuously arranged between the electrode of the first light source and the electrode of the second light source in a plan view. The light emitting module according to claim 1, wherein the second portion is arranged all around the first wiring layer in a plan view. A third wiring layer arranged under the light-reflecting member and separated from the first wiring layer, and
The fourth wiring layer arranged under the third wiring layer and
Further prepare
The third wiring layer includes a third portion in contact with the fourth wiring layer and a fourth portion not in contact with the fourth wiring layer.
The light emitting module according to claim 2, wherein the fourth portion is arranged all around the third wiring layer in a plan view. The light emitting module according to claim 1, wherein the second portion is arranged on one side of the first wiring layer in a plan view. A third wiring layer arranged under the light-reflecting member and separated from the first wiring layer, and
The fourth wiring layer arranged under the third wiring layer and
Further prepare
The third wiring layer includes a third portion in contact with the fourth wiring layer and a fourth portion not in contact with the fourth wiring layer.
The light emitting module according to claim 4, wherein the fourth portion is arranged on one side of the third wiring layer in a plan view. The first wiring layer and the second wiring layer are each
A base material made of resin material and
A plurality of conductive members arranged in the base material, and
The light emitting module according to any one of claims 1 to 5. The light emitting module according to any one of claims 1 to 6, wherein the first portion overlaps with the first light source in a plan view. The light emitting module according to any one of claims 1 to 6, wherein the first portion is separated from the first light source in a plan view. The light emitting module according to any one of claims 1 to 8, wherein the second wiring layer overlaps a part of the first wiring layer in a plan view. The light emitting module according to any one of claims 1 to 8, wherein a part of the second wiring layer is located outside the first wiring layer in a plan view. The light-reflecting member is arranged around the first light source, and the light-reflecting member is arranged around the first light source.
The light emitting module according to any one of claims 1 to 10, wherein the first wiring layer is also arranged under the first light source. The light emitting module according to any one of claims 1 to 10, wherein the light reflecting member is also arranged under the first light source.

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